Laser package, and method for producing a laser package

Abstract

The invention relates to a laser package, comprising a base element, which has an arrangement surface, on which at least one semiconductor laser element is arranged, which is designed to emit light along a first optical axis, which runs substantially parallel to the arrangement surface. The laser package additionally comprises an integrally formed deflection element, which is arranged in the beam path of the at least one semiconductor laser element on the arrangement surface and which is designed to couple out the light emitted along the first optical axis and coupled in via a light entry surface of the deflection element via a light exit surface of the deflection element along a second optical axis, which is offset substantially parallel to the first optical axis. Furthermore, the laser package comprises an optical arrangement which is arranged on the arrangement surface downstream of the deflection element in the beam path of the at least one semiconductor laser element. The optical arrangement is designed to collimate light emitted by the at least one semiconductor laser element along at least one direction and / or is designed to homogenize light emitted by the at least one semiconductor laser element along at least one direction.

Description

[0001] 2024 PF00222

[0002] 1

[0003] LASER PACKAGE AND METHOD FOR MANUFACTURING A LASER PACKAGE

[0004] The present application claims priority from German patent application No. 10 2024 123 297 . 8 of 14 August 2024, the publication of which

[0005] 5. The cash value is hereby incorporated into the present application by reference.

[0006] The present invention relates to a laser package and a method for manufacturing a laser package.

[0007] BACKGROUND

[0008] For LIDAR systems, it may be necessary to provide a desired beam profile. For example, it may be desirable to provide a beam profile that is collimated along at least one direction (e.g., fast axis) and / or homogenized along at least one direction (e.g., slow axis). In particular, in the case of a multi-channel laser with several optically and electrically separated and adjacent laser channels, an emitted beam profile in the form of a line may be desired. Currently, however, this requires a complex arrangement of optical components that must precisely shape and direct the emitted light. Essentially, this involves at least one of two tasks: collimating the light along the fast axis of the emitted light cone and homogenizing the light along the slow axis of the emitted light cone.

[0009] To achieve such a beam profile, several optical elements are required, including lenses, mirrors, and prisms. Each of these elements must be precisely positioned and aligned to produce the desired beam shape. Even minor placement inaccuracies pose a challenge, as they can affect the divergence of the emitted light and thus the accuracy of the LIDAR system. In particular, achieving a desired residual divergence of the collimated light of, for example, less than ±0.05° (nearly perfectly collimated) requires the use of commercially available lenses and 2024 PF00222.

[0010] For two common placement accuracies, a minimum distance of approximately 13 mm or 8 mm between the laser and the lens must be maintained. Stacking the laser and components therefore results in a large overall height (and thus risks to manufacturability), and there is a risk of complications.

[0011] 5. The risk exists that components of the arrangement expand depending on the temperature, causing the collimation lens to become defocused and the requirements for low residual divergence to no longer be met. At the same time, it may also be desirable to design such a LiDAR system to be very compact.

[0012] Until now, LIDAR systems have typically used glass lenses positioned outside and in front of a laser package. However, such LIDAR systems usually do not meet the requirements for very low residual divergence or are very complex to manufacture. Furthermore, there are few, if any, known more compact solutions that simultaneously provide the desired beam shaping of the emitted light with a sufficiently low residual divergence.

[0013] There is therefore a need to counteract at least one of the problems described above and to provide an improved laser arrangement. Furthermore, there is a need to provide a method for manufacturing such a laser arrangement.

[0014] SUMMARY OF THE INVENTION

[0015] This need is addressed by the subject matter of the independent patent claims. Further developments and embodiments of the proposed principle are specified in the dependent claims.

[0016] To solve the problem, the inventors propose providing a deflecting element in combination with an optical arrangement on an assembly surface within a laser package, in addition to a semiconductor laser element. This arrangement enables collimation and / or homogenization of the emitted light within the laser package. The invention provides for the integration of the optical components on the same substrate plane as the semiconductor laser element, thereby reducing the package height and improving the manufacturability of the 2024 PF00222.

[0017] 3

[0018] Packages can be simplified. To enable such an arrangement, a deflecting element is used that shifts the optical axis of the laser beam emitted by the semiconductor laser element essentially parallel upwards to avoid disturbing the divergent beam.

[0019] To prevent beam clipping due to reflection / absorption at the substrate, this allows for a very compact system. Furthermore, the necessary components can be precisely matched during the assembly of the laser package, significantly simplifying the integration of the system into a final product. Additionally, integrating the optical components and the semiconductor laser element onto the same flat substrate with, for example, low GTE, prevents defocusing of the optical element during collimation.

[0020] For example, it is possible to perform pre-collimation or even full collimation of the highly divergent fast axis within the laser package. This eliminates the need for a separate collimation lens downstream of the laser package, as the emitted light has a matched divergence angle. Furthermore, the beam profile of several adjacent channels of a semiconductor laser element within the laser package can be homogenized along, for example, the slow axis. This allows the laser package to generate a desired beam profile, such as a (thin) line, without the need for any additional lenses or optical components downstream.

[0021] The optical arrangement can be formed by one or more optical elements arranged in the beam path of the semiconductor laser element within the laser package, which effect corresponding collimation and / or homogenization of the emitted light. For example, the optical arrangement can also include a light-shaping optical element arranged on / in the deflection element of the laser package and / or an optical element integrated into a cover element of the laser package. 2024 PF00222

[0022] 4

[0023] According to one aspect of the invention, a laser package comprises a base element having a mounting surface on which at least one semiconductor laser element is arranged. The semiconductor laser element is configured to emit light along a first optical axis.

[0024] 5 emitting, which runs essentially parallel to the arrangement surface. Furthermore, the laser package comprises a one-piece deflecting element which is arranged in the beam path of the at least one semiconductor laser element on the arrangement surface and is configured to couple the light emitted along the first optical axis and coupled in via a light entry surface of the deflecting element, via a light exit surface of the deflecting element along a second optical axis which is offset essentially parallel to the first optical axis.

[0025] Furthermore, the laser package comprises an optical arrangement which is arranged on the arrangement surface downstream of the deflecting element in the beam path of the at least one semiconductor laser element, and which is configured to collimate light emitted by the at least one semiconductor laser element along at least one direction, in particular along a fast axis of the light, and / or which is configured to homogenize light emitted by the at least one semiconductor laser element along at least one direction, in particular along a slow axis of the light.

[0026] The laser package is designed to generate electromagnetic radiation, in particular laser radiation, during its operation. The laser package is configured to generate electromagnetic radiation with one or more different wavelengths, which, for example, lie in the wavelength range between infrared and ultraviolet radiation. Specifically, the electromagnetic radiation can lie in the wavelength range of infrared and / or ultraviolet radiation.

[0027] The laser package can be designed, in particular, to generate electromagnetic radiation during operation which, when considering the shape of the emitted laser beam, has an elliptical cross-section in a direction perpendicular to the emission direction. One reason 2024 PF00222

[0028] 5. This may be because the electromagnetic radiation emitted by the laser packet propagates in two mutually perpendicular directions perpendicular to the emission direction with different divergence angles due to the shape of an active area of ​​the laser packet.

[0029] 5 The axis with the larger divergence angle is called the fast axis, while the axis with the smaller divergence angle is called the slow axis.

[0030] According to at least one embodiment, the laser package comprises at least one semiconductor laser element. The at least one semiconductor laser element can, in particular, be an edge-emitting semiconductor laser chip. However, it is also conceivable that the at least one semiconductor laser element is formed by a surface-emitting semiconductor laser chip arranged to emit light along a first optical axis that runs substantially parallel to the mounting surface.

[0031] The at least one semiconductor laser element comprises, for example, a semiconductor body, reflective outer surfaces that form at least one resonator, and electrical connection points for contacting the semiconductor laser element.

[0032] The at least one semiconductor laser element comprises at least one laser facet. During operation, the light generated by the at least one semiconductor laser element exits at this at least one laser facet. The at least one laser facet can, for example, be formed on an outer surface of the at least one semiconductor laser element that is recessed relative to a front surface, such as a recessed side or top surface, or it can be formed directly on the front or outer surface of the at least one semiconductor laser element.

[0033] The at least one semiconductor laser element comprises at least one active zone, which encompasses the region of the at least one laser facet at which the electromagnetic radiation generated during operation exits the semiconductor laser element. For example, in the region of 2024 PF00222

[0034] 6 active zone an active layer of the semiconductor laser element to a reflective layer of the semiconductor laser element, which is part of at least one resonator of the semiconductor laser element .

[0035] 5 According to at least one embodiment, the laser package comprises a one-piece deflecting element and an optical arrangement, which are arranged in the beam path of the at least one semiconductor laser element on the mounting surface. The deflecting element and the optical arrangement follow the laser facet of the at least one semiconductor laser element, in particular in one emission direction of the at least one semiconductor laser element.

[0036] In particular, the deflecting element and the optical arrangement are designed and arranged such that all or at least a large part of the light leaving the at least one semiconductor laser element passes through the deflecting element and the optical arrangement and is optically influenced by them.

[0037] According to at least one embodiment, the integrally formed deflecting element is formed by a substantially transparent solid body having a light entry and a light exit surface. The light entry and / or light exit surface and / or one or more reflective surfaces of the deflecting element can be arranged and configured such that the light emitted along the first optical axis and coupled in via the light entry surface of the deflecting element is coupled out via the light exit surface of the deflecting element along the second optical axis, the second optical axis being substantially parallel to the first optical axis.

[0038] For example, the light-entry surface and / or the light-emission surface may be tilted relative to the mounting surface, and in particular may form an angle of less than 90° with the mounting surface. This can result, for example, in refractive index jumps between an adjacent medium and the light-entry surface and / or the light-emission surface, causing the light emitted along the first optical axis to be emitted at a correspondingly altered angle in 2024 PF00222.

[0039] 7 the deflecting element is coupled in and / or the light transmitted through the deflecting element is coupled out of the deflecting element along the second optical axis.

[0040] 5 According to at least one embodiment, the light entry surface and the light exit surface are substantially parallel to each other. In particular, the light entry surface and the light exit surface can be formed by two plane-parallel planes, which contribute to the fact that the light emitted along the first optical axis is coupled into the deflecting element at a correspondingly changed angle and / or the light transmitted by the deflecting element is coupled out of the deflecting element along the second optical axis.

[0041] Alternatively or additionally, the deflecting element can comprise at least one first and one second reflective surface opposite the first, arranged in the beam path of the at least one semiconductor laser element between the light-entry surface and the light-emission surface. The reflective surfaces can be designed and arranged to deflect light coupled in via the light-entry surface within the deflecting element towards the light-emission surface. For this purpose, the first and / or second reflective surface can, for example, be tilted relative to the mounting surface, and in particular, form an angle of less than 90° with the mounting surface.

[0042] According to at least one embodiment, a filler material is provided between the at least one semiconductor laser element and the deflecting element, or between the laser facet of the at least one semiconductor laser element and the deflecting element, in order to couple the deflecting element with the laser facet of the at least one semiconductor laser element. The filler material can, in particular, be formed by silicone or polysiloxane and, in particular, have a refractive index that differs from the refractive index of the material of the semiconductor laser element and the deflecting element. Furthermore, such a filler material can also provide additional protection to the laser facet of the at least one semiconductor laser element. In particular, this can create an effective 2024 PF00222

[0043] 8

[0044] Protection of the facet from particles that could otherwise lead to failure of the semiconductor laser element is achieved. Further along the beam path, the divergent laser beam is already so widely expanded that particles are less critical.

[0045] 5

[0046] According to at least one embodiment of the laser package, the optical arrangement is configured to homogenize light emitted by the at least one semiconductor laser element along at least one direction, in particular along a slow axis of the light. For example, the optical arrangement can be configured to homogenize light emitted by the at least one semiconductor laser element along both the fast and slow axes of the light, or the optical arrangement can be configured to homogenize light emitted by the at least one semiconductor laser element along either the fast or the slow axis.

[0047] Homogenization can be understood, in particular, as the process of emitting light homogeneously, i.e., with essentially the same distribution, over a defined area along the direction in which it is to be homogenized. This can be especially desirable when the light from several "individual" beams of several adjacent semiconductor laser elements or adjacent laser channels of a semiconductor laser element is to illuminate a defined area homogeneously. Accordingly, homogenization can prevent areas between the beams from being unilluminated or only minimally illuminated. In the case of a LiDAR system, for example, it may be desirable to generate a common beam profile in the form of a (narrow) line using a multi-channel laser, with the intensity being essentially constant along the line.For example, it may be necessary to "overlay" several adjacent light cones to obtain a homogeneous beam profile. This eliminates areas between the light cones that are not illuminated or only barely illuminated, compared to a non-homogeneized beam profile.5 2024 PF00222.

[0048] 9

[0049] According to at least one embodiment of the laser package, the optical arrangement is configured to direct light emitted by the at least one semiconductor laser element along at least one direction, in particular along a fast axis.

[0050] 5 light, to collimate. For example, the optical arrangement can be configured to collimate light emitted by the at least one semiconductor laser element along the fast axis and the slow axis of the light, or the optical arrangement can be configured to collimate light emitted by the at least one semiconductor laser element along the fast axis or the slow axis.

[0051] According to at least one embodiment, the optical arrangement is configured to collimate light emitted by the at least one semiconductor laser element along a first direction, in particular along a fast axis of the light, and to homogenize it along a second direction, in particular along a slow axis of the light. This allows a beam profile in the form of a (narrow) line to be generated in the case of a multi-channel laser. For example, the optical arrangement can also be configured to collimate the light emitted by the at least one semiconductor laser element along the second direction and, furthermore, to homogenize it within the collimated area, or to homogenize the light emitted by the at least one semiconductor laser element along the second direction and then collimate the homogenized light, i.e., to collimate it at the "edges" of the homogenized area.

[0052] According to at least one embodiment, the optical arrangement comprises at least one consisting of a microlens array, a collimating lens, and a prism.

[0053] For example, the optical arrangement includes an optical element for beam shaping by means of optical refraction, e.g., a lens for collimating and / or focusing the laser radiation. Alternatively or additionally, it is possible that the optical arrangement includes a diffractive optical element (also DOE) in which the beam shaping is based on the principle of optical diffraction to reduce the radiation emitted by the semiconductor. 2024 PF00222

[0054] 10 laser elements emitted light along at least one direction to homogenize .

[0055] According to at least one embodiment, the optical arrangement comprises

[0056] 5. A plurality of microlenses. The microlenses can, in particular, serve to homogenize the light emitted by the at least one semiconductor laser element along at least one direction, especially along a slow axis of the light. In particular, the optical arrangement can comprise an array of a plurality of microlenses.

[0057] According to at least one embodiment, the optical arrangement comprises a first optical element for collimating the light emitted by the at least one semiconductor laser element along at least one direction, in particular along a high-speed axis of the light. For example, the first optical element can be formed by a lens / FAC lens, for example, formed by a plastic injection-molded part, a cast glass component, or a 3D-printed component. In particular, the first optical element can be formed by a material transparent to the laser radiation generated by the at least one semiconductor laser element, such as glass, a semiconductor material, and / or a plastic material.The first optical element can, for example, be formed from a ceramic or comprise a ceramic material, such as ZrO or SiN, or it can be formed from a 3D-printable material, such as cured methacrylate. Through a demolding process or a 3D printing method, the first optical element can be brought into the desired shape and then, for example, arranged downstream of the deflection element on the mounting surface.

[0058] According to at least one embodiment, the optical arrangement comprises a second optical element for homogenizing the light emitted by the at least one semiconductor laser element along at least one direction, in particular along a slow axis of the light. For example, the second optical element can be a 2024 PF00222

[0059] 11

[0060] Multi-lens array that is arranged downstream of the deflecting element on the arrangement surface.

[0061] According to at least one embodiment, the optical arrangement comprises

[0062] 5. At least one of the first and second reflective surfaces of the deflecting element, or the optical arrangement is formed at least partially by a reflective coating of a surface of the deflecting element. In particular, the deflecting element can have a reflective coating which is simultaneously configured to collimate light emitted by the at least one semiconductor laser element along at least one direction, in particular along a fast axis of the light.

[0063] The reflecting surface(s) can be configured to deflect light emitted by the at least one semiconductor laser element towards the light-emitting surface. Furthermore, the reflecting surface(s) can be configured, for example by a curved shape, to collimate light emitted by the at least one semiconductor laser element along at least one direction, in particular along a fast axis of the light. Similarly, the deflecting element can also be configured to collimate the light emitted by the at least one semiconductor laser element along at least one direction of the light. For this purpose, the deflecting element or a reflecting surface of the deflecting element can, for example, have a curved surface.Alternatively or additionally, the deflecting element can also be designed to homogenize light emitted by the at least one semiconductor laser element along at least one direction, in particular along a slow axis of the light. For example, the deflecting element or a reflective surface of the deflecting element can have a corrugated / structured surface that homogenizes the light in a desired direction.

[0064] According to at least one embodiment, the optical arrangement 5 comprises the light-emitting surface and / or light-intake surface, or the optical arrangement is formed at least partially by the light-emitting surface and / or light-intake surface. In particular, the 2024 PF00222

[0065] 12

[0066] The light-emitting surface and / or light-intake surface are designed to collimate light emitted by the at least one semiconductor laser element along at least one direction, in particular along a high-speed axis of the light, and / or to collimate light emitted by the at least one semiconductor laser element.

[0067] 5. The semiconductor laser element is designed to homogenize light emitted along at least one direction, particularly along a slow axis of the light. The light entry and / or exit surface can, for example, have a curved surface for collimation and / or a corrugated surface due to a multitude of adjacent microlenses for homogenizing the light. The type and orientation of the curvature, as well as the shape and configuration of the microlenses, can determine the direction in which the light is collimated and / or homogenized.

[0068] According to at least one embodiment, the perpendicular distance between the first and second optical axes is at least 8 mm, in particular at least 5 mm, or at least 2 mm, or at least 1 mm, or at least 0.5 mm. Such a distance allows sufficiently collimated light with sufficiently low residual divergence, in particular a residual divergence of less than ± 0.05°, and a sufficiently large beam profile, in particular a beam profile with a diameter of at least 16 mm, or at least 4 mm, to be coupled out from the laser package without collision with the base element.

[0069] According to at least one embodiment, the laser package comprises a lid element connected to the base element, forming a frame that encapsulates the at least one semiconductor laser element, the deflecting element, and the optical arrangement in a lateral direction with the base element. In particular, the laser package can be closed with a lid to provide a flat top surface for, for example, a modified pick-and-place process, as well as mechanical protection for the internal components.

[0070] According to at least one embodiment, the cover element is at least partially transparent to light emitted by the at least one semiconductor laser element and / or has a window that is in the beam path of the at least one semiconductor laser element. 2024 PF00222

[0071] 13 ments of the optical arrangement is formed downstream. The window or a region transparent to the light emitted by the at least one semiconductor laser element forms a light emission surface of the laser package through which a collimated and / or homo-

[0072] 5 genized light is coupled out.

[0073] The light emission surface of the lid element can, in particular, be an outer surface of the lid element or the laser package through which the light emitted by the at least one semiconductor laser element exits the lid element or the laser package. The light emission surface can accordingly be the surface of the laser package through which the light emitted by the at least one semiconductor laser element leaves the laser package in a collimated and / or homogenized manner.

[0074] According to at least one embodiment, the optical arrangement comprises a third optical element that is integrated into the cover element and, in particular, is formed integrally with the cover element. The third optical element may, for example, comprise a lens cast or molded into the cover element or a microlens array cast or molded into the cover element. Accordingly, in the region where the light emitted by the at least one semiconductor laser element passes through the cover element, the cover element may comprise an optical element that collimates and / or homogenizes the light emitted by the at least one semiconductor laser element.

[0075] According to at least one embodiment, the third optical element comprises the light-emitting surface. In particular, the optical element can form the light-emitting surface through which the light emitted by the at least one semiconductor laser element leaves the laser package in a collimated and / or homogenized manner.

[0076] According to at least one embodiment, the laser package further comprises another optical element, which is arranged downstream in the beam path of the at least one semiconductor laser element on the cover element of the light emission surface. The further optical element can, for example, comprise or be formed from a microlens array and can, in particular, be configured to reflect a beam path that is less than the one shown in the original text.

[0077] 14. To homogenize light emitted by a semiconductor laser element along at least one direction, in particular along a slow axis of the light. However, it is also possible that the further optical element is formed by a lens which is in the beam path of the

[0078] 5 at least one semiconductor laser element is arranged downstream of the cover element of the light emission surface and is designed to collimate light emitted by the at least one semiconductor laser element along at least one direction, in particular along a fast axis of the light.

[0079] In one aspect, the base element has a ceramic as its main material and, in particular, features at least a partial metallic coating and / or electrical vias. The ceramic base element can, for example, comprise AlN or SiC and have at least a partial metallic coating and / or electrical vias. Alternatively, the base element can be formed essentially entirely from a metallic material such as Cu or a Cu-based alloy. According to at least one embodiment of the laser package, the base element serves for electrical control, mechanical fastening, and / or as a heat sink for components of the laser package. In particular, a material with a low GTE value (for example, silicon with ~3 ppm) can be used for the base element to prevent defocusing of the optical arrangement due to temperature increases.In particular, the base element can serve as a thermal bench for the at least one semiconductor laser element, the deflection element and the optical arrangement.

[0080] In one aspect, a submount is arranged between the at least one semiconductor laser element and the base element. In particular, the at least one semiconductor laser element and the submount can form a sub-assembly that is arranged on the mounting surface. The submount can, firstly, enable better heat dissipation from the at least one semiconductor laser element and, secondly, can represent a raised area to prevent so-called beam clipping of the laser light emitted from a laser facet of the at least one semiconductor laser element. The submount can, for example, be metallic. 2024 PF00222

[0081] 15, or have a ceramic as the main material and in particular have at least a partially metallic coating and / or electrical vias. In particular, the laser package comprises a submount which is a semiconductor laser element.

[0082] 5 is assigned. In the case of a large number of semiconductor laser elements, the laser package can have the same number of submounts as the number of semiconductor laser elements. However, it is also conceivable that only one contiguous submount is provided on which the semiconductor laser elements are arranged.

[0083] In one aspect, at least one semiconductor laser element is hermetically encapsulated in the interior between the base element and the cover element. In particular, the cover element and the base element can be hermetically joined together. For this purpose, connecting elements between the components can be formed, for example, by a metallic solder (Cu / Sn; Cu / Sn / Ag; Au / Sn) or by glass. This results in a hermetically encapsulated laser package that prevents rapid aging of the at least one half-eliter laser element.

[0084] In one aspect, at least one semiconductor laser element in the interior between the base element and the cover element is not hermetically encapsulated. In particular, the cover element and the base element may be joined using an organic adhesive.

[0085] According to at least one embodiment, the at least one semiconductor laser element has at least two adjacent active zones and each of these active zones has a laser facet adjacent to each active zone. The number two is to be understood as exemplary, and the at least one semiconductor laser element can also have three, four, or more adjacent active zones and each of these active zones has a laser facet adjacent to each active zone. Such a semiconductor laser element can, in particular, be called a multi-channel laser. Such a semiconductor laser element can be configured to emit light of different wavelengths, or can be configured to emit light of substantially the same wavelength. 2024 PF00222

[0086] 16

[0087] In one aspect, the laser package comprises a multitude of semiconductor laser elements arranged at intervals on the base element. In particular, one or more semiconductor laser elements can be provided within the laser package to emit light of the same or

[0088] to emit 5 different wavelengths. In one aspect, the semiconductor laser elements of the multitude of semiconductor laser elements can be arranged side by side in a row. In particular, the semiconductor laser elements can be arranged equidistantly or at different distances from each other on the base plate.

[0089] In one aspect, the laser package comprises a plurality of single-piece deflection elements, each arranged in the beam path of one of the plurality of semiconductor laser elements and configured to deflect laser light emitted by the corresponding semiconductor laser element. Specifically, the laser package comprises a deflection element associated with each semiconductor laser element. In the case of a plurality of semiconductor laser elements, the laser package can have the same number of deflection elements as the number of semiconductor laser elements. However, it is also conceivable that the deflection element is formed by a single, continuous element that deflects the light emitted by each of the semiconductor laser elements.

[0090] In one aspect, the laser package comprises a multitude of optical arrangements. Specifically, the laser package comprises one optical arrangement each, which is associated with a semiconductor laser element. In the case of a multitude of semiconductor laser elements, the laser package can have the same number of optical arrangements as the number of semiconductor laser elements. However, it is also conceivable that only one optical arrangement is associated with each of the multitude of semiconductor laser elements.

[0091] In one aspect, the lid element comprises a frame element having a ceramic as its main material, which is arranged adjacent to the base element on the base element and forms a frame that surrounds the at least one semiconductor laser element in a lateral direction. Furthermore, the lid element has a substantially transparent element or region, which is shown in 2024 PF00222.

[0092] 17

[0093] The beam path of at least one half-wavelength laser element is arranged.

[0094] A process for manufacturing a laser package will continue to be developed.

[0095] 5. In particular, the laser package described herein can be manufactured using this method. That is to say, all features disclosed for the laser package are also disclosed for the method and vice versa.

[0096] A method for manufacturing a laser package, in particular a laser package according to at least suitable of the aforementioned aspects, comprising the steps:

[0097] Providing a base element having an arrangement surface on which at least one semiconductor laser element is arranged, wherein the semiconductor laser element is configured to emit light along a first optical axis which is substantially parallel to the arrangement surface;

[0098] Providing a one-piece deflecting element in the beam path of the at least one semiconductor laser element on the arrangement surface, wherein the deflecting element is configured to couple the light emitted along the first optical axis and coupled in via a light entry surface of the deflecting element along a second optical axis via a light exit surface of the deflecting element, which is substantially parallel to the first; and

[0099] Providing an optical arrangement in the beam path of the at least one semiconductor laser element downstream of the deflecting element on the arrangement surface, wherein the optical arrangement is configured to collimate light emitted by the at least one semiconductor laser element along at least one direction, in particular along a fast axis of the light, and / or to homogenize light emitted by the at least one semiconductor laser element along at least one direction, in particular along a slow axis of the light. 5

[0100] In one aspect, the step of providing the optical arrangement includes placing a first optical element for the collision- 2024 PF00222

[0101] 18. Motion of the light emitted by the at least one semiconductor laser element along at least one direction, in particular along a fast axis of the light, onto the array surface. Additionally or alternatively, the step of providing the optical input can be...

[0102] 5 order comprising placing a second optical element on the arrangement surface to homogenize the light emitted by the at least one semiconductor laser element along at least one direction, in particular along a slow axis of the light.

[0103] In one aspect, the step of providing the base element with the at least one half-eliter laser element comprises arranging the at least one semiconductor laser element on the mounting surface. This can, in particular, include gluing or bonding the at least one semiconductor laser element to the mounting surface. Furthermore, the step can comprise arranging a submount on the mounting surface and subsequently arranging the at least one semiconductor laser element on the submount. Additionally, the step can comprise arranging a subassembly comprising a submount and the at least one semiconductor laser element on the mounting surface.

[0104] In one aspect, the step of providing the deflection element includes arranging and aligning the deflection element on the arrangement surface.

[0105] In one aspect, the method further comprises providing a cover element that is at least partially transparent to the light emitted by the at least one semiconductor laser element, in the form of providing a cover that is at least partially transparent or a cover having a window on the base element. In particular, the step may include gluing or bonding the cover to the base element, and especially hermetically joining the substantially transparent cover to the base element. 5

[0106] BRIEF DESCRIPTION OF DRAWINGS 2024 PF00222

[0107] - 19 -

[0108] Further aspects and embodiments according to the proposed principle will be revealed in relation to the various embodiments and examples, which are described in detail in conjunction with the accompanying drawings.

[0109] 5

[0110] Figures 1 to 5 each show a cross-sectional view of a laser package according to some aspects of the proposed principle.

[0111] DETAILED DESCRIPTION

[0112] The following embodiments and examples illustrate various aspects and their combinations according to the proposed principle. The embodiments and examples are not always to scale. Likewise, various elements may be enlarged or reduced to highlight individual aspects. It is understood that the individual aspects and features of the embodiments and examples shown in the figures can readily be combined without affecting the principle of the invention. Some aspects have a regular structure or shape. It should be noted that in practice, minor deviations from the ideal shape may occur without contradicting the inventive idea.

[0113] Furthermore, the individual figures, features, and aspects are not necessarily shown at the correct size, and the proportions between the individual elements may not be entirely accurate. Some aspects and features are emphasized by being shown enlarged. However, terms such as "above," "above," "below," "below," "larger," "smaller," and the like are correctly represented in relation to the elements in the figures. Thus, it is possible to deduce such relationships between the elements from the illustrations. Figures 1 to 5 each show a cross-sectional view of a laser package 1 according to some aspects of the proposed principle. 2024 PF00222

[0114] 20

[0115] The laser package 1 comprises a top element 11, which together with a bottom element 2 forms an interior space 23 for at least one semiconductor laser element 4. On an arrangement surface 3 of the bottom element 2, at least one subassembly consisting of a submount 22 and a half-

[0116] 5 conductor laser elements 4 arranged. The laser package 1 can each have one or more such subassemblies, i.e., one or more semiconductor laser elements 4, which are arranged on the base element.

[0117] The cover element 11 forms a frame that surrounds the at least one semiconductor laser element 4 in a lateral (x and z directions) and vertical direction (y direction). Furthermore, the cover element 11 includes a substantially transparent region or window 19, which is formed in the beam path of the laser light emitted by the at least one semiconductor laser element 4. The transparent region or window 19 forms a light emission surface 18 through which the laser light emitted by the at least one semiconductor laser element 4 exits the laser package 1.

[0118] The base element is made of ceramic as the main material and has contact surfaces 21 or vias via which the semiconductor laser element 4 is electrically connected or can be bonded to a target substrate in the manner of an SMD component. The base element also has bonding surfaces 2 by means of which a connection is created between the base element 2 and the cover element 11. This is merely an example, however, and the connection between the elements can also be of a different type.

[0119] The semiconductor laser element 4 is configured as an edge-emitting laser, which is designed to emit light L along a first optical axis 12 that runs essentially parallel to the mounting surface 3. To prevent the light L emitted by the semiconductor laser element 4 from colliding with the mounting surface 3, a one-piece deflecting element 14 is arranged on the mounting surface 3 in the beam path of the at least one semiconductor laser element 4. The deflecting element 14 is configured to deflect the light L emitted along the first optical axis 12.

[0120] 21 and light L coupled in via a light entry surface 9 of the deflecting element 14 is coupled out via a light exit surface 10 of the deflecting element 14 along a second optical axis 13, which is substantially parallel to the first optical axis 12. In particular

[0121] 5. The deflecting element 14 is designed to displace the optical axis of the at least one semiconductor laser element 4 parallel to the optical axis, such that the optical axis of the light is further away from the arrangement surface 3 after leaving the deflecting element 14 than at the time of entry into the deflecting element 14.

[0122] Downstream of the deflecting element 4, or at least partially integrated into it, an optical arrangement 5 is arranged on the arrangement surface 3 in the beam path of the at least one semiconductor laser element 4, which is configured to collimate light L emitted by the at least one semiconductor laser element 4 along at least one direction y, in particular along a fast axis of the light, and which is configured to homogenize light L emitted by the at least one semiconductor laser element 4 along at least one direction z, in particular along a slow axis of the light.

[0123] As shown in Figure 1, the deflecting element 14 is formed by a translucent solid body arranged on the mounting surface 3. The light entry surface 9 and the light exit surface 10 of the deflecting element 14 are designed and tilted relative to the first optical axis 12 such that, due to the refractive index change between the deflecting element 14 and the medium surrounding the deflecting element 14, the light L emitted by the half-liter laser element 4 is deflected, so that it leaves the deflecting element 14 from the light exit surface 10 with a second optical axis that is substantially parallel to the first optical axis 12. In particular, such a shift of the optical axis can be achieved by having the light entry surface 9 and the light exit surface 10 of the deflecting element 14 lie in two mutually parallel planes. 2024 PF00222

[0124] 22

[0125] By shifting the optical axis of the light L emitted by the semiconductor laser element 4, the light L propagates along a direction x parallel to the arrangement surface 3 without collision with the base element 2 up to a greater distance from the facet.

[0126] 5 of the semiconductor laser element 4 is possible, as without such a displacement. This in turn makes it possible to position the optical arrangement 5 at a sufficiently large distance from the semiconductor laser element 4, so that the desired spreading of the light cone has already occurred and can then be collimated and / or homogenized with a corresponding diameter. For this purpose, it may be particularly desirable to shift the optical axis by at least 8 mm, or at least 2 mm in the direction away from the arrangement surface 3.

[0127] In the embodiment shown in Figure 1, the optical arrangement 5 comprises a first optical element 6 and a second optical element 7, which are arranged on the mounting surface 3. In the illustrated case, the first optical element 6 is configured as a FAC lens and is specifically configured to collimate the light L emitted by the semiconductor laser element 4 along a first direction y, such that the light L exits the first optical element 6 in a collimated manner. The second optical element 7, on the other hand, is configured as a multi-lens array (MLA) and is specifically configured to homogenize the light L emitted by the at least one semiconductor laser element 4 along at least one direction z, in particular along a slow axis of the light.

[0128] In contrast to an arrangement stacked in the direction perpendicular to the arrangement surface 3 (y-direction), the illustrated arrangement ("stacking" in the x-direction) provides a very compact laser package 1. Furthermore, the illustrated arrangement achieves a very low residual divergence of less than ± 0.05°, since the optical components of the optical arrangement 5 are arranged on the same substrate / base element 2 as the semiconductor laser element 4, thus preventing defocusing of the lens 6 due to temperature differences. 2024 PF00222

[0129] 23

[0130] Figure 2 shows a further embodiment of the laser package 1 shown in Figure 1, which additionally comprises a filler material 17 that is provided between the laser facet of the semiconductor laser element 4 and the deflection element 14. The filler material can be

[0131] 5 in particular is a transparent material which has a different refractive index than the material of the semiconductor laser element 4 and the deflecting element 14, and serves, among other things, to protect the laser facet.

[0132] Figure 3 shows a further development of the deflecting element 14. The deflecting element 14 is formed by a translucent solid body arranged on the mounting surface 3. The deflecting element 14 has a first and a second reflective surface 15, 16, which are arranged and configured such that the light L emitted by the half-liter laser element 4 is deflected such that it exits the deflecting element 14 from the light-exit surface 10 with a second optical axis that is substantially parallel to the first optical axis 12. The reflective surfaces 15, 16 can each be two surfaces coated with a reflective coating.

[0133] The reflective surfaces 15, 16 achieve multiple reflections within the deflecting element. This serves to shift the optical axis of the light L emitted by the semiconductor laser element 4 and simultaneously lengthen the path traveled by the light within the laser package 1 without increasing the size of the laser package 1, thus achieving the desired spreading of the light before collimation. The two reflective surfaces 15, 16 shown are exemplary; multiple reflective surfaces can also be provided to shift the optical axis of the light L emitted by the semiconductor laser element 4.

[0134] Figures 4 and 5 each show an embodiment of a laser package 1 in which at least part of the optical arrangement 5 is integrated into the deflecting element 14. As shown in Figure 4, for example, one of the reflective surfaces can be designed as follows: 2024 PF00222

[0135] - 24 - be, for example, curved, in order to collimate the light L emitted by the semiconductor laser element 4 along a first direction y, so that the light L leaves the deflecting element in a collimated manner. Likewise, as shown in Figure 5, the light exit surface 10 can also be designed, for example, lens-shaped, to collimate the light L emitted by the semiconductor laser element 4 along a first direction y, so that the light L leaves the deflecting element 14 in a collimated manner. 0 Not shown, but equally conceivable, is an additional or alternative configuration in which a reflective surface and / or the light exit surface 10 is designed to homogenize the light L emitted by the at least one semiconductor laser element 4 along at least one direction z, in particular along a slow axis of the light, so that the light L leaves the deflecting element 14 in a homogenized manner.

[0136] 2024 PF00222

[0137] - 25 -

[0138] REFERENCE MARK LIST

[0139] 1 laser package

[0140] 5 2 Floor element

[0141] 3 Arrangement area

[0142] 4 semiconductor laser element

[0143] 5 optical arrangement

[0144] 6 first optical element

[0145] 7 second optical element

[0146] 9 Light entry area

[0147] 10 Light emission area

[0148] 11 Cover element

[0149] 12 first optical axis

[0150] 13 second optical axis

[0151] 14 Deflection element

[0152] 15 reflective surfaces

[0153] 16 reflective surfaces

[0154] 17 Filling material

[0155] 18 light emission area

[0156] 19 windows

[0157] 20 contact area

[0158] 22 Submount

[0159] 23 Interior

[0160] 25

[0161] 26 x, y, z direction d distance

[0162] L Light 5

Claims

2024PF00222 - 26 - PATENT CLAIMS 1. Laser package (1) comprising: 5 a base element (2) having an arrangement surface (3) on which at least one semiconductor laser element (4) is arranged, wherein the semiconductor laser element (4) is configured to emit light (L) along a first optical axis (12) which is substantially parallel to the arrangement surface (3); a one-piece deflecting element (14) which is arranged in the beam path of the at least one semiconductor laser element (4) on the arrangement surface (3) and is configured to couple the light (L) emitted along the first optical axis (12) and coupled in via a light entry surface (9) of the deflecting element (14) out via a light exit surface (10) of the deflecting element (14) along a second optical axis (13) which is substantially parallel to the first optical axis (12);and an optical arrangement (5) which is arranged downstream of the deflecting element (14) in the beam path of the at least one semiconductor laser element (4) on the arrangement surface (3) and which is configured to collimate light (L) emitted by the at least one semiconductor laser element (4) along at least one direction (y), in particular along a fast axis of the light, and / or which is configured to homogenize light (L) emitted by the at least one semiconductor laser element (4) along at least one direction (z), in particular along a slow axis of the light.

2. Laser package according to claim 1, wherein the optical arrangement (5) comprises at least one consisting of a microlens array; a collimating lens; and a prism 5 .

3. Laser package according to claim 1 or 2, 2024PF00222 - 27 - wherein the optical arrangement (5) comprises a first optical element (6) for collimating the light (L) emitted by the at least one semiconductor laser element (4) along at least one direction (y) , in particular along a fast axis of the light, to 5.

4. Laser package according to one of the preceding claims, wherein the optical arrangement (5) comprises a second optical element (7) for homogenizing the light (L) emitted by the at least one semiconductor laser element (4) along at least one direction (z), in particular along a slow axis of the light.

5. Laser package according to one of the preceding claims, wherein the light entry surface (9) and / or the light exit surface (10) is tilted relative to the arrangement surface (3), and in particular forms an angle of less than 90° with the arrangement surface (3).

6. Laser package according to one of the preceding claims, wherein the light entry surface (9) and the light exit surface (10) are substantially parallel to each other.

7. Laser package according to one of the preceding claims, wherein the deflecting element (14) comprises at least a first and a second reflective surface (15, 16) opposite the first, which are arranged in the beam path of the at least one semiconductor laser element (4) between the light entry surface (9) and the light exit surface (10).

8. Laser package according to claim 7, wherein the first and / or second reflective surface (15, 16) is tilted relative to the arrangement surface (3), and in particular makes an angle of less than 90° with the arrangement surface (3).

9. Laser package according to claim 7 or 8, 2024PF00222 28 wherein the optical arrangement (5) comprises at least one of the first and second reflecting surfaces (15, 16), and at least one of the first and second reflecting surfaces (15, 16) is formed by a semiconductor of which at least one 5 laser element (4) to collimate emitted light (L) along at least one direction (y) , in particular along a fast axis of the light.

10. Laser package according to one of the preceding claims, wherein the optical arrangement (5) comprises the light-emitting surface (10), and the light-emitting surface (10) is configured to collimate light (L) emitted by the at least one semiconductor laser element (4) along at least one direction (y), in particular along a fast axis of the light.

11. Laser package according to one of the preceding claims, wherein a perpendicular distance (d) between the first and the second optical axis (12, 13) is at least 2 mm.

12. Laser package according to one of the preceding claims, further comprising a lid element (11) which is arranged on the arrangement surface (3) and forms a frame which encapsulates the at least one semiconductor laser element (4), the deflection element (14) and the optical arrangement (5) with the base element (2).

13. Laser package according to claim 12, wherein the cover element (11) is at least partially transparent to light (L) emitted by the at least one semiconductor laser element (4); and / or comprises a window (19) in the beam path of the at least one semiconductor laser element (4) downstream of the optical arrangement (5).

14. Laser package according to claim 12 or 13, 5 wherein the optical arrangement (5) comprises a third optical element (8) which is integrated into the lid element (11) and is formed integrally with the lid element (11). 2024PF00222 29 15. Laser package according to one of claims 12 to 14, wherein the at least one semiconductor laser element (4) is hermetically encapsulated in the interior (23) between the base element (2) and the lid element (11). 5 16. Laser package according to one of the preceding claims, wherein a submount (22) is arranged between the at least one semiconductor laser element (4) and the base plate (2).

17. Laser package according to one of the preceding claims, wherein the at least one semiconductor laser element (4) is formed by a multi-channel laser and / or the laser package (1) comprises a plurality of semiconductor laser elements (4).

18. Method for manufacturing a laser package (1), in particular a laser package according to one of the preceding claims, comprising the steps: Providing a base element (2) having an arrangement surface (3) on which at least one semiconductor laser element (4) is arranged, wherein the semiconductor laser element (4) is configured to emit light (L) along a first optical axis (12) which is substantially parallel to the arrangement surface (3); Providing a one-piece deflecting element (14) in the beam path of the at least one semiconductor laser element (4) on the mounting surface (3), wherein the deflecting element (14) is configured to couple the light (L) emitted along the first optical axis (12) and coupled in via a light entry surface (9) of the deflecting element (14) out via a light exit surface (10) of the deflecting element (14) along a second optical axis (13) which is substantially parallel to the first; and Providing an optical arrangement (5) in the beam path of the at least one semiconductor laser element (4) arranged downstream of the deflecting element (14) on the arrangement surface (3), wherein the optical arrangement (5) is configured to direct light (L) emitted by the at least one semiconductor laser element (4) along the beam path. 2024PF00222 - 30 - collimating at least one direction (y) , in particular along a fast axis of the light and / or which is designed to homogenize light (L) emitted by the at least one semiconductor laser element (4) along at least one direction (z) , in particular along a slow axis of the light.

19. The method of claim 18, wherein the step of providing the optical arrangement (5) comprises placing a first optical element (6) for collimating the light (L) emitted by the at least one semiconductor laser element (4) along at least one direction (y), in particular along a fast axis of the light, on the arrangement surface (3); and / or wherein the step of providing the optical arrangement (5) comprises placing a second optical element (7) for homogenizing the light (L) emitted by the at least one semiconductor laser element (4) along at least one direction (z), in particular along a slow axis of the light, on the arrangement surface (3).

20. The method according to claim 18 or 19 further comprises providing a cover element (11) on the arrangement surface (3), wherein the cover element (11) forms a frame that encapsulates the at least one semiconductor laser element (4), the deflecting element (14) and the optical arrangement (5) with the base element (2).

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