Electronic device and assembling method for electronic device

Abstract

The present application relates to the technical field of terminals, and provides an electronic device and an assembling method for the electronic device, for use in solving the problems of low internal space utilization and excessive thickness in electronic devices. The electronic device comprises a housing and a microphone module; a sound pickup hole is formed on the housing; the microphone module is located in the housing; the microphone module comprises a support plate and a microphone; the support plate is fixed to the housing; the Young's modulus of the support plate is greater than that of the housing; the microphone is fixed to the support plate; the microphone is provided with a first sound pickup channel; and the first sound pickup channel is communicated with the sound pickup hole.

Description

Electronic devices and their assembly methods

[0001] This application claims priority to Chinese Patent Application No. 202411222224.7, filed with the State Intellectual Property Office of China on August 30, 2024, entitled "Electronic Device and Method for Assembling an Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of terminal technology, and in particular to an electronic device and a method for assembling the electronic device. Background Technology

[0003] A microphone module is an energy conversion device that converts sound signals into electrical signals. It is a crucial piece of hardware in electronic devices such as headphones, mobile phones, loudspeakers, and smartwatches for enabling call, amplification, and human-computer interaction functions. Microphone modules are installed inside electronic devices, and due to the trend towards thinner and lighter devices, internal space is limited.

[0004] Therefore, how to improve the utilization rate of the internal space of electronic devices and thereby reduce the thickness of electronic devices has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] This application provides an electronic device and an assembly method for the electronic device, which is beneficial to improving the internal space utilization of the electronic device and reducing the thickness of the electronic device.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] In a first aspect, this application provides an electronic device, which includes a housing and a microphone module. The housing has a pickup hole. The microphone module is located inside the housing and includes a support plate and a microphone. The support plate is fixed to the housing, and the Young's modulus of the support plate is greater than that of the housing. The microphone is fixed to the support plate and has a first pickup channel that communicates with the pickup hole.

[0008] In this way, the microphone module is fixed inside the housing by a support plate. The support plate has a high Young's modulus and high rigidity, providing more stable support for the microphone module. Furthermore, because the Young's modulus of the support plate is higher than that of the housing, the thickness of the support plate can be designed to be thinner than that of the housing, while still providing sufficient support for the microphone module.

[0009] Furthermore, the microphone module is supported and fixed within the housing by a thinner support plate. The thickness of the electronic device includes at least the thickness of the housing and the thickness of the support plate. Because the support plate is thinner, the overall thickness of the electronic device can be reduced, which is beneficial for achieving a slimmer design.

[0010] Furthermore, given a fixed overall thickness of the electronic device, a thinner support plate occupies less internal space within the casing, freeing up more installation space for other structural components and improving the utilization rate of the internal space of the casing.

[0011] In one possible implementation, the thickness of the support plate is less than or equal to 0.25 mm, and / or greater than or equal to 0.1 mm. A thickness greater than or equal to 0.1 mm meets the structural strength requirements for supporting and fixing the microphone module, ensuring sufficient support and fixation. Furthermore, a thickness of less than or equal to 0.25 mm facilitates a thinner microphone module, and the smaller internal space occupied by the support plate allows for more space to be allocated for other structural components, improving the flexibility of the internal structural component layout of the electronic device.

[0012] In one possible implementation, the support plate is a metal plate. For example, aluminum, aluminum alloy, titanium, titanium alloy, stainless steel, etc. In this way, the metal plate has a high Young's modulus, the thickness of the metal plate can be designed to be thinner, and it can also provide sufficient support for the microphone module.

[0013] In one possible implementation, the support plate includes a main body that is flat, and the microphone module also includes a flexible circuit board disposed between the microphone and the main body.

[0014] In this way, the support plate is flat, which simplifies its structure and manufacturing process, thus improving production efficiency. Furthermore, the flat support plate also simplifies assembly, enhancing the overall assembly efficiency of electronic devices and facilitating mass production.

[0015] In one possible implementation, the support plate further includes a first mating part connected to the edge of the main body, and the outer shell includes a second mating part. The first mating part and the second mating part are stacked and fixedly connected in the thickness direction of the main body.

[0016] Since the first mating part and the second mating part are arranged in the thickness direction of the main body, it is convenient to apply pressure to the first mating part or the second mating part when performing pressure holding treatment, thereby ensuring the adhesion of the first mating part and the second mating part.

[0017] In one possible implementation, the support plate further includes a first mating portion and a bending portion. The main body and the first mating portion are spaced apart along the thickness direction of the main body, and the bending portion connects the main body and the first mating portion. The outer shell includes a second mating portion, and the first and second mating portions are stacked and fixedly connected.

[0018] In this way, the support plate is bent, which allows it to better fit the shape of the outer casing, ensuring a tight fit between the first and second mating parts. Furthermore, the bent portion of the support plate allows the main body to be inserted into the narrow space inside the casing, improving the utilization of the internal space of the electronic device.

[0019] In one possible implementation, the microphone module also includes a reinforcing plate disposed between the flexible circuit board and the main body. This allows for a thinner electronic device, specifically reducing the thickness difference between the support plate and the third wall plate, thus contributing to a slimmer design. The reinforcing plate supports and secures the flexible circuit board, making its surface smoother. Because the reinforcing plate is flat, flux can be evenly applied to the surface of the flexible circuit board, thereby improving the soldering quality between the microphone and the flexible circuit board.

[0020] In one possible implementation, the electronic device further includes an adhesive portion that connects the first mating portion and the second mating portion.

[0021] In summary, the first mating part and the second mating part are connected by an adhesive part, ensuring the connection strength between them. Furthermore, the adhesive part seals the gap between the first and second mating parts, thereby improving their sealing performance. This reduces the entry of dust, moisture, and other contaminants into the electronic device through the gap, thus enhancing its durability.

[0022] In one possible implementation, one end of the first pickup channel forms a pickup port, the orientation of which is parallel to the thickness direction of the main body. The orthographic projection of the pickup port onto a reference plane does not overlap with the orthographic projection of the pickup aperture onto the reference plane, which is perpendicular to the thickness direction of the main body.

[0023] In this way, the microphone opening and microphone hole are staggered in the thickness direction of the main body, which can prevent external wind from blowing directly to the microphone opening through the microphone hole, which helps to reduce wind noise when the microphone is picking up sound, thereby improving the microphone's sound pickup effect.

[0024] In one possible implementation, the main body divides the outer shell into a second pickup channel and a first accommodating cavity, with the second pickup channel connected to both the pickup port and the first pickup channel. The microphone is fixed within the first accommodating cavity, with the pickup port facing the main body. The main body has a first through hole, which is connected to both the pickup port and the second pickup channel.

[0025] In this way, the sound enters the microphone through the pickup hole into the second pickup channel inside the housing. The sound is then transmitted through the second pickup channel to the first through hole, and then back into the first pickup channel from the first through hole to be picked up by the microphone. This bottom-out sound method can lengthen the path of the sound to the microphone. After passing through the first and second pickup channels, some noise can be reduced, thereby improving the microphone's sound pickup effect.

[0026] In one possible implementation, the main body and a portion of the outer casing form a second accommodating cavity, with the microphone located within the second accommodating cavity and its pickup port facing away from the main body. This approach improves microphone pickup performance while also contributing to a thinner electronic device.

[0027] In one possible implementation, the microphone module further includes a seal disposed between the microphone and the housing. The seal includes a fourth through hole, the orthographic projection of which overlaps with the orthographic projection of the pickup port on the reference surface. The reference surface is perpendicular to the thickness direction of the support plate.

[0028] In this way, the seal seals the gap between the microphone and the fourth wall panel, thereby improving the sealing between the microphone and the fourth wall panel, ensuring that the sound enters the first pickup channel through the pickup port, preventing sound leakage outside the pickup port, and thus improving the microphone's pickup effect.

[0029] In one possible implementation, one end of the first pickup channel forms a pickup port, the orientation of which is parallel to the thickness direction of the main body. The orthographic projection of the pickup port onto a reference surface overlaps with the orthographic projection of the pickup aperture onto the reference surface, which is perpendicular to the thickness direction of the main body. The microphone is used for noise reduction.

[0030] In one possible implementation, the electronic device also includes a speaker module, with the housing comprising a steel mesh. A portion of the steel mesh is used for sound output from the speaker module, and another portion serves as a pickup port. This reduces the area of ​​the microphone's output port that is obstructed, thereby minimizing interference from the microphone module with sound propagation, ensuring clear and accurate sound from the speaker module, and also reducing the impact of the microphone module on the speaker module's sound quality.

[0031] In one possible implementation, the microphone module further includes an acoustic mesh, which is stacked on the side of the main body opposite to the microphone and covers the sound outlet. In another possible implementation, the acoustic mesh is stacked on the side of the main body facing the microphone and covers the sound outlet. In yet another possible implementation, the microphone module further includes an acoustic mesh, which is stacked between the seal and the housing and covers the pickup port.

[0032] The placement of acoustic meshes offers high flexibility. Their location can be optimized based on acoustic principles to reduce sound reflection and refraction, improving clarity and accuracy, thereby optimizing microphone acoustic performance and enhancing noise reduction. This flexibility also increases the flexibility of internal space layout within electronic devices, ultimately improving space utilization.

[0033] Secondly, this application also provides a method for assembling an electronic device, the method comprising:

[0034] A support plate and a microphone are provided, and the microphone is fixed to the support plate to form a microphone module, wherein the Young's modulus of the support plate is greater than that of the outer shell.

[0035] Provide an outer casing to secure the support plate inside.

[0036] The assembly method provided in the second aspect of this application, since it is used to assemble the aforementioned electronic device, can solve the same technical problem and achieve the same technical effect. Attached Figure Description

[0037] Figure 1 is a perspective view of a wired headphone provided in some embodiments of this application;

[0038] Figure 2 is a perspective view of a TWS earphone provided in some embodiments of this application;

[0039] Figure 3 is a perspective view of the OWS headset provided in some embodiments of this application;

[0040] Figure 4 shows an application scenario of OWS headphones being worn on a user's ear;

[0041] Figure 5 is a schematic diagram of a cross-sectional structure of the OWS headset at line AA as shown in Figure 3;

[0042] Figure 6 is a schematic diagram of another cross-sectional structure of the OWS headphones at line AA as shown in Figure 3;

[0043] Figure 7 is a perspective view of the OWS headset provided in some embodiments of this application from another angle;

[0044] Figure 8 is a schematic diagram of a cross-sectional structure of the OWS headset at the BB line as shown in Figure 7;

[0045] Figure 9 is a schematic diagram of the structure of the electronic device shown in Figure 8 as viewed from angle C;

[0046] Figure 10 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0047] Figure 11 is a flowchart of the assembly process of the microphone module shown in Figure 10;

[0048] Figure 12 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0049] Figure 13 is a flowchart of the assembly process of the microphone module shown in Figure 12;

[0050] Figure 14 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0051] Figure 15 is a flowchart of the assembly process of the microphone module shown in Figure 14.

[0052] Figure 16 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0053] Figure 17 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0054] Figure 18 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0055] Figure 19 is a schematic diagram of the electronic device shown in Figure 18 as viewed from perspective D;

[0056] Figure 20 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0057] Figure 21 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0058] Figure 22 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0059] Figure 23 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0060] Figure 24 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application.

[0061] Reference numerals: 100, Electronic device; 101, First earphone; 102, Second earphone; 103, Connecting cable; 10, Microphone module; 11, Microphone; 111, First pickup channel; 111a, Pickup port; 112, Second pickup channel; 113, Third pickup channel; 12, Flexible circuit board; 12a, Third through hole; 13, Reinforcing plate; 13a, Fifth through hole; 14, Acoustic mesh; 15, First accommodating cavity; 16, Second accommodating cavity; 20, Main body; 21, Outer shell; 211, First wall panel; 212, Second wall panel; 213, Side wall panel; 214, Third wall panel; 214a, Second through hole; 21a, Pickup hole; 215, Fourth wall panel; 22, Support plate; 221, Main body; 221a, First through hole; 222, First mating part; 223, Bending part; 23. Adhesive part; 24. Sound guiding structure; 25. Sealing element; 251. Fourth through hole; 30. Earpiece; 40. Clamping part; 50. Flux; 51. Brush. Detailed Implementation

[0062] In the embodiments of this application, the terms "exemplarily" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0063] In the description of the embodiments of this application, the term "and / or" refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" describes an association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "or" relationship.

[0064] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0065] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0066] In the description of embodiments of this application, the terms "collinear," "parallel," and "equal" include the described situation and situations similar to the described situation, where the range of similarity is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "collinear" means approximately collinearity within a certain error range, which can be an angular deviation of 5°, 10°, or 15° relative to absolute collinearity, or a spacing deviation of no more than 0.05 mm, 0.1 mm, 0.2 mm, 0.5 mm, or 1 mm relative to absolute collinearity. "Parallel" includes absolute parallelism and approximately parallelism, where the acceptable deviation range for approximately parallelism can be, for example, an angular deviation of 5°, 8°, or 10°. "Perpendicular" includes absolute perpendicularity and approximately perpendicularity, where the acceptable deviation range for approximately perpendicularity can also be, for example, a deviation of 5°, 8°, or 10°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality is, for example, the difference between the two equals is less than or equal to 5% of either one.

[0067] This application provides an electronic device, which is a type of electronic device with a microphone module. Specifically, the electronic device includes, but is not limited to, electronic products and headphones. Electronic products include, but are not limited to, mobile phones, tablet personal computers, laptop computers, personal digital assistants (PDAs), personal computers, laptops, in-vehicle devices, wearable devices, portable music players, radios, televisions, and speakers. Wearable devices include, but are not limited to, smart bracelets, smartwatches, smart head-mounted displays, and smart glasses. When the electronic device is a headphone, the headphone includes, but is not limited to, wired headphones and wireless headphones; wireless headphones can be TWS headphones or OWS headphones.

[0068] In more detail, the electronic device can be a wired headset with a microphone module. Please refer to Figure 1, which is a perspective view of a wired headset according to some embodiments of this application. The wired headset 100 has a first earpiece 101, a second earpiece 102, and a connecting cable 103, wherein the first earpiece 101 and the second earpiece 102 are connected via the connecting cable 103. The microphone module 10 can be disposed on at least one of the first earpiece 101 and the second earpiece 102.

[0069] Wired headphones may be inconvenient to wear and require connection to electronic devices via a headphone jack, consuming the power of the electronic devices during operation.

[0070] Wireless headphones can communicate with other electronic devices using wireless communication technologies (such as Bluetooth, infrared radio frequency, 2.4G wireless technology, ultrasound, etc.). Compared with wired headphones, wireless headphones are more convenient to use because they are free from the constraints of physical wires.

[0071] Wireless headphones include True Wireless Stereo (TWS) headphones and Open Wearable Stereo (OWS) headphones.

[0072] Please refer to Figure 2, which is a perspective view of a TWS earphone provided in some embodiments of this application. TWS earphones are mostly in-ear or semi-in-ear types. Specifically, the TWS earphone has a body portion 20 and an earpiece portion 30. The body portion 20 integrates structures such as a microphone module 10, a wireless communication module, a circuit board, and a speaker module. The earpiece portion 30 is connected to the body portion 20. The earpiece portion 30 can extend into the user's ear canal. The TWS earphone can wirelessly connect to electronic products through the wireless communication module, greatly facilitating user use.

[0073] Please refer to Figure 3, which is a perspective view of an OWS headset provided in some embodiments of this application. The OWS headset includes a body portion 20 and a clamping portion 40, the clamping portion 40 being connected to the body portion 20.

[0074] The main body 20 includes structural components and electronic components such as a housing 21, a microphone module 10, a battery (not shown in the figure), and a circuit board (not shown in the figure). It is understood that Figure 3 only schematically shows some of the components included in the main body 20, and the actual shape, size, position, and structure of these components are not limited by Figure 3.

[0075] The outer casing 21 may have a cylindrical or irregular shape, among other things. In this embodiment, the outer casing 21 is described as having a cylindrical shape. The outer casing 21 may include a first wall panel 211 and a second wall panel 212 disposed opposite to each other, and a side wall panel 213 connected between the first wall panel 211 and the second wall panel 212.

[0076] The housing 21 can serve as a carrier for devices such as the microphone module 10, battery, and circuit board, accommodating these devices within it. It is understood that in other embodiments, the battery may not be housed within the housing 21, but rather within the clamping portion 40.

[0077] The clamping part 40 may be curved. For example, the clamping part 40 may be generally C-shaped. The material of the clamping part 40 may include, but is not limited to, plastic or rubber.

[0078] When a user wears the OWS headphones, please refer to Figure 4, which illustrates an application scenario of the OWS headphones being worn on a user's ear. The main body 20 is located outside the user's ear canal and near the entrance of the ear canal. The clamping part 40 can be held in place on the user's ear. In other embodiments, the clamping part 40 may cooperate with the main body 20 to clamp the user's ear. Since the OWS headphones do not extend into the user's ear canal, the user's wearing comfort and fit are higher.

[0079] The structure, location, and installation method of the microphone module 10 are described in detail below.

[0080] Please refer to Figures 3 and 5 together. Figure 5 is a schematic cross-sectional view of the OWS headset shown in Figure 3 at line AA. In this embodiment, the description uses the electronic device 100 as an example of an OWS headset, but this does not constitute a specific limitation on this application. It is understood that Figure 5 only schematically shows some components included in the microphone module 10, and the actual shape, size, position, and structure of these components are not limited by Figure 5.

[0081] Based on their functions, microphone modules 10 can be divided into communication microphone modules, noise-canceling microphone modules, and communication noise-canceling microphone modules. Communication microphone modules are used to capture user voices during calls, recordings, and other scenarios, converting sound into electrical signals. Noise-canceling microphone modules are used to capture ambient noise; the electronic device 100 generates sound waves with the opposite phase to the ambient noise to cancel it out, thereby reducing background noise heard by the user. Communication noise-canceling microphone modules can combine the functions of both communication microphone modules and noise-canceling microphone modules.

[0082] The electronic device 100 may include at least one microphone module 10. The microphone module 10 may be a communication microphone module, a noise-canceling microphone module, or a communication noise-canceling microphone module. This application describes the electronic device 100 as having two microphone modules 10, one of which is a communication microphone module and the other is a noise-canceling microphone module.

[0083] First, let's take microphone module 10 as an example of a communication microphone module. Please refer to Figure 5 for details. Microphone module 10 includes microphone 11, circuit board (not shown in the figure), flexible circuit board 12, reinforcing plate 13, and acoustic mesh 14.

[0084] The microphone 11 can be a dynamic microphone, a condenser microphone, an electret microphone, etc. The microphone 11 is an audio capture component of the electronic device 100. The microphone 11 converts sound signals into electrical signals so that the electronic device 100 can further process and transmit them.

[0085] The circuit board is used to convert and process the output signal of the microphone 11, enabling the output signal of the microphone 11 to communicate with other system components. However, due to the limited internal space of the electronic device 100, the circuit board is usually located in a larger space inside the housing 21, while the microphone 11 is usually located near the pickup hole 21a on the housing 21.

[0086] Therefore, the distance between the microphone 11 and the circuit board is relatively large, and a flexible printed circuit board (FPCB) is usually required to connect the microphone 11 and the circuit board.

[0087] A flexible circuit board 12 is disposed on one side of the microphone 11, and the microphone 11 is electrically connected to the flexible circuit board 12. Because the flexible circuit board 12 is relatively soft, it is easy to bend and fold. A reinforcing plate 13 is stacked on the surface of the flexible circuit board 12 facing away from the microphone 11. The reinforcing plate 13 can provide additional mechanical support for the flexible circuit board 12, enhancing its stability.

[0088] The sound barrier 14 is stacked on the surface of the reinforcing plate 13 on the side opposite to the microphone 11, and the sound barrier 14 covers the first pickup channel 111. The sound barrier 14 is used to reduce the influence of external ambient noise on the microphone 11 pickup, so as to improve the signal-to-noise ratio and sound clarity of the microphone 11.

[0089] The microphone module 10 is fixed inside the housing 21. Specifically, the housing 21 may include a first part and a second part. The first part serves as the exterior surface of the electronic device 100, protecting the internal structural components. The first part may include a first wall panel 211, a second wall panel 212, and a side wall panel 213. The second part is located within the first part and supports and fixes the internal structural components of the electronic device 100. The second part may include a third wall panel 214, and the microphone module 10 is fixed to the first part via the third wall panel 214.

[0090] The first part of the outer casing 21 is provided with a sound pickup hole 21a. The sound pickup hole 21a can be provided on the first wall panel 211 or on the side wall panel 213. In this embodiment, the sound pickup hole 21a is provided on the first wall panel 211 as an example.

[0091] The pickup hole 21a is the entrance for external sound to enter the interior of the housing 21. The microphone 11 includes a first pickup channel 111 connected to the pickup hole 21a, and one end of the first pickup channel 111 forms a pickup port 111a. Sound enters the first pickup channel 111 through the pickup port 111a and acts on the diaphragm of the microphone 11. The diaphragm converts the sound wave into mechanical vibration, and the microphone 11 converts the mechanical vibration into an electrical signal, which is then transmitted to the circuit board.

[0092] The flexible circuit board 12 has a third through hole 12a, and the reinforcing plate 13 has a fifth through hole 13a. The third through hole 12a and the fifth through hole 13a are used to avoid the pickup port 111a, so that the pickup port 21a is connected to the first pickup channel 111.

[0093] Furthermore, to improve the sound pickup effect of the microphone 11, the orthographic projection of the pickup hole 21a on the reference plane does not overlap with the orthographic projection of the pickup port 111a on the reference plane, and the reference plane is perpendicular to the thickness direction of the third wall plate 214. A second sound pickup channel 112 is formed between the first wall plate 211 and the third wall plate 214, and the second sound pickup channel 112 connects the pickup hole 21a and the pickup port 111a. The third wall plate 214 has a second through hole 214a, and the second through hole 214a connects the first sound pickup channel 111 and the second sound pickup channel 112.

[0094] In this way, sound enters the interior of the housing 21 through the pickup hole 21a, and then enters the first pickup channel 111 via the second pickup channel 112. External wind will not blow directly through the pickup hole 21a to the first pickup channel 111 of the microphone 11. The second pickup channel 112 can reduce wind noise, thereby further improving the sound pickup effect of the microphone 11.

[0095] In some other embodiments, please refer to Figure 6, which is a schematic cross-sectional view of the OWS headset at the AA line according to Figure 3. The difference between this embodiment and the above embodiments is that the pickup hole 21a is disposed on the side wall plate 213.

[0096] In this way, the pickup hole 21a is located on one side of the pickup port 111a, and the orthographic projection of the pickup hole 21a on the reference plane does not overlap with the orthographic projection of the pickup port 111a on the reference plane. Therefore, the electronic device 100 in this embodiment can also reduce wind noise and further improve the sound pickup effect of the microphone 11.

[0097] To reduce the overall weight of the electronic device 100, the housing 21 can typically be made of materials with low density, such as polycarbonate (PC), polyamide (PA), or a mixture of plastics and fibers. Furthermore, to ensure the structural strength of the housing 21, it needs a certain thickness.

[0098] Therefore, for the two embodiments described above, the thickness of the electronic device 100 includes at least the thickness D1 of the first wall panel 211, the thickness D2 of the third wall panel 214, and the height D3 of the second pickup channel 112. The thickness D1 of the first wall panel 211 is greater than 0.45 mm, the thickness D2 of the second part is greater than 0.3 mm, and the height D3 of the second pickup channel 112 is greater than 0.3 mm. Thus, the overall thickness of the electronic device 100 is relatively large, which is detrimental to making the electronic device 100 thinner and lighter.

[0099] The above embodiment is illustrated using microphone module 10 as a communication microphone module as an example. Similarly, when microphone module 10 is a noise-canceling microphone module, there is also the problem of a relatively large overall thickness of electronic device 100. The following description uses microphone module 10 as a noise-canceling microphone module as an example.

[0100] Please refer to Figures 7 and 8. Figure 7 is a perspective view of the OWS headset provided in some embodiments of this application from another angle; Figure 8 is a schematic cross-sectional structure diagram of the OWS headset at the BB line according to Figure 7.

[0101] The structure of the microphone module 10 in this embodiment is the same as that in the above embodiments, and will not be described again here. The difference between the microphone module 10 in this embodiment and the microphone module 10 in the above embodiments is that the microphone module 10 in this embodiment is disposed inside the electronic device 100 on the side near the second wall panel 212.

[0102] The electronic device 100 also includes a speaker module (not shown), which converts electrical signals into sound signals so that the user can hear the sound. The second wall panel 212 can be a steel mesh, which is used for sound emission from the speaker module. Specifically, the sound emitted by the speaker module is transmitted to the outside of the housing through the steel mesh and reaches the user's ears. The pickup hole 21a can be provided on the steel mesh, and the sound enters the interior of the electronic device 100 through the steel mesh.

[0103] The first pickup channel 111 is connected to the steel mesh. Sound enters the first pickup channel 111 through the steel mesh and is picked up by the microphone 11. Because the steel mesh is covered with acoustic mesh, the microphone module 10 cannot be directly fixed to the steel mesh. The microphone module 10 is fixed to the side wall panel 213 by means of the third wall panel 214. The material of the outer shell 21 in this embodiment is the same as that of the outer shell 21 in the above embodiment, and will not be described again here.

[0104] Therefore, the third wall panel 214 in this embodiment also occupies a large internal space, and the electronic device 100 in this embodiment also has the problem of being quite thick.

[0105] In addition, the noise-canceling microphone module also has the following problems, please refer to Figure 9, which is a structural schematic diagram of the electronic device 100 shown in Figure 8 as viewed from perspective C. Since the steel mesh is also used for the sound output of the speaker module, the third wall panel 214 in this embodiment also has the problem that the area of ​​the steel mesh obstructed is relatively large, which affects the sound output effect of the speaker module.

[0106] In summary, fixing the microphone module 10 using the third wall panel 214 of the housing 21 results in a relatively large thickness of the electronic device 100. To solve the above problem, this application also provides an electronic device 100 designed to reduce the thickness of the structural components used to fix the microphone module 10, thereby reducing the overall thickness of the electronic device 100.

[0107] Specifically, please refer to Figure 10, which is a structural schematic diagram of an electronic device 100 provided in some embodiments of this application. The electronic device 100 includes a housing 21 and a microphone module 10. The housing 21 has a pickup hole 21a. The microphone module 10 is located inside the housing 21 and includes a support plate 22 and a microphone 11. The support plate 22 is fixed to the housing 21, and the Young's modulus of the support plate 22 is greater than that of the housing 21. The microphone 11 is fixed to the support plate 22 and has a first pickup channel 111, which is connected to the pickup hole 21a.

[0108] The structure and material of the outer shell 21 in this embodiment are the same as those in the above embodiments. The structure of the microphone module 10 in this embodiment is also the same as that in the above embodiments, and will not be described again here.

[0109] The difference between this embodiment and the previous embodiment is that in this embodiment, the microphone module 10 is fixed inside the housing 21 by means of a support plate 22, while in the previous embodiment, the microphone module 10 is fixed inside the housing 21 by means of a third wall plate 214 of the housing 21. In this embodiment, the Young's modulus of the support plate 22 is greater than that of the housing 21. Young's modulus describes a material's ability to resist deformation within its elastic range and is also a physical quantity describing the stiffness of a material. The larger the Young's modulus, the harder and stiffer the material. Under the same stress, a material with a larger Young's modulus will have smaller strain, thus maintaining the integrity and stability of its structural shape.

[0110] In this way, the microphone module 10 is fixed inside the housing 21 by means of the support plate 22. The support plate 22 has a higher Young's modulus and greater rigidity, providing more stable support for the microphone module 10. Furthermore, since the Young's modulus of the support plate 22 is higher than that of the housing 21, the thickness of the support plate 22 can be designed to be thinner than that of the housing 21, while still providing sufficient support for the microphone module 10.

[0111] Furthermore, the microphone module 10 is supported and fixed within the housing 21 by means of a thinner support plate 22. The thickness of the electronic device 100 includes at least the thickness D1 of the housing 21 and the thickness D4 of the support plate 22. Compared to the embodiment described above, where the microphone module 10 is supported and fixed within the housing 21 by means of a third wall plate 214, the thickness of the support plate 22 is thinner than the thickness of the third wall plate 214. Therefore, the overall thickness of the electronic device 100 can be thinner, which is beneficial for the miniaturization of the electronic device 100.

[0112] Furthermore, given that the overall thickness of the electronic device 100 is constant, the support plate 22 is thinner, and the internal space occupied by the support plate 22 in the outer shell 21 is smaller, which makes room for other structural components and helps to improve the utilization rate of the internal space of the outer shell 21.

[0113] In some embodiments, the thickness of the support plate 22 is greater than or equal to 0.1 mm and less than or equal to 0.25 mm. For example, the thickness of the support plate 22 can be 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, 0.2 mm, 0.21 mm, 0.22 mm, 0.23 mm, 0.24 mm, 0.25 mm, etc.

[0114] When the thickness of the support plate 22 is greater than or equal to 0.1 mm, it can meet the structural strength requirements for supporting and fixing the microphone module 10, ensuring that the support plate 22 provides sufficient support and fixation for the microphone module 10.

[0115] Furthermore, the thickness of the support plate 22 is less than or equal to 0.25 mm, which facilitates the thinning of the microphone module 10. In addition, the support plate 22 occupies less internal space in the housing 21, giving up more installation space for other structural components and improving the flexibility of the internal structural component layout of the electronic device 100.

[0116] To meet the structural strength requirements for supporting and fixing the microphone module 10, the average thickness of the third wall panel 214 in the above embodiment reaches 0.6 mm. Therefore, the electronic device 100 in this embodiment can be reduced in thickness by about 0.5 mm compared to the electronic device 100 in the above embodiment.

[0117] In some embodiments, the support plate 22 is a metal plate, such as aluminum, aluminum alloy, titanium, titanium alloy, stainless steel, etc. In this way, the metal plate has a high Young's modulus, the thickness of the metal plate can be designed to be thinner, and it can also provide sufficient support for the microphone module 10.

[0118] In other embodiments, the support plate 22 can also be a non-metallic material with a high Young's modulus, such as carbon fiber reinforced plastic, glass fiber reinforced plastic, etc. When the support plate 22 is made of the above materials, the Young's modulus of the support plate 22 is also high, and the thickness of the support plate 22 can also be reduced, which is beneficial to the overall thinning of the electronic device 100.

[0119] The structure of the support plate 22 is different for different types of microphone modules 10, and the relative positional relationship between the support plate 22 and the microphone 11 is different. The following is a detailed introduction for different types of microphone modules 10.

[0120] Example 1

[0121] Taking the microphone module 10 as an example of a communication microphone module, the microphone module 10 is located near the first wall panel 211 inside the outer casing 21.

[0122] Please refer to Figure 10. The microphone 11 includes a first pickup channel 111, one end of which forms a pickup port 111a. Based on the relative position of the pickup port 111a and the flexible circuit board 12, the microphone 11 can be classified as a bottom-emitting microphone 11 or a top-emitting microphone 11. Specifically, when the microphone 11 is a bottom-emitting microphone 11, the pickup port 111a faces the surface of the flexible circuit board 12; when the microphone 11 is a top-emitting microphone 11, the pickup port 111a faces away from the surface of the flexible circuit board 12. The flexible circuit board 12 includes a third through-hole 12a, which communicates with the first pickup channel 111.

[0123] In this embodiment, the microphone 11 is a bottom-firing microphone, that is, the pickup port 111a faces the flexible circuit board 12. Furthermore, the orthographic projection of the pickup hole 21a on the reference surface does not overlap with the orthographic projection of the pickup port 111a on the reference surface, and the reference surface is perpendicular to the thickness direction of the flexible circuit board 12.

[0124] In this way, the pickup port 111a and the pickup hole 21a are staggered in the thickness direction of the flexible circuit board 12, which can prevent external wind from blowing directly to the pickup port 111a through the pickup hole 21a, which helps to reduce wind noise when the microphone 11 picks up sound, thereby improving the sound pickup effect of the microphone 11.

[0125] The support plate 22 includes a main body 221, which is stacked on top of the flexible circuit board 12. That is, the thickness direction of the main body 221 is the same as the thickness direction of the flexible circuit board 12. Since the flexible circuit board 12 is made of a soft material and is prone to folding and wrinkling, the main body 221 also serves to support the flexible circuit board 12.

[0126] The main body 221 divides the outer shell 21 into a second pickup channel 112 and a first accommodating cavity 15. The second pickup channel 112 is connected to the pickup hole 21a and the first pickup channel 111, respectively. The microphone 11 is fixed to the side of the main body 221 facing the first accommodating cavity 15, and the pickup port 111a faces the main body 221. The main body 221 has a first through hole 221a, which is connected to the pickup port 111a and the second pickup channel 112, respectively.

[0127] In this way, the sound enters the microphone 11 via the pickup hole 21a into the second pickup channel 112 inside the housing 21, then is transmitted through the second pickup channel 112 to the first through hole 221a, and finally enters the first pickup channel 111 through the first through hole 221a to be picked up by the microphone 11. This bottom-out sound output method extends the path of the sound to the microphone 11. After passing through the first pickup channel 111 and the second pickup channel 112, some noise can be reduced, thereby improving the pickup effect of the microphone 11.

[0128] Furthermore, compared to the second sound pickup channel 112 formed by the first wall panel 211 and the third wall panel 214 of the outer casing 21, the second sound pickup channel 112 in the above embodiment is formed by the main body 221 and the first wall panel 211, and the thickness of the main body 221 is thinner than that of the third wall panel 214. Therefore, the electronic device 100 in this embodiment can ensure the sound pickup effect of the microphone 11 while also facilitating a thinner design.

[0129] In summary, the support plate 22 in this embodiment can both support the flexible circuit board 12 and fix the microphone module 10 inside the housing 21. Compared to the above embodiments, the support plate 22 in this embodiment integrates the functions of the third wall plate 214 and the reinforcing plate 13 in the above embodiments, and the thickness of the support plate 22 is also less than the thickness of the third wall plate 214. Therefore, the electronic device 100 in this embodiment is at least thinner than the thickness of the reinforcing plate 13, and the thickness difference between the support plate 22 and the third wall plate 214 is beneficial to the thinning of the electronic device 100.

[0130] The microphone module 10 is supported and fixed within the housing 21 by means of a support plate 22. In some embodiments, the support plate 22 includes a main body 221 and a first mating part 222 disposed on the edge of the main body 221. The main body 221 is used to connect with the microphone 11, and the first mating part 222 is used to connect with the housing 21. The housing 21 includes a second mating part that mates with the first mating part 222, and the second mating part is formed on the inner wall of the housing 21. The main body 221 is flat, and the first mating part 222 is also flat. The main body 221 and the first mating part 222 are on the same plane, making the support plate 22 as a whole flat.

[0131] In this way, the support plate 22 is flat in shape. The flat support plate 22 has a simple structure, and the manufacturing process of the support plate 22 is also simplified, which is beneficial to the production efficiency of the support plate 22. Furthermore, the assembly process of the flat support plate 22 is also simpler, which is beneficial to improving the overall assembly efficiency of the electronic device 100, and thus beneficial to the mass production of the electronic device 100.

[0132] Please refer to Figure 11, which is a flowchart of the assembly process of the microphone module 10 shown in Figure 10. Some of the stacked layers in the microphone module 10 are omitted in Figure 11. The assembly process of the microphone module 10 may include mounting the flexible circuit board 12 onto the surface of the support plate 22. The flexible circuit board 12 is supported by the support plate 22 to make the surface of the flexible circuit board 12 flatter, which facilitates the subsequent placement of electronic components on the flexible circuit board 12. The microphone 11 can be placed on the flexible circuit board 12 using surface mount technology (SMT).

[0133] Surface mount technology (SMT) is an electronic assembly technology that allows electronic components (such as integrated circuits, resistors, and capacitors) to be directly mounted on a circuit board without the need for leads. SMT improves the efficiency of microphone 11 assembly. Specifically, in the SMT process, flux 50 is applied to the surface of the flexible circuit board 12 to improve the adhesion between the microphone 11 and the flexible circuit board 12, enabling the microphone 11 to be soldered to the surface of the flexible circuit board 12.

[0134] Flux 50 can be applied to the surface of the flexible circuit board 12 by spraying or brushing 51. The nozzle or brush 51 used to apply the flux 50 applies it from one side of the flexible circuit board 12 to the other side, and the process is repeated to cover the flexible circuit board 12 with flux 50. The embodiment shown in Figure 11 uses flux 50 applied to the surface of the flexible circuit board 12 by brushing 51.

[0135] After the microphone module 10 is assembled, it is attached to the inner wall of the electronic device 100 and fixed inside the electronic device 100 by means of the support plate 22. The assembly process of the microphone module 10 is simple and facilitates the improvement of the assembly efficiency of the electronic device 100.

[0136] Please refer to Figure 12, which is a schematic diagram of the structure of an electronic device 100 provided in some embodiments of this application. In other embodiments, the support plate 22 is bent, that is, the main body 221 and the first mating part 222 are not on the same plane. In the thickness direction of the main body 221, the main body 221 and the first mating part 222 are spaced apart. The support plate 22 also includes a bent part 223, which connects the main body 221 and the first mating part 222, and the bent part 223 is in at least partial contact with the outer casing 21.

[0137] In this way, the support plate 22 is bent, which can better fit the shape of the outer shell 21 to ensure a tight fit between the first mating part 222 and the second mating part. In addition, the support plate 22 has a bent part 223, which allows the main body 221 to be inserted into the narrow space inside the outer shell 21, which is beneficial to the utilization of the internal space of the electronic device 100.

[0138] Please refer to Figure 13, which is a flowchart of the assembly process of the microphone module 10 shown in Figure 12. Some of the stacked layers in the microphone module 10 are omitted in Figure 13.

[0139] The assembly process of the microphone module 10 may include mounting the flexible circuit board 12 onto the surface of the main body 221. The flexible circuit board 12 is supported by the main body 221 to make the surface of the flexible circuit board 12 flatter, which facilitates the subsequent placement of electronic components on the flexible circuit board 12. The microphone 11 can be mounted on the flexible circuit board 12 using surface mount technology (SMT).

[0140] Flux 50 can be applied to the surface of the flexible circuit board 12 by spraying or brushing. The nozzle or brush 51 for applying flux 50 applies it from one side of the flexible circuit board 12 to the other side, repeating this process to cover the flexible circuit board 12 with flux 50. However, when the support plate 22 is bent, that is, when the support plate 22 has a bend 223, the bend 223 is located at one end of the movement path of the nozzle or brush 51, and the bend 223 obstructs the movement of the nozzle or brush 51. As a result, the bend 223 hinders the uniform application of flux 50, thereby affecting the subsequent soldering quality between the microphone 11 and the flexible circuit board.

[0141] Therefore, to solve the above problems, please refer to FIG14, which is a structural schematic diagram of an electronic device 100 provided in some embodiments of this application. In order to facilitate the microphone 11 to be connected to the flexible circuit board 12 by surface mount technology, based on any of the above embodiments, the microphone module 10 further includes a reinforcing plate 13. The reinforcing plate 13 is flat and is disposed between the flexible circuit board 12 and the main body 221.

[0142] The microphone module 10 in this embodiment includes at least a support plate 22, a reinforcing plate 13, and a microphone 11. The reinforcing plate 13 is used to support and fix the flexible circuit board 12, so that the surface of the flexible circuit board 12 is flatter, which facilitates the uniform application of flux 50 to the surface of the flexible circuit board 12, thereby improving the welding quality between the microphone 11 and the flexible circuit board 12. The reinforcing plate 13 is fixed to the support plate 22, and the microphone module 10 is fixed inside the housing 21 by means of the support plate 22.

[0143] In this way, the thickness of the electronic device 100 includes at least the thickness of the outer shell 21, the thickness of the support plate 22, the thickness of the reinforcing plate 13, and the thickness of the microphone 11. Compared with the microphone module 10, which is fixed in the outer shell 21 by means of the third wall plate 214, the electronic device 100 in this embodiment is thinner. Specifically, the thickness difference between the support plate 22 and the third wall plate 214 can be reduced, which is beneficial to the thinning of the electronic device 100.

[0144] The reinforcing plate 13 has a fifth through hole 13a, which is connected to the first pickup channel 111 and the second pickup channel 112 respectively.

[0145] Please refer to Figure 15, which is a flowchart of the assembly process of the microphone module 10 shown in Figure 14. Some of the stacked layers in the microphone module 10 are omitted in Figure 15.

[0146] The assembly process of the microphone module 10 may include mounting the flexible circuit board 12 onto the surface of the reinforcing plate 13, with the flexible circuit board 12 supported by the reinforcing plate 13, so that the surface of the flexible circuit board 12 is flatter, making it easier to set electronic components on the flexible circuit board 12 in the future; the microphone 11 can be set on the flexible circuit board 12 by surface mount technology (SMT).

[0147] In the surface mount process, flux 50 is applied to the surface of the flexible circuit board 12 to improve the adhesion between the microphone 11 and the flexible circuit board 12, so that the microphone 11 is soldered to the surface of the flexible circuit board 12. The flux 50 is applied to the surface of the flexible circuit board 12 by a brush 51. The nozzle or brush 51 for applying the flux 50 applies it from one side of the flexible circuit board 12 to the other side, and the process is repeated so that the flux 50 covers the flexible circuit board 12.

[0148] The reinforcing plate 13 is used to support and fix the flexible circuit board 12, so as to make the surface of the flexible circuit board 12 flatter. Since the reinforcing plate 13 is flat, it is easy for the flux 50 to be evenly coated on the surface of the flexible circuit board 12, thereby improving the welding quality between the microphone 11 and the flexible circuit board 12.

[0149] The microphone 11 is fixed to the flexible circuit board 12, and the reinforcing plate 13 is fixed to the main body 221. After the microphone module 10 is assembled, it is assembled to the inner wall of the electronic device 100, and the microphone module 10 is fixed inside the electronic device 100 by means of the support plate 22. The assembly process of the microphone module 10 is simple, which facilitates the improvement of the assembly efficiency of the electronic device 100.

[0150] Based on any of the above embodiments, the first mating part 222 and the second mating part can be connected by means of threaded connection, welding, adhesive bonding, snap-fit, etc. Please continue to refer to Figure 14. In some embodiments, the first mating part 222 and the second mating part are connected by adhesive bonding. Specifically, the electronic device 100 also includes an adhesive part 23, which is connected between the first mating part 222 and the second mating part. The adhesive part 23 can be double-sided tape, ultraviolet curable adhesive, epoxy resin adhesive, etc.

[0151] The bonding process between the first mating part 222 and the second mating part may include coating an adhesive part 23 onto at least one of the first mating part 222 and the second mating part; stacking the first mating part 222 and the second mating part in the thickness direction of the main body part 221; and performing a pressure holding process on the first mating part 222, the second mating part and the adhesive part 23 to ensure that the adhesive part 23 can fully fill the bonding interface, remove air and form a tight bond.

[0152] Since the first mating part 222 and the second mating part are arranged in the thickness direction of the main body part 221, the pressure holding process described above facilitates the application of pressure to the first mating part 222 or the second mating part, thereby ensuring the adhesion between the first mating part 222 and the second mating part.

[0153] In summary, the first mating part 222 and the second mating part are connected by the adhesive part 23, ensuring the connection strength between them. Furthermore, the adhesive part 23 seals the gap between the first mating part 222 and the second mating part, thereby improving their sealing performance. This reduces the amount of dust, moisture, and other contaminants entering the interior of the electronic device 100 through the gap, thus improving the durability of the electronic device 100.

[0154] Furthermore, the good sealing between the first mating part 222 and the second mating part can also prevent sound from entering the microphone 11 through the gap between the first mating part 222 and the second mating part, thereby improving the sound pickup effect of the microphone 11.

[0155] Referring to Figure 14, the microphone module 10 also includes an acoustic mesh 14, which is stacked on the side of the main body 221 facing the microphone 11 and covers the sound outlet. In some other embodiments, please refer to Figure 16, which is a schematic diagram of the structure of an electronic device 100 provided in some further embodiments of this application. The microphone module 10 also includes an acoustic mesh 14, which is stacked on the side of the main body 221 away from the microphone 11 and covers the sound outlet.

[0156] The placement of the acoustic mesh 14 is highly flexible. Its location can be optimized based on acoustic principles to reduce sound reflection and refraction, improve sound clarity and accuracy, and thus optimize the acoustic performance of the microphone 11, enhancing its noise reduction effect. This flexibility in placement also increases the flexibility of the internal space layout of the electronic device 100, thereby improving the utilization rate of the internal space.

[0157] Example 2

[0158] The difference between this embodiment and the aforementioned communication microphone module is that, firstly, the microphone module 10 in this embodiment is located inside the electronic device 100 near the second wall panel 212, which can be a steel mesh. Secondly, the microphone module 10 in this embodiment is a noise-canceling microphone module. Since a noise-canceling microphone module needs to pick up external noise, the microphone module 10 in this embodiment does not need to have a second sound pickup channel 112 to reduce noise pickup.

[0159] Please refer to Figure 17, which is a schematic diagram of the structure of an electronic device 100 provided in some embodiments of this application. Specifically, a portion of the steel mesh can be used as a sound pickup hole 21a, through which sound enters the interior of the electronic device 100. The electronic device 100 also includes a speaker module (not shown in Figure 17), and another portion of the steel mesh can also be used as a sound outlet for the speaker module, through which sound emitted by the speaker module is transmitted to the user's ear.

[0160] The first pickup channel 111 is connected to the steel mesh. Sound enters the first pickup channel 111 through the steel mesh and is picked up by the microphone 11. Because the steel mesh is covered with acoustic mesh, the microphone module 10 cannot be directly fixed to the steel mesh. The microphone module 10 is fixed to the side wall panel 213 by means of the support plate 22.

[0161] As shown in Figure 17, in some embodiments, the support plate 22 can be flat. This flat shape simplifies the structure and manufacturing process, improving production efficiency. Furthermore, the flat support plate 22 simplifies assembly, enhancing the overall assembly efficiency of the electronic device 100 and facilitating mass production.

[0162] Please refer to Figure 18, which is a schematic diagram of the structure of an electronic device provided in some embodiments of this application. In other embodiments, the support plate 22 is bent, that is, the main body 221 and the first mating part 222 are not on the same plane. In the thickness direction of the main body 221, the main body 221 and the first mating part 222 are spaced apart. The support plate 22 also includes a bent part 223, which connects the main body 221 and the first mating part 222, and the bent part 223 is in at least partial contact with the outer casing 21.

[0163] In this way, the support plate 22 is bent, which can better fit the shape of the outer shell 21 to ensure a tight fit between the first mating part 222 and the second mating part. In addition, the support plate 22 has a bent part 223, which allows the main body 221 to be inserted into the narrow space inside the outer shell 21, which is beneficial to the utilization of the internal space of the electronic device 100.

[0164] Please refer to Figure 19, which is a structural schematic diagram of the electronic device 100 shown in Figure 18 viewed from perspective D. Because the support plate 22 in this embodiment has a large Young's modulus, its volume can be set to be small, thus meeting the structural strength requirements for fixing the microphone module 10 within the housing 21. Therefore, the volume of the support plate 22 in this embodiment is smaller than that of the third wall panel 214 in the above embodiment. In the thickness direction of the electronic device 100, the area of ​​the second wall panel 212 obscured by the support plate 22 is also smaller.

[0165] In this way, the area of ​​the sound outlet is less blocked, thereby reducing the interference of the microphone module 10 on sound propagation, ensuring the clarity and accuracy of the speaker module's sound, and also reducing the impact of the microphone module 10 on the speaker module's sound quality.

[0166] Please refer to Figure 20, which is a schematic diagram of the structure of an electronic device 100 provided in some embodiments of this application. The housing 21 also includes a sound guiding structure 24, which is used to transmit sound to the user's ear canal after the user wears the headphones. When the user wears the headphones, the guiding structure is located outside the user's ear canal, shortening the path of sound transmission of the speaker module, thereby improving the sound quality of the speaker module.

[0167] Example 3

[0168] Please refer to Figure 21, which is a structural schematic diagram of an electronic device 100 provided in some embodiments of this application. The difference between this embodiment and Embodiment 1 is that the microphone 11 is a top-firing microphone 11, that is, the pickup port 111a faces away from the flexible circuit board 12. Specifically, the support plate 22 and a part of the outer shell 21 form a second accommodating cavity 16, the microphone 11 is located in the second accommodating cavity 16, and the pickup port 111a faces away from the support plate 22.

[0169] In contrast to the method where the microphone 11 is fixed to the housing 21 by means of the third wall panel 214, in this embodiment, the microphone 11 is fixed inside the housing 21 by means of the support plate 22. The thickness of the support plate 22 is thinner than that of the third wall panel 214 in the above embodiment. Therefore, the electronic device 100 in this embodiment is advantageous for thinning.

[0170] In some embodiments, the orthographic projection of the pickup hole 21a onto the reference plane does not overlap with the orthographic projection of the pickup port 111a onto the reference plane, and the reference plane is perpendicular to the thickness direction of the flexible circuit board 12. Specifically, a portion of the housing 21 forms a third pickup channel 113, which is connected to the pickup hole 21a and the first pickup channel 111, respectively.

[0171] In this way, the path of sound entering the microphone 11 is as follows: the sound enters the third pickup channel 113 inside the housing 21 through the pickup hole 21a, and the sound is transmitted to the first pickup channel 111 through the third pickup channel 113 so that it can be picked up by the microphone 11. The third pickup channel 113 extends the path of sound to the microphone 11. After passing through the first pickup channel 111 and the third pickup channel 113, some noise can be reduced to improve the sound pickup effect of the microphone 11.

[0172] In some embodiments, the housing 21 may include a first wall panel 211 and a fourth wall panel 215, with the third pickup channel 113 located between the first wall panel 211 and the fourth wall panel 215. In this way, the electronic device 100 in this embodiment replaces the third wall panel 214 with a support plate 22, and the electronic device 100 at least reduces the thickness difference between the third wall panel 214 and the support plate 22. This improves the pickup effect of the microphone 11 and facilitates the thinning of the electronic device 100.

[0173] Because of its small size, when the microphone 11 is a top-firing microphone, its pickup port 111a faces the fourth wall panel 215. When the microphone module 10 is assembled onto the housing 21, a gap can easily form between the microphone 11 and the fourth wall panel 215. When sound enters the pickup port 111a from the outside, sound leakage can easily occur at this gap, thus affecting the microphone 11's pickup performance.

[0174] To avoid the above problems, the microphone module 10 also includes a seal 25. In some embodiments, the seal 25 is disposed between the microphone 11 and the fourth wall plate 215. The seal 25 includes a fourth through hole 251. The orthographic projection of the fourth through hole 251 on the reference surface overlaps with the orthographic projection of the pickup port 111a on the reference surface. The reference surface is perpendicular to the thickness direction of the support plate 22.

[0175] Please refer to Figure 22, which is a schematic diagram of the structure of an electronic device provided in some embodiments of this application. In some other embodiments, a portion of the seal 25 is disposed between the microphone 11 and the fourth wall panel 215, and another portion of the seal 25 is disposed around the microphone 11.

[0176] In this way, the seal 25 seals the gap between the microphone 11 and the fourth wall panel 215, thereby improving the sealing between the microphone 11 and the fourth wall panel 215, ensuring that the sound enters the first pickup channel 111 through the pickup port 111a, avoiding sound leakage outside the pickup port 111a, and thus improving the pickup effect of the microphone 11.

[0177] The microphone module 10 also includes an acoustic mesh 14, which is stacked between the seal 25 and the first portion and covers the pickup port 111a. In some other embodiments, the acoustic mesh 14 may also be disposed on the side of the fourth wall panel 215 opposite to the second accommodating cavity 16. The acoustic mesh 14 is used to reduce the impact of external ambient noise on the microphone 11's sound pickup, thereby improving the signal-to-noise ratio and sound clarity of the microphone 11.

[0178] In some other embodiments, please refer to FIG23, which is a schematic diagram of the structure of an electronic device 100 provided in some further embodiments of this application. The electronic device 100 also includes a reinforcing plate 13, which supports the flexible circuit board 12. The reinforcing plate 13 and a portion of the housing 21 form a second accommodating cavity 16. The microphone 11 is located in the second accommodating cavity 16, and the pickup port 111a faces away from the reinforcing plate 13. A support plate 22 is located on the side of the microphone 11 facing away from the flexible circuit board 12, and a third pickup channel 113 is formed between the support plate 22 and the first wall panel 211.

[0179] In this way, the electronic device 100 in this embodiment replaces the third wall panel 214 with the reinforcing plate 13 and the fourth wall panel 215 with the support plate 22. The electronic device 100 at least reduces the thickness difference between the third wall panel 214 and the reinforcing plate 13, as well as the thickness difference between the fourth wall panel 215 and the support plate 22. While improving the sound pickup effect of the microphone 11, this also facilitates the thinning of the electronic device 100.

[0180] Furthermore, adhesive foam is provided between the microphone 11 and the support plate 22. The adhesive foam can seal the gap between the microphone 11 and the support plate 22, thereby improving the sealing between the microphone 11 and the support plate 22, ensuring that the sound enters the first pickup channel 111 through the pickup port 111a, avoiding sound leakage outside the pickup port 111a, and thus improving the pickup effect of the microphone 11.

[0181] Example 4

[0182] The following explanation will be based on the example of microphone module 10 being a noise-canceling microphone module, and microphone 11 in microphone module 10 being a top-firing microphone 11.

[0183] Please refer to Figure 24, which is a schematic diagram of the structure of an electronic device 100 provided in some embodiments of this application. The orthographic projection of the pickup hole 21a on the reference plane overlaps with the orthographic projection of the pickup port 111a on the reference plane, and the reference plane is perpendicular to the thickness direction of the flexible circuit board 12.

[0184] In this way, the area of ​​the sound outlet is less blocked, thereby reducing the interference of the microphone module 10 on sound propagation, ensuring the clarity and accuracy of the speaker module's sound, and also reducing the impact of the microphone module 10 on the speaker module's sound quality.

[0185] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples. For example, specific features, structures, materials, or characteristics of the support plate 22 in Embodiment 1 may be applied in Embodiments 2, 3, and 4.

[0186] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, include: The outer casing has a microphone hole; A microphone module is located inside the housing. The microphone module includes a support plate and a microphone. The support plate is fixed to the housing. The Young's modulus of the support plate is greater than that of the housing. The microphone is fixed to the support plate. The microphone has a first pickup channel, which is connected to the pickup hole.

2. The electronic device according to claim 1, characterized in that, The thickness of the support plate is less than or equal to 0.25 mm, and / or the thickness of the support plate is greater than or equal to 0.1 mm.

3. The electronic device according to claim 1 or 2, characterized in that, The support plate is a metal plate.

4. The electronic device according to any one of claims 1-3, characterized in that, The support plate includes a main body that is flat, and the microphone module also includes a flexible circuit board disposed between the microphone and the main body.

5. The electronic device according to claim 4, characterized in that, The support plate further includes a first mating part, which is connected to the edge of the main body. The outer shell includes a second mating part, and the first mating part and the second mating part are stacked and fixedly connected in the thickness direction of the main body.

6. The electronic device according to claim 4, characterized in that, The support plate further includes a first mating part and a bending part. In the thickness direction of the main body, the main body and the first mating part are spaced apart, and the bending part is connected between the main body and the first mating part. The outer shell includes a second mating part, and the first mating part and the second mating part are stacked and fixedly connected.

7. The electronic device according to claim 6, characterized in that, The microphone module also includes a reinforcing plate, which is disposed between the flexible circuit board and the main body.

8. The electronic device according to any one of claims 5-7, characterized in that, The electronic device further includes an adhesive portion, which connects the first mating portion and the second mating portion.

9. The electronic device according to any one of claims 4-8, characterized in that, One end of the first pickup channel forms a pickup port, and the pickup port is oriented parallel to the thickness direction of the main body. The orthographic projection of the pickup hole onto the reference surface does not overlap with the orthographic projection of the pickup port onto the reference surface, and the reference surface is perpendicular to the thickness direction of the main body.

10. The electronic device according to claim 9, characterized in that, The main body divides the outer shell into a second pickup channel and a first accommodating cavity, and the second pickup channel is connected to the pickup hole and the first pickup channel respectively; The microphone is located inside the first accommodating cavity, and the pickup port faces the main body. The main body has a first through hole, which is connected to the pickup port and the second pickup channel.

11. The electronic device according to claim 9, characterized in that, The main body and a portion of the outer shell form a second accommodating cavity, the microphone is located within the second accommodating cavity, and the pickup port faces away from the main body.

12. The electronic device according to claim 11, characterized in that, The microphone module also includes a sealing element disposed between the microphone and the housing. The sealing element includes a fourth through hole. The orthographic projection of the fourth through hole on the reference surface overlaps with the orthographic projection of the pickup port on the reference surface. The reference surface is perpendicular to the thickness direction of the support plate.

13. The electronic device according to any one of claims 4-8, characterized in that, One end of the first pickup channel forms a pickup port, and the pickup port is oriented parallel to the thickness direction of the main body. The orthographic projection of the pickup hole onto the reference surface overlaps with the orthographic projection of the pickup port onto the reference surface, and the reference surface is perpendicular to the thickness direction of the main body.

14. The electronic device according to claim 13, characterized in that, The electronic device also includes a speaker module, and the housing includes a steel mesh, a portion of which is used for sound output from the speaker module, and another portion of which serves as the sound pickup hole.

15. The electronic device according to any one of claims 4-14, characterized in that, The microphone module also includes an acoustic mesh, which is stacked on the side of the main body away from the microphone and covers the pickup port; Alternatively, the acoustic mesh is stacked on the side of the main body facing the microphone, and the acoustic mesh covers the sound outlet.

16. The electronic device according to claim 12, characterized in that, The microphone module also includes an acoustic mesh, which is stacked between the seal and the housing, and covers the pickup port.

17. A method for assembling an electronic device, characterized in that, include: A support plate and a microphone are provided, and the microphone is fixed to the support plate to form a microphone module, wherein the Young's modulus of the support plate is greater than the Young's modulus of the outer shell; A housing is provided, and the support plate is fixed inside the housing.

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