Display module and display apparatus

Abstract

Provided are a display module and a display apparatus. The display module comprises: a display panel, the display panel having a display area and a non-display area located outside the display area, the non-display area comprising a first bonding area, and the display panel comprising a first chip; a flexible printed circuit, the flexible printed circuit being electrically connected to the first chip in the first bonding area; and a second chip, the second chip being electrically connected to the first chip by means of the flexible printed circuit. The flexible printed circuit comprises a first side edge on a side close to the display area, and the first side edge is spaced apart from the display area by a first spacing distance. The flexible printed circuit further comprises a first connection portion. The first connection portion is used to be electrically connected to the first chip. The first connection portion comprises a second side edge on a side close to the display area, and the second side edge is spaced apart from the first side edge by a second spacing distance, the second spacing distance being less than the first spacing distance.

Description

Display modules and display devices Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] Silicon-based organic light-emitting diode (OLED) displays (Micro OLED or silicon-based OLED displays) are a new type of OLED display device that uses a silicon substrate. Silicon-based OLED displays are characterized by their small size and high resolution, and are widely used in near-eye displays, virtual reality (VR), and augmented reality (AR) fields, especially in AR / VR head-mounted displays. Typically, silicon-based OLED displays have a bonding area on the side for connection to the driver chip. However, if the bonding area is too close to the display area, the heat generated by the bonding area may adversely affect the light-emitting devices in the display area; if the bonding area is too far from the display area, the bezel of the display device becomes too wide, increasing costs.

[0003] How to achieve narrow bezels in silicon-based OLED displays while minimizing the impact of the bonding area on the light-emitting devices is one of the important research topics for researchers in this field.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] In one aspect, a display module is provided, comprising:

[0006] The display panel has a display area and a non-display area located outside the display area, the non-display area including a first bonding area, and the display panel including a first chip;

[0007] A flexible circuit board, wherein the flexible circuit board is electrically connected to the first chip in the first bonding region; and

[0008] The second chip is electrically connected to the first chip via the flexible circuit board.

[0009] The flexible circuit board includes a first side edge near the display area, the first side edge being spaced apart from the display area by a first interval distance; and

[0010] The flexible circuit board further includes a first connecting portion for electrical connection with the first chip. The first connecting portion includes a second side edge near the display area, and the second side edge and the first side edge are separated by a second spacing distance.

[0011] Wherein, the second interval distance is smaller than the first interval distance.

[0012] According to some exemplary embodiments, the sum of the first interval distance and the second interval distance is greater than or equal to 500 micrometers.

[0013] According to some exemplary embodiments, the ratio of the first interval distance to the second interval distance is in the range of 2.7-15.

[0014] According to some exemplary embodiments, the display panel includes a third side covered by the flexible circuit board portion, and the first connecting portion includes a fourth side adjacent to the third side, the third side and the fourth side being separated by an eleventh interval distance, the eleventh interval distance being substantially equal to the second interval distance.

[0015] According to some exemplary embodiments, the first chip includes a plurality of first terminals located in the first bonding region, and the flexible circuit board includes a plurality of second terminals located in the first connecting portion, wherein the plurality of first terminals and the plurality of second terminals are connected in a one-to-one correspondence; and

[0016] The size of the second terminal is larger than the size of the corresponding first terminal.

[0017] According to some exemplary embodiments, the flexible circuit board further includes a second connection portion located on the side of the first connection portion away from the display area, and the second connection portion is electrically connected to the second chip.

[0018] According to some exemplary embodiments, the flexible circuit board further includes a fifth side away from the display area, the fifth side being spaced twelfth interval distance from the side of the second connection portion closest to the fifth side, the twelfth interval distance being greater than the second interval distance.

[0019] According to some exemplary embodiments, the flexible circuit board further includes a second connection portion located on the side of the first connection portion away from the display area;

[0020] The display module further includes a printed circuit board, which is electrically connected to the second connection portion; and

[0021] The second chip is disposed on the printed circuit board.

[0022] According to some exemplary embodiments, the second connection portion and the second chip are separated by a thirteenth interval distance, the thirteenth interval distance being greater than the second interval distance; and / or,

[0023] The printed circuit board includes a sixth side away from the display area, the sixth side being spaced fourteenth interval distance from the second chip, the fourteenth interval distance being greater than the second interval distance.

[0024] According to some exemplary embodiments, in a first direction, the first binding region includes a first region located on a first side, a second region located in the middle, and a third region located on a second side, and the first direction is parallel to the first side.

[0025] The plurality of first terminals include: a plurality of first sub-terminals located in the first region, a plurality of second sub-terminals located in the second region, and a plurality of third sub-terminals located in the third region.

[0026] Wherein, at least one end of the first sub-terminal near the display area is inclined toward the third region relative to the end of the first sub-terminal away from the display area; and / or,

[0027] At least one end of the second sub-terminal near the display area is not tilted relative to the end of the second sub-terminal away from the display area; and / or,

[0028] At least one of the third sub-terminals is inclined toward the first region at one end near the display area relative to the end of the third sub-terminal away from the display area.

[0029] According to some exemplary embodiments, in the second direction, the plurality of first terminals include M rows of first terminals, wherein the area where the first terminal in the i-th row is located and the area where the first terminal in the (i+1)-th row is located are separated by a third interval distance, wherein the second direction is parallel to the direction from the display area to the flexible circuit board, M is a positive integer greater than or equal to 2, and i is a positive integer greater than or equal to 1 and less than or equal to M-1.

[0030] The first binding region has a first width in the second direction, and the ratio of the third spacing distance to the first width is less than 20%.

[0031] According to some exemplary embodiments, the ratio of the third interval distance to the second interval distance is in the range of 0.5-4.

[0032] According to some exemplary embodiments, in a first direction, two adjacent first sub-terminals among the plurality of first sub-terminals are spaced apart by a fourth interval distance, two adjacent second sub-terminals among the plurality of second sub-terminals are spaced apart by a fifth interval distance, and two adjacent third sub-terminals among the plurality of third sub-terminals are spaced apart by a sixth interval distance.

[0033] Wherein, the fourth interval distance is substantially equal to the fifth interval distance; and / or,

[0034] The fourth interval distance is substantially equal to the sixth interval distance; and / or,

[0035] The fifth interval distance is substantially equal to the sixth interval distance.

[0036] According to some exemplary embodiments, the second chip includes a second bonding region and a plurality of third terminals located in the second bonding region;

[0037] In the first direction and the second direction, the plurality of third terminals include N rows and L columns of third terminals, wherein the third terminal in the (j+1)th row and kth column is offset relative to the third terminal in the jth row and kth column along the first direction, wherein N and L are positive integers greater than or equal to 2, j is a positive integer greater than or equal to 1 and less than or equal to N-1, and k is a positive integer greater than or equal to 1 and less than or equal to L.

[0038] According to some exemplary embodiments, the third terminal has a second width in a first direction and a third width in a second direction, wherein the second width and the third width are substantially equal.

[0039] According to some exemplary embodiments, the centers of two adjacent third terminals located in the same row are spaced apart by a seventh spacing distance in a first direction, the ratio of the seventh spacing distance to the second width being greater than or equal to 2.4; and / or,

[0040] The centers of two adjacent third terminals located in the same column are spaced apart by an eighth interval distance in the second direction, and the ratio of the eighth interval distance to the third width is greater than or equal to 2.

[0041] According to some exemplary embodiments, the second chip further includes a third bonding region; in a first direction, the width of the third bonding region is greater than the width of the second bonding region.

[0042] According to some exemplary embodiments, the second chip includes a plurality of fourth terminals located in the third bonding region, and in a second direction, the plurality of fourth terminals include P rows of fourth terminals, where P is a positive integer greater than or equal to 2;

[0043] In a first direction, the third binding region includes a fourth region located on the first side, a fifth region located in the middle, and a sixth region located on the second side, wherein the first direction is parallel to the first side.

[0044] Wherein, in at least one column of the fourth terminals in the fourth region, the fourth terminals in the (a+1)th row are offset relative to the fourth terminals in the ath row in the opposite direction to the first direction; and / or,

[0045] In at least one column of the fourth terminals in the fifth region, the fourth terminals in row a+1 are aligned with the fourth terminals in row a in a first direction; and / or,

[0046] In at least one column of the fourth terminal in the sixth region, the fourth terminal in row a+1 is offset relative to the fourth terminal in row a along the first direction, where a is a positive integer greater than or equal to 1 and less than or equal to P-1.

[0047] According to some exemplary embodiments, the fourth terminal has a fourth width in a first direction and a fifth width in a second direction, the fourth width and the fifth width being substantially equal.

[0048] According to some exemplary embodiments, the fourth width is greater than the second width; and / or,

[0049] The fifth width is greater than the third width.

[0050] According to some exemplary embodiments, the centers of two adjacent fourth terminals located in the same row are spaced apart by a ninth spacing distance in a first direction, the ratio of the ninth spacing distance to the fourth width being in the range of 2.1 to 2.5; and / or,

[0051] The centers of two adjacent fourth terminals located in the same column are spaced a tenth interval distance in the second direction, and the ratio of the tenth interval distance to the fifth width is in the range of 1.9 to 2.5.

[0052] According to some exemplary embodiments, the flexible circuit board includes a first flexible circuit layer, a second flexible circuit layer, and a first insulating layer located between the first flexible circuit layer and the second flexible circuit layer, wherein the first flexible circuit layer and the second flexible circuit layer are electrically connected by a plurality of first connection traces penetrating the first insulating layer.

[0053] According to some exemplary embodiments, the flexible circuit board further includes an auxiliary portion connected to the first connecting portion; the auxiliary portion includes a bending portion and a main body portion, the bending portion being located on the side of the first connecting portion near the display area, and the main body portion bending towards the first connecting portion via the bending portion; and

[0054] The main body and the first connecting part are connected by a first adhesive layer.

[0055] According to some exemplary embodiments, the first connection trace is located in the main body.

[0056] According to some exemplary embodiments, the bending portion has a first bending radius, the first adhesive layer has a first thickness in a third direction, the first bending radius is greater than the first thickness, and the third direction is parallel to the light emission direction of the display panel.

[0057] According to some exemplary embodiments, the second interval distance is approximately equal to 0.

[0058] According to some exemplary embodiments, the flexible circuit board further includes a third connection portion located on the side of the second connection portion away from the display area;

[0059] The display module also includes a flexible circuit board connector, which is electrically connected to the third connection part.

[0060] In another aspect, a display device is provided. The display device includes a display module as described in any of the preceding claims. Attached Figure Description

[0061] The foregoing contents, as well as other objects, features, and advantages of this disclosure, will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0062] Figure 1 is a schematic diagram of the structure of a display module according to an embodiment of the present disclosure;

[0063] Figure 2 is a plan view of a display panel according to an embodiment of the present disclosure;

[0064] Figure 3 is a schematic diagram of the cross section taken along line AA' in Figure 2;

[0065] Figure 4 is a plan view of a display module according to an embodiment of the present disclosure;

[0066] Figure 5 is a partially enlarged schematic diagram of the first binding area in Figure 4;

[0067] Figure 6 is a partial structural schematic diagram of a display module according to an embodiment of the present disclosure;

[0068] Figure 7 is a partially enlarged schematic diagram of the bonding area of ​​the driver chip according to an embodiment of the present disclosure;

[0069] Figure 8 is a plan view of a display module according to an embodiment of the present disclosure;

[0070] Figure 9 is a partial plan view of a display module according to an embodiment of the present disclosure;

[0071] Figure 10 is a partial plan view of a display module according to an embodiment of the present disclosure, wherein a first bonding area is shown;

[0072] Figure 11 is a partial plan view of a display module according to an embodiment of the present disclosure;

[0073] Figure 12 is a partial plan view of a display module according to an embodiment of the present disclosure, wherein a second bonding area is shown;

[0074] Figure 13 is a partial plan view of a display module according to an embodiment of the present disclosure, in which a third bonding area is shown;

[0075] Figure 14 is a partial structural schematic diagram of a display module according to an embodiment of the present disclosure, showing a double-layer flexible circuit board;

[0076] Figures 15A and 15B are schematic diagrams of the structure of a display module according to an embodiment of the present disclosure;

[0077] Figures 16A and 16B are schematic diagrams of the structure of a display module according to an embodiment of the present disclosure; and

[0078] Figure 17 is a structural block diagram of a display device according to an embodiment of the present disclosure.

[0079] It should be noted that, for clarity, the dimensions of layers, structures, or regions in the accompanying drawings used to describe embodiments of the present invention may be enlarged or reduced; that is, these drawings are not drawn to actual scale. Detailed Implementation

[0080] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0081] It should be noted that, for clarity and / or descriptive purposes, the dimensions and relative dimensions of components may be enlarged in the accompanying drawings. Therefore, the dimensions and relative dimensions of the individual components are not necessarily limited to those shown in the drawings. In the specification and accompanying drawings, the same or similar reference numerals indicate the same or similar parts.

[0082] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.

[0083] In this document, unless otherwise specified, directional terms such as "up," "down," "left," "right," "inner," and "outer" are used to indicate orientation or positional relationships based on the accompanying drawings, and are used only for the convenience of describing this disclosure, and are not intended to indicate or imply that the device, element, or component referred to must have a specific orientation, or be constructed or operated in a specific orientation. It should be understood that when the absolute position of the described object changes, the relative positional relationships they represent may also change accordingly. Therefore, these directional terms should not be construed as limitations on this disclosure.

[0084] In this article, "parallel" refers to the state where the angle formed by two straight lines or two planes is greater than -10° and less than 10°, and therefore also includes the state where the angle is greater than -5° and less than 5°. In addition, "perpendicular" refers to the state where the angle formed by two straight lines or two planes is greater than 80° and less than 100°, and therefore also includes the state where the angle is greater than 85° and less than 95°.

[0085] In this document, the terms “approximately,” “about,” “approximately,” and other similar terms are used as terms of approximation rather than as terms of degree, and they are intended to account for inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. Taking into account factors such as process variations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), “about” or “approximately” as used herein includes stated values ​​and indicates that a particular value is within an acceptable range of deviation for one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0086] In this document, the term "terminal" refers to the part of a chip or circuit board that is electrically connected to external leads, traces, electrodes, etc., including but not limited to the chip's pad.

[0087] Silicon-based OLED displays combine CMOS technology and OLED technology, using monocrystalline silicon as the active driving backplane to fabricate active organic light-emitting diode (OLED) display devices. The structure of a silicon-based OLED device consists of two parts: the driving backplane and the OLED device itself. The driving backplane can include a first chip (also called a panel chip) fabricated on a silicon substrate using standard CMOS technology. The first chip can include pixel circuits, row and column driving circuits, and other functional circuits. To improve the display effect of the silicon-based OLED display device, a second chip can usually be externally connected. For example, the second chip can include a display driver IC (DDIC chip). The second chip can include pixel circuits, row and column driving modules, digital-to-analog conversion modules, communication modules, data processing modules, power supply modules, and other functional modules. For high-resolution applications, the second chip can use a digital interface to complete data transmission through data sampling and comparison. Since the brightness of OLED devices varies significantly under different temperature conditions, a temperature sensing module can also be integrated into the second chip. This module can monitor the chip's operating temperature in real time, enabling precise adjustment of the voltage output at high and low temperatures, thereby regulating the display brightness and maintaining the stability and consistency of the display.

[0088] When silicon-based OLED displays are used in near-eye display devices, the fixed position of the display panel is crucial for the user experience. On one hand, current silicon-based OLED displays are used in AR / VR devices, where users may be in various environments, making the reliability and lifespan of the OLED devices paramount. On the other hand, during the manufacturing process of silicon-based OLED displays, to improve display quality, there cannot be significant color differences on the module surface, as this would result in a poor image quality experience.

[0089] Exemplary embodiments of this disclosure provide a display module. The display module includes: a display panel having a display area and a non-display area located outside the display area, the non-display area including a first bonding area, and the display panel including a first chip. The display module further includes: a flexible circuit board electrically connected to the first chip in the first bonding area; and a second chip electrically connected to the first chip via the flexible circuit board. The flexible circuit board includes a first side edge near the display area, the first side edge being spaced apart from the display area by a first interval distance; and the flexible circuit board further includes a first connecting portion for electrically connecting to the first chip; the first connecting portion includes a second side edge near the display area, the second side edge being spaced apart from the first side edge by a second interval distance, wherein the second interval distance is smaller than the first interval distance.

[0090] This design enables chip-on-chip (COC) design within the display module, improving the driving effect of the display device. Furthermore, it allows for narrower bezels in the display device, reducing the size of individual silicon substrates and thus lowering costs.

[0091] Figure 1 is a structural schematic diagram of a display module according to an embodiment of the present disclosure, Figure 2 is a plan view of a display panel according to an embodiment of the present disclosure, and Figure 3 is a cross-sectional view taken along line AA' in Figure 2.

[0092] Exemplary, in an embodiment of this disclosure, referring to FIG1, a display module 200 is provided. The display module 200 may include a display panel 100 and a flexible circuit board 30 electrically connected to the display panel 100. The flexible circuit board 30 may be connected to an external driving circuit (e.g., a driving power supply or a driving circuit board) to drive the display panel to display.

[0093] By way of example, referring to Figures 2 and 3, the display panel 100 may include a substrate 11 and a cover plate 18. For example, the substrate 11 may be a silicon substrate. The display panel 100 may also include a light-emitting device 20 located between the substrate 11 and the cover plate 18. The cover plate 18 has the function of emitting light and protecting the light-emitting device 20. The light-emitting device 20 may be an OLED light-emitting device, which can realize color light emission function. The substrate 11 may serve as the substrate material for the light-emitting device 20. The cover plate 18 may be a transparent material, for example, the cover plate 18 may be a high-transmittance plain glass.

[0094] For example, the display panel 100 has a display area AA and a non-display area NA located outside the display area AA. For instance, the orthographic projection of the display area AA onto the substrate 11 can fall within the orthographic projection of the cover plate 18 onto the substrate 11. That is, the area of ​​the orthographic projection of the cover plate 18 onto the substrate 11 is larger than the area of ​​the display area AA, thereby protecting the entire display area.

[0095] For example, the area of ​​the orthographic projection of the cover plate 18 onto the substrate 11 is smaller than the area of ​​the substrate 11, so that the display module can be positioned and fixed through the portion of the substrate 11 exposed outside the cover plate 18. For example, at least a portion of the non-display area NA is not covered by the cover plate 18, and terminals can be provided in a portion of the non-display area NA exposed outside the cover plate 18 for electrical connection with other components in the display module.

[0096] For example, the light-emitting device 20 may include a first electrode 12 formed on the substrate 11, such as an anode. The first electrode 12 may be formed of a material with high transmittance and high work function, such as ITO.

[0097] For example, the light-emitting device 20 may further include a light-emitting functional layer 13 located on the side of the first electrode 12 away from the substrate 11. For example, the light-emitting functional layer 13 may be made of organic materials, and by utilizing the light-emitting properties of organic materials, holes and electrons are excited to form excitons under the action of voltage or current, thereby realizing light emission.

[0098] Exemplarily, the light-emitting device 20 may further include a second electrode 14 located on the side of the light-emitting functional layer 13 away from the substrate 11. For example, the second electrode 14 may be the cathode of the light-emitting device 20. For example, the material of the second electrode 14 may include one or more combinations of Mg and Ag. The second electrode 14 may be a transparent structure, allowing light to pass through the second electrode 14 and be emitted in a direction away from the substrate 11.

[0099] Exemplarily, the light-emitting device 20 may further include: a first encapsulation layer 15 located on the side of the second electrode 14 away from the substrate 11; a color filter layer 16 located on the side of the first encapsulation layer 15 away from the substrate 11; and a second encapsulation layer 17 located on the side of the color filter layer 16 away from the substrate 11. For example, the first encapsulation layer 15 and the second encapsulation layer 17 may be thin-film encapsulation layers. Exemplarily, the first encapsulation layer 15 and the second encapsulation layer 17 may be made of one or more organic or inorganic materials with good sealing properties, such as silicon oxide, silicon nitride, etc., thereby protecting the OLED light-emitting device and achieving a good sealing effect. The combined use of the first encapsulation layer 15 and the second encapsulation layer 17 can achieve effective encapsulation of the light-emitting device, effectively blocking water vapor and oxygen, thereby protecting the light-emitting device and extending its lifespan. Exemplarily, the color filter layer 16 may include one or more of a red color filter layer, a green color filter layer, and a blue color filter layer. The color filter layer 16 may be disposed corresponding to the light-emitting functional layer 13 to achieve colorized display of emitted light.

[0100] Exemplarily, substrate 11 can be a silicon substrate, which can be used as the substrate material for the driving backplane and fabricated using standard CMOS processes to form the first chip of the display module on substrate 11. The first chip may include pixel circuits, row and column driving circuits, and other functional circuits. For example, the first chip can be fabricated using 180nm or 110nm semiconductor processes. The first chip may include multiple terminals located in a portion of the non-display area exposed outside the cover plate for electrical connection with other display modules (e.g., flexible circuit boards or second chips). FIG4 is a plan view of a display module according to an embodiment of the present disclosure, FIG5 is a partially enlarged view of the first bonding area in FIG4, and FIG6 is a partial structural view of a display module according to an embodiment of the present disclosure.

[0101] Exemplary, in embodiments of this disclosure, referring to Figures 4-6, the display module 200 includes a display panel 100. The display panel 100 has a display area AA and a non-display area NA. The non-display area NA includes a first bonding area SA1. The display panel 100 includes a first chip IC1. For example, the first chip IC1 can be integrated and fabricated on the display panel 100 using a CMOS process. The first chip IC1 may include multiple pins disposed in the non-display area (e.g., the first bonding area SA1) of the display panel 100 for electrical connection with other structures or components in the display module. The display module 200 also includes a flexible circuit board 30. The first chip IC1 and the flexible circuit board 30 can be bonded together in the first bonding area SA1 to achieve signal transmission between the first chip IC1 and the flexible circuit board 30.

[0102] For example, the display module 200 may also include a second chip IC2. The second chip IC2 can be electrically connected to the first chip IC1 via the flexible circuit board 30.

[0103] For example, the flexible circuit board 30 may include a first connection portion 31. The first connection portion 31 may be electrically connected to the first chip IC1.

[0104] For example, the flexible circuit board 30 may further include a second connection portion 32. The second connection portion 32 is located on the side of the first connection portion 31 away from the display area AA. The second connection portion 32 may be electrically connected to the second chip IC2.

[0105] For example, the flexible circuit board 30 may further include a third connection portion 33, which is located on the side of the second connection portion 32 away from the display area AA. The display module 200 may further include a flexible circuit board connector 60, which can be electrically connected to the third connection portion 33. By designing the flexible circuit board connector 60, the connection between the flexible circuit board 30 and the external driving circuit can be facilitated; for example, the flexible circuit board connector 60 and the external driving circuit can be connected in a plug-in manner.

[0106] The first connecting part 31, the second connecting part 32 and the third connecting part 33 can be electrically connected through the connecting traces inside the flexible circuit board 30, thereby realizing the electrical connection of the first chip IC1 and the second chip IC2; and / or, the second chip IC2 and the flexible circuit board connector 60 are electrically connected.

[0107] Exemplarily, the flexible circuit board 30 may further include an auxiliary portion 34 located on the side of the first connection portion 31 near the display area AA. The auxiliary portion 34 can protect the second terminal 312 in the flexible circuit board 30. During the bonding process between the flexible circuit board 30 and the first chip IC1, the auxiliary portion 34 can also serve a heat dissipation function, reducing the impact of heat generated during bonding on the light-emitting devices in the display area. In some embodiments, the flexible circuit board 30 may include multiple flexible circuit layers, and different flexible circuit layers can be electrically connected through connection traces located in the auxiliary portion 34.

[0108] For example, referring to Figures 4 and 5, the first chip IC1 includes a plurality of first terminals 111 located in the first bonding region SA1. The flexible circuit board 30 includes a first connection portion 31 located in the first bonding region SA1. The first connection portion 31 is electrically connected to at least a portion of the plurality of first terminals 111 to realize the electrical connection between the flexible circuit board 30 and the first chip IC1.

[0109] For example, the first connection portion 31 may include a plurality of second terminals 312. The plurality of first terminals 111 and the plurality of second terminals 312 may be connected one-to-one to realize the electrical connection between the first chip IC1 and the flexible circuit board 30.

[0110] For example, referring to FIG5, the size of the second terminal 312 is larger than the size of the corresponding first terminal 111. For example, in the first direction X, the width d2 of the second terminal 312 is larger than the width d1 of the first terminal 111. In the second direction Y, the width d4 of the second terminal 312 is larger than the width d3 of the first terminal 111. In some embodiments, the orthographic projections of the plurality of first terminals 111 on the substrate may fall within the orthographic projections of the plurality of second terminals 312 on the substrate.

[0111] This design improves the reliability of the bonding connection between the first chip IC1 and the flexible circuit board 30.

[0112] For example, continuing to refer to FIG4, the flexible circuit board 30 includes a first side L1 near the display area AA. For example, the first side L1 may be located in the auxiliary part 34. The first side L1 is separated from the display area AA by a first interval distance H1. The first connecting part 31 includes a second side L2 near the display area AA. The second side L2 and the first side L1 are separated by a second interval distance H2. For example, the second interval distance H2 is smaller than the first interval distance H1.

[0113] It should be noted that, in the embodiments of this disclosure, the "display area" refers to the area of ​​the display panel that displays the image. The boundary of the display area is the dividing line between the area of ​​the display panel that displays the image and the area of ​​the display panel that does not display the image. The first spacing distance H1 between the first side L1 and the display area AA refers to the minimum spacing distance between the first side L1 and the display area AA, that is, the spacing distance between the first side L1 and the boundary of the display area AA that is closest to the first side L1.

[0114] This design allows the flexible circuit board 30 to have a smaller width in the second direction Y relative to the portion of the first bonding region SA1 protruding towards the display area AA (e.g., the auxiliary portion 34). This reduces the space occupied by the flexible circuit board 30 in the non-display area NA of the display panel 100. Consequently, the width of the non-display area NA in the display panel 100 can be designed to be smaller, achieving a narrow bezel in the display panel 100. This reduces the size of a single silicon-based OLED display device and lowers costs.

[0115] For example, referring to Figures 4 and 5, the sum of the first spacing distance H1 and the second spacing distance H2 is greater than 500 micrometers. That is, the spacing between the second terminal 312 in the first connection portion 31 and the display area is greater than or equal to 500 micrometers. The first terminal 111 is correspondingly disposed with the second terminal 312, and the size of the first terminal 111 is smaller than the size of the second terminal 312. Therefore, the spacing between the first terminal 111 of the first chip IC1 and the display area is also greater than or equal to 500 micrometers.

[0116] This design reduces the impact of heat generated when the first chip IC1 is bonded to the flexible circuit board 30 on the light-emitting devices in the display area, thereby improving the lifespan of the display panel.

[0117] In some embodiments, the ratio of the first spacing distance H1 to the second spacing distance H2 is in the range of 2.7-15. For example, the first spacing distance H1 is in the range of 800-1500 micrometers, and the second spacing distance H2 is in the range of 100-300 micrometers.

[0118] For example, continuing to refer to FIG4, the display panel 100 further includes a third side L3 partially covered by the flexible circuit board 30, and the first connecting portion 31 includes a fourth side L4 adjacent to the third side L3, with the third side L3 and the fourth side L4 separated by an eleventh interval distance H11. For example, the eleventh interval distance H11 is substantially equal to the second interval distance H2. Here, "substantially equal" means that the ratio of the eleventh interval distance H11 to the second interval distance H2 is in the range of 0.8-1.2.

[0119] For example, the eleventh interval distance H11 is in the range of 100-300 micrometers.

[0120] This design ensures that there is sufficient space near the bonding area when the flexible circuit board and the display panel are bonded, which helps to improve the bonding yield.

[0121] For example, referring to Figures 4 and 6, the second chip IC2 can be electrically connected to the first chip IC1 via the flexible circuit board 30. For instance, the flexible circuit board 30 also includes a driver chip bonding area SA20, and the second connection portion 32 in the flexible circuit board 30 can be located in the driver chip bonding area SA20. The driver chip bonding area SA20 is located on the side of the first bonding area SA1 away from the display area AA. For example, the second chip IC2 and the second connection portion 32 can be bonded together in the driver chip bonding area SA20, thereby realizing signal transmission between the second chip IC2 and the flexible circuit board 30, and further realizing signal transmission between the second chip IC2 and the first chip IC1, to achieve drive control of the display panel.

[0122] For example, the driver chip bonding area SA20 and the display panel 100 are spaced apart in the second direction Y, which is parallel to the direction in which the display area AA points to the flexible circuit board 30.

[0123] For example, continuing to refer to FIG4, the flexible circuit board 30 further includes a fifth side L5 on the side away from the display area AA. The fifth side L5 is separated from the side of the second connection portion 32 closest to the fifth side L5 by a twelfth spacing distance H12. The twelfth spacing distance H12 is greater than the second spacing distance H2. For example, the twelfth spacing distance H12 is in the range of 400-600 micrometers. The second spacing distance H2 is in the range of 100-300 micrometers.

[0124] This design ensures that the flexible circuit board has sufficient bonding space when the second chip is bonded, which helps to improve the bonding effect between the second chip and the flexible circuit board.

[0125] Figure 7 is a partially enlarged schematic diagram of the bonding area of ​​the driver chip according to an embodiment of the present disclosure.

[0126] Exemplary, in an embodiment of this disclosure, referring to Figures 4, 6, and 7, the flexible circuit board 30 may include a second connection portion 32. The second connection portion 32 is located on the side of the first connection portion 31 away from the display area AA. The second connection portion 32 and the second chip IC2 can be electrically connected in the driver chip bonding area SA20.

[0127] Exemplarily, the second chip IC2 may include a second bonding region SA2 and a plurality of third terminals IC23 located in the second bonding region SA2. The second connection portion 32 in the flexible circuit board 30 may include a plurality of fifth terminals 325 located in the driver chip bonding region SA20, and the plurality of fifth terminals 325 may be configured one-to-one with the plurality of third terminals IC23. Exemplarily, the plurality of fifth terminals 325 may be electrically connected to the first chip IC1 through internal traces of the flexible circuit board 30, thereby realizing the electrical connection between the second chip IC2 and the first chip IC1. In some embodiments, the terminals in the second chip IC2 used for electrical connection with the first chip IC1 may all be located in the second bonding region SA2.

[0128] Exemplarily, the second chip IC2 may further include a third bonding region SA3 and a plurality of fourth terminal ICs IC24 located in the third bonding region SA3. Exemplarily, the third bonding region SA3 may be located on the side of the second bonding region SA2 away from the display area AA. The second connection portion 32 in the flexible circuit board 30 may further include a plurality of sixth terminals 326 located in the driver chip bonding region SA20, and the plurality of sixth terminals 326 may be configured one-to-one with the plurality of fourth terminal ICs IC24. The plurality of sixth terminals 326 may be connected to an external driving circuit, such as an external driving circuit board PCB, through the internal wiring of the flexible circuit board 30, thereby providing a driving signal for the second chip IC2.

[0129] With this design, signal transmission between the second chip IC2 and the first chip IC1, as well as signal transmission between the second chip IC2 and the external driving circuit, can be achieved, thereby driving the display panel to emit light.

[0130] It should be noted that although the embodiments of this disclosure schematically show that the orthographic projections of the first terminal, second terminal, third terminal, fourth terminal, fifth terminal, and sixth terminal on the substrate are rectangular, the embodiments of this disclosure are not limited to this. In the embodiments of this disclosure, the orthographic projections of the first terminal, second terminal, third terminal, fourth terminal, fifth terminal, and sixth terminal on the substrate can also be various shapes such as square, parallelogram, circle, and ellipse.

[0131] For example, the size of the fifth terminal 325 is larger than the size of the corresponding third terminal IC23.

[0132] For example, the size of the sixth terminal 326 is larger than the size of the corresponding fourth terminal IC24.

[0133] This design improves the reliability of the bonding connection between the second chip IC2 and the flexible circuit board 30.

[0134] Figure 8 is a plan view of a display module according to an embodiment of the present disclosure.

[0135] Exemplary examples, in some embodiments of this disclosure, referring to FIG8, the flexible circuit board 30 includes a second connection portion 32 located on the side of the first connection portion 31 away from the display area AA. The display module 200 may also include a printed circuit board 50, for example, the printed circuit board 50 may be a driver circuit board.

[0136] For example, the printed circuit board 50 can be electrically connected to the second connection portion 32. Furthermore, a second chip IC2 is disposed on the printed circuit board 50.

[0137] For example, the orthographic projection of the second chip IC2 on the printed circuit board 50 and the orthographic projection of the second connection portion 32 on the printed circuit board 50 may partially overlap or not overlap.

[0138] This design allows for more flexible connection design between the second chip IC2, the printed circuit board 50, and the first chip IC1. When the second chip IC2 has a large number of terminals, the printed circuit board 50 can provide more sufficient bonding space, thereby improving bonding stability and ultimately enhancing the reliability of the display module.

[0139] For example, continuing to refer to Figure 8, the second connection portion 32 and the second chip IC2 are separated by a thirteenth spacing distance H13, which is greater than the second spacing distance H2. For example, the thirteenth spacing distance H13 is in the range of 400-600 micrometers. The second spacing distance H2 is in the range of 100-300 micrometers.

[0140] For example, the printed circuit board 50 includes a sixth side L6 on the side away from the display area AA, and the sixth side L6 is separated from the second chip IC2 by a fourteenth spacing distance H14. The fourteenth spacing distance H14 is greater than the second spacing distance H2. For example, the fourteenth spacing distance H14 is in the range of 400-600 micrometers.

[0141] For example, the second connection portion 32 is spaced 15 intervals H15 from the side edge of the printed circuit board 50 near the display area AA. The 15th interval distance H15 is in the range of 150-300 micrometers.

[0142] This design improves the bonding effect between the flexible circuit board and the printed circuit board, as well as the bonding effect between the second chip and the printed circuit board.

[0143] The inventors discovered that as silicon-based OLED display devices develop towards higher resolution and narrower bezels, the number of terminals in these devices is increasing, while the layout space for these terminals is decreasing. This leads to smaller spacing between adjacent terminals and increasingly higher requirements for alignment accuracy. However, the bonding process of the display module generates a significant amount of heat, which can cause the terminals to expand and misalign. For example, this can cause a misalignment when bonding the second terminal 312 in the flexible circuit board to the first terminal 111 in the first chip IC1, or when bonding the fifth terminal 325 or the sixth terminal 326 in the flexible circuit board to the third terminal IC23 or the fourth terminal IC24 in the second chip IC2, thus affecting the yield of the display module. To improve the alignment accuracy of the terminals during the bonding process, the terminal arrangement can be designed.

[0144] Figure 9 is a partial plan view of a display module according to an embodiment of the present disclosure.

[0145] For example, in an embodiment of this disclosure, referring to FIG9, in the first direction X, the first binding region 31 includes a first region S1 located on the first side, a second region S2 located in the middle, and a third region S3 located on the second side, and the first direction X is parallel to the first side L1.

[0146] For example, the plurality of first terminals 111 may include: a plurality of first sub-terminals 1111 located in the first region S1, a plurality of second sub-terminals 1112 located in the second region S2, and a plurality of third sub-terminals 1113 located in the third region S3.

[0147] For example, at least one first sub-terminal 1111 is tilted towards the third region S3 at the end closest to the display area relative to the end furthest from the display area. For instance, at least one first sub-terminal 1111 is designed to tilt to the right.

[0148] For example, at least one end of the second sub-terminal 1112 near the display area is not tilted relative to the end of the second sub-terminal away from the display area. That is, one side of the second sub-terminal 1112 may be parallel to the second direction Y.

[0149] For example, at least one third sub-terminal 1113 is tilted towards the first region S1 at the end closest to the display area relative to the end furthest from the display area. For instance, at least one third sub-terminal 1113 is designed to be tilted to the left.

[0150] By dividing multiple first terminals 111 into sections and using different tilt designs, the multiple first terminals 111 can be made into a figure-eight shape.

[0151] For example, the plurality of second terminals 312 in the first connection portion 31 of the flexible circuit board 30 may also adopt the same tilted design as the plurality of first terminals 111, so that the plurality of second terminals 312 as a whole are also designed in a figure-eight shape.

[0152] When the terminals expand due to heat, the offset of multiple terminals without a tilt design in one direction can easily accumulate to an excessive amount, which can easily lead to display module malfunction.

[0153] In the exemplary embodiments of this disclosure, the plurality of first terminals 111 and the plurality of second terminals 312 are all designed with a figure-eight tilt, which can compensate for the offset caused by thermal expansion of the terminals during bonding, and avoid the situation where the terminal offset is too large during bonding, resulting in misalignment, short circuit or missing connection, which is beneficial to improving the yield of the display module.

[0154] For example, continuing to refer to FIG9, in the first direction X, two adjacent first sub-terminals 1111 are spaced apart by a fourth interval distance H4, two adjacent second sub-terminals 1112 are spaced apart by a fifth interval distance H5, and two adjacent third sub-terminals 1113 are spaced apart by a sixth interval distance H6.

[0155] It should be noted that, in the embodiments of this disclosure, the "fourth spacing distance" refers to the spacing distance between the center points or center lines of two adjacent first sub-terminals. In the embodiments of this disclosure, the "fifth spacing distance" refers to the spacing distance between the center points or center lines of two adjacent second sub-terminals. In the embodiments of this disclosure, the "sixth spacing distance" refers to the spacing distance between the center points or center lines of two adjacent third sub-terminals.

[0156] For example, the fourth interval distance H4 is substantially equal to the fifth interval distance H5. And / or, the fourth interval distance H4 is substantially equal to the sixth interval distance H6. And / or, the fifth interval distance H5 is substantially equal to the sixth interval distance H6. It should be noted that "substantially equal" here means that the ratio between the two is within the range of 0.8 to 1.2.

[0157] Multiple first terminals 111 located in different areas can all adopt an equidistant design. Combined with the figure-eight tilt design of the multiple first terminals 111, the offset during the bonding process can be less than the spacing between two adjacent first terminals 111, avoiding terminal misalignment and short circuits that could lead to display module malfunctions. This design can further improve the reliability of the bonding connection between the first chip IC1 and the flexible circuit board 30, thereby improving the reliability of the display module.

[0158] Figure 10 is a partial plan view of a display module according to an embodiment of the present disclosure, showing a first binding area.

[0159] Exemplary, in embodiments of this disclosure, referring to Figures 9 and 10, in the second direction Y, the plurality of first terminals 111 can be designed to be arranged in a single row or multiple rows. For example, the plurality of first terminals 111 may include M rows of first terminals, such as 1 to 5 rows of first terminals. The number of terminals in each row of first terminals may be in the range of 300 to 500.

[0160] For example, the plurality of first terminals 111 can be arranged in two rows in the second direction Y. For instance, a row of first terminals 111 near the display area AA can be used to transmit signals to the display area, and a row of first terminals 111 near the second chip IC2 can be used to transmit signals to the second chip IC2.

[0161] For example, the multiple first terminals 111 are designed in multiple rows, such as an M-row design, where M is a positive integer greater than or equal to 2. The region containing the first terminal in the i-th row and the region containing the first terminal in the (i+1)-th row are separated by a third spacing distance H3, where i is a positive integer greater than or equal to 1 and less than or equal to M-1. The first binding region 31 has a first width D1 in the second direction Y. For example, the ratio of the third spacing distance H3 to the first width D1 is less than 20%.

[0162] In some embodiments, the ratio of the third spacing distance H3 to the second spacing distance H2 is in the range of 0.5-4. For example, the third spacing distance H3 is in the range of 150-400 micrometers, and the second spacing distance H2 is in the range of 100-300 micrometers.

[0163] When the first terminal adopts a multi-row design, by adjusting the ratio of the spacing between two adjacent rows of terminals in the second direction Y to the width of the first bonding area 31 in the second direction Y, the size of the first bonding area in the second direction Y can be reduced while ensuring that the multi-row terminals have little mutual influence. This is beneficial for achieving a narrow bezel on the display panel and thus reducing costs.

[0164] Figure 11 is a partial plan view of a display module according to an embodiment of the present disclosure.

[0165] In some embodiments, to increase the number of channels between the flexible circuit board 30 and the first chip IC1 within a limited space, the flexible circuit board 30 can adopt a multi-layer design, such as a double-layer design. Insulating layers and connecting traces penetrating the aforementioned insulating layers are provided between the multiple flexible circuit layers to ensure signal transmission between them.

[0166] By way of example, in an embodiment of this disclosure, referring to FIG11, the flexible circuit board 30 may further include an auxiliary portion 34. The auxiliary portion 34 is located on the side of the first connection portion 31 near the display area.

[0167] For example, the auxiliary part 34 may include a plurality of vias VH and a plurality of first connection traces 341 filling the plurality of vias VH. The plurality of flexible circuit layers can be electrically connected through the plurality of first connection traces 341.

[0168] The flexible circuit board adopts a multi-layer design, which can increase the number of transmission channels on the flexible circuit board and ensure the transmission of large amounts of data between the second chip IC2 and the first chip IC1. This enables the display panel to meet the requirements of high resolutions such as 3K and 4K, thereby enhancing the product's competitive advantage.

[0169] Exemplary, in an embodiment of this disclosure, continuing to refer to FIG11, the second chip IC2 may include a second bonding region SA2 and a third bonding region SA3 spaced apart in the second direction Y. The third bonding region SA3 is located on the side of the second bonding region SA2 away from the display area.

[0170] For example, the second chip IC2 may include a plurality of third terminal IC23 located in the second bonding region SA2 and a plurality of fourth terminal IC24 located in the third bonding region SA3.

[0171] For example, the terminal in the second chip IC2 used for communication with the first chip IC1 (e.g., the third terminal IC23) can be disposed in the second bonding area SA2, and the terminal in the second chip IC2 used for communication with an external driving circuit or driving board (e.g., the fourth terminal IC24) can be disposed in the third bonding area SA3. This design shortens the signal transmission distance, improves signal transmission efficiency, and thus enhances the response speed of the display device.

[0172] In some embodiments, to improve the bonding effect of the second chip IC2 and avoid misalignment, short circuits, or missed connections due to thermal expansion of the terminals, the multiple third terminal IC23s and multiple fourth terminal IC24s may be the same or different in terms of the number of terminals, terminal size, and terminal arrangement. For example, the terminal size of the fourth terminal IC24 may be larger than the size of the third terminal IC23. As another example, the spacing between two adjacent fourth terminal IC24s may be greater than the spacing between two adjacent third terminal IC23s.

[0173] For example, in the first direction X, the width d6 of the third bonding region SA3 can be greater than the width d5 ​​of the second bonding region SA2, thereby better meeting the spatial arrangement requirements of multiple fourth terminal IC24.

[0174] Figure 12 is a partial plan view of a display module according to an embodiment of the present disclosure, showing a second binding area.

[0175] Exemplarily, in embodiments of this disclosure, referring to FIG12, a plurality of third terminal ICs 23 may include N rows of third terminal ICs 23 spaced apart in the second direction Y. For example, N is greater than or equal to 1 and less than or equal to 15. Exemplarily, N equals 10. The number of terminals in each row of third terminal ICs 23 is approximately in the range of 300 to 500.

[0176] For example, in the first direction X and the second direction Y, a plurality of third terminal IC23s include N rows and L columns of third terminals, where N and L are positive integers greater than or equal to 2. The third terminal IC232 in the (j+1)th row and kth column is offset relative to the third terminal IC231 in the jth row and kth column along the first direction X, where j is a positive integer greater than or equal to 1 and less than or equal to N-1, and k is a positive integer greater than or equal to 1 and less than or equal to L.

[0177] This tilted design increases the spacing between two adjacent third terminal IC23s in the same column, reducing the impact of thermal expansion on terminal offset during bonding. This reduces the likelihood of misalignment, short circuits, or missed connections during bonding, thus improving the yield of the display module.

[0178] For example, continuing to refer to Figure 12, the third terminal IC23 has a second width D2 in the first direction X, and the third terminal IC23 has a third width D3 in the second direction Y. For example, the second width D2 and the third width D3 are substantially equal. It should be noted that "substantially equal" here means that the ratio of the two is within the range of 0.8 to 1.2.

[0179] For example, the second width D2 is approximately equal to 36 micrometers. The third width D3 is approximately equal to 36 micrometers.

[0180] For example, the centers of two adjacent third terminals IC23 located in the same row are spaced apart by a seventh spacing distance H7 in the first direction X. The ratio of the seventh spacing distance H7 to the second width D2 is greater than or equal to 2.4. For example, the seventh spacing distance H7 is approximately equal to 87 micrometers.

[0181] For example, the gap width d7 between two adjacent third terminals IC23 in the same row is approximately equal to the difference between the seventh spacing distance H7 and the second width D2, i.e., d7 ≈ H7 - D2. For instance, the gap width d7 between two adjacent third terminals IC23 in the same row is approximately 51 micrometers.

[0182] For example, the centers of two adjacent third terminals IC23 located in the same column are spaced apart by an eighth spacing distance H8 in the second direction Y. The ratio of the eighth spacing distance H8 to the third width D3 is greater than or equal to 2. For example, the eighth spacing distance is approximately 72 micrometers.

[0183] For example, the gap width d8 between two adjacent third terminals IC23 in the same column is approximately equal to the difference between the eighth spacing distance H8 and the third width D3, i.e., d8 ≈ H8 - D3. For instance, the gap width d8 between two adjacent third terminals IC23 in the same column is approximately 36 micrometers.

[0184] This design ensures good bonding performance of the terminals while minimizing the impact of thermal expansion between adjacent terminals. It reduces the likelihood of terminal misalignment, short circuits, or missed connections caused by thermal expansion during the bonding process, thus improving the yield of the display module.

[0185] Exemplary examples, in some embodiments of this disclosure, continuing to refer to FIG12, the plurality of third terminal ICs 23 may include one or more first virtual pads ICs 233. The first virtual pads ICs 233 may be located in the edge region of the second bonding region SA2, for example, the first virtual pads ICs 233 may be located in one or more rows near the edge of the plurality of third terminal ICs 23; or, the first virtual pads ICs 233 may be located in one or more columns near the edge of the plurality of third terminal ICs 23. By designing the first virtual pads, the second chip can be supported, thereby avoiding warping or poor contact during the bonding process, which is beneficial to improving the reliability of chip bonding and thus improving the yield of the display module.

[0186] Figure 13 is a partial plan view of a display module according to an embodiment of the present disclosure, showing a third binding area.

[0187] For example, referring to FIG13, the second chip IC2 may further include a plurality of fourth terminals IC24 located in the third bonding region SA3. In the second direction Y, the plurality of fourth terminals include P rows of fourth terminals, where P is a positive integer greater than or equal to 2.

[0188] For example, in the first direction X, the third binding region SA3 includes a fourth region S4 located on the first side, a fifth region S5 located in the middle, and a sixth region S6 located on the second side.

[0189] For example, in the multiple rows of fourth terminal IC24 in the fourth region S4, the fourth terminal IC24 located in the lower row is offset away from the sixth region S6 relative to the fourth terminal IC24 located in the upper row, that is, offset in the opposite direction of the first direction X as shown in FIG13. For example, in at least one column of fourth terminal IC24 in the fourth region S4, the fourth terminal in the (a+1)th row is offset in the opposite direction of the first direction X relative to the fourth terminal in the ath row, thereby making the multiple rows of fourth terminal IC24 in the fourth region S4 arranged as a whole tilted to the right.

[0190] For example, in at least one column of fourth terminal IC24 in the fifth region S5, the fourth terminal IC24 in the (a+1)th row is aligned with the fourth terminal IC24 in the ath row in the first direction X. That is, the multiple rows of fourth terminal IC24 in the fifth region S5 are arranged in a non-tilted manner.

[0191] For example, in the multiple rows of fourth terminal IC24 in the sixth region S6, the fourth terminal IC24 located in the lower row is offset away from the fourth region S4 relative to the fourth terminal IC24 located in the upper row, that is, offset in the first direction X as shown in FIG13. For example, in at least one column of fourth terminal IC24 in the sixth region S6, the fourth terminal IC24 in the (a+1)th row is offset relative to the fourth terminal IC24 in the ath row along the first direction X, where a is a positive integer greater than or equal to 1 and less than or equal to P-1, thereby making the multiple rows of fourth terminal IC24 in the sixth region S6 arranged as a whole tilted to the left.

[0192] This design allows the multiple fourth-terminal IC24s in the third bonding area SA3 to be arranged in a figure-eight shape. This figure-eight structure compensates for terminal offset during bonding, preventing excessive offset and improving the yield of the display module.

[0193] For example, continuing to refer to Figure 13, the fourth terminal IC 24 has a fourth width D4 in the first direction X and a fifth width D5 in the second direction Y. The fourth width D4 can be substantially equal to the fifth width D5. It should be noted that "substantially equal" here means that the ratio of the two is within the range of 0.8 to 1.2. For example, the fourth width D4 is approximately equal to 40 micrometers. The fifth width D5 is approximately equal to 40 micrometers.

[0194] For example, the fourth width D4 is greater than the second width D2. For instance, the fourth width D4 is approximately 40 micrometers and the second width D2 is approximately 36 micrometers.

[0195] For example, the fifth width D5 is greater than the third width D3. For instance, the fifth width D5 is approximately 40 micrometers, and the third width D3 is approximately 36 micrometers.

[0196] For example, the centers of two adjacent fourth terminals IC24 located in the same row are spaced apart by a ninth spacing distance H9 in the first direction X, and the ratio of the ninth spacing distance H9 to the fourth width D4 is in the range of 2.1 to 2.5. For example, the ninth spacing distance H9 is in the range of 84 micrometers to 100 micrometers.

[0197] For example, the gap width d9 between two adjacent fourth terminals IC24 in the same row is approximately equal to the difference between the ninth spacing distance H9 and the fourth width D4, i.e., d9 ≈ H9 - D4. For instance, the gap width d9 between two adjacent fourth terminals IC24 in the same row is in the range of 44 micrometers to 60 micrometers.

[0198] For example, the centers of two adjacent fourth terminals IC24 located in the same column are spaced apart by a tenth spacing distance H10 in the second direction Y, and the ratio of the tenth spacing distance H10 to the fifth width D5 is in the range of 1.9 to 2.5. For example, the tenth spacing distance H10 is in the range of 76 micrometers to 100 micrometers.

[0199] For example, the gap width d10 between two adjacent fourth terminals IC24 in the same column is approximately equal to the difference between the tenth spacing distance H10 and the fifth width D5, i.e., d10≈H10-D5. For example, the gap width d10 between two adjacent fourth terminals IC24 in the same column is in the range of 36 micrometers to 60 micrometers.

[0200] This design ensures good bonding performance of the terminals while minimizing the impact of thermal expansion between adjacent terminals. It reduces the likelihood of terminal misalignment, short circuits, or missed connections caused by thermal expansion during the bonding process, thus improving the yield of the display module.

[0201] Exemplary examples, in some embodiments of this disclosure, continuing to refer to FIG13, the plurality of fourth terminal ICs 24 may include one or more second virtual pads ICs 241. The second virtual pads ICs 241 may be located at the edge region of the third bonding region SA3. For example, the second virtual pads ICs 241 may be located in one or more rows near the edge of the plurality of fourth terminal ICs 24; or, the second virtual pads ICs 241 may be located in one or more columns near the edge of the plurality of fourth terminal ICs 24. By designing the second virtual pads, the second chip IC2 can be supported, thereby avoiding warping or poor contact during the bonding process, which is beneficial to improving the reliability of chip bonding and thus improving the yield of the display module.

[0202] Figure 14 is a partial structural schematic diagram of a display module according to an embodiment of the present disclosure, showing a double-layer flexible circuit board.

[0203] By way of example, in an embodiment of this disclosure, referring to FIG14, the flexible circuit board 30 may employ a double-layer design. For example, the flexible circuit board 30 may include a first flexible circuit layer 301, a second flexible circuit layer 302, and a first insulating layer 303 located between the first flexible circuit layer 301 and the second flexible circuit layer 302.

[0204] The flexible circuit board 30 may also include an auxiliary portion 34. The auxiliary portion 34 is located on the side of the first connection portion 31 near the display area. The flexible circuit board 30 may also include a plurality of vias VH located in the auxiliary portion 34 and a plurality of first connection traces 341 filling the plurality of vias VH. The first flexible circuit layer 301 and the second flexible circuit layer 302 may be electrically connected through the plurality of first connection traces 341 penetrating the first insulating layer 303.

[0205] The flexible circuit board 30 adopts a double-layer design, which can increase the number of transmission channels on the flexible circuit board and ensure the transmission of large amounts of data between the second chip IC2 and the first chip IC1, thereby enabling the display panel to meet the requirements of high resolutions such as 3K and 4K and enhancing the product's competitive advantage.

[0206] Figures 15A and 15B are schematic diagrams of the structure of a display module according to an embodiment of the present disclosure.

[0207] Exemplary, in embodiments of this disclosure, the flexible circuit board 30 may further include an auxiliary portion 34 connected to the first connecting portion 31. The auxiliary portion 34 protrudes relative to the first connecting portion 31 in a direction toward the display area AA. Exemplary, the auxiliary portion 34 may be used for electrical connections between multiple flexible circuit layers or for protecting terminals in the first connecting portion 31.

[0208] In some embodiments, after bonding the first chip IC1 and the first connecting portion 31, a display module structure as shown in FIG15A can be obtained. The flexible circuit board 30 includes a first side L1 near the display area AA, and the first connecting portion 31 includes a second side L2 near the display area AA. The first side L1 and the second side L2 are separated by a second spacing distance H2. When the auxiliary portion 34 adopts a planarization design, the second spacing distance H2 is equal to the width of the auxiliary portion 34 in the second direction Y. Since the width of the auxiliary portion 34 in the second direction Y is relatively large, for example, the width of the auxiliary portion 34 in the second direction Y is in the range of 1 mm to 2 mm, the auxiliary portion 34 needs to occupy more space, which is not conducive to the narrow bezel of the display panel.

[0209] In some embodiments of this disclosure, after the first chip IC1 and the first connecting portion 31 are bonded together, the auxiliary portion 34 can be bent toward the first connecting portion 31, and the auxiliary portion 34 and the first connecting portion 31 can be fixed using a connecting component to obtain the display module structure shown in FIG15B. For example, the auxiliary portion 34 may include a bending portion 342 and a main body portion 343. The bending portion 342 is located on the side of the first connecting portion 31 near the display area AA, and the main body portion 343 is bent toward the first connecting portion 31 via the bending portion 342. The first side L1 of the flexible circuit board 30 near the display area AA may be located in the bending portion 342.

[0210] Compared to the display module in the embodiment shown in FIG15A, the auxiliary part 34 of the display module in the embodiment shown in FIG15B adopts a bending design, which can greatly reduce the second spacing distance H2 between the first side L1 and the second side L2 in the flexible circuit board 30. For example, the second spacing distance H2 is approximately equal to 0.325 mm.

[0211] This design reduces the space occupied by the flexible circuit board 30 in the non-display area NA. Correspondingly, the width reserved in the non-display area of ​​the display panel can be reduced during display panel design. For example, in the second direction Y, the reserved width d0 between the cover plate 18 of the display panel and the flexible circuit board 30 can be reduced, which facilitates a narrow bezel design for the display panel. A narrow bezel design for the display panel reduces the size of the silicon substrate in a single silicon-based OLED display device, thereby lowering costs.

[0212] For example, the main body 343 and the first connecting part 31 can be connected by the first adhesive layer 70.

[0213] In some embodiments, referring to Figures 14 and 15B, the first connection trace 341 may be located in the main body portion 343.

[0214] For example, the bending portion 342 has a first bending radius r1, and the first adhesive layer 70 has a first thickness h1 in the third direction Z, wherein the first bending radius r1 is greater than the first thickness h1. The third direction Z is parallel to the light emission direction of the display panel.

[0215] For example, the first bending radius r1 is in the range of 0.3 mm to 2 mm. For instance, the first bending radius r1 can be approximately equal to 0.325 mm.

[0216] For example, the first thickness h1 is in the range of 0.2 mm to 2 mm. For instance, the first thickness h1 can be approximately equal to 0.25 mm.

[0217] For example, the thickness of the flexible circuit board 30 in the third direction Z can be approximately equal to 0.2 mm.

[0218] For example, the surface of the cover plate 18 away from the substrate 11 is separated from the surface of the substrate 11 near the cover plate 18 by an eleventh spacing distance H11. For example, the eleventh spacing distance H11 is approximately equal to 0.7 mm.

[0219] For example, the surface of the main body 343 away from the substrate 11 is separated from the surface of the substrate 11 near the cover plate 18 by a twelfth spacing distance H12. For example, the twelfth spacing distance H12 is approximately equal to 0.65 mm.

[0220] For example, the eleventh interval distance H11 is greater than or equal to the twelfth interval distance H12. That is to say, the bending design of the auxiliary part 34 does not increase the thickness of the entire display module.

[0221] This design allows for narrow bezels on the display panel without increasing the overall thickness of the display module, thus facilitating miniaturization and thinning of the display module.

[0222] Figures 16A and 16B are schematic diagrams of the structure of a display module according to an embodiment of the present disclosure.

[0223] Exemplarily, in embodiments of this disclosure, referring to Figures 16A and 16B, after completing the bonding process between the first connecting portion 31 and the first chip IC1, the portion of the flexible circuit board 30 protruding towards the display area AA relative to the first connecting portion 31 can be removed, for example, the auxiliary portion 34 can be removed, thereby reducing the second spacing distance H2 between the first side L1 and the second side L2. Specifically, before bonding the flexible circuit board 30 to the first chip IC1, a first substrate layer 80 can be adhered to the surface of the auxiliary portion 34 near the substrate. After bonding the flexible circuit board 30 to the first chip IC1, the first substrate layer 80 is used to assist in removing the auxiliary portion 34. For example, the auxiliary portion 34 is used to protect the first connecting portion on the flexible circuit board 30 before bonding; or, the auxiliary portion is used to dissipate heat during the bonding process, reducing the impact of heat generation during the bonding process on the light-emitting devices in the display area. After the flexible circuit board 30 and the first chip IC1 are bonded, the auxiliary portion 34 has already played a corresponding protective or heat dissipation role. Furthermore, a portion or all of the auxiliary part 34 can be removed, thereby reducing the space occupied by the flexible circuit board 30 in the non-display area.

[0224] For example, the first side L1 and the second side L2 can be the same side. That is, the second interval distance H2 can be approximately equal to 0.

[0225] This design reduces the space occupied by the flexible circuit board 30 in the non-display area NA. Correspondingly, the width reserved in the non-display area of ​​the display panel can be reduced during display panel design. For example, in the second direction Y, the reserved width d0 between the cover plate 18 and the flexible circuit board 30 can be reduced, which facilitates a narrow bezel design for the display panel. A narrow bezel design for the display panel reduces the size of the silicon substrate in a single silicon-based OLED display device, thus lowering costs.

[0226] Figure 17 is a structural block diagram of a display device according to an embodiment of the present disclosure.

[0227] Optionally, embodiments of this disclosure also provide a display device. Referring to FIG17, the display device 1000 may include the aforementioned display module 200. The display device may include, but is not limited to, any product or component with display function such as electronic paper, mobile phone, tablet computer, monitor, laptop computer, digital photo frame, and navigator. It should be understood that this display device has the same beneficial effects as the display module provided in the foregoing embodiments.

[0228] While some embodiments of the general concept of this disclosure have been shown and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the general concept of this disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that, include: The display panel has a display area and a non-display area located outside the display area, the non-display area including a first bonding area, and the display panel including a first chip; A flexible circuit board, wherein the flexible circuit board is electrically connected to the first chip in the first bonding region; and The second chip is electrically connected to the first chip via the flexible circuit board. The flexible circuit board includes a first side edge near the display area, the first side edge being spaced apart from the display area by a first interval distance; and The flexible circuit board further includes a first connecting portion for electrical connection with the first chip. The first connecting portion includes a second side edge near the display area, and the second side edge and the first side edge are separated by a second spacing distance. Wherein, the second interval distance is smaller than the first interval distance.

2. The display module according to claim 1, wherein, The sum of the first interval distance and the second interval distance is greater than or equal to 500 micrometers.

3. The display module according to claim 1, wherein, The ratio of the first interval distance to the second interval distance is in the range of 2.7-15.

4. The display module according to claim 1, wherein, The display panel includes a third side covered by the flexible circuit board portion, and the first connecting portion includes a fourth side close to the third side. The third side and the fourth side are separated by an eleventh interval distance, which is substantially equal to the second interval distance.

5. The display module according to claim 1 or 2, wherein, The first chip includes a plurality of first terminals located in the first bonding region, and the flexible circuit board includes a plurality of second terminals located in the first connecting portion, wherein the plurality of first terminals and the plurality of second terminals are connected in a one-to-one correspondence; and The size of the second terminal is larger than the size of the corresponding first terminal.

6. The display module according to claim 5, wherein, The flexible circuit board further includes a second connection portion, which is located on the side of the first connection portion away from the display area, and the second connection portion is electrically connected to the second chip.

7. The display module according to claim 6, wherein, The flexible circuit board also includes a fifth side away from the display area, the fifth side being spaced twelfth interval distance from the side of the second connection portion closest to the fifth side, the twelfth interval distance being greater than the second interval distance.

8. The display module according to claim 5, wherein, The flexible circuit board further includes a second connecting portion, which is located on the side of the first connecting portion away from the display area; The display module further includes a printed circuit board, which is electrically connected to the second connection portion; and The second chip is disposed on the printed circuit board.

9. The display module according to claim 8, wherein, The second connection portion and the second chip are separated by a thirteenth interval distance, which is greater than the second interval distance; and / or, The printed circuit board includes a sixth side away from the display area, the sixth side being spaced fourteenth interval distance from the second chip, the fourteenth interval distance being greater than the second interval distance.

10. The display module according to any one of claims 5-9, wherein, In a first direction, the first binding area includes a first area located on a first side, a second area located in the middle, and a third area located on a second side, and the first direction is parallel to the first side. The plurality of first terminals include: a plurality of first sub-terminals located in the first region, a plurality of second sub-terminals located in the second region, and a plurality of third sub-terminals located in the third region. Wherein, at least one end of the first sub-terminal near the display area is inclined toward the third region relative to the end of the first sub-terminal away from the display area; and / or At least one end of the second sub-terminal near the display area is not tilted relative to the end of the second sub-terminal away from the display area; and / or, At least one of the third sub-terminals is inclined toward the first region at one end near the display area relative to the end of the third sub-terminal away from the display area.

11. The display module according to any one of claims 5-10, wherein, In the second direction, the plurality of first terminals include M rows of first terminals, wherein the area where the first terminal in the i-th row is located and the area where the first terminal in the (i+1)-th row is located are separated by a third interval distance, wherein the second direction is parallel to the direction from the display area to the flexible circuit board, M is a positive integer greater than or equal to 2, and i is a positive integer greater than or equal to 1 and less than or equal to M-1. The first binding region has a first width in the second direction, and the ratio of the third spacing distance to the first width is less than 20%; and / or, The ratio of the third interval distance to the second interval distance is in the range of 0.5-4.

12. The display module according to claim 10, wherein, In the first direction, adjacent first sub-terminals among the plurality of first sub-terminals are spaced apart by a fourth interval distance, adjacent second sub-terminals among the plurality of second sub-terminals are spaced apart by a fifth interval distance, and adjacent third sub-terminals among the plurality of third sub-terminals are spaced apart by a sixth interval distance. Wherein, the fourth interval distance is substantially equal to the fifth interval distance; and / or, The fourth interval distance is substantially equal to the sixth interval distance; and / or, The fifth interval distance is substantially equal to the sixth interval distance.

13. The display module according to claim 12, wherein, The second chip includes a second bonding region and a plurality of third terminals located in the second bonding region; The third terminal has a second width in a first direction, and the third terminal has a third width in a second direction, wherein the second width and the third width are substantially equal. The centers of two adjacent third terminals located in the same row are separated by a seventh spacing distance in a first direction, the ratio of the seventh spacing distance to the second width being greater than or equal to 2.4; and / or, The centers of two adjacent third terminals located in the same column are spaced apart by an eighth interval distance in the second direction, and the ratio of the eighth interval distance to the third width is greater than or equal to 2.

14. The display module according to claim 13, wherein, The second chip also includes a third bonding region and a plurality of fourth terminals located in the third bonding region, the fourth terminals having a fourth width in a first direction and a fifth width in a second direction, the fourth width and the fifth width being substantially equal; And / or, The fourth width is greater than the second width; and / or, The fifth width is greater than the third width.

15. The display module according to claim 14, wherein, The centers of two adjacent fourth terminals located in the same row are spaced a ninth interval distance in a first direction, the ratio of the ninth interval distance to the fourth width being in the range of 2.1 to 2.5; and / or, The centers of two adjacent fourth terminals located in the same column are spaced a tenth interval distance in the second direction, and the ratio of the tenth interval distance to the fifth width is in the range of 1.9 to 2.

5.

16. The display module according to any one of claims 1-15, wherein, The flexible circuit board includes a first flexible circuit layer, a second flexible circuit layer, and a first insulating layer located between the first flexible circuit layer and the second flexible circuit layer. The first flexible circuit layer and the second flexible circuit layer are electrically connected by multiple first connection traces that penetrate the first insulating layer.

17. The display module according to any one of claims 1-16, wherein, The flexible circuit board further includes an auxiliary portion connected to the first connecting portion; the auxiliary portion includes a bending portion and a main body portion, the bending portion being located on the side of the first connecting portion near the display area, and the main body portion bending towards the first connecting portion via the bending portion; and The main body and the first connecting part are connected by a first adhesive layer.

18. The display module according to claim 17, wherein, The first connecting trace is located in the main body; and / or, the bending portion has a first bending radius, the first adhesive layer has a first thickness in a third direction, the first bending radius is greater than the first thickness, and the third direction is parallel to the light emission direction of the display panel.

19. The display module according to claim 1, wherein, The second interval is approximately equal to 0.

20. A display device comprising a display module as described in any one of claims 1-19.

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