Dielectric cavity resonator and filter

Abstract

The present application provides a dielectric cavity resonator and a filter. The dielectric cavity resonator comprises a resonator housing (10) and a dielectric resonance member (20); the resonator housing (10) is provided with a first plate member (11) and a second plate member (12); the dielectric resonance member (20) is arranged in the resonator housing (10); one end of the dielectric resonance member (20) is connected to the first plate member (11), and the other end of the dielectric resonance member (20) is spaced apart from the second plate member (12); and the dielectric resonance member (20) is provided with an opening structure (21), and the opening structure (21) is used for increasing the resonance frequency of a TE mode, so that the resonance frequency of the TE mode and the resonance frequency of a TM mode are within the same frequency band. The dielectric cavity resonator can couple, in a single cavity, at least two resonance modes such as a TE mode and a TM mode, so that a coupling relationship between the dielectric cavity resonator and resonators such as a metal coaxial resonator can be conveniently constructed, and a better coupling effect is achieved.

Description

Dielectric cavity resonator and filter

[0001] This application claims priority to the Chinese Patent Application No. 202411369571.2, filed on September 27, 2024, and entitled "Dielectric cavity resonator and filter", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application belongs to the field of communication technology, and particularly relates to a dielectric cavity resonator and filter. BACKGROUND

[0003] A dual-mode resonator is a resonator capable of simultaneously generating two frequency-stable oscillation signals. The dual-mode resonator can support two resonant modes within its passband range. The commonly used dual-mode resonator is an HE dual-mode resonator. However, the HE dual-mode resonator utilizes HE (Hybrid Electromagnetic Mode) two orthogonal modes, and the coupling of the HE mode with TEM (Transverse Electric and Magnetic Field) mode and other modes is difficult, resulting in that the coupling of the HE dual-mode resonator with resonators such as a metal coaxial resonator is difficult to build and the coupling effect is poor, thereby causing poor usability and applicability of the HE dual-mode resonator.

[0004] SUMMARY

[0005] Embodiments of the present application provide a dielectric cavity resonator and filter, aiming to solve the problem of poor usability and applicability of the existing dual-mode resonator and resonators such as a metal coaxial resonator due to the difficulty in coupling construction and poor coupling effect.

[0006] To achieve the above object, the technical solutions adopted by the embodiments of the present application are as follows:

[0007] In a first aspect, a dielectric cavity resonator is provided, comprising:

[0008] a resonator shell having a first plate member and a second plate member arranged oppositely;

[0009] a dielectric resonator member arranged in the resonator shell, one end of the dielectric resonator member being connected to the first plate member, the other end of the dielectric resonator member being arranged spaced apart from the second plate member, the dielectric resonator member being provided with an opening structure, the opening structure being used to increase the resonant frequency of the TE mode so that the resonant frequency of the TE mode and the resonant frequency of the TM mode are in the same frequency band.

[0010] In some embodiments, the opening structure is arranged close to the outer peripheral surface of the dielectric resonator member and away from the central axis of the dielectric resonator member.

[0011] In some embodiments, the opening structure comprises at least one of a hole, a groove.

[0012] In some embodiments, the opening structure is in axial communication with at least one end surface of the dielectric resonator along an axial direction of the dielectric resonator.

[0013] In some embodiments, the opening structure comprises a first opening formed in an end surface of the dielectric resonator, the first opening being disposed between an outer circumferential surface of the dielectric resonator and a central axis of the dielectric resonator;

[0014] and / or, the opening structure comprises a second opening formed in a circumferential edge of the dielectric resonator, the second opening being in communication with an outer circumferential surface of the dielectric resonator and at least one end surface of the dielectric resonator;

[0015] and / or, the opening structure comprises a third opening formed in an outer circumferential surface of the dielectric resonator, the third opening being disposed between two end surfaces of the dielectric resonator.

[0016] In some embodiments, the first plate member has a grounding component, the opening structure comprises an annular recess which is continuous or discontinuous around the annular shape, a central axis of the annular recess coincides with a central axis of the dielectric resonator, a recess bottom of the annular recess is closed, and the grounding component closes the recess of the annular recess so that a resonant frequency of the HE dual mode is in the same frequency band as a resonant frequency of the TE mode and a resonant frequency of the TM mode.

[0017] In some embodiments, the dielectric resonator comprises a plurality of dielectric layers arranged in sequence along an axial direction thereof; and a cross-sectional dimension of each of the dielectric layers is tapered in a direction close to the first plate member.

[0018] In some embodiments, the first plate member is provided with a base platform, and the dielectric resonator is connected to the base platform.

[0019] In some embodiments, the opening structure is formed in a circumferential edge of the dielectric resonator, and the opening structure is in communication with an end surface of the dielectric resonator facing the first plate member; or,

[0020] the opening structure is formed in an end surface of the dielectric resonator facing the first plate member.

[0021] In some embodiments, the dielectric cavity resonator comprises a ceramic base connected between the dielectric resonator and the first plate member.

[0022] In some embodiments, the ceramic base is provided with a receiving groove on a side facing the dielectric resonator, a fastening hole is formed through a groove bottom of the receiving groove, the ceramic base is connected to the first plate through a fastener penetrating the fastening hole, the fastener does not protrude from a groove opening of the receiving groove, and the ceramic base is in abutment with and fixedly connected to the dielectric resonator.

[0023] In some embodiments, the dielectric resonator has a rotational symmetry structure.

[0024] In some embodiments, the dielectric cavity resonator comprises an adjusting screw threadedly connected to the resonator housing for adjusting the resonant frequency of the TM mode.

[0025] In some embodiments, the dielectric cavity resonator comprises a metal disc and an insulating member, the metal disc is arranged opposite to the dielectric resonator along an axial direction of the dielectric resonator, the metal disc is connected to the second plate through the insulating member, and a spacing between the metal disc and the dielectric resonator is adjustable for adjusting the resonant frequency of the TE mode.

[0026] In some embodiments, the metal disc has a circular disc shape, an outer peripheral wall of the insulating member is provided with external threads, the insulating member is connected to a center of the metal disc and threadedly connected to the second plate.

[0027] In a second aspect, a filter is provided, comprising the dielectric cavity resonator provided in the embodiments.

[0028] The dielectric cavity resonator provided in the embodiments has the following beneficial effects:

[0029] The dielectric cavity resonator provided in the embodiments can have an opening structure arranged on the dielectric resonator to locally thin the dielectric resonator, especially to reduce or even zero the thickness of the dielectric resonator corresponding to the opening structure along the axial direction and the radial direction, thereby improving the resonant frequency of the TE mode, approaching the resonant frequency of the TE mode to the resonant frequency of the TM mode, and making the resonant frequency of the TE mode and the resonant frequency of the TM mode within the passband range and close to the same frequency band. Thus, the dielectric cavity resonator can couple at least two orthogonal resonant modes of the TE mode and the TM mode with high Q value (Quality Factor, Q value), and can be coupled with a resonator such as a metal coaxial resonator based on the TE mode and the TM mode, so that the coupling effect is better, thereby improving the usability, applicability and practicability of the dielectric cavity resonator. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings described below only are some embodiments of the present application, and for those skilled in the art, based on these drawings, other drawings can be obtained without any creative work.

[0031] Fig. 1 is a perspective view of a dielectric cavity resonator according to some embodiments of the present application;

[0032] Fig. 2 is a cross-sectional view of the dielectric cavity resonator according to Fig. 1;

[0033] Fig. 3 is an exploded view of the dielectric resonator, the ceramic base and the fastener according to Fig. 2, wherein the opening structure comprises a first opening, and the first opening comprises a plurality of first holes;

[0034] Fig. 4 is a cross-sectional view of a dielectric cavity resonator according to some other embodiments of the present application, wherein the opening structure comprises a first opening and a second opening, the first opening comprises a first annular slot, and the second opening comprises a second annular slot;

[0035] Fig. 5 is a perspective view of the dielectric resonator according to Fig. 4;

[0036] Fig. 6 is a cross-sectional view of a dielectric cavity resonator according to some other embodiments of the present application, wherein the opening structure comprises a second opening, and the second opening comprises a second annular slot;

[0037] Fig. 7 is a perspective view of the dielectric resonator according to Fig. 6;

[0038] Fig. 8 is a perspective view of a dielectric resonator according to some other embodiments of the present application, wherein the opening structure comprises a second opening, and the second opening comprises a plurality of strip slots;

[0039] Fig. 9 is a cross-sectional view of a dielectric cavity resonator according to some other embodiments of the present application, wherein the opening structure comprises a third opening, and the third opening comprises a second hole;

[0040] Fig. 10 is a cross-sectional view of a dielectric cavity resonator according to some other embodiments of the present application, wherein the opening structure comprises a third opening, and the third opening comprises a third annular slot.

[0041] In the drawings:

[0042] 10 - resonator housing, 11 - first plate member, 111 - bottom base, 12 - second plate member, 121 - first threaded hole, 122 - second threaded hole, 13 - resonant cavity; 20 - dielectric resonator, 21 - opening structure, 211 - first opening, 212 - second opening, 213 - third opening, 2111 - first hole, 2112 - first annular groove, 2121 - second annular groove, 2122 - strip-shaped groove, 2131 - second hole, 2132 - third annular groove, 22 - dielectric layer, 23 - central hole; 30 - ceramic base, 31 - accommodating groove, 32 - fastening hole, 40 - fastening member, 50 - adjusting screw, 60 - metal disc, 61 - through hole, 70 - insulating member, y - first direction, L - central axis of the dielectric resonator. DETAILED DESCRIPTION

[0043] In order to make the technical problems to be solved, technical solutions and beneficial effects of the present application clear, the present application will be described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application. If not specifically stated, all embodiments and optional embodiments of the present application can be combined to form new technical solutions. If not specifically stated, all technical features and optional technical features of the present application can be combined to form new technical solutions.

[0044] In the description of the present application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0045] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0046] In this application, unless otherwise expressly specified and limited, the terms "mounting", "connection", "connecting", "fixed", and like terms should be construed in a broad sense and should not be limited to the meaning of fixed connection, detachable connection, or integral connection; mechanical connection, or electrical connection; direct connection, or indirect connection via an intermediate medium; or internal communication between two elements, or interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0047] In this application, "central axis" refers to a line passing through the geometric center line of the corresponding structure.

[0048] In this application, "axial direction" refers to the extension direction of the central axis of the corresponding structure, "radial direction" refers to any direction passing through the central axis and perpendicular to the central axis of the corresponding structure, and "circumferential direction" refers to the circumferential direction of the outer circumferential surface of the corresponding structure.

[0049] A single-mode resonator supports only one resonant mode (e.g., TE (Transverse Electric) mode, TM (Transverse Magnetic) mode, TEM (Transverse Electric and Magnetic Field) mode, etc.) within its passband range. For example, a metal coaxial resonator is a single-mode resonator, which supports only a TEM mode within its passband range.

[0050] A dual-mode resonator is a resonator capable of simultaneously generating two frequency-stable oscillation signals. A dual-mode resonator can support two resonant modes within its passband range. The commonly used dual-mode resonator is an HE dual-mode resonator. However, the HE dual-mode resonator utilizes two orthogonal HE (Hybrid Electromagnetic Mode) modes, and it is difficult to couple the HE mode with TEM mode, TM mode, TE mode, etc. This leads to difficulties in coupling the HE dual-mode resonator with other resonators such as a metal coaxial resonator, and the coupling effect is poor, resulting in poor usability and applicability of the HE dual-mode resonator.

[0051] Therefore, the embodiments of the present application provide a dielectric cavity resonator, which can couple at least two orthogonal resonant modes of TE mode and TM mode in a single cavity. The dielectric cavity resonator is convenient to establish a coupling relationship with other resonators such as a metal coaxial resonator, and the coupling effect is better. The dielectric cavity resonator has better usability, applicability, and practicality.

[0052] The specific implementation of the present application is described in detail below in combination with specific embodiments:

[0053] Referring to FIG. 1, FIG. 2, and FIG. 3, some embodiments of the present application provide a dielectric cavity resonator. The dielectric cavity resonator comprises a resonator shell 10 and a dielectric resonator piece 20. The resonator shell 10 has a first plate 11 and a second plate 12 arranged oppositely. The dielectric resonator piece 20 is arranged in the resonator shell 10. One end of the dielectric resonator piece 20 is connected to the first plate 11, and the other end of the dielectric resonator piece 20 is arranged apart from the second plate 12. The dielectric resonator piece 20 is provided with an opening structure 21 for improving the resonant frequency of the TE mode so that the resonant frequency of the TE mode is in the same frequency band as the resonant frequency of the TM mode.

[0054] It should be noted that the dielectric cavity resonator provided by the present application can couple at least two orthogonal resonant modes of the TE mode and the TM mode in a single cavity, that is, while the dielectric cavity resonator couples the TE mode and the TM mode in the two modes, the dielectric cavity resonator can also couple other modes in addition to the TE mode and the TM mode, or can not couple other modes in addition to the TE mode and the TM mode. When the dielectric cavity resonator only couples the TE mode and the TM mode in a single cavity, the dielectric cavity resonator is a TE-TM dual-mode resonator. When the dielectric cavity resonator couples the TE mode and the TM mode in a single cavity while also coupling other resonant modes (such as the HE mode), the dielectric cavity resonator is a multi-mode resonator (such as a three-mode resonator, a four-mode resonator).

[0055] It should also be noted that the resonator shell 10 has a resonant cavity 13 (which can be an air cavity) inside. The resonant cavity 13 can be, but is not limited to, a rectangular resonant cavity, a square resonant cavity, a polygonal column resonant cavity, a cylindrical resonant cavity, etc. The resonant cavity 13 can accommodate the dielectric resonator piece 20. Alternatively, the dielectric resonator piece 20 can be arranged centrally in the resonant cavity 13. The resonator shell 10 can achieve a shielding function to prevent signal leakage.

[0056] The plate on one side of the resonator shell 10 is the first plate 11, and the plate on the side of the resonator shell 10 opposite the first plate 11 is the second plate 12. In actual application scenarios, the resonator shell 10 can be placed with the second plate 12 facing up, or placed with the second plate 12 facing left, right, front, or back. In addition, the shape, size, material, etc. of the resonator shell 10 can be flexibly set as needed.

[0057] It should also be noted that the dielectric resonator piece 20 is a resonator piece made of dielectric material. The dielectric resonator piece 20 can be a ceramic dielectric resonator piece or a dielectric resonator piece made of other materials.

[0058] The medium resonant piece 20 is connected to the first plate piece 11 at one end along the axial direction thereof. The other end of the medium resonant piece 20 along the axial direction thereof (i.e. the end of the medium resonant piece 20 close to the second plate piece 12) is spaced apart from the second plate piece 12. The medium resonant piece 20 can be directly connected and fixed to the first plate piece 11 by means of welding, bonding, riveting, crimping, insertion, screw fastening, threaded connection, clamping, etc., or can be indirectly connected and fixed to the first plate piece 11 by means of other structures connected thereto (e.g. the base 111, the ceramic base 30, the coupling rib, etc.).

[0059] The medium resonant piece 20 can be in the form of, but is not limited to, a column, a block, a rod, etc. The cross-sectional shape of the medium resonant piece 20 perpendicular to the axial direction thereof can be in the form of, but is not limited to, a circle, a rectangle, a square, a polygon, a petal shape, a cross shape, etc. The cross-sectional shape of the medium resonant piece 20 parallel to the axial direction thereof can also be in the form of, but is not limited to, a circle, a rectangle, a square, a polygon, a petal shape, a cross shape, etc. The medium resonant piece 20 can be provided with a central hole 23 at the central axis L thereof, or can not be provided with a central hole 23.

[0060] It should be further noted that the spacing arrangement direction of the first plate piece 11 and the second plate piece 12 is defined as the first direction y. In the present application, the central axis L of the medium resonant piece 20 is parallel or substantially parallel to the first direction y after the medium resonant piece 20 is installed into the resonant cavity 13. That is, the axial direction of the medium resonant piece 20 is parallel or substantially parallel to the first direction y after the medium resonant piece 20 is installed into the resonant cavity 13.

[0061] It should be further noted that, in the present application, the two end faces of the medium resonant piece 20 refer to the two end faces opposite along the axial direction of the medium resonant piece 20, and the outer peripheral surface of the medium resonant piece 20 refers to the peripheral surface connecting the two end faces of the medium resonant piece 20.

[0062] It should be further noted that, in the case where the medium resonant piece 20 is not provided with the opening structure 21, the resonant frequency of the TE mode is at a low frequency, and the resonant frequency of the TM mode is at a high frequency, i.e. the resonant frequency of the TE mode is lower than the resonant frequency of the TM mode and is outside the passband range.

[0063] In order to make the resonant frequency of the TE mode close to the resonant frequency of the TM mode, the present embodiment provides the opening structure 21 at the medium resonant piece 20, so that the part of the medium resonant piece 20 at the opening structure 21 is hollowed out.

[0064] Since the electric field of the TE mode is horizontally (i.e. parallel to the orientation of the first plate member 11) distributed and the magnetic field of the TE mode is vertically (i.e. perpendicular to the orientation of the first plate member 11) distributed, the electric field of the TE mode is more concentrated around the circumference of the dielectric resonant member 20. Since the magnetic field of the TM mode is horizontally distributed and the electric field of the TM mode is vertically distributed, the electric field of the TM mode is more concentrated at the central axis L of the dielectric resonant member 20.

[0065] Therefore, based on the opening structure 21, the dielectric resonant member 20 can be locally thinned, and in particular, the thickness (i.e. axial dimension) of the portion of the dielectric resonant member 20 corresponding to the opening structure 21 in the axial direction can be reduced or even zeroed, so that the resonant frequency of the TE mode can be improved. Correspondingly, when the size of the portion of the dielectric resonant member 20 corresponding to the opening structure 21 in the axial direction is reduced, the size of the portion of the dielectric resonant member 20 corresponding to the opening structure 21 in the radial direction is also reduced accordingly. Based on this, the resonant frequency of the TE mode can be finely improved by precisely designing the shape (e.g. slot, hole, etc.), shape (e.g. ring, circle, rectangle, ellipse, etc.), size (e.g. depth, width, length, etc.), position, etc. of the opening structure 21, so as to make the resonant frequency of the TE mode close to the resonant frequency of the TM mode and approach the same frequency band and be within the passband range.

[0066] In summary, the dielectric cavity resonator provided by the embodiments of the present application can locally thin the dielectric resonant member 20 by providing the opening structure 21 on the dielectric resonant member 20, and in particular, the thickness of the portion of the dielectric resonant member 20 corresponding to the opening structure 21 in the axial and radial directions can be reduced or even zeroed, so that the resonant frequency of the TE mode can be improved, the resonant frequency of the TE mode can be made close to the resonant frequency of the TM mode, and the resonant frequency of the TE mode can be made within the passband range and close to the same frequency band as the resonant frequency of the TM mode. Thus, the dielectric cavity resonator can couple at least two orthogonal high-Q resonant modes of the TE mode and the TM mode in a single cavity, and can be coupled with a metal coaxial resonator and other resonators based on the TE mode and the TM mode, so that the coupling effect is better, and thus the usability, applicability and practicability of the dielectric cavity resonator are better.

[0067] Moreover, the dielectric cavity resonator can achieve at least two-order filtering effect, which is equivalent to the filtering effect of at least two single-mode resonators in series, i.e. the filtering effect of at least two microwave resonators, so that the performance and space utilization of the dielectric cavity resonator can be improved. Moreover, the dielectric cavity resonator has a small size, which is beneficial to miniaturization and lightweight design.

[0068] When the dielectric cavity resonator only couples TE mode and TM mode resonant modes at a single cavity, i.e., the dielectric cavity resonator is a TE-TM dual-mode resonator, the opening structure 21 not only has the effect of increasing the TE mode resonant frequency, but also has the effect of pushing away the resonant frequency of the HE mode. Based on this, the resonant frequency of the HE mode originally outside the passband range can be further pushed away to reduce the interference from the HE mode, so that the TE-TM dual-mode resonator can only couple TE mode and TM mode resonant modes, and not couple the HE mode. The performance of the dielectric cavity resonator can be optimized when the dielectric cavity resonator is a TE-TM dual-mode resonator.

[0069] Please refer to FIG. 3 and FIG. 4. In some embodiments of the present application, the opening structure 21 is arranged close to the outer circumferential surface of the dielectric resonant member 20 and away from the central axis L of the dielectric resonant member 20.

[0070] It should be noted that the opening structure 21 is arranged relatively close to the outer circumferential surface of the dielectric resonant member 20 and relatively away from the central axis L of the dielectric resonant member 20. That is, the distance between the opening structure 21 and the outer circumferential surface of the dielectric resonant member 20 is less than the distance between the opening structure 21 and the central axis L of the dielectric resonant member 20.

[0071] Since the electric field of the TE mode is more concentrated around the side of the dielectric resonant member 20, and since the electric field of the TM mode is more concentrated at the central axis L of the dielectric resonant member 20. By using the above scheme, by arranging the opening structure 21 close to the outer circumferential surface of the dielectric resonant member 20 and away from the central axis L of the dielectric resonant member 20, the opening structure 21 can be arranged relatively close to the main distribution area of the TE mode electric field and relatively away from the main distribution area of the TM mode electric field. Based on this, the influence of the opening structure 21 on the TM mode resonant frequency can be reduced on the basis of increasing the TE mode resonant frequency through the opening structure 21, so that the resonant frequency of the TE mode and the resonant frequency of the TM mode can be accurately designed to be within the passband range and close to the same frequency band, and the performance of the dielectric cavity resonator can be improved.

[0072] Please refer to FIG. 3 and FIG. 4. In some embodiments of the present application, the opening structure 21 includes at least one of an opening and a groove.

[0073] It should be noted that in some embodiments, the opening structure 21 can include an opening. In other embodiments, the opening structure 21 can include a groove. In other embodiments, the opening structure 21 can include an opening and a groove. That is, the embodiments of the opening and the embodiments of the groove can be arranged separately or in combination.

[0074] The opening can be a blind hole or a through hole. The opening can be a circular hole, a rectangular hole, a waist-shaped hole, a special-shaped hole, or the like. The opening can be formed on any end surface of the dielectric resonant piece 20 along the axial direction thereof, or can be formed on the outer circumferential surface of the dielectric resonant piece 20.

[0075] The groove can be a straight groove, a curved groove, an arc-shaped groove, a ring-shaped groove, or the like. The groove can be formed on any end surface of the dielectric resonant piece 20 along the axial direction thereof, or can be formed on the outer circumferential surface of the dielectric resonant piece 20.

[0076] By using the above scheme, the opening structure 21 can adopt the opening and groove forms to improve the structural regularity of the opening structure 21. Based on this, on the one hand, it can be convenient to design a mold, and it can be convenient to integrally form the dielectric resonant piece 20 and the opening structure 21 of the dielectric resonant piece 20 in the form of an opening and groove through the mold, thereby improving the forming convenience and forming precision of the dielectric resonant piece 20 and the opening structure 21 thereof. On the other hand, the opening and groove forms can facilitate accurate adjustment of the size, shape, and position to accurately control the resonant frequency of the TE mode, thereby facilitating accurate design of the “TE mode resonant frequency and TM mode resonant frequency being in the passband range and close to the same frequency band”, and facilitating improvement of the performance of the dielectric cavity resonator. Moreover, the opening and groove forms can accurately reduce the weight of the dielectric resonant piece 20, thereby reducing the weight of the dielectric cavity resonator under the premise of optimizing the performance, which is conducive to the lightweight of the dielectric cavity resonator.

[0077] Please refer to FIGS. 2, 3, 4, and 5. In some embodiments of the present application, the opening structure 21 is communicated to at least one end surface of the dielectric resonant piece 20 along the axial direction of the dielectric resonant piece 20.

[0078] It should be noted that the opening structure 21 is communicated to at least one end surface of the dielectric resonant piece 20 along the axial direction of the dielectric resonant piece 20, which includes the case that the opening structure 21 is formed on the end surface of the dielectric resonant piece 20, and the opening structure 21 is arranged between the outer circumferential surface of the dielectric resonant piece 20 and the central axis L of the dielectric resonant piece 20 (for example, the first hole 2111 shown in FIG. 3, and for example, the first ring-shaped groove 2112 shown in FIG. 4), and also includes the case that the opening structure 21 is formed on the circumferential edge of the dielectric resonant piece 20, and the opening structure 21 is communicated to the outer circumferential surface of the dielectric resonant piece 20 and at least one end surface of the dielectric resonant piece 20 (for example, the second ring-shaped groove 2121 shown in FIG. 4, and for example, the strip-shaped groove 2122 shown in FIG. 8).

[0079] It should be noted that, no matter whether the opening structure 21 is in the form of a hole or a groove, the opening structure 21 is communicated to at least one end surface of the dielectric resonant element 20 along the axial direction of the dielectric resonant element 20, and the depth direction of the opening structure 21 (for example, the hole depth direction of the hole or the groove depth direction of the groove) corresponds to (that is, is substantially parallel to) the axial direction of the dielectric resonant element 20. In this case, the opening structure 21 can be communicated to only one end surface of the dielectric resonant element 20 along the axial direction of the dielectric resonant element 20, or the opening structure 21 can be communicated to opposite two end surfaces of the dielectric resonant element 20 along the axial direction of the dielectric resonant element 20.

[0080] By using the above scheme, by making the opening structure 21 communicated to at least one end surface of the dielectric resonant element 20 along the axial direction of the dielectric resonant element 20, the depth direction of the opening structure 21 can correspond to the axial direction of the dielectric resonant element 20, so that the specific area of the dielectric resonant element 20 can be directly thinned along the axial direction of the dielectric resonant element 20, and in particular, the thickness of the part of the dielectric resonant element 20 corresponding to the opening structure 21 in the axial direction can be directly, flexibly and accurately thinned to the expected value (even to zero) based on the depth design of the opening structure 21, so that the resonant frequency of the TE mode can be conveniently, controllably and accurately improved, the adjustment convenience and adjustment accuracy of the resonant frequency of the TE mode can be improved, and the performance and design flexibility of the dielectric cavity resonator can be improved.

[0081] In addition, based on the arrangement of the present embodiment, the opening of the opening structure 21 is communicated to the end surface of the dielectric resonant element 20, and the opening structure 21 is arranged to extend along the axial direction of the dielectric resonant element 20, based on which, the mold can be conveniently designed, and the dielectric resonant element 20 and the opening structure 21 thereof can be integrally formed through the mold, in particular, the demolding convenience of the mold after the dielectric resonant element 20 is formed (the demolding can be performed along the axial direction of the dielectric resonant element 20) can be improved, and the forming convenience and forming accuracy of the dielectric resonant element 20 can be improved, and the cost of the mold and the processing cost of the dielectric resonant element 20 can be reduced.

[0082] Please refer to FIG. 3, FIG. 4 and FIG. 5, in some embodiments of the present application, the opening structure 21 includes a first opening 211 formed in the end surface of the dielectric resonant element 20, and the first opening 211 is arranged between the outer circumferential surface of the dielectric resonant element 20 and the central axis L of the dielectric resonant element 20.

[0083] It should be noted that no matter whether the first opening 211 is in the form of a hole or a groove, the first opening 211 is formed in the end face of the dielectric resonant element 20 and is located between the outer circumferential surface of the dielectric resonant element 20 and the central axis L of the dielectric resonant element 20. Among them, the first opening 211 can be arranged exactly in the middle between the outer circumferential surface of the dielectric resonant element 20 and the central axis L of the dielectric resonant element 20, or can be arranged towards the outer circumferential surface of the dielectric resonant element 20 or towards the central axis L of the dielectric resonant element 20.

[0084] For example, as shown in FIGS. 2 and 3, in a possible embodiment, the first opening 211 includes at least one first hole 2111, the first hole 2111 is formed in the end face of the dielectric resonant element 20, and the hole depth direction of the first hole 2111 corresponds to the axial direction of the dielectric resonant element 20. The first hole 2111 is arranged between the outer circumferential surface of the dielectric resonant element 20 and the central axis L of the dielectric resonant element 20. The first hole 2111 can be a through hole or a blind hole. In the case of a blind hole, the first hole 2111 can be formed in the end face of the dielectric resonant element 20 facing the first plate 11, or can be formed in the end face of the dielectric resonant element 20 facing the second plate 12. The first hole 2111 can be a circular hole, a rectangular hole, a waist-shaped hole, a special-shaped hole, etc. In the case of multiple first holes 2111, the multiple first holes 2111 can be arranged on the same circumference, or can be flexibly arranged; in the case of multiple first holes 2111 arranged on the same circumference, the multiple first holes 2111 can be arranged at equal angles around the central axis L of the dielectric resonant element 20, or can be arranged at unequal angles. In the case of multiple first holes 2111, the multiple first holes 2111 can be the same type of hole, or a combination of different types of holes; in the case of multiple first holes 2111 being the same type of hole, the sizes of the multiple first holes 2111 can be the same or different. In the case of multiple first holes 2111, the multiple first holes 2111 can be formed in the same end face of the dielectric resonant element 20, or can be formed in the opposite two end faces of the dielectric resonant element 20.

[0085] Among them, the more the number of the first holes 2111, the higher the resonant frequency of the TE mode; the deeper the hole depth of the first hole 2111, the higher the resonant frequency of the TE mode; the larger the hole diameter of the first hole 2111, the higher the resonant frequency of the TE mode; the closer the position of the first hole 2111 to the outer circumferential side of the dielectric resonant element 20, the higher the resonant frequency of the TE mode. Based on this, the number, size, shape and position of the first hole 2111 can be accurately adjusted to accurately control the resonant frequency of the TE mode, thereby facilitating the accurate design of the resonant frequency of the TE mode and the resonant frequency of the TM mode being in the passband range and close to the same frequency band, and facilitating the improvement of the performance of the dielectric cavity resonator.

[0086] For example, as shown in FIG. 4 and FIG. 5, in another possible embodiment, the first opening 211 includes at least one first annular groove 2112. The first annular groove 2112 can be formed on the end surface of the dielectric resonant piece 20 facing the first plate piece 11, or on the end surface of the dielectric resonant piece 20 facing the second plate piece 12. The first annular groove 2112 is arranged between the outer circumferential surface of the dielectric resonant piece 20 and the central axis L of the dielectric resonant piece 20. The first annular groove 2112 surrounds the central axis L of the dielectric resonant piece 20. The central axis (i.e., the surrounding axis) of the first annular groove 2112 is parallel to the central axis L of the dielectric resonant piece 20. The central axis of the first annular groove 2112 can be coincident with the central axis L of the dielectric resonant piece 20, or can be spaced apart from the central axis L of the dielectric resonant piece 20. The shape of the surrounding path of the first annular groove 2112 can be the same as or different from the cross-sectional shape of the dielectric resonant piece 20 perpendicular to the central axis L thereof. The groove depth direction of the first annular groove 2112 corresponds to the axial direction of the dielectric resonant piece 20. The shape of the first annular groove 2112 can be a cylindrical groove, a conical groove, a table groove, a stepped groove, or other shapes. In the case where multiple first annular grooves 2112 are provided, the multiple first annular grooves 2112 can be arranged in sequence from the inside to the outside. In the case where multiple first annular grooves 2112 are provided, the multiple first annular grooves 2112 can all be formed on the same end surface of the dielectric resonant piece 20, or can be formed on the opposite two end surfaces of the dielectric resonant piece 20.

[0087] In the above formula, the more the number of the first annular groove 2112, the higher the resonant frequency of the TE mode; the deeper the groove depth of the first annular groove 2112, the higher the resonant frequency of the TE mode; the wider the groove width of the first annular groove 2112, the higher the resonant frequency of the TE mode; the longer the extension path of the first annular groove 2112 along the circumferential direction thereof, the higher the resonant frequency of the TE mode; the closer the position of the first annular groove 2112 to the outer circumferential side of the dielectric resonant piece 20, the higher the resonant frequency of the TE mode. Based on this, the number, size, shape, and position of the first annular groove 2112 can be accurately adjusted to accurately control the resonant frequency of the TE mode, thereby facilitating the accurate design of the resonant frequency of the TE mode and the resonant frequency of the TM mode being within the passband range and close to the same frequency band, and facilitating the improvement of the performance of the dielectric cavity resonator.

[0088] Of course, in other possible embodiments, the first annular groove 2112 can be replaced by a straight groove, a curved groove, an arcuate groove, or the like. The number of the straight groove, the curved groove, the arcuate groove, or the like can be one or multiple. In the case where the number of the straight groove, the curved groove, the arcuate groove, or the like is multiple, the multiple grooves can be grooves of the same type or a combination of grooves of different types; in the case where the multiple grooves are grooves of the same type, the sizes of the multiple grooves can be the same or different.

[0089] By adopting the above scheme, by opening the first opening 211 on the end surface of the dielectric resonant piece 20, and arranging the first opening 211 between the outer circumferential surface of the dielectric resonant piece 20 and the central axis L of the dielectric resonant piece 20, the depth direction of the first opening 211 corresponds to the axial direction of the dielectric resonant piece 20, so that the specific area of the dielectric resonant piece 20 can be thinned directly along the axial direction of the dielectric resonant piece 20, thereby conveniently, controllably and accurately improving the resonant frequency of the TE mode.

[0090] Moreover, since the electric field of the TE mode is relatively concentrated around the circumferential side of the dielectric resonant piece 20, when the opening structure 21 is on the outer circumferential side of the dielectric resonant piece 20, the influence on the resonant frequency of the TE mode is the largest, and when the opening structure 21 is on the central axis L of the dielectric resonant piece 20, the influence on the resonant frequency of the TE mode is the smallest. By arranging the first opening 211 between the outer circumferential surface of the dielectric resonant piece 20 and the central axis L of the dielectric resonant piece 20, the first opening 211 can be avoided from the outer circumferential surface of the dielectric resonant piece 20, so that the first opening 211 will not excessively affect the resonant frequency of the TE mode, causing the frequency to suddenly increase. At the same time, the first opening 211 avoids the central axis L of the dielectric resonant piece 20, so that the first opening 211 will not excessively affect the resonant frequency of the TE mode, causing the frequency to be unable to be significantly increased. Based on this, it is convenient to more finely regulate the resonant frequency of the TE mode, that is, the resonant frequency of the TE mode can be more accurately, finely and stably increased while increasing the resonant frequency of the TE mode, so that the resonant frequency of the TE mode can be more accurately controlled. At the same time, the electric field of the TM mode is relatively concentrated at the central axis L of the dielectric resonant piece 20, and the first opening 211 avoids the central axis L of the dielectric resonant piece 20, so that the influence of the first opening 211 on the resonant frequency of the TM mode can be greatly reduced, thereby facilitating the accurate design that the resonant frequency of the TE mode and the resonant frequency of the TM mode are in the passband range and close to the same frequency band, and facilitating the improvement of the performance of the dielectric cavity resonator.

[0091] Moreover, the first opening 211 is opened on the end surface of the dielectric resonant piece 20, which can facilitate the design of the mold, facilitate the one-piece forming of the dielectric resonant piece 20 and the first opening 211 thereof through the mold, especially improve the demolding convenience of the mold after the dielectric resonant piece 20 is formed (demolding can be performed along the axial direction of the dielectric resonant piece 20), improve the forming convenience and forming precision of the dielectric resonant piece 20, and reduce the mold cost and the processing cost of the dielectric resonant piece 20.

[0092] Please refer to FIG. 4, FIG. 6 and FIG. 8. In some embodiments of the present application, the opening structure 21 includes a second opening 212 opened on the circumferential edge of the dielectric resonant piece 20, and the second opening 212 is communicated to the outer circumferential surface of the dielectric resonant piece 20 and at least one end surface of the dielectric resonant piece 20.

[0093] It should be noted that no matter whether the second opening 212 is in the form of a hole or a groove, the second opening 212 is formed in the periphery of the dielectric resonant piece 20, and the second opening 212 simultaneously communicates to the outer peripheral surface of the dielectric resonant piece 20 and at least one end surface of the dielectric resonant piece 20. The depth direction of the second opening 212 (for example, the hole depth direction of the hole or the groove depth direction of the groove) corresponds to (that is, is substantially parallel to) both the radial direction of the dielectric resonant piece 20 and the axial direction of the dielectric resonant piece 20. Among them, the second opening 212 can communicate to the corresponding end surface of the dielectric resonant piece 20 along one side of the axial direction of the dielectric resonant piece 20, and the second opening 212 can also communicate to the opposite two end surfaces of the dielectric resonant piece 20 along the opposite two sides of the axial direction of the dielectric resonant piece 20.

[0094] For example, as shown in FIGS. 4, 5, 6, and 7, in a possible embodiment, the second opening 212 includes a second annular groove 2121, and the second annular groove 2121 is formed in the periphery of the dielectric resonant piece 20 and communicates to the outer peripheral surface of the dielectric resonant piece 20 and one end surface of the dielectric resonant piece 20. The second annular groove 2121 surrounds the outer periphery of the central axis L of the dielectric resonant piece 20, and the central axis (that is, the surrounding axis) of the second annular groove 2121 can be parallel to or intersect the central axis L of the dielectric resonant piece 20. The central axis of the second annular groove 2121 can be arranged coincidentally with the central axis L of the dielectric resonant piece 20, or can be arranged separately. The shape of the second annular groove 2121 can be in the form of a cylindrical groove, a conical groove, a table groove, a stepped groove, or other shapes. For example, in FIG. 4, the shape of the second annular groove 2121 is in the form of a cylindrical groove, and for example, in FIG. 6, the shape of the second annular groove 2121 is in the form of a stepped groove.

[0095] Among them, the deeper the groove depth of the second annular groove 2121 along the axial direction of the dielectric resonant piece 20, the higher the resonance frequency of the TE mode; the deeper the groove depth of the second annular groove 2121 along the radial direction of the dielectric resonant piece 20, the higher the resonance frequency of the TE mode. Based on this, the size and shape of the second annular groove 2121 can be accurately adjusted to accurately control the resonance frequency of the TE mode, thereby facilitating the accurate design of the TE mode resonance frequency and the TM mode resonance frequency being in the passband range and close to the same frequency band, and facilitating the improvement of the performance of the dielectric cavity resonator.

[0096] For example, as shown in FIG. 8, in another possible embodiment, the second opening 212 includes at least one strip-shaped slot 2122 formed on the periphery of the dielectric resonant piece 20. The strip-shaped slot 2122 is in communication with the outer circumferential surface of the dielectric resonant piece 20 and at least one end surface of the dielectric resonant piece 20. The strip-shaped slot 2122 can be a straight slot, and the extension direction of the strip-shaped slot 2122 can be parallel (or inclined) to the axial direction of the dielectric resonant piece 20. The strip-shaped slot 2122 can be open at both ends along the extension direction thereof, or can be closed at one end and open at the other end to the corresponding end surface of the dielectric resonant piece 20. In the case where a plurality of strip-shaped slots 2122 are provided, the plurality of strip-shaped slots 2122 can be arranged at equal angles along the circumferential direction of the dielectric resonant piece 20, or can be arranged at unequal angles. In the case where a plurality of strip-shaped slots 2122 are provided, the plurality of strip-shaped slots 2122 can have the same size or different sizes.

[0097] In the above formula, the greater the number of strip-shaped slots 2122, the higher the resonant frequency of the TE mode; the greater the slot depth of the strip-shaped slot 2122 in the axial direction of the dielectric resonant piece 20, the higher the resonant frequency of the TE mode; the greater the slot depth of the strip-shaped slot 2122 in the radial direction of the dielectric resonant piece 20, the higher the resonant frequency of the TE mode; and the greater the slot width of the strip-shaped slot 2122, the higher the resonant frequency of the TE mode. Based on this, the number, size, and shape of the second annular slot 2121 can be accurately adjusted to accurately control the resonant frequency of the TE mode, thereby facilitating accurate design of the resonant frequency of the TE mode and the resonant frequency of the TM mode being in the passband range and close to the same frequency band, and facilitating improvement of the performance of the dielectric cavity resonator.

[0098] Of course, in other possible embodiments, the strip-shaped slot 2122 can be replaced by a curved slot, an arc-shaped slot, or the like. The number of slot structures such as curved slots and arc-shaped slots can be one or a plurality. In the case where the number of slot structures is a plurality, the plurality of slot structures can be the same type of slot or a combination of different types of slots. In the case where the plurality of slot structures are the same type of slot, the plurality of slot structures can have the same size or different sizes.

[0099] By using the above scheme, by forming the second opening 212 on the periphery of the dielectric resonant piece 20 and making the second opening 212 in communication with the outer circumferential surface of the dielectric resonant piece 20 and at least one end surface of the dielectric resonant piece 20, so that the depth direction of the second opening 212 corresponds to the axial direction and the radial direction of the dielectric resonant piece 20, the specific region of the dielectric resonant piece 20 can be thinned along the axial direction and the radial direction of the dielectric resonant piece 20, thereby facilitating controllable and accurate improvement of the resonant frequency of the TE mode.

[0100] And, since the electric field of the TE mode is more concentratedly surrounded at the circumferential side of the dielectric resonant piece 20, the second opening 212 is located at the circumferential edge of the dielectric resonant piece 20 and communicates to the outer circumferential surface of the dielectric resonant piece 20, therefore, the second opening 212 has the greatest influence on the resonant frequency of the TE mode. Based on this, the resonant frequency of the TE mode can be more significantly increased through the second opening 212, facilitating convenient and fast regulation of the resonant frequency of the TE mode, and the range of the TE mode resonant frequency that can be increased can be increased, and the resonant frequency of the TE mode can be more easily increased to the required range. At the same time, since the electric field of the TM mode is more concentratedly distributed at the central axis L of the dielectric resonant piece 20, based on the arrangement of the present embodiment, the influence of the second opening 212 opened at the circumferential edge of the dielectric resonant piece 20 on the resonant frequency of the TM mode can be greatly reduced, and the resonant frequency of the TE mode can be conveniently and controllably increased based on the basically unchanged TM mode resonant frequency. Therefore, the adjustment convenience and accuracy of the resonant frequency of the TE mode can be improved, and the design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode being in the passband range and close to the same frequency band" can be facilitated, and the performance and design flexibility of the dielectric cavity resonator can be improved.

[0101] And, the second opening 212 communicates to at least one end surface of the dielectric resonant piece 20, which can facilitate the design of the mold, facilitate the one-piece molding of the dielectric resonant piece 20 and the second opening 212 thereof through the mold, especially improve the mold release convenience after the mold forms the dielectric resonant piece 20 (the mold release can be performed in the axial direction of the dielectric resonant piece 20), improve the molding convenience and accuracy of the dielectric resonant piece 20, and reduce the mold cost and the processing cost of the dielectric resonant piece 20.

[0102] Please refer to FIG. 9 and FIG. 10, in some embodiments of the present application, the opening structure 21 includes a third opening 213 opened on the outer circumferential surface of the dielectric resonant piece 20, and the third opening 213 is arranged between the two end surfaces of the dielectric resonant piece 20.

[0103] It should be noted that no matter whether the third opening 213 adopts the form of a hole or a groove, the third opening 213 is opened on the outer circumferential surface of the dielectric resonant piece 20 and located between the two opposite end surfaces of the dielectric resonant piece 20 in the axial direction, that is, the third opening 213 does not communicate with any end surface of the dielectric resonant piece 20 in the axial direction of the dielectric resonant piece 20, and the opposite ends of the third opening 213 in the axial direction of the dielectric resonant piece 20 are both closed.

[0104] For example, as shown in FIG. 9, in a possible embodiment, the third opening 213 includes at least one second hole 2131, which is formed in the outer circumferential surface of the dielectric resonant piece 20, and the hole depth direction of the second hole 2131 corresponds to the radial direction of the dielectric resonant piece 20. The second hole 2131 is arranged between the two end surfaces of the dielectric resonant piece 20. The second hole 2131 can be a blind hole. The second hole 2131 can be a circular hole, a rectangular hole, a waist-shaped hole, a special-shaped hole, or the like. In the case where a plurality of second holes 2131 are arranged, the plurality of second holes 2131 can be arranged at the same axial height, or can be flexibly arranged; in the case where the plurality of second holes 2131 are arranged at the same axial height, the plurality of second holes 2131 can be arranged at equal angles along the circumferential direction of the dielectric resonant piece 20, or can be arranged at unequal angles. In the case where a plurality of second holes 2131 are arranged, the plurality of second holes 2131 can be the same type of holes, or can be a combination of different types of holes; in the case where the plurality of second holes 2131 are the same type of holes, the sizes of the plurality of second holes 2131 can be the same or different.

[0105] In the above formula, the greater the number of second holes 2131, the higher the resonant frequency of the TE mode; the greater the hole depth of the second hole 2131, the higher the resonant frequency of the TE mode; and the greater the hole diameter of the second hole 2131, the higher the resonant frequency of the TE mode. Based on this, the number, size, shape, and position of the second hole 2131 can be accurately adjusted to accurately control the resonant frequency of the TE mode, thereby facilitating accurate design of the resonant frequency of the TE mode and the resonant frequency of the TM mode being in the passband range and close to the same frequency band, and facilitating improvement of the performance of the dielectric cavity resonator.

[0106] For example, as shown in FIG. 10, in another possible embodiment, the third opening 213 includes at least one third annular groove 2132. The third annular groove 2132 is formed in the outer circumferential surface of the dielectric resonant piece 20. The third annular groove 2132 is arranged between the two end surfaces of the dielectric resonant piece 20. The third annular groove 2132 surrounds the outer circumferential surface of the central axis L of the dielectric resonant piece 20. The central axis (i.e., the surrounding axis) of the third annular groove 2132 can be parallel to, intersect with, or coincide with the central axis L of the dielectric resonant piece 20. The central axis of the third annular groove 2132 and the central axis L of the dielectric resonant piece 20 can be arranged in a coincident manner or in a spaced manner. The groove depth direction of the third annular groove 2132 corresponds to the radial direction of the dielectric resonant piece 20. The shape of the third annular groove 2132 can be a cylindrical groove, a conical groove, a table groove, a stepped groove, or other shapes. In the case where a plurality of third annular grooves 2132 are arranged, the plurality of third annular grooves 2132 can be arranged in a spaced manner along the axial direction of the dielectric resonant piece 20.

[0107] The more the number of the third annular grooves 2132 is, the higher the resonance frequency of the TE mode is; the deeper the groove depth of the third annular grooves 2132 is, the higher the resonance frequency of the TE mode is; the wider the groove width of the third annular grooves 2132 is, the higher the resonance frequency of the TE mode is. Based on this, the number, size, shape and position of the third annular grooves 2132 can be accurately adjusted to accurately control the resonance frequency of the TE mode, so as to facilitate the accurate design of "the resonance frequency of the TE mode and the resonance frequency of the TM mode being in the passband range and close to the same frequency band", and facilitate the improvement of the performance of the dielectric cavity resonator.

[0108] Of course, in other possible embodiments, the third annular grooves 2132 can be replaced by straight grooves, strip grooves, curved grooves, arc grooves, etc. The number of straight grooves, strip grooves, curved grooves, arc grooves, etc. can be one or more. In the case where the number of straight grooves, strip grooves, curved grooves, arc grooves, etc. is more than one, the multiple groove structures can be grooves of the same type or a combination of grooves of different types; in the case where the multiple groove structures are grooves of the same type, the sizes of the multiple groove structures can be the same or different. In the case where the straight grooves, strip grooves, curved grooves, arc grooves, etc. are provided with multiple groove structures, the multiple groove structures can be arranged at equal angles or at unequal angles along the circumference of the dielectric resonator 20.

[0109] By adopting the above scheme, by providing the third opening 213 on the outer circumferential surface of the dielectric resonator 20 and arranging the third opening 213 between the two end surfaces of the dielectric resonator 20, the depth direction of the third opening 213 corresponds to the radial direction of the dielectric resonator 20, so that the specific area of the dielectric resonator 20 can be thinned along the radial direction of the dielectric resonator 20, thereby facilitating the controllable and accurate improvement of the resonance frequency of the TE mode.

[0110] And, since the electric field of the TE mode is more concentratedly surrounded at the circumference of the dielectric resonant piece 20, the third opening 213 has the greatest influence on the resonant frequency of the TE mode when the third opening 213 is at the outer circumferential surface of the dielectric resonant piece 20. Therefore, the resonant frequency of the TE mode can be more significantly increased through the third opening 213, facilitating convenient and fast regulation of the resonant frequency of the TE mode, increasing the range of the TE mode resonant frequency that can be increased, and more easily increasing the resonant frequency of the TE mode to the required range. At the same time, since the electric field of the TM mode is more concentratedly distributed at the central axis L of the dielectric resonant piece 20, based on the arrangement of the present embodiment, the third opening 213 opened at the outer circumferential surface of the dielectric resonant piece 20 can also greatly reduce the influence on the resonant frequency of the TM mode, and can facilitate controllable increase of the resonant frequency of the TE mode on the basis of basically stable TM mode resonant frequency. Thus, the adjustment convenience and accuracy of the resonant frequency of the TE mode can be improved, and the design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode being in the passband range and close to the same frequency band" can be facilitated, and the performance and design flexibility of the dielectric cavity resonator can be improved.

[0111] In the present application, the above-mentioned embodiments related to the "first opening 211", "second opening 212" and "third opening 213" can be implemented individually, in pairs or all together. For example, in the embodiment shown in FIG. 3, the dielectric resonant piece 20 can only have the first opening 211; for example, in the embodiment shown in FIG. 4, the dielectric resonant piece 20 can have both the first opening 211 and the second opening 212; for example, in the embodiment shown in FIG. 6, the dielectric resonant piece 20 can only have the second opening 212.

[0112] Please refer to FIG. 4, FIG. 5 and FIG. 10, in some embodiments of the present application, the above-mentioned embodiments of the second opening 212 and / or the third opening 213 are combined with the embodiments of the first opening 211. That is, the opening structure 21 of the dielectric resonant piece 20 includes the first opening 211 and the second opening 212; or the opening structure 21 of the dielectric resonant piece 20 includes the first opening 211 and the third opening 213; or the opening structure 21 of the dielectric resonant piece 20 includes the first opening 211, the second opening 212 and the third opening 213.

[0113] Since the electric field of the TE mode is more concentrated around the circumference of the dielectric resonant piece 20, the second opening 212 is located at the circumference of the dielectric resonant piece 20 and communicates with the outer circumferential surface of the dielectric resonant piece 20, and the third opening 213 is located at the outer circumferential surface of the dielectric resonant piece 20, therefore, the second opening 212 and the third opening 213 have the greatest influence on the resonant frequency of the TE mode, and the influence of the second opening 212 and the third opening 213 on the resonant frequency of the TE mode is more significant; and the first opening 211 avoids the outer circumferential surface of the dielectric resonant piece 20, therefore, compared with the second opening 212 and the third opening 213, the first opening 211 has less influence on the resonant frequency of the TE mode; and the first opening 211 also avoids the central axis L of the dielectric resonant piece 20, and the first opening 211 will not lose the effect of increasing the frequency due to too small influence on the resonant frequency of the TE mode.

[0114] By adopting the above scheme, the resonant frequency of the TE mode can be significantly increased through the second opening 212 and / or the third opening 213, and at the same time, the resonant frequency of the TE mode is also slightly increased through the first opening 211. Based on this, more fine adjustment of the resonant frequency of the TE mode can be realized on the basis of "conveniently and quickly adjusting the resonant frequency of the TE mode, increasing the range of the resonant frequency of the TE mode that can be increased, and more easily increasing the resonant frequency of the TE mode to the required range". That is, the resonant frequency of the TE mode can be significantly increased to the vicinity of the required range through the second opening 212 and / or the third opening 213, and then the resonant frequency of the TE mode is accurately and slightly increased to the required range through the first opening 211. In this way, more fine adjustment of the resonant frequency of the TE mode can be realized, the resonant frequency of the TE mode can be more accurately, finely and stably increased while the resonant frequency of the TE mode is significantly increased, and the resonant frequency of the TE mode can be more accurately controlled, so as to facilitate the accurate design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode being in the passband range and close to the same frequency band", and facilitate the improvement of the performance and design flexibility of the dielectric cavity resonator.

[0115] In some embodiments of the present application, the first plate member 11 has a grounding component, the opening structure 21 includes an annular recess that continuously or discontinuously surrounds the annular shape, the central axis of the annular recess coincides with the central axis L of the dielectric resonant piece 20, and the recess bottom of the annular recess is closed, and the grounding component closes the recess of the annular recess, so that the resonant frequency of the HE dual mode is in the same frequency band as the resonant frequency of the TE mode and the resonant frequency of the TM mode.

[0116] The annular recess can be continuous or discontinuous in its entirety along its circumferential direction, and the central axis of the annular recess (i.e. the circumferential axis) coincides with the central axis L of the dielectric resonator 20. In some embodiments, the annular recess can be a complete continuous annular structure, such as an annular groove. In other embodiments, the annular recess can also be a discontinuous structure formed by multiple parts together, such as multiple arc grooves circumferentially surrounding the shaft and together forming the annular recess, or multiple blind holes circumferentially surrounding the shaft and together forming the annular recess, or multiple straight grooves circumferentially surrounding the shaft and together forming the annular recess. The annular recess has a closed bottom, i.e. the annular recess does not include a through-hole structure. The annular recess can be provided on any end surface, peripheral edge or outer peripheral surface of the dielectric resonator 20.

[0117] The opening of the annular recess includes the opening of each part, such as the opening of each arc groove, or the opening of each blind hole, or the opening of each straight groove, and the like.

[0118] It should be noted that the opening structure 21 can only include the annular recess; the opening structure 21 can also include the annular recess and other structures in addition to the annular recess, such as the opening structure 21 further including the first hole 2111 which is a through hole in FIG. 3. When the opening structure 21 includes the annular recess and other structures in addition to the annular recess, it can be understood that the other structures in addition to the annular recess can not be annular, can be connected to the opposite ends of the dielectric resonator 20, and the central axis of the structure can not coincide with the central axis L of the dielectric resonator 20.

[0119] The ground component can be the first plate 11 itself, i.e. the first plate 11 itself can serve as the ground component, the notch of the first plate 11 itself enclosing the annular recess; or the ground component can be a metal ground ring, a metal ground column or a bottom base 111 protruding from the first plate 11, the inner side of the ring of the metal ground ring, the surface of the column of the metal ground column or the end surface of the bottom base 111 enclosing the notch of the annular recess. The ground component enclosing the notch of the annular recess makes the ground component and the annular recess together form at least one closed air cavity, the electric field path of the HE dual mode in the air cavity is vertically distributed and has no substantial transmission effect, most of the electric field path of the HE dual mode needs to be bent around the air cavity and has substantial transmission effect, based on which, the electric field path of the HE dual mode can be prolonged, the resonant frequency of the HE dual mode can be lowered, the resonant frequency of the HE dual mode can be made close to the resonant frequency of the TE mode and the resonant frequency of the TM mode, and the resonant frequency of the HE dual mode, the resonant frequency of the TE mode and the resonant frequency of the TM mode can all be within the passband range and close to the same frequency band. That is, the dielectric cavity resonator of the embodiment is a four-mode resonator.

[0120] The opening structure 21 includes an annular recess, i.e. the annular recess has the relevant effect of the opening structure 21, the annular recess can make the dielectric resonator 20 locally thin, especially can make the thickness of the dielectric resonator 20 corresponding to the annular recess in the axial direction of the dielectric resonator 20 reduced, and can also make the size of the dielectric resonator 20 corresponding to the annular recess in the radial direction of the dielectric resonator 20 reduced. Based on this, the resonant frequency of the TE mode can be improved, and the resonant frequency of the TE mode can be finely improved by accurately designing the specific structure (such as an annular groove, multiple blind holes, multiple arc grooves, multiple straight grooves, etc.), size (such as depth, width, length, etc.), position, etc. of the annular recess, so as to make the resonant frequency of the TE mode close to the resonant frequency of the TM mode and close to the same frequency band, and within the passband range. Wherein, the more the number of blind holes and grooves included in the annular recess, the higher the resonant frequency of the TE mode; the deeper the depth of each part of the annular recess, the higher the resonant frequency of the TE mode; the wider the width of each part of the annular recess, the higher the resonant frequency of the TE mode; the longer the extension path of the annular recess, the higher the resonant frequency of the TE mode; the closer the position of the annular recess to the outer circumferential surface of the dielectric resonator 20, the higher the resonant frequency of the TE mode; and so on.

[0121] By adopting the above scheme, the notch of the annular recess can be closed by the grounding component, so that the grounding component and the annular recess can enclose at least one closed air cavity, the electric field path of the HE dual mode in the air cavity is vertically distributed, and most or all of the electric field path of the HE dual mode needs to be bent to bypass the air cavity, so that the electric field path of the HE dual mode can be prolonged, the resonant frequency of the HE dual mode can be lowered, the resonant frequency of the HE dual mode can be close to the resonant frequency of the TE mode and the resonant frequency of the TM mode, and the resonant frequencies of the HE dual mode, the TE mode and the TM mode can be in the passband range and close to the same frequency band. Therefore, the dielectric cavity resonator can realize four resonant modes of the TE mode, the TM mode and the HE dual mode in a single cavity, that is, the dielectric cavity resonator of the embodiment is a four-mode resonator. The dielectric cavity resonator of the embodiment can realize four-order filtering effect, which is equivalent to the filtering effect of four single-mode resonators in series, so that the performance and space utilization of the dielectric cavity resonator can be optimized.

[0122] In addition, the annular recess can also locally thin the dielectric resonator 20, especially the thickness of the part of the dielectric resonator 20 corresponding to the annular recess in the axial and radial directions, so that the resonant frequency of the TE mode can be increased, the resonant frequency of the TE mode can be close to the resonant frequency of the TM mode, and the resonant frequencies of the TE mode and the TM mode can be in the passband range and close to the same frequency band.

[0123] In addition, compared with the existing multi-mode resonator, the dielectric cavity resonator realizes four modes without significantly increasing the size of the dielectric resonator 20, so that the overall size of the dielectric cavity resonator can be miniaturized, and the dielectric cavity resonator can meet the needs of high performance and miniaturization.

[0124] In addition, since the dielectric cavity resonator realizes four resonant modes of the TE mode, the TM mode and the HE dual mode in a single cavity, the dielectric cavity resonator can easily form a coupling relationship with a resonator having any mode of the TE mode, the TM mode, the HE mode and the TEM mode, and the coupling effect is better, so that the dielectric cavity resonator has better usability, applicability and practicality.

[0125] In addition, in actual application scenarios, the dielectric cavity resonator can make the grounding component not close all the notches of the annular recess, so that the electric field path of the HE dual mode can directly pass through the annular recess, thereby shortening the electric field path of the HE dual mode, so that all the annular recesses have the functions of "increasing the resonant frequency of the TE mode" and "pushing away the resonant frequency of the HE dual mode", and the resonant frequency of the HE dual mode is pushed away from the passband range. Based on this, the dielectric cavity resonator can be conveniently, quickly and flexibly switched between the four-mode resonator and the TE-TM dual-mode resonator. Therefore, the dielectric cavity resonator has better flexibility and convenience.

[0126] Please refer to FIG. 6 and FIG. 7, in some embodiments of the present application, the dielectric resonant piece 20 comprises a plurality of dielectric layers 22 arranged in sequence along the axial direction thereof. The cross-sectional dimension of each dielectric layer 22 is tapered in the direction close to the first plate piece 11.

[0127] It is to be noted that the dielectric resonant piece 20 comprises a plurality of dielectric layers 22 arranged in sequence and coaxially along the axial direction of the dielectric resonant piece 20.

[0128] The cross-sectional dimension of each dielectric layer 22 of the dielectric resonant piece 20 is tapered in the direction close to the first plate piece 11, i.e. the end of the dielectric resonant piece 20 close to the first plate piece 11 is thinner, while the other end is thicker. Herein, the “cross-section” is the cross-section perpendicular to the axial line of the corresponding structure. Based on this, in each dielectric layer 22 of the dielectric resonant piece 20, each two adjacent dielectric layers 22 form a step. The outer periphery of each dielectric layer 22 and the end face of each dielectric layer 22 enclose the above-mentioned second annular groove 2121.

[0129] By adopting the above-mentioned scheme, by tapering the cross-sectional dimension of each dielectric layer 22 of the dielectric resonant piece 20 in the direction close to the first plate piece 11, the end of the dielectric resonant piece 20 close to the first plate piece 11 can be made thinner while the other end is thicker. Based on this, on the one hand, the thickness of the dielectric resonant piece 20 can be arranged to decrease from the center thereof to the side thereof, so that the resonant frequency of the TE mode can be balanced and finely improved, the influence on the resonant frequency of the TM mode can be reduced, the resonant frequency of the TM mode can be basically kept unchanged, so that it is convenient to accurately design that “the resonant frequency of the TE mode and the resonant frequency of the TM mode are in the passband range and close to the same frequency band”, and the performance and design flexibility of the dielectric cavity resonator can be improved. On the other hand, the occupied space of the end of the dielectric resonant piece 20 close to the first plate piece 11 can be reduced, so that the end of the dielectric resonant piece 20 close to the first plate piece 11 can be left with space for arranging the coupling structure such as the coupling rib, so that the coupling can be conveniently planned, designed and constructed, and the performance and design flexibility of the dielectric cavity resonator can be improved.

[0130] Of course, in other embodiments, the cross-sectional dimension of each dielectric layer 22 of the dielectric resonant piece 20 can be tapered in the direction close to the first plate piece 11 (i.e. the end of the dielectric resonant piece 20 close to the first plate piece 11 is thicker, while the other end is thinner), or can be tapered first and then expanded (i.e. the middle of the dielectric resonant piece 20 is thinner, while the two ends are thicker), or can be expanded first and then tapered (i.e. the middle of the dielectric resonant piece 20 is thicker, while the two ends are thinner).

[0131] Please refer to FIG. 2, FIG. 4 and FIG. 6, in some embodiments of the present application, the first plate piece 11 is provided with a bottom platform 111, and the dielectric resonant piece 20 is connected to the bottom platform 111.

[0132] It should be noted that the bottom base 111 is protruded on the side of the first plate member 11 facing the second plate member 12, i.e. the inner side of the first plate member 11. The shape and size of the bottom base 111 can be set as required. The bottom base 111 can be used to position the dielectric resonant member 20, and to raise the position of the dielectric resonant member 20, and to stabilize the mounting position and mounting state of the dielectric resonant member 20. The dielectric resonant member 20 can be directly connected and fixed to the bottom base 111 by means of welding, bonding, riveting, crimping, insertion, screw fastening, threaded connection, clamping, etc., or can be indirectly connected and fixed to the bottom base 111 by means of other structures connected thereto, such as a ceramic base 30, etc.

[0133] Since the magnetic field of the TM mode is horizontally distributed in a ring shape and the electric field is vertically distributed in a ring shape, the electric field of the TM mode is more concentrated around the central axis L of the dielectric resonant member 20 and the second plate member 12. Therefore, the bottom base 111 can also be used to raise the resonant position of the TM mode.

[0134] By using the above scheme, the dielectric resonant member 20 can be connected to the bottom base 111 to facilitate and expedite the stable mounting of the dielectric resonant member 20, thereby improving the assembly convenience and efficiency of the dielectric resonant member 20, and improving the assembly efficiency of the dielectric cavity resonator. Moreover, the bottom base 111 can provide an accurate mounting position for the dielectric resonant member 20 to facilitate the accurate positioning of the dielectric resonant member 20 in the resonator housing 10, based on which the performance fluctuation caused by the inaccurate mounting position of the dielectric resonant member 20 can be reduced, and the stability and consistency of the performance of the dielectric cavity resonator can be improved. Furthermore, the bottom base 111 can raise the position of the dielectric resonant member 20 and the resonant position of the TM mode to enhance the resonant index and optimize the resonant characteristics of the TM mode, thereby facilitating the optimization and improvement of the performance of the dielectric cavity resonator.

[0135] Of course, in other embodiments, the bottom base 111 can be omitted, and the dielectric resonant member 20 can be directly connected to the inner side of the first plate member 11, or can be indirectly connected and fixed to the inner side of the first plate member 11 by means of other structures connected thereto, such as a ceramic base 30, etc. This case can be compatible with any of the above embodiments regarding the opening structure 21.

[0136] Please refer to FIGS. 2, 3, 4, and 6, in some embodiments of the present application, in the case where the dielectric resonant member 20 is connected to the bottom base 111, the opening structure 21 is formed on the periphery of the dielectric resonant member 20, and the opening structure 21 is communicated to the end face of the dielectric resonant member 20 facing the first plate member 11; or, the opening structure 21 is formed on the end face of the dielectric resonant member 20 facing the first plate member 11.

[0137] It should be noted that since the bottom base 111 is a protruding metal base, the bottom base 111 can affect the directionality and uniformity of the electric field.

[0138] Therefore, in the case that the dielectric resonator 20 is connected to the base 111, the opening structure 21 can be formed on the end surface of the dielectric resonator 20 facing the first plate 11, so that the opening structure 21 has an opening facing the first plate 11. Alternatively, the opening structure 21 can be formed on the periphery of the dielectric resonator 20, and the side of the opening structure 21 close to the first plate 11 is communicated to the end surface of the dielectric resonator 20 facing the first plate 11, so that the opening structure 21 has a communication port facing the first plate 11.

[0139] Based on this, by adopting the above scheme, the opening structure 21 can have an opening or a communication port facing the first plate 11, the setting position of the opening structure 21 can be close to the main distribution area of the TE mode electromagnetic field and far away from the main distribution area of the TM mode electromagnetic field, the distribution of the electromagnetic field and the refraction in the electromagnetic wave transmission process can be stabilized in the case that the base 111 affects the directionality and uniformity of the electric field, the risk of changes in the distribution of the electromagnetic field and the refraction in the electromagnetic wave transmission process can be reduced, so that the improvement effect of the opening structure 21 on the TE mode resonance frequency can meet the expected effect, the design of “the resonance frequency of the TE mode and the resonance frequency of the TM mode are in the passband range and close to the same frequency band” can be facilitated, and the performance of the dielectric cavity resonator can be optimized and improved.

[0140] Please refer to FIG. 2, FIG. 3, FIG. 4 and FIG. 6, in some embodiments of the present application, the dielectric cavity resonator comprises a ceramic base 30, which is connected between the dielectric resonator 20 and the first plate 11.

[0141] It should be noted that the ceramic base 30 is made of ceramic material, and the ceramic base 30 is a non-metallic piece. In some embodiments, the ceramic base 30 can be an alumina base. Since the ceramic base 30 and the dielectric resonator 20 are both non-metallic pieces, the ceramic base 30 and the dielectric resonator 20 can be easily connected and fixed, and the connection strength, reliability and stability between the ceramic base 30 and the dielectric resonator 20 can be improved. The ceramic base 30 and the dielectric resonator 20 can be connected by, but not limited to, bonding, welding and the like.

[0142] In addition, since the ceramic base 30 has good strength and impact resistance, the ceramic base 30 and the metal first plate 11 can be easily connected and fixed, and the risk of damage to the dielectric resonator 20 due to connection operation can be reduced. The ceramic base 30 and the first plate 11 can be connected by, but not limited to, bonding, welding, riveting, screw fastening and the like.

[0143] By adopting the above scheme, the ceramic base 30 which is also a non-metallic piece can be conveniently connected and fixed with the dielectric resonant piece 20, the connection strength, connection reliability and connection stability between the ceramic base 30 and the dielectric resonant piece 20 can be improved, the risk of damage of the dielectric resonant piece 20 due to connection operation can be reduced, and the connection difficulty and connection cost between the ceramic base 30 and the dielectric resonant piece 20 can be reduced. In addition, the ceramic base 30 with good strength and impact resistance can be conveniently connected and fixed with the first plate piece 11 made of metal, the risk of damage of the dielectric resonant piece 20 due to connection operation can be reduced, and the connection convenience, connection strength, connection reliability and connection stability between the ceramic base 30 and the first plate piece 11 can be improved. Therefore, the ceramic base 30 can be used to conveniently, quickly and reliably realize the connection and fixation between the dielectric resonant piece 20 and the first plate piece 11.

[0144] Please refer to FIGS. 2, 3, 4 and 6. In some embodiments of the present application, the ceramic base 30 is provided with a receiving groove 31 on the side facing the dielectric resonant piece 20, the groove bottom of the receiving groove 31 is provided with a fastening hole 32, the ceramic base 30 is connected to the first plate piece 11 through the fastening piece 40 penetrating the fastening hole 32, the fastening piece 40 does not protrude from the groove opening of the receiving groove 31, and the ceramic base 30 is in abutment and fixed connection with the dielectric resonant piece 20.

[0145] It should be noted that the ceramic base 30 is provided with the receiving groove 31 and the fastening hole 32, the groove opening of the receiving groove 31 is arranged to face the dielectric resonant piece 20, and the shape, size, etc. of the receiving groove 31 can be set as required. The fastening hole 32 penetrates the groove bottom of the receiving groove 31, and the fastening hole 32 can be but is not limited to a circular hole. The fastening piece 40 penetrates the fastening hole 32 and is fastened to the first plate piece 11 to realize fastening of the ceramic base 30 to the first plate piece 11. The fastening piece 40 can be but is not limited to a screw.

[0146] The receiving groove 31 is used to accommodate the fastening piece 40, so that the fastening piece 40 does not protrude from the groove opening of the receiving groove 31, so as to facilitate the side of the ceramic base 30 facing the dielectric resonant piece 20 to abut and be fixedly connected with the dielectric resonant piece 20. The fixed connection between the ceramic base 30 and the dielectric resonant piece 20 can be but is not limited to being achieved by adhesion, welding, etc.

[0147] By adopting the above scheme, the connection between the ceramic base 30 and the first plate member 11 can be conveniently, quickly and reliably constructed by threading the fastener 40 through the fastening hole 32 and fastening and connecting it to the first plate member 11, so that the connection convenience, connection strength, connection reliability and connection stability between the ceramic base 30 and the first plate member 11 can be improved. Moreover, the fastener 40 can be accommodated in the accommodating groove 31, so that the fastener 40 does not protrude from the groove opening of the accommodating groove 31, and the side surface of the ceramic base 30 facing the dielectric resonant member 20 can be conveniently abutted against and fixedly connected to the dielectric resonant member 20, so that the risk of unstable connection of the dielectric resonant member 20 caused by the part of the fastener 40 protruding from the groove opening of the accommodating groove 31 abutting against the dielectric resonant member 20 can be reduced, and the connection convenience, connection strength, connection reliability and connection stability between the ceramic base 30 and the dielectric resonant member 20 can be improved.

[0148] Based on the present embodiment, in one specific application example, the dielectric resonant member 20 has a central hole 23, based on which, in the assembly process, the side surface of the ceramic base 30 facing the dielectric resonant member 20 can be first abutted against and fixedly connected to the dielectric resonant member 20, and then the fastener 40 can be threaded through the fastening hole 32 and fastened and connected to the first plate member 11 from the central hole 23 of the dielectric resonant member 20.

[0149] In another specific application example, whether the dielectric resonant member 20 has a central hole 23 or not, in the assembly process, the fastener 40 can be first threaded through the fastening hole 32 and fastened and connected to the first plate member 11, and then the side surface of the ceramic base 30 facing the dielectric resonant member 20 can be abutted against and fixedly connected to the dielectric resonant member 20.

[0150] Of course, in other embodiments, in the case that the dielectric resonant member 20 has a central hole 23, the accommodating groove 31 can be omitted, and the fastener 40 can be directly accommodated through the central hole 23 of the dielectric resonant member 20, so as to facilitate the abutment and fixed connection of the side surface of the ceramic base 30 facing the dielectric resonant member 20 against the dielectric resonant member 20.

[0151] In other embodiments, the connection between the ceramic base 30 and the first plate member 11 can be achieved in other ways, such as welding, riveting, etc.

[0152] It should be noted that the "ceramic base 30" embodiment is suitable to be combined with the "base table 111" embodiment, so that the ceramic base 30 is connected between the dielectric resonant member 20 and the base table 111. The "ceramic base 30" embodiment and the "base table 111" embodiment can also be set alternatively. Even, the dielectric resonant member 20 can be directly connected to the inner side surface of the first plate member 11, and the base table 111 and the ceramic base 30 can be omitted.

[0153] Please refer to FIG. 3, FIG. 5, FIG. 7 and FIG. 8, in some embodiments of the present application, the dielectric resonant member 20 is a rotationally symmetrical structure.

[0154] It should be noted that the dielectric resonant piece 20 is of a rotational symmetry structure around the central axis L thereof, for example, the dielectric resonant piece 20 can be a circular rod, a circular column, a regular polygon rod (for example, a square rod), a regular polygon column, etc. In the case where the dielectric resonant piece 20 is provided with the opening structure 21, the opening structure 21 is also of a rotational symmetry structure around the central axis L of the dielectric resonant piece 20.

[0155] As shown in FIG. 3, in one specific application example, the opening structure 21 includes six first holes 2111, which are arranged in an equiangular circumferential array around the central axis L of the dielectric resonant piece 20.

[0156] As shown in FIG. 8, in another specific application example, the opening structure 21 includes four strip-shaped grooves 2122, which are arranged in an equiangular circumferential array around the central axis L of the dielectric resonant piece 20.

[0157] As shown in FIG. 5, in another specific application example, the opening structure 21 includes a first annular groove 2112 and a second annular groove 2121, the central axis L of the second annular groove 2121 and the central axis L of the first annular groove 2112 both coincide with the central axis L of the dielectric resonant piece 20, the second annular groove 2121 is of a rotational symmetry structure around the central axis L of the dielectric resonant piece 20, and the first annular groove 2112 is of a rotational symmetry structure around the central axis L of the dielectric resonant piece 20.

[0158] As shown in FIG. 7, in another specific application example, the opening structure 21 includes a second annular groove 2121, the central axis L of the second annular groove 2121 coincides with the central axis L of the dielectric resonant piece 20, and the second annular groove 2121 is of a rotational symmetry structure around the central axis L of the dielectric resonant piece 20.

[0159] By adopting the above scheme, by making the dielectric resonant piece 20 be of a rotational symmetry structure, the structure, electromagnetic field distribution, etc. of the dielectric resonant piece 20 can be promoted to be basically the same in different directions around the central axis L of the dielectric resonant piece 20, without directionality. Based on this, the dielectric resonant piece 20 can be directly and quickly assembled when assembled into the resonator shell 10 without considering the assembly angle and limiting problem, so that the assembly convenience and assembly efficiency of the dielectric resonant piece 20 can be improved, and the assembly efficiency of the dielectric cavity resonator can be improved. Moreover, the performance fluctuation caused by the inaccurate assembly angle of the dielectric resonant piece 20 can be reduced, and the stability and consistency of the performance of the dielectric cavity resonator can be improved.

[0160] Of course, in other embodiments, the dielectric resonant piece 20 can be of a non-rotational symmetry structure.

[0161] Please refer to FIG. 2, FIG. 4 and FIG. 6. In some embodiments of the present application, the dielectric cavity resonator comprises an adjusting screw 50 which is threadedly connected to the resonator housing 10 for adjusting the resonant frequency of the TM mode.

[0162] It is to be noted that the number of adjusting screws 50 can be one or more. The adjusting screw 50 can be threadedly connected to any plate member (e.g. the second plate member 12, the first plate member 11 or other side plate) of the resonator housing 10. The adjusting screw 50 can be directly threadedly connected to a threaded hole (e.g. the first threaded hole 121 of the second plate member 12) formed in the corresponding plate member; or the corresponding plate member can be embedded with a first mounting member (not shown in the drawings), and the adjusting screw 50 can be threadedly connected to a threaded hole of the first mounting member. The adjusting screw 50 is grounded based on the connection with the resonator housing 10.

[0163] The mounting position of the adjusting screw 50 is not limited. Along the axial direction of the dielectric resonant member 20, the adjusting screw 50 can be in alignment with the dielectric resonant member 20 or out of alignment.

[0164] By using the above scheme, the length of the portion of the adjusting screw 50 extending into the resonator housing 10 can be conveniently and quickly adjusted by screwing in or out the adjusting screw 50. Based on this, the electric field of the TM mode can be affected by adjusting the length of the portion of the adjusting screw 50 extending into the resonator housing 10, so that the resonant frequency of the TM mode can be independently and finely adjusted, and the tuning is convenient, quick and accurate. That is, the resonant frequency of the TM mode can be independently tuned by the grounded adjusting screw 50, and the resonant frequency of the TE mode is basically not affected. The longer the length of the portion of the adjusting screw 50 extending into the resonator housing 10, the lower the resonant frequency of the TM mode; on the contrary, the shorter the length of the portion of the adjusting screw 50 extending into the resonator housing 10, the higher the resonant frequency of the TM mode.

[0165] In some embodiments, the adjusting screw 50 is threadedly connected to the second plate member 12. In this way, the tuning effect of the adjusting screw 50 on the resonant frequency of the TM mode can be optimized, and the tuning range of the adjusting screw 50 on the resonant frequency of the TM mode can be expanded. Especially, when the adjusting screw 50 is threadedly connected to the second plate member 12 and the adjusting screw 50 is in alignment with the dielectric resonant member 20 along the axial direction of the dielectric resonant member 20, the tuning effect of the adjusting screw 50 on the resonant frequency of the TM mode is the best.

[0166] In some embodiments, if the dielectric resonant piece 20 has a central hole 23, and the adjusting screw 50 is arranged opposite to the central hole 23 of the dielectric resonant piece 20 along the axial direction of the dielectric resonant piece 20, the central hole 23 of the dielectric resonant piece 20 can be used for the adjusting screw 50 to extend into. In this way, when the length of the part of the adjusting screw 50 extending into the resonator shell 10 is long, the adjusting screw 50 can extend into the central hole 23 of the dielectric resonant piece 20, so that the tuning range of the adjusting screw 50 can be correspondingly expanded, the adjustable range of the resonant frequency of the TM mode can be correspondingly expanded, and the performance index of the resonator can be correspondingly improved.

[0167] Please refer to FIG. 2, FIG. 4, and FIG. 6. In some embodiments of the present application, the dielectric cavity resonator comprises a metal disc 60 and an insulating piece 70. The metal disc 60 is arranged opposite to the dielectric resonant piece 20 along the axial direction of the dielectric resonant piece 20. The metal disc 60 is connected to the second plate piece 12 through the insulating piece 70. The spacing between the metal disc 60 and the dielectric resonant piece 20 is adjustable, which is used for adjusting the resonant frequency of the TE mode.

[0168] It should be noted that the metal disc 60 is in a disc structure. The metal disc 60 can be made of metal material, or the metal disc 60 can be made by covering metal material on the surface of an insulating disc structure. The metal disc 60 can be a circular disc, a polygonal disc, or other shapes. Along the axial direction of the dielectric resonant piece 20, the metal disc 60 is arranged opposite to the dielectric resonant piece 20. The metal disc 60 is connected to the second plate piece 12 through the insulating piece 70, so that the metal disc 60 is insulated from the second plate piece 12, so that the metal disc 60 is not grounded, so that the metal disc 60 is suspended between the second plate piece 12 and the dielectric resonant piece 20, so that the metal disc 60 can compress the magnetic field of the TE mode. The insulating piece 70 can be, but is not limited to, a plastic piece, a plastic piece, a wooden piece, a ceramic piece, a quartz piece, a glass piece, etc.

[0169] In some embodiments, the metal disc 60 can have a through hole 61, and the insulating piece 70 can be inserted into the through hole 61 to connect the metal disc 60. Of course, in other embodiments, the metal disc 60 can omit the through hole 61, and the insulating piece 70 can be connected to the metal disc 60 by means of bonding, welding, clamping, etc.

[0170] The insulating piece 70 is inserted into the second plate piece 12, and the insulating piece 70 can move axially relative to the second plate piece 12 to drive the metal disc 60 to move in the direction of approaching or moving away from the dielectric resonant piece 20, so as to adjust the spacing between the metal disc 60 and the dielectric resonant piece 20. As the spacing between the metal disc 60 and the dielectric resonant piece 20 decreases, the metal disc 60 can enhance its compression effect on the magnetic field of the TE mode, so as to improve the resonant frequency of the TE mode.

[0171] By adopting the above scheme, the distance between the metal disc 60 and the dielectric resonant piece 20 can be conveniently and quickly adjusted by moving the insulating piece 70 along its axial direction to drive the ungrounded metal disc 60 to approach or move away from the dielectric resonant piece 20 via the insulating piece 70 relative to the second plate piece 12. Based on this, the compression effect of the metal disc 60 on the magnetic field of the TE mode can be adjusted by adjusting the distance between the metal disc 60 and the dielectric resonant piece 20, so as to realize independent and fine adjustment of the resonant frequency of the TE mode, and the tuning is convenient, quick and accurate. That is, the resonant frequency of the TE mode can be independently tuned by the ungrounded metal disc 60, and the resonant frequency of the TM mode is basically not affected. Wherein, the smaller the distance between the metal disc 60 and the dielectric resonant piece 20, the more the metal disc 60 compresses the magnetic field of the TE mode, and the higher the resonant frequency of the TE mode; on the contrary, the larger the distance between the metal disc 60 and the dielectric resonant piece 20, the weaker the compression effect of the metal disc 60 on the magnetic field of the TE mode, and the lower the resonant frequency of the TE mode.

[0172] In addition, the compression effect of the metal disc 60 on the magnetic field of the TE mode can be enhanced by replacing the metal disc 60 with a larger area, so as to improve the resonant frequency of the TE mode.

[0173] Please refer to FIG. 2, FIG. 4 and FIG. 6, in some embodiments of the present application, the shape of the metal disc 60 is a circular disc, the outer peripheral wall of the insulating piece 70 is provided with external threads, the insulating piece 70 is connected to the center of the metal disc 60 and is threadedly connected to the second plate piece 12.

[0174] It should be noted that the shape of the metal disc 60 is a circular disc, that is, the metal disc 60 has a rotational symmetry structure around its axis.

[0175] For example, the insulating piece 70 can be an insulating screw or an insulating screw rod, such as a plastic screw or a plastic screw rod. The insulating piece 70 is connected to the center of the metal disc 60, so that the insulating piece 70 and the metal disc 60 together have a rotational symmetry structure around the central axis of the metal disc 60. The insulating piece 70 is threadedly connected to the second plate piece 12, so as to facilitate the axial movement of the insulating piece 70 relative to the second plate piece 12 by screwing in or out the insulating piece 70. Wherein, the insulating piece 70 can be directly threadedly connected to the second threaded hole 122 of the second plate piece 12; or the second plate piece 12 can be embedded with a second mounting piece (not shown in the figure), and the insulating piece 70 can be threadedly connected to the threaded hole of the second mounting piece.

[0176] By adopting the above scheme, by making the shape of the metal disc 60 a circular disc, and making the insulating piece 70 connected to the center of the metal disc 60, the insulating piece 70 and the metal disc 60 can be in a rotational symmetry structure around the central axis of the metal disc 60, which can promote the structure of the metal disc 60, the compression effect on the TE mode magnetic field, and the compression effect on the TE mode magnetic field in different directions around the central axis of the metal disc 60 is basically the same and has no directionality. On this basis, by screwing the insulating piece 70 to the second plate piece 12, the axial movement stroke of the insulating piece 70 can be conveniently adjusted by screwing in or out the insulating piece 70, so that the metal disc 60 can be conveniently and quickly moved close to or away from the dielectric resonator 20, and the distance between the metal disc 60 and the dielectric resonator 20 can be conveniently and quickly adjusted. The machining convenience and machining precision of the disc are higher. Therefore, the tuning stability, tuning controllability and tuning accuracy of the resonance frequency of the TE mode can be effectively improved.

[0177] Of course, in other embodiments, the metal disc 60 can be a non-circular disc.

[0178] In other embodiments, the insulating piece 70 can be provided in the second plate piece 12, that is, the insulating piece 70 and the second plate piece 12 are not connected by screwing. The insulating piece 70 can be directly axially moved relative to the second plate piece 12 to drive the metal disc 60 to move close to or away from the dielectric resonator 20, thereby adjusting the distance between the metal disc 60 and the dielectric resonator 20. In this case, the second plate piece 12 is provided with a mounting hole, and the insulating piece 70 can be clamped to the mounting hole. For example, the insulating piece 70 can be deformed in the radial direction thereof, and the insulating piece 70 is fixed to and released from the mounting hole of the second plate piece 12 by deforming in the radial direction thereof. In each operation process of releasing and fixing the insulating piece 70 to the mounting hole, the axial movement of the insulating piece 70 relative to the second plate piece 12 can be controlled. For another example, the hole wall of the mounting hole is provided with a clamping groove, and the outer peripheral wall of the insulating piece 70 is provided with a plurality of clamping beads spaced apart in the axial direction thereof. By driving different clamping beads of the insulating piece 70 to be fixed in the clamping groove, the insulating piece 70 can be directly axially moved relative to the second plate piece 12.

[0179] Please refer to FIG. 1, some embodiments of the present application provide a filter, which comprises the dielectric cavity resonator provided by the embodiments of the present application.

[0180] It should be noted that the filter can comprise one or more resonators, and at least one resonator adopts the dielectric cavity resonator provided by the embodiments of the present application. In the case where a plurality of resonators are provided, the plurality of resonators can be arranged and designed, and a coupling relationship can be established between adjacent two resonators as needed.

[0181] By adopting the above scheme, the filter can improve the performance and power capacity of the filter, reduce the insertion loss, and reduce the size and the like by adopting the dielectric cavity resonator provided by the embodiments of the present application.

[0182] The above descriptions are only the preferred embodiment of the application, not intended to limit the application. Accordingly, any modification, equivalent replacement or improvement made without departing from the spirit and principle of the application shall fall in the protection scope of the application.

Claims

1. A dielectric cavity resonator, wherein, The resonator comprises: a resonator housing having a first plate and a second plate arranged oppositely; a dielectric resonator arranged in the resonator housing, one end of the dielectric resonator being connected to the first plate, the other end of the dielectric resonator being arranged spaced apart from the second plate, the dielectric resonator being provided with an opening structure for increasing the resonant frequency of a TE mode so that the resonant frequency of the TE mode and the resonant frequency of a TM mode are in the same frequency band.

2. The dielectric cavity resonator of claim 1, wherein, The opening structure is arranged close to the outer circumferential surface of the dielectric resonator and away from the central axis of the dielectric resonator.

3. The dielectric cavity resonator of claim 1, wherein, The opening structure comprises at least one of an opening hole and a groove.

4. The dielectric resonator of claim 1, wherein, The opening structure is communicated to at least one end surface of the dielectric resonator along the axial direction of the dielectric resonator.

5. The dielectric resonator of claim 1, wherein, The opening structure comprises a first opening formed in the end surface of the dielectric resonator, the first opening being arranged between the outer circumferential surface of the dielectric resonator and the central axis of the dielectric resonator. The opening structure comprises a second opening formed in the circumferential edge of the dielectric resonator, the second opening being communicated to the outer circumferential surface of the dielectric resonator and at least one end surface of the dielectric resonator. The opening structure comprises a third opening formed in the outer circumferential surface of the dielectric resonator, the third opening being arranged between the two end surfaces of the dielectric resonator.

6. The dielectric resonator of claim 1, wherein, The first plate is provided with a grounding member, the opening structure comprises an annular recess which is continuously or discontinuously annular, the central axis of the annular recess coincides with the central axis of the dielectric resonator, the recess bottom of the annular recess is closed, and the grounding member closes the recess of the annular recess so that the resonant frequency of a HE dual mode is in the same frequency band as the resonant frequency of a TE mode and the resonant frequency of a TM mode.

7. The dielectric resonator of claim 1, wherein, The dielectric resonator comprises a plurality of dielectric layers arranged in sequence along the axial direction thereof; in the direction close to the first plate, the cross-sectional size of each dielectric layer is gradually reduced.

8. The dielectric resonator of claim 1, wherein, The first plate is provided with a base, and the dielectric resonator is connected to the base.

9. The dielectric resonator of claim 8, wherein, The opening structure is formed in the circumferential edge of the dielectric resonator, and the opening structure is communicated to the end surface of the dielectric resonator facing the first plate. Alternatively, The opening structure is formed in the end surface of the dielectric resonator facing the first plate.

10. The dielectric cavity resonator of any one of claims 1-9, wherein, The dielectric cavity resonator comprises a ceramic base connected between the dielectric resonator and the first plate.

11. The dielectric resonator of claim 10, wherein, The ceramic base is provided with a receiving groove on the side facing the dielectric resonator, the groove bottom of the receiving groove is provided with a fastening hole, the ceramic base is connected to the first plate through a fastener penetrating the fastening hole, the fastener does not protrude from the groove opening of the receiving groove, and the ceramic base and the dielectric resonator are in abutment and fixedly connected.

12. The dielectric cavity resonator of any one of claims 1-9, wherein, The dielectric resonator is of a rotational symmetry structure.

13. The dielectric cavity resonator of any one of claims 1-9, wherein, The dielectric cavity resonator comprises an adjusting screw threadedly connected to the resonator housing for adjusting the resonant frequency of a TM mode.

14. The dielectric cavity resonator of any one of claims 1-9, wherein, The dielectric cavity resonator comprises a metal disc and an insulating piece, the metal disc is arranged opposite to the dielectric resonator along the axial direction of the dielectric resonator, the metal disc is connected to the second plate through the insulating piece, and the distance between the metal disc and the dielectric resonator is adjustable to adjust the resonant frequency of the TE mode.

15. The dielectric resonator of claim 14, wherein, The metal disc is in the shape of a circular disc, the outer peripheral wall of the insulating piece is provided with external threads, the insulating piece is connected to the center of the metal disc and is threadedly connected to the second plate.

16. A filter, wherein, The dielectric cavity resonator as claimed in any one of claims 1-15.

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