Terminal block and protection control system

Abstract

A terminal block 50 is configured by combining input conversion modules, and the terminal block 50 is characterized in that: the input conversion modules include current measurement modules on which shunt resistors 10a, 10b are mounted and / or voltage measurement modules on which voltage dividing resistors 11a, 11b are mounted; and the input conversion modules are partitioned by non-conductive partition walls 501, 503, 505, 507, 509 Accordingly, a terminal block for achieving a good input converter and a protection control system having the good input converter are provided.

Description

Terminal block and protective control system

[0001] This invention relates to a terminal block and a protective control system.

[0002] Patent Document 1 discloses that when transient DC components due to faults such as ground faults are superimposed on the current taken into a protective relay, the auxiliary current transformers in the input converter become DC-biased, and in the worst case, the magnetic saturation of the iron core occurs, causing distortion of the secondary output. Furthermore, regarding protection control systems, digital protection control systems are beginning to be applied in which the functions of conventional protection control devices are divided into a merging unit and a protection control device, and the two are connected by a transmission network. IEC 61850 is known as the international standard for this configuration. In a digital protection control system according to IEC 61850, the merging unit acquires the electrical quantities (current and voltage) of the power system (hereinafter, current and voltage will be referred to as electrical quantities). The merging unit performs A / D (Analog to Digital) conversion of the acquired electrical quantity signals and transmits the A / D converted digital signals to the protection control device via process bus transmission. In addition, protection or control calculations, such as relay calculations, are performed by the protection control device.

[0003] Japanese Patent Publication No. 2011-155158

[0004] Conventionally, the input converters used in protection control devices were input converters with wound coils. However, there was a problem that when a transient DC component was superimposed, the coil became magnetically saturated, resulting in output distortion. In current measurement, there is a method of flowing a large current through a shunt resistor and converting it to a voltage at an appropriate level. In voltage measurement, there is a method of applying a large voltage to a voltage-dividing resistor to convert it to a voltage at an appropriate level. In these methods using resistors, magnetic saturation does not occur. However, when a shunt resistor and a voltage-dividing resistor are mounted on an input conversion board, it is difficult to flexibly respond to changes in the number and order of current channels and voltage channels on the input conversion board because the shunt resistor and the voltage-dividing resistor have different external dimensions and mounting forms. Also, there is a problem that an electric wire needs to be provided for the current channel to flow a large current. The present invention has been invented in view of these problems. An object of the present invention is to provide a terminal block for realizing a good input converter and a protection control system having a good input converter.

[0005] The above problems are solved, for example, by the invention described in the claims. To solve the above problems, the present invention provides a terminal block configured by combining input conversion modules. The input conversion module includes at least one of a current measurement module with a shunt resistor mounted thereon and a voltage measurement module with a voltage-dividing resistor mounted thereon. The input conversion module is characterized in that it is separated by a non-conductive partition. In this case, a protection control system having a good input converter can be provided. In this case, a terminal block for realizing a good input converter can be provided.

[0006] Further, the present invention provides a terminal block configured by combining input conversion modules. The input conversion module includes at least one of a current measurement module with a shunt resistor mounted thereon and a voltage measurement module with a voltage-dividing resistor mounted thereon. The terminal block is characterized in that the number or order of combining the input conversion modules can be changed. In this case, a terminal block for realizing a good input converter can be provided.

[0007] Here, for example, the shape and dimensions of the input section to the input conversion module are the same for all input conversion modules constituting the terminal block, and the shape and dimensions of the output section from the input conversion module are the same for all input conversion modules constituting the terminal block. In this case, the combination of either the current measurement module or the voltage measurement module can be swapped. Also, for example, when a component that is electrically connected to a shunt resistor or voltage divider resistor included in an input conversion module is called a connecting electrical component, and when an input conversion module that has an insulation withstand voltage specification between the input conversion modules and is placed adjacent to the first input conversion module is called the second input conversion module, if the shortest distance L between the connecting electrical component included in the first input conversion module and the connecting electrical component included in the second input conversion module is L, then the shortest distance L is shorter than the minimum spatial distance required to achieve the insulation withstand voltage. In this case, miniaturization can be achieved. Furthermore, for example, when a component electrically connected to a shunt resistor or voltage divider resistor included in an input conversion module is referred to as a connecting electrical component, and when an input conversion module adjacent to a first input conversion module is designated as a second input conversion module, and has an isolation voltage V [kV] specification between the input conversion modules, the shortest distance between the connecting electrical component included in the first input conversion module and the connecting electrical component included in the second input conversion module is V [mm] or less. In this case, miniaturization can be achieved while ensuring the isolation voltage V. Moreover, for example, the shunt resistor is mounted on a substrate, and the substrate is positioned perpendicular to the substrate on which the terminal block is mounted. In this case, it can handle up to the maximum current in the power system. Furthermore, for example, the input conversion modules are separated by partitions and conductive materials, and the conductive materials are electrically connected to the substrate on which the terminal block is fixed. In this case, the inductive effect between channels can be reduced. Furthermore, for example, the surface of the conductive material is covered with a non-conductive material. In this case, unintended conduction through the conductive material can be prevented. Furthermore, the device includes, for example, a wiring that outputs at least one of the voltage obtained by current-to-voltage conversion using a shunt resistor and the voltage obtained by voltage division using a voltage divider resistor, and a ferrite core, with the wiring passing through the ferrite core. In this case, noise immunity is improved.Furthermore, for example, an isolation IC is mounted on the input conversion module. In this case, the voltage output from the shunt resistor or voltage divider resistor can be amplified while also providing electrical isolation. Furthermore, for example, an isolation IC and an amplification circuit are mounted on the input conversion module. In this case, the isolation IC amplifies the voltage output from the shunt resistor or voltage divider resistor, and the amplification circuit can output a signal multiplied by a predetermined factor. And, for example, an isolation IC and an amplification circuit are mounted on the input conversion module, and at least one of the voltage converted from current to voltage by the shunt resistor and the voltage divided by the voltage divider resistor is output via serial communication. In this case, a noise-resistant structure can be achieved.

[0008] Furthermore, for example, in a protection control system having the above-mentioned terminal block, the first electrical circuit to which wiring from the current measurement module is connected and the second electrical circuit to which wiring from the voltage measurement module is connected are interchangeable in terms of components. In this case, it is possible to accommodate changes in the ratio and order of current channels and voltage channels. Moreover, for example, in a protection control system having the above-mentioned terminal block, the circuits to which wiring from the input conversion module is connected have the same component configuration. In this case, it is possible to accommodate changes in the ratio and order of current channels and voltage channels by changing the mounted components on a single input conversion board. Furthermore, for example, in a protection control system having an input conversion board equipped with the above-mentioned terminal block, when the maximum current value taken by the shunt resistor is called the current full scale and the maximum voltage value taken by the voltage divider resistor is called the voltage full scale, the output amplitude of the input conversion board when the current full scale flows through the shunt resistor is approximately the same as the output amplitude of the input conversion board when the voltage full scale is applied to the voltage divider resistor. In this case, the calculation board can be used in common even if the current full scale and voltage full scale are different. Furthermore, for example, in a protection control system having the above-mentioned terminal block, the terminal block consists of at least two or more current measurement modules, and is a terminal block combining a first current measurement module with a first shunt resistor mounted on it and a second current measurement module with a second shunt resistor mounted on it, where the maximum current value captured by the first shunt resistor is called the first current full scale, and the maximum current value captured by the second shunt resistor is called the second current full scale, the ratio of the second current full scale to the first current full scale is different from the ratio of the resistance value of the first shunt resistor to the resistance value of the second shunt resistor, and the output amplitude of the input conversion board when the first current full scale flows through the first shunt resistor is approximately the same as the output amplitude of the input conversion board when the second current full scale flows through the second shunt resistor. In this case, it is possible to accommodate the difference in current full scale.Furthermore, for example, in a protection control system having the above-mentioned terminal block, the terminal block consists of at least two or more voltage measurement modules, and is a terminal block combining a first voltage measurement module with a first voltage divider resistor and a second voltage measurement module with a second voltage divider resistor, where the maximum voltage value captured by the first voltage divider resistor is referred to as the first voltage full scale, and the maximum voltage value captured by the second voltage divider resistor is referred to as the second voltage full scale, the ratio of the second voltage full scale to the first voltage full scale is different from the ratio of the voltage division ratio of the first voltage divider resistor to the voltage division ratio of the second voltage divider resistor, and the output amplitude of the input conversion board when the first voltage full scale is applied to the first voltage divider resistor is approximately the same as the output amplitude of the input conversion board when the second voltage full scale is applied to the second voltage divider resistor. In this case, it is possible to accommodate the difference in voltage full scale. Furthermore, for example, in a protection control system having the above-mentioned terminal block, the conductive material is connected to the frame ground of the input conversion board. In this case, the inductive effect between channels can be reduced.

[0009] According to the present invention, a terminal block for realizing a good input converter and a protection control device having a good input converter can be realized.

[0010] This figure illustrates the protection control system of this embodiment, which applies the international standard IEC 61850. This is a block diagram illustrating the configuration of the merging unit of Embodiment 1. This figure shows the terminal block in Embodiment 1 disassembled into individual modules. This figure shows the terminal block in Embodiment 1 mounted on a printed circuit board. (a) to (b) are diagrams illustrating the configuration of the miniature circuit board in Embodiment 1. This is a diagram illustrating the configuration of the miniature circuit board in a second modified example of Embodiment 1. This figure illustrates the configuration of the terminal block in Embodiment 2. This is a block diagram illustrating the configuration of the merging unit in Embodiment 3. This is a block diagram illustrating the configuration of the protection control device in Embodiment 4.

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0012] Embodiments of the present invention will be described with reference to the accompanying drawings. This embodiment is an example in which the present invention is applied to a protection control system that conforms to the international standard IEC 61850. The protection control system S of this embodiment, which conforms to the international standard IEC 61850, will be described with reference to Figure 1.

[0013] Figure 1 is a diagram illustrating the protection control system S of this embodiment, which applies the international standard IEC 61850. The protection control system S comprises a protection control device 5, a plurality of merging units 1, and a SCADA device 4. The protection control device 5 is connected to a transmission path called a station bus and a transmission path called a process bus. The station bus and process bus are redundant, and the protection control device 5 and the merging units 1 have two communication interfaces per bus.

[0014] The protection control device 5 is connected to the merging unit 1 via a process bus. The merging unit 1 acquires electrical quantities (current and voltage) from the power system. The merging unit 1 performs A / D (Analog to Digital) conversion on the acquired electrical quantity signals and transmits the converted digital information via communication IF 31 and communication IF 32. The protection control device 5 receives the electrical quantity information transmitted from the merging unit 1 via communication IF 5003 and communication IF 5004. At this time, a communication method called SV (Sampled Value) is used.

[0015] The protection control device 5 performs protection relay calculations based on the electrical quantity information, and if the relay operation conditions are met, it transmits trip command information to the merging unit 1. At this time, a communication method called GOOSE is used. Multiple merging units 1 may be installed in the substation, as shown in Figure 1.

[0016] Furthermore, the protection control device 5 is connected to the SCADA device 4, which is a higher-level device, via a station bus. The protection control device 5 transmits its own device status and other information to the SCADA device 4 via communication IF 5001 and communication IF 5002, and also receives command information from the SCADA device 4. At this time, a communication method called MMS is used. Communication methods such as SV, GOOSE, and MMS are specified in the international standard IEC 61850.

[0017] The configuration of the merging unit 1 in this embodiment will be explained using the block diagram in Figure 2. Figure 2 is a block diagram illustrating the configuration of the merging unit 1 in Embodiment 1. The merging unit 1 transmits information on the amount of electricity for performing at least one of the calculations for protection and control of the power system via a process bus, which is a network. As shown in Figure 2, the merging unit 1 consists of three boards: an input conversion board 40, a calculation board 41, and an output board 42. The input conversion board 40 and the calculation board 41 are connected by a cable 43. The calculation board 41 and the output board 42 are connected by a cable 44.

[0018] The input conversion board 40 takes in the current and voltage of the power system. The input conversion circuit in this embodiment has four channels, and the circuit including the shunt resistor 10a is called channel 1, the circuit including the shunt resistor 10b is called channel 2, the circuit including the voltage divider resistor 11a is called channel 3, and the circuit including the voltage divider resistor 11b is called channel 4. The input conversion board 40 consists of a terminal block 50, isolation amplifiers 12a and 12b, amplification circuits 101a and 101b, isolation amplifiers 13a and 13b, amplification circuits 102a and 102b.

[0019] In the input conversion board 40 of this embodiment, the current and voltage input from the power system are input to the merging unit 1 via the terminal block 50. The terminal block 50 has built-in shunt resistors 10a, shunt resistors 10b, voltage divider resistors 11a, and voltage divider resistors 11b. The configuration of the terminal block 50 will be described later.

[0020] The shunt resistor 10a converts the power system current into voltage. The voltage across the shunt resistor 10a is input to the isolation amplifier 12a. The isolation amplifier 12a amplifies the voltage across the shunt resistor 10a and provides electrical isolation. The output of the isolation amplifier 12a is input to the amplification circuit 101a. The amplification circuit 101a outputs a signal obtained by multiplying the input signal by a predetermined factor. The shunt resistor 10a, isolation amplifier 12a, and amplification circuit 101a constitute a current 1-channel input conversion circuit (channel 1). Similarly, the shunt resistor 10b, isolation amplifier 12b, and amplification circuit 101b constitute a current 1-channel input conversion circuit (channel 2).

[0021] Furthermore, the voltage divider resistor 11a divides the voltage of the power system at a predetermined voltage division ratio, and the divided voltages are input to the isolation amplifier 13a. The isolation amplifier 13a amplifies the divided voltages and provides electrical isolation. The output of the isolation amplifier 13a is input to the amplification circuit 102a. The voltage divider resistor 11a, isolation amplifier 13a, and amplification circuit 102a constitute a voltage 1-channel input conversion circuit (channel 3). Similarly, the voltage divider resistor 11b, isolation amplifier 13b, and amplification circuit 102b constitute a voltage 1-channel input conversion circuit (channel 4).

[0022] In this embodiment, the shunt resistor 10a and the shunt resistor 10b are the same component, and the voltage divider resistor 11a and the voltage divider resistor 11b are the same component. Furthermore, the shunt resistor 10a and the shunt resistor 10b are collectively referred to as the shunt resistor 10, and the voltage divider resistor 11a and the voltage divider resistor 11b are collectively referred to as the voltage divider resistor 11. Similarly, the isolation amplifier after the shunt resistor 10 is collectively referred to as the isolation amplifier 12, and the amplification circuit after the isolation amplifier 12 is collectively referred to as the amplification circuit 101. The isolation amplifier after the voltage divider resistor 11 is collectively referred to as the isolation amplifier 13, and the amplification circuit after the isolation amplifier 13 is collectively referred to as the amplification circuit 102. The isolation ICs in this embodiment are isolation amplifiers 12 and 13 that electrically isolate the input analog signal and output an analog signal multiplied by a predetermined factor.

[0023] When the maximum current value taken in by the shunt resistor 10 is referred to as the current full scale, and the maximum voltage value taken in by the voltage divider resistor 11 is referred to as the voltage full scale, the output amplitude of the amplifier circuit 101 when the current full scale flows through the shunt resistor 10 and the output amplitude of the amplifier circuit 102 when the voltage full scale is applied to the voltage divider resistor 11 are assumed to be approximately equal. This can also be said to mean that when the maximum amount of electricity taken in by the shunt resistor 10 and the voltage divider resistor 11 is referred to as the full scale, and an amount of electricity equivalent to the full scale is input to each of the multiple channels, the output amplitude of the input conversion circuit output from the input conversion board 40 is approximately the same for each channel. As a result, the calculation board 41 can be used in common even when the current full scale and voltage full scale are different.

[0024] Furthermore, isolation amplifiers 12 and 13 are assumed to be pin-compatible components, although their IC characteristics differ. That is, isolation amplifier 12 is an isolation amplifier IC designed for current detection, and isolation amplifier 13 is an isolation amplifier IC designed for voltage measurement, but isolation amplifiers 12 and 13 share the same number, shape, and arrangement of pins. Similarly, the characteristics (such as amplification factor) of amplification circuits 101 and 102 can be changed by changing the mounted components. For example, amplification circuits 101 and 102 are amplification circuits using operational amplifiers and resistors, and by mounting resistor components with different resistance values, amplification circuit 101 can be changed to have the same characteristics as amplification circuit 102. In this embodiment, the input conversion board 40 has been described as having an input conversion circuit with two current channels and two voltage channels, but the number of current and voltage channels that the input conversion board 40 has is not limited to this.

[0025] The arithmetic board 41 consists of analog filters 103a, 103b, 104a, 104b, an A / D converter 14, an integrated circuit unit 20, a non-volatile memory 30, a communication IF 31, and a communication IF 32. The output signal of the amplification circuit 101a is input to the analog filter 103a via cable 43. The output signal of the amplification circuit 101b is input to the analog filter 103b via cable 43. The output signal of the amplification circuit 102a is input to the analog filter 104a via cable 43. The output signal of the amplification circuit 102b is input to the analog filter 104b via cable 43. The A / D converter 14 is a multi-channel A / D converter that takes the output signals of analog filters 103a, 103b, 104a, and 104b as input, converts the input voltage values ​​into digital information (digital values), and outputs them. The converted digital information is input to the integrated circuit unit 20.

[0026] The integrated circuit unit 20 consists of an arithmetic processing unit 200, a transmission / reception circuit 201, and a multiple I / O circuit 202. The arithmetic processing unit 200, the transmission / reception circuit 201, and the multiple I / O circuit 202 are connected to each other by an internal bus, which is shown as a thick line in Figure 2. When the integrated circuit unit 20 is a System on Chip (SoC), the arithmetic processing unit 200 is the CPU, the transmission / reception circuit 201 is a circuit built into an FPGA circuit, and the multiple I / O circuit is a circuit built into the SoC. The arithmetic processing unit 200 performs predetermined processing on the data digitally converted by the A / D converter 14, generates SV data, and executes SV transmission processing. In SV transmission processing, the arithmetic processing unit 200 instructs the transmission / reception circuit 201 to transmit SV data via communication IF 31 and communication IF 32.

[0027] The arithmetic processing unit 200 also processes trip command information received via communication IF 31 and communication IF 32. The arithmetic processing unit 200 outputs a trip signal via the multiple I / O circuit 202, which drives the relay drive output circuit 33 in the output board 42. The multiple I / O circuit 202 is a circuit that interfaces with external circuits and has a circuit that corresponds to a communication standard such as SPI communication. In this embodiment, the non-volatile memory 30 and the relay drive output circuit 33 in the output board 42 are connected via the multiple I / O circuit 202.

[0028] The configuration of the terminal block 50 in this embodiment will be explained with reference to Figures 3 and 4. Figure 3 is a diagram showing the terminal block 50 disassembled into its modules, illustrating only representative components. Figure 4 shows the terminal block 50 mounted on the printed circuit board 401. Figure 4 also shows the mechanism for holding the partition walls together (omitted in Figure 3). The printed circuit board 401 is a printed circuit board on which the components constituting the input conversion board 40 are mounted. Figure 4 shows a cross-sectional view of the terminal block 50 and the printed circuit board 401 in the mounted state, and does not show the isolation amplifiers 12, 13, amplification circuits 101, 102, or wiring between electronic components mounted on the printed circuit board 401.

[0029] The terminal block 50 is constructed by combining modules on which shunt resistors 10 or voltage divider resistors 11 are mounted. Specifically, the terminal block 50 is constructed by connecting partition walls 501, small circuit boards 502, 503, 504, 505, 506, 507, 508, and 509 in a direction parallel to the surface of the circuit board on which it is mounted. Here, partition walls 501, 503, 505, 507, and 509 have a common structure and are made of a non-conductive material such as plastic. Furthermore, a shunt resistor 10a is mounted on small circuit board 502, a shunt resistor 10b on small circuit board 504, a voltage divider resistor 11a on small circuit board 506, and a voltage divider resistor 11b on small circuit board 508. In this embodiment, small circuit boards 502 and 504 are common circuit boards, and small circuit boards 506 and 508 are common circuit boards.

[0030] The partition wall 501 and the small circuit board 502 are configured as a CT module, and the partition wall 505 and the small circuit board 506 are configured as a VT module. The terminal block 50 can be described as a configuration in which two CT modules and two VT modules are connected. CT stands for Current Transformer, and refers to a component that takes in the current of an electrical system and converts it to an appropriate level of voltage. VT stands for Voltage Transformer, and refers to a component that takes in the voltage of an electrical system and converts it to an appropriate level of voltage. Therefore, the CT module can be called a current measurement module, and the VT module can be called a voltage measurement module. In this specification, CT modules and VT modules are collectively referred to as input conversion modules.

[0031] The configuration of the miniature substrate 502 will be explained using Figure 5(a). Figure 5(a) is a diagram illustrating the configuration of the miniature substrate 502. In Figure 5(a), the hatched areas are electrode patterns formed on the miniature substrate 502. The shunt resistor 10a is a surface-mount type shunt resistor having four electrodes, two electrodes for inputting current and two electrodes for extracting the measured voltage. Input current application terminals 5021 and 5022 are terminals for inputting current from the power system and are electrically connected to the two electrodes for inputting current to the shunt resistor 10a, respectively, via the electrode patterns formed on the miniature substrate 502. The two electrodes for extracting the measured voltage to the shunt resistor 10a are electrically connected to wiring 5023 and wiring 5024, respectively, via the electrode patterns formed on the miniature substrate 502. Wiring 5023 and wiring 5024 are mounted via through-holes (not shown) provided on the printed circuit board 401, as shown in Figure 4. This connects electrically to the wiring pattern (not shown) mounted on the printed circuit board 401. With this configuration, the electrical wiring shown in Figure 2 can be realized.

[0032] Furthermore, the configuration of the miniature substrate 506 will be explained using Figure 5(b). Figure 5(b) is a diagram illustrating the configuration of the miniature substrate 506. In Figure 5(b), the hatched areas are electrode patterns formed on the miniature substrate 506. Input voltage application terminals 5061 and 5062 are terminals for inputting voltage from the power system and are connected to the voltage divider resistor 11a. In addition, the voltage divided at a predetermined voltage division ratio is extracted by wiring 5063 and wiring 5064 and mounted through through-holes (not shown) provided on the printed circuit board 401 as shown in Figure 4. This electrically connects to the wiring patterns (not shown) mounted on the printed circuit board 401. With the above configuration, the electrical wiring shown in Figure 2 can be realized.

[0033] As shown in Figures 3 and 4, the two types of modules, the CT module and the VT module, have the same shape, dimensions, and position of the current application terminals and input voltage application terminals that serve as inputs to the terminal block 50, and the same shape, dimensions, and position of the wiring that serves as an output to the terminal block 50. For example, when a VT module consisting of a partition wall 505 and a small circuit board 506 is combined with a CT module consisting of a partition wall 501 and a small circuit board 502, input voltage application terminals 5061 and 5062 are placed where input current application terminals 5021 and 5022 were located. Also, wiring 5063 and 5064 are placed where wiring 5023 and 5024 were located. As a result, the combinations of either module can be swapped. In this embodiment, a terminal block configuration with two current channels and two voltage channels has been described. However, it is possible to reconfigure the terminal block 50 to support four current channels by connecting four CT modules, or to reconfigure the terminal block 50 to support four voltage channels by connecting four VT modules. The shape and dimensions of the input section to the input conversion module are the same for all input conversion modules constituting the terminal block 50, and the shape and dimensions of the output section from the input conversion module are also the same for all input conversion modules constituting the terminal block 50. In addition, the wiring patterns required on the circuit board on which the terminal block 50 is mounted can also be standardized. Furthermore, the structure allows for changing the number of modules connected.

[0034] Next, the effects of this embodiment will be explained. The first effect of this embodiment is that miniaturization can be achieved by incorporating the shunt resistor 10 and the voltage divider resistor 11 into the terminal block 50 and separating them with a partition made of a non-conductive material. Each channel of the input conversion board 40 requires insulation between channels, and there is a specification for dielectric breakdown voltage. Here, the dielectric breakdown voltage specification is V [kV]. For this reason, if there are no obstacles between the shunt resistor 10a and the shunt resistor 10b, or between the voltage divider resistor 11a and the voltage divider resistor 11b, the electrical circuits constituting each channel must be placed at a distance greater than the minimum spatial distance (also called creepage distance) required to achieve the dielectric breakdown voltage V.

[0035] The electrical circuits that make up each channel are the electrical components that make up the CT module or VT module. For example, in the case of a CT module, it includes a shunt resistor 10a, a small circuit board 502, input current application terminals 5021 and 5022, wiring 5023 and 5024. In the case of a VT module, it includes a voltage divider resistor 11a, a small circuit board 506, input voltage application terminals 5061 and 5062, wiring 5063 and 5064. These can be described as "connecting electrical components that are electrically connected to the shunt resistor or voltage divider resistor."

[0036] Here, adjacent input conversion modules are referred to as the first input conversion module and the second input conversion module, and the shortest distance between the connected electrical components of the first input conversion module and the connected electrical components of the second input conversion module is defined as L [mm]. As shown in Figure 3, the shunt resistor 10 in this embodiment is a surface-mount type shunt resistor, and its height during mounting is shown as low. In addition, the input current application terminals 5021 and 5022 are flat plates arranged horizontally. Therefore, the shortest distance L between connected electrical components is the shortest distance between the input current application terminal (or input voltage application terminal) of the first input conversion module and the input current application terminal (or input voltage application terminal) of the second input conversion module. Figure 4 illustrates the shortest distance L between connected electrical components in this embodiment.

[0037] In this embodiment, the shunt resistor 10 has a low height when mounted, so the shortest distance L between connected electrical components is the shortest distance between input current application terminals. However, if the shunt resistor 10 has a high height when mounted, the shortest distance L between connected electrical components may be the shortest distance between shunt resistors. Thus, in this specification, "connected electrical components electrically connected to a shunt resistor or voltage divider resistor" includes the shunt resistor itself or the voltage divider resistor itself.

[0038] In conventional technology, the shortest distance L between connected electrical components must be greater than the minimum spatial distance required to achieve the dielectric strength V. In conventional technology, this creepage distance prevented the high-density mounting of shunt resistors 10 and voltage divider resistors 11. In contrast, the configuration of this embodiment uses partitions made of non-conductive material to separate the components. Therefore, the shortest distance L can be shorter than the minimum spatial distance required to achieve the dielectric strength V. As a result, miniaturization can be achieved. The minimum spatial distance required to achieve the dielectric strength V is specified, for example, in JIS C 60664-1:2009 Table F. 2. For example, under conditions of uneven electrolysis, the minimum spatial distance is 4.0 mm at V = 5 kV and 8.0 mm at V = 8 kV. If the minimum spatial distance required to achieve the dielectric strength V [kV] is Lv [mm], then approximately Lv = V. Therefore, if the dielectric strength specification between each channel of the terminal block 50 is V [kV], it can be said that the shortest distance between connected electrical components can be V [mm] or less. This makes it possible to achieve miniaturization while ensuring the dielectric strength V.

[0039] Although the partition wall 501 and the small substrate 502 are configured as a CT module, and the partition wall 505 and the small substrate 506 are configured as a VT module, as shown in Figure 3, the partition walls may not be included in the CT module or VT module, but may be fixed as separate components.

[0040] A second advantage of this embodiment is that the structure of the terminal block 50 can flexibly accommodate changes in the number and order of current channels and voltage channels of the input conversion board 40. Since the terminal block 50 of this embodiment can be configured by combining CT modules and VT modules, it can flexibly accommodate changes in the number and order of current channels and voltage channels of the input conversion board 40 by changing the order of the combined modules.

[0041] In the protection control device 5, there is a problem in that the order of current channels and voltage channels may be restricted due to wiring constraints, but according to this embodiment, this can be addressed by rearranging the structure of the terminal block 50. Therefore, the design flexibility of the protection control system S can be increased. In addition, in the protection control device 5, it is necessary to increase the number of current inputs for busbar protection applications. Therefore, an input conversion board 40 that only inputs current may be required, but since the terminal block 50 is modularized, the components can be standardized. For example, by combining only CT modules, it is easy to rearrange it into a 4-channel configuration for current only. It is also easy to rearrange it into a 4-channel configuration for voltage only. Furthermore, by connecting only eight CT modules, it is easy to rearrange it into a terminal block 50 with 8 channels for current only. In this way, terminal blocks 50 with different numbers of channels can be easily realized, increasing the design flexibility of the protection control system S.

[0042] A third advantage of this embodiment is that the ratio and order of current channels and voltage channels can be changed by changing the mounted components on the input conversion board 40. In the prior art, when a shunt resistor and a voltage divider resistor were mounted on the input conversion board, the shunt resistor 10 and the voltage divider resistor 11 had different external dimensions and mounting configurations. Therefore, changing the number and order of current channels and voltage channels required changing the wiring pattern of the printed circuit board 401 of the input conversion board 40 itself. In this embodiment, the shunt resistor 10 and the voltage divider resistor 11, which have different external dimensions and mounting configurations, are built into the terminal block 50. In addition, the isolation amplifier 12 and the isolation amplifier 13 are pin-compatible, and the characteristics of the amplification circuit 101 and the amplification circuit 102 can also be changed by changing the mounted components. In other words, the electrical circuits to which the wiring from the shunt resistor 10 is connected (isolation amplifier 12 and amplification circuit 101) and the electrical circuits to which the wiring from the voltage divider resistor 11 is connected (isolation amplifier 13 and amplification circuit 102) have a circuit configuration in which components can be interchanged with each other. In this case, the electrical circuit to which the wiring from the shunt resistor 10 is connected (isolation amplifier 12 and amplification circuit 101) functions as the first electrical circuit to which the wiring from the current measurement module is connected. Furthermore, the electrical circuit to which the wiring from the voltage divider resistor 11 is connected (isolation amplifier 13 and amplification circuit 102) functions as the second electrical circuit to which the wiring from the voltage measurement module is connected.

[0043] Therefore, for example, even when attempting to change the configuration of the present embodiment to a four-channel configuration with only current, the following correspondence is possible. First, the terminal block 50 combines only four CT modules. Next, the isolation amplifier 13 changes the mounted components to those of the isolation amplifier 12. Further, the amplifier circuit 102 changes the mounted components so as to have the same characteristics as the amplifier circuit 101. In this way, with respect to the problem of changing the ratio and order of current channels and voltage channels, the printed circuit board 401 can be shared. That is, by changing the mounted components of the single input conversion board 40, it is possible to respond to changes in the ratio and order of current channels and voltage channels. In other words, the wiring pattern of the printed circuit board 401 of the input conversion board 40 can be made to correspond to one type, and the printed circuit board 401 can be shared. Or rather, when the CT module and the VT module constituting the terminal block 50 are referred to as input conversion modules, the circuits to which the wiring from the input conversion module is connected have the same component configuration and can be expressed as pin-compatible.

[0044] This third effect is obtained by changing the electronic components mounted on the input conversion board 40 in correspondence with a change in the number of combinations of the CT module and the VT module constituting the terminal block 50. Also, although the performance required for the isolation amplifier 12 for current measurement and the isolation amplifier 13 for voltage measurement is different as an isolation amplifier IC, this effect is obtained by designing the wiring pattern of the printed circuit board 401 as a pattern capable of mounting the isolation amplifier 12 and the isolation amplifier 13 which are pin-compatible.

[0045] A fourth advantage of this embodiment is that it becomes possible to use a common processing board 41. In this embodiment, signal amplification is performed within the input conversion board 40 by amplification circuits 101 and 102, and the processing board 41 is mounted on a separate board. By providing amplification circuits 101 and 102, if the amplification ratio of each amplification circuit is appropriately designed, it becomes possible to design the output amplitude of the input conversion board 40 to be approximately equal when a full-scale current is input to channel 1, which is an input for current, and when a full-scale voltage is input to channel 3, which is an input for voltage. As a result, even if there are multiple types of input conversion boards 40 with different channel configurations in the lineup, it becomes possible to use a common processing board 41.

[0046] A fifth advantage of this embodiment is that, because a surface-mount type shunt resistor having four electrodes is used as the shunt resistor 10, high-precision current measurement is possible. A surface-mount type four-terminal shunt resistor is a suitable component for this embodiment in terms of both its structural aspect, which requires it to be small in order to be built into the terminal block 50, and its performance aspect, which requires high-precision current measurement.

[0047] Also, the surface mount type shunt resistor 10 is preferably mounted on a small substrate 502 arranged in a direction perpendicular to the printed board 401 to which the terminal block 50 is attached as in this embodiment. In this case, it can also be said that the shunt resistor 10 is mounted on a substrate (in this case, the small substrate 502), and the substrate (in this case, the small substrate 502) is arranged in a direction perpendicular to the substrate (in this case, the printed board 401) on which the terminal block 50 is mounted. In the case of a surface mount type shunt resistor whose short side size is larger than the dimension obtained by subtracting the thickness of the partition from the interval between the partitions, it cannot be mounted in a direction parallel to the printed board 401. On the other hand, since the shunt resistor 10 needs to be able to handle up to the maximum current considered in the event of an accident in the power system, it is necessary to select a component having a predetermined size. By mounting the surface mount type shunt resistor 10 on the small substrate 502 arranged in a direction perpendicular to the printed board 401, it is possible to handle up to the maximum current in the event of an accident in the power system.

[0048] The sixth effect of this embodiment is that there is no need to provide an electric wire for passing a current through the shunt resistor 10. In the prior art, when a shunt resistor is mounted on an input conversion board, it is necessary to provide an electric wire capable of handling up to the maximum current considered in the event of an accident in the power system for each shunt resistor mounted on the input conversion board. On the other hand, according to this embodiment, there is no need to provide an electric wire. Therefore, the man-hours required for manufacturing the input conversion board 40 can be reduced, and it can be manufactured at a low cost.

[0049] Next, a modified version of this embodiment will be described. In this embodiment, the input conversion board 40 has multiple current channels, but in the first modified version, we consider a configuration in which each has a different current full scale. Since the terminal block 50 is a single component, ideally, it is desirable that the difference in current full scale can be absorbed by the terminal block 50. For example, let the current full scale of channel 1 be F1 and the resistance value of the shunt resistor 10a be R1. If the current full scale of channel 1 is F2, then if the resistance value R2 of the shunt resistor 10b is set to R1:R2 = F2:F1, that is, R2 = R1 × (F1 / F2), then it is possible to design the output amplitude of the terminal block 50 to be approximately equal when a current of full scale F1 is input to channel 1 and when a current of full scale F2 is input to channel 2. However, it may be difficult to provide a lineup of resistance values ​​for the shunt resistor 10 that corresponds to the types of current full scales required for the input conversion board 40.

[0050] Therefore, in this modified example, the input conversion board 40, which includes an isolation amplifier 12 and an amplification circuit 101 in addition to the terminal block 50, is designed to accommodate different full-scale currents. The electrical circuit consisting of the isolation amplifier 12 and the amplification circuit 101 can be considered as a current-voltage conversion circuit. If α1 is the current-voltage conversion coefficient by the isolation amplifier 12a and the amplification circuit 101a, and α2 is the current-voltage conversion coefficient by the isolation amplifier 12b and the amplification circuit 101b, then α1 and α2 are designed such that R1 × F1 × α1 = R2 × F2 × α2 holds true. Specifically, α1 and α2 are adjusted by changing the design of the magnification of the isolation amplifier 12 and the magnification of the amplification circuit 101.

[0051] In this case, the terminal block 50 consists of at least two current measurement modules, and is a combination of a first current measurement module with a first shunt resistor (in this case, shunt resistor 10a) mounted on it and a second current measurement module with a second shunt resistor (in this case, shunt resistor 10b) mounted on it, and when the maximum current value captured by the first shunt resistor is called the first current full scale (in this case, current full scale F1), and the maximum current value captured by the second shunt resistor is called the second current full scale (in this case, current full scale F2), then the ratio of the second current full scale to the first current full scale is different from the ratio of the resistance value of the first shunt resistor to the resistance value of the second shunt resistor, and it can be said that the output amplitude of the input conversion board 40 when the first current full scale flows through the first shunt resistor is approximately the same as the output amplitude of the input conversion board 40 when the second current full scale flows through the second shunt resistor.

[0052] The advantages of this modified example are, in addition to the advantages of Example 1, that the number of different resistance values ​​for the shunt resistor 10 can be reduced, resulting in cost reduction and manufacturing management benefits through component commonality. As mentioned above, it is possible for the terminal block 50 alone to handle differences in full-scale current, but this is not practical when there are many different full-scale values. Therefore, it is preferable to abandon the idea of ​​the terminal block 50 alone handling differences in full-scale current, and instead consider the terminal block 50 as a terminal block that incorporates shunt resistors 10a and 10b with resistance values ​​R1 and R2, respectively, and to handle differences in full-scale current current through the electrical circuit design of the input conversion board 40 on which the terminal block is mounted.

[0053] Although this modified example uses a current channel, the same principle applies to voltage channels. The resistance value of the shunt resistor 10 can be replaced with the voltage division ratio of the voltage divider resistor 11. If F3 is the full-scale voltage of channel 3, RR3 is the voltage division ratio of the voltage divider resistor 11a, F4 is the full-scale voltage of channel 4, RR4 is the voltage division ratio of the voltage divider resistor 11b, β1 is the voltage-to-voltage conversion coefficient by the isolation amplifier 13a and the amplification circuit 102a, and β2 is the voltage-to-voltage conversion coefficient by the isolation amplifier 13b and the amplification circuit 102b, then β1 and β2 are designed such that F3 × RR3 × β1 = F4 × RR4 × β2. This reduces the number of voltage division ratios for the voltage divider resistor 11.

[0054] In this case, the terminal block 50 consists of at least two voltage measurement modules, and is a combination of a first voltage measurement module equipped with a first voltage divider resistor (in this case, voltage divider resistor 11a) and a second voltage measurement module equipped with a second voltage divider resistor (in this case, voltage divider resistor 11b). When the maximum voltage value captured by the first voltage divider resistor is referred to as the first voltage full scale (in this case, voltage full scale F3), and the maximum voltage value captured by the second voltage divider resistor is referred to as the second voltage full scale (in this case, voltage full scale F4), the ratio of the second voltage full scale to the first voltage full scale is different from the ratio of the voltage division ratio of the first voltage divider resistor to the voltage division ratio of the second voltage divider resistor, and it can also be said that the output amplitude of the input conversion board when the first voltage full scale is applied to the first voltage divider resistor is approximately the same as the output amplitude of the input conversion board when the second voltage full scale is applied to the second voltage divider resistor. Furthermore, in this modified configuration, the current-voltage conversion circuit using isolation amplifier 12a and amplification circuit 101a and the current-voltage conversion circuit using isolation amplifier 12b and amplification circuit 101b can be interchanged. Similarly, the voltage-to-voltage conversion circuit using isolation amplifier 13a and amplification circuit 102a and the voltage-to-voltage conversion circuit using isolation amplifier 13b and amplification circuit 102b can be interchanged. Thus, the fact that the circuits to which the wiring from the input conversion module is connected have the same component configuration and are pin-compatible applies to all circuits from channel 1 to channel 4, including current measurement and voltage measurement.

[0055] A second modification will be explained using Figure 6. Figure 6 is a diagram of the configuration of the small circuit board 502 in this modification. In this modification, there are differences in the wiring 5023 and 5024, which are for extracting the measured voltage of the shunt resistor 10a. Wiring 5023 is connected to a wiring pattern mounted on the printed circuit board 401 through a ferrite core 5025. Similarly, wiring 5024 is connected to a wiring pattern mounted on the printed circuit board 401 through a ferrite core 5026. The ferrite cores 5025 and 5026 can also be called ring-shaped magnetic materials. In addition, although this explanation uses the small circuit board 502 on which the shunt resistor 10 is mounted, wiring 5063 and 5064 of the small circuit board 506 on which the voltage divider resistor 11 is mounted are similarly connected to the wiring pattern mounted on the printed circuit board 401 through ferrite cores. The effect of this modification is improved noise immunity. When external noise is superimposed on the surrounding circuits of the shunt resistor 10 or voltage divider resistor 11, its propagation to the subsequent circuits can be eliminated, thereby improving the accuracy of current and voltage measurements.

[0056] Thus, according to this embodiment, a merging unit with a good input converter can be realized.

[0057] In Embodiment 1, the terminal block 50 was configured such that the CT module and VT module were separated by a partition made of a non-conductive material. This embodiment is a different internal structure. The terminal block 51 in this embodiment has a conductive plate made of a conductive material, and the CT module and VT module are separated by a partition and the conductive plate.

[0058] The configuration of the terminal block 51 in this embodiment will be explained with reference to Figure 7. Figure 7 is a diagram illustrating the configuration of the terminal block 51 in Embodiment 2. Note that components common to both Figures 3-5, which are configuration diagrams in Embodiment 1, are given the same numbers, and their explanations are omitted.

[0059] The terminal block 51 is constructed by connecting the following components in a direction parallel to the surface of the substrate to be mounted: partition wall 501, conductive plate 510, small substrate 502, partition wall 503, conductive plate 511, small substrate 504, partition wall 505, conductive plate 512, small substrate 506, partition wall 507, conductive plate 513, small substrate 508, conductive plate 514, and partition wall 509. In this embodiment, a conductive plate 510 made of a conductive material is bonded to partition wall 501. The partition wall 501, conductive plate 510, and small substrate 502 are configured as a CT module. To prevent unintended electrical contact between the conductive plate 510 and the small substrate 502, the surface of the conductive plate 510 is covered with a non-conductive material after it is bonded to the partition wall 501. Wiring extends from the conductive plate 510 to the substrate and is electrically connected to the frame ground of the input conversion board 40. This can also be described as the conductive material being electrically connected to the substrate (in this case, the input conversion board 40) that fixes the terminal block 50. Partitions 503, 505, and 507 have the same configuration as partition 501. Partition 509 is also the same as the other partitions, except that the conductive plate 514 is bonded to a different surface from partition 509 so that the surface to which it is bonded faces inward.

[0060] The conductive plate 511 and the like are inserted between the modules to function as a shield. The effect of this embodiment is that the inductive effects between channels can be reduced. In addition, by preventing external noise from being superimposed on the peripheral circuits of the shunt resistor 10 and voltage divider resistor 11, the accuracy of current and voltage measurements can be improved.

[0061] The explanation described a configuration in which the conductive plate 510 is bonded to the partition wall 501, but various modifications of this configuration are possible. Bonding may be performed by, for example, heat compression, or it is not necessarily required that the partition wall 501 and the conductive plate 510 be bonded together, and the partition wall 501 and the conductive plate 510 may be fixed as separate components. The conductive plate 510 does not need to be a plate-shaped structure, and the same effect can be obtained by applying a paint made of a conductive material to the partition wall 501. In addition, the wiring extending from the conductive plate 510 to the substrate may be structured to allow terminal connection, or the wires may be brought out from the conductive plate 510 and soldered to the substrate. Furthermore, although the conductive plate was arranged along the partition wall, the conductive plate or conductive material may be arranged to cover the entire terminal block 51. This can further prevent the superposition of external noise.

[0062] In Example 1, the isolation IC was described in the case of isolation amplifiers 12 and 13, which amplify the input differential voltage and provide electrical isolation. This example uses a different type of isolation IC.

[0063] The configuration of the merging unit 2 in this embodiment will be explained using the block diagram in Figure 8. Figure 8 is a block diagram illustrating the configuration of the merging unit 2 in Embodiment 3. Components common to both Embodiment 1 and Embodiment 1 (Figure 2) are given the same numbers and their descriptions are omitted. The merging unit 2 consists of three boards: an input conversion board 45, a calculation board 46, and an output board 42. The input conversion board 45 and the calculation board 46 are connected by a cable 47.

[0064] The input conversion board 45 of this embodiment consists of a shunt resistor 10, an amplification circuit 105 (105a, 105b), an analog filter 107 (107a, 107b), an A / D converter 15 (15a, 15b), a digital isolation IC 17 (17a, 17b), a voltage divider resistor 11, an amplification circuit 106 (106a, 106b), an analog filter 108 (108a, 108b), an A / D converter 16 (16a, 16b), and a digital isolation IC 18 (18a, 18b). The A / D converters 15 and 16 convert the input voltage value into digital information and output it as a digital signal via serial communication. In this embodiment, serial communication will be described as SPI communication. As in the description in Embodiment 1, the analog filter 107a and the analog filter 107b will be collectively referred to as the analog filter 107, etc. The voltage across the shunt resistor 10 is input to the amplification circuit 105. The amplification circuit 105 amplifies the voltage across the shunt resistor 10, and the output of the amplification circuit 105 is input to the analog filter 107. The A / D converter 15 takes the output signal of the analog filter 107 as input and converts the voltage value into digital information. The converted digital information is input to the digital isolation IC 17. The digital isolation IC 17 electrically isolates the input digital signal and propagates it to the next stage.

[0065] The same applies to the circuit after the voltage divider resistor 11 (amplifier circuit 106, analog filter 108, A / D converter 16, digital isolation IC 18), which takes voltage as input. As a result, the input conversion board 45 outputs the SPI communication signal. The isolation ICs in this embodiment are digital isolation ICs 17 and 18, which electrically isolate the input digital signal before outputting the digital signal.

[0066] In this embodiment, the arithmetic board 46 connects the SPI communication signal group from the input conversion board 45 to the multiple I / O circuit 202. Normally, SPI signals communicate using four signal lines: CLK, SI, SO, and CS. In one-to-many (N: integers greater than or equal to 2) communication, all signals except CS are common. In other words, in this embodiment, the number of SPI communication signals connected to the multiple I / O circuit 202 is seven.

[0067] With this configuration, the arithmetic processing unit 200 can acquire data on the amount of electricity digitally converted by the A / D converter 15 and A / D converter 16, just as in the first embodiment. Therefore, the same effects as in the first embodiment can be obtained.

[0068] In this embodiment, however, it is necessary to ensure isolation between channels, so a multi-channel A / D converter cannot be used. In addition, it becomes necessary to implement analog filters and A / D converters for each channel within the input conversion board 45. Furthermore, the number of signals in cable 47 increases compared to Embodiment 1, as it is the number of channels plus three signals for CLK, SI, and SO. As a result, the configuration of Embodiment 1 has the advantage of efficiently realizing a multi-channel input conversion board. Nevertheless, the present invention is similarly applicable to the configuration of this embodiment. Thus, according to this embodiment, a merging unit 2 with a good input converter can be realized.

[0069] The above embodiments 1 to 3 describe a configuration in which the present invention is applied to a merging unit in a protection control system S to which IEC 61850 is applied. This embodiment is an embodiment for a protection control device in a configuration in which IEC 61850 is not applied. The merging unit itself does not perform protection relay calculations, but the protection control device in this embodiment does not perform SV transmissions and performs protection relay calculations within its own device.

[0070] Figure 9 is a block diagram illustrating the configuration of the protection control device 3 in Embodiment 4. The configuration of the protection control device 3 in this embodiment will be explained using the block diagram in Figure 9. Note that components common to both this embodiment and Figure 2, which is a block diagram of Embodiment 1, are given the same numbers and their explanations are omitted. The protection control device 3 consists of three boards: an input conversion board 40, a calculation board 48, and an output board 42. The configurational differences between this embodiment and Embodiments 1 to 3 are that the communication IF 31 and communication IF 32 have been removed from the calculation board 48, and the transmission / reception circuit 201 has been removed from the integrated circuit section 21 within the calculation board 48.

[0071] In this embodiment, the arithmetic processing unit 200 performs protection relay calculations and sequence processing using the amount of electricity from the power system acquired by the A / D converter 14. In the sequence processing, protection logic calculations are performed using the results of the protection relay calculations, and a trip signal is output via the multiple I / O circuit 202 as needed to drive the relay drive output circuit 33 in the output board 42.

[0072] In this embodiment as well, the configuration of incorporating a shunt resistor 10 and a voltage divider resistor 11 into the terminal block 50 and separating them with a partition made of a non-conductive material is similarly applicable, and it is clear that the same effects as in Embodiment 1 can be obtained.

[0073] Thus, according to this embodiment, a protection control device having a good input converter can be realized.

[0074] In the above embodiments, the configuration described was one in which the shunt resistor 10 and the voltage divider resistor 11 are built into the terminal block. However, it is also acceptable to build the terminal block with the electrical circuits included in the input conversion board as well. For example, in Embodiment 1, the terminal block may also be configured to include the isolation amplifier 12 and the isolation amplifier 13. In this case, the shunt resistor 10 and the isolation amplifier 12 will be mounted on the CT module, and the voltage divider resistor 11 and the isolation amplifier 13 will be mounted on the VT module. In addition to the effects of Embodiment 1, further miniaturization can be achieved.

[0075] Furthermore, the terminal block may be configured to integrate all the subsequent circuits of the shunt resistor 10 and voltage divider resistor 11 included in the input conversion board. For example, in Embodiment 3, the terminal block may be configured to integrate the amplifier circuit 105, analog filter 107, A / D converter 15, digital isolation IC 17, amplifier circuit 106, analog filter 108, A / D converter 16, and digital isolation IC 18. In this case, the CT module will have the shunt resistor 10, amplifier circuit 105, analog filter 107, A / D converter 15, and digital isolation IC 17 mounted on it, while the VT module will have the voltage divider resistor 11, amplifier circuit 106, analog filter 108, A / D converter 16, and digital isolation IC 18 mounted on it. In addition to the effects of Embodiment 1, further miniaturization can be achieved. Also, since the output of the terminal block is a serial communication signal, a noise-resistant structure can be achieved. Furthermore, a noise-resistant structure can be achieved by providing a shielding structure to the terminal block.

[0076] Whether the configuration described above involves integrating the isolation amplifier 12 and isolation amplifier 13 into the terminal block, or whether the configuration involves integrating all the subsequent circuits of the shunt resistor 10 and voltage divider resistor 11 included in the input conversion board, it is possible to make the shape, dimensions, and position of the current application terminal and input voltage application terminal that form the input section of the terminal block the same, and to make the shape, dimensions, and position of the wiring that forms the output section of the terminal block the same, as in the case of Embodiment 1.

[0077] In the embodiments described above, a terminal block was described as a combination of a CT module with a shunt resistor and a VT module with a voltage divider resistor. However, since the CT module and the VT module are structurally interchangeable, the present invention is equally applicable when a terminal block is constructed using only CT modules or only VT modules. In other words, the terminal block to which the present invention applies may be a terminal block constructed using a combination of CT modules and VT modules, a terminal block consisting only of CT modules, or a terminal block consisting only of VT modules.

[0078] In the above embodiments, if we define a device that performs protective relay calculations as a protective control device, then in Embodiments 1 and 2, the device to which the present invention is applied is a merging unit and not a protective control device, but in Embodiment 3, it becomes a protective control device. The device to which the present invention is applied may be any form of protective control system, but it is preferable that the protective control system has an input conversion board. Therefore, in general terms, it can be considered that the present invention is applicable to protective control systems. Furthermore, regardless of the form of protective control system to which it is applied, a common feature is the use of a terminal block with the structure of the present invention at the input section of the input conversion board.

[0079] In the embodiments described above, Embodiment 1 described the case using isolation amplifiers 12 and 13, and Embodiment 3 described the case using digital isolation ICs 17 and 18. Isolation amplifiers 12 and 13 and digital isolation ICs 17 and 18 can be generally referred to as isolation ICs. As can be seen from Figure 2, the block diagram of Embodiment 1, and Figure 8, the block diagram of Embodiment 3, the placement of the isolation IC or the A / D converter in the preceding stage differs depending on the type of isolation IC. In other words, in the present invention, the placement of the isolation IC or the A / D converter in the preceding stage is not limited, and as described in Embodiments 1 and 3, the present invention is applicable regardless of whether the isolation IC or the A / D converter is placed in the preceding stage. Furthermore, the present invention is also applicable when an A / D converter is not used and the electrical quantity is not converted digitally. In addition, the electrical circuit section may be functionally integrated from the multiple blocks described in the above embodiments and realized in a single circuit element. For example, in Embodiment 1, the isolation amplifier 12 and the amplification circuit 101 may be realized in a single IC. Furthermore, the analog filter 103 may be a built-in function of the A / D converter 14.

[0080] It should be noted that the present invention is not limited to the embodiments described above, and various other modifications are included in addition to the modifications described above. For example, the embodiments described above are described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to those having all the configurations described. Furthermore, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. Furthermore, it is possible to add, delete, or replace a part of the configuration of each embodiment with other configurations. In addition, each of the above configurations, functions, processing units, processing means, etc. may be implemented in hardware, in whole or in part, for example, by designing them as integrated circuits. Furthermore, each of the above configurations, functions, etc. may be implemented in software by having a processor interpret and execute a program that realizes each function. Information such as programs, tables, files that realize each function can be stored in memory, a recording device such as a hard disk or SSD (Solid State Drive), or a recording medium such as an IC card, SD card, or DVD.

[0081] Furthermore, the control lines and information lines shown are those deemed necessary for explanatory purposes, and not all control lines and information lines are necessarily shown in the actual product. In reality, it can be assumed that almost all components are interconnected. The protection control system S, merging units 1 and 2, and protection control device 3 described in detail above enable good input conversion.

[0082] S...Protection control system, 1, 2...Merging unit, 3, 5...Protection control device, 4...SCADA device, 10, 10a, 10b...Shunt resistor, 11, 11a, 11b...Voltage divider resistor, 12a, 12b, 13a, 13b...Isolation amplifier, 14, 15a, 15b, 16a, 16b...A / D converter, 17a, 17b, 18a, 18b...Digital isolation IC, 20, 21...Integrated circuit section, 30...Non-volatile memory, 31, 32...Communication IF, 33...Output circuit, 40, 45...Input conversion board, 41, 46, 48...Calculation board, 42...Output board, 43, 44, 47...Cable, 5 0, 51... Terminal block, 101a, 101b, 102a, 102b, 105a, 105b, 106a, 106b... Amplifier circuit, 103a, 103b, 104a, 104b, 107a, 107b, 108a, 108b... Analog filter, 200... Arithmetic processing unit, 201... Transmission / reception circuit, 202... Multiple I / O circuit, 401... Printed circuit board, 501, 503, 505, 507, 509... Partition wall, 502, 504, 506, 508... Small circuit board, 510-514... Conductive board, 5023, 5024... Wiring, 5025, 5026... Ferrite core, L... Shortest distance

Claims

1. A terminal block comprising a combination of input conversion modules, wherein each input conversion module includes at least one of a current measurement module with a shunt resistor and a voltage measurement module with a voltage divider resistor, and the input conversion modules are separated by non-conductive partitions.

2. A terminal block configured by combining input conversion modules, wherein each input conversion module includes at least one of a current measurement module with a shunt resistor and a voltage measurement module with a voltage divider resistor, and the number or order of the combined input conversion modules can be changed.

3. A terminal block according to claim 1 or claim 2, characterized in that the shape and dimensions of the input portion to the input conversion module are the same for all of the input conversion modules constituting the terminal block, and the shape and dimensions of the output portion from the input conversion module are the same for all of the input conversion modules constituting the terminal block.

4. A terminal block according to claim 1 or claim 2, wherein when a component included in the input conversion module that is electrically connected to the shunt resistor or the voltage divider resistor is referred to as a connecting electrical component, and the input conversion module having an dielectric breakdown voltage specification between the input conversion modules, and the input conversion module arranged adjacent to the first input conversion module is referred to as the second input conversion module, the shortest distance L between the connecting electrical component included in the first input conversion module and the connecting electrical component included in the second input conversion module is shorter than the minimum spatial distance required to achieve the dielectric breakdown voltage.

5. A terminal block according to claim 1 or claim 2, wherein when a component included in the input conversion module that is electrically connected to the shunt resistor or the voltage divider resistor is referred to as a connecting electrical component, and when the input conversion module having an dielectric strength V [kV] specification between the input conversion modules and being arranged adjacent to the first input conversion module is referred to as the second input conversion module, the shortest distance between the connecting electrical component included in the first input conversion module and the connecting electrical component included in the second input conversion module is V [mm] or less.

6. A terminal block according to claim 1 or claim 2, characterized in that the shunt resistor is mounted on a substrate, and the substrate is arranged perpendicular to the substrate on which the terminal block is mounted.

7. A terminal block according to claim 1, wherein the input conversion module is separated by the partition wall and the conductive material, and the conductive material is electrically connected to the substrate for fixing the terminal block.

8. A terminal block according to claim 7, characterized in that the surface of the conductive material is covered with a non-conductive material.

9. A terminal block according to claim 1 or claim 2, comprising: a wiring that outputs at least one of the voltage obtained by current-voltage conversion by the shunt resistor and the voltage obtained by voltage division by the voltage divider resistor; and a ferrite core, wherein the wiring is routed through the ferrite core.

10. A terminal block according to claim 1 or claim 2, characterized in that an insulated IC is mounted on the input conversion module.

11. A terminal block according to claim 1 or claim 2, characterized in that the input conversion module is equipped with an isolation IC and an amplification circuit.

12. A terminal block according to claim 1 or claim 2, wherein the input conversion module is equipped with an isolation IC and an amplification circuit, and outputs at least one of the voltage obtained by current-voltage conversion with the shunt resistor and the voltage obtained by voltage division with the voltage divider resistor via serial communication.

13. A protective control system having a terminal block according to claim 1 or claim 2, characterized in that a first electrical circuit to which wiring from the current measurement module is connected and a second electrical circuit to which wiring from the voltage measurement module is connected are interchangeable components.

14. A protective control system having a terminal block according to claim 1 or claim 2, characterized in that the circuits to which the wiring from the input conversion module is connected have the same component configuration.

15. A protection control system having an input conversion board equipped with the terminal block described in claim 1 or claim 2, wherein, when the maximum current value taken in by the shunt resistor is referred to as the current full scale and the maximum voltage value taken in by the voltage divider resistor is referred to as the voltage full scale, the output amplitude of the input conversion board when the current full scale flows through the shunt resistor and the output amplitude of the input conversion board when the voltage full scale is applied to the voltage divider resistor are approximately the same.

16. A protection control system having an input conversion board equipped with a terminal block according to claim 1 or claim 2, wherein the terminal block comprises at least two or more current measurement modules, and is a terminal block combining a first current measurement module equipped with a first shunt resistor and a second current measurement module equipped with a second shunt resistor, wherein when the maximum current value taken up by the first shunt resistor is referred to as the first current full scale, and the maximum current value taken up by the second shunt resistor is referred to as the second current full scale, the ratio of the second current full scale to the first current full scale is different from the ratio of the resistance value of the first shunt resistor to the resistance value of the second shunt resistor, and the output amplitude of the input conversion board when the first current full scale flows through the first shunt resistor is approximately the same as the output amplitude of the input conversion board when the second current full scale flows through the second shunt resistor.

17. A protection control system having an input conversion board equipped with a terminal block according to claim 1 or claim 2, wherein the terminal block comprises at least two or more voltage measurement modules, and is a terminal block combining a first voltage measurement module equipped with a first voltage divider resistor and a second voltage measurement module equipped with a second voltage divider resistor, wherein when the maximum voltage value taken by the first voltage divider resistor is referred to as the first voltage full scale, and the maximum voltage value taken by the second voltage divider resistor is referred to as the second voltage full scale, the ratio of the second voltage full scale to the first voltage full scale is different from the ratio of the voltage division ratio of the first voltage divider resistor to the voltage division ratio of the second voltage divider resistor, and the output amplitude of the input conversion board when the first voltage full scale is applied to the first voltage divider resistor is approximately the same as the output amplitude of the input conversion board when the second voltage full scale is applied to the second voltage divider resistor.

18. A protective control system having an input conversion board equipped with the terminal block described in claim 7, wherein the conductive material is connected to the frame ground of the input conversion board.

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