Organopolysiloxane, composition, film, transfer film, and pattern formation method

Abstract

The first problem addressed by the present invention is to provide an organopolysiloxane which has excellent pattern-forming performance and which has little optical loss in a pattern to be formed. Further, the second problem addressed by the present invention is to provide a composition, a film, a transfer film, and a pattern formation method.　An organopolysiloxane according to the present invention comprises a repeating unit represented by formula (1), a repeating unit represented by formula (2), and a repeating unit represented by formula (3).　Formula (1): [X-SiO3 / 2] In the formula, X represents a monovalent group having a carboxylic acid group.　Formula (2): [Y-SiO3 / 2] In the formula, Y represents a monovalent group having a polymerizable group.　Formula (3): [SiO3 / 2-M-(SiO3 / 2)n] In the formula, M represents an (n +1)-valent organic group. n represents an integer of 1 or more.

Description

Organopolysiloxane, composition, film, transfer film, pattern formation method

[0001] The present invention relates to organopolysiloxanes, compositions, films, transfer films, and pattern forming methods.

[0002] Recently, organopolysiloxanes have been applied to various applications such as protective films for touch panels as materials with excellent hard coating properties. For example, Patent Document 1 discloses a composition containing an organopolysiloxane having a predetermined structure with a carboxyl group and a radical polymerizable group, which can be applied to protective films for touch panels and the like.

[0003] Furthermore, a widely used method for forming resin patterns on a substrate is one that utilizes a transfer film having a temporary support and a photosensitive layer placed on the temporary support. In this pattern formation method using a transfer film, the photosensitive layer transferred from the transfer film onto a substrate is generally exposed and developed to form the resin pattern.

[0004] International Publication No. 2010 / 061744

[0005] In recent years, optical transmission has been considered as an alternative to conventional electrical wiring for power transmission, in order to further improve high-speed and high-density signal transmission between electronic elements and wiring boards. Furthermore, polymer optical waveguides are attracting attention as optical transmission paths connecting electronic elements and wiring boards due to their ease of processing, high degree of flexibility in placement, and ability to accommodate high-density mounting. A fundamental requirement for polymer optical waveguides is low optical loss.

[0006] The present inventors fabricated a transfer film using a composition containing the organopolysiloxane described in Patent Document 1 as the photosensitive layer and investigated its application to optical waveguides. They found that the formed patterns had significant and insufficient light loss, indicating the need for improvement to suppress light loss. They also found that there is room for further improvement in the pattern-forming performance of the organopolysiloxane (the ability to form a pattern-forming film through development and to achieve excellent pattern resolution).

[0007] Therefore, the object of the present invention is to provide an organopolysiloxane that has excellent pattern-forming performance and low light loss in the formed pattern. The object of the present invention is also to provide a composition, a film, a transfer film, and a pattern-forming method.

[0008] As a result of diligent research to solve the above problems, the inventors have found that the above problems can be solved by the following configuration.

[0009] [1] An organopolysiloxane comprising a repeating unit represented by formula (1) described later, a repeating unit represented by formula (2) described later, and a repeating unit represented by formula (3) described later. [2] The organopolysiloxane according to [1], further comprising a repeating unit represented by formula (4) described later. [3] The organopolysiloxane according to [1] or [2], wherein the polymerizable group is an acryloyl group or a methacryloyl group. [4] The organopolysiloxane according to any one of [1] to [3], wherein the above X represents a group represented by formula (X) described later. [5] The above L ＸThe organopolysiloxane according to [4], wherein the repeating unit represented by formula (1) is 5 to 30 mol% of the total repeating units of the organopolysiloxane, the repeating unit represented by formula (2) is 5 to 30 mol% of the total repeating units of the organopolysiloxane, the repeating unit represented by formula (3) is 1 to 15 mol% of the total repeating units of the organopolysiloxane, and the repeating unit represented by formula (4) is 25 to 89 mol% of the total repeating units of the organopolysiloxane. [7] The organopolysiloxane according to [2], wherein the content of repeating units represented by formula (1) is 7 to 20 mol% of the total repeating units of the organopolysiloxane, the content of repeating units represented by formula (2) is 8 to 15 mol% of the total repeating units of the organopolysiloxane, the content of repeating units represented by formula (3) is 3 to 10 mol% of the total repeating units of the organopolysiloxane, and the content of repeating units represented by formula (4) is 55 to 82 mol% of the total repeating units of the organopolysiloxane. [8] A composition comprising the organopolysiloxane according to any one of [1] to [7]. [9] A film formed from the composition according to [8].

[10] A transfer film having a temporary support and a photosensitive layer formed from the composition according to any one of [1] to [7].

[11] The transfer film according to

[10] , further comprising an intermediate layer between the temporary support and the photosensitive layer.

[12] A pattern forming method comprising: a bonding step of bonding the transfer film and the substrate together by bringing the surface of the photosensitive layer in the transfer film described in

[10] or

[11] opposite to the temporary support side into contact with the substrate, thereby forming a substrate with a photosensitive layer; an exposure step of exposing the photosensitive layer in a patterned manner; a developing step of developing the exposed photosensitive layer using a developer; and a step of peeling the temporary support from the substrate with the photosensitive layer between the bonding step and the exposure step, or between the exposure step and the developing step.

[13] The pattern forming method according to

[12] , wherein the developer is an alkaline developer.

[0010] According to the present invention, it is possible to provide an organopolysiloxane that has excellent pattern-forming performance and low light loss in the formed pattern. Furthermore, according to the present invention, compositions, films, transfer films, and pattern-forming methods can also be provided.

[0011] This is a schematic diagram showing an example of an embodiment of a transfer film.

[0012] The present invention will now be described in detail. The following descriptions of constituent elements may be based on representative embodiments of the present invention, but the present invention is not limited to such embodiments. The present invention will now be described in detail. In this specification, numerical ranges expressed using "~" mean ranges that include the numbers written before and after "~" as the lower and upper limits. In addition, in numerical ranges described stepwise in this specification, the upper or lower limit stated in one numerical range may be replaced with the upper or lower limit of another numerical range described stepwise. In addition, in numerical ranges described in this specification, the upper or lower limit stated in one numerical range may be replaced with the values ​​shown in the examples.

[0013] Furthermore, the term "process" as used in this specification includes not only independent processes, but also processes that cannot be clearly distinguished from other processes, as long as their intended purpose is achieved.

[0014] In this specification, unless otherwise specified, the temperature condition may be 25°C. For example, unless otherwise specified, the temperature when performing each of the above steps may be 25°C.

[0015] In this specification, "transparent" means that the average transmittance of visible light with a wavelength of 400 to 700 nm is 80% or more, and preferably 90% or more. Therefore, for example, "transparent resin layer" refers to a resin layer having an average transmittance of visible light with a wavelength of 400 to 700 nm of 80% or more. The average transmittance of visible light is a value measured using a spectrophotometer, and can be measured using, for example, a Hitachi, Ltd. U-3310 spectrophotometer.

[0016] In this specification, "active light" or "radiation" means, for example, the emission line spectra of mercury lamps such as g-rays, h-rays, and i-rays, far ultraviolet light represented by excimer lasers, extreme ultraviolet (EUV) light, X-rays, and electron beams (EB). Also, in this invention, "light" means active light or radiation.

[0017] In this specification, unless otherwise specified, "exposure" includes not only exposure using far ultraviolet, extreme ultraviolet, X-ray, and EUV light represented by mercury lamps and excimer lasers, but also drawing using particle beams such as electron beams and ion beams.

[0018] In this specification, unless otherwise specified, molecular weights where a molecular weight distribution exists are weight-average molecular weights. In this specification, the weight-average molecular weight of resins is the weight-average molecular weight obtained by gel permeation chromatography (GPC) on a polystyrene basis.

[0019] In this specification, "(meth)acrylic" is a concept that encompasses both acrylic and methacrylic, "(meth)acryloyl" is a concept that encompasses both acryloyl and methacryloyl, and "(meth)acrylate" is a concept that encompasses both acrylate and methacrylate.

[0020] In this specification, "water-soluble" means that the solubility in 100 g of water at a temperature of 22°C and pH 7.0 is 0.1 g or more. Therefore, for example, a water-soluble resin refers to a resin that satisfies the above-mentioned solubility conditions.

[0021] The "solid content" of a composition refers to the components that form the composition layer when the composition is used. If the composition contains a solvent (e.g., organic solvent and water), it refers to all components excluding the solvent. Furthermore, any liquid components that form the composition layer are also considered to be solid content.

[0022] In this specification, the bonding direction of divalent groups is not limited unless otherwise specified. For example, in a compound represented by the formula "X-Y-Z", if Y is -COO-, Y may also be -CO-O- or -O-CO-. Furthermore, the above compound may also be "X-CO-O-Z" or "X-O-CO-Z". In this specification, an organic group is intended to be a group containing at least one carbon atom.

[0023] In this specification, unless otherwise specified, the thickness of a layer (film thickness) is the average thickness measured using a scanning electron microscope (SEM) for thicknesses of 0.5 μm or more, and the average thickness measured using a transmission electron microscope (TEM) for thicknesses less than 0.5 μm. The above average thickness is the average thickness obtained by forming a section of the material to be measured using an ultramicrotome, measuring the thickness at any five points, and arithmetically averaging them.

[0024] [Organopolysiloxane] The organopolysiloxane of the present invention (hereinafter also referred to as the "specific compound") comprises a repeating unit represented by formula (1) (hereinafter also referred to as "repeating unit (1)"), a repeating unit represented by formula (2) (hereinafter also referred to as "repeating unit (2)"), and a repeating unit represented by formula (3) (hereinafter also referred to as "repeating unit (3)"). Formula (1) [X-SiO ３／２ In the formula, X represents a monovalent group having a carboxylic acid group. Formula (2) [Y-SiO ３／２ In the formula, Y represents a monovalent group having a polymerizable group. Formula (3) [SiO３／２ -M-(SiO ３／２ ) ｎ In the formula, M represents an n+1 valent organic group, and n represents an integer greater than or equal to 1.

[0025] The organopolysiloxane of the present invention having the above configuration exhibits excellent pattern-forming performance and low light loss in the formed pattern. The reason why the organopolysiloxane having the above configuration can solve the problems of the present invention is not necessarily clear, but the inventors speculate as follows. It should be noted that the mechanism by which the effect is obtained is not limited by the following speculation. In other words, even if the effect is obtained by a mechanism other than that described below, it is included in the scope of the present invention.

[0026] One of the distinctive features of the organopolysiloxane (specific compound) of the present invention is that it contains repeating units (3). When forming a pattern on a substrate using a transfer film having a temporary support and a composition layer containing the specific compound disposed on the temporary support, it is presumed that the inclusion of repeating units (3) in the specific compound makes it easier to suppress surface roughness of the composition layer after peeling off the temporary support (surface roughness caused by the components of the composition layer adhering to the temporary support and peeling off from the composition layer when the temporary support is peeled off). As a result, it is presumed that the formed pattern will have suppressed light scattering due to surface roughness, and that light loss will be kept to a minimum. Furthermore, it is presumed that suppressing surface roughness of the composition layer after peeling off the temporary support will also suppress a decrease in resolution due to poor exposure.

[0027] Hereinafter, the phrase "the effects of the present invention are superior" also refers to the superior pattern-forming performance of a specific compound (organopolysiloxane) and / or the reduced optical loss of the formed pattern.

[0028] The organopolysiloxane (specific compound) of the present invention will be described in detail below.

[0029] The organopolysiloxane (specific compound) of the present invention contains a repeating unit (repeating unit (1)) represented by formula (1), a repeating unit (repeating unit (2)) represented by formula (2), and a repeating unit (repeating unit (3)) represented by formula (3). The specific compound preferably further contains a repeating unit represented by formula (4) (hereinafter also referred to as "repeating unit (4)"). Hereinafter, the repeating units (1) to (4) will be described in detail.

[0030] <<Repeating Unit (1)>> The repeating unit (1) is a repeating unit represented by formula (1). Note that the repeating unit (1) corresponds to a so-called T unit. Formula (1) [X - SiO ３／２ In the formula, X represents a monovalent group having a carboxylic acid group.

[0031] In formula (1), X represents a monovalent group having a carboxylic acid group. The number of carboxylic acid groups in the monovalent group having a carboxylic acid group represented by X is not particularly limited, preferably 1 to 10, more preferably 1 to 6, and still more preferably 1 or 2.

[0032] The monovalent group having a carboxylic acid group represented by X preferably represents a group represented by formula (X). Formula (X) * - L Ｘ - (COOH)m In formula (X), L Ｘ represents a (m + 1)-valent hydrocarbon group which may have a substituent and may contain a hetero atom. m represents an integer of 1 or more. * represents a bonding position.

[0033] In formula (X), examples of the hetero atom include an oxygen atom, a sulfur atom, and a nitrogen atom.

[0034] As the hydrocarbon group, in terms of more excellent effects of the present invention, it is preferably an aliphatic hydrocarbon group. That is, L Ｘ preferably represents an aliphatic hydrocarbon group which may have a substituent and may contain a (m + 1)-valent hetero atom.

[0035] In formula (X), L ＸSpecific examples of m+1 valent hydrocarbon groups, which may have substituents and may contain heteroatoms, include the following groups: (when m is 1) When m is 1, L Ｘ This represents a divalent hydrocarbon group that may have substituents and may contain heteroatoms. Examples of such divalent hydrocarbon groups that may contain heteroatoms include -CH ２ At least one of the following is -O-, -S-, -SO ２ -, -NR Ｓ１ Examples include divalent aliphatic hydrocarbon groups that may be substituted with divalent linking groups selected from the group consisting of - and -CO-, divalent aromatic ring groups (divalent aromatic hydrocarbon groups and divalent aromatic heterocyclic groups), and groups formed by combinations thereof. Ｓ１ This represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

[0036] The above-mentioned divalent aliphatic hydrocarbon group may be linear, branched, or cyclic. Examples of divalent aliphatic hydrocarbon groups include alkylene groups, alkenylene groups, and alkylylene groups, with alkylene groups being preferred. The number of carbon atoms in the divalent aliphatic hydrocarbon group, which may be substituted with the above-mentioned divalent linking group, is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 12. The above-mentioned divalent aliphatic hydrocarbon group may further have substituents. Substituents are not particularly limited, but examples include aryl groups, hydroxyl groups, and halogen atoms.

[0037] Specific examples of divalent aliphatic hydrocarbon groups that may be substituted with the above-mentioned divalent linking group include -CH ２ - A linear or branched alkylene group having 1 to 20 carbon atoms (preferably 1 to 10 carbon atoms), in which at least one of the carbon atoms may be substituted with the above-mentioned divalent linking group, and -CH ２ Examples include cyclic alkylene groups having 6 to 20 carbon atoms (preferably 6 to 10 carbon atoms), in which at least one of the groups may be substituted with the divalent linking group described above. These alkylene groups may further have substituents. Examples of substituents include those exemplified as substituents that the divalent aliphatic hydrocarbon group described above may have.

[0038] Examples of the above-mentioned divalent aromatic ring group include a divalent aromatic hydrocarbon group and a divalent aromatic heterocyclic group, with the divalent aromatic hydrocarbon group being preferred. The number of carbon atoms in the above-mentioned divalent aromatic hydrocarbon group is preferably 6 to 20, more preferably 6 to 10, and even more preferably 6. Examples of the divalent aromatic hydrocarbon group include a divalent benzene ring group or a divalent naphthalene ring group, with the divalent benzene ring group being preferred. The above-mentioned divalent aromatic hydrocarbon group may further have substituents. The substituents are not particularly limited, but examples include alkyl groups, alkoxy groups, alkoxycarbonyl groups, acyloxy groups, hydroxyl groups, and halogen atoms.

[0039] Examples of divalent hydrocarbon groups that may contain the above heteroatoms include *-AL-*, *-AR-*, *-AL-O-AR-*, and *-(AL Ａ Examples include -O)p-AL-* and *-AR-CO-O-AR-*. AL represents an alkylene group having 1 to 10 carbon atoms (which may be linear, branched, or cyclic) and may have substituents. AL Ａ represents a linear or branched alkylene group having 1 to 4 carbon atoms, which may have substituents. AR represents a phenylene group, which may have substituents. AL and AL Ａ The substituents that AR may have are not particularly limited, and examples include the groups exemplified as substituents that the divalent aliphatic hydrocarbon group described above may have. The substituents that AR may have are not particularly limited, and examples include the groups exemplified as substituents that the divalent aromatic hydrocarbon group described above may have. p represents a number from 1 to 10. * represents the bond position.

[0040] (When m is 2 or greater) When m represents an integer of 2 or greater, L Ｘ Specific examples of m+1 valent hydrocarbon groups, which may have substituents and may contain heteroatoms, include a trivalent linking group represented by formula (X-A) and a tetravalent linking group represented by formula (X-B).

[0041]

[0042] In formula (X-A), M１１ is, >C(R Ｍ１ ) - Represents a trivalent cyclic aliphatic hydrocarbon group which may have substituents, a trivalent aromatic ring group which may have substituents (trivalent aromatic hydrocarbon group and trivalent aromatic heterocyclic group), a group represented by the following formula (MA), or a nitrogen atom. R Ｍ１ This represents a hydrogen atom or a monovalent organic group. １１ ~T １３ Each of these independently represents a divalent hydrocarbon group, which may have a single bond, a substituent, or a heteroatom. *1 represents the bond position with the silicon atom in formula (1). *2 represents the bond position with the carboxyl group.

[0043]

[0044] In the above formula (MA), * represents the bond position.

[0045] Examples of the above-mentioned trivalent cyclic aliphatic hydrocarbon group include a trivalent cycloalkyl ring group, with a trivalent cyclohexane ring group being preferred. The above-mentioned trivalent cyclic aliphatic hydrocarbon group may further have substituents. The substituents are not particularly limited, but examples include linear or branched alkyl groups, alkoxy groups, alkoxycarbonyl groups, acyloxy groups, hydroxyl groups, and halogen atoms.

[0046] Examples of the above-mentioned trivalent aromatic ring group include a trivalent aromatic hydrocarbon group and a trivalent aromatic heterocyclic group, with the trivalent aromatic hydrocarbon group being preferred. The number of carbon atoms in the above-mentioned trivalent aromatic hydrocarbon group is preferably 6 to 20, more preferably 6 to 10, and even more preferably 6. Examples of the trivalent aromatic hydrocarbon group include a trivalent benzene ring group or a divalent naphthalene ring group, with the trivalent benzene ring group being preferred. The above-mentioned trivalent aromatic hydrocarbon group may further have substituents. There are no particular limitations on substituents, but examples include alkyl groups, alkoxy groups, alkoxycarbonyl groups, acyloxy groups, hydroxyl groups, and halogen atoms.

[0047] R Ｍ１ R represents a hydrogen atom or a monovalent organic group. Ｍ１ R preferably represents a hydrogen atom. Ｍ１The monovalent organic group represented by is preferably a monovalent aliphatic hydrocarbon group or a monovalent aromatic hydrocarbon group, which may have substituents. The monovalent aliphatic hydrocarbon group may be linear, branched, or cyclic. The monovalent aliphatic hydrocarbon group is preferably an alkyl group. The number of carbon atoms in the monovalent aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, even more preferably 1 to 12, and particularly preferably 1 to 6. The above monovalent aliphatic hydrocarbon group may further have substituents. Substituents are not particularly limited, but examples include aryl groups, hydroxyl groups, and halogen atoms.

[0048] The number of carbon atoms in the monovalent aromatic hydrocarbon group is preferably 6 to 20, more preferably 6 to 10, and even more preferably 6. Examples of monovalent aromatic hydrocarbon groups include monovalent benzene ring groups or monovalent naphthalene ring groups, with monovalent benzene ring groups being preferred. The monovalent aromatic hydrocarbon group may further have substituents. Substituents are not particularly limited, but examples include alkyl groups, alkoxy groups, alkoxycarbonyl groups, acyloxy groups, hydroxyl groups, and halogen atoms.

[0049] M １１ In terms of the superior effects of the present invention, >C(R Ｍ１ It is preferable to represent it as ).

[0050] T １１ ~T １３ A divalent hydrocarbon group represented by the above formula (X) may have substituents and may contain heteroatoms, is L when m is 1. Ｘ This is synonymous with the group represented by , and the preferred embodiment is also the same. １１ ~T １３ The divalent hydrocarbon group represented by may have substituents and may contain heteroatoms is more preferably a linear or branched alkylene group having 1 to 10 carbon atoms, which may have substituents, and even more preferably a linear or branched alkylene group having 1 to 6 carbon atoms, which may have substituents. The substituents are not particularly limited, for example, L in formula (X) above. ＸExamples of substituents that the divalent aliphatic hydrocarbon group represented by may have include the groups shown.

[0051] In formula (X-B), M ２１ represents >C<, a substituted tetravalent cyclic aliphatic hydrocarbon group, or a substituted tetravalent aromatic ring group (a tetravalent aromatic hydrocarbon group and a tetravalent aromatic heterocyclic group). ２１ ~T ２４ Each of these independently represents a divalent hydrocarbon group, which may have a single bond, a substituent, or a heteroatom. *1 represents the bond position with the silicon atom in formula (1). *2 represents the bond position with the carboxyl group.

[0052] Examples of the above-mentioned tetravalent cyclic aliphatic hydrocarbon group include tetravalent cycloalkyl ring groups, with tetravalent cyclohexane ring groups being preferred. The above-mentioned tetravalent cyclic aliphatic hydrocarbon group may further have substituents. The substituents are not particularly limited, but examples include linear or branched alkyl groups, alkoxy groups, alkoxycarbonyl groups, acyloxy groups, hydroxyl groups, and halogen atoms.

[0053] Examples of the above-mentioned tetravalent aromatic ring group include tetravalent aromatic hydrocarbon groups and tetravalent aromatic heterocyclic groups, with tetravalent aromatic hydrocarbon groups being preferred. The number of carbon atoms in the above-mentioned tetravalent aromatic hydrocarbon group is preferably 6 to 20, more preferably 6 to 10, and even more preferably 6. Examples of the tetravalent aromatic hydrocarbon group include tetravalent benzene ring groups or tetravalent naphthalene ring groups, with tetravalent benzene ring groups being preferred. The above-mentioned tetravalent aromatic hydrocarbon group may further have substituents. The substituents are not particularly limited, but examples include alkyl groups, alkoxy groups, alkoxycarbonyl groups, acyloxy groups, hydroxyl groups, and halogen atoms.

[0054] T ２１ ~T ２４ A divalent hydrocarbon group represented by may have substituents and may contain heteroatoms, T １１ ~T １３ This is synonymous with a divalent hydrocarbon group, which may have substituents and may contain heteroatoms, and the preferred embodiments are the same.

[0055] The repeating unit (1) may be used alone or in combination of two or more types. The content of the repeating unit (1) is preferably 1 to 50 mol%, more preferably 5 to 30 mol%, and even more preferably 7 to 20 mol%, relative to the total repeating units (100 mol%) of the specific compound.

[0056] <<Repeating Unit (2)>> Repeating unit (2) is a repeating unit represented by formula (2). Repeating unit (2) corresponds to the so-called T unit. Repeating unit (2) is a different repeating unit from repeating unit (1) described above. It is preferable that repeating unit (2) does not contain a carboxyl group.

[0057] Formula (2) [Y-SiO ３／２ In the formula, Y represents a monovalent group having a polymerizable group.

[0058] The type of polymerizable group represented by Y is not particularly limited, and examples include radical polymerizable groups and cationic polymerizable groups. Examples of radical polymerizable groups include acryloyl groups, methacryloyl groups, vinyl groups, styryl groups, and allyl groups. Examples of cationic polymerizable groups include oxyranyl groups and oxetanyl groups. Acryloyl groups or methacryloyl groups are preferred as polymerizable groups in terms of superior effects of the present invention.

[0059] The number of polymerizable groups in a monovalent group having polymerizable groups represented by Y is not particularly limited, but is preferably 1 to 10, more preferably 1 to 6, even more preferably 1 or 2, and particularly preferably 1.

[0060] The monovalent group having a polymerizable group represented by Y is preferably represented by the group represented by formula (Y). Formula (Y) *-L Ｙ -P Ｙ In formula (Y), L Ｙ This represents a divalent hydrocarbon group that may have substituents and may contain heteroatoms. Ｙ * represents a polymerizable group. * represents a bond position.

[0061] In formula (Y), L ＹA divalent hydrocarbon group represented by the above formula (X) may have substituents and may contain heteroatoms, is L when m is 1. Ｘ This is synonymous with the group represented by L, and the preferred embodiment is also the same. Ｙ Examples of divalent hydrocarbon groups that may contain heteroatoms represented by include *-AL-*, *-AL-O-*, and *-AL-O-AL-*. AL represents a C1-C10 alkylene group (which may be linear, branched, or cyclic) that may have substituents. The substituents that AL may have are not particularly limited and include, for example, the groups exemplified as substituents that the above-mentioned divalent aliphatic hydrocarbon groups may have. * represents the bond position.

[0062] P in equation (Y) Ｙ Examples of polymerizable groups represented by include those similar to those described above.

[0063] The repeating unit (2) may be used alone or in combination of two or more types. The content of the repeating unit (2) is preferably 1 to 50 mol%, more preferably 5 to 30 mol%, and even more preferably 8 to 15 mol%, relative to the total repeating units (100 mol%) of the specific compound.

[0064] <<Repeating Unit (3)>> Repeating unit (3) is a repeating unit represented by equation (3). Note that repeating unit (3) has n+1 T units. Repeating unit (3) is a different repeating unit from repeating unit (1) and repeating unit (2) described above.

[0065] Formula (3) [SiO ３／２ -M-(SiO ３／２ ) ｎ In the formula, M represents an n+1 valent organic group, and n represents an integer greater than or equal to 1.

[0066] In equation (3), n represents an integer greater than or equal to 1. There is no particular upper limit to n, for example, it is 6 or less. n is preferably 1 to 3, and more preferably 1 or 2.

[0067] In formula (3), specific examples of the n+1 valent organic group represented by M include the following groups: (When n is 1) When n is 1, M represents a divalent organic group. Divalent organic groups include divalent hydrocarbon groups that may have substituents and may contain heteroatoms, and *-Si(R Ｓ２ ) ２ Examples include groups represented by -O-*. A specific example of a divalent hydrocarbon group represented by M, which may have substituents and may contain heteroatoms, is L when m is 1 in the above formula (X). Ｘ This is synonymous with the base represented by , and the preferred embodiment is also the same.

[0068] *-Si(R Ｓ２ ) ２ In a group represented by -O-*, R Ｓ２ R represents a monovalent organic group. Ｓ２ The monovalent organic group represented by is preferably an alkyl group, more preferably an alkyl group having 1 to 6 carbon atoms, and even more preferably a methyl group or an ethyl group.

[0069] Among the divalent organic groups represented by M, -CH ２ At least one of the following is -O-, -S-, -SO ２ -, -NR Ｓ１ A linear or branched alkylene group having 1 to 20 carbon atoms (preferably 1 to 10 carbon atoms), which may be substituted with a divalent linking group selected from the group consisting of - and -CO-, -CH ２ A cyclic alkylene group having 6 to 20 carbon atoms (preferably 6 to 10 carbon atoms), in which at least one of the - is substituted with the above-mentioned divalent linking group, or *-Si(R Ｓ１ ) ２ -O-* is preferred. The alkylene group may have further substituents. As substituents, the above L Ｘ Examples of substituents that the divalent aliphatic hydrocarbon group represented by may have include the groups shown.

[0070] (When n is 2 or greater) When n represents an integer of 2 or greater, specific examples of an n+1 valent organic group represented by M include the trivalent linking group represented by formula (X-A) and the tetravalent linking group represented by formula (X-B) as described above. However, *1 and *2 in the trivalent linking group represented by formula (X-A) and the tetravalent linking group represented by formula (X-B) represent the bonding positions with the silicon atom in formula (3).

[0071] The repeating unit (3) may be used alone or in combination of two or more types. The content of the repeating unit (3) is preferably 1 to 20 mol%, more preferably 1 to 15 mol%, and even more preferably 3 to 10 mol%, relative to the total repeating units (100 mol%) of the specific compound.

[0072] <<Repeating Unit (4)>> Repeating unit (4) is a repeating unit represented by formula (4). Repeating unit (4) is a different repeating unit from repeating unit (1), repeating unit (2), and repeating unit (3) described above. It is preferable that repeating unit (4) does not contain a carboxyl group. It is also preferable that repeating unit (4) does not contain a polymerizable group.

[0073] Formula (4) [Z-SiO ３／２ Z represents a monovalent hydrocarbon group, which may have substituents.

[0074] Examples of monovalent hydrocarbon groups represented by Z include monovalent aliphatic hydrocarbon groups and monovalent aromatic hydrocarbon groups.

[0075] The monovalent aliphatic hydrocarbon group described above may be linear, branched, or cyclic. Examples of monovalent aliphatic hydrocarbon groups include alkyl groups, alkenyl groups, and alkynyl groups, with alkyl groups being preferred. The number of carbon atoms in the monovalent aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, even more preferably 1 to 12, and particularly preferably 1 to 6. The monovalent aliphatic hydrocarbon group may further have substituents. Substituents are not particularly limited, but examples include aryl groups, hydroxyl groups, and halogen atoms.

[0076] The number of carbon atoms in the monovalent aromatic hydrocarbon group is preferably 6 to 20, more preferably 6 to 10, and even more preferably 6. Examples of monovalent aromatic hydrocarbon groups include phenyl groups and naphthyl groups, with phenyl groups being preferred. The monovalent aromatic hydrocarbon group may further have substituents. Substituents are not particularly limited, but examples include alkyl groups, alkoxy groups, alkoxycarbonyl groups, acyloxy groups, hydroxyl groups, and halogen atoms.

[0077] The repeating unit (4) may be used alone or in combination of two or more types. The content of the repeating unit (4) is preferably 20 to 89 mol%, more preferably 25 to 89 mol%, and more preferably 55 to 82 mol%, relative to the total repeating units (100 mol%) of the specific compound.

[0078] The content of repeating unit (1), repeating unit (2), repeating unit (3), and repeating unit (4) relative to the total repeating units (100 mol%) of a specific compound is, for example, ２９ Si-NMR and １ It can be measured using 1H-NMR (nuclear magnetic resonance analysis).

[0079] Examples of specific compound structures include irregular forms such as random structures, ladder structures, cage structures (fully condensed cage structures), and incomplete cage structures (partially cleaved cage structures in which some silicon atoms are missing from the cage structure, and structures in which some silicon-oxygen bonds in the cage structure are broken).

[0080] The weight-average molecular weight of the specific compound is preferably 3,000 to 1,000,000, more preferably 5,000 to 500,000, and even more preferably 5,000 to 50,000.

[0081] The method for producing the specific compound is not particularly limited. For example, it can be produced by hydrolyzing and condensing raw materials containing a repeating unit (1), a repeating unit (2), a repeating unit (3), and optionally a repeating unit (4), by hydrolysis condensation.

[0082] [Composition] The composition of the present invention contains specific compounds. The specific compounds are described below.

[0083] [Specific Compounds] The specific compounds are as described above. The specific compounds may be used individually or in combination of two or more. The content of the specific compounds (total content if multiple types are included) is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more, based on the total solid content of the composition. The upper limit is preferably 100% by mass or less, more preferably 90% by mass or less, and even more preferably 85% by mass or less.

[0084] [Polymerization Initiator] The composition may also preferably contain a polymerization initiator (preferably a photopolymerization initiator). The photopolymerization initiator may be a photoradical polymerization initiator, a photocationic polymerization initiator, or a photoanionic polymerization initiator, but it is preferably a photoradical polymerization initiator.

[0085] There are no particular restrictions on the photopolymerization initiator, and known photopolymerization initiators can be used. The photopolymerization initiator is preferably one or more selected from the group consisting of oxime ester compounds (photopolymerization initiators having an oxime ester structure) and aminoacetophenone compounds (photopolymerization initiators having an aminoacetophenone structure), and it is more preferable to include both compounds. When both compounds are included, the content of the oxime ester compound relative to the total content of both compounds is preferably 5 to 90% by mass, and more preferably 15 to 50% by mass. Furthermore, other photopolymerization initiators may be used in combination, such as hydroxyacetophenone compounds, acylphosphine oxide compounds, and bistriphenylimidazole compounds.

[0086] Furthermore, as photopolymerization initiators, for example, those described in paragraphs 0031 to 0042 of Japanese Patent Publication No. 2011-095716 and paragraphs 0064 to 0081 of Japanese Patent Publication No. 2015-014783 may be used.

[0087] Specific examples of photopolymerization initiators include the following: Oxime ester compounds include, for example, 1,2-octanedione,1-[4-(phenylthio)phenyl-,2-(O-benzoyl oxime)] (trade name: IRGACURE OXE-01, IRGACURE series are BASF products), etanone,1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-,1-(O-acetyloxime) (trade name: IRGACURE OXE-02, manufactured by BASF), [8-[5-(2,4,6-trimethylphenyl)-11-(2-ethylhexyl)-11H-benzo[a]carbazoyl][2-(2,2,3,3-tetrafluoropropoxy)phenyl]methanone-(O-acetyloxime) (trade name: IRGACURE OXE-03 (manufactured by BASF), 1-[4-[4-(2-benzofuranylcarbonyl)phenyl]thio]phenyl]-4-methylpentanone-1-(O-acetyloxime) (trade name: IRGACURE OXE-04 (manufactured by BASF), and trade name: Lunar 6. Examples include 1-[4-(phenylthio)phenyl]-3-cyclopentylpropane-1,2-dione-2-(O-benzoyl oxime) (product name: TR-PBG-305, manufactured by Changzhou Strong Electronic Materials Co., Ltd.), 1,2-propanedione,3-cyclohexyl-1-[9-ethyl-6-(2-furanylcarbonyl)-9H-carbazole-3-yl]-,2-(O-acetyloxime) (product name: TR-PBG-326, manufactured by Changzhou Strong Electronic Materials Co., Ltd.), and 3-cyclohexyl-1-(6-(2-(benzoyloxyimino)hexanoyl)-9-ethyl-9H-carbazole-3-yl)-propane-1,2-dione-2-(O-benzoyl oxime) (product name: TR-PBG-391, manufactured by Changzhou Strong Electronic Materials Co., Ltd.).Examples of aminoacetophenone compounds include 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (trade name: Omnirad 379EG, the Omnirad series is a product of IGM Resins B.V.), 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (trade name: Omnirad 907), and APi-307 (1-(biphenyl-4-yl)-2-methyl-2-morpholinopropan-1-one, manufactured by Shenzhen UV-ChemTech Ltd.). Other photopolymerization initiators include, for example, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one (trade name: Omnirad 127), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 (trade name: Omnirad 369), 2-hydroxy-2-methyl-1-phenyl-propan-1-one (trade name: Omnirad 1173), 1-hydroxy-cyclohexyl-phenyl-ketone (trade name: Omnirad 184), 2,2-dimethoxy-1,2-diphenylethane-1-one (trade name: Omnirad 651), and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: Omnirad TPO). Examples include H), and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (trade name: Omnirad 819).

[0088] If the composition contains a polymerization initiator (preferably a photopolymerization initiator) (or the total content if multiple types are included), the content is preferably 0.1 to 15% by mass, and more preferably 0.5 to 10% by mass, based on the total solid content of the composition. The polymerization initiator may be used alone or in combination of two or more types.

[0089] [Polymerizable Compounds] The composition may also preferably contain polymerizable compounds. Note that polymerizable compounds are compounds different from the specified compounds.

[0090] The polymerizable compound is preferably a compound with a molecular weight (or weight-average molecular weight if it has a molecular weight distribution) of less than 5,000, and is also preferably a polymerizable monomer.

[0091] A polymerizable compound is a polymerizable compound having one or more polymerizable groups (for example, 1 to 15 groups) in one molecule. Examples of polymerizable groups include ethylenically unsaturated groups, such as (meth)acryloyl groups, vinyl groups, and styryl groups, with (meth)acryloyl groups being preferred. It is preferable that the polymerizable compound contains a polymerizable compound with two or more functions. Here, a polymerizable compound with two or more functions means a polymerizable compound having two or more polymerizable groups (for example, 2 to 15 groups) in one molecule. It is preferable that the composition contains a bifunctional polymerizable compound and a polymerizable compound with three or more functions.

[0092] A preferred embodiment of a bifunctional polymerizable compound is the compound represented by formula (M) (hereinafter also referred to as "compound M"). ２ -R １ - Q １ Formula (M) In formula (M), Q １ and Q ２ Each of these independently represents a (meth)acryloyloxy group. １ This represents a divalent linking group having a chain-like structure.

[0093] Q １ and Q ２ They may be the same or different, but in terms of ease of synthesis, Q １ and Q ２ It is preferable that they are the same group. １ Examples include divalent hydrocarbon groups and alkylene oxides of divalent hydrocarbon groups (-L １ -O-) Adducts include divalent hydrocarbon groups having 6 to 20 carbon atoms, or alkylene oxides of divalent hydrocarbon groups (-L １An adduct with (-O-) is preferred. The divalent hydrocarbon group may have a chain structure at least in part. As the part other than the chain structure, for example, it may be any of a branched chain structure, a cyclic structure, or a linear alkylene group having 1 to 20 carbon atoms, an arylene group, an ether bond, and combinations thereof. An alkylene group or a group combining two or more alkylene groups and one or more arylene groups is preferred. As the alkylene oxide adduct of the divalent hydrocarbon group, an alkyleneoxyalkylene group (-L １ -O-L １ -), a polyalkyleneoxyalkylene group (-(L １ -O) ｐ -L １ -), and an alkylene oxide adduct of a divalent hydrocarbon group other than the polyalkyleneoxyalkylene group can be mentioned. Here, each of the above L １ represents an alkylene group independently, and an ethylene group, a propylene group, or a butylene group is preferred, and an ethylene group or a 1,2-propylene group is more preferred. p represents an integer of 2 or more, and is preferably an integer of 10 to 30.

[0094] Also, the number of atoms in the shortest linking chain connecting Q １ and Q[[ID=IS]] ２ in compound M is preferably 20 to 150, more preferably 30 to 120, and even more preferably 40 to 90. In this specification, "the number of atoms in the shortest linking chain connecting Q １ and Q ２ " means the shortest number of atoms connecting from the atom in R １ connected to Q １ to the atom in R ２ connected to Q １ .

[0095] Examples of compound M include 1,6-hexanediol di(meth)acrylate, 1,7-heptanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 1,4-cyclohexanediol di(meth)acrylate, di(meth)acrylate of bisphenol A or hydrogenated bisphenol A and its ethylene oxide / propylene oxide adduct, di(meth)acrylate of bisphenol F or hydrogenated bisphenol F and its ethylene oxide / propylene oxide adduct, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, poly(ethylene glycol / propylene glycol) di(meth)acrylate, and polybutylene glycol di(meth)acrylate. Other examples include tricyclodecanedimethanol diacrylate, tricyclodecanedimethanol di(meth)acrylate, fluorene structure-containing (meth)acrylate, and epoxy (meth)acrylate. The above ester monomers can also be used as mixtures.

[0096] More specifically, examples of bifunctional polymerizable compounds include tricyclodecanedimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), tricyclodecanedimethanol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), and fluorene structure-containing (meth)acrylates (OGSOL EA-F5710, OGSOL EA-0300, and OGSOL GA-2800, all manufactured by Osaka Gas Chemical Co., Ltd.).

[0097] There are no particular restrictions on the polymerizable compounds with three or more functions, and they can be appropriately selected from known compounds. Examples of polymerizable compounds with three or more functions include dipentaerythritol (tri / tetra / penta / hexa)(meth)acrylate, pentaerythritol (tri / tetra)(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, isocyanuric acid (meth)acrylate, and (meth)acrylate compounds with a glycerin tri(meth)acrylate skeleton.

[0098] Here, "(tri / tetra / penta / hexa)(meth)acrylate" is a concept that encompasses tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate, while "(tri / tetra)(meth)acrylate" is a concept that encompasses tri(meth)acrylate and tetra(meth)acrylate.

[0099] Polymerizable compounds include urethane (meth)acrylates. The lower limit of the number of functional groups is more preferably 6 or more, and even more preferably 8 or more. The upper limit of the number of functional groups is, for example, 20 or less. Examples of urethane (meth)acrylates include urethane di(meth)acrylates, such as propylene oxide-modified urethane di(meth)acrylates and ethylene oxide and propylene oxide-modified urethane di(meth)acrylates. In addition, urethane (meth)acrylates with three or more functional groups are also included. Examples of urethane (meth)acrylates with three or more functionalities include 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.), UA-32P, U-15HA, and UA-1100H (all manufactured by Shin Nakamura Chemical Industry Co., Ltd.), AH-600 (product name) manufactured by Kyoeisha Chemical Co., Ltd., UA-306H, UA-306T, UA-306I, UA-510H, and UX-5000 (all manufactured by Nippon Kayaku Co., Ltd.).

[0100] Other preferred embodiments of polymerizable compounds include ethylenically unsaturated compounds having acidic groups. Examples of acidic groups include phosphoric acid groups, sulfo groups, and carboxyl groups, with carboxyl groups being preferred. Examples of ethylenically unsaturated compounds having acidic groups include tri- to tetrafunctional ethylenically unsaturated compounds having acidic groups [pentaerythritol tri- and tetraacrylate (PETA) skeletons with carboxyl groups introduced (acid value: 80-120 mg KOH / g)] and quintuple- to hexafunctional ethylenically unsaturated compounds having acidic groups [dipentaerythritol penta- and hexaacrylate (DPHA) skeletons with carboxyl groups introduced (acid value: 25-70 mg KOH / g)]. These tri- or more functional ethylenically unsaturated compounds having acidic groups may be used in combination with bifunctional ethylenically unsaturated compounds having acidic groups as needed. Examples of bifunctional or ethylenically unsaturated compounds having a carboxyl group include Arronix® TO-2349 (manufactured by Toagosei Co., Ltd.), Arronix® M-520 (manufactured by Toagosei Co., Ltd.), and Arronix® M-510 (manufactured by Toagosei Co., Ltd.).

[0101] As ethylenically unsaturated compounds having acidic groups, polymerizable compounds having acidic groups as described in paragraphs

[0025] to

[0030] of Japanese Patent Application Publication No. 2004-239942 are preferred, and the details thereof are incorporated herein.

[0102] The weight-average molecular weight (Mw) of the polymerizable compound is preferably 200 to 3000, more preferably 250 to 2600, and even more preferably 280 to 2200.

[0103] If the composition contains polymerizable compounds, the content of polymerizable compounds (or the total content if multiple types are included) is preferably 3 to 70% by mass, more preferably 10 to 70% by mass, and particularly preferably 20 to 55% by mass, based on the total solid content of the composition.

[0104] [Surfactants] The composition may contain surfactants. Examples of surfactants include anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants, with nonionic surfactants being preferred. Examples of nonionic surfactants include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkylphenyl ethers, higher fatty acid diesters of polyoxyethylene glycol, silicone surfactants, and fluorine-based surfactants.

[0105] As surfactants, for example, the surfactants described in paragraphs 0120 to 0125 of International Publication No. 2018 / 179640 can also be used. Furthermore, as surfactants, the surfactants described in paragraph 0017 of Japanese Patent Publication No. 4502784 and paragraphs 0060 to 0071 of Japanese Unexamined Patent Publication No. 2009-237362 can also be used. A commercially available fluorine-based surfactant is, for example, Megafac. F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-475, F-477, F-479 , F-482, F-551-A, F-552, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, F-565, F -563, F-568, F-575, F-780, EXP, MFS-330, MFS-578, MFS-579, MFS-586, MFS-587, R-41, R-41-LM, R-01, R-40, R-40-LM, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (all manufactured by DIC Corporation), Florard FC430, FC431, FC171 (all manufactured by Sumitomo 3M Co., Ltd.), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA Corporation), Futergent Examples include 710FL, 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F, 251, 212M, 250, 209F, 222F, 208G, 710LA, 710FS, 730LM, 650AC, 681, and 683 (all manufactured by NEOS Corporation). In addition, acrylic compounds having a molecular structure with a functional group containing a fluorine atom, in which the fluorine atom-containing functional group is cleaved and the fluorine atom volatilizes when heated, can also be suitably used as fluorine-based surfactants. Examples of such fluorine-based surfactants include the MegaFac DS series manufactured by DIC Corporation (Chemical Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016)), for example, MegaFac DS-21.Furthermore, as a fluorinated surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound. Block polymers can also be used as fluorinated surfactants. In addition, fluorinated polymer compounds containing repeating units derived from a (meth)acrylate compound having a fluorine atom and repeating units derived from a (meth)acrylate compound having two or more (preferably five or more) alkylene oxy groups (preferably ethylene oxy groups, propylene oxy groups) can also be used as fluorinated surfactants. Furthermore, fluorinated polymers having ethylenically unsaturated bond-containing groups in their side chains can also be used as fluorinated surfactants. Examples include Megafac RS-101, RS-102, RS-718K, RS-72-K (all manufactured by DIC Corporation).

[0106] As for fluorine-based surfactants, from the viewpoint of improving environmental suitability, it is preferable that the surfactant is derived from a substitute material for compounds having a linear perfluoroalkyl group with 7 or more carbon atoms, such as perfluorooctanoic acid (PFOA) and perfluorooctanesulfonic acid (PFOS). Nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane and their ethoxylates and propoxylates (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid esters, Pluronic® L10, L31, L61, L62, 10R5, 17R2, 25R2 (all manufactured by BASF), Tetronic 304, 701, 704, 901, 904, 150R1 (all manufactured by BASF), and Solspers. Examples include 20000 (manufactured by Lubrizol Nippon Co., Ltd.), NCW-101, NCW-1001, NCW-1002 (manufactured by Fujifilm Wako Pure Chemical Industries Ltd.), Paionin D-6112, D-6112-W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), Orfin E1010, Surfinol 104, 400, 440 (manufactured by Nisshin Chemical Industry Co., Ltd.), etc.

[0107] Examples of silicone-based surfactants include linear polymers composed of siloxane bonds, and modified siloxane polymers in which organic groups have been introduced into the side chains or terminals.

[0108] Specific examples of surfactants include DOWSIL 8032 ADDITIVE, Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, Toray Silicone SH8400 (all manufactured by Toray Dow Corning Co., Ltd.), as well as X-22-4952, X-22-4272, X-22-6266, KF-351A, K354L, KF-355A, KF- Examples include 945, KF-640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-341, KF-6001, KF-6002 (all manufactured by Shin-Etsu Silicone Co., Ltd.), F-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), BYK307, BYK323, BYK330 (all manufactured by Bic Chemie), etc.

[0109] The surfactant content (total content if multiple types are included) is preferably 0.0001 to 10% by mass, more preferably 0.001 to 5% by mass, and even more preferably 0.005 to 3% by mass, relative to the total solid content of the composition. The surfactant may be used alone or in combination of two or more types.

[0110] [Solvent] The composition may also preferably contain a solvent. The solvent is not particularly limited as long as it can dissolve or disperse each component other than the solvent, and known solvents can be used. Specifically, organic solvents are preferred. Examples of organic solvents include methyl ethyl ketone, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate (also known as 1-methoxy-2-propyl acetate), diethylene glycol ethyl methyl ether, cyclohexanone, methyl isobutyl ketone, ethyl lactate, methyl lactate, caprolactam, n-propanol, and 2-propanol. In addition, if necessary, organic solvents with a boiling point of 180 to 250°C (high-boiling point solvents) can also be used as the solvent.

[0111] The solvent may be used alone or in combination of two or more types. The solvent content in the composition is preferably 20 to 95% by mass, more preferably 60 to 95% by mass, and even more preferably 70 to 95% by mass, based on the total mass of the composition.

[0112] [Other Additives] The composition may contain other additives as needed. Examples of other additives include polymerization inhibitors, chain transfer agents, antioxidants, plasticizers, sensitizers, heterocyclic compounds, and alkoxysilane compounds. Examples of polymerization inhibitors, plasticizers, sensitizers, heterocyclic compounds, and alkoxysilane compounds are those described in paragraphs 0097 to 0119 of International Publication No. 2018 / 179640. Additives contained in the compositions described in Japanese Patent Publication No. 2024-052274, Japanese Patent Publication No. 2022-185008, Japanese Patent Publication No. 2024-034089, and International Publication No. 2023 / 119998 can also be referenced.

[0113] The composition may also further contain known additives such as rust inhibitors, metal oxide particles, dispersants, acid growth agents, development accelerators, conductive fibers, colorants, thermal radical polymerization initiators, thermal acid generators, ultraviolet absorbers, thickeners, and organic or inorganic precipitation inhibitors. Preferred embodiments of these components are described in paragraphs 0165 to 0184 of Japanese Patent Application Publication No. 2014-085643, and the contents of this publication are incorporated herein by reference.

[0114] [Transfer Film] The transfer film of the present invention comprises a temporary support and a composition layer formed from the above-described composition (hereinafter also referred to as the "photosensitive layer"). The transfer film may also have other layers besides the temporary support and the photosensitive layer. Examples of other layers include an intermediate layer and a thermoplastic resin layer. The transfer film may also have a protective film (hereinafter also referred to as the "cover film") on the photosensitive layer. Examples of the layer configuration of the transfer film of the present invention include "temporary support / intermediate layer / photosensitive layer / protective film", "temporary support / photosensitive layer / protective film", and "temporary support / thermoplastic resin layer / intermediate layer / photosensitive layer / protective film".

[0115] Figure 1 is a schematic diagram showing an example of an embodiment of the transfer film of the present invention. The transfer film 10 shown in Figure 1 has a temporary support 1, a photosensitive layer 3, and a protective film 5 in that order. Although the transfer film 10 shown in Figure 1 has the protective film 5 in place, the protective film 5 is not required. Furthermore, an intermediate layer may be included between the temporary support 1 and the photosensitive layer 3. The constituent members of the transfer film of the present invention will be described below.

[0116] <Temporary Support> The transfer film has a temporary support. The temporary support is a member that supports the photosensitive layer and is ultimately removed by a peeling process. The temporary support may have either a single-layer structure or a multi-layer structure. The temporary support is preferably a film, and more preferably a resin film. A film that is flexible and does not undergo significant deformation, shrinkage, or elongation under pressure, or under pressure and heat, is also preferred as a temporary support. Examples of the above films include polyethylene terephthalate film (e.g., biaxially oriented polyethylene terephthalate film), polymethyl methacrylate film, cellulose triacetate film, polystyrene film, polyimide film, and polycarbonate film, with polyethylene terephthalate film being preferred. It is also preferable that the temporary support does not have deformation such as wrinkles or scratches. The thickness of the temporary support is preferably 5 to 200 μm, more preferably 5 to 150 μm, even more preferably 5 to 50 μm, and particularly preferably 5 to 35 μm in terms of ease of handling and versatility.

[0117] Examples of temporary supports include a biaxially oriented polyethylene terephthalate film with a thickness of 16 μm, a biaxially oriented polyethylene terephthalate film with a thickness of 12 μm, and a biaxially oriented polyethylene terephthalate film with a thickness of 9 μm.

[0118] Examples of provisional supports include those described in paragraphs 0017-0018 of Japanese Patent Publication No. 2014-085643, paragraphs 0019-0026 of Japanese Patent Publication No. 2016-027363, paragraphs 0041-0057 of International Publication No. 2012 / 081680, and paragraphs 0029-0040 of International Publication No. 2018 / 179370, the contents of which are incorporated herein by reference.

[0119] <Photosensitive Layer> The transfer film has a photosensitive layer. The photosensitive layer is a composition layer (film) formed from the composition of the present invention described above, and contains an organopolysiloxane. The photosensitive layer preferably contains a photopolymerization initiator, and more preferably contains a photopolymerization initiator and a polymerizable compound. The thickness of the photosensitive layer is preferably, for example, 1.0 to 50 μm, more preferably 1.0 to 30 μm, even more preferably 1.0 to 10 μm, and particularly preferably 1.0 to 5.0 μm.

[0120] <Intermediate Layer> As the intermediate layer, a water-soluble resin layer containing a water-soluble resin can be used. Alternatively, as the intermediate layer, an oxygen barrier layer with oxygen barrier function, as described as a "separation layer" in Japanese Patent Publication No. 5-072724, can also be used. The oxygen barrier layer used as the intermediate layer may be appropriately selected from known layers described in the above publication, etc. Among these, an oxygen barrier layer that exhibits low oxygen permeability and disperses or dissolves in water or an alkaline aqueous solution (a 1% by mass aqueous solution of sodium carbonate at 22°C) is preferred.

[0121] The following describes the various components that may be included in the intermediate layer (water-soluble resin layer).

[0122] <Water-soluble resin> The intermediate layer contains a resin. The resin contains a water-soluble resin as part or all of it. Examples of resins that can be used as water-soluble resins include polyvinyl alcohol-based resins, polyvinylpyrrolidone-based resins, cellulose-based resins, acrylamide-based resins, polyethylene oxide-based resins, gelatin, vinyl ether-based resins, polyamide resins, and copolymers thereof. Copolymers of (meth)acrylic acid / vinyl compounds can also be used as water-soluble resins. As the copolymer of (meth)acrylic acid / vinyl compounds, copolymers of (meth)acrylic acid / (meth)acrylate are preferred, and copolymers of methacrylic acid / methacrylate are more preferred. When the water-soluble resin is a copolymer of (meth)acrylic acid / vinyl compounds, the composition ratio (mol%) is preferably, for example, 90 / 10 to 20 / 80, and more preferably 80 / 20 to 30 / 70.

[0123] The lower limit of the weight-average molecular weight of the water-soluble resin is preferably 5,000 or more, more preferably 7,000 or more, and even more preferably 10,000 or more. The upper limit is preferably 200,000 or less, more preferably 100,000 or less, and even more preferably 50,000 or less. The degree of dispersion (Mw / Mn) of the water-soluble resin is preferably 1 to 10, and more preferably 1 to 5.

[0124] Furthermore, in order to further improve the ability to suppress interlayer mixing in the intermediate layer, it is preferable that the resin contained in the intermediate layer is different from the resin contained in the layers arranged on one side and the other side of the intermediate layer.

[0125] The water-soluble resin preferably contains polyvinyl alcohol, and more preferably contains both polyvinyl alcohol and polyvinylpyrrolidone, in order to further improve oxygen barrier properties and interlayer mixing inhibition ability.

[0126] The water-soluble resin may be used alone or in combination of two or more types. The content of the water-soluble resin is not particularly limited, but in order to further improve oxygen barrier properties and interlayer mixing suppression ability, it is preferably 50% by mass or more, and more preferably 70% by mass or more, relative to the total mass of the intermediate layer. There is no particular upper limit, but for example, it is preferably 99.9% by mass or less, and more preferably 99.8% by mass or less.

[0127] The thickness of the intermediate layer is preferably 6.0 μm or less, more preferably 5.0 μm or less, and even more preferably 4.0 μm or less. The lower limit is preferably 0.1 μm or more, more preferably 0.5 μm or more, and even more preferably 1.0 μm or more.

[0128] <Thermoplastic Resin Layer> The transfer film may have a thermoplastic resin layer. Examples of thermoplastic resin layers include those described in paragraphs 0164-0204 of International Publication No. 2021 / 166719, the contents of which are incorporated herein by reference.

[0129] <Protective Film> The transfer film may have a protective film. If the transfer film includes a protective film, it is preferable that the protective film be provided on the outermost layer opposite to the temporary support.

[0130] Examples of protective films include polyethylene terephthalate film, polypropylene film, polystyrene film, and polycarbonate film. Examples of protective films include the protective films described in paragraphs 0083 to 0087 and 0093 of Japanese Patent Application Publication No. 2006-259138, the contents of which are incorporated herein by reference.

[0131] Examples of protective films include Alphan® FG-201 (manufactured by Oji F-Tex Co., Ltd.), Alphan® E-201F (manufactured by Oji F-Tex Co., Ltd.), Therapyle® 25WZ (manufactured by Toray Film Processing Co., Ltd.), and Lumirror® 16QS62 (16KS40) (manufactured by Toray Industries, Inc.).

[0132] The method for manufacturing the transfer film may be a known manufacturing method. Preferably, the method for manufacturing the transfer film includes a step of applying a composition containing the above-mentioned specific compound (organopolysiloxane) onto a temporary support to form a composition layer (photosensitive layer). Examples of methods for applying the composition include printing, spraying, roll coating, bar coating, curtain coating, spin coating, and die coating (i.e., slit coating). Furthermore, after application, it is preferable to dry the coating film of the composition on the temporary support by heating and vacuum drying.

[0133] [Pattern Forming Method] The pattern forming method of the present invention preferably comprises the following steps: Lamination step: A step of forming a substrate with a photosensitive layer by bringing the surface of the photosensitive layer in the transfer film opposite to the temporary support side into contact with the substrate and laminating the transfer film and the substrate together. Exposure step: A step of exposing the photosensitive layer in a patterned manner. Development step: A step of developing the exposed photosensitive layer using a developing solution. Peeling step: A step of peeling the temporary support from the substrate with the photosensitive layer between the lamination step and the exposure step, or between the exposure step and the development step described later. The steps of the pattern forming method of the present invention will be described below.

[0134] [Lamination Process] The lamination process involves bringing the surface of the transfer film opposite to the temporary support into contact with the substrate and laminating them together to obtain a substrate with a photosensitive layer having the substrate, composition layer (photosensitive layer), and temporary support in that order. If the transfer film has a protective film, the protective film is removed before performing the lamination process.

[0135] In the above bonding process, the substrate and the surface of the photosensitive layer are pressed together so that they come into contact. There are no particular restrictions on the method of pressing, and known transfer methods and lamination methods can be used. In particular, it is preferable to place the surface of the photosensitive layer on the substrate and apply pressure and heat using a roll or the like. Known laminators such as vacuum laminators and auto-cut laminators can be used for bonding. There are no particular restrictions on the lamination temperature, but for example, 70 to 130°C is preferred.

[0136] The substrate is not particularly limited and examples include quartz substrates, silicon substrates, printed circuit boards (e.g., FR4 substrates, glass epoxy substrates, polyimide substrates, etc.), resin substrates (e.g., cycloolefin polymers or polyimide), and semiconductor substrates. A resin layer having a refractive index lower than that of the pattern formed by the photosensitive layer of the transfer film of the present invention may be formed on the above substrate. For example, the substrate described in paragraph

[0140] of International Publication No. 2018 / 155193 can also be used.

[0137] [Exposure Process] The exposure process is a process of pattern exposure of the photosensitive layer. Here, "pattern exposure" refers to exposure in a patterned manner, that is, exposure in a manner in which exposed areas and unexposed areas exist. The positional relationship between the exposed and unexposed areas in pattern exposure is not particularly limited and can be adjusted as appropriate. Exposure may be performed from the side opposite to the substrate of the photosensitive layer, or from the substrate side of the photosensitive layer.

[0138] As a light source for pattern exposure, any light source capable of emitting light in a wavelength range sufficient to cure the photosensitive layer (for example, 365 nm or 405 nm) can be appropriately selected and used. Among these, 365 nm is preferred as the dominant wavelength of the exposure light for pattern exposure. The dominant wavelength is the wavelength with the highest intensity.

[0139] Examples of light sources include various lasers, light-emitting diodes (LEDs), ultra-high pressure mercury lamps, high-pressure mercury lamps, and metal halide lamps. The exposure dose is 5 to 200 mJ / cm². ２ Preferably, 10 to 200 mJ / cm² ２ This is preferable.

[0140] Preferred embodiments of the light source, exposure amount, and exposure method used for exposure are described, for example, in paragraphs

[0146] to

[0147] of International Publication No. 2018 / 155193, which are incorporated herein by reference.

[0141] A resin pattern is formed on the substrate by performing an exposure process and a development process, which will be described later.

[0142] [Peeling Process] The peeling process is a process of peeling the temporary support from the photosensitive layer-coated substrate between the lamination process and the exposure process, or between the exposure process and the development process described later. The peeling method is not particularly limited, and a mechanism similar to the cover film peeling mechanism described in paragraphs

[0161] to

[0162] of Japanese Patent Application Publication No. 2010-072589 can be used.

[0143] [Development Process] The development process is a process of developing the exposed photosensitive layer to form a pattern. The development of the photosensitive layer can be carried out using a developer. An alkaline aqueous solution is preferred as the developer. Examples of alkaline compounds that may be contained in the alkaline aqueous solution include sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate, potassium bicarbonate, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, and choline (2-hydroxyethyltrimethylammonium hydroxide).

[0144] Examples of development methods include paddle development, shower development, spin development, and dip development.

[0145] Examples of developers preferred in this specification include the developer described in paragraph

[0194] of International Publication No. 2015 / 093271, and examples of development methods preferred in this specification include the development method described in paragraph

[0195] of International Publication No. 2015 / 093271.

[0146] [Post-exposure and post-bake steps] The pattern formation method described above may include a step of exposing the pattern obtained in the development step (post-exposure step) and / or a step of heating it (post-bake step). If both a post-exposure step and a post-bake step are included, it is preferable to perform post-baking after post-exposure. The exposure amount for post-exposure is 100 to 5000 mJ / cm². ２ Preferably, 200 to 3000 mJ / cm² ２This is more preferable. The post-bake temperature is preferably 80 to 250°C, and more preferably 90 to 160°C. The post-bake time is preferably 1 to 180 minutes, and more preferably 10 to 60 minutes.

[0147] [Applications] Patterns (cured films) formed from compositions containing specific compounds can be applied to a variety of uses. Examples of applications include optical waveguides (core members, cladding members), electrode protective films, insulating films, planarization films, overcoat films, hardcoat films, passivation films, partitions, spacers, microlenses, optical filters, anti-reflective films, etching resists, and plated components.

[0148] The present invention will be described in more detail below based on the following examples. The materials, amounts used, proportions, processing content, and processing procedures shown in the following examples can be modified as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be interpreted as being limited by the following examples.

[0149] [Synthesis Examples 1-26] Organopolysiloxanes 1-26 are synthesized according to the procedures described in Synthesis Examples 1-26. Specifically, trialkoxysilane raw materials are mixed based on the molar ratios shown in Table 1, and the synthesis is carried out according to the organopolysiloxane synthesis procedure described below. Note that in organopolysiloxane, when [3-(trimethoxysilyl)propyl] succinic anhydride is used as "raw material 1 [raw material for repeating unit (1)]", the succinic anhydride portion is hydrolyzed to form a dicarboxylic acid. In other words, a dicarboxylic acid is generated during the hydrolysis treatment in the synthesis of organopolysiloxane.

[0150] (Synthesis procedure for organopolysiloxane) A total of 0.3 mol of trialkoxysilane starting material and 75.0 g of methyl isobutyl ketone were mixed in a 300 mL three-necked flask and stirred while heating at an ambient temperature of 80°C. 18.0 g of 0.1% by mass aqueous potassium hydroxide solution was added dropwise at a constant rate over 5 minutes, and the mixture was continued to heat and stir for 5 hours. During heating, the reaction was carried out while removing refluxed methanol from the system using a Dean-Stark apparatus. After stopping the stirring and cooling to room temperature (25°C) in a water bath, 150 g of methyl isobutyl ketone and 150 g of 5% by mass saline solution were added to extract the organic phase. The organic phase was washed sequentially once with 150 g of 5% by mass saline solution and twice with 150 g of pure water, dried over 45 g of magnesium sulfate, and then concentrated under reduced pressure at 50°C and 35 mmHg to obtain a methyl isobutyl ketone solution of organopolysiloxane.

[0151] Table 1 is shown below.

[0152]

[0153]

[0154] The various raw materials listed in Table 1 are shown below. Note that Me represents a methyl group, and * indicates the bonding position.

[0155]

[0156] [Preparation of Photosensitive Composition] A photosensitive composition was prepared based on the components and formulation shown below. The photosensitive composition was adjusted to have a solid content concentration of 27% by mass. In the preparation of the photosensitive composition, the resin that would become the binder polymer was dissolved in an organic solvent (a mixed solvent of propylene glycol monomethyl ether and methyl ethyl ketone (mass ratio of 43 / 57)). The photosensitive composition was prepared by mixing the above-mentioned binder polymer solution with the other components. The binder polymer content shown in the composition below is indicated as the solid content of the binder polymer (excluding the solvent).

[0157] <<Composition of Photosensitive Composition>> ・Binder: Organopolysiloxane 51.4 parts by mass ・Polymerizable compound 1: A-NOD-N 24.6 parts by mass ・Polymerizable compound 2: DPHA 11.8 parts by mass ・Polymerizable compound 3: TO-2349 3.8 parts by mass ・Polymerization initiator: B-CIM 6.9 parts by mass ・Sensitizer: SB-PI 701 0.3 parts by mass ・Chain transfer agent 1: N-phenylcarbamoylmethyl-N-carboxymethylaniline 0.1 parts by mass ・Chain transfer agent 2: LCV 0.4 parts by mass ・Rust inhibitor 1: CBT-1 0.1 parts by mass ・Rust inhibitor 2: F-552 0.3 parts by mass ・Inhibitor: TDP-G 0.3 parts by mass

[0158] The details of each component of the photosensitive composition are shown below. [Binder] In Examples 1 to 25, organopolysiloxanes 1 to 25 synthesized by Synthesis Examples 1 to 25 were used, respectively. In Comparative Example 1, organopolysiloxane 26 synthesized by Synthesis Example 26 was used. [Polymerizable compound] A-NOD-N: 1,9-nonanediol diacrylate (manufactured by Shin Nakamura Chemical Industry Co., Ltd.) DPHA: dipentaerythritol hexaacrylate (manufactured by Toshin Oil & Fat Co., Ltd.) TO-2349: Aronics TO-2349 (manufactured by Toagosei Co., Ltd.) [Polymerization initiator] B-CIM: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Kurogane Kasei Co., Ltd.). [Sensitizer] SB-PI 701: 4,4'-bis(diethylamino)benzophenone (Sanyo Trading Co., Ltd.) [Chain transfer agent] N-phenylcarbamoylmethyl-N-carboxymethylaniline: Manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. LCV: Leucocrystal violet (Manufactured by Tokyo Chemical Industries, Ltd.) [Rust inhibitor] CBT-1: Carboxybenzotriazole (Manufactured by Johoku Chemical Industry Co., Ltd.) F-552: Megafac F-552 (Fluorine-based surfactant, manufactured by DIC Corporation) [Polymerization inhibitor] TDP-G: Phenothiazine (Manufactured by Kawaguchi Chemical Industry Co., Ltd.)

[0159] [Preparation of Intermediate Layer Forming Composition] An intermediate layer forming composition was prepared with the following composition. <<Composition of Intermediate Layer Forming Composition>> --------------------------------------------------- ・PVA 67.5 parts by mass ・PVP 31.5 parts by mass ・HPMC 1.0 part by mass ・Fluorine-based surfactant 0.1 parts by mass ・Methanol 630 parts by weight ・Water 270 parts by mass ---------------------------------------------------

[0160] The following details each component of the intermediate layer forming composition: PVA (Polyvinyl Alcohol): Kuraray Poval PVA-205 (manufactured by Kuraray Co., Ltd.) PVP (Polypyrrolidone): Polyvinylpyrrolidone K-30 (manufactured by Nippon Shokubai Co., Ltd.) HPMC (Hydroxypropyl Methylcellulose): Metroze 60SH-03 (manufactured by Shin-Etsu Chemical Co., Ltd.) Fluorine-based surfactant: Megafac F-444 (manufactured by DIC Corporation)

[0161] [Preparation of Transfer Film] [Preparation of Transfer Film with Temporary Support / Intermediate Layer / Photosensitive Layer / Protective Film Composition] A transfer film having a temporary support, intermediate layer, photosensitive layer, and protective film in this order was prepared according to the following procedure. The specific preparation procedure is described below. An intermediate layer-forming composition was applied to a temporary support (a polyethylene terephthalate film with a thickness of 25 μm) using a bar coater to a thickness of 2.0 μm after drying, and dried in an oven at 100°C to form an intermediate layer. Next, a photosensitive composition was applied to the intermediate layer using a bar coater to a thickness of 4.0 μm after drying, and dried in an oven at 100°C to form a photosensitive layer. A protective film (polyethylene terephthalate, 16KS40, Toray Industries, Inc., with a thickness of 16 μm) was pressed onto the photosensitive layer.

[0162] [Pattern Creation] [Laminate Creation] After cutting the fabricated transfer film into 50 cm squares, the protective film was removed. The photosensitive layer of the transfer film and the glass substrate were bonded together under the conditions of a roller temperature of 100°C, a linear pressure of 0.6 MPa, and a linear speed of 1.0 m / min. The laminate obtained by bonding the transfer film and the glass substrate has the structure of "glass substrate / photosensitive layer / intermediate layer / temporary support".

[0163] [Pattern Preparation] The temporary support was peeled off from the laminate. Next, the photomask was brought into close contact with the outermost layer of the laminate (the surface opposite to the glass substrate of the laminate). The line and space pattern formed on the photomask was designed with a line width of 4 μm and a space width of 125 μm. Light was irradiated onto the photosensitive layer using a high-pressure mercury lamp exposure machine (MAP-1200L, Dainippon Kaken Co., Ltd., main wavelength: 365 nm). During exposure, the exposure amount was adjusted so that the line width of the pattern corresponding to the 4 μm lines formed on the photomask was 4 μm. Next, the exposed laminate was subjected to alkaline development treatment using a 1.0% sodium carbonate aqueous solution (pH 11.8) at 30°C as the developer to form the pattern. Specifically, a shower treatment with the developer was performed for 90 seconds, followed by an AirKnife treatment to remove the developer. Furthermore, a shower treatment with pure water was performed for 30 seconds, followed by an AirKnife treatment.

[0164] [Evaluation] [Optical Loss] Photosensitive layers were laminated to an average thickness of 100 μm. Next, the same procedure as the pattern formation method described above was performed on the photosensitive layers with an average thickness of 100 μm. The transmittance (%) and reflectance (%) of the hardened film of the obtained photosensitive layer were measured using a spectrophotometer equipped with an integrating sphere, and the absorptance (%) was determined by subtracting the reflectance (%) value from the transmittance (%) value from 100%. Next, the optical loss (dB / cm) at a wavelength of 1310 nm was determined based on the following formula (OP1). Formula (OP1): Optical loss (dB / cm) = -10 × log10 (absorptance (%) / 100) / film thickness Note that the lower the optical loss, the easier it is to form an optical waveguide with low optical transmission loss. (Evaluation Criteria) "AA": Less than 0.30 dB / cm "A": 0.30 dB / cm or more and less than 0.45 dB / cm "B": 0.45 dB / cm or more and less than 0.60 dB / cm "C": 0.60 dB / cm or more

[0165] [Pattern Formation Performance] The minimum line width of the pattern formed without development residue or distortion was adopted as the minimum resolution line width. (Evaluation Criteria) "AA": Less than 3.0 μm "A": 3.0 μm or more and less than 4.0 μm "B": 4.0 μm or more and less than 6.0 μm "C": 6.0 μm or more, or no pattern can be formed

[0166] Table 2 is shown below. The "Content (mol%)" column in the table shows the content (mol%) of each repeating unit relative to the total repeating units of the organopolysiloxane (100 mol%).

[0167]

[0168] The structures listed in the "Type of X," "Type of Y," "Type of M," and "Type of Z" columns of Table 2 are shown below. In organopolysiloxanes 1 to 25, "Type of X" corresponds to the structure of "X" in the repeating unit (1) described above, "Type of Y" corresponds to the structure of "Y" in the repeating unit (2) described above, "Type of M" corresponds to the structure of "M" in the repeating unit (3) described above, and "Type of Z" corresponds to the structure of "Z" in the repeating unit (4) described above. Me is a methyl group, and * indicates the bond position.

[0169]

[0170] The results shown in Table 2 confirm that the organopolysiloxanes of the examples exhibit excellent pattern formation performance and low light loss in the formed patterns.

[0171] Furthermore, a comparison of Examples 1 to 6 confirms that when the lower limit of the content of repeating units (1) in the organopolysiloxane is 5 mol% or more (preferably 7 mol% or more) relative to the total repeating units of the organopolysiloxane, the pattern-forming performance of the organopolysiloxane is superior. Also, when the upper limit of the content of repeating units (1) in the organopolysiloxane is 30 mol% or less (preferably 20 mol% or less) relative to the total repeating units of the organopolysiloxane, it can be confirmed that the light loss of the formed pattern is lower.

[0172] Furthermore, a comparison of Examples 7 to 12 confirms that when the lower limit of the content of repeating units (2) in the organopolysiloxane is 5 mol% or more (preferably 8 mol% or more) relative to the total repeating units of the organopolysiloxane, the pattern formation performance is superior. Also, when the upper limit of the content of repeating units (2) in the organopolysiloxane is 30 mol% or less (preferably 15 mol% or less) relative to the total repeating units of the organopolysiloxane, the light loss of the formed pattern is lower.

[0173] Furthermore, a comparison of Examples 13 to 17 confirms that when the lower limit of the content of repeating units (3) in the organopolysiloxane is 3 mol% or more relative to the total repeating units of the organopolysiloxane, the pattern formation performance is superior and the light loss of the formed pattern is lower. Also, when the upper limit of the content of repeating units (3) in the organopolysiloxane is 15 mol% or less (preferably 10 mol% or less) relative to the total repeating units of the organopolysiloxane, the light loss of the formed pattern is lower.

[0174] Furthermore, from a comparison between Example 14 and Example 20, it can be seen that X in the repeating unit (1) of the organopolysiloxane represents a group represented by formula (X), and L Ｘ However, it can be confirmed that the pattern-forming performance is superior when representing an m+1 valent aliphatic hydrocarbon group which may have substituents and may contain heteroatoms.

[0175] Furthermore, a comparison of Examples 14, 18, and 19 confirms that when Y in the repeating unit (2) of the organopolysiloxane has a (meth)acryloyl group as a polymerizable group, the light loss of the formed pattern is lower.

[0176] As shown in Table 2, the comparative organopolysiloxane exhibited inferior pattern formation performance and also showed significant optical loss in the formed patterns.

Claims

The repeating unit represented by equation (1), The repeating unit represented by equation (2), An organopolysiloxane comprising a repeating unit represented by formula (3). Equation (1) [X-SiO] ３／２ ] In the formula, X represents a monovalent group having a carboxylic acid group. Formula (2) [Y-SiO] ３／２ ] In the formula, Y represents a monovalent group having a polymerizable group. Equation (3) [SiO ３／２ -M-(SiO) ３／２ ) ｎ ] In the formula, M represents an n+1 valent organic group, and n represents an integer greater than or equal to 1. 　 Furthermore, the organopolysiloxane according to claim 1, comprising a repeating unit represented by formula (4). Equation (4) [Z-SiO] ３／２ ] In the formula, Z represents a monovalent hydrocarbon group which may have substituents. 　 The organopolysiloxane according to claim 1 or 2, wherein the polymerizable group is an acryloyl group or a methacryloyl group. 　 The organopolysiloxane according to claim 1 or 2, wherein X represents a group represented by formula (X). In the formula, (X) *-L Ｘ -(COOH)m L Ｘ * represents an m+1 valent hydrocarbon group, which may have substituents and may contain heteroatoms. m represents an integer of 1 or more. * represents the bond position. The above L Ｘ represents an (m + 1)-valent aliphatic hydrocarbon group which may have a substituent and may contain a hetero atom, and the organopolysiloxane according to claim 4. 　 The content of the repeating units represented by formula (1) is 5 to 30 mol% relative to the total repeating units of the organopolysiloxane. The content of the repeating units represented by formula (2) is 5 to 30 mol% relative to the total repeating units of the organopolysiloxane. The content of the repeating units represented by formula (3) is 1 to 15 mol% relative to the total repeating units of the organopolysiloxane. The organopolysiloxane according to claim 2, wherein the content of the repeating units represented by formula (4) is 25 to 89 mol% of the total repeating units of the organopolysiloxane. 　 The content of the repeating units represented by formula (1) is 7 to 20 mol% relative to the total repeating units of the organopolysiloxane. The content of the repeating units represented by formula (2) is 8 to 15 mol% relative to the total repeating units of the organopolysiloxane. The content of the repeating units represented by formula (3) is 3 to 10 mol% relative to the total repeating units of the organopolysiloxane. The organopolysiloxane according to claim 2, wherein the content of the repeating units represented by formula (4) is 55 to 82 mol% of the total repeating units of the organopolysiloxane. 　 A composition comprising the organopolysiloxane described in claim 1 or 2. 　 A film formed from the composition described in claim 8. 　 A transfer film comprising a temporary support and a photosensitive layer formed from the composition described in claim 8. 　 The transfer film according to claim 10, further comprising an intermediate layer between the temporary support and the photosensitive layer. 　 A lamination step of forming a substrate with a photosensitive layer by bringing the surface of the photosensitive layer in the transfer film according to claim 10, opposite to the temporary support side, into contact with the substrate, thereby bonding the transfer film and the substrate together, An exposure step of exposing the photosensitive layer in a patterned manner, A developing step in which the exposed photosensitive layer is developed using a developer, A pattern forming method comprising a step of peeling off a temporary support from a photosensitive layer-coated substrate between the lamination step and the exposure step, or between the exposure step and the development step. 　 The pattern forming method according to claim 12, wherein the developing solution is an alkaline developing solution.

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