Wearable electronic device including conductive pattern

Abstract

A wearable electronic device according to various embodiments of the present invention may comprise: a housing having a ring shape; a first non-conductive portion formed on a first surface of the housing; a first substrate disposed at a position corresponding to the first non-conductive portion in an inner space of the housing; a first portion, a connection portion, and a second portion forming the first substrate; a wireless communication circuit disposed on the first portion; and an antenna pattern disposed on the second portion, wherein the second portion is bent through the connection portion and disposed on the wireless communication circuit.

Description

Wearable electronic device including a conductive pattern

[0001] Various embodiments of the present invention disclose a wearable electronic device comprising at least one conductive pattern.

[0002] The use of electronic devices such as bar type, foldable type, rollable type, sliding type, or wearable type is increasing, and various functions are being provided to electronic devices.

[0003] The above electronic device is evolving into the form of a wearable electronic device for portability and accessibility.

[0004] For example, the wearable electronic device may include a form such as a watch, glasses, a bracelet, or a ring that can be worn on a part of the user's body.

[0005] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0006] A wearable electronic device that a user can wear on their finger (e.g., a smart ring) can perform various actions by interacting with other electronic devices (e.g., portable electronic devices and / or home appliances).

[0007] The wearable electronic device may include at least one conductive pattern (e.g., an antenna pattern and / or a sensing pattern) to exchange various data with other electronic devices. For example, the conductive pattern may be partially bent or curved to correspond to the shape of the ring-shaped wearable electronic device.

[0008] For example, the wearable electronic device can electrically connect a conductive pattern and a substrate (e.g., a printed circuit board (PCB)) using a connector such as a C-clip.

[0009] For example, if the conductive pattern is bent to correspond to the shape of a ring-shaped wearable electronic device, the contact with the C clip may not be properly formed.

[0010] For example, when electrically connecting a conductive pattern and a substrate using a C-clip, the thickness of a wearable electronic device (e.g., a smart ring) increases due to the height of the C-clip, and the space available to place other electronic components on the substrate may decrease due to the placement area of ​​the C-clip.

[0011] Various embodiments of the present invention can provide a wearable electronic device capable of placing at least one conductive pattern (e.g., an antenna pattern and / or a sensing pattern) inside a housing by modifying the structure of a substrate.

[0012] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below.

[0013] A wearable electronic device according to one embodiment of the present invention may include a housing having a ring shape and a first non-conductive portion formed on a first surface of the housing. According to one embodiment, the wearable electronic device may include a first substrate disposed in an internal space of the housing at a position corresponding to the first non-conductive portion. According to one embodiment, the first substrate may include a first portion, a connecting portion, and a second portion. According to one embodiment, the wearable electronic device may include a wireless communication circuit disposed on the first portion and an antenna pattern disposed on the second portion. According to one embodiment, the second portion may be bent through the connecting portion and disposed on the wireless communication circuit.

[0014] According to various embodiments of the present invention, by utilizing a modified structure of a substrate to place at least one conductive pattern (e.g., an antenna pattern and / or a sensing pattern) inside a housing, the contact between the conductive pattern and the substrate can be improved and the thickness of the wearable electronic device can be reduced.

[0015] In addition, various effects that can be identified directly or indirectly through this document may be provided.

[0016] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0017] FIG. 1a is a block diagram of an electronic device in a network environment according to various embodiments of the present invention.

[0018] FIG. 1b is a block diagram of a wireless communication module, a power management module, and an antenna module of an electronic device according to various embodiments of the present invention.

[0019] FIG. 2 is a perspective view schematically showing a wearable electronic device according to one embodiment of the present invention.

[0020] FIG. 3 is a cross-sectional view schematically illustrating a wearable electronic device according to one embodiment of the present invention.

[0021] FIG. 4 is an enlarged view schematically showing part A of the wearable electronic device disclosed in FIG. 3 according to one embodiment of the present invention.

[0022] FIG. 5 is an enlarged view schematically showing part B of the wearable electronic device disclosed in FIG. 3 according to one embodiment of the present invention.

[0023] FIG. 6 is an enlarged view schematically showing part C of the wearable electronic device disclosed in FIG. 3 according to one embodiment of the present invention.

[0024] FIG. 7 is a schematic diagram illustrating an example in which a first substrate to a third substrate is bent in a first direction when a part of the wearable electronic device disclosed in FIG. 3 according to an embodiment of the present invention is unfolded.

[0025] FIG. 8 is a schematic diagram illustrating an example in which a first substrate to a third substrate is bent in a first direction or a second direction when a part of the wearable electronic device disclosed in FIG. 3 according to one embodiment of the present invention is unfolded.

[0026] FIG. 9 is a diagram schematically showing the bent state of the first to third substrates according to one embodiment of the present invention.

[0027] FIG. 10 is an enlarged view schematically showing a part of a wearable electronic device according to various embodiments of the present invention.

[0028] FIG. 1a is a block diagram of an electronic device in a network environment according to various embodiments of the present invention.

[0029] Referring to FIG. 1a, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0030] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0031] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0032] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0033] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0036] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0037] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0038] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] According to various embodiments, the interface (177) may electrically or operationally connect components within the electronic device (101). For example, the interface (177) may include a MIPI (mobile industry processor interface), a UFS (universal flash storage) interface, or a PCIE (peripheral component interconnect express) interface.

[0041] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0043] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0044] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0045] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0046] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0047] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0048] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0049] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0050] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0051] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0052] FIG. 1b is a block diagram of a wireless communication module, a power management module, and an antenna module of an electronic device according to various embodiments of the present invention.

[0053] Referring to FIG. 1b, the wireless communication module (192) may include a magnetic secure transmission (MST) communication module (191) or a near field communication (NFC) communication module (193), and the power management module (188) may include a wireless charging module (185). In this case, the antenna module (197) may include a plurality of antennas, including an MST antenna (197-1) connected to the MST communication module (191), an NFC antenna (197-3) connected to the NFC communication module (193), and a wireless charging antenna (197-5) connected to the wireless charging module (185). For convenience of explanation, components that overlap with FIG. 1a are omitted or described briefly.

[0054] The MST communication module (191) receives a signal from the processor (120) containing control information or payment information such as card information, generates a magnetic signal corresponding to the received signal through the MST antenna (197-1), and then transmits the generated magnetic signal to an external electronic device (102) (e.g., POS device). To generate the magnetic signal, according to one embodiment, the MST communication module (191) includes a switching module (not shown) comprising one or more switches connected to the MST antenna (197-1), and can control the switching module to change the direction of the voltage or current supplied to the MST antenna (197-1) according to the received signal. The change in the direction of the voltage or current enables the direction of the magnetic signal (e.g., magnetic field) transmitted through the MST antenna (197-1) to change accordingly. When a magnetic signal in a state of changing direction is detected by an external electronic device (102), it can cause an effect similar to a magnetic field (e.g., waveform) that occurs when a magnetic card corresponding to the received signal (e.g., card information) is swiped by the card reader of the electronic device (102). According to one embodiment, payment-related information and control signals received in the form of the magnetic signal at the electronic device (102) can be transmitted to an external server (108) (e.g., payment server) via a network (199), for example.

[0055] The NFC communication module (193) can acquire a signal including control information or payment information, such as card information, from the processor (120) and transmit the acquired signal to an external electronic device (102) through the NFC antenna (197-3). According to one embodiment, the NFC communication module (193) can receive a signal transmitted from an external electronic device (102) through the NFC antenna (197-3).

[0056] The wireless charging module (185) can wirelessly transmit power to an external electronic device (102) (e.g., a mobile phone or a wearable device) or wirelessly receive power from an external electronic device (102) (e.g., a wireless charging device) through a wireless charging antenna (197-5). The wireless charging module (185) can support one or more of various wireless charging methods, including, for example, magnetic resonance or magnetic induction.

[0057] According to one embodiment, some antennas among the MST antenna (197-1), NFC antenna (197-3), or wireless charging antenna (197-5) may share at least a portion of the radiating portion with each other. For example, the radiating portion of the MST antenna (197-1) may be used as the radiating portion of the NFC antenna (197-3) or the wireless charging antenna (197-5), and vice versa. In this case, the antenna module (197) may include a switching circuit (not shown) configured to selectively connect (e.g., close) or disconnect (e.g., open) at least a portion of the antennas (197-1, 197-3, or 197-3) under the control of a wireless communication module (192) (e.g., MST communication module (191) or NFC communication module (193)) or a power management module (188) (e.g., wireless charging module (185)). For example, when the electronic device (101) uses a wireless charging function, the NFC communication module (193) or the wireless charging module (185) can control the switching circuit to temporarily separate at least a portion of the radiating portion shared by the NFC antenna (197-3) and the wireless charging antenna (197-5) from the NFC antenna (197-3) and connect it to the wireless charging antenna (197-5).

[0058] According to one embodiment, at least one function of the MST communication module (191), the NFC communication module (193), or the wireless charging module (185) may be controlled by an external processor (e.g., processor (120)). According to one embodiment, designated functions (e.g., payment functions) of the MST communication module (191) or the NFC communication module (193) may be performed in a trusted execution environment (TEE). A trusted execution environment (TEE) according to various embodiments may form an execution environment in which at least a designated area of ​​memory (130) is allocated to be used to perform functions requiring a relatively high level of security (e.g., financial transactions, or personal information-related functions). In such cases, access to the designated area may be restricted, for example, depending on the entity accessing it or the application running in the trusted execution environment.

[0059] FIG. 2 is a perspective view schematically showing a wearable electronic device according to one embodiment of the present invention.

[0060] According to one embodiment, the wearable electronic device (200) disclosed below may include the electronic device (101) disclosed in FIG. 1a. For example, the wearable electronic device (200) may include at least some components and embodiments of the electronic device (101) disclosed in FIG. 1a.

[0061] According to one embodiment, the wearable electronic device (200) according to one embodiment of the present invention may include an electronic device in the form of a ring (e.g., a smart ring) that can be worn on a finger by a user. According to various embodiments, the wearable electronic device (200) of the present disclosure is not limited to the example described above and may be substantially similarly applied to a bracelet form that can be worn on a wrist by a user. According to various embodiments, the wearable electronic device (200) of the present disclosure may be substantially similarly applied to various electronic devices that can be worn on the body by a user.

[0062] Referring to FIG. 2, a wearable electronic device (200) according to one embodiment of the present invention (e.g., the electronic device (101) of FIG. 1a) may include a housing (210).

[0063] According to one embodiment, the housing (210) may be formed to have a ring shape. For example, the housing (210) may include an opening (201). The wearable electronic device (200) may be worn on a user's finger through the opening (201). For example, the opening (201) may be a hole through which the user can insert the wearable electronic device (200) into the finger. For example, the opening (201) may be formed with a size corresponding to the thickness of the user's finger.

[0064] According to one embodiment, the housing (210) may include a first surface (210a), a second surface (210b), and a side (210c) surrounding a space (S) (e.g., an internal space) between the first surface (210a) and the second surface (210b). For example, the first surface (210a), the second surface (210b), and the side (210c) may be integrally formed to form a housing (210) having a ring shape (e.g., annular). For example, when the wearable electronic device (200) is worn on a user's finger through an opening (201), the first surface (210a) may be a portion exposed to the outside of the housing (210), and the second surface (210b) may be a portion in contact with the finger inside the housing (210). For example, the first surface (210a) may be the outer surface, outer side, outer circumference, or outer edge of the housing (210). For example, the second surface (210b) may be the inner side, inner side, inner circumference, or inner edge of the housing (210).

[0065] According to one embodiment, the housing (210) may include a conductive portion (220) and / or a non-conductive portion (231, 232, 233, 234, 235 and / or 236). For example, a first surface (210a) of the housing (210) may include a conductive portion (220) and / or at least some non-conductive portions (231, 232, 233, 234, 235 and / or 236). For example, the first surface (210a) of the housing (210) may include at least one of a first non-conductive portion (231), a second non-conductive portion (232), a third non-conductive portion (233), a fourth non-conductive portion (234), a fifth non-conductive portion (235), and a sixth non-conductive portion (236) formed of a non-conductive material (e.g., a polymer) in at least a portion of the conductive portion (220). For example, a conductive portion (220) may be disposed between the first non-conductive portion (231), the second non-conductive portion (232), the third non-conductive portion (233), the fourth non-conductive portion (234), the fifth non-conductive portion (235), and the sixth non-conductive portion (236) formed on the first surface (210a) of the housing (210). For example, the second surface (210b) and / or side (210c) of the housing (210) may be formed of a non-conductive material (e.g., polymer). For example, the second surface (210b) and / or side (210c) of the housing (210) may be formed of a conductive material (e.g., metal). For example, the space (S) (e.g., internal space) between the first surface (210a) and the second surface (210b) of the housing (210) may be filled with a non-conductive injection molded material (e.g., the non-conductive injection molded material (308) of FIG. 3 (e.g., polymer)).

[0066] FIG. 3 is a cross-sectional view schematically illustrating a wearable electronic device according to one embodiment of the present invention.

[0067] According to one embodiment, FIG. 3 may be a cross-sectional view of the 3-3' portion of a wearable electronic device (200) according to one embodiment of the present invention disclosed in FIG. 2, viewed from the -z axis direction.

[0068] According to one embodiment, a wearable electronic device (200) according to one embodiment of the present invention may include at least one substrate (310, 320, 330, 340, 350 and / or 360) disposed in a space (S) (e.g., an internal space of the housing (210)) between a first surface (210a) (e.g., outer) and a second surface (210b) (e.g., inner) of the housing (210), a connecting member (301), a connector (303), a wireless charging antenna (305), a battery (189), and / or a non-conductive injection molded part (308).

[0069] According to one embodiment, at least one substrate may include a first substrate (310), a second substrate (320), a third substrate (330), a fourth substrate (340), a fifth substrate (350) and / or a sixth substrate (360). For example, the first substrate (310) may be positioned at a location corresponding to a first non-conductive portion (231) formed on a first surface (210a) of the housing (210). For example, the second substrate (320) may be positioned at a location corresponding to a second non-conductive portion (232) formed on the first surface (210a) of the housing (210). For example, the third substrate (330) may be positioned at a location corresponding to a third non-conductive portion (233) formed on the first surface (210a) of the housing (210). For example, a fourth substrate (340) may be positioned at a location corresponding to a fourth non-conductive portion (234) formed on the first surface (210a) of the housing (210). For example, a fifth substrate (350) may be positioned at a location corresponding to a fifth non-conductive portion (235) formed on the first surface (210a) of the housing (210). For example, a sixth substrate (360) may be positioned at a location corresponding to a sixth non-conductive portion (236) formed on the first surface (210a) of the housing (210). In one embodiment, the at least one substrate is described as including a first substrate (310), a second substrate (320), a third substrate (330), a fourth substrate (340), a fifth substrate (350), and / or a sixth substrate (360), but is not limited thereto and may include more substrates.

[0070] According to one embodiment, the first substrate (310), the second substrate (320), the third substrate (330), the fourth substrate (340), the fifth substrate (350), or the sixth substrate (360) may each include a structure in which a plurality of printed circuit boards are stacked. For example, the first substrate (310), the second substrate (320), the third substrate (330), the fourth substrate (340), the fifth substrate (350), or the sixth substrate (360) may each include an interposer structure. For example, the first substrate (310), the second substrate (320), the third substrate (330), the fourth substrate (340), the fifth substrate (350), or the sixth substrate (360) may each be configured in the form of a flexible printed circuit board (FPCB), a rigid PCB, and / or a rigid flexible (RF) PCB.

[0071] According to one embodiment, the connecting member (301) can electrically connect a first substrate (310), a second substrate (320), a third substrate (330), a fourth substrate (340), a fifth substrate (350) and / or a sixth substrate (360). For example, the connecting member (301) may include a flexible printed circuit board (FPCB) and / or a coaxial cable.

[0072] According to one embodiment, the connector (303) can electrically connect the connecting member (301), the wireless charging antenna (305), and the battery (189). For example, the connector (303) may be any one of a B2B (board to board) connector, a ZIF (zero insertion force) connector, a micro-junction connector, an FFC (flat flex cable), an FPC (flexible printed circuit), and a conductive connecting member.

[0073] According to one embodiment, the wireless charging antenna (305) can charge the wearable electronic device (200). For example, the wireless charging antenna (305) may include a form in which a conductor (e.g., a conductive pattern) is spirally wound on an FPCB. For example, the wireless charging antenna (305) may be formed into a curved structure to correspond to the shape of the housing (210). For example, the wireless charging antenna (305) may receive power wirelessly from an external electronic device (e.g., the external electronic device (102, 104) or charging device of FIG. 1a).

[0074] According to one embodiment, the battery (189) can supply power to at least one component of the wearable electronic device (200). For example, the battery (189) can supply power to at least one substrate (310, 320, 330, 340, 350 and / or 360) through a connecting member (301) and a connector (303). For example, the battery (189) can supply power to a radio frequency integrated circuit and / or a sensing circuit (IC) placed on at least one substrate (310, 320, 330, 340, 350 and / or 360). For example, the battery (189) may be formed with a curved structure to correspond to the shape of the housing (210). For example, the battery (189) may be placed below the wireless charging antenna (305) (e.g., in the -y-axis direction). According to various embodiments, the wireless charging antenna (305) may be positioned on the lower part of the battery (189) (e.g., in the -y-axis direction). For example, the wireless charging antenna (305) may be positioned between the first surface (210A) of the housing (210) and the battery (189).

[0075] According to one embodiment, a non-conductive injection molded product (308) may be filled inside the housing (210). For example, the non-conductive injection molded product (308) may be filled in the space (S) between the first surface (210a) and the second surface (210b) of the housing (210) (e.g., the internal space of the housing).

[0076] FIG. 4 is an enlarged view schematically showing part A of the wearable electronic device disclosed in FIG. 3 according to one embodiment of the present invention.

[0077] According to one embodiment, a first substrate (310) of a wearable electronic device (200) may be positioned at a location corresponding to a first non-conductive portion (231) formed on a first surface (210a) of a housing (210). For example, the first substrate (310) may include a flexible substrate (e.g., a flexible printed circuit board), a rigid substrate (e.g., a rigid PCB), and / or a rigid-flexible substrate (e.g., a rigid-flexible PCB).

[0078] According to one embodiment, a wireless communication circuit (410), a shielding member (420), a first adhesive member (431), and / or a second adhesive member (432) may be disposed between the first substrate (310) and the first non-conductive portion (231). According to various embodiments, the second adhesive member (432) may be optionally used or omitted.

[0079] According to one embodiment, the first substrate (310) may include a first part (411), a connecting part (413), and a second part (415). The first part (411), the connecting part (413), and the second part (415) may form the first substrate (310). A wireless communication circuit (410) may be disposed on a first surface (e.g., top, first direction, or y-axis direction) of the first part (411). The connecting part (413) may integrally connect the first part (411) and the second part (415). The connecting part (413) may have a specified length in a direction perpendicular to the first part (411) (e.g., y-axis direction). The connecting part (413) may include a first wiring (401) (e.g., a first signal line). The first wiring (401) may include at least one conductive line. For example, the connection portion (413) may form a bending portion or a folding portion. The first substrate (310) may have a second portion (415) bent or folded onto the first portion (411) through the connection portion (413). When the first substrate (310) is bent through the connection portion (413), the second portion (415) may be placed on the first portion (411). For example, the first portion (411) of the first substrate (310) may be formed of a rigid substrate (e.g., a rigid PCB), and the connection portion (413) and / or the second portion (415) may be formed of a flexible substrate (e.g., a flexible printed circuit board). The second part (415) can be bent in a direction perpendicular to the connecting part (413) (e.g., z-axis direction). For example, the first part (411), the connecting part (413), and the second part (415) of the first substrate (310) can be bent to have a "C" shape. For example, the second part (415) can be bent through the connecting part (413) and face each other with the first part (411).For example, the second part (415) may be at least partially bent to correspond to the ring-shaped housing (210) and may face the first non-conductive part (231). The second part (415) may include an antenna pattern (450) (e.g., a conductive pattern). The antenna pattern (450) placed in the second part (415) may transmit and receive wireless signals through the first non-conductive part (231) formed on the first surface (210a) of the housing (210). For example, the antenna pattern (450) may be formed in at least one layer. The antenna pattern (450) may be electrically connected to the wireless communication circuit (410) and the first part (411) through the first wiring (401) formed in the connection part (413). For example, expressions related to bending disclosed in this document may include meanings such as folding or bending.

[0080] According to one embodiment, a wireless communication circuit (410) (e.g., a radio frequency integrated circuit) may be disposed between a first part (411) and a second part (415) of a first substrate (310). The wireless communication circuit (410) may be disposed on a first surface (e.g., the top, the first direction, or the y-axis direction) of the first part (411) of the first substrate (310). For example, if the second part (415) of the first substrate (310) is bent from the first part (411) through a connecting part (413), the second part (415) may be disposed on the top (e.g., the y-axis direction) of the wireless communication circuit (410). The wireless communication circuit (410) can supply a wireless signal and / or a feeding signal to an antenna pattern (450) (e.g., a conductive pattern or an antenna radiator) disposed on a second part (415) of the first substrate (310). The wireless communication circuit (410) can perform wireless communication with an external electronic device (e.g., the external electronic device (102, 104) of FIG. 1a) using the antenna pattern (450). For example, the wearable electronic device (200) can perform at least one of NFC (near field communication), Bluetooth, BLE (Bluetooth low energy), WiFi direct, and / or UWB (ultra-wide band) communication with an external electronic device (e.g., the external electronic device (102, 104) of FIG. 1a) using the wireless communication circuit (410) and the antenna pattern (450). For example, the wireless communication circuit (410) may include the wireless communication module (192) disclosed in FIG. 1a. For example, the wireless communication circuit (410) may perform substantially the same functions and operations as the wireless communication module (192) disclosed in FIG. 1a.

[0081] According to one embodiment, the shielding member (420) may be disposed on a first surface (e.g., top, first direction, or y-axis direction) of the wireless communication circuit (410). The shielding member (420) may shield noise and / or electromagnetic interference generated from the wireless communication circuit (410). For example, the shielding member (420) may absorb noise and / or electromagnetic interference generated from the wireless communication circuit (410). For example, the shielding member (420) may include a conductive plate.

[0082] According to one embodiment, a first adhesive member (431) may be disposed between a second portion (415) of a first substrate (310) and a shielding member (420). The first adhesive member (431) may adhere the second portion (415) of the first substrate (310) and the shielding member (420). The first adhesive member (431) may include double-sided adhesive tape, fixing poron, adhesive resin, or adhesive (e.g., bond). For example, the first adhesive member (431) may have a thickness of about 0.03 mm to 0.07 mm. For example, the first adhesive member (431) may be formed between the second portion (415) and the shielding member (420) with a thickness of about 0.03 mm to 0.07 mm.

[0083] According to one embodiment, a second adhesive member (432) may be disposed between a second portion (415) of a first substrate (310) and a first non-conductive portion (231). The second adhesive member (432) may bond the second portion (415) of the first substrate (310) and the first non-conductive portion (231). The second adhesive member (432) may include a transparent injection molded product, double-sided adhesive tape, fixing poron, adhesive resin, or adhesive (e.g., bond). For example, the second adhesive member (432) may have a thickness of about 0.03 mm to 0.07 mm. For example, the second adhesive member (432) may be formed between the second portion (415) and the first non-conductive portion (231) with a thickness of about 0.03 mm to 0.07 mm. According to various embodiments, the second adhesive member (432) may be optionally used or omitted. For example, if the second adhesive member (432) is omitted, an air gap may be formed between the second portion (415) of the first substrate (310) and the first non-conductive portion (231).

[0084] FIG. 5 is an enlarged view schematically showing part B of the wearable electronic device disclosed in FIG. 3 according to one embodiment of the present invention.

[0085] According to one embodiment, a second substrate (320) of a wearable electronic device (200) may be positioned at a location corresponding to a second non-conductive portion (232) formed on a first surface (210a) of a housing (210). For example, the second substrate (320) may include a flexible substrate (e.g., a flexible printed circuit board), a rigid substrate (e.g., a rigid PCB), and / or a rigid-flexible substrate (e.g., a rigid-flexible PCB).

[0086] According to one embodiment, a sensing circuit (510), a third adhesive member (531), and / or a fourth adhesive member (532) may be disposed between the second substrate (320) and the second non-conductive portion (232). According to various embodiments, the fourth adhesive member (532) may be optionally used or omitted.

[0087] According to one embodiment, the second substrate (320) may include a first part (511), a connecting part (513), and a second part (515). A sensing circuit (510) may be disposed on a first surface (e.g., top, first direction, or y-axis direction) of the first part (511). The connecting part (513) may integrally connect the first part (511) and the second part (515). The connecting part (513) may have a specified length in a direction perpendicular to the first part (511) (e.g., y-axis direction). The connecting part (513) may include a second wiring (501) (e.g., a second signal line). For example, the second wiring (501) may include at least one conductive line. For example, the connecting part (513) may form a bending part or a folding part. The second substrate (320) can be bent so that the second part (515) is bent onto the first part (511) through the connecting part (513). When the second substrate (320) is bent through the connecting part (513), the second part (515) can be placed on the first part (511). For example, the first part (511) of the second substrate (320) may be formed of a rigid substrate (e.g., a rigid PCB), and the connecting part (513) and / or the second part (515) may be formed of a flexible substrate (e.g., a flexible printed circuit board). The second part (515) can be bent in a direction perpendicular to the connecting part (513) (e.g., the z-axis direction). For example, the first part (511), the connecting part (513), and the second part (515) of the second substrate (320) can be bent to have a "C" shape. For example, the second part (515) can be bent through the connecting part (513) and can face each other with the first part (511). For example, the second part (515) can be at least partially bent to correspond to the ring-shaped housing (210) and can face the second non-conductive part (232).The second part (515) may include a sensing pattern (550) (e.g., a first sensing pattern, a conductive pattern, or a touch pattern). The sensing pattern (550) (e.g., a first sensing pattern) placed in the second part (515) may sense and / or detect a touch or swipe action input through a second non-conductive part (232) formed on the first surface (210a) of the housing (210). For example, the sensing pattern (550) may be formed in at least one layer. The sensing pattern (550) may be electrically connected to the sensing circuit (510) and the first part (511) through a second wiring (501) formed in the connection part (513).

[0088] According to one embodiment, a sensing circuit (510) (e.g., a sensing IC) may be positioned between a first part (511) and a second part (515) of a second substrate (320). The sensing circuit (510) may be positioned on a first surface (e.g., upper, first direction, or y-axis direction) of the first part (511) of the second substrate (320). For example, if the second part (515) of the second substrate (320) is bent from the first part (511) through a connection part (513), the second part (515) may be positioned on the upper part (e.g., y-axis direction) of the sensing circuit (510). The sensing circuit (510) may receive a signal detected through a sensing pattern (550) (e.g., a touch pattern). For example, the sensing pattern (550) and the sensing circuit (510) can form a sensor. For example, when a touch and swipe operation is performed through the second non-conductive part (232), the sensing pattern (550) and the sensing circuit (510) can detect a signal corresponding to the touch and swipe operation. The sensing circuit (510) can transmit a control signal corresponding to the detected signal to an external electronic device (e.g., external electronic device (102, 104) of FIG. 1a) using an antenna pattern (450) and a wireless communication circuit (410) placed on the first substrate (310). For example, the sensing circuit (510) can detect at least one of a short touch, a long touch (e.g., a long press), a multi-touch, a drag, and a swipe input through the second non-conductive part (232) and the sensing pattern (550), and transmit a control signal corresponding to the detected signal to an external electronic device (e.g., the external electronic device (102, 104) of FIG. 1a).

[0089] According to one embodiment, when a touch and / or swipe action is performed by a user's hand (e.g., finger) on the second non-conductive portion (232), the sensing circuit (510) and the sensing pattern (550) can detect a change in a physical quantity (e.g., capacitance or resistance value) corresponding to the touch and / or swipe action and recognize that a touch and / or swipe event has occurred. For example, the sensing circuit (510) may include the sensor module (176) disclosed in FIG. 1a. For example, the sensing circuit (510) may include a circuit that detects a touch and / or swipe action performed on the second non-conductive portion (232) and the sensing pattern (550). For example, the sensing circuit (510) may include any one of a proximity sensor, a pressure sensor, a grip sensor, a temperature sensor, a gesture sensor, and a touch sensor.

[0090] According to one embodiment, the wearable electronic device (200) may transmit a detection signal and / or a control signal designated to an external electronic device (102, 104) disclosed in FIG. 1a (e.g., a smartphone) and / or a home appliance. For example, when a long press input is performed on a second non-conductive part (232) and a sensing pattern (550) of the wearable electronic device (200) (e.g., a smart ring) by a user's finger, the sensing circuit (510) may transmit a control signal corresponding to the detected signal to an external electronic device (e.g., the external electronic device (102, 104) of FIG. 1a). For example, the long press input performed on the second non-conductive part (232) and the sensing pattern (550) may be an input set to enter a sleep mode. For example, when a signal corresponding to a long press is received through a wearable electronic device (200), an external electronic device (102, 104) (e.g., a smartphone) can transmit a control signal corresponding to a sleep mode to a paired home appliance (e.g., an IoT device). For example, the home appliance can control the brightness of the light to dim based on the control signal received from the external electronic device (102, 104) (e.g., a smartphone).

[0091] According to one embodiment, the wearable electronic device (200) may transmit a detection signal and / or a control signal specified to an external electronic device (102, 104) disclosed in FIG. 1a (e.g., a smartphone). For example, when an input related to a swipe motion is performed on the second non-conductive part (232) and the sensing pattern (550) of the wearable electronic device (200) (e.g., a smart ring) by a user's finger, the sensing circuit (510) may transmit a control signal corresponding to the detected signal to the external electronic device (e.g., the external electronic device (102, 104) of FIG. 1a). For example, the swipe motion performed on the second non-conductive part (232) and the sensing pattern (550) may be an input set for a payment service (e.g., a transportation card) using near-field communication (NFC). For example, when a signal corresponding to a swipe motion is received through a wearable electronic device (200), an external electronic device (102, 104) (e.g., a smartphone) may provide the user with a notification (e.g., vibration and / or sound) related to payment approval. In one embodiment, a specific function (e.g., a payment service) is described as being executed when an input related to a swipe motion is performed through the second non-conductive part (232) and the sensing pattern (550), but a specific function or action (e.g., a payment service) may be executed substantially the same way when a touch or press motion is performed through the second non-conductive part (232) and the sensing pattern (550).

[0092] According to various embodiments, when a swipe motion through the first non-conductive part (231) and the second non-conductive part (232) of a wearable electronic device (200) (e.g., a smart ring) is detected by a sensing pattern (550), the sensing circuit (510) may transmit a control signal corresponding to the detected signal to an external electronic device (e.g., the external electronic device (102, 104) of FIG. 1a). For example, the swipe motion performed on the first non-conductive part (231), the second non-conductive part (232), and the sensing pattern (550) may be an input set for a payment service (e.g., a transportation card) using near-field communication (NFC). For example, when a signal corresponding to a swipe action is received through the first non-conductive part (231), the second non-conductive part (232), and the sensing pattern (550) of the wearable electronic device (200), the external electronic device (102, 104) (e.g., a smartphone) may provide the user with a notification (e.g., vibration and / or sound) related to payment approval. In various embodiments, although it has been described as an example that a specific function (e.g., a payment service) is executed when an input related to a swipe action is performed through the first non-conductive part (231), the second non-conductive part (232), and the sensing pattern (550), a specific function or action (e.g., a payment service) may be executed substantially the same way when a touch or press action is performed through the first non-conductive part (231), the second non-conductive part (232), and the sensing pattern (550).

[0093] According to various embodiments, when a swipe motion through the second non-conductive portion (232) and the third non-conductive portion (233) of a wearable electronic device (200) (e.g., a smart ring) is detected by at least one sensing pattern (e.g., the sensing pattern (550) of FIG. 5 and / or the sensing pattern (650) of FIG. 6), the sensing circuit (510) (or the control circuit (661) of FIG. 6) may transmit a control signal corresponding to the detected signal to an external electronic device (e.g., the external electronic device (102, 104) of FIG. 1a). For example, the swipe motion performed on the second non-conductive portion (232) and the third non-conductive portion (233) may be an input set for a payment service (e.g., a transportation card) using near-field communication (NFC). For example, when a signal corresponding to a swipe action is received through the second non-conductive part (232), the third non-conductive part (233), the sensing pattern (550), and / or the control circuit (661) disclosed in FIG. 6 of the wearable electronic device (200), the external electronic device (102, 104) (e.g., a smartphone) may provide the user with a notification (e.g., vibration and / or sound) related to payment approval. In various embodiments, a specific function (e.g., payment service) is executed when an input related to a swipe action is performed through the second non-conductive part (232), the third non-conductive part (233), and at least one sensing pattern (e.g., the sensing pattern (550) of FIG. 5 and / or the sensing pattern (650) of FIG. 6, but the specific function or action (e.g., payment service) may also be executed substantially the same way when a touch or press action is performed through the second non-conductive part (232), the third non-conductive part (233), and at least one sensing pattern (e.g., the sensing pattern (550) of FIG. 5 and / or the sensing pattern (650) of FIG. 6).

[0094] According to one embodiment, a third adhesive member (531) may be disposed between a second portion (515) of a second substrate (320) and a sensing circuit (510). The third adhesive member (531) may bond the second portion (515) of the second substrate (320) and the sensing circuit (510). The third adhesive member (531) may include double-sided adhesive tape, fixing poron, adhesive resin, or adhesive (e.g., bond). For example, the third adhesive member (531) may have a thickness of about 0.03 mm to 0.07 mm. For example, the third adhesive member (531) may be formed between the second portion (515) and the sensing circuit (510) with a thickness of about 0.03 mm to 0.07 mm.

[0095] According to one embodiment, a fourth adhesive member (532) may be disposed between the second portion (515) and the second non-conductive portion (232) of the second substrate (320). The fourth adhesive member (532) may bond the second portion (515) and the second non-conductive portion (232) of the second substrate (320). The fourth adhesive member (532) may include a transparent injection molded product, double-sided adhesive tape, fixing poron, adhesive resin, or adhesive (e.g., bond). For example, the fourth adhesive member (532) may have a thickness of about 0.03 mm to 0.07 mm. For example, the fourth adhesive member (532) may be formed between the second portion (515) and the second non-conductive portion (232) with a thickness of about 0.03 mm to 0.07 mm. According to various embodiments, the fourth adhesive member (532) may be optionally used or omitted. For example, if the fourth adhesive member (532) is omitted, an air gap may be formed between the second portion (515) of the second substrate (320) and the second non-conductive portion (232).

[0096] FIG. 6 is an enlarged view schematically showing part C of the wearable electronic device disclosed in FIG. 3 according to one embodiment of the present invention.

[0097] According to one embodiment, a third substrate (330) of a wearable electronic device (200) may be positioned at a location corresponding to a third non-conductive portion (233) formed on a first surface (210a) of a housing (210). For example, the third substrate (330) may include a flexible substrate (e.g., a flexible printed circuit board), a rigid substrate (e.g., a rigid PCB), and / or a rigid-flexible substrate (e.g., a rigid-flexible (RF) PCB).

[0098] According to one embodiment, between the third substrate (330) and the third non-conductive portion (233), at least one electronic component (661, 662, 663), a fifth adhesive member (631), and / or a sixth adhesive member (632) may be included. According to various embodiments, the sixth adhesive member (632) may be optionally used or omitted.

[0099] According to one embodiment, the third substrate (330) may include a first part (611), a first connection part (613a), a second connection part (613b), and a second part (615). At least one electronic component (661, 662, 663) may be disposed on a first surface (e.g., top, first direction, or y-axis direction) of the first part (611). For example, at least one electronic component may include at least one of a control circuit (661) (e.g., the sensing circuit (510) of FIG. 5), a capacitor (662), and an inductor (663). The first connection part (613a) and the second connection part (613b) may integrally connect the first part (611) and the second part (615). The first connecting part (613a) and the second connecting part (613b) may have a specified length in a direction perpendicular to the first part (611) (e.g., y-axis direction). The first connecting part (613a) and the second connecting part (613b) may be spaced apart. The first connecting part (613a) may include a third wiring (601) (e.g., a third signal line). For example, the third wiring (601) may include at least one conductive line. The second connecting part (613b) may include a fourth wiring (602) (e.g., a fourth signal line). For example, the fourth wiring (602) may include at least one conductive line. For example, the first connecting part (613a) and the second connecting part (613b) may form a bending part or a folding part. The third substrate (330) can have a second part (615) bent onto the first part (611) through the first connecting part (613a) and the second connecting part (613b). When the third substrate (330) is bent through the first connecting part (613a) and the second connecting part (613b), the second part (615) can be placed on the first part (611).For example, the first part (611) of the third substrate (330) may be formed of a rigid substrate (e.g., a rigid PCB), and the first connecting part (613a) and the second connecting part (613b), and / or the second part (615) may be formed of a flexible substrate (e.g., a flexible printed circuit board). The second part (615) may be bent in a direction perpendicular to the first connecting part (613a) and the second connecting part (613b) (e.g., the z-axis direction). For example, the first part (611), the first connecting part (613a), the second connecting part (613b), and the second part (615) of the third substrate (330) may be bent to have a "C" shape. For example, the second part (615) is bent through the first connecting part (613a) and the second connecting part (613b) and may face each other with the first part (611). For example, the second part (615) is at least partially bent to correspond to the ring-shaped housing (210) and may face the third non-conductive part (233). The second part (615) may include a sensing pattern (650) (e.g., a second sensing pattern, a conductive pattern, or a touch pattern). The sensing pattern (650) (e.g., a second sensing pattern) placed on the second part (615) may sense and / or detect a touch or swipe action input through the third non-conductive part (233) formed on the first surface (210a) of the housing (210). For example, the sensing pattern (650) may be formed in at least one layer. The sensing pattern (650) may be electrically connected to the first part (611) through a third wire (601) placed in the first connection part (613a) and a fourth wire (602) placed in the second connection part (613b).

[0100] According to one embodiment, at least one electronic component (e.g., control circuit (661) (e.g., sensing circuit (510) of FIG. 5), capacitor (662) and inductor (663)) may be placed between the first part (611) and the second part (615) of the third substrate (330). For example, the at least one electronic component may include various other passive components (e.g., resistors) and may not be limited to the example described above. For example, the capacitor (662) may have various capacitance values, and the inductor (663) may have various inductance values. The control circuit (661) (e.g., sensing circuit (510) of FIG. 5), capacitor (662) and inductor (663) may be placed on the first surface (e.g., top, first direction or y-axis direction) of the first part (611) of the third substrate (330). For example, when the second portion (615) of the third substrate (330) is bent from the first portion (611) through the first connection portion (613a) and the second connection portion (613b), the second portion (615) may be placed on top (e.g., in the y-axis direction) of the control circuit (661) (e.g., the sensing circuit (510) of FIG. 5), the capacitor (662), and the inductor (663). The control circuit (661) may receive a signal detected through the sensing pattern (650) (e.g., a conductive pattern). For example, the sensing pattern (650) and the control circuit (661) may form a sensor. For example, when a touch and swipe operation is performed through the third non-conductive part (233), the sensing pattern (650) and the control circuit (661) can detect a signal corresponding to the touch and swipe operation. The control circuit (661) can transmit a control signal corresponding to the detected signal to an external electronic device (e.g., external electronic device (102, 104) of FIG. 1a) using an antenna pattern (450) and a wireless communication circuit (410) placed on the first substrate (310).For example, the control circuit (661) can detect at least one of a short touch, a long touch (e.g., a long press), a multi-touch, a drag, and a swipe input through the third non-conductive part (233) and the sensing pattern (650), and transmit a control signal corresponding to the detected signal to an external electronic device (e.g., the external electronic device (102, 104) of FIG. 1a).

[0101] According to one embodiment, when a touch and / or swipe action is performed by a user's hand (e.g., finger) on the third non-conductive portion (233), the control circuit (661) and the sensing pattern (650) can detect a change in a physical quantity (e.g., capacitance or resistance value) corresponding to the touch and / or swipe action and recognize that a touch and / or swipe event has occurred. For example, the control circuit (510) may include the sensor module (176) or processor (120) disclosed in FIG. 1a. For example, the control circuit (661) may include a sensing circuit that detects the touch and / or swipe action performed on the third non-conductive portion (233) and the sensing pattern (650). For example, the control circuit (661) may perform substantially the same function and operation as any one of a proximity sensor, a pressure sensor, a grip sensor, a temperature sensor, a gesture sensor, and a touch sensor.

[0102] According to one embodiment, the wearable electronic device (200) may transmit a detection signal and / or a control signal designated to an external electronic device (102, 104) disclosed in FIG. 1a (e.g., a smartphone) and / or a home appliance. For example, when a long press input (e.g., a long touch) is performed on the third non-conductive part (233) and the sensing pattern (650) of the wearable electronic device (200) (e.g., a smart ring) by a user's finger, the control circuit (661) may transmit a control signal corresponding to the detected signal to the external electronic device (e.g., the external electronic device (102, 104) of FIG. 1a). For example, the long press input performed on the third non-conductive part (233) and the sensing pattern (650) may be an input set to enter a sleep mode. For example, when a signal corresponding to a long press is received through a wearable electronic device (200), an external electronic device (102, 104) (e.g., a smartphone) can transmit a control signal corresponding to a sleep mode to a paired home appliance (e.g., an IoT device). For example, the home appliance can control the brightness of the light to dim based on the control signal received from the external electronic device (102, 104) (e.g., a smartphone).

[0103] According to one embodiment, the wearable electronic device (200) may transmit a detection signal and / or a control signal specified to an external electronic device (102, 104) disclosed in FIG. 1a (e.g., a smartphone). For example, when an input related to a swipe action is performed on the third non-conductive part (233) and the sensing pattern (650) of the wearable electronic device (200) (e.g., a smart ring) by a user's finger, the control circuit (661) may transmit a control signal corresponding to the detected signal to the external electronic device (e.g., the external electronic device (102, 104) of FIG. 1a). For example, the swipe action performed on the third non-conductive part (233) and the sensing pattern (650) may be an input set for a payment service (e.g., a transportation card) using near-field communication (NFC). For example, when a signal corresponding to a swipe action is received through a wearable electronic device (200), an external electronic device (102, 104) (e.g., a smartphone) can provide the user with a notification (e.g., vibration and / or sound) related to payment approval.

[0104] According to one embodiment, the fifth adhesive member (631) may be placed between the second part (615) of the third substrate (330) and at least one electronic component (e.g., control circuit (661) (e.g., sensing circuit (510) of FIG. 5), capacitor (662) and inductor (663)). The fifth adhesive member (631) may adhere the second part (615) of the third substrate (330) and at least one electronic component (e.g., control circuit (661) (e.g., sensing circuit (510) of FIG. 5), capacitor (662) and inductor (663)). The fifth adhesive member (631) may include double-sided adhesive tape, fixing poron, adhesive resin, or adhesive (e.g., bond).

[0105] According to one embodiment, the sixth adhesive member (632) may be disposed between the second portion (615) and the third non-conductive portion (2323) of the third substrate (330). The sixth adhesive member (632) may bond the second portion (615) and the third non-conductive portion (233) of the third substrate (330). The sixth adhesive member (632) may comprise a transparent injection molded part, double-sided adhesive tape, fixing poron, adhesive resin, or adhesive (e.g., bond). For example, the sixth adhesive member (632) may have a thickness of about 0.03 mm to 0.07 mm. For example, the sixth adhesive member (632) may be formed between the second portion (615) and the third non-conductive portion (233) with a thickness of about 0.03 mm to 0.07 mm. According to various embodiments, the The 6 adhesive member (632) may be optionally used or omitted. For example, if the 6 adhesive member (632) is omitted, an air gap may be formed between the second part (615) and the third non-conductive part (233) of the third substrate (330).

[0106] According to various embodiments, the fourth substrate (340), the fifth substrate (350), or the sixth substrate (360) disclosed in FIG. 4 may be configured substantially identically to the second substrate (320) or the third substrate (330) described above. For example, the first substrate (310) disclosed in FIG. 4 is merely an example for illustrative purposes and may be positioned at a location corresponding to the second substrate (320), the third substrate (330), the fourth substrate (340), the fifth substrate (350), or the sixth substrate (360).

[0107] FIG. 7 is a schematic diagram illustrating an example in which a first substrate to a third substrate is bent in a first direction when a part of the wearable electronic device disclosed in FIG. 3 according to an embodiment of the present invention is unfolded.

[0108] For example, FIG. 7 may be a diagram schematically showing a configuration in which the first substrate (310), the second substrate (320), the third substrate (330), and the connecting member (301) disclosed in FIG. 3 are unfolded.

[0109] According to one embodiment, the first substrate (310), the second substrate (320), and the third substrate (330) can be electrically connected using a connecting member (301) (e.g., FPCB).

[0110] According to one embodiment, the first substrate (310) may include a first part (411), a connecting part (413), and a second part (415). For example, the first substrate (310) may be bent or curved in a first direction toward the first part (411) through the connecting part (413) so that the second part (415) is bent. For example, when the second part (415) is bent in a first direction toward the first part (411), the second part (415) may be placed on a wireless communication circuit (410) and positioned to face the first part (411).

[0111] According to one embodiment, the second substrate (320) may include a first part (511), a connecting part (513), and a second part (515). For example, the second substrate (320) may be bent or curved in a first direction toward the first part (511) through the connecting part (513). For example, when the second part (515) is bent in a first direction toward the first part (511), the second part (515) may be placed on a sensing circuit (510) and positioned to face the first part (511).

[0112] According to one embodiment, the third substrate (330) may include a first portion (611), a first connecting portion (613a), a second connecting portion (613b), and a second portion (615). For example, the third substrate (330) may be bent or curved in a first direction toward the first portion (611) through the first connecting portion (613a) and the second connecting portion (613b). For example, when the second portion (615) is bent in a first direction toward the first portion (611), the second portion (615) may be placed on at least one electronic component (660) and positioned to face the first portion (611). For example, at least one electronic component (660) may include a control circuit (661) disclosed in FIG. 6, a capacitor (662), and / or an inductor (663).

[0113] According to one embodiment, in the embodiment disclosed in FIG. 7, a case was described in which a second part (415) of a first substrate (310) is bent toward a first part (411) through a connecting part (413), a second part (515) of a second substrate (320) is bent toward a first part (511) through a connecting part (513), and a third substrate (330) is bent toward a first part (611) through a first connecting part (613a) and a second connecting part (613b), but the invention may not be limited thereto.

[0114] According to various embodiments, the first substrate (310) may be bent or curved through the connection portion (413) such that the second portion (415) is bent toward the first portion (411) in a second direction opposite to the first direction. For example, when the second portion (415) is bent toward the first portion (411) in the second direction, the second portion (415) may be placed on the wireless communication circuit (410) and positioned to face the first portion (411).

[0115] According to various embodiments, the second substrate (320) may be bent or curved through the connection portion (513) such that the second portion (515) is bent toward the first portion (511) in a second direction opposite to the first direction. For example, when the second portion (515) is bent toward the first portion (511) in the second direction, the second portion (515) may be placed on the sensing circuit (510) and positioned to face the first portion (511).

[0116] According to one embodiment, the third substrate (330) can be bent or curved so that the second part (615) is bent toward the first part (611) in a second direction opposite to the first direction through the first connection part (613a) and the second connection part (613b). For example, when the second part (615) is bent toward the first part (611) in the second direction, the second part (615) may be placed on at least one electronic component (660) and positioned to face the first part (611).

[0117] FIG. 8 is a schematic diagram illustrating an example in which a first to third substrate is bent in a first direction or a second direction when a part of the wearable electronic device disclosed in FIG. 3 according to an embodiment of the present invention is unfolded. FIG. 9 is a schematic diagram illustrating a state in which the first to third substrates are bent according to an embodiment of the present invention.

[0118] For example, FIG. 8 may be a schematic diagram showing an unfolded configuration of the first substrate (310), the second substrate (320), the third substrate (330), and the connecting member (301) disclosed in FIG. 3. For example, FIG. 9 may be a schematic diagram showing a state in which the second portions (415, 515, 615) of the first substrate (310), the second substrate (320), and the third substrate (330) are bent to the first portions (411, 511, 611).

[0119] According to one embodiment, the first substrate (310), the second substrate (320), and the third substrate (330) can be electrically connected using a connecting member (301) (e.g., FPCB).

[0120] According to one embodiment, the first substrate (310) may include a first part (411), a connecting part (413), and a second part (415). For example, the first substrate (310) may be bent or curved in a second direction toward the first part (411) through the connecting part (413). For example, when the second part (415) is bent in a second direction toward the first part (411), the second part (415) may be placed on a wireless communication circuit (410) and positioned to face the first part (411).

[0121] According to one embodiment, the second substrate (320) may include a first part (511), a connecting part (513), and a second part (515). For example, the second substrate (320) may be bent or curved in a first direction toward the first part (511) through the connecting part (513). For example, when the second part (515) is bent in a first direction toward the first part (511), the second part (515) may be placed on a sensing circuit (510) and positioned to face the first part (511).

[0122] According to one embodiment, the third substrate (330) may include a first portion (611), a first connecting portion (613a), a second connecting portion (613b), and a second portion (615). For example, the third substrate (330) may be bent or curved in a second direction toward the first portion (611) through the first connecting portion (613a) and the second connecting portion (613b). For example, when the second portion (615) is bent in a second direction toward the first portion (611), the second portion (615) may be placed on at least one electronic component (660) and positioned to face the first portion (611).

[0123] According to one embodiment, in the embodiment disclosed in FIG. 8, a second part (415) of the first substrate (310) is bent toward the first part (411) in a second direction through a connecting part (413), a second part (515) of the second substrate (320) is bent toward the first part (511) in a first direction through a connecting part (513), and a third substrate (330) is bent toward the first part (611) in a second direction through a first connecting part (613a) and a second connecting part (613b), but the case is not limited thereto.

[0124] According to various embodiments, a second part (415) of a first substrate (310) may be bent in a first direction toward a first part (411) through a connecting part (413), a second part (515) of a second substrate (320) may be bent in a second direction toward a first part (511) through a connecting part (513), and a third substrate (330) may be bent in a first direction toward a first part (611) through a first connecting part (613a) and a second connecting part (613b).

[0125] According to various embodiments, as long as the second part (415) of the first substrate (310) is bent and positioned to face the first part (411), the second part (515) of the second substrate (320) is bent and positioned to face the first part (511), and the second part (615) of the third substrate (330) is bent and positioned to face the first part (611), it may not matter whether the first substrate (310), the second substrate (320), and the third substrate (330) are bent in either the first direction or the second direction described above.

[0126] Referring to FIG. 9, the second part (415) of the first substrate (310) may be bent in a second direction toward the first part (411) through a connecting part (413) and positioned to face the first part (411). For example, the second part (515) of the second substrate (320) may be bent in a second direction toward the first part (511) through a connecting part (513) and positioned to face the first part (511). For example, the second part (615) of the third substrate (330) may be bent in a second direction toward the first part (611) through a first connecting part (613a) and a second connecting part (613b) and positioned to face the first part (611).

[0127] FIG. 10 is an enlarged view schematically showing a part of a wearable electronic device according to various embodiments of the present invention.

[0128] For example, FIG. 10 may be an enlarged view schematically showing various embodiments of part B of the wearable electronic device disclosed in FIG. 3.

[0129] According to various embodiments, the embodiment of the wearable electronic device (200) disclosed in FIG. 10 may be substantially identically applied to the embodiments disclosed in FIG. 2 through 9. For example, the embodiments disclosed in FIG. 1a through 9 may be substantially identically applied and integrated into the wearable electronic device (200) disclosed in FIG. 10.

[0130] According to one embodiment, the housing (210) (e.g., the first surface (21a) of FIG. 3) may include a conductive portion (220) and a window portion (1050). For example, the window portion (1050) may be formed of a transparent material.

[0131] According to one embodiment, a substrate (1010) of a wearable electronic device (200) may be positioned at a location corresponding to a window portion (1050) formed on a first surface (210a) of a housing (210). For example, the substrate (1010) may include a flexible substrate (e.g., a flexible printed circuit board), a rigid substrate (e.g., a rigid PCB), and / or a rigid-flexible substrate (e.g., a rigid-flexible (RF) PCB).

[0132] According to one embodiment, a sensing circuit (1020), an adhesive member (1030), and / or an optical sensor (1040) may be disposed between the substrate (1010) and the window portion (1050).

[0133] According to one embodiment, the substrate (1010) may include a first portion (1011), a connecting portion (1013), and a second portion (1015). A sensing circuit (1020) may be disposed on a first surface (e.g., top, first direction, or y-axis direction) of the first portion (1011). The connecting portion (1013) may integrally connect the first portion (1011) and the second portion (1015). The connecting portion (1013) may have a specified length in a direction perpendicular to the first portion (511) (e.g., y-axis direction). The connecting portion (1013) may include wiring (1001) (e.g., a signal line). For example, the wiring (1001) may include at least one conductive line. For example, the connecting portion (1013) may form a bending portion or a folding portion. The substrate (1010) can be bent or curved from the first part (1011) to the second part (1015) through the connecting part (1013). When the substrate (1010) is bent through the connecting part (1013), the second part (1015) can be placed on the first part (1011). For example, the first part (1011) of the substrate (1010) may be formed of a rigid substrate (e.g., a rigid PCB), and the connecting part (1013) and / or the second part (1015) may be formed of a flexible substrate (e.g., a flexible printed circuit board). The second part (1015) may be bent in a direction perpendicular to the connecting part (1013) (e.g., the z-axis direction). For example, the first part (1011), the connecting part (1013), and the second part (1015) of the substrate (1010) can be bent or curved to have a "C" shape. For example, the second part (1015) can be bent through the connecting part (1013) and can face each other with the first part (1011).

[0134] According to one embodiment, a sensing circuit (1020) (e.g., a sensing IC) may be disposed between a first part (1011) and a second part (1015) of a substrate (1010). The sensing circuit (1020) may be disposed on a first surface (e.g., top, first direction, or y-axis direction) of the first part (1011) of the substrate (1010). For example, if the second part (1015) of the substrate (1010) is bent onto the first part (1011) through a connection part (1013), the second part (1015) may be disposed on the top (e.g., y-axis direction) of the sensing circuit (1020). The sensing circuit (1020) may receive a signal detected through an optical sensor (1040) disposed on the second part (1015).

[0135] According to one embodiment, an adhesive member (1030) may be disposed between a second part (1015) of a substrate (1010) and a sensing circuit (1020). The adhesive member (1030) may bond the second part (1015) of the substrate (1010) and the sensing circuit (1020). The adhesive member (1030) may include double-sided adhesive tape, fixing poron, adhesive resin, or adhesive (e.g., bond).

[0136] According to one embodiment, the optical sensor (1040) may be positioned between the window portion (1050) and the second portion (1015) of the substrate (1010). The optical sensor (1040) may be electrically connected to the sensing circuit (1020) and / or the substrate (1010) through wiring (1001) (e.g., signal line) formed in the connection portion (1013). For example, the optical sensor (1040) may be configured so that at least some of the reflected light, which is reflected from an external object (e.g., finger) by light output through a light-emitting portion (e.g., LED), can be detected by a light-receiving portion (e.g., photodiode). For example, a wearable electronic device (200) may use the optical sensor (1040) to obtain biometric information such as a user's heart rate, stress, and blood oxygen saturation. According to various embodiments, the optical sensor (1040) may include a fingerprint sensor. According to various embodiments, the optical sensor (1040) may include an IR (infrared) sensor, a biosensor, a temperature sensor, or an illuminance sensor.

[0137] According to various embodiments, the window portion (1050) disclosed in FIG. 10 may be applied to at least one of the first non-conductive portion (231), the second non-conductive portion (232), the third non-conductive portion (233), the fourth non-conductive portion (234), the fifth non-conductive portion (235), and the sixth non-conductive portion (236) disclosed in FIG. 3, for example. For example, at least one of the first non-conductive portion (231), the second non-conductive portion (232), the third non-conductive portion (233), the fourth non-conductive portion (234), the fifth non-conductive portion (235), and the sixth non-conductive portion (236) disclosed in FIG. 3 may include the window portion (1050) disclosed in FIG. 10 or may be replaced by the window portion (1050).

[0138] A wearable electronic device (200) according to one embodiment of the present invention may include a housing (210) having a ring shape, a first non-conductive portion (231) formed on a first surface of the housing (210), and a first substrate (310) disposed in an internal space of the housing (210) at a position corresponding to the first non-conductive portion (231). According to one embodiment, the first substrate (310) may include a first portion (411), a connecting portion (413), and a second portion (415). According to one embodiment, the wearable electronic device (200) may include a wireless communication circuit (410) disposed on the first portion (411) and an antenna pattern (450) disposed on the second portion (415). According to one embodiment, the second part (415) can be bent through the connecting part (413) and placed on the wireless communication circuit (410).

[0139] According to one embodiment, the connecting portion (413) includes a first wiring (401), and the antenna pattern (450) and the first portion (411) can be electrically connected through the first wiring (401).

[0140] According to one embodiment, the wearable electronic device (200) may further include a shielding member (420) disposed on the wireless communication circuit (410).

[0141] According to one embodiment, the wearable electronic device (200) may further include a first adhesive member (431) disposed between the second part (415) and the shielding member (420).

[0142] According to one embodiment, the wearable electronic device (200) may further include a second adhesive member (432) disposed between the first non-conductive portion (231) and the second portion (415).

[0143] According to one embodiment, the wearable electronic device (200) may further include a second non-conductive portion (232) formed on the first surface of the housing (210), a second substrate (320) disposed at a position corresponding to the second non-conductive portion (232) in the internal space of the housing (210), a first portion (511) forming the second substrate (320), a connecting portion (513) and a second portion (515), a sensing circuit (510) disposed on the first portion (511), and a first sensing pattern (550) disposed on the second portion (515). According to one embodiment, the second portion (515) may be bent through the connecting portion (513) and disposed on the sensing circuit (510).

[0144] According to one embodiment, the connecting portion (513) includes a second wiring (501), and the first sensing pattern (550) and the first portion (511) can be electrically connected through the second wiring (501).

[0145] According to one embodiment, the first sensing pattern (550) and the sensing circuit (510) may be configured to detect a touch or swipe action through the second non-conductive portion (232).

[0146] According to one embodiment, the wearable electronic device (200) may further include a third adhesive member (531) disposed between the second part (515) and the sensing circuit (510).

[0147] According to one embodiment, the wearable electronic device (200) may further include a fourth adhesive member (532) disposed between the second non-conductive portion (232) and the second portion (515).

[0148] According to one embodiment, the wearable electronic device (200) may further include a third non-conductive portion (233) formed on the first surface of the housing (210), a third substrate (323) disposed at a position corresponding to the third non-conductive portion (233) in the internal space of the housing (210), a first portion (611) forming the third substrate (330), a first connecting portion (613a), a second connecting portion (613b) and a second portion (615), at least one electronic component (660) disposed on the first portion (611), and a second sensing pattern (650) disposed on the second portion (615). According to one embodiment, the second part (615) is bent through the first connecting part (613a) and the second connecting part (613b) and can be placed on the at least one electronic component (660).

[0149] According to one embodiment, the first connection part (613a) includes a third wire (601), the second connection part (613b) includes a fourth wire (602), and the second sensing pattern (650) and the first part (611) can be electrically connected through the third wire (601) and the fourth wire (602).

[0150] According to one embodiment, the at least one electronic component (660) may include at least one passive component.

[0151] According to one embodiment, the wearable electronic device (200) may further include a fifth adhesive member (631) disposed between the second part (615) and the at least one electronic component (660).

[0152] According to one embodiment, the wearable electronic device (200) may further include a sixth adhesive member (632) disposed between the third non-conductive portion (233) and the second portion (615).

[0153] According to one embodiment, the first substrate (310), the second substrate (320), and the third substrate (330) can be electrically connected through a connecting member (301).

[0154] According to one embodiment, the internal space of the housing (210) may be filled with a non-conductive injection molded material (308).

[0155] According to one embodiment, the wearable electronic device (200) further includes a wireless charging antenna (305) and a battery (189) disposed in the internal space of the housing (210), and the wireless charging antenna (305) and the battery (189) can be electrically connected to the connecting member (301) through a connector (303).

[0156] According to one embodiment, the first part (411) may be formed of a rigid substrate, and the connecting part (413) and / or the second part (415) may be formed of a flexible substrate.

[0157] According to one embodiment, the first non-conductive portion (231) or the second non-conductive portion (232) may include a transparent window portion (1050).

[0158] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0159] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0160] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0161] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0162] The embodiments of the present disclosure disclosed in this specification and drawings are provided merely as specific examples to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of an embodiment of the present disclosure should be interpreted as including various modifications or variations other than those disclosed herein.

Claims

1. In a wearable electronic device (200), Housing (210) having a ring shape; A first non-conductive portion (231) formed on the first surface of the housing (210); A first substrate (310) disposed in the internal space of the housing (210) at a position corresponding to the first non-conductive portion (231); A first part (411), a connecting part (413), and a second part (415) forming the first substrate (310); A wireless communication circuit (410) disposed on the first part (411); and It includes an antenna pattern (450) disposed in the second part (415) above, and The second part (415) is bent through the connecting part (413) and is a wearable electronic device placed on the wireless communication circuit (410).

2. In Paragraph 1, The above connecting part (413) includes a first wiring (401), and The antenna pattern (450) and the first part (411) are electrically connected to the wearable electronic device through the first wiring (401).

3. In Paragraph 1 or 2, A wearable electronic device further comprising a shielding member (420) disposed on the above wireless communication circuit (410).

4. In Paragraph 3, A wearable electronic device further comprising a first adhesive member (431) disposed between the second part (415) and the shielding member (420).

5. In any one of paragraphs 1 through 4, A wearable electronic device further comprising a second adhesive member (432) disposed between the first non-conductive portion (231) and the second portion (415).

6. In any one of paragraphs 1 through 5, A second non-conductive portion (232) formed on the first surface of the housing (210); A second substrate (320) disposed in the internal space of the housing (210) at a position corresponding to the second non-conductive portion (232); A first part (511), a connecting part (513), and a second part (515) forming the second substrate (320); A sensing circuit (510) disposed on the first part (511); and It further includes a first sensing pattern (550) disposed in the second part (515), and The second part (515) is bent through the connecting part (513) and is a wearable electronic device placed on the sensing circuit (510).

7. In Paragraph 6, The above connecting part (513) includes a second wiring (501), and The first sensing pattern (550) and the first part (511) are electrically connected to the wearable electronic device through the second wiring (501).

8. In Paragraph 6, A wearable electronic device configured such that the first sensing pattern (550) and the sensing circuit (510) detect a touch or swipe motion through the second non-conductive portion (232).

9. In Paragraph 6, A third adhesive member (531) disposed between the second part (515) and the sensing circuit (510); and A wearable electronic device further comprising a fourth adhesive member (532) disposed between the second non-conductive portion (232) and the second portion (515).

10. In Paragraph 1, A third non-conductive portion (233) formed on the first surface of the housing (210); A third substrate (323) disposed in the internal space of the housing (210) at a position corresponding to the third non-conductive portion (233); A first part (611), a first connecting part (613a), a second connecting part (613b), and a second part (615) forming the third substrate (330); At least one electronic component (660) disposed on the first part (611); and It further includes a second sensing pattern (650) disposed in the second part (615) above, and The second part (615) is bent through the first connecting part (613a) and the second connecting part (613b) and is a wearable electronic device placed on the at least one electronic component (660).

11. In Paragraph 10, The first connecting part (613a) includes a third wiring (601), and the second connecting part (613b) includes a fourth wiring (602). The second sensing pattern (650) and the first part (611) are electrically connected to the wearable electronic device through the third wiring (601) and the fourth wiring (602).

12. In Paragraph 11, A fifth adhesive member (631) disposed between the second part (615) and the at least one electronic component (660); and A wearable electronic device further comprising a sixth adhesive member (632) disposed between the third non-conductive portion (233) and the second portion (615).

13. In Paragraph 11, The first substrate (310), the second substrate (320), and the third substrate (330) are electrically connected through a connecting member (301), and A wearable electronic device in which a non-conductive injection molded material (308) is filled in the internal space of the housing (210).

14. In Paragraph 13, It further includes a wireless charging antenna (305) and a battery (189) disposed in the internal space of the housing (210), and The above wireless charging antenna (305) and the battery (189) are electrically connected to the connecting member (301) through the connector (303) of the wearable electronic device.

15. In any one of paragraphs 1 through 5, A wearable electronic device in which the first part (411) is formed of a rigid substrate and the connecting part (413) and / or the second part (415) is formed of a flexible substrate.

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