Guide device and apparatus for processing object to be processed including same

Abstract

Provided are a guide device for guiding an object to be processed so as to prevent a blocking film from being in contact with the object to be processed, and an apparatus for processing an object to be processed including same. The apparatus for processing an object to be processed comprises: a chamber housing including a first region and a second region as an inner space, in which the object to be processed is processed, respectively; a transfer unit for moving the object to be processed from the first region to the second region; a blocking film disposed between the first region and the second region and spaced apart from the object to be processed above the object to be processed; and a guide device disposed adjacent to the blocking film and configured to guide the object to be processed downward.

Description

Guide device and workpiece processing device including the same

[0001] The present invention relates to a guide device applicable to a wet etching process and a workpiece processing device including the same.

[0002] A wet etching chamber can be used in a semiconductor manufacturing process and can form a wiring pattern on a substrate using a chemical solution. The substrate can be loaded onto a stage and transported, and the wet etching chamber can form a desired pattern on the substrate by sequentially passing through a washing area and an etching area.

[0003] However, by-products generated by substrate etching in the etching area may scatter and flow into the washing area, adsorb onto the substrate, and interfere with the formation of a desired wiring pattern on the substrate. Therefore, a barrier may be installed between the washing area and the etching area to prevent the inflow of by-products. However, because the gap between the stage and the barrier is very narrow, the substrate may come into contact with the barrier during the process of moving from the washing area to the etching area, which may result in a defect in the substrate.

[0004] The technical problem to be solved by the present invention is to provide a guide device that guides a workpiece to prevent a barrier from coming into contact with the workpiece, and a workpiece processing device including the same.

[0005] The technical problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below.

[0006] An aspect of the workpiece processing device of the present invention for achieving the above technical problem comprises: a chamber housing including a first area and a second area for processing a workpiece into an internal space; a conveying unit for moving the workpiece from the first area to the second area; a barrier disposed between the first area and the second area and spaced apart from the workpiece on the workpiece; and a guide device disposed adjacent to the barrier and guiding the workpiece downward.

[0007] One aspect of the guide device of the present invention for achieving the above technical objective is installed in a workpiece processing device comprising a barrier for separating a first area and a second area for processing a workpiece, wherein the guide device comprises: a first support member installed on one side of the upper portion of a conveyor unit that moves the workpiece from the first area to the second area; a second support member installed on the other side of the upper portion of the conveyor unit; and a rotating body rotatably coupled to the first support member and the second support member, and including a plurality of ribs that protrude while forming a step with the surface of the main body, and is arranged adjacent to the barrier and guides the workpiece so that the workpiece and the barrier are spaced apart.

[0008] Specific details of other embodiments are included in the detailed description and drawings.

[0009] According to the present invention, the following effects can be obtained.

[0010] First, by guiding the workpiece, it is possible to prevent the workpiece from coming into contact with the barrier during the process of moving from the washing area to the etching area.

[0011] Second, by preventing contact between the workpiece and the barrier film, damage to the workpiece or defects in the workpiece can be prevented.

[0012] Third, it can reduce the need for separate manual work to adjust the spacing of the barriers.

[0013] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description below.

[0014] FIG. 1 is a block diagram schematically illustrating the internal configuration of a workpiece processing device according to some embodiments of the present invention.

[0015] FIG. 2 is a first exemplary diagram illustrating a wet etching chamber that constitutes a workpiece processing device according to some embodiments of the present invention.

[0016] FIG. 3 is a second exemplary diagram illustrating a wet etching chamber constituting a workpiece processing device according to some embodiments of the present invention.

[0017] FIG. 4 is a first exemplary diagram illustrating a guide device constituting a wet etching chamber according to some embodiments of the present invention.

[0018] FIG. 5 is a second exemplary diagram illustrating a guide device constituting a wet etching chamber according to some embodiments of the present invention.

[0019] FIG. 6 is a third exemplary diagram illustrating a guide device constituting a wet etching chamber according to some embodiments of the present invention.

[0020] FIG. 7 is a fourth exemplary diagram illustrating a guide device constituting a wet etching chamber according to some embodiments of the present invention.

[0021] FIG. 8 is a fifth exemplary diagram illustrating a guide device constituting a wet etching chamber according to some embodiments of the present invention.

[0022] FIG. 9 is a first illustrative diagram for explaining the internal structure of a guide device according to some embodiments of the present invention.

[0023] FIG. 10 is an illustrative diagram for explaining a support member constituting a guide device according to some embodiments of the present invention.

[0024] FIG. 11 is a first illustrative diagram for explaining a rotating body constituting a guide device according to some embodiments of the present invention.

[0025] FIG. 12 is a second exemplary diagram for explaining a rotating body constituting a guide device according to some embodiments of the present invention.

[0026] FIG. 13 is a third exemplary diagram for explaining a rotating body constituting a guide device according to some embodiments of the present invention.

[0027] FIG. 14 is a second exemplary diagram for explaining the internal structure of a guide device according to some embodiments of the present invention.

[0028] FIG. 15 is an illustrative diagram for explaining a detachment prevention member constituting a guide device according to some embodiments of the present invention.

[0029] Embodiments of the present invention will be described in detail below with reference to the attached drawings. Identical components in the drawings are denoted by the same reference numerals, and redundant descriptions thereof are omitted.

[0030] First, a workpiece processing device is described. The workpiece processing device can etch a workpiece using a chemical solution. The workpiece processing device can wet-etch the workpiece. The workpiece processing device can form a desired pattern on the workpiece by etching a portion of the thin film formed on the workpiece. For example, the workpiece may be a substrate, and the workpiece processing device may be a semiconductor manufacturing device including a wet etching chamber.

[0031] FIG. 1 is a block diagram schematically illustrating the internal configuration of a workpiece processing device according to some embodiments of the present invention. Referring to FIG. 1, the workpiece processing device (100) may be configured to include a first chamber (110), a second chamber (120), and a third chamber (130). FIG. 1 is an example in which the workpiece and the workpiece processing device are a substrate and a semiconductor manufacturing device, respectively. Hereinafter, the workpiece and the workpiece processing device will be described as a substrate and a semiconductor manufacturing device, respectively, but the workpiece and the workpiece processing device in the present invention are not limited thereto.

[0032] The substrate may be transported while loaded onto a stage. The substrate may be a substrate on which a circuit is formed. For example, the substrate may be any one of a flexible circuit board, a rigid circuit board, and a rigid-flexible circuit board. The substrate loaded onto the stage may pass through the first chamber (110), the second chamber (120), and the third chamber (130) in sequence. A continuous process may be performed in the first chamber (110), the second chamber (120), and the third chamber (130). The first chamber (110), the second chamber (120), and the third chamber (130) may process the substrate in-situ.

[0033] The first chamber (110) may be provided as a pretreatment chamber. In the first chamber (110), the substrate may be pretreated before wet etching. The first chamber (110) may treat the substrate using a pretreatment solution. The first chamber (110) may surface treat the substrate.

[0034] The third chamber (130) may be provided as a post-processing chamber. In the third chamber (130), the substrate may be post-processed after wet etching. The third chamber (130) may process the substrate using a chemical solution. The third chamber (130) may clean the substrate. The third chamber (130) may remove foreign substances remaining on the substrate after etching.

[0035] The second chamber (120) may be provided as a wet etching chamber. A substrate may be wet-etched in the second chamber (120). The second chamber (120) may wet-etch the substrate after removing residual pretreatment solution and foreign substances from the substrate. The second chamber (120) may include a washing area and an etching area. A continuous process may be carried out in the washing area and the etching area. In the washing area, residual pretreatment solution and foreign substances from the substrate may be removed. In the etching area, the substrate may be wet-etched.

[0036] However, it is not limited to this, and the second chamber (120) may include only an etching area. In this case, the first chamber (110) may be configured to include a washing area. The first chamber (110) can clean a surface-treated substrate. The first chamber (110) can remove pretreatment liquid and foreign substances remaining on the substrate.

[0037] Below, a case in which the second chamber (120) is configured to include a washing area and an etching area is described. FIG. 2 is a first exemplary diagram for explaining a wet etching chamber that constitutes a workpiece processing device according to some embodiment of the present invention. Referring to FIG. 2, the wet etching chamber (200) may be configured to include a chamber housing (210), a return section (220), a barrier (230), a first spraying section (240), a second spraying section (250), and a ventilation section (260).

[0038] The first direction (D1) and the second direction (D2) can form a two-dimensional plane. Either of the first direction (D1) and the second direction (D2) may be the X-axis direction and the other the Y-axis direction. Alternatively, either of the first direction (D1) and the second direction (D2) may be the left-right direction and the other the front-back direction. The third direction (D3) can form a three-dimensional solid with the first direction (D1) and the second direction (D2). The third direction (D3) is a direction perpendicular to the plane formed by the first direction (D1) and the second direction (D2). The third direction (D3) may be the Z-axis direction. Alternatively, the third direction (D3) may be the up-down direction.

[0039] The chamber housing (210) may have an internal space. The first injection unit (240), the second injection unit (250), the barrier (230), and the ventilation unit (260) may be installed in the internal space of the chamber housing (210).

[0040] Although not illustrated in FIG. 2, the chamber housing (210) may include an inlet and an outlet. A substrate (B) may be introduced into the internal space of the chamber housing (210) through the inlet while loaded in the return section (220). A substrate (B) may be discharged to the outside of the chamber housing (210) through the outlet while loaded in the return section (220).

[0041] The inlet and outlet of the chamber housing (210) can be connected to the first chamber (110) and the third chamber (130), respectively, for a continuous process. The first chamber (110) can be connected to the inlet of the chamber housing (210). A return unit (220) can connect the first chamber (110) and the inlet of the chamber housing (210). After the substrate (B) is processed by the first chamber (110), it can be moved to the inlet of the chamber housing (210) through the return unit (220). The third chamber (130) can be connected to the outlet of the chamber housing (210). A return unit (220) can connect the third chamber (130) and the outlet of the chamber housing (210). After the substrate (B) is processed by the wet etching chamber (200) and discharged through the outlet, it can be moved to the third chamber (130) through the return section (220).

[0042] The return section (220) can be connected to the first chamber (110) and the third chamber (130). The return section (220) can be connected to the first chamber (110) by passing through the inlet of the chamber housing (210). The return section (220) can be connected to the third chamber (130) by passing through the outlet of the chamber housing (210).

[0043] The return unit (220) can load the substrate (B) and return it to a destination. For example, the return unit (220) may be provided as a stage-type return means. The substrate (B) can pass through the first area (R1) and the second area (R2) in sequence while loaded in the return unit (220). The substrate (B) can pass through the first area (R1) while the first processing liquid is sprayed by the first spray unit (240). The substrate (B) can pass through the second area (R2) while the second processing liquid is sprayed by the second spray unit (250).

[0044] The transport unit (220) can move the substrate (B) placed on its upper surface. The substrate (B) can be moved from the first area (R1) to the second area (R2) by the transport unit (220). The substrate (B) can be moved from the first chamber (110) through the wet etching chamber (200) to the third chamber (130). However, it is not limited thereto, and it is also possible for the transport unit (220) to move from the first area (R1) to the second area (R2) while carrying the substrate (B).

[0045] In the present invention, the conveying unit (220) is not limited to being provided as a stage-type conveying means. In the present invention, it is also possible to convey the substrate (B) using a roll-to-roll method. When conveying the substrate (B) using a roll-to-roll method, the substrate (B) may be wound onto a roller. The substrate (B) may pass through the first region (R1) and the second region (R2) in sequence while wound onto the roller. The substrate (B) may be a flexible circuit board.

[0046] The barrier (230) can be installed as a side wall in the internal space of the chamber housing (210). The barrier (230) can be fixed in the internal space of the chamber housing (210). The barrier (230) can divide the internal space of the chamber housing (210) into a first area (R1) and a second area (R2).

[0047] The barrier (230) may be spaced apart from the return section (220). For example, the barrier (230) may be spaced apart from the return section (220) by a height of 2.0 mm to 6.0 mm. If the barrier (230) is spaced apart from the return section (220) by less than 2.0 mm, there is a touch risk with the substrate (B). On the other hand, if the barrier (230) is spaced apart from the return section (220) by more than 6.0 mm, the etching fume blocking efficiency may be reduced.

[0048] The barrier (230) may be spaced apart from the return section (220) and also spaced apart from the upper wall of the chamber housing (210). That is, the barrier (230) may not seal the first area (R1) and the second area (R2). The first area (R1) and the second area (R2) may be connected through a portion not blocked by the barrier (230). The first area (R1) and the second area (R2) may be connected through a first portion (S1) interposed between the barrier (230) and the return section (220). Additionally, the first area (R1) and the second area (R2) may be connected through a second portion (S2) interposed between the barrier (230) and the upper wall of the chamber housing (210). However, it is not limited thereto, and it is also possible for the first area (R1) and the second area (R2) to be connected only through the first portion (S1).

[0049] The first injection unit (240) may be positioned in a first area (R1) within the chamber housing (210). The first injection unit (240) may spray a first treatment liquid onto a substrate (B). The first injection unit (240) may spray the first treatment liquid when the substrate (B) enters the first area (R1). The first injection unit (240) may remove residual pretreatment liquid and foreign substances on the substrate (B) with the first treatment liquid. The first area (R1) may be provided as a washing area.

[0050] The first treatment liquid may be a liquid. For example, the first treatment liquid may be water. If the first treatment liquid is a liquid, the first spray unit (240) may be provided as a nozzle. The first treatment liquid may also be a gas. For example, the first treatment liquid may be compressed air. If the first treatment liquid is a gas, the first spray unit (240) may be provided as an air knife.

[0051] If the first processing liquid is a liquid, a liquid film may be formed on the substrate (B). The sum of the height of the substrate (B) and the height of the liquid film may be greater than the height of the first part (S1). With the liquid film formed on the substrate (B), fumes generated by the etching of the substrate (B) in the second region (R2) can be prevented from flowing into the first region (R1) through the first part (S1).

[0052] The first injection unit (240) may be provided in a single unit in the first area (R1). The first injection unit (240) may be positioned at an angle with respect to the longitudinal direction (D1) of the return unit (220). For example, the first injection unit (240) may be positioned so as to face the second area (R2) from the vertical direction of the upper surface of the return unit (220). However, it is not limited thereto, and it is also possible for the first injection unit (240) to be positioned perpendicular to the longitudinal direction (D1) of the return unit (220). Meanwhile, it is also possible for the first injection unit (240) to be provided in multiple units in the first area (R1).

[0053] The second injection unit (250) may be positioned in a second region (R2) within the chamber housing (210). The second injection unit (250) may spray a second processing liquid different from the first processing liquid onto the substrate (B). The second injection unit (250) may spray the second processing liquid when the substrate (B) enters the second region (R2). The second injection unit (250) may etch the substrate (B) with the second processing liquid. The second region (R2) may be provided as an etching region.

[0054] The second treatment solution may be a liquid. For example, the second treatment solution may be provided as an etching solution containing a chlorine compound. Alternatively, the second treatment solution may be provided as an etching solution containing a fluorine compound.

[0055] The second injection unit (250) may be provided in the second area (R2) in multiple numbers. For example, the second injection unit (250) may include three nozzles (251, 252, 253), such as a first nozzle (251), a second nozzle (252), and a third nozzle (253). The three nozzles (251, 252, 253) may be arranged to face the same direction. For example, the first nozzle (251), the second nozzle (252), and the third nozzle (253) may all be arranged perpendicular to the longitudinal direction (D1) of the return unit (220). However, not limited thereto, it is also possible for the three nozzles (251, 252, 253) to be arranged to face different directions. Two of the three nozzles (251, 252, 253) selected may be positioned to face the same direction, and the remaining nozzle may be positioned to face a different direction from these two nozzles. Alternatively, it is possible for all three nozzles (251, 252, 253) to be positioned to face different directions. Meanwhile, the second injection unit (250) may be provided in a single unit in the second area (R2).

[0056] Although not shown in FIG. 2, an outlet may be installed in the second region (R2). The outlet can discharge fumes generated by etching the substrate (B) in the second region (R2) to the outside. Through the outlet installed in the second region (R2), the fumes can be prevented from flowing into the first region (R1).

[0057] A ventilation unit (260) may be installed on the upper wall of the chamber housing (210). The ventilation unit (260) may draw in air inside the chamber housing (210). The ventilation unit (260) may discharge the first treatment liquid scattered in the first area (R1) to the outside. The ventilation unit (260) may discharge the second treatment liquid scattered in the second area (R2) to the outside.

[0058] A ventilation unit (260) may be provided in a single unit within the internal space of the chamber housing (210). The ventilation unit (260) may be installed on the upper wall of the chamber housing (210) within the second area (R2). Between the first area (R1) and the second area (R2), not only the first part (S1) but also the second part (S2) may be formed. The first treatment liquid scattered from the first area (R1) may move to the second area (R2) through the second part (S2) and be discharged to the outside through the ventilation unit (260).

[0059] Although not illustrated in FIG. 2, the ventilation unit (260) may also be installed on the upper wall of the chamber housing (210) within the first region (R1). In this case as well, between the first region (R1) and the second region (R2), not only the first part (S1) but also the second part (S2) may be formed. The second treatment liquid scattered from the second region (R2) may move to the first region (R1) through the second part (S2) and be discharged to the outside through the ventilation unit (260).

[0060] It is also possible to provide a plurality of ventilation units (260) in the internal space of the chamber housing (210). For example, the ventilation units (260) may include two ventilation units, such as a first ventilation unit (261) and a second ventilation unit (262). FIG. 3 is a second exemplary diagram for explaining a wet etching chamber that constitutes a workpiece processing device according to some embodiments of the present invention.

[0061] Referring to FIG. 3, a first fan (261) may be installed on the upper wall of a chamber housing (210) within a first area (R1). A second fan (262) may be installed on the upper wall of a chamber housing (210) within a second area (R2). A first treatment liquid scattered in the first area (R1) may be discharged to the outside through the first fan (261). A second treatment liquid scattered in the second area (R2) may be discharged to the outside through the second fan (262). Between the first area (R1) and the second area (R2), only a first part (S1) may be formed, and a second part (S2) may not be formed.

[0062] As previously explained, because the gap between the return section (220) and the blocking film (230) is very narrow, the substrate (B) may come into contact with the blocking film (230) during the process of moving from the first region (R1) to the second region (R2). In order to solve this problem, the present invention may provide a guide device that guides the substrate (B) to prevent the substrate (B) from coming into contact with the blocking film (230). The guide device will be described below. FIG. 4 is a first exemplary diagram illustrating a guide device that constitutes a wet etching chamber according to some embodiments of the present invention.

[0063] Referring to FIG. 4, a guide device (300) may be provided in a first area (R1). The guide device (300) may be placed on a return section (220) within the first area (R1). The guide device (300) may be placed adjacent to a barrier (230) within the first area (R1).

[0064] The guide device (300) may be provided in a single unit in the first area (R1), but is not limited thereto and may also be provided in multiple units in the first area (R1). For example, the guide device (300) may be provided in two units, including a first guide part (300a) and a second guide part (300b).

[0065] Referring to FIG. 5, the first guide section (300a) and the second guide section (300b) may be arranged in close proximity to each other. The first guide section (300a) and the second guide section (300b) may be arranged adjacent to the barrier (230) within the first region (R1). Referring to FIG. 6, the first guide section (300a) and the second guide section (300b) may also be arranged spaced apart from each other. The first guide section (300a) may be arranged adjacent to the barrier (230) within the first region (R1), but the second guide section (300b) may not be arranged adjacent to the barrier (230) within the first region (R1). FIG. 5 is a second exemplary diagram for explaining a guide device constituting a wet etching chamber according to some embodiment of the present invention. FIG. 6 is a third exemplary diagram for explaining a guide device constituting a wet etching chamber according to some embodiment of the present invention.

[0066] A guide device (300) may be provided in a first region (R1), but is not limited thereto and may also be provided in a second region (R2). Referring to FIG. 7, the guide device (300) may be placed on a return section (220) within the second region (R2) and may be placed adjacent to a barrier (230). It is also possible to provide a plurality of guide devices (300) within the second region (R2) in the same manner as provided in the first region (R1). FIG. 7 is a fourth exemplary diagram for explaining a guide device constituting a wet etching chamber according to some embodiment of the present invention.

[0067] It is also possible for the guide device (300) to be provided in both the first region (R1) and the second region (R2). Referring to FIG. 8, the first guide part (300a) may be provided in the first region (R1), and the second guide part (300b) may be provided in the second region (R2). Both the first guide part (300a) and the second guide part (300b) may be positioned adjacent to the barrier (230). However, this is not limited thereto, and it is also possible for only one of the first guide part (300a) and the second guide part (300b) to be positioned adjacent to the barrier (230). FIG. 8 is a fifth exemplary diagram for explaining a guide device constituting a wet etching chamber according to some embodiment of the present invention.

[0068] Meanwhile, although not shown in FIGS. 4 to 8, the guide device (300) may also be positioned between the return section (220) and the barrier (230). In this case, the guide device (300) may be provided so as not to come into contact with the barrier (230).

[0069] FIG. 9 is a first illustrative diagram for explaining the internal structure of a guide device according to some embodiment of the present invention. Referring to FIG. 9, the guide device (300) may be configured to include a first support member (310a), a second support member (310b), and a rotating body (320).

[0070] The first support member (310a) and the second support member (310b) can support the rotating body (320). The first support member (310a) and the second support member (310b) can be installed on both sides of the return unit (220), respectively. The first support member (310a) and the second support member (310b) are formed outside the substrate (B) and can be fixed to the return unit (220). The first support member (310a) and the second support member (310b) may not come into contact with the substrate (B) while the substrate (B) moves on the return unit (220).

[0071] Referring to FIG. 10, the first support member (310a) may include a groove (330). A rotating body (320) may be inserted into the groove (330) of the first support member (310a). Referring to FIG. 10 (a), the groove (330) may be bent. The groove (330) may be formed inwardly from the side of the first support member (310a) and subsequently formed inwardly from the bottom of the first support member (310a). The rotating body (320) may be inserted into the bent interior so that it does not easily detach from the groove (330) of the first support member (310a). Referring to FIG. 10 (b), it is also possible for the groove (330) not to be bent. The groove (330) may be formed only inwardly from the side of the first support member (310a). The first support member (310a) may include a plug (340) to prevent the rotating body (320) inserted into the groove (330) from easily detaching. The groove (330) described with reference to FIG. 10 (a) and (b) may be formed in the second support member (310b) in the same manner. FIG. 10 is an illustrative diagram for explaining the support members constituting a guide device according to some embodiments of the present invention.

[0072] Referring again to Fig. 9, the explanation will be provided.

[0073] The rotating body (320) can be rotatably coupled with the first support member (310a) and the second support member (310b). The rotating body (320) can rotate while inserted into the groove (330) within the pair of support members (310a, 310b). The rotating body (320) can rotate clockwise or counterclockwise depending on the direction of movement of the substrate (B). Referring to FIG. 9, when the substrate (B) moves from right to left, the rotating body (320) can rotate clockwise. Although not shown in FIG. 9, when the substrate (B) moves from left to right, the rotating body (320) can rotate counterclockwise. The rotation of the rotating body (320) can reduce friction between the substrate (B) and the rotating body (320).

[0074] The rotating body (320) may be made of a material having a low coefficient of friction. The rotating body (320) may be made of a soft material. For example, the rotating body (320) may be made of Teflon resin. If the rotating body (320) is made of such a material, when the rotating body (320) guides a moving substrate (B), the frictional force between the rotating body (320) and the substrate (B) can be reduced, and damage to the substrate (B) can be minimized.

[0075] The rotating body (320) may include a main body (321), a bracket (322), and a plurality of ribs. FIG. 11 is a first illustrative diagram for explaining a rotating body that constitutes a guide device according to some embodiment of the present invention. Referring to FIG. 11, the bracket (322) may be formed at both ends of the main body (321). The bracket (322) may be provided as a pair (322a, 322b). The length of the pair of brackets (322a, 322b) may be extended in the horizontal direction (D2) from both ends of the main body (321). The pair of brackets (322a, 322b) may be inserted into the groove (330) of the first support member (310a) and the groove (330) of the second support member (310b), respectively.

[0076] A plurality of ribs may be formed protruding from the surface of the main body (321). A plurality of ribs may protrude in a vertical direction (D3) from the surface of the main body (321). For example, the plurality of ribs may include a first rib (323a) and a second rib (323b). The first rib (323a) and the second rib (323b) may be formed to have a step with respect to the surface of the main body (321). For example, the first rib (323a) and the second rib (323b) may have a step with respect to the surface of the main body (321) of 1.0 mm to 2.0 mm. The first rib (323a) and the second rib (323b) may be provided in a ring shape on the surface of the main body (321).

[0077] The first rib (323a) and the second rib (323b) can guide a substrate (B) moving on the return section (220). The first rib (323a) and the second rib (323b) can guide the substrate (B) so that the substrate (B) does not come into contact with the blocking film (230). The first rib (323a) and the second rib (323b) can guide a non-circuit area on the substrate (B). The first rib (323a) and the second rib (323b) can guide the substrate (B) without damaging the circuit portion of the substrate (B). The rotating body (320) can be formed with a stepped structure by including the first rib (323a) and the second rib (323b).

[0078] The diameter of the main body (321) may be 40 mm or less. For example, the diameter of the main body (321) may be 30 mm to 40 mm. In this way, the distance between the center of the main body (321) and the barrier (230) becomes 20 mm (radius of the main body (321) + 10 mm separation due to the bracket (322) = 30 mm or less. The step difference caused by the first rib (323a) and the second rib (323b) is set to 1.0 mm to 2.0 mm. When the distance between the center of the main body (321) and the barrier (230) is 30 mm or less and the step difference between the first rib (323a) and the second rib (323b) is set to 1.0 mm to 2.0 mm, stable blocking between the etching solution and the cleaning solution is possible by forming a liquid film at the lower center portion of the rotating body (320). If the step difference between the first rib (323a) and the second rib (323b) is 2.0 mm or more, there is a risk in terms of stable blocking, and if the step difference between the first rib (323a) and the second rib (323b) is 1.0 mm or less, there is a risk in terms of the substrate (B) of the rotating body (321) touching.

[0079] A plurality of ribs may further include a third rib (323c) in addition to the first rib (323a) and the second rib (323b). FIG. 12 is a second illustrative diagram for explaining a rotating body constituting a guide device according to some embodiment of the present invention. Referring to FIG. 12, the third rib (323c) may be positioned between the first rib (323a) and the second rib (323b). The third rib (323c) may be provided in multiple numbers, but is not limited thereto and may be provided in a single number. FIG. 12 is an example of a case where two third ribs (323c) are positioned between the first rib (323a) and the second rib (323b).

[0080] The third rib (323c) can guide the substrate (B) moving on the return section (220) just like the first rib (323a) and the second rib (323b). The third rib (323c) can guide the non-circuit area on the substrate (B). The third rib (323c) can guide the middle part of the substrate (B) when the middle part of the substrate (B) is raised by bowing, thereby preventing the middle part from coming into contact with the barrier (230).

[0081] The first rib (323a) and the second rib (323b) may be formed to have equal height. The third rib (323c) may be formed to have equal height to the first rib (323a) and the second rib (323b). However, it is not limited thereto, and it is also possible for the third rib (323c) to be formed to have a different height from the first rib (323a) and the second rib (323b). Referring to FIG. 13, the third rib (323c) may have a lower height than the first rib (323a) and the second rib (323b). A first height difference (H1) may be formed between the first rib (323a) and the third rib (323c). Likewise, a first height difference (H1) can also be formed between the second rib (323b) and the third rib (323c). FIG. 13 is a third exemplary diagram for explaining a rotating body constituting a guide device according to some embodiments of the present invention.

[0082] As previously explained, the rotating body (320) is inserted into each groove (330) of a pair of support members (310a, 310b), and each groove (330) can be bent so that the rotating body (320) does not easily escape. However, even if the groove (330) is formed in this way, there is a possibility that the rotating body (320) may escape from the groove (330) depending on the moving speed of the substrate (B). The guide device (300) may further include an anti-escape member (350) to prevent the rotating body (320) from escaping from the groove (330).

[0083] FIG. 14 is a second exemplary diagram illustrating the internal structure of a guide device according to some embodiments of the present invention. Referring to FIG. 14, the anti-detachment member (350) can fix the rotating body (320) to the groove (330) of the support members (310a, 310b). The anti-detachment member (350) may be provided as a fixing member including an elastic body. However, it is not limited thereto, and the anti-detachment member (350) may also be provided as a fixing member not including an elastic body.

[0084] Referring to FIG. 15, when the anti-detachment member (350) is provided as a fixed member including an elastic body, it may include a round bar (410), a first elastic body (420), a second elastic body (430), a first snap ring (440), and a second snap ring (450). FIG. 15 is an illustrative diagram for explaining an anti-detachment member constituting a guide device according to some embodiments of the present invention.

[0085] The round bar (410) can penetrate the first support member (310a). Hereinafter, the portion protruding to one side of the first support member (310a) is defined as the first portion (410a) of the round bar (410), and the portion protruding to the other side of the first support member (310a) is defined as the second portion (410b) of the round bar (410). The end of the second portion (410b) may be adjacent to the rotating body (320).

[0086] The first elastic body (420) may surround the first part (410a) of the round bar (410). The second elastic body (430) may surround the second part (410b) of the round bar (410). For example, the first elastic body (420) and the second elastic body (430) may be provided as springs. The first elastic body (420) and the second elastic body (430) may guide the round bar (410) to move in the up-and-down direction (D3).

[0087] The first snap ring (440) can be fastened to the end of the first part (410a). The first snap ring (440) can secure the first elastic body (420) to the first part (410a). The first snap ring (440) can prevent the first elastic body (420) from detaching from the first part (410a). The second snap ring (450) can be fastened to the end of the second part (410b). The second snap ring (450) can secure the second elastic body (430) to the second part (410b). The second snap ring (450) can prevent the second elastic body (430) from detaching from the second part (410b).

[0088] The anti-detachment member (350) is formed with such a structure, so that when the rotating body (320) rises, the tension of the first elastic body (420) and the second elastic body (430) guides the first bracket (322a) in the opposite direction to the direction in which the rotating body (320) rises, thereby preventing the rotating body (320) from detaching from the groove (330) of the support members (310a, 310b).

[0089] Meanwhile, although FIG. 15 describes a detachment prevention member (350) installed on the first support member (310a), it is obvious that a detachment prevention member (350) of an equivalent structure can also be installed on the second support member (310b).

[0090] Meanwhile, if the anti-detachment member (350) is provided as a fixed member that does not include an elastic body, a bolt can be inserted into the bracket (322a, 322b) to prevent the rotating body (320) from detaching from the groove (330) of the support member (310a, 310b).

[0091] Although embodiments of the present invention have been described above with reference to the attached drawings, the present invention is not limited to the above embodiments and can be manufactured in various different forms, and those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical concept or essential features of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

[0092] The present invention can be applied to a substrate processing apparatus and a substrate processing method that perform a wet etching process.

Claims

1. A chamber housing comprising a first area and a second area for processing a workpiece into an internal space; A conveying unit that moves the above-mentioned workpiece from the first area to the second area; A barrier disposed between the first region and the second region and spaced apart from the workpiece on the workpiece; and A workpiece processing device comprising a guide device positioned adjacent to the above barrier and guiding the workpiece.

2. In Paragraph 1, The above guide device is, A first support member installed on one side of the upper portion of the above-mentioned return section; A second support member installed on the upper other side of the above-mentioned return member; and A workpiece processing device comprising a rotating body rotatably coupled to the first support member and the second support member.

3. In Paragraph 2, The above rotating body is, entity; A bracket formed at both ends of the main body and coupled to the first support member and the second support member, respectively; and It includes a plurality of ribs that protrude while forming a step with the surface of the main body, and The above plurality of ribs is a workpiece processing device that guides the workpiece.

4. In Paragraph 3, A workpiece processing device comprising a plurality of ribs, each including a first rib and a second rib formed adjacent to both ends of the main body.

5. In Paragraph 4, A workpiece processing device comprising at least one third rib formed between the first rib and the second rib, wherein the plurality of ribs above further include 6. In Paragraph 5, A workpiece processing device in which the height of the third rib is equal to or lower than the height of the first rib.

7. In Paragraph 3, The first support member and the second support member include a groove, The above bracket is a workpiece processing device inserted into the above groove.

8. In Paragraph 7, The above groove is a processing device for a workpiece that is bent.

9. In Paragraph 7, The above guide device is, It further includes a stopper that closes the above groove, or A workpiece processing device further comprising a detachment prevention member for fixing the bracket inserted into the above groove.

10. In Paragraph 9, The above-mentioned anti-detachment member is, A round bar penetrating the first support member; A first elastic body surrounding a first portion of the round bar protruding to one side of the first support member; A second elastic body surrounding the second portion of the round bar protruding to the other side of the first support member; A first snap ring that is connected to the end of the first part and fixes the first elastic body to the first part; and A workpiece processing device comprising a second snap ring that is connected to the end of the second part and fixes the second elastic body to the second part.

11. In Paragraph 2, The above-mentioned rotating body is a workpiece processing device comprising a soft material.

12. In Paragraph 1, The above guide device is a workpiece processing device placed in the first area.

13. In Paragraph 1, The above guide device is a workpiece processing device comprising a first guide section and a second guide section.

14. In Paragraph 13, A workpiece processing device in which the first guide portion is disposed in the first area and the second guide portion is disposed in the second area.

15. In Paragraph 1, The above workpiece is a substrate on which a circuit is formed, and The above guide device is a workpiece processing device that guides the non-circuit area of ​​the above substrate.

16. Installed in a workpiece processing device comprising a barrier for separating a first area and a second area for processing the workpiece, respectively, A first support member installed on one side of the upper portion of a conveyor unit that moves the workpiece from the first area to the second area; A second support member installed on the upper other side of the above-mentioned return member; and It includes a rotating body that is rotatably coupled to the first support member and the second support member, and includes a plurality of ribs that protrude while forming a step with the surface of the main body. A guide device positioned adjacent to the above barrier and guiding the workpiece so that the workpiece and the barrier are spaced apart.

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