MEMS sensor module
By using partition walls and adhesive to wrap the ASIC chip in the MEMS sensor module, the problem of ASIC chip heat affecting other MEMS sensors is solved, achieving thermal isolation and ensuring the normal operation and performance of the sensor components.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2026-04-16
AI Technical Summary
In existing MEMS sensor modules, the heat generated by the ASIC chip during operation is transmitted through the circuit board or air, affecting the performance of temperature-sensitive MEMS sensor components and causing them to malfunction.
The MEMS sensor module is divided into two cavities by a partition wall. An ASIC chip is wrapped in one of the cavities, heat is isolated by glue, and a gold finger layer surrounds each cavity to reduce heat transfer. The other cavity is connected to the outside through a slot for ventilation.
It effectively isolates the heat generated by the ASIC chip from the impact on another MEMS sensor component, ensuring its normal operation, reducing thermal flow disturbance, and improving overall performance.
Smart Images
Figure CN2024123564_16042026_PF_FP_ABST
Abstract
Description
MEMS sensor module Technical Field
[0001] This utility model relates to the field of sensors, and in particular to a MEMS sensor module. Background Technology
[0002] The MEMS sensor module of the related technology will have multiple MEMS sensor components built in to realize at least one sensor function, such as pressure sensor, microphone sensor, gas sensor, etc.
[0003] MEMS sensor components include MEMS chips and ASIC chips. However, some MEMS sensor components' ASIC chips generate a lot of heat when they are working. This heat is spread through the thermal movement of air within the circuit board or module, which affects temperature-sensitive MEMS sensor components, causing their performance to degrade and making them unable to work properly. Technical issues
[0004] Therefore, it is necessary to provide a new MEMS sensor module to solve the above-mentioned technical problems. Technical solutions
[0005] The purpose of this invention is to overcome the above-mentioned technical problems and provide a MEMS sensor module that can prevent the large amount of heat generated by the ASIC chip of one MEMS sensor component from affecting the other MEMS sensor component.
[0006] To achieve the above objectives, this utility model provides a MEMS sensor module, including a sidewall forming a cavity, a first circuit board disposed at the top of the sidewall, and a second circuit board disposed at the bottom of the sidewall. The MEMS sensor module further includes a partition wall disposed within the cavity and connected to the sidewall, the partition wall dividing the cavity into a first cavity and a second cavity. A first MEMS sensor assembly encapsulated with adhesive is disposed in the first cavity, and a second MEMS sensor assembly is disposed in the second cavity. A first gold finger layer is disposed between the sidewall and the partition wall and the first circuit board, the first gold finger layer surrounding the first cavity and the second cavity respectively. A second gold finger layer is disposed between the sidewall and the partition wall and the second circuit board, the second gold finger layer surrounding the first cavity and the second cavity respectively. The first gold finger layer at the partition wall has a slot communicating with the first cavity and the second cavity.
[0007] Preferably, the first MEMS sensor assembly includes a first ASIC chip fixed to the second circuit board, a first MEMS chip stacked and fixed to the first ASIC chip, a first bonding gold wire connecting the first ASIC chip and the first MEMS chip, and a second bonding gold wire connecting the first ASIC chip and the second circuit board. The second MEMS sensor assembly includes a second ASIC chip fixed to the second circuit board, a second MEMS chip fixed to the second circuit board, a third bonding gold wire connecting the second ASIC chip and the second MEMS chip, and a fourth bonding gold wire connecting the second ASIC chip and the second circuit board. The first ASIC chip, the first MEMS chip, the first bonding gold wire, and the second bonding gold wire are completely encapsulated by the adhesive.
[0008] Preferably, the total area of the slot is less than 6400 μm. 2 .
[0009] Preferably, the inner surface of the sidewalls that form the cavity is a metallized surface.
[0010] Preferably, the first gold finger layer includes a first portion of the first gold finger layer disposed on the side wall and the partition wall, and a second portion of the first gold finger layer disposed on the first circuit board. The first portion of the first gold finger layer and the second portion of the first gold finger layer are combined to form the first gold finger layer, and the slot is disposed on the first portion of the first gold finger layer.
[0011] Preferably, both the first circuit board and the second circuit board are embedded with capacitors and resistors to eliminate high-frequency signal interference.
[0012] Preferably, the second circuit board has a through-hole corresponding to the position of the second MEMS chip, and the through-hole connects the second MEMS chip to the outside. Beneficial effects
[0013] In the MEMS sensor module of this invention, the first gold finger layer surrounds the first cavity and the second cavity respectively, and the second gold finger layer surrounds the first cavity and the second cavity respectively, thereby dividing the areas of the first cavity and the second cavity. In addition, the MEMS sensor component including the ASIC chip that generates a lot of heat during operation is wrapped with glue, thereby reducing the heat flow disturbance caused by the large amount of heat generated by the ASIC chip during operation. This arrangement can prevent the large amount of heat generated by the ASIC chip of one MEMS sensor component from affecting the other MEMS sensor component. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 is a perspective view of the MEMS sensor module of this utility model;
[0016] Figure 2 is an exploded perspective view of the MEMS sensor module of this utility model;
[0017] Figure 3 is an exploded perspective view of the MEMS sensor module of this utility model from another angle;
[0018] Figure 4 is a cross-sectional view of the MEMS sensor module of this utility model. The best embodiment of the present invention
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.
[0020] Please refer to Figures 1-4, which illustrate the MEMS sensor module 100 provided by this invention. The MEMS sensor module 100 includes a sidewall 1 forming a cavity 10, a first circuit board 2 disposed at the top of the sidewall 1, a second circuit board 3 disposed at the bottom of the sidewall 1, a partition wall 4 disposed within the cavity 10 and connected to the sidewall 1, and a first MEMS sensor assembly 5 and a second MEMS sensor assembly 7 disposed within the cavity 10. The first MEMS sensor assembly 5 and the second MEMS sensor assembly 7 can realize at least one sensor function such as a pressure sensor, a microphone sensor, and a gas sensor.
[0021] The partition wall 4 divides the cavity 10 into a first cavity 11 and a second cavity 12.
[0022] The first cavity 11 contains the first MEMS sensor assembly 5, which is wrapped with adhesive 6, and the adhesive 6 can be a jelly adhesive.
[0023] The second cavity 12 contains the second MEMS sensor assembly 7.
[0024] A first gold finger layer 8 is provided between the sidewall 1 and the partition wall 4 and the first circuit board 2. The first gold finger layer 8 surrounds the first cavity 11 and the second cavity 12 respectively. A second gold finger layer 9 is provided between the sidewall 1 and the partition wall 4 and the second circuit board 3. The second gold finger layer 9 surrounds the first cavity 11 and the second cavity 12 respectively. The first gold finger layer 8 and the second gold finger layer 9 divide the regions of the first cavity 11 and the second cavity 12, and the first MEMS sensor assembly 5 and the second MEMS sensor assembly 7 each have their own respective regions.
[0025] The first MEMS sensor assembly 5 includes a first ASIC chip 51 fixed to the second circuit board 3, a first MEMS chip 52 stacked and fixed to the first ASIC chip 51, a first bonding gold wire 53 connecting the first ASIC chip 51 and the first MEMS chip 52, and a second bonding gold wire 54 connecting the first ASIC chip 51 and the second circuit board 3. The first ASIC chip 51, the first MEMS chip 52, the first bonding gold wire 53, and the second bonding gold wire 54 are completely encapsulated by the adhesive 6.
[0026] The second MEMS sensor assembly 7 includes a second ASIC chip 71 fixed to the second circuit board 3, a second MEMS chip 72 fixed to the second circuit board 3, a third bonding gold wire 73 connecting the second ASIC chip 71 and the second MEMS chip 72, and a fourth bonding gold wire 74 connecting the second ASIC chip 71 and the second circuit board 3.
[0027] Alternatively, the first gold finger layer 8 may include a first portion 81 of the first gold finger layer disposed on the sidewall 1 and the partition wall 4, and a second portion 82 of the first gold finger layer disposed on the first circuit board 2. The projections of the first portion 81 and the second portion 82 of the first gold finger layer coincide, and the first portion 81 and the second portion 82 of the first gold finger layer are combined to form the first gold finger layer 8. Of course, the first gold finger layer 8 can also be formed in other feasible ways, and is not limited to including the combination of the two portions.
[0028] Similarly, the second gold finger layer 9 may include a first portion 91 of the second gold finger layer disposed on the sidewall 1 and the partition wall 4, and a second portion 92 of the second gold finger layer disposed on the second circuit board 3. The projections of the first portion 91 and the second portion 92 of the second gold finger layer coincide, and the first portion 91 and the second portion 92 of the second gold finger layer are combined to form the second gold finger layer 9. Of course, the second gold finger layer 9 can also be formed in other feasible ways and is not limited to including the combination of the two portions.
[0029] The first gold finger layer 8 at the partition wall 4 has a slot 80 connecting the first cavity 11 and the second cavity 12. Specifically, the slot 80 is located in the first portion 81 of the first gold finger layer. The slot 80 can meet the ventilation requirements of the MEMS sensor module 100, reducing the need for vents in the sidewall 1, the first circuit board 2, and the second circuit board 3 of the MEMS sensor module 100, facilitating the design of backend applications and saving costs. Of course, in other embodiments, the slot 80 can also be located in the second portion 82 of the first gold finger layer, or it can be located in both the first portion 81 and the second portion 82 of the first gold finger layer. The total area of the slot 80 can be set to less than 6400 μm. 2 .
[0030] In this embodiment, the second circuit board 3 has a through-hole 31 corresponding to the position of the second MEMS chip 72, and the through-hole 31 connects the second MEMS chip 72 to the outside. Alternatively, the through-hole 31 can be a sound inlet, and the second MEMS chip 72 can be a MEMS microphone chip.
[0031] Alternatively, the inner surface of the sidewall 1 that forms the cavity 10 is metallized to satisfy the ability of the MEMS sensor module 100 to resist radio frequency interference.
[0032] Alternatively, the first circuit board 2 and the second circuit board 3 may be embedded with capacitors and resistors to eliminate high-frequency signal interference.
[0033] In the MEMS sensor module of this invention, the first gold finger layer surrounds the first cavity and the second cavity respectively, and the second gold finger layer surrounds the first cavity and the second cavity respectively, thereby dividing the areas of the first cavity and the second cavity. In addition, the MEMS sensor component including the ASIC chip that generates a lot of heat during operation is wrapped with glue, thereby reducing the heat flow disturbance caused by the large amount of heat generated by the ASIC chip during operation. This arrangement can prevent the large amount of heat generated by the ASIC chip of one MEMS sensor component from affecting the other MEMS sensor component.
[0034] The above description is merely an embodiment of this utility model. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this utility model, but these improvements all fall within the protection scope of this utility model.
Claims
1. A MEMS sensor module, comprising a sidewall forming a cavity, a first circuit board disposed on the top of the sidewall, and a second circuit board disposed on the bottom of the sidewall, characterized in that, The MEMS sensor module further includes a partition wall disposed within the cavity and connected to the side wall, the partition wall dividing the cavity into a first cavity and a second cavity. A first MEMS sensor assembly encapsulated in adhesive is disposed in the first cavity, and a second MEMS sensor assembly is disposed in the second cavity. A first gold finger layer is disposed between the side wall and the partition wall and the first circuit board, the first gold finger layer surrounding the first cavity and the second cavity respectively. A second gold finger layer is disposed between the side wall and the partition wall and the second circuit board, the second gold finger layer surrounding the first cavity and the second cavity respectively. The first gold finger layer at the partition wall has a slot communicating with the first cavity and the second cavity.
2. The MEMS sensor module according to claim 1, characterized in that, The first MEMS sensor assembly includes a first ASIC chip fixed to the second circuit board, a first MEMS chip stacked and fixed to the first ASIC chip, a first bonding gold wire connecting the first ASIC chip and the first MEMS chip, and a second bonding gold wire connecting the first ASIC chip and the second circuit board. The second MEMS sensor assembly includes a second ASIC chip fixed to the second circuit board, a second MEMS chip fixed to the second circuit board, a third bonding gold wire connecting the second ASIC chip and the second MEMS chip, and a fourth bonding gold wire connecting the second ASIC chip and the second circuit board. The first ASIC chip, the first MEMS chip, the first bonding gold wire, and the second bonding gold wire are completely encapsulated by the adhesive.
3. The MEMS sensor module according to claim 1, characterized in that, The total area of the slot is less than 6400 μm. 2 .
4. The MEMS sensor module according to claim 1, characterized in that, The inner surface of the sidewalls that form the cavity is a metallized surface.
5. The MEMS sensor module of claim 1, wherein, The first gold finger layer includes a first portion of the first gold finger layer disposed on the side wall and the partition wall, and a second portion of the first gold finger layer disposed on the first circuit board. The first portion of the first gold finger layer and the second portion of the first gold finger layer are combined to form the first gold finger layer, and the slot is disposed on the first portion of the first gold finger layer.
6. The MEMS sensor module according to claim 1, characterized in that, Both the first circuit board and the second circuit board have embedded capacitors and resistors to eliminate high-frequency signal interference.
7. The MEMS sensor module according to claim 2, characterized in that, The second circuit board has a through-hole corresponding to the position of the second MEMS chip, and the through-hole connects the second MEMS chip to the outside.
Citation Information
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