Electronic device comprising conductive line

Abstract

According to one embodiment, an electronic device may comprise: a side member including a conductive portion; a printed circuit board (PCB); a flexible PCB (FPCB) electrically connected to the PCB and disposed adjacent to the conductive portion; at least one dome switch disposed on the FPCB and electrically connected to a first conductive line; and a wireless communication circuit disposed on the PCB and configured to transmit and / or receive a radio frequency (RF) signal of a designated frequency band by supplying power to the conductive portion, wherein the FPCB includes the first conductive line for transmitting a signal, the first conductive line including a plurality of curved portions, through which a signal may be transmitted to or received from the at least one dome switch.

Description

Electronic device including a conductive line

[0001] The present disclosure relates to an electronic device comprising a conductive line.

[0002] In order to electrically connect various electronic components within an electronic device, the electronic device may include various types of connecting members. For example, the electronic device may provide electrical connections between various electronic components through conductive lines or conductive vias formed within a flexible printed circuit board (FPCB).

[0003] According to one embodiment, the electronic device comprises a side member including a conductive portion, a printed circuit board (PCB), a flexible PCB connected to the PCB and disposed adjacent to the conductive portion, at least one dome switch disposed on the FPCB and electrically connected to the first conductive line, and a wireless communication circuit disposed on the PCB and fed to the conductive portion to transmit and / or receive a radio frequency (RF) signal of a designated frequency band, wherein the FPCB includes a first conductive line for transmitting a signal, the first conductive line includes a plurality of curved portions, and a signal may be transmitted to the at least one dome switch or received from the at least one dome switch through the plurality of curved portions of the first conductive line.

[0004] According to one embodiment, an electronic device may include a side member including a conductive portion, a printed circuit board (PCB), a side key, and a wireless communication circuit disposed on the PCB and fed to the conductive portion to transmit and / or receive a radio frequency (RF) signal of a designated frequency band. A portion of the side key may be disposed in the hole, and the side key may be connected to the PCB and may include a flexible PCB (FPCB) disposed adjacent to the conductive portion and including a first conductive line for transmitting a signal, and at least one dome switch disposed on the FPCB and electrically connected to the first conductive line. The conductive portion may include a hole, and the first conductive line may include a plurality of curved portions, and a signal may be transmitted to the at least one dome switch or received from the at least one dome switch through the plurality of curved portions of the first conductive line.

[0005] FIG. 1 is a drawing illustrating an electronic device in a network environment according to one embodiment.

[0006] FIG. 2 is a drawing illustrating an electronic device according to one embodiment.

[0007] FIG. 3 is a drawing illustrating an electronic device including a side key according to one embodiment.

[0008] FIG. 4 is a drawing illustrating area A in which a side key including an FPCB according to one embodiment is placed.

[0009] FIG. 5 is a drawing illustrating area A in which a non-conductive member is removed and area A in which at least one dome switch of a side key is removed, according to one embodiment.

[0010] FIG. 6a is a drawing illustrating a first conductive line included in an FPCB according to one embodiment.

[0011] FIG. 6b illustrates a method for reducing or preventing parasitic resonance through a first conductive line including a conductive pattern comprising a plurality of curved portions according to one embodiment.

[0012] FIG. 7 is a drawing illustrating an FPCB including a plurality of layers according to one embodiment.

[0013] FIG. 8 is a side view of an electronic device according to one embodiment.

[0014] FIG. 9 is a diagram illustrating the electrical connection relationship between each of the dome portion and the contact portion included in at least one dome switch according to one embodiment and the connection pads.

[0015] FIG. 10 is a diagram illustrating the electrical connection relationship between at least one dome switch and conductive pads according to one embodiment.

[0016] FIG. 11 is a drawing illustrating an FPCB including a conductive line that does not include a conductive pattern according to one embodiment.

[0017] FIG. 12 is a drawing illustrating an FPCB having additional conductive patterns than the FPCB of FIG. 7 according to one embodiment.

[0018] FIG. 13 is a drawing illustrating an FPCB (1300) with the first conductive region and the second conductive region removed according to one embodiment.

[0019] FIG. 14 is a drawing illustrating various FPCBs according to one embodiment.

[0020] FIG. 15 is a graph of the radiation performance of an antenna including a first conductive portion when various FPCBs according to one embodiment are included in an electronic device.

[0021] Figure 16 is a diagram illustrating the change in reflection coefficient according to the width of the conductive pattern.

[0022] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0023] Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments and should be understood to include various modifications, equivalents, and / or alternatives of the embodiments of the present invention.

[0024] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with an electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0025] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0026] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0027] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0028] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0029] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0031] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0032] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0033] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0037] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0039] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi Direct (wireless fidelity direct), or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beamforming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0042] An antenna module (197) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197). According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0043] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0044] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0045] The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0046] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any component (e.g., the first) is referred to as "coupled" or "connected" to another component (e.g., the second), with or without the terms "functionally" or "communicationally," it means that said component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0047] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0048] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0049] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., CD-ROM (compact disc read-only memory)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0050] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Additionally or substantially, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0051] FIG. 2 is a drawing illustrating an electronic device according to one embodiment.

[0052] Referring to FIG. 2, an electronic device (101) according to one embodiment may include a housing (220) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (or side wall) (210C) surrounding the space between the first surface (210A) and the second surface (210B). In one embodiment, the housing (220) may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIG. 2B.

[0053] For example, the housing (220) may include a front plate (202) forming part of a first surface (210A), a rear cover (211) forming at least part of a second surface (210B), and / or a frame (210) forming at least part of a third surface (210C). The frame (210) may include a side member (215) and a support plate (320) extending from the side member (215) toward the inside of the electronic device (101), as described below.

[0054] According to one embodiment, the first surface (210A) of the electronic device (101) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. In one embodiment, the front plate (202) may include a curved portion that extends seamlessly from the first surface (210A) toward the rear cover (211) at at least one side edge portion.

[0055] According to one embodiment, the second surface (210B) may be formed by a substantially opaque rear cover (211). The rear cover (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. According to one embodiment, the rear cover (211) may include a curved portion that extends seamlessly from the second surface (210B) toward the front plate (202) at least at one end.

[0056] According to one embodiment, a side member forming a side (210C) of an electronic device (101) may be combined with a front plate (202) and a rear cover (211) and may be formed by a frame (210) comprising a metal and / or a polymer. In one embodiment, the rear cover (211) and the frame (210) may be formed integrally and may comprise substantially the same material (e.g., a metallic material such as aluminum).

[0057] According to one embodiment, the electronic device (101) may include at least one of a display (201), a first camera module (205), a side key (217), or a first connector hole (208). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the side key (217)) or additionally include other components. For example, within the area provided by the front plate (202), a sensor such as a proximity sensor or an ambient light sensor may be integrated into the display (201) or positioned adjacent to the display (201).

[0058] For example, the display (201) may be exposed through a significant portion of the front plate (202). In one embodiment, the edge of the display (201) may be formed to be largely the same as the adjacent outer shape (e.g., curved surface) of the front plate (202). In one embodiment, to expand the area where the display (201) is exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be largely the same. In one embodiment, a recess or opening may be formed in a portion of the screen display area of ​​the display (201), and other electronic components aligned with the recess or opening, such as a first camera module (205), a proximity sensor or an illuminance sensor not shown, may be included.

[0059] In one embodiment, the display (201) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0060] According to one embodiment, the display (201) may include an area (101B) (e.g., a sensing area) for identifying the user's biometric information (e.g., information about a fingerprint). For example, the display (201) may include a sensor for identifying the user's biometric information (e.g., information about a fingerprint), and the sensor may acquire the biometric information (e.g., a fingerprint) when the user contacts a part of the display (201) with a part of the body (e.g., a finger).

[0061] In one embodiment, the electronic device (101) may include a microphone hole (203) and / or at least one speaker hole (207). A microphone for acquiring external sound may be placed inside the microphone hole (203), and at least one audio module may be placed inside the electronic device (101) to detect the direction of sound.

[0062] In one embodiment, the electronic device (101) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state by including a sensor module (204). The sensor module (204) may further include, for example, a proximity sensor disposed on a first surface (210A) of the housing (220), a fingerprint sensor integrated into or adjacent to the display (201), and / or a biosensor (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (220). The electronic device (101) may further include at least one of a sensor module not illustrated, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0063] In one embodiment, the electronic device (101) may include a second camera module (255) disposed on a second surface (210B). The first camera module (205) and the second camera module (255) may include one or more lenses, an image sensor, and / or an image signal processor. A flash, not illustrated, may be disposed on the second surface (210B). The flash may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101).

[0064] According to one embodiment, the electronic device (101) may include a camera cover (284). For example, the electronic device (101) may include a camera cover (284) disposed on a second surface (210B). For example, the camera cover (284) may cover a second camera module (255). For example, the camera cover (284) may be disposed in a designated direction (e.g., -z direction) relative to the second camera module (255). For example, the camera cover (284) may protect the camera module (e.g., the second camera module (255)) from external impact.

[0065] According to one embodiment, the side key (217) may be placed on the side (210C) of the housing (220).

[0066] In one embodiment, the first connector hole (208) may include a first connector hole (208) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device.

[0067] In FIG. 2, the electronic device (101) is depicted as being of a bar type, but this is merely an example, and in reality, the electronic device (101) may correspond to various types of devices. For example, the electronic device (101) may correspond to a foldable device, a slideable device, a wearable device (e.g., a smart watch, wireless earphones), or a tablet PC. Accordingly, the technical concept disclosed in this document is not limited to the bar-type device shown in FIG. 2 and can be applied to various types of devices.

[0068] The rear cover (211) of the present disclosure may be replaced with various terms. For example, the term rear cover may be replaced with the terms rear plate, plate, rear housing, housing, or non-conductive material covering the rear.

[0069] FIG. 3 is a drawing illustrating an electronic device including a side key according to one embodiment.

[0070] Referring to FIG. 3, an electronic device (101) according to one embodiment may include a side member (215), a support plate (320), a side key (217), a battery (189) and / or a PCB (330).

[0071] According to one embodiment, the side member (215) may include a plurality of conductive portions, and the plurality of conductive portions may include a first conductive portion (311), a second conductive portion (312), a third conductive portion (313) and / or a fourth conductive portion (314). For example, each of the plurality of conductive portions may form a part of the side of the electronic device (101).

[0072] According to one embodiment, each of the plurality of conductive parts may be spaced apart from one another. For example, the first conductive part (311) and the second conductive part (312) may be spaced apart, and a non-conductive material (e.g., dielectric, insulating material) may be placed between the first conductive part (311) and the second conductive part (312). For example, the second conductive part (312) and the third conductive part (313) may be spaced apart, and a non-conductive material may be placed between the second conductive part (312) and the third conductive part (313). For example, the third conductive part (313) and the fourth conductive part (314) may be spaced apart, and a non-conductive material may be placed between the third conductive part (313) and the fourth conductive part (314).

[0073] According to one embodiment, a plurality of conductive portions of the side member (215) may each operate as an antenna radiator. For example, the first conductive portion (311) of the side member (215) may be an antenna radiator that transmits and / or receives an RF (radio frequency) signal of a specified frequency band (e.g., about 1.8 GHz to about 2.4 GHz). For example, the first conductive portion (311) of the side member (215) may be an antenna radiator for supporting 3G (generation) communication, 4G communication (e.g., LTE (long term evolution) communication), UWB (ultra-wide band) communication, GPS (global positioning system) communication, BT (Bluetooth) communication, and / or Wi-Fi communication (e.g., wireless LAN communication). However, the frequency bands supported by the first conductive portion (311) in the present disclosure may vary, and numerical examples (e.g., about 1.8 GHz (gigahertz) to about 2.4 GHz) are merely examples. For example, an antenna including the first conductive portion (311) may support a frequency band of about 1.7 to about 2 GHz.

[0074] According to one embodiment, the support plate (320) may be placed inside the electronic device (101). For example, the support plate (320) may be placed in the internal space of the electronic device (101) surrounded by the side member (215), and the support plate (320) may support components (e.g., PCB (330)) of the electronic device (101).

[0075] According to one embodiment, the support plate (320) may be formed integrally with the side member (215). For example, the support plate (320) may be a portion extending from the fourth conductive portion (314) of the side member (215). In this case, the support plate (320) may be included in the side member (215). For example, the support plate (321) may be formed integrally with the side member (215).

[0076] In FIG. 3 of the present disclosure, the support plate (320) is described as extending from the side member (215), but this is merely an example. For example, the support plate (320) may be a separate component from the side member (215). In this case, the support plate (320) may be spaced apart from the side member (215) or connected to the side member (215) through a separate connecting member.

[0077] According to one embodiment, the PCB (330) may provide an electrical connection path for various components within the electronic device (101) or provide a space for various components to be placed. For example, a power management module (188) may be placed on the PCB (330), and the PCB (330) may provide a conductive path that electrically connects the power management module (188) and the battery (189).

[0078] In FIG. 3 of the present disclosure, only one PCB within the electronic device (101) is shown, but this is merely an example and the electronic device (101) may include a plurality of PCBs. For example, the electronic device (101) may further include a PCB (330) placed at the top of the electronic device (101) and an additional PCB placed at the bottom of the electronic device (101). As another example, the electronic device (101) may further include an additional PCB that is laminated to the PCB (330) via an interposer. For example, the electronic device (101) may include a PCB (330) located in a first direction (e.g., +y direction) relative to the battery (189) and an additional PCB located in a second direction (e.g., -y direction) opposite to the first direction relative to the battery (189).

[0079] According to one embodiment, a processor (120) (e.g., application processor, communication processor) may be placed on or within the PCB (330), and the processor (120) (e.g., application processor) may transmit and / or receive a signal (e.g., control signal) to the side key (217).

[0080] According to one embodiment, the side key (217) may include a flexible PCB (FPCB) (340), a support member (350) on which at least a portion of the FPCB (340) is placed, at least one dome switch (e.g., the first dome switch (511) of FIG. 5), and / or a button (360).

[0081] For example, the FPCB (340) can be electrically connected to the PCB (330) and can transmit signals (e.g., control signals, data signals) transmitted from electronic components (e.g., application processors) placed on the PCB (330) to a dome switch. As another example, the FPCB (340) can transmit signals (e.g., control signals, data signals) to electronic components (e.g., application processors). For example, the signal transmitted to the PCB (330) through the FPCB (340) may be a DC (direct current) signal. For example, the FPCB (340) may include at least one alternating conductive layer, a non-conductive layer, and / or at least one conductive via penetrating the layer.

[0082] For example, the support member (350) may include a non-conductive material. However, it is not limited thereto, and the support member (350) may include only a conductive material or include both a non-conductive material and a conductive material. That is, the support member (350) may include a non-conductive material and / or a conductive material.

[0083] For example, at least one dome switch may be combined with a button (360). For example, the button (360) may include a part forming one side of the electronic device (101) (e.g., a button part) and a part connected to at least one dome switch (e.g., a pillar part, a connecting part).

[0084] According to one embodiment, the FPCB (340) of the side key (217) may be electrically connected to the PCB (330). For example, a conductive connecting member (e.g., C-clip, pogo-pin, conductive foam) may be placed between the FPCB (340) and the PCB (330), and the FPCB (340) and the PCB (330) may be electrically connected through the conductive connecting member. For example, a signal output from at least one dome switch may be transmitted to a processor (120) (e.g., application processor) on the PCB (330) through the FPCB (340). In one example, the signal may be transmitted from the FPCB (340) to the PCB (330) when the dome portion (e.g., first dome switch (511a)) and the contact portion (e.g., first contact portion (511b)) of at least one dome switch are in contact and electrically connected. In this case, the processor (120) placed on the PCB (330) can identify the signal and increase or decrease the volume of the speaker (e.g., the acoustic output module (155) of FIG. 1) based on the signal. For example, the signal may be a DC signal.

[0085] According to one embodiment, the side key (217) may be positioned adjacent to the first conductive portion (311) of the side member (215). For example, the side key (217) may be formed by penetrating the side member (215). For example, at least a portion of the side key (217) may be positioned within a hole (370) formed in the first conductive portion (311) of the side member (215). For example, the first conductive portion (311) may include a hole (370) for the side key (217), and a button (360) of the side key (217) may be positioned within the hole (370). For example, the side key (217) may be positioned such that the button (360) forms one side together with the first conductive portion (311). For example, the side key (217) may be positioned within the hole (370) such that the button (360) faces a third direction (e.g., -x direction). For example, the side key (217) may be positioned within the hole (370) such that the button (360) can move in a fourth direction (e.g., +x direction) by physical pressure from the user. For example, the side key (217) may be positioned closer to the first conductive part (311) than to the fourth conductive part (314).

[0086] According to one embodiment, a portion of the side key (217) may be placed within a slit (380) between the first conductive portion (311) of the side member (215) and the support plate (320). For example, a portion of the support member (350) and / or the FPCB (340) of the side key (217) may be placed within the slit (380). For example, a portion of the side key (217) may be placed in the space between the first conductive portion (311) and the support plate (320).

[0087] According to one embodiment, the slit (380) may be formed up to the side of the electronic device (101), and a first conductive portion (311) and a second conductive portion (312) may be distinguished based on the portion (380a) formed up to the side of the slit (380). For example, the side member (215) may be segmented into a first conductive portion (311) and a second conductive portion (312) by the portion (380a). For example, a non-conductive material (e.g., a dielectric) may be disposed in at least a portion of the slit (380).

[0088] The term side key (217) of the present disclosure may be replaced with the terms key input device, key button, button, side key, and / or volume key.

[0089] The term support plate (320) of the present disclosure may be replaced with the terms support member, support structure, substrate, bracket, conductor (or non-conductor) for support, or support portion extending from the side member (215).

[0090] The term hole (370) in the present disclosure may be replaced with the terms opening, opening portion, slit, pit, or penetrating portion.

[0091] In the present disclosure, the hole (370) is described as being formed in the first conductive portion (311), but this is merely an example. For example, the hole (370) may be formed in the second conductive portion (312), the third conductive portion (313), and / or the fourth conductive portion (314) of the side member (215).

[0092] FIG. 4 is a drawing illustrating area A in which a side key including an FPCB according to one embodiment is placed.

[0093] Referring to FIG. 4, an electronic device (101) according to one embodiment may include a plurality of camera modules (410), a non-conductive member (420), and / or a first conductive connecting member (430) electrically connected to a first conductive part (311).

[0094] According to one embodiment, a plurality of camera modules (410) may be placed on a support plate (320). For example, a plurality of camera modules (410) may be placed on the support plate (320) and face the rear (210B) of the electronic device (101). For example, a plurality of camera modules (410) may be placed on the support plate (320) so as to face the rear cover (211). For example, a plurality of camera modules (410) may be rear cameras of the electronic device (101).

[0095] According to one embodiment, the side key (217) may be positioned between the first conductive portion (311) and the plurality of camera modules (410). For example, the side key (217) may be positioned relatively closer to the first conductive portion (311) than to the plurality of camera modules (410). For example, the side key (217) may be positioned between the first conductive portion (311) and the plurality of camera modules (410) when viewed in a direction perpendicular to the rear cover (211) (e.g., +z direction).

[0096] According to one embodiment, the slit (380) between the first conductive portion (311) and the support plate (320) may be filled by a non-conductive member (420). For example, the non-conductive member (420) may include an injected member, plastic, glass, and / or a dielectric having a specified dielectric constant.

[0097] According to one embodiment, the first conductive connecting member (430) may be connected to the first conductive part (311) for power supply to the first conductive part (311). Although not shown in the drawing of FIG. 4, the first conductive connecting member (430) may be located in a direction perpendicular to the rear cover (211) with respect to the side key (217) (e.g., +z direction), and one end of the first conductive connecting member (430) may be connected to the first conductive part (311). As another example, one end of the first conductive connecting member (430) may be coupled to the first conductive part (311) (e.g., electromagnetic connection, capacitive connection).

[0098] According to one embodiment, the FPCB (340) may include a plurality of pads for electrically connecting to the PCB (330). For example, the FPCB (340) may include a first connection pad (341), a second connection pad (342), and / or a third connection pad (343). For example, the PCB (330) may be electrically connected to the first connection pad (341), the second connection pad (342), and / or the third connection pad (343) through conductive connection members (e.g., C-Clip, L-Clip, pogo-pin).

[0099] The term "connection pad" in the present disclosure may be replaced with other terms referring to a part for electrical connection. For example, "connection pad" may be replaced with the terms "conductive part for connection," "conductive material," or "conductor."

[0100] The term camera module in the present disclosure may be replaced with the terms camera or camera circuit.

[0101] FIG. 5 is a drawing illustrating area A in which a non-conductive member is removed and area A in which at least one dome switch of a side key is removed, according to one embodiment.

[0102] Referring to FIG. 5, a region A is shown in which a non-conductive member (e.g., the non-conductive member (420) of FIG. 4) according to one embodiment has been removed.

[0103] According to one embodiment, the side key (217) may include at least one dome switch (510). For example, the at least one dome switch (510) may include a plurality of dome switches. For example, the side key (217) may include a first dome switch (511) and / or a second dome switch (512).

[0104] According to one embodiment, the first dome switch (511) may be for increasing the volume, and the second dome switch (512) may be for decreasing the volume. For example, when a user of the electronic device (101) applies pressure to the part of the button (360) corresponding to the first dome switch (511), the first dome switch (511) may output a signal to the PCB (330) through the FPCB (340). In this case, the processor (120) (e.g., application processor) may increase the volume of the speaker of the electronic device (101). For example, when a user of the electronic device (101) applies pressure to the part of the button (360) corresponding to the second dome switch (512), the second dome switch (512) may output a signal to the PCB (330) through the FPCB (340). In this case, the processor (120) (e.g., application processor) can lower the volume of the speaker of the electronic device (101).

[0105] For example, when a user of the electronic device (101) moves the part of the button (360) corresponding to the first dome switch (511) in a direction toward the inside of the electronic device (101) (e.g., +x direction), the first dome switch (511) can transmit a signal to the PCB (330) through the FPCB (340). In this case, the processor (120) can increase the volume of the speaker of the electronic device (101). For example, when a user of the electronic device (101) moves the part of the button (360) corresponding to the second dome switch (512) in a direction toward the inside of the electronic device (101) (e.g., +x direction), the second dome switch (512) can transmit a signal to the PCB (330) through the FPCB (340). In this case, the processor (120) can decrease the volume of the speaker of the electronic device (101).

[0106] As the dome portion and the contact portion included in each of the first dome switch (511) and the second dome switch (512) come into contact, a signal from each of the first dome switch (511) and the second dome switch (512) can be transmitted to the PCB (330) and the processor (120) placed on the PCB (330). The electrical path and method of transmitting the signal from each of the first dome switch (511) and the second dome switch (512) to the processor (120) is described in more detail below in FIG. 9.

[0107] According to one embodiment, at least one dome switch (510) may be placed on a portion of the FPCB (340). For example, the FPCB (340) may include a portion for connecting to the PCB (330) (e.g., the third portion (793) of FIG. 7) and a portion on which at least one dome switch (510) is placed (e.g., the first portion (791) and the second portion (792) of FIG. 7). For example, at least one dome switch (510) may be placed on the FPCB (340) so as to face in a direction perpendicular to the first conductive portion (311) (e.g., the -x direction).

[0108] According to one embodiment, a connecting member (530) for ground (e.g., C-clip, pogo-pin, L-clip) may be disposed on a region of the first conductive portion (311). The connecting member (530) may form a ground path for the first conductive portion (311) to operate as an antenna radiator. For example, the first conductive portion (311) may be electrically connected to the ground of the PCB (330) through the connecting member (530). For example, the connecting member (530) may form a ground point of the first conductive portion (311) that operates as an antenna.

[0109] According to one embodiment, area A is shown with at least one dome switch (510) removed.

[0110] According to one embodiment, the first conductive connecting member (430) may be electrically connected to the first conductive part (311), and the first conductive connecting member (430) may form part of the feed path for the first conductive part (311) to operate as an antenna radiator.

[0111] According to one embodiment, the connecting member (530) for ground may be a connecting member for connecting the ground of the first conductive part (311) and the PCB (330). For example, the connecting member (530) may form part of the ground path for the first conductive part (311) to operate as an antenna radiator.

[0112] In FIG. 5 of the present disclosure, the side key (217) is described as comprising at least one dome switch (510) and controlling the volume of the speaker based on the physical pressure of the user, but this is merely an example. For example, the electronic device (101) may include a side key that operates based on the user's touch input (e.g., a side key including a touch sensing panel) instead of a side key that operates via a dome switch. In this case, the processor (120) can identify a change in capacitance due to the user's touch via the side key and can control the volume based on the location where the change in capacitance is detected.

[0113] In FIG. 5 of the present disclosure, the side key (217) is described as including a first dome switch (511) and a second dome switch (512), but this is merely an example. For example, the side key (217) may include a first dome (e.g., first dome switch (511)) and a second dome (e.g., second dome switch (512)) included in the dome switch.

[0114] In the present disclosure, the side key (217) is described as including a switch having a dome shape (e.g., at least one dome switch (510)), but this is merely an example. For example, the shapes of the switches included in the side key (217) may vary.

[0115] In FIG. 5 of the present disclosure, the side key (217) is described as including a first dome switch (511) and a second dome switch (512), but this is merely an example. For example, the side key (217) may include various numbers of dome switches. For example, the side key (217) may include only one dome switch (e.g., the first dome switch (511)). For example, the side key (217) may include three or more dome switches.

[0116] FIG. 6a is a drawing illustrating a first conductive line included in an FPCB according to one embodiment.

[0117] Referring to FIG. 6a, an FPCB (340) according to one embodiment may be electrically connected to a PCB (330). For example, the FPCB (340) may be electrically connected to the PCB (330) through a second conductive connecting member (630) (e.g., a C-clip). For example, the FPCB (340) may be coupled to the PCB (330) through a conductive connecting member (e.g., a coupling pad). For example, the FPCB (340) may be electrically connected to the PCB (330) through a connecting member (e.g., a connector, a connecting terminal, an interposer) disposed on the PCB (330).

[0118] According to one embodiment, the electronic device (101) may include a wireless communication circuit (610) (e.g., a radio frequency integrated circuit (RFIC)), and the wireless communication circuit (610) may be disposed on a PCB (330). The wireless communication circuit (610) may be supplied to a first conductive portion (311) through a first conductive connecting member (430) and may transmit and / or receive RF signals of a specified frequency band (e.g., about 1.8 to about 2.4 GHz) based on an electrical path formed in the first conductive portion (311). For example, the wireless communication circuit may perform a specified communication method (e.g., GPS communication, UWB communication, BT communication, Wi-Fi communication) based on an electrical path formed in the first conductive portion (311).

[0119] According to one embodiment, the FPCB (340) of the side key (217) may include at least one conductive line for transmitting a signal. For example, the FPCB (340) may include a first conductive line (620) for transmitting a signal. For example, the first conductive line (620) may be formed on a layer of the FPCB (340). For example, the first conductive line (620) may be formed on a non-conductive layer of the FPCB (340). For example, the first conductive line (620) may be an electrical connection member for connecting at least one dome switch (510) and the ground of the PCB (330). For example, as the dome portion of at least one dome switch (510) and the contact portion come into contact, a signal can be transmitted to the first conductive line (620), and the first conductive line (620) can form a ground path for the signal to be transmitted to the ground of the PCB (330).

[0120] For example, the first conductive line (620) may be an electrical connection member for connecting at least one dome switch (510) and the signal line of the PCB (330). For example, a component of the PCB (330) (e.g., processor (120)) may transmit a signal to the FPCB (340) through the signal line of the PCB (330). The signal transmitted to the FPCB (340) may be transmitted to at least one dome switch (510) through the first conductive line (620). For example, the signal may be a signal for identifying user input to at least one dome switch (510). For example, the signal may be a signal for identifying user input to the side key (217). For example, the signal may be a signal for identifying whether the dome portion of at least one dome switch (510) and the contact portion are in contact.

[0121] According to one embodiment, the FPCB (340) may include a plurality of curved portions (650). For example, the FPCB (340) may include a conductive pattern (621), and the conductive pattern (621) may include a plurality of curved portions (650). For example, the plurality of curved portions (650) may have a meander shape. For example, each of the plurality of curved portions (650) may be referred to as a folded portion. For example, a signal may be transmitted to at least one dome switch (510) or received from said at least one dome switch through the plurality of curved portions (650) of the first conductive line (620).

[0122] For example, the FPCB (340) may include a conductive pattern (621), and the conductive pattern (621) may include a plurality of curved portions (650) and / or connecting portions (640). For example, the conductive pattern (621) may include a first connecting portion (641) extending along a direction parallel to the first conductive portion (311) (e.g., y-axis direction), a first curved portion (651) connected to the first connecting portion (641), and / or a second connecting portion (642) connected to the first curved portion (651). For example, the conductive pattern (621) may include a second connecting portion (642) extending along a direction parallel to the first conductive portion (311) (e.g., y-axis direction), a second curved portion (652) connected to the second connecting portion (642), and / or a third connecting portion (643). For example, the conductive pattern (621) may include a third connecting part (643), a third curved part (653), and / or a fourth connecting part (644) extending along a direction parallel to the first conductive part (311) (e.g., the y-axis direction).

[0123] For example, the conductive pattern (621) may include a fourth connecting part (644), a fourth curved part (654), and / or a fifth connecting part (645) extending along a direction parallel to the first conductive part (311) (e.g., the y-axis direction). For example, the conductive pattern (621) may include a fifth connecting part (645) extending along a direction parallel to the first conductive part (311) (e.g., the y-axis direction), a fifth curved part (655) connected to the fifth connecting part (645), and / or a sixth connecting part (646) connected to the fifth curved part (655). For example, the conductive pattern (621) may include a sixth connecting portion (646), a sixth curved portion (656) connected to the sixth connecting portion (646), and / or a seventh connecting portion (647) connected to the sixth curved portion (656).

[0124] For example, the conductive pattern (621) may include a seventh connecting portion (647), a seventh curved portion (657) connected to the seventh connecting portion (647), and / or an eighth connecting portion (648) connected to the seventh curved portion (657). For example, the conductive pattern (621) may include an eighth connecting portion (648), an eighth curved portion (658) connected to the eighth connecting portion (648), and / or a ninth connecting portion (649) connected to the eighth curved portion (658).

[0125] For example, the conductive pattern (621) may include a ninth connecting portion (649), a ninth curved portion (659) connected to the ninth connecting portion (649), and / or a tenth connecting portion (660). The conductive pattern (621) may include a tenth connecting portion (660), a tenth curved portion (670) connected to the tenth connecting portion (660), and / or a tenth connecting portion (661) connected to the tenth curved portion (670).

[0126] According to one embodiment, each of the plurality of curved portions (650) may include portions connected at a specified angle. For example, the first curved portion (651) may include a first portion (651a) extending in a direction parallel to the first connecting portion (641), a second portion (651b) extending in a direction parallel to the second connecting portion (642), and a third portion (651c) connected to the first connecting portion (641) and the second connecting portion (642). The third portion (651c) may be connected to the first portion (651a) at a specified angle (e.g., about 90 degrees) and may be connected to the second portion (651b) at a specified angle (e.g., about 90 degrees). However, the specified angle (e.g., about 90 degrees) is not limited to 90 degrees and may be less than or greater than 90 degrees.

[0127] According to one embodiment, when the first conductive line (620) includes a conductive pattern (621) comprising a plurality of curved portions (650) and a plurality of connecting portions (640), the inductance of the first conductive line (620) may be increased. For example, compared to the case where the first conductive line (620) is formed only as a linear line without including a conductive pattern (621), the inductance of the first conductive line (620) may be increased when the first conductive line (620) includes a conductive pattern (621) comprising a plurality of curved portions (650). In other words, through the multiple curved sections (650), the first conductive line (620) within the area of ​​the FPCB (340) can have a physically long length, and the first conductive line (620) can have a relatively high inductance value compared to the case where there are no multiple curved sections (650).

[0128] For example, the conductive pattern (621) of the first conductive line (620) may correspond to an inductor. For example, as the conductive pattern (621) includes a plurality of curved portions (650), the length of the first conductive line (620) formed within a limited area of ​​the FPCB (340) may be increased. In this case, as the length of the first conductive line (620) increases, the inductance of the first conductive line (620) may increase, thereby ensuring substantially the same effect as having a separate inductor electrically connected to the first conductive line (620). Consequently, the stability and cost-saving effects of the electronic device (101) can be secured by replacing a separate inductor, which is large and prone to damage, through the conductive pattern of the first conductive line (620), and a specified inductance (e.g., an inductance to reduce LC resonance described later in FIG. 6b) can be secured even without including an inductor.

[0129] According to one embodiment, the first conductive line (620) may be electrically connected to at least one dome switch (510) through a pad of the FPCB (340) as described below in FIG. 7. The first conductive line (620) may transmit a signal received from at least one dome switch (510) to the PCB (330). In another example, the first conductive line (620) may transmit a signal to at least one dome switch (510).

[0130] In the present disclosure, a plurality of curved portions (650) are described as having a meander shape, but this is merely an example. For example, a plurality of curved portions (650) may be referred to as having a step shape, a winding shape, a sinuous shape, or a zigzag shape.

[0131] The term "curved" in the present disclosure may be replaced with the terms "bent," "arched," "wavy," or "spiral."

[0132] The first conductive line (620) included in the FPCB (340) of the present disclosure may be replaced with various terms as a member for electrical connection. For example, the first conductive line (620) may be replaced with a conductive pattern, an electrical connection member, an electrical path, a conductive material, or an inductive line.

[0133] In FIG. 6a of the present disclosure, the FPCB (340) is described as including a first conductive line (620), but this is merely an example. For example, the FPCB (340) may include additional conductive lines other than the first conductive line (620). For example, the FPCB (340) may include a plurality of conductive lines, and the first conductive line (620) may be one of the plurality of conductive lines.

[0134] In the present disclosure, it is described that an FPCB (340) is electrically connected to a PCB (330) and that the FPCB (340) adjacent to the first conductive portion (311) includes a conductive line, but this is merely an example. For example, an additional PCB may be placed adjacent to the first conductive portion (311), the additional PCB may include the first conductive line (620), and the additional PCB may be electrically connected to the PCB (330). That is, the FPCB (340) including the first conductive line (620) of the present disclosure may be replaced with a PCB including the first conductive line.

[0135] In the present disclosure, the FPCB (340) is described as being adjacent to a first conductive portion (311) which is an antenna radiator and reducing radiation effects on the first conductive portion (311), but this is merely an example. For example, the FPCB (340) may be adjacent to other electrical components (e.g., camera modules (410)) within the electronic device (101) and may include a first conductive pattern (621) so as not to affect the function of the other electrical components (e.g., camera modules (410)).

[0136] FIG. 6b illustrates a method for reducing or preventing parasitic resonance through a first conductive line including a conductive pattern comprising a plurality of curved portions according to one embodiment.

[0137] Referring to FIG. 6b, when the FPCB (340) according to one embodiment includes a first conductive line (620) including a conductive pattern (621), the degradation of the radiation performance of the first conductive part (311) can be reduced or prevented even if the FPCB (340) is adjacent to the first conductive part (311).

[0138] For example, the wireless communication circuit (610) may apply an RF signal to the first conductive part (311) to utilize the first conductive part (311) as an antenna radiator. In this case, coupling may occur between the first conductive part (311) and the FPCB (340) of the adjacent side key (217). That is, a capacitance component may be formed due to the coupling between the first conductive part (311) and the FPCB (340). Additionally, an inductance component may be formed as the coupled RF signal is transmitted along the conductive line of the FPCB (340). In this case, LC resonance, which is a parasitic resonance, may be formed based on the capacitance component and the inductance component, and if the LC resonance occurs in the resonance frequency band of the RF signal radiated by the first conductive part (311) (e.g., operating frequency band (e.g., about 1.8 to about 2.4 GHz)), the antenna performance may be degraded.

[0139] On the other hand, when a first conductive line (620) including a conductive pattern (621) according to one embodiment is included in the FPCB (340), the formation of parasitic resonance may be reduced, or the frequency band in which parasitic resonance is formed may be shifted away from the resonant frequency band of the RF signal (e.g., about 1.8 to about 2.4 GHz). For example, if the first conductive line (620) includes a plurality of curved portions (650), the inductance of the first conductive line (620) may increase as the physical length of the first conductive line (620) increases. (Isolation implementation) As the inductance of the first conductive line (620) increases, it may be difficult for the RF signal, which is an alternating current signal, to be transmitted along the first conductive line (620). Accordingly, the frequency band of the LC resonance corresponding to the parasitic resonance can be shifted away from the operating frequency band of the first conductive part (311) (e.g., about 1.8 GHz to about 2.4 GHz), and as a result, the influence of the parasitic resonance on the radiation performance of the first conductive part (311) can be reduced, and the degradation of the radiation performance can be reduced or minimized.

[0140] As the first conductive line (620) is included in the FPCB (340), the degradation of the radiation performance of the antenna including the first conductive part (311) in a specified frequency band (e.g., about 1.8 to about 2.4 GHz) is reduced, as is explained in more detail below in FIG. 15.

[0141] FIG. 7 is a drawing illustrating an FPCB including a plurality of layers according to one embodiment.

[0142] Referring to FIG. 7, an FPCB (340) according to one embodiment may include a first part (791), a second part (792), a third part (793) and / or a fourth part (794). For example, a first dome switch (511) among at least one dome switch (510) may be disposed in the first part (791). For example, a second dome switch (512) among at least one dome switch (510) may be disposed in the second part (792). For example, the first part (791) may be disposed adjacent to the top of the electronic device (101) relative to the second part (792). For example, the first part (791) may be disposed adjacent to the part (380a) for segmentation among the slits (380) of FIG. 3 relative to the second part (792).

[0143] For example, a plurality of connection pads for electrical connection with the PCB (330) may be disposed in the third part (793). For example, the plurality of connection pads may include a first connection pad (341), a second connection pad (342), and / or a third connection pad (343).

[0144] For example, the first connection pad (341) can transmit a signal received from the PCB (330) to at least one dome switch (510), and the third connection pad (343) can transmit a signal received from the PCB (330) to at least one dome switch (510). For example, the first connection pad (341) and the third connection pad (343) may be pads for transmitting a signal received from a processor (120) (e.g., an application processor) placed on the PCB (330) to at least one dome switch (510). For example, the first connection pad (341) and the third connection pad (343) may be pads connected to a signal line of the PCB (330).

[0145] For example, the second connection pad (342) may be a pad connected to the ground of the PCB (330) and may be a pad for transmitting a signal received from at least one dome switch (510) to the PCB (330). For example, the second connection pad (342) may be a pad for transmitting a signal transmitted to at least one dome switch (510) through the first connection pad (341) back to the PCB (330).

[0146] For example, the fourth part (794) may be a connecting part for connecting the first part (791), the second part (792), and the third part (793). For example, the fourth part (794) may be a junction for connecting the first part (791), the second part (792), and the third part (793).

[0147] According to one embodiment, the FPCB (340) may include a plurality of layers. For example, the FPCB (340) may include a first layer (781) and / or a second layer (782). For example, the first layer (781) and / or the second layer (782) may be conductive layers. For example, the first layer (781) may be a layer forming the outer surface of the FPCB (340), and the second layer (782) may be a layer formed inside the FPCB (340). For example, the FPCB (340) may include alternating conductive layers and non-conductive layers, and the first layer (781) and the second layer (782) may be included in the conductive layers of the FPCB (340). For example, the first layer (781) may be positioned adjacent to at least one dome switch (510) than the second layer (782).

[0148] According to one embodiment, the FPCB (340) may include a plurality of first conductive pads (770) and / or a plurality of second conductive pads (780). For example, the plurality of first conductive pads (770) may correspond to a first dome switch (511). The plurality of first conductive pads (770) may be electrically connected to the first dome switch (511).

[0149] For example, a plurality of second conductive pads (780) may correspond to a second dome switch (512). A plurality of second conductive pads (780) may be electrically connected to the second dome switch (512).

[0150] For example, a plurality of first conductive pads (770) may include a first conductive pad (771), a second conductive pad (772), a third conductive pad (773) and / or a fourth conductive pad (774). For example, a plurality of second conductive pads (780) may include a fifth conductive pad (785), a sixth conductive pad (786), a seventh conductive pad (787) and / or an eighth conductive pad (788).

[0151] According to one embodiment, among a plurality of first conductive pads (770), the first conductive pad (771) and / or the second conductive pad (772) may be electrically connected to the ground of the PCB (330) through the second connection pad (342). For example, the first conductive pad (771) and / or the second conductive pad (772) may be electrically connected to the first conductive vias (731) of the FPCB (340) through the first conductive connection portion (701) of the first layer (781). The first conductive pad (771) and / or the second conductive pad (772) may be electrically connected to the first conductive line (711) of the second layer (782) through the first conductive vias (731). The first conductive pad (771) and / or the second conductive pad (772) may be electrically connected to the second conductive via (733) through the first conductive line (711). The first conductive pad (771) and / or the second conductive pad (772) may be electrically connected to the first layer (781) containing a conductive material through the second conductive via (733) and may be connected to the second connecting pad (342) through the second conductive line (705). Consequently, the first conductive pad (771) and / or the second conductive pad (772) can be electrically connected to the ground of the PCB (330) through the first conductive connection part (701), the first conductive vias (731), the first conductive line (711), the second conductive via (733), the first layer (781), the second conductive line (705), and / or the second connection pad (342).

[0152] The electrical path in which the first conductive pad (771) and / or the second conductive pad (772) are electrically connected to the PCB (330) may include the first conductive line (711) and / or the second conductive line (705). For example, the first conductive line (711) and the second conductive line (705) may be included in different layers. The first conductive line (711) may be included in the second layer (782), and the second conductive line (706) may be included in the first layer (781).

[0153] Each of the first conductive line (711) and the second conductive line (705) may include a conductive pattern comprising a plurality of curved portions (e.g., a plurality of curved portions (650) of FIG. 6a). For example, the first conductive line (711) may include a first conductive pattern (711a), a second conductive pattern (711b), and a third conductive pattern (711c). The first conductive pattern (711a) may include a plurality of curved portions, the second conductive pattern (711b) may include a plurality of curved portions, and the third conductive pattern (711c) may include a plurality of curved portions.

[0154] For example, the second conductive line (705) may include a fourth conductive pattern (705a) and a fifth conductive pattern (705b). The fourth conductive pattern (705a) may include a plurality of curved portions, and the fifth conductive pattern (705b) may include a plurality of curved portions.

[0155] According to one embodiment, as each of the first conductive line (711) and the second conductive line (705) includes a conductive pattern including curved portions, the lengths of the electrical paths between each of the first conductive pad (771) and the second conductive pad (772) and the ground of the PCB (330) can be relatively long. As the lengths of the electrical paths become relatively long, the inductance of the first electrical path between the first conductive pad (771) and the ground of the PCB (330) can be increased, and the inductance of the second electrical path between the second conductive pad (772) and the ground of the PCB (330) can be increased. Consequently, as the inductances of the first electrical path and the second electrical path increase, the frequency band of parasitic resonance shifts to a frequency band different from the designated frequency band, and the deterioration of the antenna performance of the first conductive portion (311) adjacent to the FPCB (340) can be reduced.

[0156] According to one embodiment, among a plurality of first conductive pads (770), a third conductive pad (773) and / or a fourth conductive pad (774) may be electrically connected to a signal line of a PCB (330) through a first connection pad (341). For example, the third conductive pad (773) and / or the fourth conductive pad (774) may be electrically connected to a second layer (782) containing a conductive material through a second conductive connection portion (702) and a third conductive via (732). The third conductive pad (773) and / or the fourth conductive pad (774) may be electrically connected to a third conductive line (712) and may be electrically connected to a fourth conductive via (737) through the third conductive line (712). The third conductive pad (773) and / or the fourth conductive pad (774) may be electrically connected to the first connection pad (341) through the fourth conductive via (737). The third conductive pad (773) and / or the fourth conductive pad (774) may be electrically connected to the PCB (330) (e.g., the processor (120) on the PCB (330)) through the first connection pad (341). Consequently, the third conductive pad (773) and / or the fourth conductive pad (774) may be electrically connected to the signal line of the PCB (330) through the second conductive connection portion (702), the third conductive via (732), the third conductive line (712), and the fourth conductive via (737).

[0157] The third conductive line (712) may include a conductive pattern comprising a plurality of curved portions (e.g., a plurality of curved portions (650) of FIG. 6a). For example, the third conductive line (712) may include a sixth conductive pattern (712a), and the sixth conductive pattern (712a) may include a plurality of curved portions. For example, the third conductive line (712) may be included in the second layer (782).

[0158] According to one embodiment, as the third conductive line (712) includes a conductive pattern (e.g., a sixth conductive pattern (712a)) that includes curved portions, the length of the electrical paths between the third conductive pad (773) and the fourth conductive pad (774), respectively, and the PCB (330) (or the processor (120) on the PCB (330)) may be relatively long. As the length of the electrical paths becomes relatively long, the inductance of the third electrical path between the third conductive pad (773) and the PCB (330) may increase, and the inductance of the fourth electrical path between the fourth conductive pad (774) and the PCB (330) may increase. Consequently, as the inductances of the third electrical path and the fourth electrical path increase, the antenna performance degradation of the first conductive portion (311) adjacent to the FPCB may be reduced. For example, the third electrical path and the fourth electrical path, respectively, may be referred to as paths of the FPCB (340) and / or PCB (330) for transmitting a signal to at least one dome switch (510).

[0159] According to one embodiment, among a plurality of second conductive pads (780), the fifth conductive pad (785) and / or the sixth conductive pad (786) may be electrically connected to a signal line of the PCB (330) through a third connection pad (343). For example, the fifth conductive pad (785) and / or the sixth conductive pad (786) may be electrically connected to a fourth conductive line (714) through a third conductive connection portion (703), and may be electrically connected to a fifth conductive via (734) through the fourth conductive line (714). The fifth conductive pad (785) and / or the sixth conductive pad (786) may be electrically connected to a sixth conductive via (738) through the fifth conductive via (734) and the second layer (782). The fifth conductive pad (785) and / or the sixth conductive pad (786) can be electrically connected to the third connection pad (343) through the sixth conductive via (738). Consequently, the fifth conductive pad (785) and / or the sixth conductive pad (786) can be electrically connected to the PCB (330) through the third conductive connection part (703), the fourth conductive line (714), the fifth conductive via (734), the sixth conductive via (738), and the third connection pad (343).

[0160] The electrical path in which the fifth conductive pad (785) and / or the sixth conductive pad (786) are electrically connected to the PCB (330) may include a fourth conductive line (714). For example, the fourth conductive line (714) may be included in the first layer (781).

[0161] The fourth conductive line (714) may include a seventh conductive pattern (714a) comprising a plurality of curved portions (e.g., a plurality of curved portions (650) of FIG. 6a). As the fourth conductive line (714) includes a seventh conductive pattern (714a) comprising a plurality of curved portions, the lengths of the electrical paths between the fifth conductive pad (785) and the sixth conductive pad (786), respectively, and the PCB (330) may be increased. As the lengths of the electrical paths increase, the inductance of the fifth electrical path between the fifth conductive pad (785) and the PCB (330) may increase, and the inductance of the sixth electrical path between the sixth conductive pad (786) and the PCB (330) may increase. As a result, as the inductances of the fifth and sixth electrical paths increase, the deterioration of the antenna performance of the first conductive part (311) adjacent to the FPCB (340) can be reduced.

[0162] According to one embodiment, among the plurality of second conductive pads (780), the seventh conductive pad (787) and / or the eighth conductive pad (788) may be electrically connected to the ground of the PCB (330) through the second connecting pad (342). For example, the seventh conductive pad (787) and / or the eighth conductive pad (788) may be electrically connected to the second conductive line (705) through the fourth conductive connecting part (704) and the first layer (781), and may be electrically connected to the second connecting pad (342) through the second conductive line (705). Consequently, the seventh conductive pad (787) and / or the eighth conductive pad (788) may be electrically connected to the ground of the PCB (330) through the fourth conductive connecting part (704), the second conductive line (705), and the second connecting pad (342).

[0163] The electrical path in which the 7th conductive pad (787) and / or the 8th conductive pad (788) is electrically connected to the PCB (330) may include a 2nd conductive line (705).

[0164] The second conductive line (705) may include a fourth conductive pattern (705a) and a fifth conductive pattern (705b). The fourth conductive pattern (705a) may include a plurality of curved portions, and the fifth conductive pattern (705b) may include a plurality of curved portions.

[0165] As the second conductive line (705) includes conductive patterns (e.g., fourth conductive pattern (705a), fifth conductive pattern (705b)) that include curved portions, the length of the electrical paths between the seventh conductive pad (787) and the eighth conductive pad (788), respectively, and the ground of the PCB (330) can be increased. As the length of the electrical paths increases, the inductance of the seventh electrical path between the seventh conductive pad (787) and the ground of the PCB (330) can be increased, and the inductance of the eighth electrical path between the eighth conductive pad (788) and the ground of the PCB (330) can be increased. Consequently, as the inductances of the seventh electrical path and the eighth electrical path increase, the degradation of the antenna performance of the first conductive portion (311) adjacent to the FPCB (340) can be reduced.

[0166] According to one embodiment, each of the seventh conductive pad (787) and the eighth conductive pad (788) may be electrically connected to a second layer (782) containing a conductive material through the seventh conductive vias (736) and may be electrically connected to a fifth conductive line (713) formed in the second layer (782). The fifth conductive line (713) may include an eighth conductive pattern (713a) and / or a ninth conductive pattern (713b), and each of the eighth conductive pattern (713a) and / or the ninth conductive pattern (713b) may include a plurality of curved portions. As the 7th conductive pad (787) and the 8th conductive pad (788) are electrically connected to the 8th conductive pattern (713a) and the 9th conductive pattern (713b), the inductance of each of the 7th electrical path and the 8th electrical path may increase, and the deterioration of the antenna performance of the 1st conductive part (311) may decrease.

[0167] According to one embodiment, the first layer (781) may include a first conductive region (760) disposed in the fourth part (794), and the second layer (782) may include a second conductive region (761) disposed in the fourth part (794). The first conductive region (760) and the second conductive region (761) may be capacitively coupled to each other. The first conductive region (760) and the second conductive region (761) may change the frequency band of the LC resonance corresponding to parasitic resonance to be further away from the operating frequency band of the first conductive part (311) by forming a capacitance component. For example, the first layer (781) may include a conductive material (e.g., the first conductive region (760)), and the second layer (782) may include a conductive material (e.g., the second conductive region (761)). A capacitance component is formed between the first layer (781) and the second layer (782), so that the frequency band of the LC resonance can be adjusted.

[0168] The conductive vias included in the FPCB (340) of the present disclosure can electrically connect the first layer (781) and the second layer (392). For example, at least some of the conductive vias may extend from the first layer (781) to the second layer (392).

[0169] The first conductive line (711), the second conductive line (705), the third conductive line (712), the fourth conductive line (714) and / or the fifth conductive line (715) of the present disclosure may correspond to the first conductive line (620) of FIG. 6A. The conductive pattern included in each of the first conductive line (711), the second conductive line (705), the third conductive line (712), the fourth conductive line (714) and the fifth conductive line (715) may correspond to the conductive pattern (621) of FIG. 6A.

[0170] In FIG. 7 of the present disclosure, the FPCB (340) is described as having a T-shape, but this is merely an example. For example, the FPCB (340) may have various shapes, such as an L-shape (e.g., the FPCB of FIG. 6a), an inverted L-shape, or a straight line shape.

[0171] In FIG. 7 of the present disclosure, only the first layer (781) and the second layer (782) among the plurality of layers of the FPCB (340) are described, but this is merely an example. For example, the FPCB (340) may include additional layers in addition to the first layer (781) and the second layer (782).

[0172] In FIG. 7 of the present disclosure, a plurality of connecting pads are described as including a first connecting pad (341), a second connecting pad (342), and a third connecting pad (343), but this is merely an example. For example, the plurality of connecting pads may include only the first connecting pad (341) and the second connecting pad (342). For example, the plurality of connecting pads may include a first connecting pad (341), a second connecting pad (342), a third connecting pad (343), and a fourth connecting pad.

[0173] In the present disclosure, the FPCB (340) is described as being adjacent to a first conductive portion (311) which is an antenna radiator and reducing radiation effects on the first conductive portion (311), but this is merely an example. For example, the FPCB (340) may be adjacent to other electrical components (e.g., camera modules (410)) within the electronic device (101) and may include a first conductive pattern (621) so as not to affect the function of the other electrical components (e.g., camera modules (410)).

[0174] FIG. 8 is a side view of an electronic device according to one embodiment.

[0175] Referring to FIG. 8, a side key (217) according to one embodiment may include a button (360), a pillar portion (810) coupled to the button (360), at least one dome switch (510) (e.g., a second dome switch (512)) connected to the pillar portion (810), and / or an FPCB (340).

[0176] According to one embodiment, a wireless communication circuit (610) on a PCB (330) can be electrically connected to a first conductive portion (311) through a second conductive connecting member (630) (e.g., a C-clip) and a first conductive connecting member (430) (e.g., an L-pad), and can be supplied to the first conductive portion (311) through the second conductive connecting member (630) and the first conductive connecting member (430). For example, the first conductive connecting member (430) can be connected to the first conductive portion (311) and can be placed between the PCB (330) and the display (201), and the second conductive connecting member (630) can electrically connect the first conductive connecting member (430) and the wireless communication circuit (610). The wireless communication circuit (610) can be connected to the first conductive portion (311) through the first conductive connecting member (430) and the second conductive connecting member (630). The conductive part (311) can be configured to be powered.

[0177] According to one embodiment, the first conductive portion (311) may be positioned adjacent to the FPCB (340), and a gap may be formed between the first conductive portion (311) and the FPCB (340). In this case, coupling may occur between the first conductive portion (311) and the FPCB (340), and as a capacitance component is formed due to the coupling, it may affect the antenna performance of the first conductive portion (311). Hereinafter, FIG. 9 describes a method for reducing or preventing the degradation of antenna performance caused by coupling between the first conductive portion (311) and the FPCB (340) through a connection structure between at least one dome switch (510) and connection pads.

[0178] FIG. 9 is a diagram illustrating the electrical connection relationship between each of the dome portion and the contact portion included in at least one dome switch according to one embodiment and the connection pads.

[0179] Referring to FIG. 9, an FPCB (340) according to one embodiment may include a first part (791) in which a first dome switch (511) is placed, a second part (792) in which a second dome switch (512) is placed, a third part (793) in which connection pads (e.g., a first connection pad (341)) are placed, and / or a fourth part (794) connecting the first part (791), the second part (792) and the third part (793).

[0180] According to one embodiment, the first dome switch (511) may include a first dome portion (511a) and a first contact portion (511b). For example, the first dome switch (511) may include a first dome portion (511a) coupled with a button (360), and a first contact portion (511b) disposed between the first dome portion (511a) and the FPCB (340) and electrically connected to the first dome portion (511a).

[0181] According to one embodiment, the first dome portion (511a) may be electrically connected to the ground of the PCB (330) through at least one of the first conductive pad (771) or the second conductive pad (772). For example, the first dome portion (511a) may be electrically connected to the first conductive pad (771) and the second conductive pad (772). The first dome portion (511a) may be electrically connected to the ground of the PCB (330) through the first conductive pad (771) and the second connecting pad (342). The first dome portion (511a) may be electrically connected to the ground of the PCB (330) through the second conductive pad (772) and the second connecting pad (342).

[0182] According to one embodiment, the first contact portion (511b) may be electrically connected to a signal line of the PCB (330) through at least one of the third conductive pad (773) or the fourth conductive pad (774). For example, the first contact portion (511b) may be electrically connected to the third conductive pad (773) and the fourth conductive pad (774). The first contact portion (511b) may be electrically connected to the PCB (330) through the third conductive pad (773) and the first connection pad (341). In this case, the first contact portion (511b) may receive a signal from the processor (120) of the PCB (330) through the third conductive pad (773) and the first connection pad (341).

[0183] The first contact portion (511b) may be electrically connected to the PCB (330) through the fourth conductive pad (774) and the first connection pad (341). In this case, the first contact portion (511b) may receive a signal from the processor (120) of the PCB (330) through the fourth conductive pad (774) and the first connection pad (341). For example, the signal may be a signal for identifying user input for volume control (e.g., a control signal). For example, the signal may be an indicating signal indicating whether there is contact between the first dome portion (511a) and the first contact portion (511b).

[0184] For example, the processor (120) (e.g., application processor) may be configured to increase the volume output from the speaker based on the reception of a first signal through the first dome switch (511) and to decrease the volume output from the speaker based on the reception of a second signal through the second dome switch (512).

[0185] According to one embodiment, the second dome switch (512) may include a second dome portion (512a) and a second contact portion (512b).

[0186] According to one embodiment, the second dome portion (512a) may be electrically connected to the ground of the PCB (330) through at least one of the seventh conductive pad (787) or the eighth conductive pad (788). For example, the second dome portion (512a) may be electrically connected to the seventh conductive pad (787) and the eighth conductive pad (788). The second dome portion (512a) may be electrically connected to the ground of the PCB (330) through the seventh conductive pad (787) and the second connecting pad (342). The second dome portion (512a) may be electrically connected to the ground of the PCB (330) through the eighth conductive pad (788) and the second connecting pad (342).

[0187] According to one embodiment, the second contact portion (512b) may be electrically connected to a signal line of the PCB (330) through at least one of the fifth conductive pad (785) or the sixth conductive pad (786). For example, the second contact portion (512b) may be electrically connected to the fifth conductive pad (785) and the sixth conductive pad (786). The second contact portion (512b) may be electrically connected to the PCB (330) (e.g., a processor of the PCB (330)) through the fifth conductive pad (785) and the third connection pad (343). In this case, the second contact portion (512b) may receive a signal from the processor (120) of the PCB (330) through the fifth conductive pad (785) and the third connection pad (343).

[0188] The second contact portion (512b) may be electrically connected to the PCB (330) through the sixth conductive pad (786) and the third connection pad (343). In this case, the second contact portion (512b) may receive a signal from the processor (120) of the PCB (330) through the sixth conductive pad (786) and the third connection pad (343). The signal may be a signal for identifying user input for volume control (e.g., a control signal). For example, the signal may be an indicating signal indicating whether there is contact between the first dome portion (511a) and the first contact portion (511b).

[0189] According to one embodiment, the first dome switch (511) may be a component for increasing the volume of a speaker included in the electronic device (101). For example, the first dome switch (511) may include a first dome portion (511a) forming the exterior of the first dome switch (511) and a first contact portion (511b) disposed within the first dome portion (511a). For example, when a user of the electronic device (101) applies physical pressure to a portion of the button (360) corresponding to the first dome switch (511), a portion of the first dome portion (511a) of the first dome switch (511) may move toward the first contact portion (511b). In this case, the first dome portion (511a) and the first contact portion (511b) can come into contact with each other and can be electrically connected, and a signal can be transmitted to the PCB (330) through the first dome portion (511a) and the first contact portion (511b). The processor (120) of the PCB (330) can increase the volume of the speaker in the electronic device (101) when the signal is identified.

[0190] According to one embodiment, the second dome switch (512) may be a component for lowering the volume of a speaker included in the electronic device (101). For example, the second dome switch (512) may include a second dome portion (512a) forming the exterior of the second dome switch (512) and a second contact portion (512b) disposed within the second dome portion (512a). For example, when a user of the electronic device (101) applies physical pressure to a portion of the button (360) corresponding to the second dome switch (512), a portion of the second dome portion (512a) of the second dome switch (512) may move toward the second contact portion (512b). In this case, the second dome portion (512a) and the second contact portion (512b) can come into contact with each other and can be electrically connected, and a signal can be transmitted to the PCB (330) through the second dome portion (512a) and the second contact portion (512b). The processor (120) of the PCB (330) can lower the volume of the speaker in the electronic device (101) when the signal is identified.

[0191] According to one embodiment, when the first dome portion (511a) of the first dome switch (511) for increasing the volume of the speaker is electrically connected to the ground of the PCB (330) and the first contact portion (511b) is connected to the signal line of the PCB (330) (e.g., a line for transmitting a signal from the PCB to the FPCB), the degradation of radiation performance due to coupling between the first conductive portion (311) and at least one dome switch (510) may be reduced. Additionally, when the second dome portion (512a) of the second dome switch (512) for decreasing the volume of the speaker is connected to the signal line of the PCB (330) and the second contact portion (512b) is electrically connected to the ground of the PCB (330), the degradation of radiation performance due to coupling between the first conductive portion (311) and at least one dome switch (510) may be reduced.

[0192] For example, coupling may occur when at least one dome switch (510) is adjacent to the first conductive portion (311), and may affect the RF signal radiation of the first conductive portion (311). On the other hand, according to one embodiment, the first dome portion (511a) of the first dome switch (511) may be connected to ground and the first contact portion (511b) may be connected to a signal line, and the second dome portion (512a) of the second dome switch (512) may be connected to ground and the second contact portion (512b) may be connected to a signal line. In this case, the degradation of radiation performance due to coupling in a specified frequency band of the RF signal (e.g., about 1.8 to about 2.4 GHz) may be reduced or minimized.

[0193] The description of FIG. 7 may be applied to the description of the path in which each of the first conductive pad (771) and the second conductive pad (772) of the present disclosure is electrically connected to the second connecting pad (342). The description of FIG. 7 may be applied to the description of the path in which each of the third conductive pad (773) and the fourth conductive pad (774) is electrically connected to the first connecting pad (341). The description of FIG. 7 may be applied to the description of the path in which each of the fifth conductive pad (785) and the sixth conductive pad (786) is electrically connected to the third connecting pad (343). The description of FIG. 7 may be applied to the description of the path in which each of the seventh conductive pad (787) and the eighth conductive pad (788) is electrically connected to the second connecting pad (342).

[0194] FIG. 10 is a diagram illustrating the electrical connection relationship between at least one dome switch and conductive pads according to one embodiment.

[0195] Referring to FIG. 10, in order to control the coupling between the first conductive portion (311) and at least one dome switch (510) according to one embodiment, the at least one dome switch (510) may be electrically connected to the ground or signal line of the PCB (330) through conductive pads (e.g., a plurality of first conductive pads (770), a plurality of second conductive pads (780)).

[0196] For example, in case 1 (e.g., GND-GND), the first dome portion (511a) of the first dome switch (511) can be connected to the ground of the PCB (330) through the first conductive pad (771) and the second conductive pad (772), and the second dome portion (512a) of the second dome switch (512) can be connected to the ground of the PCB (330) through the seventh conductive pad (787) and the eighth conductive pad (788). In Case 1, the first contact portion (511b) can be connected to the signal line of the PCB (330) through the third conductive pad (773) and the fourth conductive pad (774), and the second contact portion (512b) can be connected to the signal line of the PCB (330) through the fifth conductive pad (785) and the sixth conductive pad (786). For example, the signal line of the PCB (330) may be a conductive path for supplying a signal to the FPCB (340), and the ground of the PCB (330) may be a conductive path for the signal supplied to the FPCB (340) to return to the PCB (330) through at least one dome switch (510).

[0197] For example, in case 2 (e.g., Signal-Signal), the first dome portion (511a) of the first dome switch (511) can be connected to the signal line of the PCB (330) through the third conductive pad (773) and the fourth conductive pad (774). The second dome portion (512a) can be connected to the signal line of the PCB (330) through the fifth conductive pad (785) and the sixth conductive pad (786). In Case 2, the first contact portion (511b) can be connected to the ground of the PCB (330) through the first conductive pad (771) and the second conductive pad (772), and the second contact portion (512b) can be electrically connected to the ground of the PCB (330) through the seventh conductive pad (787) and the eighth conductive pad (788).

[0198] For example, in case 3 (e.g., Signal-GND), the first dome portion (511a) of the first dome switch (511) can be connected to the signal line of the PCB (330) through the third conductive pad (773) and the fourth conductive pad (774). The second dome portion (512a) can be electrically connected to the ground of the PCB (330) through the seventh conductive pad (787) and the eighth conductive pad (788). In Case 3, the first contact portion (511b) can be electrically connected to the ground of the PCB (330) through the first conductive pad (771) and the second conductive pad (772), and the second contact portion (512b) can be electrically connected to the signal line of the PCB (330) through the fifth conductive pad (785) and the sixth conductive pad (786).

[0199] For example, in case 4 (e.g., GND-Signal), the first dome portion (511a) of the first dome switch (511) can be electrically connected to the ground of the PCB (330) through the first conductive pad (771) and the second conductive pad (772). The second dome portion (512a) can be electrically connected to the signal line of the PCB (330) through the fifth conductive pad (785) and the sixth conductive pad (786). In Case 4, the first contact portion (511b) can be electrically connected to the signal line of the PCB (330) through the third conductive pad (773) and the fourth conductive pad (774), and the second contact portion (512b) can be electrically connected to the ground of the PCB (330) through the seventh conductive pad (787) and the eighth conductive pad (788).

[0200] [Table 1] describes the possibility of damage due to ESD for cases 1 to 4, the performance of the first conductive part (311) in the UWB frequency band, the performance of the first conductive part (311) in the L5 frequency band (e.g., about 1176.45 MHz) for GPS communication, the BT / Wi-Fi communication performance of the first conductive part (311), the antenna radiation efficiency when the first conductive part (311) is an antenna radiator, and the performance when the first conductive part (311) performs MIMO (multi-input multi-output) with another antenna placed on top of the electronic device (101).

[0201] Case 1 Case 2 Case 3 Case 4 ESD (electrostatic discharge) Damage occurred X Damage occurred X Damage occurred X Damage occurred X UWB (ultra-wide band) -79.79 -79.74 -79.44 -79.27 / -79.68 GPS (global positioning system) (e.g., L5) Cases where 2dB degradation exists --0.5 dB BT / WiFi equivalent equivalent equivalent equivalent Antenna radiation efficiency (passive data) 2dB degradation in L5 band, 0.5 dB degradation in B3 band equivalent equivalent equivalent Top radiation of electronic device (101) (e.g., MIMO third best fourth best best second best

[0202] According to one embodiment, in case 4, the MIMO performance may be relatively higher compared to case 1 and case 2, and the GPS communication performance may be higher compared to case 3. Consequently, it can be confirmed that the degradation of radiation performance due to the coupling between the first conductive part (311) and the FPCB (340) is smallest when the ground is connected to the first dome part (511a) of the first dome switch (511) and the signal line is connected to the second dome part (512a) of the second dome switch (512) (e.g., case 4).

[0203] In FIG. 10 of the present disclosure, it is described that the degradation of the radiation performance of the first conductive part (311) is least in case 4, but this is merely an example. For example, case 3 may be selected under certain conditions (e.g., when high performance of MIMO is required). As another example, case 1 or case 2 may be selected under certain conditions.

[0204] FIG. 11 is a drawing illustrating an FPCB including a conductive line that does not include a conductive pattern according to one embodiment.

[0205] Referring to FIG. 11, according to one embodiment, the FPCB (1140) may include a plurality of layers. For example, the plurality of layers of the FPCB (1140) may include a first layer (1141) and / or a second layer (1142).

[0206] According to one embodiment, the FPCB (1140) may include a plurality of first conductive pads (1170) corresponding to a first dome switch (511). The FPCB (1140) may include a plurality of second conductive pads (1180) corresponding to a second dome switch (512). For example, the plurality of first conductive pads (1170) may include a first conductive pad (1171), a second conductive pad (1172), a third conductive pad (1173), and / or a fourth conductive pad (1174). For example, the plurality of second conductive pads (1180) may include a fifth conductive pad (1185), a sixth conductive pad (1186), a seventh conductive pad (1187), and / or an eighth conductive pad (1188).

[0207] For example, a plurality of first conductive pads (1170) may be included or placed in the first layer (1141), and a plurality of second conductive pads (1180) may be included or placed in the first layer (1141).

[0208] According to one embodiment, the FPCB (1140) may include connection pads included in the first layer (1141). For example, the FPCB (1140) may include a first connection pad (1191) connected to a signal line of the PCB (330), a second connection pad (1192) connected to the ground of the PCB (330), and / or a third connection pad (1193) connected to a signal line of the PCB (330).

[0209] According to one embodiment, the first connection pad (1191) can be electrically connected to the first inductor (1151), the second connection pad (1192) can be electrically connected to the second inductor (1152), and the third connection pad (1193) can be electrically connected to the third inductor (1153).

[0210] According to one embodiment, each of the first plurality of conductive pads (1170) and the second plurality of conductive pads (1180) can be electrically connected to the PCB (330) through connecting pads.

[0211] For example, the first conductive pad (1171) and the second conductive pad (1172) can be electrically connected to the second layer (1142) through the first conductive vias (1101). The first conductive pad (1171) and the second conductive pad (1172) can be electrically connected to the second conductive via (1104) through the second layer (1142). The first conductive pad (1171) and the second conductive pad (1172) can be electrically connected to the first layer (1141) through the second conductive via (1104) and can be electrically connected to the second connection pad (1192) through the second inductor (1152).

[0212] For example, the third conductive pad (1173) and the fourth conductive pad (1174) can be electrically connected to the first conductive line (1111) of the second layer (1142) through the third conductive vias (1102). The third conductive pad (1173) and the fourth conductive pad (1174) can be electrically connected to the first inductor (1151) through the first conductive line (1111) and the fourth conductive via (1112). The third conductive pad (1173) and the fourth conductive pad (1174) can be electrically connected to the first connection pad (1191) through the first inductor (1151).

[0213] For example, the fifth conductive pad (1185) and the sixth conductive pad (1186) can be electrically connected to the third inductor (1153) through the second conductive line (1103). The fifth conductive pad (1185) and the sixth conductive pad (1186) can be electrically connected to the third connecting pad (1193) through the third inductor (1153).

[0214] For example, the seventh conductive pad (1187) and the eighth conductive pad (1188) can be electrically connected to the second inductor (1152) and can be electrically connected to the second connecting pad (1192) through the second inductor (1152).

[0215] According to one embodiment, the FPCB (1140) may include separate inductors (e.g., a first inductor (1151)) unlike the FPCB (340) of FIG. 7.

[0216] The first conductive pad (1171), second conductive pad (1172), third conductive pad (1173), and fourth conductive pad (1174) of FIG. 11 of the present disclosure may correspond in order to the first conductive pad (771), second conductive pad (772), third conductive pad (773), and fourth conductive pad (774) of FIG. 7. For example, the fifth conductive pad (1185), sixth conductive pad (1186), seventh conductive pad (1187), and eighth conductive pad (1188) of FIG. 11 may correspond in order to the fifth conductive pad (785), sixth conductive pad (786), seventh conductive pad (787), and eighth conductive pad (788) of FIG. 7.

[0217] FIG. 12 is a drawing illustrating an FPCB having additional conductive patterns than the FPCB of FIG. 7 according to one embodiment.

[0218] Referring to FIG. 12, a first conductive pad (771) and a second conductive pad (772) according to one embodiment may be electrically connected to a first conductive via (731) through a first conductive connection portion (1201). The first conductive pad (771) and the second conductive pad (772) may be electrically connected to a second layer (1292) through the first conductive via (731). The first conductive pad (771) and the second conductive pad (772) may be connected to a second conductive via (1203) through a first conductive line (711) formed in the second layer (1292), and may be electrically connected to a first additional conductive line (1281) of the first layer (1291) through the second conductive via (1203). The first conductive pad (771) and the second conductive pad (772) can be connected to the second additional conductive line (1282) through the first additional conductive line (1281) and can be electrically connected to the third conductive via (1204) through the second additional conductive line (1282). The first conductive pad (771) and the second conductive pad (772) can be electrically connected to the third additional conductive line (1283) formed in the second layer (1292) through the third conductive via (1204). The first conductive pad (771) and the second conductive pad (772) can be electrically connected to the second connecting pad (342) formed in the first layer (1291) through the fourth conductive via (1205) via the third additional conductive line (1283).

[0219] According to one embodiment, the electrical path between the first conductive pad (771) and the second conductive pad (772) and the second connecting pad (342) may include a first conductive line (711), a first additional conductive line (1281), a second additional conductive line (1282), and / or a third additional conductive line (1283). For example, each of the first conductive line (711), the first additional conductive line (1281), the second additional conductive line (1282), and / or the third additional conductive line (1283) may include a conductive pattern comprising a plurality of curved portions. For example, the first conductive line (711) and the third additional conductive line (1283) may be included in the second layer (1292). For example, the first additional conductive line (1281) and the second additional conductive line (1282) may be included in the first layer (1291).

[0220] According to one embodiment, the third conductive pad (773) and the fourth conductive pad (774) can be electrically connected to the second layer (1292) through the fifth conductive via (1202) and can be electrically connected to the fourth additional conductive line (1284) through the third conductive line (712). The third conductive pad (773) and the fourth conductive pad (774) can be electrically connected to the sixth conductive via (1250) through the fourth additional conductive line (1284) and can be electrically connected to the seventh conductive via (1251) through the sixth conductive via (1250). The third conductive pad (773) and the fourth conductive pad (774) can be electrically connected to the fifth additional conductive line (1285) formed in the second layer (1292) through the seventh conductive via (1251), and can be electrically connected to the eighth conductive via (1252) through the fifth additional conductive line (1285). The third conductive pad (773) and the fourth conductive pad (774) can be electrically connected to the first connecting pad (341) through the eighth conductive via (1252).

[0221] According to one embodiment, the electrical path between the third conductive pad (773) and the fourth conductive pad (774) and the first connecting pad (341) may include a third conductive line (712), a fourth additional conductive line (1284), and / or a fifth additional conductive line (1285). For example, each of the third conductive line (712), the fourth additional conductive line (1284), and / or the fifth additional conductive line (1285) may include a conductive pattern comprising a plurality of curved portions. For example, the third conductive line (712), the fourth additional conductive line (1284), and the fifth additional conductive line (1285) may be included in the second layer (1292).

[0222] According to one embodiment, the fifth conductive pad (785) and the sixth conductive pad (786) can be electrically connected to the ninth conductive via (1254) through the second conductive connection portion (1253) and the fourth conductive line (714), and can be electrically connected to the sixth additional conductive line (1286) formed in the second layer (1292) through the ninth conductive via (1254). The fifth conductive pad (785) and the sixth conductive pad (786) can be electrically connected to the tenth conductive via (1255) through the sixth additional conductive line (1286), and can be electrically connected to the seventh additional conductive line (1287) formed in the first layer (1291) through the tenth conductive via (1255). The fifth conductive pad (785) and the sixth conductive pad (786) can be connected to the eleventh conductive via (1256) through the seventh additional conductive line (1287), and can be electrically connected to the eighth additional conductive line (1288) formed in the second layer (1292) through the eleventh conductive via (1256), and can be electrically connected to the ninth additional conductive line (1289) formed in the first layer (1291) and the twelfth conductive via (1257) through the eighth additional conductive line (1288), and can be electrically connected to the third connecting pad (343) through the ninth additional conductive line (1289).

[0223] According to one embodiment, the electrical path between the fifth conductive pad (785) and the sixth conductive pad (786) and the third connecting pad (343) may include a fourth conductive line (714), a sixth additional conductive line (1286), a seventh additional conductive line (1287), an eighth additional conductive line (1288) and / or a ninth additional conductive line (1289). For example, the fourth conductive line (714), the seventh additional conductive line (1287), and the ninth additional conductive line (1289) may be included in the first layer (1291). For example, the sixth additional conductive line (1286) and the eighth additional conductive line (1288) may be included in the second layer (1292). For example, each of the fourth conductive line (714), the sixth additional conductive line (1286), the seventh additional conductive line (1287), the eighth additional conductive line (1288) and / or the ninth additional conductive line (1289) may include a conductive pattern comprising a plurality of curved portions.

[0224] According to one embodiment, the seventh conductive pad (787) and the eighth conductive pad (788) can be electrically connected to the thirteenth conductive via (1207) through the third conductive connection portion (1206) and can be electrically connected to the fifth conductive line (713) through the thirteenth conductive via (1207). The seventh conductive pad (787) and the eighth conductive pad (788) can be electrically connected to the fourteenth conductive via (1208) through the fifth conductive line (713) and can be electrically connected to the second connecting pad (342) through the first additional conductive line (1281) formed in the first layer (1291) through the fourteenth conductive via (1208).

[0225] According to one embodiment, the electrical path between the seventh conductive pad (787) and the eighth conductive pad (788), respectively, and the second connecting pad (342) may include a fifth conductive line (713) and / or a first additional conductive line (1281). For example, the first additional conductive line (1281) may be included in the first layer (1291), and the fifth conductive line (713) may be included in the second layer (1292). For example, each of the fifth conductive line (713) and / or the first additional conductive line (1281) may include a conductive pattern comprising a plurality of curved portions.

[0226] The FPCB (1200) of FIG. 12 may further include additional conductive lines including a conductive pattern comprising a plurality of curved portions compared to the FPCB (340) of FIG. 7. Accordingly, the electronic device (101) can reduce or minimize the degradation of the radiation performance of the first conductive portion (311).

[0227] FIG. 13 is a drawing illustrating an FPCB (1300) with the first conductive region and the second conductive region removed according to one embodiment.

[0228] Referring to FIG. 13, the FPCB (1300) of FIG. 13 according to one embodiment may have the first conductive region (760) and the second conductive region (761) removed compared to the FPCB (340) of FIG. 7. For example, in FIG. 7, the first conductive region (760) and the second conductive region (761) are arranged in the fourth part (794) of the FPCB (340) and may be coupled and formed to form a capacitance component. On the other hand, in the FPCB (1300) according to one embodiment, the first conductive region (760) and the second conductive region (761) are removed so that a first additional conductive line (1281) may be formed. That is, by placing a first additional conductive line (1281) in the area where the first conductive region (760) and the second conductive region (761) are placed, the inductance of the electrical path of the FPCB (1300) can be relatively increased.

[0229] According to one embodiment, the first conductive pad (771) and the second conductive pad (772) can be electrically connected to the second connecting pad (342) through the first conductive connecting portion (701), the first conductive vias (731), the first conductive line (711), the first additional conductive via (1303), and the first additional conductive line (1281).

[0230] The fifth conductive pad (785) and the sixth conductive pad (786) can be electrically connected to the third connecting pad (343) through the second additional conductive via (1309) and the sixth conductive via (738).

[0231] The seventh conductive pad (787) and the eighth conductive pad (788) can be electrically connected to the second connecting pad (342) through the seventh conductive vias (736), the fifth conductive line (713), the third additional conductive via (1308), and / or the first additional conductive line (1281).

[0232] FIG. 14 is a drawing illustrating various FPCBs according to one embodiment.

[0233] Referring to FIG. 14, the FPCB (1300) according to one embodiment may include a first additional conductive line (1281) compared to the FPCB (340), and accordingly, the inductance may be relatively larger.

[0234] According to one embodiment, the second layer (1392) of the FPCB (1300) may include a first conductive region (1401) and a second conductive region (1402). The capacitance component and the inductance component of the conductive lines formed based on the first conductive region (1401) and the second conductive region (1402) may form a notch filter. On the other hand, the first conductive region (1402) and the second conductive region (1402) may be removed from the FPCB (1200), and a third additional conductive line (1283), a fifth additional conductive line (1285), and an eighth additional conductive line (1288) may be further added. Accordingly, the FPCB (1200) may secure a relatively high inductance compared to the FPCB (1200).

[0235] According to one embodiment, the grounds in the FPCB (1400) may be separated compared to the FPCB (1300). For example, in the FPCB (1400), the first region (1410) and the second region (1420) of the first layer may be removed compared to the FPCB (1300). Accordingly, the ground (1451) (e.g., meander ground) connected to the first conductive pad (771) and the ground (1461) (e.g., plane ground) of the first layer may be electrically separated. The ground (1452) (e.g., meander ground) connected to the seventh conductive pad (787) and the ground (1462) (e.g., plane ground) of the first layer may be electrically separated.

[0236] [Table 2] describes the inductance between the conductive pads and ground (or the second connection pad (342) for ground connection) and the inductance between the conductive pads and the signal line (or the connection pad for signal line connection).

[0237] Ground - L value (GND(UP)) to the first conductive pad (771) Ground - L value (GND(DOWN)) to the seventh conductive pad (787) Signal line - L value (UP) to the third conductive pad (773) Signal line - L value (DOWN) to the fifth conductive pad (785) FPCB (1300) 33n 28n 17n 19n FPCB (1200) 45n 25n 28n 33n FPCB (1400) 45n 25n 28n 33n Additional embodiment 45n+39n (inductor) 42n+39n (inductor) 28n+39n (inductor) 33n+39n (inductor)

[0238] FIG. 15 is a graph of the radiation performance of an antenna including a first conductive portion when various FPCBs according to one embodiment are included in an electronic device.

[0239] Referring to FIG. 15, a first graph (1501) according to one embodiment is a radiation efficiency graph of an antenna including the first conductive portion (311) in the case where no conductive line including an inductor or a conductive pattern is disposed on the FPCB disposed adjacent to the first conductive portion (311). A second graph (1502) is a radiation efficiency graph of an antenna including the first conductive portion (311) with respect to the FPCB (1140) disposed adjacent to the first conductive portion (311). A third graph (1503) is a radiation efficiency graph of an antenna including the first conductive portion (311) with respect to the FPCB (1300) disposed adjacent to the first conductive portion (311). A fourth graph (1504) is a radiation efficiency graph of an antenna including the first conductive portion (311) with respect to the FPCB (1200) disposed adjacent to the first conductive portion (311). The fifth graph (1505) is a graph of the radiation efficiency of an antenna including the first conductive portion (311) with respect to an FPCB (340) placed adjacent to the first conductive portion (311).

[0240] When comparing the first graph (1501) with other graphs, the first graph (1501) shows a relatively lower antenna radiation efficiency value compared to other graphs (e.g., the fifth graph (1505)) in a specified frequency band (e.g., about 1.8 to about 2.4 GHz). Thus, it is confirmed that the antenna radiation efficiency is lower in the specified frequency band (e.g., about 1.8 to about 2.4 GHz) when the FPCB adjacent to the first conductive part (311) does not contain an inductor or a conductive line containing a conductive pattern having a high inductance value. On the other hand, when an inductor is included in the FPCB (1140) or conductive lines containing a conductive pattern are formed in the FPCB (340) (e.g., the second graph (1502) to the fifth graph (1505)), it is confirmed that a relatively high antenna radiation efficiency value is shown in the specified frequency band (e.g., about 1.8 to about 2.4 GHz). This is because when the FPCB (340) includes conductive lines containing an inductor or a conductive pattern with a high inductance value, the LC resonance based on the coupling occurring between the first conductive part (311) and the FPCB (340) is formed in a relatively low frequency band (e.g., about 1.3 to about 1.7 GHz).

[0241] Consequently, the reduction in antenna radiation efficiency in a specified frequency band can be prevented or reduced by including an inductor within the FPCB (1140) or by including a conductive line including a conductive pattern including bendable portions within the FPCB (340). Additionally, the electronic device (101) can prevent or reduce the reduction in antenna radiation efficiency while reducing the possibility of failure due to inductor breakage by including a conductive line including a conductive pattern without including an inductor within the FPCB (1140).

[0242] [Table 3] explains the inductance and height of FPCBs by type.

[0243] Inductance Epoxy + Tape Height FPCB (1140) 82nH 0.25T + 0.15TF PCB (1300) L value from signal line to 3rd conductive pad (773): 17nH L value from signal line to 5th conductive pad (785): 19nH L value from ground to 1st conductive pad (771): 33nH L value from ground to 7th conductive pad (787): 28nH 0.25T + 0.15TF PCB (1200) L value from signal line to 3rd conductive pad (773): 28nH L value from signal line to 5th conductive pad (785): 33nH L value from ground to 1st conductive pad (771): 45nH L value from ground to 7th conductive pad (787): L value from PCB (340) signal line to 3rd conductive pad (773): 17nH L value from signal line to 5th conductive pad (785): 19nH L value from ground to 1st conductive pad (771): 26nH L value from ground to 7th conductive pad (787): 21nH 0.25T+0.15T

[0244] Figure 16 is a diagram illustrating the change in reflection coefficient according to the width of the conductive pattern.

[0245] Referring to FIG. 16, a first example (1610) according to one embodiment is a first reflection coefficient graph (1611) for a first dome switch (511) (e.g., UP) and a second reflection coefficient graph (1612) for each of a second dome switch (512) (e.g., DOWN) in a case where the FPCB does not contain an inductor or a conductive pattern with high inductance (case 5).

[0246] According to one embodiment, the second example (1620) is a third reflection coefficient graph (1613) for a first dome switch (511) (e.g., UP) and a fourth reflection coefficient graph (1614) for a second dome switch (512) (e.g., DOWN) in the case where an inductor is included in the FPCB (1140) (case 6).

[0247] According to one embodiment, the third example (1630) is a fifth reflection coefficient graph (1615) for the first dome switch (511) and a sixth reflection coefficient graph (1616) for the second dome switch (512) when the width of the conductive pattern (621) included in the FPCB (340) is 100 µm (case 7).

[0248] According to one embodiment, the fourth example (1640) is a seventh reflection coefficient graph (1617) for the first dome switch (511) and an eighth reflection coefficient graph (1618) for the second dome switch (512) in the case where the width of the conductive pattern (621) included in the FPCB (340) is 70 µm (case 8).

[0249] [Table 4] describes the reflection coefficient values ​​for each of the first dome switch (e.g., UP) and the second dome switch (e.g., DOWN) for each case at 1.8 GHz to 2.5 GHz.

[0250] S211.8G(UP)1.8G(DOWN)2G(UP)2G(DOWN)2.5G(UP)2.5G(DOWN)Case 5-5.8-8.9-6.4-10.3-6.7-13.1Case 6(39n)-26.6-31.1-29.5-33.5-40.5-42.9Case 7(100um)-9.8-9.1-10.4-9.7-9.5-11.3Case 8(70um)-6.4-7.8-6.5-7.7-6.2-20

[0251] [Table 5] describes the reflection coefficient values ​​for each of the first dome switch (e.g., UP) and the second dome switch (e.g., DOWN) for each case at 3 GHz to 5 GHz.

[0252] S213G(UP)3G(DOWN)4G(UP)4G(DOWN)5G(UP)5G(DOWN)Case 5-11.1-10.6-11.5-13.4-7.9-17.2Case 6(39n)-42-36.9-26.4-22.8-20.7-11.1Case 7(100um)-10.4-16.7-22.1-28.8-19.8-20.6Case 8(70um)-20.7-24.2-31.9-26.4-17.7-23.3

[0253] [Table 6] describes the reflection coefficient values ​​for each of the first dome switch (e.g., UP) and the second dome switch (e.g., DOWN) for each case at 6 GHz to 8 GHz.

[0254] S216G(UP)6G(DOWN)7G(UP)7G(DOWN)8G(UP)8G(DOWN)Case 5-11.4-13.4-15.6-17.8-16.1-19.4Case 6(39n)-20.7-17.3-21.2-22.9-18.8-26.2Case 7(100um)-41.1-25.4-26.8-23.4-19.1-19.4Case 8(70um)-22.1-18.1-21.4-27.4-23.2-31

[0255] According to one embodiment, it is confirmed that case 8 has a relatively higher reflection coefficient in some bands compared to case 7. For example, it is confirmed that case 8 has a relatively higher reflection coefficient in the 3 GHz band compared to case 7, and accordingly, it is identified that case 8 has relatively less effect on the antenna including the first conductive part (311) compared to case 7.

[0256] As a result, as the width of the first conductive line (620) is reduced, a relatively long length of conductive pattern can be secured within the same area, and a relatively high inductance can be secured. Through this, the electronic device (101) can reduce or minimize the effect of radiation performance on the first conductive part (311) by the FPCB (340). That is, the more conductive patterns are placed in a limited space, the higher the inductance value (e.g., L value), and to achieve this, by reducing the width of the pattern and using multiple layers, a result similar to that of an inductor element being mounted can be secured.

[0257] According to one embodiment, an electronic device (101) comprises a side member (215) including a first conductive portion (311), a printed circuit board (PCB) (330), a flexible PCB (FPCB) (340) connected to the PCB (330) and disposed adjacent to the first conductive portion (311), at least one dome switch (510) disposed on the FPCB and electrically connected to the first conductive line (620), and a wireless communication circuit (610) disposed on the PCB (330) and fed to the first conductive portion (311) to transmit and / or receive a radio frequency (RF) signal of a designated frequency band, wherein the FPCB (340) includes a first conductive line for transmitting the signal, the first conductive line includes a plurality of curved portions (650), and through the plurality of curved portions (650) of the first conductive line (620) the at least one dome A signal may be transmitted to the switch (510) or received from the at least one dome switch (510).

[0258] According to one embodiment, the at least one dome switch may include a dome portion coupled to a key button, and a contact portion disposed between the dome portion and the FPCB and electrically connected to the dome portion, and as the key button moves in a direction toward the interior of the electronic device, the dome portion and the contact portion may come into contact and be electrically connected.

[0259] According to one embodiment, the FPCB may further include a first conductive pad electrically connected to the dome portion, a second conductive pad electrically connected to the contact portion, and a second conductive line, and the first conductive line may transmit a first signal to the dome portion through the first conductive pad, and when the dome portion and the contact portion are in contact, the second conductive line may receive the first signal from the contact portion through the second conductive pad.

[0260] According to one embodiment, the second conductive line includes a plurality of curved portions, and the first signal received from the contact portion can be transmitted to the ground of the electronic device through the plurality of curved portions of the second conductive line.

[0261] According to one embodiment, the device further includes an additional conductive line electrically connected to the first conductive line, wherein the additional conductive line includes a plurality of curved portions, and the first conductive line and the additional conductive line may be included in a first layer of the FPCB.

[0262] According to one embodiment, the electronic device further includes a conductive via and an additional conductive line electrically connected to the first conductive line through the conductive via, the additional conductive line further includes a plurality of curved portions, and the signal can be transmitted to the at least one dome switch through the plurality of curved portions of the first conductive line and the plurality of curved portions of the additional conductive line.

[0263] According to one embodiment, the first conductive line is included in the first layer of the FPCB, the additional conductive line is included in the second layer of the FPCB, and the conductive via may extend from the first layer to the second layer.

[0264] According to one embodiment, the at least one dome switch includes a first dome switch and a second dome switch, and the FPCB includes a first portion where the first dome switch is placed, a second portion where the second dome switch is placed, a third portion for connecting to the PCB, and a fourth portion connecting the first portion, the second portion and the third portion, and the first conductive line may be placed in the first portion of the FPCB, and the additional conductive line may be placed in the fourth portion of the FPCB.

[0265] According to one embodiment, the first layer comprises a conductive material and the second layer comprises a conductive material, and a capacitance component may be formed between the first layer and the second layer.

[0266] According to one embodiment, the electronic device further comprises a speaker and an application processor disposed on the PCB, and the at least one dome switch comprises a plurality of dome switches including a first dome switch and a second dome switch, and the application processor may be configured to increase the volume output from the speaker based on the reception of a first signal through the first dome switch and to decrease the volume output from the speaker based on the reception of a second signal through the second dome switch.

[0267] According to one embodiment, the FPCB may include a first portion in which the first dome switch is placed, a second portion in which the second dome switch is placed, a third portion for connecting to the PCB, and a fourth portion connecting the first portion, the second portion and the third portion.

[0268] According to one embodiment, the electronic device further includes a camera module and a support member disposed between the camera module and the conductive portion of the side member, and the first portion and the second portion of the FPCB may be disposed on the support member.

[0269] According to one embodiment, the electronic device includes a display, a first conductive connecting member connected to the conductive portion and disposed between the PCB and the display, and a second conductive connecting member disposed on the PCB to electrically connect the first conductive connecting member and the wireless communication circuit, and the wireless communication circuit may be configured to supply power to the conductive portion through the first conductive connecting member and the second conductive connecting member.

[0270] According to one embodiment, the plurality of curved portions may have a meander shape.

[0271] According to one embodiment, the device further includes a key button coupled to the at least one dome switch, wherein the conductive portion of the side member includes a hole, and the key button may be positioned in the hole and exposed to the outside of the electronic device.

[0272] According to one embodiment, an electronic device may include a side member including a conductive portion, a printed circuit board (PCB), a side key, and a wireless communication circuit disposed on the PCB and configured to transmit and / or receive a radio frequency (RF) signal of a designated frequency band by supplying power to the conductive portion. A portion of the side key may be disposed in the hole, and the side key may be electrically connected to the PCB and may include a flexible PCB (FPCB) disposed adjacent to the conductive portion and including a first conductive line for transmitting a signal, and at least one dome switch disposed on the FPCB and electrically connected to the first conductive line. The conductive portion may include a hole, and the first conductive line may include a conductive pattern including a plurality of curved portions, and a signal may be transmitted to the at least one dome switch or received from the at least one dome switch through the plurality of curved portions of the first conductive line.

[0273] According to one embodiment, the at least one dome switch includes a dome portion coupled to a key button and a contact portion disposed between the dome portion and the FPCB and electrically connectable to the dome portion, and as the key button moves in a direction toward the interior of the electronic device, the dome portion and the contact portion can come into contact and be electrically connected.

[0274] According to one embodiment, the FPCB further includes a first conductive pad electrically connected to the dome portion, a second conductive pad electrically connected to the contact portion, and a second conductive line, wherein the first conductive line transmits a first signal to the dome portion through the first conductive pad, and when the dome portion and the contact portion are in contact, the second conductive line can receive the first signal from the contact portion through the second conductive pad.

[0275] According to one embodiment, the second conductive line includes a plurality of curved portions, and the first signal received from the contact portion can be transmitted to the ground of the electronic device through the plurality of curved portions of the second conductive line.

[0276] According to one embodiment, the electronic device further includes an additional conductive line electrically connected to the first conductive line, the additional conductive line includes a plurality of curved portions, and the first conductive line and the additional conductive line may be included in a first layer of the FPCB.

Claims

1. In an electronic device, Side member including a conductive portion; PCB (printed circuit board); An FPCB (flexible PCB) electrically connected to the above PCB and disposed adjacent to the above conductive portion, wherein the FPCB includes a first conductive line for transmitting a signal, and the first conductive line includes a plurality of curved portions; At least one dome switch disposed on the above FPCB and electrically connected to the first conductive line; and It includes a wireless communication circuit disposed on the PCB and configured to transmit and / or receive RF (radio frequency) signals of a designated frequency band by supplying power to the conductive portion, An electronic device in which a signal is transmitted to or received from at least one dome switch through the plurality of curved portions of the first conductive line.

2. In Claim 1, The at least one dome switch comprises a dome portion coupled to a key button, and a contact portion disposed between the dome portion and the FPCB and electrically connectable to the dome portion. An electronic device in which the dome portion and the contact portion come into contact and are electrically connected as the key button moves in a direction toward the interior of the electronic device.

3. In Claim 2, The above FPCB further includes a first conductive pad electrically connected to the dome portion, a second conductive pad electrically connected to the contact portion, and a second conductive line, and The first conductive line transmits a first signal to the dome portion through the first conductive pad, and An electronic device in which, when the above dome portion and the above contact portion are in contact, the second conductive line receives the first signal from the above contact portion through the second conductive pad.

4. In Claim 3, The above second conductive line includes a plurality of curved portions, and An electronic device in which the first signal received from the contact portion is transmitted to the ground of the electronic device through the plurality of curved portions of the second conductive line.

5. In Claim 1, It further includes an additional conductive line electrically connected to the first conductive line, and The above additional conductive line includes a plurality of curved sections, and The electronic device, wherein the first conductive line and the additional conductive line are included in the first layer of the FPCB.

6. In Claim 1, Conductive vias; and It further includes an additional conductive line electrically connected to the first conductive line through the conductive via, The above additional conductive line further includes a plurality of curved portions, and An electronic device in which the above signal is transmitted to the at least one dome switch through the plurality of curved portions of the first conductive line and the plurality of curved portions of the additional conductive line.

7. In Claim 6, The first conductive line is included in the first layer of the FPCB, and The above additional conductive line is included in the second layer of the above FPCB, and The above conductive via is an electronic device extending from the first layer to the second layer.

8. In Claim 7, The above at least one dome switch includes a first dome switch and a second dome switch, and The above FPCB includes a first portion where the first dome switch is disposed, a second portion where the second dome switch is disposed, a third portion for connecting to the PCB, and a fourth portion connecting the first portion, the second portion and the third portion. The above first conductive line is disposed in a first part of the above FPCB, and The above additional conductive line is an electronic device disposed in the above fourth part of the above FPCB.

9. In Claim 7 The first layer comprises a conductive material, and the second layer comprises a conductive material, An electronic device in which a capacitance component is formed between the first layer and the second layer.

10. In Claim 1, Speaker; and It further includes an application processor disposed on the above PCB, and The above at least one dome switch comprises a plurality of dome switches, including a first dome switch and a second dome switch, and The above application processor is: Based on the reception of a first signal through the first dome switch, the volume output from the speaker is increased, and An electronic device configured to lower the volume output from the speaker based on the reception of a second signal through the second dome switch.

11. In Claim 10, The electronic device comprising the above FPCB having a first portion in which the first dome switch is disposed, a second portion in which the second dome switch is disposed, a third portion for connecting to the PCB, and a fourth portion connecting the first portion, the second portion and the third portion.

12. In Claim 11, Camera module; and It further includes a support member disposed between the camera module and the conductive portion of the side member, and An electronic device in which the first part and the second part of the above FPCB are disposed on the support member.

13. In Claim 12, display; A first conductive connecting member connected to the conductive portion and disposed between the PCB and the display; and It includes a second conductive connecting member disposed on the PCB and electrically connecting the first conductive connecting member and the wireless communication circuit, An electronic device in which the above wireless communication circuit is configured to supply power to the conductive part through the first conductive connecting member and the second conductive connecting member.

14. In Claim 1, The above plurality of curved portions have a meander shape, in an electronic device.

15. In Claim 1, It further includes a key button coupled to the above-mentioned at least one dome switch, and The conductive portion of the above-mentioned side member includes a hole, An electronic device, wherein the above key button is positioned in the above hole and exposed to the outside of the electronic device.

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