Heat dissipation device and optical module system
By designing a flow channel diversion structure with multiple liquid cooling plates connected in parallel, series, or series-parallel in the optical module system, the heat dissipation problem of high-density optical modules is solved, achieving efficient and low-flow-resistance heat dissipation.
WO2026086107A1PCT designated stage Publication Date: 2026-04-30RUIJIE NETWORKS CO LTD
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- RUIJIE NETWORKS CO LTD
- Filing Date
- 2025-04-02
- Publication Date
- 2026-04-30
Smart Images
Figure CN2025086999_30042026_PF_FP_ABST
Abstract
Provided in the present application are a heat dissipation device and an optical module system. The heat dissipation device comprises: a housing; a liquid storage chamber provided in the housing; and a plurality of liquid cooling plates, which are substantially parallel to each other, are arranged in the housing at intervals and extend in a second direction, wherein the outer surfaces of the plurality of liquid cooling plates are configured to allow contact with one or more heat transfer pipes so as to allow heat from the one or more heat transfer pipes to be transferred to the plurality of liquid cooling plates, and the one or more heat transfer pipes extend in a third direction. Liquid cooling flow channels provided in the plurality of liquid cooling plates are all in communication with the liquid storage chamber. The third direction is perpendicular to the second direction.
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Citation Information
Patent Citations
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