Circuit board and preparation method therefor, and connector, electronic component, electronic device and signal transmission method

Abstract

Provided in the present application are a circuit board and a preparation method therefor, and a connector, an electronic component, an electronic device and a signal transmission method. The circuit board is used for being connected to the connector by means of insertion. The circuit board comprises a main body region and a connection region, wherein the main body region and the connection region are arranged in an insertion direction, and the end face of the connection region that faces away from the main body region in the insertion direction is a first end face. The circuit board comprises a shielding metal layer and a plurality of gold fingers, wherein the plurality of gold fingers are arranged in the connection region to form a gold finger connector. The circuit board further comprises a grounding metal layer, wherein the shielding metal layer is fixed to the first end face, and the shielding metal layer is electrically connected to the grounding metal layer. The shielding metal layer forms a shielding structure on the first end face, and the shielding metal layer and the grounding metal layer together form a shielding structure and a multi-point return ground. The solution can increase the rate and bandwidth of signal transmission between a connector and a peer connector.

Description

Circuit boards and their manufacturing methods, connectors, electronic components, electronic devices, and signal transmission methods

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411514041.2, filed on October 28, 2024, with the invention entitled "Circuit Board, Connector, Electronic Component, Electronic Device and Signal Transmission Method", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of electronic equipment technology, and in particular to circuit boards and their manufacturing methods, connectors, electronic components, electronic devices, and signal transmission methods. Background Technology

[0004] Electronic devices typically consist of multiple electronic components, which need to transmit signals between each other. With the continuous evolution of electronic devices, the number of transmitted signals is increasing, and the speed is also accelerating. High-speed connectors, as a crucial link in signal transmission, have a significant impact on the operating speed of electronic devices; therefore, higher requirements are placed on the signal transmission rate of high-speed connectors. Furthermore, in addition to the signal transmission rate, increasingly stringent requirements are being placed on the crosstalk immunity and bandwidth of high-speed connectors. Summary of the Invention

[0005] This application provides circuit boards and their manufacturing methods, connectors, electronic components, electronic devices, and signal transmission methods, which improve the shielding effect of connectors against crosstalk signals and increase the signal transmission rate and bandwidth of connectors.

[0006] Firstly, this application provides a circuit board for mating with a connector. Specifically, the circuit board includes a main body region and a connection region. The main body region is used to house electronic components, and the connection region is used to house the connector. The main body region and the connection region are arranged along the mating direction, specifically, the connection region is located at the edge of the circuit board. The circuit board includes a shielding metal layer and multiple gold fingers. The multiple gold fingers are arranged in the connection region to form a gold finger connector. The end face of the connection region facing away from the main body region along the mating direction is a first end face, which is also the end face of the gold finger connector. The circuit board includes a ground metal layer, the end face of which can be exposed on the first end face. The shielding metal layer is fixed to the first end face, covers the end face of the ground metal layer, and is electrically connected to the ground metal layer. The electrical connection between the shielding metal layer and the ground metal layer allows the gold finger connector to also form a shielding structure on the first end face of the circuit board, and the shielding metal layer and the ground metal layer together form a shielding structure and multiple return grounds. Therefore, this solution can improve the anti-interference performance of the gold finger connector and improve the return current effect of the gold finger connector. This improves the signal transmission rate and bandwidth between the connector and the other connector.

[0007] The aforementioned circuit board includes a first surface and a second surface that are opposite to each other. Gold fingers are disposed on the first surface, and a shielding metal layer also covers a portion of the first surface. This enhances the fixing strength of the shielding metal layer to the circuit board and improves the structural reliability of the circuit board.

[0008] Furthermore, the aforementioned shielding metal layer also covers part of the second surface. This can enhance the fixing strength of the shielding metal layer to the circuit board from opposite sides, thereby improving the structural reliability of the circuit board.

[0009] The circuit board also includes conductive vias containing metal pillars. A shielding metal layer covers the surface of the metal pillars and is fixedly connected to them. Since both the shielding metal layer and the metal pillars are made of metal, the bonding strength between the shielding metal layer and the surface of the metal pillars is high, which helps to improve the bonding strength of the shielding metal layer to the circuit board and enhances the structural reliability of the circuit board.

[0010] The width of the aforementioned shielding metal layer on the first surface along the insertion direction is greater than or equal to 1 mm. This improves the fixing strength between the shielding metal layer and the circuit board.

[0011] When the shielding metal layer covers the second surface, the width of the area of ​​the shielding metal layer on the second surface along the insertion direction is greater than or equal to 1 mm, thereby improving the fixing strength between the shielding metal layer and the circuit board.

[0012] Furthermore, the circuit board may also include a chamfer. Specifically, the circuit board includes a first surface and a second surface facing away from each other, the first surface being provided with gold fingers; a first chamfer bevel is formed between the first surface and the first end face, and the shielding metal layer further covers the first chamfer bevel; or, a second chamfer bevel is formed between the second surface and the first end face, and the shielding metal layer further covers the second chamfer bevel. Alternatively, the first chamfer bevel is formed between the first surface and the first end face, the second chamfer bevel is formed between the second surface and the first end face, and the shielding metal layer further covers both the first and second chamfer bevels. This solution can improve the fixing strength of the shielding metal layer to the circuit board.

[0013] In one technical solution, multiple gold fingers of a circuit board are arranged along a first direction in the connection area of ​​the circuit board, and a shielding metal layer covers a portion of the first end face along the first direction. The shielding metal layer may include multiple segments arranged at intervals along the first direction, which is beneficial for enriching the layout of the shielding metal layer.

[0014] Secondly, this application also provides a connector for use with a fixed structure and multiple terminals, the terminals being fixed to the fixed structure. The connector includes a mating interface, and the fixed structure has a second end face facing the mating interface. At least a portion of the terminal structure is located between the second end face and the mating interface. An elastic conductive structure is fixed to the second end face. The elastic conductive structure has elastic deformation capability along the mating direction and is conductive. The elastic conductive structure is used to contact a shielding metal layer on a first end face of a circuit board. The elastic conductive structure is connected to the shielding metal layer, and the shielding metal layer is connected to the grounding metal layer of the circuit board. This allows the elastic conductive structure to connect with the grounding metal layer of the circuit board, jointly forming a shielding structure and a multi-point return ground. Specifically, a shielding cage can be formed, improving the anti-interference performance of the connector and the gold finger connector in the connected state, and improving the return current effect of the connector's transmitted signal. Therefore, this application can improve the signal transmission rate and bandwidth of the connector and the gold finger connector.

[0015] Thirdly, this application also provides a method for manufacturing a circuit board. This method is used to manufacture the circuit board provided in the first aspect. The method includes: preparing gold fingers on the surface of the connection area of ​​the circuit board, specifically by using chemical methods and / or electroplating to prepare a metal layer, followed by etching to remove some of the metal to form the gold fingers. Then, a shielding metal layer is prepared on a first end face, covering the end face of a grounding metal layer, and the shielding metal layer is electrically connected to the grounding metal layer. Specifically, the metal layer can be prepared using chemical methods and / or electroplating; then, etching is used to remove some of the metal to form the shielding metal layer. The shielding metal layer and the grounding metal layer together form a shielding structure and a multi-point return ground. Therefore, this solution can improve the anti-interference performance of the gold finger connector and improve the return current effect of the gold finger connector. This further improves the signal transmission rate and bandwidth between the connector and the peer connector.

[0016] In the specific technical solution, gold fingers are fabricated on the surface of the connection area of ​​the circuit board; a shielding metal layer is fabricated on the first end face, specifically including: fabricating a first metal layer on the surface of the circuit board; and then etching the first metal layer to form the gold fingers and the shielding metal layer. This solution eliminates the need for an additional separate process to fabricate the shielding metal layer, as it is fabricated simultaneously during the gold finger fabrication process. This simplifies the circuit board fabrication process and improves the efficiency of circuit board fabrication.

[0017] Furthermore, a shielding metal layer is prepared on the first end face, specifically including preparing a shielding metal layer on the first end face and a portion of the first surface. This improves the fixing strength of the shielding metal layer on the circuit board and enhances the structural reliability of the circuit board.

[0018] The aforementioned fabrication of gold fingers on the surface of the connection area of ​​the circuit board includes, prior to: fabricating conductive vias on the circuit board, each conductive via containing a metal pillar; and fabricating a shielding metal layer on the first end face. The process further includes: the shielding metal layer covering the surface of the metal pillar and being fixedly connected to it. The high bonding strength between the shielding metal layer and the surface of the metal pillar is beneficial for improving the bonding strength of the shielding metal layer to the circuit board, thereby enhancing the structural reliability of the circuit board.

[0019] The fabrication method involves preparing a shielding metal layer on the first end face, followed by preparing a chamfer between the first surface of the circuit board and the first end face. The chamfer can serve a guiding function, facilitating the insertion of the gold finger connector into the connector.

[0020] Furthermore, in one technical solution, the preparation method, before preparing gold fingers on the surface of the connection area of ​​the circuit board, includes: preparing a chamfer between a first surface and a first end face of the circuit board to form a first chamfered bevel; and preparing a shielding metal layer on the first end face, specifically including: preparing a shielding metal layer on the first end face and the first chamfered bevel. This increases the area of ​​the shielding metal layer, improving the shielding effect; and also enhances the fixing strength of the shielding metal layer on the circuit board.

[0021] Fourthly, this application also provides an electronic component. This electronic component includes a first electronic device and the circuit board provided in the first aspect, wherein the first electronic device is electrically connected to gold fingers. This electronic component has a high signal transmission rate and bandwidth.

[0022] Fifthly, this application also provides an electronic device. The electronic device includes a housing and the circuit board provided in the first aspect, the circuit board being fixed to the housing. This electronic device has a high signal transmission rate and bandwidth, which is beneficial for improving the user's communication efficiency.

[0023] Sixthly, this application also provides a signal transmission method. This signal transmission method utilizes the circuit board provided in the first aspect to transmit signals. The gold fingers include signal terminals and ground terminals. The method specifically includes: transmitting communication signals through the signal terminals; and transmitting ground signals through the ground terminals. This scheme achieves a higher signal transmission rate and a wider signal bandwidth. Attached Figure Description

[0024] Figure 1 is a schematic diagram of an electronic device according to an embodiment of this application;

[0025] Figure 2 is a schematic diagram of a circuit board structure in an embodiment of this application;

[0026] Figure 3 is a schematic diagram of a circuit board structure in an embodiment of this application;

[0027] Figure 4 is a partial cross-sectional view of a circuit board in an embodiment of this application.

[0028] Figure 5 is a schematic diagram of a structure in which the gold finger connector and the connector are in a plugging state in an embodiment of this application;

[0029] Figure 6 is a partial cross-sectional view of a circuit board in an embodiment of this application;

[0030] Figure 7 is a partial cross-sectional view of a circuit board in an embodiment of this application;

[0031] Figure 8 is a partial top view of a circuit board in an embodiment of this application;

[0032] Figure 9 is a partial top view of a circuit board in an embodiment of this application;

[0033] Figure 10 is a schematic diagram of a fabrication process of a circuit board in an embodiment of this application;

[0034] Figure 11 is a schematic diagram of the fabrication process of a circuit board in an embodiment of this application.

[0035] Reference numerals: 100-Electronic component; 100a-First electronic component; 100b-Second electronic component; 200-Housing; 1-Connector; 11-Terminal; 12-Fixing structure; 121-Second end face; 13-Interface; 14-Elastic conductive structure; 2-Gold finger connector; 3-Second electronic device; 4-Housing shell; 5-First electronic device; 6-Circuit board; 611-First end; 612-Main body area; 613-Connection area; 614-First end face; 615-First surface; 616-Second surface; 617-Conductive hole; 6171-First conductive hole; 6172-Second conductive hole; 618-Metal pillar; 6181-First metal pillar; 6182-Second metal pillar; 619-First chamfered bevel; 6110-Second chamfered bevel; 62-Gold finger; 63-Shielding metal layer; 631-Main body layer;632 - Protective layer; 64 - Grounding metal layer; 65 - Solder resist layer; 66 - First metal layer; 67 - Dry film pattern; 7 - Cage. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0037] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise.

[0038] References to “an embodiment” or “a specific embodiment” as used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. The terms “comprising,” “including,” “having,” and variations thereof mean “including, but not limited to,” unless otherwise specifically emphasized.

[0039] The terms "first" and "second" used in this specification are merely for distinguishing different directions or components, and do not limit the direction or component itself. For example, "first electronic component" and "second electronic component" in this application are used only to indicate that they are not the same electronic component, but both are electronic components.

[0040] To facilitate understanding of the connectors, circuit boards and their manufacturing methods, electronic components, electronic devices and signal transmission methods provided in the embodiments of this application, their application scenarios will be introduced first below.

[0041] With the development of communication technology, communication bandwidth is increasing. Optical signals offer advantages such as high transmission speed, low energy consumption, low heat generation, and low loss. Optical modules, including transmitters and receivers, are core components of fiber optic communication systems. During signal transmission, optical modules require conversion between optical and electrical signals; therefore, they need electrical signal transmission interfaces, with gold finger connectors being a common choice. These gold finger connectors connect the optical module to the communication equipment. As optical modules evolve towards higher transmission speeds, the density of metal interconnects and the number of metal layers are constantly increasing. This leads to increasingly severe crosstalk problems, causing signal distortion, data loss, and even system performance degradation, negatively impacting communication quality and reliability.

[0042] The application of optical signals for signal transmission is becoming increasingly widespread. For example, optical module products are used in fields such as passive optical networks (PON), wireless networks, and Internet Protocol (IP).

[0043] Figure 1 is a schematic diagram of an electronic device according to an embodiment of this application. As shown in Figure 1, the electronic device in this embodiment includes two electronic components 100. For ease of description, one of the two electronic components 100 is considered to be the first electronic component 100a, and the other electronic component 100 is considered to be the second electronic component 100b. The first electronic component 100a includes a connector 1, and the second electronic component 100b includes a gold finger connector 2. The first electronic component 100a and the second electronic component 100b are electrically connected through the insertion of the connector 1 and the gold finger connector 2.

[0044] The first electronic component 100a includes a connector 1 and a second electronic device 3. The connector 1 includes terminals 11, and the second electronic device 3 is connected to the terminals 11, thereby enabling the second electronic device 3 to be electrically connected to other electronic components through the connector 1 for signal transmission. Specifically, the second electronic device 3 and the connector 1 can be electrically connected via a circuit board and / or cables. The second electronic device 3 can be a chip used to perform functions such as storage or computation.

[0045] The aforementioned second electronic component 100b can be an electronic module, such as an optical module. The second electronic component 100b includes a housing 4, a first electronic device 5, and a circuit board 6. The circuit board 6 is fixedly mounted on the housing 4, and the first electronic device 5 can be disposed on the circuit board 6. The circuit board 6 includes a gold finger connector 2. Specifically, the circuit board 6 includes multiple gold fingers 62 forming the gold finger connector 2. The aforementioned second electronic device 3 is disposed on the circuit board 6 and is electrically connected to the gold fingers 62. The gold finger connector 2 of the circuit board 6 is inserted into the connector 1 along the insertion direction X, realizing the electrical connection between the gold fingers 62 and the terminal 11, thereby realizing the electrical connection between the first electronic device 5 and the second electronic device 3, and the electrical connection between the first electronic component 100a and the second electronic component 100b. The aforementioned second electronic device 3 can specifically be a chip used to implement functions such as storage or computation.

[0046] Figure 2 is a schematic diagram of another structure of the electronic device in an embodiment of this application. In the embodiment shown in Figure 2, the second electronic component 100b can also be a circuit board. In one embodiment, the circuit board includes a circuit board, a first electronic device disposed on the circuit board, and a gold finger connector 2 located at the edge of the circuit board.

[0047] In a specific embodiment, the electronic device further includes a housing 200, and either the first electronic component 100a or the second electronic component 100b is fixed to the housing 200. In a specific embodiment, the connector 1 is fixed to the housing 200, or the circuit board 6 is fixed to the housing 200. As shown in the embodiment of FIG1, the connector 1 is fixed to the housing 200, and the circuit board 6 with the gold finger connector 2 is connected to the connector 1 via a plug-in connection, thereby fixing it to the housing 200.

[0048] Taking the second electronic component 100b as an optical module as an example, as shown in Figure 1, the first electronic component 100a with connector 1 is fixed to the housing 200. The electronic device may also include a cage 7. When connector 1 and gold finger connector 2 are connected, the second electronic component 100b is fixed inside the cage 7, which helps to improve the fixing strength of the second electronic component 100b, making the second electronic component 100b more reliably fixed to the electronic device, and also helps to improve the connection reliability of connector 1 and gold finger connector 2.

[0049] The electronic devices in this application embodiment can be communication devices (such as routers), computing devices (such as servers), network devices (such as switches), or storage devices (such as storage arrays), especially electronic devices with high-speed signal transmission requirements. This application does not limit the specific type of electronic device; any electronic device that needs to achieve electrical connection using the gold finger connector 2 can adopt the technical solution provided in this application.

[0050] Figure 3 is a schematic diagram of a circuit board structure in an embodiment of this application, and Figure 4 is a partial cross-sectional view of a circuit board in an embodiment of this application. Specifically, Figure 4 shows a cross-sectional view of AA in Figure 4. As shown in Figures 3 and 4, in one embodiment, the circuit board 6 provided by this application includes a shielding metal layer 63 and a plurality of gold fingers 62. The plurality of gold fingers 62 are disposed on the surface of a first end 611 of the circuit board 6 along the insertion direction, such that the first end 611 of the circuit board 6 forms a gold finger connector 2. It can be understood that in this embodiment, the gold finger connector 2 is located at the edge of the circuit board 6, so that it can be inserted with a connector. In addition, the first end 611 refers to the end of the circuit board 6 with the gold finger connector 2. For ease of description, in practical applications, if the circuit board 6 has gold finger connectors 2 at different ends, then each end with a gold finger connector 2 can be called the first end 611. For example, the circuit board 6 can be considered to include a main body area 612 and a connection area 613. The main body area 612 is used for wiring and setting various electronic devices, and the connection area 613 is used to set the gold fingers 62 to form a gold finger connector. The aforementioned connection area 613 is located at the first end 611 of the circuit board 6, and the connection area 613 and the main body area 612 are arranged along the insertion direction of the gold finger connector. The end face of the connection area 613 facing away from the main body area 612 along the insertion direction is the first end face 614.

[0051] For ease of description, the end face 611 of the circuit board 6 along the insertion direction is considered to be the first end face 614. This first end face 614 can also be understood as the end face facing the connector when the gold finger connector is about to be connected. The circuit board 6 includes a first surface 615 and a second surface 616 facing away from each other, and at least one of the first surface 615 and the second surface 616 is provided with gold fingers 62. In one embodiment, the first surface 615 and the second surface 616 can be two parallel surfaces. The first end face 614 is a side end face of the circuit board 6, and the first end face 614 intersects with the first surface 615. In a specific embodiment, the first end face 614 is perpendicular to the first surface 615.

[0052] The aforementioned circuit board 6 includes a ground metal layer 64, which may include linear metal layers and / or sheet metal layers, etc., and this application is not limited in this regard. The ground metal layer 64 can serve as a shielding structure and a return ground. The end face of the ground metal layer 64 is exposed on the first end face 614. The end face of the ground metal layer 64 can also be understood as a cross-section of the ground metal layer 64. The shielding metal layer 63 of the circuit board 6 is fixed to the first end face 614 of the circuit board 6, covering the end face of the ground metal layer 64, and is electrically connected to the ground metal layer 64. In this scheme, the shielding metal layer 63 and the ground metal layer 64 are electrically connected, so that the gold finger connector also forms a shielding structure on the first end face 614 of the circuit board 6, and the shielding metal layer 63 and the ground metal layer 64 together form a shielding structure and a multi-point return ground. Therefore, this scheme can improve the anti-interference performance of the gold finger connector and improve the return current effect of the gold finger connector. This, in turn, improves the signal transmission rate and bandwidth between the connector and the peer connector.

[0053] As shown in Figure 4, in one embodiment, the circuit board 6 includes multiple grounded metal layers 64. A shielding metal layer 63 is connected to the multiple grounded metal layers 64, thereby forming a common ground shielding cage with the shielding metal layer 63 and the multiple grounded metal layers 64 to improve the shielding effect of the shielding metal layer 63, improve the anti-crosstalk effect of the gold finger connector, and increase the signal transmission rate of the connector.

[0054] Figure 5 is a schematic diagram of a gold finger connector and a connector in an insertion state in an embodiment of this application. As shown in Figure 5, in this embodiment of the application, a connector 1 is also provided. The connector 1 includes a fixing structure 12 and a plurality of terminals 11, wherein the plurality of terminals 11 are fixed to the fixing structure 12. It can be understood that the fixing structure 12 is used to fix the terminals 11.

[0055] In one embodiment, the plurality of terminals 11 include signal terminals and ground terminals, wherein the signal terminals are used to transmit signals, and the ground terminals are used for grounding. The signals transmitted by the signal terminals can be high-speed signals, such as high-speed differential signals. The ground terminals serve as the return ground, reference ground, and shielding structure of the signal terminals.

[0056] The connector 1 includes a insertion interface 13 for mating with a gold finger connector, which is inserted into the connector 1 through the insertion interface 13 along the mating direction X. In one embodiment, the insertion interface 13 is an opening formed by a fixed shell. In another embodiment, the insertion interface 13 is the outermost edge of the connector 1 along the mating direction X. The fixing structure 12 has a second end face 121 on the side facing the insertion interface 13, and at least a portion of the terminal 11 is located between the second end face 121 and the insertion interface 13. An elastic conductive structure 14 is fixed to the second end face 121, which has the ability to elastically deform along the mating direction X and is conductive. When the connector 1 and the gold finger connector are in the mated state, the elastic conductive structure 14 contacts the shielding metal layer 63 of the first end face 614 of the gold finger connector. The elastic conductive structure 14 is in contact with the shielding metal layer 63, which is connected to the grounding metal layer 64 of the circuit board 6. This allows the elastic conductive structure 14 to connect with the grounding metal layer 64 of the circuit board 6, jointly forming a shielding structure and a multi-point return ground. Specifically, a shielding cage can be formed, improving the anti-interference performance of connector 1 and the gold finger connector in the connected state, and also improving the return current effect of the connector. Therefore, this application can improve the signal transmission rate and bandwidth of connector 1 and the gold finger connector.

[0057] By providing an elastic conductive structure 14 and a shielding metal layer 63 between the first end face 614 of the gold finger connector and the second end face 121 of the fixing structure 12 of the connector 1, crosstalk between the terminals 11 of the connector is less likely to occur, thereby meeting the needs of electronic devices to improve signal transmission rate and increasing the bandwidth of the connector's signal transmission.

[0058] In specific embodiments, the type of the aforementioned elastic conductive structure 14 can be selected in various ways. In one embodiment, the elastic conductive structure 14 itself can be made of a material that is both elastic and conductive. For example, the elastic conductive structure 14 can be at least one of conductive foam or conductive plastic, as shown in Figure 4. Alternatively, the elastic conductive structure 14 can also be made elastic and conductive through a reasonable structural arrangement. For example, the elastic conductive structure 14 can include a metal spring arm.

[0059] Figure 6 is a partial cross-sectional view of a circuit board in an embodiment of this application. As shown in Figure 6, in one embodiment, the shielding metal layer 63 further covers part of the first surface 615, thereby improving the fixing strength of the shielding metal layer 63 to the circuit board 6 and improving the structural reliability of the circuit board 6.

[0060] Furthermore, the shielding metal layer 63 can also cover part of the second surface 616, that is, the shielding metal layer 63 covers part of the first surface 615 and the second surface 616, which can improve the fixing strength of the shielding metal layer 63 to the circuit board 6 from opposite sides and improve the structural reliability of the circuit board 6.

[0061] In a specific embodiment, the shielding metal layer 63 extends from the first surface 615 to the first end face 614 and then to the second surface 616. That is, the shielding metal layer 63 has a continuous structure along the first surface 615, to the first end face 614 and then to the second surface 616, so as to improve the fixing strength of the shielding metal layer 63 to the circuit board 6.

[0062] Since the shielding metal layer 63 is located at the end of the gold finger connector, the repeated insertion and removal processes place high demands on the fixing strength of the shielding metal layer 63. Figure 7 is a partial cross-sectional view of a circuit board in an embodiment of this application. As shown in Figure 7, in one embodiment, the circuit board 6 includes a conductive hole 617, which contains a metal pillar 618. The shielding metal layer 63 covers the surface of the metal pillar 618 and is fixedly connected to the metal pillar 618. Since both the shielding metal layer 63 and the metal pillar 618 are made of metal, the fixing strength between the shielding metal layer 63 and the surface of the metal pillar 618 is high, which helps to improve the fixing strength of the shielding metal layer 63 to the circuit board 6 and improve the structural reliability of the circuit board 6.

[0063] The cross-sectional area of ​​the metal pillar 618 within the aforementioned conductive hole can be designed according to the actual product. For example, a larger cross-sectional area of ​​the metal pillar 618 will improve the fixing effect of the shielding metal layer 63, but it will occupy more layout space on the circuit board. Therefore, the cross-sectional area of ​​the metal pillar 618 should be designed and selected in conjunction with the circuit board layout. Here, the cross-section of the metal pillar 618 refers to the section perpendicular to the extension direction of the metal pillar 618.

[0064] In a specific embodiment, the axis of the conductive hole 617 is perpendicular to the first surface 615 of the circuit board 6. In some embodiments, the circuit board 6 may include multiple conductive holes 617. A conductive hole 617 includes a first conductive hole 6171, located on the side of the circuit board 6 near the first surface 615, and a metal pillar 618 within the first conductive hole 6171 is a first metal pillar 6181, the surface of which is exposed on the first surface 615, thereby the shielding metal layer 63 covers the surface of the first metal pillar 6181 exposed on the first surface 615. In one embodiment, a conductive hole 617 includes a second conductive hole 6172, located on the side of the circuit board 6 near the second surface 616, and a metal pillar 618 within the second conductive hole 6172 is a second metal pillar 6182, the surface of which is exposed on the second surface 616, thereby the shielding metal layer 63 covers the surface of the second metal pillar 6182 exposed on the second surface 616. In this scheme, the first surface 615 or the second surface 616 of the circuit board 6 has a conductive hole 617, which can improve the fixing strength at the end of the shielding metal layer 63. The force between the metal post 618 in the conductive hole 617 and the shielding metal layer 63 is a tangential force relative to the metal post 618, which can improve the fixing effect on the shielding metal layer 63.

[0065] In one embodiment, the conductive via 617 includes a first conductive via 6171 and a second conductive via 6172. The first conductive via 6171 is located on the side of the circuit board 6 near the first surface 615, and the metal pillar 618 within the first conductive via 6171 is a first metal pillar 6181, the surface of which is exposed on the first surface 615. The second conductive via 6172 is located on the side of the circuit board 6 near the second surface 616, and the metal pillar 618 within the second conductive via 6172 is a second metal pillar 6182, the surface of which is exposed on the second surface 616. A shielding metal layer 63 covers and connects the surfaces of the first metal pillar 6181 and the second metal pillar 6182. This design can enhance the fixing strength of the shielding metal layer 63 from both sides, thereby improving product reliability.

[0066] Referring to Figure 4, in one embodiment, a first chamfered bevel 619 is formed between the first surface 615 and the first end face 614, and a second chamfered bevel 6110 is formed between the second surface 616 and the first end face 614. This chamfer can serve a guiding function, facilitating the insertion of the gold finger connector into the connector. The aforementioned shielding metal layer 63 is located in the area between the first chamfered bevel 619 and the second chamfered bevel 6110. This design simplifies the fabrication process of the circuit board 6.

[0067] Referring to Figures 6 and 7, in one embodiment of this application, a first chamfered bevel 619 is formed between the first surface 615 and the first end face 614, and the shielding metal layer 63 further covers the first chamfered bevel 619; or, a second chamfered bevel 6110 is formed between the second surface 616 and the first end face 614, and the shielding metal layer 63 further covers the second chamfered bevel 6110. Alternatively, the first chamfered bevel 619 is formed between the first surface 615 and the first end face 614, and a second chamfered bevel 6110 is formed between the second surface 616 and the first end face 614, and the shielding metal layer 63 further covers both the first chamfered bevel 619 and the second chamfered bevel 6110. This solution can improve the fixing strength of the shielding metal layer 63 to the circuit board 6.

[0068] In this embodiment, when the shielding metal layer 63 covers the first surface 615, the width W of the shielding metal layer 63 in the area of ​​the first surface 615 along the insertion direction is greater than or equal to 1 mm, thereby improving the fixing strength between the shielding metal layer 63 and the circuit board 6. Similarly, when the shielding metal layer 63 covers the second surface 616, the width of the shielding metal layer 63 in the area of ​​the second surface 616 along the insertion direction is greater than or equal to 1 mm, thereby improving the fixing strength between the shielding metal layer 63 and the circuit board 6.

[0069] In a specific embodiment, the shielding metal layer 63 does not include the area covering the first chamfered bevel 619 in the area of ​​the first surface 615, and the shielding metal layer 63 does not include the area covering the second chamfered bevel 6110 in the area of ​​the second surface 616.

[0070] Referring to Figure 7, in one embodiment, the shielding metal layer 63 includes a body layer 631 and a protective layer 632, with the protective layer 632 located on the side of the body layer 631 facing away from the circuit board 6. In an optional embodiment, the body layer 631 is made of a material with good conductivity and low cost, such as copper, while the protective layer 632 is made of a material with good stability, such as a nickel-gold layer or a nickel-palladium-gold layer. Thus, the protective layer 632 can protect the body layer 631, reducing the risk of oxidation of the shielding metal layer 63 and lowering the probability of wear.

[0071] Figure 8 is a partial top view of a circuit board in an embodiment of this application. As shown in Figure 8, in one embodiment, multiple gold fingers 62 of the circuit board 6 are arranged along the first direction Z in the connection area 613 of the circuit board 6, and a shielding metal layer 63 covers a portion of the first end face 614 along the first direction Z. In a specific embodiment, the shielding metal layer 63 may include multiple segments arranged at intervals along the first direction Z. In a specific embodiment, the length of the shielding metal layer 63 along the first direction Z is less than the length of the first end face 614 along the first direction Z.

[0072] Figure 9 is a partial top view of a circuit board structure according to an embodiment of this application. As shown in Figures 3 and 9, in some embodiments, the shielding metal layer 63 continuously covers the area of ​​the first end face 614 extending along the first direction Z. In a specific embodiment, the length of the shielding metal layer 63 along the first direction Z is the same as the length of the first end face 614 along the first direction Z.

[0073] Based on the same inventive concept, this application also provides a method for manufacturing a circuit board, used to manufacture the circuit board 6 in the above embodiments. The manufacturing method specifically includes:

[0074] Step S101: Provide a circuit board 6. The circuit board 6 includes a ground metal layer 64. The circuit board 6 includes a main body region 612 and a connection region 613. The main body region 612 and the connection region 613 are arranged along the insertion direction. The end face of the connection region 613 facing away from the main body region 612 along the insertion direction is a first end face 614. The end face of the ground metal layer 64 is exposed on the first end face 614. The circuit board 6 includes a first surface 615 and a second surface 616 facing away from each other.

[0075] In a specific embodiment, the circuit board 6 may include a multilayer structure, which includes a dielectric layer and a metal layer. The end face of the first end 611 of the circuit board 6 along the insertion direction is a first end face 614.

[0076] Step S102: Prepare gold fingers 62 on the surface of the connection area 613 of the circuit board 6;

[0077] The aforementioned gold fingers 62 are disposed on the surface of the first end 611 of the circuit board 6 along the insertion direction, that is, the gold fingers 62 are formed on the surface of the connection area 613 of the circuit board 6, so that the first end 611 of the circuit board 6 forms a gold finger connector. The gold finger connector is located at the edge of the circuit board 6, thereby enabling it to be inserted with a connector. Specifically, a metal layer can be formed on the surface of the circuit board 6, for example, by using chemical methods and / or electroplating; then, a portion of the metal is removed by etching or other methods to form the aforementioned gold fingers 62.

[0078] Step S103: Prepare a shielding metal layer 63 on the first end face 614. The shielding metal layer 63 covers the end face of the grounding metal layer 64 and is electrically connected to the grounding metal layer 64.

[0079] Specifically, the metal layer can be prepared using chemical methods and / or electroplating; subsequently, etching or other methods are used to remove some of the metal to form the aforementioned shielding metal layer 63. The shielding metal layer 63 is electrically connected to the grounding metal layer 64, so that the gold finger connector also forms a shielding structure on the first end face 614 of the circuit board 6. Furthermore, the shielding metal layer 63 and the grounding metal layer 64 together form a shielding structure and a multi-point return ground. Therefore, this solution can improve the anti-interference performance of the gold finger connector and enhance its return current effect. This, in turn, improves the signal transmission rate and bandwidth between the connector and the peer connector.

[0080] In one embodiment, the gold finger 62 and the shielding metal layer 63 can be fabricated simultaneously, that is, steps S102 and S103 are performed simultaneously. Specifically, this includes:

[0081] Step S104: Prepare a first metal layer 66 on the surface of the circuit board 6;

[0082] Specifically, a first metal layer 66 can be prepared on the surface of the circuit board 6 using chemical methods and / or electroplating.

[0083] Step S105: Etch the first metal layer 66 to form the gold finger 62 and the shielding metal layer 63. Specifically, this also disconnects the shielding metal layer 63 from the gold finger 62.

[0084] This solution eliminates the need for a separate process to fabricate the shielding metal layer 63. The shielding metal layer 63 is fabricated simultaneously during the fabrication of the gold fingers 62, which simplifies the fabrication process of the circuit board 6 and improves the fabrication efficiency of the circuit board 6.

[0085] In one embodiment, the shielding metal layer 63 prepared in step S103 covers a portion of the first end face 614 along a first direction. The first direction refers to the arrangement direction of the plurality of gold fingers 62 of the circuit board 6 in the connection area 613 of the circuit board 6. In a specific embodiment, the shielding metal layer 63 may include multiple segments arranged at intervals along the first direction. In a specific embodiment, the length of the shielding metal layer 63 along the first direction is less than the length of the first end face 614 along the first direction.

[0086] In one embodiment, step S103 further includes: preparing a shielding metal layer 63 on the first end face 614 and a portion of the first surface 615. This improves the fixing strength of the shielding metal layer 63 on the circuit board 6 and enhances the structural reliability of the circuit board 6.

[0087] Furthermore, the shielding metal layer 63 can also cover part of the second surface 616, that is, the shielding metal layer 63 covers part of the first surface 615 and the second surface 616, thereby improving the fixing strength of the shielding metal layer 63 to the circuit board 6 and improving the structural reliability of the circuit board 6.

[0088] In one embodiment, the procedure prior to step S102 includes:

[0089] A conductive hole 617 is fabricated in the circuit board 6, and a metal pillar 618 is included in the conductive hole 617.

[0090] Then step S103 also includes:

[0091] The shielding metal layer 63 covers the surface of the metal post 618 and is fixedly connected to the metal post 618.

[0092] Since both the shielding metal layer 63 and the metal pillar 618 are made of metal, the surface fixation strength of the shielding metal layer 63 and the metal pillar 618 is relatively high, which is beneficial to improving the fixation strength of the shielding metal layer 63 to the circuit board 6 and improving the structural reliability of the circuit board 6.

[0093] In a specific embodiment, the axis of the conductive hole 617 is perpendicular to the first surface 615 of the circuit board 6 and is embedded in the circuit board 6. In some embodiments, the circuit board 6 may include multiple conductive holes 617. The conductive hole 617 includes a first conductive hole 6171, which is located on the side of the circuit board 6 near the first surface 615, and the metal post 618 in the first conductive hole 6171 is a first metal post 6181, the surface of which is exposed on the first surface 615, thereby the shielding metal layer 63 covers the surface of the first metal post 6181 exposed on the first surface 615. In one embodiment, the conductive hole 617 includes a second conductive hole 6172, which is located on the side of the circuit board 6 near the second surface 616. The metal post 618 within the second conductive hole 6172 is a second metal post 6182, the surface of which is exposed on the second surface 616. Thus, the shielding metal layer 63 covers the exposed surface of the second metal post 6182 on the second surface 616. In this solution, the conductive hole 617 on either the first surface 615 or the second surface 616 of the circuit board 6 enhances the fixing strength at the end of the shielding metal layer 63. Furthermore, the force between the metal post 618 within the conductive hole 617 and the shielding metal layer 63 is a tangential force relative to the metal post 618, which improves the fixing effect on the shielding metal layer 63.

[0094] In one embodiment, the step S103 described above includes:

[0095] Step S106: A chamfer is prepared between the first surface 615 and the first end face 614 of the circuit board 6.

[0096] This step results in the circuit board 6 shown in Figure 4. The end of the gold finger connector on the circuit board 6 has a chamfer, which serves as a guide to facilitate the insertion of the gold finger connector into the connector. In this design, the chamfer is prepared after the shielding metal layer 63 is prepared, so the shielding metal layer 63 does not cover the beveled surface formed by the chamfer.

[0097] In one embodiment, the procedure prior to step S102 includes:

[0098] A chamfer is formed between the first surface 615 and the first end face 614 of the circuit board 6 to form a first chamfered bevel 619.

[0099] Step S103 specifically includes:

[0100] A shielding metal layer 63 is prepared on the first end face 614 and the first chamfered bevel 619.

[0101] In step S103, the shielding metal layer 63 can cover the first chamfered slope 619, which increases the area of ​​the shielding metal layer 63 and improves the shielding effect; on the other hand, it can improve the fixing strength of the shielding metal layer 63 on the circuit board 6.

[0102] In this embodiment, when the shielding metal layer 63 covers the first surface 615, the width of the shielding metal layer 63 in the area of ​​the first surface 615 along the insertion direction is greater than or equal to 1 mm, thereby improving the fixing strength between the shielding metal layer 63 and the circuit board 6. Similarly, when the shielding metal layer 63 covers the second surface 616, the width of the shielding metal layer 63 in the area of ​​the second surface 616 along the insertion direction is greater than or equal to 1 mm, thereby improving the fixing strength between the shielding metal layer 63 and the circuit board 6.

[0103] In a specific embodiment, the shielding metal layer 63 does not include the area covering the first chamfered bevel 619 in the area of ​​the first surface 615, and the shielding metal layer 63 does not include the area covering the second chamfered bevel 6110 in the area of ​​the second surface 616.

[0104] In this application, various specific methods for fabricating circuit board 6 can be formed by combining the embodiments listed above. In the embodiments of this application, multiple circuit boards 6 can be fabricated at once. Specific embodiments of two circuit board 6 fabrication methods are listed below.

[0105] Figure 10 is a schematic diagram of a fabrication process of a circuit board in an embodiment of this application. As shown in Figure 10, in one embodiment, a method for fabricating a circuit board 6 specifically includes the following steps:

[0106] Step S201: Provide circuit board 6.

[0107] The circuit board 6 includes a multilayer structure, comprising dielectric layers and metal layers. The metal layers include a ground metal layer 64. The circuit board 6 includes a first surface 615 and a second surface 616 that are opposite to each other.

[0108] Step S202: Cut the connection area 613 of the circuit board 6, and form a first end face 614 on the end face of the connection area 613 away from the main body area along the insertion direction. The end face of the ground metal layer 64 is exposed on the first end face 614.

[0109] Specifically, the first end face 614 is located at the top of the gold finger connector. The first end 611 of the circuit board 6 can be cut by drilling or slotting. Specifically, the first end 611 of the connection area 613 of the circuit board 6 can be cut by laser cutting or mechanical cutting.

[0110] Step S203: Prepare a first metal layer 66 on the surface of the circuit board 6;

[0111] The first metal layer 66 covers the surface of the circuit board 6 and the first end face 614. Specifically, the first metal layer 66 can be prepared by a combination of chemical and electroplating methods. Furthermore, the material of the first metal layer 66 can be copper.

[0112] Step S204: Prepare a dry film pattern 67 on the surface of the first metal layer 66;

[0113] The dry film pattern 67 covers the metal pattern area that the first metal layer 66 needs to retain, and the metal pattern area includes at least the gold fingers 62 and the shielding metal layer 63.

[0114] Step S205: Etch the first metal layer 66 and remove the dry film pattern 67 to form the gold finger 62 and the shielding metal layer 63.

[0115] Step S206: Prepare solder mask layer 65 to protect the first metal layer 66 located on the surface of circuit board 6;

[0116] Step S207: A chamfer is prepared between the surface of the circuit board 6 and the first end face 614, and different circuit boards are divided.

[0117] Figure 11 is a schematic diagram of a fabrication process of a circuit board according to an embodiment of this application. As shown in Figure 11, a method for fabricating a circuit board specifically includes the following steps:

[0118] Step S301: Provide circuit board 6.

[0119] The circuit board 6 includes a multilayer structure, comprising dielectric layers and metal layers. The metal layers include a ground metal layer 64. The circuit board 6 includes a first surface 615 and a second surface 616 that are opposite to each other.

[0120] Step S302: Cut the connection area 613 of the circuit board 6, form a first end face 614 on the end face of the connection area 613 away from the main body area along the insertion direction, and expose the end face of the ground metal layer 64 on the first end face 614; make a chamfer between the surface of the circuit board 6 and the first end face 614 to form a first chamfered bevel 619.

[0121] Specifically, the first end face 614 is located at the top of the gold finger connector. The first end 611 of the circuit board 6 can be cut by drilling or slotting. Specifically, the first end 611 of the circuit board 6 can be cut by laser cutting or mechanical cutting, and chamfering is performed.

[0122] Step S303: Prepare a first metal layer 66 on the surface of the circuit board 6;

[0123] The first metal layer 66 covers the surface of the circuit board 6, the first end face 614, and the first chamfered surface 619. Specifically, the first metal layer 66 can be prepared using a combination of chemical and electroplating methods. Furthermore, the material of the first metal layer 66 can be copper.

[0124] Step S304: Prepare a dry film pattern 67 on the surface of the first metal layer 66;

[0125] The dry film pattern 67 covers the metal pattern area that the first metal layer 66 needs to retain, and the metal pattern area includes at least the gold fingers 62 and the shielding metal layer 63.

[0126] Step S305: Etch the first metal layer 66 and remove the dry film pattern 67 to form the body layer 631 of the conductive hole 617, gold finger 62 and shielding metal layer 63;

[0127] Step S306: Prepare solder resist layer 65 and prepare protective layer 632.

[0128] The protective layer 632 is made of a stable material such as a nickel-gold layer or a nickel-palladium-gold layer, and it covers the surface of the body layer 631 of the shielding metal layer 63. Therefore, the protective layer 632 protects the body layer 631, reducing the risk of oxidation of the shielding metal layer 63 and lowering the probability of wear. This improves the reliability of the shielding metal layer 63 and enhances its effectiveness as a shielding structure and return ground in the connector.

[0129] Step S307: Divide the circuit boards into different sections.

[0130] Based on the same inventive concept, this application also provides a signal transmission method. Specifically, this method utilizes the gold finger connector provided in this application to transmit signals. The gold fingers in the gold finger connector include signal terminals and ground terminals. The signal transmission method specifically includes: transmitting communication signals through the signal terminals and transmitting low-level signals through the ground terminals. The shielding structure in the embodiments of this application is relatively abundant, resulting in less crosstalk between signals and superior impedance. Therefore, the communication signal transmitted in the signal transmission method of this application has a high rate and wide bandwidth, enabling high-speed communication and improving user communication efficiency.

[0131] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit board for mating with a connector, characterized in that, It includes a main body area and a connecting area, which are arranged along the insertion direction. The end face of the connecting area away from the main body area along the insertion direction is the first end face. The circuit board includes a shielding metal layer and a plurality of gold fingers, wherein the plurality of gold fingers are arranged in the connection area, the shielding metal layer is fixed to the first end face, the shielding metal layer is electrically connected to the grounding metal layer of the circuit board, and the shielding metal layer covers the end face of the grounding metal layer.

2. The circuit board as described in claim 1, characterized in that, The circuit board includes a first surface and a second surface that are opposite to each other. The first surface is provided with the gold fingers, and the shielding metal layer also covers a portion of the first surface.

3. The circuit board as described in claim 2, characterized in that, The shielding metal layer also covers a portion of the second surface.

4. The circuit board as described in claim 2 or 3, characterized in that, The circuit board includes conductive holes, each containing a metal pillar. A shielding metal layer covers the surface of the metal pillar and is fixedly connected to it.

5. The circuit board as described in any one of claims 2 to 4, characterized in that, The width of the shielding metal layer in the region of the first surface along the insertion direction is greater than or equal to 1 mm.

6. The circuit board according to any one of claims 1 to 5, characterized in that, The circuit board includes a first surface and a second surface that are opposite to each other, and the gold fingers are disposed on the first surface. The first surface and the first end face have a first chamfered bevel, and the shielding metal layer further covers the first chamfered bevel; and / or, The second surface has a second chamfered bevel between it and the first end face, and the shielding metal layer also covers the second chamfered bevel.

7. The circuit board according to any one of claims 1 to 6, characterized in that, Along the arrangement direction of the plurality of gold fingers, the shielding metal layer covers a portion of the first end face.

8. A connector, characterized in that, For connection to a circuit board as described in any one of claims 1 to 7, the connector includes a fixing structure and a plurality of terminals, the plurality of terminals being fixed to the fixing structure; The connector includes a plug interface, and the fixing structure has a second end face on the side facing the plug interface. At least a portion of the terminal structure is located between the second end face and the plug interface. An elastic conductive structure is fixed to the second end face. The elastic conductive structure has the ability to elastically deform along the plugging direction and is used to contact the shielding metal layer of the circuit board.

9. A method for manufacturing a circuit board, characterized in that, The method for preparing the circuit board as described in any one of claims 1 to 7 comprises: Gold fingers are prepared on the surface of the connection area of ​​the circuit board; A shielding metal layer is prepared on the first end face, the shielding metal layer is electrically connected to the grounding metal layer of the circuit board, and the shielding metal layer covers the end face of the grounding metal layer.

10. The preparation method according to claim 9, characterized in that, The process of fabricating gold fingers on the surface of the connection area of ​​the circuit board and fabricating a shielding metal layer on the first end face specifically includes: A first metal layer is prepared on the surface of the circuit board; The first metal layer is etched to form the gold finger and the shielding metal layer.

11. The preparation method according to claim 9 or 10, characterized in that, The step of preparing a shielding metal layer on the first end face specifically includes: A shielding metal layer is prepared on the first end face and part of the first surface.

12. The preparation method according to any one of claims 9 to 11, characterized in that, The process of fabricating gold fingers on the surface of the connection area of ​​the circuit board includes, prior to: A conductive hole is fabricated on a circuit board, wherein the conductive hole includes a metal pillar; The step of preparing a shielding metal layer on the first end face further includes: The shielding metal layer covers the surface of the metal column and is fixedly connected to the metal column.

13. The preparation method according to any one of claims 9 to 12, characterized in that, The step of preparing a shielding metal layer on the first end face includes: A chamfer is formed between the first surface and the first end face of the circuit board.

14. The preparation method according to any one of claims 9 to 12, characterized in that, The process of fabricating gold fingers on the surface of the connection area of ​​the circuit board includes, prior to: A chamfer is formed between the first surface and the first end face of the circuit board to form a first chamfered bevel. The step of preparing a shielding metal layer on the first end face specifically includes: The shielding metal layer is prepared on the first end face and the first chamfered bevel.

15. An electronic component, characterized in that, It includes a first electronic device and a circuit board as described in any one of claims 1 to 7, wherein the first electronic device is electrically connected to the gold finger.

16. An electronic device, characterized in that, It includes a housing and a circuit board as described in any one of claims 1 to 7, wherein the circuit board is fixed to the housing.

17. A signal transmission method, characterized in that, The circuit board as described in any one of claims 1 to 7 is used to transmit signals, wherein the gold finger includes a signal terminal and a ground terminal, and the method specifically includes: Communication signals are transmitted through the signal terminals; Ground signals are transmitted through the ground terminal.

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