PCA component, electric motor, positioning system, and lithographic apparatus

Abstract

Disclosed is a PCA component for a coil assembly (CAS), comprising a PCA component body (COB) and a covering plate (COP). The PCA component body has one or more conductive traces (TRA) and one or more electronic components, wherein the one or more conductive traces (TRA) and one or more electronic components are embedded in the PCA component body. The covering plate (COP) is mounted on the PCA component body. The PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein. The PCA component can be used as a coil carrier (COC), or part thereof, to accommodate one or more coils of the coil assembly. The coil carrier (COC) may be part of an electric motor.

Description

PCA COMPONENT. ELECTRIC MOTOR. POSITIONING SYSTEM. AND LITHOGRAPHICAPPARATUSCROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims priority to U.S. Application No. 63 / 713,239 which was filed on 29 October 2024, and which is incorporated herein in its entirety by reference.TECHNICAL FIELD

[0002] This description relates generally to a PCA component for a coil assembly. The description also relates to an electric motor, a positioning system and a lithographic apparatus.BACKGROUND

[0003] Linear electric motors are known. Also known multi-phase linear electric motors have for example been used as long stroke motors in lithography apparatuses, metrology systems, and other devices, for example. A lithography (e.g., projection) apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In such a case, a patterning device (e.g., a mask) may contain or provide a pattern corresponding to an individual layer of the IC (“design layout”), and this pattern can be transferred onto a target portion (e.g. comprising one or more dies) on a substrate (e.g., silicon wafer) that has been coated with a layer of radiation-sensitive material (“resist”), by methods such as irradiating the target portion through the pattern on the patterning device. In general, a single substrate contains a plurality of adjacent target portions to which the pattern is transferred successively by the lithographic projection apparatus, one target portion at a time. In one type of lithographic projection apparatus, the pattern on the entire patterning device is transferred onto one target portion in one operation. Such an apparatus is commonly referred to as a stepper. In an alternative apparatus, commonly referred to as a step-and-scan apparatus, a projection beam scans over the patterning device in a given reference direction (the “scanning” direction) while synchronously moving the substrate parallel or anti-parallel to this reference direction. Different portions of the pattern on the patterning device are transferred to one target portion progressively. Various movements of the lithography apparatus may be facilitated by one or more linear electric motors.

[0004] Linear electric motors may comprise a coil carrier comprising a recess to receive one or more coils therein. The coil carrier provides structure to the coil assembly. A linear electric motor may further comprise a temperature sensor to measure the temperature at or close to the one or more coils of the coil assembly.

[0005] In known embodiments of temperature sensors used in linear electric motors, placement of the temperature sensors at a suitable location within the electric motor configuration may be challenging as these temperature sensors require substantial volume for sensors and cabling. Also, themanual routing of sensor cables may be time-consuming and introduce potential for human error.Further, due to the limited available space, the complex routing of the sensor and / or sensor cables in the coil assembly may limit the mechanical stability of the sensor assemblies.SUMMARY

[0006] A PCA component for a coil assembly is described.

[0007] According to an embodiment, a PCA component for a coil assembly is disclosed. The PCA component comprises a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.

[0008] In some embodiments, the PCA component body and the covering plate comprise at least one recess having an inner contour surrounding at least one of the one or more coils.

[0009] In some embodiments, the one or more conductive traces and one or more electronic components are embedded in at least one side of the PCA component body and the covering plate mainly covers the complete at least one side of the PCA component body.

[0010] In some embodiments, the covering plate comprises one or more openings to expose at least one of the one or more electronic components arranged on the PCA component body.

[0011] In some embodiments, the one or more electronic components comprise one or more sensors.

[0012] In some embodiments, the one or more electronic components comprise at least one temperature sensor.

[0013] In some embodiments, the coil assembly is a motor coil assembly.

[0014] In some embodiments, the PCA component body is made of a fiberglass material and / or wherein the covering plate is made of a fiberglass material.

[0015] In some embodiments, the PCA component body has one or more locations for cable connections, wherein the one or more locations for cable connections are not covered by the covering plate.

[0016] According to an embodiment, an electric motor is disclosed. The electric motor comprises a coil assembly having one or more coils, and a coil carrier comprising one or more recesses in which the one or more coils at least partially are placed, wherein the coil carrier comprises a PCA component. The PCA component comprises a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.

[0017] In some embodiments, the one or more electronic components of the PCA component comprise one or more sensors.

[0018] In some embodiments, the one or more electronic components of the PCA component comprise at least one temperature sensor.

[0019] In some embodiments, the coil carrier comprises at least one cooling plate.

[0020] In some embodiments, the coil carrier comprises multiple cooling plates, wherein the multiple cooling plates and the PCA component are provided in a stacked configuration.

[0021] In some embodiments, the coil carrier comprises two or more PCA components. Each of the two or more PCA components comprises a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.

[0022] According to an embodiment, a positioning system is disclosed. The positioning system is arranged to position a movable object. The positioning system comprises one or more electric motors. The electric motor comprises a coil assembly having one or more coils, and a coil carrier comprising one or more recesses in which the one or more coils at least partially are placed, wherein the coil carrier comprises a PCA component. The PCA component comprises a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.

[0023] According to an embodiment, a lithographic apparatus is disclosed. The lithographic apparatus comprises one or more electric motors. The electric motor comprises a coil assembly having one or more coils, and a coil carrier comprising one or more recesses in which the one or more coils at least partially are placed, wherein the coil carrier comprises a PCA component. The PCA component comprises a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate one or more embodiments and, together with the description, explain these embodiments. Embodiments of the invention will now be described, by way of example only, withreference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:

[0025] FIG. 1 schematically depicts a lithography apparatus, which may include a PCA component, in particular an electric motor comprising such PCA component, according to an embodiment.

[0026] FIG. 2 shows schematically a coil assembly of an electric motor according to an embodiment of the invention.

[0027] FIG. 3 shows schematically the PCA component body of the coil assembly of Fig. 2.

[0028] FIG. 4 shows schematically the cover plate of the coil assembly of Fig. 2.

[0029] FIG. 5 shows schematically a side view (A -A) of the coil carrier of Fig. 2.

[0030] FIG. 6 shows schematically a first cross-section (B-B) of the coil assembly and the coil carrier of Fig. 2.

[0031] FIG. 7 shows schematically a second cross-section (C-C) of the coil carrier of Fig. 2.

[0032] FIG. 8 shows schematically a cross-section of an alternative embodiment of a coil assembly and coil carrier of an electric motor.DETAILED DESCRIPTION

[0033] Linear electric motors, such as Lorentz motors, are used in a lithographic apparatus to provide a force, for example to provide a driving force to move a substrate support or a patterning device support in a desired driving direction.

[0034] Such linear electric motor may comprise a coil carrier comprising a recess to receive one or more coils therein. The coil carrier provides structure to the coil assembly. The coil carrier is not necessarily intended to support the one or more coils. A linear electric motor further may comprise a temperature sensor to measure the temperature at or close to the one or more coils. This temperature sensor may be bead-style sensors wrapped in polyamide tape and arranged at or near the one or more coils. A cable may be connected to the bead style sensor to guide the sensor signal to a processing device. In another embodiment, the temperature sensor may be a PCA component which is partially flexible and partially rigid and arranged in a gap in the coil carrier.

[0035] Both of these types of temperature sensors require substantial volume within the electric motor configuration for sensors and cabling. The available space in coil assemblies is limited making the placement of the temperature sensor at a suitable location challenging. Also, the routing of sensor cables, especially for bead-style sensors, may be time-consuming. The placement of these sensors is typically a manual process, which introduces potential for human error. Further, due to the limited available space, the complex routing of the sensor and / or sensor cables in the coil assembly may limit the mechanical stability of the sensor assemblies. For example, the PCA component which is partially flexible and partially rigid may be relative long and fragile with the risk being damaged during shipping and assembly.

[0036] A new PCA component for a coil assembly is described, comprising a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.

[0037] The new PCA component may at least partially form the coil carrier. In other words, temperature sensors, or other electronic components, may be integrated, as a PCA component, into the coil carrier of an electric motor.

[0038] As the temperature sensors and associated conductive connections are incorporated into a single component, limited space is required and the complexity of the routing of cabling may be substantially reduced. Also, no manual steps are required for routing of cables. Placement of temperature sensors, or other electronic components is carried out simultaneously with placement of the coil carrier. Cable connections to the PCA component for cabling that routes signals out of the coil assembly can be placed in an easy-to-access location. Further, the conductive traces on the PCA component as integral part of the coil carrier provide a substantially increased mechanical stability in comparison to separate cables guided through the coil carrier. This improves robustness of the PCA component with respect to known embodiments of temperature sensors in a linear electric motor.

[0039] The following introductory paragraphs describe general lithography system functionality - as one of many possible use case examples for the linear actuator(s) described herein. Note that although specific reference may be made in this text to the manufacture of integrated circuits (ICs), it should be understood that the described cooling system has many other possible applications. For example, it may be employed in the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, liquid-crystal display panels, thin-film magnetic heads, etc.

[0040] As an introduction, prior to transferring a pattern from a patterning device such as a mask to a substrate, the substrate may undergo various procedures, such as priming, resist coating and a soft bake. After exposure, the substrate may be subjected to other procedures (“post-exposure procedures”), such as a post-exposure bake (PEB), development, a hard bake and measurement and / or other inspection of the transferred pattern. This array of procedures is used as a basis to make an individual layer of a device, e.g., an IC. The substrate may then undergo various processes such as etching, ion-implantation (doping), metallization, oxidation, chemical mechanical polishing, etc., all intended to finish an individual layer of the device. If several layers are required in the device, then the whole procedure, or a variant thereof, is repeated for each layer. Eventually, a device will be present in each target portion on the substrate. These devices are then separated from one another by a technique such as dicing or sawing, and then the individual devices can be mounted on a carrier, connected to pins, etc.

[0041] Manufacturing devices, such as semiconductor devices, typically involves processing asubstrate (e.g., a semiconductor wafer) using a number of fabrication processes to form various features and multiple layers of the devices. Such layers and features are typically manufactured and processed using, e.g., deposition, lithography, etch, chemical mechanical polishing, ion implantation, and / or other processes. Multiple devices may be fabricated on a plurality of dies on a substrate and then separated into individual devices. This device manufacturing process may be considered a patterning process. A patterning process involves a patterning step, such as optical and / or nanoimprint lithography using a patterning device in a lithographic apparatus, to transfer a pattern on the patterning device to a substrate and typically, but optionally, involves one or more related pattern processing steps, such as resist development by a development apparatus, baking of the substrate using a bake tool, etching using the pattern using an etch apparatus, etc. One or more metrology processes are typically involved in the patterning process. Lithography apparatuses, metrology systems, and other equipment used to fabricate semiconductor devices may use one or more linear actuators having the described cooling system.

[0042] Lithography is a step in the manufacturing of device such as ICs, where patterns formed on substrates define functional elements of the devices, such as microprocessors, memory chips, etc. Similar lithographic techniques are also used in the formation of flat panel displays, micro-electro mechanical systems (MEMS) and other devices.

[0043] FIG. 1 schematically depicts an embodiment of a lithographic apparatus LA that may include and / or be associated with one or more linear actuators and corresponding cooling systems. The apparatus comprises: an illumination system (illuminator) IL configured to condition a radiation beam B (e.g. UV radiation, DUV radiation, or EUV radiation); a support structure (e.g. a mask table) MT constructed to support a patterning device (e.g. a mask) MA and connected to a first positioner PM configured to accurately position the patterning device in accordance with certain parameters; a substrate table (e.g. a wafer table) WT (e.g., WTa, WTb or both) configured to hold a substrate (e.g. a resist-coated wafer) W and coupled to a second positioner PW configured to accurately position the substrate in accordance with certain parameters; and a projection system (e.g. a refractive projection lens system) PS configured to project a pattern imparted to the radiation beam B by patterning device MA onto a target portion C (e.g. comprising one or more dies and often referred to as fields) of the substrate W. The projection system is supported on a reference frame (RF). As depicted, the apparatus is of a transmissive type (e.g. employing a transmissive mask). Alternatively, the apparatus may be of a reflective type (e.g. employing a programmable mirror array of a type as referred to above, or employing a reflective mask).

[0044] The illuminator IL receives a beam of radiation from a radiation source SO. The source and the lithographic apparatus may be separate entities, for example when the source is an excimer laser. In such cases, the source is not considered to form part of the lithographic apparatus and the radiation beam is passed from the source SO to the illuminator IL with the aid of a beam delivery system BD comprising for example suitable directing mirrors and / or a beam expander. In other cases, the sourcemay be an integral part of the apparatus, for example when the source is a mercury lamp. The source SO and the illuminator IL, together with the beam delivery system BD if required, may be referred to as a radiation system.

[0045] The illuminator IL may alter the intensity distribution of the beam. The illuminator may be arranged to limit the radial extent of the radiation beam such that the intensity distribution is non -zero within an annular region in a pupil plane of the illuminator IL. Additionally or alternatively, the illuminator IL may be operable to limit the distribution of the beam in the pupil plane such that the intensity distribution is non-zero in a plurality of equally spaced sectors in the pupil plane. The intensity distribution of the radiation beam in a pupil plane of the illuminator IL may be referred to as an illumination mode.

[0046] The illuminator IL may comprise adjuster AD configured to adjust the (angular / spatial) intensity distribution of the beam. Generally, at least the outer and / or inner radial extent (commonly referred to as o-outer and o-inner, respectively) of the intensity distribution in a pupil plane of the illuminator can be adjusted. The illuminator IL may be operable to vary the angular distribution of the beam. For example, the illuminator may be operable to alter the number, and angular extent, of sectors in the pupil plane wherein the intensity distribution is non-zero. By adjusting the intensity distribution of the beam in the pupil plane of the illuminator, different illumination modes may be achieved. For example, by limiting the radial and angular extent of the intensity distribution in the pupil plane of the illuminator IL, the intensity distribution may have a multi-pole distribution such as, for example, a dipole, quadrupole or hexapole distribution. A desired illumination mode may be obtained, e.g., by inserting an optic which provides that illumination mode into the illuminator IL or using a spatial light modulator.

[0047] The illuminator IL may be operable to alter the polarization of the beam and may be operable to adjust the polarization using adjuster AD. The polarization state of the radiation beam across a pupil plane of the illuminator IL may be referred to as a polarization mode. The use of different polarization modes may allow greater contrast to be achieved in the image formed on the substrate W. The radiation beam may be unpolarized. Alternatively, the illuminator may be arranged to linearly polarize the radiation beam. The polarization direction of the radiation beam may vary across a pupil plane of the illuminator IL. The polarization direction of radiation may be different in different regions in the pupil plane of the illuminator IL. The polarization state of the radiation may be chosen in dependence on the illumination mode. For multi -pole illumination modes, the polarization of each pole of the radiation beam may be generally perpendicular to the position vector of that pole in the pupil plane of the illuminator IL. For example, for a dipole illumination mode, the radiation may be linearly polarized in a direction that is substantially perpendicular to a line that bisects the two opposing sectors of the dipole. The radiation beam may be polarized in one of two different orthogonal directions, which may be referred to as X-polarized and Y-polarized states. For a quadrupole illumination mode, the radiation in the sector of each pole may be linearly polarized in adirection that is substantially perpendicular to a line that bisects that sector. This polarization mode may be referred to as XY polarization. Similarly, for a hexapole illumination mode the radiation in the sector of each pole may be linearly polarized in a direction that is substantially perpendicular to a line that bisects that sector. This polarization mode may be referred to as TE polarization.

[0048] In addition, the illuminator IL generally comprises various other components, such as an integrator IN and a condenser CO. The illumination system may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic, or other types of optical components, or any combination thereof, for directing, shaping, or controlling radiation. Thus, the illuminator provides a conditioned beam of radiation B, having a desired uniformity and intensity distribution in its cross section.

[0049] The support structure MT supports the patterning device in a manner that depends on the orientation of the patterning device, the design of the lithographic apparatus, and other conditions, such as for example whether or not the patterning device is held in a vacuum environment. The support structure may use mechanical, vacuum, electrostatic or other clamping techniques to hold the patterning device. The support structure may be a frame or a table, for example, which may be fixed or movable as required. The support structure may ensure that the patterning device is at a desired position, for example with respect to the projection system.

[0050] The lithographic apparatus may be of a type having two (dual stage) or more tables (e.g., two or more substrate tables WTa, WTb, two or more patterning device tables, a substrate table WTa and a table WTb below the projection system without a substrate that is dedicated to, for example, facilitating measurement, and / or cleaning, etc.). In such “multiple stage” machines, the additional tables may be used in parallel, or preparatory steps may be carried out on one or more tables while one or more other tables are being used for exposure. For example, alignment measurements using an alignment sensor AS and / or level (height, tilt, etc.) measurements using a level sensor LS may be made.

[0051] In operation of the lithographic apparatus, a radiation beam is conditioned and provided by the illumination system IL. The radiation beam B is incident on the patterning device (e.g., mask) MA, which is held on the support structure (e.g., mask table) MT. Having traversed the patterning device MA, the radiation beam B passes through the projection system PS, which focuses the beam onto a target portion C of the substrate W. With the aid of the second positioner PW and position sensor IF (e.g., an interferometric device, linear encoder, 2-D encoder, or capacitive sensor), the substrate table WT can be moved accurately, e.g. to position different target portions C in the path of the radiation beam B. Similarly, the first positioner PM and another position sensor (which is not explicitly depicted in Fig. 1) can be used to accurately position the patterning device MA with respect to the path of the radiation beam B, e.g. after mechanical retrieval from a mask library, or during a scan. In general, movement of the support structure MT may be realized with the aid of a long-stroke module (coarse positioning) and a short-stroke module (fine positioning), which form part of the firstpositioner PM. Similarly, movement of the substrate table WT may be realized using a long-stroke module and a short-stroke module, which form part of the second positioner PW. In the case of a stepper (as opposed to a scanner), the support structure MT may be connected to a short-stroke actuator only, or may be fixed. Patterning device MA and substrate W may be aligned using patterning device alignment marks Ml, M2 and substrate alignment marks Pl, P2. Although the substrate alignment marks as illustrated occupy dedicated target portions, they may be located in spaces between target portions (these are known as scribe-lane alignment marks). Similarly, in situations in which more than one die is provided on the patterning device MA, the patterning device alignment marks may be located between the dies.

[0052] The depicted apparatus may be used in at least one of the following modes: 1. In step mode, the support structure MT and the substrate table WT are kept essentially stationary, while a pattern imparted to the radiation beam is projected onto a target portion C at one time (i.e. a single static exposure). The substrate table WT is then shifted in the X and / or Y direction so that a different target portion C can be exposed. In step mode, the maximum size of the exposure field limits the size of the target portion C imaged in a single static exposure. 2. In scan mode, the support structure MT and the substrate table WT are scanned synchronously while a pattern imparted to the radiation beam is projected onto a target portion C (i.e. a single dynamic exposure). The velocity and direction of the substrate table WT relative to the support structure MT may be determined by the (de-) magnification and image reversal characteristics of the projection system PS. In scan mode, the maximum size of the exposure field limits the width (in the non-scanning direction) of the target portion in a single dynamic exposure, whereas the length of the scanning motion determines the height (in the scanning direction) of the target portion. 3. In another mode, the support structure MT is kept essentially stationary holding a programmable patterning device, and the substrate table WT is moved or scanned while a pattern imparted to the radiation beam is projected onto a target portion C. In this mode, generally a pulsed radiation source is employed, and the programmable patterning device is updated as required after each movement of the substrate table WT or in between successive radiation pulses during a scan. This mode of operation can be readily applied to maskless lithography that utilizes programmable patterning device, such as a programmable mirror array of a type as referred to above. Combinations and / or variations on the above -de scribed modes of use or entirely different modes of use may also be employed.

[0053] A substrate may be processed, before or after exposure, in for example a track (a tool that typically applies a layer of resist to a substrate and develops the exposed resist) or a metrology or inspection tool. Any or all of these tools may include linear actuators with corresponding cooling systems. Where applicable, the disclosure herein may be applied to such and other substrate processing tools. Further, the substrate may be processed more than once, for example in order to create a multi-layer IC, so that the term substrate used herein may also refer to a substrate that already includes multiple processed layers.

[0054] The terms “radiation” and “beam” used herein encompass all types of electromagnetic radiation, including ultraviolet (UV) or deep ultraviolet (DUV) radiation (e.g. having a wavelength of 365, 248, 193, 157 or 126 nm) and extreme ultra-violet (EUV) radiation (e.g. having a wavelength in the range of 5-20 nm), as well as particle beams, such as ion beams or electron beams.

[0055] Various patterns on or provided by a patterning device may have different process windows, i.e., a space of processing variables under which a pattern will be produced within specification. Examples of pattern specifications that relate to potential systematic defects include checks for necking, line pull back, line thinning, critical dimension (CD), edge placement, overlapping, resist top loss, resist undercut and / or bridging. The process window of the patterns on a patterning device or an area thereof may be obtained by merging (e.g., overlapping) process windows of each individual pattern. The boundary of the process window of a group of patterns comprises boundaries of process windows of some of the individual patterns. In other words, these individual patterns limit the process window of the group of patterns.

[0056] The first positioner PM and the second positioner PW may each comprise one or more electric motors EM, for example linear electric motors. The linear electric motors may be Lorentz motors.

[0057] Fig. 2 shows schematically a part of an electric motor comprising a coil assembly CAS and a coil carrier COC. The coil carrier COC defines a single recess in which the coil assembly CAS is placed. The coil assembly CAS has a row of six coils. The coil assembly CAS may also have any other suitable number of coils.

[0058] The coil carrier COC comprises a PCA (Printed Circuit Assembly) component. The PCA component is generally plate shaped and comprises a PCA component body COB and a covering plate COP.

[0059] Fig. 3 shows schematically a top view of the PCA component body COB of Fig. 2.

[0060] Fig. 4 shows schematically a top view of the covering plate COP of Fig. 2.

[0061] The PCA component body COB has a number of (electrically) conductive traces TRA and one or more electronic components, in particular two temperature sensors TES. The conductive traces TRA are provided to electrically connect the temperature sensors TES to a cable connector CON provided in a comer of the PCA component body COB. The cable connector CON may comprise openings in which cables can be fixed, for example by soldering. In an alternative embodiment, the cable connector CON may be any other suitable device to connect cables to the PCA component body COB, for example a socket to receive a cable plug.

[0062] The temperature sensors TES are for example positive-temperature-coefficient (PTC) or negative-temperature-coefficient (NTC) thermistors to form a voltage divider, which has the effect of producing an output voltage that is linear over temperature.

[0063] The conductive traces TRA and the temperature sensors TES are embedded in the PCA component body COB. Embedded means that the one or more conductive traces TRA and thetemperature sensors TES are fixed on or in the material of the PCA component body COB. The conductive traces TRA may for example be deposited on the main material of the PCA component body COB. The conductive traces TRA may be made of any suitable electrically conductive material, such as copper. The temperature sensors TES may be soldered to the PCA component COB and arranged in electrical connection to the conductive traces TRA. In Figs. 2 and 3, the conductive traces TRA are shown as two solid lines. In practice, each line may have multiple separate traces that connect the temperature sensors TES to the cable connector CON.

[0064] As the temperature sensors TES and conductive traces TRA are integrated in the coil carrier COC, limited space is required for the arrangement of the temperature sensors TES and the conductive tracers TRA. The routing of the conductive tracers TRA is relatively simple and do not require manual steps during assembly of the coil carrier COC. The cable connector CON for cable connections to the PCA can be placed in an easy-to-access location, for example in a comer of the PCA component. The provision of the conductive tracers TRA on the PCA component results in more mechanical stability, less creepage and improved clearance, compared to separate cabling in an electric motor.

[0065] The PCA component body COB may also comprise only one or three or more temperature sensors TES. As an alternative or as an addition to the temperature sensors TES one or more other electronics components, for example other sensor types, may be provided on the PCA component body COB. '

[0066] In Fig. 2, the covering plate COP is mounted, for example bonded, on the PCA component body COB. The surface area of the covering plate COP substantially corresponds to the surface area of the PCA component body COB. In other words, the main inner and outer contour of the covering plate COP is mainly the same as the main inner and outer contour of the PCA component body COB such that the covering plate COP and the PCA component body COB form a stack of plates.

[0067] The covering plate COP comprises one or more openings to expose the temperature sensors TES and the cable connector CON arranged on the PCA component body COB. The opening exposing the cable connector CON is surrounded by material of the covering plate COP, while the openings exposing the temperature sensors TES are provided at the edge of the material of the covering plate COP.

[0068] The covering plate COP provides protection to the one or more conductive traces TRA provided on the PCA component body COB. Further, the covering plate COP may provide additional stiffness to the PCA component.

[0069] The openings in the covering plate COP may be fdled by potting material. For example after connection of the cables to the cable connector CON, for example by soldering, the opening in the covering plate COP exposing the cable connector CON may be filled with potting material. The presence of the walls of the opening formed by the covering plate COP form a suitable space for receiving and holding the fluid potting material before the potting material solidifies.

[0070] The PCA component body COB may be made of any suitable material, for example fiberglass. The covering plate COP may be made of the same or similar material, or any other suitable material.

[0071] Fig. 5 shows schematically a side view (A-A) of the coil carrier of Fig. 2. The coil carrier COC comprises the PCA component shown in Fig. 2 and multiple cooling plates CPL. The cooling plates CPL and the PCA component are arranged in a stacked configuration, wherein a main surface area of the cooling plates CPL and the PCA component are substantially the same. The coil carrier COC, i.e. the combination of PCA component and cooling plates CPL, defines a single recess in which the coil assembly CAS is arranged. The cooling plates CPL are made of athermal conductive material to guide heat away from the coils of the coil assembly CAS. The cooling plates CPL may be connected to a cooling system to provide cooling to the cooling plates CPL.

[0072] Fig. 6 shows schematically a first cross-section (B-B) of the coil assembly and the coil carrier of Fig. 2 at the location of a temperature sensor TES. It can be seen that the temperature sensor TES is arranged at a suitable location relatively close to the coil assembly CAS. This facilitates effective measurement of the temperature of the coil assembly CAS.

[0073] In the embodiment of Fig. 2, the conductive traces TRA, the temperature sensors TES and the cable connector CON are provided at one side of the PCA component body COB. In alternative embodiments, conductive traces TRA, temperature sensors TES, or other electronic components, and cable connector CON may also be arranged on the opposite side of the PCA component body COB. The conductive traces TRA may be guided through the PCA component body COB to create an electrical connection between the opposite sides of the PCA component body COB.

[0074] Fig. 7 shows schematically a second cross-section (C-C) of the coil carrier of Fig. 2 at the location of the cable connector CON. The cable connector CON is provided in an opening provided in the covering plate COP. It can be seen that the walls of the cover plate COP forming the opening can be used as a space to receive and hold a fluid potting material before solidification of the potting material.

[0075] Fig. 8 shows schematically a cross-section of an alternative embodiment of a coil assembly CAS and coil carrier COC of an electric motor. In the embodiment of Fig. 8, two PCA components are integrated in the coil carrier COC. One of the PCA components is arranged at the upper side of the coil carrier COC and the other of the PCA components is arranged at the lower side of the coil carrier. Cooling plates CPL are arranged between the two PCA components. The two PCA components and the cooling plates CPL form a stacked configuration that defines a recess in which at least one coil of the coil assembly CAS is received.

[0076] Each PCA component comprises a PCA component body COB and a covering plate COP mounted on the PCA component body COB. The PCA component body COB has one or more conductive traces TRA and one or more electronic components, in particular a temperature sensor TES. Corresponding to the embodiment of Fig. 2, the one or more conductive traces TRA and thetemperature sensor TES are embedded in the PCA component body COB.

[0077] In alternative embodiments, more than two PCA components may be provided in a coil carrier.

[0078] Hereinabove, embodiments are described in which a PCA component is integrated into a coil carrier COC, which coil carrier COC defines a single recess to receive at least one coil of a coil assembly therein. In other embodiments, two or more coil carriers may be provided to define a recess to at least partially receive the coils of a coil assembly, wherein a PCA component is integrated into at least one of the coil carriers. For example, the coil carrier COC shown in Fig. 2 may be divided in two halves, such as a left side coil carrier and a right side coil carrier, wherein a PCA component is integrated in at least one of the left side coil carrier and the right side coil carrier. In another alternative embodiment, the coil carrier and integrated PCA component may define two recesses, wherein each recess is arranged to receive a coil assembly.

[0079] Various embodiments of the present systems and methods are disclosed in the subsequent list of numbered clauses. In the following, further features, characteristics, and exemplary technical solutions of the present disclosure will be described in terms of clauses that may be optionally claimed in any combination:1. A PCA component for a coil assembly, comprising: a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.2. The PCA component of clause 1, wherein the PCA component body and the covering plate comprise at least one recess having an inner contour surrounding at least one of the one or more coils.3. The PCA component of any of the preceding clauses, wherein one or more conductive traces and one or more electronic components are embedded in at least one side of the PCA component body and the covering plate mainly covers the complete at least one side of the PCA component body.4. The PCA component of any of the preceding clauses, wherein the covering plate comprises one or more openings to expose at least one of the one or more electronic components arranged on the PCA component body.5. The PCA component of any of the preceding clauses, wherein the one or more electronic components comprise one or more sensors.6. The PCA component of any of the preceding clauses, wherein the one or more electronic components comprise at least one temperature sensor.7. The PCA component of any of the preceding clauses, wherein the coil assembly is a motorcoil assembly.8. The PCA component of any of the preceding clauses, wherein the PCA component body is made of a fiberglass material and / or wherein the covering plate is made of a fiberglass material.9. The PCA component of any of the preceding clauses, wherein the PCA component body has one or more locations for cable connections, wherein the one or more locations for cable connections are not covered by the covering plate.10. An electric motor comprising: a coil assembly having one or more coils, a coil carrier comprising one or more recesses in which the one or more coils at least partially are placed, wherein the coil carrier comprises a PCA component, comprising: a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.11. The electric motor of clause 10, wherein the one or more electronic components of the PCA component comprise one or more sensors.12. The electric motor of clause 10 or 11, wherein the one or more electronic components of the PCA component comprise at least one temperature sensor.13. The electric motor of any of the clauses 10-12, wherein the coil carrier comprises at least one cooling plate.14. The electric motor of any of the clauses 10-13, wherein the coil carrier comprises multiple cooling plates, wherein the multiple cooling plates and the PCA component are provided in a stacked configuration.15. The electric motor of any of the clauses 10-14, wherein the coil carrier comprises two or more PCA components, wherein each PCA component comprises: a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.16. A positioning system to position a movable object, the positioning system comprising one or more electric motors according to any of the clauses 10-15.17. A lithographic apparatus, the lithographic apparatus comprising one or more electric motors according to any of the clauses 10-15.18. A semiconductor device manufacturing method, the method comprising: receiving a substrate with a photoresist layer; directing radiation from a radiation source to transfer a pattern from a reticle onto the photoresist layer; and actuating a movable object using an electric motor, the electric motor comprising: a coil assembly having one or more coils, a coil carrier comprising one or more recesses in which the one or more coils at least partially are placed, wherein the coil carrier comprises a PCA component, comprising: a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.

[0080] While the concepts disclosed herein may be used for a linear actuator associated with wafer manufacturing on a substrate such as a silicon wafer, it shall be understood that the disclosed concepts may be used with any type of manufacturing system that may include a linear actuator, e.g., those used for manufacturing on substrates other than silicon wafers. In addition, the combination and subcombinations of disclosed elements may comprise separate embodiments. For example, the cooling system, and an associated lithography apparatus that includes the cooling system may comprise separate embodiments, and / or these features may be used together in the same embodiment.

[0081] The descriptions above are intended to be illustrative, not limiting. Thus, it will be apparent to one skilled in the art that modifications may be made as described without departing from the scope of the claims set out below.

Claims

CLAIMS1. A PCA component for a coil assembly, comprising: a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.

2. The PCA component of claim 1, wherein the PCA component body and the covering plate comprise at least one recess having an inner contour surrounding at least one of the one or more coils.

3. The PCA component of claim 1, wherein one or more conductive traces and one or more electronic components are embedded in at least one side of the PCA component body and the covering plate mainly covers the complete at least one side of the PCA component body.

4. The PCA component of claim 1, wherein the covering plate comprises one or more openings to expose at least one of the one or more electronic components arranged on the PCA component body.

5. The PCA component of claim 1, wherein the one or more electronic components comprise one or more sensors or at least one temperature sensor.

6. The PCA component of claim 1, wherein the coil assembly is a motor coil assembly.

7. The PCA component of claim 1, wherein the PCA component body is made of a fiberglass material and / or wherein the covering plate is made of a fiberglass material.

8. The PCA component of claim 1, wherein the PCA component body has one or more locations for cable connections, wherein the one or more locations for cable connections are not covered by the covering plate.

9. An electric motor comprising: a coil assembly having one or more coils, a coil carrier comprising one or more recesses in which the one or more coils at least partially are placed, wherein the coil carrier comprises a PCA component, comprising:a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.

10. The electric motor of claim 9, wherein the one or more electronic components of the PCA component comprise one or more sensors or at least one temperature sensor.

11. The electric motor of claim 9, wherein the coil carrier comprises at least one cooling plate or the coil carrier comprises multiple cooling plates, wherein the multiple cooling plates and the PCA component are provided in a stacked configuration.

12. The electric motor of claim 9, wherein the coil carrier comprises two or more PCA components according to claim 1.

13. A positioning system to position a movable object, the positioning system comprising one or more electric motors according to claim 9.

14. A lithographic apparatus, the lithographic apparatus comprising one or more electric motors according to claim 9.

15. A semiconductor device manufacturing method, the method comprising: receiving a substrate with a photoresist layer; directing radiation from a radiation source to transfer a pattern from a reticle onto the photoresist layer; and actuating a movable object using an electric motor, the electric motor comprising: a coil assembly having one or more coils, a coil carrier comprising one or more recesses in which the one or more coils at least partially are placed, wherein the coil carrier comprises a PCA component, comprising: a PCA component body having one or more conductive traces and one or more electronic components, wherein the one or more conductive traces and one or more electronic components are embedded in the PCA component body; and a covering plate mounted on the PCA component body, wherein the PCA component body and the covering plate define one or more recesses to receive one or more coils of the coil assembly at least partially therein.

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