Component transfer device and component transfer method

Abstract

Provided is a component transfer device and a component transfer method, that when a suction failure has occurred, makes it possible to minimize the incidence of another suction failure following recovery.　A device for controlling the component transfer device according to the present disclosure executes: a suction process in which a head movement device is controlled so as to grab a component from a component supply device via suction on a suction nozzle of a head; a correction process in which the next and subsequent positions at which the suction nozzle grabs components from the component supply device by suction are corrected using correction values that are based on the position of the component grabbed from the component supply device on the suction nozzle by the suction process and the position of the suction nozzle; a correction value update process in which the correction values are updated according to the execution of the suction process; a storage process that, in the event of success in grabbing using the suction process after the correction process has been executed, stores, as stable values, values that are based on the correction values used in the correction process; and a setting process that, in the event of failure in grabbing using the suction process, the stable values are set as the correction values to be used in the correction process after the failure.

Description

Component Transfer Device and Component Transfer Method

[0001] The present disclosure relates to a technique for correcting the position where a component is adsorbed from a component supply device.

[0002] Conventionally, techniques for correcting the position where a component is adsorbed from a component supply device have been proposed. For example, in the electronic component automatic mounting device of Patent Document 1 below, the component supplied by the component supply device to the component extraction position is adsorbed by the suction nozzle of the suction head unit, the suction state is imaged by a CCD camera, and the positional deviation between the suction nozzle and the component is corrected and mounted on the printed circuit board. The electronic component automatic mounting device stores the deviation amount between the component supplied from the component supply device and the suction nozzle, and when sucking the next component, moves the component supply device based on the stored deviation amount to correct the component extraction position.

[0003] Japanese Utility Model Publication No. 5-33600

[0004] In the control for correcting the position in subsequent suction based on the deviation amount of the component adsorbed from the component supply device in the past as in Patent Document 1 described above, a sudden deviation occurs for some reason such as a vacuum leak in the suction nozzle. If such a sudden deviation is fed back and the correction value diverges, suction fails. After suction fails, if the deviation amount at the time of failure stored in the storage device or the correction value based on the deviation amount is used, there is a risk of suction failure again.

[0005] The present disclosure has been made in view of the above problems, and an object thereof is to provide a component transfer device and a component transfer method that can suppress the occurrence of suction failure again after recovery when suction failure occurs.

[0006] To solve the above problems, this specification discloses a component transfer device comprising: a head that picks up a component with a suction nozzle; a component supply device that supplies the component to the head; a head moving device that moves the head; and a control device, wherein the control device controls the head moving device to pick up the component from the component supply device to the suction nozzle of the head; a correction process that uses a correction value based on the position of the component picked up from the component supply device to the suction nozzle by the pick-up process and the position of the suction nozzle to correct the position at which the suction nozzle picks up the component from the component supply device in subsequent instances; a correction value update process that updates the correction value in accordance with the execution of the pick-up process; a storage process that stores a value based on the correction value used in the correction process as a stable value if the pick-up by the pick-up process after the correction process is successful; and a setting process that sets the stable value as the correction value to be used in the correction process after the pick-up fails. Furthermore, the contents of this disclosure are not limited to implementation as a parts transfer device, but are also extremely useful as a parts transfer method in a parts transfer device.

[0007] According to the component transfer apparatus and component transfer method of this disclosure, it is possible to suppress the occurrence of further suction failures after recovery following a suction failure.

[0008] A schematic diagram showing the configuration of the component mounting device 10 according to the first embodiment. An explanatory diagram showing the electrical connection relationship of the control device 25 according to the first embodiment. A diagram showing the flowchart of the component mounting process according to the first embodiment. A diagram showing the flowchart of the component mounting process according to the first embodiment. An explanatory diagram showing the process of picking up a component P according to the first embodiment and then transporting it onto the substrate S. A diagram showing the flowchart of the component mounting process according to the second embodiment. A diagram for explaining sudden misalignment according to the second embodiment.

[0009] (First Embodiment) Hereinafter, a component mounting device 10 of the first embodiment, which is an embodiment of the component transfer device of the present disclosure, will be described in detail with reference to the drawings. As shown in Figure 1, the component mounting device 10 includes a base 11, a housing 12, a component supply device 13, a substrate transport device 15, a moving mechanism 16, a head 17, a suction nozzle 18, a part camera 19, a mark camera 21, a nozzle station 22, an air supply device 23 (see Figure 2), and a control device 25 (see Figure 2). The component mounting device 10 is a device that mounts components P supplied from the component supply device 13 onto a substrate S using the suction nozzle 18.

[0010] In the following explanation, as shown in Figure 1, the direction in which the substrate S is transported will be referred to as the X-axis direction, the direction parallel to the plane of the transported substrate S and perpendicular to the X-axis direction will be referred to as the Y-axis direction, and the direction perpendicular to both the X-axis and Y-axis directions will be referred to as the Z-axis direction. Also, as shown in Figure 1, the directions may be referred to as the left-right direction (X-axis direction), the front-back direction (Y-axis direction), and the up-down direction (Z-axis direction), with the direction of viewing the component mounting device 10 from the front as the reference point.

[0011] On the base 11, various devices such as a component supply device 13, a substrate transport device 15, and a moving mechanism 16 are arranged, and the upper part is covered by a housing 12. The component supply device 13 is provided at the front end of the base 11 and includes a feeder stand (not shown) on which a plurality of tape feeders 13A are detachably mounted. The feeder stand has a plurality of slots on which each of the plurality of tape feeders 13A can be mounted. The plurality of slots are arranged in the left-right direction (X-axis direction). Therefore, the plurality of tape feeders 13A mounted in the slots are arranged in the left-right direction. The tape feeder 13A is fitted with a reel 13B on which tape is wound. This tape contains components P in storage compartments formed at predetermined intervals. The tape feeder 13A supplies components P to the component supply position by pulling the tape from the reel and feeding it out. Components P are, for example, electronic components such as ICs and resistors.

[0012] The substrate transport device 15 is installed from the center to the rear of the base 11 and transports the substrate S in a direction parallel to the X-axis direction and fixes the substrate S at a predetermined working position. After the mounting of the components P is completed, the substrate transport device 15 unloads the substrate S in a direction parallel to the X-axis direction. The substrate transport device 15 has a pair of conveyor belts. The pair of conveyor belts are installed with a gap between them in the front and rear directions and are stretched across in the left and right directions to carry and transport the substrate S.

[0013] The head 17 picks up the component P supplied to the component supply position and attaches it to the substrate S. The head 17 includes, for example, a nozzle holder to which a suction nozzle 18 can be attached and detached, and a lifting device that moves the nozzle holder up and down (moves in the Z-axis direction) together with the suction nozzle 18. The air supply device 23 shown in Figure 2 is a device that supplies negative pressure air to the suction nozzle 18 (head 17) based on the control of the control device 25. The suction nozzle 18 picks up the component P by the negative pressure supplied to the suction port from the air supply device 23. The suction nozzle 18 releases the picked-up component P when the negative pressure supply is released or when positive pressure is supplied to the suction port from the air supply device 23. The head 17 is, for example, a rotary-type head in which multiple nozzle holders are arranged in a ring shape, and the suction nozzle 18 that picks up and attaches is switched by rotating the multiple nozzle holders. Note that the head 17 is not limited to a rotary-type head, and may be configured to attach only one suction nozzle 18.

[0014] The moving mechanism 16 is provided on the upper part of the component mounting device 10 and is a device that moves the head 17 in the XY direction. The moving mechanism 16 includes, for example, a slider 16A to which the head 17 is attached, and a device (ball screw mechanism or linear motor) that slides the slider 16A in the X-axis direction or the Y-axis direction. With the head 17 attached to the slider 16A, it moves to any position in the XY direction based on the drive of the moving mechanism 16.

[0015] The parts camera 19 is located on the base 11, between the parts supply device 13 and the substrate transport device 15 in the front-rear direction, and captures images of the parts P held by the suction nozzle 18 from below. The mark camera 21 is located on the slider 16A and captures images of positioning marks and the like attached to the substrate S from above. The nozzle station 22 is located adjacent to the parts camera 19 and can store multiple replacement suction nozzles 18. The head 17 moves to the position of the nozzle station 22 to exchange the suction nozzle 18 mounted on the head 17 with the suction nozzle 18 stored in the nozzle station 22.

[0016] As shown in Figure 2, the control device 25 includes a CPU 31, a ROM 32, an HDD 33, a RAM 34, and an input / output interface (I / F) 35. These devices are electrically connected via a bus 36. The RAM 34 stores, for example, the correction values ​​ΔX1(i), ΔY1(i), positional deviation amounts ΔX2(i), ΔY2(i), stability values ​​X3, Y3, and target suction positions (Xp, Yp), which will be described later. The ROM 32 and HDD 33 store control data (control programs and setting values) for controlling the component mounting device 10. The control device 25 also receives image data from the parts camera 19 and the mark camera 21, and detection signals from position sensors that detect the positions of the suction nozzles 18 in the X-axis, Y-axis, and Z-axis directions, via the input / output interface 35. As position sensors, encoders of the moving mechanism 16 or sensors that directly detect the position of the suction nozzles 18 can be used. Furthermore, the control device 25 outputs control signals to the component supply device 13, the substrate transport device 15, the moving mechanism 16, the head 17, and the air supply device 23 via the input / output interface 35.

[0017] As shown in Figure 2, the component mounting device 10 is connected to a management device 40. The management device 40 is, for example, a general-purpose computer and includes a CPU 41, ROM 42, HDD 43, RAM 44, and an input / output interface 45. These devices are electrically connected via a bus 46. The management device 40 is connected to the input / output interface 35 of the control device 25 via the input / output interface 45. The control device 25 performs bidirectional communication with the management device 40 via the input / output interfaces 35 and 45, exchanging data and control signals. Input signals are input to the management device 40 from input devices 47 such as a mouse or keyboard via the input / output interface 45. The management device 40 also outputs image signals to the display 48 via the input / output interface 45. The ROM 42 and HDD 43 store control data for the management device 40 and the production program for the circuit board S. The production program for the circuit board S referred to here is a description of the process that defines which components P to mount on the circuit board S in what order in each component mounting device 10, and how many circuit boards S with components P mounted in that manner to be produced.

[0018] Note that the configurations of the component mounting device 10 and management device 40 shown in Figure 2 are just examples. For example, the component mounting device 10 and management device 40 may be equipped with storage devices other than ROM 32, 42 and HDD 33, 43 (such as SSDs) as storage devices.

[0019] Next, the operation of mounting components P using the component mounting device 10 with the above-described configuration will be explained. Figures 3 and 4 show flowcharts of the component mounting process executed by the control device 25. Figure 5 shows the process of picking up components P and then transporting them onto the substrate S. When the control device 25 receives an instruction to start production of the substrate S, for example, it executes the production program acquired from the management device 40 and starts the process shown in Figures 3 and 4. The control device 25 executes the process shown in Figures 3 and 4 for each slot where the tape feeder 13A is mounted. The control device 25 also executes the process shown in Figures 3 and 4 for each suction nozzle 18. In the following explanation, in order to avoid making the explanation complicated, the explanation will be based on any combination of nozzle holder and slot. Therefore, unless the suction nozzle 18 of the target nozzle holder is replaced, the target suction nozzle 18 is the same. Similarly, unless the tape feeder 13A of the target slot is replaced, the target tape feeder 13A is the same. Next, we will explain the case in which the target suction nozzle 18 repeatedly picks up and attaches the component P from the target tape feeder 13A.

[0020] The control device 25 performs the processes shown in Figures 3 and 4, correcting the target suction position (Xp, Yp) for picking up the component P with correction values ​​ΔX1(i) and ΔY1(i), updating the stable values ​​X3 and Y3 while successfully picking up the component P, and if picking fails, setting the correction values ​​ΔX1(i+1) and ΔY1(i+1) to be used next time based on the stable values ​​X3 and Y3 stored when picking up was successful. Note that i indicates the number of times the component P has been picked up from the same tape feeder 13A. Therefore, for example, ΔX1(i) and ΔY1(i) represent the correction values ​​used to correct the target suction position (Xp, Yp) when picking up the component P for the ith time from the same tape feeder 13A. Furthermore, in the following explanation, the correction values ​​ΔX1(i), ΔY1(i), positional displacement amounts ΔX2(i), ΔY2(i), and stability values ​​X3, Y3 may be simply referred to as correction values, positional displacement amounts, and stability values, respectively.

[0021] Furthermore, in the following explanation, the control device 25, which executes programs such as production programs, will be referred to simply by its name. For example, the statement "The control device 25 controls the moving mechanism 16 and the head 17 and moves the suction nozzle 18 above the target suction position (Xp, Yp)" means that "The control device 25 executes the production program using the CPU 31, controls the moving mechanism 16 and the head 17 based on the production program, and moves the suction nozzle 18 above the target suction position (Xp, Yp)."

[0022] First, when the control device 25 starts the processing shown in Figures 3 and 4, in step (hereinafter simply referred to as S) 11, it determines whether at least one of the target suction nozzle 18 and the target tape feeder 13A has been replaced. If the target suction nozzle 18 has not been replaced and the target tape feeder 13A has not been replaced, the control device 25 makes a negative determination in S11 (S11: NO) and executes S13.

[0023] On the other hand, if the control device 25 replaces the target suction nozzle 18 at the nozzle station 22, or executes control to switch the suction nozzle 18 that picks up the component P from the target tape feeder 13A, it makes an affirmative decision in S11 (S11: YES) and executes S15. Also, if the control device 25 replaces the tape feeder 13A installed in the target slot, it makes an affirmative decision in S11 (S11: YES) and executes S15. In S15, the control device 25 initializes the number of suctions i to a predetermined initial value (for example, 1). The control device 25 also initializes the correction values ​​ΔX1(i), ΔY1(i), stability values ​​X3, Y3, and the number of consecutive successes N, which will be described later, to predetermined initial values ​​(for example, zero). Also, in S15, the control device 25 initializes the specified number of times TH, which will be described later. For example, the control device 25 initializes the specified number of times TH to a predetermined initial value (such as 4 times, the first specified number of times in this disclosure). The control device 25 executes S15, and then executes S13. Note that the correction values ​​ΔX1(1), ΔY1(1), stability values ​​X3, Y3, and consecutive success count N are set to zero, for example, and stored in the RAM 34 when the processing shown in Figures 3 and 4 is started.

[0024] Here, the control device 25 controls the position of the head 17 and the suction nozzle 18 using an XY coordinate system with the origin (0,0) set at a reference position within the component mounting device 10. The target suction position (Xp, Yp) shown in Figure 5 is, for example, a position determined for each tape feeder 13A, and is the target XY coordinate when picking up component P from the tape feeder 13A. The target suction position (Xp, Yp) is also the target destination position for positioning the suction nozzle 18 when moving the head 17 to the tape feeder 13A in order to pick up component P. The correction values ​​ΔX1(i) and ΔY1(i) are values ​​that correct the target suction position. The correction values ​​are updated each time a suction operation is performed, based on the positional deviation amounts ΔX2(i) and ΔY2(i), as will be described later (S27 in Figure 4).

[0025] If no sudden deviations occur for any reason, and the correction value is repeatedly updated while the operating environment remains the same, the correction value will converge to a value within a predetermined range (hereinafter referred to as the stable value). The control device 25 stores these stable values ​​X3 and Y3 and uses the stable value as the correction value when a suction error occurs. A sudden deviation (hereinafter referred to as a sudden deviation) here refers to a phenomenon in which, for example, the negative pressure air supplied from the air supply device 23 to the suction nozzle 18 leaks and becomes unstable, causing the suction position of the part P to shift. Alternatively, a sudden deviation refers to a phenomenon in which the suction position of the part P shifts due to vibrations during the movement of the head 17, etc., between the time of suction and its movement to the part camera 19. In the feedback process that updates the correction value based on the positional deviation amounts ΔX2(i) and ΔY2(i), sudden deviations that do not result in a suction error are also fed back. Therefore, a sudden deviation is a deviation that, when it occurs, makes the correction value unstable and hinders the convergence of the correction value to the stable value. If these sudden deviations occur continuously or discretely and frequently, the correction value may diverge beyond the appropriate range, potentially leading to snapping errors (see Figure 7).

[0026] In other words, if no sudden deviations occur and the suction operation is repeated using the same suction nozzle 18 and the same tape feeder 13A (the same equipment), the correction value will stabilize within a predetermined range. On the other hand, if the target suction nozzle 18 or tape feeder 13A is replaced, the operating environment changes, which affects the correction value. Therefore, the correction value and stable value that were stored up to that point may not be suitable for the new operating environment. Accordingly, in S11, if at least one of the suction nozzle 18 and tape feeder 13A is replaced (S11: YES), the control device 25 resets the number of suctions i, the correction value, the stable value, and the number of consecutive successful operations N used to set the stable value to zero (S15). Details of the stable value, etc., will be described later.

[0027] In S13, the control device 25 corrects the target adsorption position based on the correction value. For example, the control device 25 adds the correction value ΔX1(i) for the X coordinate to the target adsorption position Xp for the X coordinate to obtain the corrected target adsorption position Xp for the X coordinate (=Xp + ΔX1(i)). Similarly, the control device 25 adds the correction value ΔY1(i) for the Y coordinate to the target adsorption position Yp for the Y coordinate to obtain the corrected target adsorption position Yp for the Y coordinate (=Yp + ΔY1(i)).

[0028] Next, the control device 25 controls the moving mechanism 16 and the head 17 to move the suction nozzle 18 above the target suction position (Xp, Yp) corrected in S13, and lowers the suction nozzle 18 to pick up the part P (S17). Next, the control device 25 controls the moving mechanism 16 to move the head 17 above the part camera 19, moving the head 17 so that the part P picked up by the suction nozzle 18 is above the part camera 19 (S19). The control device 25 then performs so-called on-the-fly imaging, for example, by controlling the part camera 19 to image the part P while the head 17 is still moving (S19). The control device 25 may also stop the head 17 above the part camera 19 and image the suction nozzle 18.

[0029] Next, the control device 25 processes the image captured by the parts camera 19 to detect the position where the part P is actually picked up by the suction nozzle 18. The control device 25 detects the amount of positional deviation between the detected actual suction position and the ideal position (S21). The actual suction position is, for example, the center position of the part P picked up by the suction nozzle 18. The ideal position is, for example, the center position of the opening of the nozzle hole in the suction nozzle 18. The control device 25 obtains the difference in the X-axis direction between the actual suction position and the ideal position as the positional deviation amount ΔX2(i) (S21). The control device 25 also obtains the difference in the Y-axis direction between the actual suction position and the ideal position as the positional deviation amount ΔY2(i) (S21).

[0030] Next, the control device 25 determines whether or not it succeeded in picking up the component P (S23). Failure to pick up the component P can occur, for example, due to a pick-up error, an error in the orientation of the component P, or a pick-up tolerance error. A pick-up error occurs when the pick-up nozzle 18 fails to pick up the component P at the component supply position of the tape feeder 13A, or when the component P falls from the pick-up nozzle 18 after being picked up. For example, if a pick-up error occurs and the control device 25 cannot detect the component P based on the image captured by the parts camera 19, it determines in S23 that the pick-up of the component P has failed (S23: NO). An error in the orientation of the component P occurs when the component P cannot be picked up in the correct orientation, for example, when an IC is picked up sideways. The control device 25 detects the orientation of the component P based on the image captured by the parts camera 19, and if the detected orientation is incorrect, it determines that the pick-up of the component P has failed (S23: NO). A pick-up tolerance error occurs when an error occurs that is too large to be corrected. The control device 25 determines, for example, that the suction of part P has failed if the magnitude of the positional deviation amounts ΔX2(i) and ΔY2(i) acquired in S21 is greater than a set upper limit (S23: NO). This upper limit is set, for example, in the production program.

[0031] If the control device 25 fails to pick up the part P (S23: NO), it executes S25. If no such pick-up error occurs and the pick-up was successful (S23: YES), it executes S27 in Figure 4. In S27, the control device 25 sets correction values ​​ΔX1(i+1) and ΔY1(i+1) to be used in the correction for the next mounting (S13) based on the positional deviation amounts ΔX2(i) and ΔY2(i) acquired in S21. This makes it possible to bring the pick-up position for the part P closer to the ideal position in subsequent mountings.

[0032] The control device 25 sets the next correction value ΔX1(i+1) by multiplying the positional displacement amount ΔX2(i) in the X-axis direction acquired in S21 by a predetermined coefficient k and adding a negative sign (S27). Similarly, the control device 25 sets the next correction value ΔY1(i+1) by multiplying the positional displacement amount ΔY2(i) in the Y-axis direction by a predetermined coefficient k and adding a negative sign. The coefficient k may be a fixed value or a value that is changed according to the number of suction cycles i. As a method for updating the correction value, for example, the method described in International Publication No. WO2020 / 105134 can be adopted.

[0033] Furthermore, the calculation method described above is just one example. For example, the control device 25 may use a value obtained by integrating and averaging past positional deviations and correction values ​​to correct the correction value. Specifically, if the control device 25 has successfully attached the part 10 times in a row, it may integrate (sum) the value obtained by multiplying each of the positional deviations for the past 10 times by the coefficient k, divide the integrated value by the number of suction attempts (10 times in this case), and set the value with a negative sign as the correction value for the 11th time. Also, since the magnitude of the negative pressure air may be unstable at the start of suction, the value of the coefficient k may be gradually decreased in the order of the first suction, second suction, third suction, and so on. In other words, the weight of the coefficient k may be increased the earlier the suction. In addition, in the case of a rotary head that can be fitted with multiple suction nozzles 18, the more suction nozzles 18 that are blocked by suction of the part P, the higher the negative pressure may become and the greater the suction force may become. For this reason, the coefficient k may be changed according to the order of suction at the multiple suction nozzles 18.

[0034] Furthermore, the control device 25 may determine whether the correction values ​​ΔX1(i+1) and ΔY1(i+1) calculated using the coefficient k are within a predetermined tolerance range. If the updated correction values ​​ΔX1(i+1) and ΔY1(i+1) are outside the tolerance range, the control device 25 may set the previous correction values ​​ΔX1(i) and ΔY1(i) or other set values ​​as the correction values ​​ΔX1(i+1) and ΔY1(i+1).

[0035] Next, the control device 25 increases the number of consecutive successes N by one (S29). As a result, the number of consecutive successes N increases by one each time suction is successful (S23: YES), and is reset to zero when the target suction nozzle 18 or tape feeder 13A is replaced (S11: YES) (S15).

[0036] Next, the control device 25 determines whether the number of consecutive successes N is equal to or greater than the specified number TH (S31). If the number of consecutive successes N is equal to or greater than the specified number TH (S31: YES), the control device 25 executes S33 to update the stable value. If the number of consecutive successes N is less than the specified number TH (S31: NO), the control device 25 executes S35.

[0037] In S33, the control device 25 sets the correction values ​​ΔX1(i) and ΔY1(i), i.e., the correction values ​​used for the current adsorption, as the stable values ​​X3 and Y3. Next, the control device 25 updates the specified number of times TH (S37). Therefore, the stable values ​​X3 and Y3 are updated each time the number of consecutive successful attempts N reaches the specified number TH. For example, the specified number of times TH can be set to values ​​such as 4, 16, or 25. In this case, the stable values ​​are updated to the correction values ​​used for adsorption each time the number of consecutive successful attempts N reaches 4, 16, or 25, respectively. The initial value of the specified number of times (e.g., 4) is an example of the first specified number of times in this disclosure. The updated specified number of times TH (e.g., 16 or 25) is an example of the second specified number of times.

[0038] For example, the suction position of component P tends to be unstable in the initial stages after suction begins. Therefore, by updating the stable value after a single-digit number of consecutive successful attempts, such as four or five, suction can be restarted (recovered) using the stable value determined early on, even if a suction error occurs in the initial or early stages. Furthermore, when the number of consecutive successful attempts N reaches double digits or more, the suction position and correction value tend to stabilize to some extent. Therefore, by updating the stable value at an early stage, such as 15 or 16 attempts, a relatively stable value can be determined relatively early. Moreover, as the number of consecutive successful attempts N increases, the correction value converges within a predetermined range. Therefore, by updating the stable value at 25 or more attempts, an even more stable value can be determined.

[0039] The method for updating the stable value described above is just one example. For example, the specified number of times TH for updating the stable value is not limited to the values ​​described above (4 times, 16 times, 25 times). Also, the number of times TH is updated may be once or three or more times. Furthermore, the control device 25 may set the stable value only once and not update it. Also, the control device 25 may update the stable value each time adsorption is successful (S23: YES), i.e., update it every time.

[0040] In S35, the control device 25 corrects the target mounting position (X*, Y*) (see Figure 5) for mounting the component P, which has been adsorbed by the suction nozzle 18, onto the substrate S, using the positional deviation amounts ΔX2(i) and ΔY2(i) acquired in S21. For example, the control device 25 subtracts the positional deviation amount ΔX2(i) in the X-axis direction from the X-coordinate X* of the target mounting position set in the production program and sets it as the corrected X-coordinate X*. Similarly, the control device 25 subtracts the positional deviation amount ΔY2(i) in the Y-axis direction from the Y-coordinate Y* of the target mounting position set in the production program and sets it as the corrected Y-coordinate Y*. In this way, the target mounting position (X*, Y*) can be corrected by offsetting it by the positional deviation amount in the X-axis and Y-axis directions.

[0041] After executing S35, the control device 25 controls the moving mechanism 16 and the head 17 to move the suction nozzle 18 that has adsorbed the component P above the corrected target mounting position (X*, Y*), and lowers the suction nozzle 18 to mount the component P on the substrate S (S39). When the control device 25 executes S39, it executes S41 in FIG. 3.

[0042] In S41, the control device 25 determines whether or not all the mounting of the component P using the target suction nozzle 18 and the tape feeder 13A has been completed. The control device 25 determines the end of mounting, for example, based on the production program. When not all the mountings have been completed (S41: NO), the control device 25 increases the mounting count i by one (S43) and executes the process from S11 again. Thereby, in S13, the target suction position (Xp, Yp) can be corrected using the correction value updated in S27. That is, the correction value can be updated each time of mounting to correct the next target suction position. By feeding back the position deviation amount, the correction value can be converged. When all the mountings have been completed (S41: YES), the control device 25 ends the processes shown in FIGS. 3 and 4.

[0043] Also, as described above, when the control device 25 continuously succeeds in suction and the continuous success count N increases, it updates the stable value (S23: YES, S33). The control device 25 continues the mounting operation while updating the correction value, and sets the correction value at that time as the stable value each time the continuous success count N reaches, for example, 4 times, 16 times, 25 times.

[0044] On the other hand, when the control device 25 determines in S23 that the suction has failed (S23: NO), it initializes the continuous success count N to zero (S25) and executes S47. In S47, the control device 25 sets the stable values X3 and Y3 as the correction values ΔX1(i + 1) and ΔY1(i + 1) to be used for the next suction. The stable value referred to here is the stable value set at this time.

[0045] After executing S47, the control device 25 executes S41. For example, since the adsorption has failed, the control device 25 makes a negative determination in S41 (S41: NO) and executes the operations after S11 to attempt to adsorb and mount the part P that has failed in adsorption again. In this case, the stable values X3 and Y3 are used as the correction values ΔX1(i + 1) and ΔY1(i + 1) for the case of re - execution. Therefore, in the next adsorption operation after the adsorption has failed, the stable values updated until then are used as the initial values of the correction values. Thereby, compared with the case of initializing and restarting the correction values, the adsorption of the part P at the restart can be performed with high accuracy. Also, the correction values can be converged more quickly.

[0046] In the above description, for the sake of avoiding complexity in the explanation, the description has been given for an arbitrary combination of nozzle holders and slots, but it is not limited to this. For example, when imaging a plurality of parts P together after adsorbing them sequentially or together, the processes shown in FIGS. 3 and 4 can also be executed for each tape feeder 13A or for each adsorption nozzle 18.

[0047] Therefore, as described above, when the adsorption in S17 after correction in S13 of the control device 25 of the present embodiment is successful (S23: YES), the control device 25 sets the latest correction values ΔX1(i) and ΔY1(i) updated in S27 as the stable values X3 and Y3 (S33). According to this, when the conditions (such as the specified number of times TH) for updating the stable values X3 and Y3 are satisfied, the correction values being used at that time can be set as the stable values X3 and Y3. The correction values in a state where the adsorption has been successful for a certain number of times or more can be set as the stable values.

[0048] Also, the control device 25 measures the continuous success count N, which is the number of consecutive successful times in the correction in S27 and the adsorption in S17 (S29). When the adsorption in S17 after correction in S27 is successful and the measured continuous success count N is equal to or greater than a predetermined specified number of times TH (S31: YES), the control device 25 sets the stable values X3 and Y3 in S33.

[0049] According to this method, after successfully adsorbing for a specified number of consecutive times TH, values ​​based on the correction values ​​ΔX1(i) and ΔY1(i) can be set as stable values ​​X3 and Y3. By successfully adsorbing consecutively and repeatedly correcting the amount of positional deviation with feedback, the correction values ​​stabilize within a predetermined range. Therefore, by setting stable values ​​based on the correction values ​​at a stage where adsorption has been successful for a certain number of consecutive times, more reliable stable values ​​can be set. In the correction process after adsorption failure, the correction of the adsorption position can be performed with high accuracy, and the recurrence of adsorption errors can be suppressed.

[0050] Furthermore, in S37, the control device 25 updates the specified number of times TH. The control device 25 increases the specified number of times TH by, for example, 4 times, 16 times, and 25 times each time it updates. Therefore, the control device 25 uses a first specified number of times (for example, 4 times) and a second specified number of times that is greater than the first specified number (for example, 16 times, 25 times) as the specified number of times TH. If the control device 25 succeeds in adsorption (S23: YES) and the number of consecutive successes N becomes 4 or more (S31: YES), it sets the stable values ​​X3 and Y3 (S33). Also, in S37, the control device 25 updates the specified number of times TH to 16. Subsequently, if the control device 25 succeeds in adsorption consecutively and the number of consecutive successes N becomes 16 or more (S31: YES), it also updates the stable values ​​X3 and Y3.

[0051] For example, in the initial stages of the component suction process, the negative pressure supplied from the air supply device 23 to the suction nozzle 18 may become unstable, potentially leading to suction errors. Therefore, a stable value is initially set during the initial stages when the negative pressure supply is unstable (e.g., 4 times). Subsequently, the stable value is updated when the suction operation has stabilized to a certain extent (e.g., 16 times). Furthermore, if suction is successful consecutively, the stable value is updated at an even more stable stage (e.g., 25 times). By using multiple specified number of times TH, the stable values ​​X3 and Y3 can be updated in stages according to the circumstances of the suction operation. As suction becomes successful consecutively, the stable values ​​X3 and Y3 can be updated to more reliable values.

[0052] Furthermore, if at least one of the suction nozzle 18 and the tape feeder 13A is replaced (S11: YES), the control device 25 initializes the number of suctions i, the correction values ​​ΔX1(i) and ΔY1(i), the stability values ​​X3 and Y3, and the number of consecutive successes N (S15). The suction nozzle 18 and the tape feeder 13A have equipment-specific characteristics. Therefore, if the correction values ​​and stability values ​​used for one combination of suction nozzle 18 and tape feeder 13A are used for another suction nozzle 18 or tape feeder 13A, there is a risk that the suction position may not be properly corrected. For this reason, when the suction nozzle 18 or tape feeder 13A is replaced, the correction values, stability values, and number of consecutive successes N are initialized, allowing the correction values ​​and stability values ​​to be reset from the beginning. In other words, the correction values ​​and stability values ​​can be optimized to match the characteristics of each piece of equipment.

[0053] Furthermore, the control device 25 uses the parts camera 19 to image the part P that has been picked up by the suction nozzle 18, and based on the captured image, corrects the position at which the suction nozzle 18 will pick up the part P from the tape feeder 13A in subsequent instances using correction values ​​ΔX1(i) and ΔY1(i) corresponding to the positional difference ΔX2(i) and ΔY2(i) between the position of the part P picked up by the suction nozzle 18 and the position of the suction nozzle 18 (S27).

[0054] According to this, the control device 25 can detect positional displacement amounts ΔX2(i) and ΔY2(i) by image processing based on the captured image taken by the parts camera 19, and can set correction values ​​ΔX1(i) and ΔY1(i) based on the detected positional displacement amounts ΔX2(i) and ΔY2(i). The control device 25 corrects the suction position for subsequent operations using the set correction values. This allows the displacement caused by the correction to be fed back into subsequent corrections. By repeating the correction, the correction values ​​can be converged to stable values ​​within a predetermined range, stabilizing the suction position and suppressing the occurrence of suction errors. In addition, stable values ​​X3 and Y3 based on the stable correction values ​​can be stored, and if a suction error occurs, the suction operation can be restarted using those stable values ​​X3 and Y3.

[0055] Incidentally, the correspondence between the terms used in the first embodiment and the terms used in the claims will be explained below. The component mounting device 10 in the first embodiment is an example of a component transfer device. The moving mechanism 16 is an example of a head moving device. The part camera 19 is an example of an imaging device. The process in S13 is an example of a correction process or correction step. The process in S17 is an example of a suction process or suction step. The process in S27 is an example of a correction value update process or correction value update step. The process in S29 is an example of a continuous success count measurement process. The process in S33 is an example of a storage process or storage step. The process in S47 is an example of a setting process or setting step.

[0056] As described above, the first embodiment provides the following effects. In one aspect of this embodiment, the control device 25 controls the moving mechanism 16 to pick up a part P from the part supply device 13 onto the suction nozzle 18 of the head 17 (S17). The control device 25 uses correction values ​​ΔX1(i) and ΔY1(i) based on the position of the part P picked up from the part supply device 13 onto the suction nozzle 18 and the position of the suction nozzle 18 to correct the position at which the suction nozzle 18 will pick up the part P from the part supply device 13 in subsequent instances (S13). The control device 25 updates the correction values ​​each time S17 is executed (S27). If the suction by S17 after executing S27 is successful (S23: YES), the control device 25 stores values ​​based on the correction values ​​ΔX1(i) and ΔY1(i) used in S13 as stable values ​​X3 and Y3 (S33). If the adsorption in S17 fails (S23: NO), the control device 25 sets stable values ​​X3 and Y3 as correction values ​​to be used in S13 after the failure (S47).

[0057] According to this, the control device 25 stores values ​​based on the correction values ​​ΔX1(i) and ΔY1(i) obtained when suction is successful as stable values ​​X3 and Y3. Then, if suction fails (S23: NO), the control device 25 sets the stable values ​​X3 and Y3 as correction values ​​to be used in the correction process after failure (S13). As a result, if suction fails, the component suction process can be restarted using the stable values ​​X3 and Y3 based on the correction values ​​obtained when suction was previously successful. Therefore, the use of the correction values ​​at the time of failure or values ​​based on the correction values ​​can be suppressed, and the failure of suction again can be suppressed.

[0058] (Second Embodiment) Next, a second embodiment of the present disclosure will be described. In the first embodiment described above, in S33 of Figure 4, the correction values ​​ΔX1(i) and ΔY1(i) used for the suction in the round in which S33 was executed were set as the stable values ​​X3 and Y3. In contrast, the second embodiment differs from the first embodiment in that the correction values ​​ΔX1(i-M) and ΔY1(i-M) from the round a predetermined number of return rounds M prior are set as the stable values ​​X3 and Y3. In the following description, the same reference numerals are used for components and processes as in the first embodiment, and their descriptions are omitted as appropriate.

[0059] Figure 6 is a flowchart of the component mounting process in the second embodiment, and is a modified version of the flowchart in Figure 4 of the first embodiment. The control device 25 of the second embodiment executes the processes S11 to S47 shown in Figure 3, similar to the first embodiment. For this reason, Figure 3 will be used in the explanation of the second embodiment. The control device 25 of the second embodiment starts the component mounting process in Figure 3, and if suction is successful in S23 (S23: YES), it executes the process in Figure 6. The control device 25 executes S27 to S31, similar to the first embodiment, and if the number of consecutive successes N is equal to or greater than the specified number TH (S31: YES), it sets the correction values ​​ΔX1(i-M) and ΔY1(i-M) from the previous number of returns M as the stable values ​​X3 and Y3 (S51). Then, in subsequent suction operations, if suction fails (S23: NO), the control device 25 sets the correction values ​​ΔX1(i-M) and ΔY1(i-M) stored in the RAM 34 as correction values ​​ΔX1(i+1) and ΔY1(i+1) to be used for correcting the suction operation after the failure, using the correction values ​​ΔX1(i+1) and ΔY1(i+1) that were used in the previous operation by the number of return operations M from the time when the number of consecutive successes N reached a specified number TH or more (S47 in Figure 3).

[0060] Furthermore, after executing S51 in Figure 6, the control device 25 executes S52. The control device 25 updates the predetermined number of times TH, similar to S37 in the first embodiment. In addition, in S52, the control device 25 updates the number of returns M. The control device 25 increases the number of returns M each time the number of consecutive successes N increases and the number of consecutive successes N becomes equal to or greater than the predetermined number TH, that is, each time the stable value is updated. For example, the control device 25 increases the number of returns to 1, 5, and 7 each time the number of consecutive successes N increases and the predetermined number TH increases to 4, 16, and 25.

[0061] Figure 7 shows a state in which sudden misalignments occur consecutively, ultimately resulting in a suction failure. Figure 7 shows the suction operations performed sequentially from left to right, indicating whether "misalignment," "sudden misalignment," or "suction failure" occurred in each suction operation. The "misalignment" shown in Figure 7 represents the misalignment in suction operations where no sudden misalignment occurred. While this "misalignment" is occurring, the correction values ​​ΔX1(i) and ΔY1(i) converge to stable values ​​within a predetermined range through feedback of the positional misalignment amounts ΔX2(i) and ΔY2(i) described above, allowing stable values ​​X3 and Y3 to be set. On the other hand, as described above, if sudden misalignments occur consecutively, even if no failure occurs in a single suction, the consecutive occurrences can cause the correction values ​​to deviate significantly, resulting in a suction failure. As shown in Figure 7, for example, a sudden misalignment occurs at timing T1, and after five consecutive sudden misalignments, the correction values ​​deviate significantly at timing T3, resulting in a suction failure. Therefore, if the correction values ​​ΔX1(i) and ΔY1(i) from the time when adsorption is successful and the number of consecutive successes N exceeds the specified number TH are stored as stable values ​​X3 and Y3 (for example, stored at timing T2 in Figure 7), then those correction values ​​may already include the amount of deviation due to sudden deviations. If adsorption is reattached using stable values ​​X3 and Y3 after an adsorption failure occurs, there is a possibility that another adsorption failure will occur because correction values ​​containing sudden deviations were used.

[0062] Therefore, in the second embodiment, when the number of consecutive successful attempts N exceeds a predetermined number TH, the control device 25 stores the correction values ​​ΔX1(i-M) and ΔY1(i-M) from the previous attempt as stable values ​​X3 and Y3 for the number of return attempts M, thereby preventing sudden deviations from being fed back. For example, as shown in Figure 7, if sudden deviations occur five times in a row and suction errors occur, the number of return attempts M can be set to a number of 6 or more.

[0063] If the number of return steps M is set to 6, the control device 25 will always store, for example, the correction values ​​ΔX1(i-1) to (i-6) and ΔY1(i-1) to (i-6) for the past 6 steps, and when S51 is executed, it will set the correction values ​​ΔX1(i-6) and ΔY1(i-6) from 6 steps prior as the stable values ​​X3 and Y3. This makes it possible to set correction values ​​that are not affected by sudden deviations as the stable values ​​X3 and Y3.

[0064] Furthermore, the control device 25 increases the number of return attempts M as the number of consecutive successful suction attempts N increases (S52). The more consecutive successful suction attempts N there are, the more return attempts M can be made (for example, 6 times, 12 times, etc.). As the number of consecutive successful suction attempts N increases, the correction value stabilizes within a predetermined range, so it is preferable to increase the number of return attempts M to return to a point where no sudden deviations occur, more reliably. Therefore, the number of return attempts M may be increased in accordance with the increase in the number of consecutive successful suction attempts N (specified number TH). This makes it possible to more reliably retain correction values ​​that are not affected by sudden deviations as stable values ​​X3, Y3. The control device 25 may also use a fixed value for the number of return attempts M. In this case, the control device 25 does not need to update the number of return attempts M in S52. Also, if the control device 25 updates the stable values ​​X3, Y3 each time suction is successful, the number of return attempts M may be gradually increased as the number of consecutive successful suction attempts N increases.

[0065] Incidentally, the correspondence between the terminology used in the second embodiment and the terminology used in the claims will be explained below. In the second embodiment, S47 in Figure 3, which is reused, is an example of the setting process.

[0066] As described above, the second embodiment provides the same effects as the first embodiment. Furthermore, the second embodiment provides the following effects. In one aspect of this embodiment, the control device 25, when suction fails (S23: NO), sets the correction values ​​ΔX1(i-M) and ΔY1(i-M) used in the suction process a predetermined number of return cycles M from the suction process that failed as the correction values ​​ΔX1(i+1) and ΔY1(i+1) used in the correction process after the failure (S47). This allows correction values ​​that are not affected by sudden deviations to be set as stable values ​​X3 and Y3, and suppresses the occurrence of suction errors after recovery.

[0067] It goes without saying that this disclosure is not limited to the embodiments described above, and various improvements and modifications are possible without departing from the spirit of this disclosure. For example, the processing content of each step and the order of steps in the flowcharts shown in Figures 3, 4, and 6 of the embodiments described above are examples and can be changed as appropriate. For example, if the relationship between each of the multiple suction nozzles 18 attached to the head 17 and the tape feeder 13A that goes to pick up the part P is fixed, the control device 25 may determine in S11 whether or not the suction nozzle 18 that picks up the part P of the target tape feeder 13A has been replaced. That is, the control device 25 may determine only whether or not the suction nozzle 18 that picks up the part P of the target tape feeder 13A has been replaced, rather than determining whether or not all of the suction nozzles 18 attached to the head 17 have been replaced. Furthermore, if at least one of the suction nozzle 18 and the tape feeder 13A is replaced (S11: YES), the control device 25 does not need to initialize the suction count i, correction values ​​ΔX1(i) and ΔY1(i), stability values ​​X3 and Y3, and consecutive success count N. Alternatively, the control device 25 may initialize only the stability values ​​X3 and Y3 and consecutive success count N without initializing the suction count i and correction values ​​ΔX1(i) and ΔY1(i). Or, the control device 25 may initialize only one of the stability values ​​X3 and Y3 or the consecutive success count N. Also, the control device 25 may update the stability values ​​X3 and Y3 by executing S31 and S33 after performing the correction in S35 and the mounting in S39. In addition, the control device 25 has set the correction values ​​ΔX1(i) and ΔY1(i) for that suction count as the stability values ​​X3 and Y3 in S33, but is not limited to this. For example, the control device 25 may set stable values ​​X3 and Y3 using past correction values ​​and weighting coefficients, etc. That is, it may set values ​​calculated from correction values ​​as stable values. Also, in S47, the control device 25 sets the stable values ​​X3 and Y3 at that time as the correction values ​​ΔX1(i+1) and ΔY1(i+1) for the next adsorption, but is not limited to this. For example, the control device 25 may set the correction values ​​for the next adsorption using past stable values ​​and weighting coefficients, etc.Furthermore, in each of the above embodiments, the correction values ​​and stability values ​​were updated for the same combination of suction nozzle 18 and tape feeder 13A, but this is not limited to this. For example, the control device 25 may update the correction values, etc., for the same tape feeder 13A. In this case, the control device 25 may only decide to replace the tape feeder 13A in S11. Similarly, the control device 25 may update the correction values, etc., for the same suction nozzle 18.

[0068] Furthermore, in each of the above embodiments, a moving mechanism 16 which is an XY robot is used as the head moving device of the present disclosure, but it is not limited to this. For example, the head moving device of the present disclosure may be an articulated robot that moves the head 17. Alternatively, a parts camera 19 may be attached to the head 17. Also, in each of the above embodiments, a tape feeder 13A is used as the parts supply device of the present disclosure, but it is not limited to this. The parts supply device may be a device capable of supplying other parts P. For example, the parts supply device of the present disclosure may be a tray-type supply device that supplies parts P by placing them on a tray. Alternatively, the parts supply device may be a device that picks up and inverts arbitrary chip parts from a plurality of chip parts cut from a wafer and supplies them. Also, the parts transfer device of the present disclosure is not limited to a parts mounting device 10. For example, the parts transfer device may be a device that moves parts P received from the parts supply device to a destination other than the substrate S. For example, if the component supply device is a device that supplies chip components from a wafer, the component transfer device may be a device that transfers the chip components picked up from the component supply device to a shuttle that transports chip components.

[0069] Furthermore, the scope of this disclosure is not limited to the dependencies described in the claims. For example, this specification also discloses a technical concept in which "the component transfer device described in claim 3" is changed to "the component transfer device described in claim 3 or claim 4" in claim 5. Also, this specification also discloses a technical concept in which "the component transfer device described in claim 1 or claim 2" is changed to "the component transfer device described in any one of claims 1 to 5" in claim 6.

[0070] 10 Component mounting device (component transfer device), 13 Component supply device, 13A Tape feeder (component supply device), 16 Moving mechanism (head moving device), 17 Head, 18 Suction nozzle, 19 Part camera (imaging device), 25 Control device, N Number of consecutive successful attempts, M Number of returns, P Component, TH Specified number of attempts (1st specified number of attempts, 2nd specified number of attempts), ΔX1(i), ΔY1(i) Correction value, X3, Y3 Stability value, ΔX2(i), ΔY2(i) Positional deviation amount.

Claims

1. A component transfer device comprising: a head that picks up a component using a suction nozzle; a component supply device that supplies the component to the head; a head moving device that moves the head; and a control device, wherein the control device performs: an adsorption process that controls the head moving device to pick up the component from the component supply device to the suction nozzle of the head; a correction process that uses a correction value based on the position of the component picked up from the component supply device to the suction nozzle by the adsorption process and the position of the suction nozzle to correct the position at which the suction nozzle picks up the component from the component supply device in subsequent instances; a correction value update process that updates the correction value in accordance with the execution of the adsorption process; a storage process that, if the adsorption by the adsorption process after the execution of the correction process is successful, stores a value based on the correction value used in the correction process as a stable value; and a setting process that, if the adsorption by the adsorption process fails, sets the stable value as the correction value to be used in the correction process after the failure.

2. The component transfer device according to claim 1, wherein, if the adsorption process after the correction process is successful, the control device sets the latest correction value updated by the correction value update process as the stable value.

3. The component transfer device according to claim 1 or 2, wherein the control device performs a continuous success count measurement process, which measures the number of consecutive successful suctions performed by the suction process after the correction process has been executed, and when the suction process after the correction process has been executed is successful and the number of consecutive successful suctions measured by the continuous success count measurement process is equal to or greater than a predetermined number, the device performs the storage process.

4. The component transfer device according to claim 3, wherein the control device uses a first predetermined number of times and a second predetermined number of times greater than the first predetermined number of times as the predetermined number of times, and when the suction process after the correction process is successful and the number of consecutive successes measured by the consecutive success count measurement process is equal to or greater than the first predetermined number of times, it executes the storage process, and when the suction process after the correction process is successful and the number of consecutive successes measured by the consecutive success count measurement process is equal to or greater than the second predetermined number of times, it executes the storage process and updates the stable value.

5. The component transfer device according to claim 3, wherein the control device initializes the correction value, the stability value, and the number of consecutive successes when at least one of the suction nozzle and the component supply device is replaced.

6. The component transfer device according to claim 1 or 2, further comprising an imaging device for imaging the component adsorbed by the suction nozzle, wherein the control device images the component adsorbed by the suction nozzle using the imaging device, and in the correction process, corrects the position at which the suction nozzle will pick up the component from the component supply device in subsequent instances, using a correction value corresponding to the amount of positional deviation between the position of the component adsorbed by the suction nozzle and the position of the suction nozzle, based on the captured image.

7. A component transfer device comprising: a head that picks up a component using a suction nozzle; a component supply device that supplies the component to the head; a head moving device that moves the head; and a control device, wherein the control device performs: an adsorption process that controls the head moving device to pick up the component from the component supply device to the suction nozzle of the head; a correction process that uses a correction value based on the position of the component picked up from the component supply device to the suction nozzle by the adsorption process and the position of the suction nozzle to correct the position at which the suction nozzle picks up the component from the component supply device in subsequent instances; a correction value update process that updates the correction value in accordance with the execution of the adsorption process; and, if the adsorption by the adsorption process fails, a setting process that sets the correction value used in the previous adsorption process a predetermined number of return steps from the failed adsorption process as the correction value to be used in the correction process after the failure.

8. The component transfer device according to claim 7, wherein the control device increases the number of return cycles as the number of consecutive successful suctions by the suction process after the correction process increases.

9. A part transfer method in a part transfer device comprising: a head for picking up parts with a suction nozzle; a part supply device for supplying parts to the head; and a head moving device for moving the head, the method comprising: a suction step of controlling the head moving device to pick up the parts from the part supply device to the suction nozzle of the head; a correction step of correcting the position at which the suction nozzle picks up the parts from the part supply device in subsequent instances using a correction value based on the position of the parts picked up from the part supply device to the suction nozzle by the suction step and the position of the suction nozzle; a correction value update step of updating the correction value in accordance with the execution of the suction step; a storage step of storing a value based on the correction value used in the correction step as a stable value if the suction by the suction step after the execution of the correction step is successful; and a setting step of setting the stable value as the correction value to be used in the correction step after the suction by the suction step fails.

Images