Electronic module and method for manufacturing electronic module

Abstract

The main purpose of the present technology is to provide a technique with which it is possible to reduce the incidence of electrical connection failure between an electronic device within an electronic module and an external power supply electrode, which could occur due to a temperature change (TC cycle) occurring during manufacturing of the electronic module.　As a result of intensive studies, the present inventors have found that, by installing a wire for electrically connecting an electronic device attached to a substrate and an external power supply electrode such that the wire penetrates a rib for supporting a lid body provided so as to face the electronic device, it is possible to reduce the stress applied to a wire neck, which is a connection portion where the wire connects to the electronic device, in the course of a temperature change occurring during manufacturing of an electronic module.

Description

Electronic module and method for manufacturing an electronic module

[0001] The present technology relates to an electronic module and a method for manufacturing an electronic module. More specifically, it relates to an electronic module including a wire that electrically connects an electronic device attached to a substrate and an external power supply electrode, and a method for manufacturing the same.

[0002] Conventionally, a technique for electrically connecting an electronic module attached to a substrate and an external power supply electrode with a wire has been known.

[0003] For example, Patent Document 1 below discloses an iBGA sensor package structure provided with connection pads, in which the ends of wires (gold wires) are embedded inside a bonding layer.

[0004] Japanese Patent Application Laid-Open No. 2018-6760

[0005] The main object of the present technology is to provide a technology capable of reducing the occurrence of poor electrical connection between an electronic device in an electronic module and an external power supply electrode that may occur due to temperature changes (TC cycle) during the manufacture of the electronic module.

[0006] As a result of intensive research, the inventors have found that by installing a wire that electrically connects an electronic device attached to a substrate and an external power supply electrode through a rib that supports a lid provided so as to face the electronic device, during the process of temperature change that occurs during the manufacture of the electronic module, the stress applied to the wire neck, which is the connection portion of the wire with the electronic device, can be reduced.

[0007] In other words, this technology provides an electronic module comprising a substrate having a first main surface and a second main surface, an electronic device attached to the first main surface, a cover provided facing the electronic device, ribs supporting the cover, an external power supply electrode, and a wire electrically connecting the electronic device and the external power supply electrode, wherein the wire is installed passing through the ribs. It is preferable that the wire neck, which is the connection portion between the wire and the electronic device, is exposed. In the electronic module of this technology, the resin constituting the ribs may not cover the electronic device. In the electronic module of this technology, the ribs may be a laminated structure consisting of a base rib and one or more upper ribs. In this case, the area of ​​the surface of the base rib facing the cover may be larger than the area of ​​the portion of the upper rib in contact with the base rib, and the area of ​​the surface of the upper rib in contact with the base rib may be larger than the area of ​​the surface of the base rib facing the cover. In the electronic module of this technology, the ribs may consist of a single layer. In the electronic module of this technology, the ribs may be provided on the substrate. In this case, the ribs and the electronic device do not need to be in contact. Alternatively, the electronic module may be provided with a die-bonding resin for attaching the electronic device to the first main surface, and the ribs and the die-bonding resin may not be in contact. The surface of the electronic device facing the cover may be located closer to the surface of the cover than the surface of the base rib facing the cover. Furthermore, the surface of the base rib facing the cover may be located closer to the surface of the cover than the surface of the electronic device facing the cover. In the electronic module of this technology, a resin layer having a wiring layer inside may be provided, and the electrical connection between the electronic device and the external power supply electrode by the wire may be made via the wiring layer. In the electronic module of this technology, the ribs may be a laminated structure consisting of a base rib and one or more upper ribs, and the base rib may also serve as the resin layer. In this case, the surface of the base rib facing the cover and the surface of the electronic device facing the cover may be on substantially the same plane.The electronic module of this technology may further include a sealing layer that seals the electronic device by covering at least a portion of the outer surface of the rib. The electronic module of this technology may have a plurality of solder bumps formed on the second main surface of the substrate.

[0008] Next, the present technology provides a method for manufacturing an electronic module, comprising: providing annular base ribs on the outside of an area on a substrate equipped with an external power supply electrode where an electronic device is provided; then installing the electronic device; installing wires to electrically connect the electronic device and the external power supply electrode; providing one or more upper ribs on the base ribs so as not to cover the wire neck, which is the connection portion between the wire and the electronic device; and installing a cover on the upper ribs. In the method for manufacturing an electronic module of the present technology, the upper ribs may be formed by inkjet. In the method for manufacturing an electronic module of the present technology, a sealing layer may be provided to cover the outer surface of the upper ribs. Furthermore, the present technology also provides a method for manufacturing an electronic module, comprising: providing annular base ribs on the outside of an electronic device on a substrate equipped with an external power supply electrode; installing wires to electrically connect the electronic device and the external power supply electrode; providing one or more upper ribs on the base ribs so as not to cover the wire neck, which is the connection portion between the wire and the electronic device; and installing a cover on the upper ribs.

[0009] This is a schematic diagram showing an example of the overall configuration of the electronic module of this technology. This is an image diagram of an example of the first embodiment of the electronic module of this technology, viewed from the side. This is an image diagram of an example of the first embodiment of the electronic module of this technology, viewed from above. This is an image diagram of the manufacturing process of the first embodiment of the electronic module of this technology. This is an image diagram of the manufacturing process of the first embodiment of the electronic module of this technology. This is an image diagram of the manufacturing process of the first embodiment of the electronic module of this technology. This is an image diagram of the manufacturing process of the first embodiment of the electronic module of this technology. This is an image diagram of the manufacturing process of the first embodiment of the electronic module of this technology. This is an image diagram of the manufacturing process of the first embodiment of the electronic module of this technology. This is an image diagram of the manufacturing process of the first embodiment of the electronic module of this technology, viewed from the side. This is an image diagram of a second variation of the first embodiment of the electronic module of this technology, viewed from the side. This is an image diagram of a third variation of the first embodiment of the electronic module of this technology, viewed from the side. This is an image diagram of an example of the second embodiment of the electronic module of this technology, viewed from the side. This is an image diagram of the manufacturing process of the second embodiment of the electronic module of this technology. This is an image diagram of the manufacturing process of the second embodiment of the electronic module of this technology. This is an image diagram of the manufacturing process of the second embodiment of the electronic module of this technology. This is an image diagram of the manufacturing process of the second embodiment of the electronic module of this technology. This is an image diagram illustrating the manufacturing process of the second embodiment of the electronic module of this technology. This is an image diagram illustrating the manufacturing process of the second embodiment of the electronic module of this technology. This is an image diagram illustrating an example of the third embodiment of the electronic module of this technology, viewed from the side. This is an image diagram illustrating an example of the fourth embodiment of the electronic module of this technology, viewed from the side. This is an image diagram illustrating an example of the fifth embodiment of the electronic module of this technology, viewed from the side. This is an image diagram illustrating an example of the sixth embodiment of the electronic module of this technology, viewed from the side. This is an image diagram illustrating the manufacturing process of the sixth embodiment of the electronic module of this technology. This is an image diagram illustrating the manufacturing process of the sixth embodiment of the electronic module of this technology. This is an image diagram illustrating the manufacturing process of the sixth embodiment of the electronic module of this technology.This is a schematic diagram illustrating the manufacturing process of the sixth embodiment of the electronic module of this technology.

[0010] Preferred embodiments of the present technology are described below. However, the embodiments shown below are merely examples of typical embodiments of the present technology, and the present technology is not limited to these preferred embodiments, but can be freely modified within the scope of the present technology.

[0011] [Electronic Module] As shown in the schematic diagram of Figure 1, the electronic module according to this technology comprises a substrate 11 having a first main surface and a second main surface, an electronic device 12 attached to the first main surface, a cover 13 provided facing the electronic device 12, ribs 14 supporting the cover 13, an external power supply electrode 15, and wires 16 electrically connecting the electronic device 12 and the external power supply electrode 15. The electronic module 10 may further include a sealing layer 17 that seals the electronic device 12 by covering at least a portion of the outer surface of the ribs 14. Furthermore, it can also take the form of a so-called ball grid array (BGA) configuration in which a plurality of solder bumps are provided on the second main surface of the substrate 11.

[0012] In this specification, "electrically connected" means connected in a way that allows current to flow. That is, when a wire electrically connects an electronic device to an external power supply electrode, it is not limited to cases where the wire directly joins the electronic device to the external power supply electrode in a way that allows current to flow, but also includes cases where the wire connects the electronic device to the external power supply electrode via a conductive part in a way that allows current to flow.

[0013] In this technology, the electronic module 10 seals an electronic device 12, such as an image sensor, mounted on the first main surface of the substrate 11, with ribs 14 or a sealing layer 17, and a cover 13 is provided on the ribs 14 so as to face the electronic device 12, thereby forming a cavity, which is a semi-sealed space surrounding the electronic device 12. By forming a cavity, the electronic device such as the image sensor is physically protected from the outside, and foreign matter such as dust is prevented from entering the electronic module, thereby suppressing failure and deterioration of the electronic device.

[0014] In electronic modules, the electronic device inside the cavity is electrically connected to an external power supply electrode outside the cavity via wires, enabling the electronic device to function optimally. Therefore, reducing the occurrence of electrical connection failures between the electronic device and the external power supply electrode is crucial for the electronic device to perform its intended function. In particular, temperature changes (TC cycles) that occur during the manufacturing process of electronic modules can cause changes in the stress applied to the wire neck, which is the connection point between the wire and the electronic device. Reducing the electrical connection failures between the electronic device and the external power supply electrode that can result from this is important.

[0015] In the electronic module 10 of this technology, the wire 16 is installed by passing through the rib 14, so that the wire neck, which is the connection point between the wire 16 and the electronic device 12, is not covered by the resin or the like that forming the rib 14. This reduces the stress applied to the wire neck due to the expansion or contraction of the resin or the like that forming the rib 14 caused by temperature changes (TC cycle) that occur during the manufacturing process of the electronic module. As a result, it is possible to suppress the occurrence of electrical connection failures between the electronic device and the external power supply electrode caused by this.

[0016] In the electronic module 10 of this technology, the wire 16 is installed by passing through the rib 14 so that the wire neck is not covered by the resin or the like that forming the rib 14. However, from the viewpoint of reducing the stress applied to the wire neck, it is more preferable that the wire neck be exposed. Here, "exposed wire neck" means a state in which the wire neck is not protected by resin or the like and is directly exposed to the inside of the cavity.

[0017] The following provides a more detailed explanation of each element that constitutes the electronic module related to this technology.

[0018] <Substrate> In the electronic module of this technology, "substrate" refers to a printed circuit board for mounting electronic components such as elements and frames of electronic devices and for wiring. As the material for forming the substrate, known synthetic resins that can be used as materials for forming substrates used in electronic modules, such as epoxy resin, phenolic resin, polyimide, and glass cloth, can be suitably used.

[0019] The circuit board of the electronic module of this technology may have multiple solder bumps or connector terminals arranged on the back side (the side of the second main surface) of the surface on which the electronic device is mounted, as external connection terminals.

[0020] Furthermore, the substrate of the electronic module of this technology may have a wiring layer (also called a "Through Mold Via") formed inside. This "wiring layer" is a conductive layer provided so as to penetrate the inside of the resin layer of the substrate. For example, if the wiring layer is provided so as to penetrate the substrate in a vertical direction, an element attached to the first main surface of the substrate, such as an electronic device, and an external connection terminal such as a solder bump provided on the back side (second main surface side) of the substrate can be electrically connected in a vertical direction. This contributes to multilayering, high-density mounting, and improved performance through shortening of electrical signals.

[0021] <Electronic Devices> "Electronic devices" are elements that constitute a part of the electronic circuit of the electronic module of this technology, and in the electronic module of this technology, they are attached to the surface side (first main surface side) of the substrate. There are no particular limitations on the "electronic devices" that can be used in the electronic module of this technology, but examples include integrated circuits (ICs). Furthermore, as integrated circuits, for example, image sensors, FPGAs, etc., can be suitably used for any application.

[0022] Here, an "image sensor" is a device that receives light and converts the amount of light into an electrical signal. Examples of image sensors include CCDs (Charge-Coupled Devices) and CMOS image sensors.

[0023] The method of attaching the electronic device to the surface side (first main surface side) of the substrate is not particularly limited, and it can be attached in any way. For example, it can be attached using any die bond resin (Die Bond resin / DB resin) that can bond the two together. When attaching the electronic device to the first main surface using die bond resin, the die bond resin used can preferably have any properties such as thermal conductivity and electrical insulation, in addition to fixing the electronic device to the substrate, depending on the characteristics of the electronic module.

[0024] <Cover> In the electronic module of this technology, the "cover" is a cover for protecting the electronic devices and substrates placed inside the electronic module, and can protect the inside of the electronic module from external physical influences and environmental factors.

[0025] In the electronic module of this technology, when an image sensor is used as an electronic device, the cover is preferably made of a transparent material because the image sensor receives light from the outside. Suitable transparent materials include known materials that can be used as transparent materials for electronic modules, such as glass (silica glass, quartz glass, sapphire glass, etc.), acrylic resin, polycarbonate resin, and polymethyl methacrylate resin (PMMA).

[0026] <Ribs> In the electronic module of this technology, "ribs" are members that support the cover and are formed to surround the electronic device. Here, "formed to surround the electronic device" includes not only cases where the ribs are formed to surround the electronic device from the outside, but also cases where they are formed on the electronic device, along the outer edge of the electronic device, as shown in the form in Figure 6 described later.

[0027] Furthermore, as described above, the electronic device is sealed with this rib or the sealing layer described later, forming a cavity together with the lid, which physically protects the electronic device from the outside, prevents foreign matter such as dust from entering the electronic module, and suppresses failure and deterioration of the electronic device.

[0028] In the electronic module of this technology, as described above, the wire that electrically connects the electronic device inside the cavity to the external power supply electrode outside the cavity is installed by passing it through the rib, so that the wire neck, which is the connection part of the wire to the electronic device, is not covered by the resin or other material that makes up the rib. This reduces the change in stress applied to the wire neck due to temperature changes (TC cycle) that occur during the manufacturing process of the electronic module, and is expected to reduce electrical connection failures between the electronic device and the external power supply electrode that may occur as a result.

[0029] In the electronic module of this technology, when a wire is installed by passing it through a rib, it is more preferable to leave the wire neck uncovered by the resin or the like that forming the rib (the wire neck is exposed), thereby reducing the stress applied to the wire neck due to the expansion or contraction of the resin or the like.

[0030] The shape of the ribs in the electronic module of this technology is not particularly limited, as long as the shape allows the wire to pass through the ribs. As a shape that can suitably support the lid, allow the wire to pass through the ribs, and prevent the wire neck from being covered by the resin or the like that forming the ribs, for example, a tapered shape can be adopted in the portion where the wire passes through the ribs. For example, when the resin that constitutes the ribs in the portion where the wire passes through the ribs is placed near the wire neck, by making this portion tapered, the ribs can suitably support the lid, and a state in which the wire neck is not covered by the resin or the like that forming the ribs can be suitably achieved.

[0031] In the electronic module of this technology, the resin constituting the ribs may or may not cover a portion of the surface of the electronic device. If the resin constituting the ribs does not cover the surface of the electronic device, the top surface of the electronic device can be effectively utilized. In this case, for example, if an image sensor is used as the electronic device, the yield of image sensors obtained from each silicon wafer can be increased, potentially leading to a reduction in the manufacturing cost of the electronic module.

[0032] Furthermore, in the electronic module of this technology, the ribs and the electronic device may be formed in contact, or they may be formed separately and not in contact. When the ribs and the electronic device are formed in contact, the resin constituting the ribs may be in contact with the electronic device. When the ribs and the electronic device are formed separately and not in contact, the resin constituting the ribs will not be in contact with the electronic device.

[0033] In the electronic module of this technology, the ribs may be provided on the electronic device or on the substrate. In the electronic module of this technology, if the ribs are provided on the substrate, they may be formed in contact with the electronic device, or they may be formed at a distance from the electronic device without contact.

[0034] In the electronic module of this technology, when a configuration is adopted in which the ribs and electronic devices are formed separately without contact, for example, the die bond resin to which the electronic device is attached to the first main surface and the resin constituting the ribs can be positioned separately without contact. As a result, the die bond resin can avoid absorbing moisture from the resin constituting the ribs, and the amount of moisture absorbed from outside the cavity can be reduced. This can suppress the occurrence of cracks at the joint surface between the electronic device and the substrate due to changes in stress applied to the electronic module when the electronic module is exposed to environmental changes. Furthermore, because the resin constituting the ribs and the electronic device are separated, the shrinkage of the resin constituting the ribs due to temperature changes that occur during the manufacturing of the electronic module can be transmitted to the electronic device, and the occurrence of cracks in the electronic device can be suppressed.

[0035] The ribs used in the electronic module of this technology may be formed from a single layer, or they may be formed as a laminated structure consisting of a base rib and one or more upper ribs.

[0036] If the electronic module of this technology has a laminated structure consisting of a base rib and one or more upper ribs, for example, by providing the base rib up to a position close to the height at which the wire will be placed before the step of connecting the wire and the electronic device to form the wire neck, the height and shape of the upper rib can be adjusted after the wire neck is formed so that the wire passes through the rib, thereby efficiently forming the rib of this technology. Furthermore, because the height of the ribs can be easily adjusted, the height of the ribs supporting the lid of the electronic module can be more easily aligned, thus preventing the lid from being positioned at an angle.

[0037] Here, the term "laminated structure consisting of a base rib and one or more upper ribs" is not limited to cases where one upper rib is formed on top of the base rib, resulting in a rib with two layers, but also includes cases where multiple upper ribs are formed on top of the base rib, resulting in a rib with three or more layers.

[0038] When the ribs of the electronic module of this technology are arranged in a laminated structure consisting of a base rib and one or more upper ribs, the area of ​​the surface of the base rib facing the cover may be larger than the area of ​​the portion of the upper rib that contacts the base rib. In this case, when the substrate is viewed from above, the upper ribs, which have a relatively smaller area, are formed in a pyramidal shape on top of the base rib, which has a larger area. In this case, the amount of resin per unit horizontal cross-sectional area used for the upper rib can be less than the amount of resin used for the base rib, making it easier to adjust the height and shape of the upper rib after the wire neck is formed so that the wire passes through the rib, thus enabling efficient formation of the rib of this technology. Furthermore, since the cross-sectional area of ​​the surface of the upper rib facing the cover is smaller than the area of ​​the upper surface of the base rib, contamination of the interface layer formed on the substrate when forming the upper rib can be suppressed.

[0039] Conversely, the ribs of the electronic module of this technology may be configured such that the area of ​​the surface of the upper rib in contact with the base rib is larger than the area of ​​the surface of the base rib facing the cover. In this case, when the substrate is viewed from above, an upper rib with a relatively larger area than the base rib is formed on top of the base rib, extending beyond the base rib. In the electronic module of this technology, if, for example, an image sensor is used as the electronic device, flare that may be generated by light incident on the electronic module from an oblique direction can be suppressed by adjusting the area of ​​the upper rib.

[0040] In the case where the ribs of the electronic module of this technology have a laminated structure consisting of a base rib and one or more upper ribs, the ribs may be formed such that the surface of the electronic device on which the electronic module is located facing the cover is closer to the surface of the cover than the surface of the base rib facing the cover. In this case, since the height of the base rib is physically lower than that of the electronic device, it is possible to suppress the bleeding of the resin constituting the rib onto the surface (pixel surface) of the electronic device, which is located higher than the base rib, during the manufacturing of the electronic module (particularly the process of forming the base rib).

[0041] On the other hand, when the ribs of the electronic module of this technology have a laminated structure consisting of a base rib and one or more upper ribs, the ribs may be formed such that the surface of the base rib facing the cover is closer to the surface of the cover of the electronic device than the surface of the cover facing the cover of the electronic device. In this case, the height of the base rib becomes physically higher than that of the electronic device, and the proportion of the height of the upper ribs formed during the manufacturing of the electronic module to the overall height of the electronic module becomes relatively low, making it easier to adjust the height of the ribs. As a result, the heights of the ribs supporting the cover of the electronic module are more easily aligned, which can suppress the tilting of the cover.

[0042] In the electronic module of the present technology, when the rib used is formed from a single layer, the rib may be formed on the substrate or on the electronic device. When forming a rib on the electronic device, since the formation of the rib can be started from a position near the height where the wire is provided, it becomes easier to adjust the height and shape of the rib so that the wire penetrates the rib even without the aforementioned base rib. Also, similar to the case of providing a base rib, since the adjustment of the height of the rib becomes easy, the heights of the ribs that support the lid of the electronic module are likely to be uniform, and it is possible to suppress the lid from being tilted.

[0043] Also, the method for manufacturing the rib used in the electronic module of the present technology is not particularly limited. For example, it can be formed using any method such as inkjet, molding, potting, injection molding, transfer molding, liquid encapsulation method, etc.

[0044] For example, by forming the rib provided in the electronic module of the present technology by inkjet, the position of the ink ejected from the nozzle of the inkjet, the number of ejection times, and the discharge amount from the nozzle can be suitably adjusted, so that the rib can be suitably formed at the target position in the target shape. Therefore, it is easy to adjust the height and shape of the rib so that the wire penetrates the rib. Also, by adjusting the height of the rib provided in the electronic module of the present technology by inkjet, surface tension acts at the portion where the resin constituting the rib contacts the wire surface, and the wire neck can be adjusted to a state where it is not covered with the resin constituting the rib. Furthermore, when the rib has a laminated structure composed of a base rib and one or more upper ribs, by forming the upper rib by inkjet, it becomes easier to adjust the height of the rib, and it becomes easier to make the heights of the ribs that support the lid of the electronic module uniform. In this case, after coating by inkjet, the rib can be suitably formed by curing under any conditions according to the characteristics of the resin constituting the rib.

[0045] The resin constituting the ribs that can be used in the electronic module of this technology can be any resin that can be used in an electronic module, in accordance with the manufacturing method of the ribs described above. Examples include thermosetting resins such as phenolic resins, silicone resins, acrylic resins, epoxy resins, urethane resins, silicon resins, and polyetheramide resins; thermoplastic resins such as polyamide-imide, polypropylene, and liquid crystal polymers; photosensitive resins such as UV (ultraviolet) curable resins, which are acrylic resins; rubber; and other known resins. These resins may be used individually or in combination of multiple types.

[0046] Furthermore, in the electronic module of this technology, the resin constituting the ribs may contain fillers such as silicon oxide or alumina. The resin may also be prepared to have light-shielding properties. Specifically, the resin may contain black pigments such as carbon black or titanium black. In this case, the ribs of the electronic module of this technology will be black and will have light-shielding properties. This makes it possible to avoid or reduce, for example, the reception of unintended light by the image sensor due to light reflected from the ribs, if the electronic device in the electronic module of this technology is an image sensor.

[0047] If the ribs of the electronic module of this technology have a laminated structure consisting of a base rib and one or more upper ribs, the resin constituting the base rib and the resin constituting each of the one or more upper ribs may be formed using different resins for each layer, or all or some of the layers of the ribs of the electronic module of this technology may be formed using the same resin.

[0048] The electronic module of the present technology includes a resin layer having a wiring layer inside, and the electrical connection between the electronic device by wire and the external power supply electrode may be made via the wiring layer. This "wiring layer" is a conductive layer provided so as to penetrate the inside of the resin layer. In this specification, when the wiring layer penetrates linearly inside the resin layer, the wiring layer is also referred to as a "through via". The position where the wiring layer is provided can be provided inside the substrate included in the electronic module, inside the rib, etc., according to the characteristics of the electronic module to be manufactured.

[0049] In the electronic module of the present technology, when the wiring layer is provided inside the rib, for example, the rib can be formed into a laminated structure including a base rib and one or more upper ribs, and the base rib can also serve as the resin layer in which the wiring layer is provided. For example, by providing the wiring layer as a through via so as to penetrate the base rib, which is a resin layer, vertically, the connection terminal arranged on the upper surface of the base rib and the connection terminal arranged on the lower surface (connection point with the external power supply electrode) can be electrically connected vertically. This contributes to multi-layerization, high-density mounting, and high performance improvement due to shortening of electrical signals. In particular, as shown in FIG. 12, by providing the wiring layer (through rib) provided inside the base rib at a position where it can be directly connected to the external power supply electrode, the vertical electrical connection from the external power supply electrode to the upper surface of the base rib can be preferably made.

[0050] As described above, when the base rib also serves as the resin layer in which the wiring layer is provided, for example, by making the surface of the base rib facing the lid (the upper surface of the base rib when the electronic module is placed) and the surface of the electronic device facing the lid (the upper surface of the electronic device when the electronic module is placed) be on substantially the same plane, the heights of two points (the end of the wiring layer in the base rib and the connection point of the electronic device) physically connected by wire can be made the same. Thereby, when physically connecting two points with different heights by wire, the frequency of occurrence of connection failure that may occur due to bending of the wire or the like can be reduced.

[0051] <Wires> The wires in the electronic module of this technology are conductive members that electrically connect the electronic device to the external power supply electrode described later and function as a pathway for electrical signals. The electronic module of this technology may have multiple wires, corresponding to the number of terminals on the electronic device. In this specification, "wire" includes not only metal wires formed independently of the substrate, which can be used for wire bonding, etc., but also conductive patterns, lines, and other conductors formed on the substrate.

[0052] The wires in the electronic module of this technology are not particularly limited, as long as they can electrically connect the electronic device and the external power supply electrode. The wires can be made from any highly conductive material, such as Au, Pt, Cu, Ag, Ni, Al, either alone or in combination. In addition, the wires may be coated with any insulating material such as polyurethane, enamel, or polytetrafluoroethylene (PTFE) to prevent short circuits with adjacent wires or terminals present within the electronic module.

[0053] <External Power Supply Electrode> The external power supply electrode provided in the electronic module of this technology is an electrode for supplying electricity to the electronic module from outside the electronic module. In the electronic module of this technology, multiple external power supply electrodes may be provided together with the wires, corresponding to the number of terminals provided in the electronic device.

[0054] The material constituting the external power supply electrode is not particularly limited as long as it is a conductive material. For example, metals such as Au, Pt, Cu, Ag, Ni, and Al, or metalloids such as graphene, or materials that can be formed into a film on a substrate by methods such as plating, can be suitably used.

[0055] <Sealing Layer> The electronic module of this technology may further include a sealing layer that seals the electronic device by covering at least a portion of the outer surface of the ribs. The sealing layer that the electronic module of this technology may include prevents foreign matter such as dust from entering the cavity, which is a semi-sealed space surrounding the electronic device, by covering at least a portion of the outer surface of the ribs, thereby suppressing failure and deterioration of the electronic device.

[0056] Here, "covering at least a portion of the outer surface of the rib" means that the entire outer surface of the rib is covered by the sealing layer so that the rib is not exposed to the outside of the electronic module, and is not limited to cases where the electronic device is sealed mainly by the sealing layer, but also includes cases where a portion of the outer surface of the rib is exposed to the outside, the other portion is covered by the sealing layer, and the electronic device is sealed by the sealing layer and the rib.

[0057] The material constituting the sealing layer is not particularly limited as long as it is a material that can cover the outer surface of the rib and seal the electronic device. For example, thermosetting resins such as liquid compound, thermosetting resins, filler-containing resins, phenolic resins, silicone resins, acrylic resins, epoxy resins, urethane resins, silicon resins, and polyetheramide resins, thermoplastic resins such as polyamide-imide, polypropylene, and liquid crystal polymers, photosensitive resins such as UV-curable resins which are acrylic resins, rubber, and other known resin materials can be used individually or in combination. The method for forming the sealing layer in the electronic module of this technology is not particularly limited, and any method capable of forming a sealing layer in the electronic module can be used. For example, a sealing layer can be suitably formed by a jetting method in which a liquid material such as a liquid sealing resin is sprayed at high speed to the desired position, a dispensing method in which a liquid material such as a liquid sealing resin is extruded from a nozzle or dispenser and placed at a specific position, or a molding method in which the sealing material is molded using a mold.

[0058] Furthermore, when a portion of the outer surface of the rib is exposed to the outside and the electronic device is sealed with the sealing layer and the rib, the electronic device can be suitably sealed with the sealing layer and the rib by using a resin that has the function of preventing foreign matter such as dust from entering the cavity as the resin constituting the rib, or by designing the thickness of the rib, which is provided from the cavity to the outside of the electronic module, to be thick enough to prevent foreign matter such as dust from entering the cavity. Specifically, UV-curing resins, thermosetting resins, transparent resins, black resins containing black pigments, and other known resin materials can be suitably used.

[0059] <Solder Bumps> The electronic module of this technology can also take the form of a so-called ball grid array (BGA), in which multiple solder bumps are formed on the second main surface of the substrate. Here, "solder bumps" are spherical or other shaped solder provided to electrically connect the semiconductor module to external terminals.

[0060] Solder bumps formed on the second main surface of the electronic module's substrate electrically connect the external terminals to the electronic module, and also mechanically connect the two. This allows electrical signals and power to be transmitted from the external terminals to the electronic devices within the electronic module.

[0061] <Other Configurations> The electronic module of this technology may have other configurations besides those described above, as needed, as long as they do not significantly impair the desired physical properties. Furthermore, for example, a configuration in which multiple electronic modules are formed on a single substrate is also possible.

[0062] The following describes specific embodiments of the electronic module relating to this technology using drawings. Note that the embodiments shown below are examples of embodiments of this technology, and this technology is not limited in any way to the contents of these embodiments.

[0063] <1 First Embodiment> Figure 2 is an image diagram of an example of the first embodiment of the electronic module of the present technology viewed from the side, and Figure 3 is an image diagram of the electronic module according to Figure 2 viewed from above. The electronic module 10 according to this embodiment includes a substrate 11 having a first main surface and a second main surface, an electronic device 12 attached to the first main surface (surface side of the substrate), a cover 13 provided so as to face the electronic device 12, ribs 14 supporting the cover 13, an external power supply electrode 15, and wires 16 electrically connecting the electronic device 12 and the external power supply electrode 15. In the electronic module 10 shown in Figure 2, the electronic device 12 is sealed with a sealing layer 17, and a cavity 19, which is a semi-sealed space surrounding the electronic device 12, is formed by providing a cover 13 on the ribs 14 so as to face the electronic device 12. The electronic module 10 shown in Figure 2 has a so-called ball grid array (BGA) configuration, with a plurality of solder bumps 18 on the main surface of the substrate 11. However, the electronic module according to this embodiment is not limited to this configuration. Furthermore, the electronic module 10 shown in Figure 2 shows an example in which the electronic device 12 is attached to the first main surface of the substrate 11 with die bond resin 21. However, the method of attaching the electronic device to the substrate is not limited to this method.

[0064] Furthermore, as shown in Figures 2 and 3, in the electronic module 10 according to this embodiment, the wire 16 is installed through the rib 14, and it can be seen that the wire neck 16-1, which is the connection portion between the wire 16 and the electronic device 12, is exposed. Since the wire neck 16-1 is not covered with the resin or the like that forming the rib, even if temperature changes (TC cycles) occur during the manufacturing process of the electronic module, the stress applied to the wire neck 16-1 due to the expansion or contraction of the resin or the like can be reduced, and it is expected that this can reduce electrical connection failures between the electronic device 12 and the external power supply electrode 15 that may occur as a result.

[0065] The rib 14 of the electronic module 10 shown in Figure 2 is an example of a laminated structure consisting of a base rib 14-1 and an upper rib 14-2. In the front view of the electronic module 10 shown in Figure 2, the rib on the left side has a surface area of ​​the base rib 14-1 facing the cover 13 that is larger than the surface area of ​​the upper rib 14-2 that contacts the base rib 14-1. That is, when the substrate 11 is viewed from above, the upper rib 14-2, which has a relatively smaller surface area, is formed in a pyramidal shape on top of the base rib 14-1, which has a larger surface area. As a result, the rib on the left side of the electronic module 10 in Figure 2 can use less resin per unit horizontal cross-sectional area for the upper rib 14-2 than for the base rib 14-1. This makes it easier to adjust the height and shape of the upper rib 14-2 after forming the wire neck 16-1 so that the wire 16 penetrates the upper rib 14-2, and thus the rib of this technology can be formed efficiently. Furthermore, since the cross-sectional area of ​​the surface of the upper rib 14-2 facing the cover 13 is smaller than the area of ​​the upper surface of the base rib 14-1, contamination of the interface layer formed on the substrate 11 during the formation of the upper rib 14-1 can also be suppressed.

[0066] In contrast, in the front view of the electronic module 10 shown in Figure 2, the rib on the right side has a surface area where the upper rib 14-2 contacts the base rib 14-1 that is larger than the surface area of ​​the base rib 14-1 that faces the cover 13. That is, when viewing the substrate 11 from above, the upper rib 14-2, which has a relatively larger surface area than the base rib 14-1, is formed on top of the base rib 14-1, extending beyond the base rib 14-1. In the right-hand rib of the electronic module 10 in Figure 2, by adjusting the area of ​​the upper rib 14-2, it is possible to suppress flare that may be generated by light incident on the electronic module from an oblique direction.

[0067] Furthermore, in the front view of the electronic module 10 shown in Figure 2 above, the upper rib 14-2 on the right side of the rib is tapered in the portion where the wire 16 passes through the upper rib 14-2. This allows the rib to suitably support the lid 13, and even if the area of ​​the surface of the upper rib 14-2 that contacts the base rib 14-1 is larger than the area of ​​the surface of the base rib 14-1 that faces the lid 13, it is possible to suitably achieve a state in which the wire neck 16-1 is not covered by the resin or the like that forming the rib.

[0068] The electronic module according to the first embodiment shown in Figures 2 and 3 can be suitably manufactured by, for example, installing an electronic device on a substrate equipped with an external power supply electrode, providing annular base ribs on the outside of the electronic device, installing wires to electrically connect the electronic device and the external power supply electrode, providing one or more upper ribs on the base ribs so as not to cover the wire neck which is the connection portion between the wire and the electronic device, and installing a cover on the upper ribs. Figures 4A to 4F are illustrative diagrams showing the above manufacturing process in order.

[0069] First, Figure 4A shows the process of attaching the electronic device 12 to the first main surface (front surface side of the substrate) of the substrate 11. In the example shown in Figure 4A, the electronic device 12 is attached by bonding the electronic device 12 to the substrate 11 using die bond resin 21. In this case, in addition to fixing the electronic device 12 to the substrate 11, a die bond resin having any properties such as thermal conductivity and electrical insulation can be suitably used depending on the characteristics of the electronic module 10. The substrate 11 that can be used in this process may be a substrate that has an external power supply electrode 15 already installed, as shown in Figure 4A.

[0070] Next, Figure 4B shows the process of forming the base rib 14-1. In this process, the base rib 14-1 is provided in an annular shape on the outside of the electronic device 12. By providing the base rib 14-1 in advance to a position near the height at which the wire 16 will be provided, before the process of connecting the wire 16 and the electronic device 12 to form the wire neck 16-1, it becomes easier to form the upper rib 14-2 after the wire neck 16-1 is formed by adjusting the height and shape so that the wire 16 penetrates the rib. Furthermore, in the electronic module shown in Figure 4B, the rib (base rib 14-1) is formed in contact with the electronic device 12, but as in the electronic module according to the second embodiment described later, the rib can also be formed with a gap between it and the electronic device without contact.

[0071] Furthermore, in this manufacturing process, the base ribs 14-1 can be formed using any method such as inkjet or molding, as described above. For example, the base ribs 14-1 can be suitably formed by coating them with an inkjet and then curing the resin constituting the base ribs 14-1 under any conditions that match the properties of the resin. When forming the base ribs 14-1 with an inkjet in the electronic module of this embodiment, the position of the base ribs 14-1 and the height of the formed base ribs 14-1 can be easily adjusted by suitably adjusting the position of the ink sprayed from the inkjet nozzle, the number of sprays, and the amount of ink discharged from the nozzle.

[0072] Figure 4C shows the process of installing the wire 16 to electrically connect the electronic device 12 and the external power supply electrode 15. The method of electrically connecting the electronic device 12 and the external power supply electrode 15 with the wire 16 is not particularly limited, and any method can be suitably used.

[0073] Figure 4D shows the process of forming the upper rib 14-2 such that the wire 16 passes through the upper rib 14-2. In this process, one or more upper ribs 14-2 are provided on the base rib 14-1 so as not to cover the wire neck 16-1, which is the connection part between the wire 16 and the electronic device 12. As described above, the upper rib 14-2 can be formed using any method such as inkjet or molding, but it is particularly preferable to form it by inkjet due to the ease of controlling the position and height at which the upper rib 14-2 is formed. For example, the upper rib 14-2 can be suitably formed by coating it by inkjet and then curing the resin constituting the upper rib 14-2 under any conditions that match the properties of the resin.

[0074] In the electronic module of this embodiment, when the upper rib 14-2 is formed by inkjet printing, the wire 16 can penetrate the upper rib 14-2 by suitably adjusting the position of the ink ejected from the inkjet nozzle, the number of ejections, and the amount of ink ejected from the nozzle. Furthermore, by adjusting the height of the upper rib 14-2 by inkjet printing, surface tension acts at the point where the resin constituting the upper rib 14-2 and the surface of the wire 16 come into contact, allowing the wire neck 16-1 to be suitably exposed. Moreover, the height of the ribs can be suitably aligned so that the lid 13 can be supported without tilting. Note that the resin constituting the base rib 14-1 and the resin constituting the upper rib 14-2 may be the same, but they may also be different resins.

[0075] Figure 4E shows the step of installing the cover 13 on the upper rib 14-2. The method of installing the cover 13 is not particularly limited and can be suitably installed by any method. This creates a space that becomes the cavity 19.

[0076] Figure 4F shows the step of providing a sealing layer 17 that covers the outer surface of the rib. The material constituting the sealing layer 17 is not particularly limited, and any material that can be used as a sealing layer for an electronic module can be suitably used. Furthermore, the method of forming the sealing layer is not particularly limited, but the method described above can be suitably used as a method for forming the sealing layer.

[0077] Furthermore, since the electronic module of this technology is not limited to a so-called ball grid array (BGA) configuration, the explanation of the solder bump formation process is omitted in the manufacturing process of the electronic module according to the first embodiment shown in Figures 4A to 4F above. When forming solder bumps in order to implement the electronic module of this technology as a BGA configuration, any method for forming solder bumps can be suitably used. In this case, solder bumps can be suitably formed on the electronic module of this technology by performing the method at any timing within the process.

[0078] <2 Modified Examples of the First Embodiment> Figure 5 shows a side view of the first modified example of the first embodiment of the electronic module of this technology. The modified electronic module differs from the example of this embodiment shown earlier in that, in the front view from the side direction shown in Figure 5, on the left side, the wire 16 penetrates the upper rib 14-2 to electrically connect the electronic device 12 and the external power supply electrode 15, while on the right side, there is no wire. Such modified configurations can be selected depending on the application of the electronic module to be implemented. In addition to the above differences, the same configurations that can be used in the example of this embodiment can be suitably used in this modified example as well. Furthermore, it can be suitably manufactured using the manufacturing method that can be used in the example of this embodiment.

[0079] Figure 6 is a side view of a second modified example of the first embodiment of the electronic module of this technology, showing an example where the ribs 14 are formed on the electronic device. By forming the ribs on the electronic device as in this modified example, it becomes easier to adjust the height and shape of the ribs so that the wires pass through the ribs. Furthermore, because the height of the ribs can be easily adjusted, the height of the ribs supporting the lid of the electronic module can be more easily aligned, which can prevent the lid from being positioned at an angle. Aside from the differences described above, this modified example can suitably use the same configuration as that used in the example of this embodiment and the first modified example. It can also be suitably manufactured using the manufacturing method that can be used in the example of this embodiment and the first modified example.

[0080] Figure 7 is a side view diagram of a third modified example of the first embodiment of the electronic module of this technology. This modified electronic module differs from the example of this embodiment shown earlier in that the ribs used in the electronic module of this technology are formed from a single layer on the substrate. Such modified configurations can be selected depending on the application of the electronic module to be implemented. In addition to the above differences, this modified example can suitably use the same configuration as that used in the example of this embodiment and other modified examples. Furthermore, it can be suitably manufactured using the manufacturing methods that can be used in the example of this embodiment and other modified examples.

[0081] <3. Second Embodiment> Figure 8 is an image of an example of a second embodiment of the electronic module of the present technology, viewed from the side. The electronic module of this embodiment differs from the electronic module of the first embodiment in that the ribs (substrate ribs 14-1 in Figure 8) are provided on the substrate 11, and the ribs (substrate ribs 14-1) do not come into contact with the electronic device 12 but are formed at a distance from it.

[0082] In this case, for example, by arranging the resin constituting the base rib 14-1 and the die bond resin 21 at a distance from each other on the substrate 11, the die bond resin 21 can avoid absorbing moisture from the resin constituting the rib, thereby reducing the amount of moisture absorbed from outside the cavity. This can suppress the occurrence of cracks at the joint surface between the electronic device 12 and the substrate 11 due to changes in stress applied to the electronic module 10 when the electronic module 10 is exposed to environmental changes. Furthermore, because the resin constituting the rib and the electronic device 12 are spaced apart, the shrinkage of the resin constituting the rib due to temperature changes that occur during the manufacturing of the electronic module 10 can be transmitted to the electronic device 12, thus suppressing the occurrence of cracks in the electronic device 12. Aside from the differences described above, the same configurations as those used in the first embodiment and other embodiments described herein can be suitably used in this embodiment as well.

[0083] The electronic module according to the second embodiment shown in Figure 8 can be suitably manufactured by, for example, providing annular base ribs on the outside of the area on the substrate where the electronic device with an external power supply electrode is provided, then installing the electronic device, installing wires to electrically connect the electronic device and the external power supply electrode, providing one or more upper ribs on the base ribs so as not to cover the wire neck which is the connection portion between the wire and the electronic device, and then installing a cover on the upper ribs. Figures 9A to 9F are illustrative diagrams showing the above manufacturing process in order.

[0084] First, Figure 9A shows the process of forming the base rib 14-1 on the substrate 11. In Figures 9A to F, α is an image of the electronic module viewed from the side during the manufacturing process of the electronic module, and β is an image of the electronic module viewed from above.

[0085] In the electronic module according to the second embodiment, as shown in the example of the manufacturing method for the electronic module according to the first embodiment, after the electronic device on the substrate equipped with an external power supply electrode is installed, a base rib can be formed in an annular shape on the outside of the electronic device. However, since the rib does not come into contact with the electronic device and is formed at a distance from it, the base rib 14-1 may be formed on the substrate 11 before the step of attaching the electronic device 12 to the substrate 11 (on the first main surface (surface side of the substrate)), as shown in Figure 9A. By forming the rib before attaching the electronic device 12 to the substrate 11, it is possible to prevent the die bond resin 21 from seeping out from the intended position on the substrate 11. For example, if the die bond resin 21 seeps out to the position of the external power supply electrode 15, an electrical connection failure may occur. Therefore, by providing annular base ribs outside the area on the substrate where the electronic device equipped with the external power supply electrode is to be installed, and then installing the electronic device, even if seepage of the die bond resin 21 occurs, the resin constituting the base ribs 14-2, etc., acts as a barrier, effectively preventing seepage up to the position of the external power supply electrode 15.

[0086] Furthermore, the method for forming the base rib 14-1 can preferably be the same as the method used in the manufacturing method of the first embodiment described above.

[0087] Next, Figure 9B shows the step of attaching the electronic device 12 to the substrate 11. In this manufacturing method, since the base rib 14-1 is formed on the substrate 11 in advance, when attaching the electronic device 12 to the substrate 11, as shown in Figure 9B, the base rib 14-2, which is provided in an annular shape on the outside of the area on the substrate 11 where the electronic device 12 is to be placed, acts as a wall, effectively preventing the die bond resin 21 from seeping out to the position of the external power supply electrode 15. In this step, the method for attaching the electronic device 12 to the substrate 11 is preferably the same as the method used in the manufacturing method of the first embodiment described above.

[0088] Next, Figure 9C shows the step of installing the wire 16 so as to electrically connect the electronic device 12 and the external power supply electrode 15. Figure 9D shows the step of forming the upper rib 14-2 so that the wire 16 penetrates the upper rib 14-2. Figure 9E shows the step of installing the cover 13 on the upper rib 14-2. Furthermore, Figure 9F shows the step of providing a sealing layer 17 that covers the outer surface of the rib. In these steps as well, the same methods that can be used in the manufacturing method of the first embodiment described above can be suitably used.

[0089] Furthermore, since the electronic module of this technology is not limited to a so-called ball grid array (BGA) configuration, the manufacturing process of the electronic module according to the second embodiment shown in Figures 9A to 9F above also omits the explanation of the solder bump formation process, similar to the explanation of the manufacturing process of the electronic module according to the first embodiment. Since the electronic module of this embodiment is implemented as a BGA configuration, any method for forming solder bumps can be suitably used when forming solder bumps. In this case as well, solder bumps can be suitably formed on the electronic module of this technology by performing the method at any timing within the process.

[0090] <4 Third Embodiment> Figure 10 is an image diagram of an example of a third embodiment of the electronic module of the present technology, viewed from the side. The ribs of the electronic module of this embodiment have a laminated structure consisting of a base rib 14-1 and an upper rib 14-2. As shown in Figure 10, the surface of the electronic device 12 facing the cover 13 is located closer to the surface of the cover 13 than the surface of the base rib 14-1 facing the cover 13. As a result, the height of the base rib 14-1 is physically lower than that of the electronic device 12, and therefore, during the manufacturing of the electronic module 10 (especially the process of forming the base rib 14-1), it is possible to effectively suppress the bleeding of the resin constituting the rib onto the surface (pixel surface) of the electronic device, which is located higher than the base rib 14-1.

[0091] Aside from the differences described above, the electronic module of this embodiment can also suitably utilize the same configuration as that used in the first and second embodiments. Furthermore, the electronic module of this embodiment can be suitably manufactured using the manufacturing methods that can be used in the first and second embodiments.

[0092] <5. Fourth Embodiment> Figure 11 is an image of an example of the fourth embodiment of the electronic module of the present technology, viewed from the side. The ribs of the electronic module of this embodiment have a laminated structure consisting of a base rib 14-1 and an upper rib 14-2. As shown in Figure 11, the surface of the base rib 14-1 facing the cover 13 is closer to the surface of the cover 13 than the surface of the electronic device 12 facing the cover 13. As a result, the height of the base rib 14-1 is physically higher than that of the electronic device 12, and the proportion of the height of the upper rib 14-2 formed during the manufacturing of the electronic module 10 to the total height of the electronic module is relatively low, making it easier to adjust the height of the ribs. As a result, the heights of the ribs supporting the cover of the electronic module are more easily aligned, which can suppress the tilting of the cover.

[0093] Aside from the differences described above, the electronic module of this embodiment can also suitably utilize the same configuration as that used in the first to third embodiments. Furthermore, the electronic module of this embodiment can be suitably manufactured using the manufacturing methods that can be used in the first to third embodiments.

[0094] <6 Fifth Embodiment> Figure 12 is an image of an example of a fifth embodiment of the electronic module of the present technology, viewed from the side. The electronic module of this embodiment includes a resin layer having a conductive wiring layer (through via) 22 inside, and the electrical connection between the electronic device 12 and the external power supply electrode 15 is made via the wiring layer 22 using wires 16.

[0095] In this embodiment, as shown in Figure 12, for example, the ribs of the electronic module can be configured as a laminated structure consisting of a base rib 14-1 and an upper rib 14-2, with the base rib 14-1 also serving as a resin layer having a conductive wiring layer 22 inside. In particular, as shown in Figure 12, by providing the wiring layer 22 as through vias that penetrate vertically through the resin layer, the connection terminals located on the upper surface and the connection terminals located on the lower surface (connection points with the external power supply electrode 15) can be electrically connected vertically. In particular, as shown in Figure 12, by positioning the base rib 14-1 and the wiring layer (through rib) 22 provided inside the base rib 14-1 so that they can be directly connected to the external power supply electrode 15, the area from the external power supply electrode 15 to the upper surface of the base rib 14-1 can be electrically connected vertically in a suitable manner.

[0096] Furthermore, as shown in Figure 12, the electronic module of this embodiment may be configured such that the surface of the base rib 14-1 facing the cover 13 (the upper surface of the base rib 14-1 when the electronic module 10 is placed on it) and the surface of the electronic device 12 facing the cover 13 (the upper surface of the electronic device 12 when the electronic module 10 is placed on it) are substantially on the same plane. This makes it possible to align the heights of the two points that are physically connected by the wire 16 (the end of the wiring layer 22 on the upper surface of the base rib 14-1 and the connection point of the electronic device 12). This can reduce the frequency of connection failures that may occur due to bending of the wire or the like when the wire 16 physically connects two points of different heights.

[0097] Furthermore, the method for providing the wiring layer in the electronic module of this embodiment is not particularly limited, and any method used to provide the wiring layer inside the resin layer can be suitably used in this embodiment as well.

[0098] Aside from the differences described above, the electronic module of this embodiment can preferably utilize the same configuration as that used in the first to fourth embodiments. Furthermore, the electronic module of this embodiment can preferably be manufactured using the manufacturing methods that can be used in the first to fourth embodiments.

[0099] <7 Sixth Embodiment> Figure 13 is an image diagram of an example of the sixth embodiment of the electronic module of the present technology, viewed from the side. The electronic module of this embodiment shows an example of the structure when the ribs of the electronic module of the present technology are formed by a molding method. In the electronic module 10 of this embodiment, as shown in Figure 13, the wire 16 is installed passing through the upper rib 14-2, and the wire neck 16-1, which is the connection part between the wire 16 and the electronic device 12, is exposed. In the electronic module of this embodiment, since the wire neck 16-1 is not covered with resin or the like that forming the rib, even if temperature changes (TC cycles) occur during the manufacturing process of the electronic module, the stress applied to the wire neck 16-1 due to the expansion or contraction of the resin or the like can be reduced, and it is expected that electrical connection failures between the electronic device 12 and the external power supply electrode 15 that may occur as a result can be reduced.

[0100] The configuration of an example of the electronic module of this embodiment shown in Figure 13 is the same as that of the electronic module of the fifth embodiment shown in Figure 12, except that it is manufactured by mold molding. Furthermore, the electronic module of this embodiment can also suitably use the same configuration as that which can be used in the embodiments described herein.

[0101] Figures 14A to 14E are illustrative diagrams showing, in order, the steps involved in the manufacturing process of the electronic module of this embodiment shown in Figure 13, specifically the process of forming the ribs of the electronic module by molding and installing the wires of the electronic module. It should be noted that the manufacturing process described herein is merely an example of the process for forming the ribs of the electronic module of this technology by molding, and this technology is not limited to this manufacturing method.

[0102] Figure 14A shows the step of physically inverting the electronic device 12 and mounting it on the wafer sheet 23. This step can suitably utilize any method of physically inverting an electronic device and mounting it on a wafer sheet that can be used in the manufacturing method of an electronic module.

[0103] Next, Figure 14B shows the process of forming the base rib 14-1 by mold molding using the mold 24. The mold molding method that can be used in this molding is not particularly limited, and the base rib can be formed using any mold molding method that can be used in the manufacturing method of an electronic module.

[0104] Figure 14C shows the process of forming wires 16 that electrically connect the electronic device 12 and the external power supply electrode. The electronic device 12 is then physically inverted and mounted on the wafer sheet 23. Subsequently, as described above, conductive holes (Via) for forming the wiring layer 22 are provided in the base rib 14-1 formed by mold molding, and the wiring layer 22 and wires 16 are formed using any highly conductive material such as Cu. In this process, the method for forming the wiring layer 22 and wires 16 is not particularly limited as long as it is a method that can form conductors in the manufacturing method of an electronic module, and can be suitably formed by methods such as plating.

[0105] Figure 14D shows the process of adjusting the base rib 14-1 to the desired shape using the polisher 25. The electronic device 12 is then physically inverted again and mounted on the wafer sheet 23, and as shown in Figure 14D, the polisher 25 is used to remove unwanted resin from the resin constituting the base rib 14-1 by polishing. The polishing method that can be used in this process is not particularly limited as long as it is a method that can be used to polish the resin layer in the manufacturing method of an electronic module, and any method can be used.

[0106] Figure 14E shows the process of cutting the electronic device 12 and the substrate ribs 14-1 at an arbitrary pitch using a cutting blade 26. The cutting method in this process is not particularly limited as long as it is a method that can be used to cut the resin layer in the manufacturing method of the electronic module, and any method can be used.

[0107] Subsequently, an upper rib 14-2 is formed on the base rib 14-1 of the electronic module equipped with the wire 16 obtained by the above process, using the method used in other embodiments described herein, as shown in Figure 13, so as not to cover the wire neck 16-1. Furthermore, by combining and implementing the manufacturing processes that can be used in other embodiments described herein, the electronic module of this embodiment can be suitably manufactured. Although Figure 13 shows an example of an electronic module equipped with a substrate having various interface layers inside, the substrate used is not limited to this, and any substrate can be used depending on the application and purpose of the electronic module to be manufactured.

[0108] Furthermore, this technology can take the following configurations: [1] An electronic module comprising: a substrate having a first main surface and a second main surface; an electronic device attached to the first main surface; a cover provided so as to face the electronic device; ribs supporting the cover; an external power supply electrode; and a wire electrically connecting the electronic device and the external power supply electrode, wherein the wire is installed passing through the ribs. [2] The electronic module according to [1], wherein the wire neck, which is the connection portion between the wire and the electronic device, is exposed. [3] The electronic module according to [1] or [2], wherein the resin constituting the ribs does not cover the electronic device. [4] The electronic module according to any one of [1] to [3], wherein the ribs have a laminated structure consisting of a base rib and one or more upper ribs. [5] The electronic module according to [4], wherein the area of ​​the surface of the base rib facing the cover is larger than the area of ​​the portion where the upper rib contacts the base rib. [6] The electronic module according to [4], wherein the area of ​​the surface of the upper rib that contacts the base rib is greater than the area of ​​the surface of the base rib that faces the cover. [7] The electronic module according to any one of [1] to [3], wherein the rib is made of a single layer. [8] The electronic module according to any one of [1] to [7], wherein the rib is provided on the substrate. [9] The electronic module according to [8], wherein the rib does not come into contact with the electronic device.

[10] The electronic module according to [8] or [9], comprising a die bond resin for attaching the electronic device to the first main surface, wherein the rib does not come into contact with the die bond resin.

[11] The electronic module according to any one of [4] to

[10] , wherein the surface of the electronic device that faces the cover is located closer to the surface of the cover than the surface of the base rib that faces the cover.

[12] The electronic module according to any one of [4] to

[10] , wherein the surface of the base rib facing the cover is located closer to the surface of the cover than the surface of the electronic device facing the cover.

[13] The electronic module according to any one of [1] to

[12] , comprising a resin layer having a wiring layer inside, wherein the electrical connection between the electronic device and the external power supply electrode by the wire is made via the wiring layer.

[14] The electronic module according to

[13] , wherein the rib has a laminated structure consisting of a base rib and one or more upper ribs, and the base rib also serves as the resin layer.

[15] The electronic module according to

[14] , wherein the surface of the base rib facing the cover and the surface of the electronic device facing the cover are substantially on the same plane.

[16] The electronic module according to any one of [1] to

[15] , further comprising a sealing layer that seals the electronic device by covering at least a portion of the outer surface of the rib.

[17] The electronic module according to any one of [1] to

[16] , wherein a plurality of solder bumps are formed on the second main surface of the substrate.

[18] A method for manufacturing an electronic module, comprising: providing a base rib in an annular shape outside the area on a substrate on which an electronic device is provided that includes an external power supply electrode; installing the electronic device; installing a wire that electrically connects the electronic device and the external power supply electrode; providing one or more upper ribs on the base rib so as not to cover the wire neck, which is the connection portion between the wire and the electronic device; and installing a cover on the upper rib.

[19] The method for manufacturing an electronic module according to

[18] , wherein the upper ribs are formed by inkjet.

[20] The method for manufacturing an electronic module according to

[18] or

[19] , further comprising a sealing layer covering the outer surface of the upper ribs.

[21] A method for manufacturing an electronic module, wherein after setting up an electronic device on a substrate equipped with an external power supply electrode, a base rib is provided in an annular shape on the outside of the electronic device, a wire is provided to electrically connect the electronic device and the external power supply electrode, one or more upper ribs are provided on the base ribs so as not to cover the wire neck which is the connection portion between the wire and the electronic device, and a cover is provided on the upper ribs.

[0109] 10 Electronic module 11 Substrate 12 Electronic device (image sensor) 13 Cover 14 Rib 14-1 Base rib 14-2 Upper rib 15 External power supply electrode 16 Wire 16-1 Wire neck 17 Encapsulation layer 18 Solder bump 19 Cavity 21 Die bond resin 22 Wiring layer (through via) 23 Wafer sheet 24 Mold 25 Polisher 26 Cutting blade

Claims

1. An electronic module comprising: a substrate having a first main surface and a second main surface; an electronic device attached to the first main surface; a cover provided opposite the electronic device; ribs supporting the cover; an external power supply electrode; and a wire electrically connecting the electronic device and the external power supply electrode, wherein the wire is installed passing through the ribs.

2. The electronic module according to claim 1, wherein the wire neck, which is the connection portion between the wire and the electronic device, is exposed.

3. The electronic module according to claim 1, wherein the resin constituting the ribs does not cover the electronic device.

4. The electronic module according to claim 1, wherein the rib has a laminated structure consisting of a base rib and one or more upper ribs.

5. The electronic module according to claim 4, wherein the area of ​​the surface of the base rib facing the cover is greater than the area of ​​the portion of the upper rib that contacts the base rib.

6. The electronic module according to claim 4, wherein the area of ​​the surface of the upper rib that contacts the base rib is greater than the area of ​​the surface of the base rib that faces the cover.

7. The electronic module according to claim 1, wherein the rib consists of a single layer.

8. The electronic module according to claim 1, wherein the ribs are provided on the substrate.

9. The electronic module according to claim 8, wherein the rib does not come into contact with the electronic device.

10. The electronic module according to claim 8, comprising a die-bonding resin for attaching the electronic device to the first main surface, wherein the rib and the die-bonding resin are not in contact.

11. The electronic module according to claim 4, wherein the surface of the electronic device facing the cover is located closer to the surface of the cover than the surface of the base rib facing the cover.

12. The electronic module according to claim 4, wherein the surface of the base rib facing the cover is located closer to the surface of the cover than the surface of the electronic device facing the cover.

13. The electronic module according to claim 1, comprising a resin layer having a wiring layer inside, wherein the electrical connection between the electronic device and the external power supply electrode by the wire is made via the wiring layer.

14. The electronic module according to claim 13, wherein the rib has a laminated structure consisting of a base rib and one or more upper ribs, and the base rib also serves as the resin layer.

15. The electronic module according to claim 14, wherein the surface of the base rib facing the cover and the surface of the electronic device facing the cover are substantially on the same plane.

16. The electronic module according to claim 1, further comprising a sealing layer that seals the electronic device by covering at least a portion of the outer surface of the rib.

17. The electronic module according to claim 1, wherein a plurality of solder bumps are formed on the second main surface of the substrate.

18. A method for manufacturing an electronic module, comprising: providing annular base ribs on the outside of an area on a substrate equipped with an external power supply electrode where an electronic device is to be provided; installing the electronic device; installing wires to electrically connect the electronic device and the external power supply electrode; providing one or more upper ribs on the base ribs so as not to cover the wire neck, which is the connection portion between the wire and the electronic device; and installing a cover on the upper ribs.

19. The method for manufacturing an electronic module according to claim 18, wherein the upper rib is formed by inkjet.

20. The method for manufacturing an electronic module according to claim 18, further comprising a sealing layer covering the outer surface of the upper rib.

21. A method for manufacturing an electronic module, comprising: installing an electronic device on a substrate equipped with an external power supply electrode; providing an annular base rib on the outside of the electronic device; installing a wire to electrically connect the electronic device and the external power supply electrode; providing one or more upper ribs on the base rib so as not to cover the wire neck, which is the connection portion between the wire and the electronic device; and installing a cover on the upper rib.

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