Electronic device comprising conductive contact member
The conductive contact member with a bent nickel sheet and elastic member in the electronic device addresses the challenge of miniaturizing antennas by ensuring stable electrical connections and grounding, enhancing antenna performance.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SAMSUNG ELECTRONICS CO LTD
- Filing Date
- 2025-09-17
- Publication Date
- 2026-05-07
AI Technical Summary
Existing electronic devices face challenges in efficiently placing antennas within limited internal space while ensuring miniaturization and weight reduction, and maintaining optimal antenna performance, particularly due to the need for efficient grounding structures.
The electronic device incorporates a conductive contact member comprising a conductive member and an elastic member, with a bent configuration to surround the elastic member, ensuring stable electrical connection between the display and a support member through a welded and bonded structure, utilizing a nickel sheet for improved weldability and a compressible material for resilience.
This configuration enhances the stability and efficiency of electrical connections, maintaining antenna performance by providing a robust grounding structure that supports miniaturization and weight reduction.
Smart Images

Figure KR2025014468_07052026_PF_FP_ABST
Abstract
Description
Electronic device including a conductive contact member
[0001] The embodiments disclosed in this document relate to an electronic device comprising a conductive contact member.
[0002] A portable electronic device may include an antenna for voice calls and / or data transmission. In particular, as frequency bands for wireless communication become more diverse, the electronic device may include an antenna capable of transmitting and receiving signals in various frequency bands. The antenna must be efficiently placed within the internal space of the electronic device through miniaturization and weight reduction, and may be designed with an optimized shape to ensure antenna performance. Additionally, a grounding structure may be formed in an area adjacent to the antenna of the electronic device to ensure antenna performance.
[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.
[0004] An electronic device according to one embodiment disclosed herein may include a housing comprising a front, a rear opposite to the front, and a side that surrounds the space between the front and the rear; a display disposed in the space and visible through the front; a support member having at least a portion disposed between the display and the rear; and a contact member configured to electrically connect the display and the support member. The contact member may include an elastic member and a conductive member that is bent to surround at least a portion of the elastic member. The conductive member may include a first portion that contacts the display and a second portion that contacts the support member. The first portion may include an uneven surface. The second portion may include a first region welded to the support member and a second region bonded to the support member. The first region may be formed as a single layer.
[0005] FIG. 1 is a perspective view of the front of an electronic device according to one embodiment.
[0006] FIG. 2 is a perspective view of the rear of an electronic device according to one embodiment.
[0007] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.
[0008] FIG. 4 is a drawing for explaining the area where a contact member is located within the housing of an electronic device according to one embodiment.
[0009] FIG. 5 is a drawing showing an example of a contact member seated on a support member according to one embodiment.
[0010] FIG. 6 is a drawing showing an example of a contact member that contacts a display and a support member according to one embodiment.
[0011] FIG. 7 is a drawing showing an example of a contact member according to one embodiment, viewed from various angles.
[0012] FIG. 8 is a drawing showing an example of the configurations of a contact member according to one embodiment.
[0013] FIG. 9 is a drawing for explaining each part of a conductive member according to one embodiment.
[0014] FIG. 10 is an enlarged view of a portion where a conductive member is welded, according to one embodiment.
[0015] FIG. 11 is a drawing showing an example of the weld shape of a contact member according to one embodiment.
[0016] FIG. 12 is a drawing showing examples of the surface of a conductive member according to a comparative example and the surface of a conductive member according to one embodiment.
[0017] FIG. 13 is a drawing showing examples of the surface of a display according to one embodiment.
[0018] FIG. 14 is a table showing a comparison of the friction coefficient between a conductive member and a display according to a comparative example and the friction coefficient between a conductive member and a display according to one embodiment.
[0019] FIG. 15 is a graph showing the relationship between the compression ratio and the repulsive force of an elastic member according to one embodiment.
[0020] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.
[0021] Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments and should be understood to include various modifications, equivalents, and / or alternatives of the embodiments of the present invention.
[0022] An electronic device according to an embodiment disclosed in this document (e.g., the electronic device (100) of FIG. 1) may include a contact member (e.g., the contact member (300) of FIG. 5) that electrically connects a display (e.g., the display (210) of FIG. 3) and a support member (e.g., the support member (132) of FIG. 3). At least a portion of the surface of the contact member (300) that contacts the display (210) may be corroded (e.g., etched), and at least a portion of the surface facing the support member (132) may be welded. Through the contact member (300), the stability of the electrical connection between the display (210) and the support member (132) may be ensured. Below, various purposes and effects provided by an electronic device including a contact member according to various embodiments may be mentioned through examples in the detailed description.
[0023] FIG. 1 is a perspective view of the front of an electronic device according to one embodiment.
[0024] FIG. 2 is a perspective view of the rear of an electronic device according to one embodiment.
[0025] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.
[0026] Referring to FIGS. 1 through 3, in one embodiment, an electronic device (100) may comprise a housing (101) comprising a front (111), a rear (121), and a side (131) that surrounds at least a portion of the space between the front (111) and the rear (121). According to one embodiment, the front (111) may be formed by a front plate (110) in which at least a portion is substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate). The rear (121) may be formed by a rear plate (120) in which at least a portion is substantially opaque. The rear plate (120) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the materials. The side (131) may be combined with the front plate (110) and the rear plate (120). The side (131) may be formed by a side bezel structure (130) (or side member) comprising a metal and / or polymer. In one embodiment, the rear plate (120) and the side bezel structure (130) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum). In one embodiment, the front (111) may be a surface facing the first direction (e.g., +z-axis direction) of the electronic device (100), and the rear (121) may be a surface facing the second direction (e.g., -z-axis direction) of the electronic device (100).
[0027] According to one embodiment, the electronic device (100) may include at least one of a display (210), an audio module (107, 108), a camera module (105, 140), a key input device (104), a flash (112), a connector hole (106), or a tray (109). In one embodiment, the electronic device (100) may omit at least one of the components (e.g., a key input device (104)) or additionally include other components.
[0028] The display (210) may be exposed, for example, through a significant portion of the front plate (110). In one embodiment, the corners of the display (210) may be formed to be generally identical to the adjacent outer shape of the front plate (110). In one embodiment (not shown), to expand the area where the display (210) is exposed, the gap between the outer edge of the display (210) and the outer edge of the front plate (110) may be formed to be generally identical. In one embodiment, the display (210) may include a plurality of layers. For example, the display (210) may include a cover layer (or cover film), a protective layer, a pixel layer, a shielding layer, and / or optical adhesive layers.
[0029] In one embodiment (not shown), a recess or opening is formed in a part of the screen display area of the display (210), and at least one of an audio module (107, 108), a sensor module, or a camera module (105, 140) may be included that is aligned with the recess or the opening. In one embodiment (not shown), at least one of an audio module (107, 108), a sensor module, a camera module (105, 140), or a fingerprint sensor may be included on the back surface of the screen display area of the display (210). In one embodiment (not shown), the display (210) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus pen.
[0030] The audio module (107, 108) may include a speaker hole (107) and a microphone hole (108). The speaker hole (107) may include an external speaker hole and / or a receiver hole for calls. A microphone for acquiring external sound may be placed inside the microphone hole (108). In one embodiment, a plurality of microphones may be placed inside the microphone hole (108) to detect the direction of sound. In one embodiment, the speaker hole (107) and the microphone hole (108) may be implemented as a single hole, or a speaker may be included without the speaker hole (107) (e.g., a piezo speaker).
[0031] The sensor module can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. The sensor module may further include at least one of, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
[0032] The camera module (105, 140) may include a first camera device (105) (e.g., front camera) in which a portion is seen through the front (111) of the electronic device (100) and a second camera device (140) (e.g., rear camera) in which a portion is seen through the rear (121). The camera module (105, 140) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, two or more lenses (e.g., an infrared camera, a wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (100). In one embodiment, the second camera device (140) may include a plurality of camera modules (e.g., a telephoto camera module, a wide-angle camera module, an ultra-wide-angle camera module). The flash (112) may include, for example, a light-emitting diode or a xenon lamp.
[0033] A key input device (104) may be positioned on the side (131) of an electronic device (100). In one embodiment, the electronic device (100) may not include some or all of the key input devices (104), and the key input devices (104) that are not included may be implemented in other forms, such as soft keys, on a display (210). In one embodiment, the key input device may include a sensor module positioned on the rear (121).
[0034] The connector hole (106) can accommodate a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device. In one embodiment, the electronic device (100) may include a connector hole (e.g., an earphone jack) formed on the side (131) to accommodate a connector for transmitting and receiving audio signals with an external electronic device.
[0035] The tray (109) can accommodate a smart card (e.g., a universal subscriber identity module (USIM)) that can be used as a module for user authentication and for a mobile communication network subscribed to by the user of the electronic device. In one embodiment, the tray (109) can be detachably coupled to the side (131) so that the USIM chip can be easily separated from and replaced from the electronic device (100).
[0036] Referring to FIG. 3, the electronic device (100) may include a housing (101) comprising a front plate (110), a rear plate (120), and a side bezel structure (130). The electronic device (100) may include a display (210), a support member (132) (e.g., a bracket), a first printed circuit board (220), a battery (250), a second printed circuit board (230), and an antenna structure (240) disposed inside the housing (101). In one embodiment, the electronic device (100) may omit at least one of the components (e.g., the second printed circuit board (230)) or additionally include other components. At least one of the components of the electronic device (100) may be identical or similar to at least one of the components of the electronic device (100) of FIG. 1 or FIG. 2, and redundant descriptions are omitted below.
[0037] The support member (132) may be disposed inside the electronic device (100) and connected to the side bezel structure (130), or may be formed integrally with the side bezel structure (130). The support member (132) may be formed of a metal material (e.g., aluminum, or titanium). In one embodiment, the support member (132) may have a display (210) attached to one side and a first printed circuit board (220) attached to the other side.
[0038] The first printed circuit board (220) may be equipped with a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a USB interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (100) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.
[0039] The battery (250) is a device for supplying power to at least one component of the electronic device (100) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially coplanar with, for example, the first printed circuit board (220). The battery (250) may be disposed integrally inside the electronic device (100) or may be disposed detachably from the electronic device (100).
[0040] An antenna structure (240) may be positioned between the rear plate (120) and the battery (250). The antenna structure (240) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna structure (240) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a part or a combination thereof of the side bezel structure (130) and / or the support member (132). In one embodiment, the antenna structure (240) may include a plurality of antenna modules using different frequencies.
[0041] FIG. 4 is a drawing for explaining the area where a contact member is located within the housing of an electronic device according to one embodiment. FIG. 4 shows a side bezel structure (130) viewed from the +z axis.
[0042] Referring to FIGS. 1 to 4, in one embodiment, the side bezel structure (130) may form at least a portion of the side (131) of the electronic device (100), and the support member (132) may form at least a portion of the interior of the electronic device (100). The side bezel structure (130) may include a plurality of segments spaced apart from each other. For example, the side bezel structure (130) may include a plurality of segments made of a metal material. Each of the plurality of segments may be used as a radiator of an antenna structure (240) or an antenna module (hereinafter referred to as an antenna) included in the antenna structure (240).
[0043] The support member (132) can be combined with the side bezel structure (130). The support member (132) may be formed of a conductive material to electrically connect the antenna and the segment. For example, the support member (132) may include an aluminum-based alloy, a titanium-based alloy, or a combination thereof.
[0044] In one embodiment, the electronic device (100) may include various grounding (or ground connection) paths to ensure the performance of the antenna. For example, contact members (e.g., the contact member (300) of FIG. 5) for electrical connection between the display (210) and the support member (132) may be disposed inside the housing (101) of the electronic device (100). For example, the electronic device (100) may include grounding points (C1, C2, C3, C4, C5, C6) formed in a number corresponding to the number of antennas, and the contact member may be disposed at each of the grounding points. The number, shape, and / or location of the grounding points may change depending on the components disposed inside the electronic device (100). The shape of the contact member disposed at each grounding point may be substantially the same, and for convenience of explanation, the contact member (300) disposed at the first grounding point (C1) will be described below.
[0045] FIG. 5 is a drawing showing an example of a contact member seated on a support member according to one embodiment.
[0046] FIG. 6 is a drawing showing an example of a contact member that contacts a display and a support member according to one embodiment.
[0047] FIG. 5 shows a part of a support member (132) corresponding to the first grounding point (C1) of FIG. 4 and a contact member (300) placed on said part, and FIG. 6 shows the contact member (300) viewed from the -x axis to explain the shape in which the contact member (300) is placed within the electronic device (100).
[0048] Referring to FIGS. 1 to 6, in one embodiment, the electronic device (100) may include a contact member (300) (or, contact member, connecting member) for electrical connection of a display (210) and a support member (132). The contact member (300) may include a conductive member (310) in contact with the display (210) and the support member (132), an elastic member (320) that is at least partially surrounded by the conductive member (310), and a film (330) disposed between the conductive member (310) and the elastic member (320).
[0049] A contact member (300) may be disposed between a display (210) and a support member (132). The display (210) may include a window (211) (or cover glass) visible from outside the electronic device (100), a metal layer (212) disposed adjacent to a support member (132) at the bottom of the window (211) (e.g., in the -z-axis direction), and a display panel (213) disposed between the window (211) and the metal layer (212). In one example, the display (210) may include a plurality of layers disposed between the window (211) and the display panel (213), or between the display panel (213) and the metal layer (212). The plurality of layers may include, for example, a cover layer, a protective layer, or an adhesive layer. The contact member (300) may be disposed between the metal layer (212) and the seating surface (133) of the support member (132). At least a portion of the conductive member (310) may be in contact with the metal layer (212), and another portion may be in contact with the seating surface (133).
[0050] In one example, the mounting surface (133) may be formed by removing a portion of the oxide film formed on the surface of the support member (132). For example, the support member (132) may have an oxide film formed on its surface through an anodizing process, and a portion of the oxide film formed on the portion of the support member (132) for mounting the contact member (300) may be removed through processing. For example, at least a portion of the oxide film formed on the mounting surface (133) may be destroyed by laser hatching, and the contact member (300) may be in contact with and welded to the mounting surface (133) without interference from the oxide film. Since the mounting surface (133) does not contain an oxide film, welding with the contact member (300) can be easily performed.
[0051] The mounting surface (133) may be in the shape of being recessed in a second direction (e.g., -z-axis direction) from the surface of the support member (132). For example, the mounting surface (133) may be formed at a position spaced apart by a first distance (D1) in a second direction (e.g., -z-axis direction) from the metal layer (212) of the display (210). In one example, the area of the mounting surface (133) may be formed to be larger than the area of the surface (e.g., the surface facing the -z-axis) that contacts the mounting surface (133) of the conductive member (310).
[0052] In one embodiment, the conductive member (310) may be formed to extend in one direction. For example, the conductive member (310) may be formed as a metal sheet extending in one direction (e.g., -y-axis direction) along the seating surface (133). In one example, the conductive member (310) may be a nickel (Ni) sheet. As the entire conductive member (310) is formed as a single nickel layer, the hardness and / or ductility may be improved compared to a conductive member formed of another metal (e.g., copper). A conductive member (310) formed of a nickel sheet may have improved weldability with the support member (132). The conductive member (310) may be formed of a metal (e.g., nickel) that has a higher hardness than the fabric material and may be in strong contact with the metal layer (212).
[0053] The conductive member (310) may be formed by bending at least a portion thereof. For example, the conductive member (310) may be in a shape that is at least partially bent so that the other end opposite to one end (e.g., the end facing the -y-axis) contacts the metal layer (212). The elastic member (320) may be surrounded by the bent portion of the conductive member (310). At least a portion of the conductive member (310) may be welded to the seating surface (133) to be electrically connected to the support member (132). A welding bead (or weld, weld line) (314) that is electrically connected to the support member (132) may be formed on the conductive member (310). For example, the conductive member (310) may include a welding bead (314) formed by laser welding.
[0054] In one embodiment, the elastic member (320) may be positioned to provide an elastic force (or, repulsive force) (Fr) so that the conductive member (310) can be firmly in contact with the metal layer (212). For example, the elastic member (320) may be formed of a compressible material. The elastic member (320) may be at least partially compressed while surrounded by the conductive member (310) and may provide an elastic force (Fr) to the conductive member (310) in a first direction (e.g., +z-axis direction) so that the conductive member (310) contacts the metal layer (212). The elastic member (320) may be formed such that, for example, the width in the first direction is greater than the first distance (D1) between the seating surface (133) and the metal layer (212). The elastic member (320) may include a material with excellent compressibility and / or resilience. In one example, the elastic member (320) may be formed of a foamed plastic (or plastic foam) having a porous shape. For example, the elastic member (320) may be polyurethane foam.
[0055] In one embodiment, the film (330) may surround at least a portion of the elastic member (320) and may be in contact with the conductive member (310). The film (330) may be combined with the conductive member (310) and the elastic member (320). For example, the conductive member (310) and the elastic member (320) may be bonded to each other using the film (330) as a medium. In one example, the film (330) may be bonded to the conductive member (310) and the elastic member (320) through an adhesive. The film (330) may serve to facilitate the bonding (or bonding) of the conductive member (310) and the elastic member (320). For example, the film (330) may include a polymer material with excellent thermal stability. For example, the film (330) may be a polyimide film. The film (330) is formed to surround the elastic member (320) and is bonded to the conductive member (310), so that the elastic member (320) may not detach from the conductive member (310) even if impact or friction occurs. In one example, the film (330) may be used as a buffer against impact (or stress) applied to the conductive member (310) or the elastic member (320).
[0056] FIG. 7 is a drawing showing an example of a contact member according to one embodiment, viewed from various angles. Reference numeral 701 of FIG. 7 shows the contact member (300) of FIG. 6 viewed from the +z axis, reference numeral 702 shows the contact member (300) viewed from the -x axis, and reference numeral 703 shows the contact member (300) viewed from the -z axis.
[0057] Referring to FIGS. 5 through 7, in one embodiment, the contact member (300) may be positioned in a compressed state between the support member (132) and the metal layer (212) of the display (210). The width (D2) of the contact member (300) in a first direction (e.g., +z-axis direction) may be formed to be greater than the first distance (D1) between the seating surface (133) of the support member (132) and the metal layer (212). For example, when the contact member (300) is combined with the support member (132) and the metal layer (212), the bending portion (e.g., bending portion (312)) of the conductive member (310) may be further bent. In the combined state, the elastic member (320) may be compressed in a direction parallel to the first direction.
[0058] In one embodiment, the conductive member (310) may include a first portion (311) in contact with the metal layer (212), a second portion (313) in contact with the support member (132), and a bending portion (312) connecting the first portion (311) and the second portion (313). For example, the first portion (311) and the second portion (313) may be in a shape extending in a direction perpendicular to the first direction (e.g., +z-axis direction) (e.g., -y-axis direction). The bending portion (312) may be in a shape formed in a curved manner from the first portion (311) to the second portion (313). At least a portion of the surface facing the +z-axis of the first portion (311) may be in contact with the metal layer (212), and at least a portion of the surface facing the -z-axis may be in contact with the film (330). At least a portion of the surface facing the elastic member (320) of the bending portion (312) may be in contact with the film (330). At least a portion of the surface facing the +z axis of the second portion (313) may be in contact with the film (330), and at least a portion of the surface facing the -z axis may be in contact with the support member (132). The shape of the conductive member (310) is not limited to the above description and may be formed in various shapes. For example, the shape of the conductive member (310) may be deformed within the range in which elastic force is provided by the elastic member (320) so that contact with the support member (132) and the metal layer (212) can be maintained. For example, one end facing the -y axis of the first portion (311) may be extended in a curved manner toward the surface facing the +z axis of the second portion (313), and the first portion (311) and the second portion (313) may be directly connected.
[0059] The second part (313) of the conductive member (310) may be formed to be extended longer than the first part (311). For example, for welding and bonding the conductive member (310) and the support member (132), the length of the second part (313) in one direction (e.g., -y-axis direction) may be formed to be longer than the length of the first part (311) in said one direction. The second part (313) may be formed to be extended further in the -y-axis direction from the bending part (312) compared to the first part (311). For example, the second part (313) may include a part (313a) that overlaps with the first part (311) in a second direction (e.g., -z-axis direction) and an extended part (313b) that does not overlap in said second direction. For example, when viewing the challenge member (310) from above (e.g., on the +z-axis), the first part (311) and the extension part (313b) may be seen side by side.
[0060] The first portion (311) of the conductive member (310) may be formed with at least a portion of an uneven surface to enhance the contact force with the metal layer (212). For example, at least a portion of the first portion (311) may be corroded by an etching process. The surface of the first portion (311) may be formed unevenly due to corrosion. The surface of the first portion (311) facing the metal layer (212) (e.g., the surface facing the +z-axis) may include an uneven surface formed with varying heights depending on the variation in corrosion. The uneven surface may come into contact with the metal layer (212). Due to the formation of the uneven surface, the surface friction force generated when the uneven surface and the metal layer (212) come into contact may be improved compared to the case where the uneven surface is not formed.
[0061] The second portion (313) of the conductive member (310) may include a region welded to the support member (132) and a region bonded to the support member (132). The second portion (313) may include a first region (3131) welded to the support member (132), a second region (3132) bonded to the support member (132), and a third region (3133). The first region (3131) may be distinguished from the second region (3132) and the third region (3133). For example, the first region (3131) may be located at the extension portion (313b) of the second portion (313). The second region (3132) may be located on one side (e.g., +y-axis) of the first region (3131), and the third region (3133) may be located on the other side (e.g., -y-axis) of the first region (3131). The second region (3132) may overlap at least partially with the first part (311) and / or the elastic member (320) in the first direction (e.g., +z-axis direction). The third region (3133) may be located at the -y-axis end of the extension part (313b). By separating the area where the conductive member (310) and the support member (132) are welded (e.g., the first region (3131)) from the area where the conductive member (310) and the support member (132) are bonded (e.g., the second region (3132), the third region (3133)), the precision of the weld can be improved and the occurrence of weld defects can be prevented.
[0062] FIG. 8 is a drawing showing an example of the configurations of a contact member according to one embodiment. FIG. 8 shows the contact member (300) viewed from the -x-axis direction.
[0063] Referring to FIGS. 5 to 8, in one embodiment, the contact member (300) may include a conductive member (310), an elastic member (320), a film (330), an adhesive member (340, 341), and a synthetic resin (350, 360). A first adhesive member (340) and a second adhesive member (341) may be disposed on the surface of the conductive member (310) facing the seating surface (133) of the support member (132) (e.g., the surface facing the -z axis). The first adhesive member (340) and the second adhesive member (341) may be bonded to the conductive member (310) and the support member (132) so that one side of the conductive member (310) (e.g., the -z axis) is fixed to the support member (132). For example, the first adhesive member (340) may be positioned below the second region (3132) of the second part (313) (e.g., the -z axis), and the second adhesive member (341) may be positioned below the third region (3133) of the second part (313). For example, the first adhesive member (340) and the second adhesive member (341) may be positioned to avoid the welded portion of the conductive member (310) (e.g., the first region (3131) of the second part (313)). The adhesive members (340, 341) may firmly secure one side of the conductive member (310) (e.g., the -z axis) and the support member (132), thereby preventing the conductive member (310) from lifting. In one example, the first adhesive member (340) and / or the second adhesive member (341) may be formed from a conductive adhesive. For example, the first adhesive member (340) may be a pressure-sensitive adhesive (PSA).
[0064] A synthetic resin (350, 360) may be placed between the components of the contact member (300) to facilitate maintaining the combined (or bonded) state of the components. For example, a thermosetting material (350) may be placed between the first portion (311) of the conductive member (310) and the film (330). The face of the first portion (311) facing the -z axis and the film (330) may be bonded with the thermosetting material (350). In one example, the thermosetting material (350) may be thermosetting silicone. A thermoplastic material (360) may be placed between the elastic member (320) and the film (330). The face of the elastic member (320) facing the -z axis may be supported by the thermoplastic material (360). In one example, the thermoplastic material (360) may be polyethylene terephthalate (PET).
[0065] In one embodiment, the thermoplastic material (360) may be in contact with the elastic member (320) to support the lower surface of the elastic member (320) (e.g., the surface facing the -z axis). As the thermoplastic material (360) adheres to the lower surface of the elastic member (320), the elastic member (320) may be uniformly adhered on the second portion (313) of the conductive member (310). For example, when the contact member (300) is assembled between the display (210) and the support member (132) and the elastic member (320) is compressed, the thermoplastic material (360) may be uniformly adhered to the lower surface of the elastic member (320). As the thermoplastic material (360) and the elastic member (320) are in close contact, the phenomenon of a part of the elastic member (320) lifting up can be prevented, and the deviation of the elastic force (or repulsive force) generated from the elastic member (320) can be reduced.
[0066] FIG. 9 is a drawing for explaining each part of a conductive member according to one embodiment. Reference numeral 901 of FIG. 9 shows the contact member (300) viewed obliquely along the +z-axis, and reference numeral 902 shows the contact member (300) viewed obliquely along the -z-axis.
[0067] Referring to FIGS. 5 through 9, in one embodiment, the conductive member (310) may be configured to enable contact with the display (210) and contact with the support member (132) with only a single layer extending from the first portion (311) through the bending portion (312) to the second portion (313). The display (210) may be electrically connected to the support member (132) through the conductive member (310) formed as a single metal (e.g., nickel) layer. The first portion (311) of the conductive member (310) may have an uneven surface formed thereon to allow for strong contact with the display (210). At least a portion (e.g., a first region (3131)) of the second portion (313) of the conductive member (310) may be welded to the support member (132) to be physically and / or electrically connected. For example, a laser beam (L) for welding may be incident on the surface facing the +z-axis of the first region (3131). The surface facing the -z-axis of the first region (3131) may be melted together with the seating surface (133) of the support member (132) to form a weld. The remaining parts of the second part (313) (e.g., the second region (3132), the third region (3133)) may be physically connected to the support member (132) through adhesive members (340, 341).
[0068] FIG. 10 is an enlarged view of the portion where a conductive member is welded according to one embodiment. FIG. 10 briefly shows laser welding being performed on the second portion (313) of the conductive member (310).
[0069] Referring to FIGS. 5 through 10, in one embodiment, the conductive member (310) may be welded to the support member (132) by a laser welding method. For example, a laser beam (L) may pass through the second portion (313) of the conductive member (310). The laser beam (L) may be set to penetrate the area (e.g., the first area (3131)) where the adhesive member (340, 341) of the second portion (313) is not placed. For example, the weld bead formed by the laser beam (L) (e.g., the weld bead (314) of FIG. 11) may be spaced apart from the second area (3132) and the third area (3133). Alternatively, the weld bead (314) may be spaced apart from the first adhesive member (340) and the second adhesive member (341). The laser light (L) can be, for example, a CW laser (continuous wave laser) or a pulse laser.
[0070] The first adhesive member (340) and the second adhesive member (341) may be placed between the second part (313) and the support member (132). The first adhesive member (340) and the second adhesive member (341) may be placed to tack-weld (or tack-weld) the conductive member (310) and the support member (132) prior to welding the conductive member (310). In one example, the first adhesive member (340) and the second adhesive member (341) may be formed as an adhesive tape with a width in the first direction (e.g., +z-axis direction) that is thin compared to the conductive member (310). The first adhesive member (340) and the second adhesive member (341) may be formed thinly so that the gap (D3) between the conductive member (310) and the seating surface (133) of the support member (132) can be minimized. The gap (D3) may be set above a certain level to prevent thermal deformation from occurring in the conductive member (310) and / or the seating surface (133) during welding. The gap (D3) may be set below a certain level to prevent the seating surface (133) from being unintentionally penetrated during welding.
[0071] FIG. 11 is a drawing showing an example of the welding shape of a contact member according to one embodiment. FIG. 11 shows the first grounding point (C1) of FIG. 4 shown in FIG. 5 viewed from the +z axis.
[0072] Referring to FIGS. 5 through 11, in one embodiment, a weld bead (314) may be formed in a first region (3131) by welding (e.g., laser welding) the contact member (300) and the seating surface (133) of the support member (132). The weld bead (314) may be formed in multiple numbers, and its shape (or pattern) may be varied to prevent thermal deformation of the conductive member (310). For example, the weld bead (314) may be formed in a circular pattern as shown in FIG. 11. The spacing (D4) between the weld beads (314) or the number of weld beads (314) may be designed considering the thermal deformation of the conductive member (310). For example, the spacing (D4) may be set so that the weld beads (314) are formed densely, thereby preventing thermal deformation of the conductive member (310). The number of weld beads (314) can be adjusted so that the weld beads (314) are not formed densely. For example, the weld beads (314) can be formed with five weld beads arranged in a diagonal shape (or a zigzag shape). The stability of the weld can be improved by separating the area where the weld beads (314) are formed (e.g., the first area (3131)) from the area where the adhesive member (340, 341) is placed (e.g., the second area (3132), the third area (3133)).
[0073] The conductive member (310) and the support member (132) can be electrically connected by welding. The conductive resistance of the conductive member (310) and the support member (132) after welding can be measured to be close to 0Ω. For example, the electrical circuit (or electrical path) formed by the conductive member (310) and the support member (132) after welding can have linearity. For example, in the electrical circuit, the current can increase proportionally with increasing voltage.
[0074] FIG. 12 is a drawing showing examples of the surface of a conductive member according to a comparative example and the surface of a conductive member according to one embodiment. FIG. 12 shows a part of the surface facing the +z-axis of the first part (311) of the conductive member (310).
[0075] Referring to FIGS. 5 through 12, in one embodiment, at least a portion of the surface facing the metal layer (212) of the first portion (311) of the conductive member (310) (e.g., the surface facing the +z axis) may be corroded. For example, an uneven surface (311a, 311b) may be formed on the first portion (311). For example, as shown in reference numeral 1202, the surface facing the +z axis of the first portion (311) may be corroded at least a portion of the surface by soft etching to form a first uneven surface (311a). Or, for example, as shown in reference numeral 1203, the surface facing the +z axis of the first portion (311) may be corroded at least a portion of the surface by dot etching to form a second uneven surface (311b). In comparison, reference numeral 1201 represents a surface (411) facing the +z-axis of a first portion that has not undergone soft etching or dot etching treatment according to a comparative example. The first uneven surface (311a) and the second uneven surface (311b) may have a surface roughness (or surface roughness) that is significantly greater than that of the surface (411) of the comparative example. In one example, the surface roughness of the second uneven surface (311b) may be greater than the surface roughness of the first uneven surface (311a).
[0076] FIG. 13 is a drawing showing examples of the surface of a display according to one embodiment. FIG. 13 shows a portion of the surface facing the -z axis of the metal layer (212) of the display (210).
[0077] Referring to FIGS. 5 through 13, in one embodiment, an oxide film may be formed on the surface of the metal layer (212) facing the first portion (311) of the conductive member (310) (e.g., the surface facing the -z axis) to prevent corrosion. For example, an oxide film containing chromium oxide may be formed on the metal layer (212). For example, as shown in reference numeral 1301, the metal layer (212) may be formed of rolled copper foil, and a first oxide film (212a) may be formed on the surface facing the -z axis. Alternatively, for example, as shown in reference numeral 1302, the metal layer (212) may be formed of electrolytic copper foil, and a second oxide film (212b) may be formed on the surface facing the -z axis. The oxide film (212a, 212b) formed on the metal layer (212) may include an uneven structure. For example, the surface roughness of the second oxide film (212b) may be greater than the surface roughness of the first oxide film (212a).
[0078] FIG. 14 is a table showing a comparison of the friction coefficient between a conductive member and a display according to a comparative example and the friction coefficient between a conductive member and a display according to one embodiment.
[0079] A comparative example relates to the surface of a first portion of a conductive member that has not undergone an etching process as shown in reference number 1201 of FIG. 12. A first embodiment relates to a first uneven surface (311a) of a conductive member (310) that has undergone soft etching as shown in reference number 1202 of FIG. 12. A second embodiment relates to a second uneven surface (311b) of a conductive member (310) that has undergone dot etching as shown in reference number 1203 of FIG. 12. Rolled copper foil relates to a first oxide film (212a) of a metal layer (212) as shown in reference number 1301 of FIG. 13. Electrolytic copper foil relates to a second oxide film (212b) of a metal layer (212) as shown in reference number 1302 of FIG. 13.
[0080] Referring to FIGS. 5 through 14, in one embodiment, an uneven surface (e.g., a first uneven surface (311a) or a second uneven surface (311b)) formed as the surface of a first part (311) is corroded by an etching process may be in contact with at least a portion of an oxide film (e.g., a first oxide film (212a) or a second oxide film (212b)) of a metal layer (212). As the uneven surface comes into contact with and is in contact with the oxide film, at least a portion of the oxide film may be destroyed and detached (or removed) from the display (210). For example, the uneven surface may have a surface roughness greater than a specified value to allow at least a portion of the oxide film to be removed. When at least a portion of the oxide film is damaged, the conductive member (310) may be electrically connected to the display (210) without interference from the oxide film. For example, the stability of the electrical connection between the display (210) and the conductive member (310) can be improved due to the formation of the above-mentioned uneven surface.
[0081] In one embodiment, the friction coefficient (e.g., static friction coefficient, dynamic friction coefficient) between a conductive member (310) including uneven surfaces (311a, 311b) formed through an etching process and a metal layer (212) (e.g., material to be frictioned) may have a relatively large value compared to the friction coefficient between a conductive member including a surface (411) that has not undergone an etching process and a metal layer (212) (e.g., material to be frictioned). For example, the contact force (or friction force, contact pressure) between the conductive member (310) and the metal layer (212) according to the first or second embodiment may be larger than the contact force between the conductive member and the metal layer (212) according to the comparative example. For example, assuming that the same normal force (e.g., elastic force applied to the conductive member (310) in a first direction (e.g., +z-axis direction) by the elastic member (320)) is generated, the uneven surface (311a, 311b) according to the first embodiment or the second embodiment may have an advantageous effect compared to the comparative example in terms of contact force between the conductive member (310) and the metal layer (212). Due to the formation of the first uneven surface (311a) or the second uneven surface (311b), the surface friction force generated between the conductive member (310) and the metal layer (212) may be enhanced.
[0082] FIG. 15 is a graph showing the relationship between the compression ratio and the repulsive force of an elastic member according to one embodiment. The horizontal axis of the graph (G1) in FIG. 15 represents the compression ratio of the elastic member (320), and the vertical axis represents the repulsive force (or elastic force) of the elastic member (320).
[0083] Referring to FIGS. 5 to 15, in one embodiment, the compression ratio of the elastic member (320) and the resulting repulsive force may be set by taking into account the separation distance (e.g., the first distance (D1) in FIG. 6) between the display (210), the contact member (300), and the support member (132) so that stable contact (hereinafter referred to as electric contact) between them can be maintained. For example, the elastic member (320) may be compressed within a predetermined range (R1) to have a repulsive force greater than or equal to the minimum repulsive force (P1) that allows the uneven surfaces (311a, 311b) of the conductive member (310) to strongly contact the metal layer (212) of the display (210). For example, the elastic member (320) may be compressed within a range (R1) in which the electric contact can be stably implemented by taking into account the assembly deviation inside the housing (e.g., the housing (101) in FIG. 3). In one example, the compression range (R1) of the elastic member (320) may be set to a compression ratio (e.g., 20%) that generates a minimum repulsive force (P1) at which the electrical contact is implemented, or a compression ratio (e.g., 40%) that generates a repulsive force (P2) at which no damage or deformation occurs to the contact member (300) and the display (210). The repulsive force of the elastic member (320) may be increased substantially in proportion to the compression ratio of the elastic member (320).
[0084] According to one embodiment, the electrical connection between the conductive member (310) and the support member (132) and the electrical connection between the conductive member (310) and the display (210) can be stably implemented by the contact member (300). As the electrical connection is stably implemented, the performance deviation of the antenna and / or the performance degradation of the RF (radio frequency) element (e.g., signal distortion or signal interference) can be improved.
[0085] An electronic device (100) according to one embodiment may be configured to implement an electrical connection between a display (210) and a support member (132) using a conductive member (310) formed from a single metal (e.g., nickel) layer. The electronic device (100) may not include a separate layer (e.g., an auxiliary layer for welding, or a plating layer) for implementing the electrical connection in addition to the conductive member (310). The electronic device (100) may include a single contact member (300) in which the conductive member (310), an elastic member (320), and a film (330) are integrally formed. Since the electronic device (100) does not require two or more types of members (or parts) for the electrical connection, the components for the electrical connection may be reduced, and there may be advantages in the manufacturing process.
[0086] An electronic device according to one embodiment disclosed in this document comprises: a housing including a front, a rear opposite to the front, and a side that surrounds the space between the front and the rear; a display disposed in the space and visible through the front; a support member having at least a portion disposed between the display and the rear; and a contact member configured to electrically connect the display and the support member, wherein the contact member comprises an elastic member and a conductive member that is bent to surround at least a portion of the elastic member, the conductive member comprises a first portion that contacts the display and a second portion that contacts the support member, the first portion comprises an uneven surface, the second portion comprises a first region welded to the support member and a second region that is bonded to the support member, and the first region may be formed as a single layer.
[0087] According to one embodiment disclosed in this document, the display includes a metal layer, and an oxide film may be formed on the surface facing the uneven surface of the metal layer.
[0088] According to one embodiment disclosed in this document, the uneven surface may have a surface roughness greater than a specified value to remove at least a portion of the oxide film.
[0089] According to one embodiment disclosed in this document, the surface roughness of the uneven surface may be greater than the surface roughness of the oxide film.
[0090] According to one embodiment disclosed in this document, the uneven surface may be formed by corrosion of the first part.
[0091] According to one embodiment disclosed in this document, the elastic member may be disposed in a compressed state between the first part and the second part to apply an elastic force toward the display to the first part.
[0092] According to one embodiment disclosed in this document, at least a portion of the oxide film in contact with the uneven surface may be damaged by the elastic force.
[0093] According to one embodiment disclosed in this document, the conductive member includes a bending portion connecting the first portion and the second portion, and the elastic member may be surrounded by the first portion, the second portion, and the bending portion.
[0094] According to one embodiment disclosed in this document, the first portion and the second portion extend in the same direction from the bending portion, and the second portion includes an extension portion that extends longer than the first portion, and the first region may be located at the extension portion.
[0095] According to one embodiment disclosed in this document, the second region is located on one side of the first region and may overlap at least partially with the elastic member in a first direction toward which the front face is facing.
[0096] According to one embodiment disclosed in this document, the second portion includes a third portion located on one side of the first portion, and the third portion may be located in the extended portion.
[0097] According to one embodiment disclosed in this document, a first adhesive member is disposed between the second region and the support member, a second adhesive member is disposed between the third region and the support member, and the first region may be at least partially spaced apart from the support member.
[0098] According to one embodiment disclosed in this document, the first region and the support member may be laser welded.
[0099] According to one embodiment disclosed in this document, the first region may include a plurality of weld beads spaced apart at designated intervals to prevent thermal deformation of the conductive member.
[0100] According to one embodiment disclosed in this document, the contact member further comprises a film disposed between the conductive member and the elastic member and surrounding the elastic member, and the film may be bonded to the conductive member with a thermosetting material.
[0101] According to one embodiment disclosed in this document, a thermoplastic material may be disposed on the surface of the elastic member facing the support member.
[0102] According to one embodiment disclosed in this document, an adhesive member may not be disposed in the first region.
[0103] According to one embodiment disclosed in this document, the conductive member may comprise nickel, and the supporting member may comprise aluminum.
[0104] According to one embodiment disclosed in this document, the side comprises at least one segment formed of metal, and the contact member may be disposed adjacent to the at least one segment.
[0105] According to one embodiment disclosed in this document, an antenna module disposed within the housing is included, wherein at least one segment is used as a radiator of the antenna module, and the contact member may be configured to form at least a part of the ground path of the antenna module.
Claims
1. In an electronic device, A housing comprising a front, a rear opposite to the front, and a side surrounding the space between the front and the rear; A display positioned in the above space and visible through the above front; A support member having at least a portion disposed between the display and the rear surface; and It includes a contact member configured to electrically connect the display and the support member, and The above contact member comprises an elastic member and a conductive member that is bent to surround at least a portion of the elastic member, and The above conductive member includes a first portion in contact with the display and a second portion in contact with the support member, and The above first part includes an uneven surface, and The second portion includes a first region welded to the support member and a second region bonded to the support member, and The above first region is an electronic device formed as a single layer.
2. In Claim 1, The above display includes a metal layer, and An electronic device in which an oxide film is formed on the surface facing the uneven surface of the metal layer.
3. In Claim 2, The above-mentioned uneven surface has a surface roughness greater than or equal to a specified value for removing at least a portion of the oxide film, in an electronic device.
4. In Claim 3, An electronic device in which the surface roughness of the above uneven surface is greater than the surface roughness of the above oxide film.
5. In Claim 4, The above uneven surface is formed by corrosion of the first part, in an electronic device.
6. In Claim 5, An electronic device in which the elastic member is positioned in a compressed state between the first part and the second part to apply an elastic force toward the display to the first part.
7. In Claim 6, The above oxide film is an electronic device in which at least a portion of the surface in contact with the above uneven surface is damaged by the elastic force.
8. In Claim 1, The above-mentioned conductive member includes a bending portion connecting the first portion and the second portion, and The above elastic member is surrounded by the first part, the second part, and the bending part, in an electronic device.
9. In Claim 8, The first part and the second part extend in the same direction from the bending part, and The second part includes an extended portion that extends longer than the first part, and The first region is an electronic device located in the extension portion.
10. In Claim 9, An electronic device wherein the second region is located on one side of the first region and at least partially overlaps with the elastic member and the first direction toward which the front faces.
11. In Claim 10, The second portion includes a third portion located on one side of the first portion, and The above third region is an electronic device located in the above extension portion.
12. In Claim 11, A first adhesive member is disposed between the second region and the support member, and A second adhesive member is disposed between the third region and the support member, and The above first region is an electronic device that is at least partially spaced apart from the support member.
13. In Claim 12, An electronic device in which the first region and the support member are laser welded.
14. In Claim 13, The electronic device, wherein the first region comprises a plurality of weld beads spaced apart at designated intervals to prevent thermal deformation of the conductive member.
15. In Claim 1, The above contact member further includes a film disposed between the conductive member and the elastic member and surrounding the elastic member, and The above film is an electronic device that is bonded to the above conductive member with a thermosetting material.
Citation Information
Patent Citations
Embedded antenna device for water-proof mobile phone
KR101400846B1
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KR1020160063214A
Electronic apparatus having metal case and metal case used therein
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Method for preparing soy sauce decoction and soy sauce decoction prepared thereby
KR102279702B1