Image processing method and related apparatus

Abstract

The present application relates to the field of wafer dicing machines, and discloses an image processing method and a related apparatus. Upon receiving a trigger on a first control, a motion control is controlled to move to a position represented by the first control, so that the motion control drives an image acquisition module to move to the position; and the image acquisition module is controlled to capture a dicing object in real time, so that an image captured by the image acquisition module is displayed. A process engineer can intuitively view, in a preset display area in a display interface, a physical image of specific dicing street coordinates corresponding to the first control, so as to check whether alignment coordinates are correct, without manually viewing a size table of the dicing object and then comparing same with coordinate data of a dicing street, thereby reducing the probability of misviewing and shortening the check time.

Description

An image processing method and related apparatus

[0001] This application claims priority to a domestic application filed on November 8, 2024, with application number 202411589459X and entitled "An Image Processing Method and Related Apparatus", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of wafer dicing machines, and more specifically, to an image processing method and related apparatus. Background Technology

[0003] Wafer dicing machines are indispensable key equipment in semiconductor manufacturing, primarily used to cut entire wafers into individual chip dies. The two main processes of wafer dicing are alignment and cutting. Ensuring accurate alignment and correct coordinates is a prerequisite for successful cutting.

[0004] To ensure alignment accuracy, the wafer dicing machine displays the coordinate data of the dicing ridges on the display interface. Process engineers will compare the dimensions of the workpiece with the coordinate data of the dicing ridges on the display interface, which is easy to make mistakes and takes a long time. Summary of the Invention

[0005] In view of the above problems, this application provides an image processing method and related apparatus. The specific solution is as follows:

[0006] The first aspect of this application provides an image processing method, comprising:

[0007] In response to the received trigger on the first control in the coordinate list in the display interface, the motion control is controlled to move to the position represented by the first control. The coordinate list also displays a number of second controls in addition to the first control. The first control and each of the second controls respectively represent the coordinate data of a cutting path of the current cutting surface of the cutting object. The positions represented by the first control and each of the second controls are different.

[0008] After the motion control moves the image acquisition module to the position indicated by the first control, the image acquisition module is controlled to take a picture of the cut object to obtain the captured image;

[0009] If a trigger is received on the shooting parameter control during the shooting process, the shooting parameters of the image acquisition module are adjusted;

[0010] The image captured by the image acquisition module is displayed in the preset display area of ​​the display interface.

[0011] In one possible implementation, after receiving a trigger on the first control, the image processing method further includes:

[0012] Determine whether a captured image already exists corresponding to the location represented by the first control;

[0013] If an image has been captured corresponding to the location indicated by the first control, the captured image corresponding to the location indicated by the first control is displayed in the preset display area.

[0014] In one possible implementation, if the coordinate list displays multi-step cutting track data, for each step, the color of the first coordinate data of that step is different from the color of the other coordinate data of that step.

[0015] In one possible implementation, the coordinate list uses at least two background colors to alternately display the coordinate data of multiple cutting paths on the current cutting surface of the cutting object.

[0016] In one possible implementation, when the image acquisition module is a high-magnification microscope camera and the upper left corner of the object to be cut is located at the center of the high-magnification microscope camera, the display interface is also used to display the coordinates of the upper left corner of the object to be cut.

[0017] In one possible implementation, adjusting the shooting parameters of the image acquisition module if a trigger to the shooting parameter control is received during the shooting process includes:

[0018] In response to a received trigger on the brightness control, the image brightness adjustment interface is displayed;

[0019] In response to receiving a trigger on at least one brightness adjustment control in the image brightness adjustment interface, the brightness parameters of the image acquisition module are adjusted accordingly. The image brightness adjustment interface includes at least one of a direct illumination adjustment control, an oblique illumination adjustment control, an automatic brightness control, and an initial brightness control.

[0020] In one possible implementation, adjusting the shooting parameters of the image acquisition module if a trigger to the shooting parameter control is received during the shooting process includes:

[0021] In response to the received trigger of the focus control, the focus adjustment interface is displayed;

[0022] In response to receiving a trigger on the focus adjustment control in the focus adjustment interface, the image acquisition module performs automatic or manual focus. The focus adjustment interface includes a variety of focus adjustment controls, each with different focus parameters.

[0023] In one possible implementation, the image acquisition module includes a high-magnification microscope and a low-magnification microscope. After the image captured by the image acquisition module is displayed in a preset display area on the display interface, the image processing method further includes:

[0024] In response to the received trigger on the scaling factor change control, the scaling factor change interface is displayed;

[0025] In response to a received trigger on the high-magnification microscope control in the magnification change interface, the image captured by the high-magnification microscope is displayed in the preset display area;

[0026] or,

[0027] In response to a received trigger on the low-magnification microscope control in the magnification change interface, the image captured by the low-magnification microscope is displayed in the preset display area.

[0028] A second aspect of this application provides an image processing apparatus, comprising:

[0029] The motion control module is used to respond to the received trigger of the first control in the coordinate list in the display interface, and control the motion control to move to the position represented by the first control. The coordinate list also displays a number of second controls in addition to the first control. The first control and each second control respectively represent the coordinate data of a cutting path of the current cutting surface of the cutting object. The positions represented by the first control and each second control are different.

[0030] The shooting control module is used to control the image acquisition module to take a picture of the cut object after the motion control moves the image acquisition module to the position indicated by the first control, so as to obtain the captured image;

[0031] The parameter adjustment module is used to adjust the shooting parameters of the image acquisition module if a trigger to the shooting parameter control is received during the shooting process.

[0032] An image display module is used to display the image captured by the image acquisition module in a preset display area of ​​the display interface.

[0033] A third aspect of this application provides a controller disposed in a wafer dicing machine, comprising at least one processor and a memory connected to the processor, wherein:

[0034] The memory is used to store computer programs;

[0035] The processor is used to execute the computer program so that the controller can implement the image processing method of the first aspect or any implementation thereof.

[0036] A fourth aspect of this application provides a wafer dicing machine, including: a controller, a motion control, an image acquisition module, and a display;

[0037] The motion control is used to move the image acquisition module under the control of the controller;

[0038] The image acquisition module is used to photograph the object to be cut under the control of the controller;

[0039] The display is used to display the image captured by the image acquisition module in a preset display area in the display interface;

[0040] The controller is used to implement the image processing method described in the first aspect or any implementation thereof.

[0041] The fifth aspect of this application provides a computer program product including computer-readable instructions that, when executed on a controller, cause the controller to implement the image processing method described in the first aspect or any implementation thereof.

[0042] The sixth aspect of this application provides a computer storage medium carrying one or more computer programs, which, when executed by a controller, enable the controller to perform the image processing method described in the first aspect or any implementation thereof.

[0043] By means of the above technical solution, the image processing method and related apparatus provided in this application, after receiving a trigger on the first control, control the motion control to move to the position indicated by the first control, thereby causing the motion control to drive the image acquisition module to move to that position, controlling the image acquisition module to take real-time pictures of the cutting object, and then displaying the image captured by the image acquisition module. The process engineer can intuitively view the physical image of the specific cutting track coordinates corresponding to the first control in the preset display area of ​​the display interface, thereby checking whether the alignment coordinates are correct, without having to manually check the size table of the cutting object and compare it with the coordinate data of the cutting track, reducing the probability of misreading and shortening the inspection time. Attached Figure Description

[0044] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale.

[0045] Figure 1 is a flowchart illustrating an image processing method provided in an embodiment of this application;

[0046] Figure 2 is a schematic diagram of the display interface of the wafer dicing machine provided in an embodiment of this application;

[0047] Figure 3 is a schematic diagram of the single-step cutting track distribution provided in an embodiment of this application;

[0048] Figure 4 is a schematic diagram of the multi-step cutting track distribution provided in an embodiment of this application;

[0049] Figure 5 is a schematic diagram of the image brightness adjustment interface provided in an embodiment of this application;

[0050] Figure 6 is a schematic diagram of the focus adjustment interface provided in an embodiment of this application;

[0051] Figure 7 is a schematic diagram of an image taken by a high-magnification microscope camera provided in an embodiment of this application;

[0052] Figure 8 is a schematic diagram of an image taken by a low-magnification microscope camera provided in an embodiment of this application;

[0053] Figure 9 is a schematic diagram of the automatic cutting (2.4) screen provided in an embodiment of this application;

[0054] Figure 10 is a schematic diagram of a semi-automatic cutting (2.5) screen provided in an embodiment of this application;

[0055] Figure 11 is a schematic diagram of the fully automatic cutting status screen provided in an embodiment of this application;

[0056] Figure 12 is a schematic diagram of the pause screen provided in an embodiment of this application;

[0057] Figure 13 is a schematic diagram of the structure of an image processing device provided in an embodiment of this application;

[0058] Figure 14 is a schematic diagram of the structure of a controller provided in an embodiment of this application. Detailed Implementation

[0059] The embodiments of this application are described below with reference to the accompanying drawings. The terminology used in the implementation section of this application is for explaining specific embodiments only and is not intended to limit the scope of this application.

[0060] The embodiments of this application will now be described with reference to the accompanying drawings. Those skilled in the art will recognize that, with technological advancements and the emergence of new scenarios, the technical solutions provided in the embodiments of this application are equally applicable to similar technical problems.

[0061] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms are interchangeable where appropriate; this is merely a way of distinguishing objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of elements is not necessarily limited to those elements, but may include other elements not explicitly listed or inherent to those processes, methods, products, or apparatuses.

[0062] This application provides an image processing method applied to the controller of a wafer dicing machine. The image processing method of this application embodiment will be described in detail below with reference to the accompanying drawings.

[0063] Referring to Figure 1, which is a flowchart illustrating an image processing method provided in an embodiment of this application, the image processing method provided in this application may include steps 101 to 104, which will be described in detail below.

[0064] 101: In response to the received trigger on the first control in the coordinate list on the display interface, control the motion control to move to the position represented by the first control;

[0065] The display screen of the wafer dicing machine can provide a picture of the alignment and length measurement results, that is, a coordinate list in the display interface, which is used to display the physical coordinates of all the cutting tracks of the current cutting surface. The physical coordinates of each cutting track correspond to a control, and the control can represent the position of the physical coordinates of the corresponding cutting track. The first control can be any of the above controls.

[0066] The coordinate list in the display interface also shows multiple second controls in addition to the first control. For ease of representation, the control triggered by the user is the first control, and the controls corresponding to other cutting paths in the coordinate list are the second controls. The first control and each second control represent the coordinate data of a cutting path on the current cutting surface of the cutting object. The positions represented by the first control and each second control are different.

[0067] When a user, such as a process engineer, triggers the first control, the controller receives the trigger signal from the first control and controls the motion control to move to the position indicated by the first control.

[0068] The method by which the user triggers the first control is related to the hardware and software architecture of the wafer dicing machine. If the wafer dicing machine's display screen is a touch screen and the software is touch control software, then the user triggers the first control through touch operation. In other embodiments, the user can also trigger the first control through one or more of the following methods: physical keyboard, function keys, trackball, mouse, joystick, etc.

[0069] 102: After the motion control moves the image acquisition module to the position indicated by the first control, the image acquisition module is controlled to take a picture of the cut object to obtain the captured image;

[0070] The motion control can move the image acquisition module. By controlling the motion control to move to the position indicated by the first control, the motion control can move the image acquisition module to the position indicated by the first control. After the image acquisition module moves to the position indicated by the first control, the controller controls the image acquisition module to take a picture of the cut object.

[0071] The image acquisition module includes at least one image acquisition device. In one possible implementation, the image acquisition module includes a low-magnification microscope camera; in another possible implementation, the image acquisition module includes a high-magnification microscope camera; and in yet another possible implementation, the image acquisition module includes both a low-magnification microscope camera and a high-magnification microscope camera.

[0072] 103: If a trigger is received on the shooting parameter control during the shooting process, adjust the shooting parameters of the image acquisition module;

[0073] The shooting parameters of the image acquisition module include: brightness, focal length, etc.

[0074] By adjusting the shooting parameters of the image acquisition module, users can meet different shooting needs for the object being cut.

[0075] 104: Display the image captured by the image acquisition module in the preset display area of ​​the display interface.

[0076] Figure 2 shows a schematic diagram of the display interface of the wafer dicing machine. The following sections describe each control in the display interface of the wafer dicing machine.

[0077] The control represented by number 3 is the workpiece number control. Each workpiece number corresponds to a cutting object. If there are multiple cutting objects, you can select the specific cutting object by triggering this control to select the workpiece number.

[0078] The control represented by number 4 is a channel control, which is the current cutting surface of the cutting object corresponding to the workpiece number.

[0079] The control represented by number 6 is the current page number control of the coordinate list of the dicing track, and the control represented by number 7 is the total page number control of the coordinate list of the dicing track. Due to the limitations of the display interface of the wafer dicing machine, if there are many dicing tracks, it is necessary to display them in pages. Taking the dicing track of the dicing object shown in Figure 2 as an example, the coordinate list of the dicing track includes 7 pages, and the current display is page 2.

[0080] The control represented by number 8 is the previous page control. When the user triggers this control, the user switches to the previous page of the current page number. If there is no previous page, the coordinate list of the cutting path will not change when the user triggers this control.

[0081] The control represented by number 9 is the next page control. When the user triggers this control, the user switches to the next page of the current page number. If there is no next page, the coordinate list of the cutting path that triggers this control does not change.

[0082] The area corresponding to number 2 represents a list of coordinates for the cutting path. This list displays the current cutting surface, the cutting path number for the current page, and the actual alignment coordinates. In some embodiments, each cutting path corresponds to a control. For ease of representation, the control triggered by the user is designated as the first control. After the user triggers the first control, the controller controls the motion control to move the image acquisition module to the position indicated by the first control. Here, No represents the cutting path number, the step represents the distance relative to the previous cutting path (a relative positional distance), Y represents the actual coordinate Y of the high-magnification microscope when the cutting path is located at the center of the high-magnification microscope, and θ represents the actual coordinate θ of the high-magnification microscope when the cutting path is located at the center of the high-magnification microscope.

[0083] The display area corresponding to number 1 is used to display the above image, which is a real-time image captured by the image acquisition module.

[0084] The control corresponding to number 10 is the Ch1 control. When the user triggers this control, the user switches to cutting face 1. If there is no cutting face 1, the user will not jump when triggering this control. If the current cutting face is cutting face 1, the control will not display the text description Ch1 (the current cutting face is cutting face 1 in Figure 2).

[0085] The control corresponding to number 11 is the Ch2 control. When the user triggers this control, the user is switched to cutting face 2. If there is no cutting face 2, the user will not switch when the user triggers this control.

[0086] The control corresponding to number 12 is the Ch3 control. When the user triggers this control, the user is switched to cutting face 3. If there is no cutting face 3, the user will not switch when the user triggers this control.

[0087] The control corresponding to number 13 is the Ch4 control. When the user triggers this control, the user is switched to cutting face 4. If there is no cutting face 4, the user will not switch when the user triggers this control.

[0088] In some embodiments, the control corresponding to number 14 is a view cutting track control. When the user selects one data point in the coordinate list, the control is triggered, and the controller controls the motion control to move the image acquisition module to the position indicated by the selected data point.

[0089] The other controls represented by the numbers in Figure 2 will be described in detail in subsequent embodiments, and will not be repeated here.

[0090] As can be seen, the image processing method disclosed in this embodiment, after receiving a trigger on the first control, controls the motion control to move to the position represented by the first control, thereby causing the motion control to move the image acquisition module to that position, controlling the image acquisition module to take real-time pictures of the cutting object, and then displaying the image captured by the image acquisition module. The process engineer can intuitively view the physical image of the specific cutting track coordinates corresponding to the first control in the preset display area of ​​the display interface, thereby checking whether the alignment coordinates are correct, without having to manually check the size table of the cutting object and compare it with the coordinate data of the cutting track, reducing the chance of misreading and shortening the inspection time.

[0091] In one possible implementation, after step 104 above, the captured image corresponding to the position indicated by the first control is saved, for example, using the cutting channel data corresponding to the first control as the key and the image as the value. Upon receiving a trigger on the first control, it is determined whether a captured image corresponding to the position indicated by the first control already exists. If such an image exists, it is displayed in a preset display area. This avoids repeated control of the motion control to move the image acquisition module to the position indicated by the first control when the user repeatedly triggers it, thus preventing wear and tear on the motion control and image acquisition module, and improving display speed.

[0092] In practical applications, wafer dicing machines may be single-step or multi-step dicing. Figure 3 shows a schematic diagram of the single-step dicing run distribution, where each dicing run (dicing run number 1-9) has the same distribution. Figure 4 shows a schematic diagram of the multi-step dicing run distribution, where the distribution of dicing run numbers 1-4 is not entirely the same, and the distribution of dicing run numbers 5-8 is also not entirely the same, but the distribution of dicing run numbers 1-4 and 5-8 is the same, arranged cyclically. If the coordinate list displays multi-step dicing run data, to distinguish different steps and facilitate quick user location, in this embodiment, the color of the first coordinate data of each step is different from the colors of the other coordinate data of that step. For example, the first coordinate data of a step is displayed in red, and the other coordinate data are displayed in black. Regarding the multi-step dicing run distribution schematic diagram shown in Figure 4, the coordinate data colors of dicing run numbers 1 and 4 in the coordinate list are different from the coordinate data colors of the other numbers.

[0093] In addition, if there are too many coordinate data of the cutting track in the coordinate list, it is easy for the human eye to misread them. In this embodiment, at least two background colors are used to alternately display the coordinate data of multiple cutting tracks on the current cutting surface of the cutting object. Taking the alternating display of two background colors as an example, the display effect is shown in the schematic diagram of the wafer dicing machine display interface in Figure 2. This makes it easier for users to distinguish the coordinate data of different cutting tracks according to the background color and prevent misreading.

[0094] In one possible implementation, when the image acquisition module is a high-magnification microscope camera and the upper left corner of the object to be cut is located at the center of the high-magnification microscope camera, the display interface is also used to display the coordinates of the upper left corner of the object to be cut, as shown in the schematic diagram of the wafer dicing machine display interface in Figure 2. Number 5 indicates the upper left corner control, which displays the coordinates of the upper left corner of the object to be cut. Displaying the coordinates of the upper left corner of the object to be cut helps the user confirm whether the Y-coordinate in the coordinate list is correct and check whether the alignment coordinates are offset overall. Theoretically, the Y-value of the upper left corner of the object to be cut must be larger than the Y-value of the cutting path, because the cutting path must be distributed below the upper left corner of the object to be cut; the cutting path cannot be distributed outside the object to be cut.

[0095] In one possible implementation, the image acquisition module's shooting parameters include brightness parameters. Adjusting the image acquisition module's shooting parameters specifically includes the following steps A1-A2:

[0096] A1: In response to the received trigger on the brightness control, display the image brightness adjustment interface;

[0097] For example, the brightness control is the control corresponding to number 15 shown in Figure 2. After the user triggers the control, the image brightness adjustment interface shown in Figure 5 is displayed. In the image brightness adjustment interface, the brightness of the image acquisition module (e.g., the current microscope camera) can be adjusted by triggering at least one brightness adjustment control to make the image clearer.

[0098] A2: In response to receiving a trigger on at least one brightness adjustment control in the image brightness adjustment interface, the brightness parameters of the image acquisition module are adjusted accordingly.

[0099] The image brightness adjustment interface includes at least one of the following: direct illumination adjustment control, oblique illumination adjustment control, automatic brightness control, and initial brightness control. Users can trigger at least one of these brightness adjustment controls to adjust the brightness parameters of the image acquisition module. Specifically, triggering the direct illumination adjustment control adjusts the direct illumination of the image acquisition module; triggering the oblique illumination adjustment control adjusts the oblique illumination of the image acquisition module; triggering the automatic brightness control automatically adjusts the direct and oblique illumination of the image acquisition module to their default values; and triggering the initial brightness control adjusts the direct and oblique illumination of the image acquisition module to their initial values.

[0100] In some embodiments, there are multiple direct light adjustment controls and multiple oblique light adjustment controls. Each direct light adjustment control corresponds to a different direct light adjustment amount, and each oblique light adjustment control corresponds to a different oblique light adjustment amount. As shown in Figure 5, the adjustment range for both direct and oblique light is 0-255. The purpose of setting multiple adjustment controls in this embodiment is to adjust to the appropriate light level more quickly. For example, if the target value for direct light is 186 and the current direct light level is 0, then triggering the +50 direct light adjustment control 4 times, the -5 direct light adjustment control 3 times, and the +1 direct light adjustment control 1 time, for a total of 8 triggers, is sufficient to adjust to the target value. However, if there is only a +1 direct light adjustment control, then 186 triggers are required, which would affect the user experience.

[0101] In addition, as shown in Figure 5, the image brightness adjustment interface can also include default values ​​for direct light and oblique light, current direct light and current oblique light, so as to facilitate real-time viewing of the adjusted current direct light and current oblique light.

[0102] It should be noted that, if the user does not trigger the brightness adjustment control, the image acquisition module will take a picture of the object to be cut based on the pre-configured default values ​​for direct light and oblique light.

[0103] In one possible implementation, the shooting parameters of the image acquisition module include focal length. Adjusting the shooting parameters of the image acquisition module specifically includes the following steps B1-B2:

[0104] B1: In response to the received trigger of the focus control, display the focus adjustment interface;

[0105] For example, the focus control is the control corresponding to number 16 shown in Figure 2. After the user triggers the control, the focus adjustment interface shown in Figure 6 is displayed. In the focus adjustment interface, the focus length of the microscope camera can be adjusted by triggering the focus adjustment control to make the image clearer.

[0106] B2: In response to receiving a trigger on the focus adjustment control in the focus adjustment interface, the image acquisition module performs automatic or manual focus.

[0107] The focus adjustment interface includes a variety of focus adjustment controls, each with different focus parameters.

[0108] For example, as shown in Figure 6, the focus adjustment interface includes: F8, an autofocus control that initiates autofocus upon activation; F3, a focus adjustment control centered on the position where the distance from the worktable is equal to the [film thickness + object thickness] set in the current cutting parameters, and initiates autofocus; F4, a large-stroke autofocus control that initiates large-area (approximately 4mm wide) autofocus upon activation; F9, a small-stroke autofocus control that initiates small-area (approximately 0.4mm wide) autofocus; and F5, a focus adjustment control that returns the microscope to its initial position and initiates autofocus. Other focus adjustment controls are manual focus controls: F2, an upward focus control that raises the microscope via a scanning motion upon activation; and F7, a downward focus control that lowers the microscope via a scanning motion upon activation.

[0109] In some embodiments, the focus adjustment interface may also include a brightness control, which the user triggers to display the image brightness adjustment interface.

[0110] In some embodiments, the image acquisition module includes a high-magnification microscope and a low-magnification microscope, and after step 104 in the above embodiments, it further includes the following steps C1-C3:

[0111] C1: In response to the received trigger on the scaling factor change control, display the scaling factor change interface;

[0112] For example, the multiplier change control is the control corresponding to number 17 shown in Figure 2. After the user triggers the control, the multiplier change interface is displayed.

[0113] C2: In response to the received triggering of the high-magnification microscope control in the magnification change interface, display the image captured by the high-magnification microscope in the preset display area;

[0114] or,

[0115] C3: In response to a received trigger on the low-magnification microscope control in the magnification change interface, display the image captured by the low-magnification microscope in the preset display area.

[0116] Specifically, Figure 7 shows an image taken by a high-magnification microscope camera, and Figure 8 shows an image taken by a low-magnification microscope camera at the same location. This embodiment provides a magnification change function to meet the user's need to view images taken by microscope cameras at different magnifications.

[0117] Furthermore, the controller can determine whether cutting is in progress. If not, it controls the lighting to turn on, opens the cover of the image acquisition module, activates the air blowing function of the image acquisition module, and displays the alignment and length measurement results, the first object to be cut, the first cut surface, and the data on the first page. The cover of the image acquisition module prevents water from entering the lens, and the air blowing function removes water droplets from the object being cut, resulting in clearer images.

[0118] If cutting is in progress, the automatic cutting screen can also be displayed in response to the received trigger of the automatic cutting control. For example, the automatic cutting (2.4) screen is shown in Figure 9.

[0119] In response to the received trigger of the semi-automatic cutting control, the semi-automatic cutting screen is displayed. For example, the semi-automatic cutting (2.5) screen is shown in Figure 10.

[0120] In response to the received trigger of the fully automatic cutting control, the fully automatic cutting status screen is displayed. For example, the fully automatic cutting status screen is shown in Figure 11.

[0121] In response to the received trigger of the pause control, a pause screen is displayed, as shown in Figure 12.

[0122] All four screens include an alignment and length measurement result control. Responding to a received trigger on the alignment and length measurement result control, the alignment and length measurement result screen is displayed. When the alignment and length measurement result screen is brought up from the cutting status screen, the buttons below are hidden: View Cutting Track, Light Intensity, Focus, and Magnification Change. The light source, microscope camera cover, and camera air blowing function are all disabled. This is because cutting is in progress, and the axis cannot be moved or the cutting track cannot be viewed.

[0123] The above describes an image processing method provided by an embodiment of this application. The following describes the apparatus for performing the above image processing method.

[0124] Please refer to Figure 13, which is a schematic diagram of the structure of an image processing apparatus provided in an embodiment of this application. As shown in Figure 13, the image processing apparatus includes:

[0125] The motion control module 131 is used to respond to the received triggering of the first control in the coordinate list in the display interface, and control the motion control to move to the position represented by the first control. The coordinate list also displays a plurality of second controls in addition to the first control. The first control and each of the second controls respectively represent the coordinate data of a cutting path of the current cutting surface of the cutting object. The positions represented by the first control and each of the second controls are different.

[0126] The shooting control module 132 is used to control the image acquisition module to shoot the cutting object after the motion control moves the image acquisition module to the position indicated by the first control, so as to obtain the captured image;

[0127] The parameter adjustment module 133 is used to adjust the shooting parameters of the image acquisition module if a trigger to the shooting parameter control is received during the shooting process.

[0128] The image display module 134 is used to display the image captured by the image acquisition module in a preset display area in the display interface.

[0129] In one possible implementation, the image processing apparatus further includes:

[0130] The judgment module is used to determine whether a captured image corresponding to the position represented by the first control already exists; if a captured image corresponding to the position represented by the first control exists, the captured image corresponding to the position represented by the first control is displayed in the preset display area.

[0131] In one possible implementation, if the coordinate list displays multi-step cutting track data, for each step, the color of the first coordinate data of that step is different from the color of the other coordinate data of that step.

[0132] In one possible implementation, the coordinate list uses at least two background colors to alternately display the coordinate data of multiple cutting paths on the current cutting surface of the cutting object.

[0133] In one possible implementation, when the image acquisition module is a high-magnification microscope camera and the upper left corner of the object to be cut is located at the center of the high-magnification microscope camera, the display interface is also used to display the coordinates of the upper left corner of the object to be cut.

[0134] In one possible implementation, the parameter adjustment module 133 includes:

[0135] A brightness adjustment submodule is used to display an image brightness adjustment interface in response to a received trigger of a brightness control; and to adjust the brightness parameters of the image acquisition module accordingly in response to a received trigger of at least one brightness adjustment control in the image brightness adjustment interface, wherein the image brightness adjustment interface includes at least one of a direct light adjustment control, an oblique light adjustment control, an automatic brightness control, and an initial brightness control.

[0136] In one possible implementation, the parameter adjustment module 133 includes:

[0137] The focus adjustment submodule is used to display the focus adjustment interface in response to a received trigger on the focus control; and to perform automatic or manual focus on the image acquisition module in response to a received trigger on the focus adjustment control in the focus adjustment interface. The focus adjustment interface includes a variety of focus adjustment controls, each with different focus parameters.

[0138] In one possible implementation, the image acquisition module includes a high-magnification microscope camera and a low-magnification microscope camera, and the image processing device further includes:

[0139] The magnification change module is used to display a magnification change interface in response to a received trigger of the magnification change control; to display an image captured by the high-magnification microscope in the preset display area in response to a received trigger of the high-magnification microscope control in the magnification change interface; or to display an image captured by the low-magnification microscope in the preset display area in response to a received trigger of the low-magnification microscope control in the magnification change interface.

[0140] This embodiment discloses an image processing device relating to the field of wafer dicing machines. After receiving a trigger on a first control, the device moves a motion control to the position indicated by the first control, thereby causing the motion control to move the image acquisition module to that position. The image acquisition module is then controlled to take real-time pictures of the dicing object, and the pictures taken by the image acquisition module are displayed. Process engineers can intuitively view the physical image of the specific dicing track coordinates corresponding to the first control in the preset display area of ​​the display interface, thereby checking whether the alignment coordinates are correct, without having to manually check the size table of the dicing object and compare it with the coordinate data of the dicing track, reducing the chance of misreading and shortening the inspection time.

[0141] Figure 14 provides a schematic diagram of a controller. As shown in Figure 14, the controller includes a bus 141, a processor 142, a communication interface 143, and a memory 144. The processor 142, the memory 144, and the communication interface 143 communicate with each other via the bus 141.

[0142] Bus 141 can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of representation, only one thick line is used in Figure 14, but this does not indicate that there is only one bus or one type of bus.

[0143] The processor 142 can be any one or more of the following processors: central processing unit (CPU), graphics processing unit (GPU), microprocessor (MP), or digital signal processor (DSP).

[0144] Memory 144 may include volatile memory, such as random access memory (RAM). Memory 144 may also include non-volatile memory, such as read-only memory (ROM), flash memory, hard disk drive (HDD), or solid state drive (SSD).

[0145] The memory 144 can be used to store software code related to the image processing method, and the processor 142 can execute the steps of the image processing method and can also schedule other units to achieve corresponding functions.

[0146] This application embodiment also provides a wafer dicing machine, including: a controller, motion control, an image acquisition module, and a display;

[0147] The motion control is used to move the image acquisition module under the control of the controller;

[0148] The image acquisition module is used to photograph the object to be cut under the control of the controller;

[0149] The display is used to display the image captured by the image acquisition module in a preset display area in the display interface;

[0150] The controller is used to implement any of the image processing methods provided in the embodiments of this application.

[0151] This application also provides a computer program product including computer-readable instructions, which, when executed on a controller, cause the controller to implement any of the image processing methods provided in this application.

[0152] This application also provides a computer-readable storage medium that carries one or more computer programs. When the one or more computer programs are executed by a controller, the controller is able to implement any of the image processing methods provided in this application.

[0153] It should also be noted that the device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. In addition, in the device embodiment drawings provided in this application, the connection relationship between modules indicates that they have a communication connection, which can be implemented as one or more communication buses or signal lines.

[0154] Through the above description of the embodiments, those skilled in the art can clearly understand that this application can be implemented by means of software plus necessary general-purpose hardware, or it can be implemented by special-purpose hardware including application-specific integrated circuits, special-purpose CPUs, special-purpose memory, special-purpose components, etc. Generally, any function performed by a computer program can be easily implemented by corresponding hardware, and the specific hardware structure used to implement the same function can also be diverse, such as analog circuits, digital circuits, or special-purpose circuits. However, for this application, software program implementation is more often the preferred implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a readable storage medium, such as a computer floppy disk, USB flash drive, mobile hard disk, ROM, RAM, magnetic disk, or optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, training equipment, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0155] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product.

[0156] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions may be transmitted from one website, computer, training device, or data center to another website, computer, training device, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a training device or data center that integrates one or more available media. The available media may be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., DVDs), or semiconductor media (e.g., solid-state drives (SSDs)).

Claims

1. An image processing method, characterized in that, The image processing method, used in a controller for a wafer dicing machine, includes: In response to the received trigger on the first control in the coordinate list in the display interface, the motion control is controlled to move to the position represented by the first control. The coordinate list also displays a number of second controls in addition to the first control. The first control and each of the second controls respectively represent the coordinate data of a cutting path of the current cutting surface of the cutting object. The positions represented by the first control and each of the second controls are different. After the motion control moves the image acquisition module to the position indicated by the first control, the image acquisition module is controlled to take a picture of the cut object to obtain the captured image; If a trigger is received on the shooting parameter control during the shooting process, the shooting parameters of the image acquisition module are adjusted; The image captured by the image acquisition module is displayed in the preset display area of ​​the display interface.

2. The image processing method according to claim 1, characterized in that, After receiving a trigger on the first control, the image processing method further includes: Determine whether a captured image already exists corresponding to the location represented by the first control; If an image has been captured corresponding to the location indicated by the first control, the captured image corresponding to the location indicated by the first control is displayed in the preset display area.

3. The image processing method according to claim 1, characterized in that, If the coordinate list displays multi-step cutting track data, for each step, the color of the first coordinate data of the step is different from the color of the other coordinate data of the step.

4. The image processing method according to claim 1, characterized in that, The coordinate list uses at least two background colors to alternately display the coordinate data of multiple cutting paths on the current cutting surface of the cutting object.

5. The image processing method according to claim 1, characterized in that, When the image acquisition module is a high-magnification microscope camera, and the upper left corner of the object to be cut is located at the center of the high-magnification microscope camera, the display interface is also used to display the coordinates of the upper left corner of the object to be cut.

6. The image processing method according to claim 1, characterized in that, If a trigger to the shooting parameter control is received during the shooting process, the shooting parameters of the image acquisition module are adjusted, including: In response to a received trigger on the brightness control, the image brightness adjustment interface is displayed; In response to receiving a trigger on at least one brightness adjustment control in the image brightness adjustment interface, the brightness parameters of the image acquisition module are adjusted accordingly. The image brightness adjustment interface includes at least one of a direct illumination adjustment control, an oblique illumination adjustment control, an automatic brightness control, and an initial brightness control.

7. The image processing method according to claim 1, characterized in that, If a trigger to the shooting parameter control is received during the shooting process, the shooting parameters of the image acquisition module are adjusted, including: In response to the received trigger of the focus control, the focus adjustment interface is displayed; In response to receiving a trigger on the focus adjustment control in the focus adjustment interface, the image acquisition module performs automatic or manual focus. The focus adjustment interface includes a variety of focus adjustment controls, each with different focus parameters.

8. The image processing method according to claim 1, characterized in that, The image acquisition module includes a high-magnification microscope camera and a low-magnification microscope camera. After the image captured by the image acquisition module is displayed in a preset display area on the display interface, the image processing method further includes: In response to the received trigger on the scaling factor change control, the scaling factor change interface is displayed; In response to a received trigger on the high-magnification microscope control in the magnification change interface, the image captured by the high-magnification microscope is displayed in the preset display area; or, In response to a received trigger on the low-magnification microscope control in the magnification change interface, the image captured by the low-magnification microscope is displayed in the preset display area.

9. An image processing apparatus, characterized in that, The controller used in a wafer dicing machine, the image processing device includes: The motion control module is used to respond to the received trigger of the first control in the coordinate list in the display interface, and control the motion control to move to the position represented by the first control. The coordinate list also displays a number of second controls in addition to the first control. The first control and each second control respectively represent the coordinate data of a cutting path of the current cutting surface of the cutting object. The positions represented by the first control and each second control are different. The shooting control module is used to control the image acquisition module to take a picture of the cut object after the motion control moves the image acquisition module to the position indicated by the first control, so as to obtain the captured image; The parameter adjustment module is used to adjust the shooting parameters of the image acquisition module if a trigger to the shooting parameter control is received during the shooting process. An image display module is used to display the image captured by the image acquisition module in a preset display area of ​​the display interface.

10. A controller, characterized in that, The wafer dicing machine includes at least one processor and a memory connected to the processor, wherein: The memory is used to store computer programs; The processor is used to execute the computer program so that the controller can implement the image processing method as described in any one of claims 1 to 8.

11. A wafer dicing machine, characterized in that, include: Controller, motion controls, image acquisition module, and display; The motion control is used to move the image acquisition module under the control of the controller; The image acquisition module is used to photograph the object to be cut under the control of the controller; The display is used to display the image captured by the image acquisition module in a preset display area in the display interface; The controller is used to implement the image processing method as described in any one of claims 1 to 8.

12. A computer program product, characterized in that, Includes computer-readable instructions that, when executed on a controller, cause the controller to implement the image processing method as described in any one of claims 1 to 8.

13. A computer storage medium, characterized in that, The storage medium carries one or more computer programs that, when executed by the controller, enable the controller to implement the image processing method as described in any one of claims 1 to 8.

Images