Antenna module

Abstract

Disclosed is an antenna module having improved wireless communication performance and heat dissipation characteristics. The antenna module according to the present invention comprises: a slot antenna having a three-dimensional structure in which slots, through which electromagnetic waves pass, are formed and slot-forming portions, each defining a slot, are thicker than an outer peripheral portion; and a package substrate which has radio frequency integrated circuit chips mounted thereon and has cavities formed on the surface facing the slot antenna, wherein portions of the slot-forming portions are interlockingly received within respective cavities.

Description

Antenna module

[0001] The present invention relates to an antenna module comprising a package module having a slot antenna and a cavity formed therein, and in particular, to an antenna module capable of improving wireless communication performance and heat dissipation characteristics in the ultra-high frequency band and facilitating defect detection.

[0002] As IT technology advances, wireless communication data traffic is increasing dramatically, and electronic devices related to wireless communication are becoming highly high-performance. As the development of advanced IT technologies related to autonomous driving, VR / AR, IoT, telemedicine, and ultra-high-resolution video transmission—which require the rapid exchange of large amounts of data over wireless networks—accelerates, there is a demand for wireless communication components and related technologies in the millimeter wave band based on 5G and 6G using ultra-high frequencies to support this.

[0003] To meet these demands, the amount of wireless communication data transmitted must be increased. Consequently, the operating frequency of wireless communication components constituting the system must be raised, and their bandwidth must be increased. As the frequency band increases in wireless communication systems, an increase in the number of antennas transmitting and receiving radio waves is also required to boost the output of transmitted and received signals and improve the signal-to-noise ratio.

[0004] Therefore, particularly in millimeter-wave band wireless transmission and reception systems, in order to obtain these characteristics, antennas are arranged in a multiple array form, and antenna modules are configured to perform beamforming functions that control the characteristics of the beam.

[0005] A beamforming antenna module or system that performs the function of forming and controlling an electromagnetic beam is typically composed of numerous antenna elements, various integrated circuits, their interconnects, and control lines. Such an antenna module additionally includes multilayer antenna elements, their signal transmission structures, radio frequency integrated circuit (RFIC) chips in the ultra-high frequency band that perform functions such as beamforming, intermediate frequency distribution circuits, local oscillators, and related signal, control, and bias circuits.

[0006] These antenna modules or systems are essential components of wireless communication systems, and it is very important to implement characteristics such as high output, low signal loss degradation, excellent beamforming, high reception sensitivity, low cost, easy compatibility, and expansion.

[0007] Meanwhile, in ultra-high frequency bands such as the 7–21 GHz, 24 GHz, 28 GHz, 39 GHz, and 60 GHz bands, radio frequency (RF) signals are easily absorbed and lost during the signal transmission process, so the quality of wireless communication can rapidly deteriorate.

[0008] Therefore, in the case of antenna modules in the ultra-high frequency band, technologies such as securing antenna gain, minimizing connection loss between the antenna and RFIC, minimizing signal interference caused by complex signal line arrangement, and securing spacing between antenna arrays (usually 0.5 times the signal wavelength) must be developed.

[0009] To realize these characteristics, antenna modules in the ultra-high frequency band, particularly in the millimeter wave band, are configured with multiple antennas in an array form to increase output and perform beamforming functions, and are configured together with integrated circuit chips to operate them.

[0010] Meanwhile, as the frequency used in wireless communication systems increases, the size of the antenna and the width of the transmission line in the corresponding band decrease, and the integration density of the integrated circuit configured with them increases.

[0011] In order to form an antenna module by connecting such antenna arrays to integrated circuit chips, the antenna arrays and integrated circuit chips can be located on the top layer of their substrates. However, with this method, as the number of antenna elements increases, the number of routings required to connect each antenna to an integrated circuit chip also increases. Consequently, it is very difficult to effectively configure the antenna array and arrange it to properly perform functions such as beamforming.

[0012] To solve this, according to the existing Korean registered patent 1581225, a dual-sided package is used in which antenna elements are formed on the top layer of the package substrate constituting them, and the integrated circuits and BGAs connected thereto are placed on the opposite side of the substrate. In addition, a method is used in which integrated circuit chips for additional control and power supply, other than the RFIC configured by direct routing to the antenna, are connected to another package substrate through ball grid arrays (BGAs).

[0013] In this method, an array of multiple antennas is formed on the top layer of the package substrate, and radio frequency integrated circuit (RFIC) chips are formed face-up on the opposite side of the same package substrate, with the input / output lines of each RFIC chip correspondingly connected to each antenna element.

[0014] At this time, the feeding signal lines of the antenna elements are constructed using dielectric layers and metal layers inside the substrate.

[0015] This antenna module configuration method is called an antenna-in-package, as the antenna is integrated within the package substrate. It has the advantage of reducing signal loss by configuring a short signal transmission line between the antenna and the RFIC.

[0016] In this case, since integrated circuit chips such as RFICs are located on the opposite side of the antenna array on the package substrate, the control and power lines of the integrated circuits are not placed on the same plane as the antenna, but can be placed as metal lines inside the package.

[0017] On the other hand, to connect additional passive components and connectors routed to the control and power lines of integrated circuit chips, they must be connected to another package substrate using BGA, etc.

[0018] Meanwhile, to improve antenna performance, the antenna must be implemented as a multilayer structure, and the antenna signal transmission structure also needs to be implemented as a multilayer structure to avoid signal interference with control and power lines. However, as the number of antennas increases, this multilayer structure becomes more complex and wiring becomes difficult, leading to a significant increase in the number of layers on the implemented package substrate. Such an increase in the number of substrate layers results in very high manufacturing costs and makes it more difficult to dissipate heat generated from high-power devices through the package substrate.

[0019] Furthermore, since the signal lines of both the antenna and the RFIC chip are configured on a single package substrate, the characteristics of the RF signal lines of the RFIC chip and the antenna can only be evaluated in a combined form. In other words, it is not possible to evaluate the characteristics of the antenna array alone or to evaluate the characteristics of the RF signal lines of the RFIC chip individually. Additionally, since defects caused by design and manufacturing processes cannot be evaluated individually, there are difficulties in identifying and improving defects and increasing yield. Moreover, if defects occur in high-power components such as RFIC chips, as well as their associated parts and lines, during the use of the antenna module, there is no method to evaluate them and detect the defective parts.

[0020] In other words, when a problem of characteristic degradation occurs, such as a drop in the output of any one of the RFICs, it is difficult to identify and replace the component causing the problem, so the entire module must be replaced. Furthermore, in such dual-sided packages, if the top layer antenna is configured in a patch form, there is no method to measure the RF characteristics for each individual antenna.

[0021] In addition, since the antenna part and the routing part of the RFIC's control and power lines must be configured together on a single package substrate, there are limitations in using a substrate material suitable for the antenna characteristics. That is, if a substrate material with low dielectric loss in the ultra-high frequency band is applied to a part or the entire area of ​​the package substrate to obtain antenna characteristics, the manufacturing cost of the package substrate constituting the antenna module becomes very high, and the mechanical strength of the package substrate also deteriorates. Furthermore, since the package substrate must be composed of a significant number of layers, manufacturing is very difficult or there are limitations in manufacturing.

[0022] Accordingly, a method for configuring an antenna module is also presented, in which a substrate on which an antenna structure is formed and a package substrate on which a radio frequency integrated circuit (RFIC) chip is placed are fabricated separately and bonded together.

[0023] According to Korean registered patent 2145219, etc., in order to provide an antenna module advantageous for improving antenna performance or miniaturization, a method is proposed to electrically connect an antenna substrate in which an antenna array and a part of its feeding structure are formed separately from a package substrate in which integrated circuit chips such as radio frequency integrated circuit chips are arranged and related circuits are formed, by means of a bonding method.

[0024] Typically, feeding metal vias connected to each antenna to transmit RF signals and metal vias connected to a radio frequency integrated circuit chip to transmit RF signals are electrically connected and fixed using ball-shaped bumps.

[0025] The antenna board and the package board on which the RFIC chips are placed are directly connected via bumps, or an interposer board is configured in between to rewire the connections; however, to ensure signal connectivity between package boards, ball-shaped bump structures are applied between the signal lines of each board to electrically connect and secure them.

[0026] Therefore, as the number of antenna elements increases, the number of bumps for signal transmission and substrate attachment increases, and as the operating frequency increases, the required bump size must also decrease.

[0027] This is a type of package-on-package method in which a package substrate is connected on top of another package substrate. By separating the antenna substrate from the package substrate on which the radio frequency integrated circuit chip is placed, an antenna module can be fabricated, allowing the materials of the antenna substrate and the package substrate to be different.

[0028] Therefore, in order to improve characteristics such as antenna gain, the antenna and antenna feeding structure can be effectively designed in multiple layers, and there is an advantage in that the substrate material can also be effectively selected.

[0029] However, in addition to antenna signal line feed vias, ground vias must also be meticulously connected via bumps. Therefore, a complex manufacturing process for these multiple bump connections is additionally required.

[0030] Consequently, if the number of antenna arrays is increased to achieve high output of the antenna module, or if the spacing between antenna arrays is reduced for use in high frequency bands, the configuration of the module becomes constrained by the size of the bumps for electrical connection of each substrate, and the difficulty of the manufacturing process increases significantly.

[0031] On the other hand, in the ultra-high frequency millimeter wave band, the physical size of RF signal lines is very small, so impedance matching of RF signal lines is crucial to reduce signal loss. However, when configuring an antenna module in this way, impedance mismatches can occur due to bumps for connecting antenna signal lines, which can lead to increased RF signal loss.

[0032] Furthermore, in antenna modules with bonding structures between these package substrates, numerous defects occur where the substrates bend and the bump bonds detach due to the difference in thermal expansion coefficients between the substrates when used for extended periods at high power. In other words, when heat is generated from high-power RFICs, the bonding structure is subjected to significant stress due to the difference in thermal expansion coefficients between the substrates. Consequently, problems such as the bonding structure detaching or breaking frequently occur during prolonged use. In this case, there is a critical disadvantage in that the entire antenna module becomes unusable even if only a single bond is damaged.

[0033] To solve these conventional problems, according to the existing Korean patent application No. 10-2024-0052373, an antenna module is presented in which an interconnection member having a slot through which a wireless signal passes is arranged between an antenna substrate containing an antenna and a package substrate having a transmission line formed therein to transmit a wireless frequency signal combined with a wireless communication chip. The antenna substrate and the package substrate are manufactured separately and configured to connect signals via the interconnection member, thereby eliminating a separate bonding connection structure and offering the advantage of being able to use the antenna substrate and the package substrate separately. Meanwhile, in this structure, the structural shape and thickness of the slot of the interconnection member formed between the antenna substrate and the package substrate become important characteristic factors that determine the bandwidth of the transmitted signal.

[0034] The present invention was devised to solve the problems described above, and the objective of the present invention is to provide an antenna module capable of having high performance in the ultra-frequency band of 5 GHz or higher.

[0035] In addition, the invention comprises a three-dimensional slot antenna having a slot and a package substrate having a cavity formed therein and a radio frequency integrated circuit (RFIC) chip arranged thereon, and a portion of the slot forming area constituting the slot structure of the three-dimensional slot antenna is coupled by engaging it within the cavity structure of the package substrate to reduce signal interference and loss, thereby providing an antenna module with high output and radiation efficiency.

[0036] In addition, the invention provides an antenna module with high heat dissipation characteristics capable of effectively dissipating heat from inside the package substrate by comprising a three-dimensional slot antenna having a slot and a package substrate having a cavity formed therein and a radio frequency integrated circuit (RFIC) chip arranged thereon, and by engaging and coupling a portion of the slot forming area constituting the slot structure of the three-dimensional slot antenna within the cavity structure of the package substrate.

[0037] In addition, the invention provides an antenna module comprising a three-dimensional slot antenna having a slot and a package substrate having a cavity formed therein and a radio frequency integrated circuit (RFIC) chip arranged thereon, wherein a portion of the slot forming portion constituting the slot structure of the three-dimensional slot antenna is coupled by interlocking it within the cavity structure of the package substrate, thereby reducing the thickness of the slot support portion while maintaining the shape of the slot structure determining frequency characteristics, and thereby improving the overall thickness and weight.

[0038] In addition, a 3D structured slot antenna equipped with a slot and a signal connection portion are placed facing each other between the package substrate and the slot antenna to transmit wireless communication signals through electromagnetic wave coupling, thereby eliminating the need for the bump bonding structure used for connecting the antenna and the package substrate in the past, and thus providing an antenna module that improves upon signal loss and bump connection failure issues that occur when using bumps.

[0039] In addition, by individually fabricating and connecting a 3D slot antenna with a slot structure and a package substrate to form an antenna module, the antenna module is configured after individually testing the characteristics of the antenna and the package substrate.

[0040] In addition, the antenna module is configured to allow the connection or separation of a package substrate and a slot antenna having a 3D structure equipped with a slot, thereby enabling the individual characteristic inspection of the signal connection portion of the package substrate to detect defects in the signal connection portion and the wireless communication chip connected thereto.

[0041] In addition, the present invention provides an antenna module that can facilitate the placement of the slot or improve the transmission and reception performance of electromagnetic waves by forming a ridge-forming protrusion on the slot of a three-dimensional slot antenna equipped with a slot, thereby reducing the size of the slot capable of transmitting and receiving electromagnetic waves corresponding to the operating frequency.

[0042] In addition, the present invention provides an antenna module that improves signal transmission efficiency by placing a signal transmission line connected to the input / output section of a radio frequency integrated circuit chip inside a package substrate and placing a metal layer facing one side of the package substrate to reflect the wireless communication signal.

[0043] In addition, the present invention provides an antenna module that can facilitate the placement of slots or improve the transmission and reception performance of electromagnetic waves by filling the slots of a three-dimensional slot antenna equipped with slots with a dielectric material, thereby reducing the size of the slots capable of transmitting and receiving electromagnetic waves corresponding to the operating frequency.

[0044] In addition, by arranging a signal coupling pattern so that it can be positioned in the slot of a three-dimensional slot antenna equipped with a slot, thereby strengthening the coupling of wireless signals, an antenna module is provided that enables smoother transmission of radio frequency signals.

[0045] In addition, a trench is formed in the lower outer part of a slot antenna with a three-dimensional structure equipped with a slot, thereby providing an antenna module capable of efficiently configuring the routing and placement of the substrate.

[0046] In addition, a heat dissipation means is combined on one or more side surfaces of a slot antenna with a three-dimensional structure having a slot and a package substrate to provide an antenna module with improved heat dissipation characteristics.

[0047] In addition, the outer surface of the slot antenna with a three-dimensional structure equipped with a slot is formed of a metal material, while the inner surface is formed of a material with a lower density than the outer surface, thereby providing an antenna module that allows for efficient heat dissipation and also reduces the load of the device.

[0048] In addition, the invention provides an antenna module that simplifies the manufacturing process and reduces the time required for the process by forming a fixing hole that can be aligned and fixed to a package substrate and a 3D structure slot antenna equipped with a slot, thereby facilitating alignment and fixing between the slot antenna and the package substrate.

[0049] In addition, the present invention provides an antenna module comprising an adhesive member disposed between the lower surface of the outer portion of the slot antenna and the upper surface of the package substrate, thereby maintaining a constant distance between the slot forming portion of the slot antenna and the signal connection portion inside the cavity substrate and facilitating smooth fixation between the slot antenna and the package substrate.

[0050] The antenna module of the present invention for achieving the above-mentioned purpose comprises a package substrate having a slot formed through which electromagnetic waves pass, a slot antenna having a three-dimensional structure in which the slot forming portion is thicker than the outer portion, and a radio frequency integrated circuit chip disposed thereon, and a cavity formed on a surface facing the slot antenna, wherein a part of the slot forming portion is interlocked and disposed within the cavity.

[0051] The above-mentioned slot antenna and the above-mentioned package substrate can be combined after being manufactured individually.

[0052] A plurality of the above slots can be spaced apart at regular intervals on the antenna to form an array.

[0053] The cross-sectional area, length, and material of the above slot can be determined in correspondence with the wavelength of the radio frequency signal.

[0054] The above slot may be provided corresponding to the cavity specifications of the package substrate, or may be provided corresponding to the specifications of a passage passing through the package substrate opposite to the package substrate.

[0055] The above package substrate has a cavity formed to accommodate the slot, and may further include a plurality of cavity shielding vias surrounding the cavity of the package substrate.

[0056] The above package substrate may include a shielding portion arranged to surround the signal transmission line.

[0057] The above package substrate may include a metal layer formed on an upper surface where a cavity is formed.

[0058] The shielding portion may include a plurality of metal layers formed on a dielectric layer constituting the package substrate and shielding vias connecting the metal layers.

[0059] Any one selected metal layer among the plurality of metal layers may be positioned facing the slot with the signal transmission line in between.

[0060] The shielding portion above can be arranged to surround the slot, thereby forming a signal transmission portion in the center.

[0061] The above slot antenna may include a ridge-forming projection formed to protrude toward the slot.

[0062] Multiple ridge-forming protrusions may be formed.

[0063] The above-described slot antenna includes a slot closing member provided in the slot, and the slot closing member may be a dielectric.

[0064] The above slot closing member may have a permittivity of 2 or more and 10 or less.

[0065] The above package substrate may include a coupling portion that guides the movement of electromagnetic waves between the radio frequency integrated circuit chip and the slot.

[0066] The above-mentioned slot antenna may include a trench formed on the lower surface facing the package substrate.

[0067] The above-described slot antenna may have an outer surface formed of a conductor and an interior formed of a material with a lower density than the conductor.

[0068] It may include a heat dissipation means coupled to one or more sides of the above-mentioned slot antenna and package substrate.

[0069] The above-described slot antenna may include a fixing groove formed on a lower surface facing the package substrate, the package substrate may include a fixing hole formed facing the fixing groove, and may include a fixing bolt fastened to the fixing groove and the fixing hole.

[0070] The above-described slot antenna may include a fixing bar formed on a lower surface facing the package substrate, and the package substrate may include a fixing hole formed at a position facing the fixing bar and to which the fixing bar is coupled.

[0071] The above-described slot antenna may include an adhesive member disposed between the lower surface of the slot antenna's outer portion and the upper surface of the package substrate.

[0072] When a plurality of slot arrangements formed in the above-mentioned slot antenna are formed as a multi-resonant structure, the size of each slot of the plurality of slots corresponding to the multi-resonant structure is formed differently, and the vertical length of the slot forming part can be determined in correspondence with the size of the formed slot.

[0073] The antenna module of the present invention has the advantage of being able to eliminate signal loss and interference and configure an antenna module with high output and high radiation efficiency by combining a three-dimensional slot antenna having a slot formed for transmitting and receiving radio frequency signals and a slot forming portion thicker than the outer portion, and a package substrate having a radio frequency integrated circuit chip arranged and a cavity formed therein, so that a part of the slot forming portion interlocks with each other within the cavity to transmit radio frequency signals.

[0074] The antenna module of the present invention has the advantage of being able to effectively dissipate heat generated in the package substrate by combining a three-dimensional slot antenna having a slot formed for transmitting and receiving radio frequency signals and a slot forming portion thicker than the outer portion, and a package substrate having a radio frequency integrated circuit chip arranged and a cavity formed, such that a part of the slot forming portion interlocks with each other within the cavity.

[0075] The antenna module of the present invention has the advantage of reducing the weight and thickness of the antenna module by combining a three-dimensional slot antenna having a slot formed for transmitting and receiving radio frequency signals and a slot forming portion thicker than the outer portion, and a package substrate having a radio frequency integrated circuit chip arranged and a cavity formed, such that a part of the slot forming portion interlocks with each other within the cavity.

[0076] The antenna module of the present invention has the advantage of eliminating a packaging process for producing multiple fine ball-shaped electrical connection structures between the antenna and the signal transmission line of the wireless communication chip by combining a three-dimensional slot antenna having a slot formed for transmitting and receiving radio frequency signals and a slot forming portion thicker than the outer portion, and a package substrate having a radio frequency integrated circuit chip arranged and a cavity formed, such that a part of the slot forming portion interlocks with each other within the cavity.

[0077] The antenna module of the present invention has the advantage of preventing the separation of fine ball-shaped electrical connection structures between the antenna substrate and the package substrate due to excessive heat generation by arranging and combining a three-dimensional slot antenna, in which a slot for transmitting and receiving radio frequency signals is formed and the slot-forming portion is thicker than the outer portion, and a package substrate, in which a radio frequency integrated circuit chip is arranged and a cavity is formed, such that a part of the slot-forming portion interlocks with each other within the cavity.

[0078] The antenna module of the present invention implements the antenna module by applying a package substrate on which an antenna equipped with a slot and a radio frequency integrated circuit chip are arranged. Since the package substrate for circuit implementation can be manufactured separately from the antenna characteristics, it has the advantage of being able to use a substrate material that is more suitable for circuit implementation.

[0079] The antenna module of the present invention has the advantage of improving heat dissipation characteristics and preventing output degradation by applying a slot antenna in which the front or outer surface is made of a conductor, thereby facilitating the dissipation of heat generated in the antenna module.

[0080] The antenna module of the present invention implements the antenna module by separately manufacturing and connecting a slot antenna and a package substrate, thereby enabling the measurement and analysis of antenna characteristics and defects, or the individual measurement and analysis of the characteristics and defects of the package substrate, each radio frequency integrated circuit chip, and each connected signal transmission line, so that defect detection is possible and yield can be improved.

[0081] In addition, by forming a ridge-forming projection on the slot of the slot antenna, the size of the slot capable of transmitting and receiving electromagnetic waves corresponding to the operating frequency can be reduced, thereby making it easier to arrange the slot or improving the performance of transmitting and receiving electromagnetic waves.

[0082] In addition, since the slots of the slot antenna are filled with a dielectric material that has a permittivity higher than air, there is an advantage in that the slot size can be minimized.

[0083] In addition, by placing the signal transmission line of the radio frequency integrated circuit chip inside the package substrate and placing the metal layer facing one side of the package substrate to reflect the radio frequency signal, there is an advantage of further improving the signal transmission efficiency.

[0084] In addition, by arranging a signal coupling pattern on one side of the package substrate that contacts the slot antenna so that it can be positioned in the slot, there is an advantage of improving signal transmission efficiency by strengthening the coupling of radio frequency signals.

[0085] In addition, a trench space is formed at the bottom of the slot antenna, so that radio frequency integrated circuit chips, integrated circuit chips, passive components, connectors, etc. placed on the package substrate can be placed on the surface in contact with the slot antenna, thus having the advantage of effectively configuring the routing and placement of the package substrate.

[0086] In addition, a heat dissipation means having heat dissipation fins formed on the edges of the antenna module can be combined, allowing for smoother heat dissipation and offering the advantage of preventing reduced output loss and deformation of the substrate.

[0087] In addition, the present invention has the advantage of being able to control radio frequency band characteristics by applying an adhesive member between the outer part of a three-dimensional slot antenna and a package substrate so that the antenna substrate and the package substrate are connected, thereby accurately adjusting and maintaining the gap between the slot forming part and the inside of the cavity of the package substrate.

[0088] FIGS. 1 and 2 are drawings showing a first embodiment of the antenna module of the present invention.

[0089] FIGS. 3 and 4 are drawings showing a second embodiment of the antenna module of the present invention.

[0090] FIG. 5 is a drawing showing a third embodiment of the antenna module of the present invention.

[0091] FIG. 6 is a drawing showing a fourth embodiment of the antenna module of the present invention.

[0092] FIG. 7 is a drawing showing a fifth embodiment of the antenna module of the present invention.

[0093] FIG. 8 is a drawing showing a sixth embodiment of the antenna module of the present invention.

[0094] FIG. 9 is a drawing showing a seventh embodiment of the antenna module of the present invention.

[0095] FIG. 10 is a drawing showing the eighth embodiment of the antenna module of the present invention.

[0096] FIG. 11 is a drawing showing a ninth embodiment of the antenna module of the present invention.

[0097] FIG. 12 is a drawing showing the 10th embodiment of the antenna module of the present invention.

[0098] FIG. 13 is a drawing showing the 11th embodiment of the antenna module of the present invention.

[0099] FIG. 14 is a drawing showing the 12th embodiment of the antenna module of the present invention.

[0100] FIG. 15 is a drawing showing the 13th embodiment of the antenna module of the present invention.

[0101] The advantages and features of the embodiments of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0102]

[0103] In describing the embodiments of the present invention, specific descriptions of known functions or configurations will be omitted if it is determined that such detailed descriptions could unnecessarily obscure the essence of the invention. Furthermore, the terms described below are defined in consideration of their functions in the embodiments of the present invention, and these definitions may vary depending on the intentions or practices of the user or operator. Therefore, such definitions should be based on the content throughout this specification.

[0104]

[0105] Hereinafter, an antenna module (1000) according to the present invention will be described with reference to the attached drawings.

[0106] FIGS. 1 and 2 are drawings illustrating a first embodiment of an antenna module according to the present invention, FIGS. 3 and 4 are drawings illustrating a second embodiment of an antenna module according to the present invention, FIG. 5 is a drawing illustrating a third embodiment of an antenna module according to the present invention, FIG. 6 is a drawing illustrating a fourth embodiment of an antenna module according to the present invention, FIG. 7 is a drawing illustrating a fifth embodiment of an antenna module according to the present invention, FIG. 8 is a drawing illustrating a sixth embodiment of an antenna module according to the present invention, FIG. 9 is a drawing illustrating a seventh embodiment of an antenna module according to the present invention, FIG. 10 is a drawing illustrating an eighth embodiment of an antenna module according to the present invention, FIG. 11 is a drawing illustrating a ninth embodiment of an antenna module according to the present invention, FIG. 12 is a drawing illustrating a tenth embodiment of an antenna module according to the present invention, FIG. 13 is a drawing illustrating an eleventh embodiment of an antenna module according to the present invention, FIG. 14 is a drawing illustrating a twelfth embodiment of an antenna module according to the present invention, and FIG. 15 is a drawing illustrating the twelfth embodiment of an antenna module according to the present invention This is a drawing showing an example.

[0107]

[0108] In the following description, it is predefined that 'radio frequency signal', 'wireless communication signal', and 'electromagnetic wave' all represent signals for communication.

[0109] Referring to FIGS. 1 and 2, the antenna module (1000) according to the first embodiment comprises a three-dimensional slot antenna (100) having one or more slots (110) for transmitting and receiving electromagnetic waves formed and arranged in an array form, wherein the slot forming portion (111) forming the slot is thicker than the outer portion (112), and a package substrate (200) having a radio frequency integrated circuit chip (210) disposed thereon and a cavity (205) formed thereon, wherein a part of the slot forming portion (111) of the slot antenna (100) is interlocked and disposed within the cavity (205). In this manner, one side of the slot of the slot antenna (100) corresponds to the upper surface of the signal transmission portion, i.e., the signal connection portion (C), which will be described later, within the cavity (205) of the package substrate, so that a radio frequency signal is transmitted and received.

[0110] Here, the radio frequency integrated circuit (RFIC) chip may refer to a chip for wireless communication. Here, the signal connection portion (C) refers to one side of the package substrate corresponding to the slot formed by the slot forming portion (111) of the slot antenna (100) within the cavity of the package substrate (200).

[0111] The slot antenna (100) has a structure in which one or more slots (110) are arranged in an array form, and electromagnetic waves are radiated or received through the slots (110). The slot antenna (100) determines the frequency band and characteristics of the electromagnetic waves transmitted by the size, structure, and material of the slots (110), and the slots (110) operate as antennas that transmit and receive electromagnetic waves.

[0112] It is preferable that the side surface of the slot (110) be made of a conductor such as metal so that electromagnetic waves are transmitted without loss, and it is preferable that the upper and lower sides be open so that electromagnetic waves can be transmitted well up and down.

[0113] That is, this slot (110) has a shape similar to a well-known waveguide, and can be implemented in various shapes such as a slender square shape or a circular shape as shown in FIG. 2 (a) when viewed from above. In addition, this slot can be implemented in various shapes such as a “C” shape with one ridge-forming protrusion formed on the side, an “H” shape with ridge-forming protrusions formed on each side, or a shape with three or more ridge-forming protrusions formed.

[0114] In addition, the slot can be implemented in various forms, such as two or more stages, in which the structure and shape are configured differently in the height direction. For example, the side in contact with the package substrate can be in a square shape, and the opposite side, which is the side exposed to air, can be implemented in an “H” shape with ridge-forming protrusions formed on the side.

[0115] These slot antennas are also called slot waveguide antennas. They can be implemented in a low-profile flat form, are easy to manufacture at a low cost, and have the advantages of higher gain and radiation efficiency compared to widely used microstrip patch antennas.

[0116] On the other hand, since the slot space must be relatively large compared to the size of a microstrip patch antenna formed on a widely used dielectric substrate in the same operating frequency band, it may have the disadvantage of being difficult to design when implemented in an array form.

[0117] Therefore, in order to implement the slot antenna in the form of an array having a plurality of slots (110) to configure the slot antenna as an antenna module, the frequency band to be designed, the size of the slots (110), and the arrangement and placement of the signal connection part (C) must be appropriately designed.

[0118] Additionally, the slot antenna (100) may be implemented in a ridge-formed shape to reduce the size of the slot (110), or may be filled with a dielectric material inside.

[0119] The cavity (205) of the above-described package substrate is configured such that one side of the substrate is recessed inward, and can be configured using processing methods such as mechanically milling a portion of the package substrate. In order to enhance the effects of heat dissipation and signal interference when applied as an antenna module, it is preferable to place a metal layer (231) or a portion of a metal layer on the uppermost surface of the substrate exposed within the cavity.

[0120] Meanwhile, cavity shielding vias (206) are formed around the cavity (205) of the package substrate in a shape that surrounds the cavity (205). These cavity shielding vias (205) are preferably connected to metal layers from top to bottom to enhance the shielding effect, with their side surfaces composed of metal layers, and are preferably arranged densely in one row or two or more rows. (Indicated as two rows in the drawing)

[0121] Referring to FIG. 1, the package substrate (200) includes a shielding portion (230) arranged to surround the signal transmission line (220), and the shielding portion (230) may include a plurality of metal layers (231) formed on a dielectric layer (200A) constituting the package substrate (200) and shielding vias (232) connecting the metal layers (231). These metal layers (231) are generally configured to serve as grounds. At this time, the upper surface and internal metal layers of the package substrate (200) are configured on the entire surface in the drawing, but it is understood that only a portion of the surface may be used as needed.

[0122] And, the signal connection portion (C) formed on one side of the package substrate (200) can be wrapped by a metal layer (231) and positioned to face the slot (110).

[0123] The cavity (205) formed on one side of the package substrate is configured such that a portion of the area on one side of the package substrate is recessed inward. Additionally, a cavity shielding via (206) is configured around the cavity (205) of the package substrate to surround the cavity (205).

[0124] To explain in detail, the slot antenna (100) and the package substrate (200) are combined so that the slot (110) and the signal connection part (C) face each other, thereby forming a signal transmission structure in which a signal received through the slot antenna or a signal from the radio frequency integrated circuit chip (210) of the package substrate (200) effectively travels through the signal transmission part (201), the signal connection part (C), and the slot (110) formed in the center of the shielding part (230), thereby minimizing transmission loss of the radio frequency signal and blocking signal interference with other analog signals, such as radio frequency signals and control, of the adjacent slot and the signal transmission structure.

[0125] At this time, the shielding portion (230) is arranged in a manner that surrounds the signal transmission portion (201) to block interference received from external signals by the signal passing through the signal transmission portion (201), and the shielding portion (230) may include a plurality of metal layers (231) formed on a dielectric layer (200A) constituting the package substrate (200) and shielding vias (232) connecting the metal layers (231).

[0126] In addition, the signal transmission unit (201) mentioned above refers to a specific area of ​​the package substrate (200) wrapped by the shielding unit (230), and it goes without saying that multiple units may be formed corresponding to the number of input / output ports of the radio frequency integrated circuit chip (210).

[0127] In this antenna module (1000), transmission of the antenna is achieved by transmitting an ultra-high frequency signal of the operating frequency band from a radio frequency integrated circuit chip (210) coupled to the package substrate (200) through the signal transmission line (220), transmitting it to a signal connection unit (C) formed on one side of the cavity of the package substrate through a signal transmission unit (201) enclosed by a plurality of shielding vias (232), and then transmitting it from the signal connection unit (C) to the slot (110) of the slot antenna (100), thereby radiating electromagnetic waves having characteristics such as a pre-designed frequency band and beam width to the outside through the slot (110). Reception of the antenna is achieved by undergoing the opposite process, receiving electromagnetic waves of a specific external frequency through the slot (110), and transmitting the received signal to the radio frequency integrated circuit chip (210) through the signal connection unit (C) and the signal transmission unit (201).

[0128] Meanwhile, as the frequency increases, the number of antennas in the antenna module increases and the spacing between antennas decreases, which may cause signal interference between signal transmission units of adjacent slots.

[0129] In addition, as the number of arrays in the antenna module increases, manufacturing tolerances may occur, or if the size of the slot antenna and the package substrate increases, a gap may occur between the slot forming part and the signal connection part, especially in the center. If the gap between the slot forming part (111) of the slot antenna and the signal connection part (C) of the package substrate widens in this way, electromagnetic waves may unintentionally propagate toward the adjacent slot, causing interference and reducing the efficiency of signal transmission and reception.

[0130] That is, the cavity (205) and the cavity shielding via (206) of the package substrate (200) are formed and arranged in a manner that surrounds the area corresponding to the slot forming portion (111) and the signal connection portion (C), thereby eliminating the unintended sideways propagation of electromagnetic wave signals or causing interference, and increasing the efficiency of transmitting and receiving electromagnetic waves.

[0131] In addition, as the slot forming portion (111) of the antenna (100) is positioned within the cavity of the package substrate (200), the signal transmission portion can be reduced on the path through which the radio frequency signal passes within the package substrate (200). This is because the signal transmission portion within the package substrate (200) is a dielectric material, so the loss is greater than that of the air layer that serves as the path through the slot. Furthermore, by positioning the slot forming portion within the cavity structure in this way, it is possible to reduce the weight of the antenna module (1000) and reduce the thickness of the outer portion (112) of the antenna substrate (100), thereby reducing the thickness of the antenna module.

[0132] In addition, heat can be released from the inside of the package substrate by configuring the slot forming portion (115) of the slot antenna and the metal layer exposed inside the cavity (205) of the package substrate to be in contact. That is, heat generated from high-power devices configured in the package substrate can be released directly from the metal layer (231), which is the internal metal layer of the package substrate, through the slot forming portion (111) and the outer portion (112) surface, thereby greatly increasing the heat dissipation efficiency.

[0133] A package substrate (200) on which a radio frequency integrated circuit chip (210) is placed may be manufactured in a form in which one or more dielectric layers (200A) are stacked in multiple layers, and may also be formed in a heterojunction form in which various materials are combined rather than a single material as needed.

[0134] In addition, the package substrate (200) may include various integrated circuit (IC) chips such as a power amplifier and a mixer, various passive components such as an inductor, a capacitor, and a resistor, and connectors for other connections, in addition to the radio frequency integrated circuit (RFIC) chip and signal transmission line.

[0135] A package substrate (200) may have a metal layer and a connection via formed thereon, and may have a metal wire, a metal layer, a via structure and a shielding structure arranged thereon for routing signal transmission wiring, power, control signals, etc., for transmitting radio frequency signals.

[0136] The package substrate (200) transmits not only signals in the high-frequency wireless communication frequency band but also various analog signals such as power and control signals, and can be composed of a radio frequency integrated circuit chip (210), various integrated circuit chips, passive components, connectors, etc. Accordingly, there are requirements such as having low dielectric loss so that the attenuation of radio frequency band signals is low, having excellent mechanical rigidity so that the substrate does not bend due to various processes and heat generation, and having a multilayer structure for circuit implementation so that the material cost is not high.

[0137] Furthermore, as the radio frequency band increases, the integration density of components increases further and the implementation of wiring becomes more complex, making the characteristics of the above requirements even more important.

[0138] However, materials such as Teflon, which are mainly used because of their low dielectric loss at ultra-high frequencies, have the disadvantage of poor mechanical strength and being very expensive when implemented in multiple layers, while materials such as FR4, which are used cheaply at low frequencies, have the advantage of having relatively excellent mechanical strength and being easy to implement in multiple layers, but have the disadvantage of being difficult to apply because of their very high dielectric loss at ultra-high frequencies.

[0139] Therefore, since it is difficult to satisfy these diverse requirements when applying a single dielectric material, substrates are sometimes implemented with heterojunction structures by applying heterogeneous dielectrics; however, this presents problems such as difficulty in realizing multilayer structures and a significant increase in manufacturing costs.

[0140] In addition, multilayer package substrates made of ultra-high frequency low-loss materials such as Teflon, which have poor mechanical rigidity, have the disadvantage that defects such as the substrate bending due to heat generated by high-power devices occur during long-term use.

[0141]

[0142] FIG. 2(a) is a plan view of a slot antenna (100), and FIG. 2(b) is a plan view of an antenna module in which one side of the slot antenna (100) and one side of a package substrate (200) having a cavity (205) formed therein are interlocked.

[0143] Referring to FIG. 2(a) and FIG. 2(b), the slot forming portion (111) of the slot antenna (100) corresponds one-to-one with the cavity (205) of the package substrate (200), and the slot antenna (1000) and the package substrate (200) are combined in such a way that a part of the slot forming portion (111) of the slot antenna (100) is interlocked and aligned within the cavity (205) of the package substrate (200).

[0144] Additionally, a metal layer (231) formed on one side of the package substrate (200) is positioned at the edge of the slot (110), and a signal connection part (C) is aligned with the slot in the center of the metal layer (231) to transmit a radio frequency signal. Depending on the design, the signal connection part area may be larger or smaller than the slot area.

[0145] In addition, it is recommended that the metal layer (231) within the cavity of the package substrate and the surface (conductive layer) of the slot forming portion of the slot antenna (100) be connected without gaps to provide perfect shielding, thereby preventing electromagnetic wave loss. However, even if gaps occur in some areas due to manufacturing tolerances or increased overall size, the cavity structure and the cavity shielding vias surrounding it can be wrapped and shielded to completely eliminate electromagnetic wave loss or interference caused by surrounding signals.

[0146] Meanwhile, the slot (110) of the slot antenna (100) is formed such that the outer wall or the entire structure is made of a conductor such as metal, like a waveguide, and the interior is hollow, so the upper and lower sides are penetrated, allowing electromagnetic waves to form a resonance mode and be transmitted well up and down.

[0147] That is, the slot (110) formed by the slot forming part (110) serves as a passage for electromagnetic waves to travel, or corresponds one-to-one with the signal connection part (C) within the cavity (111) of the package substrate (200) to couple and transmit signals, and on the opposite side, performs the role of an antenna that radiates or receives electromagnetic waves within the space.

[0148] In addition, when multiple slots (110) form a slot array, the gain of the antenna can be increased, and a beamforming function can be performed to adjust the radiation angle of the antenna beam. In such a slot array antenna, the placement period (L1) of the slots is most preferably formed at half the wavelength (0.5 times) of the frequency band mainly used, taking into account the gain of the antenna array and the adjustment of the beam angle, but it may also be formed at other intervals such as 0.55 times or 0.6 times as needed, and it goes without saying that such intervals can be adjusted according to the placement space of the wireless communication chip and related circuit.

[0149]

[0150] To summarize the above description, the antenna module (1000) according to the first embodiment of the present invention is designed so that the slot (110) performs the role of an antenna, thereby reducing signal transmission loss and improving the radiation efficiency of the antenna. That is, in the case of the antenna module of the prior art, in which the antenna array is formed in the form of a multilayer metal layer on top of a dielectric substrate or configured to include a multilayer transmission layer, loss of radio frequency signals occurs due to dielectric loss of the dielectric forming the antenna structure. Therefore, it is obvious that the gain and radiation efficiency of the antenna in such an antenna module are reduced compared to the antenna module applying the slot antenna of the present invention.

[0151] In addition, since the slot (110) through which the radio frequency signal passes and the cavity (205) of the package substrate (200) are coupled together, electromagnetic waves are transmitted through coupling, so electrical connection structures such as bumps, which were essential for signal transmission between the antenna and the signal transmission line connected to the radio frequency integrated circuit chip like in conventional antenna modules, are no longer needed.

[0152] By removing the electrical connection structure (ball-shaped bump) described above, the packaging process of forming multiple ball-shaped bumps can be omitted, which has the advantage of realizing process simplification.

[0153] In addition, the package substrate (200) equipped with the slot antenna (100) and the radio frequency integrated circuit chip (210) can be implemented separately in this manner, thereby allowing the use of a substrate material with superior mechanical properties, etc., for the package substrate (200) regardless of the characteristics and manufacturing of the antenna.

[0154] In addition, the slot antenna (100) of the present invention is implemented with a conductor such as metal on its front or outer surface, so that heat generated from a high-power semiconductor integrated circuit chip, etc. of the package substrate (200) is effectively transferred and discharged through an internal metal layer, etc. to the slot forming part (111) of the slot antenna and the slot antenna (100), thereby increasing the heat dissipation effect and preventing a decrease in output due to heat generation, which is an advantage.

[0155] In addition, since the antenna module (1000) of the present invention is manufactured by individually fabricating and connecting the slot antenna and the package substrate, it is possible to measure and analyze the characteristics and defects of the slot antenna (100), or to individually measure and analyze the characteristics and defects of the package substrate (200), the individual wireless communication chip (210), and each signal transmission line (220) connected thereto, thereby enabling the detection of defective products and thus having the advantage of improving the manufacturing yield.

[0156] To explain once again, the manufacturing of the antenna module (1000) of the present invention can be carried out through a slot antenna manufacturing step for manufacturing a slot antenna (100), a package substrate manufacturing step for manufacturing a package substrate (200), and a coupling step for aligning the manufactured slot antenna (100) and the package substrate (200) as shown in FIG. 1 (a) and then coupling them as shown in FIG. 1 (b).

[0157] At this time, the condition of the slot antenna (100) and the package substrate (200) is determined during the inspection stage to remove defective products, so that an antenna module in which the slot antenna (100) and the package substrate (200) are combined in a normal state can be manufactured during the subsequent combination stage.

[0158]

[0159] Referring to FIGS. 3 and 4, the slot antenna (100) of the antenna module according to the second embodiment may include a ridge-forming projection (120) formed on the side surface of the slot forming portion (111) so that the slot (110) becomes an 'H' shape. Additionally, the metal layer (231) forming the signal connection portion (C) within the cavity (205) of the package substrate (200) may also be formed in an 'H' shape. In FIG. 3, the portion where the cross-sectional area of ​​the slot and the signal connection portion differs due to the 'H' shape is indicated by a dotted line.

[0160] To explain in detail, the slot is formed into an H shape through the ridge-forming projection (120) so that the size of the slot (110) can be reduced, the frequency band of the electromagnetic waves passing through the slot (110) can be adjusted, or the electromagnetic wave transmission characteristics can be improved.

[0161] The slot (110) that serves to transmit and receive electromagnetic waves in the slot antenna (100) has a disadvantage in that the size required to secure a wide transmission and reception frequency band is relatively large compared to the patch size of the patch antenna fabricated together with the dielectric substrate. Therefore, a ridge-forming protrusion (120) is formed on the side of the slot (110) in this slot antenna (100) to reduce the size of the slot (110), increase the transmission and reception frequency band, and improve transmission characteristics.

[0162] At this time, it is preferable to position the ridge-forming protrusions (120) equally on both the left and right sides of the slot (110) as shown in FIG. 4(a) to make the characteristics of the beam radiated or received from the slot antenna (100) uniform, and in one embodiment, the ridge-forming protrusions (120) are formed equally on both the left and right sides of the slot (110) so that the shape of the slot (110) has an 'H' shape.

[0163] Likewise, as shown in FIG. 4(b), the signal connection section can also have an 'H' shape to adjust the transmission frequency band and design size of the signal connection section.

[0164] As described, the slot shape of the slot antenna (110) and the signal connection part shape of the package substrate (200) can be an 'H' shape, and only one side can be an 'H' shape.

[0165] Referring to FIG. 5, the slot of the antenna module according to the third embodiment may include a ridge-forming projection that is formed to protrude in a multilayer shape.

[0166] To explain in detail, it may include a plurality of ridge-forming protrusions that are sequentially formed along the length of the slot and have different shapes. Through a slot structure including such multilayered ridge-forming protrusions, it is possible to more effectively control the frequency band of electromagnetic waves radiated into the air by passing through the slot or to improve transmission characteristics.

[0167] The slot (110) shown in the partial enlargement in FIG. 5 is depicted as a left-right inversion for a more specific explanation, and as shown in FIG. 5, when multiple ridge grooves are formed in the height direction of the slot (110), the height of the ridge grooves can vary and is not limited.

[0168] Additionally, the ridge-forming protrusion (120) may include a plurality of protrusions having different shapes that are sequentially formed along the length direction of the slot (110) as shown in FIG. 5 (a) and (b). More specifically, the first ridge-forming protrusion (121) may include a first-1 ridge-forming protrusion (121-1) and a first-2 ridge-forming protrusion (121-2) that are formed on the upper and lower sides and have different shapes, and the second ridge-forming protrusion (122) may include a second-1 ridge-forming protrusion and a second-2 ridge-forming protrusion that are formed on the upper and lower sides and have different shapes.

[0169] Although the ridge-forming projection (120) is shown in the drawing as having a square cross-sectional shape, the ridge-forming projection can have various shapes such as an ellipse, a semicircle, or a polygon, so it is not limited to that.

[0170] In addition, in the antenna module (1000), the slot on the outer side of the slot antenna can be implemented in an ‘H’ shape including a ridge-forming protrusion, and the slot on the package substrate side can be implemented in a square shape. Of course, the opposite case is also possible.

[0171]

[0172] Referring to FIG. 6, the antenna module (1000) according to the fourth embodiment may have at least one of the selected metal layers (231) constituting the shielding portion (230) positioned facing the slot (110) with the signal transmission line (220) in between.

[0173] To explain in detail, a signal transmission line (220) connected to a radio frequency integrated circuit chip (210) is placed inside a package substrate (200), and a metal layer (231) is placed behind the signal transmission line (220), so that the metal layer (231) placed behind can reflect the radio frequency integrated circuit signal applied, thereby improving the transmission efficiency of the radio frequency signal.

[0174] At this time, the arrangement and connection of the metal layer (231), shielding via (232), power and control signal lines (260) must, of course, be arranged in an optimal form so as not to interfere with each other.

[0175]

[0176] Referring to FIG. 7, the slot antenna (100) of the antenna module (1000) according to the fifth embodiment includes a slot closing member (130) provided in the slot (110), and the slot closing member (130) may be a dielectric.

[0177] To explain in detail, in the above-described slot antenna (100), the slot (110) is an empty space, so air is used as a medium for transmitting radio frequency signals inside it; however, if air is used as a medium, there is a problem that the size of the slot (110) must be above a certain level. Therefore, in the present invention, a slot closing member (130) having a higher dielectric constant than air is filled into the slot (110), so that radio frequency signals of the same frequency band can be transmitted even if the size of the slot (110) is reduced.

[0178] The slot (110) must be designed in structure and size to match the frequency band of the antenna module (1000). In the case of a slot (110) in which air with a permittivity of 1 is used, its size is implemented to be relatively larger compared to the case in which a material with a high permittivity is filled inside the slot.

[0179] When implementing with a reduced slot size, it becomes easier to arrange a relatively large number of slots (110), and the trench space on the lower surface of the slot antenna (100) can be used widely to facilitate placement, or the conductive layer can be implemented widely to improve heat dissipation characteristics.

[0180] Therefore, since the slot (110) is filled with a dielectric material that has a higher dielectric constant than air, there is an advantage in that the slot size can be reduced. Various materials such as FR4 and Teflon, which are dielectric materials of commonly used substrates, can be applied as the slot closing member (130).

[0181] In addition, since the size (area) of the slot (110) is generally inversely proportional to the square root of the dielectric constant of the dielectric, it is desirable to use a dielectric with a dielectric constant between 2 and 10 as the slot closing member (130) in order to easily adjust and manufacture the size of the slot (110).

[0182] In addition, a slot antenna (100) can be manufactured very simply by milling, die casting, wire cutting, etc., and then putting a liquid dielectric material into the space of the slot and solidifying it, thereby producing a slot antenna including a slot closing member (130).

[0183]

[0184] Referring to FIG. 8, the slot antenna (100) of the antenna module according to the sixth embodiment includes the slot (110), and the package substrate (200) may include a coupling portion (240) that guides the movement of electromagnetic waves between the signal transmission line (220) and the slot (110).

[0185] And, the coupling unit (240) may include a signal coupling layer (241) located in the signal transmission unit (C) and a signal transmission via (242) connecting the signal coupling layer (241) and the signal transmission line (220).

[0186] To explain in detail, a signal coupling layer is formed in the signal connection part of the package substrate to improve impedance matching and signal coupling between the slot (110) of the slot antenna (100) and the signal connection part (C), thereby enabling high signal transmission capability between them.

[0187] At this time, the signal coupling layer (241) can transmit a signal to the signal transmission line (220) through the signal connection via (242).

[0188] At this time, although the signal transmission line (220) is shown in FIG. 8, it may be configured to be connected directly from the radio frequency integrated circuit chip (210) to the signal connection via (242) without a signal transmission line.

[0189] In addition, the signal coupling layer (241) of the package substrate (200) is preferably positioned facing the slot (110) of the slot antenna (100) and is configured to be wrapped by the metal layer (231) within the cavity of the package substrate (200).

[0190]

[0191] Referring to FIG. 9, in the antenna module according to the seventh embodiment, a trench (140) may be formed on the lower surface of the outer portion (112) facing the package substrate (200) of the slot antenna (100).

[0192] To explain in detail, in the case of the package substrate (200), a radio frequency integrated circuit chip (210), other integrated circuit chips, passive components, connectors, signal transmission lines (220), etc. are formed. If these components are formed on the lower surface, the connection wiring becomes more complex, especially on the lower surface, and the number of wiring layers for electrical connection increases. A trench (140) is formed on the lower surface of the outer part (112) of the slot antenna (100) facing the package substrate (200), so that components such as integrated circuit chips, passive components, and connectors can be placed on the upper surface of the package substrate (200) adjacent to the slot antenna (100). Furthermore, the signal generated by the components located in this trench is shielded by the structural characteristics of the slot antenna, which has a front or outer surface composed of a conductor, so that it does not affect the wireless signal transmitted through the slot. At this time, although the metal layer on the upper surface of the package substrate (200) is configured on the entire surface in the drawing, it is obvious that it can be patterned to be used only on a partial surface for the arrangement and electrical connection of components within the trench.

[0193] As explained above, when the components are freely arranged through the trench (140), power and control signal lines (260) can be formed on the lower surface of the package substrate (200), so that the analog signal routing wiring is moved away from the signal transmission line (220), and thus the effect of the analog signal of the power and control signal lines not interfering with the radio frequency signal also occurs.

[0194] In other words, since interference occurs when the radio frequency signal transmission path and the analog signal routing wiring are adjacent, it is very difficult to implement an antenna module in the ultra-high frequency millimeter wave band. Therefore, the problem that the package substrate (200) constituting the antenna module had to be thickened to secure an appropriate placement space can be solved.

[0195] To explain once again, a trench space (140) is formed in the slot antenna (100), so that a radio frequency integrated circuit chip (210), other integrated circuit chips, passive components, connectors, etc. placed on the package substrate (200) can be placed not only on the lower surface of the package substrate (200) but also on the upper surface coupled with the slot antenna (100), thus having the advantage of effectively configuring the routing and placement of the package substrate (200).

[0196]

[0197] Referring to FIG. 10, the slot antenna (100) of the antenna module according to the 8th embodiment may have an outer surface (F) formed of a conductor and an inner surface (I) formed of a different material having a lower density than the conductor.

[0198] To explain in detail, in the case of the slot antenna (100), since the slot (110) serves as a channel for transmitting and receiving wireless communication signals, the side surface of the slot (110) must be formed of a conductor material (such as metal) capable of shielding electromagnetic waves without loss.

[0199] In addition, regarding the part that contacts the signal connection portion of the package substrate, it is desirable to ensure that the lower conductor surface of the slot antenna contacts the ground layer of the package substrate without any gap, in order to reduce the loss of the transmitted wireless communication signal.

[0200] In addition, the upper surface of the slot antenna is also preferably composed of a conductor to perform the function of an antenna.

[0201] As such, a certain portion of the outer surface of the slot antenna must be composed of a conductor, but the interior of the slot antenna does not necessarily have to be composed of a conductor.

[0202] Therefore, since forming the entire slot antenna (100) with a conductive material would result in a problem of increased antenna module load, only the outer surface (F), which shields electromagnetic waves and guides them to pass through the slot (110) without loss, is formed with a conductive material, and the inner surface (I) of the slot antenna is formed with a different type of material that is lighter than the material forming the outer surface (PCB material, insulating material such as dielectric, foamed metal, especially a light and flexible material) to minimize weight.

[0203] In addition, the outer surface of the slot antenna (100) may not be formed entirely of the same material but may be formed of multiple materials. Specifically, the inner outer surface forming the slot (110) may be formed of a metal with excellent conductivity, while the lower surface may be formed of a metal with high thermal conductivity to effectively dissipate heat.

[0204] It is obvious that when the lower surface of the slat antenna (100) is formed of a metal having conductive properties and high thermal conductivity, heat dissipation through the slat antenna can be effectively achieved.

[0205] At this time, metals with high thermal conductivity having the conductive properties described above may include Al, Cu, Ag, or alloys of these metals, but are not limited to these as they may also include various other metals.

[0206]

[0207] Referring to FIG. 11, the antenna module according to the ninth embodiment may include a heat dissipation means (300) coupled to one or more sides of the slot antenna (100) and the package substrate (200). In particular, since the outer surface of the slot antenna is formed by a conductor, heat generated in the antenna module can be effectively dissipated from the conductive surface of the slot antenna to the heat dissipation means.

[0208] To explain in detail, the antenna module of the present invention is equipped with a plurality of high-output power devices, such as radio frequency integrated circuit chips, so as the output of these chips increases, the output of the transmitted signal is increased, and low signals can also be received.

[0209] Therefore, it is required to mount devices with increasingly higher output, and significant heat is generated from these high-output devices.

[0210] Heat is generated from high-power devices within the package substrate (200), which degrades the characteristics of the devices, causes deformation such as bending the substrate, and causes problems such as separating the bonding of components within the substrate.

[0211] Accordingly, in the present invention, heat generated in an antenna module including a package substrate (200) can be effectively discharged through the heat dissipation means (300).

[0212] To explain once again, in the case of the package substrate (200), the lower the dielectric loss, the less the loss of the radio frequency signal occurs. However, materials such as Teflon, which have low dielectric loss, are not only expensive but also have low thermal conductivity and mechanical properties, so there is a problem that deformation due to heat occurs easily. Therefore, heat is released through the heat dissipation means (300) to prevent a decrease in output loss of the antenna module and deformation of the package substrate due to heat generation.

[0213] At this time, the heat dissipation means may include a heat dissipation pad (310) that is combined in a manner that wraps around the side of the antenna module where the slot antenna (100) and the package substrate (200) are combined, and a plurality of heat dissipation fins (320) that are spaced apart and formed on the outer surface of the heat dissipation pad (310).

[0214]

[0215] Referring to FIG. 12, in the antenna module according to the 10th embodiment, a fixing groove (150) is formed on the lower surface of the slot antenna (100) facing the package substrate (200), and a fixing hole (250) corresponding to the fixing groove (150) may be drilled in the package substrate (200), and the slot antenna (100) and the package substrate (200) may be connected by a fixing bolt (400) that is fastened to the fixing groove (150) and the fixing hole (250).

[0216] In the manufacturing stage, a fixing hole (250) and a fixing groove (150) are formed in advance to align and attach the slot antenna (100) and the package substrate (200). In the coupling stage, the fixing groove (150) of the slot antenna (100) and the fixing hole (250) of the package substrate (200) are connected using a fixing bolt (400), thereby aligning the slot antenna (100) and the package substrate (200) to the correct coupling position, and at the same time, the lower surface of the slot antenna (100) and the upper surface of the package substrate (200) can be fixed by bringing them into contact.

[0217] At this time, it is desirable that there be no gap between the lower surface of all slot antennas (100) and the upper surface of the package substrate (200), and also desirable that there be no gap between the slot forming portion (111) of all slot antennas and the metal layer (231) within the cavity (205) of the package substrate. However, as previously described, even if a gap occurs in some areas due to the increase in the antenna array size, or manufacturing tolerances, the slot antennas can eliminate signal loss or interference through the cavity shielding via structure of the cavity of the package substrate.

[0218] The method of aligning and fixing the antenna module can be performed using a single fixing hole (250) and fixing groove (150), but it goes without saying that alignment and fixing can be achieved more effectively if performed using multiple or more.

[0219]

[0220] Referring to FIG. 13, in the antenna module according to the 11th embodiment, a fixing bar (160) is formed protruding from the lower surface of the slot antenna (100), and the package substrate (200) may have a fixing hole (250) formed to which the fixing bar (160) is coupled.

[0221] To explain in detail, the slot (110) of the slot antenna (100) and the cavity (205) of the package substrate (200) should be positioned in a one-to-one correspondence, and it is preferable that the lower surface of the slot forming portion of the slot antenna (100) and the metal layer (231) covering the signal connection portion (C) of the package substrate (200) be in contact with each other.

[0222] A fixing bar (160) is formed to align and interlock with a package substrate (200) on a slot antenna (100), and a fixing hole (250) is formed in the package substrate to which the fixing bar (160) is fastened. When the fixing bar (160) of the slot antenna is fastened to the fixing hole (250) of the package substrate, the slot antenna (100) and the package substrate (200) can be combined.

[0223] The alignment and fixing method of such antenna modules can be performed with a single fixing bar (160) and a fixing hole (250), but it is obvious that the effect is better when multiple fixing bars (160) and fixing holes (250) are used.

[0224]

[0225] Referring to FIG. 14, when the antenna module according to the 12th embodiment is coupled with the slot antenna (100) by engaging it with the package substrate (200), an adhesive member (410) may be disposed between the lower surface of the outer portion (112) of the slot antenna and the upper surface of the package substrate (200).

[0226] This adhesive member (410) can be configured to have adhesive properties to bond and fix the slot antenna and the package substrate. It can also be applied by placing a liquid on the adhesive surface of the package substrate or the slot antenna and allowing it to harden. Additionally, to include heat dissipation properties, it is preferable to use a material with high thermal conductivity, such as a metal material like copper, graphene, CNT, or nanoparticles like gold or copper, on the front or surface of this adhesive member.

[0227] By applying an adhesive member between the slot antenna (100) and the package substrate (200) in this way, a certain gap can be determined or maintained between the antenna slot forming portion (111) and the signal connection portion (C), which is the upper surface of the signal transmission portion (201), within the cavity of the package substrate, depending on the thickness of the adhesive member (4100). This gap, or whether it is in direct contact, is one of the major design elements that determine the frequency band passing through the slot. By applying the adhesive member in this manner, the frequency band passing through the slot in the antenna module can be controlled more effectively, and there is also the advantage of performing the heat dissipation and fixing roles described above.

[0228] Referring to FIG. 15, when a plurality of slot arrangements formed in a slot antenna (100) are formed as a multi-resonant structure, the size of each slot of the plurality of slots corresponding to the multi-resonant structure is formed differently, and the vertical length of the slot forming part can be determined in correspondence with the size of the formed slot.

[0229] For example, as shown in FIG. 15, the size and arrangement of the slots are determined according to a multi-slot arrangement based on the multi-resonant structure described above, such that the size of the second slot (110-2) may be larger than the size of the first slot (110-1).

[0230] As a result, the vertical length of the slot forming part (111-4) corresponding to the first slot (110-1) can be formed in proportion to the size of the first slot (110-1).

[0231] Additionally, the vertical length of the slot forming part (111-3) corresponding to the second slot (110-2) can be formed in proportion to the size of the second slot (110-2).

[0232] That is, a step (D) occurs between the slot forming part (111-4) corresponding to the first slot (110-1) and the slot forming part (111-3) corresponding to the second slot (110-2), and this step (D) can be understood as allowing the advantages of the structure of the slot antenna (100), including the slot (110) and the slot forming part (120) described above in the present invention, to be further extended to the part of the antenna module (1000) corresponding to the step (D).

[0233] Under a multi-resonance structure, forming each slot forming part differently in proportion to the size of the corresponding slot has the advantage of directly linking the manufacturing process for forming the slot to the manufacturing process for forming the slot forming part. This allows for the waste of slot material that falls off during the drilling process when the manufacturing process for forming the slot involves drilling the slot antenna (100). In such cases, it is possible to improve the process into an efficient one by directly linking the manufacturing process for the vertical length of the slot forming part while forming the slot on the slot antenna (100), and the slot material that was wasted in the conventional drilling method of slot formation can be used to form the slot forming part.

[0234] Of course, even under a multi-resonance structure, it is possible to provide a constant vertical length of the slot forming portion even if the sizes of the various slots differ. This can be applied when providing a slot antenna (100) in which the slot is already formed by a separate mold manufacturing process, rather than forming the slot by a drilling method as described above.

[0235] The present invention is not limited to the embodiments described above and has a diverse scope of application. Furthermore, it is understood that anyone with ordinary knowledge in the field to which the present invention pertains can make various modifications without departing from the essence of the invention as claimed in the claims.

Claims

1. A three-dimensional slot antenna having a slot formed through which electromagnetic waves pass, wherein the slot forming portion forming the slot is thicker than the outer portion; and A package substrate having a radio frequency integrated circuit chip disposed thereon and a cavity formed on a surface facing the slot antenna; comprising An antenna module characterized by a portion of the above-mentioned slot forming portion being interlocked and arranged within the above-mentioned cavity.

2. In Paragraph 1, An antenna module characterized by the fact that the above-mentioned slot antenna and the above-mentioned package substrate are manufactured individually and then combined.

3. In Paragraph 1, An antenna module characterized by the fact that a plurality of the above slots are spaced apart at regular intervals on the antenna to form an array.

4. In Paragraph 1, The above slot is an antenna module whose cross-sectional area, length, and material are determined in correspondence with the wavelength of the radio frequency signal.

5. In Paragraph 1, The above slot is provided in correspondence with the cavity specifications of the package substrate, or is provided in correspondence with the specifications of a passage passing through the package substrate opposite to the package substrate, for an antenna module.

6. In Paragraph 1, An antenna module comprising a plurality of cavity shielding vias surrounding the cavity of the package substrate, wherein the package substrate has a cavity formed therein for accommodating the slot.

7. In Paragraph 1, An antenna module comprising: a shielding portion arranged in a manner that encloses the signal transmission line on the above package substrate.

8. In Paragraph 1, The above package substrate comprises a metal layer formed on an upper surface having a cavity formed therein, an antenna module.

9. In Paragraph 7, The above shielding portion comprises a plurality of metal layers formed on a dielectric layer constituting the package substrate and shielding vias connecting the metal layers; an antenna module.

10. In Paragraph 9, An antenna module characterized by the fact that one of the plurality of metal layers selected is positioned to face the slot with the signal transmission line in between.

11. In Paragraph 7, An antenna module characterized by the shielding portion being arranged to surround the slot and forming a signal transmission portion in the center.

12. In Paragraph 1, An antenna module comprising: a ridge-forming projection formed to protrude toward the slot; the above-mentioned slot antenna.

13. In Paragraph 12, An antenna module characterized by having a plurality of the above-mentioned ridge-forming protrusions formed therein.

14. In Paragraph 1, An antenna module characterized by the above-mentioned slot antenna including a slot closing member provided in the slot, wherein the slot closing member is a dielectric.

15. In Paragraph 14, An antenna module characterized by the above-mentioned slot closing member having a permittivity of 2 or more and 10 or less.

16. In Paragraph 1, An antenna module comprising: a coupling portion that guides the movement of electromagnetic waves between the radio frequency integrated circuit chip and the slot, wherein the above package substrate.

17. In Paragraph 1, The above-mentioned slot antenna comprises a trench formed on the lower surface facing the package substrate; an antenna module.

18. In Paragraph 1, An antenna module characterized by the fact that the slat antenna has an outer surface formed of a conductor and an inner surface formed of a material having a lower density than the conductor.

19. In Paragraph 1, An antenna module comprising: a heat dissipation means coupled to one or more sides of the above-mentioned slot antenna and package substrate.

20. In Paragraph 1, The above-mentioned slot antenna has a fixing groove formed on the lower surface facing the package substrate; The above package substrate includes a fixing hole formed facing the above fixing groove; and An antenna module comprising: a fixing bolt fastened to the fixing groove and the fixing hole.

21. In Paragraph 1, The above-mentioned slot antenna has a fixing bar formed on the lower surface facing the package substrate; An antenna module comprising: a fixing hole formed in a position facing the fixing bar, to which the fixing bar is coupled; wherein the above package substrate is formed.

22. In Paragraph 1, An antenna module comprising: an adhesive member disposed between the lower surface of the outer portion of the slot antenna and the upper surface of the package substrate.

23. In any one of paragraphs 1 through 22 selected, An antenna module in which, when a plurality of slot arrangements formed in the above-mentioned slot antenna are formed as a multi-resonance structure, the size of each slot of the plurality of slots corresponding to the multi-resonance structure is formed differently, and the vertical length of the slot forming part is determined in correspondence with the size of the formed slot.

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