Application method of component-embedded packaging unit in PCB
By vertically embedding the component embedding packaging unit into the PCB substrate, the shortcomings of traditional packaging methods in terms of current carrying capacity and heat dissipation are solved, and high-efficiency energy consumption is improved.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- WUS PRINTED CIRCUIT KEPZ (KUNSHAN) CO LTD
- Filing Date
- 2025-11-12
- Publication Date
- 2026-05-21
AI Technical Summary
Traditional component packaging methods and PCB processing methods cannot meet the requirements of increasingly complex electronic functions and high energy efficiency, especially in terms of current carrying capacity, losses and heat dissipation.
By vertically embedding the component embedded packaging unit into the second PCB substrate, processing the exposed pins on the sidewalls, and forming metallized holes that allow for vertical conduction at the pins, circuit conduction is achieved.
It reduces the floor space occupied, increases the flow density per unit area, improves the heat dissipation distribution of the system, reduces losses, and improves energy efficiency.
Smart Images
Figure CN2025134241_21052026_PF_FP_ABST
Abstract
Description
A method for applying embedded component packaging units in PCB Technical Field
[0001] This invention relates to a method for applying embedded component packaging units in PCBs, belonging to the field of printed circuit board technology. Background Technology
[0002] With the rapid development of the technology industry in recent decades, electronic equipment technology has continuously evolved and progressed, leading to increasingly complex and diversified functions. This has resulted in increasingly stringent requirements for component packaging and PCB (printed circuit board) applications. Due to the diverse needs of electronic equipment, traditional packaging methods and PCB processing techniques can no longer meet the ever-changing societal demands. Further research is needed to improve current carrying capacity, reduce losses, and enhance power and efficiency. Summary of the Invention
[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for applying a component embedded packaging unit in a PCB. The method involves forming a component embedded packaging unit, processing pins with external sides, and then vertically embedding this component embedded packaging unit into a second PCB substrate. Metallized holes with vertical conductivity are made at the pins to achieve circuit conduction.
[0004] To achieve the above objectives, the present invention is implemented using the following technical solution:
[0005] In a first aspect, the present invention provides a method for applying embedded component packaging units in a PCB, comprising:
[0006] The second PCB substrate is processed according to the design requirements to generate a scouring groove, wherein the surface of the second PCB substrate after generating the scouring groove has a second copper layer.
[0007] The component embedding and packaging unit is vertically embedded in the retrieval groove;
[0008] Prepreg and copper foil are sequentially laid on the surface of the second copper layer, pressed together, and laser holes with external conductivity are processed at the pin positions of the components. The laser holes are electroplated with copper to achieve circuit conductivity in the PCB.
[0009] Furthermore, the fabrication process of the embedded component packaging unit includes:
[0010] According to the design requirements, the first PCB substrate is drilled and electroplated with copper, and the surface of the first PCB substrate has a first copper layer; the graphic design is performed on the first copper layer to generate the placement area;
[0011] A first groove is formed in a predetermined placement area of the first PCB substrate, and the bottom of the first groove extends to the first copper layer at the bottom of the first PCB substrate;
[0012] The components are attached to the first copper layer at the bottom of the first groove;
[0013] Prepreg and copper foil are sequentially laid on the side of the first PCB substrate where the components are attached, and then laminated.
[0014] A second groove for external conduction of the component is machined on the prepreg and copper foil;
[0015] Electroplating copper is performed on the second groove on the top of the component to generate a metallized filler layer;
[0016] The top and bottom surfaces of the first PCB substrate after lamination are electroplated to thicken them, thereby generating a thickened copper layer on the surface.
[0017] Graphical design is performed on the thickened copper layer to generate the top and bottom pins of the component, resulting in the finished embedded component packaging unit.
[0018] Furthermore, when the top and bottom surfaces of the first PCB substrate after lamination are electroplated to thicken, the thickness is at least greater than 2 oz.
[0019] Furthermore, the components are attached to the first copper layer by forming a welding layer through silver sintering or eutectic bonding.
[0020] Furthermore, the bottom pins of the component extend to the sidewall through a solder layer and etched patterns, and the top pins of the component extend to the sidewall through a metallized second groove and etched patterns.
[0021] Furthermore, the size of the groove on the second PCB substrate is larger than the size of the embedded component packaging unit, and the single-sided spacing is between 100 and 300 μm; the thickness of the second PCB substrate matches the thickness of the component, with a deviation within + / - 100 μm.
[0022] Furthermore, the first PCB substrate / second PCB substrate is a single-layer core board or a composite of multiple core boards laminated together.
[0023] Furthermore, the thickness of the first copper layer at the bottom of the first PCB substrate is not less than 1 oz, and the board thickness is greater than the thickness of the components.
[0024] Furthermore, the size of the first groove is larger than the size of the component, and the single-sided spacing is between 100 and 200 μm.
[0025] Furthermore, one or more components are embedded in the component embedding packaging unit.
[0026] Compared with the prior art, the beneficial effects achieved by the present invention are as follows:
[0027] This invention provides a method for applying embedded component packaging units in PCBs. Based on PCB fabrication, it achieves highly integrated embedded component packaging and fabricates pins that can be exposed on the sidewalls. The embedded component packaging unit is vertically embedded into a second PCB substrate, and conductive metallized holes are made at the pins to form a circuit distribution perpendicular to the component. Compared with traditional planar power supply structures, the planar area is reduced for the same current carrying capacity, and the current density per unit area can be increased several times. Furthermore, the vertical copper surface structure improves the heat dissipation distribution of the system, reduces losses, and improves energy efficiency. It has strong applicability and far-reaching significance. Attached Figure Description
[0028] Figure 1 is a schematic diagram of vertically embedding a component embedding and packaging unit in the second PCB substrate according to an embodiment of the present invention;
[0029] Figure 2 is a schematic diagram of a conventional planar power supply structure provided in an embodiment of the present invention;
[0030] Figure 3 is a schematic diagram of the vertical embedded structure in the PCB provided in an embodiment of the present invention;
[0031] Figure 4 is a schematic diagram of drilling, electroplating and pattern processing of the first PCB substrate according to design requirements provided in an embodiment of the present invention.
[0032] Figure 5 is a schematic diagram of the processing of the first groove provided in an embodiment of the present invention;
[0033] Figure 6 is a schematic diagram of attaching components to the first copper layer by means of silver sintering or eutectic bonding according to an embodiment of the present invention.
[0034] Figure 7 is a schematic diagram of the lamination of a prepreg and copper foil onto a first PCB substrate provided in an embodiment of the present invention.
[0035] Figure 8 is a schematic diagram of the processing of the second groove provided in an embodiment of the present invention;
[0036] Figure 9 is a schematic diagram of the second groove electroplating and the thickened surface copper electroplating provided in an embodiment of the present invention;
[0037] Figure 10 is a schematic diagram of the component embedded packaging unit provided in an embodiment of the present invention.
[0038] In the figure: 1. First PCB substrate; 2. First groove; 3. Component; 4. Solder layer; 5. Copper foil; 6. Prepreg; 7. Second groove; 8. Metallized filler layer; 9. Component embedded packaging unit; 10.1. Top pin of component; 10.2. Bottom pin of component; 11. Metallized holes above and below the pin; 12. Second PCB substrate. Detailed Implementation
[0039] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.
[0040] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.
[0041] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0042] As shown in Figure 1-10, this embodiment introduces a method for applying a component embedded packaging unit in a PCB, including:
[0043] 1. Drilling, electroplating and pattern processing are performed on the first PCB substrate 1 according to the design requirements, as shown in Figure 4;
[0044] 2. A first groove 2 is machined in the area where the component needs to be placed to expose the first copper layer at the bottom of the first PCB substrate 1, as shown in Figure 5;
[0045] 3. The component 3 is attached to the first copper layer by forming a welding layer 4 through silver sintering or eutectic bonding, as shown in Figure 6;
[0046] 4. A prepreg 6 and a copper foil 5 are stacked on the first PCB substrate 1 on which the components are attached, and then pressed together, as shown in Figure 7.
[0047] 5. A second groove 7 is machined above the area on the top of the component that needs to be externally conductive, and the first PCB substrate 1 after lamination is drilled according to the design requirements, as shown in Figure 8.
[0048] 6. Electroplating copper is performed on the second groove 7 on the top of the component to form a metallized filling layer 8, and the drilled hole is electroplated with metallization.
[0049] 7. The first copper layer at the top and bottom of the first PCB substrate 1 after lamination is electroplated to thicken it by at least 2 oz, as shown in Figure 9.
[0050] 8. Create the surface pattern according to the circuit design to form the top pin 10.1 and bottom pin 10.2 of the component;
[0051] 9. The surface of the first PCB substrate 1 can be further metallized as required;
[0052] 10. Fabricate the components into embedded packaging units 9 according to the design, as shown in Figure 10;
[0053] 11. Make the second PCB substrate 12, drill holes in the second PCB substrate according to the design requirements to generate slots, vertically embed the component embedded packaging unit 9 in the slots, add prepreg and copper foil on the top and bottom and press them together, make metallized holes 11 on the top and bottom of the pin area, and complete the vertical embedding of the component embedded packaging unit 9 in the PCB, so that the circuit in the PCB can be connected, as shown in Figure 1.
[0054] The first PCB substrate 1 can be a single core board or a composite of multiple core boards laminated together. The thickness of the first copper layer at its bottom must be ≥1oz, and the board thickness must be greater than the thickness of component 3. Drilling, electroplating, and pattern processing can be selectively performed according to the circuit design of component 3.
[0055] The first groove 2 processed in the area where the component 3 is placed must be larger than the size of the component 3, and the single-sided spacing must be between 100 and 300 μm.
[0056] The attachment method of the component 3 includes not only the silver sintering and eutectic bonding methods described in the example, but also other bonding methods.
[0057] The metallization of the second groove 7 and the drilled hole on the top of the component 3 includes not only the electroplating process described in the example, but also other metallization processes.
[0058] The copper thickness of the top and bottom surfaces of the PCB board is increased by electroplating, and the copper thickness specification is determined according to the circuit design and current of component 3.
[0059] The top pin 10.1 of the component extends to the sidewall through the metallized second groove 7 and the etched pattern; the bottom pin 10.2 of the component extends to the sidewall through the solder layer 4 and the etched pattern.
[0060] The further metallization treatment of the surface of the first PCB substrate 1 after lamination can be selectively performed according to the circuit design of the components 3.
[0061] The component embedding and packaging unit 9 can embed one or more components 3 according to the design.
[0062] The second PCB substrate 12 can be a single core board or a composite of multiple core boards laminated together; the groove size is larger than the size of the component embedding package unit 9, and the single-sided spacing is between 100 and 200 μm; the thickness of the second PCB substrate 12 matches the thickness of the component 3, with a deviation within + / - 100 μm; the structural design of vertically embedding the component embedding package unit 9 and making metallized holes on the top and bottom of the pins to achieve circuit conduction in the PCB is considered to use this solution.
[0063] As shown in Figure 2, traditional components are packaged and attached to the substrate surface to form a traditional planar power supply structure. In this solution, the component embedded packaging unit 9 is fabricated and vertically embedded in the PCB. Metallized holes 11 are made above and below the pins to form a vertical embedded structure in the PCB, as shown in Figure 3. The planar area occupied by the unit component is reduced. Under the same current carrying capacity, the current density per unit area is increased to 3 times, and the heat dissipation distribution is improved and the loss is reduced, which has profound significance.
[0064] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.
Claims
1. A method for applying a component embedded packaging unit in a PCB, characterized in that, include: The second PCB substrate is processed according to the design requirements to generate a scouring groove, wherein the surface of the second PCB substrate after generating the scouring groove has a second copper layer. The component embedding and packaging unit is vertically embedded in the retrieval groove; Prepreg and copper foil are sequentially laid on the surface of the second copper layer, pressed together, and laser holes with external conductivity are processed at the pin positions of the components. The laser holes are electroplated with copper to achieve circuit conductivity in the PCB.
2. The application method of the component embedded packaging unit in a PCB according to claim 1, characterized in that, The fabrication process of the embedded component packaging unit includes: According to the design requirements, the first PCB substrate is drilled and electroplated with copper, and the surface of the first PCB substrate has a first copper layer; the graphic design is performed on the first copper layer to generate the placement area; A first groove is formed in a predetermined placement area of the first PCB substrate, and the bottom of the first groove extends to the first copper layer at the bottom of the first PCB substrate; The components are attached to the first copper layer at the bottom of the first groove; Prepreg and copper foil are sequentially laid on the side of the first PCB substrate where the components are attached, and then laminated. A second groove for external conduction of the component is machined on the prepreg and copper foil; Electroplating copper is performed on the second groove on the top of the component to generate a metallized filler layer; The top and bottom surfaces of the first PCB substrate after lamination are electroplated to thicken them, thereby generating a thickened copper layer on the surface. Graphical design is performed on the thickened copper layer to generate the top and bottom pins of the component, resulting in the finished embedded component packaging unit.
3. The method for applying the embedded component packaging unit in a PCB according to claim 2, characterized in that, When the top and bottom surfaces of the first PCB substrate after lamination are electroplated to thicken them, the thickness shall be at least greater than 2 oz.
4. The method for applying the embedded component packaging unit in a PCB according to claim 2, characterized in that, The components are attached to the first copper layer by forming a solder layer through silver sintering or eutectic bonding.
5. The method for applying the embedded component packaging unit in a PCB according to claim 4, characterized in that, The bottom pins of the component extend to the sidewall through a solder layer and an etched pattern, while the top pins of the component extend to the sidewall through a metallized second groove and an etched pattern.
6. The method for applying the embedded component packaging unit in a PCB according to claim 1, characterized in that, The size of the groove on the second PCB substrate is larger than the size of the embedded component packaging unit, and the single-sided spacing is between 100 and 300 μm; the thickness of the second PCB substrate matches the thickness of the component, with a deviation within + / - 100 μm.
7. The method for applying the embedded component packaging unit in a PCB according to claim 2, characterized in that, The first PCB substrate / second PCB substrate is a single-layer core board or a whole formed by laminating multiple core boards.
8. The method for applying the embedded component packaging unit in a PCB according to claim 2, characterized in that, The thickness of the first copper layer at the bottom of the first PCB substrate is not less than 1 oz, and the board thickness is greater than the thickness of the components.
9. The method for applying the embedded component packaging unit in a PCB according to claim 1, characterized in that, The first groove is larger than the size of the component, and the single-sided spacing is between 100 and 200 μm.
10. The method for applying the embedded component packaging unit in a PCB according to claim 1, characterized in that, One or more components are embedded in the component embedding and packaging unit.