Temperature resistant frame structure for housing device and a manufacturing method thereof

Abstract

The present invention relates to a temperature-resistant frame structure for housing devices used in extreme and hazardous environments. The invention provides an article comprising a flat base configured for secure attachment to the housing device and a top unit having a groove that partially conceals and shields the gasket to reduce exposure to heat, dust, and contaminants. The frame is manufactured by a compression moulding process conducted under defined pressure, temperature, and curing conditions to achieve uniform structural integrity and precise groove formation. The flat base ensures stable attachment to the enclosure, while the groove covers a portion of the gasket, extending its operational life and maintaining an effective seal. The resulting frame structure exhibits high thermal stability, durability, and reliable sealing performance, making it suitable for industrial applications requiring continuous protection of internal components under extreme environmental conditions.

Description

TEMPERATURE RESISTANT FRAME STRUCTURE FOR HOUSING DEVICE AND A MANUFACTURING METHOD THEREOFFIELD OF INVENTION

[0001] The present invention relates to the field of protective seals specifically designed for use in environments that are exposed to extreme temperatures. More particularly, it pertains to a temperature-resistant frame structure for housing devices, including a groove feature, which acts as an excellent seal and provides enhanced protection to gasket and internal components from harsh environmental conditions. The invention also provides the method for manufacturing the temperature-resistant frame, suitable for various types and sizes of housing devices, and its assembly on such housing devices, thereby ensuring high durability, thermal stability, and robust sealing capabilities in hazardous locations such as industrial plants, oil and gas facilities, and chemical processing units.BACKGROUND OF INVENTION

[0002] In many industrial applications, electrical and electronic components are housed within housing devices to protect them from external environmental factors. These housing devices are essential for maintaining the integrity and functionality of the components they safeguard. However, in environments characterized by extreme temperatures, such as industrial plants, oil and gas facilities, and chemical processing units, standard housing devices often fail to provide adequate protection. The seals and structural materials of conventional housing devices degrade rapidly when exposed to high temperatures, leading to premature failure and increased maintenance costs.

[0003] Existing solutions, while offering some degree of protection, often fall short in providing comprehensive temperature resistance. Materials used in currentenclosures as gaskets, installed on the door of the housing device to act as a seal, may not withstand prolonged exposure to extreme heat or cold, resulting in compromised performance and potential safety hazards. The degradation of gasket can lead to the ingress of dust, water, and other contaminants, further increasing the risk of equipment failure.

[0004] When considering materials for gaskets, several options are commonly used due to their specific properties, including but not limited to, silicone-based seals for flexibility and resistance to moisture, dust, and temperature fluctuations; Neoprene, for its resistance to oils and chemicals; EPDM (ethylene propylene diene monomer) for its durability and exceptional UV resistance; PVC (polyvinyl chloride) and TPE (thermoplastic elastomer) for cost-effectiveness; fluor elastomers like Viton for chemical resistance. While each of these materials offers unique benefits, they are not engineered for prolonged thermal resilience and degrade rapidly under fluctuating temperatures. This results in a loss of sealing capability and compromises enclosure integrity, allowing contaminants to infiltrate the housing device. Consequently, sensitive internal components are exposed to risks, reducing their operational life and increasing the likelihood of malfunctions. Such degradation necessitates frequent maintenance and replacement, resulting in costly downtime and inefficiencies in industrial operations. Thus, there is a significant need for a robust enclosure system with a seal that can effectively withstand extreme temperature conditions, protect the gasket, and ensure not only the longevity and reliability of the housed components but also the safety of operators working in proximity to such industrial equipment.

[0005] The present invention addresses this need by introducing a temperature- resistant frame structure specifically designed using advanced materials, including but not limited to, Antistatic Fiberglass Reinforced Polyester (FRP), for housing devices used in hazardous and high-temperature environments. The advanced materials have comprehensive qualities, which includes thermal resistance, mechanical strength, excellent insulation, goodchemical resistance, and UV durability, making it an ideal choice for hazardous and extreme temperature environments.

[0006] Additionally, the temperature-resistant frame structure in the present invention incorporates a specially designed groove that partially conceals and shields the gasket, thereby providing strong seal and effectively reducing the gasket’s direct exposure to extreme temperatures and contaminants. By safeguarding the gasket in this manner, the invention enhances the overall durability and performance of the housing device, ensuring a longer service life, reduced maintenance needs, and improved protection for critical internal components in challenging industrial and hazardous environments. This frame structure, including the groove feature, is manufactured using advanced materials and a unique method that provides superior thermal stability and sealing capabilities, significantly improving the durability and reliability of the housing devices.

[0007] The manufacturing method ensures that the frame structure maintains its integrity and performance even under the most demanding conditions. By focusing on materials with high thermal resistance and employing advanced moulding techniques, the invention offers a solution that not only extends the operational life of the housing devices and minimizes maintenance costs and downtime, but also enhances the overall safety of operators by preventing failures or malfunctions that could arise from thermal degradation or compromised sealing performance.

[0008] This invention represents a significant advancement in the field of protective housing devices, providing a much-needed solution for industries where extreme temperatures are a daily challenge. It ensures that critical electrical and electronic components remain protected, thereby improving overall operational safety and efficiency.

[0009] Till date no attempts have been made to develop a temperature-resistant frame structure specifically designed for housing devices, particularly for protectingthe gasket in extreme and hazardous environments. Current solutions lack the comprehensive thermal protection and durability required to maintain seal integrity under prolonged exposure to high and low temperatures, as well as resistance to dust, moisture, and corrosive substances. While standard gasket materials like silicone, neoprene, and EPDM offer some degree of sealing and environmental resistance, they fall short in terms of structural stability and long-term performance in demanding settings. This gap has highlighted the need for an advanced frame structure that not only withstands harsh conditions but also protects the gasket by partially concealing it within the groove, thereby extending the lifespan of the housing devices and minimizes maintenance. The present invention addresses this need by providing a unique combination of advanced materials and a specialized groove feature, ensuring unmatched thermal resilience and protection for both gasket on the door of the housing device and the sensitive internal components, thereby enhancing the safety of the operator during use and maintenance.OBJECT OF THE INVENTION

[0010] It is the principal object of the invention, to provide a temperature resistant frame structure for housing devices, including but limited to metallic housing devices such as stainless-steel, aluminum and sheet metal housing devices.

[0011] Another object of the invention is to enhance the durability and longevity of housing devices in extreme environments by incorporating advanced materials that can withstand high and low temperatures, thereby reducing degradation and extending the service life of the housing device seals.

[0012] Yet another object of the invention is to provide a process for manufacturing temperature resistant frame structure for housing devices, ensuring consistent quality and performance.

[0013] Another object of the invention is to provide a temperature resistant frame structure manufactured using advanced materials, including but not limited to, Antistatic Fiberglass Reinforced Polyester (FRP) and High-TemperatureRTV (Room Temperature Vulcanized) Silicone Sealant, which together provide enhanced thermal insulation, structural integrity, and protection.

[0014] Yet another object of the invention is to provide a groove within the temperature-resistant frame structure, configured to partially conceal the gasket or seal on the door of the housing device, thereby providing enhanced protection to the gasket by reducing direct exposure to extreme temperatures and prolonging the operational life of the seal.

[0015] A further object of the invention is to minimize maintenance requirements for housing devices in industrial settings by providing a robust frame structure that maintains reliable sealing capabilities against dust, moisture, and contaminants, thereby reducing downtime and maintenance costs.

[0016] It is also an object of the invention to improve the safety of electrical components housed within housing devices by protecting them from exposure to harsh environmental conditions, particularly in hazardous locations where temperature fluctuations may pose operational challenges and potential safety risks to personnel.

[0017] Another obj ect of the invention is to ensure the adaptability of the temperature resistant frame structure to various enclosure types and sizes, allowing for broader industrial applications in fields requiring secure and thermally stable housing for electrical components, such as oil and gas, chemical processing, and outdoor installations.SUMMARY OF INVENTION

[0018] Conventional sealing materials often degrade when subjected to extreme temperatures, leading to compromised enclosure integrity, increased maintenance requirements, and potential safety risks for sensitive electrical components. Additionally, the existing manufacturing processes for thermal frames lack consistency and efficiency, which can lead to variations in quality and performance. Therefore, there is a need for a frame structure that not onlyprovides effective thermal resistance but also minimizes maintenance, enhances safety against dust, moisture, and other contaminants, and extends the operational lifespan of housing devices in challenging environments. The temperature-resistant frame structure for electrical housing devices that can withstand high and low temperatures, thereby reducing material degradation and extending the service life of the enclosure seals, and the manufacturing process are disclosed.

[0019] According to the main aspect of the invention, there is provided a temperature-resistant frame structure (200) for housing devices (100), comprising of a top unit (201) and a bottom unit (202), wherein the bottom unit includes a flat base (203) configured for secure attachment to the body of the housing device (101), thereby providing a stable and consistent contact surface, ensuring reliable adhesion to the enclosure’s lip area (103), and the top unit is equipped with a groove (204) specifically designed to partially conceal and shield the gasket (104) positioned on the door (102) of the housing device, thereby effectively reducing direct exposure to extreme temperatures and environmental contaminants, such top unit and bottom unit coupled with each other to constitute the temperature-resistant frame structure.

[0020] According to another aspect of the invention, the temperature-resistant frame structure (200) provided for housing devices (100) is particularly suited for use in metallic housing devices, including stainless steel, aluminium, and sheet metal housing devices, which are commonly exposed to fluctuating temperatures in industrial and hazardous locations.

[0021] According to another aspect of the invention, the groove (204) in the top unit (201) is designed with a width ranging from approximately 8mm to 11 mm, more preferably between 10mm to 11 mm, and a depth of about 2 mm, and the bottom unit (202) having a flat base (203) has a width in the range of approximately 12 mm to 20 mm, more preferably between 19 mm and 20 mm.

[0022] According to another aspect of the invention, the groove (204) in the top unit (201) is configured to conceal 30% to 40% of the gasket surface to enhance gasket retention and sealing performance.

[0023] According to another aspect of the invention, the top unit (201) and the bottom unit (202) of the frame structure are configured to form an impermeable seal, thereby restricting the passage of air and / or water and preventing potential damage from environmental factors.

[0024] According to another aspect of the invention, the overall length and breadth of the temperature-resistant frame structure (200) are tailored to match the specific dimensions of the enclosure's lip area (103), ensuring a precise fit for the selected housing device, and the frame thickness may range from approximately 5mm to 6 mm depending on the enclosure dimensions and intended application, forming a consistent and robust seal along the enclosure’s lip.

[0025] According to another aspect of the invention, the housing devices (100) may be selected in various configurations, with a height ranging from approximately 75 mm to 2200 mm; a width ranging from approximately 75 mm to 2000 mm; and a depth ranging from approximately 50 mm to 1600 mm.

[0026] According to another aspect of the invention, there is provided a temperature- resistant frame structure (200) to enhance the durability and longevity of housing devices (100) in extreme environments by incorporating advanced materials that can withstand high and low temperatures, thereby reducing degradation and extending the service life of the housing device seals.

[0027] According to another aspect of the invention, there is provided a temperature- resistant frame structure constructed using advanced materials, including but not limited to Antistatic Fiberglass Reinforced Polyester (FRP) and sealant (301), including but not limited to High-Temperature RTV (Room Temperature Vulcanized) Silicone Sealant.

[0028] According to another aspect of the invention, there is provided a temperature- resistant frame structure (200) constructed from Antistatic Fiberglass Reinforced Polyester (FRP) having thermal resistance ranging from -60°C to 200°C.

[0029] According to another aspect of the invention, there is provided sealing of temperature-resistant frame structure (200) to the housing device (100) using High-Temperature RTV (Room Temperature Vulcanized) Silicone Sealant having thermal resistance ranging from -60°C to 220°C.

[0030] According to yet another aspect of the invention, there is provided a process for manufacturing a temperature-resistant frame structure (200) and said method comprising the steps of:(a) preparing the pre-impregnated fiber and resin mixture of the advanced material with a Relative thermal index (RTI) including factor of safety; (b) compressing the pre -impregnated fiber and resin mixture of the advanced material using a compression moulding machine with predefined moulding parameters, including curing period, to obtain a thermally stable, impact-resistant frame of desired shape and size;(c) allowing the moulded frame to cool at room temperature to obtain the temperature-resistant frame of desired shape and size, factoring the shrinkage and warpage due to the nature of the advanced material;

[0031] According to another aspect of the invention, the temperature-resistant frame structure (200) is manufactured using a pre -impregnated fiber and resin mixture of the advanced material, specifically Antistatic Fiberglass Reinforced Polyester (FRP).

[0032] According to another aspect of the invention, the Antistatic Fiberglass Reinforced Polyester (FRP) used to manufacture the temperature-resistant frame structure (200) is designed with a Relative thermal index (RTI) rangingapproximately from 150°C to 200°C to ensure high thermal stability in extreme environments.

[0033] According to another aspect of the invention, the moulding parameters designed to obtain the temperature-resistant frame (200) of desired shape and size are a mould temperature range of 150°C to 180°C, a pressure range of 100 Kg / cm2to 150 Kg / cm2, a charge weight calculated as Volume of Parts (CC) x 1.7 to 1.8 gm / CC, and a curing time typically ranging from 170 seconds to 180 seconds.

[0034] According to yet another aspect of the invention, the temperature-resistant frame structure (200) is assembled on the body of the housing device (101) using High-Temperature RTV (Room Temperature Vulcanized) Silicone Sealant, engineered to withstand elevated temperatures, as part of an adhesive application process.

[0035] According to another aspect of the invention, the adhesive application process includes steps to clean, apply, align, and cure the temperature-resistant frame structure (200) on the housing device body (101), ensuring a secure bond and reliable seal.

[0036] According to another aspect of the invention, the body of the housing device (101) is metallic, particularly stainless steel or carbon steel.

[0037] According to another aspect of the invention, the technical grade solvent used for cleaning the surface of the housing device is Isopropyl Alcohol of 99.8% purity.

[0038] According to another aspect of the invention, the assembled temperature- resistant frame (200) forms a seal between the door (102) and the body (101) of the housing device, protecting the electrical components from exposure to harsh environmental conditions, including dust, moisture, and other contaminants.

[0039] These and other aspects of the present invention are set out in the following detailed description of the invention.BRIEF DESCRIPTION OF DRAWINGS

[0040] FIG. 1 depicts a perspective view of the temperature-resistant frame structure (200), showcasing the overall design and configuration of the frame, including the groove feature.

[0041] FIG. 2 depicts a perspective view of the temperature-resistant frame structure (200) assembled onto a housing device (100), highlighting the placement and configuration of the bottom unit (202) of the frame with respect to the lip area (103) of the housing device.

[0042] FIG. 3 shows a cross-sectional view of the frame structure (200) and housing device ( 100), illustrating the bonding between the temperature-resistant frame structure and the metal surface of the housing device, as well as the application of the High-temperature RTV (Room Temperature Vulcanizing) Silicone sealant (301).

[0043] FIG. 4 illustrates a flowchart of the assembly process for the temperature- resistant frame structure, detailing steps from the cleaning and preparation of the housing device surface to the application, positioning, and curing of the frame structure.

[0044] The drawings described herein above are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. DETAILED DESCRIPTION OF THE INVENTION

[0045] The present invention overcomes the limitations of the conventional frame structures used in housing devices (100) by providing a temperature-resistant frame structure (200) of desired shape and size that maintains structural integrity and sealing effectiveness under extreme environmental conditions. Unlike existing solutions that are prone to degradation when exposed to highand low temperature fluctuations, the present invention employs a unique combination of advanced materials, Antistatic Fiberglass Reinforced Polyester (FRP) and High-Temperature RTV Silicone Sealant, which together offer superior thermal stability, chemical resistance, and mechanical strength. Through optimized moulding parameters and a precision assembly process, the invention ensures reliable adherence of the temperature-resistant frame structure onto the surface of the housing device, significantly reducing maintenance requirements and extending the service life of the housing device in industrial applications. The invention thus represents an effective solution to meet the demands of harsh environments, particularly in industries where housing device performance and safety are paramount. For purposes of this invention, terms, features and aspects are disclosed throughout and include those summarized herein.

[0046] In the following disclosure, it is to be understood that description will describe the invention in relation to the preferred embodiments of the invention. All embodiments provided are illustrative and the invention is in no way limited to these preferred embodiments as they are purely to exemplify the invention only and non-limiting representatives of many possible embodiments would be readily apparent without departing from the scope of the invention.

[0047] In general, the term “housing devices” refer to enclosures or structures designed to contain, protect, and support internal components or systems. In the context of the present disclosure, the term “housing devices” and “housing device” shall refer to the electrical enclosures, particularly metallic enclosures, such as stainless steel, carbon steel, aluminum, and sheet metal enclosures, more particularly stainless-steel enclosure.

[0048] As used herein, the term “advanced materials” refer to substances that have been engineered to exhibit superior performance characteristics compared to conventional materials and are classified into several categories, including but not limited to composites, nanomaterials, smart materials, biomaterials,high-performance alloys, ceramics and polymeric materials. These materials are often designed to meet specific requirements or to enhance properties such as strength, durability, weight, resistance to temperature, corrosion, and electrical conductivity. In the context of the present disclosure, the term “advanced materials” and “advanced material” refer to the composites category for selection of Antistatic Fiberglass Reinforced Polyester (FRP) as a raw material and polymeric materials for selection of High-Temperature RTV (Room Temperature Vulcanizing) Silicone as a sealant.

[0049] As used herein, the terms “frame”, “frame structure”, “seal” and “product” shall refer to the temperature-resistant frame structure, which can be manufactured in various shapes and sizes to accommodate a wide range of housing devices and its types. These terms encompass frame structures designed to fit various dimensions and configurations, thereby making them versatile and adaptable for use in numerous enclosure applications across diverse industrial environments.

[0050] Unless defined otherwise, all technical and scientific terms used herein have the same meanings as commonly understood by a person of ordinary skill in the relevant art of the present disclosure. Further, all components listed by generic name, if any, are herein meant to include or encompass all equivalents for such components available.

[0051] As used in the specification, and in the appended claims, the singular forms “a”, “an”, “the”, include plural referents unless the context clearly dictates otherwise. Further, the terms such as “may,” “may provide for,” and “it is contemplated that the present invention may” and so forth are terms used in interchange with the terms “is,” “can,” “will,” and like terms used as synonyms.

[0052] It is to be understood that the reference, such as “in one embodiment” or “an embodiment” in the disclosure is intended to indicate that at least an embodiment of the invention is included with a particular feature, structure, or characteristic described in connection with the embodiment. In variousplaces in the disclosure, it is not necessary that the presence of the phrase “in one embodiment” or “an embodiment” is all referring to the same embodiment. Further, it is to be understood that the term “comprise” and variations thereof, such as “comprising”, “comprises” and “comprised” as used in this disclosure, except where the context requires otherwise, are not intended to exclude other additives, components, integers or steps.

[0053] According to an embodiment of the present invention, a temperature-resistant frame structure for housing devices is provided, where such housing devices are exposed to extreme environments, including fluctuating temperatures, in industrial and hazardous locations.

[0054] Further in an embodiment of the present invention, a temperature-resistant frame structure of desired shape and size is specifically designed for metallic housing devices, including but not limited to stainless steel, carbon steel, aluminium, and sheet metal, and more specifically for stainless steel enclosures.

[0055] Further in an embodiment of the present invention, the temperature resistant frame structure is constructed using advanced materials, including, but not limited to, Antistatic Fiberglass Reinforced Polyester (FRP) with a thermal resistance ranging from approximately -60°C to 200°C, and High- Temperature RTV (Room Temperature Vulcanized) Silicone Sealant with a thermal resistance ranging from approximately -60°C to 220°C, and such advanced materials provide high thermal stability and mechanical strength, allowing the frame to withstand high and low temperatures, thereby reducing material degradation and enhancing durability and longevity of the housing device.

[0056] In an embodiment of the present invention, the temperature-resistant frame structure (200) for housing devices (100), comprises a top unit (201) and a bottom unit (202), wherein the bottom unit includes a flat base (203) configured for secure attachment to the body (101) of the housing device, thereby providing a stable and consistent contact surface, ensuring reliableadhesion to the enclosure’s lip area (103), and the top unit is equipped with a groove (204) specifically designed to partially conceal and shield the gasket (104) positioned on the door (102) of the housing device, thereby effectively reducing direct exposure to extreme temperatures and environmental contaminants, such top unit and bottom unit coupled with each other to constitute the temperature-resistant frame structure.

[0057] In an embodiment of the present invention, the top unit (201) and bottom unit (202) are integrally moulded to form a monolithic frame structure, thereby providing a continuous and seamless construction. This monolithic configuration eliminates the requirement for any mechanical or adhesive joining between the top and bottom units, ensuring uniform distribution of stress and enhanced dimensional stability. The integral moulding further improves the overall strength, thermal performance, and sealing capability of the frame structure under fluctuating temperature conditions.

[0058] Further in an embodiment of the present invention, the groove (204) in the top unit (201) is designed with a width ranging from approximately 8 mm to 11 mm and a depth of about 2 mm configured to conceal 30% to 40% of the gasket surface, thereby shielding the gasket (104) from direct exposure to extreme temperatures and extending its functional lifespan by mitigating the impact of thermal fluctuations on the gasket material. In some embodiments, the groove width may vary depending on the gasket dimensions and the sealing requirements of the housing device.

[0059] Further in an embodiment of the present invention, the bottom unit (202) having a flat base (203) has a width in the range of approximately 12 mm to 20 mm, more preferably between 19 mm and 20 mm, providing a stable foundation for secure attachment to the enclosure.

[0060] Further in an embodiment of the present invention, the top unit (201) and the bottom unit (202) of the frame structure (200) are configured to form an impermeable seal, thereby restricting the passage of air and / or water and preventing potential damage from environmental factors.

[0061] Further in an embodiment of the present invention, the overall length and breadth of the temperature-resistant frame structure (200) are tailored to match the specific dimensions of the enclosure's lip area (103), ensuring a precise fit for the selected housing device, and the frame thickness may range from approximately 5 mm to 6 mm depending on the dimensions of the housing device and intended application, forming a consistent and robust seal along the enclosure’s lip.

[0062] Further in an embodiment of the present invention, the housing devices (100) may be selected in various configurations, with a height ranging from approximately 75 mm to 2200 mm; a width ranging from approximately 75 mm to 2000 mm; and a depth ranging from approximately 50 mm to 1600 mm.

[0063] In an embodiment of the present invention, a method for manufacturing a temperature-resistant frame structure (200) is provided and said method comprising the steps of:(a) preparing the pre-impregnated fiber and resin mixture of the advanced material, Antistatic Fiberglass Reinforced Polyester (FRP) with a Relative thermal index (RTI) including factor of safety to ensure reliability in extreme environments;(b) compressing the pre -impregnated fiber and resin mixture using a compression moulding machine, calibrated with specific moulding parameters to achieve a thermally stable, impact-resistant frame of desired shape and size; and(c) allowing the moulded frame to cool at room temperature, factoring the shrinkage and warpage inherent to the material used for pre-impregnated fiber and resin mixture, to obtain the temperature-resistant frame of desired shape and size.

[0064] The pre-impregnated fiber and resin mixture of the Antistatic Fiberglass Reinforced Polyester (FRP) with a Relative thermal index (RTI) is prepared by selecting suitable fiberglass reinforcement, such as E-glass or S-glass, in conjunction with a high-performance polyester resin exhibiting superior thermal and chemical resistance. Antistatic additives, such as conductive carbon black or antistatic surfactants, are gradually incorporated into the resin mixture to mitigate static charge accumulation. The resin mixture is thoroughly blended with a hardener according to manufacturer specifications to achieve uniformity, after which the fiberglass fabric is cut to specified dimensions and impregnated using either a hand lay-up or vacuum infusion method to ensure complete saturation and minimize air entrapment. This preimpregnated fiberglass is subsequently cured at room temperature or under controlled heating conditions, with optional post-curing to enhance thermal stability. Quality control measures include mechanical testing to confirm that the FRP meets required performance standards, while the RTI is evaluated to assess thermal endurance. Additionally, a factor of safety, typically between 1.5 and 3.0, is incorporated, selected based on industry standards to ensure the structural integrity of the final product in its intended applications.

[0065] Further embodiments of the invention include selected materials for preparing the pre-impregnated fiber and resin mixture, specifically chosen for their compatibility with the compression moulding process and their performance under extreme environmental conditions.

[0066] Further in an embodiment of the present invention, the materials selected for the preparation of a pre -impregnated fiber and resin mixture for Antistatic Fiberglass Reinforced Polyester (FRP) are including, but not limited to, E- CR (Electrical Chemical Resistant) glass as glass fibres; isophthalic resin as a high-performance polyester resin; conductive carbon black as antistatic additive; peroxides as curing agent; polyester based inorganic pigments; and calcium carbonate as fillers.

[0067] Furthermore, in an embodiment of the present invention, the Antistatic Fiberglass Reinforced Polyester (FRP) used to manufacture the temperature- resistant frame structure (200) is designed with a Relative thermal index (RTI) ranging approximately from 150°C to 200°C to ensure high thermal stability and durability in extreme temperatures and hostile environments.

[0068] Further in an embodiment of the present invention, the pre-impregnated fiber and resin mixture of the Antistatic Fiberglass Reinforced Polyester (FRP) with a Relative thermal index (RTI) is subjected to the moulding process using compression moulding machine calibrated to the pre-defined moulding parameters to obtain the frame structure of the desired specifications.

[0069] Furthermore, in an embodiment of the present invention, the moulding parameters designed to obtain the product are a mould temperature range of 150°C to 180°C, a pressure range of 100 Kg / cm2to 150 Kg / cm2, a charge weight calculated as Volume of Parts (CC) x 1.7 to 1.8 gm / CC, and a curing time range of 170 seconds to 180 seconds.

[0070] Further in an embodiment of the present invention, the compression moulding process comprises the steps of:(a) placing the prepared FRP mixture into a pre-heated compression mould, configured to the specific dimensions required for the temperature- resistant frame structure (200), including the formation of a groove (204) on the top unit (201) of the frame;(b) applying controlled pressure within the specified range of 100 Kg / cm2to 150 Kg / cm2to the mould to compress the FRP mixture, ensuring even distribution and compaction of the material within the mould cavity, including the groove formation;(c) maintaining the mould temperature within a range of 150°C to 180°C to facilitate curing, while holding the material under pressure for thedefined curing time of 170 to 180 seconds to achieve optimal structural integrity, surface finish and precise groove dimensions;(d) releasing the pressure and removing the cured frame structure from the mould upon completion of the curing process, with the groove accurately formed as per the design specifications; and(e) allowing the moulded frame to cool at room temperature to stabilize its physical properties before further handling or assembly.

[0071] Further in an embodiment of the present invention, the groove (204) and flat base (203) are formed integrally within a single moulding operation. During the compression moulding process, the mould cavity is configured to define both the groove and the flat base in one step, thereby ensuring accurate geometric alignment and eliminating post-mould assembly operations. This integrated formation provides improved precision, consistency in dimensions, and contributes to the frame’s ability to maintain a reliable seal and resist deformation under high thermal stress.

[0072] In an embodiment of the present invention, there is provided an assembly process for affixing the temperature-resistant frame (200) onto the body of a housing device (101).

[0073] The temperature-resistant frame is adhered to the body of the housing device (101) through an adhesive application process using a sealant (301), specifically High-Temperature RTV (Room Temperature Vulcanized) Silicone Sealant, which is engineered to endure elevated temperatures.

[0074] The adhesive application process for affixing the frame to the housing device body comprises the steps of:(a) cleaning the surface of the housing device body (101) using a technical- grade solvent to prepare it for bonding;(b) applying the sealant (301) on the flat lip area of the housing device body with an applicator, ensuring a consistent adhesive layer;(c) positioning the temperature-resistant frame (200), configured to the shape and size of the housing device body, onto the sealant-coated area, with the frame’s groove aligned to shield 30% to 40% of the gasket, thereby providing additional protection to the gasket (104) in extreme temperature conditions; and(d) curing the assembly at room temperature for a duration of 170 to 180 seconds to achieve a durable and secure bond between the frame and the housing device body.

[0075] In a further embodiment, additional steps are provided to enhance the alignment and bonding strength of the frame (200), including the use of a positioning fixture and controlled environmental conditions to optimize the adhesive bond.

[0076] In a further embodiment of the present invention, the adhesive application process may comprise additional steps to ensure precise alignment and enhanced bonding strength of the temperature-resistant frame (200) on the housing device body (101), the method comprising:(a) applying a positioning fixture to the temperature-resistant frame to maintain precise alignment and ensure consistent pressure across the bonding surface, including the groove area, during the curing process; (b) subjecting the assembly to a controlled environment with a specified humidity and temperature parameters to optimize curing conditions, thereby enhancing the adhesive bond strength and durability under extreme temperature variations; and(c) performing a post-curing inspection to verify the uniformity of the bond and check for any potential gaps, seal misalignments or groovemisconfigurations, thereby ensuring that the frame structure meets quality and performance standards before deployment.

[0077] Further in an embodiment of the present invention, the technical grade solvent used for cleaning the surface of the housing device body (101) is Isopropyl Alcohol of 99.8% purity.

[0078] Furthermore, in an embodiment of the present invention, a seal is formed between the door (102) and the housing device body (101), protecting the internal components from exposure to harsh environmental conditions and against dust, moisture, and other contaminants.

[0079] The following examples are provided to illustrate certain embodiments of the present invention and therefore should not be construed to limit the scope of the present invention.Best Mode of the Invention

[0080] In the best working embodiment of the present invention, the temperature- resistant frame structure (200) is manufactured using E-CR glass-based Antistatic Fiberglass Reinforced Polyester (FRP) having a Relative Thermal Index (RTI) of approximately 200°C, which has been experimentally validated as suitable for continuous industrial operation under elevated and fluctuating temperature conditions. The said frame structure (200) is formed as a single, monolithic unit, wherein the groove (204) and the flat base (203) are simultaneously formed within the compression mould cavity during the moulding operation. This integrated moulding approach ensures dimensional uniformity, eliminates assembly tolerances, and minimizes potential weak points that may arise from multi-part construction. Consequently, the frame exhibits enhanced structural integrity, excellent surface finish, and superior thermal and mechanical stability during exposure to both high and low temperature cycles. Furthermore, in the said embodiment, a High- Temperature RTV (Room Temperature Vulcanized) Silicone Sealant is employed for bonding the frame structure (200) to the housing device (100).The sealant possesses a tensile strength of 28 kg / sq. cm, a shear strength of 1.8 kg / sq. cm, dielectric strength of 20 kv / mm, and an elongation capacity of approximately 450 percent, thereby providing the necessary flexibility and resilience under thermal stress, ensuring long-term adhesion performance and reliable sealing efficiency in industrial and hazardous environments.

[0081] In certain embodiments of the present invention, the sealant is capable of withstanding a maximum intermittent operating temperature of up to 260°C and a maximum continuous operating temperature of approximately 204°C, which are consistent with the sealant’s previously disclosed thermal resistance range of -60°C to 220°C and represent further characterization of the operational limits without departing from the scope of the originally disclosed invention. These parameters quantify the sealant’s performance under intermittent and continuous thermal exposure while maintaining optimal sealing, dimensional stability, and adhesion of the frame structure (200) to the housing device (100).

[0082] In support of the best working embodiment, the Relative Thermal Index (RTI) of the E-CR glass-based Antistatic Fiberglass Reinforced Polyester (FRP) employed in the temperature-resistant frame structure (200) was determined through experimental validation conducted in accordance with the internationally recognized test standards, including UL 746C. The tests were performed to evaluate the long-term thermal aging characteristics of the FRP material under controlled temperature conditions. During the assessment, standardized test samples were subjected to thermal endurance as per IEC 60079-0 standard, wherein this method involves 4 different cycles of hot and cold. Test starts with cycle 1, wherein samples were tested at 90% relative humidity, with temperature of 95°C for 336 hours. During cycle 2 dry heat was induced at 160°C temperature for 336 hours. During 3rdcycle samples were kept under the room temperature for about 24 hours. Finally, during cycle 4 samples were kept in cold chamber at -60°C for 24 hours. The extrapolated data established that the material maintained its structural and insulating integrity up to a continuous operating temperature of 160°C,thereby confirming its suitability for use in industrial and hazardous environments requiring sustained thermal stability.

[0083] The results from the validation indicated that the Antistatic Fiberglass Reinforced Polyester (FRP) retained dimensional stability, surface hardness, and electrical resistivity within acceptable limits throughout the test duration. These findings substantiate the material’s classification with a Relative Thermal Index (RTI) of approximately 200°C, ensuring that the frame structure (200) maintains its mechanical strength, antistatic performance, and sealing effectiveness during prolonged thermal exposure under real-world operating conditions.

[0084] The temperature-resistant frame structure (200) has an overall thickness ranging from approximately 5 mm to 6 mm depending on the enclosure dimensions and intended application, a base width ranging from 12 mm to 20 mm, more preferably between 19 mm and 20 mm, and a groove (204) having a width ranging from approximately 8 mm to 11 mm and depth of about 2 mm. The frame structure (200) is designed to fit the lip area (103) of the housing device (100), having dimensions ranging from 75 mm * 75 mm * 50 mm to 2200 mm * 2000 mm * 1600 mm.

[0085] Performance tests demonstrated that under cyclic temperature variations between the range of -60°C and 180°C, preferably between -60°C and 160°C, the frame structure maintained bond integrity without delamination or loss of adhesion. The concealed seal between the gasket (104) and the frame structure (200) retained over 720 hours of its sealing performance after 4 operational cycles, confirming the superior resistance of the temperature- resistant frame structure to thermal degradation compared to conventional metallic or polymeric sealing frames.

[0086] A comparative evaluation was conducted to assess the performance of the temperature-resistant frame structure (200) formed from the E-CR glassbased Antistatic Fiberglass Reinforced Polyester (FRP) material against conventional sealing system without the temperature resistant frame. Eachcomparative sample was subjected to identical test conditions, including continuous thermal exposure cycles ranging from -60°C to 160°C, mechanical load testing, and environmental resistance trials involving humidity, dust ingress, and chemical exposure.

[0087] In further support of the best mode of the present invention, multiple iterative tests were performed to evaluate the structural integrity, thermal endurance, and sealing effectiveness of the temperature-resistant frame structure (200) and its compatibility with various gasket types. The tests were conducted at various approved Testing and Certification Laboratories, including CSA Group, United Kingdom, Electronics Test and Development Centre (ETDC), Bengaluru, India, and Karandikar Laboratories Pvt. Ltd. (KLPL), Mumbai, India, under controlled laboratory conditions simulating industrial thermal exposure.

[0088] Earlier prototype models employing conventional gasket configurations, including extruded flat gaskets and D-shaped gaskets affixed to stainless steel enclosures, failed under repeated temperature cycling. Failures included gasket flattening, cracking, and adhesion loss, resulting in air and moisture ingress. Test results indicated that the gasket material deteriorated rapidly when subjected to high-temperature exposure above 95 °C, leading to loss of seal integrity and increased risk to sensitive internal components.

[0089] The improved configuration developed in the present invention incorporated the temperature-resistant frame structure (200) formed from Antistatic Fiberglass Reinforced Polyester (FRP) and designed with an integrated groove (204). This configuration successfully addressed the above shortcomings. Testing confirmed that the groove concealed approximately 30-40% of the gasket surface, thereby reducing direct thermal stress. Further, the integrated groove (204) design enhanced gasket retention and sealing performance by reducing its direct exposure to heat and environmental stressors by approximately 80%, thereby maintaining optimal sealing pressure and preventing ingress of moisture, dust, and contaminants. Theassembly maintained dimensional stability and adhesion with no evidence of gasket deformation or cracking throughout the thermal cycling regime ranging between -60°C and 160°C.

[0090] The validated performance results established that the temperature-resistant frame structure (200) provides a significant enhancement in long-term sealing reliability, minimizing thermal degradation and mechanical failure of the gasket. Furthermore, the stability of the frame structure under cyclic thermal and mechanical stress ensures sustained protection of the internal components, thereby improving the overall operational reliability and safety of the system, protecting both the enclosed equipment and the personnel operating in its vicinity, and extending the functional life of the enclosure and associated devices. These experimental results substantiate the functional advantages claimed in the present invention demonstrating a significant advancement over prior art and demonstrate its industrial applicability.

[0091] In an embodiment of the invention, the temperature-resistant frame structure (200) finds application in electrical and electronic housings, industrial control panels, oil and gas installations, chemical processing plants, and outdoor enclosures, where thermal stability and environmental sealing are critical. The invention can be integrated with existing enclosure systems with minimal modification, providing a cost-effective enhancement to reliability and operational safety.

[0092] The foregoing description of preferred embodiments is illustrative and not limiting. It will be apparent to persons skilled in the art that various changes and modifications to this description may be made without departing from the spirit or scope of the present invention, as defined in the following claims.

Claims

We Claim:

1. A temperature-resistant frame structure (200) for housing devices (100) comprising:(a) a top unit (201) having a groove (204) configured to partially conceal and shield the gasket (104) positioned on the door (102) of the housing device, thereby reducing direct exposure of the gasket to extreme temperatures, dust, and contaminants; and (b) a bottom unit (202) having a flat base (203) configured for secure attachment to the body (101) of the housing device, thereby providing a stable and consistent contact surface and ensuring reliable adhesion to the lip area (103) of the enclosure.

2. The temperature-resistant frame structure as claimed in Claim 1, wherein the top unit (201) and bottom unit (202) are integrally moulded to form a monolithic frame structure.

3. The temperature-resistant frame structure as claimed in Claim 1, wherein the groove (204) in the top unit (201) has a width ranging from 8 mm to 11 mm and a depth of about 2 mm, configured to conceal 30% to 40% of the gasket surface area.

4. The temperature-resistant frame structure as claimed in Claim 1, wherein the integrated groove (204) enhances gasket retention and sealing performance, reducing direct exposure of the gasket ( 104) to heat and environmental stressors by approximately 80%.

5. The temperature-resistant frame structure as claimed in Claim 1, wherein the flat base (203) of the bottom unit (202) measures a width ranging from 12mm to 20 mm, preferably 19 mm to 20 mm, and provides a stable foundation for bonding with the housing device (100).

6. The temperature-resistant frame structure as claimed in Claim 1, wherein the overall thickness of the frame structure is ranging from 5 mm to 6 mm, and the overall length and width are customized to correspond with the dimensions of the lip area ( 103) of the selected housing device.

7. The temperature-resistant frame structure as claimed in Claim 1, wherein the frame structure is assembled onto the lip area (103) of the housing device using High- Temperature RTV (Room Temperature Vulcanized) Silicone Sealant.

8. The temperature-resistant frame structure as claimed in Claim 1, wherein the High- Temperature RTV (Room Temperature Vulcanized) Silicone Sealant has a thermal resistance ranging from -60°C to 220°C.

9. The temperature-resistant frame structure as claimed in Claim 1, wherein the housing devices (100) is metallic, preferably made of stainless steel, carbon steel, aluminium, or sheet metal, with dimensions ranging from approximately 75 mm * 75 mm * 50 mm to 2200 mm * 2000 mm * 1600 mm.

10. A method for manufacturing a temperature-resistant frame structure (200) as claimed in claim 1, the method comprising the steps of:(a) preparing the pre-impregnated fiber and resin mixture having a Relative thermal index (RTI) in the range of 150°C to 200°C;(b) placing the mixture into a pre-heated mould cavity configured to the desired frame dimensions and groove profile;(c) applying pressure in the range of 100 Kg / cm2to 150 Kg / cm2at a mould temperature between 150°C and 180°C, and maintaining the material under pressure for a curing time ranging from 170 seconds to 180 seconds to form the frame structure; (d) releasing the pressure and demoulding the cured frame structure; and(e) allowing the moulded frame to cool at room temperature to stabilize its physical properties.

11. The method as claimed in Claim 10, wherein the pre-impregnated fiber and resin mixture comprises as Antistatic Fiberglass Reinforced Polyester (FRP) material having a Relative thermal index (RTI) of 200°C.

12. The method as claimed in Claim 10, wherein the Antistatic Fiberglass Reinforced Polyester (FRP) material comprises of E-CR glass fibre; isophthalic polyester resin; conductive carbon black as antistatic additive; peroxides as a curing agent; polyester- based inorganic pigments; and calcium carbonate as fillers.

13. The method as claimed in Claim 10, wherein the Antistatic Fiberglass Reinforced Polyester (FRP) material used to construct the frame structure has thermal resistance ranging from -60°C to 200°C.

14. The method as claimed in Claim 10, wherein the Antistatic Fiberglass Reinforced Polyester (FRP) material used to construct the frame structure maintains its structural and insulating integrity up to a continuous operating temperature of 160°C.

15. The method as claimed in Claim 10, further comprising bonding the frame structure (200) onto the housing device (100) using a High-Temperature RTV Silicone Sealant, the method comprising the steps of:(a) cleaning the lip area (103) of the housing device with technical -grade isopropyl alcohol;(b) applying the sealant uniformly on the lip area through an applicator;(c) positioning the frame structure (200) in alignment with the lip area (103) such that the groove (204) corresponds to the gasket (104); and(d) curing the adhesive bond for 170 to 180 seconds at room temperature.

16. The method as claimed in Claim 15, wherein a positioning fixture is applied during curing to ensure alignment and uniform pressure across the bonding surface, thereby improving adhesive bonding strength and sealing uniformity.

17. The method as claimed in any of the preceding claims, wherein the moulded and assembled frame structure (200) forms an impermeable seal between the door (102) and the housing device (100), thereby protecting the internal components from dust, moisture, and extreme temperature fluctuations.

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