Device and method for measuring thermal characteristic of sample

Abstract

This measurement device for measuring a thermal characteristic of a sample can: irradiate a sample with a first probe optical signal of a probe light source; acquire, using a spectrometer, spectra of optical signals reflected from a region of interest in each of a first state before a first bias signal is applied to the sample and a second state in which the first bias signal is applied to the sample; acquire a thermal reflectance spectrum of the sample on the basis of the spectra acquired in each of the first and second states; and determine an optimal wavelength of the probe light source on the basis of the thermal reflectance spectrum.

Description

Measuring device and method for measuring the exothermic characteristics of a sample

[0001] The following embodiments relate to a measuring device and method for measuring the exothermic properties of a sample.

[0002] Due to the miniaturization and three-dimensional high integration of semiconductor devices and the transparency and flexibility of display devices, heat generated during the operation of microelectronic devices, such as semiconductor and display devices, can degrade the performance and reliability of the devices. For this reason, it may be important to measure and analyze the heat generation characteristics of microelectronic devices.

[0003] For microelectronic devices, thermal imaging technology capable of measuring and analyzing spatiotemporal thermal characteristics with sub-micron level spatial and temporal resolution is required to analyze the causes of physical deformation (or destruction) of devices due to thermal stress and to resolve the problem.

[0004] The aforementioned background technology is one that the inventor possessed or acquired in the process of deriving the contents of the disclosure of the present application, and it cannot be considered as prior art disclosed to the general public prior to the filing of this application.

[0005] According to one embodiment, a measuring device for measuring the exothermic characteristics of a sample may include a camera, a spectrometer, a movable dichroic beam splitter, a probe light source, and a variable pinhole used to determine a region of interest of the sample.

[0006] The operating mode of the above measuring device may include a first mode for measuring the wavelength-dependent heating characteristics of the sample, a second mode for measuring the spatial heating characteristics of the sample, and a third mode for measuring the temporal heating characteristics of the sample.

[0007] In the first mode, the dichroic light splitter is positioned in the optical path of the camera, and the measuring device irradiates the sample with a first probe light signal of the probe light source, and acquires a spectrum of the light signal reflected from the region of interest through the spectrometer in each of the first state before the first bias signal is applied to the sample and the second state when the first bias signal is applied to the sample, acquires a thermal reflection spectrum of the sample based on the spectra acquired in each of the first and second states, determines the optimal wavelength of the probe light source based on the thermal reflection spectrum, and can operate in the second mode and the third mode when the optimal wavelength is determined.

[0008] In each of the first and second states above, the optical signal in the first wavelength region among the optical signals reflected from the region of interest can be transmitted to the spectrometer by the dichroic splitter located in the optical path of the camera, and the optical signal in the second wavelength region among the optical signals reflected from the region of interest can be transmitted to the camera by passing through the dichroic splitter. Specifically, among the optical signals reflected from the region of interest, the optical signal corresponding to the first wavelength region (e.g., reflection wavelength region) of the dichroic splitter located in the optical path of the camera can be transmitted to the spectrometer, and among the optical signals reflected from the region of interest, the optical signal corresponding to the second wavelength region (e.g., transmission wavelength region) of the dichroic splitter can be transmitted to the camera.

[0009] In the second mode, the dichroic optical splitter is removed from the optical path of the camera, and the measuring device irradiates the sample with a second probe optical signal having the optimal wavelength and applies a second bias signal to the sample, and while the second probe optical signal is irradiated to the sample, a first thermal reflection image of the sample can be obtained using the optical signal reflected from the sample and the camera.

[0010] The measuring device may further include a filter turret having a plurality of optical filters. In the second mode, the measuring device controls the filter turret so that a first optical filter having a wavelength closest to the optimal wavelength among the plurality of optical filters is positioned in the optical path of the probe light source, and can generate the second probe optical signal by filtering the first probe optical signal through the first optical filter.

[0011] In the third mode, the dichroic optical splitter is removed from the optical path of the camera, and the measuring device irradiates the sample with a third probe optical signal in the form of a pulse signal having the optimal wavelength and applies a third bias signal to the sample, and while the third probe optical signal is irradiated to the sample, a second thermal reflection image of the sample can be obtained using the optical signal reflected from the sample and the camera.

[0012] In the third mode above, the measuring device outputs the first probe optical signal in the form of a pulse signal through the probe light source, and can generate the third probe optical signal by filtering the first probe optical signal in the form of a pulse signal through a first optical filter having a wavelength closest to the optimal wavelength among a plurality of optical filters of the filter turret of the measuring device.

[0013] In the first mode above, when the dichroic optical splitter is out of the optical path of the camera, the measuring device acquires a reflected image of the sample using the optical signal reflected from the sample and the camera while the first probe optical signal is irradiated onto the sample, while acquiring the reflected image as at least one of the position and size of the variable pinhole is adjusted, and can determine the region of interest based on the acquired reflected image.

[0014] The measuring device may further include a first lens and a second lens located in the optical path of the probe light source. The variable pinhole may be located between the first lens and the second lens.

[0015] In the first mode, the measuring device can monitor the region of interest by acquiring a spectrum for the region of interest from an optical signal in the first wavelength range through the spectrometer and acquiring an image of the region of interest from an optical signal in the second wavelength range through the camera.

[0016] According to one embodiment, a method of operating a measuring device for measuring the heat generation characteristics of a sample may include: a step of irradiating a first probe light signal of a probe light source onto the sample in a first mode for measuring the heat generation characteristics of the sample by wavelength; a step of obtaining a spectrum of a light signal reflected from a region of interest through a spectrometer in each of a first state before a first bias signal is applied to the sample and a second state in which the first bias signal is applied to the sample; a step of obtaining a thermal reflection spectrum of the sample based on the spectrum obtained in each of the first and second states; a step of determining an optimal wavelength of the probe light source based on the thermal reflection spectrum; and a step of operating in a second mode for measuring the spatial heat generation characteristics of the sample or a third mode for measuring the temporal heat generation characteristics of the sample when the optimal wavelength is determined.

[0017] In each of the first and second states above, the light signal in the first wavelength region among the light signals reflected from the region of interest can be transmitted to the spectrometer by the dichroic optical splitter located in the optical path of the camera, and the light signal in the second wavelength region among the light signals reflected from the region of interest can be transmitted to the camera by passing through the dichroic optical splitter.

[0018] The method of operation of the above-described measuring device may further include, in the second mode, the step of irradiating the sample with a second probe optical signal having the optimal wavelength and applying a second bias signal to the sample, and the step of acquiring a first thermal reflection image of the sample using the camera and the optical signal reflected from the sample while the second probe optical signal is irradiated to the sample.

[0019] In the second mode above, the dichroic light splitter may be out of the optical path of the camera.

[0020] The method of operation of the above-described measuring device may further include the steps of irradiating a third probe optical signal, which is in the form of a pulse signal having the optimal wavelength in the third mode, onto the sample and applying a third bias signal to the sample, and acquiring a second thermal reflection image of the sample using the optical signal reflected from the sample and the camera while the third probe optical signal is irradiated onto the sample.

[0021] In the above third mode, the dichroic light splitter may be out of the optical path of the camera.

[0022] FIG. 1 is a drawing illustrating a multi-domain thermal imaging measurement device according to one embodiment.

[0023] FIGS. 2, FIGS. 3, FIGS. 4, and FIGS. 5 are drawings illustrating a first mode (or wavelength domain mode) of a multi-domain thermal imaging measurement device according to one embodiment.

[0024] FIGS. 6 and FIGS. 7 are drawings illustrating a second mode (or spatial domain mode) of a multi-domain thermal imaging measurement device according to one embodiment.

[0025] FIGS. 8 and 9 are drawings illustrating a third mode (or time domain mode) of a multi-domain thermal imaging measurement device according to one embodiment.

[0026] FIG. 10 is a flowchart illustrating an example of the operation method of a multi-domain thermal imaging measurement device according to one embodiment.

[0027] Specific structural or functional descriptions of the embodiments are disclosed for illustrative purposes only and may be modified and implemented in various forms. Accordingly, actual implementations are not limited to the specific embodiments disclosed, and the scope of this specification includes modifications, equivalents, or substitutions included in the technical concept described by the embodiments.

[0028] Terms such as "first" or "second" may be used to describe various components, but these terms should be interpreted solely for the purpose of distinguishing one component from another. For example, the first component may be named the second component, and similarly, the second component may be named the first component.

[0029] When it is stated that a component is "connected" to another component, it should be understood that it may be directly connected to or joined to that other component, or that there may be other components in between.

[0030] The singular expression includes the plural expression unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to specify the existence of the described features, numbers, steps, actions, components, parts, or combinations thereof, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0031] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this specification.

[0032] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are given the same reference numeral regardless of the drawing number, and redundant descriptions thereof will be omitted.

[0033] FIG. 1 is a drawing illustrating a multi-domain thermal imaging measurement device according to one embodiment.

[0034] According to one embodiment, a multi-domain thermal image measuring device (100) can measure the heat characteristics or heat distribution of a region of interest (ROI) of a sample (105) in multiple domains (e.g., wavelength domain, spatial domain, and temporal domain). The sample (105) may include, for example, a microelectronic device (e.g., a semiconductor device, a display device, etc.), but is not limited thereto.

[0035] According to one embodiment, the operating mode (or multi-domain mode) of the multi-domain thermal imaging measurement device (100) may include a first mode (or wavelength domain mode), a second mode (or spatial domain mode), and a third mode (or time domain mode).

[0036] A first mode (or wavelength domain mode) may represent a mode in which the multi-domain thermal imaging measurement device (100) measures the wavelength-dependent heating characteristics of a sample (105) (or the heating characteristics of the sample in the wavelength domain). A second mode (or spatial domain mode) may represent a mode in which the multi-domain thermal imaging measurement device (100) measures the spatial heating characteristics of a sample (105) (or the heating characteristics of the sample (105) in the spatial domain). A third mode (or time domain mode) may represent a mode in which the multi-domain thermal imaging measurement device (100) measures the heating characteristics of the sample (105) over time (or the heating characteristics of the sample (105) in the time domain).

[0037] Referring to FIG. 1, a multi-domain thermal imaging measuring device (100) according to one embodiment may include a system control unit (111), a control board (113), a bias device (115), a spectrometer (117), a probe light source (119), a first lens (121), a filter turret (123), a variable pin hole (125), a second lens (127), a first dichroic optical splitter (129), an optical splitter (131), an objective lens (133), a third lens (135), a second dichroic optical splitter (137), and a camera (139).

[0038] The system control unit (111) can control the multi-domain thermal imaging measurement device (100) overall.

[0039] The control board (113) may include a Printed Circuit Board (PCB). The control board (113) may be electrically connected to a spectrometer (117), a camera (139), a bias device (115), and a filter turret (123). The control board (113) may transmit a trigger signal to each of the spectrometer (117) and the camera (139). The control board (113) may control the filter turret (123). The control board (113) may control the bias device (115) so that the bias device (115) can output a bias signal.

[0040] The system control unit (111) can transmit a trigger signal for driving the spectrometer (117) and the camera (139) respectively to the spectrometer (117) and the camera (139) respectively through the control board (113). The system control unit (111) can control the filter turret (123) through the control board (113). The filter turret (123) may include a plurality of slots, one of the plurality of slots may be empty, and each of the remaining slots may have an optical filter located therein. Each of the optical filters may pass an optical signal of a specified wavelength and may not pass an optical signal of a wavelength other than the specified wavelength. The system control unit (111) can control the bias device (115) through the control board (113). The bias device (115) may apply or provide a bias signal to the sample (105) based on the control of the system control unit (111). The sample (105) can generate heat by a bias signal. The bias signal may correspond, for example, to a signal that is always constant in magnitude or modulated based on a specific frequency. The bias signal may correspond, for example, to a pulse signal that repeats high and low (or a pulse signal having a duty cycle).

[0041] In each operating mode of the multi-domain thermal imaging measurement device (100), the bias signal applied to the sample (105) may differ. For example, in the first mode, the multi-domain thermal imaging measurement device (100) may apply a first bias signal (e.g., a DC (direct current) voltage bias signal) to the sample (105). In the second mode, the multi-domain thermal imaging measurement device (100) may apply a second bias signal (e.g., an AC (alternating current) voltage bias signal) to the sample (105). In the third mode, the multi-domain thermal imaging measurement device (100) may apply a third bias signal (e.g., a square wave bias signal) to the sample (105).

[0042] The system control unit (111) can receive at least one spectrum from the spectrometer (117). The system control unit (111) can obtain a thermoflectance spectrum of the sample (105) based on at least one spectrum received from the spectrometer (117). The system control unit (111) can determine the optimal wavelength of the probe light source (119) based on the thermoflectance spectrum of the sample (105).

[0043] The system control unit (111) can receive at least one image signal from the camera (139). The system control unit (111) can process the image signal received from the camera (139) to obtain a thermal reflection image of the sample (105) (e.g., a first thermal reflection image and a second thermal reflection image to be described later).

[0044] The first dichroic light splitter (129) and the second dichroic light splitter (137) may have a reflection wavelength region and a transmission wavelength region, and may reflect a light signal corresponding to the reflection wavelength region and transmit a light signal corresponding to the transmission wavelength region. The reflection wavelength region of the first dichroic light splitter (129) may correspond to the light signal of the probe light source (119). The reflection wavelength region of the first dichroic light splitter (129) may include the light signal of the probe light source (119). The transmission wavelength region of the first dichroic light splitter (129) may correspond to the light signal of another probe light source. The transmission wavelength region of the first dichroic light splitter (129) may include the light signal of another probe light source. The first dichroic light splitter (129) is not movable, while the second dichroic light splitter (137) may be movable. When the second dichroic light splitter (137) is located in the optical path of the camera (139), the light signal corresponding to the reflection wavelength region of the second dichroic light splitter (137) among the light signals reflected from the sample (105) can be transmitted to the spectrometer (117), and the light signal corresponding to the transmission wavelength region of the second dichroic light splitter (137) among the light signals reflected from the sample (105) can be transmitted to the camera (139). When the second dichroic light splitter (137) is out of the optical path of the camera (139), the light signal reflected from the sample (105) can be transmitted to the camera (139).

[0045] A variable pinhole (125) can be used to determine a region of interest of a sample (105). When the multi-domain thermal imaging measurement device (100) determines the region of interest of the sample (105), the second dichroic beam splitter (137) may be removed from the light path of the camera (139). The region of interest of the sample (105) can be determined by adjusting at least one of the position and size (e.g., diameter) of the variable pinhole (125). The region of interest of the sample (105) may be related to the position and size of the variable pinhole (125). The variable pinhole (125) may be located between the first lens (121) (or filter turret (123)) and the second lens (127) on the light path of the probe light source (119). The variable pinhole (125) may be located on an intermediate image plane existing on the light path between the first lens (121) and the second lens (127). Accordingly, when the multi-domain thermal imaging measurement device (100) acquires an image of the sample (105) through the camera (139), it can also acquire an image of the variable pinhole (125).

[0046] For measuring and analyzing the thermal characteristics of each of the samples having various materials and structures (e.g., semiconductor devices and / or display devices), thermal reflection microscopy technology capable of acquiring thermal images with sub-micron-level high resolution and time resolution may be required. The samples may be diverse, and in order for thermal reflection microscopy technology to be utilized for various samples, it is necessary to accurately determine a specific part of each sample as a region of interest. In other words, since the location or size of the region of interest may differ for each sample, thermal reflection microscopy technology to be utilized for various samples requires accurately determining the region of interest for each of the various samples. According to one embodiment, a multi-domain thermal imaging measurement device (100) can accurately determine the region of interest for each of the various samples through a variable pinhole (125). Additionally, according to one embodiment, a single "multi-domain thermal imaging measurement device (100)" can measure the thermal characteristics of the sample (105) by wavelength, the thermal distribution characteristics of the sample in the spatial domain, and the thermal characteristics of the sample in the time domain.

[0047] The operation of the multi-domain thermal imaging measurement device (100) will be described in detail below.

[0048] FIGS. 2, FIGS. 3, FIGS. 4, and FIGS. 5 are drawings illustrating a first mode (or wavelength domain mode) of a multi-domain thermal imaging measurement device according to one embodiment.

[0049] Referring to FIG. 2, the multi-domain thermal imaging measurement device (100) can operate in a first mode (or wavelength domain mode).

[0050] A multi-domain thermal imaging measurement device (100) can determine a region of interest of a sample (105). When the multi-domain thermal imaging measurement device (100) determines a region of interest of the sample (105), it can acquire a spectrum of a light signal reflected from the region of interest of the sample (105). The multi-domain thermal imaging measurement device (100) can acquire a spectrum of a light signal reflected from the region of interest of the sample (105) in each of a first state before a first bias signal is applied to the sample (105) and a second state when the first bias signal is applied to the sample (105). The multi-domain thermal imaging measurement device (100) can acquire a thermal reflection spectrum of the sample (105) based on the spectrum acquired in each of the first and second states. The multi-domain thermal imaging measurement device (100) can determine the optimal wavelength of a probe light source based on the thermal reflection spectrum of the sample (105).

[0051] In the example illustrated in FIG. 2, the second dichroic splitter (137) may first be moved out of the optical path of the camera (139) so that the multi-domain thermal imaging measurement device (100) can determine the region of interest of the sample (105). Accordingly, the light signal reflected from the sample (105) may be transmitted to the camera (139) and not to the spectrometer (117). The movement of the second dichroic splitter (137) may be performed by the multi-domain thermal imaging measurement device (100) or by the user. The system control unit (111) may control the filter turret (123) via the control board (113). Under this control, an empty slot of the filter turret (123) (e.g., a slot without an optical filter) may be positioned in the optical path of the probe light source (119).

[0052] The probe light source (119) can output a first probe light signal. The first probe light signal may be, for example, a white light signal. The multi-domain thermal imaging device (100) can irradiate the first probe light signal onto a sample (105). The multi-domain thermal imaging device (100) can irradiate the first probe light signal onto the sample (105) through a first lens (121), an empty slot of a filter turret (123), a variable pinhole (125), a second lens (127), a first dichroic light splitter (129), a light splitter (131), and an objective lens (133).

[0053] When a first probe light signal is irradiated onto a sample (105), a light signal may be reflected from the sample (105), and the reflected light signal (e.g., the first probe light signal reflected from the sample (105)) may be transmitted to a camera (139) through an objective lens (133), a light splitter (131), and a third lens (135). The camera (139) may acquire an image corresponding to the light signal reflected from the sample (105) (hereinafter referred to as the reflected image of the sample (105)). The image (310) of FIG. 3 may correspond to the reflected image of the sample (105).

[0054] A multi-domain thermal imaging measurement device (100) can determine a region of interest of a sample (105) by adjusting at least one of the position and size of a variable pinhole (125) based on a reflected image of the sample (105). The position and size of the variable pinhole (125) can be adjusted by the multi-domain thermal imaging measurement device (100) or by a user. The adjustment of the position of the variable pinhole (125) can be performed in a plane where the variable pinhole (125) is perpendicular to the optical axis (e.g., the optical axis of the first probe optical signal). For example, if the optical axis of the first probe optical signal is the Z-axis, the position of the variable pinhole (125) can be adjusted in an XY plane perpendicular to the optical axis (Z-axis). Even when the position of the variable pinhole (125) is adjusted, the position of the variable pinhole (125) may not deviate from the optical path of the probe light source (119). The reflected image of the sample (105) may change whenever at least one of the position and size of the variable pin hole (125) is adjusted. The image (320) of FIG. 3 shows an example of a region of interest of the sample (105).

[0055] After the region of interest of the sample (105) is determined, the second dichroic optical splitter (137) can be positioned in the optical path of the camera (139). The movement of the second dichroic optical splitter (137) can be performed by the multi-domain thermal imaging measurement device (100) or by the user.

[0056] There may be a situation where the first probe light signal is still being irradiated onto the sample (105). When the second dichroic light splitter (137) is located in the light path of the camera (139), the light signal reflected from the region of interest of the sample (105) (e.g., the first probe light signal reflected from the region of interest of the sample (105)) (hereinafter referred to as the first reflected signal) can be transmitted to the second dichroic light splitter (137) via the objective lens (133), the light splitter (131), and the third lens (135).

[0057] Among the first reflected signals, the optical signal in the first wavelength region (e.g., the optical signal corresponding to the reflection wavelength region of the second dichroic optical splitter (137)) can be reflected by the second dichroic optical splitter (137) and transmitted to the spectrometer (117). Among the first reflected signals, the optical signal in the second wavelength region (e.g., the optical signal corresponding to the transmission wavelength region of the second dichroic optical splitter (137)) can pass through the second dichroic optical splitter (137) and be transmitted to the camera (139). The multi-domain thermal imaging measurement device (100) can acquire a spectrum (hereinafter referred to as the first spectrum) for the first reflected signal (e.g., the optical signal in the first wavelength region described above) through the spectrometer (117). Since the first bias signal may not be applied to the sample (105), the sample (105) may not generate heat. The first spectrum may be a spectrum for a first reflected signal (e.g., an optical signal in the first wavelength region of the first reflected signal) before a first bias signal is applied to the sample (105). The spectrum (410) of FIG. 4 may be an example of the first spectrum. In the spectrum (410), the wavelength on the x-axis may represent the wavelength of the probe light source (119) (or the first probe optical signal).

[0058] The system control unit (111) can control the bias device (115) through the control board (113). In accordance with this control, the bias device (115) can apply a first bias signal to the sample (105). The sample (105) can generate heat by the first bias signal.

[0059] The light signal reflected from the region of interest of the sample (105) to which the first bias signal is applied (e.g., the first probe light signal reflected from the region of interest of the sample (105)) (hereinafter referred to as the second reflected signal) can be transmitted to the second dichroic light splitter (137) via the objective lens (133), the light splitter (131), and the third lens (135).

[0060] Among the second reflected signals, the optical signal in the first wavelength region (e.g., the optical signal corresponding to the reflection wavelength region of the second dichroic optical splitter (137)) can be reflected by the second dichroic optical splitter (137) and transmitted to the spectrometer (117). Among the second reflected signals, the optical signal in the second wavelength region (e.g., the optical signal corresponding to the transmission wavelength region of the second dichroic optical splitter (137)) can pass through the second dichroic optical splitter (137) and be transmitted to the camera (139). The multi-domain thermal imaging measurement device (100) can acquire a spectrum (hereinafter referred to as the second spectrum) for the second reflected signal (e.g., the optical signal in the first wavelength region of the second reflected signal) through the spectrometer (117). The second spectrum may be a spectrum of a second reflected signal (e.g., a light signal in the first wavelength region among the second reflected signals) when a first bias signal is applied to the sample (105).

[0061] The system control unit (111) can receive a first spectrum and a second spectrum from the spectrometer (117). In other words, the system control unit (111) can obtain the first spectrum and the second spectrum of the sample (105) through the spectrometer (117). In block 210, the system control unit (111) can obtain the thermal reflection spectrum of the sample (105) based on the first spectrum and the second spectrum. The thermal reflection spectrum of the sample (105) may represent the wavelength-specific heating characteristics of the sample (105) measured by the multi-domain thermal imaging measurement device (100) in wavelength domain mode. The thermal reflection spectrum (510) of FIG. 5 may be an example of the thermal reflection spectrum of the sample (105). The x-axis of the thermal reflection spectrum (510) may represent the wavelength (e.g., the wavelength of the probe light source (119) or the wavelength of the first probe light signal), and the y-axis may represent the magnitude of the relative change in reflectance due to the temperature change of the region of interest of the sample (105). The magnitude of the thermal reflection spectrum (510) may be maximum at a wavelength of 570 nm. This may indicate that the relative change in reflectance of the region of interest of the sample (105) is greatest at a wavelength of 570 nm.

[0062] The system control unit (111) can determine the wavelength corresponding to the maximum value of the thermal reflection spectrum of the sample (105) as the optimal wavelength of the probe light source (119). In the example illustrated in FIG. 5, the maximum value of the thermal reflection spectrum (510) may be 570 nm, so the system control unit (111) can determine 570 nm as the optimal wavelength of the probe light source (119) (or the wavelength of the probe light signal irradiated on the sample (105) in the second mode / third mode).

[0063] FIGS. 6 and FIGS. 7 are drawings illustrating a second mode (or spatial domain mode) of a multi-domain thermal imaging measurement device according to one embodiment.

[0064] Referring to FIG. 6, the multi-domain thermal imaging measurement device (100) can operate in a second mode (or spatial domain mode).

[0065] In the second mode (or spatial domain mode), the second dichroic light splitter (137) may be removed from the light path of the camera (139). The multi-domain thermal imaging measurement device (100) may irradiate the sample (105) with a second probe light signal having an optimal wavelength (e.g., the optimal wavelength determined in the first mode) (or a second probe light signal having a wavelength close to the optimal wavelength) and may apply a second bias signal to the sample (105) through the bias device (115). While the second probe light signal is irradiated to the sample (105), the multi-domain thermal imaging measurement device (100) may generate or acquire a first thermal reflection image of the sample (105) using the light signal reflected from the sample (105) and the camera (139).

[0066] In the example illustrated in FIG. 6, the system control unit (111) can control the filter turret (123) through the control board (113). The system control unit (111) (or the control board (113)) can control the filter turret (123) such that a first optical filter having a wavelength closest to the optimal wavelength (e.g., the optimal wavelength determined in the first mode) among the plurality of optical filters of the filter turret (123) is positioned in the optical path of the probe light source (119). When the probe light source (119) outputs a first probe light signal, the multi-domain thermal imaging device (100) can generate a second probe light signal by filtering the first probe light signal through the first optical filter of the filter turret (123). The second probe light signal can be irradiated onto the sample (105) through a variable pinhole (125), a second lens (127), a first dichroic light splitter (129), a light splitter (131), and an objective lens (133).

[0067] A second bias signal is applied to the sample (105) so that the sample (105) can generate heat, and while a second probe light signal is irradiated onto the sample (105) to which the second bias signal is applied, a light signal reflected from the sample (105) (hereinafter referred to as the third reflected signal) can be transmitted to a camera (139) through an objective lens (133), a light splitter (131), and a third lens (135). The camera (139) can detect the third reflected signal to generate an image signal (610) and transmit the image signal (610) to a system control unit (111).

[0068] In block 620, the system control unit (111) can generate or acquire at least one first thermal reflection image of the sample (105) using an image signal (610) received from the camera (139). For example, the system control unit (111) can generate or acquire at least one first thermal reflection image of the sample (105) by performing a 4-bucket method (or 4-bucket algorithm) on the image signal (610). At least one first thermal reflection image of the sample (105) may correspond to an image representing the spatial heat distribution of the sample (105).

[0069] FIG. 7 illustrates a reflection image (710) (e.g., reflection image (310) of FIG. 3), a thermal reflection image (720) of sample (105) obtained when a probe light signal having a wavelength (490 nm) is irradiated onto sample (105) to which a second bias signal is applied, a thermal reflection image (730) of sample (105) obtained when a probe light signal having a wavelength (530 nm) is irradiated onto sample (105) to which a second bias signal is applied, and a thermal reflection image (740) of sample (105) obtained when a second probe light signal (e.g., a probe light signal having an optimal wavelength (570 nm)) is irradiated onto sample (105) to which a second bias signal is applied. The thermal reflection image (740) may correspond to a first thermal reflection image of sample (105) obtained by a multi-domain thermal imaging measurement device (100) in a second mode. When comparing the thermal reflection image (740) with the thermal reflection image (720) and the thermal reflection image (730), the thermal reflection image (740) can show the spatial heat distribution of the sample (105) (or the relative change in reflectance (ΔR / R) of the sample (105) according to temperature change) better than the thermal reflection image (720) and the thermal reflection image (730).

[0070] The multi-domain thermal imaging measurement device (100) can operate in a third mode when acquiring a first thermal reflection image of a sample (105).

[0071] FIGS. 8 and 9 are drawings illustrating a third mode (or time domain mode) of a multi-domain thermal imaging measurement device according to one embodiment.

[0072] Referring to FIG. 8, the multi-domain thermal imaging measurement device (100) can operate in a third mode (or time domain mode) of the device.

[0073] In a third mode (or time domain mode), the multi-domain thermal imaging measurement device (100) can irradiate a sample (105) with a third probe optical signal in the form of a pulse signal having an optimal wavelength (e.g., the optimal wavelength determined in the first mode) (or a third probe optical signal in the form of a pulse signal having a wavelength close to the optimal wavelength) and apply a third bias signal to the sample (105). While the third probe optical signal is irradiated to the sample (105) to which the third bias signal is applied, the multi-domain thermal imaging measurement device (100) can acquire a second thermal reflection image (or time-resolved thermal image) of the sample (105) using the optical signal reflected from the sample (105) and the camera (139).

[0074] In the example illustrated in FIG. 8, the probe light source (119) can output a first probe light signal in the form of a pulse signal in which the pulses are repeated periodically. The system control unit (111) can control the probe light source (119) so that the probe light source (119) can output a first probe light signal in the form of a pulse signal. A first optical filter of a filter turret (123) may be positioned in the optical path of the probe light source (119). When the probe light source (119) outputs a first probe light signal in the form of a pulse signal, the multi-domain thermal imaging measurement device (100) can generate a third probe light signal by filtering the first probe light signal in the form of a pulse signal through the first optical filter of the filter turret (123). The third probe light signal may also be in the form of a pulse signal. The third probe light signal can be irradiated onto the sample (105) through a variable pinhole (125), a second lens (127), a first dichroic light splitter (129), a light splitter (131), and an objective lens (133).

[0075] A third bias signal is applied to the sample (105) so that the sample (105) can generate heat, and while a third probe light signal is irradiated onto the sample (105) to which the third bias signal is applied, a light signal reflected from the sample (105) (hereinafter referred to as the fourth reflected signal) can be transmitted to a camera (139) through an objective lens (133), a light splitter (131), and a third lens (135). The camera (139) can detect the fourth reflected signal to generate an image signal (810) and transmit the image signal (810) to a system control unit (111).

[0076] In block 820, the system control unit (111) can generate or acquire at least one second thermal reflection image of the sample (105) using an image signal (810) received from the camera (139). For example, the system control unit (111) can generate or acquire at least one second thermal reflection image of the sample (105) by performing box-car averaging on the image signal (810). At least one second thermal reflection image of the sample (105) may correspond to an image representing the heat distribution of the sample (105) over time.

[0077] When the temporal resolution corresponding to the irradiation time (or pulse width) of the probe light source (119) in the third mode is 2μs, examples of each of the second thermal reflection images (or time-resolved thermal images) (910, 920, 930) of the sample (105) are illustrated in FIG. 9. While the third probe light signal is irradiated onto the sample (105) to which the third bias signal is applied, the multi-domain thermal imaging measurement device (100) can sequentially acquire the second thermal reflection image (910), the second thermal reflection image (920), and the second thermal reflection image (930).

[0078] Previously, it was described that the multi-domain thermal image measuring device (100) operates in a third mode after operating in a second mode, but this is merely an exemplary case, and the multi-domain thermal image measuring device (100) can operate in a second mode after operating in a third mode.

[0079] FIG. 10 is a flowchart illustrating an example of the operation method of a multi-domain thermal imaging measurement device according to one embodiment.

[0080] Steps 1010 to 1040 illustrated in FIG. 10 can be performed in a first mode of a multi-domain thermal imaging measurement device (or a measurement device for measuring the heat characteristics of a sample (105)) (100).

[0081] Referring to FIG. 10, in step 1010, the multi-domain thermal imaging measuring device (100) can irradiate a first probe light signal of a probe light source (119) onto a sample (105).

[0082] In step 1020, the multi-domain thermal imaging measurement device (100) can acquire a spectrum of a light signal reflected from a region of interest of the sample (105) through a spectrometer (117) in each of a first state before a bias signal (e.g., a first bias signal) is applied to the sample (105) and a second state in which a bias signal (e.g., a first bias signal) is applied to the sample (105). The spectrum of the light signal reflected from the region of interest of the sample (105) in the first state (e.g., a light signal in the first wavelength region among the light signals reflected from the region of interest of the sample (105) in the first state) may correspond to the first spectrum described above, and the spectrum of the light signal reflected from the region of interest of the sample (105) in the second state (e.g., a light signal in the first wavelength region among the light signals reflected from the region of interest of the sample (105) in the second state) may correspond to the second spectrum described above.

[0083] In each of the first and second states, the light signal in the first wavelength region among the light signals reflected from the region of interest of the sample (105) can be transmitted to the spectrometer (117) by a movable dichroic beam splitter (137) located in the optical path of the camera (139), and the light signal in the second wavelength region among the light signals reflected from the region of interest of the sample (105) can be transmitted to the camera (139) by passing through the dichroic beam splitter (137). The multi-domain thermal imaging measurement device (100) can obtain a spectrum for the region of interest of the sample (105) from the light signal in the first wavelength region through the spectrometer (117) and can monitor the region of interest of the sample (105) by obtaining an image of the region of interest of the sample (105) from the light signal in the second wavelength region through the camera (139).

[0084] In step 1030, the multi-domain thermal imaging measurement device (100) can obtain a thermal reflection spectrum of the sample (105) (e.g., the thermal reflection spectrum (510) of FIG. 5) based on the spectrum obtained in each of the first and second states.

[0085] In step 1040, the multi-domain thermal imaging measurement device (100) can determine the optimal wavelength of the probe light source (119) based on the thermal reflection spectrum of the sample (105). For example, the multi-domain thermal imaging measurement device (100) can determine the wavelength having the maximum value of the thermal reflection spectrum of the sample (105) as the optimal wavelength of the probe light source (119) (or the wavelength of the probe light signal irradiated onto the sample (105) in the second mode / third mode). As described above, the optimal wavelength of the probe light source (119) can be used in the second mode and the third mode of the multi-domain thermal imaging measurement device (100).

[0086] Before step 1010 is performed, the multi-domain thermal imaging measurement device (100) can determine the region of interest of the sample (105). For example, the multi-domain thermal imaging measurement device (100) can irradiate the sample (105) with a movable dichroic splitter (i.e., a second dichroic splitter (137)) out of the optical path of the camera (139). While irradiating the sample (105) with the first probe optical signal, the multi-domain thermal imaging measurement device (100) can acquire a reflected image of the sample (105) using the optical signal reflected from the sample (105) and the camera (139). At this time, the multi-domain thermal imaging measurement device (100) can acquire a reflected image of the sample (105) while at least one of the position and size of the variable pinhole (125) is adjusted. The multi-domain thermal imaging measurement device (100) can determine the region of interest of the sample (105) by considering the acquired reflection image. After the region of interest of the sample (105) is determined, a movable dichroic splitter (i.e., a second dichroic splitter (137)) can be positioned in the optical path of the camera (139).

[0087] When step 1040 is completed, the multi-domain thermal imaging measurement device (100) may operate in a second mode and / or a third mode. In the second mode and / or a third mode, a movable dichroic splitter (i.e., a second dichroic splitter (137)) may be removed from the optical path of the camera (139). The multi-domain thermal imaging measurement device (100) may operate in a second mode and / or a third mode when the optimal wavelength of the probe light source (119) is determined.

[0088] In the second mode, the multi-domain thermal imaging measurement device (100) can irradiate a second probe light signal having an optimal wavelength onto a sample (105) to which a second bias is applied. The multi-domain thermal imaging measurement device (100) can control the filter turret (123) so that a first optical filter having a wavelength closest to the optimal wavelength among a plurality of optical filters of the filter turret (123) is positioned in the optical path of the probe light source (119). The multi-domain thermal imaging measurement device (100) can generate a second probe light signal by filtering the first probe light signal through the first optical filter and can irradiate the second probe light signal onto a sample (105) to which a second bias signal is applied. While the second probe light signal is irradiated onto the sample (105), the multi-domain thermal imaging measurement device (100) can acquire a first thermal reflection image of the sample (105) using the light signal reflected from the sample (105) and the camera (139).

[0089] In the third mode, the multi-domain thermal imaging measurement device (100) can irradiate a third probe optical signal, which has an optimal wavelength and is in the form of a pulse signal, onto a sample (105) to which a third bias signal is applied. The multi-domain thermal imaging measurement device (100) can output a first probe optical signal in the form of a pulse signal through a probe light source (119), and can generate a third probe optical signal by filtering the first probe optical signal in the form of a pulse signal through a first optical filter of a filter turret (123). The multi-domain thermal imaging measurement device (100) can irradiate the third probe optical signal onto a sample (105) to which a third bias signal is applied. While the third probe optical signal is irradiated onto the sample (105), the multi-domain thermal imaging measurement device (100) can acquire a second thermal reflection image of the sample (105) using the optical signal reflected from the sample (105) and the camera (139).

[0090] According to an embodiment, the multi-domain thermal imaging measurement device (100) may operate in a third mode after acquiring a first thermal reflection image of a sample (105) in a second mode. Not limited thereto, the multi-domain thermal imaging measurement device (100) may operate in a second mode after acquiring a second thermal reflection image of a sample (105) in a third mode. According to an embodiment, the multi-domain thermal imaging measurement device (100) may operate in a second mode or a third mode depending on the user's selection input.

[0091] The embodiments described through FIGS. 1 to 9 can be applied to the operation method of the multi-domain thermal imaging measurement device of FIG. 10.

[0092] The embodiments described above may be implemented as hardware components, software components, and / or combinations of hardware and software components. For example, the devices, methods, and components described in the embodiments may be implemented using a general-purpose computer or a special-purpose computer, such as, for example, a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing unit may execute an operating system (OS) and software applications executed on said operating system. Additionally, the processing unit may access, store, manipulate, process, and generate data in response to the execution of the software. For ease of understanding, the processing unit may be described as being used as a single unit, but those skilled in the art will understand that the processing unit may include multiple processing elements and / or multiple types of processing elements. For example, the processing unit may include multiple processors or one processor and one controller. In addition, other processing configurations, such as parallel processors, are also possible.

[0093] Software may include computer programs, code, instructions, or a combination of one or more of these, and may configure a processing unit to operate as desired or instruct the processing unit independently or collectively. Software and / or data may be stored on any type of machine, component, physical device, virtual equipment, computer storage medium, or device so as to be interpreted by the processing unit or to provide instructions or data to the processing unit. Software may be distributed over networked computer systems and stored or executed in a distributed manner. Software and data may be stored on computer-readable recording media.

[0094] The method according to the embodiment may be implemented in the form of program instructions that can be executed through various computer means and recorded on a computer-readable medium. The computer-readable medium may store program instructions, data files, data structures, etc., either individually or in combination, and the program instructions recorded on the medium may be those specifically designed and configured for the embodiment or those known and available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tapes; optical recording media such as CD-ROMs and DVDs; magneto-optical media such as floptical disks; and hardware devices specifically configured to store and execute program instructions, such as ROM, RAM, and flash memory. Examples of program instructions include machine code, such as that generated by a compiler, as well as high-level language code that can be executed by a computer using an interpreter, etc.

[0095] The hardware device described above may be configured to operate as one or more software modules to perform the operation of the embodiment, and vice versa.

[0096] Although the embodiments have been described above with reference to the limited drawings, those skilled in the art can apply various technical modifications and variations based thereon. For example, suitable results may be achieved even if the described techniques are performed in a different order than described, and / or if the components of the described system, structure, device, circuit, etc. are combined or assembled in a form different from described, or replaced or substituted by other components or equivalents.

[0097] Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims set forth below.

Claims

1. In a measuring device for measuring the heat generation characteristics of a sample, Camera; Spectrometer; Movable dichroic optical splitter; probe light source; and A variable pin hole used to determine the region of interest (ROI) of the above sample Includes, The operating mode of the above measuring device includes a first mode for measuring wavelength-specific heating characteristics of the sample, a second mode for measuring spatial heating characteristics of the sample, and a third mode for measuring temporal heating characteristics of the sample. In the first mode, the dichroic optical splitter is positioned in the optical path of the camera, and the measuring device irradiates the sample with a first probe optical signal of the probe light source, and acquires a spectrum of the optical signal reflected from the region of interest through the spectrometer in each of the first state before the first bias signal is applied to the sample and the second state when the first bias signal is applied to the sample, and acquires a thermal reflection spectrum of the sample based on the spectra acquired in each of the first and second states, determines the optimal wavelength of the probe light source based on the thermal reflection spectrum, and operates in the second mode and the third mode when the optimal wavelength is determined. In each of the first and second states above, the optical signal in the first wavelength region among the optical signals reflected from the region of interest is transmitted to the spectrometer by the dichroic optical splitter located in the optical path of the camera, and the optical signal in the second wavelength region among the optical signals reflected from the region of interest is transmitted to the camera by passing through the dichroic optical splitter. Measuring device.

2. In Paragraph 1, In the second mode above, the dichroic optical splitter is removed from the optical path of the camera, and the measuring device irradiates the sample with a second probe optical signal having the optimal wavelength and applies a second bias signal to the sample, and while the second probe optical signal is irradiated onto the sample, acquires a first thermal reflection image of the sample using the optical signal reflected from the sample and the camera. Measuring device.

3. In Paragraph 2, The above measuring device further includes a filter turret having a plurality of optical filters, and In the second mode above, the measuring device controls the filter turret so that a first optical filter having a wavelength closest to the optimal wavelength among the plurality of optical filters is positioned in the optical path of the probe light source, and filters the first probe optical signal through the first optical filter to generate the second probe optical signal. Measuring device.

4. In Paragraph 1, In the third mode above, the dichroic optical splitter is removed from the optical path of the camera, and the measuring device irradiates the sample with a third probe optical signal in the form of a pulse signal having the optimal wavelength and applies a third bias signal to the sample, and while the third probe optical signal is irradiated onto the sample, acquires a second thermal reflection image of the sample using the optical signal reflected from the sample and the camera. Measuring device.

5. In Paragraph 4, In the third mode above, the measuring device outputs the first probe optical signal in the form of a pulse signal through the probe light source, and generates the third probe optical signal by filtering the first probe optical signal in the form of a pulse signal through a first optical filter having a wavelength closest to the optimal wavelength among a plurality of optical filters of the filter turret of the measuring device. Measuring device.

6. In Paragraph 1, In the first mode above, when the dichroic optical splitter is out of the optical path of the camera, the measuring device acquires a reflected image of the sample using the optical signal reflected from the sample and the camera while the first probe optical signal is irradiated onto the sample, wherein the reflected image is acquired while at least one of the position and size of the variable pinhole is adjusted, and the region of interest is determined based on the acquired reflected image. Measuring device.

7. In Paragraph 1, A first lens and a second lens located in the optical path of the probe light source. Includes more, The variable pinhole is located between the first lens and the second lens, Measuring device.

8. In Paragraph 1, In the first mode above, the measuring device monitors the region of interest by acquiring a spectrum for the region of interest from an optical signal of the first wavelength range through the spectrometer and acquiring an image for the region of interest from an optical signal of the second wavelength range through the camera. Measuring device.

9. A method of operating a measuring device for measuring the heat generation characteristics of a sample, In a first mode for measuring the wavelength-dependent heating characteristics of the sample, a step of irradiating the sample with a first probe light signal of a probe light source; A step of acquiring, through a spectrometer, a spectrum of a light signal reflected from a region of interest of the sample in each of a first state before a first bias signal is applied to the sample and a second state in which the first bias signal is applied to the sample; A step of obtaining a thermal reflection spectrum of the sample based on the spectra obtained in each of the first and second states; A step of determining the optimal wavelength of the probe light source based on the above thermal reflection spectrum; and When the optimal wavelength is determined, the step of operating in a second mode for measuring the spatial heating characteristics of the sample or a third mode for measuring the temporal heating characteristics of the sample Includes, In each of the first and second states above, the optical signal in the first wavelength region among the optical signals reflected from the region of interest is transmitted to the spectrometer by a movable dichroic optical splitter located in the optical path of the camera of the measuring device, and the optical signal in the second wavelength region among the optical signals reflected from the region of interest is transmitted to the camera by passing through the dichroic optical splitter. Method of operation of the measuring device.

10. In Paragraph 9, In the second mode, a second probe optical signal having the optimal wavelength is irradiated onto the sample, and a second bias signal is applied to the sample; and A step of acquiring a first thermal reflection image of the sample using the camera and the light signal reflected from the sample while the second probe light signal is irradiated onto the sample. Includes more, In the second mode above, the dichroic light splitter deviates from the optical path of the camera, Method of operation of the measuring device.

11. In Paragraph 9, Steps of irradiating the sample with a third probe optical signal in the form of a pulse signal having the optimal wavelength in the third mode and applying a third bias signal to the sample; and A step of acquiring a second thermal reflection image of the sample using the light signal reflected from the sample and the camera while the third probe light signal is irradiated onto the sample. Includes more, In the third mode above, the dichroic light splitter deviates from the optical path of the camera, Method of operation of the measuring device.

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