Speaker module and electronic device comprising same

Abstract

This dipole speaker module may comprise: a first vibration assembly including a first diaphragm connected to a first coil and a first frame in which the first diaphragm is disposed; a second vibration assembly including a second diaphragm which is connected to a second coil, is positioned opposite to the first diaphragm, and has a size larger than that of the first diaphragm; a magnet facing the first coil and the second coil between the first diaphragm and the second diaphragm; and a yoke including an opening in which a portion of the first frame is accommodated, the yoke having a portion disposed between the magnet and the first diaphragm. The first and second diaphragms of the first and second vibration assemblies may vibrate by means of an electromagnetic force acting between the first and second coils and the magnet to output first and second acoustic signals, respectively.

Description

Speaker module and electronic device including the same

[0001] The various embodiments disclosed in this document relate to a speaker module and an electronic device including the same.

[0002] With the increasing performance of electronic devices, various electronic components performing different functions are being placed inside them. As an example of such electronic components, a speaker module for outputting sound may be included. The speaker module utilizes a surround contained in a diaphragm to facilitate air vibrations, thereby converting electrical signals generated by the electronic device into sound signals that can be heard by the user and outputting them.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] According to one embodiment of the present disclosure, a dipole speaker module may include a first vibration assembly comprising a first coil, a first diaphragm connected to the first coil, and a first frame on which the first diaphragm is disposed. The dipole speaker module may include a second vibration assembly comprising a second coil, a second diaphragm connected to the second coil, positioned opposite to the first diaphragm, and larger in size than the first diaphragm. The dipole speaker module may include a magnet facing the first coil and the second coil between the first diaphragm and the second diaphragm. The dipole speaker module may include an opening into which a portion of the first frame is received, and a yoke into which a portion is disposed between the magnet and the first diaphragm. The first diaphragm of the first vibration assembly may vibrate through an electromagnetic force acting between the first coil and the magnet to output a first acoustic signal. The second diaphragm of the second vacuum assembly may vibrate through an electromagnetic force acting between the second coil and the magnet to output a second acoustic signal.

[0005] According to one embodiment of the present disclosure, an electronic device may include a housing and a dipole speaker module disposed in the housing. The dipole speaker module may include a first vibration assembly comprising a first coil, a first diaphragm connected to the first coil, and a first frame on which the first diaphragm is disposed. The dipole speaker module may include a second vibration assembly comprising a second coil, a second diaphragm connected to the second coil, positioned opposite to the first diaphragm, and larger in size than the first diaphragm. The dipole speaker module may include a magnet facing the first coil and the second coil between the first diaphragm and the second diaphragm. The dipole speaker module may include an opening into which a portion of the first frame is received, and a yoke in which a portion is disposed between the magnet and the first diaphragm. The first diaphragm of the first vibration assembly may vibrate through an electromagnetic force acting between the first coil and the magnet to output a first acoustic signal. The second diaphragm of the second vacuum assembly can vibrate through the electromagnetic force acting between the second coil and the magnet to output a second acoustic signal.

[0006] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0007] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0008] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 2b is a perspective view of the rear side of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0010] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0011] FIG. 4a is an assembly diagram of a speaker module according to one embodiment of the present disclosure.

[0012] FIG. 4b is an assembly diagram of an embodiment in which the support structure is omitted from the yoke of FIG. 4a.

[0013] Figure 5a is an assembly diagram of the speaker module of Figure 4a.

[0014] FIG. 5b is a front perspective view of the speaker module of FIG. 4a.

[0015] FIG. 5c is a rear perspective view of the speaker module of FIG. 4a.

[0016] FIG. 5d is a drawing in which a magnet is disposed on one surface of a yoke according to one embodiment of the present disclosure.

[0017] Figures 6a and 6b are cross-sectional views taken along the line 6a-6a of Figure 5b.

[0018] Figure 6c is a cross-sectional view taken along the line 6c-6c of Figure 5b.

[0019] Figure 7 is a cross-sectional view taken along line 7-7 of Figure 5b.

[0020] FIG. 8 is a drawing of an embodiment in which the first frame in FIG. 4b is supported through a magnet.

[0021] Figure 9a is a cross-sectional view taken along the line 9a-9a of Figure 8.

[0022] Figure 9b is a cross-sectional view taken along the line 9b-9b of Figure 8.

[0023] FIG. 10 is a drawing of an embodiment according to one embodiment of the present disclosure in which a first diaphragm is supported through a yoke.

[0024] FIG. 11 is a drawing of a structure in which a first vibration assembly and a second vibration assembly share a ventilation space according to one embodiment of the present disclosure.

[0025] In the following description, various embodiments of this document are described with reference to the accompanying drawings. The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments.

[0026] In relation to the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise.

[0027] In this document, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said component may be connected to said other component directly (e.g., wired), wirelessly, or through a third component.

[0028] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0029] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0030] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0031] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0032] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0033] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0034] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0035] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0036] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0037] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0039] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0041] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0043] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0045] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0046] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0047] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0048] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0049] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0050] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 2b is a rear perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0051] The electronic device (200) described below may include at least one of the components of the electronic device (101) described above in FIG. 1.

[0052] Referring to FIGS. 2a and 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In one embodiment (not shown), the housing may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIG. 2a. According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (218) (or "side member") comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0053] In the illustrated embodiment, the front plate (202) may include a first region (210D) that curves seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 2b), the rear plate (211) may include a second region (210E) that curves seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0054] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or an indicator) or additionally include other components.

[0055] The display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0056] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The sound output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), speakers (207, 214), and connector (208) may be placed in at least part of the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone (203) and the speakers (207, 214). In some embodiments, the acoustic output device (207, 214) may include a speaker (e.g., a piezo speaker) that is operated with the hole formed in the housing (210) excluded.

[0057] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM (heart rate monitor) sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., home key button), a portion of the second surface (210B), and / or below the display (201). The electronic device (200) may further include at least one of the unillustrated sensor modules, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0058] The camera module (205, 212) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (200), a second camera module (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0059] A key input device (217) may be placed on the side (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input device (217) that is not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0060] An indicator may be placed, for example, on a first surface (210A) of a housing (210). The indicator may provide status information of an electronic device (200), for example, in the form of light (e.g., a light-emitting element). In one embodiment, the light-emitting element may provide a light source that corresponds to the operation of a camera module (205), for example. The indicator may include, for example, a light-emitting diode (LED), an infrared (IR) LED, and / or a xenon lamp.

[0061] The connector hole (208) may include a first connector hole (208) capable of receiving a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0062] Some camera modules (205) among the camera modules (205, 212), some sensor modules (204) among the sensor modules (204, 219), or an indicator may be positioned to be visually exposed through the display (201). For example, the camera module (205), sensor module (204), or indicator may be positioned to come into contact with the external environment through an opening or a transparent area perforated to the front plate (202) of the display (201) within the internal space of the electronic device (200). According to one embodiment, the area facing the display (201) and the camera module (205) may be formed as a transparent area having a certain transmittance as part of the area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. These transparent areas may include an area that overlaps with the effective area (e.g., field of view area) of the camera module (205) through which light passes to form an image with an image sensor to generate an image. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be positioned to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device. For example, in this case, the area of ​​the display (201) facing the sensor modules may not require a perforated opening.

[0063] According to one embodiment, the electronic device (200) has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (200) may be part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms "foldable electronic device," "slidable electronic device," "stretchable electronic device," and / or "rollable electronic device" may mean an electronic device that is capable of bending deformation of a display (e.g., display (330) in FIG. 3), so that at least a portion may be folded, wound or rolled, at least a portion of the area may be expanded, and / or can be housed inside a housing (e.g., housing (210) in FIG. 2a and 2b). Foldable electronic devices, slideable electronic devices, stretchable electronic devices and / or rollable electronic devices can be used by expanding the screen display area by unfolding the display or by exposing a larger area of ​​the display to the outside, depending on the user's needs.

[0064] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0065] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (200) of FIG. 2a and FIG. 2b, or may include other embodiments of the electronic device.

[0066] Referring to FIG. 3, an electronic device (300) (e.g., the electronic device (200) of FIG. 2a or FIG. 2b) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or support structure), a front plate (320) (e.g., a front cover) (e.g., the front plate (202) of FIG. 2a), a display (330) (e.g., the display (201) of FIG. 2a), a substrate (340) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover) (e.g., the rear plate (211) of FIG. 2b). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311), or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2a or FIG. 2b, and redundant descriptions are omitted below.

[0067] The first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. A display (330) may be attached to one side of the first support member (311), and a substrate (340) may be attached to the other side. The substrate (340) may be equipped with a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0068] Memory may include, for example, volatile memory or non-volatile memory.

[0069] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD (secure digital) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector.

[0070] The battery (350) is a device for supplying power to at least one component of the electronic device (300) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, the substrate (340). The battery (350) may be integrally disposed inside the electronic device (300). In one embodiment, the battery (350) may be disposed detachably from the electronic device (300).

[0071] An antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a part or combination thereof of the side bezel structure (310) and / or the first support member (311).

[0072] FIG. 4a is an assembly drawing of a speaker module according to one embodiment of the present disclosure. FIG. 4b is an assembly drawing of an embodiment in which a support structure is omitted from the yoke of FIG. 4a. FIG. 5a is an assembly drawing of the speaker module of FIG. 4a. FIG. 5b is a front perspective view of the speaker module of FIG. 4a. FIG. 5c is a rear perspective view of the speaker module of FIG. 4a. FIG. 5d is a drawing in which a magnet is arranged on one surface of the yoke according to one embodiment of the present disclosure.

[0073] According to one embodiment, as illustrated in FIG. 4a, a speaker module (400) (e.g., the acoustic output module (155) of FIG. 1, or the speakers (207, 214) of FIG. 2a) may include a first vibration assembly (410), a second vibration assembly (420), at least one magnet (M) (e.g., a first magnet (M1), a second magnet (M2) and / or a third magnet (M3)) disposed between a first diaphragm (412) and a second diaphragm (422), and / or a yoke (440) in which at least a portion is disposed between the first vibration assembly (410) and the second vibration assembly (420). In one embodiment, the first vibration assembly (410) may include a first diaphragm (412), a first coil (411), and a first frame (413) (e.g., a first housing, a first bracket) supporting the first diaphragm (412). The second vibration assembly (420) may include a second diaphragm (422), a second coil (421), and a second frame (423) (e.g., a second housing, a second bracket) supporting the second diaphragm (422). In one embodiment, the speaker module (400) may omit at least one of the above-described configurations or add at least one configuration.

[0074] In one embodiment, the speaker module (400) may be a bidirectional speaker (e.g., a dipole speaker) that radiates sound from the front (e.g., the side facing the +Z direction in FIG. 5b) and the back (e.g., the side facing the -Z direction in FIG. 5b). In one embodiment, the speaker module (400) may form sound waves in both directions through the vibration of a first diaphragm (412) facing the front of the speaker module (400) and a second diaphragm (422) facing the back of the speaker module (400). For example, the first diaphragm (412) of the first vibration assembly (410) may vibrate through the electromagnetic force acting between the first coil (411) and the magnets (M1, M2, M3) to output a first acoustic signal. The second diaphragm (422) of the second vibration assembly (420) can vibrate through the electromagnetic force acting between the second coil (421) and the magnets (M1, M2, M3) to output a second acoustic signal. In one embodiment, the frequencies of the first acoustic signal and the second acoustic signal may be the same or different from each other.

[0075] In one embodiment, the first coil (411) of the first vibration assembly (410) and the second coil (421) of the second vibration assembly (420) can form a magnetic field with a magnet (M) (e.g., first magnet (M1), second magnet (M2), and third magnet (M3)) placed inside the speaker module (400). In one embodiment, the first coil (411) and the second coil (421) may share at least one magnet (M1, M2, M3). Thus, the speaker module (400) can be miniaturized through space efficiency between the components included in the speaker module (400).

[0076] According to one embodiment, as illustrated in FIGS. 4a, 4b, 5a, and 5b, the first coil (411) of the first vibration assembly (410) may be connected to a first diaphragm (412) (e.g., a cone-shaped diaphragm or a dome-shaped diaphragm). In one embodiment, the first coil (411) may be positioned between a first magnet (M1) and a second magnet (M2). As current is applied to the first coil (411), an electromagnetic force may act between the magnets (M1, M2, M3) and the first coil (411). Referring to FIGS. 6a and 6c to be described later, as the first coil (411) is positioned between the first magnet (M1) and the second magnet (M2), an electromagnetic force may act between the first magnet (M1) and the second magnet (M2) and the first coil (411). Accordingly, the first diaphragm (412) can output a first acoustic signal in a first frequency range as it vibrates in connection with the first coil (411).

[0077] According to one embodiment, as illustrated in FIGS. 4a, 4b, 5a, and 5c, the second coil (421) of the second vibration assembly (420) may be connected to a second diaphragm (422) (e.g., a cone-shaped diaphragm or a dome-shaped diaphragm). In one embodiment, the second coil (421) may be positioned between the second magnet (M2) and the third magnet (M3). As current is applied to the second coil (421), an electromagnetic force may act between the magnets (M1, M2, M3) and the second coil (421). Referring to FIGS. 6a and 6c to be described later, as the second coil (421) is positioned between the second magnet (M2) and the third magnet (M3), an electromagnetic force may act between the second magnet (M2) and the third magnet (M3) and the second coil (421). Accordingly, the second diaphragm (422) can output a second acoustic signal in a second frequency range as it vibrates in connection with the second coil (421).

[0078] According to one embodiment, as illustrated in FIGS. 5a, 5b, and 5c, the first diaphragm (412) may be formed to be smaller in size than the second diaphragm (422). In one embodiment, the output strength of the acoustic signal generated in the second vibration assembly (420) may be greater than the output strength of the acoustic signal generated in the first vibration assembly (410). For example, the amplitude of the second acoustic signal generated in the second diaphragm (422) of the second vibration assembly (420) may be greater than the amplitude of the first acoustic signal generated in the first diaphragm (412) of the first vibration assembly (410). In one embodiment, the first vibration assembly (410) may be a receiver that outputs a sound. The second vibration assembly (420) may output various sounds required for the operation of the electronic device (200), such as music, video sound, notification sound, or multimedia sound.

[0079] According to one embodiment, as illustrated in FIGS. 4a, 4b, 5a, and 5b, the first diaphragm (412) may be placed on the first frame (413). In one embodiment, the first diaphragm (412) may be placed on the upper surface of the first frame (413) (e.g., the +Z direction in FIG. 4a). In one embodiment, a cover member (414) may be coupled to the first frame (413) while the first diaphragm (412) is placed on the first frame (413). In one embodiment, the first coil (411) may be connected to the first diaphragm (412) and located inside the first frame (413).

[0080] According to one embodiment, as illustrated in FIGS. 4a, 4b, 5a, 5b, and 5c, the second diaphragm (422) may be placed on the second frame (423). In one embodiment, the second diaphragm (422) may be placed on the lower surface of the second frame (423) (e.g., the -Z direction in FIG. 4a). In one embodiment, the second frame (423) may be coupled with a yoke (440). In one embodiment, a plurality of magnets (M) (e.g., a first magnet (M1), a second magnet (M2), and / or a third magnet (M3)) and a second coil (421) connected to the second diaphragm (422) may be placed in the internal space formed by the coupling of the second frame (423) and the yoke (440).

[0081] According to one embodiment, as illustrated in FIGS. 5a and 5b, the yoke (440) may include an opening (441). In one embodiment, at least a portion of the first frame (413) may be located within the opening (441) of the yoke (440). In one embodiment, referring to FIGS. 6a and 6c to be described later, the first frame (413) may be located within the opening (441) of the yoke (440) and may be placed on a support structure (450) (e.g., a support structure, or a bridge) of the yoke (440) located in the opening (441). In one embodiment, with reference to FIGS. 8, 9a, and 9b to be described later, the first frame (413) may be positioned at least partially in the opening (441) of the yoke (440) and placed on a magnet (e.g., second magnet (M2)) located in the lower part of the yoke (440) (e.g., the -Z direction of FIG. 8).

[0082] In one embodiment, the first frame (413) and the second frame (423) may be formed from various materials. In one embodiment, the first frame (413) and the second frame (423) may be formed from a metal material and / or a non-metal material. For example, the metal material may include aluminum, stainless steel (STS, SUS), iron, magnesium, or an alloy of titanium. For example, the non-metal material may include synthetic resin, ceramic, or engineering plastic.

[0083] In one embodiment, the magnet (M) may include a first magnet (M1), a second magnet (M2), and a third magnet (M3). In one embodiment, the first magnet (M1), the second magnet (M2), and / or the third magnet (M3) may be formed from various materials such as neodymium magnets, alnico magnets, or ferrite magnets. In one embodiment, the second magnet (M2) may be placed outside the first magnet (M1). The third magnet (M3) may be placed in multiple numbers outside the second magnet (M2). In one embodiment, the first magnet (M1) and the third magnet (M3) may be formed in the shape of bar magnets, and the second magnet (M2) may be a closed-loop magnet that surrounds the first magnet (M1). The shapes of the first magnet (M1), second magnet (M2), and third magnet (M3) described above are examples, and the shapes of the first magnet (M1), second magnet (M2), and third magnet (M3) can be varied in many ways. Additionally, among the first magnet (M1), second magnet (M2), and third magnet (M3), at least one magnet may be omitted or at least one additional magnet may be included.

[0084] According to one embodiment, at least some of the plurality of magnets (M1, M2, M3) may be fixed to the yoke (440). In one embodiment, referring to FIG. 5d, the second magnet (M2) and the third magnet (M3) may be fixed to the second surface (440b) of the yoke (440). Thus, the yoke (440) may have a first frame (413) placed on the first surface (440a) and magnets (e.g., the second magnet (M2) and the third magnet (M3)) placed on the second surface (440b). In one embodiment, the yoke (440) may be formed of a material that conducts magnetism well. For example, the yoke (440) may be formed of a high-magnetic material such as a cobalt alloy (FeCo), iron (Fe), or an iron-silicon (FeSi) alloy.

[0085] According to one embodiment, as illustrated in FIG. 5b, the yoke (440), the first frame (413), the first diaphragm (412), and / or the cover member (414) may form the front surface of the speaker module (400) (e.g., the side facing the + Z direction in FIG. 5b). In one embodiment, the second diaphragm (422) may form the back surface of the speaker module (400) (e.g., the side facing the - Z direction in FIG. 5b). In one embodiment, the side covering the space between the front surface and the back surface of the speaker module (400) may be formed through the second frame (423).

[0086] FIGS. 6a and 6b are cross-sectional views taken along the line 6a-6a of FIG. 5b. FIG. 6c is a cross-sectional view taken along the line 6c-6c of FIG. 5b.

[0087] According to one embodiment, as illustrated in FIGS. 6a and 6c, the first diaphragm (412) may be coupled with the first coil (411). For example, the first coil (411) may be coupled with the first diaphragm (412) and at least a portion of it may be located inside the first frame (413). In one embodiment, the first coil (411) may pass through the opening (441) of the yoke (440) and face a magnet (e.g., first magnet (M1) and second magnet (M2)) in the internal space formed by the coupling of the yoke (440) and the second frame (423). For example, the first coil (411) may be located between the first magnet (M1) and the second magnet (M2). The first diaphragm (412) may generate sound by vibrating together with the first coil (411). The first diaphragm (411) can be formed from a thin film.

[0088] According to one embodiment, as illustrated in FIGS. 6a and 6c, the second diaphragm (422) may be coupled with the second coil (421). For example, the second coil (421) may be coupled with the second diaphragm (422) and may face a magnet (e.g., a second magnet (M2) and a third magnet (M3)) in an internal space formed by the coupling of the yoke (440) and the second frame (423). For example, the second coil (421) may be positioned between the second magnet (M2) and the third magnet (M3). The second diaphragm (422) may generate sound by vibrating together with the second coil (421). The second diaphragm (421) may be formed from a thin film.

[0089] In one embodiment, the speaker module (400) can output acoustic signals of different frequency ranges through a first diaphragm (412) and a second diaphragm (422). In one embodiment, the first vibration assembly (410) can be connected to a first acoustic hole (e.g., receiver hole) formed in a housing (210) (e.g., housing (210) of FIG. 2a). The acoustics (e.g., sound) output from the first vibration assembly (410) can be emitted to the outside of an electronic device (e.g., electronic device (101) of FIG. 1, electronic device (200) of FIG. 2a, and / or electronic device (300) of FIG. 3) through the first acoustic hole. In one embodiment, the second vibration assembly (420) can be connected to a second acoustic hole (e.g., speaker hole) formed in a housing (210) (e.g., housing (210) of FIG. 2a). The sound (e.g., sound) output from the second vibration assembly (420) can be emitted to the outside of the electronic device (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2a, and / or the electronic device (300) of FIG. 3) through the second acoustic hole.

[0090] According to one embodiment, as illustrated in FIGS. 6a and 6b, sound output from the first vibration assembly (410) and sound output from the second vibration assembly (420) can be emitted outside the electronic device (200) through different acoustic conduits (e.g., acoustic spaces). For example, sound output from the first vibration assembly (410) can be transmitted to the first acoustic hole through a first acoustic conduit (P1) connected to the first acoustic hole and emitted outside the electronic device (200). Sound output from the second vibration assembly (420) can be transmitted to the second acoustic hole through a second acoustic conduit (P2) connected to the second acoustic hole and emitted outside the electronic device (200). In one embodiment, the first acoustic conduit (P1) and the second acoustic conduit (P2) can be formed directly in the housing (210). In one embodiment, the first acoustic channel (P1) and the second acoustic channel (P2) may be formed through a mechanism disposed in the housing (210). Here, “acoustic channel” or “acoustic space” may refer to a passage that guides the transmission of sound (sound waves, acoustics). For example, the acoustic channel or acoustic space may refer to a physical space. The acoustic channel or acoustic space may include a space filled with a medium (e.g., air) capable of transmitting sound waves. Hereinafter, the transmission of sound through the acoustic channel or acoustic space may mean that sound is transmitted via a specific space. In one embodiment, referring to FIG. 11 to be described later, the first vibration assembly (410) and the second vibration assembly (420) may share a single acoustic channel. In this case, the single acoustic channel may be physically connected to the first acoustic hole and the second acoustic hole.

[0091] In one embodiment, referring to FIG. 6b, a hole (H) may be formed in a device (470) forming a second acoustic tube (P2) (e.g., a part of the housing (210) or a device disposed in the housing (210)). In one embodiment, a breathable member (460) disposed to cover the hole (H) may be disposed in the device forming the second acoustic tube (P2). In one embodiment, the breathable member (460) may include a porous hole or a mesh structure (e.g., a grid structure) to provide air permeability to the outside and inside of the speaker module (400). In one embodiment, the second acoustic tube (P2) may achieve pressure equilibrium with the first acoustic tube (P1) through the hole (H) and the breathable member (460).

[0092] In one embodiment, the breathable member (460) may be formed from a material such as nylon, polyester, or metal, and may also be formed from various other materials.

[0093] In one embodiment, the processor (120) can play a sound such as music, video sound, notification sound, or multimedia sound by applying current to the first coil (411) and the second coil (412) of the speaker module (400) to vibrate the first diaphragm (412) and the second diaphragm (422). In some embodiment, the processor (120) can play a sound such as music, video sound, notification sound, or multimedia sound by applying current to the second coil (421) of the speaker module (400) to vibrate the second diaphragm (422). In one embodiment, the processor (120) can output a call sound by applying current to the first coil (421) of the speaker module (400) to vibrate the first diaphragm (412) in the call operation mode of the electronic device (200).

[0094] According to one embodiment, the processor (120) can amplify sound waves in a specific frequency band by controlling the speaker module (400) so that the first vibration assembly (410) and the second vibration assembly (420) output sound in the same phase in a specific frequency band to play sound such as music, video sound, notification sound, or multimedia sound. The processor (120) can cancel out sound waves in a specific frequency band by applying current to the first coil (411) and the second coil (421) of the speaker module (400) so that the first vibration assembly (410) and the second vibration assembly (420) output sound in opposite phases in a specific frequency band.

[0095] According to one embodiment, as illustrated in FIG. 6c, the first diaphragm (412) may include a first surround (4122) (or edge, or peripheral area) that expands the vibration area and contributes to efficient air vibration. The first surround (4122) may have a shape that facilitates the vibration of the first diaphragm (412). The first surround (4122) may be formed adjacent to the edge of the first diaphragm (412) and along said edge. The first diaphragm (412) may include a first center cap (4121) positioned substantially corresponding to the first coil (411). For example, the first center cap (4121) may contribute to determining the directionality of sound waves. The first center cap (4121) may serve to prevent foreign substances, such as dust, from entering the interior of the first coil (411).

[0096] According to one embodiment, as illustrated in FIG. 6c, the second diaphragm (422) may include a second surround (4222) (or edge, or peripheral area) that expands the vibration area and contributes to efficient air vibration. The second surround (4222) may have a shape that facilitates the vibration of the second diaphragm (422). The second surround (4222) may be formed adjacent to the edge of the second diaphragm (422) and along said edge. The second diaphragm (422) may include a second center cap (4221) positioned substantially corresponding to the second coil (421). For example, the second center cap (4221) may contribute to determining the directionality of sound waves. The second center cap (4221) may serve to prevent foreign substances, such as dust, from entering the interior of the second coil (421).

[0097] According to one embodiment, the first diaphragm (412) can be vibrated through an electromagnetic force acting between the first coil (411) and the magnets (M1, M2, M3). For example, the first coil (411) can be electrically connected to a printed circuit board (e.g., the board (340) of FIG. 3) through conductive wiring (e.g., a flexible circuit board). The first coil (411) can be powered through the conductive wiring and an electromagnetic force can act with the magnets (M1, M2, M3). In one embodiment, referring to FIG. 6a and FIG. 6c, the first coil (411) can be vibrated in the up-and-down direction (e.g., the Z-axis direction of FIG. 6a) through an electromagnetic force acting with the first magnet (M1) and the second magnet (M2). The first diaphragm (412) can be connected to the first coil (411) and vibrate in the up-and-down direction (e.g., the Z-axis direction of FIG. 6a). Accordingly, the first diaphragm (412) can output a first acoustic signal in a first frequency range as it vibrates in connection with the first coil (411).

[0098] According to one embodiment, the second diaphragm (422) can be vibrated through an electromagnetic force acting between the second coil (421) and the magnets (M1, M2, M3). For example, the second coil (421) can be electrically connected to a printed circuit board (e.g., the board (340) of FIG. 3) through conductive wiring (e.g., a flexible circuit board). The second coil (421) can be powered through the conductive wiring and an electromagnetic force can act with the magnets (M1, M2, M3). In one embodiment, referring to FIG. 6a and FIG. 6c, the second coil (421) can be vibrated in the up-and-down direction (e.g., the Z-axis direction of FIG. 6a) through an electromagnetic force acting with the second magnet (M2) and the third magnet (M3). The second diaphragm (422) can be connected to the second coil (421) and vibrate in the up-and-down direction (e.g., the Z-axis direction of FIG. 6a). Accordingly, the second diaphragm (422) can output a second acoustic signal in a second frequency range as it vibrates in connection with the second coil (421).

[0099] According to one embodiment, as illustrated in FIGS. 4a, 4b and FIGS. 6a and 6c above, the first magnet (M1) may be positioned between the first plate (431) and the second plate (432) placed inside the speaker module (400). In one embodiment, the first plate (431) may be positioned on the first magnet (M1) between the first magnet (M1) and the first diaphragm (412). For example, the first plate (431) may be attached to one side of the magnet (M) (e.g., the first magnet (M1)) (e.g., the side facing the + Z direction in FIG. 6a) and face the first diaphragm (412). The second plate (432) may be positioned on the magnets (M1, M2, M3) between the second diaphragm (422) and the magnets (M1, M2, M3). For example, the second plate (432) can be attached to the other side (e.g., the side facing the -Z direction in FIG. 6a) of the magnet (M) (e.g., the first magnet (M1), the second magnet (M2), and the third magnet (M3)) and face the second diaphragm (422).

[0100] In one embodiment, the first plate (431) and the second plate (432) may include a magnetic material (e.g., a material that becomes magnetized in a magnetic field) that facilitates the passage of magnetic force. In one embodiment, the second magnet (M2) and the third magnet (M3) may be placed between the yoke (440) and the second plate (432). In one embodiment, the yoke (440), the first plate (431), and the second plate (432) may contribute to forming a magnetic field distribution by collecting the magnetic fields generated from the magnets (M1, M2, M3), the first coil (411), and the second coil (421). In one embodiment, at least one of the first plate (431) and the second plate (432) may be formed from a high magnetic material such as soft iron, silicon steel, ferrite, cast iron, amorphous metal, nanocrystalline alloy, cobalt alloy (FeCo), iron (Fe), or iron-silicon (FeSi), as in the yoke (440).

[0101] According to one embodiment, as shown in FIG. 6a, at least a portion of the first frame (413) may be located within the opening (441) of the yoke (440). The first frame (413) may be located within the opening (441) so that at least a portion may be wrapped through the yoke (440). Compared to a comparative embodiment in which the opening (441) for receiving the first frame (413) is not formed in the yoke (440), the speaker module (400) of FIG. 6a may have its thickness (e.g., Z-axis length in FIG. 6a) reduced as at least a portion of the first frame (413) is located within the opening (441) of the yoke (440).

[0102] According to one embodiment, as illustrated in FIG. 6c, the yoke (440) may include a support structure (450) (e.g., a support structure, a bridge) extending toward the opening (441). In one embodiment, the first frame (413) may be supported through the support structure (450) of the yoke (440). For example, the first frame (413) may be bonded to the support structure (450) through bonding or welding via an adhesive (e.g., bond, or tape) of the yoke (440).

[0103] In one embodiment, the support structure (450) may be formed by extending inward from the side edge of the yoke (440) defining the opening (441). The side edge may be the border of the yoke (440) defining the opening (441). For example, the support structure (450) may be formed by extending into the opening (441).

[0104] In one embodiment, the support structure (450) may form a step in the Z-axis direction of FIG. 6c with respect to the first surface (440a) of the yoke (440). For example, the support structure (450) may be located in the -Z direction of FIG. 6c with respect to the first surface (440a) of the yoke (440). In one embodiment, the first surface (440a) of the yoke (440) may be a surface where the opening (441) is formed or a surface where the opening (441) is defined.

[0105] According to one embodiment, the speaker module (400) may have a change in internal pressure caused by the compression or expansion of internal air due to the vibration of the first diaphragm (412) and the second diaphragm (422). The change in internal pressure may provide resistance to the movement of the first diaphragm (412) and the second diaphragm (422). The speaker module (400) of the present disclosure includes a ventilation structure (e.g., a first ventilation hole (V1) and a second ventilation hole (V2)), and can induce equilibrium between internal air pressure and external air pressure through the ventilation structure. Accordingly, the speaker module (400) may prevent or avoid acoustic distortion by reducing the resistance to the movement of the first diaphragm (412) and the second diaphragm (422) caused by the change in internal pressure.

[0106] According to one embodiment, as illustrated in FIG. 6a, the speaker module (400) may include a first ventilation hole (e.g., a first space) (V1) and a second ventilation hole (e.g., a second space) (V2). In one embodiment, the first ventilation hole (V1) may be part of the opening (441) of the yoke (440). For example, the first ventilation hole (V1) may be the remaining space in the opening (441) of the yoke (440) excluding the space occupied by the first frame (413). The first ventilation hole (V1) may be the space between the first frame (413) and the edge of the yoke (440) surrounding the first frame (413). In one embodiment, the change in internal pressure generated inside the speaker module (400) by the vibration of the first diaphragm (412) may be balanced with external air pressure through the first ventilation hole (V1).

[0107] In one embodiment, a second ventilation hole (V2) may be formed in the second frame (423). In one embodiment, the second frame (423) may include a side substantially perpendicular to the first diaphragm (412) and the second diaphragm (422). In one embodiment, the second ventilation hole (V2) may be formed on the side of the second frame (423). In one embodiment, a change in internal pressure generated inside the speaker module (400) by the vibration of the second diaphragm (422) may be balanced with external air pressure through the second ventilation hole (V2).

[0108] In one embodiment, a mesh member (4231) may be disposed in the second ventilation hole (V2). In one embodiment, the mesh member (4231) may block foreign substances or moisture that may enter from the outside of the speaker module (400) into the inside of the speaker module. In one embodiment, the mesh member (4231) may include porous holes or a mesh structure (e.g., a grid structure) to provide air permeability between the outside and inside of the speaker module (400). In one embodiment, the mesh member (4231) may be formed from a material such as nylon, polyester, or metal, and may also be formed from various other materials.

[0109] Figure 7 is a cross-sectional view taken along line 7-7 of Figure 5b.

[0110] The speaker module (400) shown in FIG. 7 below is a cross-sectional view taken along line 7-7 of FIG. 5b, but may include a yoke (540) of a different shape from the yoke (440) shown in FIG. 5b.

[0111] FIG. 7 below may be an embodiment in which the thickness of the third magnet (M'3) (e.g., the length in the Z-axis direction of FIG. 7) is formed to be thicker than the thickness of the third magnet (M3) shown in FIG. 6c. In this case, the yoke (540) of FIG. 7 (e.g., the yoke (440) of FIG. 4a) may have a region (540a) corresponding to the third magnet (M'3) protruding in the + Z direction of FIG. 7 more than the second region (540b) corresponding to the first diaphragm (412). In one embodiment, the yoke (540) of FIG. 7 may have a step formed between the first region (540a) and the second region (540b). For example, the second region (540b) may be located in the - Z direction of FIG. 7 relative to the first region (540a). The first frame (413) is located in a stepped section formed in the yoke (540) so that at least a portion of it may be located within the opening (541) of the yoke (540) (e.g., the opening (441) of FIG. 4a).

[0112] According to one embodiment, as shown in FIG. 7, the thickness of the third magnet (M'3) can be formed to be thicker than the thickness of the third magnet (M3) in FIG. 6a and FIG. 6c to increase the magnetic field strength of the third magnet (M'3). In one embodiment, the thickness of the third magnet (M'3) (e.g., length and height in the Z-axis direction of FIG. 7) can be formed to be thicker than the thickness of the first magnet (M1) and the second magnet (M2). Accordingly, the strength of the electromagnetic force acting between the third magnet (M'3) of FIG. 7 and the first coil (411) and the second coil (421) is increased, and the output strength of the acoustic signal that can be output through the first vibration assembly (410) and the second vibration assembly (420) can be increased.

[0113] However, the above description is based on the premise that the thickness of the third magnet (M'3) in FIG. 7 is formed to be thicker than the thickness of the third magnet (M3) in FIG. 6a and FIG. 6c, but it is not limited thereto. In one embodiment, the thickness of the first magnet (M1) in FIG. 7 may be formed to be thicker than the thickness of the first magnet (M1) in FIG. 6a. In one embodiment, the thickness of the second magnet (M2) in FIG. 7 may be formed to be thicker than the thickness of the second magnet (M2) in FIG. 6a.

[0114] FIG. 8 is a drawing of an embodiment in which the first frame in FIG. 4b is supported by a magnet. FIG. 9a is a cross-sectional view taken along the line 9a-9a of FIG. 8. FIG. 9b is a cross-sectional view taken along the line 9b-9b of FIG. 8.

[0115] The yoke (640) in FIGS. 8 to 9b below is a drawing of an embodiment in which the support structure (450) of the yoke (440), previously described through FIGS. 4a, 5a to 6c, is omitted. In one embodiment, the embodiment of FIGS. 8 to 9b may be the speaker module (400) shown in FIG. 4b. Descriptions of configurations identical or similar to the above-described configurations will be omitted from the following description.

[0116] According to one embodiment, as illustrated in FIG. 8, FIG. 9a and FIG. 9b, the first frame (413) may be attached to a magnet (M) (e.g., second magnet (M2)) located at least partially in the opening (641) of the yoke (640) (e.g., yoke (440) in FIG. 4a, yoke (640) in FIG. 4b) located at the bottom of the yoke (640) (e.g., the -Z direction in FIG. 9a). For example, the first frame (413) may be attached to the magnet (M) (e.g., second magnet (M2)) through an adhesive (e.g., bond, or tape). Compared to a comparative embodiment in which an opening (641) for receiving the first frame (413) is not formed in the yoke (640), the speaker module (400) of FIGS. 8 to 9b may have a reduced thickness (e.g., length in the Z-axis direction of FIG. 9a) as at least a portion of the first frame (413) is located in the opening (641) of the yoke (640).

[0117] In the description above, the first frame (413) is described as being placed on the second magnet (M2), but is not limited thereto. In one embodiment, the first frame (413) may be placed on the first magnet (M1) and / or the third magnet (M3) depending on the shape of the opening (641) of the yoke (640).

[0118] FIG. 10 is a drawing of an embodiment according to one embodiment of the present disclosure in which a first diaphragm is supported through a yoke.

[0119] The following FIG. 10 may be an embodiment in which the first frame (413) described through FIG. 4a to FIG. 9 is omitted, and a separate support (742) is formed in which the first diaphragm (412) is disposed on the yoke (740) (e.g., the yoke (440) of FIG. 4a or the yoke (640) of FIG. 9a).

[0120] According to one embodiment, the yoke (740) may include a support portion (742) (e.g., a seating portion, or a support structure) on which the first diaphragm (412) is placed, and an opening (741) (e.g., the opening (441) of FIG. 4a, the opening (641) of FIG. 9a) into which the first coil (411) is received. In one embodiment, the first diaphragm (412) may be fixed to the support portion (742) of the yoke (740). For example, the first surround (4122) of the first diaphragm (412) may be fixed to the support portion (742). Subsequently, a cover member (414) may be placed on the support portion (742) to cover a portion of the first surround (4122) of the first diaphragm (412).

[0121] In one embodiment, the support portion (742) may be formed integrally with the yoke (740). For example, the support portion (742) may be a portion formed by bending a portion of the yoke (740) adjacent to the opening (741) in a direction substantially perpendicular to one surface of the yoke (740) (e.g., the + Z direction in FIG. 10). In some embodiments, the support portion (742) may be formed separately from the yoke (740) and joined to the yoke (740) through welding or bonding. Thus, the first frame (413) supporting the first diaphragm (412) is omitted, and the first diaphragm (412) is supported through a portion of the yoke (740) (e.g., the support portion (742)), thereby reducing the production cost of the speaker module (400).

[0122] FIG. 11 is a drawing of a structure in which a first vibration assembly and a second vibration assembly share a ventilation space according to one embodiment of the present disclosure.

[0123] According to one embodiment, as illustrated in FIG. 11, the yoke (840) (e.g., the yoke (440) of FIG. 4a, the yoke (540) of FIG. 7, the yoke (640) of FIG. 9a, or the yoke (740) of FIG. 10) may include an opening (841). In one embodiment, the yoke (840) may include a support structure (e.g., the support structure (450) of FIG. 6a). In one embodiment, the support structure (e.g., the support structure (450) of FIG. 6a) may form a step with respect to one side of the yoke (840) where the opening (841) is formed. For example, the support structure may be located in the -Z direction of FIG. 11 with respect to one side of the yoke (840) where the opening (841) is formed. In one embodiment, the first frame (414) of the first vibration assembly (410) may be bonded to the support structure of the yoke (840). The first frame (414) can be placed on the support structure to cover the opening (841) of the yoke (840), as shown in FIG. 11. In this case, as the first frame (414) is positioned in the space formed by the step formed by the support structure and the yoke (840), the thickness (e.g., the length in the Z-axis direction of FIG. 11) of the speaker module (400) (e.g., the acoustic output module (155) of FIG. 1, or the speakers (207, 214) of FIG. 2a) can be reduced.

[0124] In one embodiment, the yoke (840) may not include the support structure (450) of FIG. 4a. In this case, the first frame (414) may be placed on one side of the yoke (840) where the opening (841) is formed and may cover the opening (841) as shown in FIG. 11.

[0125] According to one embodiment, as illustrated in FIG. 11, a third ventilation hole (V3) (e.g., a third space) formed through a magnet (M) (e.g., a first magnet (M1), a second magnet (M2) and / or a third magnet (M3)) may be in communication with a second ventilation hole (V2) formed in the second frame (423). In one embodiment, the third ventilation hole (V3) may be a space between the first magnet (M1), the second magnet (M2), and the third magnet (M3). In some embodiments, when a magnet (M) is placed inside the space formed by the yoke (840) and the second frame (423), the third ventilation hole (V3) may be a hole formed in the magnet (M).

[0126] In one embodiment, the second plate (432) may be placed on the magnets (M1, M2, M3) between the second diaphragm (422) and the magnets (M1, M2, M3). For example, the second plate (432) may be attached to the other side (e.g., the side facing the -Z direction in FIG. 11) of the magnets (M) (e.g., the first magnet (M1), the second magnet (M2), and the third magnet (M3)) and face the second diaphragm (422). In one embodiment, the second plate (432) may include an opening corresponding to the third ventilation hole (V3) formed through the magnets (M). In one embodiment, a ventilation member (460) (e.g., the ventilation member (460) in FIG. 6b) may be placed in the opening of the second plate (432).

[0127] In one embodiment, the internal pressure change caused by the vibration of the first diaphragm (412) can achieve pressure equilibrium through the third ventilation hole (V3), the space between the second plate (432) and the second diaphragm (422), and the second ventilation hole (V2). In one embodiment, the space between the first plate (431) and the first diaphragm (412) can be ventilated to the outside of the speaker module (400) through the third ventilation hole (V3), the ventilation member (460), the space between the second plate (432) and the second diaphragm (422), and the second ventilation hole (V2) to achieve pressure equilibrium. In one embodiment, the internal pressure change caused by the vibration of the second diaphragm (422) can achieve pressure equilibrium through the second ventilation hole (V2). Accordingly, the resistance to movement of the first diaphragm (412) and the second diaphragm (422) due to changes in internal pressure of the speaker module (400) is reduced, so that sound distortion can be prevented or avoided.

[0128] According to one embodiment, the processor (120) can output a call sound by applying current to the first coil (411) of the speaker module (400) in the call operation mode of the electronic device (200) to vibrate the first diaphragm (412). The processor (120) can control a media operation (e.g., music, video sound, notification sound, or multimedia sound output) by applying current to the second coil (421) to vibrate the second diaphragm (422). Accordingly, in an embodiment where the first vibration assembly (410) and the second vibration assembly (420) share a single acoustic channel, such as the speaker module (400) of FIG. 11, the first vibration assembly (410) and the second vibration assembly (420) can be driven individually according to an operation scenario (e.g., call operation, or media operation).

[0129] The speaker module (400) may be a bidirectional speaker (e.g., a dipole speaker) that radiates sound from the front and back. In this bidirectional speaker, a first vibration assembly (410) and a second vibration assembly (420) may be positioned on the upper and lower sides, respectively, with respect to magnets (M1, M2, M3). The bidirectional speaker may have a structure in which the first vibration assembly (410), magnets (M1, M2, M3), and the second vibration assembly (420) are stacked in the thickness direction of the speaker module (400). This stacked structure may increase the thickness of the speaker module (400). Accordingly, the thickness (e.g., in the Z-axis direction of FIG. 2a) of the electronic device (101, 200, 300) may be increased to accommodate the speaker module (400).

[0130] Meanwhile, if the thickness of the magnets (M1, M2, M3) is reduced to reduce the thickness of the speaker module (400), or if the vibration amplitude of the first diaphragm (412) of the first vibration assembly (410) and the second diaphragm (422) of the second vibration assembly (420) is reduced, the acoustic performance of the speaker module (400) may be degraded.

[0131] The technical tasks intended to be accomplished in this document are not limited to those mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art to which this document belongs from the description below.

[0132] According to one embodiment of the present disclosure, a dipole speaker module (155, 207, 214, 400) may include a first vibration assembly (410) comprising a first coil (411), a first diaphragm (412) connected to the first coil, and a first frame (413) on which the first diaphragm is placed. The dipole speaker module may include a second vibration assembly (420) comprising a second coil (421) and a second diaphragm (422) connected to the second coil, positioned opposite to the first diaphragm, and larger in size than the first diaphragm. The dipole speaker module may include magnets (M1, M2, M3) facing the first coil and the second coil between the first diaphragm and the second diaphragm. The dipole speaker module may include an opening (441) into which a portion of the first frame is received, and a yoke (440) into which a portion is disposed between the magnet and the first diaphragm. The first diaphragm of the first vibration assembly may vibrate through the electromagnetic force acting between the first coil and the magnet to output a first acoustic signal. The second diaphragm of the second vacuum assembly may vibrate through the electromagnetic force acting between the second coil and the magnet to output a second acoustic signal.

[0133] In one embodiment, the yoke may include a support structure (450) that extends inward from a side edge defining the opening. The first frame may be attached to the support structure of the yoke.

[0134] In one embodiment, the support structure may form a step with one surface defining the opening of the yoke.

[0135] In one embodiment, the interior and exterior of the speaker module can be communicated through the space (V1) between the opening and the first frame.

[0136] In one embodiment, the second vibration assembly may include a second frame (423) that supports the second diaphragm. The second frame may include a ventilation hole (V2) that communicates the inside and outside of the speaker module.

[0137] In one embodiment, the second frame may include a side substantially perpendicular to the first diaphragm and the second diaphragm. The ventilation hole may be formed on the side of the second frame.

[0138] In one embodiment, the dipole speaker module may further include a mesh member (4231) disposed in the ventilation hole.

[0139] In one embodiment, the first frame can be received in the opening of the yoke and attached to the magnet.

[0140] In one embodiment, the magnet may include a first magnet (M1), a second magnet (M2) disposed outside the first magnet, and a third magnet (M3) disposed outside the second magnet. A first coil of the first vibration assembly may be disposed between the first magnet and the second magnet. A second coil of the second vibration assembly may be disposed between the second magnet and the third magnet.

[0141] In one embodiment, the thickness of the third magnet may be formed to be thicker than the thickness of the first magnet and the thickness of the second magnet.

[0142] In one embodiment, the output strength of the second acoustic signal generated in the second vibration assembly may be greater than the output strength of the first acoustic signal generated in the first vibration assembly.

[0143] In one embodiment, the yoke, the first frame, and the first diaphragm may form the front surface of the speaker module. The second diaphragm may form the back surface opposite to one side of the speaker module.

[0144] In one embodiment, the dipole speaker module may further include a first plate (431) attached to one side of the magnet and facing the first diaphragm and containing a magnetic material, and a second plate (432) attached to the other side opposite to the one side of the magnet and facing the second diaphragm and containing a magnetic material.

[0145] In one embodiment, the second magnet may be formed in a closed-loop shape.

[0146] According to one embodiment of the present disclosure, an electronic device may include a housing (210) and a dipole speaker module (155, 207, 214, 400) disposed in the housing. The dipole speaker module may include a first vibration assembly (410) comprising a first coil (411), a first diaphragm (412) connected to the first coil, and a first frame (413) on which the first diaphragm is disposed. The dipole speaker module may include a second vibration assembly (420) comprising a second coil (421) and a second diaphragm (422) connected to the second coil, positioned opposite to the first diaphragm, and larger in size than the first diaphragm. The dipole speaker module may include magnets (M1, M2, M3) facing the first coil and the second coil between the first diaphragm and the second diaphragm. The dipole speaker module may include an opening (441) into which a portion of the first frame is received, and a yoke (440) into which a portion is disposed between the magnet and the first diaphragm. The first diaphragm of the first vibration assembly may vibrate through the electromagnetic force acting between the first coil and the magnet to output a first acoustic signal. The second diaphragm of the second vacuum assembly may vibrate through the electromagnetic force acting between the second coil and the magnet to output a second acoustic signal.

[0147] In one embodiment, the housing may include a first acoustic hole connected to the first vibration assembly to emit the first acoustic signal generated in the first vibration assembly, and a second acoustic hole connected to the second vibration assembly to emit the second acoustic signal generated in the second vibration assembly.

[0148] In one embodiment, the yoke may include a support structure (450) that extends inward from a side edge defining the opening. The first frame may be attached to the support structure of the yoke.

[0149] In one embodiment, the support structure may form a step with one surface defining the opening of the yoke.

[0150] In one embodiment, the interior and exterior of the speaker module can be communicated through the space (V1) between the opening and the first frame.

[0151] In one embodiment, the second vibration assembly may include a second frame (423) that supports the second diaphragm. The second frame may include a ventilation hole (V2) that communicates the inside and outside of the speaker module.

[0152] According to one embodiment disclosed in this document, a frame (413) supporting a diaphragm (412) of a vibration assembly (410) may be partially accommodated in an opening (441) formed in a yoke (440) of a speaker module (400). Accordingly, as the stacking section of the components constituting the speaker module (400) is reduced, the thickness of the speaker module (400) may be reduced compared to an embodiment in which an opening (441) is not formed in the yoke (440).

[0153] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0154] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0155] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0156] It will be understood that the present invention considers and includes, in addition to the embodiments disclosed above, embodiments based on any two or more combinations of the disclosed embodiments and embodiments including any combination of the features disclosed herein. That is, the absence of an explicit indication that two features can be combined or two embodiments can be combined does not mean that such combination is not conceived, but should be understood as such combination being included herein.

Claims

1. Regarding a dipole speaker module, A first vibration assembly comprising a first coil, a first diaphragm connected to the first coil, and a first frame on which the first diaphragm is disposed; A second vibration assembly comprising a second coil, a second diaphragm connected to the second coil and positioned opposite to the first diaphragm and larger in size than the first diaphragm; A magnet facing the first coil and the second coil between the first diaphragm and the second diaphragm; and It includes a yoke having an opening that accommodates a portion of the first frame and a portion disposed between the magnet and the first diaphragm; The first diaphragm of the first vibration assembly above is, It vibrates through the electromagnetic force acting between the first coil and the magnet to output a first acoustic signal, and The second diaphragm of the second vacuum assembly above is, A dipole speaker module that outputs a second acoustic signal by vibrating through the electromagnetic force acting between the second coil and the magnet.

2. In Paragraph 1, The above yoke is, It includes a support structure that extends inward from the side edge defining the above opening, and The first frame above is a dipole speaker module attached to the support structure of the yoke.

3. In Paragraph 2, The above support structure is, A dipole speaker module that forms a step and defines the opening of the above-mentioned yoke.

4. In Paragraph 1, A dipole speaker module in which the interior and exterior of the speaker module are connected through the space between the opening and the first frame.

5. In Paragraph 1, The above second vibration assembly is, It includes a second frame that supports the second diaphragm, and The above second frame is, A dipole speaker module including a ventilation hole connecting the inside and outside of the speaker module.

6. In Paragraph 5, The above second frame is, It includes a side substantially perpendicular to the first diaphragm and the second diaphragm, The above ventilation hole is a dipole speaker module formed on the side of the second frame.

7. In Paragraph 5, A dipole speaker module further comprising a mesh member disposed in the above ventilation hole.

8. In Paragraph 1, The above first frame is, A dipole speaker module accommodated in the opening of the above yoke and attached to the above magnet.

9. In Paragraph 1, The above magnet is, It includes a first magnet, a second magnet disposed outside the first magnet, and a third magnet disposed outside the second magnet. The first coil of the first vibration assembly above is, It is positioned between the first magnet and the second magnet, and The second coil of the second vibration assembly above is, A dipole speaker module positioned between the second magnet and the third magnet.

10. In Paragraph 9, The thickness of the third magnet mentioned above is, A dipole speaker module formed to be thicker than the thickness of the first magnet and the thickness of the second magnet.

11. In Paragraph 1, The output strength of the second acoustic signal generated in the second vibration assembly is, A dipole speaker module with an output strength greater than that of the first acoustic signal generated in the first vibration assembly.

12. In Paragraph 1, The above yoke, the above first frame, and the above first diaphragm form the front surface of the speaker module, and The above second diaphragm is a dipole speaker module that forms a back surface opposite to one side of the speaker module.

13. In Paragraph 5, A first plate attached to one side of the magnet, facing the first diaphragm, and comprising a magnetic material; and A dipole speaker module further comprising: a second plate attached to the other side opposite to one side of the magnet, facing the second diaphragm, and containing a magnetic material.

14. In Paragraph 9, The second magnet above is a dipole speaker module formed in a closed-loop shape.

15. In electronic devices, Housing; and A dipole speaker module disposed in the above housing; comprising The above dipole speaker module is, A first vibration assembly comprising a first coil, a first diaphragm connected to the first coil, and a first frame on which the first diaphragm is disposed. A second vibration assembly comprising a second coil, a second diaphragm connected to the second coil and positioned opposite to the first diaphragm and larger in size than the first diaphragm, A magnet facing the first coil and the second coil between the first diaphragm and the second diaphragm, and It includes an opening in which a portion of the first frame is received, and a yoke in which a portion is disposed between the magnet and the first diaphragm, and The first diaphragm of the first vibration assembly above is, It vibrates through the electromagnetic force acting between the first coil and the magnet to output a first acoustic signal, and The second diaphragm of the second vacuum assembly above is, An electronic device that vibrates through the electromagnetic force acting between the second coil and the magnet to output a second acoustic signal.

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