Coil for receiving wireless power and radio frequency communications

Abstract

A device includes a power element, a radio, a coil, a first circuit, and a second circuit. The first circuit is connected between the coil and the power element to supply power to the power element using an inductive wireless power transfer (WPT) signal received by the coil at a first frequency. The second circuit is connected between the coil and the radio to transmit and receive radio frequency (RF) communication signals via the coil at a second frequency.

Description

1618.327.1111COIL FOR RECEIVING WIRELESS POWER AND RADIO FREQUENCY COMMUNICATIONSBackground

[0001] A significant portion of the population suffers from various forms of sleep-related issues, some of which may involve sleep disordered breathing (SDB) and / or other conditions. In some patients, external breathing therapy devices and / or mere surgical interventions may fail to treat the sleep disordered breathing behavior.Brief Description of the Drawings

[0002] FIG. 1 A is a diagram schematically representing an example method and / or example device in relation to a target tissue.

[0003] FIG. 1B is a diagram including a front view schematically representing a patient’s body including example implantable components and example external elements of example methods and / or example devices.

[0004] FIG. 1 C is a block diagram of a control portion.

[0005] FIG. 2 is a graph illustrating impedance versus frequency for an ideal inductor and a typical inductor.

[0006] FIG. 3 is a diagram illustrating an example coil that may be used for wireless power transfer, inductive communications, and / or radiofrequency (RF) communications.

[0007] FIG. 4 is a diagram illustrating another example coil that may be used for wireless power transfer, inductive communications, and / or RF communications.

[0008] FIG. 5 is a diagram schematically representing an example device including an enclosure and a coil configured for wireless power transfer and / or inductive communications.

[0009] FIG. 6 is a diagram schematically representing the example device of FIG.5 configured for RF communications.1618.327.1112

[0010] FIGS. 7A-7C are diagrams schematically representing example devices including a single coil for wireless power transfer, inductive communications, and / or RF communications.

[0011] FIGS. 8A-8D are diagrams schematically representing example implantable medical devices (IMDs) including a single coil for wireless power transfer, inductive communications, and / or RF communications.

[0012] FIGS. 9A and 9B are diagrams schematically representing example IMDs including a power element housing and a coil and / or printed circuit board assembly (PCBA) housing.

[0013] FIG. 9C is a diagram schematically representing an example internal electrical assembly for an IMD.

[0014] FIGS. 10A-10C are diagrams schematically representing example portions of IMDs including a power element.

[0015] FIG. 10D is a diagram schematically representing an example internal electrical assembly for an IMD.

[0016] FIGS. 11A-11C are diagrams illustrating example coils for wireless power transfer, inductive communications, and / or RF communications.

[0017] FIGS. 12A and 12B are a plan view and a cross-sectional view, respectively, of an example multilayer coil including a plurality of conductive trace layers separated by insulation layers.

[0018] FIG. 120 is a cross-sectional view of another example multilayer coil including a plurality of conductive trace layers separated by insulation layers.

[0019] FIGS. 13A-13H are plan views of one layer of example multilayer coils including a conductive trace.

[0020] FIGS. 14A-14D are diagrams schematically representing example circuits including a single coil for wireless power transfer, inductive communications, and / or RF communications.

[0021] FIG. 14E is a diagram schematically representing another example circuit including a single coil for wireless power transfer, inductive communications, and / or RF communications.1618.327.1113

[0022] FIGS. 14F and 14G are diagrams schematically representing an example circuit including a coil for wireless power transfer and an RF antenna for RF communications.

[0023] FIG. 14H is a diagram schematically representing an example circuit including an RF antenna for RF communications.

[0024] FIG. 15A is a diagram schematically representing an example IMD including a lead including a coil.

[0025] FIG. 15B is a diagram schematically representing an example IMD including a coil and a lead.

[0026] FIG. 150 is a diagram schematically representing an example IMD including a coil within an end cap of the housing.

[0027] FIG. 15D is a diagram schematically representing an example IMD including a housing including a window and a coil adjacent to the window.

[0028] FIG. 15E is a diagram schematically representing an example IMD including an acoustic sensor.

[0029] FIG. 15F is a diagram schematically representing an example IMD including an acoustic sensor adjacent to a window.

[0030] FIGS 16A-16B are diagrams schematically representing example electrical assemblies including a power element, a coil, and a flex circuit.

[0031] FIGS. 17A-17B are diagrams schematically representing example electrical assemblies including a power element, a coil, and a printed circuit board assembly (PCBA).

[0032] FIG. 18A is a diagram schematically representing an example device including a power element, a coil, a PCBA, and a portion of a housing.

[0033] FIG. 18B is a diagram schematically representing an example device including a power element, a coil, a PCBA, a ferrite cap, and a portion of a housing.

[0034] FIG. 19 is a diagram schematically representing an example power element assembly.

[0035] FIG. 20 is a diagram schematically representing an example IMD.1618.327.1114

[0036] FIG. 21 is a diagram schematically representing an example device including a power element, a coil, a PCBA, and a frame.

[0037] FIG. 22 is a diagram schematically representing an example device including a sleeve.

[0038] FIG. 23 is a diagram schematically representing an example device including a housing.

[0039] FIG. 24 is a diagram schematically representing an example device including an inner housing and an outer housing.

[0040] FIGS. 25A-25D are diagrams schematically representing a method for fabricating an IMD.

[0041] FIGS. 26A and 26B are diagrams schematically representing another example device including a power element, a coil, and a PCBA.

[0042] FIGS. 27A-27C are diagrams schematically representing an example device including a removable and replaceable power element.

[0043] FIGS. 28A-28D are diagrams schematically representing another example device including a removable and replaceable power element.

[0044] FIGS. 29A-29D are diagrams schematically representing another example device including a power element, a coil, and a PCBA.

[0045] FIG. 29E is a diagram schematically representing another example device including a power element, a coil, and a PCBA.

[0046] FIGS. 30A-30C are diagrams schematically representing another example device including a power element, a coil, and a PCBA.

[0047] FIGS. 31 A and 31 B illustrate various views of an example electrical connector for a device.

[0048] FIGS. 32A and 32B illustrate cross-sectional views of example electrical connectors for a device.

[0049] FIGS. 33A-33D illustrate various views of an example device including an electrical connector.

[0050] FIGS. 34A-34F illustrate various views of another example device including an electrical connector.1618.327.1115

[0051] FIGS. 35A-35D illustrate various views of yet another example device including an electrical connector.

[0052] FIGS. 36A-36C illustrate cross-sectional views of yet other example electrical connectors for a device.

[0053] FIG. 37 is a flow diagram illustrating an example method for operating a device including a single coil.

[0054] FIG. 38 is a flow diagram illustrating another example method for operating a device including a single coil.

[0055] FIG. 39 is a diagram illustrating an example deployment of an IMD in a neck region.

[0056] FIGS. 40A-40D are diagrams, including side views, illustrating example IMDs for sensing and / or stimulation.

[0057] FIGS. 41 A and 41 B are block diagrams schematically representing example control portions.

[0058] FIG. 41 C is a block diagram schematically representing an example user interface.

[0059] FIG. 42 is a block diagram schematically representing example communication arrangements between an IMD and external devices.Detailed Description

[0060] In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific examples in which the disclosure may be practiced. It is to be understood that other examples may be utilized, and structural or logical changes may be made without departing from the scope of the present disclosure. The following detailed description, therefore, is not to be taken in a limiting sense. It is to be understood that features of the various examples described herein may be combined, in part or whole, with each other, unless specifically noted otherwise.1618.327.1116

[0061] Ranges can be expressed herein as from “about” one particular value, and / or to “about” another particular value. When such a range is expressed, another example includes from the one particular value and / or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about,” it will be understood that the particular value forms another example. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.

[0062] At least some examples of the present disclosure are directed to devices for diagnosis, therapy, and / or other care of medical conditions. At least some examples may include implantable devices and / or methods including use of implantable devices. However, in some examples, the methods and / or devices may include at least some external components. In some examples, a therapeutic medical device may include a combination of implantable components and external components. At least some examples include implantable medical devices including a coil, a power element, and a radio. The power element may be charged by an external charger via inductive wireless power transfer (WPT) using an inductive wireless power transfer signal received by the coil at a first frequency. The radio may transmit and receive radio frequency (RF) communication signals via the same coil at a second frequency. Therefore, a single coil within the implantable medical devices may be used for both WPT and RF communications. In some examples, the single coil within the implantable medical devices may be used for both inductive wireless communications and RF communications. By using a single coil for WPT, inductive communications, and / or RF communications, the size of the implantable medical devices may be reduced compared to implantable medical devices that use separate coils / antennas for WPT, inductive communications, and / or RF communications.

[0063] At least some of the example devices and / or example methods may relate to sleep disordered breathing (SDB) care, which may include monitoring, diagnosis, evaluation, and / or treatment, which may include stimulation in some examples. At least some examples include implantable medical devices (IMDs) including housings having shapes and features configured for fixation to specific tissues within a patient,1618.327.1117configured for ease of access and delivery, and / or configured for effective therapy (e.g., stimulation). At least some example implantable medical devices include structures and configurations within a housing of the IMDs which are conducive to reducing a size of the IMDs and / or to implementing the above-mentioned sizes and / or shapes facilitating fixation. At least some example implantable medical devices include structures and configurations regarding external surfaces of a housing of the IMDs which are conducive to delivery and / or securely fixating the housing relative to anchoring tissues. Among other target tissues for stimulation and / or sensing, at least some target tissues include tissues of the head and / or neck regions which include nerves, muscles, and / or other tissues (e.g., tendons, bones, cartilage, etc.) related to treating sleep disordered breathing such as, but not limited to, obstructive sleep apnea. These target tissues may directly or indirectly relate to promoting upper airway patency. Other target tissues also may include those tissues relating to treating pelvic disorders such as (but not limited to) treating urinary and / or fecal incontinence. In some examples, target tissues may generally comprise any peripheral nerve stimulation therapies.

[0064] These examples, and additional examples, are further described in association with at least FIGS. 1A-42.

[0065] FIG. 1A is a block diagram schematically representing an example arrangement 50 (an example device and / or example method) including an implantable medical device (IMD) 52 in operable relation to target tissue(s) 60. In some examples, the IMD 52 may include a sensing element 54, a stimulation element 56, and / or other element 58 (or function) such that the IMD 52 may be in sensing relation, stimulating relation, and / or other relation with the target tissue(s) 60.

[0066] FIG. 1 B is a block diagram schematically representing a patient’s body 100, including example target portions 110-134 at which at least some example sensing element(s), stimulation element(s), and / or other elements may be employed to implement at least some examples of the present disclosure. As shown in FIG. 1 B, the patient’s body 100 includes a head-and-neck portion 110, including head 1121618.327.1118and neck 114. Head-and-neck portion 110 includes cranial tissue, nerves, etc., and upper airway 116 (e.g., nerves, muscles, tissues), etc. which primarily extends through and within the neck 114. As further shown in FIG. 1 B, the patient’s body 100 includes a torso 120, which includes various organs, muscles, nerves, other tissues, such as but not limited to those in pectoral region 122 (e.g., lungs 126, cardiac 127), abdomen 124, and / or pelvic region 129 (e.g., urinary / bladder, anal, reproductive, etc.). As further shown in FIG. 1B, the patient’s body 100 includes limbs 130, such as arms 132 and legs 134.

[0067] It will be understood that various sensing elements and / or stimulation elements as described throughout the various examples of the present disclosure may be deployed within the various regions of the patient’s body 100 to sense and / or otherwise diagnose, monitor, treat various physiologic conditions such as, but not limited to those examples described below in association with FIGS. 2-42. In some such examples, a stimulation element 117 may be located in or near the upper airway 116 for treating sleep disordered breathing and / or near other nerves / muscles in other locations (e.g., torso, other) for treating sleep disordered breathing. In some examples, a sensing element 128 may be located anywhere within the neck 114, head 112, and / or torso 120 (or other body regions) to sense physiologic information for providing patient care (e.g., SDB, other). Sleep disordered breathing (SDB) may comprise obstructive sleep apnea (OSA), central sleep apnea (CSA), mixed sleep apnea, and / or other conditions. Moreover, in some examples regardless of their location (e.g., neck 114, torso 120, other), the stimulation element 117 and / or sensing element 128 may be used to provide patient care for other conditions, at least some of which are later identified below.

[0068] In some examples, at least a portion of the stimulation element 117 may include part of an implantable component / device (e.g., IMD or IMD portion), such as an implantable pulse generator (IPG). In some examples, the IPG may comprise a full sized IMD which is chronically implantable in the torso 120 (e.g., pectoral region 122) but otherwise generally considered too large for implantation in the head-and-neck region 110. In some examples, the IPG may comprise a smaller sized IPG1618.327.1119which is sized and shaped to be chronically implanted in the head-and-neck region 110 or neck region 114 alone, such as in locations, spaces, etc. in which a full sized IPG would not reasonably fit. In some examples in which the IMD (e.g., IPG) is generally chronically implanted in the neck region 114, a portion of the IPG or the entire IPG may be chronically implanted at a transition of a lower portion of the neck 114 and an upper portion of the torso 120, such as (but not limited to) at or near a clavicle, manubrium, sternum, etc. In some examples, the “smaller sized” IPG may sometimes be referred to as a microstimulator.

[0069] In some examples, the neck 114 may comprise submandibular locations in an anterior cervical region and includes locations superior to the clavicle. However, as noted above, in some examples, the neck 114 may comprise locations at or near transitions of the lower portion of the neck 114 and the upper portion of the torso 120.

[0070] The implantable components (e.g., IPG, other) may include a stimulation / control circuit, a power supply (e.g., non-rechargeable, rechargeable), communication elements, and / or other components. In some examples, the stimulation element 117 may also include a stimulation electrode and / or stimulation lead connected to the implantable pulse generator.

[0071] Further details regarding the location, structure, operation, and / or use of the sensing element 128, external element(s) 150, and / or stimulation element 117 are described below in association with FIGS. 10-42.

[0072] In some examples, at least a portion of the stimulation element 117 may include part of an external component / device such as, but not limited to, the external component including a pulse generator (e.g., stimulation / control circuitry), power supply (e.g., rechargeable, non-rechargeable), and / or other components. In some examples, a portion of the stimulation element 117 may be implantable and a portion of the stimulation element 117 may be external to the patient.

[0073] Accordingly, as further shown in FIG. 1 B, the various sensing element(s) 128 and / or stimulation element(s) 117 implanted in the patient’s body may be in1618.327.11110wireless communication (e.g., connection 137) with at least one external element 150.

[0074] As further shown in FIG. 1 B, in some examples, the external element(s) 150 may be implemented via a wide variety of formats such as, but not limited to, at least one of the formats 151 including a patient support 152 (e.g., bed, chair, sleep mat, other), wearable elements 154 (e.g., finger, wrist, head, neck, shirt), noncontact elements 156 (e.g., watch, camera, mobile device, other), and / or other elements 158.

[0075] As further shown in FIG. 1 B, in some examples, the external element(s) 150 may include one or more different modalities 170 such as (but not limited to) a sensing portion 171 , stimulation portion 172, power portion 174, communication portion 176, and / or other portion 178. The different portions 171 , 172, 174, 176, 178 may be combined into a single physical structure (e.g., package, arrangement, assembly), may be implemented in multiple different physical structures, and / or with just some of the different portions 171, 172, 174, 176, 178 combined together in a single physical structure.

[0076] In some examples, the external stimulation portion 172 and / or implantable portions of stimulation element 117 may include at least some of substantially the same features and attributes of at least the stimulation arrangements, as further described below in association with at least FIGS. 8A-8D and 39-42 and / or other examples throughout the present disclosure.

[0077] In some examples, the external power portion 174 and / or power components associated with stimulation element 117 (e.g., implantable portions) may include at least some of substantially the same features and attributes of at least the stimulation arrangements, as further described throughout the examples of the present disclosure. In some such examples, the respective power portion, components, etc. may include a rechargeable power element (e.g., supply, battery, circuitry elements) and / or non-rechargeable power elements (e.g., battery). In some examples, the external power portion 174 may include a power source by which a1618.327.11111power component of the stimulation element 117 (e.g., implantable portions) may be recharged.

[0078] In some examples, the implantable components of (and / or associated with) stimulation element 117 which comprise power elements may receive power from (or via) external power portion 174 of external element 150 but not store the received power. Instead, the received power may be used immediately (or with minor delay) as part of transmitting a stimulation signal (received from or via stimulation portion 172) via stimulation element 117 to target tissues within the patient’s body.

[0079] In some examples, the wireless communication portion 176 (e.g., connection / link at 137) may be implemented via various forms of radio frequency communication and / or other forms of wireless communication, such as (but not limited to) magnetic induction telemetry, Bluetooth (BT), Bluetooth Low Energy (BLE), near infrared (NIF), near-field protocols, Wi-Fi, Ultra-Wideband (UWB), ultrasonic waves, and / or other short range or long range wireless communication protocols suitable for use in communicating between implanted components and external components in a medical device environment.

[0080] Examples are not so limited as expressed by other portion 178 via which other aspects of implementing medical care may be embodied in external element(s) 150 to relate to the various implanted and / or external components described above.

[0081] FIG. 1C schematically represents a control portion 190, which may include at least some of substantially the same features and attributes as the control portion 3500 in FIG. 41 A described below. The control portion 190 may be used to implement at least some of the various example devices and / or example methods of the present disclosure as described herein. In some examples, the control portion 190 may form part of, and / or be in communication with, the sensing element 128 and / or the stimulation element 117 in FIG. 1 B, external element(s) 150, and / or other medical device (or portions thereof), as further described below.

[0082] In some examples, the example devices (e.g., elements, components, portions, etc.) and / or example methods of FIGS. 1A-10 may be implemented via, and / or comprise at least some of substantially the same features as, the example1618.327.11112devices and / or example methods further described below in association with at least FIGS. 2-42.

[0083] In some examples, an inductor configured as a coil may be used as an antenna for transferring power in association with power portion 174 of FIG. 1B and / or for transferring communications in association with communication portion 176 of FIG. 1B. With this in mind, FIG. 2 is a graph 300 illustrating impedance (in ohms) versus frequency (in hertz) for an ideal inductor and a typical inductor. As shown in graph 300, for an ideal inductor as indicated at 302, the impedance linearly increases from a lower impedance to a higher impedance as the frequency increases from a lower frequency to a higher frequency. In contrast, for a typical inductor as indicated at 304, at lower frequencies (e.g., below about 109hertz in this example), the impedance of the typical inductor closely follows the impedance of an ideal inductor. As the frequency increases, intrinsic capacitance across the windings of the typical inductor becomes more impactful and the impedance of the typical inductor increases rapidly until the impedance reaches a peak, as indicated at 306, which is the self-resonance frequency. At frequencies above the self-resonance frequency, intrinsic capacitance of the typical inductor becomes dominant, and the impedance decreases as the frequency increases.

[0084] As disclosed herein with reference to FIGS. 3-42, an inductor configured as a coil may be used as an antenna for wireless power transfer (WPT), inductive communications (e.g., inductive telemetry), and / or radio frequency (RF) communications (e.g., RF telemetry). The coil may be used for inductive wireless power transfer and / or inductive communications at a first frequency at or below the self-resonance frequency 306 as indicated at 308. The same coil may be used as an antenna for RF communications at a second frequency above the self-resonance frequency 306 as indicated at 310. In some examples, the second frequency may be greater than at least ten times the first frequency. In some examples, the coil may be used for inductive wireless power transfer and / or inductive communications at a first frequency within a range, for example, between about 9 kilohertz and about 50 megahertz, such as 6.78 megahertz or 13.56 megahertz. In some examples, the1618.327.11113same coil may be used for RF communications at a second frequency within a range, for example, between about 100 megahertz and about 5 gigahertz, such as 400 megahertz or 2.4 gigahertz.

[0085] FIG. 3 is a diagram illustrating an example coil 350 that may be used for wireless power transfer, inductive communications, and / or RF communications. A cross-section of the coil 350 may include a diameter or width as indicated at 352 within a range, for example, between about 0.2 centimeters and about 4 centimeters, such as 1 centimeter. In some examples, the cross-section of the coil 350 may be variable such that coil 350 has a conical, bowtie, or other shape (e.g., as described below with reference to FIGS. 11A-11C). The coil 350 may include a length as indicated at 354 within a range, for example, between about 0.4 centimeters and about 8 centimeters, such as 1 centimeter. The coil 350 may include any suitable electrically conductive material, such as, but not limited to, copper, aluminum, or another suitable material. In some examples, the coil 350 may include litz wire. Litz wire may be used when the wireless power transfer frequency is less than about 30 megahertz. The coil 350 may include a wire within a range, for example, between about 10 American wire gauge (AWG) and about 50 AWG, such as 24 AWG. The coil 350 may include a number of windings as indicated at 353 within a range, for example, between about 4 windings and about 200 windings, such as 19 windings. A pitch as indicated at 356 between the windings 353 of the coil 350 may be within a range, for example, between about 0.05 millimeters and about 5 millimeters, such as about 0.2 millimeters. In some examples, the pitch 356 may be variable to optimize the impedance versus frequency behavior of the coil 350 for the selected inductive wireless power transfer and RF communications frequencies. An intrinsic capacitance as indicated at 358 between the windings 353 of the coil 350 may be within a range, for example, between about 10 femtofarads and about 100 picofarads, such as 100 femtofarads. While coil 350 includes a circular cross-sectional shape (e.g., through the diameter or width 352) in the example of FIG. 3, in some examples coil 350 may include another suitable cross-sectional shape, such as elliptical, rectangular (e.g., see FIG. 4), etc. In some examples, coil 350 may1618.327.11114conform (e.g., curve, change shape along its length, etc.) to a shape of a device (e.g., IMD).

[0086] To optimize wireless power transmission performance, the cross-sectional area of the coil 350 may be maximized within the constraints of the device form factor and packaging considerations. To increase the intrinsic capacitance 358, the pitch 356 between windings 353 may be reduced, such as by using a thinner wire insulation, a higher dielectric insulation material, a thicker wire, and / or a reduced gap between windings 353. For acceptable RF communications performance, the length 354 of the coil 350 should be greater than one-tenth of the wavelength at the operating frequency. The wavelength at the operating frequency may be defined in air or using the average electrical parameters of surrounding tissues around an IMD or using the tissue with the highest dielectric constant surrounding the IMD.

[0087] FIG. 4 is a diagram illustrating another example coil 400 that may be used for wireless power transfer (e.g., inductive wireless power transfer), inductive communications, and / or RF communications. A capacitor 402 (e.g., shunt capacitor) may be electrically coupled in parallel with the coil 400 to tune the coil to the first frequency (e.g., an inductive WPT and / or inductive communications frequency), such as 6.78 megahertz or 13.56 megahertz, in some examples. A wire section 406 may extend across the coil 400 to electrically connect the two ends of the coil. The wire section 406 enables coil 400 to operate at the first frequency for WPT and / or inductive communications. In some examples, the wire section 406 may be replaced by printed circuit board (PCB) traces (e.g., of a printed circuit board assembly (PCBA) as described below with reference to at least FIGS. 9A-9B, 17-18B, 21 , and 26A) or feedthrough pins connected to electrical circuitry. For RF communications, the wire section 406 is not needed. Accordingly, a switch 408 may be used to connect the wire section 406 to enable the coil 400 to operate at the first frequency for WPT and / or inductive communications and disconnect the wire section 406 to operate the coil 400 at the second frequency for RF communications. While coil 400 has a rectangular cross-sectional shape in the example of FIG. 4, in some examples, coil 400 may have another suitable cross-sectional shape, such as circular (e.g., coil1618.327.11115350 of FIG. 3), elliptical, or shaped as described below with reference to FIGS. 11 A-110.

[0088] FIG. 5 is a diagram schematically representing an example device 420 including an enclosure 422 and a coil 400 configured for inductive WPT and / or inductive communications. At lower first frequencies (e.g., between about 40 kilohertz and about 50 megahertz) for inductive WPT and / or inductive communications, the capacitance between adjacent windings of the coil 400 is negligible, and a current (IWPT) as indicated at 424 flows inside the wire / windings. The enclosure 422 may be a power element (e.g., battery) enclosure or a portion of a housing of the device 420 (e.g., power element 706 enclosure or housing 902 of FIGS. 9A and 9B described below).

[0089] FIG. 6 is a diagram schematically representing the example device 420 of FIG. 5 configured for RF communications. At higher second frequencies (e.g., greater than about 100 megahertz) for RF communications, the capacitance between adjacent windings becomes significant enough, and a current (IRF) as indicated at 426 flows through the capacitance between windings such that the coil 400 appears like a surface to the RF currents following the envelope of the coil as illustrated in FIG. 6. In this example, the coil 400 may form a primary section of an RF antenna and the enclosure 422 may form a secondary section of the RF antenna. In some examples, the secondary section of the RF antenna provided by the enclosure 422 (or at least a portion of the enclosure) may provide an RF reference or ground. The shape and dimensions of the RF reference / g round (e.g., secondary section of the RF antenna) may be different compared to the shape and dimensions of the coil 400 (e.g., primary section of the RF antenna). In some examples, the RF reference / g round may be planar and may be implemented within a layer of a multilayer printed circuit board (PCB) (e.g., of a printed circuit board assembly (PCBA) as described below with reference to at least FIGS. 9A-9B and 26A), one or more surfaces of a housing enclosure (e.g., of a device as described below with reference to at least FIGS. 7A-10C and 15A-30C), or one or more surfaces of a power element (e.g., as described below with reference to at least FIGS. 9A-10C and 17A-30C).1618.327.11116

[0090] FIG. 7A is a diagram schematically representing an example device 700a including a single coil for wireless power transfer and RF communications. In some examples, the device 700a may include an example implementation of, and / or at least some of substantially the same features as the example devices (e.g., elements, components, portions, etc.) and / or example methods of FIGS. 1A-1C and / or the example coils of FIGS. 3-6.

[0091] Device 700a includes a housing 702 enclosing a coil 704, a power element 706, and a radio 708. The coil 704 may be configured to receive an inductive WPT signal to supply power (e.g., for immediate use and / or for charging) to the power element 706 and to transmit and receive RF communication signals for the radio 708. In some examples, device 700a may be configured such that coil 704 may receive the inductive WPT signal during a first period and transmit and / or receive the RF communication signals during a second period separate from the first period (e.g., the first period does not overlap the second period). In some examples, device 700a may be configured such that coil 704 may receive the inductive WPT signal and the RF communication signals simultaneously. The coil 704 may include coil 350 of FIG. 3 or coil 400 of FIG. 4 or any of coils 905, 1000, 1010, 1020, 1200, 1804, 1805, 1904, 2104, and 2105 described below with reference to at least FIGS. 9A-10B, 11 A-13H, 15A-15D, 16A-18B, 21 , 26A, 28A, 29A, 29E, and 30A.

[0092] The power element 706 may be a liquid electrolyte battery (e.g., lithium-ion battery), a solid-state battery, a supercapacitor, or other suitable component configured to store energy that may be used to power the device 700a. In some examples, the solid-state battery may include a thin-film solid-state electrolyte, such as (but not limited to) a lithium phosphorus oxynitride (LiPON) material.

[0093] The time required to recharge the power element 706 of the device 700a is based upon the power element technology. For example, given a supercapacitor, a solid-state battery, and a liquid electrolyte battery each having the same energy capacity, in some examples the supercapacitor may be recharged from a 10 percent charge to a 90 percent charge faster than the solid-state battery, and the solid-state battery may be recharged from a 10 percent charge to a 90 percent charge faster1618.327.11117than the liquid electrolyte battery. For example, when a supercapacitor is used as the power element 706, the device 700a may be rapidly recharged from an about 10 percent charge to an about 90 percent charge by an external charger (e.g., 3670 of FIG. 42) in under about 90 seconds for example. When a solid-state battery is used as the power element 706, the device 700a may be quickly recharged from an about 10 percent charge to an about 90 percent charge by an external charger in under about 10 minutes for example. When a liquid electrolyte battery is used as the power element 706, the device 700a may be recharged from an about 10 percent charge to an about 90 percent charge by an external charger in about 20 to 30 minutes for example.

[0094] In examples in which a solid-state battery is used as the power element 706, the power element 706 and thus the device 700a may be made smaller since solid state batteries are more energy dense than supercapacitors and liquid electrolyte batteries. Supercapacitors and solid-state batteries are safer than liquid electrolyte batteries, since there is little risk of a liquid electrolyte leaking and the risk of fire may be reduced. Supercapacitors can withstand more charge and discharge cycles (e.g., hundreds of thousands) than solid state batteries before degrading (e.g., storing less energy), and solid-state batteries can withstand more charge and discharge cycles (e.g., about 5000) than liquid electrolyte batteries (e.g., about 1000) before degrading. Supercapacitors have an additional benefit over both solid-state batteries and liquid electrolyte batteries in that supercapacitors do not contain any toxic metals (e.g., lithium) that may involve more special handling, sealing, etc. to permit use within a patient. In some examples, the power element 706 may include two or more power storage technologies, such as a supercapacitor paired with a solid-state battery.

[0095] Radio 708 includes a transmitter and a receiver to transmit and receive RF communication signals using coil 704 as an antenna. Radio 708 may transmit and receive RF communication signals between the device 700a (e.g., as an example of medical device 3610 of FIG. 42) and another device, such as a mobile device 3620, a remote control 3640, a clinician programmer 3650, a patient management tool1618.327.111183660, or an external charger 3670 described below with reference to at least FIG.42. In some examples, radio 708 is a Bluetooth (BT) radio, a Bluetooth Low Energy (BLE) radio, a Wi-Fi radio, an Ultra-Wideband (UWB) radio, or another suitable RF radio.

[0096] FIG. 7B is a diagram schematically representing another example device 700b including a single coil for wireless power transfer and RF communications. Device 700b is similar to device 700a previously described and illustrated with reference to FIG. 7A, except that in addition to coil 704, power element 706, and radio 708, device 700b further includes a first circuit 710 and a second circuit 712. The first circuit 710 is electrically coupled between the coil 704 and the power element 706. The second circuit 712 is electrically coupled between the coil 704 and the radio 708.

[0097] The first circuit 710 connected between the coil 704 and the power element 706 may supply power to the power element 706 using an inductive wireless power transfer (WPT) signal received by the coil 704 at a first frequency (e.g., between 9 kilohertz and 50 megahertz). The WPT signal received by the coil 704 may be transmitted from a non-contact charger, such as external charger 3670 of FIG. 42. In some examples as further described below with reference to at least FIGS. 14A-14E, the first circuit 710 may include a capacitor (e.g., 402 of FIG. 4) to tune the coil 704 to the first frequency, a rectifier coupled in parallel with the capacitor to rectify the inductive WPT signal to generate a rectified signal, and a regulator to regulate the rectified signal to supply power to the power element 706. In some examples as further described below with reference to at least FIG. 14E, the first circuit 710 may include a first filter (e.g., low pass, band pass) to pass the inductive WPT signal received by the coil 704 at the first frequency and block the RF communication signals received by the coil 704 at the second frequency.

[0098] The second circuit 712 connected between the coil 704 and the radio 708 may be used to transmit and receive RF communications via the coil 704 at a second frequency (e.g., greater than 100 megahertz). In some examples as further described below with reference to at least FIGS. 14A-14E, the second circuit 7121618.327.11119may include an impedance matching circuit. In some examples as further described below with reference to at least FIG. 14E, the second circuit 712 may include a second filter (e.g., high pass, band pass) to pass the RF communication signals received by the coil 704 at the second frequency and block the inductive WPT signal received by the coil 704 at the first frequency.

[0099] FIG. 70 is a diagram schematically representing another example device 700c including a single coil for inductive communications and RF communications. Device 700c includes a coil 704 and a radio 708 as previously described and illustrated with reference to FIGS. 7A and 7B. In addition, device 700c includes a control portion 720 enclosed within the housing 702. Control portion 720 may include a transmitter 722 to transmit inductive communications via the coil 704 and a receiver 724 to receive communications via the coil 704. In some examples, transmitter 722 may be excluded such that control portion 720 may receive inductive communications via receiver 724 but cannot transmit inductive communications. In the example of FIG. 7C, the coil 704 may be configured to transmit and / or receive inductive communication signals for the control portion 720 and transmit and / or receive RF communication signals for the radio 708.

[0100] In some examples, the inductive communication signals may include security and / or key exchanges for pairing the radio 708 to a further device, such as a mobile device 3620, a remote control 3640, a clinician programmer 3650, a patient management tool 3660, or an external charger 3670 described below with reference to at least FIG. 42. In some examples, the inductive communication signals include device 700c wake-up communications, shipping mode enable and / or disable communications, therapy enable and / or disable communications, Bluetooth low energy (BLE) functionality enable communications, rapid advertisement communications, and / or other suitable communications. Accordingly, the inductive communications may be used for a first type of communications, while the RF communications may be used for a second type of communications different from the first type.1618.327.11120

[0101] In some examples, device 700c may further include a power element (e.g., 706) as previously described and illustrated with reference to FIGS. 7A and 7B or a primary cell battery to power the control portion 720 and the radio 708. In these examples, the power element may be charged using an inductive WPT signal received by the coil 704 as previously described.

[0102] FIG. 8A is a diagram schematically representing an example implantable medical device (IMD) 800a including a single coil for wireless power transfer, inductive communications, and / or RF communications. IMD 800a includes a housing 802 enclosing a coil 704, a power element 706, a radio 708, a stimulation element 802, and a control portion 820. The coil 704 may be configured to receive an inductive WPT signal to supply power (e.g., for immediate use and / or for charging) to the power element 706 as previously described, transmit and / or receive inductive communication signals for the control portion 820 (e.g., similarly as described for control portion 720 of FIG. 7C), and transmit and receive RF communication signals for the radio 708 as previously described. In some examples, IMD 800a may be configured such that coil 704 may receive the inductive WPT signal and / or inductive communication signals during a first period and transmit and / or receive the RF communication signals during a second period separate from the first period (e.g., the first period does not overlap the second period). In some examples, device 800a may be configured such that coil 704 may receive the inductive WPT signal and / or the inductive communication signals and the RF communication signals simultaneously.

[0103] In some examples, via the stimulation element 804, the IMD 800a may be used to apply electrical stimulation to respiratory-related tissue, such as (but not limited to) an upper airway patency-related tissue of a patient, to treat sleep disordered breathing (SDB) conditions. In some examples, the IMD 800a may be used to apply electrical stimulation to other tissues (e.g., pelvic, spinal) of a patient to treat other conditions (e.g., urinary and / or fecal incontinence). The simulation element 804 may include stimulation circuitry and / or at least one stimulation electrode to apply electrical stimulation to a patient. The stimulation element 8041618.327.11121receives power from the power element 706 and / or control signals from the control portion 820. In some examples, the control portion 820 may control the delivery of power from the power element 706 to the stimulation element 804. The electrical stimulation may be applied via at least one electrode of the stimulation element 804 or electrically coupled to the stimulation element 804. In some examples, at least one electrode (not shown) may be arranged on the housing 802 (e.g., see electrodes 3295 on housing 3225 of FIG. 40D described below), or as further described below with reference to at least FIG. 39, at least one electrode 3230 may be arranged on a lead 3224 electrically coupled to the stimulation element 804.

[0104] The control portion 820 may control the coil 704, the power element 706, the radio 708, the stimulation element 804, and other circuitry (not shown) of the IMD 800a. In some examples, the control portion 820 may implement aspects of the example methods described below with reference to at least FIGS. 37 and 38. The control portion 820 may include a central processing unit (CPU), a microcontroller, an application specific integrated circuit (ASIC), and / or other suitable logic circuitry. At least some example implementations of the control portion 820 are further described below with reference to at least FIGS. 41 A and 41 B.

[0105] The control portion 820 may include a therapy manager arranged to control the stimulation element 804 based on at least control information to apply electrical stimulation to a patient. In some examples, the therapy manager may be arranged to control (e.g., based on control information) the stimulation element 804 to apply electrical stimulation to respiratory-related tissue (e.g., upper airway patency-related tissue) to treat sleep disordered breathing (SDB) conditions or to apply electrical stimulation to other tissues, as noted above.

[0106] It will be further understood that in some examples, at least some aspects or elements of the control portion 820 may form part of, and / or be distributed among, the other components (e.g., power element 706, radio 708, other) of the IMD 800a such that control portion 820 does not necessarily form a component of the IMD 800a separate from those other elements (e.g., power element 706, radio 708, etc.).1618.327.11122

[0107] In some examples, the housing 802 encloses the coil 704, the power element 706, the radio 708, at least a portion (e.g., at least stimulation circuitry) of the stimulation element 804, and the control portion 820. In some examples, housing 802 may encapsulate (e.g., overmold) the coil 704, the power element 706, the radio 708, at least a portion (e.g., at least stimulation circuitry) of the stimulation element 804, and the control portion 820 to hermetically seal the coil 704, the power element 706, the radio 708, at least a portion (e.g., at least stimulation circuitry) of the stimulation element 804, and the control portion 820. As further described below with reference to at least FIGS. 15A-15D, 18A-20, 22-25D, 26B-27C, and 28B-28D, housing 802 may include any suitable biocompatible material, such as a metal (e.g., titanium, stainless steel, MP35N), a thermoplastic polymer (e.g., silicone, polysulfone), a thermoset material, a blend polymer material (e.g., polyetheretherketone (PEEK)), a ceramic material (e.g., glass, alumina oxide, zirconia, etc.), or a combination thereof. Different portions of the housing 802 may be made of different materials. For example, a first portion of the housing 802 may be made of a metal (e.g., titanium) while a second portion of the housing where the coil 704 is arranged may be made of a nonconductive material (e.g., PEEK).

[0108] In some examples, the IMD 800a may comprise a first size configured to be implanted within a head-and-neck region in some examples, and in neck 114 (FIG.1 B) in some examples. Whether comprising the first size or a larger size, the IMD 800a may also be implantable within other regions of the patient, such as within a torso, pelvic region, etc. Regardless of being the first size or a larger size, the IMD 800a may include the housing 802 to encapsulate (e.g., hermetically seal) the coil 704, the power element 706, the radio 708, at least a portion (e.g., stimulation circuitry) of the stimulation element 804, and the control portion 820. In some examples, the IMD 800a comprising the first size may sometimes be referred to as a microstimulator. In some examples, the IMD 800a comprising the first size may be configured in a first shape adapted for implantation in the neck 114, which may comprise an anterior cervical portion of the neck in some examples.1618.327.11123

[0109] FIG. 8B is a diagram schematically representing an example implantable medical device (IMD) 800b including a single coil for wireless power transfer, inductive communications, and / or RF communications. IMD 800b includes a housing 802 enclosing a coil 704, a power element 706, a radio 708, a sensing element 806, and a control portion 820. In this example, the control portion 820 may include a sensing manager arranged to control the sensing element 806 based on at least control information to obtain sensing information (e.g., physiologic information) for a patient. The sensing element 806 may include sensors (e.g., accelerometer, gyroscope, piezoelectric sensor, acoustic sensor, microphone, temperature sensor, and / or pressure sensor, etc.) and / or other suitable circuitry for obtaining sensing information for a patient. The sensing information (e.g., sensed physiologic information) may include respiratory information, cardiac information, activity information, motion information, posture information, and / or other information about the patient.

[0110] In some examples, the sensing element 806 may sense information of a patient via at least one electrode electrically coupled to the sensing element 806. In some examples, at least one electrode (not shown) may be arranged on the housing 802 (e.g., see electrodes 3295 on housing 3225 of FIG. 40D described below), or as further described below with reference to at least FIG. 39, at least one electrode 3230 may be arranged on a lead 3224 electrically coupled to the sensing element 806. In some examples in which a sensing element includes at least one electrode, the at least one electrode also may, at times, be used for stimulation and / or comprise a portion of the stimulation element 804 of FIG. 8C described below. In some examples, the sensing element 806 (e.g., accelerometer, acoustic sensor, other) may be located within the housing 802 of IMD 800b, on the housing 802, and / or external to the housing 802. In some examples, the sensing element 806 may comprise both an electrode as previously described and a non-electrode sensing component (e.g., accelerometer, acoustic sensor, other).

[0111] FIG. 8C is a diagram schematically representing an example implantable medical device (IMD) 800c including a single coil for wireless power transfer,1618.327.11124inductive communications, and / or RF communications. IMD 800c includes a housing 802 enclosing a coil 704, a power element 706, a radio 708, a stimulation element 804, a sensing element 806, and a control portion 820. In this example, the sensing element 806 is included along with the stimulation element 804 within a single IMD 800c. The sensed information may be used to initiate, terminate, pause, synchronize, and / or trigger therapy to be applied via the IMD 800c and / or external therapy elements. In some examples, the sensed information may be used as feedback for controlling therapy (e.g., stimulation therapy), such as closed loop therapy. The sensed information also may be used for diagnostic purposes and / or for monitoring (and / or evaluation of) a particular physiologic effect, physiologic response, etc. regardless of whether the sensed information is used for other purposes (e.g., therapy). In some such examples, the sensed information may be used to evaluate open loop therapy (e.g., stimulation) which does not include a feedback loop to initiate, terminate, pause, synchronize, and / or trigger delivery of therapy relative to sensed respiratory information and / or relative to disease burden. However, in some examples, the sensed information may be used to evaluate and adjust open loop stimulation therapy such as via a feedback loop to initiate, terminate, pause, synchronize, and / or trigger delivery of therapy based on a sensed disease burden but without synchronizing or triggering the stimulation therapy relative to sensed respiratory phase information. In some examples associated with FIG. 8C, a first element (e.g., electrode) may serve as both at least a portion of the sensing element 806 and at least a portion of the stimulation element 804.

[0112] FIG. 8D is a diagram schematically representing an example implantable medical device (IMD) 800d including a single coil for wireless power transfer, inductive communications, and / or RF communications. IMD 800d includes a housing 802 enclosing a coil 704, a radio 708, and a control portion 820. In some examples, IMD 800d may further include a stimulation element 804 and / or a sensing element 806. Notably absent in IMD 800d is a power element 706. Accordingly, in this example, IMD 800d may be powered (e.g., active) while receiving a WPT signal via coil 704 and not powered (e.g., inactive) when a WPT signal is not being received1618.327.11125via coil 704. In some examples, the WPT signal may be provided by an external power transfer device, such as external charger 3670 of FIG. 42. Accordingly, the IMD 800d does not store power such that received power may be used immediately (or with minor delay) as part of applying a stimulation signal via stimulation element 804 to target tissues within the patient’s body, sensing a sensor signal via sensing element 806, and / or transmitting and / or receiving inductive and / or RF communication signals via control portion 820 and / or radio 708, respectively.

[0113] In some examples, an IMD may include any one of various combinations of the above-described elements (e.g., stimulation, sensing, power, communication, control) of the respective IMDs described in association with FIGS. 8A-8D and / or FIGS. 1 A-1 C. At least some of these various combinations regarding FIGS. 1 A-1 C and 8A-8D are also applicable to the various later described examples associated with FIGS. 9A-42.

[0114] FIG. 9A is a diagram schematically representing an example IMD 900a including a first (e.g., power element) housing 902 and a second (e.g., coil and / or printed circuit board assembly (PCBA)) housing 904. In some examples, IMD 900a may include at least some of substantially the same features and attributes as IMDs 800a-800c of FIGS. 8A-8O. IMD 900a includes a power element 706, a coil 905, and at least one PCBA 906a, 906b, and / or 906c. In some examples, the at least one PCBA includes the radio 708, first circuit 710, second circuit 712, control portion 720 or 820, at least stimulation circuitry of stimulation element 804, and / or at least sensing circuitry of sensing element 806 as previously described and illustrated with reference to FIGS. 7A-8D. In some examples, coil 905 may include at least some of substantially the same features and attributes as coil 350 of FIG. 3, 400 of FIG. 4, or 704 of FIGS. 7A-8D. The first housing 902 encloses the power element 706 and / or PCBA 906b and / or PCBA 906c, and the second housing 904 encloses the coil 905 and / or PCBA 906a.

[0115] In some examples, IMD 900a may include a PCBA 906a arranged inside the coil 905 (e.g., inside a generally cylindrically-shaped lumen defined by the coil windings), such that the coil 905 at least partially surrounds or is wrapped around at1618.327.11126least a portion of the PCBA 906a. In some examples, the coil may be wrapped around or integrated into a support structure (e.g., polymer structure) that supports (e.g., holds, stabilizes) an internal electrical assembly of IMD 900a including the power element 706, a PCBA 906a, 906b and / or 906c, and coil 905. By arranging PCBA 906a inside the coil 905, the IMD 900a may have a more compact size compared to an IMD where the PCBA is not arranged within the coil. In some examples, IMD 900a may include a PCBA 906b between the coil 905 and the power element 706. PCBA 906b may have a different orientation to coil 905 and / or power element 706. For example, PCBA 906a may be arranged parallel to coil 905 and / or power element 706, while PCBA 906b may be arranged perpendicular to coil 905 and / or power element 706. While PCBA 906b is illustrated as being within first housing 902, in some examples PCBA 906b may be included within second housing 904. In some examples, IMD 900a may include a PCBA 906c within the first housing 902. PCBA 906c may be arranged parallel to power element 706.

[0116] In some examples, first housing 902 may encapsulate (e.g., overmold) the power element 706 and PCBA 906b and / or PCBA 906c to hermetically seal the power element 706 and PCBA 906b and / or PCBA 906c. Second housing 904 may encapsulate (e.g., overmold) the coil 905 and / or PCBA 906a to hermitically seal the coil 905 and / or PCBA 906a. The first housing 902 may be coupled to the second housing 904 to hermetically seal the first housing 902 to the second housing 904. As further described below with reference to at least FIGS. 15A-15D, 18A-20, 22-25D, 26B-27C, and 28B-28D, first housing 902 and second housing 904 may include any suitable biocompatible material, such as a metal (e.g., titanium, stainless steel, MP35N), a thermoplastic polymer (e.g., silicone, polysulfone, polyoxidemethylene, polypropylene, polycarbonate), a thermoset material (e.g., epoxy), a blend polymer material (e.g., polyetheretherketone (PEEK)), a ceramic material (e.g., glass, alumina oxide, zirconia, etc.), a liquid-crystal polymer (LCP), or a combination thereof. First housing 902 and second housing 904 may be made of different materials. For example, first housing 902 may be made of a metal (e.g., titanium) while second housing 904 may be made of a nonconductive material (e.g., PEEK).1618.327.11127

[0117] FIG. 9B is a diagram schematically representing an example IMD 900b including a first housing 902 and a second housing 904. IMD 900b is similar to IMD 900a previously described and illustrated with reference to FIG. 9A, except that in IMD 900b, a ferrite sheet 908a, 908b, and / or 908c surrounds the PCBA 906a, 906b, and / or 906c, respectively. Each ferrite sheet 908a, 908b, and / or 908c may cover the respective electrical components (e.g., semiconductor dies, passive components, traces, etc.) of the respective PCBA to shield the electrical components from electromagnetic interference (e.g., due to coil 905, power element 706, and / or external sources).

[0118] FIG. 9C is a diagram schematically representing an example internal electrical assembly 910a for an IMD, such as IMD 900a or 900b of FIGS. 9A and 9B. Electrical assembly 910a includes a PCBA 906a, a ferrite sheet 908a, a coil 905, and a frame 912a. The coil 905 is wrapped around the outer surface of the frame 912a to provide structural integrity for the coil. The coil 905 may be tightly wound such that adjacent windings contact each other or wound with separation between adjacent windings. The PCBA 906a is within and supported by the frame 912a. The ferrite sheet 908a (e.g., a ferrite tape) is arranged on the inner surface of the frame 912a. The ferrite sheet 908a may shield PCBA 906a from electromagnetic interference (e.g., due to coil 905, a power element, and / or external sources). In some examples, the ferrite sheet 908a may be excluded. In some examples, the frame 912a includes sidewalls extending between opposing flanges 914a. The sidewalls of the frame 912a may have rounded corners 916a on the outer surface on which coil 905 is wound and on the inner surface on which ferrite sheet 908a is arranged. While frame 912a has a substantially square shape in the example of FIG.9C, in some examples frame 912a may have another suitable shape, such as rectangular, circular, elliptical, etc. The electrical assembly 910a may be placed in a housing, such as housing 902 or 904 of FIGS. 9A and 9B.

[0119] Alternatively, in some examples the ferrite sheet 908a may be combined with the frame 912a to provide a ferrite frame. The ferrite frame 912a may be constructed using a composite material of injection-moldable thermoplastic and1618.327.11128ferrite nanoparticles. The nanoparticles may be constructed from manganese-zinc, nickel-zinc, cobalt, or a combination thereof. The thermoplastic may be polypropylene (PP), polyethylene (PE), polycarbonate (PC), polyetheretherketone (PEEK), or liquid crystal polymer (LCP). The ferrite frame may be constructed by premixing or stirring the nanoparticles into melted thermoplastic material to homogenously disperse the nanoparticles throughout the thermoplastic, or the nanoparticles may be mixed at the point of injection molding of the ferrite frame.

[0120] FIG. 10A is a diagram schematically representing an example portion of an IMD 920a including a power element 706. In some examples, IMD 920a may include at least some of substantially the same features and attributes as IMDs 800a-800c of FIGS. 8A-8C and / or 900a-900b of FIGS. 9A-9B. IMD 920a includes a housing 922, a power element 706, and a coil 905. In this example, the coil 905 is wrapped around the power element 706 (e.g., at least partially surrounding the power element 706 or wrapped around at least a portion of the power element 706). In some examples, the coil 905 may be integrated into the housing 922, such that the coil is wrapped around the power element 706 but does not use any internal space within the housing 922, which may enable a smaller housing 922. By arranging the power element 706 inside the coil 905, the IMD 920a may have a more compact size compared to an IMD where the power element is not arranged within the coil. Housing 922 may include any suitable biocompatible material, such as a thermoplastic polymer (e.g., silicone, polysulfone), a thermoset material, a blend polymer material (e.g., polyetheretherketone (PEEK)), a ceramic material (e.g., glass, alumina oxide, zirconia, etc.), or a combination thereof. While not shown in FIG. 10A, it will be apparent that IMD 920a may also include at least one PCBA (e.g., PCBA 906a, 906b and / or 906c of FIGS. 9A and 9B) for other components (e.g., radio 708, control portion 820, stimulation element 804, sensing element 806, etc.).

[0121] FIG. 10B is a diagram schematically representing another example portion of an IMD 920b including a power element 706. IMD 920b is similar to IMD 920a previously described and illustrated with reference to FIG. 10A including the coil 905 wrapped around the power element 706 within the housing 922. IMD 920b, however,1618.327.11129further includes a ferrite sheet 924 surrounding (e.g., covering) the power element 706 such that the ferrite sheet 924 is between the coil 905 and the power element 706. By wrapping the power element 706 with the ferrite sheet 924, WPT efficiency may be improved.

[0122] FIG. 10C is a diagram schematically representing another example portion of an IMD 920c including a power element 706. IMD 920c is similar to IMD 920b previously described and illustrated with reference to FIG. 10B, except that IMD 920c does not include coil 905 within housing 922. IMD 920c includes a ferrite sheet 924 surrounding (e.g., covering) the power element 706 such that the ferrite sheet 924 is between the power element 706 and the housing 922. In this example, the coil 905 may be arranged as a separate coil and / or in a PCBA housing (e.g., 904 of FIG. 9A or 9B), which may be coupled to housing 922.

[0123] FIG. 10D is a diagram schematically representing an example internal electrical assembly 910b for an IMD, such as IMD 900a or 900b of FIGS. 9A and 9B. Electrical assembly 910b includes a PCBA 906d, a ferrite sheet 908d, a coil 905, a power element 706, and a frame 912b. The coil 905 is wrapped around the outer surface of the frame 912b to provide structural integrity for the coil. The coil 905 may be tightly wound such that adjacent windings contact each other or wound with separation between adjacent windings. The power element 706 and the PCBA 906d are within and supported by the frame 912b. The ferrite sheet 908d (e.g., a ferrite tape) is arranged on the inner surface of the frame 912b. The ferrite sheet 908d may shield PCBA 906d and power element 706 from electromagnetic interference (e.g., due to coil 905 and / or external sources). In some examples, the ferrite sheet 908d may be excluded, or the ferrite sheet 908d may be combined with frame 912b to provide a ferrite frame as previously described with reference to FIG. 9C. In some examples, the frame 912b includes sidewalls extending between opposing flanges 914b. The sidewalls of the frame 912b may have rounded corners 916b on the outer surface on which coil 905 is wound and on the inner surface on which ferrite sheet 908d is arranged. While frame 912b has a substantially rectangular shape in the example of FIG. 10D, in some examples frame 912b may have another suitable1618.327.11130shape, such as square, circular, elliptical, etc. The electrical assembly 910b may be placed in a housing, such as housing 902 or 904 of FIGS. 9A and 9B or housing 922 of FIGS. 10A-10C.

[0124] FIG. 11 A is a diagram including a side view illustrating an example coil 1000 for wireless power transfer, inductive communications, and / or RF communications. In some examples, coil 1000 may include at least some of substantially the same features and attributes as coil 350 of FIG. 3, 400 of FIG. 4, 704 of FIGS. 7A-8D, or 905 of FIGS. 9A-10B. As illustrated in FIG. 11 A, coil 1000 is a conical coil, where the radius or width of the windings 1002 increase from a smallest radius or width at a first end 1004 of the coil to a largest radius or width at a second end 1006 of the coil. Conical coil 1000 may conform to a housing that encloses the coil.

[0125] FIG. 11 B is a diagram including a side view illustrating an example coil 1010 for wireless power transfer, inductive communications, and / or RF communications. In some examples, coil 1010 may include at least some of substantially the same features and attributes as coil 350 of FIG. 3, 400 of FIG. 4, 704 of FIGS. 7A-8D, or 905 of FIGS. 9A-10B. As illustrated in FIG. 11 B, coil 1010 is a bow tie coil, where the radius or width of the windings 1012 decrease from a largest radius or width at a first end 1014 of the coil to a smallest radius or width at a center 1015 of the coil, and where the radius or width of the windings 1012 increase from the smallest radius or width at the center 1015 of the coil to the largest radius or width at a second end 1016 of the coil. Bow tie coil 1010 may conform to a housing that encloses the coil.

[0126] FIG. 11C is a diagram including an isometric view illustrating an example coil 1020 for wireless power transfer, inductive communications, and / or RF communications. In some examples, coil 1020 may include at least some of substantially the same features and attributes as coil 350 of FIG. 3, 400 of FIG. 4, 704 of FIGS. 7A-8D, or 905 of FIGS. 9A-10B. As illustrated in FIG. 11 C, coil 1020 is a figure eight coil, where each winding 1022 of the coil is arranged in two antisymmetric loops (e.g., circular, rectangular, etc.) and the windings are stacked on each other. Figure eight coil 1020 may improve the efficiency of WPT, inductive1618.327.11131communications, and / or RF communications and / or reduce electromagnetic interference.

[0127] FIGS. 12A and 12B are a plan view and a cross-sectional view, respectively, of an example multilayer coil 1200 including a plurality of conductive trace layers 1204i to 1204N separated by insulation layers 1202i to 1202N, respectively, where “N” is any suitable number of layers. In some examples, multilayer coil 1200 may be used for coil 704 of FIGS. 7A-8D. As illustrated in FIG. 12B, each conductive trace layer 1204i to 1204N may be formed on a respective insulation layer 1202i to 1202N and electrically connected to the adjacent conductive trace layer in the stack through a respective conductive via 1206i to 1206N. In this example, each conductive trace layer 1204i to 1204N has a circular shape. In some examples, however, as described below with reference to FIGS. 13A-13H, each conductive trace layer 1204i to 1204N may have another suitable shape. In some examples, each conductive trace layer 1204i to 1204N and each conductive via 1206i to 1206N may include copper, aluminum, or another suitable electrically conductive material. In some examples, each insulation layer 1202i to 1202N may include FR-4, a polymer, a ceramic, or another suitable electrically insulating material. In some examples, multilayer coil 1200 may be formed using multiple printed circuit board layers and / or may be integrated into a PCBA (e.g., 906a-906c of FIGS. 9A-9B).

[0128] FIG. 12C is a cross-sectional view of another example multilayer coil 1201. Multilayer coil 1201 is similar to multilayer coil 1200 previously described and illustrated with reference to FIG. 12B including a plurality of conductive trace layers 1204i to 1204N separated by insulation layers 1202i to 1202N. In this example, however, each conductive trace layer 1204i to 1204N is electrically isolated but capacitively coupled to each other. That is, multilayer coil 1201 does not include conductive vias 1206i to 1206N.

[0129] FIGS. 13A-13H are plan views of one layer of example multilayer coils including a conductive trace that could be used in place of each conductive trace 1204i to 1204N of FIGS. 12A-12C.1618.327.11132

[0130] FIG. 13A is a plan view of one layer 1202a of a multilayer coil (e.g., 1200 or 1201 of FIGS. 12A-12B, 120) including a conductive trace 1204a. In this example, conductive trace 1204a is circular in shape and includes two sections 1220a and 1220b. Each section 1220a and 1220b is a half-circle with the concave portion of section 1220a facing the concave portion of section 1220b.

[0131] FIG. 13B is a plan view of one layer 1202b of a multilayer coil (e.g., 1200 or 1201 of FIGS. 12A-12B, 120) including a conductive trace 1204b. In this example, conductive trace 1204b is circular in shape and includes three sections 1222a, 1222b, and 1222c. Each section 1222a and 1222b is a quarter-circle and section 1222c is a half-circle with the concave portions of sections 1222a and 1222b facing each other and the concave portion of section 1222c.

[0132] FIG. 13C is a plan view of one layer 1202c of a multilayer coil (e.g., 1200 or 1201 of FIGS. 12A-12B, 12C) including a conductive trace 1204c. In this example, conductive trace 1204c is circular in shape and includes four sections 1224a, 1224b, 1224c, and 1224d. Each section 1224a, 1224b, 1224c, and 1224d is a quarter-circle with the concave portions of each section facing each other.

[0133] FIG. 13D is a plan view of one layer 1202d of a multilayer coil (e.g., 1200 or 1201 of FIGS. 12A-12B, 12C) including a conductive trace 1204d. In this example, conductive trace 1204d is square shaped. In some examples, conductive trace 1204d may include two sections similar to sections 1220a and 1220b of FIG. 13A, three sections similar to sections 1222a, 1222b, and 1222c of FIG. 13B, or four sections similar to sections 1224a, 1224b, 1224c, and 1224d of FIG. 13C except each section is part of a square instead of a circle.

[0134] FIG. 13E is a plan view of one layer 1202e of a multilayer coil (e.g., 1200 or 1201 of FIGS. 12A-12B, 12C) including a conductive trace 1204e. In this example, conductive trace 1204e is an open loop square including a break in the trace. While the break in conductive trace 1204e is illustrated at the center of the bottom side of the square, in other examples the break may be arranged at any location around the square. In some examples, open loop conductive trace 1204e may have another suitable shape, such as circular, elliptical, etc.1618.327.11133

[0135] FIG. 13F is a plan view of one layer 1202f of a multilayer coil (e.g., 1200 or 1201 of FIGS. 12A-12B, 120) including a conductive trace 1204f. In this example, conductive trace 1204f is bow tie shaped. While conductive trace 1204f includes straight line portions forming the bow tie shape, in some examples conductive trace 1204f may include curved line portions forming the bow tie shape.

[0136] FIG. 13G is a plan view of one layer 1202g of a multilayer coil (e.g., 1200 or 1201 of FIGS. 12A-12B, 120) including a conductive trace 1204g. In this example, conductive trace 1204g is figure eight shaped. While conductive trace 1204g includes straight line portions forming the figure eight shape, in some examples conductive trace 1204g may include curved line portions forming the figure eight shape.

[0137] FIG. 13H is a plan view of one layer 1202h of a multilayer coil (e.g., 1200 or 1201 of FIGS. 12A-12B, 12C) including a conductive trace 1204h. In this example, conductive trace 1204h is spiral shaped. While conductive trace 1204h includes a square shaped spiral, in some examples conductive trace 1204h may include a circular shaped spiral.

[0138] It is noted that the various features (e.g., shapes, sections, breaks, etc.) described with reference to FIGS. 12A-13H may be combined with each other and / or other features to form additional conductive traces not specifically illustrated herein. For example, the circular traces 1204i to 1204N, 1204a, 1204b, and 1204c of FIGS.12A-13C could be elliptical, triangular, hexagonal, etc., and the sharp corners and / or straight sides of conductive traces 1204d-1204h of FIGS. 13D-13H could be curved. In some examples, the conductive traces may conform to a cross-sectional shape of the device (e.g., D-shaped, semi-circle shaped, etc.).

[0139] FIG. 14A is a diagram schematically representing an example circuit 1400 including a single coil 704 for wireless power transfer and RF communications. In addition to coil 704, circuit 1400 includes a power element 706, a radio 708, a capacitor 1404, a rectifier 1406, a regulator 1408, a switch 1410, and an impedance matching circuit 1412. Radio 708 includes a transmitter 1414 and a receiver 1416. In some examples, coil 704, power element 706, and radio 708 may include at least1618.327.11134some of substantially the same features and attributes as the coils, power elements, and radio described with reference to FIGS. 1A-13H.

[0140] One end of coil 704 is electrically coupled to one side of capacitor 1404 and an input of rectifier 1406 through a signal path 1403. The other end of coil 704 is electrically coupled to an input of switch 1410. A first output of switch 1410 is electrically coupled to the other side of capacitor 1404 and an input of rectifier 1406 through a signal path 1405. The output of rectifier 1406 is electrically coupled to the input of regulator 1408 through a signal path 1407. The output of regulator 1408 is electrically coupled to power element 706 through a signal path 1409. In some examples, regulator 1408 may be excluded such that signal path 1407 is directly connected to signal path 1409. A second output of switch 1410 is electrically coupled to the input of impedance matching circuit 1412 through a signal path 1411. The output of impedance matching circuit 1412 is electrically coupled to radio 708 through a signal path 1413. In some examples, capacitor 1404, rectifier 1406, and optional regulator 1408 form first circuit 710 of FIG. 7B, and impedance matching circuit 1412 forms second circuit 712 of FIG. 7B.

[0141] Capacitor 1404, rectifier 1406, and optional regulator 1408 supply power (e.g., for immediate use and / or for charging) to the power element 706 using an inductive WPT signal received by the coil 704 at a first frequency. Capacitor 1404 tunes the coil 704 to the first frequency. Rectifier 1406 coupled in parallel with the capacitor 1404 rectifies the inductive WPT signal to generate a rectified signal. Optional regulator 1408 regulates the rectified signal to generate a power element voltage (VPE) and a power element current (IPE) to supply power to the power element 706. Impedance matching circuit 1412 connected between the coil 704 and the radio 708 is for transmitting and receiving RF communication signals via the coil 704 at a second frequency. Impedance matching circuit 1412 matches the impedance of the coil 704 (e.g., antenna) to the impedance of the radio 708. Switch 1410 selectively connects the coil 704 to the capacitor 1404 and rectifier 1406 (e.g., first circuit) to supply power to the power element 706 using an inductive WPT signal received by the coil 704 at the first frequency or to the impedance matching circuit 1412 (e.g.,1618.327.11135second circuit) to transmit and receive RF communication signals via the coil 704 at the second frequency. In some examples, switch 1410 may be controlled by a control portion, such as control portion 190 of FIG. 1 C, 820 of FIGS. 8A-8C, or 3500 of FIG. 41A.

[0142] FIG. 14B is a diagram schematically representing an equivalent circuit 1400a of circuit 1400 of FIG. 14A configured for WPT. In this example, switch 1410 (not shown in FIG. 14B) selectively connects the coil 704 to the capacitor 1404 and rectifier 1406 (e.g., first circuit) to supply power to the power element 706 using an inductive WPT signal received by the coil 704 at the first frequency as previously described.

[0143] FIG. 14C is a diagram schematically representing an equivalent circuit 1400b of circuit 1400 of FIG. 14A configured to transmit and receive RF communication signals. In this example, switch 1410 (not shown in FIG. 14B) selectively connects the coil 704 to the impedance matching circuit 1412 (e.g., second circuit) to transmit and receive RF communication signals via the coil 704 at the second frequency as previously described.

[0144] While FIGS. 14A-14C include a single coil 704 for wireless power transfer and RF communications, FIG. 14D described below includes a single coil 704 for inductive communications and RF communications and may exclude wireless power transfer via the single coil.

[0145] FIG. 14D is a diagram schematically representing an example circuit 1420 including a single coil 704 for inductive communications and RF communications. In addition to coil 704, circuit 1420 includes a radio 708, a capacitor 1404, an application specific integrated circuit (ASIC) 1422, a switch 1410, an impedance matching circuit 1412, and a controller 1424. Radio 708 includes a transmitter 1414 and a receiver 1416. In some examples, coil 704 and radio 708 may include at least some of substantially the same features and attributes as the coils and radio described with reference to FIGS. 1A-14C.

[0146] One end of coil 704 is electrically coupled to one side of capacitor 1404 and an input of ASIC 1422 through a signal path 1403. The other end of coil 704 is1618.327.11136electrically coupled to an input of switch 1410. A first output of switch 1410 is electrically coupled to the other side of capacitor 1404 and an input of ASIC 1422 through a signal path 1405. The output of ASIC 1422 is communicatively coupled to controller 1424 through a communication (e.g., digital communication) path 1423. A second output of switch 1410 is electrically coupled to the input of impedance matching circuit 1412 through a signal path 1411. The output of impedance matching circuit 1412 is electrically coupled to radio 708 through a signal path 1413. Radio 708 is communicatively coupled to controller 1424 through a communication (e.g., digital communication) path 1425. In some examples, ASIC 1422 and / or controller 1424 may be part of a control portion 190 of FIG. 1 C, 720 of FIG. 7C, 820 of FIG.8D, or 3500 of FIG. 41A.

[0147] ASIC 1422 may include a transmitter (e.g., 722 of FIG. 7C) and a receiver (e.g., 724 of FIG. 7C) to transmit and receive inductive communication signals via the coil 704 when switch 1410 connects coil 704 to capacitor 1404 and ASIC 1422. In some examples, the inductive communication signals transmitted and / or received by ASIC 1422 may include security and / or key exchanges for pairing the radio 708 to a further device, such as a mobile device 3620, a remote control 3640, a clinician programmer 3650, a patient management tool 3660, or an external charger 3670 described below with reference to at least FIG. 42. In some examples, the communication signals transmitted and / or received by ASIC 1422 may include device wake-up communications, shipping mode enable and / or disable communications, therapy enable and / or disable communications, Bluetooth low energy (BLE) functionality enable communications, rapid advertisement communications, and / or other suitable communications.

[0148] As previously described, impedance matching circuit 1412 matches the impedance of the coil 704 (e.g., antenna) to the impedance of the radio 708. Switch 1410 selectively connects the coil 704 to capacitor 1404 and ASIC 1422 to transmit and / or receive inductive communication signals via coil 704 at a first frequency or to the impedance matching circuit 1412 to transmit and / or receive RF communication signals via the coil 704 at a second frequency. In some examples, the1618.327.11137communication signals transmitted and / or received by radio 708 may include sensing, stimulation, control, and / or status communications.

[0149] Controller 1424 may control switch 1410, ASIC 1422, and radio 708, process communications received from ASIC 1422 and radio 708, and process communications for transmission via ASIC 1422 and radio 708. Controller 1424 may also control sensing and / or stimulation as previously described with reference to FIGS. 1A-1C and 8A-8D.

[0150] While FIGS. 14A-14C include a switch 1410 to switch between wireless power transfer and RF communications, FIG. 14E described below eliminates the switch such that wireless power transfer and RF communications may occur simultaneously.

[0151] FIG. 14E is a diagram schematically representing another example circuit 1500 including a single coil 704 for wireless power transfer and RF communications. In addition to coil 704, circuit 1500 includes a power element 706, a radio 708, a capacitor 1404, a rectifier 1406, a regulator 1408, a first filter 1502, a second filter 1504, and an impedance matching circuit 1412. In some examples, second filter 1504 and impedance matching circuit 1412 may be replaced by impedance matching circuit 1506, which includes the second filter (e.g., 1504). In some examples, coil 704, power element 706, and radio 708 may include at least some of substantially the same features and attributes as the coils, power elements, and radio described with reference to FIGS. 1A-13H.

[0152] One end of coil 704 is electrically coupled to one side of capacitor 1404 and an input of rectifier 1406 through a signal path 1403. The other end of coil 704 is electrically coupled to an input of first filter 1502 and an input of second filter 1504 (or impedance matching circuit 1506) through a signal path 1501. The output of first filter 1502 is electrically coupled to the other side of capacitor 1404 and an input of rectifier 1406 through a signal path 1503. The output of rectifier 1406 is electrically coupled to the input of regulator 1408 through a signal path 1407. The output of regulator 1408 is electrically coupled to power element 706 through a signal path 1409. In some examples, regulator 1408 may be excluded such that signal path1618.327.111381407 is directly connected to signal path 1409. The output of second filter 1504 is electrically coupled to the input of impedance matching circuit 1412 through a signal path 1505. The output of impedance matching circuit 1412 (or impedance matching circuit 1506) is electrically coupled to radio 708 through a signal path 1413. In some examples, first filter 1502 forms first circuit 710 of FIG. 7B, and second filter 1504 and impedance matching circuit 1412 (or impedance matching circuit 1506) form second circuit 712 of FIG. 7B.

[0153] First filter 1502 (e.g., a low pass filter or band pass filter) passes inductive WPT signals received by the coil 704 at the first frequency and blocks RF communication signals received at the second frequency. Capacitor 1404, rectifier 1406, and optional regulator 1408 supply power to the power element 706 using the inductive WPT signal at the first frequency received by the coil 704 and passed through the first filter 1502. Capacitor 1404 tunes the coil 704 to the first frequency. Rectifier 1406 coupled in parallel with the capacitor 1404 rectifies the inductive WPT signal to generate a rectified signal. Optional regulator 1408 regulates the rectified signal to generate a power element voltage (VPE) and a power element current (IPE) to supply power to the power element 706.

[0154] Second filter 1504 (e.g., a high pass filter or band pass filter) passes RF communication signals received by the coil 704 at the second frequency and blocks inductive WPT signals received by the coil 704 at the first frequency. Impedance matching circuit 1412 (or impedance matching circuit 1506) connected between the coil 704 and the radio 708 facilitates transmitting and receiving of RF communication signals via the coil 704 at the second frequency. Impedance matching circuit 1412 matches the impedance of the coil 704 (e.g., antenna) to the impedance of the radio 708. In some examples, the coil 704 may be configured to receive an inductive WPT signal and an RF communication signal simultaneously. In some examples, the coil 704 may be configured to receive an inductive WPT signal during a first period and transmit or receive an RF communication signal during a second period that does not overlap the first period.1618.327.11139

[0155] FIGS. 14F is a diagram schematically representing an example circuit 1520 including a coil 704 for wireless power transfer and an RF antenna 1522 for RF communications. In some examples, RF antenna 1522 is a single-ended RF antenna. In addition to coil 704 and RF antenna 1522, circuit 1520 includes a power element 706, a radio 708, a capacitor 1404, a rectifier 1406, a regulator 1408, a capacitor 1528, and an impedance matching circuit 1412. Radio 708 includes a transmitter 1414 and a receiver 1416.

[0156] One end of coil 704 is electrically coupled to one side of capacitor 1404 and an input of rectifier 1406 through a signal path 1403. The other end of coil 704 is electrically coupled to the other side of capacitor 1404, an input of rectifier 1406, and one side of capacitor 1528 through a signal path 1405. The output of rectifier 1406 is electrically coupled to the input of regulator 1408 through a signal path 1407. The output of regulator 1408 is electrically coupled to power element 706 through a signal path 1409. In some examples, regulator 1408 may be excluded such that signal path 1407 is directly connected to signal path 1409. The other side of capacitor 1528 is electrically coupled to radio 708 through a signal path 1526. In some examples, signal path 1526 provides a reference or ground for RF antenna 1522. Radio 708 is electrically coupled to an output of impedance matching circuit 1412 through a signal path 1413. An input of impedance matching circuit 1412 is electrically coupled to RF antenna 1522 through a signal path 1524. In some examples, capacitor 1528 may be excluded such that signal path 1526 is directly connected to signal path 1405.

[0157] As previously described with reference to FIG. 14A, capacitor 1404, rectifier 1406, and optional regulator 1408 supply power (e.g., for immediate use and / or for charging) to the power element 706 using an inductive WPT signal received by the coil 704 at a first frequency. Capacitor 1404 tunes the coil 704 to the first frequency. Rectifier 1406 coupled in parallel with the capacitor 1404 rectifies the inductive WPT signal to generate a rectified signal. Optional regulator 1408 regulates the rectified signal to generate a power element voltage (VPE) and a power element current (IRE) to supply power to the power element 706. Impedance matching circuit 1412 connected between the RF antenna 1522 and the radio 708 is for transmitting and1618.327.11140receiving RF communication signals via the RF antenna at a second frequency. Impedance matching circuit 1412 matches the impedance of the RF antenna 1522 to the impedance of the radio 708.

[0158] In some examples, capacitor 1528 is an RF coupling capacitor to present a lower impedance to short the RF antenna reference / ground (e.g., signal path 1526) to the coil 704 (e.g., as illustrated and described below with reference to the equivalent circuit of FIG. 14G) at the second frequency. At the first frequency, capacitor 1528 presents a higher impedance to isolate the WPT signal from the radio 708 (e.g., see equivalent circuit 1400a described and illustrated with reference to FIG. 14B). Therefore, the coil 704 provides a reference / ground for the RF antenna 1522 during RF communications at the second frequency.

[0159] FIG. 14G is a diagram schematically representing an equivalent circuit 1520a of circuit 1500 of FIG. 14F configured to transmit and receive RF communication signals. In this example, capacitor 1528 (not shown in FIG. 14G) shorts the coil 704 to the radio 708 such that the coil 704 provides a reference / ground for RF antenna 1522 to transmit and receive RF communication signals via the RF antenna 1522 at the second frequency.

[0160] FIG. 14H is a diagram schematically representing an example circuit 1540 including an RF antenna 1522 for RF communications. In addition to antenna 1522, circuit 1540 includes an enclosure 1542, a capacitor 1528, a radio 708, and an impedance matching circuit 1412. Radio 708 includes a transmitter 1414 and a receiver 1416. Enclosure 1542 is electrically coupled to one side of capacitor 1528 through a signal path 1544. Enclosure 1542 may be a power element enclosure (e.g., case neutral) or a conductive case enclosure (e.g., 902 or 904 of FIGS. 9A-9B or 922 of FIGS. 10A-10C). The other side of capacitor 1528 is electrically coupled to radio 708 through a signal path 1526. In some examples, signal path 1526 provides a reference / ground for RF antenna 1522. Radio 708 is electrically coupled to an output of impedance matching circuit 1412 through a signal path 1413. An input of impedance matching circuit 1412 is electrically coupled to RF antenna 15221618.327.11141through a signal path 1524. In some examples, capacitor 1528 may be excluded such that signal path 1526 is directly connected to signal path 1544.

[0161] In some examples, capacitor 1528 is an RF coupling capacitor to present a lower impedance to short the RF antenna reference / ground (e.g., signal path 1526) to the enclosure 1542 at the second frequency. At the first frequency, capacitor 1528 presents a higher impedance to isolate the enclosure 1542 from the radio 708. Therefore, the enclosure 1542 provides a reference / ground for the RF antenna 1522 during RF communications.

[0162] The reference / ground (e.g., 1526) of a single-ended RF antenna (e.g., 1522) generally needs to be larger than the antenna itself for optimum performance. Due to size constraints within an IMD, it is challenging to implement a sufficiently large antenna reference / ground within an IMD. By using another IMD component to serve as the antenna reference / ground, space may be saved by removing the need to implement a dedicated antenna reference / ground. Accordingly, by using part of a conductive IMD enclosure, a power element (e.g., battery) enclosure, and / or a WPT coil as the reference / ground of the single-ended RF antenna as disclosed herein, space may be saved within the IMD thereby enabling a smaller sized IMD.

[0163] FIGS. 15A-15D relate to example IMDs in which a coil (e.g., antenna) is configured in a particular manner relative to a housing and / or elements (e.g., lead) external of the housing. In some examples, each example of FIGS. 15A-15D may include at least some of substantially the same features of, and / or example implementations of, at least some of the examples of FIGS. 1A-14H and / or FIGS.15E-42.

[0164] FIG. 15A is a diagram schematically representing an example IMD 1700a. The IMD 1700a includes a housing 1702a and a lead 1706 coupled to the housing 1702a. In this example, the IMD 1700a includes a coil 704 arranged on and / or integrated into the lead 1706. The housing 1702a may include a metal (e.g., titanium, stainless steel, MP35N) enclosure 1704a. Thus, by arranging and / or integrating the coil 704 into the lead 1706 rather than within the metal enclosure 1704a, the magnetic field generated by the coil 704 is not redirected or attenuated due to the1618.327.11142metal enclosure 1704a, thereby improving coupling with an external device (e.g., external element 150 in FIG. 1 B and / or external charger 3670, mobile device 3620, remote control 3640, clinician programmer 3650, or patient management tool 3660 of FIG. 42). In addition, by separating the coil 704 from the housing 1702a, this example arrangement also may permit implanting the coil 704 at locations within the patient which may facilitate easier or stronger WPT signals and / or wireless communication signals. In some examples, placing the coil 704 on and / or within lead 1706 may permit reducing the size of, and / or changing a shape of, the housing 1702a of the IMD 1700a, in a manner which may enhance maneuvering, positioning, and / or fixating the housing 1702a, lead 1706, and / or coil 704 among tissues at which the IMD 1700a is implanted. For instance, by providing a reduced size (and / or altered shape) of the housing 1702a (via separating the coil 704 from being within housing 1702a), the housing 1702a may be implanted in some smaller or differently-shaped locations that might otherwise not be feasible, which may in turn, may increase the general implantability and / or ability to fixate the housing 1702a in robust locations.

[0165] FIG. 15B is a diagram schematically representing an example IMD 1700b. The IMD 1700b includes a housing 1702b and a lead 1706 coupled to the housing 1702b. In this example, the IMD 1700b includes a coil 704 arranged in and / or integrated into the housing 1702b. The housing 1702b may include an enclosure 1704b including a non-magnetic material, such as a thermoplastic polymer (e.g., silicone, polysulfone), a thermoset material, a blend polymer material (e.g., PEEK), a ceramic material (e.g., glass, alumina oxide, zirconia, etc.), or a combination thereof. Thus, by arranging and / or integrating the coil 704 into the non-magnetic enclosure 1704b rather than within a metal enclosure, the magnetic field generated by the coil 704 is not redirected or attenuated due to the metal enclosure, thereby improving coupling with an external device (e.g., external element 150 in FIG. 1 B and / or external charger 3670, mobile device 3620, remote control 3640, clinician programmer 3650, or patient management tool 3660 of FIG. 42).1618.327.11143

[0166] FIG. 15C is a diagram schematically representing an example IMD 1700c. The IMD 1700c includes a housing 1702c and a lead 1706 coupled to the housing 1702c. In this example, the IMD 1700c may include a metal (e.g., titanium, stainless steel, MP35N) enclosure 1704c and an end cap 1710 coupled to (e.g., co-molded with, welded to, adhered to, etc.) the metal enclosure 1704c. A coil 704 is arranged within the end cap 1710. The end cap 1710 may be made of a non-magnetic material, such as a thermoplastic polymer (e.g., silicone, polysulfone), a thermoset material, a blend polymer material (e.g., PEEK), a ceramic material (e.g., glass, alumina oxide, zirconia, etc.), or a combination thereof. Thus, by arranging the coil 704 within the non-magnetic end cap 1710 of the housing 1702c rather than within the metal enclosure 1704c, the magnetic field generated by the coil 704 is not redirected or attenuated by the metal enclosure 1704c, thereby improving coupling with an external device (e.g., external element 150 in FIG. 1 B and / or external charger 3670, mobile device 3620, remote control 3640, clinician programmer 3650, or patient management tool 3660 of FIG. 42). In addition, end cap 1710 may include features for fixation and / or suturing of the IMD within a patient.

[0167] While the housing 1702c illustrated in FIG. 15C has a rectangular shape, in some examples, the housing 1702c may have any suitable geometric shape (e.g., square, circular, elliptical, hexagonal, triangular, etc.), non-geometric shape, or asymmetrical shape. In some examples, housings having an asymmetrical shape provide a clinical advantage in that they reduce the risk of the IMD rotating, twisting, flipping, etc. after implantation within a patient. In some examples, at least a portion of the end cap 1710 may have a geometric shape which is different from a geometric shape of the enclosure 1704c of housing 1702c, which may facilitate providing differently shaped coils as desired.

[0168] FIG. 15D is a diagram schematically representing an example IMD 1700d. The IMD 1700d includes a housing 1702d and a lead 1706 coupled to the housing 1702d. In this example, the IMD 1700d may include a metal (e.g., titanium, stainless steel, MP35N) enclosure 1704d and a window 1712 extending through the metal enclosure 1704d. A coil 704 may be arranged within the housing 1702d adjacent1618.327.11144(e.g., directly adjacent) to the window 1712. The window 1712 may include a nonmagnetic material, such as a thermoplastic polymer (e.g., silicone, polysulfone), a thermoset material, a blend polymer material (e.g., PEEK), a ceramic material (e.g., glass, alumina oxide, zirconia, etc.), or a combination thereof. Thus, by arranging the coil 704 adjacent to the window 1712 rather than adjacent to a metal wall of the enclosure 1704d, the magnetic field generated by the coil 704 is not redirected or attenuated by the metal enclosure 1704d, thereby improving coupling with an external device (e.g., external element 150 in FIG. 1 B and / or external charger 3670, mobile device 3620, remote control 3640, clinician programmer 3650, or patient management tool 3660 of FIG. 42). While the window 1712 is illustrated on a major face of the housing 1702d, in some examples, the window 1712 may be arranged on a side face (e.g., perpendicular to the major face) of the housing 1702d. While the window 1712 is illustrated as having a rectangular shape, in some examples, the window 1712 may have any suitable geometric shape (e.g., square, circular, elliptical, hexagonal, triangular, etc.), non-geometric shape, or asymmetrical shape to conform to a shape of the coil 704.

[0169] While FIGS. 15C and 15D depict end cap 1710 and window 1712, respectively, as being transparent or translucent at least for illustrative purposes, the respective end cap 1710 or window 1712 may include materials which are opaque, translucent, or transparent. In some examples, by forming the end cap 1710 (or window 1712) of a material, color, and / or opacity different from a material, color, and / or opacity of enclosure 1704c (or enclosure 1704d), one can more readily position and fixate IMD 1700c (or IMD 1700d) in a manner which places the coil 704 in a preferred orientation that may enhance WPT and / or wireless communication.

[0170] FIGS. 15E-15F relate to example IMDs in which an acoustic sensor (e.g., microphone, piezoelectric sensor) is configured in a particular manner relative to a housing. In some examples, each example of FIGS. 15E-15F may include at least some of substantially the same features of, and / or example implementations of, at least some of the examples of FIGS. 1 A-15D and / or FIGS. 16A-42.1618.327.11145

[0171] FIG. 15E is a diagram schematically representing an example IMD 1700e. The IMD 1700e includes a housing 1702e and a lead 1706 coupled to the housing 1702e. In this example, the IMD 1700e includes an acoustic sensor 1720 (e.g., microphone, piezoelectric sensor) arranged in and / or integrated into the housing 1702e. In some examples, acoustic sensor 1720 may be an example implementation of sensing element 128 of FIG. 1 B or sensing element 806 of FIGS.8B-8D. In some examples, acoustic sensor 1720 may be included as part of a PCBA, such as PCBA 906a, 906b, or 906c of FIGS. 9A-9B, PCBA 1920 of FIGS. 17A-27C, PCBA 2120 of FIGS. 28A-29D and 30A-30C, or PCBA 2121 of FIG. 29E described below.

[0172] The housing 1702e may include an enclosure 1704e including a nonmagnetic material, such as a thermoplastic polymer (e.g., silicone, polysulfone), a thermoset material, a blend polymer material (e.g., PEEK), a ceramic material (e.g., glass, alumina oxide, zirconia, etc.), or a combination thereof. In this example, the acoustic sensor 1720 (and other components within the enclosure 1704e) may be encapsulated within a potting material (e.g., epoxy, polyurethane, liquid crystal polymer (LCP), or silicone, etc.), such that the potting material completely fills any empty space between the acoustic sensor 1720 and inner sidewalls of the enclosure 1704e (as further described below with reference to FIG. 24). In this way, acoustic energy transferred (e.g., from tissue of a patient) to the enclosure 1704e is further transferred via the potting material to the acoustic sensor 1720, which can generate a sensor signal corresponding to the acoustic energy. The sensor signal, which may correspond to physiologic information, may include respiratory information, cardiac information, and / or other information about the patient.

[0173] FIG. 15F is a diagram schematically representing an example IMD 1700f. The IMD 1700f includes a housing 1702f and a lead 1706 coupled to the housing 1702f. In this example, the housing 1702f may include an enclosure 1704f including a non-magnetic material, such as a thermoplastic polymer (e.g., silicone, polysulfone), a thermoset material, a blend polymer material (e.g., PEEK), a ceramic material (e.g., glass, alumina oxide, zirconia, etc.), or combination thereof. The1618.327.11146housing 1702f may also include a window 1722 extending through the non-magnetic enclosure 1704f. An acoustic sensor 1720 may be arranged within the housing 1702f adjacent (e.g., directly adjacent) to the window 1722.

[0174] The window 1722 may mimic the density / consistency of the surrounding tissue and match the impedance of the surrounding tissue to minimize acoustic energy scattering. In some examples, the window 1722 may include a metal (e.g., titanium, stainless steel, MP35N). In some examples, the metal window 1722 may have a thickness within a range between about 0.05 millimeters and about 0.2 millimeters, such as about 0.1 millimeters. In some examples, the window 1722 may include a polymeric material. In some examples, the polymeric window 1722 may have a thickness within a range between about 0.4 millimeters and about 0.6 millimeters, such as about 0.5 millimeters. In the example of FIG. 15F, the acoustic sensor 1720 (and other components within the enclosure 1704f) may not be encapsulated within a potting material, such that air fills any empty space between the acoustic sensor 1720 and the inner sidewalls of the enclosure 1704f and the window 1722. In this way, acoustic energy transferred (e.g., from tissue of a patient) to the window 1722 is further transferred via the air within the enclosure 1704f to the acoustic sensor 1720, which can generate a sensor signal corresponding to the acoustic energy.

[0175] While the window 1722 is illustrated on a major face of the housing 1702f, in some examples, the window 1722 may be arranged on a side face (e.g., perpendicular to the major face) of the housing 1702f. While the window 1722 is illustrated as having a rectangular shape, in some examples, the window 1722 may have any suitable geometric shape (e.g., square, circular, elliptical, hexagonal, triangular, etc.), non-geometric shape, or asymmetrical shape.

[0176] FIG. 16A is a diagram schematically representing an example electrical assembly 1800 for a device (e.g., an IMD). Electrical assembly 1800 includes a power element 1810 and a flex circuit 1820. Electrical assembly 1800 also includes a coil 1804 (not visible) between the power element 1810 and the flex circuit 1820. In some examples, the coil 1804 may include at least some of substantially the same1618.327.11147features as, and / or an example implementation of at least some features of, the example coils 350, 400, 704, or 905 described in association with at least FIGS. 3-10B. In some examples, the power element 1810 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the example power element 706 described in association with at least FIGS. 7A-7B, 8A-8C, and 9A-10C. The electrical assembly 1800 may be enclosed by a housing (not shown) shaped to conform to the electrical assembly 1800, such as a housing 702, 802, or 1702a-1702f as described in association with at least FIGS. 7A-8D and 15A-15F.

[0177] In the example illustrated in FIG. 16A, power element 1810 comprises a cylindrical (e.g., button cell) shape. In some examples, power element 1810 may have another suitable shape, such as a rectangular cuboid, hexagonal prism, etc. Coil 1804 is wrapped around (e.g., surrounding) power element 1810 (e.g., around the sidewalls of the cylinder) and is electrically coupled to the flex circuit 1820. In some examples, flex circuit 1820 may include circuitry to selectively electrically connect a first end of the coil 1804 to a second end of the coil 1804 for WPT and / or inductive communications and electrically disconnect the first end of the coil 1804 from the second end of the coil 1804 for RF communications. Power element 1810 is electrically coupled to the flex circuit 1820 via a first terminal (e.g., positive terminal) on a first major surface of the power element and a second terminal (e.g., negative terminal) on a second major surface of the power element opposite to the first major surface.

[0178] Flex circuits may include alternating layers of adhesive and insulation (e.g., polyimide) in which copper traces and through holes are formed as part of the layers that results in a flexible, conductive substrate. Electrical components (e.g., semiconductor chips, passive components, etc.) are then surface mounted on the flex circuit via a surface mount technology (SMT) process.

[0179] Flex circuit 1820 includes a flexible substrate 1822 supporting a plurality of components 1824. Components 1824 may include radio 708, first circuit 710, second circuit 712, control portion 720 or 820, stimulation element 804, sensing1618.327.11148element 806 (e.g., acoustic sensor 1720 of FIGS. 15E and 15F), capacitor 1404, rectifier 1406, regulator 1408, impedance matching circuit 1412 or 1506, ASIC 1422, controller 1424, first filter 1502, second filter 1504 of FIGS. 7A-8D and FIGS. 14A-14E, and / or other components or circuitry. The flex circuit 1820 is wrapped around (e.g., surrounding) the coil 1804 and the power element 1810 (e.g., around the sidewalls of the cylinder). By wrapping the coil 1804 and the flex circuit 1820 around the power element 1810, a small form factor (e.g., about 1.5 cubic centimeter) IMD may be fabricated.

[0180] FIG. 16B is a diagram schematically representing an example electrical assembly 1801 for a device (e.g., an IMD). Electrical assembly 1801 is similar to electrical assembly 1800 previously described and illustrated with reference to FIG.16A, except that in electrical assembly 1801 , coil 1804 of FIG. 16A is replaced by a coil 1805. In some examples, the coil 1805 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the example coils 350, 400, 704, 1200, or 1201 described in association with at least FIGS. 3-8D and 12A-13H. In this example, coil 1805 may be arranged on a major surface (e.g., top surface) of the power element 1810 and within a footprint of the power element 1810. While the major surface (e.g., top surface) of the power element 1810 is partially visible in FIG. 16B, in some examples, the coil 1805 may cover the entire major surface of the power element 1810. The electrical assembly 1801 may be enclosed by a housing (not shown) shaped to conform to electrical assembly 1801 , such as a housing 702, 802, or 1702a-1702f as described in association with at least FIGS. 7A-8D and 15A-15F.

[0181] FIG. 17A is a diagram schematically representing an example electrical assembly 1900 for a device (e.g., an IMD). Electrical assembly 1900 includes a coil 1904, a power element 1910, and a printed circuit board assembly (PCBA) 1920. In some examples, the coil 1904 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the example coils 350, 400, 704, or 905 described in association with at least FIGS. 3-10B. In some examples, the power element 1910 may include at least some of1618.327.11149substantially the same features as, and / or an example implementation of at least some features of, the example power element 706 described in association with at least FIGS. 7A-7B, 8A-8C, and 9A-10C. In some examples, the PCBA 1920 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the PCBA 906a-906c described in association with at least FIGS. 9A and 9B.

[0182] In the example illustrated in FIG. 17A, power element 1910 comprises a one-half obround shape (e.g., a first portion including a rectangular cuboid shape and a second portion with a semi-circular shape). In some examples, power element 1910 may have another suitable shape, such as a rectangular cuboid, a cylinder, etc. Coil 1904 is wrapped around (e.g., surrounding) power element 1910 (e.g., around the rectangular cuboid portion) and includes a first end 1906 and a second end 1908 electrically coupled to the PCBA 1920. In some examples, PCBA 1920 may include circuitry to selectively electrically connect the first end 1906 to the second end 1908 for WPT and / or inductive communications and electrically disconnect the first end 1906 from the second end 1908 for RF communications. In some examples, wrapping the coil 1904 around the power element 1910 may decrease WPT efficiency due to the power element 1910; however, the decrease in WPT efficiency may be mitigated by including a ferrite sheet between the power element 1910 and the coil 1904 as previously described and illustrated with reference to FIG. 10B.

[0183] Power element 1910 includes a first terminal 1912 (e.g., positive terminal) and a second terminal 1914 (e.g., negative terminal) electrically coupled to the PCBA 1920. PCBA 1920 includes a printed circuit board (PCB) 1922 supporting a plurality of components 1924. Components 1924 may include radio 708, first circuit 710, second circuit 712, control portion 720 or 820, stimulation element 804, sensing element 806 (e.g., acoustic sensor 1720 of FIGS. 15E and 15F), capacitor 1404, rectifier 1406, regulator 1408, impedance matching circuit 1412 or 1506, ASIC 1422, controller 1424, first filter 1502, second filter 1504 of FIGS. 7A-8D and FIGS. 14A-14E, and / or other components or circuitry. In the example illustrated in FIG. 17A,1618.327.11150the power element 1910 and the PCBA 1920 are laterally aligned. In some examples, the power element 1910 and the PCBA 1920 may have another suitable arrangement, such as the PCBA 1920 being perpendicular to the power element 1910.

[0184] FIG. 17B is a diagram schematically representing an example electrical assembly 1901 for a device (e.g., an IMD). Electrical assembly 1901 is similar to electrical assembly 1900 previously described and illustrated with reference to FIG.17A, except that in electrical assembly 1901, a coil 1905 is wrapped around (e.g., surrounding) power element 1910 (e.g., around the rectangular cuboid portion) and at least a portion of the PCBA 1920. Accordingly, compared to the coil 1904 of FIG.17A, the coil 1905 of FIG. 17B may include more windings.

[0185] FIG. 18A is a diagram schematically representing an example device 1930a. Device 1930a includes an electrical assembly 1900a and a portion of a housing 1932. Electrical assembly 1900a is similar to electrical assembly 1900 of FIG. 17A including a coil 1904 and a power element 1910. Electrical assembly 1900a, however, includes a PCBA 1920a in place of PCBA 1920. PCBA 1920a is similar to PCBA 1920 of FIG. 17A, except that PCBA 1920a includes a plurality (e.g., three in this example) of through holes 1926 through the PCB 1922a. The portion (e.g., bottom half) of housing 1932 includes a plurality of heat stakes 1934 corresponding to the plurality of through holes 1926 of the PCBA 1920a that locate and retain the PCBA 1920a within the housing 1932. Accordingly, to assemble the device 1930a, the PCBA 1920a is placed onto the heat stakes 1934, which are then deformed using heat such that the PCBA 1920a is secured in place within the housing 1932.

[0186] FIG. 18B is a diagram schematically representing an example device 1930b. Device 1930b is similar to device 1930a of FIG. 18A except that device 1930b includes electrical assembly 1900b in place of electrical assembly 1900b. Electrical assembly 1900b is similar to electrical assembly 1900a including a coil 1904, a power element 1910, and a PCBA 1920a. Only PCB 1922a of PCBA 1920a is visible in FIG. 18B. Electrical assembly 1900b, however, further includes a ferrite cap 1940 over the PCBA 1920a on PCB 1922a. In some examples, at least one clip 1942 may1618.327.11151be used to secure the ferrite cap 1940 to the PCB 1922a. The ferrite cap 1940 may shield PCBA 1920a from electromagnetic interference (e.g., due to coil 1904, power element 1910, and / or external sources).

[0187] In some examples, the ferrite cap 1940 may be constructed using a composite material of injection-moldable thermoplastic and ferrite nanoparticles. The nanoparticles may be constructed from manganese-zinc, nickel-zinc, cobalt, or a combination thereof. The thermoplastic may be polypropylene (PP), polyethylene (PE), polycarbonate (PC), polyetheretherketone (PEEK), or liquid crystal polymer (LCP). The ferrite cap may be constructed by premixing or stirring the nanoparticles into melted thermoplastic material to homogenously disperse the nanoparticles throughout the thermoplastic, or the nanoparticles may be mixed at the point of injection molding of the ferrite cap.

[0188] FIG. 19 is a diagram schematically representing an example power element assembly 1950. In some examples, power element assembly 1950 may include at least some of substantially the same features of, and / or example implementations of, at least some of the examples of FIGS. 9A-10C. Power element assembly 1950 includes a power element 1910 and a power element housing 1952. In some examples, a coil 1904 (not visible in FIG. 19) may be wrapped around the power element 1910 as previously described and illustrated with reference to FIG. 17A. In some examples, the power element housing 1952 may be fabricated using polymer molding or a ceramic casting to form features that mitigate large flat sections and sharp corners commonly seen in metallic housings. Large flat sections may be susceptible to bending moments. Accordingly, housing 1950 avoids large flat sections on major and / or minor surfaces by including curved surfaces as indicated at 1954, and / or housing 1950 avoids sharp corners between surfaces by including curved corners as indicated at 1956. Power element assembly 1950 may be electrically coupled to a PCBA (e.g., 1920 of FIG. 17A) via first terminal 1912 and second terminal 1914. The PCBA may be within a PCBA housing that is mechanically coupled to the power element housing 1952. The PCBA housing may1618.327.11152include similar features (e.g., curved surfaces, curved corners) as power element housing 1952.

[0189] FIG. 20 is a diagram schematically representing an example IMD 1970. IMD 1970 may include electrical assembly 1900 previously described and illustrated with reference to FIG. 17A and a housing 1972. Housing 1972 may include a first (e.g., inner) housing portion 1974 and a second (e.g., outer) housing portion 1976, either of which may form a hermetic barrier. Housing 1972 is shown in FIG. 20 prior to attaching an end cap (e.g., 2046 of FIG. 26B described below) and / or a lead (e.g., 3224 of FIG. 39 described below) to the housing 1972 to seal (e.g., hermetically seal) the electrical assembly 1900 within the housing 1972. In some examples, inner housing portion 1974 may be a single part into which electrical assembly 1900 may be slidably inserted prior to attaching the end cap and / or lead. The inner housing portion 1974 encloses electrical assembly 1900 and may include a hermetic material such as a thermoplastic polymer, a thermoset material, a blend polymer material (e.g., PEEK), a ceramic material (e.g., glass, alumina oxide, zirconia, etc.), or a combination thereof. The outer housing portion 1976 may enclose the first housing portion 1974 and may include silicone or another suitable low durometer, non-hermetic polymer material. In some examples, the outer housing portion 1976 may mitigate large flats and sharp corners of the inner housing portion 1974, improve the mechanical robustness of the IMD, and / or improve patient comfort by forming a softer exterior of the IMD.

[0190] FIG. 21 is a diagram schematically representing an example device 1980 including electrical assembly 1900 (e.g., coil 1904, power element 1910, and PCBA 1920) and a frame 1982. The frame 1982 supports the coil 1904, the power element 1910, and the PCBA 1920 within a housing (e.g., 1972 of FIG. 20 or 2042 of FIG.26B described below). In some examples, frame 1982 may include a first (e.g., outer wall) portion 1982a supporting (e.g., securing) the PCBA 1920, a second (e.g., outer wall) portion 1982b supporting (e.g., securing) the coil 1904 and the power element 1910, and a third (e.g., inner wall) portion 1982c partially extending between the first portion 1982a and the second portion 1982b (e.g., perpendicular to the first portion1618.327.111531982a and the second portion 1982b and extending toward the first terminal 1912 and the second terminal 1914 of the power element 1910). In some examples, the third portion 1982c may set the spacing between the power element 1910 and the PCBA 1920 in addition to supporting (e.g., securing) the power element 1910 and the PCBA 1920. Frame 1982 prevents movement of the coil 1904, the power element 1910, and the PCBA 1920 within a housing.

[0191] FIG. 22 is a diagram schematically representing an example device 1990. Device 1990 includes electrical assembly 1900 and a sleeve 1992. The electrical assembly 1900 is placed inside the sleeve 1992. The sleeve 1992 may include silicone, thermoplastic vulcanizate, rubber, or other suitable flexible material. In some examples, the device 1990 with sleeve 1992 may then be placed inside a rigid, hermetically sealed mechanical housing such that sleeve 1992 provides an inner housing portion 1974 as illustrated in FIG. 20. In this example, the outer housing portion 1976 may include a thermoplastic polymer, a thermoset material, a blend polymer material (e.g., PEEK), a ceramic material (e.g., glass, alumina oxide, zirconia, etc.), or a combination thereof. In some examples, the inner sleeve 1992 may form a hermetic barrier such that the outer housing portion 1974 does not have to form a hermetic barrier. In some examples, the inner sleeve 1992 may provide cushioning for the electrical assembly 1900 if the outer housing portion 1974 is a rigid material.

[0192] FIG. 23 is a diagram schematically representing an example device 2000. Device 2000 includes electrical assembly 1900 and a housing 2002. In some examples, electrical assembly 1900 is potted in an epoxy, silicone, thermoplastic urethane, or another suitable potting material to form the housing 2002. In some examples, electrical assembly 1900 is overmolded with a single polyurethane, polyester, PEEK, or other suitable thermoplastic material to form the housing 2002. In some examples, the housing 2002 may provide the entire housing for the device 2000. In some examples, the device 2000 including housing 2002 may be placed inside a rigid mechanical housing 2004 or overmolded as described below with reference to FIG. 24, such that housing 2002 provides an inner housing portion.1618.327.11154

[0193] FIG. 24 is a diagram schematically representing an example device 2010. Device 2010 includes electrical assembly 1900 and a housing 2012. Housing 2012 includes a first (e.g., inner) housing portion 2002 and a second (e.g., outer) housing portion 2004. In some examples, as described above with reference to FIG. 23, the electrical assembly 1900 is potted to form the inner housing portion 2002, and the inner housing portion 2002 is placed inside a rigid outer housing portion 2004. In some examples, the electrical assembly 1900 is first placed inside a rigid outer housing portion 2004 and then potted in an epoxy, silicon, thermoplastic urethane material, or another suitable potting material to form the inner housing portion 2002. Accordingly, in this example, the outer housing portion 2004 is used as the potting mold.

[0194] In some examples, electrical assembly 1900 and inner housing portion 2002 are overmolded with a polyurethane, polyester, PEEK, or another suitable thermoplastic material to form the outer housing portion 2004. In some examples, electrical assembly 1900 is overmolded with a first polyurethane, polyester, PEEK, or other suitable thermoplastic material (which may be a lower reflow temperature material to avoid damage to the electrical assembly 1900) to form the inner housing portion 2002, and then inner housing portion 2002 is overmolded with a second polyurethane, polyester, PEEK, or another suitable thermoplastic material (which may be a higher reflow temperature material for mechanical robustness and biocompatibility) to form the outer housing portion 2004. The inner housing portion 2002 and / or the outer housing portion 2004 may form a hermetic barrier.

[0195] FIGS. 25A-25D are diagrams schematically representing a method for fabricating an IMD. As illustrated in FIG. 25A at 2020a, the method includes providing a ceramic housing 2022 (e.g., casted ceramic pocket) including an opening 2023. As illustrated in FIG. 25B at 2020b, the method includes attaching (e.g., brazing) a metallic ring 2024 to the ceramic housing 2022 around the opening 2023. The metallic ring 2024 may be brazed to the ceramic housing 2022 without any electronics within the housing 2022 to prevent heat damage to the electronics. As illustrated in FIG. 25C at 2020c, the method includes placing the electrical assembly1618.327.111551900 inside the ceramic housing 2022 through the opening 2023. As illustrated in FIG. 25D at 2020d, the method includes attaching (e.g., laser welding) a feedthrough 2026 to the metallic ring 2024 to form a hermetic seal. Feedthrough 2026 may include a plurality of feedthrough posts 2028, which are electrically coupled to electrical assembly 1900. Feedthrough posts 2028 may be electrically coupled to a lead (e.g., 3224 of FIG. 39). While feedthrough 2026 includes four feedthrough posts 2028 in FIG. 25D, in some examples feedthrough 2026 may include less than four feedthrough posts 2028 (e.g., 1, 2, or 3) or more than four feedthrough posts 2028 (e.g., 5, 6, 7, 8, etc.). In some examples, feedthrough 2026 may include at least some of substantially the same features and attributes as the electrical connectors described below in association with at least FIGS. 31 A-36C.

[0196] FIG. 26A is a diagram schematically representing an example electrical assembly 2030 for a device (e.g., an IMD). Electrical assembly 2030 includes a coil 1904, a power element 1910, a printed circuit board assembly (PCBA) 1920, and a ferrite sheet 1928. In some examples, the coil 1904 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the example coils 350, 400, 704, or 905 described in association with at least FIGS. 3-10B. In some examples, the power element 1910 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the example power element 706 described in association with at least FIGS. 7A-7B, 8A-8C, and 9A-10C. In some examples, the PCBA 1920 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the PCBA 906a-906c described in association with at least FIGS. 9A and 9B. In some examples, the ferrite sheet 1928 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the ferrite sheet 908a described in association with at least FIG. 9B.

[0197] In the example illustrated in FIG. 26A, power element 1910 comprises a one-half obround shape (e.g., a first portion including a rectangular cuboid shape and a second portion with a semi-circular shape) In some examples, power element1618.327.111561910 may have another suitable shape, such as a rectangular cuboid, a cylinder, etc. Coil 1904 is wrapped around (e.g., surrounding) the ferrite sheet 1928 and PCBA 1920 and includes a first end 1906 and a second end 1908 electrically coupled to the PCBA 1920. Power element 1910 includes a first terminal 1912 (e.g., positive terminal) and a second terminal 1914 (e.g., negative terminal) electrically coupled to the PCBA 1920. PCBA 1920 includes a printed circuit board (PCB) 1922 supporting a plurality of components 1924 (e.g., see FIG. 17A). Components 1924 may include radio 708, first circuit 710, second circuit 712, control portion 720 or 820, stimulation element 804, sensing element 806, capacitor 1404, rectifier 1406, regulator 1408, impedance matching circuit 1412 or 1506, ASIC 1422, controller 1424, first filter 1502, second filter 1504 of FIGS. 7A-8D and FIGS. 14A-14E, and / or other components or circuitry. In the example illustrated in FIG. 26A, the power element 1910 and the PCBA 1920 are laterally aligned. In some examples, the power element 1910 and the PCBA 1920 may have another suitable arrangement, such as the PCBA 1920 being perpendicular to the power element 1910. In some examples, the coil 1904 may be spaced apart from the power element 1910 by a distance as indicated at 1911 to increase the WPT efficiency. In some examples, distance 1911 may be greater and about 1 millimeter, such as greater than about 2 millimeters.

[0198] In some examples, electrical assembly 2030 may be supported, secured, and enclosed (e.g., housed) similarly to electrical assembly 1900 as described in association with FIGS. 18A-25D.

[0199] FIG. 26B is a diagram schematically representing an example device 2040 (e.g., an IMD). Device 2040 includes a housing 2042 enclosing an electrical assembly 2030 of FIG. 26A (not visible in FIG. 26B) or electrical assembly 1900 of FIG. 17A. Housing 2042 includes a first (e.g., pocket) housing portion 2044 and a second (e.g., end cap) housing portion 2046 sealed (e.g., hermetically sealed) to the first housing portion 2044. In some examples, second housing portion 2046 may be coupled to a lead as described below with reference to at least FIGS. 39-40C.

[0200] Housing 2042 includes a length (e.g., along the major axis) indicated at 2048, a width (e.g., along the minor axis) indicated at 2050, and a height (e.g.,1618.327.11157thickness) indicated at 2052. In some examples, the length 2048 of the housing 2042 is less than or equal to about 4 centimeters, the width 2050 of the housing 2042 is less than or equal to about 2.5 centimeters, and the height 2052 of the housing 2042 is less than or equal to about 2.5 centimeters. In some examples, a volume enclosed by the housing 2042 is within a range between about 0.5 cubic centimeters and about 5 cubic centimeters. In some examples, a volume enclosed by the housing 2042 is within a range between about 5 cubic centimeters and about 20 cubic centimeters. In some examples, the housing 2042 is sized and / or shaped for implantation into a patient via a single incision having a length within a range between about 0.5 centimeters and about 3 centimeters. In some examples, the housing 2042 is sized and / or shaped for implantation into a patient via a single incision having a length within a range between about 0.5 centimeters and about 8 centimeters. In some examples, the housing 2042 is sized and / or shaped for percutaneous implantation into a patient. In some examples, the housing 2042 is sized and / or shaped to be implanted within a head-and-neck region of a patient. For example, housing 2042 may include a cross-sectional area less than about 1.5 square centimeters, a major axis (e.g., length 2048) less than about 1.5 centimeters, and a volume less than about 3.0 cubic centimeters.

[0201] In some examples, the housing 2042 may comprise a generally obround shape, and in some examples, the utmost end portion of at least one end (e.g., end cap 2046) of the housing 2042 may comprise a flattened portion such as for connecting a lead and / or for other purposes.

[0202] FIGS. 27A-27C are diagrams schematically representing an example device 2060 including a removable and replaceable power element. Device 2060 includes a housing 2062 including a power element housing 2066 and a PCBA housing 2064. In some examples, a coil (e.g., 1904) may be included within the power element housing 2066 (e.g., wrapped around the power element as illustrated in FIG. 17A). In some examples, a coil (e.g., 1904) may be included within the PCBA housing 2064 (e.g., wrapped around the PCBA as illustrated in FIG. 26A). Power element housing 2066 may be removably coupled mechanically to PCBA housing 2064 and secured1618.327.11158via at least two screws 2068 (only one screw is visible in FIG. 27A). With power element housing 2066 mechanically coupled to PCBA housing 2064, the power element (e.g., 1910) within power element housing 2066 is electrically coupled to the PCBA (e.g., 1920) within the PCBA housing 2064, and a hermetic seal (e.g., via a gasket) is formed between the power element housing 2066 and the PCBA housing 2064. Accordingly, when implanted within a patient, the power element (e.g., 1910) may be replaced without removing the PCBA housing 2064 and, in some examples, a lead that may be coupled to the PCBA housing 2064.

[0203] FIG. 27B is a diagram schematically representing an example PCBA housing 2064. PCBA housing 2064 may include at least two receivers 2072 (only one receiver is visible in FIG. 27B) each for receiving a screw 2068 (FIG. 27A) when PCBA housing 2064 is mechanically coupled to the power element housing 2066. PCBA housing 2064 also includes a plurality (e.g., at least two) electrical contacts 2070 to electrically couple the PCBA (e.g., 1920) within the PCBA housing 2064 to the power element (e.g., 1910) within the power element housing 2066 when the PCBA housing 2064 is mechanically coupled to the power element housing 2066. In some examples, electrical contacts 2070 may include at least some of substantially the same features and attributes as the electrical connectors described below in association with at least FIGS. 31A-36C.

[0204] FIG. 27C is a diagram schematically representing an example power element housing 2066. Power element housing 2066 may include at least two receivers 2082 each for receiving a screw 2068 (FIG. 27A) when power element housing 2066 is mechanically coupled to the PCBA housing 2064. Power element housing 2066 also includes a plurality (e.g., at least two) feedthrough posts 2080 to electrically couple the power element (e.g., first terminal 1912 and second terminal 1914 of power element 1910) within the power element housing 2066 to the PCBA (e.g., 1920) within the PCBA housing 2064 when the power element housing 2066 is mechanically coupled to the PCBA housing 2064. In some examples, feedthrough posts 2080 may include at least some of substantially the same features and1618.327.11159attributes as the electrical connectors described below in association with at least FIGS. 31A-36C.

[0205] FIGS. 28A-28D are diagrams schematically representing another example device (e.g., IMD) including a removable and replaceable power element. FIG. 28A is a diagram schematically representing an example electrical assembly 2100 for a device (e.g., an IMD). Electrical assembly 2100 includes a coil 2104, a power element 2110, a printed circuit board assembly (PCBA) 2120, and a ferrite sheet 2128. In some examples, the coil 2104 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the example coils 350, 400, 704, or 905 described in association with at least FIGS. 3-10B. In some examples, the power element 2110 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the example power element 706 described in association with at least FIGS. 7A-7B, 8A-8C, and 9A-10C. In some examples, the PCBA 2120 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the PCBA 906a-906c described in association with at least FIGS. 9A and 9B. In some examples, the ferrite sheet 1928 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the ferrite sheet 908a described in association with at least FIG. 9B.

[0206] Coil 2104 is wrapped around (e.g., surrounding) the ferrite sheet 2128 and PCBA assembly 2120 and includes a first end 2106 and a second end 2108 electrically coupled to the PCBA 2120. In some examples, PCBA 2120 may include circuitry to selectively electrically connect the first end 2106 to the second end 2108 for WPT and / or inductive communications and electrically disconnect the first end 2106 from the second end 2108 for RF communications. Power element 2110 includes a first terminal 2112 (e.g., positive terminal) and a second terminal 2114 (e.g., negative terminal) electrically coupled to the PCBA 2120. In this example, power element 2110 has a cylindrical shape. PCBA 2120 includes a printed circuit board (PCB) 2122 supporting a plurality of components 2124. Components 21241618.327.11160may include radio 708, first circuit 710, second circuit 712, control portion 720 or 820, stimulation element 804, sensing element 806 (e.g., acoustic sensor 1720 of FIGS.15E and 15F), capacitor 1404, rectifier 1406, regulator 1408, impedance matching circuit 1412 or 1506, ASIC 1422, controller 1424, first filter 1502, second filter 1504 of FIGS. 7A-8D and FIGS. 14A-14E, and / or other components or circuitry.

[0207] FIGS. 28B is a diagram schematically representing an example device 2130 (e.g., IMD) including a removable and replaceable power element 2110 (FIG. 28A). Device 2130 includes a housing 2132 including a power element housing 2136 and a PCBA housing 2134. In some examples, a coil 2104 may be included within PCBA housing 2134 (e.g., wrapped around the PCBA 2120 as illustrated in FIG. 28A). In some examples, a coil may be included within the power element housing 2136 (e.g., wrapped around the power element 2110). Power element housing 2136 may be removably coupled mechanically to PCBA housing 2134 and secured via a threaded connection, which is facilitated by the cylindrical shape of the power element 2110. With power element housing 2136 mechanically coupled to PCBA housing 2134, the power element 2110 within power element housing 2136 is electrically coupled to the PCBA 2120 within the PCBA housing 2134, and a hermetic seal (e.g., via a gasket) is formed between the power element housing 2136 and the PCBA housing 2134. Accordingly, when implanted within a patient, the power element may be replaced without removing the PCBA housing 2134 and, in some examples, a lead that may be coupled to the PCBA housing 2134.

[0208] FIG. 28C is a diagram schematically representing an example PCBA housing 2134. PCBA housing 2134 may include an internally threaded portion 2140 for receiving an externally threaded portion (illustrated in FIG. 28D) when PCBA housing 2134 is mechanically coupled to the power element housing 2136. PCBA housing 2134 also includes a first electrical contact 2142 (e.g., inner ring contact) and a second electrical contact 2144 (e.g., outer ring contact) to electrically couple the PCBA 2120 within the PCBA housing 2134 to the first terminal 2112 and the second terminal 2114, respectively, of the power element 2110 within the power element housing 2136 when the PCBA housing 2134 is mechanically coupled to the1618.327.11161power element housing 2136. In some examples, electrical contacts 2142 and 2144 may include at least some of substantially the same features and attributes as the electrical connectors described below in association with at least FIGS. 31 A-36C.

[0209] FIG. 28D is a diagram schematically representing an example power element housing 2136. Power element housing 2136 may include an externally threaded portion 2150 for threading into the internally threaded portion 2140 of FIG.280 when power element housing 2136 is mechanically coupled to the PCBA housing 2134. Power element housing 2136 also include a first feedthrough post 2152 and a second feedthrough post 2154 to electrically couple the power element (e.g., first terminal 2112 and second terminal 2114, respectively) within the power element housing 2136 to the PCBA 2120 (e.g., via contacts 2142 and 2144, respectively) within the PCBA housing 2134 when the power element housing 2136 is mechanically coupled to the PCBA housing 2134. In some examples, feedthrough posts 2152 and 2154 may include at least some of substantially the same features and attributes as the electrical connectors described below in association with at least FIGS. 31A-36C.

[0210] FIGS. 29A-29D are diagrams schematically representing another example device 2160 (e.g., IMD). FIG. 29A is a diagram schematically representing a crosssection of the device 2160 through a PCBA housing 2162. Device 2160 includes a coil 2104, a PCBA 2120 (including a PCB 2122 supporting a plurality of components 2124), and a ferrite sheet 2128 as previously described and illustrated with reference to FIG. 28A. In this example, PCBA housing 2162 includes a ceramic material (e.g., alumina oxide or zirconia). PCBA housing 2162 encloses the coil 2104, PCBA 2120, and ferrite sheet 2128. Thus, by arranging the coil 2104 within the ceramic PCBA housing 2162 rather than within a metal enclosure, the magnetic field generated by the coil 2104 is not redirected or attenuated by the metal enclosure, thereby improving coupling with an external device (e.g., external element 150 in FIG. 1 B and / or external charger 3670, mobile device 3620, remote control 3640, clinician programmer 3650, or patient management tool 3660 of FIG. 42).1618.327.11162

[0211] FIG. 29B is a diagram schematically representing a cross-section of the device 2160 through a power element housing 2164. Power element housing 2164 encloses / encapsulates a power element 2166, such that power element housing 2164 forms both the external housing of device 2160 and the power element enclosure / case. Accordingly, in this example power element 2166 does not include a separate power element enclosure (e.g., see 1910 of FIG. 26A) within the power element housing 2164. Power element housing 2166 may include a metal (e.g., stainless steel, titanium, MP35N, nickel-alloys, Pt-lr, nitinol).

[0212] FIG. 29C is a diagram schematically representing an exploded view of the device 2160 prior to assembly. As shown in FIG. 29C, device 2160 includes a PCBA housing 2162, a power element housing 2164, and a brazing ring 2172. Power element 2166 includes a first terminal 2168 (e.g., positive terminal) and a second terminal 2170 (e.g., negative terminal). Brazing ring 2172 may include the same material as power element housing 2164, such as a metal (e.g., stainless steel, titanium, MP35N, nickel-alloys, Pt-lr, nitinol). PCBA housing 2162 may include a recessed portion 2163 extending around the edge of the PCBA housing 2162 where brazing ring 2172 is to be connected. Likewise, power element housing 2164 may include a recessed portion 2165 extending around the edge of the power element housing 2164 where brazing ring 2172 is to be connected.

[0213] FIG. 29D is a diagram schematically representing device 2160 after the device is assembled. Brazing ring 2172 may be brazed to the ceramic PCBA housing 2162. Next, the PCBA assembly 2120 may be electrically connected to the first terminal 2168 and the second terminal 2170 of the power element 2166. The assembled coil 2104, PCBA assembly 2120, and ferrite sheet 2128 may then be inserted into the PCBA housing 2162. The brazing ring 2172 may then be welded (e.g., laser welded) to the power element housing 2164 to form a hermetic seal between the PCBA housing 2162 and the power element housing 2164. In some examples, the depth of recessed portion 2163 of PCBA housing 2162 and the depth of recessed portion 2165 of power element housing 2164 may be about equal to the thickness of brazing ring 2172, such that the outer surface of brazing ring 2172 does1618.327.11163not protrude past the outer surfaces of PCBA housing 2162 and power element housing 2164.

[0214] FIG. 29E is a diagram schematically representing another example device 2161 (e.g., IMD). Device 2161 is similar to device 2160 of FIGS. 29A-29D, except that device 2161 includes a PCBA 2121 including a coil 2105 in place of PCBA 2120 and coil 2104. In some examples, the coil 2105 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the example coils 350, 400, 704, or 905 described in association with at least FIGS. 3-10B.

[0215] Device 2161 includes a power element housing 2164 and a PCBA housing 2162 as previously described. In FIG. 29E, a portion of the PCBA housing 2162 has been removed for illustrative purposes to show the PCBA 2121 within the PCBA housing 2162. In this example, PCBA 2121 includes a PCB 2123 supporting a plurality of components 2124 (e.g., radio 708, first circuit 710, second circuit 712, control portion 720 or 820, stimulation element 804, sensing element 806, capacitor 1404, rectifier 1406, regulator 1408, impedance matching circuit 1412 or 1506, ASIC 1422, controller 1424, first filter 1502, second filter 1504 of FIGS. 7A-8D and FIGS.14A-14E, and / or other components or circuitry) and the coil 2105. In some examples, the coil 2105 may be wrapped around a ferrite core 2107. The coil 2105 may be arranged adjacent to an edge of the PCB 2123, which may improve the WPT efficiency of the device 2161.

[0216] FIGS. 30A-30C are diagrams schematically representing another example device 2180 (e.g., IMD). FIG. 30A is a diagram schematically representing a crosssection of the device 2180 through a PCBA housing 2182. Device 2180 includes a coil 2104, a PCBA 2120 (including a PCB 2122 supporting a plurality of components 2124), and a ferrite sheet 2128 as previously described and illustrated with reference to FIG. 28A. In this example, PCBA housing 2182 includes a metal (e.g., stainless steel, titanium, MP35N, nickel-alloys, Pt-lr, nitinol) enclosure 2184 and a window 2186 extending through the metal enclosure 2184. The coil 2104 may be arranged within the PCBA housing 2182 adjacent (e.g., directly adjacent) to the window 2186.1618.327.11164The window 2186 may include a ceramic material (e.g., alumina oxide or zirconia) or another non-magnetic material, such as a thermoplastic polymer (e.g., silicone, polysulfone), a thermoset material, a blend polymer material (e.g., PEEK), or a combination thereof. Thus, by arranging the coil 2104 adjacent to the window 2186, the magnetic field generated by the coil 2104 is not redirected or attenuated by the metal enclosure 2184, thereby improving coupling with an external device (e.g., external element 150 in FIG. 1 B and / or external charger 3670, mobile device 3620, remote control 3640, clinician programmer 3650, or patient management tool 3660 of FIG. 42). While the window 2186 is illustrated on a major face of the PCBA housing 2182, in some examples, the window 2186 may be arranged on a side face (e.g., perpendicular to the major face) of the PCBA housing 2182.

[0217] FIG. 30B is a diagram schematically representing an exploded view of the device 2180 prior to assembly. As shown in FIG. 30B, device 2180 includes a PCBA housing 2182 and a power element housing 2164 (as previously described and illustrated with reference to FIGS. 29B-29D). Power element 2166 (FIG. 29B) includes a first terminal 2168 (e.g., positive terminal) and a second terminal 2170 (e.g., negative terminal). Metal enclosure 2184 of PCBA housing 2182 may include an internal recessed portion 2185 extending around the edge of the metal enclosure 2184 where power element housing 2164 is to be connected. Power element housing 2164 may include a recessed portion 2165 corresponding to internal recessed portion 2185 extending around the edge of the power element housing 2164 where metal enclosure 2184 is to be connected.

[0218] FIG. 30C is a diagram schematically representing device 2180 after the device is assembled. The window 2186 may be brazed to the metal enclosure 2184. The PCBA assembly 2120 may be electrically connected to the first terminal 2168 and the second terminal 2170 of the power element 2166. The assembled coil 2104, PCBA assembly 2120, and ferrite sheet 2128 may then be inserted into the PCBA housing 2182. The metal enclosure 2185 may then be welded (e.g., laser welded) to the power element housing 2164 to form a hermetic seal between the PCBA housing 2182 and the power element housing 2164. In some examples, the outer1618.327.11165surfaces of PCBA housing 2182 are aligned with the corresponding outer surfaces of the power element housing 2164.

[0219] The following FIGS. 31A-36C illustrate example electrical connectors that may be used to electrically connect a power element to other circuitry within a device, such as within an IMD as described with reference to at least FIGS. 7A-10C and 15A-30C.

[0220] FIG. 31 A illustrates a side view of an example electrical connector 2200a for a device, such as an IMD (e.g., 2060 of FIGS. 27A-27C or 2130 of FIGS. 28A-28D) or another device also including a power source and / or circuitry, as one example. It will be understood that references to a pulse generator, stimulation circuitry, sensing circuitry, etc. in the following examples throughout the remaining portions of the present disclosure may be applicable generally to, and for use with, any kind of implantable medical device, circuitry, etc.

[0221] Electrical connector 2200a includes a plurality (e.g., at least two) of feedthrough posts 2204 protruding from a housing 2202 of an IMD. The housing 2202 may be made of an electrically conductive material, such as a metal (e.g., stainless steel, titanium, MP35N, nickel-alloys, Pt-lr, nitinol) and / or an electrically insulating material (e.g., ceramic, PEEK, polysulfone). The plurality of feedthrough posts 2204 may be electrically isolated from each other. The plurality of feedthrough posts 2204 are configured to be connected to a power element (e.g., 706, 1910, 2110) to electrically connect at least two terminals of the power element to circuitry, such as to a PCBA (e.g., 1920, 2120). Each feedthrough post 2204 includes an electrically conductive material, such as a metal (e.g., stainless steel, titanium, Pt-lr, Palladium, gold, MP35N, nickel-alloys, nitinol). In some examples, each feedthrough post 2204 may be solid, and the electrical connector 2200a may be a male connector configured to be connected to a female connector of a power element. In other examples, each feedthrough post 2204 may be hollow, and the electrical connector 2200a may be a female connector configured to be connected to a male connector of a power element. Each feedthrough post 2204 may extend from an external surface 2203 of the housing 2202 as indicated at 2206 within a range, for example,1618.327.11166between flush with the surface and extending about 15.0 millimeters. The spacing between adjacent feedthrough posts 2204 as indicated at 2208 may be within a range, for example, between about 0.10 millimeters and about 5 millimeters. Each feedthrough post 2204 may have a diameter or width as indicated at 2210 within a range, for example, between about 0.05 millimeters and about 2.0 millimeters. In this example, the electrical connector 2200a includes two aligned feedthrough posts 2204. Thus, the area occupied by the two feedthrough posts 2204 could be as small as 0.05 millimeters by 0.2 millimeters. In other examples, the electrical connector 2200a may include another suitable number of feedthrough posts 2204, such as 1, 2, 3, 4, 5, 6, 7, 9, 10, or more, and they do not necessarily need to be arranged in a linear manner.

[0222] The dimensions and spacing of the feedthrough posts 2204 described above may also be applicable to other contacts (e.g., contact pads, amorphous compliant contacts) and / or other arrangements and / or configurations of feedthrough posts 2204 described below with reference to the following FIGS. 32A-36C.

[0223] FIG. 31 B illustrates a plan view of another example electrical connector 2200b for a device, such as an IMD. In one example, the electrical connector 2200b is similar to the electrical connector 2200a of FIG. 31 A and includes feedthrough posts 2204 protruding from the external surface 2203 of the housing 2202. In other examples, the feedthrough posts 2204 may be flush with the external surface 2203 of the housing 2202, such that the posts 2204 do not protrude from the external surface 2203 of the housing 2202. In yet other examples, the feedthrough posts 2204 may be recessed with respect to the external surface 2203 of the housing 2202. The spacing between the feedthrough posts 2204 as indicated at 2208 and the diameter or width of each feedthrough post 2204 as indicated at 2210 may be similar to the values previously described with reference to FIG. 31 A. While each feedthrough post 2204 is illustrated as circular in cross-section in the example of FIG. 31 B, in other examples, each feedthrough post 2204 may have another suitable cross-sectional shape, such as oval, square, rectangular, triangular, hexagonal, octagonal, etc.1618.327.11167

[0224] FIG. 32A illustrates a cross-sectional view of an example electrical connector 2220a for a device, such as an IMD. Electrical connector 2220a includes a plurality of feedthrough posts 2204 extending through a wall of the housing 2202 and flush with an external surface 2203 of the housing 2202. The wall of the housing 2202 surrounding the feedthrough posts 2204 includes an electrically insulating material, such as a ceramic material, glass, lead cement, PEEK, polysulfone (PSU), etc. The electrical connector 2220a also includes a plurality of deflectable contacts 2222. Each deflectable contact 2222 is electrically connected (e.g., welded, conductive epoxy bond) to a respective feedthrough post 2204 on the external surface 2203 of the housing 2202. Each deflectable contact 2222 may include a leaf spring as illustrated in FIG. 32A or another suitable contact that can return to its original shape after being contacted, pressed, compressed, or otherwise deformed (e.g., coil spring, pogo pin, ball detent, radial spring, etc.). Each deflectable contact 2222 is configured to be electrically connected to a corresponding contact of a power element to electrically connect the power element to stimulation circuitry (and / or other circuitry) of the pulse generator. While two feedthrough posts 2204 and respective deflectable contacts 2222 are illustrated in FIG. 32A, the electrical connector 2220a may include any suitable number (e.g., 3, 4, 5, 6, 7, 8, or more) of feedthrough posts 2204 and respective deflectable contacts 2222. The plurality of feedthrough posts 2204 and respective deflectable contacts 2222 of the electrical connector 2220a may be arranged in any suitable manner (e.g., single line, two-dimensional array, circle, etc.).

[0225] FIG. 32B illustrates a cross-sectional view of another example electrical connector 2220b for a device, such as an IMD. Electrical connector 2220b includes a plurality of feedthrough posts 2204 extending through a wall of a housing 2202 and flush with an external surface 2203 of the housing 2202. The electrical connector 2220b also includes a plurality of amorphous compliant contacts 2224 arranged within an insulating layer 2226 on the external surface 2203 of the housing 2202. Each amorphous compliant contact 2224 is electrically connected to a respective feedthrough post 2204 on the external surface 2203 of the housing 2202. In other1618.327.11168examples, the feedthrough posts 2204 may be recessed with respect to the external surface 2203 of the housing 2202, and each amorphous compliant contact 2224 may be arranged within a respective recess, such that insulating layer 2226 may be excluded.

[0226] Each amorphous compliant contact 2224 may include a conductive polymer, such as a conductive silicone (e.g., carbon nanotubes mixed into silicone and held in suspension, carbon black, silver infused polymer), carbon nanotubes, carbon fiber, a graphene film, silver doping, a wire or another suitable material that can return to its original shape after being contacted, pressed, compressed, or otherwise deformed. In the example of the amorphous compliant contact being a wire, the wire may include a single gold-plated beryllium copper wire or a single gold-plated molybdenum wire randomly arranged to form a contact. In other examples, the wire may include nitinol, MP35N, stainless steel, or titanium. In some examples, each amorphous compliant contact includes a plurality of electrical pathways through the contact. Each amorphous compliant contact 2224 is configured to be electrically connected to a corresponding contact of a power element to electrically connect the power element to stimulation circuitry (and / or other circuitry) of the IMD. While two feedthrough posts 2204 and respective amorphous compliant contacts 2224 are illustrated in FIG. 32B, the electrical connector 2220b may include any suitable number (e.g., 3, 4, 5, 6, 7, 8, or more) of feedthrough posts 2204 and respective amorphous compliant contacts 2224. The plurality of feedthrough posts 2204 and respective amorphous compliant contacts 2224 of the electrical connector 2220b may be arranged in any suitable manner (e.g., single line, two-dimensional array, circle, etc.).

[0227] FIG. 33A illustrates a side view and FIG. 33B illustrates a plan view of an example device 2300a. Device 2300a may include a pulse generator 2302 (e.g., PCBA, radio, control portion, stimulation element, sensing element, etc.) and an electrical connector 2220a electrically connected to the pulse generator 2302. In addition to the feedthrough posts 2204 and the deflectable contacts 2222 (e.g., leaf springs) as previously described and illustrated with reference to FIG. 32A, in this1618.327.11169example, the electrical connector 2220a also includes a compliant electrically insulating material 2250 surrounding the plurality of feedthrough posts 2204 and the deflectable contacts 2222. In some examples as illustrated in FIG. 33B, the compliant electrically insulating material 2250 also surrounds each of the individual feedthrough posts 2204 and respective deflectable contacts 2222. The compliant electrically insulating material 2250 may include silicone, polyurethane, polyetheretherketone (PEEK), polysulfone, silicone / polyurethane blend, or another suitable material.

[0228] FIG. 33C illustrates a plan view of a power element 2320. Power element 2320 includes an electrical connector 2322 on the power element. Electrical connector 2322 includes a plurality of feedthrough posts 2326 extending through a connector housing 2330. Each feedthrough post 2326 includes an electrically conductive material, such as a metal (e.g., stainless steel, titanium, Pt-lr, MP35N, nickel-alloy, nitinol, platinum). The feedthrough posts 2326 may be flush with a surface 2332 of the connector housing 2330. Each feedthrough post 2326 is electrically connected to a respective terminal of the power element. Each feedthrough post 2326 corresponds to a respective deflectable contact 2222 of the electrical connector 2220a to electrically connect the stimulation circuitry (and / or other circuitry) to the power element. In this example, each feedthrough post 2326 is square shaped in cross-section, and may have a width, for example, within a range between about 0.05 millimeters and about 5 millimeters. In other examples, each feedthrough post 2326 may have another suitable cross-sectional shape, such as rectangular, circular, hexagonal, etc.

[0229] FIG. 33D illustrates a partial cross-sectional view of the device 2300a with the electrical connector 2322 of the power element 2320 connected to the electrical connector 2220a on the device 2300a. In some examples, the electrical connectors 2220a and 2322 may include retention features (e.g., screws) and / or additional mounting posts and / or recesses to align the components. The compliant electrically insulating material 2250 contacts the external surface 2203 of the housing 2202 and the surface 2332 of the connector housing 2330 of the electrical connector 2322 of1618.327.11170the power element 2320 to form a seal (e.g., electrically isolating seal, hermetic seal) between the external surface 2203 of the housing 2202 and the power element 2320. With the electrical connector 2322 of the power element 2320 connected to the electrical connector 2220a, the stimulation circuitry (and / or other circuit) of the pulse generator 2302 is electrically connected to the power element 2320 via the feedthrough posts 2204, deflectable contacts 2222, and feedthrough posts 2326.

[0230] FIG. 34A illustrates a side view and FIG. 34B illustrates a plan view of another example device 2300b. Device 2300b may include a pulse generator 2302 and an electrical connector 2220b electrically connected to the pulse generator 2302. Device 2300b includes the feedthrough posts 2204 as previously described and illustrated with reference to FIG. 33B.

[0231] FIG. 34C illustrates a plan view and FIG. 34D illustrates a cross-sectional view of an interposer 2340. Interposer 2340 includes a plurality of amorphous compliant contacts 2224, a compliant electrically insulating material 2250, and an insulating layer 2226. The compliant electrically insulating material 2250 surrounds the plurality of amorphous compliant contacts 2224. The compliant electrically insulating material 2250 may also surround each of the individual amorphous compliant contacts 2224 on both a first surface of the interposer 2340 (e.g., the top surface of the insulating layer 2226) and on a second surface of the interposer 2340 (e.g., the bottom surface of the insulating layer 2226) opposite to the first surface. Each amorphous compliant contact 2224 corresponds to a respective feedthrough post 2204 of the electrical connector 2220b. In this example, each amorphous compliant contact 2224 is square shaped in cross-section, and may have a width, for example, within a range between about 0.05 millimeters and about 5 millimeters. In other examples, each amorphous compliant contact 2224 may have another suitable cross-sectional shape, such as rectangular, circular, hexagonal, etc.

[0232] FIG. 34E illustrates a plan view of a power element 2320. Power element 2320 includes an electrical connector 2322 on the power element. Electrical connector 2322 includes a plurality of feedthrough posts 2326 extending through a connector housing 2330. The feedthrough posts 2326 may be flush, protrude, or be1618.327.11171recessed with respect to a surface 2332 of the connector housing 2330. Each feedthrough post 2326 is electrically connected to a respective terminal of the power element 2320. Each feedthrough post 2326 corresponds to a respective amorphous compliant contact 2224 of the interposer 2340 and a respective feedthrough post 2204 of the electrical connector 2220b to electrically connect the stimulation circuitry (and / or other circuitry) to the power element 2320. Retention features (e.g., screws) may be used to secure the connector housing 2330 and the interposer 2340 to the electrical connector 2220b.

[0233] FIG. 34F illustrates a partial cross-sectional view of the device 2300b with the electrical connector 2322 of the power element 2320 and the interposer 2340 connected to the electrical connector 2220b on the device 2300b. In some examples, the electrical connectors 2220b and 2322 may include retention features (e.g., screws) and / or additional mounting posts and / or recesses to align the components. The compliant electrically insulating material 2250 of the interposer 2340 contacts the external surface 2203 of the housing 2202 and the surface 2332 of the connector housing 2330 of the electrical connector 2322 of the power element 2320 to form a seal (e.g., electrically isolating seal, hermetic seal) between the external surface 2203 of the housing 2202 and the power element 2320. With the electrical connector 2322 of the power element 2320 connected to the electrical connector 2220b via the interposer 2340, the stimulation circuitry (and / or other circuitry) of the pulse generator 2302 is electrically connected to the power element 2320 via the feedthrough posts 2204, amorphous compliant contacts 2224, and feedthrough posts 2326.

[0234] FIG. 35A illustrates a side view and FIG. 35B illustrates a plan view of another example device 2600. Device 2600 may include a pulse generator 2302 and an electrical connector 2610 electrically connected to the pulse generator 2302. As shown in the cross-sectional view of FIG. 35D, the electrical connector 2610 includes a plurality of feedthrough posts 2204 electrically connected to the stimulation circuitry (and / or other circuitry) and extending through the housing 2202. The plurality of feedthrough posts 2204 may extend through an electrically insulating1618.327.11172material block 2612 (e.g., a ceramic material block) integral with the housing 2202, as shown in FIG. 35D, or separate from the housing 2202. The electrical connector 2610 also includes a plurality of amorphous compliant contacts 2224, where each amorphous compliant contact 2224 is electrically connected to a respective feedthrough post 2204 and at least partially extends into insulating material block 2612 as shown in FIG. 35D. In this example, as shown in FIG. 35B, the electrical connector 2610 includes two feedthrough posts 2204 and respective amorphous compliant contacts 2224. In some examples, the electrical connector 2610 may include more than two feedthrough posts 2204 and respective amorphous compliant contacts 2224.

[0235] As illustrated in FIG. 35D, the electrical connector 2610 also includes mounting screw receivers 2614. In this example as illustrated in FIG. 35D, a first mounting screw receiver 2614 is arranged to the left of and perpendicular to the two feedthrough posts 2204 and respective amorphous compliant contacts 2224, and a second mounting screw receiver 2614 is arranged to the right of and perpendicular to the two feedthrough posts 2204 and respective amorphous compliant contacts 2224. In other examples, the electrical connector 2610 may include a single mounting screw receiver or more than two mounting screw receivers, and the mounting screw receiver(s) may have another suitable arrangement with respect to the feedthrough posts 2204 and the respective amorphous compliant contacts 2224.

[0236] As illustrated in FIG. 35D, the electrical connector 2610 may also include a compliant electrically insulating material 2634 surrounding the plurality of feedthrough posts 2204, the amorphous compliant contacts 2224, and the insulating material block 2612. In this example, the compliant electrically insulating material 2634 is directly attached (e.g., glued, adhered, overmolded) to the sides of the insulating material block 2612 and includes two rings of compliant electrically insulating material. In other examples, the compliant electrically insulating material 2634 may include a single ring of compliant electrically insulating material or more than two rings of compliant electrically insulating material. The compliant electrically1618.327.11173insulating material 2634 may include silicone, polyurethane, polyetheretherketone (PEEK), polysulfone, silicone / polyurethane blend, or another suitable material.

[0237] FIG. 35C illustrates a plan view of a power element 2620. Power element 2620 includes an electrical connector 2622 on the power element. The electrical connector 2622 includes a plurality of feedthrough posts 2624 extending through a connector housing 2626 and mounting screw receivers 2630 (FIG. 35D). The feedthrough posts 2624 may be flush with a recessed surface 2628 of the connector housing 2626, such that inner sidewalls 2629 of the connector housing 2626 surround the feedthrough posts 2624. The inner sidewalls 2629 are perpendicular to the recessed surface 2628. Each feedthrough post 2624 is electrically connected to a respective terminal of the power element 2620. Each feedthrough post 2624 corresponds to a respective amorphous compliant contact 2224 of the electrical connector 2610 to electrically connect the stimulation circuitry (and / or other circuitry) to the power element 2620. Each mounting screw receiver 2630 corresponds to a respective mounting screw receiver 2614 of the electrical connector 2610 to secure the connector housing 2626 to the electrical connector 2610 using screws 2632 as shown in FIG. 35D.

[0238] FIG. 35D illustrates a cross-sectional view of the electrical connector 2622 of the power element 2620 connected to the electrical connector 2610 on the device 2600. The mounting screw receivers 2614 and 2630 and insulating material block 2612 and connector housing 2626 act as alignment features to align the electrical connector 2622 on the power element 2620 with the electrical connector 2610. Each mounting screw receiver 2630 may include a recessed portion for receiving the head of a respective screw 2632, such that the head of the respective screw 2632 does not protrude from the outer surface of the connector housing 2626. The compliant electrically insulating material 2634 contacts insulating material block 2612 of the electrical connector 2610 and the inner sidewalls 2629 of the connector housing 2626 of the electrical connector 2622 of the power element 2620 to form a seal (e.g., electrically isolating seal, hermetic seal) between the electrical connector 2610 and the power element 2620. The compliant electrically insulating material 2634 may1618.327.11174deflect when the electrical connector 2622 is connected to the electrical connector 2610. With the electrical connector 2622 of the power element 2620 connected to the electrical connector 2610, the stimulation circuitry (and / or other circuitry) of the pulse generator 2302 is electrically connected to the power element 2620 via the feedthrough posts 2204, amorphous compliant contacts 2224, and feedthrough posts 2624.

[0239] FIG. 36A illustrates a cross-sectional view of an electrical connector 2652a of a power element 2650a connected to an electrical connector 2640a on a device, such as device 2600 of FIG. 35A. The electrical connector 2640a includes a plurality of feedthrough posts 2204 electrically connected to stimulation circuitry (and / or other circuitry) and extending through the housing 2202. The plurality of feedthrough posts 2204 may extend through an electrically insulating material block 2612 (e.g., a ceramic material block) integral with the housing 2202, as shown in FIG. 36A, or separate from the housing 2202. The feedthrough posts 2204 may be recessed with respect to the surface of the insulating material block 2612. The electrical connector 2640a also includes a plurality of amorphous compliant contacts 2224, where each amorphous compliant contact 2224 is electrically connected to a respective feedthrough post 2204 and at least partially extends into insulating material block 2612. Each amorphous compliant contact 2224 may protrude from the insulating material block 2612.

[0240] The electrical connector 2640a may also include a compliant electrically insulating material 2642a surrounding the plurality of feedthrough posts 2204, the amorphous compliant contacts 2224, and the insulating material block 2612. In this example, the compliant electrically insulating material 2642a is directly attached (e.g., glued, adhered, overmolded) to the sides of the insulating material block 2612 and the surface 2203 of the housing 2202 and includes a single triangular shaped ring of compliant electrically insulating material. The compliant electrically insulating material 2642a may include silicone, polyurethane, polyetheretherketone (PEEK), polysulfone, silicone / polyurethane blend, or another suitable material.1618.327.11175

[0241] Power element 2650a includes an electrical connector 2652a. The electrical connector 2652a includes a plurality of feedthrough posts 2624 extending through a connector housing 2656a. The feedthrough posts 2624 may be flush with a recessed surface 2658a of the connector housing 2656a, such that inner sidewalls 2659a of the connector housing 2656a surround the feedthrough posts 2624. The inner sidewalls 2659a are angled with respect to the recessed surface 2658a (e.g., the angle between the recessed surface 2658a and the inner sidewalls 2656a is greater than about 90 degrees and less than about 170 degrees). Each feedthrough post 2624 is electrically connected to a respective terminal of the power element 2650a. Each feedthrough post 2624 corresponds to a respective amorphous compliant contact 2224 of the electrical connector 2640a to electrically connect the stimulation circuitry (and / or other circuitry) to the power element 2650a. The electrical connector 2640a may be secured to the electrical connector 2652a using screws (not shown), such as via screws 2632 previously described and illustrated with reference to FIG.35D.

[0242] The insulating material block 2612 and connector housing 2656a act as alignment features to align the electrical connector 2652a on the power element 2650a with the electrical connector 2640a. The compliant electrically insulating material 2642a contacts insulating material block 2612 of the electrical connector 2640a, the external surface 2203 of the housing 2202, and the inner sidewalls 2659a of the connector housing 2656a of the electrical connector 2652a of the power element 2650a to form a seal (e.g., electrically isolating seal, hermetic seal) between the electrical connector 2640a and the power element 2650a. The compliant electrically insulating material 2642a may compress when the electrical connector 2652a is connected to the electrical connector 2640a. With the electrical connector 2652a of the power element 2650a connected to the electrical connector 2640a, the stimulation circuitry (and / or other circuitry) of a pulse generator is electrically connected to the power element 2650a via the feedthrough posts 2204, amorphous compliant contacts 2224, and feedthrough posts 2624.1618.327.11176

[0243] FIG. 36B illustrates a cross-sectional view of an electrical connector 2652b of a power element 2650b connected to an electrical connector 2640b on a device, such as device 2600 of FIG. 35A. The electrical connector 2640b includes a plurality of feedthrough posts 2204 electrically connected to the stimulation circuitry (and / or other circuitry) and extending through the housing 2202. The plurality of feedthrough posts 2204 may extend through an electrically insulating material block 2612 (e.g., a ceramic material block) integral with the housing 2202, as shown in FIG. 36B, or separate from the housing 2202. The feedthrough posts 2204 may be recessed with respect to the surface of the insulating material block 2612. The electrical connector 2640b also includes a plurality of amorphous compliant contacts 2224, where each amorphous compliant contact 2224 is electrically connected to a respective feedthrough post 2204 and at least partially extends into insulating material block 2612. Each amorphous compliant contact 2224 may protrude from the insulating material block 2612.

[0244] The electrical connector 2640b may also include a compliant electrically insulating material 2642b surrounding the plurality of feedthrough posts 2204, the amorphous compliant contacts 2224, and the insulating material block 2612, and compliant electrically insulating material 2644 between the amorphous compliant contacts 2224. In this example, the compliant electrically insulating material 2642b is directly attached (e.g., glued, adhered, overmolded) to the sides of the insulating material block 2612 and the surface 2203 of the housing 2202 and includes two ridges extending from a single triangular shaped base portion ring of compliant electrically insulating material. While compliant electrically insulating material 2642b illustrated in FIG. 36B includes two ridges, in other examples, compliant electrically insulating material 2642b may include a single ridge or more than two ridges. The compliant electrically insulating material 2644 may be directly attached (e.g., glued, adhered, overmolded) to the insulating material block 2612 or part of an interposer (e.g., 2340 of FIGS. 34C and 34D). The compliant electrically insulating material 2642b and 2644 may include silicone, polyurethane, polyetheretherketone (PEEK), polysulfone, silicone / polyurethane blend, or another suitable material.1618.327.11177

[0245] Power element 2650b includes an electrical connector 2652b. The electrical connector 2652b includes a plurality of feedthrough posts 2624 extending through a connector housing 2656b. The feedthrough posts 2624 may be recessed with respect to a recessed surface 2658b of the connector housing 2656b, such that portions of amorphous compliant contacts 2224 extend into the connector housing 2656b to electrically contact the feedthrough posts 2624. The recessed surface 2658b is surrounded by inner sidewalls 2659b of the connector housing 2656b. The inner sidewalls 2659b are angled with respect to the recessed surface 2658b (e.g., the angle between the recessed surface 2658b and the inner sidewalls 2659b is greater than about 90 degrees and less than about 170 degrees). Each feedthrough post 2624 is electrically connected to a respective terminal of the power element 2650b. Each feedthrough post 2624 corresponds to a respective amorphous compliant contact 2224 of the electrical connector 2640b to electrically connect the stimulation circuitry (and / or other circuitry) to the power element 2650b. The electrical connector 2640b may be secured to the electrical connector 2652b using screws (not shown), such as via screws 2632 previously described and illustrated with reference to FIG. 35D.

[0246] The insulating material block 2612 and connector housing 2656b act as alignment features to align the electrical connector 2652b on the power element 2650b with the electrical connector 2640b. The compliant electrically insulating material 2642b contacts insulating material block 2612 of the electrical connector 2640b, the external surface 2203 of the housing 2202, and the inner walls 2659b of the connector housing 2656b of the electrical connector 2652b of the power element 2650b to form a seal (e.g., electrically isolating seal, hermetic seal) between the electrical connector 2640b and the power element 2650b. The compliant electrically insulating material 2642b and / or 2644 may compress when the electrical connector 2652b is connected to the electrical connector 2640b. The compliant electrically insulating material 2644 contacts insulating material block 2612 and the surface 2658b of the connector housing 2656b to form seals between the electrical connector 2640b and the portion of the power element 2650b between the amorphous1618.327.11178compliant contacts 2224. With the electrical connector 2652b of the power element 2650b connected to the electrical connector 2640b, the stimulation circuitry (and / or other circuitry) of a pulse generator is electrically connected to the power element 2650b via the feedthrough posts 2204, amorphous compliant contacts 2224, and feedthrough posts 2624.

[0247] FIG. 36C illustrates a cross-sectional view of an electrical connector 2652c of a power element 2650c connected to an electrical connector 2640c on a device, such as device 2600 of FIG. 35A. The electrical connector 2640c includes a plurality of feedthrough posts 2204 electrically connected to the stimulation circuitry (and / or other circuitry) and extending through the housing 2202. The plurality of feedthrough posts 2204 may extend through an electrically insulating material block 2612 (e.g., a ceramic material block) integral with the housing 2202, as shown in FIG. 36C, or separate from the housing 2202. The feedthrough posts 2204 may be flush with the surface of the electrically insulating material block 2612. The electrical connector 2640c also includes a plurality of deflectable contacts 2222 (e.g., leaf springs), where each deflectable contact 2222 is electrically connected to a respective feedthrough post 2204.

[0248] The electrical connector 2640c may also include a compliant electrically insulating material 2634 surrounding the plurality of feedthrough posts 2204, the deflectable contacts 2222, and the insulating material block 2612, and compliant electrically insulating material 2644 between the individual deflectable contacts 2222. In this example, the compliant electrically insulating material 2634 is directly attached (e.g., glued, adhered, overmolded) to the sides of the insulating material block 2612 and includes two rings of compliant electrically insulating material. In other examples, the compliant electrically insulating material 2634 may include a single ring of compliant electrically insulating material or more than two rings of compliant electrically insulating material. The compliant electrically insulating material 2644 may be directly attached (e.g., glued, adhered, overmolded) to the insulating material block 2612 or part of an interposer (e.g., 2340 of FIGS. 34C and 34D). The compliant electrically insulating material 2634 and 2644 may include1618.327.11179silicone, polyurethane, polyetheretherketone (PEEK), polysulfone, polyurethane / silicone blend, or another suitable material.

[0249] Power element 2650c includes an electrical connector 2652c. The electrical connector 2652c includes a plurality of feedthrough posts 2624 extending through a connector housing 2656c. The feedthrough posts 2624 may be flush with a recessed surface 2658c of the connector housing 2656c, such that inner sidewalls 2659c of the connector housing 2656c surround the feedthrough posts 2624. The inner sidewalls 2659c are perpendicular to the recessed surface 2658c. Each feedthrough post 2624 is electrically connected to a respective terminal of the power element 2650c. Each feedthrough post 2624 corresponds to a respective deflectable contact 2222 of the electrical connector 2640c to electrically connect the stimulation circuitry (and / or other circuitry) to the power element 2650c. The electrical connector 2640c may be secured to the electrical connector 2652c using screws (not shown), such as via screws 2632 previously described and illustrated with reference to FIG. 35D.

[0250] The insulating material block 2612 and connector housing 2656c act as alignment features to align the electrical connector 2652c on the power element 2650c with the electrical connector 2640c. The compliant electrically insulating material 2634 contacts insulating material block 2612 of the electrical connector 2640c and the inner walls 2659c of the connector housing 2656c of the electrical connector 2652c of the power element 2650c to form a seal (e.g., electrically isolating seal, hermetic seal) between the electrical connector 2640c and the power element 2650c. The compliant electrically insulating material 2634 and / or 2644 may compress when the electrical connector 2652c is connected to the electrical connector 2640c. The compliant electrically insulating material 2644 contacts insulating material block 2612 and the surface 2658c of the connector housing 2656c to form seals between the electrical connector 2640c and the portion of the power element 2650c between the deflectable contacts 2222. With the electrical connector 2652c of the power element 2650c connected to the electrical connector 2640c, the stimulation circuitry (and / or other circuitry) of a pulse generator is electrically1618.327.11180connected to the power element 2650c via the feedthrough posts 2204, deflectable contacts 2222, and feedthrough posts 2624.

[0251] FIG. 37 is a flow diagram illustrating an example method 2800 for operating a device including a single coil (e.g., 350 of FIG. 3, 400 of FIGS. 4-6, 704 of FIGS.7A-8D, 905 of FIGS. 9A-10B, 1804 of FIG. 16A, 1805 of FIG. 16B, 1904 of FIG. 17A or 26A, 2104 of FIG. 28A, 29A, and 30A, or 2105 of FIG. 29E). In some examples, method 2800 may be implemented by a device (e.g., IMD) as described herein with reference to FIGS. 1A-1C, 7A-10C, 14A-30C, or 39-40D. At 2802, method 2800 includes receiving, via a coil, an inductive wireless power transfer (WPT) signal at a first frequency (e.g., within a range between about 9 kilohertz and about 50 megahertz). At 2804, method 2800 includes transmitting and receiving, via the coil, radio frequency (RF) communication signals at a second frequency (e.g., within a range between about 100 megahertz and about 5 gigahertz).

[0252] FIG. 38 is a flow diagram illustrating another example method 2900 for operating a device including a single coil (e.g., 350 of FIG. 3, 400 of FIGS. 4-6, 704 of FIGS. 7A-8D, 905 of FIGS. 9A-10B, 1804 of FIG. 16A, 1805 of FIG. 16B, 1904 of FIG. 17A or 26A, 2104 of FIGS. 28A, 29A, and 30A, or 2105 of FIG. 29E). In some examples, method 2900 may be implemented by a device (e.g., IMD) as described herein with reference to FIGS. 1A-1C, 7A-10C, 14A-30C, or 39-40D. At 2902, method 2900 includes receiving, via a coil, inductive communication signals at a first frequency (e.g., within a range between about 9 kilohertz and about 50 megahertz). At 2904, method 2900 includes transmitting and receiving, via the coil, radio frequency (RF) communication signals at a second frequency (e.g., within a range between about 100 megahertz and about 5 gigahertz).

[0253] FIG. 39 is a diagram 3200 schematically representing an example IMD 3220 within a patient. The IMD 3220 includes a first element 3222 and a second element 3224 implanted in a patient. In some examples, the IMD 3220 may include at least some of substantially the same features as, and / or an example implementation of at least some features of, the examples described in association with FIGS. 1 A-38 and 40A-42. In some examples, the IMD 3220 may include an electrical stimulation1618.327.11181element which may be implanted in a head 112 or neck region 114 of the patient. In some such examples, the first element 3222 may include a power / control element such as (but not limited to) an implantable pulse generator (IPG).

[0254] In some examples, the entire IMD 3220 is sized and / or shaped to be implanted within the neck region 114, and in some examples, the entire IMD 3220 may be sized and shaped for non-muscular, extra-vascular implantation. This arrangement stands in sharp contrast with at least some non-example IMDs which may be injectable via a hypodermic needle into muscular tissue and / or which may be sized / shaped for intravascular delivery. However, it will be understood that IMD 3220 is merely an example and that at least some example IMDs described throughout various examples of the present disclosure may be sized and shaped for intravascular delivery and / or for delivery via an introducer or needle.

[0255] In some examples, as later shown in FIG. 40D, the first element 3222 may include the entire IMD 3220 such that IMD 3220 is lead-less.

[0256] In some examples, as shown in FIG. 39, the second element 3224 of IMD 3220 includes a lead body 3227, which may extend perpendicular to the longitudinal axis of a housing 3225 of the first element 3222, in some examples. In some instances, the entire second element 3224 may sometimes be referred to as a lead. Via this configuration, the lead body 3227 may be placed in the neck region 114 without making sharp turns (e.g., 90 degree turn) along a length of lead body 3227 relative to a longitudinal axis of a housing 3225 of the first element 3222. Accordingly, surgical implantation of the lead 3224 including lead body 3227 (and IMD 3220 generally) may be simplified and / or less stress may be applied to the lead body 3227. Moreover, this generally perpendicular configuration may enhance the ability to anchor the first and second elements 3222, 3224 relative to non-nerve tissues within the head-and-neck region (112, 114).

[0257] In some examples, such as shown in FIG. 39, a conductive element 3230 (e.g., electrode portion) of the second element 3224 (e.g., lead) may be aligned / positioned for stimulation of a target tissue (e.g., infrahyoid-muscle (IHM)-innervating nerve and / or IHM). However, it will be understood that the first and1618.327.11182second elements 3222, 3224 may be implanted in a wide variety of positions, orientations, etc. within the head-and-neck region (112, 114) to be placed in stimulating relation to a wide variety of nerves, nerve branches, muscles, and / or combinations thereof.

[0258] As one example implementation of the examples of at least FIGS. 1A and 1 B, the IMD 3220 of FIG. 39 may include a stimulation element (e.g., 56 in FIG. 1 A; 117 of FIG. 1 B) for delivering therapy and / or a sensing element (e.g., 54 of FIG. 1A; 128 of FIG. 1B) to sense information pertinent to the therapy. The IMD 3220 also may include a power element (e.g., rechargeable battery) and a communication element (e.g., coil). The first element 3222 may include an electrical connector to which an electrical connector 3226 at a proximal portion of the lead body 3227 is connected. The second element 3224 (e.g., lead) may include a wire (e.g., electrical conductor) extending through its length, and at least one electrode 3230 (e.g., stimulation electrode and / or sensing electrode) on a distal portion of the lead body 3227. In some examples, the second element 3224 may also include an antenna (e.g., coil antenna or RF antenna). The at least one electrode 3230 (e.g., cuff electrode, axial electrode, etc.) is electrically connected, via the at least one wire within lead body 3227 and the electrical connector 3226, to circuitry (e.g., stimulation circuitry, sensing circuitry), which resides within housing 3225 of first element 3222. In some examples, the second element 3224 may support independent addressability of a plurality of electrodes 3230 (e.g., 2, 3, 4, 5, 6, 7, 8, or more) that are electrically connected to circuitry of first element 3222 through a plurality of wires (e.g., extending through the lead body 3227) and the electrical connector 3226.

[0259] FIG. 40A illustrates an example device 3250 including a first element 3222 and second elements (e.g., leads) 3274A, 3274B. In some examples, device 3250 includes at least some of substantially the same features as device 3220 of FIG. 39, except that device 3250 includes two second elements 3274A, 3274B (each including a lead body 3227A, 3227B, respectively) and associated respective conductive elements 3230A, 3230B) instead of just one second element 3224 (and lead body 3227) and one conductive element 3230. Each second element 3274A,1618.327.111833274B may include a first portion (e.g., proximal portion) including an electrical connector 3226, at least one first wire, and at least one first conductive element 3230A, 3230B on an opposite second portion (e.g., first distal portion) of the second element 3274A, 3274B. As shown in FIG. 40A, in some examples the respective second elements 3274A, 3274B extend outward from opposite sides of the housing 3225 of first element 3222. The second elements 3274A, 3274B may include at least some of substantially the same features as the second element 3224 in FIG. 39 such as (but not limited to) at least one wire extending through a length of the lead body 3227A, 3227B (respectively) and the at least one conductive element 3230 described with reference to FIG. 39.

[0260] In some examples, using at least two second elements 3274A, 3274B (and two corresponding at least one conductive elements 3230A, 3230B) extending from opposite sides of first element 3222 enables reaching target tissues in different directions (e.g., opposite) from housing 3225 of first element 3222.

[0261] For instance, in some examples, the device 3250 may be implanted in a lower portion of neck region 114, such as superior to the clavicle or the manubrium, at which one lead (e.g., 3274A) may extend to be in stimulating relation to an IHM and / or an IHM-innervating nerve distal to the ansa cervicalis nerve loop. The other lead (e.g., 3274B) may extend to be in operational relation to other target tissues related to treating sleep disordered breathing (SDB) including obstructive sleep apnea. However, in some examples, the other lead 3274B is positioned to be in sensing relation to other target tissues (e.g., respiratory tissues) to facilitate stimulation therapy for treating sleep disordered breathing (e.g., obstructive sleep apnea). In some examples, the other target tissues may include a phrenic nerve and / or diaphragm muscle to sense respiration and / or other physiologic parameters suitable to facilitate stimulation therapy for treating sleep disordered breathing (e.g., obstructive sleep apnea).

[0262] In some examples, the sensed respiration may be used for providing closed loop stimulation in which a timing of the stimulation is based on the sensed respiratory information. However, in some examples, the stimulation may be an1618.327.11184open loop stimulation (e.g., in which stimulation timing is not based on sensed respiration) and the sensed respiratory information may be used for other purposes to facilitate SDB treatment. Of course, the two lead arrangement is not limited to use with the above-mentioned stimulation and sensing targets.

[0263] FIG. 40B illustrates an example device 3275 including at least some of substantially the same features as example device 3250 (FIG. 40A) except that the respective second elements 3274A, 3274B of device 3275 are connected to opposite ends 3223A, 3223B of the housing 3225 of first element 3222 via respective electrical connectors 3226A, 3226B which may provide greater flexibility in positioning the respective leads 3274A, 3274B relative to target tissues which are located in opposite directions from a location at which the housing 3225 of the first element 3222 may be anchored within the patient’s body.

[0264] While the leads 3274A, 3274B in FIG. 40A are illustrated as extending from opposite ends of the electrical connector 3226, in some examples, the leads may extend from the same sidewall of electrical connector 3226, from adjacent sidewalls (e.g., perpendicular sidewalls) of electrical connector 3226, and / or from the end wall of the electrical connector 3226. This principle similarly applies to the example of FIG. 40B.

[0265] In addition, while two leads are illustrated in FIG. 40A and FIG. 40B as extending from the first element 3222, in some examples, more than two leads 3274A, 3274B may extend from the first element 3222.

[0266] FIG. 40C illustrates an example device 3280 including a first element 3222 and a second element 3284. In some examples, device 3280 includes at least some of substantially the same features as device 3220 of FIG. 39 (or FIGS. 40A and 40B), except that instead of the lead body 3227 of second element 3284 (lead) extending perpendicular (e.g., 90°) to the longitudinal axis 3253 of the housing 3225 of the first element 3222, in device 3280 the lead body 3227 extends at an angle theta (0) relative to the longitudinal axis 3253. In some examples, the angle theta (6) may be within a range between 0° and 90° (e.g., 10°, 20°, 30°, 45°, 60°, 80°). While device 3280 illustrated in FIG. 40C includes one lead 3284, in some examples, device 32801618.327.11185may include more than one lead (as in FIGS. 40A or 40B) and at least one of the multiple leads may be connected at a non-perpendicular angle relative to the long axis 3253 of the housing 3225 of the first element 3222. In some such examples, the angle theta (0) for each lead may be the same or different and each lead may extend from the same sidewall of electrical connector 3226, from adjacent sidewalls (e.g., perpendicular sidewalls) of electrical connector 3226, and / or from the end wall of the electrical connector 3226.

[0267] FIG. 40D is a diagram illustrating an example IMD 3290, which may include at least some of substantially the same features as the examples of FIGS. 39-40C, except including a leadless implementation omitting a lead (e.g., second element 3224, 3274A, 3274B, 3284). As shown in FIG. 40D, the IMD 3290 includes a first element 3292 (like 3222 in FIGS. 39-40C) and an array 3294 of electrodes 3295, which may be used for applying electrical stimulation to target tissue and / or for sensing physiologic phenomenon. It will be understood that the electrodes 3295 may be located on a single surface or multiple different surfaces (e.g., ends, sides, top, bottom, etc.) of a housing 3225 of the first element 3292, and that array 3292 may include a greater or fewer number of electrodes 3295. In some such examples, the first element 3292 also may include additional or other sensing elements contained within a housing 3225 of the first element 3292.

[0268] It will be further understood that similar example arrangements of first and second leads, electrodes, housings, etc. may be implemented relative to target tissue (e.g., a single target tissue or multiple, different target tissues) solely for sensing, i.e. without applying stimulation.

[0269] It will be further understood that the present disclosure is not limited to the examples of FIGS. 16A-40D and that a wide variety of differently configured first elements (e.g., 3222, 3292) and second elements (e.g., 3224, 3227A, 3227B, 3284) may be employed to achieve stimulation and / or sensing of target tissue.

[0270] FIG. 41 A is a block diagram schematically representing an example control portion 3500. In some examples, control portion 3500 provides one example implementation of a control portion forming a part of, implementing, and / or generally1618.327.11186managing charging elements, power transmission elements, stimulation elements, power / control elements (e.g., pulse generators, microstimulators), wireless receivers, wireless transmitters, transceivers, sensors, and related elements, devices, user interfaces, instructions, information, engines, elements, functions, actions, and / or methods, as described throughout examples of the present disclosure in association with FIGS. 1A-40D and 41B-42.

[0271] In some examples, control portion 3500 includes a controller 3502 and a memory 3510. In general terms, controller 3502 of control portion 3500 includes at least one processor 3504 and associated memories. The controller 3502 is electrically coupled to, and in communication with, memory 3510 to generate control signals to direct operation of at least some of the charging elements, power transmission elements, stimulation elements, power / control elements (e.g., pulse generators, microstimulators), wireless receivers, wireless transmitters, transceivers, sensors, and related elements, devices, user interfaces, instructions, information, engines, elements, functions, actions, and / or methods, as described throughout examples of the present disclosure. In some examples, these generated control signals include, but are not limited to, employing instructions 3511 and / or information 3512 stored in memory 3510 for at least controlling the charging of a power element (e.g., 706 of FIGS. 7A-7B and 8A-8C), controlling a stimulation element (e.g., 804 of FIG. 8A or 8C), and / or controlling a sensing element (e.g., 806 of FIG. 8B or 8C). In some examples, such control may include part of diagnosing and / or directing and managing treatment of sleep disordered breathing such as obstructive sleep apnea, hypopnea, and / or central sleep apnea, with such control also including sensing physiologic information including but not limited to electrical brain activity, respiratory information, cardiac information, and / or monitoring sleep disordered breathing, etc. In some examples, such control may include part of diagnosing and / or directing and managing treatment of pelvic disorders including but not limited to stress incontinence. In some examples, such control may include part of diagnosing and / or directing and managing treatment of other conditions which can be treated via peripheral nerve stimulation (and / or stimulation of innervated1618.327.11187muscles). In some instances, the controller 3502 or control portion 3500 may sometimes be referred to as being programmed to perform the above-identified actions, functions, etc. such that the controller 3502, control portion 3500 and any associated processors may sometimes be referred to as being a special purpose computer, control portion, controller, or processor. In some examples, at least some of the stored instructions 3511 are implemented as, or may be referred to as, a care engine, a sensing engine, monitoring engine, and / or treatment engine. In some examples, at least some of the stored instructions 3511 and / or information 3512 may form at least part of, and / or, may be referred to as a care engine, sensing engine, monitoring engine, and / or treatment engine.

[0272] In response to or based upon commands received via a user interface (e.g., user interface 3540 in FIG. 41 C) and / or via machine-readable instructions, controller 3502 generates control signals as described above in accordance with at least some of the examples of the present disclosure. In some examples, controller 3502 is embodied in a general purpose computing device while in some examples, controller 3502 is incorporated into or associated with at least some of the charging elements, power transmission elements, stimulation elements, power / control elements (e.g., pulse generators, microstimulators), wireless receivers, wireless transmitters, transceivers, sensors, and related elements, devices, user interfaces, instructions, information, engines, functions, actions, and / or methods, etc. as described throughout examples of the present disclosure.

[0273] For purposes of this application, in reference to the controller 3502, the term “processor” shall mean a presently developed or future developed processor (or processing resources) that executes machine-readable instructions contained in a memory. In some examples, execution of the machine-readable instructions, such as those provided via memory 3510 of control portion 3500 cause the processor to perform the above-identified actions, such as operating controller 3502 to implement the power transmission, charging, sensing, monitoring, determining, treatment, etc. as generally described in (or consistent with) at least some examples of the present disclosure. The machine-readable instructions may be loaded in a random access1618.327.11188memory (RAM) for execution by the processor from their stored location in a read only memory (ROM), a mass storage device, or some other persistent storage (e.g., non-transitory tangible medium or non-volatile tangible medium), as represented by memory 3510. In some examples, the machine-readable instructions may include a sequence of instructions, a processor-executable data model (e.g., machine learning, other), or the like. In some examples, memory 3510 includes a computer readable tangible medium providing non-volatile storage of the machine-readable instructions executable by a process of controller 3502. In some examples, the computer readable tangible medium may sometimes be referred to as, and / or include at least a portion of, a computer program product. In some examples, hard wired circuitry may be used in place of or in combination with machine-readable instructions to implement the functions described. For example, controller 3502 may be embodied as part of at least one application-specific integrated circuit (ASIC), at least one field-programmable gate array (FPGA), and / or the like. In at least some examples, the controller 3502 is not limited to any specific combination of hardware circuitry and machine-readable instructions, nor limited to any particular source for the machine-readable instructions executed by the controller 3502.

[0274] In some examples, control portion 3500 may be entirely implemented within or by a stand-alone device. In some examples, the control portion 3500 may be partially implemented in one of the charging devices, power transmission devices, sensing devices, monitoring devices, stimulation devices, apnea treatment devices (or portions thereof), etc. and partially implemented in a computing resource separate from, and independent of, the apnea treatment devices (or portions thereof) but in communication with the apnea treatment devices (or portions thereof). In some examples, the control portion 3500 may be partially implemented in one of the charging devices, power transmission devices, sensing devices, monitoring devices, stimulation devices, pelvic or other treatment devices (or portions thereof), etc. and partially implemented in a computing resource separate from, and independent of, the pelvic or other treatment devices (or portions thereof) but in communication with the pelvic or other treatment devices (or portions thereof). For instance, in some1618.327.11189examples control portion 3500 may be implemented via a server accessible via the cloud and / or other network pathways. In some examples, the control portion 3500 may be distributed or apportioned among multiple devices or resources such as among a server, an apnea (or pelvic, other) treatment device (or portion thereof), and / or a user interface. In some examples, control portion 3500 includes, and / or is in communication with, a user interface 3540 as shown in FIG. 41 C.

[0275] FIG. 41 B is a diagram schematically illustrating at least some example implementations of a control portion 3520 by which the control portion 3500 (FIG.41 A) can be implemented, according to one example of the present disclosure. In some examples, control portion 3520 is entirely implemented within or by a medical device 3525 (e.g., implantable pulse generator (IPG) assembly in some examples), which has at least some of substantially the same features and attributes as a medical device as previously described throughout the present disclosure. In some examples, control portion 3520 is entirely implemented within or by a remote control 3530 (e.g., a programmer) external to the patient’s body, such as a patient control 3532 and / or a physician control 3534. In some examples, the control portion 3500 is partially implemented in the medical device 3525 and partially implemented in the remote control 3530 (at least one of patient control 3532 and physician control 3534).

[0276] FIG. 41 C is a block diagram schematically representing user interface 3540, according to one example of the present disclosure. In some examples, the user interface 3540 forms part of and / or is accessible via a device external to the patient and by which the therapy system may be at least partially controlled and / or monitored. The external device which hosts user interface 3540 may be a patient remote (e.g., 3532 in FIG. 41 B), a physician remote (e.g., 3534 in FIG. 41 B) and / or a clinician portal. In some examples, the user interface 3540 includes a user interface or other display that provides for the simultaneous display, activation, and / or operation of at least some of the charging elements, power transmission elements, stimulation elements, power / control elements (e.g., pulse generators, microstimulators), wireless receivers, wireless transmitters, transceivers, sensors, and related elements, devices, user interfaces, instructions, information, engines,1618.327.11190functions, actions, and / or methods, etc., as described in association with FIGS. 1A-41 B and 42. In some examples, at least some portions or aspects of the user interface 3540 are provided via a graphical user interface (GUI) and may include a display 3544 and input 3542.

[0277] FIG. 42 is a block diagram 3600 which schematically represents some example implementations by which a medical device (IMD) 3610, such as a microstimulator, pulse generator, and / or sensing monitor (either or both of which may be implantable in some examples), may communicate wirelessly with external devices outside the patient. As shown in FIG. 42, in some examples, the IMD 3610 may communicate with at least one of a patient app 3630 on a mobile device 3620, a patient remote control 3640, a clinician programmer 3650, a patient management tool 3660, and an external charger (or power transmission device) 3670. As previously described, the external charger 3670 may be used to charge a power element (e.g., battery) of the medical device 3610 and / or to transmit power to the medical device 3610 which is immediately used by the medical device and not stored within a power element of the medical device. The patient management tool 3660 may be implemented via a cloud-based portal 3662, the patient app 3630, and / or the patient remote control 3640. Among other types of data, these communication arrangements enable the IMD 3610 to communicate, display, manage, etc. data for wirelessly charging or transmitting power to IMD 3610 and / or for patient management as well as to allow for adjustment to control information (e.g., 3512 of FIG. 41 A) if / where needed. It will be understood that at least some of the various devices / elements 3620, 3640, 3650, patient management tool 3660, and external charger 3670 also may communicate with each other, with or without communicating with the medical device 3610.

[0278] Although specific examples have been illustrated and described herein, a variety of alternate and / or equivalent implementations may be substituted for the specific examples shown and described without departing from the scope of the present disclosure. This application is intended to cover any adaptations or variations of the specific examples discussed herein.1618.327.11191

[0279] The following examples may comprise at least some of substantially the same features and attributes as, and / or example implementations of, the previously described examples of the present disclosure. The following examples may be implemented alone or together, which may comprise any various complementary combinations.

[0280] Example A1. A device comprising: a power element; a radio; a coil; a first circuit connected between the coil and the power element to supply power to the power element using an inductive wireless power transfer (WPT) signal received by the coil at a first frequency; and a second circuit connected between the coil and the radio to transmit and receive radio frequency (RF) communication signals via the coil at a second frequency.

[0281] Example A2. The device of example A1 , wherein the first circuit comprises: a capacitor to tune the coil to the first frequency; and a rectifier coupled in parallel with the capacitor to rectify the inductive WPT signal to generate a rectified signal to supply power to the power element.

[0282] Example A3. The device of example A1 or A2, wherein the second circuit comprises: an impedance matching circuit.

[0283] Example A4. The device of any one of examples A1 to A3, further comprising: a switch to selectively connect the coil to the first circuit or the second circuit.

[0284] Example A5. The device of any one of examples A1 to A3, wherein the first circuit comprises a first filter to pass the inductive WPT signal received by the coil at the first frequency and block the RF communication signals received by the coil at the second frequency, and wherein the second circuit comprises a second filter to pass the RF communication signals received by the coil at the second frequency and block the inductive WPT signal received by the coil at the first frequency.

[0285] Example A6. The device of example A5, wherein the coil is configured to receive the inductive WPT signal and the RF communication signals simultaneously.

[0286] Example A7. The device of any one of examples A1 to A6, wherein the power element comprises a rechargeable battery.1618.327.11192

[0287] Example A8. The device of any one of examples A1 to A7, wherein the power element comprises a super capacitor.

[0288] Example A9. The device of any one of examples A1 to A8, wherein the second frequency is greater than at least ten times the first frequency.

[0289] Example A10. The device of any one of examples A1 to A9, wherein the first frequency is less than or equal to a self-resonance frequency of the coil; and wherein the second frequency is greater than the self-resonance frequency of the coil.

[0290] Example A11. The device of any one of examples A1 to A10, wherein the first frequency is within a range between 9 kilohertz and 50 megahertz.

[0291] Example A12. The device of any one of examples A1 to A11 , wherein the first frequency is 6.78 megahertz or 13.56 megahertz.

[0292] Example A13. The device of any one of examples A1 to A12, wherein the second frequency is within a range between 100 megahertz and 5 gigahertz.

[0293] Example A14. The device of any one of examples A1 to A13, wherein the second frequency is 400 megahertz or 2.4 gigahertz.

[0294] Example A15. The device of any one of examples A1 to A14, further comprising: a printed circuit board assembly (PCBA), wherein the first circuit and the second circuit are arranged on the PCBA.

[0295] Example A16. The device of example A15, wherein the PCBA is arranged inside the coil.

[0296] Example A17. The device of example A15 or A16, further comprising: a ferrite sheet surrounding the PCBA.

[0297] Example A18. The device of any one of examples A1 to A17, further comprising: a ferrite sheet surrounding the power element.

[0298] Example A19. The device of any one of examples A1 to A15, wherein the coil is wrapped around the power element.

[0299] Example A20. The device of any one of examples A1 to A19, wherein the radio comprises: a transmitter electrically coupled to the coil; and a receiver electrically coupled to the coil.1618.327.11193

[0300] Example A21. The device of any one of examples A1 to A20, wherein the device comprises an implantable medical device.

[0301] Example A22. The device of example A21 , further comprising: a stimulation element to apply electrical stimulation to an upper airway patency-related tissue of a patient.

[0302] Example A23. The device of example A21 or A22, further comprising: a sensing element to sense physiologic information of a patient.

[0303] Example B24. A device comprising: a power element; a radio; and a coil configured to receive an inductive wireless power transfer (WPT) signal to supply power to the power element and to transmit and receive radio frequency (RF) communication signals for the radio.

[0304] Example B25. The device of example B24, wherein a cross-section of the coil comprises a diameter or width within a range between 0.2 centimeters and 4 centimeters.

[0305] Example B26. The device of example B25, wherein the coil comprises a diameter or width of 1 centimeter.

[0306] Example B27. The device of example B24, wherein the coil comprises a length within a range between 0.4 centimeters and 8 centimeters.

[0307] Example B28. The device of example B27, wherein the coil comprises a length of 1 centimeter.

[0308] Example B29. The device of any one of examples B24 to B28, wherein the coil comprises litz wire.

[0309] Example B30. The device of any one of examples B24 to B29, wherein the coil comprises a wire within a range between 10 American wire gauge (AWG) and 50 AWG.

[0310] Example B31. The device of any one of examples B24 to B30, wherein the wire is 24 AWG.

[0311] Example B32. The device of any one of examples B24 to B31 , wherein the coil comprises a number of windings within a range between 4 windings and 200 windings.1618.327.11194

[0312] Example B33. The device of any one of examples B24 to B32, wherein the coil comprises 19 windings.

[0313] Example B34. The device of any one of examples B24 to B33, wherein the coil comprises a circular shape, an elliptical shape, or a rectangular shape.

[0314] Example B35. The device of any one of examples B24 to B34, further comprising: a housing enclosing the power element, the radio, and the coil, wherein the coil comprises a shape conforming to a shape of the housing.

[0315] Example B36. The device of any one of examples B24 to B35, wherein the coil comprises a figure eight configuration, a bow tie configuration, or a conical configuration.

[0316] Example B37. The device of any one of examples B24 to B36, further comprising: a switch configured to selectively electrically connect a first end of the coil to a second end of the coil to receive the inductive WPT signal and electrically disconnect the first end of the coil from the second end of the coil to transmit and receive the RF communication signals.

[0317] Example B38. The device of any one of examples B24 to B28, wherein the coil comprises a multilayer coil comprising a plurality of conductive trace layers separated by insulation layers.

[0318] Example B39. The device of example B38, wherein each conductive trace layer of the plurality of conductive trace layers comprises a circular, rectangular, triangular, figure eight, or bow tie shaped trace.

[0319] Example C40. A device comprising: a housing; a power element enclosed by the housing; a radio enclosed by the housing; and a coil enclosed by the housing, the coil configured to receive an inductive wireless power transfer (WPT) signal to supply power to the power element and to transmit and receive radio frequency (RF) communication signals for the radio.

[0320] Example C41. The device of example C40, wherein the housing comprises a first housing portion coupled to a second housing portion, wherein the power element is enclosed by the first housing portion, and wherein the coil is enclosed by the second housing portion.1618.327.11195

[0321] Example C42. The device of example C41 , wherein the first housing portion comprises a conductive material, and wherein the second housing portion comprises a non-conductive material.

[0322] Example C43. The device of example C42, wherein the coil forms a primary section of an RF antenna for the radio and the first housing portion forms a secondary section of the RF antenna for the radio.

[0323] Example C44. The device of any one of examples C41 to C43, wherein the first housing portion is hermetically sealed to the second housing portion.

[0324] Example C45. The device of any one of examples C41 to C44, wherein the first housing portion comprises titanium.

[0325] Example C46. The device of any one of examples C41 to C45, wherein the second housing portion comprises a ceramic or a polymer.

[0326] Example C47. The device of any one of examples C41 to C46, wherein the first housing portion is removably coupled to the second housing portion.

[0327] Example C48. The device of any one of examples C41 to C47, wherein the second housing portion comprises aluminum oxide (AI2O3), zirconium oxide (ZO2), liquid-crystal polymer (LCP), polyetheretherketone (PEEK), polyoxidemethylene (POM), polypropylene, polycarbonate, polysulfone (PSU), or epoxy.

[0328] Example C49. The device of example C41 , wherein the first housing portion and the second housing portion comprise a polymer.

[0329] Example C50. The device of any one of examples C40 to C49, wherein the housing is biocompatible.

[0330] Example C51. The device of any one of examples C40 to C50, wherein a volume enclosed by the housing is within a range between 0.5 cubic centimeters and 5 cubic centimeters.

[0331] Example C52. The device of any one of examples C40 to C50, wherein a volume enclosed by the housing is within a range between 5 cubic centimeters and 20 cubic centimeters.

[0332] Example C53. The device of any one of examples C40 to C52, wherein the housing comprises a round, flat, elliptical, or circular shape.1618.327.11196

[0333] Example C54. The device of any one of examples C40 to C53, wherein the housing is sized and / or shaped for implantation into a patient via a single incision having a length within a range between 0.5 centimeters and 3 centimeters.

[0334] Example C55. The device of any one of examples C40 to C53, wherein the housing is sized and / or shaped for percutaneous implantation into a patient.

[0335] Example C56. The device of any one of examples C40 to C55, wherein the housing is sized and / or shaped to be implanted within a head-and-neck region of a patient.

[0336] Example C57. The device of example C56, wherein the housing comprises a cross-sectional area less than 1.5 square centimeters, a major axis less than 1.5 centimeters, and a volume less than 3.0 cubic centimeters.

[0337] Example C58. The device of example C40, wherein the housing comprises a polymer overmolded over the power element, the radio, and the coil.

[0338] Example C59. The device of example C40, wherein the housing comprises a first housing portion inside a second housing portion.

[0339] Example C60. The device of any one of examples C40 to C59, further comprising: a printed circuit board assembly (PCBA) enclosed by the housing, wherein the radio is arranged on the PCBA.

[0340] Example C61. The device of example C60, wherein the housing comprises a plurality of heat stakes locating and retaining the PCBA within the housing.

[0341] Example C62. The device of example C60 or C61 , further comprising: a frame within the housing supporting the PCBA, the power element, and the coil.

[0342] Example C63. The device of any one of examples C60 to C62, further comprising: a polymer sleeve within the housing surrounding the PCBA, the power element, and the coil.

[0343] Example C64. The device of any one of examples C40 to C63, further comprising: a stimulation element and a sensor to sense physiologic information of a patient, the stimulation element and the sensor arranged within the housing; and a control portion arranged within the housing, the control portion comprising a therapy manager to control the stimulation element based on at least control information and1618.327.11197sensed physiologic information to apply electrical stimulation to an upper airway patency-related tissue of the patient.

[0344] Example C65. The device of any one of examples C40 to C64, further comprising: at least one electrode on the housing to apply electrical stimulation to tissue of a patient.

[0345] Example C66. The device of any one of examples C40 to C65, further comprising: a lead extending from the housing and comprising at least one electrode to apply electrical stimulation to tissue of a patient.

[0346] Example D67. A device comprising: a control portion; a radio; and a coil configured to receive inductive communication signals for the control portion and to transmit and receive radio frequency (RF) communication signals for the radio.

[0347] Example D68. The device of example D67, wherein the coil is configured to transmit inductive communication signals for the control portion.

[0348] Example D69. The device of example D68, wherein the inductive communication signals comprise security and / or key exchanges for pairing the radio to a further device.

[0349] Example D70. The device of example D68, wherein the inductive communication signals comprise device wake-up communications, shipping mode enable and / or disable communications, therapy enable and / or disable communications, Bluetooth low energy (BLE) functionality enable communications, and / or rapid advertisement communications.

[0350] Example D71. The device of any one of examples D68 to D70, further comprising: a stimulation element, wherein the control portion comprises a therapy manager to control the stimulation element based on at least control information to apply electrical stimulation to an upper airway patency-related tissue of the patient.

[0351] Example D72. The device of example D71, wherein the inductive communication signals comprise electrical stimulation on and electrical stimulation off control signals.

[0352] Example D73. The device of any one of examples D67 to D72, further comprising: a switch to selectively connect the coil to the control portion or the radio.1618.327.11198

[0353] Example D74. The device of any one of examples D67 to D73, wherein the coil is configured to receive inductive communication signals at a first frequency and RF communication signals at a second frequency.

[0354] Example D75. The device of example D74, further comprising: a first filter to pass the inductive communication signals received by the coil at the first frequency to the control portion and block the RF communication signals received by the coil at the second frequency from passing to the control portion; and a second filter to pass the RF communication signals received by the coil at the second frequency to the radio and block the inductive communication signals received by the coil at the first frequency from passing to the radio.

[0355] Example D76. The device of example D74 or D75, wherein the second frequency is greater than at least ten times the first frequency.

[0356] Example D77. The device of any one of examples D74 to D76, wherein the first frequency is within a range between 9 kilohertz and 50 megahertz; and wherein the second frequency is within a range between 100 megahertz and 5 gigahertz.

[0357] Example D78. The device of any one of examples D67 to D74, wherein the control portion comprises an application specific integrated circuit (ASIC), and wherein the coil is directly connected to the ASIC.

[0358] Example D79. The device of any one of examples D67 to D78, further comprising: a primary cell battery to power the control portion and the radio.

[0359] Example D80. The device of any one of examples D67 to D79, wherein the control portion comprises: a first transmitter to transmit inductive communications; and a first receiver to receive inductive communications; wherein the radio comprises: a second transmitter to transmit RF communications; and a second receiver to receive RF communications.

[0360] Example D81. The device of any one of examples D67 to D78, further comprising: a power element, wherein the coil is configured to receive an inductive wireless power transfer (WPT) signal to supply power to the power element.

[0361] Example E82. A method comprising: receiving, via a coil, an inductive wireless power transfer (WPT) signal at a first frequency; and transmitting and1618.327.11199receiving, via the coil, radio frequency (RF) communication signals at a second frequency.

[0362] Example F83. A method comprising: receiving, via a coil, inductive communication signals at a first frequency; and transmitting and receiving, via the coil, radio frequency (RF) communication signals at a second frequency.

[0363] Example G84. A device comprising: a power element; a coil configured to receive an inductive wireless power transfer (WPT) signal to supply power to the power element; a radio; and a radio frequency (RF) antenna configured to transmit and receive RF communication signals for the radio, wherein an enclosure of the device, an enclosure of the power element, or the coil provides a reference or ground for the RF antenna.

[0364] Example G85. The device of example G84, wherein at least a portion of the enclosure of the device provides the reference or ground for the RF antenna.

[0365] Example G86. The device of example G84, wherein the enclosure of the power element provides the reference or ground for the RF antenna.

[0366] Example G87. The device of example G84, wherein the coil provides the reference or ground for the RF antenna.

[0367] Example G88. The device of any one of examples G84 to G87, wherein the RF antenna comprises a single-ended RF antenna.

[0368] Example G89. The device of any one of examples G84 to G88, further comprising: an impedance matching circuit connected between the RF antenna and the radio.

[0369] Example G90. The device of any one of examples G84 to G89, further comprising: a capacitor connected between the radio and the enclosure of the device, the enclosure of the power element, or the coil.

Claims

1618.327.111100CLAIMSWhat is claimed is:

1. A device comprising:a power element;a radio;a coil;a first circuit connected between the coil and the power element to supply power to the power element using an inductive wireless power transfer (WPT) signal received by the coil at a first frequency; anda second circuit connected between the coil and the radio to transmit and receive radio frequency (RF) communication signals via the coil at a second frequency.

2. The device of claim 1 , wherein the first circuit comprises:a capacitor to tune the coil to the first frequency; anda rectifier coupled in parallel with the capacitor to rectify the inductive WPT signal to generate a rectified signal to supply power to the power element.

3. The device of claim 1 , wherein the second circuit comprises:an impedance matching circuit.

4. The device of claim 1 , further comprising:a switch to selectively connect the coil to the first circuit or the second circuit.

5. The device of claim 1, wherein the first circuit comprises a first filter to pass the inductive WPT signal received by the coil at the first frequency and block the RF communication signals received by the coil at the second frequency, and1618.327.111101wherein the second circuit comprises a second filter to pass the RF communication signals received by the coil at the second frequency and block the inductive WPT signal received by the coil at the first frequency.

6. The device of claim 5, wherein the coil is configured to receive the inductive WPT signal and the RF communication signals simultaneously.

7. The device of claim 1 , wherein the power element comprises a rechargeable battery.

8. The device of claim 1 , wherein the power element comprises a super capacitor.

9. The device of claim 1, wherein the second frequency is greater than at least ten times the first frequency.

10. The device of claim 1, wherein the first frequency is less than or equal to a self-resonance frequency of the coil; andwherein the second frequency is greater than the self-resonance frequency of the coil.

11. The device of claim 1 , wherein the first frequency is within a range between 9 kilohertz and 50 megahertz.

12. The device of claim 11 , wherein the first frequency is 6.78 megahertz or 13.56 megahertz.

13. The device of claim 1, wherein the second frequency is within a range between 100 megahertz and 5 gigahertz.1618.327.11110214. The device of claim 13, wherein the second frequency is 400 megahertz or 2.4 gigahertz.

15. The device of claim 1 , further comprising:a printed circuit board assembly (PCBA),wherein the first circuit and the second circuit are arranged on the PCBA.

16. The device of claim 15, wherein the PCBA is arranged inside the coil.

17. The device of claim 15, further comprising:a ferrite sheet surrounding the PCBA.

18. The device of claim 1 , further comprising:a ferrite sheet surrounding the power element.

19. The device of claim 1 , wherein the coil is wrapped around the power element.

20. The device of claim 1 , wherein the radio comprises:a transmitter electrically coupled to the coil; anda receiver electrically coupled to the coil.

21. The device of claim 1 , wherein the device comprises an implantable medical device.

22. The device of claim 21 , further comprising:a stimulation element to apply electrical stimulation to an upper airway patency-related tissue of a patient.

23. The device of claim 21 , further comprising:a sensing element to sense physiologic information of a patient.

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