A multi-band wideband power amplifier module
By integrating dynamic broadband matching, multi-stage push-pull amplification, and digital predistortion correction modules into a single-chip module, and combining them with a thermal management system, the problems of complex structure and high cost of multi-band broadband power amplifiers are solved, achieving efficient and stable broadband signal transmission and temperature control.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NANJING BENYIJIE COMM EQUIP CO LTD
- Filing Date
- 2025-06-21
- Publication Date
- 2026-06-23
AI Technical Summary
Existing multi-band broadband power amplifiers, due to the cascading of multiple narrowband amplifiers, result in complex device structures, large size, and high cost, making it difficult to meet the high bandwidth, efficiency, and linearity requirements of 5G and future 6G communication technologies for radio frequency front-end devices.
The system integrates a dynamic broadband matching module, a multi-stage push-pull amplification module, and a digital predistortion correction module using a single-chip module, and combines them with a thermal management module. It achieves real-time temperature monitoring and adjustment through heat sinks on the surface of the silicon-based CMOS chip and a microfluidic circulation system, thereby realizing low-distortion closed-loop processing and efficient thermal management of the signal.
It achieves high-efficiency and good linearity signal transmission over a wide frequency band, reduces device size and production costs, and ensures stable operation at high power output.
Smart Images
Figure CN224401491U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of radio frequency communication technology, and in particular to a multi-band broadband power amplifier module. Background Technology
[0002] Currently, with the development of 5G and future 6G communication technologies, higher requirements are being placed on the bandwidth, efficiency, and linearity of radio frequency front-end devices. As a key component, the performance of multi-band broadband power amplifiers directly affects the overall performance of communication systems.
[0003] Existing multi-band broadband power amplifiers mostly adopt a fixed frequency band design, which covers a wide frequency band by cascading multiple narrowband amplifiers, or uses a single amplifier structure to operate in a wide frequency band. However, cascading multiple narrowband amplifiers will result in a complex device structure, excessive size and high cost. Utility Model Content
[0004] To overcome the above shortcomings, this utility model provides a multi-band broadband power amplifier module, which aims to improve the problem of large device size and high cost caused by the complex structure of traditional multi-band broadband power amplifiers that use multiple narrowband amplifiers cascaded together.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a multi-band broadband power amplifier module, comprising a single-chip module, a thermal management module, and a power management module. The single-chip module integrates a dynamic broadband matching module, a multi-stage push-pull amplification module, and a digital predistortion correction module. The output terminal of the dynamic broadband matching module is electrically connected to the input terminal of the multi-stage push-pull amplification module, the output terminal of the multi-stage push-pull amplification module is electrically connected to the input terminal of the digital predistortion correction module, the output terminal of the digital predistortion correction module is electrically connected to the input terminal of the dynamic broadband matching module, and the single-chip module is bidirectionally electrically connected to the thermal management module.
[0006] The above technical solution integrates three core circuits—dynamic broadband matching, multi-stage push-pull amplification, and digital predistortion correction—into a single-chip module, achieving low-distortion closed-loop processing of RF signals. Furthermore, the thermal management module is electrically connected to the chip, ensuring real-time temperature control under high-power operation. This reduces the device size while improving amplification effect and efficiency.
[0007] As a further description of the above technical solution:
[0008] Preferably, the single-chip module is a silicon-based CMOS chip, and the thermal management module includes heat sinks, a microfluidic circulation system, a temperature sensor, and a temperature control circuit. The heat sinks and the temperature sensor are both mounted on the surface of the silicon-based CMOS chip. The microfluidic circulation system includes microchannels and a piezoelectric pump. The microchannels are mounted below the silicon-based CMOS chip. The temperature sensor is electrically connected to the temperature control circuit and the dynamic broadband matching module, respectively. The output terminal of the temperature control circuit is electrically connected to the input terminal of the piezoelectric pump.
[0009] The above technical solution achieves direct heat conduction by mounting heat sinks on the surface of the silicon-based CMOS chip, while simultaneously monitoring the chip temperature in real time by attaching temperature sensors; it also achieves efficient heat exchange by using microfluidic channels at the bottom of the chip combined with a piezoelectric pump to drive coolant circulation; and it uses dual-channel data feedback from the temperature sensor to coordinate the control of the matching module and the cooling system.
[0010] As a further description of the above technical solution:
[0011] Preferably, the dynamic broadband matching module includes an adjustable inductor, an adjustable capacitor, a fixed inductor, a fixed capacitor, a resistor, and an integrated MCU. The adjustable inductor and the adjustable capacitor are connected in parallel and then connected in series with the fixed inductor to form a compensation circuit. The fixed inductor, the fixed capacitor, and the resistor are connected in series in the circuit. The integrated MCU is communicatively connected to the adjustable inductor and the adjustable capacitor, respectively. The integrated MCU is electrically connected to the thermal management module.
[0012] The above technical solution achieves wideband impedance matching by connecting an adjustable inductor and an adjustable capacitor in parallel and then connecting them in series with a fixed inductor; and achieves bidirectional dynamic compensation for electrothermal components by integrating an MCU to synchronously adjust the parameters of the adjustable components and receiving temperature data from the thermal management module.
[0013] As a further description of the above technical solution:
[0014] Preferably, the multi-stage push-pull amplification module includes multiple pairs of symmetrically arranged transistors, microstrip lines, and coaxial lines. The collectors of the transistors are connected in parallel with the microstrip lines, and the microstrip lines are electrically connected to the coaxial lines.
[0015] The above technical solution achieves precise synthesis of push-pull power and cancellation of even harmonics by connecting multiple pairs of symmetrical transistor collectors in parallel to a microstrip line; and ensures the integrity of high-frequency signal transmission by low-loss coupling between the microstrip line and the coaxial line.
[0016] As a further description of the above technical solution:
[0017] Preferably, the predistortion correction module includes an ADC analog-to-digital converter, a DSP digital signal processor, and a DAC digital-to-analog converter. The input terminal of the ADC is electrically connected to the output terminal of the multi-stage push-pull amplifier module, the output terminal of the ADC is communicatively connected to the input terminal of the DSP digital signal processor, and the output terminal of the DSP digital signal processor is communicatively connected to the input terminal of the DAC digital-to-analog converter.
[0018] The above technical solution involves: sampling and amplifying the signal in real time using an ADC (Analog-to-Digital Converter) and converting it into a digital signal to extract distortion features; then, executing a pre-distortion algorithm using a DSP (Digital Signal Processor) to generate compensation coefficients, which are then converted into analog correction signals by a DAC (Digital-to-Analog Converter).
[0019] As a further description of the above technical solution:
[0020] Preferably, the DSP digital signal processor is communicatively connected to the integrated MCU, and the output of the DAC digital-to-analog converter is electrically connected to the input of the dynamic broadband matching module.
[0021] The above technical solution achieves real-time synchronization of predistortion parameters and temperature compensation data by establishing a communication link between the DSP digital signal processor and the integrated MCU; and forms a closed-loop correction signal injection path by connecting the output of the DAC digital-to-analog converter to the input of the matching module.
[0022] As a further description of the above technical solution:
[0023] Preferably, the power management module includes a filter and a voltage regulator. The output terminal of the filter is electrically connected to the input terminal of the voltage regulator, and the output terminal of the voltage regulator is electrically connected to the input terminals of the dynamic broadband matching module, the multi-stage push-pull amplification module, the digital predistortion correction module, and the thermal management module, respectively.
[0024] The above technical solution achieves zoned anti-interference power management by using filters to purify external power supply noise and provide clean input power; and by using multiple independent voltage regulators to supply power to the dynamic broadband matching module, multi-stage push-pull amplification module, digital predistortion correction module and thermal management module respectively.
[0025] As a further description of the above technical solution:
[0026] Preferably, the filter consists of a cascaded π-type differential mode filter module and a common mode suppression module. The input terminal of the π-type differential mode filter module is connected to an external power supply, the output terminal of the π-type differential mode filter module is electrically connected to the input terminal of the common mode suppression module, and the output terminal of the common mode suppression module is electrically connected to the input terminal of a voltage regulator.
[0027] The above technical solution eliminates line-to-line noise through a π-type differential mode filter module and blocks grounding loop interference through a series common mode suppression module. The two-stage filtering is then input to the voltage regulator to ensure power supply purity.
[0028] This utility model has the following beneficial effects:
[0029] 1. In this utility model, by adopting an integrated design, the dynamic broadband matching module, the multi-stage push-pull amplification module, and the digital predistortion correction module are integrated on a single chip, which greatly reduces the overall size, lowers the production cost, and improves the power amplification efficiency.
[0030] 2. In this utility model, the output power and stability of the power amplifier are improved without sacrificing bandwidth by using heat dissipation fins, microfluidic circulation system, temperature sensor and temperature control circuit set inside the thermal management module. The chip temperature is monitored and adjusted in real time to ensure that it maintains a stable working state even at high power output.
[0031] 3. In this utility model, through the cooperation of the dynamic broadband matching module, the multi-stage push-pull amplification module and the digital predistortion correction module, the effect of maintaining high efficiency and good linearity in a wide frequency band is achieved, and the stable transmission of signals is guaranteed. Attached Figure Description
[0032] Figure 1 This is a schematic block diagram of the overall module of a multi-band broadband power amplifier module proposed in this utility model;
[0033] Figure 2 This is a schematic block diagram of the thermal management module of a multi-band broadband power amplifier module proposed in this utility model;
[0034] Figure 3 This is a schematic block diagram of the dynamic width matching module of a multi-band broadband power amplifier module proposed in this utility model;
[0035] Figure 4 This is a schematic block diagram of a multi-stage push-pull amplifier module for a multi-band broadband power amplifier module proposed in this utility model;
[0036] Figure 5 This is a schematic block diagram of a digital predistortion correction module for a multi-band broadband power amplifier module proposed in this utility model;
[0037] Figure 6 This is a schematic block diagram of the power management module of a multi-band broadband power amplifier module proposed in this utility model. Detailed Implementation
[0038] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0039] Reference Figure 1 The present invention provides an embodiment of a multi-band broadband power amplifier module, comprising a single-chip module, a thermal management module, and a power management module. The single-chip module integrates a dynamic broadband matching module, a multi-stage push-pull amplification module, and a digital predistortion correction module. The output terminal of the dynamic broadband matching module is electrically connected to the input terminal of the multi-stage push-pull amplification module, the output terminal of the multi-stage push-pull amplification module is electrically connected to the input terminal of the digital predistortion correction module, the output terminal of the digital predistortion correction module is electrically connected to the input terminal of the dynamic broadband matching module, and the single-chip module is bidirectionally electrically connected to the thermal management module.
[0040] Specifically, the external power supply first enters the power management module, where the purified power is output to various functional units via a voltage regulator. The core single-chip module integrates a dynamic broadband matching module, a multi-stage push-pull amplification module, and a digital predistortion correction module using silicon-based CMOS technology. The chip internally employs multi-layer metal wiring to optimize the signal path and reduce signal loss. The chip is packaged in BGA or QFN form for easy connection to other communication system components. The RF signal first enters the dynamic broadband matching module, which automatically adjusts according to the control signal to achieve dynamic matching. The optimized matched signal is then input to the multi-stage push-pull amplification module, where multiple pairs of symmetrically arranged transistors perform push-pull power amplification. The output of the large, multi-stage push-pull amplifier module is transmitted in two paths: the main signal goes to the system output port, and the monitoring signal enters the digital predistortion correction module. The digital predistortion correction module acquires the output signal through an ADC, performs a fast Fourier transform on a DSP to analyze nonlinear distortion, and feeds the correction signal back to the input through a DAC, forming a closed-loop control system. During system operation, a temperature sensor mounted on the chip surface detects temperature changes in real time. The temperature control circuit automatically adjusts the working state of the cooling system based on the temperature sensor feedback, thereby maintaining the chip within the optimal operating temperature range. This module achieves high-fidelity amplification of wideband power signals through a single-chip integrated design.
[0041] Reference Figure 2The single-chip module is a silicon-based CMOS chip. The thermal management module includes heat sinks, a microfluidic circulation system, a temperature sensor, and a temperature control circuit. The heat sinks and temperature sensors are both mounted on the surface of the silicon-based CMOS chip. The microfluidic circulation system includes microchannels and a piezoelectric pump. The microchannels are mounted below the silicon-based CMOS chip. The temperature sensor is electrically connected to the temperature control circuit and the dynamic broadband matching module, respectively. The output of the temperature control circuit is electrically connected to the input of the piezoelectric pump.
[0042] Specifically, to improve the output power and stability of the power amplifier without sacrificing bandwidth, a thermal management module is introduced. This module includes heat sinks, a microfluidic circulation system, a temperature sensor, and a temperature control circuit. It monitors and regulates the chip temperature in real time to ensure stable operation even at high power output. The heat sink is designed in a fin shape and is mounted on the silicon-based CMOS chip surface along with the temperature sensor to increase the heat dissipation area. The temperature sensor monitors the chip surface temperature in real time and connects to the integrated MCU of the temperature control circuit and the dynamic broadband matching module to achieve synchronous data transmission. When the temperature exceeds the 60°C threshold, the temperature control circuit sends a start command to the piezoelectric pump. The piezoelectric pump drives the coolant to flow into the microchannel. The coolant circulates at high speed in the microchannel at the bottom of the chip and absorbs heat. Finally, the heat is dissipated to the environment through the heat sinks. During this process, the integrated MCU receives temperature data synchronously and dynamically adjusts the adjustable inductance and capacitance values of the matching module to achieve thermal compensation tuning. The piezoelectric pump precisely controls the flow rate through pulse width modulation signals, forming a closed-loop temperature control system to maintain the chip within the optimal operating temperature range.
[0043] Reference Figure 3 The dynamic broadband matching module includes an adjustable inductor, an adjustable capacitor, a fixed inductor, a fixed capacitor, a resistor, and an integrated MCU. The adjustable inductor and the adjustable capacitor are connected in parallel and then connected in series with the fixed inductor to form a compensation circuit. The fixed inductor, the fixed capacitor, and the resistor are connected in series in the circuit. The integrated MCU is communicatively connected to the adjustable inductor and the adjustable capacitor respectively. The integrated MCU is electrically connected to the thermal management module.
[0044] Specifically, the dynamic broadband matching module employs variable reactance components and series / parallel compensation circuits to dynamically adjust the matching state according to different operating frequencies, ensuring input / output impedance matching of the power amplifier across the entire frequency band, thereby improving efficiency and linearity. The variable reactance components consist of adjustable inductors and capacitors, which automatically adjust according to control signals to achieve dynamic matching. The series / parallel compensation circuits consist of fixed-value inductors, capacitors, and resistors to refine the matching effect. The adjustable inductors and adjustable capacitors form a parallel resonant network, covering a wide bandwidth of 2.4GHz to 6GHz. A fixed inductor is connected in series at the output of this parallel network to improve Q-value accuracy, and then a series network composed of fixed capacitors and resistors absorbs high-frequency harmonics. The integrated MCU receives distortion parameters from the digital predistortion correction module to achieve dynamic tuning and simultaneously processes temperature sensing data from the thermal management module for thermal compensation correction.
[0045] Reference Figure 4 The multi-stage push-pull amplifier module includes multiple pairs of symmetrically arranged transistors, microstrip lines and coaxial lines. The collectors of the transistors are connected in parallel with the microstrip lines, and the microstrip lines are electrically connected with the coaxial lines.
[0046] Specifically, in the multi-stage push-pull amplifier module, each stage of the transistor is made of GaAs or GaN material to improve voltage withstand and efficiency. The coupling network between stages includes microstrip lines and coaxial lines. By accurately calculating the line length and width, the phase consistency of the signal transmission at different frequencies is ensured. Multiple pairs of GaNHEMT transistors adopt a symmetrical topology layout. The base of each pair of transistors receives the differential input signal, and the collector is directly connected in parallel to the microstrip line through gold wire bonding points, forming a low inductive power combining point in the silicon-based CMOS redistribution layer. The combined high-power RF signal is transmitted to the output end through the microstrip line with stepped impedance transformation, and the signal is coupled to the end of the microstrip line by welding via a coaxial connector to complete the signal output.
[0047] Reference Figure 5 The predistortion correction module includes an ADC analog-to-digital converter, a DSP digital signal processor, and a DAC digital-to-analog converter. The input of the ADC is electrically connected to the output of the multi-stage push-pull amplifier module. The output of the ADC is communicatively connected to the input of the DSP digital signal processor. The output of the DSP digital signal processor is communicatively connected to the input of the DAC digital-to-analog converter. The DSP digital signal processor is communicatively connected to the integrated MCU. The output of the DAC digital-to-analog converter is electrically connected to the input of the dynamic broadband matching module.
[0048] Specifically, the output signal of the push-pull amplifier module is connected to the input of the ADC analog-to-digital converter with a coupling of -20dB. The converted digital signal is transmitted to the DSP digital signal processor via the JESD204B high-speed interface for fast Fourier transform to analyze nonlinear distortion. The DSP analyzes the signal distortion components in real time and generates predistortion coefficients. The predistortion parameters are output to the DAC digital-to-analog converter to convert the digital compensation signal into an analog domain and inject it into the input of the dynamic broadband matching module. The temperature parameters are transmitted to the integrated MCU to trigger the thermal compensation tuning of the matching network. The integrated MCU then feeds back the load impedance data to the DSP to update the algorithm weight matrix and complete the closed-loop control.
[0049] Reference Figure 6 The power management module includes a filter and a voltage regulator. The output of the filter is electrically connected to the input of the voltage regulator. The output of the voltage regulator is electrically connected to the inputs of the dynamic broadband matching module, the multi-stage push-pull amplification module, the digital predistortion correction module, and the thermal management module, respectively. The filter consists of a cascaded π-type differential mode filter module and a common mode rejection module. The input of the π-type differential mode filter module is connected to an external power supply. The output of the π-type differential mode filter module is electrically connected to the input of the common mode rejection module. The output of the common mode rejection module is electrically connected to the input of the voltage regulator.
[0050] Specifically, the external power input first connects to the π-type differential mode filter module, which consists of two stages of differential mode inductors and parallel ceramic capacitor banks, and is specifically used to suppress differential mode interference introduced by the power supply cable. The filtered power enters the common mode suppression module, which eliminates high-frequency common mode noise through a common mode choke combined with a Y-type grounding capacitor, and finally connects to the multi-channel voltage regulator system. The voltage regulator outputs multiple independent power supplies to power the dynamic broadband matching module, the multi-stage push-pull amplification module, the digital predistortion correction module, and the thermal management module.
[0051] Working principle: When this multi-band broadband power amplifier module is working, the external power supply first enters the power management module, and noise is purified through the cascaded π-type differential mode filter module and common mode rejection module. The generated clean DC is stabilized by the voltage regulator and then supplies power to the subsequent dynamic broadband matching module, multi-stage push-pull amplification module, digital predistortion correction module and thermal management module. At this time, the temperature sensor of the thermal management module immediately starts monitoring and transmits the temperature data of the silicon-based CMOS chip to the temperature control circuit and the integrated MCU of the dynamic broadband matching module at the same time.
[0052] After the radio frequency signal enters from the input port, it first arrives at the dynamic broadband matching module. It first undergoes broadband tuning through a parallel network composed of adjustable inductors and adjustable capacitors, and then completes matching through a series network composed of fixed inductors, fixed capacitors and resistors. The integrated MCU dynamically adjusts the parameters of the adjustable components according to the operating frequency band, and at the same time receives real-time data from the temperature sensor to perform thermal compensation calibration. The optimized matched signal is then input to a multi-stage push-pull amplification module. Multiple pairs of symmetrically arranged transistors amplify the power in a push-pull manner. The collector signals of each transistor are superimposed in phase through a microstrip line. The amplified radio frequency signal is then output to the system port through a coaxial line.
[0053] The output of the multi-stage push-pull amplifier module is split into two signals: the main output path is transmitted to the system output port, and the monitoring path is connected to the digital predistortion correction module. The digital predistortion correction module samples and amplifies the signal through the ADC analog-to-digital converter. The DSP digital signal processor analyzes the signal distortion characteristics in real time and generates predistortion algorithm parameters. The compensation signal is then fed back to the input of the dynamic broadband matching module through the DAC digital-to-analog converter to form a closed-loop correction. At the same time, the DSP processor maintains communication with the integrated MCU. When abnormal temperature or signal distortion is detected, parameter synchronization is triggered, and the integrated MCU adjusts the adjustable components of the matching module accordingly.
[0054] Throughout the entire operation, the temperature sensor of the thermal management module continuously monitors the chip surface temperature. When the temperature exceeds the first threshold, the temperature control circuit starts the piezoelectric pump to circulate the coolant at a basic flow rate. When a higher threshold is reached, the flow rate is increased and a power reduction command is sent to the integrated MCU. The microfluidic system efficiently transfers heat through thermo-bonded microchannels. The piezoelectric pump drives the coolant to flow through the microchannel structure at the bottom of the chip to form a heat dissipation closed loop. This multi-system collaborative operation process achieves wide-bandwidth, high linearity, and temperature-adaptive power amplification through multiple hardware connections and signal interaction.
[0055] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A multi-band broadband power amplifier module, comprising a single-chip module, a thermal management module, and a power management module, characterized in that: The single-chip module integrates a dynamic broadband matching module, a multi-stage push-pull amplification module, and a digital predistortion correction module. The output of the dynamic broadband matching module is electrically connected to the input of the multi-stage push-pull amplification module, the output of the multi-stage push-pull amplification module is electrically connected to the input of the digital predistortion correction module, the output of the digital predistortion correction module is electrically connected to the input of the dynamic broadband matching module, and the single-chip module is bidirectionally electrically connected to the thermal management module.
2. The multi-band broadband power amplifier module according to claim 1, characterized in that: The single-chip module is a silicon-based CMOS chip. The thermal management module includes heat sinks, a microfluidic circulation system, a temperature sensor, and a temperature control circuit. The heat sinks and temperature sensor are both mounted on the surface of the silicon-based CMOS chip. The microfluidic circulation system includes microchannels and a piezoelectric pump. The microchannels are mounted below the silicon-based CMOS chip. The temperature sensor is electrically connected to the temperature control circuit and the dynamic broadband matching module, respectively. The output terminal of the temperature control circuit is electrically connected to the input terminal of the piezoelectric pump.
3. The multi-band broadband power amplifier module according to claim 2, characterized in that: The dynamic broadband matching module includes an adjustable inductor, an adjustable capacitor, a fixed inductor, a fixed capacitor, a resistor, and an integrated MCU. The adjustable inductor and the adjustable capacitor are connected in parallel and then connected in series with the fixed inductor to form a compensation circuit. The fixed inductor, the fixed capacitor, and the resistor are connected in series in the circuit. The integrated MCU is communicatively connected to the adjustable inductor and the adjustable capacitor, respectively. The integrated MCU is electrically connected to the thermal management module.
4. The multi-band broadband power amplifier module according to claim 1, characterized in that: The multi-stage push-pull amplification module includes multiple pairs of symmetrically arranged transistors, microstrip lines, and coaxial lines. The collectors of the transistors are connected in parallel with the microstrip lines, and the microstrip lines are electrically connected to the coaxial lines.
5. A multi-band broadband power amplifier module according to claim 3, characterized in that: The predistortion correction module includes an ADC analog-to-digital converter, a DSP digital signal processor, and a DAC digital-to-analog converter. The input terminal of the ADC is electrically connected to the output terminal of the multi-stage push-pull amplifier module, the output terminal of the ADC is communicatively connected to the input terminal of the DSP digital signal processor, and the output terminal of the DSP digital signal processor is communicatively connected to the input terminal of the DAC digital-to-analog converter.
6. A multi-band broadband power amplifier module according to claim 5, characterized in that: The DSP digital signal processor is communicatively connected to the integrated MCU, and the output of the DAC digital-to-analog converter is electrically connected to the input of the dynamic broadband matching module.
7. A multi-band broadband power amplifier module according to claim 1, characterized in that: The power management module includes a filter and a voltage regulator. The output of the filter is electrically connected to the input of the voltage regulator. The output of the voltage regulator is electrically connected to the inputs of the dynamic broadband matching module, the multi-stage push-pull amplification module, the digital predistortion correction module, and the thermal management module, respectively.
8. A multi-band broadband power amplifier module according to claim 7, characterized in that: The filter consists of a cascaded π-type differential mode filter module and a common mode suppression module. The input terminal of the π-type differential mode filter module is connected to an external power supply, the output terminal of the π-type differential mode filter module is electrically connected to the input terminal of the common mode suppression module, and the output terminal of the common mode suppression module is electrically connected to the input terminal of a voltage regulator.