Systems and methods for thermal management and thermal impulse testing

Abstract

Systems may include a hot solution supply and a cold solution supply utilizing flow controllers, temperature control units, valve systems, various temperature and pressure sensors, an inspection zone and recirculation systems. A method for thermal management and thermal impulse testing may include configuring a hot and cold solution system and monitoring temperature profiles in each system and alternating the flow of the hot and cold cycles then monitoring the components tested in the inspection zone.

Description

024-021US01SYSTEMS AND METHODS FOR THERMAL MANAGEMENT AND THERMAL IMPULSE TESTINGBACKGROUND

[0001] The present invention relates to systems and methods for thermal management and thermal impulse testing. In some embodiments, these systems and methods for thermal management testing may be used for data center cooling and in other embodiments they may be used in thermal critical systems, such as, but not limited to, data centers, nuclear reactors and reactor core cooling, fuel cell or electric vehicle battery cooling. Modern data centers utilizing the latest in GPUs and CPUs face the challenges of heat dissipation as a result of the high calculation densities of the latest designs. Failure to remove the heat may result in the calculations to be slowed due to the physics and materials of the device circuits. Prolonged high temperature exposure can result in increased risks of a variety of failure mechanisms, such as electromigration. In severe cases of elevated temperatures, irreversible damage to the graphics processing units (GPUs) and central processing units (CPUs) can result. Many chip designs now include the ability to reduce the speed of the calculations as a safeguard against exposure to high temperatures.

[0002] Data centers are large dedicated systems used to house computer systems and accompanying equipment. Data centers range in size, power requirements, redundancy, and overall structure. Some are used to store date for financial markets, control a city grid, cloud computing services, artificial intelligence, cryptomining, media streaming, other systems that utilize a processor to control functionality, and the like.SUMMARY024-021US01

[0003] The present disclosure is directed to systems and methods of thermal management testing such as for use but not limited with data center GPU and CPU cooling circuits, fuel cell and electric and hybrid vehicle battery cooling systems, and the like.

[0004] Modem data centers, fuel cells, nuclear reactors, and electrical vehicle battery cooling systems face the challenges of heat dissipation. Failure to remove the heat can result in the calculations to be slowed due to the physics and materials of the device circuits or to critical damage occurring to the system. Prolonged high temperature exposure can result in increased risks of a variety of failure mechanisms, such as electromigration. In severe cases of elevated temperatures, irreversible damage to the GPUs and CPUs can result. Many chip designs include the ability to reduce the speed of the calculations as a safeguard against exposure to high temperatures. In a high-tech computer driven society sometimes, critical functions rely on computing speed. If these computing functions are interrupted due to thermal runaway or thermal inefficiency, then drastic consequences could occur. CPUs and GPUs also have extremely robust thermal protection; however performance will decrease. This thermal throttling occurs when a CPU or GPU’s temperature increases, and it automatically reduces its processing speed in an effort to cool to prevent damage to the hardware. If the CPU starts operating above the CPU's thermal limit it will begin to reduce the frequency in order to prevent catastrophic failure. With processers, such as produced by Intel, the thermal limit for both Turbo Boost and thermal protection on is right at 100 °C. Until the CPU hits 100 °C the process should be operating at 100% of the CPUs available performance. Over 100 °C, however, the CPU will start throttling back to keep itself from overheating. See FIG. 6.024-021US01

[0005] One means to mitigate these risks is to employ active cooling of the surfaces of the chips. Liquid cooling systems have been devised to increase the amount and rate of heat transfer away from the surface of critical components within the hardware. Liquid cooling is generally more efficient than air cooling, especially high performance systems. Liquid has a better thermal conductivity than air allowing it to remove heat more effectively and keep CPUs and GPUs components cooler. Cooler components lead to improved performance, decreased energy consumption, and increase in component life. These are all critical factors for systems that need low maintenance. In relation to air cooled systems the key benefits of liquid cooling include but are not limited to reducing overall power consumption, higher hardware density which supports more equipment in a smaller space increasing cooling capacity, reduced maintenance, prolonging hardware and CPU and GPU component life, lower operational costs, quieter operation. These approaches have seen increased application over the past years because of the efficiency of heat removal and the availability of components. The risks that are incurred by having the liquid coolant against the surface of the critical processors is that a leak of the cooling solution could result in an electrical short and significant damage to the components through thermal cycling. To present, no methods of testing hoses, couplings, and hose-couplings to transfer cooling solution have been published to optimize the components for thermal cycling and thermal shock. Thermal shock may be characterized by a rapid change in temperature that results in a transient mechanical load on a component. The load is caused by the differential expansion of different parts of the object due to the temperature change. This differential expansion can be understood in terms of strain, rather than stress. When the strain exceeds the tensile strength of the material, it can cause cracks to form, and eventually lead to structural failure.024-021US01When cyclic rapid change in temperature occurs such as a sudden increase in processor demand, cooling system power or heat exchanger failure, critical components may be more susceptible to failure causing wider complete system damage. The risk of widespread system damage occurring is why there is a need for a testing methods and systems to help test hoses, couplings, fittings used in liquid cooling systems to withstand cyclic thermal shock or have a known safety factor and temperature profile to develop a product or component lifecycle.

[0006] Currently there is an impracticality of physical testing of cooling failures on live data centers, fuel cells, or electric vehicle cooling systems due to the complex nature of processes the computer systems and processors are performing. Critical failures during testing may result in large downtime for the systems and large costs. Optimizing components of the cooling systems to be able to withstand thermal cycling and thermal shock will become increasingly important with the digitization of historically analog cooling systems.

[0007] The present invention presents a method to test for early or infant failures of the cooling conveyance products to reduce risks of harmful leakages from taking place as a result of product quality or workmanship, thermal incompatibility, incorrect assembly, or the like.

[0008] In some embodiments of data center cooling loops, one of the characteristics is a rapid increase in temperatures, followed by a rapid decrease in temperatures. This situation can result from the training of Al models, high volume requests, high data traffic requests, high battery or fuel cell load, and the like. The result of the rapid swing in temperatures can cause a leakage path due to the difference in coefficient of thermal expansion between the hose material set and the coupling material set, having one material fatigue at a different024-021US01 rate than the other, or the like. Significant differences can open leak paths where coolant solution can egress from the cooling loop in an uncontrolled fashion. It may become commercially beneficial to test for compatibility of the assembly because of differences in materials and variation in the production steps at the subcomponent or at the assembly level before the cooling system is installed in its final system.

[0009] The process and equipment developed utilizes a high-pressure thermal impulses on a recurring basis to identify any potential future issues within the application. With a high- pressure, high temperature differential test methodology potential failures may be identified more effectively before systems are installed.

[0010] Efficient thermal management means that critical systems are better safeguarded against the risks of overheating, preserving the integrity and longevity of the system as well as minimizing maintenance of the system. Utilizing components that have improved quality due to undergoing thermal impulse testing will lead to longer maintenance intervals and increased cost savings. In some embodiments high pressure may be any pressure above ambient and in others it may be in the range of lOOpsi to 1000 psi. However, in some embodiments the pressure may be larger than 1000 psi.

[0011] In some embodiments of a system for data center thermal management and thermal impulse testing of the system may include a High Pressure, Hot Supply. For example in some embodiments, 100°C of propylene glycol-water mixture, or any other solutions identified for use in cooling such as but not limited to water, including but not limited to purified or deionized water, or ethylene glycol, propylene glycol, mineral oil, dielectric fluids, any mixture of these, or the like , kept at 100 psi, or any other pressure greater than ambient. In some embodiments the pressure may be as high as 1000 psi or higher if the application024-021US01 requires it. Temperature can be added to the system by the use of a temperature control unit (TCU) or other method of heating a liquid. A temperature control unit may include but is not limited to resistive heating elements, conductive heating elements, thermistors, ceramic heaters, ceramic metallic composite heating elements, ceramic heating elements, tubular heating elements, waste heat recirculation heaters, or the like. The pressure of the liquid is maintained by pumps. In some embodiments different types of or a combination of different types of pumps may be used. The flow rate or flow volume is maintained by pressure differentials and conductance or by flow controllers. In some embodiments of a system for data center thermal management and thermal impulse testing of the system may include a High Pressure, Cold Supply. In some embodiments for example, a 0°C of propylene glycol-water mixture, or any other solutions identified for use in cooling, kept at 100 psi, or any other pressure greater than ambient. Other temperature cold liquids may be used. The low temperature range of a cold supply may be in the range of -40 Celsius to ambient temperature. The high temperature supply may be in the range of ambient to the liquids superheated liquid state, in some embodiments it may be beneficial to take the hot supply solution temperature past it superheated state temperature to simulate a catastrophic failure of the full system. Temperature can be removed from the cooling solution by the use of a temperature control unit (TCU) or other method of cooling a liquid. The pressure of the liquid is maintained by pumps. The flow rate or flow volume is maintained by pressure differentials and conductance or by flow controllers.

[0012] In some embodiments of a system for data center thermal management and thermal impulse testing of the system may include a valve control to switch between the High Pressure, Hot Supply and the High Pressure, Cold Supply. This system may be accomplished by, but is024-021US01 not limited to, a three-way valve or automated or manual switching of two separate values, one for each of the supplies. In some embodiments this system may be configured and arranged to mimic heat cycling due to thermal throttling of CPUs and GPUs to stress the cooling system and its accompanying components such as but not limited to hoses, connectors and quick connect or disconnect couplings. The time between the switching actions may vary from very fast, on the order of seconds, to very slow, on the order of days. The timing will depend on the ability to achieve desired temperature profiles. These may be different depending on the desired use of the components being tested such that for but not limited to modern data centers, artificial intelligence computing systems, cloud computing systems, fuel cell systems, and electrical vehicle battery cooling systems. In some embodiments, the valves system along with the TCUs may also be able to control and alter the temperature differential along with the interval. Through the use of the vents in the system, which in some embodiments may be computer-controlled vents, the pressure of the hot supply and cold supply systems may also be able to be altered. In some embodiments it may be beneficial to optimize the thermal impulse along with a pressure impulse. In other embodiments a purely thermal impulse may be all that is necessary.

[0013] In some embodiments a system for data center thermal management and thermal impulse it may be beneficial to include a system that is configured and arranged to facilitate filtration and recycling of the cooling solutions, especially to retain the thermal characteristics of the solution. This system may filter worn cooling solution particles and recycle them by adding new concentrations to the cooling solution mixture.

[0014] In some embodiments a system for data center thermal management and thermal impulse Monitoring and recording of the temperature, pressure, flow rate, conductance, etc.024-021US01

[0015] In some embodiments a system for data center thermal management and thermal impulse Inspection systems for detection of low level leaks with means such as tracer, fluorescent, and radioactive chemistry.

[0016] In some embodiments, a system for data center thermal management and thermal impulse adds the recirculation loops for both the hot and cold sides, and it removes the vents. Venting residual air will be from the reservoirs, which may need a pressure relief valve.

[0017] In some embodiments of a method for thermal management and thermal impulse testing may include steps such as but not limited to: loading the required assemblies onto the system, in some embodiments multiple concurrent assemblies can be tested on the same equipment or test bench; purging residual air from the system; establishing the first step of the process, either the High Pressure, Hot Supply or the High Pressure, Cold Supply, only one supply is established at this stage the other will be established and started at a different stage; allowing for the flow to continue for a defined period of time during which the temperatures at the measurement points match the expected profiles, switching to the alternate supply of High Pressure, Hot Supply or High Pressure, Cold Supply, depending on what was started in Step during the first step; measuring the temperatures of the cooling solution for a defined period at various measurement points and at the end of the defined period of time, typically but not necessarily the same as used in Step two above, Cycle 1 is defined as complete; then confirming that the Hot / Cold or Cold / Hot Waveform is defined and maintained through the full testing cycle; continuing the test by alternating between a hot cycle and cold cycle with the increment of the Full Cycle count increasing by one at the completion of the Hot / Cold or Cold / Hot cycles; testing for either a prescribed number of cycles or time or until a failure is detected by the loss of pressure, appearance of cooling024-021US01 solution, or identification of leaks using the inspection methods defined above. In some embodiments of methods of thermal impulse testing there may be two supply tanks or elements, one supplying hot solution and one supplying cold solution. The hot and cold solutions may also be pressurized in some systems. The hot and cold solutions will cyclically cycle through the components being tested. The method of testing may involve establishing the hot and cold supply solutions, purging residual air left in the system through at least one vent, then starting either the hot or cold supply flow through a flow meter, while establishing flow the solution may be recirculated and filtered through the supply, the hot and cold supply may be pressurized by the pump. The hot or cold solution is monitored through the use of temperature, flow, and pressure sensors. After the solution matches a temperature profile after a set period of time the flow is switched to the other supply of solution either the hit or cold, whichever was not previously running through the system. This is done to thermally shock the components being tested. After running the second supply for a period of time matching a temperature profile the Hot / Cold Waveform is created. Then the total period between the two cycles is calculated as one cycle. Then they system alternates between hot and cold cycles and run a full hot / cold cycle for a period of time increasing the number of cycles by one each time. The cycle is run for a period of time or until failure which is monitored by the system through sensors, UV florescent leak detection, flow-vis, tracer fluid and the like.

[0018] When loading assemblies into the system these may be entire thermal management systems, such as a complete server rack, active cooling systems or reactor cooling systems.

[0019] In some embodiments a successful test is indicated by the maintenance of pressures and flow rates through the test, by the lack of appearance of cooling solution originating from024-021US01 the assembly, and / or by the lack of detectable cooling solution through intra-test of posttest inspections such as but not limited to inspection systems for detection of low level leaks with means such as tracer, fluorescent, and radioactive chemistry. In some embodiments, gases may be introduced to

[0020] In some embodiments the hot and cold solutions may be water, including but not limited to purified or deionized water, or ethylene glycol, propylene glycol, mineral oil, dielectric fluids, any mixture of these, or the like.

[0021] The routing of the controls, may be configured in any way to facilitate the proper function of the testing methodology the testing workbench, rig, or system. In some embodiments the hot and cold sides may be constantly circulating when not flowing into the rack of assemblies being studied in a specific test.

[0022] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG. 1 is an exemplary illustration of a system for thermal management and thermal impulse testing.

[0024] FIG. 2 is another embodiment exemplary illustration of a system for thermal management and thermal impulse testing.

[0025] FIG. 3 is an exemplary illustration of a method for thermal management and thermal impulse testing.024-021US01

[0026] FIG. 4 is another embodiment exemplary illustration of a method for thermal management and thermal impulse testing.

[0027] FIG. 5 is another embodiment exemplary illustration of a method for thermal management and thermal impulse testing.

[0028] FIG. 6 is a trend of processor frequency based on temperature.DETAILED DESCRIPTION

[0029] As described above, described herein are systems and methods for data center thermal management and thermal impulse testing.

[0030] In the following description, reference is made to the accompanying drawing that forms a part hereof and in which is shown by way of illustration at least one specific embodiment. The following description provides additional specific embodiments. It is to be understood that other embodiments are contemplated and may be made without departing from the scope or spirit of the present disclosure. The following detailed description, therefore, is not to be taken in a limiting sense. While the present disclosure is not so limited, an appreciation of various aspects of the disclosure will be gained through a discussion of the examples, including the figures, provided below. In some instances, a reference numeral may have an associated sub-label consisting of a lower-case letter to denote one of multiple similar components. When reference is made to a reference numeral without specification of a sub-label, the reference is intended to refer to all such multiple similar components.

[0031] FIG. 1 is an exemplary illustration of a system for thermal management and thermal impulse testing.

[0032] FIG. 2 is another embodiment exemplary illustration of a system for thermal management and thermal impulse testing.024-021US01

[0033] FIG. 3 is an exemplary illustration of a method for thermal management and thermal impulse testing.

[0034] FIG. 4 is another embodiment exemplary illustration of a method for thermal management and thermal impulse testing.

[0035] FIG. 5 is another embodiment exemplary illustration of a method for thermal management and thermal impulse testing.

[0036] FIG. 6 is a trend of processor frequency based on temperature. Processor frequency can be correlated to processor performance.

[0037] In some embodiments system for thermal management and thermal impulse testing may include but is not limited to a High Pressure, Hot Supply system wherein for example, a High Pressure, Hot Supply solution may include a solution of approximately 100°C of propylene glycol-water mixture, or any other solutions identified for use in cooling, kept at 100 psi, or any other pressure greater than ambient. Temperature can be added to the solution by the use of a temperature control unit (TCU) or other method of heating a liquid. The pressure of the liquid may be maintained by pumps or through thermal expansion in some embodiments. The flow rate or flow volume is maintained by pressure differentials and conductance or by flow controllers; a High Pressure, Cold Supply system, wherein for example, a High Pressure, Cold Supply solution may include a solution in the range of - 40°C to ambient, but approximately 0°C of propylene glycol-water mixture, or any other compositions and temperature of solutions identified for use in cooling, kept at 100 psi, or any other pressure greater than ambient. Temperature can be removed from the cooling solution by the use of a temperature control unit (TCU) or other method of cooling a liquid. The pressure of the liquid is maintained by pumps. The flow rate or flow volume is024-021US01 maintained by pressure differentials and conductance or by flow controllers; a valve and valve control to switch between the High Pressure, Hot Supply and the High Pressure, Cold Supply, wherein the valve may be a three-way valve or automated or manual switching of two separate values, one for each of the supplies, a series of valves may also be used and may be computer controlled; a controller to control the time between the switching actions can vary from very fast, on the order of seconds, to very slow, on the order of days, the timing will depend on the ability to achieve desired temperature profiles and end application of the tested components; a filtration system and a recycling system of the cooling solutions, configured and arranged to retain the thermal characteristics of the solution; a monitoring and recording system of the temperature, pressure, flow rate, conductance, temperature; and an inspection systems for detection of low level leaks with means such as UV, tracer, fluorescent, and radioactive chemistry.

[0038] In another embodiment a system for thermal management and thermal impulse testing may include but is not limited to a High Pressure, Hot Supply system having a High Pressure, Hot Supply solution; a High Pressure, Cold Supply system having a High Pressure, Cold Supply solution a valve and valve control to switch between the High Pressure, Hot Supply and the High Pressure, Cold Supply; a controller to control the time between the switching actions can vary from very fast, on the order of seconds, to very slow, on the order of days, the timing will depend on the ability to achieve desired temperature profiles and end application of the tested components; a filtration system and a recycling system of the cooling solutions, configured and arranged to retain the thermal characteristics of the solution, where the filtration system has the ability to efficiently and effectively perform the needed function of maintaining the cooling solution in acceptable performance024-021US01 parameters; a monitoring and recording system of the temperature, pressure, flow rate, conductance, temperature; and an inspection systems for detection of low level leaks.

[0039] In a system for thermal management and thermal impulse testing It may be beneficial to include a Hot Supply solution with a solution of approximately 100°C of propylene glycol - water mixture, or any other solutions identified for use in cooling, kept at 100 psi, or any other pressure greater than ambient. It may also be beneficial for a system for thermal management and thermal impulse testing to include a temperature control unit (TCU) or other method of heating a liquid for each Hot Supply and the Cold Supply. In some embodiments, the pressure of the liquid may be maintained by pumps or through thermal expansion in some embodiments for each Hot Supply and the Cold Supply. In some embodiments, the flow rate or flow volume is maintained by pressure differentials and conductance or by flow controllers for each Hot Supply and the Cold Supply. In some embodiments the Cold Supply solution a may include a solution of approximately 0°C of propylene glycol-water mixture, or any other compositions and temperature of solutions identified for use in cooling, kept at 100 psi, or any other pressure greater than ambient. In some embodiments, the valve may be a three-way valve or automated or manual switching of two separate values, one for each of the supplies, a series of valves may also be used and may be computer controlled. In some embodiments, the inspection systems comprise of detection means such as UV, tracer, fluorescent, or radioactive chemistry.

[0040] In some embodiments of a method for thermal management and thermal impulse testing the steps of testing may include but are not limited to loading the required assemblies onto the system, wherein in some embodiments the assemblies may include but are not limited to a hot solution reservoir, a cold solution reservoir, Hot TCU, Cold TCU, Valve, quick024-021US01 connect fittings, thermocouple or other temperature sensor, pressure transducer or other pressure sensor, filtration systems, which may include filters or the like, valves configured to vent they system, hot pump, cold pump, Inlet assembly rack, inspection zone, outlet assembly rack, hot flow meter, and cold flow meter (multiple concurrent assemblies may be connected together and tested on the same equipment; purging residual air from the system; establishing a first step, either the High Pressure, Hot Supply or the High Pressure, Cold Supply each step to be performed independently; allowing for the flow to continue for a defined period of time during which the temperatures at the measurement points match the expected profiles to create a first measurement profile time period; switching to the alternate supply of High Pressure, Hot Supply or High Pressure, Cold Supply, depending on what was started in the first step to create a second step; at the end of the defined testing period of time, typically but not necessarily the same as used in the first measurement profile time period, Cycle 1 is defined as complete. The Hot / Cold or Cold / Hot Waveform is defined and must be maintained through the full testing cycle; alternating between Steps hot and cold cycles with the increment of the Cycle count; increasing the Hot / Cold or Cold / Hot cycles by one cycles at the end of the Hot / Cold or Cold / Hot cycles; testing for either a prescribed number of cycles or time or until a failure is detected by the loss of pressure, appearance of cooling solution, or identification of leaks using the inspection; and monitoring utilizing a monitoring and inspection system.

[0041] In some embodiments of a method for thermal management and thermal impulse testing the steps of testing may include but are not limited to loading a plurality of assemblies in to the system; purging residual air from the system; establishing a first step to be performed independently; starting the flow of the first step; allowing for the flow to continue for024-021US01 a defined period of time during which the temperatures at the measurement points match the expected profiles to create a first measurement profile time period; switching to the alternate supply of High Pressure, Hot Supply or High Pressure, Cold Supply, depending on what was started in the first step to create a second step; starting the flow of the second step; allowing for the flow to continue for a defined period of time during which the temperatures at the measurement points match the expected profiles to create a second measurement profile time period; combining the first and second measurement profile time period to create a full cycle time period; increasing the number of full cycles for a predetermined time period or prescribed number of cycles; testing for either the prescribed number of cycles or time or until a failure is detected by the loss of pressure, appearance of cooling solution, or identification of leaks using the inspection; and monitoring utilizing a monitoring and inspection system. In some embodiments, the a plurality of assemblies includes but is not limited to a hot solution reservoir, a cold solution reservoir, Hot TCU, Cold TCU, Valve, quick connect fittings, thermocouple or other temperature sensor, pressure transducer or other pressure sensor, filtration systems, which may include filters or the like, valves configured to vent they system, hot pump, cold pump, Inlet assembly rack, inspection zone, outlet assembly rack, hot flow meter, and cold flow meter (multiple concurrent assemblies may be connected together and tested on the same equipment. In some embodiments, the first step is either the High Pressure, Hot Supply or the High Pressure, Cold Supply. In some embodiments, the defined period of time is a interpolated service life of the component being tested. In some embodiments, the monitoring and inspection system includes but is not limited to sensors and apparatus configured and arranged to measure pressure, appearance of cooling solution, or identification of leaks024-021US01 using inspection such as but not limited to UV, chemical properties of the solution, LIDAR, SONAR, Xray, magnetism, radioactive chemistry, and the like.

[0042] The above specification and examples provide a complete description of the structure and use of exemplary embodiments of the invention. The above description provides specific embodiments. It is to be understood that other embodiments are contemplated and may be made without departing from the scope or spirit of the present disclosure. The above detailed description, therefore, is not to be taken in a limiting sense. For example, elements or features of one example, embodiment or implementation may be applied to any other example, embodiment or implementation described herein to the extent such contents do not conflict. While the present disclosure is not so limited, an appreciation of various aspects of the disclosure will be gained through a discussion of the examples provided.

[0043] Unless otherwise indicated, all numbers expressing feature sizes, amounts, and physical properties are to be understood as being modified by the term “about,” whether or not the term “about” is immediately present. Accordingly, unless indicated to the contrary, the numerical parameters set forth are approximations that can vary depending upon the desired properties sought to be obtained by those skilled in the art utilizing the teachings disclosed herein.

[0044] As used herein, the singular forms “a,” “an,” and “the” encompass implementations having plural referents, unless the content clearly dictates otherwise. As used in this specification and the appended claims, the term “or” is generally employed in its sense including “and / or” unless the content clearly dictates otherwise.

[0045] Although the technology has been described in language that is specific to certain structures and materials, it is to be understood that the invention defined in the appended claims is024-021US01 not necessarily limited to the specific structures and materials described. Rather, the specific aspects are described as forms of implementing the claimed invention. Because many embodiments of the invention can be practiced without departing from the spirit and scope of the invention, the invention resides in the claims hereinafter appended.

Claims

024-021US01CLAIMSWhat is claimed is:

1. A system for thermal management and thermal impulse testing comprising: a High Pressure, Hot Supply system wherein for example, a High Pressure, Hot Supply solution may include a solution of approximately 100°C of propylene glycol -water mixture, or any other solutions identified for use in cooling, kept at 100 psi, or any other pressure greater than ambient. Temperature can be added to the solution by the use of a temperature control unit (TCU) or other method of heating a liquid. The pressure of the liquid may be maintained by pumps or through thermal expansion in some embodiments. The flow rate or flow volume is maintained by pressure differentials and conductance or by flow controllers; a High Pressure, Cold Supply system, wherein for example, a High Pressure, Cold Supply solution may include a solution of approximately 0°C of propylene glycol-water mixture, or any other compositions and temperature of solutions identified for use in cooling, kept at 100 psi, or any other pressure greater than ambient. Temperature can be removed from the cooling solution by the use of a temperature control unit (TCU) or other method of cooling a liquid. The pressure of the liquid is maintained by pumps. The flow rate or flow volume is maintained by pressure differentials and conductance or by flow controllers; a valve and valve control to switch between the High Pressure, Hot Supply and the High Pressure, Cold Supply, wherein the valve may be a three-way valve or automated or manual switching of two separate values, one for each of the supplies, a series of valves may also be used and may be computer controlled;024-021US01 a controller to control the time between the switching actions can vary from very fast, on the order of seconds, to very slow, on the order of days, the timing will depend on the ability to achieve desired temperature profiles and end application of the tested components; a filtration system and a recycling system of the cooling solutions, configured and arranged to retain the thermal characteristics of the solution; a monitoring and recording system of the temperature, pressure, flow rate, conductance, temperature; and an inspection systems for detection of low level leaks with means such as tracer, fluorescent, and radioactive chemistry.

2. A system for thermal management and thermal impulse testing comprising: a High Pressure, Hot Supply system having a High Pressure, Hot Supply solution; a High Pressure, Cold Supply system having a High Pressure, Cold Supply solution a valve and valve control to switch between the High Pressure, Hot Supply and the High Pressure, Cold Supply; a controller to control the time between the switching actions can vary from very fast, on the order of seconds, to very slow, on the order of days, the timing will depend on the ability to achieve desired temperature profiles and end application of the tested components; a filtration system and a recycling system of the cooling solutions, configured and arranged to retain the thermal characteristics of the solution; a monitoring and recording system of the temperature, pressure, flow rate, conductance, temperature; and024-021US01 an inspection systems for detection of low level leaks.

3. A system for thermal management and thermal impulse testing as described in claim 2 wherein the Hot Supply solution a solution of approximately 100°C of propylene glycol-water mixture, or any other solutions identified for use in cooling, kept at 100 psi, or any other pressure greater than ambient.

4. A system for thermal management and thermal impulse testing as described in claim 2 further comprising a temperature control unit (TCU) or other method of heating a liquid for each Hot Supply and the Cold Supply.

5. A system for thermal management and thermal impulse testing as described in claim 2 wherein the pressure of the liquid may be maintained by pumps or through thermal expansion in some embodiments for each Hot Supply and the Cold Supply.

6. A system for thermal management and thermal impulse testing as described in claim 2 wherein the flow rate or flow volume is maintained by pressure differentials and conductance or by flow controllers for each Hot Supply and the Cold Supply.

7. A system for thermal management and thermal impulse testing as described in claim 2 wherein the Cold Supply solution a may include a solution of approximately 0°C of propylene glycol-water mixture, or any other compositions and temperature of solutions identified for use in cooling, kept at 100 psi, or any other pressure greater than ambient.

8. A system for thermal management and thermal impulse testing as described in claim 2 wherein the valve may be a three-way valve or automated or manual switching of two separate values, one for each of the supplies, a series of valves may also be used and may be computer controlled.024-021US019. A system for thermal management and thermal impulse testing as described in claim 2 wherein the inspection systems comprise of detection means such as UV, tracer, fluorescent, or radioactive chemistry.

10. A method for thermal management and thermal impulse testing comprising: loading the required assemblies onto the system, wherein in some embodiments the assemblies may include but are not limited to a hot solution reservoir, a cold solution reservoir, Hot TCU, Cold TCU, Valve, quick connect fittings, thermocouple or other temperature sensor, pressure transducer or other pressure sensor, filtration systems, which may include filters or the like, valves configured to vent they system, hot pump, cold pump, Inlet assembly rack, inspection zone, outlet assembly rack, hot flow meter, and cold flow meter (multiple concurrent assemblies may be connected together and tested on the same equipment; purging residual air from the system; establishing a first step, either the High Pressure, Hot Supply or the High Pressure, Cold Supply each step to be performed independently; allowing for the flow to continue for a defined period of time during which the temperatures at the measurement points match the expected profiles to create a first measurement profile time period; switching to the alternate supply of High Pressure, Hot Supply or High Pressure, Cold Supply, depending on what was started in the first step to create a second step; at the end of the defined testing period of time, typically but not necessarily the same as used in the first measurement profile time period, Cycle 1 is defined as complete. The Hot / Cold024-021US01 or Cold / Hot Waveform is defined and must be maintained through the full testing cycle; alternating between Steps hot and cold cycles with the increment of the Cycle count; increasing the Hot / Cold or Cold / Hot cycles by one cycles at the end of the Hot / Cold or Cold / Hot cycles; testing for either a prescribed number of cycles or time or until a failure is detected by the loss of pressure, appearance of cooling solution, or identification of leaks using the inspection; and monitoring utilizing a monitoring and inspection system.

11. A method for thermal management and thermal impulse testing comprising: loading a plurality of assemblies in to the system,; purging residual air from the system; establishing a first step to be performed independently; starting the flow of the first step; allowing for the flow to continue for a defined period of time during which the temperatures at the measurement points match the expected profiles to create a first measurement profile time period; switching to the alternate supply of High Pressure, Hot Supply or High Pressure, Cold Supply, depending on what was started in the first step to create a second step; starting the flow of the second step; allowing for the flow to continue for a defined period of time during which the temperatures at the measurement points match the expected profiles to create a second measurement profile time period;024-021US01 combining the first and second measurement profile time period to create a full cycle time period; increasing the number of full cycles for a predetermined time period or prescribed number of cycles; testing for either the prescribed number of cycles or time or until a failure is detected by the loss of pressure, appearance of cooling solution, or identification of leaks using the inspection; and monitoring utilizing a monitoring and inspection system.

12. The method for thermal management and thermal impulse testing as described in claim 11 wherein the a plurality of assemblies includes but is not limited to a hot solution reservoir, a cold solution reservoir, Hot TCU, Cold TCU, Valve, quick connect fittings, thermocouple or other temperature sensor, pressure transducer or other pressure sensor, filtration systems, which may include filters or the like, valves configured to vent they system, hot pump, cold pump, Inlet assembly rack, inspection zone, outlet assembly rack, hot flow meter, and cold flow meter (multiple concurrent assemblies may be connected together and tested on the same equipment.

13. The method for thermal management and thermal impulse testing as described in claim 11 wherein the first step is either the High Pressure, Hot Supply or the High Pressure, Cold Supply.

14. The method for thermal management and thermal impulse testing as described in claim 11 wherein the defined period of time is a interpolated service life of the component being tested.024-021US0115. The method for thermal management and thermal impulse testing as described in claim 11 wherein the monitoring and inspection system includes but is not limited to sensors and apparatus configured and arranged to measure pressure, appearance of cooling solution, or identification of leaks using inspection such as but not limited to UV, chemical properties of the solution, LIDAR, SONAR, Xray, magnetism, radioactive chemistry, and the like.

Images