Combined centralized and distribution unit (CCDU)

Abstract

COMBINED CENTRALIZED AND DISTRIBUTION UNIT (CCDU) A Centralized and Distributed Unit (CCDU) is a combined unit that integrates a Centralized unit (CU) and a Distributed unit (DU) into a single housing. The CU and DU are connected through one or more thermal bridges, which are formed by Heat pipes, to dissipate heat generated by the components. The unit includes a top housing, a bottom housing, a printed circuit board (PCB) assembly, and one or more cold plates, heat sinks, and heat pipes. The unit is designed to maintain an equilibrium thermal state between the server processor, top housing, and bottom housing, and adjust the number of heat pipes and heat sinks based on spatial constraints and thermal requirements.

Description

COMBINED CENTRALIZED AND DISTRIBUTION UNIT (CCDU)RESERVATION OF RIGHTS

[0001] A portion of the disclosure of this patent document contains material, which is subject to intellectual property rights such as, but are not limited to, copyright, design, trademark, Integrated Circuit (IC) layout design, and / or trade dress protection, belonging to Jio Platforms Limited (JPL) or its affiliates (hereinafter referred as owner). The owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent files or records, but otherwise reserves all rights whatsoever. All rights to such intellectual property are fully reserved by the owner.TECHNICAL FIELD

[0002] The present disclosure relates generally to the field of communication systems. More particularly, the present disclosure relates to a combined centralized and distribution unit (CCDU).DEFINITIONS

[0003] As used in the present disclosure, the following terms are generally intended to have the meaning as set forth below, except to the extent that the context in which they are used to indicate otherwise.

[0004] The term “Centralized unit (CU)” refers to a system or component that consolidates control, processing, or management functions into a single, central location or unit.

[0005] The term “Distribution unit (DU)” refers to a system or architecture where processing, control, or data management functions are spread across multiple locations or components, rather than being concentrated in a single central unit. In a distribution system, each unit or node typically operates independently but communicates with other units to achieve coordinated functionality.

[0006] The term “Combined centralized and distribution unit (CCDU)” refers to a system that combines and performs functions of the centralized unit and the distribution unit.

[0007] The term “Printed Circuit Board (PCB)” used hereinafter in the specification refers to a flat board made of insulating material (e.g., fiberglass or plastic) that physically supports and electrically connects electronic components using the conductive pathways or traces, typically made of copper. PCBs are essential for the functionality of electronic devices, providing a platform for assembling and interconnecting the electronic components.

[0008] The term “Heat sink” used hereinafter in the specification refers to a passive cooling component used to dissipate heat from the electronic devices, ensuring they operate within safe temperature ranges. The heat sink absorbs the heat generated by components such as central processing units (CPUs), graphical processing units (GPUs), and power transistors, dissipating it into the surrounding air or another medium. The heat sink has several key components that effectively dissipate heat from electronic devices. A base plate is a part that directly contacts the heat-generating component, absorbing heat and distributing it across the heat sink. The primary function of the heat sink is to maintain an optimal operating temperature, ensuring that the components do not overheat and perform reliably.

[0009] The term “Heat pipe” used hereinafter in the specification refers to a highly efficient thermal transfer component often used in the heat sink to dissipate heat away from the critical components, such as CPUs or GPUs.

[0010] The term “Cold plate / block” refers to a flat sheet or piece used to conduct and disperse heat away from a heat source, typically in electronic, mechanical, or thermal management systems. The cold plate / block may be made of copper, aluminum, a hybrid of copper and aluminum, graphite sheet, ceramic, alloy, or a liquid-basedcoolant (such as water). For example, Copper's high thermal conductivity makes it an ideal material for efficiently transferring heat from one area to another and dissipating it into the surrounding environment.

[0011] The term “Thermal Bridge”, used hereinafter in the specification, refers to that allows heat to transfer from one component or region to another, typically more efficiently than through the surrounding material. It acts as a bridge for heat flow, enabling controlled conduction between two surfaces or structures.

[0012] The term “Network Interface Controllers (NICs)”, also known as network interface cards or network adapters, used hereinafter in the specification, refers to hardware components that allow devices to connect to a network. The NICs facilitate communication between a computer (or other devices) and the network, enabling data exchange over wired or wireless connections.

[0013] These definitions are in addition to those expressed in the art.BACKGROUND

[0014] The following description of related art is intended to provide background information pertaining to the field of the disclosure. This section may include certain aspects of the art that may be related to various features of the present disclosure. However, it should be appreciated that this section be used only to enhance the understanding of the reader with respect to the present disclosure, and not as admissions of prior art.

[0015] Combined Centralized and Distribution Unit (CCDU) is commonly associated with telecommunications (i.e., 5G networks and data centers). The CCDU represents a core architecture component where data processing, storage, and control functions are centralized within a specific unit or location. The CCDU manages and processes large volumes of data (e.g., radio data, traffic, control signaling, resourcemanagement data, operational data, and processing data), controls network functions, and coordinates communication across different network parts. The CCDU is typically designed to handle the high demands of high-performance computing, network management, and data traffic processing. The CCDU plays a crucial role in modern communication systems, especially with emerging technologies like 5G, which are driven to centralize critical functions while enabling distributed access and processing capabilities. The CCDU consolidates control functions and data processing tasks into a single physical or logical location.

[0016] CCDU typically includes numerous high-performance computing units, such as servers, routers, and switches. As the number of components increases, so does the heat density, the amount of heat generated per unit of space. Cooling systems in CCDUs are often energy intensive. For example, air conditioning (AC) units, liquid cooling systems, and ventilation mechanisms consume significant amounts of energy to maintain acceptable operating temperatures, thereby increasing operational costs and environmental impact. In high-density environments where servers are closely packed, airflow may not always reach every part of the system, forming thermal hotspots areas that experience higher temperatures than others.

[0017] Traditional CCDUs for 5G RAN applications commonly use cooling systems (e.g., fan-based cooling, heating, ventilation and air conditioning (HVAC) units, liquid cooling, etc.). Over time, fans may accumulate dust, debris, or even moisture, which can degrade their cooling efficiency. Additionally, the cooling systems in the CCDUs, particularly those relying on fans, generate noise in the environment and are not suitable in noise-sensitive environments, environments requiring acoustic compliance, enclosed or shared working spaces, or high-density deployments. These cooling systems are prone to failures, allowing dust and moisture to damage sensitive electronic components. Such failures lead to increased maintenance needs, operational downtime, and reduced system reliability, particularly in outdoor environments.Existing designs of the CCDU may also require additional air conditioning or outdoor cabinets, which can complicate installation and increase associated costs in conditions, such as environments that accelerate fan wear and require frequent component replacements, sites with limited access leading to higher operational effort, or deployments that demand recurring maintenance due to dust, temperature fluctuations, or regulatory compliance requirements.

[0018] In outdoor or semi-outdoor CCDUs (such as those used in 5G RAN infrastructure), cooling systems are susceptible to environmental factors including ambient temperature, dust, moisture, and extreme weather conditions. These external conditions can compromise the performance of fans, air conditioning systems, and liquid cooling solutions.

[0019] There is a need for a system and method to address the challenges of inefficiencies and heat dissipation in the CCDUs, while also focusing on self- sufficiency, lowest cost, and minimal maintenance for heat dissipation, as well as the least requirement for operations.OBJECTIVES

[0020] Some of the objectives of the present disclosure, which at least one embodiment herein satisfies, are as follows:

[0021] An objective of the present disclosure is to provide a combined centralized and distribution unit (CCDU).

[0022] Another objective of the present disclosure is to integrate a Centralized Unit (CU) and a Distribution Unit (DU) into a single printed circuit board (PCB).

[0023] Yet another objective of the present disclosure is to operate the CCDU with a plurality of network cells (e.g., nine cells) and is suitable for pole mounting withoutthe need for air conditioning or additional outdoor cabinets, providing a robust solution for outdoor applications.

[0024] Yet another objective of the present disclosure is to enhance the durability of the CCDU and reduce maintenance efforts and costs by eliminating fans.

[0025] Yet another objective of the present disclosure is to provide low-power cooling with a layout utilizing various components such as heat pipes, heat sinks and cold plates or blocks (e.g., copper plates / blocks).

[0026] Yet another objective of the present disclosure is to operate efficiently with low power consumption, contribute to sustainability goals and reduce operational expenses in the network deployments.

[0027] Yet another objective of the present disclosure is to establish a self- sufficient operational framework that autonomously regulates thermal conditions and performance without reliance on external cooling subsystems or continuous operator oversight.

[0028] Yet another objective of the present disclosure is to provide a cost-efficient CCDU that minimizes capital and operational expenditure by reducing dependency on high-cost thermal management components and by employing simplified, energyefficient structural elements.

[0029] Yet another objective of the present disclosure is to reduce maintenance requirements through the integration of passive or low-complexity thermal technologies that mitigate component wear and decrease the frequency of service interventions.

[0030] Yet another objective of the present disclosure is to minimize operational requirements by incorporating automated thermal supervision mechanisms, thereby reducing the need for manual adjustments and continuous operational management.

[0031] Other objectives and advantages of the present disclosure will be more apparent from the following description, which is not intended to limit the scope of the present disclosure.SUMMARY

[0032] In an exemplary embodiment, a combined centralized and distribution unit (CCDU) comprises a top housing, a bottom housing and a printed circuit board (PCB) assembly is configured to integrate one or more components associated with a centralized unit (CU) and a distribution unit (DU). The PCB assembly comprises a first cold plate mounted on a server processor integrated on a first side of the PCB assembly and configured to contact the bottom housing and a second cold plate configured to be coupled with a second side of the PCB assembly and is configured to contact the top housing and one or more heat pipes are configured to dissipate heat generated by the CU and DU integrated on the PCB assembly by forming one or more thermal bridges.

[0033] In some embodiments, the CCDU comprises an enclosure configured to enclose the top housing, the bottom housing and the PCB assembly.

[0034] In some embodiments, the one or more thermal bridges comprise at least one of a first thermal bridge between the first cold plate and the bottom housing, and a second thermal bridge between the second cold plate and the top housing.

[0035] In some embodiments, the top housing comprises one or more top heat sinks and one or more top heat pipes. The bottom housing comprises one or more bottom heat sinks and one or more bottom heat pipes. The first cold plate and the second cold plate are copper plates.

[0036] In some embodiments, the one or more components comprise the server processor, a memory module, a hardware accelerator, a network interface controller, a plurality of network interface cards (NICs), a board management control (BMC), a synchronizer, an oscillator, and a plurality of network ports.

[0037] In some embodiments, a number of the one or more heat pipes, a number of the one or more top heat pipes and a number of the one or more bottom heat pipes are determined based on at least one of a total heat to be dissipated, a thermal capacity of the one or more heat pipes, and one or more spatial constraints of a layout of the CCDU.

[0038] In some embodiments, the CCDU is configured to determine a first temperature difference between the second cold plate and the one or more top heat sinks associated with the top housing and a second temperature difference between the first cold plate and the one or more bottom heat sinks associated with the bottom housing. The CCDU is configured to initiate a heat flow to maintain an equilibrium thermal state between the server processor, the top housing and the bottom housing based on the determined first temperature difference and the second temperature difference.

[0039] In another exemplary embodiment, a method for assembling a combined centralized and distribution unit (CCDU) is disclosed. The method comprises integrating one or more components associated with a centralized unit (CU) and a distribution unit (DU) on a printed circuit board (PCB) assembly. The method comprises mounting a first cold plate on a server processor integrated on a first side of the PCB assembly. The first cold plate is configured to contact the bottom housing. The method comprises coupling a second cold plate to a second side of the PCB assembly. The second cold plate is configured to contact the top housing. The method comprises dissipating heat generated by the CU and the DU integrated on the PCB assembly by forming one or more thermal bridges.

[0040] In some embodiments, an enclosure is configured to enclose the top housing, the bottom housing and the PCB assembly. The first cold plate and the second cold plate are copper plates. The one or more thermal bridges comprise at least one of a first thermal bridge between the first cold plate and the bottom housing and a second thermal bridge between the second cold plate and the top housing.

[0041] In some embodiments, the one or more components comprise the server processor, a memory module, a hardware accelerator, a network interface controller, a plurality of network interface cards (NICs), a board management control (BMC), a synchronizer, an oscillator, and a plurality of network ports.

[0042] In some embodiments, the method comprises determining a number of the one or more heat pipes, a number of the one or more top heat pipes and a number of the one or more bottom heat pipes based on at least one of a total heat to be dissipated, a thermal capacity of the one or more heat pipes, and one or more spatial constraints of a layout of the CCDU.

[0043] In some embodiments, the method comprises determining a first temperature difference between the second cold plate and the one or more top heat sinks associated with the top housing, and a second temperature difference between the first cold plate and the one or more bottom heat sinks associated with the bottom housing. The method comprises initiating a heat flow to maintain an equilibrium thermal state between the server processor, the top housing and the bottom housing based on the determined first temperature difference and the second temperature difference.

[0044] In yet another exemplary embodiment, a method for performing passive cooling by dissipating heat in an environment is disclosed. The method comprises transferring the heat generated by one or more components integrated on a printed circuit board (PCB) assembly to a bottom housing and a top housing through one ormore thermal bridges. The method comprises dissipating, by the one or more thermal bridges, the heat to the environment.

[0045] In some embodiments, the one or more thermal bridges comprise a first thermal bridge formed between a first cold plate mounted on a server processor integrated on a first side of the PCB assembly and the bottom housing through one or more bottom heat pipes, and the second thermal bridge formed between a second cold plate coupled with a second side of the PCB assembly and the top housing through one or more top heat pipes.

[0046] In some embodiments, the method comprises determining a first temperature difference between the second plate server processor and the one or more top heat sinks associated with the top housing, and a second temperature difference between the first plate and the one or more bottom heat sinks associated with the bottom housing and initiating a heat flow to maintain an equilibrium thermal state between the server processor, the top housing and the bottom housing based on the determined first temperature difference and the second temperature difference.BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWING

[0047] The accompanying drawings, which are incorporated herein, and constitute a part of this disclosure, illustrate exemplary embodiments of the disclosed methods and systems in which like reference numerals refer to the same parts throughout the different drawings. Components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Some drawings may indicate the components using block diagrams and may not represent the internal circuitry of each component. It will be appreciated by those skilled in the art that disclosure of such drawings includes disclosure of electrical components, electronic components or circuitry commonly used to implement such components.

[0048] FIG. 1 illustrates an exemplary representation of an internal assembly of a combined centralized and distribution unit (CCDU), in accordance with an embodiment of the present disclosure.

[0049] FIG. 2A illustrates an exemplary component diagram of the CCDU, in accordance with an embodiment of the present disclosure.

[0050] FIG. 2B illustrates an exemplary front panel of the CCDU, in accordance with an embodiment of the present disclosure.

[0051] FIG. 3 A is an exemplary representation of a top view of a printed circuit board (PCB) assembly, in accordance with an embodiment of the present disclosure.

[0052] FIG. 3B is an exemplary representation of an isometric view of the PCB assembly, in accordance with an embodiment of the present disclosure.

[0053] FIG. 4A illustrates an exemplary layout diagram of a bottom housing with one or more heat pipes, in accordance with an embodiment of the present disclosure.

[0054] FIG. 4B illustrates an exemplary layout diagram of a top housing with the one or more heat pipes, in accordance with an embodiment of the present disclosure.

[0055] FIG. 5 illustrates an exemplary flow diagram of a method for assembling a combined centralized and distribution unit (CCDU), in accordance with an embodiment of the present disclosure.

[0056] FIG. 6 illustrates an exemplary flow diagram of a method for performing passive cooling by dissipating heat in an environment, in accordance with an embodiment of the present disclosure.

[0057] The foregoing shall be more apparent from the following more detailed description of the disclosure.LIST OF REFERENCE NUMERALS100 - Combined Centralized and Distribution Unit (CCDU)102 - Top Housing104 - Printed Circuit Board (PCB) Assembly 106 - Bottom Housing200A - Connection Diagram200B - Front Panel300A - Top View of PCB Assembly302-1 - First cold plate (or block) 302-2 - Second cold plate (or block)303 - Heat pipes304 - Memory modules300B - Isometric View of PCB assembly400A - Bottom Housing Heat Pipe Layout 402 - Heat pipes404 - Thermal Bridges406 - Heat sinks400B - Top Housing Heat Pipe Layout500 - Flow Diagram600 - Flow DiagramDETAILED DESCRIPTION

[0058] In the following description, for the purposes of explanation, various specific details are set forth in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent, however, that embodiments of the present disclosure may be practiced without these specific details. Several features described hereafter can each be used independently of one another or with any combination of other features. An individual feature may not address any of the problems discussed above or might address only some of the problems discussed above. Some of the problems discussed above might not be fully addressed by any of the features described herein. Example embodiments of the present disclosure are described below, as illustrated in various drawings in which like reference numerals refer to the same parts throughout the different drawings.

[0059] The ensuing description provides exemplary embodiments only, and is not intended to limit the scope, applicability, or configuration of the disclosure. Rather, the ensuing description of the exemplary embodiments will provide those skilled in the art with an enabling description for implementing an exemplary embodiment. It should be understood that various changes may be made in the function and arrangement of elements without departing from the spirit and scope of the disclosure as set forth.

[0060] Specific details are given in the following description to provide a thorough understanding of the embodiments. However, it will be understood by one of ordinary skill in the art that the embodiments may be practiced without these specific details. For example, circuits, systems, networks, processes, and other components may be shown as components in block diagram form in order not to obscure the embodiments in unnecessary detail. In other instances, well-known circuits, processes, algorithms,structures, and techniques may be shown without unnecessary detail in order to avoid obscuring the embodiments.

[0061] Also, it is noted that individual embodiments may be described as a process that is depicted as a flowchart, a flow diagram, a data flow diagram, a structure diagram, or a block diagram. Although a flowchart may describe the operations as a sequential process, many of the operations can be performed in parallel or concurrently. In addition, the order of the operations may be re-arranged. A process is terminated when its operations are completed but could have additional steps not included in a figure. A process may correspond to a method, a function, a procedure, a subroutine, a subprogram, etc. When a process corresponds to a function, its termination can correspond to a return of the function to the calling function or the main function.

[0062] The word “exemplary” and / or “demonstrative” is used herein to mean serving as an example, instance, or illustration. For the avoidance of doubt, the subject matter disclosed herein is not limited by such examples. In addition, any aspect or design described herein as “exemplary” and / or “demonstrative” is not necessarily to be construed as preferred or advantageous over other aspects or designs, nor is it meant to preclude equivalent exemplary structures and techniques known to those of ordinary skill in the art. Furthermore, to the extent that the terms “includes,” “has,” “contains,” and other similar words are used in either the detailed description or the claims, such terms are intended to be inclusive like the term “comprising” as an open transition word without precluding any additional or other elements.

[0063] Reference throughout this specification to “one embodiment” or “an embodiment” or “an instance” or “one instance” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore,the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0064] The terminology used herein is to describe particular embodiments only and is not intended to be limiting the disclosure. As used herein, the singular forms “a”, “an”, and “the” are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms “comprises” and / or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any combinations of one or more of the associated listed items. It should be noted that the terms “mobile device”, “user equipment”, “user device”, “communication device”, “device” and similar terms are used interchangeably for the purpose of describing the invention. These terms are not intended to limit the scope of the invention or imply any specific functionality or limitations on the described embodiments. The use of these terms is solely for convenience and clarity of description. The invention is not limited to any particular type of device or equipment, and it should be understood that other equivalent terms or variations thereof may be used interchangeably without departing from the scope of the invention as defined herein.

[0065] While considerable emphasis has been placed herein on the components and component parts of the preferred embodiments, it will be appreciated that many embodiments can be made and that many changes can be made in the preferred embodiments without departing from the principles of the disclosure. These and other changes in the preferred embodiment as well as other embodiments of the disclosure will be apparent to those skilled in the art from the disclosure herein, whereby it is to be distinctly understood that the foregoing descriptive matter is to be interpreted merely as illustrative of the disclosure and not as a limitation.

[0066] Combined Centralized and Distribution Unit (CCDU) represents a core component of a network architecture where data processing, storage, and control functions are centralized within a single unit or single location. The CCDU manages and processes large volumes of data (e.g., radio data, traffic, control signaling, resource management data, operational data, and processing data), controls network functions, and coordinates communication across different parts of the network parts. The CCDU is typically designed to handle high-performance computing, network management, and data traffic processing demands.

[0067] The CCDU plays a crucial role in modern communication systems, especially with emerging technologies like 5G, which are driven to centralize critical functions while enabling distributed access and processing capabilities. The CCDU consolidates both control functions and data processing tasks into a single physical or logical location.

[0068] CCDUs typically include numerous high-performance computing units, such as servers, routers, and switches. As the number of components increases, so does the heat density — the amount of heat generated per unit of space. Cooling systems in CCDUs are often energy-intensive. For example, air conditioning (AC) units, liquid cooling systems, and ventilation mechanisms consume significant amounts of energy to maintain acceptable operating temperatures, increasing operational costs and environmental impact. In high-density environments where servers are closely packed, airflow may not always reach every part of the system, forming thermal hotspot areas that experience higher temperatures than others.

[0069] Traditional CCDUs for 5G RAN applications commonly use cooling systems (e.g., fan-based cooling, heating ventilation and air conditioning (HVAC) units, liquid cooling, etc.). Over time, fans may accumulate dust, debris, or even moisture, which degrades the cooling efficiency of the fans. In addition, the cooling systems in the CCDUs, especially those relying on fans, generate significant noise inY1 the environment and are not suitable in noise-sensitive environments, environments requiring acoustic compliance, enclosed or shared working spaces, or high-density deployments. These cooling systems are prone to failures, allowing dust and moisture to damage sensitive electronic components. Such failures lead to increased maintenance needs, operational downtime, and reduced system reliability, especially in outdoor environments. Existing designs may also require additional air conditioning or outdoor cabinets, complicating installation and increasing costs in conditions such as environments that accelerate fan wear and require frequent component replacements, sites with limited access leading to higher operational effort, or deployments that demand recurring maintenance due to dust, temperature fluctuations, or regulatory compliance requirements.

[0070] In outdoor or semi-outdoor CCDUs (such as those used in 5G RAN infrastructure), cooling systems are vulnerable to environmental factors such as ambient temperature, dust, moisture, and extreme weather conditions. These external conditions can compromise the performance of fans, air conditioning systems, and liquid cooling solutions.

[0071] There is a need for a system and method to address the challenges of inefficiencies and heat dissipation in the CCDUs, while also focusing on self- sufficiency, lowest cost, and minimal maintenance for heat dissipation, as well as the least requirement for operations.

[0072] The present disclosure aims to overcome the above-mentioned and other existing problems in this field of technology by providing a combined centralized and distribution unit (CCDU). The CCDU integrates the functionalities of a Centralized Unit (CU) and a Distribution Unit (DU) into a single PCB, enclosed in a durable housing, ensuring optimal performance in outdoor environments. The combined centralized and distribution unit saves space and simplifies installation. By employing a passive cooling mechanism (e.g., heat pipes, cold plates, and heat sinks), the CCDU(also known as passive-cooled CCDU) eliminates the need for fans and reduces the risk of mechanical failure. Further, dust and moisture ingress are minimized, improving the durability of the CCDU. The CCDU may be configured to operate in a plurality of cells (e.g., nine cells). The passive-cooled CCDU is versatile and suitable for pole mounting, reducing installation complexity by removing the necessity for air conditioning or additional outdoor cabinets. The CCDU becomes robust and efficient for outdoor telecommunications infrastructure, enhancing reliability and minimizing maintenance needs in demanding conditions typical of 5G network installations.

[0073] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0074] FIG. 1 illustrates an exemplary representation of an internal assembly of a combined centralized and distribution unit (CCDU) (100), in accordance with an embodiment of the present disclosure.

[0075] The CCDU (100) is a passively cooled server unit that combines a centralized unit (CU) and a distribution unit (DU) in a single printed circuit board (PCB). In an aspect, the CCDU (100) may be used as a high-performance 5G radio access network (RAN) core. The CCDU (100) uses a passive cooling mechanism that eliminates the use of fans. The risk of mechanical failure is reduced by eliminating the need for fans. Further, dust and moisture ingress are minimized, improving system durability. The CCDU has fewer moving parts, lower maintenance requirements, and reduced downtime.

[0076] The CCDU (100) combines the centralized unit (CU) and the distribution unit (DU). The centralized Unit (CU) performs control, processing, or management functions at a single, central location. The distribution Unit (DU) performs processing, control, or data management functions that are spread across multiple locations or components. The CCDU (100) performs combined functionalities corresponding toboth the CU and the DU. In an aspect, a server processor (e.g., server processor 220, as shown in FIG. 2A) may be configured to perform the combined functionalities corresponding to both the CU and the DU.

[0077] In an aspect, the CCDU (100) provides the functionality of the CU and the DU in a single unit. The PCB assembly (104) is configured to integrate one or more components associated with the CU and the DU. The PCB assembly (104) comprises a plurality of components, not limited to a server processor, a network interface controller, a memory module, a board management controller (BMC), a plurality of network ports, a plurality of network interface cards (NICs), a synchronizer, an oscillator, and a hardware accelerator. The CCDU (100) may perform higher layer and lower layer processing (e.g., high physical layer (PHY), LI (first layer) layer, CU processing, DU processing) by using the server processor with the memory module (e.g., Registered Dual Inline Memory Module (RDIMMS). The CCDU (100) performs synchronization through a built-in synchronizer and highly accurate temperature controller. The CCDU (100) comprises the hardware accelerator (e.g., Soft Decision Forward Error Correction (SDFEC) hardware accelerator) for data error detection and correction. In an aspect, the CCDU (100) may use to handle 5G Virtualized Radio Access Networks (vRAN) workloads. The CCDU (100) increases the overall compute capacity.

[0078] The CCDU (100) may support a plurality of cells (e.g., nine cells) by using at least one network interface controller. The CCDU (100) comprises the plurality of network ports (e.g., 4x25G and 8x10G ports). The plurality of network ports is used for high-bandwidth applications and data transmission over Ethernet or other networking protocols. The BMC is used for general housekeeping and remote access to the server processor of the CCDU (100). The CCDU (100) may support applications (e.g., 5G Radio Access Network (RAN) deployments) and ensure compatibility with the latest telecommunications technology (e.g., 4G, 5G, 6G, Wi-Fi). In the CCDU(100), the plurality of components (e.g., processors, solid-state components, switches, circuit breakers, and power units) generate heat as the components handle the logic, monitoring, and protection tasks.

[0079] Referring to FIG. 1, the internal assembly (also referred to as an enclosure) of the CCDU (100) comprises a top housing (102), a printed circuit board (PCB) assembly (104), and a bottom housing (106).

[0080] The top housing (102) and bottom housing (106) function as a robust protective enclosure that safeguard internal components while enhancing the overall functionality of the CCDU (100). The top and bottom housings (102, 106) may be made of materials (such as aluminum, steel, and high-quality plastics), providing durability, thermal management properties, and resistance to physical and environmental factors. The top and bottom housings (102, 106) protect the CCDU (100) from the external environment, such as air, rain, dust, and moisture.

[0081] In an aspect, the top and bottom housings (102, 106) of the CCDU (100) feature fin-like structures on their outer surfaces, facing the environment. These fin- like structures assist with thermal management and heat dissipation by increasing the surface area of the housing, enabling more efficient heat transfer from the CCDU (100) to the surrounding air. As the CCDU (100) operates, internal components (e.g., processors, switches, fuses, and breakers) generate heat due to electrical resistance and operational loads. The fins, typically made of conductive materials such as aluminum or steel, help dissipate the generated heat by expanding the exposed surface area. This prevents overheating of the CCDU (100) components and ensures the unit stays within its operational temperature range. The fin-like structures are effective in natural convection cooling, where heat is transferred to the air without the need for forced cooling (e.g., fans). The larger the surface area of the fins, the more heat can be radiated away.

[0082] The top housing (102) and the bottom housing (106) allow easy removal or access to internal components for maintenance, upgrades, or troubleshooting, enhancing operational efficiency.

[0083] The CCDU (100) performs heat dissipation through one or more heat sinks, one or more cold plates, and a heat pipe layout comprising one or more heat pipes, eliminating the need for a conventional cooling system.

[0084] The CCDU (100) enhances thermal conduction by employing the dual cold plate / block configuration. One cold plate / block, i.e., a first cold plate (first cold plate 302-1 as shown in FIGs. 3A and 3B), is securely mounted on the server processor, which will contact / touch the bottom housing (106), and the other cold plate / block, i.e., a second cold plate (second cold plate 302-2 as shown in FIGs. 3A and 3B), is connected to the top housing (102). The CCDU (100) optimizes the contact area, effectively minimizing thermal spreading resistance. The arrangement of the cold plates ensures the efficient transfer of heat from the server processor to the top housing (102) and the bottom housing (106).

[0085] In an aspect, the first cold plate and the second cold plate are copper plates. The copper is selected due to thermal conductivity and a cost-to-performance ratio. Further, the cold plate may be made up of, but is not limited to, copper, aluminum, hybrid copper and aluminum, graphite sheet, ceramic, alloy, or liquid-based (water) coolant.

[0086] In an aspect, aluminum may be used as an economical alternative. However, alumina has inferior thermal conductivity, which increases spreading resistance, ultimately compromising thermal efficiency. In an aspect, the hybrid cold plate combines copper and aluminum layers or sections to exploit the advantages of both materials. For example, copper is used at the heat interface for superior heat transfer, while aluminum forms the structural body to reduce weight and cost. Thiscombination ensures optimized thermal performance with lower mass. In an aspect, the graphite sheets are used due to their excellent in-plane thermal conductivity and lightweight, flexible nature. The graphite sheets spread heat rapidly over large surfaces, making them ideal for thin or compact designs. In an aspect, the ceramic materials (for example, aluminum nitride or silicon carbide) are electrically insulating yet thermally conductive. The ceramic materials are used where electrical isolation and heat dissipation must coexist. Ceramics also offer excellent corrosion resistance and stability at high temperatures. In an aspect, thermally conductive alloys, for example, copper-tungsten or aluminum-silicon carbide composites, offer tailored properties that balance strength, weight, and heat transfer capabilities. Thermally conductive materials are used when specific mechanical or thermal expansion characteristics are required to match those of other components in the assembly. In an aspect, the liquid-based cold plate incorporates internal channels through which a coolant fluid (e.g., water or glycol-water mixture) circulates. The liquid absorbs heat from the plate and carries it away to the heat sinks or heat pipes. The liquid-based cold plate achieves superior cooling performance in high-heat-flux or continuous-operation environments.

[0087] In another aspect, the cooling of the server processor and the memory modules is performed using the cold plate mechanism. The cold plate, for example, aluminum plate, is placed across the memory modules in the cold plate mechanism. The aluminum plate is connected to the one or more heat pipes of the bottom housing to distribute the heat in fins of the bottom housing.

[0088] The top housing (102), the PCB assembly (104), and the bottom housing (106) comprise one or more heat pipes in a heat pipe layout. The heat pipes are accurately arranged to facilitate seamless heat transfer, ensuring optimal cooling performance. With versatile installation, the CCDU (100) may be mounted on poles (e.g., utility poles, street poles, or similar vertical structures) without air conditioning or additional outdoor cabinets, simplifying deployment and reducing installation costs.The pole mounting of the CCDU helps to save space in areas with limited ground space in outdoor environments.

[0089] The heat pipe layout may comprise the one or more heat pipes. In an aspect, one or more heat pipes are configured to dissipate heat generated by the CU and DU integrated on the PCB assembly by forming one or more thermal bridges (i.e., thermal bridges 404-1, 404-2). In an aspect, the thermal bridge refers to a conductive pathway or material interface designed to transfer heat from the CU and the DU integrated on the PCB, thereby effectively dispersing the heat. The thermal bridge acts as a heat highway, allowing heat to dissipate from the heat-generating components and preventing overheating.

[0090] In an aspect, the one or more thermal bridges comprise at least one of a first thermal bridge between the first cold plate and the bottom housing, and a second thermal bridge between the second cold plate and the top housing. The one or more heat pipes (i.e., top heat pipes 402-5, 402-6, 402-7, 402-8, as shown in FIG. 4B) are interconnected to create one thermal bridge (i.e., second thermal bridge 404-2) between the server processor and the top housing (102) (i.e., the second cold plate and the top housing). The one or more heat pipes (i.e., heat pipes (402-1, 402-2, 402-3, 402-4) as shown in FIG. 4A) Another thermal bridge (i.e., first thermal bridge 404-1) between the server processor and the bottom housing (106).

[0091] In an aspect, a number of the one or more heat pipes, a number of the one or more top heat pipes and a number of the one or more bottom heat pipes are determined based on at least one of a total heat to be dissipated, a thermal capacity of the one or more heat pipes, and one or more spatial constraints of a layout of the CCDU.

[0092] In an aspect, the number of the one or more heat pipes is determined based on physical characteristics of the heat pipe. The physical characteristics of the heat pipe may comprise, but are not limited to, diameter, length of heat pipe, material of heatpipe, radius, angles, number of turns, thickness of heat pipe, heat transport capacity, wick structure, geometry, thermal conductivity and working fluid characteristics. In an aspect, the diameter refers to external circular width of the heat pipe, which influences the vapor flow area and overall heat-carrying capacity. For example, a heat pipe with a 6 mm diameter may carry significantly less heat than a 10 mm diameter pipe due to reduced vapor cross-section. In an aspect, the linear distance between the evaporator and condenser sections of the heat pipe, affecting thermal resistance and heat transfer efficiency. For example, a 200 mm long heat pipe exhibits greater thermal resistance than a 120 mm pipe. In an aspect, the material of the heat pipe refers to a base material (e.g., copper, aluminum) from which the pipe body is constructed, determining thermal conductivity and structural strength. In one aspect, the radius of the heat pipe refers to the curvature radius of any bend in the heat pipe, which influences vapor flow restriction and capillary performance. For example, a heat pipe bent with a small radius (tight bend) may reduce vapor flow and lower heat transfer efficiency compared to a pipe with a large bend radius. In an aspect, the angle of the heat pipe refers to specific angular bends or transitions formed along the heat pipe that alter vapor flow direction and thermal resistance. For example, a heat pipe bent at 90° may require additional units to compensate for the increased resistance at the bend compared to a straight heat pipe. In an aspect, the number of turns refers to the number of directional changes or bends incorporated into the heat pipe geometry. For example, a heat pipe with two bends typically experiences higher flow resistance than a straight pipe, reducing heat transport capacity. In an aspect, the thickness of the heat pipe refers to the wall thickness impacts mechanical strength, internal volume, and conduction resistance. For example, a wall thickness of 0.5 mm provides better heat conduction than a 1.2 mm thickness due to reduced conduction path length. In an aspect, the heat transport capacity refers to the maximum amount of heat the heat pipe can transfer before reaching capillary, boiling, or sonic limit. For example, if each heat pipe supports 20 W and the system requires 60 W dissipation, at least three heat pipes are required. Inan aspect, the wick structure refers to an internal capillary structure (sintered, mesh, grooved) that returns condensed fluid to the evaporator. For example, a sintered wick maintains higher capillary pressure and supports orientation-independent operation better than a grooved wick. In an aspect, the geometry refers to the physical form of the heat pipe, round, flat, vapor chamber, or custom geometry, affecting surface contact and heat spreading. For example, a flat heat pipe offers superior heat spreading for compact electronics compared to a cylindrical heat pipe. In an aspect, the thermal conductivity refers to the measure of how effectively the heat pipe material conducts heat from one point to another. For example, a copper pipe with a conductivity of -400 W / m K dissipates heat much faster than stainless steel, which has a conductivity of -15 W / m K. In an aspect, the working fluid characteristics of the heat pipe refer to properties of the internal fluid (boiling point, vapor pressure, temperature range) that determine the operating temperature window and efficiency.

[0093] In an aspect, the total heat to be dissipated refers to aggregate thermal energy generated by one or more heat-producing components of the CCDU during operation, which is required to be transferred away from the components to maintain the operating temperature. In an aspect, the thermal capacity of the one or more heat pipes refers to the collective ability of the heat pipes to absorb, transfer, and release heat energy during operation. The thermal capacity of the one or more heat pipes may be determined by factors, for example, but not limited to, the working fluid characteristics, internal vapor volume, wick structure, material thermal conductivity, and overall geometry of the heat pipes. In an aspect, the one or more spatial constraints of the layout refer to the positional, dimensional, or geometric limitations that define or restrict the placement, orientation, or spacing of components within the layout. The one or more spatial constraints may include, but not limited to, physical boundaries, component dimensions, alignment tolerances, separation distances, or structural interference considerations that influence the overall configuration of the layout. By selecting and determining the number and arrangement of heat pipes in accordancewith parameters such as the total heat to be dissipated, the thermal capacity of the one or more heat pipes, the spatial constraints of the layout of the CCDU (100), and the cost-effectiveness of the heat pipe configuration, the thermal design ensures efficient heat transfer while accommodating the mechanical and geometric limitations of the enclosure. By adjusting the number and placement of the heat pipes according to these factors, the thermal performance of the CCDU (100) is optimized to achieve effective and reliable heat dissipation.

[0094] In one aspect, the one or more heat pipes function as essential thermal conductors, enabling efficient heat transfer from the server processor to one or more heat sinks in the top housing. The heat is uniformly distributed across the surface area of the CCDU (100). The heat pipes between the server processor and the bottom housing continuously dissipate heat until a temperature difference between the server processor, the top housing (102), and the bottom housing (106) is equalized. A natural convective heat flow is initiated until the CCDU (100) eventually reaches equilibrium. As the thermal gradient stabilizes, a consistent heat transfer rate is established between the server processor, the top housing (102), and the bottom housing (106).

[0095] In an aspect, the heat pipes between the server processor and the bottom housing (106) continuously dissipate heat using a convection principle to cool the server processor. In this way, the server processor is cooled by passive cooling (i.e., using heat pipes). The heat pipes are used in passive cooling to automatically and continuously dissipate heat from the top housing (102) and the bottom housing (106), thereby cooling the server processor.

[0096] In an aspect, each of the top and bottom housings (102, 106) comprises one or more heat sinks. The heat sinks of the top and bottom housings (102, 106) harmonize the complexities of heat transfer dynamics, material properties, and spatial considerations. This ensures effective server processor thermal management whileoptimizing cost and performance. With environmental protection against harsh weather conditions, the CCDU (100) is suitable for outdoor applications.

[0097] In an aspect, the top housing (102) of the CCDU (100) comprises one or more top heat sinks (i.e., heat sink 406-2 as shown in FIG. 4B) and one or more top heat pipes (402-5, 402-6, 402-7, 402-8, as shown in FIG. 4B). The bottom housing (106) of the CCDU (100) comprises one or more bottom heat sinks (i.e., heat sink 406- 1 as shown in FIG. 4 A) and one or more bottom heat pipes (402-1, 402-2, 402-3, 402- 4, as shown in FIG. 4A).

[0098] In an aspect, the heat sink refers to a passive heat exchanger that transfers heat from heat-generating components (e.g., server processor) to a fluid medium (e.g., air or liquid). The heat sink is used to dissipate heat and reduce the temperature of the components of the CCDU (100). The heatsink prevents thermal stress and component degradation by maintaining the lower temperature. The heatsink works on the principle of thermal conduction and thermal convection. In the thermal conduction, the heat flows from the heat-generating components (e.g., server processor) to the heatsink. In the thermal convection, the heat is then transferred to the surrounding air in the environment. In an operative aspect, the heat generated from the heat-generating components (e.g., server processor) to the cold plates and the heat pipes and to the heat sinks (e.g., heat sinks 406-1, 406-2). Then, the heat sinks dissipate the heat to the environment.

[0099] In an aspect, the CCDU (100) may function as a thermal management system, monitoring critical temperature differentials within the enclosure. The CCDU (100) is configured to determine the temperature difference between the top housing (102) and the bottom housing (106). The CCDU then initiates a heat flow based on the determined temperature difference. In an aspect, the temperature difference between the server processor, the top housing (102), and the bottom housing (106) (top heatsink, bottom sink) may be determined by the server processor or any external units (e.g., temperature sensing units).

[0100] In an operative aspect, the CCDU (100) is configured to determine a first temperature difference and a second temperature difference.

[0101] The first temperature difference is determined between the second cold plate and the one or more top heat sinks associated with the top housing. The first temperature difference measurement provides insight into the thermal gradient driving heat transfer from the processor area towards the top housing of the CCDU (100).

[0102] The second temperature difference is determined between the first cold plate and the one or more bottom heat sinks associated with the bottom housing. The second temperature difference measurement may be used to quantify the thermal gradient across the bottom housing of the CCDU (100), allowing the CCDU (100) to assess whether heat removal is occurring effectively from the processor towards the bottom housing of the enclosure of the CCDU (100).

[0103] Based on the determined first temperature difference and the second temperature difference, the CCDU (100) is configured to initiate the heat flow to maintain an equilibrium thermal state between the server processor, the top housing and the bottom housing. By continuously evaluating both temperature differences (i.e., first temperature difference and second temperature difference), the CCDU (100) is enabled to make dynamic decisions regarding the direction and amount of heat flow required. The CCDU (100) detects disparities in temperature gradients to identify any potential thermal imbalance. Upon detecting the disparities, the CCDU (100) initiates or adjusts active heat transfer mechanisms. This may involve modulating the operation of cooling components, such as heat sinks, heat pipes, and cold plates, that are integral to the CCDU’s thermal regulation infrastructure.

[0104] The CCDU (100) is configured to maintain the equilibrium thermal state, i.e., the CCDU (100) strives for a condition where the server processor, top housing, and bottom housing are thermally balanced, preventing hotspots or zones of excessive cooling. The equilibrium thermal state refers to a state in which the rate of heat generation from the server processor is substantially equal to the rate of heat dissipation through the thermal pathways, i.e., the cold plates, heat pipes, and heat sinks, such that no region of the CCDU (100) experiences excessive thermal buildup or localized overheating. By continuously monitoring the temperature differences (i.e., first and second temperature differences), the CCDU (100) evaluates whether the heat transfer across thermal paths of the top housing and bottom housing is balanced. When an imbalance is detected, for example, a higher temperature gradient on one side, the CCDU (100) initiates or adjusts heat flow control operations, for example, by regulating coolant flow, redistributing thermal load, or activating additional heat conduction through specific heat pipes. This dynamic regulation allows the CCDU (100) to maintain the equilibrium thermal state. The temperature distribution across the server processor, top housing, and bottom housing remains uniform or within a defined tolerance range. Maintaining the equilibrium thermal state ensures stable operating temperatures, prevents thermal stress and component degradation, and thereby enhances overall system reliability and cooling efficiency.

[0105] By achieving and sustaining this equilibrium, the CCDU (100) ensures optimal processor performance, reliability, and longevity, safeguarding the system against thermal-related failures or inefficiencies while maximizing cooling effectiveness.

[0106] FIG. 2A illustrates an exemplary component diagram (200 A) of the CCDU (100), in accordance with an embodiment of the present disclosure.

[0107] The CCDU (100) comprises an integrated circuit (202), one or more ethernet adapters (a first ethernet adapter (208), a second ethernet adapter (235)), a global positioning system (GPS) module (217), a clock synchronizer (216), a serverprocessor (220), a peripheral controller hub (223), an ethernet controller (231), a board management controller (BMC) (229), an interfacing module (250), a direct current (DC) - DC conversion block (248), one or more ethernet ports (240, 241) and one or more transceiver modules (e.g., Quad Small Form-factor Pluggable (QSFPs)) (209-1, 209-2, 256).

[0108] The integrated circuit (202) is an application-specific integrated circuit (ASIC) used to process control signals or offload specific tasks from the server processor (220), ensuring more efficient operation of the CCDU (100). The integrated circuit (202) performs various operations, such as high-speed data processing, network management, encryption, or protocol handling with optimized performance and power efficiency.

[0109] The integrated circuit (202) includes a power module (206) and a Peripheral Component Interconnect Express (PCIe) (207). The power module (206) ensures that the integrated circuit (202) receives the correct and stable voltage. The PCIe (207) is a high-speed serial bus interface that connects peripheral devices (e.g., network cards, storage devices, graphics cards, sound cards, and other expansion cards) to the server processor. The PCIe (207) is used to connect the integrated circuit (202) to the server processor. The integrated circuit (202) has a connection to a plurality of memory modules (201) with error correction. The integrated circuit (202) has connections to a read-only memory (ROM) (203), a temperature sensor (204), and a sequencer (205) through a serial communication protocol (e.g., an inter-integrated circuit (I2C)). In an aspect, the temperature sensor (204) is configured to measure the temperature of the CCDU (100). The temperature sensor (204) may include thermocouples, thermistors, etc. In an aspect, the I2C is a communication protocol used for connecting low-speed devices like sensors, microcontrollers, and peripherals. In an aspect, the sequencer (205) refers to a component used to control the sequence of operations or data acquisition.

[0110] The clock synchronizer (216) synchronizes clocks for data transfer, signal processing, and system coordination. The clock synchronizer (216) has three inputs such as a crystal oscillator (XO) (219), an Oven-Controlled Crystal Oscillator (OCXO) (218), and the GPS module (217). The crystal oscillator (XO) (219) is used to connect an external crystal oscillator to the clock synchronizer (216) and provide a stable reference clock for synchronization. The OCXO (218) is a type of crystal oscillator designed to maintain a stable frequency over a wide range of environmental conditions (e.g., temperature variations). The GPS module (217) provides a Pulse Per Second (PPS) signal to the clock synchronizer (216). The PPS signal is used as a timing reference to synchronize clocks in the CCDU (100). The PPS signal provides a highly accurate, stable time pulse that can synchronize the CCDU's internal clock with GPS time. The PPS signal is utilized in systems that require precise time synchronization or clock discipline, such as telecommunication networks, data centers, and satellite communication systems.

[0111] The first ethernet adapter (208) is a hardware device that enables network devices to connect to a wired Ethernet network (LAN or local area network) for data transmission. The first ethernet adapter (208) provides a physical interface for sending and receiving data over an ethernet cable. The first ethernet adapter (208) has a plurality of media access controls (MACs) (MAC0-MAC7) (211), a PCIe (212), a Precision Time Protocol (PTP) master (213), a clock (214), a PTP slave (215). The plurality of MACs has MAC addresses. The MAC address is a unique identifier assigned to a network interface card (NIC) for use in a Local Area Network (LAN). The MAC address is used for communication within the same local network and allows devices to identify each other. In an aspect, the plurality of MACs (211) is connected to the QSLPs (209-1, 209-2). The MAC0, MAC1, MAC2, and MAC3 are connected to the QSLP (209-1) and the MAC4, MAC5, MAC6, and MAC7 are connected to the QSLP (209-2). In an aspect, the QSLP is a transceiver used for high-speed data transmission.The QSFP is used in data centers for high-speed interconnects between servers and switches.

[0112] The PCIe (212) of the first ethernet adapter (208) is used to connect the first ethernet adapter (208) to the server processor (220).

[0113] The PTP master (213) is used to synchronize the clock for components (e.g., integrating circuit (250), server processor (220), ethernet adapters (208, 235), peripheral controller hub (223)) of the CCDU (100). The PTP master (213) receives 1- pulse per second (PPS) from the clock synchronizer (216).

[0114] The clock of the first ethernet adapter (208) receives a frequency signal (e.g., 156.25 MHz) from the clock synchronizer (216). The clock synchronizes an internal clock of the first ethernet adapter (208).

[0115] The PTP Slave (215) receives the time synchronization signals from the PTP Master (213) and adjusts its own clock to match the time provided by the PTP Master (213). The PTP slave (215) of the first ethernet adapter (208) synchronizes the clock with the PTP master clock to ensure precise time synchronization across the CCDU (100). The PTP slave (215) sends a recovered PPS signal to the clock synchronizer (216). Upon receiving the PPS signal from the PTP slave (215), the clock synchronizer (216) synchronizes own internal clock or oscillator (e.g., OCXO, XO) to match the PPS signal.

[0116] The clock synchronizer provides an output signal (e.g., system clocks). The output signal (e.g., system clocks) is used to synchronize components of the CCDU (100) that require a continuous clock reference. The clock synchronizer (216) also receives a recovered clock signal from the interfacing module (250). In an aspect, the recovered clock signal refers to a timing signal (clock) that extracts or regenerates to align with the timing of an incoming signal (e.g., an incoming data stream).

[0117] In an aspect, the server processor (220) is a high-performance processor designed for server and data center applications. The server processor (220) supports higher bandwidth, parallel processing capabilities for multi-threaded applications, higher data transfer, and higher data and hardware security. The server processor (220) comprises a plurality of channels (221) used for connections to the memory channel connectors (222). The server processor (220) has PCXes for connections with the integration circuit (202), the first and second ethernet adapters (208, 235), and the peripheral controller hub (223). The server processor (220) has a direct media interface (DMI) for connection with the peripheral controller hub (223). The DMI is used for high-speed data transfer to the peripheral controller hub (223). In an aspect, the server processor (220) is configured to handle functions of the CU and the DU of the CCDU (100). The server processor (220) may also be referred to as the CU and the DU of the CCDU.

[0118] In an aspect, the server processor (220) has a connection with a programmable logic device (PLD) (224) to handle LED status indicators (239) for monitoring and control of the CCDU (100). The PLD (224) manages the LED status indicators (239) by receiving control signals from the server processor (220). The server processor (220) communicates status, health, or error conditions to the PLD (224), which then visually drives the corresponding LEDs (239) to represent the current state of the server processor (220). The LED status indicators (239) ensure that server administrators can easily monitor the health of the server processor, troubleshoot issues, and identify hardware status quickly.

[0119] The peripheral controller hub (223) serves as an interface between the server processor (220) and a plurality of peripherals and I / O devices. The plurality of peripheral and I / O devices comprises one or more solid state drives (SSDs) (225, 226), one or more universal serial buses (USBs) (227, 228), the BMC (229), and a serial peripheral interface (SPI) basic input / output system (BIOS) (234).

[0120] The peripheral controller hub (223) has connections to the SSDs (225, 226) through Serial Advanced Technology Attachment (SATA) and PCIe. The SATA is a serial communication interface, which means it transmits data one bit at a time.

[0121] The peripheral controller hub (223) receives the clock signals from the clock synchronizer (216) to synchronize its own clock.

[0122] The peripheral controller hub (223) has connections to a Trusted Platform Module (TPM) header (232), a BIOS header (235), a TPM (233), and the SPI BIOS (234). The TPM (233) is a hardware-based security component designed to provide strong security to components of the CCDU (100). The TPM (233) secures hardware components by integrating cryptographic keys and performing security-related operations, such as data encryption, identity verification, and platform integrity checks. The TPM Header (232) is a part of the communication protocol used between the TPM and an operating system or software application. The TPM header (232) is a standardized structure used in TPM messages, allowing different components of the CCDU (100) to communicate securely with the TPM (233). The TPM header contains essential information about the transmitted message, including its size, type, and other key parameters needed to process and interpret the data properly.

[0123] In an aspect, the BIOS header (235) contains critical metadata and control information about the SPI BIOS (234). The BIOS header (235) provides details that allow the CCDU (100) to properly identify, load, and initialize the SPI BIOS (234) during the boot process. The SPI BIOS (234) plays a key role in the CCDU's ability to detect and interact with the firmware, ensuring that the correct firmware version is loaded and executed.

[0124] In an aspect, the SPI is a high-speed, serial communication protocol used for data transfer between devices, such as the server processor (220) and the memory that stores the BIOS. The SPI BIOS (234) refers to the BIOS utilizing the SPI protocolfor communication between the memory and the server processor via a SPI bus. In an aspect, the SPI bus is a synchronous, serial communication protocol used for shortdistance communication between components of the CCDU (100).

[0125] The peripheral controller hub (223) is connected to the ethernet (240) via an ethernet interface card (230). The ethernet interface card (230) has an ethemet port to connect the peripheral controller hub (223) to the ethernet (240).

[0126] The peripheral controller hub (223) has a connection to the BMC (229) through a USB, a PCIe, and a low pin count (LPC) bus. In an aspect, the LPC bus is a serial communication interface used to connect low-speed peripherals. The LPC bus connects the BMC (229) to the peripheral controller hub for management tasks. In an aspect, the BMC (229) is a microcontroller embedded in servers that manages the health of servers and provides out-of-band management capabilities. The BMC (229) allows system administrators to monitor and manage the servers even when the operating system is not running, such as during system boot, hardware failures, or operating system (OS) crashes.

[0127] In an aspect, the BMC (229) is connected to the ethemet controller (231) through a Reduced Media Independent Interface (RMI) / a Media Independent Interface (Mil). The RMI / MII are interface standards used for connecting network interfaces (e.g., Ethemet) to the MAC layer in the CCDU (100). The ethernet controller (231) has an ethernet port to connect the BMC (229) to the ethernet (241).

[0128] In an aspect, the BMC (229) has connections to a memory module (242), a SPI flash (243), a plurality of fans (e.g., 4 fans) (244), a reduced Gigabit Media Independent Interface (RGMII) (245), and General-Purpose Inputs / Outputs (GPIOs) (246). In one aspect, the SPI flash (243) is a type of flash memory that retains data even when power is removed. The SPI flash (243) stores firmware, boot loaders, and configuration data. In an aspect, the RGMII (245) is a high-speed interface standardused to connect a Gigabit Ethernet MAC (Media Access Control) to a PHY (Physical Layer) in systems. The RGMII (245) supports 1 Gbps Ethernet speeds while using a reduced number of signal lines. In an aspect, the GPIOs (246) refer to pins on programmable hardware (e.g., microcontroller, microprocessor) that can be configured as either input or output for a wide range of functions. The GPIOs pins are flexible and can be used for various purposes, such as reading data from external devices, controlling other components (e.g., peripherals, sensors, actuators), or providing signal control.

[0129] In an aspect, the second ethernet adapter (235) comprises a plurality of media access controls (MACO, MAC1, MAC2, MAC3) (237), a PCIe (236), a PTP master (238). The PCIe (236) connects the second ethernet adapter (235) to the server processor (220). The plurality of MACs (237) is connected to a plurality of LINE inputs (e.g., LINE INO, LINE INI, LINE IN2, LINE IN3) (251) of the interfacing module(250).

[0130] In an aspect, the interfacing module (250) has a plurality of LINE inputs(251) and a plurality of LINE outputs (e.g., LINE OUTO, LINE OUT1, LINE OUT2, LINE OUT3) (252). The plurality of LINE outputs (252) of the interfacing module (250) is connected to the QSFP (256). The interfacing module (250) has a clock input and a clock output. The clock input receives the clock signals from the clock synchronizer (216). The interfacing module (250) sends recovered clock signals to the clock synchronizer (216) through the clock output.

[0131] In an aspect, the CCDU (100) has a power input (247) (e.g., 48V DC). The power input (247) is connected to the DC-DC conversion block (248). The DC-DC conversion block (248) converts 48V to 12V. The 12V output of the DC-DC conversion block (248) is provided to a plurality of switchers (249-1, 249-2. 249-3). The switcher (249-1) provides 5V and 3.3V to the ethernet section. The switcher (249- 2) provides 5 and 3.3V to the SDFEC section. The switcher (249-3) provides 5V and3.3V to the server processor section. In an aspect, the switcher (249) regulates the output voltage according to the desired input and output parameters. The switcher (249) functions as a power conversion circuit, adjusting the output voltage.

[0132] In an aspect, the SDFEC detects and corrects errors that may occur due to noise, signal degradation, or interference during data transmission without needing retransmission, which is useful in real-time or high-latency systems. The SDFEC improves the reliability and integrity of data transmitted over serial communication channels.

[0133] The QSEP (256) may send the LINE outputs (e g., LINE OUTO, LINE OUT1, LINE OUT2, LINE OUT3) (252) to optical links interfacing with the radio unit. This enables serialized fronthaul data delivery from the server processor to the radio unit.

[0134] FIG. 2B illustrates an exemplary front panel (200B) of the CCDU (100), in accordance with an embodiment of the present disclosure.

[0135] As shown in FIG. 2B, the front panel (200B) shows the placement of components of the CCDU (100). The front panel (200B) shows the placement of the power input (e.g., 48 V DC IN) (247), the status LEDs (239), the PPS test signal (254), a debug console (255), the BMC (229), the network ports (210, 253), and the GPS radio frequency (RF) input (IN) (217).

[0136] In an aspect, the debug console (255) is a tool or interface used to diagnose issues, monitor operations, and interact with running applications or systems during software development and system administration.

[0137] In an aspect, the GPS RF IN (217) refers to the Radio Frequency (RF) input signal for a GPS receiver. The RF input receives the raw signal from the GPS modulevia an antenna. The GPS RF IN signal is electromagnetic waves at specific frequencies and contains the necessary data to calculate the receiver's position.

[0138] FIG. 3 A is an exemplary representation of a top view (300A) of the PCB assembly (104), in accordance with an embodiment of the present disclosure.

[0139] Referring to the FIG. 3 A, the PCB assembly (104) comprises the dual cold plate configuration (302-1, 302-2), a plurality of memory modules (304), and the one or more heat pipes (303).

[0140] In an aspect, the PCB is a flat board made of insulating material that supports and connects electronic components using conductive pathways. The conductive pathways are etched from copper sheets laminated onto a non-conductive substrate. The PCB is essential in almost all electronic devices, providing mechanical support and electrical connections for components like resistors, capacitors, and microcontrollers. Depending on the complexity of the circuit, the PCB comes in various designs, including single-sided, double-sided, and multi-layer configurations.

[0141] In an aspect, copper is selected for the plates / blocks due to thermal conductivity and a cost-to-performance ratio. Further, alumina may be used as an economical alternative. However, alumina has inferior thermal conductivity, which increases spreading resistance, ultimately compromising thermal efficiency.

[0142] In an operative aspect, the dual cold plate configuration may comprise a first cold plate (302-1) and a second cold plate (302-2). The first cold plate / block (302- 1) is securely mounted on the server processor (220), which touches the bottom housing (106). The second cold plate / block (302-2) is connected to one side of the PCB assembly and touches the top housing (102). The server processor (220) heat is transferred to the first cold plate / block (302-1). The one or more heat pipes (e.g., two heat pipes) (303) is connected to the second cold plate / block (302-2). The heat of the server processor is transferred to the second cold plate / block through the heat pipes(303). The server processor heat is transferred to the top housing (102) through the second cold plate / block (302-2) and the heat pipes (303).

[0143] In an aspect, the plurality of memory modules (304) may be random access memories (RAMs). The RAM is a type of memory used to store data used by the components of the CCDU (100).

[0144] In another aspect, the cooling of the server processor (220) and the memory modules (304) is performed using a cold plate mechanism. In the cold plate mechanism, an aluminum plate is placed across the memory modules (304). The aluminum plate is connected to the one or more heat pipes (303) of the bottom housing (106) to distribute the heat in fins of the bottom housing (106).

[0145] FIG. 3B is an exemplary representation of an isometric view (300B) of the PCB assembly, in accordance with an embodiment of the present disclosure.

[0146] As shown in FIG. 3B, the PCB assembly (104) comprises the first cold plate (302-1) and the second cold plate (302-2). The first cold plate / block (302-1) is securely mounted on the server processor (220), which touches the bottom housing (106). The second cold plate / block (302-2) is connected to one side of the PCB assembly (104) and touches the top housing (102).

[0147] FIG. 4A illustrates an exemplary layout diagram (400A) of the bottom housing (106) with the one or more heat pipes (402-1, 402-2, 402-3, 402-4), in accordance with an embodiment of the present disclosure.

[0148] As shown in FIG. 4 A, the bottom housing (106) comprises the one or more heat pipes (e.g., heat pipe (402-1), heat pipe (402-2), heat pipe (402-3), heat pipe (402- 4)). The server processor heat is transferred to the bottom housing (106) through the heat pipes (i.e., heat pipe (402-1), heat pipe (402-2), heat pipe (402-3), heat pipe (402- 4))-

[0149] In an aspect, the appropriate number of heat pipes is determined by factors such as total heat load to be dissipated, thermal capacity of the one or more heat pipes, spatial constraints within a layout of the CCDU, and the cost-effectiveness of the heat pipes. By adjusting the number of heat pipes, thermal performance of the CCDU (100) is achieved for the factors.

[0150] In an aspect, the one or more heat pipes function as essential thermal conductors, enabling efficient heat movement from the server processor to one or more heat sinks of the top housing. The heat is uniformly distributed across the surface area of the top housing. The heat pipes between the server processor and the bottom housing continuously dissipate heat until the temperature difference between the server processor, top housing, and bottom housing is equalized. A natural convective heat flow is initiated until the CCDU (100) eventually reaches an equilibrium state. As the thermal gradient stabilizes, a consistent heat transfer rate is established between the server processor (220), the top housing (102), and the bottom housing (106).

[0151] In an aspect, the one or more heat pipes (402-1, 402-2, 402-3, 402-4) of the bottom housing are arranged in the heat pipe layout (e.g., bending and tilting of the heat pipes in the bottom housing) to increase the surface area of the bottom housing, ensuring that heat is uniformly distributed across the bottom housing.

[0152] FIG. 4B illustrates an exemplary layout diagram (400B) of the top housing (102) with the one or more heat pipes (402-5, 402-6, 402-7, 402-8), in accordance with an embodiment of the present disclosure.

[0153] As shown in FIG. 4B, the top housing (102) comprises the one or more heat pipes (402-5, 402-6, 402-7, 402-8) on its bottom surface. The one or more heat pipes (402-5, 402-6, 402-7, 402-8) are interconnected to create a bridge between the server processor (220) and the top housing (102). The server processor heat is transferred to the top housing (102) through the one or more heat pipes (402-5, 402-6, 402-6, 402-8).

[0154] In an aspect, the one or more heat pipes (402-5, 402-6, 402-6, 402-8) of the top housing (102) is arranged in the heat pipe layout (e.g., arranging the heat pipes in tilting format) to increase the surface area of the top housing (102), ensuring that heat is uniformly distributed across the top housing (102).

[0155] FIG. 5 illustrates an exemplary flow diagram (500) of a method for assembling the combined centralized and distribution unit (CCDU), in accordance with an embodiment of the present disclosure.

[0156] At step (502), the method (500) comprises integrating one or more components associated with the centralized unit (CU) and the distribution unit (DU) on the printed circuit board (PCB) assembly. In an aspect, the one or more components comprise the server processor, the memory module, the hardware accelerator, the network interface controller, the plurality of network interface cards (NICs), the board management control (BMC), the synchronizer, the oscillator, and the plurality of network ports. In an aspect, an enclosure is configured to enclose the top housing, the bottom housing and the PCB assembly.

[0157] At step (504), the method (500) comprises mounting a first cold plate on a server processor integrated on a first side of the PCB assembly. The first cold plate is configured to contact the bottom housing. In an aspect, the first cold plate is mounted on the server processor integrated on the first side of the PCB assembly.

[0158] At step (506), the method (500) comprises coupling a second cold plate to a second side of the PCB assembly. The second cold plate is configured to contact the top housing. In an aspect, the second cold plate is coupled to the second side of the PCB assembly. In an aspect, the first cold plate and the second cold plate are copper plates. In an operative aspect, the cold plates are made of copper. Furthermore, the cold plates may be made of, but not limited to, aluminum, a hybrid of copper and aluminum, graphite sheet, ceramic, alloy, or a liquid-based coolant (such as water).

[0159] The CCDU (100) enhances thermal conduction by employing the dual cold plate / block configuration, i.e., the first cold plate (302-1) and the second cold plate (302-2). The CCDU (100) optimizes the contact area, effectively minimizing thermal spreading resistance. The first and second cold plates ensure the efficient transfer of heat from the server processor to the top housing (102) and the bottom housing (106).

[0160] At step (508), the method (500) comprises dissipating heat generated by the CU and the DU integrated on the PCB assembly (104) by forming one or more thermal bridges. In one aspect, the thermal bridge provides a conductive pathway or material interface to transfer heat from the CU and the DU integrated on the PCB, thereby effectively dispersing the heat. The thermal bridge acts as a heat highway, allowing heat to dissipate from the heat-generating components and preventing overheating.

[0161] In an aspect, the one or more thermal bridges comprise a first thermal bridge between the first cold plate and the bottom housing and a second thermal bridge between the second cold plate and the top housing. The first thermal bridge is formed between the first cold plate and the bottom housing. The second thermal bridge is formed between the second cold plate and the top housing. The heat generated by the CU and the DU integrated on the PCB assembly is dissipated through the first thermal bridge and the second thermal bridge.

[0162] The method (500) comprises determining a number of the one or more heat pipes, a number of the one or more top heat pipes and a number of the one or more bottom heat pipes based on at least one of, but not limited to, a total heat to be dissipated, a thermal capacity of the one or more heat pipes, and one or more spatial constraints of the layout of the CCDU (100). By selecting and determining the number and arrangement of heat pipes in accordance with parameters, the thermal design ensures efficient heat transfer while accommodating the mechanical and geometric limitations of the enclosure.

[0163] The method (500) comprises determining a first temperature difference between the second cold plate and the one or more top heat sinks associated with the top housing, and a second temperature difference between the first cold plate and the one or more bottom heat sinks associated with the bottom housing.

[0164] The method (500) comprises initiating a heat flow to maintain an equilibrium thermal state between the server processor, the top housing and the bottom housing based on the determined first temperature difference and the second temperature difference. The CCDU (100) detects temperature imbalances based on the temperature differences (i.e., first temperature difference and second temperature difference) to adjust the heat flow and maintain the equilibrium thermal state. In the equilibrium state, the temperature distribution across the server processor, top housing, and bottom housing is maintained uniformly or within the defined tolerance range. Maintaining the thermal equilibrium state ensures consistent operating temperatures, prevents thermal stress and component degradation, and thereby enhances the overall reliability and cooling efficiency of the CCDU (100).

[0165] FIG. 6 illustrates an exemplary flow diagram (600) of a method for performing passive cooling by dissipating heat in the environment, in accordance with an embodiment of the present disclosure.

[0166] At step (602), the method (600) comprises transferring the heat generated by one or more components integrated on a printed circuit board (PCB) assembly to a bottom housing and a top housing through one or more thermal bridges. In an aspect, the one or more thermal bridges comprise a first thermal bridge and a second thermal bridge. The first thermal bridge is formed between a first cold plate mounted on a server processor integrated on a first side of the PCB assembly and the bottom housing through one or more bottom heat pipes, and the second thermal bridge is formed between a second cold plate coupled with a second side of the PCB assembly and the top housing through one or more top heat pipes.

[0167] At step (604), the method (600) comprises dissipating, by the one or more thermal bridges, the heat to the environment. The heat is dissipated to the environment through the thermal bridges.

[0168] The method (600) comprises determining a first temperature difference between the second plate server processor and the one or more top heat sinks associated with the top housing, and a second temperature difference between the first plate and the one or more bottom heat sinks associated with the bottom housing. A heat flow is initiated to maintain an equilibrium thermal state between the server processor, the top housing and the bottom housing based on the determined first temperature difference and the second temperature difference.

[0169] The present disclosure provides a technical advancement in a cooling arrangement for a combined centralized and distributed unit (CCDU). The cooling arrangement addresses limitations associated with conventional fan-based cooling systems, which are susceptible to mechanical failure and may allow dust or moisture to ingress into sensitive electronic components, thereby necessitating additional, energy-intensive air conditioning solutions. The present disclosure provides the CCDU that integrates a centralized unit (CU) and a distributed unit (DU) into a single, compact printed circuit board (PCB). Passive cooling is implemented to dissipate heat from heat-generating components (e.g., server processors) through cold plates and thermal bridges formed via interconnected heat pipes. The passive-cooled CCDU eliminates installation complexity and eliminates the need for active cooling, supplementary air conditioning, and external outdoor cabinet structures. Accordingly, the CCDU with passive cooling offers enhanced robustness, improved energy efficiency, and reduced maintenance requirements for outdoor telecommunications infrastructure, particularly in network deployments under demanding environmental conditions.

[0170] While the foregoing describes various embodiments of the invention, other and further embodiments of the invention may be devised without departing from thebasic scope thereof. The scope of the invention is determined by the claims that follow. The invention is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the invention when combined with information and knowledge available to the person having ordinary skill in the art.ADVANTAGES OF THE PRESENT DISCLOSURE

[0171] The present disclosure enhances reliability by eliminating the need for fans, reducing the risk of mechanical failure, and minimizing dust and moisture ingress, leading to improved system durability.

[0172] The present disclosure discloses a combined centralized and distribution unit (CCDU) that has fewer moving parts, lower maintenance requirements, and reduced downtime. This results in significant cost savings over the CCDU's lifespan.

[0173] The present disclosure has a compact design. The Centralized Unit (CU) and Distribution Unit (DU) integrated into a single printed circuit board (PCB) streamline the design, saving space and simplifying installation.

[0174] The present disclosure provides environmental protection against harsh weather conditions, making the CCDU suitable for outdoor applications.

[0175] The present disclosure provides versatile installation, including the ability to mount the CCDU on poles without the need for air conditioning or additional outdoor cabinets. The CCDU’s deployment simplifies and reduces installation costs.

[0176] The present disclosure improves scalability as the CCDU is capable of operating with up to a plurality of cells (e.g., up to nine cells). The CCDU offers flexibility in adapting to varying systems.

[0177] The present disclosure provides energy by lowering power consumption, aligning sustainability goals and reducing overall operational expenditures.

[0178] The present disclosure supports 5G Applications (e.g., 5G Radio Access Network (RAN) deployments) and ensures compatibility with the latest telecommunications technology.

[0179] The present disclosure establishes a self-sufficient operational framework that autonomously regulates thermal conditions and performance without reliance on external cooling subsystems or continuous operator oversight

[0180] The present disclosure provides a cost-effective CCDU with lower capital and operational expenditures, making the CCDU an economically viable choice for network operators.

[0181] The present disclosure reduces maintenance requirements through the integration of passive or low-complexity thermal technologies that mitigate component wear and decrease the frequency of service interventions.

[0182] The present disclosure minimizes operational requirements by incorporating automated thermal supervision mechanisms, thereby reducing the need for manual adjustments and continuous operational management.

Claims

CLAIMS1. A combined centralized and distribution unit (CCDU) (100) comprising: a top housing (102); a bottom housing (106); a printed circuit board (PCB) assembly (104) is configured to integrate one or more components associated with a centralized unit (CU) and a distribution unit (DU), the PCB assembly (104) comprises: a first cold plate (302-1) mounted on a server processor integrated on a first side of the PCB assembly (104) and configured to contact the bottom housing (106); and a second cold plate (302-2) configured to be coupled with a second side of the PCB assembly (104) and is configured to contact the top housing (102); and one or more heat pipes (303, 402) configured to dissipate heat generated by the CU and DU integrated on the PCB assembly (104) by forming one or more thermal bridges (404).

2. The CCDU (100) as claimed in claim 1, further comprises an enclosure configured to enclose the top housing (102), the bottom housing (106), and the PCB assembly (104).

3. The CCDU (100) as claimed in claim 1, wherein the one or more thermal bridges comprise at least one of a first thermal bridge (404-1) between the first cold plate (302-1) and the bottom housing, and a second thermal bridge (404- 2) between the second cold plate (302-2) and the top housing (102).

4. The CCDU (100) as claimed in claim 1, wherein the top housing (102) comprises one or more top heat sinks and one or more top heat pipes (402-5,402-6, 402-7, 402-8), wherein the bottom housing (106) comprises one or more bottom heat sinks and one or more bottom heat pipes (402-1, 402-2, 402- 3, 402-4), and wherein the first cold plate (302-1) and the second cold plate (302-2) are copper plates.

5. The CCDU (100) as claimed in claim 1, wherein the one or more components comprise the server processor, a memory module, a hardware accelerator, a network interface controller, a plurality of network interface cards (NICs), a board management control (BMC), a synchronizer, an oscillator, and a plurality of network ports.

6. The CCDU (100) as claimed in claim 1, wherein a number of the one or more heat pipes (303, 402), a number of the one or more top heat pipes (402-5, 402- 6, 402-7, 402-8) and a number of the one or more bottom heat pipes (402-1, 402-2, 402-3, 402-4) are determined based on at least one of a total heat to be dissipated, a thermal capacity of the one or more heat pipes, and one or more spatial constraints of a layout of the CCDU (100).

7. The CCDU (100) as claimed in claim 1, is configured to: determine a first temperature difference between the second cold plate (302-2) and the one or more top heat sinks associated with the top housing (102), and a second temperature difference between the first cold plate and the one or more bottom heat sinks associated with the bottom housing (106); and based on the determined first temperature difference and the second temperature difference, initiate a heat flow to maintain an equilibrium thermal state between the server processor, the top housing (102) and the bottom housing (106).

8. A method (500) for assembling a combined centralized and distribution unit (CCDU), the method (500) comprising: integrating (502) one or more components associated with a centralized unit (CU) and a distribution unit (DU) on a printed circuit board (PCB) assembly (104); mounting (504) a first cold plate on a server processor integrated on a first side of the PCB assembly (104), wherein the first cold plate is configured to contact the bottom housing (106); coupling (506) a second cold plate to a second side of the PCB assembly, wherein the second cold plate is configured to contact the top housing; and dissipating (508) heat generated by the CU and the DU integrated on the PCB assembly by forming one or more thermal bridges.

9. The method (500) as claimed in claim 8, wherein an enclosure is configured to enclose the top housing (102), the bottom housing (106), and the PCB assembly (104), wherein the first cold plate (302-1) and the second cold plate (302-2) are copper plates, and wherein the one or more thermal bridges comprise at least one of a first thermal bridge (404-1) between the first cold plate and the bottom housing and a second thermal bridge (404-2) between the second cold plate (302-2) and the top housing (102).

10. The method (500) as claimed in claim 8, wherein the one or more components comprise the server processor, a memory module, a hardware accelerator, a network interface controller, a plurality of network interface cards (NICs), a board management control (BMC), a synchronizer, an oscillator, and a plurality of network ports.

11. The method (500) as claimed in claim 8, further comprises: determining a number of the one or more heat pipes, a number of the one or more top heatpipes (402-5, 402-6, 402-7, 402-8) and a number of the one or more bottom heat pipes (402-1, 402-2, 402-3, 402-4) based on at least one of a total heat to be dissipated, a thermal capacity of the one or more heat pipes, and one or more spatial constraints of a layout of the CCDU (100).

12. The method (500) as claimed in claim 8, further comprising: determining a first temperature difference between the second cold plate (302-2) and the one or more top heat sinks associated with the top housing (102), and a second temperature difference between the first cold plate (302- 1) and the one or more bottom heat sinks associated with the bottom housing (106); and based on the determined first temperature difference and the second temperature difference, initiating a heat flow to maintain an equilibrium thermal state between the server processor, the top housing (102) and the bottom housing (106).

13. A method (600) for performing passive cooling by dissipating heat in an environment, the method (600) comprising: transferring (602) the heat generated by one or more components integrated on a printed circuit board (PCB) assembly (104) to a bottom housing (106) and a top housing (102) through one or more thermal bridges; and dissipating (604), by the one or more thermal bridges, the heat to the environment.

14. The method (600) as claimed in claim 13, wherein the one or more thermal bridges comprise a first thermal bridge (404-1) formed between a first cold plate (302-1) mounted on a server processor integrated on a first side of the PCB assembly (104) and the bottom housing (106) through one or morebotom heat pipes (402-1, 402-2, 402-3, 402-4), and the second thermal bridge formed between a second cold plate (302-2) coupled with a second side of the PCB assembly (104) and the top housing (102) through one or more top heat pipes (402-5, 402-6, 402-7, 402-8).

15. The method (600) as claimed in claim 13, further comprises: determining a first temperature difference between the second plate server processor and the one or more top heat sinks associated with the top housing (102), and a second temperature difference between the first plate and the one or more botom heat sinks associated with the bottom housing (106); and based on the determined first temperature difference and the second temperature difference, initiating a heat flow to maintain an equilibrium thermal state between the server processor, the top housing (102) and the botom housing (106).

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