Light-emitting module, manufacturing method for light-emitting module, and display device
By setting pits on the surface of the ink layer and the light-emitting component, the problem of unstable connection between the ink layer and the encapsulating adhesive layer is solved, thus extending the service life of the light-emitting module.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
- Filing Date
- 2024-11-27
- Publication Date
- 2026-06-04
Smart Images
Figure CN2024134798_04062026_PF_FP_ABST
Abstract
Description
Light-emitting module, method for manufacturing light-emitting module and display device Technical Field
[0001] This application relates to the field of light-emitting display technology, such as a light-emitting module, a method for preparing the light-emitting module, and a display device. Background Technology
[0002] In related technologies, in order to enable the light-emitting module to achieve a high contrast display effect when emitting light, an ink layer is usually set around the light-emitting element on the substrate. The ink layer is used to adjust the color of the light-emitting module and thus adjust the display contrast of the light-emitting module when emitting light.
[0003] However, dirt and foreign matter often adhere to and accumulate on the surface of the ink layer, resulting in poor bonding stability between the ink layer and the encapsulating adhesive layer covering the ink layer. During long-term use of the light-emitting module, the ink layer and the encapsulating adhesive layer are prone to separation, creating gaps. This allows oxygen, moisture, and other substances to enter the light-emitting module through the gaps between the ink layer and the encapsulating adhesive layer, affecting the lifespan of the light-emitting module. Summary of the Invention
[0004] This application provides a light-emitting module that can improve the bonding stability between the ink layer and the encapsulating adhesive layer, thereby increasing the service life of the light-emitting module.
[0005] This application provides a method for preparing a light-emitting module, which can produce the aforementioned light-emitting module with a long service life.
[0006] This application provides a display device that can improve the overall lifespan of the display device by using the aforementioned long-life light-emitting module.
[0007] In a first aspect, this application provides a light-emitting module, comprising:
[0008] substrate;
[0009] Multiple light-emitting elements are arranged in a spaced array on the same side of the substrate;
[0010] An ink layer is disposed on the substrate surrounding a plurality of light-emitting elements. The ink layer has a first surface facing away from the substrate. The first surface has a plurality of first pits, each first pit having a depth h1. The ink layer has a thickness t1, where 5%t1 ≤ h1 ≤ 20%t1.
[0011] An encapsulating adhesive layer is located on the side of the substrate where the light-emitting element is located, and the encapsulating adhesive layer covers all of the light-emitting elements and the ink layer.
[0012] In some implementations, 10μm≤t1≤50μm.
[0013] In some implementations, 1μm≤h1≤10μm.
[0014] In some embodiments, the diameter of the inscribed circle of the contour of the first recess on the first surface is d1, where 10μm≤d1≤30μm.
[0015] In some embodiments, the spacing between two adjacent light-emitting elements is w, the depth h1 of the first recess located between the two adjacent light-emitting elements, and the diameter d1 of the inscribed circle of the contour of the first recess on the first surface satisfy:
[0016] In some embodiments, the first surface includes a plurality of local surfaces located between two adjacent light-emitting elements, and for any one of the local surfaces, the total area of the local surfaces is S11, and the total area occupied by the first pit on the local surface is S12, where S12 ≥ 60% of S11.
[0017] In some embodiments, the light-emitting element protrudes from the substrate by a height of t2, where t2 > t1.
[0018] In some embodiments, the first surface has an edge region connected to adjacent light-emitting elements and a central region located in the middle between two adjacent light-emitting elements, wherein the distribution density of the first pit in the edge region is P1 and the distribution density of the first pit in the central region is P2, where P1 < P2.
[0019] In some implementations, 1.1 ≤ P2 / P1 ≤ 1.6.
[0020] In some embodiments, the first surface includes a plurality of local surfaces located between two adjacent light-emitting elements. For any one of the local surfaces, the total area of the edge region within the local surface is S111, and the total area occupied by the first pit within the edge region of the local surface is S121, where S121 ≥ 60% of S111.
[0021] The total area of the central region within the local surface is S112, and the total area occupied by the first pit within the central region of the local surface is S122, where S122 ≥ 80% of S112.
[0022] In some embodiments, the first surface has an edge region connected to an adjacent light-emitting element and an outer peripheral region connected to the edge of the substrate, wherein the distribution density of the first pit in the edge region is P1 and the distribution density of the first pit in the outer peripheral region is P3, where P1 < P3.
[0023] In some implementations, 1.1 ≤ P3 / P1 ≤ 1.6.
[0024] In some embodiments, the light-emitting element has a second surface facing away from the substrate, and the second surface is provided with a plurality of second recesses.
[0025] In some embodiments, the second pit has a depth h2, where 1.1 μm ≤ h2 ≤ 20 μm.
[0026] In some embodiments, the diameter of the inscribed circle of the contour of the second recess on the second surface is d2, where 11 μm ≤ d2 ≤ 60 μm.
[0027] In some embodiments, for one of the light-emitting elements, the area of the second surface is S21, and the total area occupied by the second recess on the second surface is S22, where S22 ≥ 85% of S21.
[0028] In some embodiments, the depth h1 of the first pit and the depth h2 of the second pit satisfy: 1.1h1≤h2≤2h1.
[0029] In some embodiments, the inscribed circle diameter d1 of the contour of the first recess on the first surface and the inscribed circle diameter d2 of the contour of the second recess on the second surface are such that 1.1d1≤d2≤2d1.
[0030] In some embodiments, the distance w between two adjacent light-emitting elements satisfies: 0.1mm ≤ w ≤ 10mm.
[0031] In some embodiments, the encapsulating adhesive layer includes one of room temperature curing adhesive, UV curing adhesive, and thermosetting adhesive.
[0032] Secondly, this application provides a method for manufacturing a light-emitting module, capable of producing the light-emitting module as described in the first aspect above, the method comprising:
[0033] Provide substrate;
[0034] Multiple light-emitting elements are arranged in a spaced array on one side of the substrate;
[0035] An ink layer is disposed around the plurality of light-emitting elements on the substrate;
[0036] From the side of the light-emitting element and the ink layer away from the substrate, at least the surface of the ink layer is sandblasted to form a first pit at least on the first surface of the ink layer away from the substrate;
[0037] An encapsulating adhesive layer is disposed on the side of the substrate on which the light-emitting element is located, and the encapsulating adhesive layer covers all of the light-emitting element and the ink layer.
[0038] Thirdly, this application provides a display device, a housing, and at least one light-emitting module as described in the first aspect above, wherein the substrate of the light-emitting module is disposed in the housing, and the light-emitting element of the light-emitting module is located on the side of the substrate away from the housing. Attached Figure Description
[0039] The present application will now be described in detail with reference to the accompanying drawings and embodiments.
[0040] Figure 1 is a cross-sectional view of the light-emitting module described in the embodiment.
[0041] Figure 2 is an enlarged schematic diagram of point L in Figure 1.
[0042] Figure 3 is a schematic diagram of the structure of the light-emitting module described in the embodiment (the encapsulation layer, the first pit, and the second pit are not shown) from the angle of the first surface and the second surface.
[0043] Figure 4 is an enlarged schematic diagram of point M in Figure 3 (without omitting the first and second pits).
[0044] Figure 5 is an enlarged schematic diagram of point N in Figure 4.
[0045] Figure 6 is a cross-sectional structural diagram of the display device described in the embodiment.
[0046] In the picture:
[0047] 100. Light-emitting module;
[0048] 1. Substrate;
[0049] 2. Light-emitting element; 21. Second surface; 22. Second recess;
[0050] 3. Ink layer; 31. First surface; 31a. Partial surface; 310. Edge region; 311. Central region; 312. Outer peripheral region; 32. First pit;
[0051] 4. Encapsulating adhesive layer;
[0052] 200. Box body. Detailed Implementation
[0053] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the meaning of the above terms in this application as appropriate.
[0054] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or indicating that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or indicating that the first feature is at a lower horizontal level than the second feature.
[0055] As shown in Figures 1 and 2, this application provides a light-emitting module 100, including a substrate 1, a plurality of light-emitting elements 2, an ink layer 3, and an encapsulating adhesive layer 4. The plurality of light-emitting elements 2 are arranged in a spaced array on the same side of the substrate 1. The ink layer 3 surrounds each light-emitting element 2 and is disposed on the substrate 1. The ink layer 3 has a first surface 31 facing away from the substrate 1. The first surface 31 is provided with a plurality of first pits 32. The first pits 32 have a depth h1. The ink layer 3 has a thickness t1, where 5%t1≤h1≤20%t1. The encapsulating adhesive layer 4 is located on the side of the substrate 1 where the light-emitting elements 2 are located, and the encapsulating adhesive layer 4 covers all the light-emitting elements 2 and the ink layer 3.
[0056] By providing a first pit 32 on the first surface 31 of the ink layer 3, part of the original structure of the first surface 31 of the ink layer 3 is removed, thereby removing some dirt and foreign matter that originally adhered to and accumulated on the first surface 31. It can also increase the connection area between the ink layer 3 and the encapsulating adhesive layer 4, thereby improving the connection stability between the ink layer 3 and the encapsulating adhesive layer 4.
[0057] The first pit 32 provided on the first surface 31 can also increase the connection area between the ink layer 3 and the encapsulating adhesive layer 4, thereby improving the connection stability between the ink layer 3 and the encapsulating adhesive layer 4, making it less likely for the ink layer 3 and the encapsulating adhesive layer 4 to separate and generate gaps, so as to better improve the service life of the light-emitting module 100.
[0058] By ensuring that the depth h1 of the first recess 32 and the thickness t1 of the ink layer 3 satisfy 5%t1≤h1≤20%t1, it is possible to effectively remove a significant amount of dirt and foreign matter originally attached to and accumulated on the first surface 31 from the first recess 32, while avoiding the situation where the depth of the first recess 32 is too deep, resulting in an excessively thin local thickness of the ink layer 3. This prevents the local portion of the ink layer 3 from having a poor appearance adjustment effect on the light-emitting module 100. For example, the depth h1 of the first recess 32 can be 5%t1, 6%t1, 7%t1, 8%t1, 10%t1, 12%t1, 14%t1, 15%t1, 16%t1, 18%t1, or 20%t1, etc.
[0059] Optionally, the light-emitting element 2 may include a light-emitting diode (LED) chip made of semiconductor material to reduce the energy consumption of the light-emitting element 2, and the light-emitting element 2 may include an LED chip for emitting light of one wavelength, or the light-emitting element 2 may include multiple LED chips, of which at least two LED chips are used to emit light of different wavelengths.
[0060] Optionally, the ink layer 3 may have a dark appearance such as black or gray, so that when the light-emitting element 2 emits light, the ink layer 3 and the appearance of the light-emitting element 2 can present a greater contrast, so that the light-emitting module 100 presents a greater display contrast in the light-emitting display state.
[0061] Since the greater the thickness t1 of the ink layer 3, the better the covering effect of the ink layer 3 on the surface of the substrate 1, the better the adjustment effect of the ink layer 3 on the appearance of the light-emitting module 100. However, at the same time, it will also lead to a greater blocking effect of the ink layer 3 on the side light emission of the light-emitting element 2, resulting in a worse display effect of the light-emitting module 100 at large angles. Therefore, the thickness t1 of the ink layer 3 should not be too large. Based on this, the thickness t1 of the ink layer 3 can optionally satisfy: 10μm≤t1≤50μm. For example, the thickness t1 of the ink layer 3 can be 10μm, 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm or 50μm, etc.
[0062] Optionally, two adjacent first pits 32 may be spaced apart, or two adjacent first pits 32 may be connected, so that dirt and foreign matter on the first surface 31 can be removed more thoroughly.
[0063] The greater the depth h1 of the first pit 32, the more ink layer 3 material is removed, resulting in greater material waste. However, the smaller the depth h1 of the first pit 32, the more dirt and foreign matter that originally adhered and accumulated on the first surface 31 remain. Therefore, the depth h1 of the first pit 32 cannot be too large or too small. Based on this, the depth h1 of the first pit 32 can optionally satisfy: 1μm≤h1≤10μm. For example, the depth h1 of the first pit 32 can be: 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm or 10μm, etc.
[0064] The first recess 32 is typically formed by sandblasting towards the first surface 31. To allow the sandblasted particles to penetrate between the two light-emitting elements 2 and impact the first surface 31 to remove some of the ink layer 3 material, the sand particles are generally approximately spherical. The diameter D of the sandblasted particles needs to be smaller than the distance w between two adjacent light-emitting elements 2. The smaller the diameter D of the sandblasted particles is than the distance w between two adjacent light-emitting elements 2, the more uniform the distribution of the sand particles impacting the first surface 31, thus creating a more evenly distributed recess on the first surface 31. The first pit 32, however, if the diameter D of the sand grains is too small, the sand grains will easily get stuck in narrow positions such as the corners and gaps of the light-emitting module 100, which is not conducive to completely removing the sand grains from the light-emitting module 100 after sandblasting. Therefore, the diameter D of the sand grains cannot be too small. Based on this, the spacing w between the diameter D of the sand grains and the two adjacent light-emitting elements 2 can optionally satisfy: (1 / 9)w≤D≤(1 / 5)w. For example, the diameter D of the sand grains can be (1 / 9)w, (1 / 8)w, (1 / 7)w, (1 / 6)w or (1 / 5)w, etc.
[0065] Referring to Figures 3 to 5, the outline shape and size of the first recess 32 on the first surface 31 are typically determined by the shape and size of the sand grains used during sandblasting and the impact direction of the sand grains hitting the first surface 31. Therefore, the diameter of the inscribed circle of the outline of the first recess 32 on the first surface 31 is d1. According to geometric relationships, d1 is equal to or close to...
[0066] Based on this, optionally, the spacing w between two adjacent light-emitting elements 2, the depth h1 of the first recess 32 located between two adjacent light-emitting elements 2, and the diameter d1 of the inscribed circle of the contour of the first recess 32 on the first surface 31 can satisfy:
[0067] For example, the diameter d1 of the inscribed circle of the contour of the first recess 32 on the first surface 31 can be... or wait.
[0068] Since the smaller the distance w between two adjacent light-emitting elements 2, the better the display clarity of the light-emitting module 100, but if the distance w is too small, it will make the setting of the light-emitting elements 2 more difficult, and the light-emitting elements 2 are prone to contact due to assembly errors, which will lead to short circuits in some light-emitting elements 2. Therefore, the distance w between two adjacent light-emitting elements 2 cannot be too small. Based on this, the distance w between two adjacent light-emitting elements 2 can optionally satisfy: 0.1mm≤w≤10mm. For example, the distance w can be 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm or 10mm, etc.
[0069] Therefore, when sandblasting the ink layer 3 with sand grains of suitable diameter D to form a first pit 32 of suitable depth h1 on the first surface 31, optionally, the inscribed circle diameter d1 of the first pit 32 on the first surface 31 can satisfy: 10μm≤d1≤30μm. For example, d1 can be 10μm, 12μm, 14μm, 15μm, 16μm, 18μm, 20μm, 22μm, 24μm, 25μm, 26μm, 28μm or 30μm, etc.
[0070] The first surface 31 includes multiple local surfaces 31a located between two adjacent light-emitting elements 2. For any local surface 31a, the area of the local surface 31a is S11, and the total area occupied by the first pit 32 on the local surface 31a is S12. The larger the area of S12, the higher the removal rate of dirt and foreign matter attached to and accumulated on the local surface 31a. In order to make the removal rate of dirt and foreign matter meet the requirements, optionally, the total area S11 of the local surface 31a and the total area S12 occupied by the first pit 32 on the local surface 31a can satisfy the following conditions: S12 ≥ 60% S11. For example, the total area S12 occupied by the first recess 32 on the local surface 31a can be 60% S11, 65% S11, 70% S11, 75% S11, 80% S11, 85% S11, 90% S11, 95% S11 or 100% S11, etc. As shown in Figure 4, the edge positions of two of the local surfaces 31a included in the first surface 31 are illustrated by thick dashed lines. The thick dashed lines are only used to indicate the edge positions of the local surfaces 31a and do not represent that there is a solid structure there.
[0071] As shown in Figures 2 to 5, the protrusion height of the light-emitting element 2 protruding from the substrate 1 is t2. Since the greater the height t2 is than the thickness t1 of the ink layer 3, the smaller the blocking effect of the ink layer 3 on the side-emitting light of the light-emitting element 2. Therefore, optionally, the protrusion height t2 of the light-emitting element 2 protruding from the substrate 1 and the thickness t1 of the ink layer 3 can satisfy t2 > t1.
[0072] The first surface 31 has an edge region 310 connected to adjacent light-emitting elements 2, and a central region 311 located in the middle between two adjacent light-emitting elements 2. Since the height t2 of the light-emitting element 2 is greater than the thickness t1 of the ink layer 3, in other words, the light-emitting element 2 protrudes from the first surface 31. Therefore, when the first surface 31 is sandblasted, the light-emitting element 2 will obstruct some sand particles, making the probability of sand particles hitting the edge region 310 of the first surface 31 less than the probability of sand particles hitting the central region 311 of the first surface 31. Based on this, optionally, the distribution density of the first pits 32 in the edge region 310 is P1, and the distribution density of the first pits 32 in the central region 311 is P2, where P1 < P2. The distribution density of the first pits 32 refers to the number of first pits 32 per unit area.
[0073] Since the height t2 of the light-emitting element 2 is greater than the thickness t1 of the ink layer 3, the ink layer 3 has a smaller blocking effect on the side-emitting light of the light-emitting element 2. However, the light-emitting element 2 also has a greater blocking effect on sand particles, resulting in a smaller probability that sand particles will collide with the edge region 310 of the first surface 31. This leads to poor uniformity of the distribution of the first pits 32 and excessive foreign matter residue in the edge region 310. Therefore, it is necessary to make the ratio P2 / P1 of the distribution density P2 of the first pits 32 in the central region 311 to the distribution density P1 of the first pits 32 in the edge region 310 smaller. To ensure a more uniform distribution of the first recesses 32 and to prevent P2 / P1 from being too small, thus avoiding excessive obstruction of the side-emitting light from the light-emitting element 2 by the ink layer 3, the ratio P2 / P1 of the distribution density P2 of the first recesses 32 in the central region 311 to the distribution density P1 of the first recesses 32 in the edge region 310 can optionally satisfy: 1.1≤P2 / P1≤1.6. For example, P2 / P1 can be 1.1, 1.15, 1.2, 1.25, 1.3, 1.35, 1.4, 1.45, 1.5, 1.55, or 1.6, etc.
[0074] For any given local surface 31a, the total area of the edge region 310 within the local surface 31a is S111, and the total area occupied by the first pit 32 within the edge region 310 of the local surface 31a is S121. The larger the area S121, the higher the removal rate of dirt and foreign matter attached to and accumulated on the local surface 31a. To ensure that the removal rate of dirt and foreign matter meets the requirements, optionally, for any given local surface 31a, the area of the edge region 310 within the local surface 31a is S111. The total area S111 and the total area S121 occupied by the first recess 32 in the edge region 310 of the local surface 31a can satisfy: S121≥60%S111. For example, the total area S121 occupied by the first recess 32 in the edge region 310 of the local surface 31a can be 60%S111, 65%S111, 70%S111, 75%S111, 80%S111, 85%S111, 90%S111, 95%S111, or 100%S111, etc.
[0075] For any given local surface 31a, the total area of the central region 311 within the local surface 31a is S112, and the total area occupied by the first pit 32 within the central region 311 of the local surface 31a is S122. The larger the area of S122, the higher the removal rate of dirt and foreign matter attached to and accumulated on the local surface 31a. To ensure that the removal rate of dirt and foreign matter meets the requirements, it is optional that the total area occupied by the first pit 32 within the central region 311 of the local surface 31a is S112. The placement area S122 can satisfy: S122≥80%S112. For example, the total placement area S122 occupied by the first recess 32 in the central region 311 of the local surface 31a can be 80%S112, 82%S112, 84%S112, 85%S112, 86%S112, 88%S112, 90%S112, 92%S112, 94%S112, 95%S112, 96%S112, 98%S112, or 100%S112, etc.
[0076] Furthermore, regarding the portion of ink layer 3 located between the edge of the light-emitting element 2 and the edge of the substrate 1, this portion of ink layer 3 has an edge region 310 connected to the adjacent light-emitting element 2 and an outer peripheral region 312 connected to the edge of the substrate 1. Since the height t2 of the light-emitting element 2 is greater than the thickness t1 of the ink layer 3, in other words, the light-emitting element 2 will protrude from the first surface 31. Therefore, when the first surface 31 is sandblasted, the light-emitting element 2 will obstruct some sand particles, making the probability of sand particles hitting the edge region 310 of the first surface 31 less than the probability of sand particles hitting the outer peripheral region 312 of the first surface 31. Based on this, optionally, the distribution density of the first pit 32 in the edge region 310 is P1, and the distribution density of the first pit 32 in the outer peripheral region 312 is P3, where P1 < P3.
[0077] Since the height t2 of the light-emitting element 2 is greater than the thickness t1 of the ink layer 3, the ink layer 3 has a smaller blocking effect on the side-emitting light of the light-emitting element 2. However, the light-emitting element 2 also has a greater blocking effect on sand particles, resulting in a lower probability that sand particles will collide with the edge region 310 of the first surface 31. This leads to poor uniformity of the distribution of the first pits 32 and excessive foreign matter residue in the edge region 310. Therefore, it is necessary to make the ratio P3 / P1 of the distribution density P3 of the first pits 32 in the outer peripheral region 312 to the distribution density P1 of the first pits 32 in the edge region 310 smaller. To ensure a more uniform distribution of the first recesses 32 and to prevent P3 / P1 from being too small, thus avoiding excessive obstruction of the side-emitting light from the light-emitting element 2 by the ink layer 3, the ratio P2 / P1 of the distribution density P3 of the first recesses 32 in the outer peripheral region 312 to the distribution density P1 of the first recesses 32 in the edge region 310 can optionally satisfy: 1.1≤P3 / P1≤1.6. For example, P3 / P1 can be 1.1, 1.15, 1.2, 1.25, 1.3, 1.35, 1.4, 1.45, 1.5, 1.55, or 1.6, etc.
[0078] During the process of sandblasting the first surface 31 to form the first pit 32, sandblasting can be performed only on the first surface 31, or sandblasting can be performed on the surface of the light-emitting element 2 at the same time. Optionally, the light-emitting element 2 has a second surface 21 facing away from the substrate 1. The second surface 21 is provided with a plurality of second pits 22. On the one hand, this can reduce the precision control requirements of the sandblasting area, thereby reducing the difficulty of the sandblasting process. On the other hand, it can also make the surface of the light-emitting element 2 form an uneven structure by the second pits 22, so as to increase the connection area between the light-emitting element 2 and the encapsulating adhesive layer 4 and improve the connection stability between the light-emitting element 2 and the encapsulating adhesive layer 4. Adjacent two second pits 22 can be spaced apart, or adjacent two second pits 22 can be connected.
[0079] The second recess 22 has a depth h2. In order for the second recess 22 to effectively increase the connection area between the light-emitting element 2 and the encapsulating adhesive layer 4, while avoiding excessive material removal from the light-emitting element 2 to reduce material waste, the second recess 22 needs to have a certain depth but not too deep. Based on this, the depth h2 of the second recess 22 can optionally satisfy: 1.1μm≤h2≤20μm. For example, the depth h2 of the second recess 22 can be 1.1μm, 1.2μm, 1.3μm, 1.5μm, 1.7μm, 2μm, 3μm, 4μm, 5μm, 7μm, 10μm, 12μm, 15μm, 17μm or 20μm, etc.
[0080] Since the shape and size of the second pit 22 on the second surface 21 are typically determined by the shape and size of the sand grains used during sandblasting and the impact direction of the sand grains hitting the second surface 21, according to geometric relationships, d2 can be obtained as equal to or close to...
[0081] Based on this, when sandblasting the ink layer 3 with sand grains of suitable diameter D to form a second pit 22 of suitable depth h2 on the second surface 21, optionally, the diameter d2 of the inscribed circle of the contour of the second pit 22 on the second surface 21 can satisfy: 11μm≤d2≤60μm. For example, d2 can be 11μm, 12μm, 14μm, 15μm, 16μm, 18μm, 20μm, 22μm, 24μm, or 25μm. The sizes of the second pits 22 are 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, or 60μm, etc. In Figures 4 and 5, the outline of the second pit 22 on the second surface 21 is shown by way of example. For two connected second pits 22, although the partial outlines formed by the two second pits 22 on the second surface 21 are removed from each other, the complete outlines of the two second pits 22 on the second surface 21 are shown in Figures 4 and 5 for easy observation.
[0082] When the protrusion height t2 of the light-emitting element 2 protruding from the substrate 1 and the thickness t1 of the ink layer 3 satisfy t2 > t1, when the first surface 31 and the second surface 21 are sandblasted simultaneously from the side facing the first surface 31 and the second surface 21, the distance between the first surface 31 and the sandblasting head is greater than the distance between the second surface 21 and the sandblasting head. Therefore, the speed of the sand particles when they hit the second surface 21 is greater than the speed of the sand particles when they hit the first surface 31, which in turn causes the depth h1 of the first pit 32 to be less than the depth h2 of the second pit 22.
[0083] Optionally, the higher the height t2 of the light-emitting element 2 is than the thickness t1 of the ink layer 3, the less the ink layer 3 blocks the side-emitting light of the light-emitting element 2. However, the depth h1 of the first recess 32 is also less than the depth h2 of the second recess 22. This results in the second recess 22 being deeper than the first recess 32 while ensuring that the depth h1 meets the requirements, leading to greater material waste for the light-emitting element 2. Therefore, the height t2 of the light-emitting element 2 should not be too higher than the thickness t1 of the ink layer 3. 1. To ensure that the depth h1 of the first pit 32 is not too less than the depth h2 of the second pit 22, the depth h1 of the first pit 32 and the depth h2 of the second pit 22 may optionally satisfy: 1.1h1≤h2≤2h1. For example, the depth h2 of the second pit 22 may be 1.1h1, 1.2h1, 1.3h1, 1.4h1, 1.5h1, 1.6h1, 1.7h1, 1.8h1, 1.9h1, or 2h1, etc.
[0084] When the protrusion height t2 of the light-emitting element 2 protruding from the substrate 1 and the thickness t1 of the ink layer 3 satisfy t2 > t1, resulting in the depth h1 of the first pit 32 being less than the depth h2 of the second pit 22, since the diameter of the sand grains impacting the first surface 31 and the diameter of the sand grains impacting the second surface 21 are in the same range, the inscribed circle diameter d1 of the contour of the first pit 32 on the first surface 31 can be less than the inscribed circle diameter d2 of the contour of the second pit 22 on the second surface 21.
[0085] At this point, since the height t2 of the light-emitting element 2 is higher than the thickness t1 of the ink layer 3, the blocking effect of the ink layer 3 on the side light emission of the light-emitting element 2 is smaller. However, the depth h1 of the first recess 32 is also smaller than the depth h2 of the second recess 22. This results in the inscribed circle diameter d2 of the second recess 22 on the second surface 21 being larger than the inscribed circle diameter d1 of the first recess 32 on the first surface 31, even when the depth h1 of the first recess 32 meets the requirements. This leads to greater material waste for the light-emitting element 2. Therefore, the height t2 of the light-emitting element 2 should not be too higher than the thickness t1 of the ink layer 3, so that the first recess 22 can achieve the desired light emission. The inscribed circle diameter d2 of the second recess 22 on the second surface 21 should not be too large than the inscribed circle diameter d1 of the first recess 32 on the first surface 31. Based on this, optionally, the inscribed circle diameter d2 of the second recess 22 on the second surface 21 and the inscribed circle diameter d1 of the first recess 32 on the first surface 31 can satisfy: 1.1d1≤d2≤2d1. For example, the inscribed circle diameter d2 can be 1.1d1, 1.2d1, 1.3d1, 1.4d1, 1.5d1, 1.6d1, 1.7d1, 1.8d1, 1.9d1 or 2d1, etc.
[0086] Furthermore, since the height t2 of the light-emitting element 2 is higher than the thickness t1 of the ink layer 3, when the first surface 31 is sandblasted, the light-emitting element 2 may obstruct some sand particles, so that the distribution density of the second pit 22 on the second surface 21 is greater than or equal to the distribution density of the first pit 32 on the first surface 31.
[0087] As mentioned above, since the protrusion height t2 of the light-emitting element 2 protruding from the substrate 1 and the thickness t1 of the ink layer 3 satisfy t2 > t1, the inscribed circle diameter d1 of the contour of the first recess 32 on the first surface 31 can be smaller than the inscribed circle diameter d2 of the contour of the second recess 22 on the second surface 21. Based on this, optionally, the total area S21 of the second surface 21, the total area S22 of the second recess 22 on the second surface 21, the total area S11 of the first surface 31, and the total area S12 of the first recess 32 on the first surface 31 can satisfy: S22 / S21 > S12 / S11.
[0088] Based on this, if the ratio S12 / S11 of the total area S12 of the first recess 32 on a local surface 31a to the area S11 of that local surface 31a meets the requirements, optionally, the ratio of the total area S22 of the second recess 22 on a second surface 21 of the light-emitting element 2 to the area S21 of the second surface 21 of the light-emitting element 2 can satisfy: S22 ≥ 85%S21. For example, the total area S22 of the second recess 22 on a second surface 21 of the light-emitting element 2 can be 85%S21, 86%S21, 87%S21, 88%S21, 89%S21, 90%S21, 92%S21, 93%S21, 95%S21, 96%S21, 98%S21, or 100%S21, etc.
[0089] Optionally, the encapsulating adhesive layer 4 includes one of room temperature curing adhesive, ultraviolet (UV) curing adhesive, and thermosetting adhesive, so that the encapsulating adhesive layer 4 can be cured under one of the following conditions: room temperature environment, ultraviolet irradiation, and heating, so as to form an encapsulating adhesive layer 4 with good structural stability.
[0090] This application also provides a method for fabricating a light-emitting module. Please continue to refer to Figures 1 and 2. This fabrication method can manufacture the light-emitting module 100 as described in the foregoing technical solution. The method for fabricating the light-emitting module 100 includes:
[0091] S1, Provide substrate 1;
[0092] S2. Multiple light-emitting elements 2 are arranged in an array at intervals on one side of the substrate 1;
[0093] S3. An ink layer 3 is disposed around each light-emitting element 2 on the substrate 1;
[0094] S4. Sandblasting is performed on at least the surface of the ink layer 3 from the side of the light-emitting element 2 and the ink layer 3 away from the substrate 1 to form a first pit 32 at least on the first surface 31 of the ink layer 3 away from the substrate 1.
[0095] S5. An encapsulating adhesive layer 4 is provided on the side of the substrate 1 where the light-emitting element 2 is provided, and the encapsulating adhesive layer 4 covers all the light-emitting elements 2 and the ink layer 3.
[0096] After the light-emitting element 2 and the ink layer 3 are disposed on the substrate 1, at least the surface of the ink layer 3 is sandblasted from the side of the light-emitting element 2 and the ink layer 3 away from the substrate 1. At least part of the structure of the ink layer 3 can be removed to form a first pit 32 on the first surface 31 of the ink layer 3 away from the substrate 1, thereby making it possible to prepare the light-emitting module 100 with a long service life as described in the aforementioned technical solution.
[0097] Optionally, in step S4, while forming the first pit 32 on the first surface 31 of the ink layer 3 away from the substrate 1, a second pit 22 can also be formed on the second surface 21 of the light-emitting element 2 away from the substrate 1.
[0098] Optionally, after step S4 and before step S5, clean air can be sprayed onto the surfaces of the ink layer 3 and the light-emitting element 2 to blow away the sand particles remaining on the surfaces of the ink layer 3 and the light-emitting element 2.
[0099] As shown in Figure 6, this application also provides a display device, including: a housing 200 and at least one light-emitting module 100 as described in the foregoing technical solution. The substrate 1 of the light-emitting module 100 is disposed on the housing 200, and the light-emitting element 2 of the light-emitting module 100 is located on the side of the substrate 1 away from the housing 200. By using the aforementioned light-emitting module 100 with a long service life, the overall service life of the display device can be improved.
[0100] In the technical field of display devices, "cabinet" refers to the support structure of the light-emitting module 100. Therefore, the cabinet 200 can be any structure capable of supporting the light-emitting module 100. For example, the cabinet 200 may include at least one of a bracket structure, a plate structure, and a box structure with an internal cavity.
[0101] In this description, the terms "upper," "lower," "left," "right," etc., refer to the orientations or positional relationships shown in the accompanying drawings. They are used for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Furthermore, the terms "first" and "second" are used for descriptive distinction and have no special meaning.
[0102] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.
Claims
1. A light-emitting module, comprising: substrate; Multiple light-emitting elements are arranged in a spaced array on the same side of the substrate; An ink layer is disposed on the substrate surrounding each of the light-emitting elements. The ink layer has a first surface facing away from the substrate. The first surface is provided with a plurality of first pits. The first pits have a depth h1. The ink layer has a thickness t1, where 5%t1≤h1≤20%t1. as well as An encapsulating adhesive layer is located on the side of the substrate where the light-emitting element is located, and the encapsulating adhesive layer covers all of the light-emitting elements and the ink layer.
2. The light-emitting module according to claim 1, wherein, 10μm≤t1≤50μm.
3. The light-emitting module according to claim 1, wherein, 1μm≤h1≤10μm.
4. The light-emitting module according to claim 1, wherein, The diameter of the inscribed circle of the first pit on the first surface is d1, where 10μm≤d1≤30μm.
5. The light-emitting module according to claim 1, wherein, The distance between two adjacent light-emitting elements is w, the depth h1 of the first recess located between the two adjacent light-emitting elements, and the diameter d1 of the inscribed circle of the contour of the first recess on the first surface satisfy:
6. The light-emitting module according to claim 1, wherein, The first surface includes a plurality of local surfaces located between two adjacent light-emitting elements. For any one of the local surfaces, the total area of the local surface is S11, and the total area occupied by the first pit on the local surface is S12, where S12 ≥ 60% of S11.
7. The light-emitting module according to claim 1, wherein, The protrusion height of the light-emitting element from the substrate is t2, where t2 > t1.
8. The light-emitting module according to claim 7, wherein, The first surface has an edge region connected to the adjacent light-emitting elements and a central region located in the middle between two adjacent light-emitting elements. The distribution density of the first pit in the edge region is P1, and the distribution density of the first pit in the central region is P2, where P1 < P2.
9. The light-emitting module according to claim 8, wherein, 1.1≤P2 / P1≤1.
6.
10. The light-emitting module according to claim 8, wherein, The first surface includes a plurality of local surfaces located between two adjacent light-emitting elements. For any one of the local surfaces, the total area of the edge region within the local surface is S111, and the total area occupied by the first pit within the edge region of the local surface is S121, where S121 ≥ 60% of S111. The total area of the central region within the local surface is S112, and the total area occupied by the first pit within the central region of the local surface is S122, where S122 ≥ 80% of S112.
11. The light-emitting module according to claim 7, wherein, The first surface has an edge region connected to the adjacent light-emitting element and an outer peripheral region connected to the edge of the substrate. The distribution density of the first pit in the edge region is P1, and the distribution density of the first pit in the outer peripheral region is P3, where P1 < P3.
12. The light-emitting module according to claim 11, wherein, 1.1≤P3 / P1≤1.
6.
13. The light-emitting module according to any one of claims 1-12, wherein, The light-emitting element has a second surface facing away from the substrate, and the second surface is provided with a plurality of second pits.
14. The light-emitting module according to claim 13, wherein, The second pit has a depth h2, where 1.1 μm ≤ h2 ≤ 20 μm.
15. The light-emitting module according to claim 13, wherein, The diameter of the inscribed circle of the contour of the second pit on the second surface is d2, 11μm≤d2≤60μm.
16. The light-emitting module according to claim 13, wherein, For one of the light-emitting elements, the area of the second surface is S21, and the total area occupied by the second recess on the second surface is S22, where S22 ≥ 85% of S21.
17. The light-emitting module according to claim 13, wherein, The depth h1 of the first pit and the depth h2 of the second pit satisfy: 1.1h1≤h2≤2h1.
18. The light-emitting module according to claim 13, wherein, The inscribed circle diameter d1 of the first recess on the first surface and the inscribed circle diameter d2 of the second recess on the second surface are such that 1.1d1≤d2≤2d1.
19. The light-emitting module according to any one of claims 1-12, wherein, The distance w between two adjacent light-emitting elements satisfies: 0.1mm ≤ w ≤ 10mm.
20. The light-emitting module according to any one of claims 1-12, wherein, The encapsulating adhesive layer includes one of room temperature curing adhesive, ultraviolet (UV) curing adhesive, and thermosetting adhesive.
21. A method for manufacturing a light-emitting module, capable of producing the light-emitting module as described in any one of claims 1-20, wherein the method for manufacturing the light-emitting module comprises: Provide substrate; Multiple light-emitting elements are arranged in a spaced array on one side of the substrate; An ink layer is disposed around each of the light-emitting elements on the substrate; From the side of the light-emitting element and the ink layer away from the substrate, at least the surface of the ink layer is sandblasted to form a first pit at least on the first surface of the ink layer away from the substrate; An encapsulating adhesive layer is disposed on the side of the substrate on which the light-emitting element is located, and the encapsulating adhesive layer covers all of the light-emitting element and the ink layer.
22. A display device, comprising: The enclosure and at least one light-emitting module as described in any one of claims 1-20, wherein the substrate of the light-emitting module is disposed on the enclosure, and the light-emitting element of the light-emitting module is located on the side of the substrate opposite to the enclosure.