Wireless communication chip, module and testing method for wireless communication module
By integrating self-calibration and RF comprehensive testing functions into the wireless communication chip, the module production process is simplified, the problem of long chip calibration and comprehensive testing time on the module production line is solved, and the manufacturing cost is reduced.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- XINYI INFORMATION TECH(SHANGHAI) CO LTD
- Filing Date
- 2025-09-30
- Publication Date
- 2026-06-04
AI Technical Summary
In the existing wireless communication module production process, the calibration and comprehensive testing of each chip on the module production line takes a long time, which increases the manufacturing cost, and there are strict requirements for high-frequency testing equipment for radio frequency test indicators.
Integrating self-calibration and RF comprehensive testing functions into wireless communication chips, including RF transmitters, power calibration units, self-test loopback, RF receivers, and digital signal processing units, enables internal self-calibration and RF comprehensive testing, simplifying the testing process.
In the FT testing phase, there is no need to perform costly and time-consuming RF comprehensive testing again. Only module connectivity testing is required before shipment to customers, saving testing time and costs.
Smart Images
Figure CN2025126010_04062026_PF_FP_ABST
Abstract
Description
Wireless communication chips, modules, and testing methods for wireless communication modules Cross-references
[0001] This application claims priority to Chinese application No. 2024117167602, filed on November 27, 2024. The contents of the above application are incorporated herein by reference. Technical Field
[0002] This invention relates to the field of wireless communication chips, and in particular to a testing method for wireless communication chips, modules, and wireless communication modules. Background Technology
[0003] The existing wireless communication module production process is as follows: After the wafer is processed by the wafer foundry, chip probing (CP) testing is performed on the unpackaged bare dies, followed by final test (FT) testing on the packaged chips, and calibration and comprehensive testing after the chips are installed in the module, as shown in Figure 1. First, CP testing mainly involves basic low-frequency voltage and current tests to screen out a batch of defective chips, saving costs by eliminating them from the next stage of packaging and FT testing. The chip structure is shown in Figure 2. Second, the chips that pass CP testing are packaged, and the packaged chips undergo FT testing. Chips that pass FT testing are supplied to module manufacturers for module development. Finally, the chips undergo calibration and comprehensive testing on the module production line before being delivered to the user.
[0004] The inventors discovered at least the following problems in the above process: In the entire process, the calibration and comprehensive testing of each chip on the module production line takes a long time, approximately more than 30 seconds (the specific time depends on the coverage of the test items). There are strict requirements for high-frequency test equipment for RF test indicators, which greatly increases the manufacturing cost. Summary of the Invention
[0005] The purpose of this invention is to provide a testing method for wireless communication chips, modules, and wireless communication modules, which simplifies the testing process of wireless communication modules and saves testing time and costs.
[0006] To address the aforementioned technical problems, embodiments of the present invention provide a wireless communication chip, comprising: a radio frequency (RF) transmitter for transmitting RF signals; a power calibration unit for receiving the RF signals transmitted by the RF transmitter and performing power calibration by comparing the RF signals with a standard signal source; a self-test loopback unit for receiving the power-calibrated RF signals and outputting the power-calibrated RF signals to an RF receiver; the RF receiver for processing the received signals transmitted by the self-test loopback unit and forwarding the processed signals to a digital signal processing unit; and the digital signal processing unit for comparing the power-calibrated RF signals with the signals processed by the RF receiver to determine the gain of the RF receiver.
[0007] An embodiment of the present invention also provides a wireless communication module, including: the wireless communication chip described above, and an antenna terminal connected to the wireless communication chip.
[0008] An embodiment of the present invention also provides a testing method for a wireless communication module, applied to the aforementioned wireless communication module. The method includes: performing wafer probe testing and finished product testing on the wireless communication chip before packaging it into a module; packaging the wireless communication chip into the wireless communication module if both tests pass; performing connectivity testing on the wireless communication module; and determining the reliability of the wireless communication module after the test passes.
[0009] Compared with the prior art, the embodiments of the present invention integrate self-calibration function and related functions of radio frequency comprehensive testing into the wireless communication chip. At the same time, self-calibration and radio frequency comprehensive testing items are added to the FT test. Therefore, after the wireless communication chip is finally assembled into the module, there is no need to perform high-cost and time-consuming radio frequency comprehensive testing again in the module testing process. Only module connectivity needs to be tested before the module can be shipped to the customer, saving the time and cost spent on comprehensive testing.
[0010] In addition, the power calibration unit includes a power self-calibration source and an RF power detector; the power self-calibration source is used to provide the standard signal source; the RF power detector is used to receive the RF signal sent by the RF transmitter and perform power calibration by comparing the difference between the RF signal and the standard signal source.
[0011] In addition, an analog-to-digital converter is provided between the radio frequency power detector and the digital signal processing unit; the signal output by the radio frequency power detector is transmitted to the digital signal processing unit after passing through the analog-to-digital converter, and the digital signal processing unit processes it to obtain the power information of the wireless communication chip.
[0012] In addition, the signal output by the radio frequency power detector is a DC signal or a low-frequency analog signal.
[0013] In addition, the wireless communication chip receives the correction signal sent by the frequency correction instrument and corrects the frequency deviation according to the correction signal.
[0014] In addition, during frequency deviation correction, multiple wireless communication chips simultaneously receive correction signals sent by the frequency correction instrument, and each wireless communication chip corrects the frequency deviation according to the received correction signal.
[0015] In addition, the antenna end is connected to the antenna pin of the wireless communication chip via a wire.
[0016] In addition, connectivity testing includes testing whether the antenna in the wireless communication module can communicate normally with the wireless communication chip, and verifying the functionality of the general purpose input / output (GPIO) ports on the module. Attached Figure Description
[0017] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.
[0018] Figure 1 is a flowchart of the testing process involved in the production of wireless communication modules in the prior art;
[0019] Figure 2 is a schematic diagram of the grain structure;
[0020] Figure 3 is a schematic diagram of the wireless communication chip in this application;
[0021] Figure 4 is a schematic diagram of the structure of a traditional wireless communication chip;
[0022] Figure 5 is a schematic diagram of the wireless communication module in this application;
[0023] Figure 6 is a schematic diagram of the structure of a traditional wireless communication module;
[0024] Figure 7 is a schematic diagram of the automatic frequency calibration implemented by the wireless communication module in this application;
[0025] Figure 8 is a flowchart of the wireless communication module testing method of this application. Embodiments of the present invention
[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been presented in the various embodiments of the present invention to enable the reader to better understand this application. However, the technical solutions claimed in this application can be implemented even without these technical details and various changes and modifications based on the following embodiments.
[0027] The division of the following embodiments is for ease of description and should not constitute any limitation on the specific implementation of the present invention. The various embodiments can be combined with and referenced by each other without contradiction.
[0028] In the final test (FT) phase of wireless communication chips, key performance indicators (KPIs) of the RF transmitter and receiver of the communication system are verified, including transmit power, adjacent channel leakage rejection (ACLR), spectrum mask, receiver sensitivity, received signal strength, and received signal-to-noise ratio (SNR). Only chips that pass the FT test are supplied to module manufacturers for module development. During the module development phase, the aforementioned KPIs need to be calibrated and tested again. This calibration and testing process places stringent requirements on the testing equipment of the module production line, increasing testing complexity and controllability, leading to larger test errors and the possibility of false detections. This application addresses this issue by proposing a simplified procedure for calibrating and testing KPIs during the module development phase.
[0029] Embodiments of this application relate to a wireless communication chip, as shown in Figure 3, comprising: a radio frequency (RF) transmitter for transmitting RF signals; a power calibration unit for receiving the RF signals transmitted by the RF transmitter and performing power calibration by comparing the RF signals with a standard signal source; a self-test loopback (SBR) for receiving the power-calibrated RF signals and outputting the power-calibrated RF signals to an RF receiver; an RF receiver for processing the received signals transmitted by the SBR and forwarding the processed signals to a digital signal processing unit; and a digital signal processing unit for comparing the power-calibrated RF signals with the signals processed by the RF receiver to determine the gain of the RF receiver. This simplifies the testing process after assembling the chip into a wireless communication module, saving testing time and costs.
[0030] Compared with the prior art, the embodiments of the present invention integrate self-calibration function and related functions of radio frequency comprehensive testing into the wireless communication chip. At the same time, self-calibration and radio frequency comprehensive testing items are added to the FT test. Therefore, after the wireless communication chip is finally assembled into the module, there is no need to perform high-cost and time-consuming radio frequency comprehensive testing again in the module testing process. Only module connectivity needs to be tested before the module can be shipped to the customer, saving the time and cost spent on comprehensive testing.
[0031] The following is a detailed description of the structure of the wireless communication chip in this embodiment. The following content is only for the convenience of understanding and is not necessary for implementing this solution.
[0032] To clearly describe the improvements made to wireless communication chips in this application, we will first introduce traditional wireless communication chips, as shown in Figure 4. Traditional wireless communication chips consist of an RF transmitter, an RF receiver, and a digital signal processing unit (e.g., a digital baseband). Since the transmitter and receiver are independent, self-calibration of the internal signals of the chip is not possible. After the chip is assembled onto the module PCB, external testing equipment, such as an RF signal generator, spectrum analyzer, and comprehensive tester, is required to perform automatic power calibration (APC), automatic gain calibration (AGC), and automatic frequency calibration (AFC) on the module. Only after these three calibrations are completed can comprehensive tests be performed on parameters such as transmit power, spectrum template, received signal strength, and received signal-to-noise ratio. These RF-related calibrations and tests are complex, costly, and time-consuming.
[0033] The structure of the wireless communication chip in this application is shown in Figure 3. The wireless communication chip integrates a switch or duplexer, and adds a built-in RF self-test loopback, an RF power detector, and a power self-calibration source. The wireless communication chip integrates the detectors internally, so it can perform transmit power calibration (Automatic Power Calibration, APC), receive gain calibration (Automatic Gain Calibration, AGC), and frequency offset correction calibration (Automatic Frequency Calibration, AFC) on its own. Furthermore, since the wireless communication chip integrates the switches or duplexers originally assembled on the wireless communication module, as well as the functional modules (not shown in the figure) located between the antenna end and the wireless communication chip, the antenna end of the wireless communication module and the antenna pins of the chip are only connected by PCB wires. This results in the performance results of the final test (FT) of the wireless communication chip being equivalent to the performance of the antenna end of the wireless communication module. Only the loss of the PCB wires between the antenna end and the wireless communication chip needs to be deducted. There is no need to repeat all the RF test items in the final test (FT) on the module again. This achieves the elimination of the need for costly and time-consuming RF comprehensive testing. Only the module connectivity needs to be tested before shipment to the customer, saving the time and cost of comprehensive testing.
[0034] Specifically, the verification of the wireless communication chip in this application can be divided into at least three test items: Automatic Power Calibration (APC), Automatic Gain Calibration (AGC), and Automatic Frequency Calibration (AFC).
[0035] Regarding transmit power calibration (APC), an RF built-in loopback path is added inside the wireless communication chip, enabling the RF power detection circuit and power self-calibration source. Since the RF power detector is integrated into the wireless communication chip, it is connected to the RF transmitter. The transmitter's output signal is fed into the RF power detector, which outputs a DC or low-frequency analog signal. This signal is then processed by an analog-to-digital converter (ADC) and a digital signal processing unit (DSP) to obtain the power level information. Because the power detector may have errors, a constant calibration signal source is needed as a reference to offset the errors introduced by the power detector. To address this error issue, the power self-calibration source is integrated inside the chip. During the CP or FT test phase, a constant power supply can be easily provided by reading the DC power supply voltage, thus ensuring the accuracy of the power self-calibration source. With the power detector and power self-calibration source integrated into the chip, the chip can perform APC calibration using its own modules, achieving the purpose of self-calibration.
[0036] Compared to the conventional method of connecting an RF signal analyzer to the module antenna to detect power, the APC calibration method described in this application does not require additional external equipment. APC calibration can be achieved using the chip's own module, reducing the number of devices required for the calibration process and lowering costs.
[0037] In addition to the methods mentioned above, an external signal source can also be used as the calibration source for APC calibration, which can also solve the error problem.
[0038] Regarding Automatic Gain Calibration (AGC), after APC calibration is complete, the RF transmitter emits a calibrated, precise signal, which is fed into the RF built-in self-test loop and output to the RF receiver as a precise input signal. This input signal is amplified, down-converted, filtered, converted from analog to digital, and processed by the Received Signal Strength Indicator (RSSI) in the RF receiver. The difference between the input and output signals is used to determine the gain of the RF receiver, thus achieving AGC self-calibration.
[0039] Regarding Automatic Frequency Calibration (AFC), as shown in Figure 7, several wireless communication chips receive correction signals sent by the frequency calibration instrument and correct frequency deviations based on these signals. The frequency calibration instrument can utilize the equipment or instruments used in the FT testing process to send downlink signals to the wireless communication chips via the antenna. The purpose of using the equipment or instruments used in the FT testing process is to improve equipment reuse and reduce the number of devices used in the entire testing process.
[0040] The AFC calibration method described in this application differs from conventional AFC calibration, which requires connecting the module antenna to an RF signal analyzer via an RF cable to read the frequency, performing frequency offset calibration, and finally storing the result in the module's non-volatile memory (NV). The AFC self-calibration method of this invention can automatically correct frequency offset using a comprehensive test instrument or a metal detector in signaling mode downlink signals, eliminating the need for an RF signal analyzer.
[0041] In addition, the proposed solution can also achieve one-to-many calibration. During frequency deviation correction, multiple wireless communication chips simultaneously receive correction signals sent by the frequency correction instrument, and each wireless communication chip corrects its own frequency deviation based on the received correction signal.
[0042] Embodiments of this application also relate to a wireless communication module, including: the aforementioned wireless communication chip, and an antenna terminal connected to the wireless communication chip.
[0043] As shown in Figure 5, the antenna end of the wireless communication module is connected to the chip antenna pin only by PCB wires. This means that the performance result of the final test (FT) of the wireless communication chip is equivalent to the performance of the antenna end of the wireless communication module. Only the loss of the PCB wires between the antenna end and the wireless communication chip needs to be deducted. There is no need to repeat all the RF test items in the final test (FT) on the module again. This eliminates the need for costly and time-consuming RF comprehensive testing. Only the module connectivity needs to be tested before it can be shipped to the customer, saving the time and cost of comprehensive testing.
[0044] As shown in Figure 6, after the chip is assembled onto the module PCB, it is connected to the switch or duplexer that was originally on the module, as well as other functional modules (not shown in the figure), and finally connected to the antenna. That is, there are multiple different power consumption modules between the antenna and the wireless communication chip. Therefore, after testing the performance of the chip, the performance of the traditional wireless communication module needs to be tested again after it is assembled into the module.
[0045] Compared with the prior art, the embodiments of the present invention integrate self-calibration function and related functions of radio frequency comprehensive testing into the wireless communication chip. At the same time, self-calibration and radio frequency comprehensive testing items are added to the FT test. Therefore, after the wireless communication chip is finally assembled into the module, there is no need to perform high-cost and time-consuming radio frequency comprehensive testing again in the module testing process. Only module connectivity needs to be tested before the module can be shipped to the customer, saving the time and cost spent on comprehensive testing.
[0046] Furthermore, since the module antenna end of this invention is directly connected to the chip antenna pin, all RF tests performed in the FT stage, including transmit power, Adjacent Channel Leakage Rejection (ACLR), Spectrum Mask, receiver sensitivity, received signal strength, and received signal-to-noise ratio, are equivalent to the test performance in the module environment. Therefore, the module RF comprehensive testing stage can be eliminated, and only connectivity testing is required. Once passed, the module can be supplied to the customer, which has significant advantages in terms of complexity, cost, and time.
[0047] Embodiments of the present invention also relate to a testing method for a wireless communication module, applied to the aforementioned wireless communication module. The method includes: performing wafer probe testing and finished product testing on the wireless communication chip before packaging it into a module; packaging the wireless communication chip into the wireless communication module if both tests pass; performing connectivity testing on the wireless communication module; and determining the reliability of the wireless communication module after the tests pass.
[0048] The testing method for the wireless communication module in this embodiment is described in detail below. As shown in Figure 8, a chip probing (CP) test is performed on the unpackaged bare die to determine whether it passes. If it fails, the die is discarded; if it passes, the die is packaged. A Fourier Transform (FT) test and chip self-calibration are then performed on the packaged chip. The FT test is then determined to pass; if it fails, the chip is discarded; if it passes, the chip is supplied to the module manufacturer. The module manufacturer assembles the chips into modules and performs a connectivity test on the modules. The connectivity test verifies whether the antenna in the wireless communication module can communicate normally with the wireless communication chip. If the connectivity test fails, the module is discarded; if the connectivity test passes, the module is shipped to the customer.
[0049] This application adds self-calibration and covers RF comprehensive testing items in the FT testing stage. Therefore, in the final module testing stage, there is no need to perform high-cost and time-consuming RF comprehensive testing again. Only module connectivity and software testing are required before the module can be shipped to the customer.
[0050] The steps of the various methods described above are only for clarity. In practice, they can be combined into one step or some steps can be split into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this patent. Adding insignificant modifications or introducing insignificant designs to the algorithm or process, but without changing the core design of the algorithm and process, are also within the scope of protection of this patent.
[0051] Those skilled in the art will understand that the above embodiments are specific embodiments for implementing the present invention, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of the present invention.
Claims
1. A wireless communication chip, characterized in that, include: Radio frequency transmitters are used to transmit radio frequency signals; A power calibration unit is used to receive the radio frequency signal sent by the radio frequency transmitter and perform power calibration by comparing the difference between the radio frequency signal and a standard signal source; The self-test loopback is used to receive the power-calibrated RF signal and output the power-calibrated RF signal to the RF receiver; The radio frequency receiver is used to process the received signal transmitted by the self-test loopback and forward the processed signal to the digital signal processing unit. The digital signal processing unit is used to compare the difference between the power-calibrated radio frequency signal and the signal processed by the radio frequency receiver, and to determine the gain of the radio frequency receiver.
2. The wireless communication chip according to claim 1, characterized in that, The power calibration unit includes: a power self-calibration source and an RF power detector; The power self-calibration source is used to provide the standard signal source; The radio frequency power detector is used to receive the radio frequency signal sent by the radio frequency transmitter and to perform power calibration by comparing the difference between the radio frequency signal and a standard signal source.
3. The wireless communication chip according to claim 2, characterized in that, An analog-to-digital converter is provided between the radio frequency power detector and the digital signal processing unit; The signal output by the radio frequency power detector is transmitted to the digital signal processing unit after passing through the analog-to-digital converter, and the digital signal processing unit processes the signal to obtain the power information of the wireless communication chip.
4. The wireless communication chip according to claim 3, characterized in that, The signal output by the radio frequency power detector is a DC signal or a low-frequency analog signal.
5. The wireless communication chip according to claim 1, characterized in that, The wireless communication chip receives a correction signal sent by a frequency correction instrument and corrects the frequency deviation based on the correction signal.
6. The wireless communication chip according to claim 5, characterized in that, During frequency deviation correction, multiple wireless communication chips simultaneously receive correction signals sent by the frequency correction instrument, and each wireless communication chip corrects the frequency deviation according to the received correction signal.
7. A wireless communication module, characterized in that, include: The wireless communication chip as described in any one of claims 1 to 6, and the antenna terminal connected to the wireless communication chip.
8. The wireless communication module according to claim 7, characterized in that, The antenna terminal is connected to the antenna pin of the wireless communication chip via a wire.
9. A testing method for a wireless communication module, characterized in that, Applied to the wireless communication module as described in claim 7 or 8, the method includes: Before packaging the wireless communication chip into a module, wafer probe testing and finished product testing are performed on the wireless communication chip. If all tests pass, the wireless communication chip is packaged into the wireless communication module. A connectivity test is performed on the wireless communication module, and the reliability of the wireless communication module is determined after the test is passed.
10. The testing method for a wireless communication module according to claim 9, characterized in that, The connectivity test includes: testing whether the antenna end in the wireless communication module can communicate normally with the wireless communication chip, and verifying the functionality of the general input / output ports.