Computing device

Abstract

A computing device, comprising: a housing assembly, a power supply module and a computing module, wherein the housing assembly is provided with a first coolant channel and a second coolant channel arranged along a first direction, the power supply module is arranged in the first coolant channel, the computing module is arranged in the second coolant channel, both ends of each of the first coolant channel and the second coolant channel in the first direction are communicated with the outside of the housing assembly, and the first coolant channel and the second coolant channel are isolated from each other.

Description

computing devices Technical Field

[0001] This disclosure relates to the field of computing device technology, and more specifically, to a computing device. Background Technology

[0002] The computing modules in computing devices generate a large amount of heat during operation, thus requiring heat dissipation. Air cooling is an effective method, but its low convective heat transfer coefficient limits its cooling capacity, resulting in poor heat dissipation.

[0003] In some related technologies, liquid cooling is used to replace air cooling. Although this can improve the heat dissipation effect, it also has the problem of uneven heat dissipation, resulting in an unsatisfactory heat dissipation effect. Summary of the Invention

[0004] This disclosure aims to at least solve the problem of uneven heat dissipation in liquid cooling in the prior art, which leads to unsatisfactory heat dissipation effect, and proposes a computing device.

[0005] To achieve the purpose of this disclosure, a computing device is provided, comprising: a housing assembly, a power module, and a computing module. The housing assembly has a first refrigerant channel and a second refrigerant channel disposed along a first direction. The power module is disposed within the first refrigerant channel, and the computing module is disposed within the second refrigerant channel. Each of the first refrigerant channel and the second refrigerant channel is connected to the outside of the housing assembly at both ends in the first direction, and the first refrigerant channel and the second refrigerant channel are isolated from each other.

[0006] Further, the housing assembly includes: a housing having a first end and a second end along the first direction, wherein a through channel is provided inside the housing from the first end to the second end; and a partition disposed within the channel along the first direction, wherein the partition extends to the first end and the second end of the housing at both ends in the first direction, respectively, dividing the channel into a first refrigerant channel and a second refrigerant channel that are adjacent in the third direction.

[0007] Furthermore, the housing assembly further includes: a liquid inlet plate connected to the first end of the housing, the liquid inlet plate being provided with a first liquid inlet and a second liquid inlet, the first liquid inlet communicating with the first refrigerant channel and the second liquid inlet communicating with the second refrigerant channel; and / or a liquid outlet plate connected to the second end of the housing, the liquid outlet plate being provided with a first liquid outlet and a second liquid outlet, the first liquid outlet communicating with the first refrigerant channel and the second liquid outlet communicating with the second refrigerant channel.

[0008] Further, the housing includes: a first side plate and a second side plate, which are spaced apart along a second direction; a third side plate and a fourth side plate, which are spaced apart along a third direction, each of the third side plate and the fourth side plate being connected between the first side plate and the second side plate and forming the channel, wherein the first direction, the second direction and the third direction intersect each other.

[0009] Furthermore, the partition is parallel to the third side plate and is connected to the first side plate and the second side plate respectively. The first side plate, the second side plate, the third side plate and the partition form the first refrigerant channel, and the first side plate, the second side plate, the fourth side plate and the partition form the second refrigerant channel.

[0010] Furthermore, the housing assembly further includes: a sealing cover located on one side of the housing in the second direction and connected to the first side plate, the sealing cover forming an installation cavity between the first side plate and the first side plate, the first side plate being provided with a first installation groove and a second installation groove, the first installation groove communicating with the first refrigerant channel, and the second installation groove communicating with the second refrigerant channel.

[0011] Furthermore, in the second direction, the second refrigerant channel has two opposing first sidewalls, and the computing module is connected to the first sidewalls; the first direction, the second direction, and the third direction intersect each other.

[0012] Furthermore, the computing module includes: a PCB board on which multiple heating elements are arranged, the PCB board being arranged perpendicular to the third direction, and the two ends of the PCB board in the second direction being slidably connected to the two first sidewalls respectively.

[0013] Furthermore, the plurality of heating elements are divided into multiple groups, with the heating elements in each group distributed at intervals along the second direction, and two adjacent heating elements in each group are connected in series.

[0014] Furthermore, a guide portion is provided on the first sidewall, and a sliding portion matching the guide portion is provided on the PCB board. The first sidewall and the PCB board achieve sliding engagement through the guide portion and the sliding portion.

[0015] Furthermore, the computing module includes a heat exchanger disposed on the PCB board and attached to a plurality of the heating elements, wherein the heating elements exchange heat with the refrigerant through the heat exchanger.

[0016] Furthermore, the length of the heat exchanger in the second direction is less than the length of the PCB board in the second direction, and at least one end of the heat exchanger in the second direction forms a flow space with the corresponding first sidewall.

[0017] Furthermore, the computing device further includes at least one blocking part, which is arranged in a one-to-one correspondence with the flow space, and each of the at least one blocking part is arranged in the corresponding flow space to prevent the refrigerant in the second refrigerant channel from flowing to the corresponding flow space.

[0018] Furthermore, there are multiple calculation modules, which are distributed at intervals along the third direction. Each heat exchanger forms the flow space between at least one end in the second direction and the corresponding first sidewall. There are multiple sealing parts, and each flow space is provided with a sealing part.

[0019] Furthermore, the sealing part is a strip-shaped structure extending along the first direction, and the two ends of the sealing part extend to the two ends of the first refrigerant channel, respectively.

[0020] Furthermore, the sealing portion is connected to the PCB board or the first sidewall.

[0021] Furthermore, the sealing part and the first sidewall are integrally formed.

[0022] Furthermore, the housing assembly further includes: a liquid inlet plate connected to the first end of the housing, the liquid inlet plate being provided with a first liquid inlet and a second liquid inlet, the first liquid inlet communicating with the first refrigerant channel and the second liquid inlet communicating with the second refrigerant channel; the computing device further includes: at least one sealing part disposed between the computing module and the liquid inlet plate and corresponding to the position of the flow space, the sealing part being used to seal between the flow space and the second liquid inlet to prevent liquid refrigerant entering from the second liquid inlet from flowing into the flow space.

[0023] Furthermore, the sealing part is fixedly connected to the first sidewall or the liquid inlet plate.

[0024] Furthermore, the sealing part has a first surface and a second surface, the first surface faces the corresponding flow space and contacts the side of the heat exchanger facing the second liquid inlet; the second surface faces the first sidewall and contacts the first sidewall, and the sealing part achieves the sealing of the corresponding flow space through the first surface and the second surface.

[0025] Furthermore, the first sidewall is provided with a guide portion that slides with the PCB board, and the second surface of the sealing portion is also provided with a clearance groove for avoiding the guide portion.

[0026] Furthermore, the heat exchanger forms flow spaces between its two ends in the second direction and the corresponding first sidewalls; the sealing part consists of two parts, each corresponding to one of the two flow spaces, to seal the corresponding flow spaces.

[0027] Furthermore, there are multiple computing modules, which are distributed at intervals along the third direction.

[0028] Furthermore, the sealing part is a strip-shaped structure arranged along the third direction. The sealing part corresponds to all the flow spaces at one end of all heat exchangers in the second direction. The sealing part is used to block all flow spaces to prevent the liquid refrigerant entering from the liquid inlet from flowing into any flow space.

[0029] Furthermore, the PCB board is provided with heat exchangers on both sides in the second direction. Each heat exchanger forms a flow space between its two ends in the second direction and the corresponding first sidewall. The flow spaces corresponding to one end of the two heat exchangers in the second direction are of different sizes. The sealing part has a protrusion, which corresponds to the larger flow space in the flow space of the two heat exchangers at one end in the second direction, so as to seal the larger flow space.

[0030] Furthermore, the inner wall of the first refrigerant channel is provided with a raised rib arranged along the first direction, and the raised rib contacts the outer wall of the power module so that a sliding gap is formed between the power module and the inner wall of the first refrigerant channel. Attached Figure Description

[0031] Figure 1 is an exploded view of a computing device according to an embodiment of the present disclosure;

[0032] Figure 2 is a schematic diagram of the structure of a computing device according to an embodiment of the present disclosure;

[0033] Figure 3 is a schematic diagram of the structure of the housing of a computing device according to an embodiment of the present disclosure;

[0034] Figure 4 is a schematic diagram of the structure of the computing module of a computing device according to an embodiment of the present disclosure;

[0035] Figure 5 is a schematic diagram of the distribution of heating elements in the computing module of a computing device according to an embodiment of the present disclosure;

[0036] Figure 6 is a schematic diagram of the cooperation between the computing module and the blocking part of the computing device according to an embodiment of the present disclosure;

[0037] Figure 7 is a schematic diagram of the connection relationship of the blocking part of a computing device according to an embodiment of the present disclosure;

[0038] Figure 8 is a schematic diagram of the structure of the blocking part of a computing device according to an embodiment of the present disclosure;

[0039] Figure 9 is a schematic diagram of the assembly relationship of the sealing part of the computing device according to an embodiment of the present disclosure;

[0040] Figure 10 is a schematic diagram of the cooperation between the sealing part and the liquid inlet plate of the computing device according to an embodiment of the present disclosure. Detailed Implementation

[0041] To enable those skilled in the art to better understand the technical solutions of this disclosure, the computing device provided in this disclosure will be described in detail below with reference to the accompanying drawings.

[0042] The computing modules in computing devices generate a large amount of heat during operation, thus requiring heat dissipation. Air cooling is an effective method, but its low convective heat transfer coefficient limits its cooling capacity, resulting in poor heat dissipation.

[0043] In some related technologies, liquid cooling is used to replace air cooling. Although this can improve the heat dissipation effect, it also has the problem of uneven heat dissipation, resulting in an unsatisfactory heat dissipation effect.

[0044] Research has found that liquid cooling is more sensitive to flow resistance compared to air cooling. In related technologies, computing modules in computing devices have heat sinks with multiple fins. Due to the small spacing between adjacent fins, the flow resistance is high when fluid passes between them. When using air cooling, air has low viscosity and high velocity, allowing air to flow between adjacent fins and achieving heat exchange; therefore, the problem of uneven heat exchange is not significant. However, with liquid cooling, the refrigerant is usually cooling oil, which has high viscosity and slow velocity. Therefore, the refrigerant easily flows from areas of high flow resistance to areas of low flow resistance, preventing the refrigerant from flowing between adjacent fins.

[0045] In some related technologies, since the space for placing the power module and the space for the computing module in the computing device are connected, when liquid cooling is used, more refrigerant flows to the power module and less refrigerant flows to the computing module, resulting in poor heat dissipation of the computing module.

[0046] To address the aforementioned technical problems, this disclosure proposes a computing device.

[0047] Figure 1 is an exploded view of a computing device according to an embodiment of the present disclosure, and Figure 2 is a structural schematic diagram of a computing device according to an embodiment of the present disclosure.

[0048] As shown in Figures 1 and 2, the computing device includes: housing assembly 10, power supply module 20, and computing module 30.

[0049] The housing assembly 10 has a first refrigerant channel 40 and a second refrigerant channel 50 arranged along a first direction x, a power module 20 disposed in the first refrigerant channel 40, and a computing module 30 disposed in the second refrigerant channel 50.

[0050] The first refrigerant channel 40 and the second refrigerant channel 50 are respectively connected to the outside of the housing assembly 10 at both ends in the first direction x, and the first refrigerant channel 40 and the second refrigerant channel 50 are isolated from each other to restrict the flow of liquid refrigerant in the second refrigerant channel 50 to the first refrigerant channel 40.

[0051] During use, external liquid refrigerant enters the first refrigerant channel 40 and the second refrigerant channel 50 respectively, and exchanges heat with the power module 20 and the computing module 30 respectively. Since the first refrigerant channel 40 and the second refrigerant channel 50 are isolated from each other, the refrigerant in the second refrigerant channel 50 cannot enter the first refrigerant channel 40. Therefore, it can only flow along the second refrigerant channel 50 and exchange heat with the computing module 30, ensuring that the refrigerant in the second refrigerant channel 50 exchanges heat fully with the computing module 30, thereby improving the heat exchange effect of the computing module 30.

[0052] The computing device disclosed herein isolates the first refrigerant channel 40 from the second refrigerant channel 50, preventing the refrigerant in the second refrigerant channel 50 from flowing into the first refrigerant channel 40. This ensures that the refrigerant in the second refrigerant channel 50 can only flow along the second refrigerant channel 50 and exchange heat with the computing module 30, thereby guaranteeing sufficient heat exchange between the refrigerant in the second refrigerant channel 50 and the computing module 30 and improving the heat exchange effect of the computing module 30.

[0053] As shown in Figure 1, the housing assembly 10 includes a housing 11, a partition 12, an inlet plate 13, and an outlet plate 14. The housing 11 has a first end and a second end along a first direction, and a through channel is provided inside the housing 11 from its first end to its second end. The partition 12 is disposed in the channel along the first direction, and the two ends of the partition 12 extend to the two ends of the housing 11 in the first direction, dividing the channel into a first refrigerant channel 40 and a second refrigerant channel 50 that are adjacent in a third direction. As shown in Figure 3, the second refrigerant channel 50 in the second direction has two opposing first sidewalls 51, and the calculation module 30 is connected to the first sidewalls 51.

[0054] The liquid inlet plate 13 is connected to the first end of the housing 11. The liquid inlet plate 13 is provided with a first liquid inlet 131 and a second liquid inlet 132. The first liquid inlet 131 is connected to the first refrigerant channel 40, and the second liquid inlet 132 is connected to the second refrigerant channel 50.

[0055] The liquid outlet plate 14 is connected to the second end of the housing 11. The liquid outlet plate 14 is provided with a first liquid outlet 141 and a second liquid outlet 142. The first liquid outlet 141 is connected to the first refrigerant channel 40, and the second liquid outlet 142 is connected to the second refrigerant channel 50.

[0056] During heat dissipation, liquid refrigerant enters the first refrigerant channel 40 through the first inlet 131 to exchange heat with the power module 20, and then exits from the first outlet 141; liquid refrigerant enters the second refrigerant channel 50 through the second inlet 132 to exchange heat with the computing module 30, and then exits from the second outlet 142.

[0057] It should be noted that the components and their positions of the housing assembly 10 shown in FIG. 1 are not limiting. In some other embodiments not shown in the figure, the housing assembly 10 may include: a housing 11, a partition 12, and a liquid inlet plate 13 connected to the first end of the housing 11, but excluding the liquid outlet plate; or, the housing assembly 10 may include: a housing 11, a partition 12, and a liquid outlet plate 14 connected to the second end of the housing 11, but excluding the liquid inlet plate. That is to say, without departing from the inventive concept and technical principles of this disclosure, the above situations all fall within the protection scope of this disclosure.

[0058] Figure 3 is a schematic diagram of the structure of the housing of a computing device according to an embodiment of the present disclosure.

[0059] As shown in Figure 3, the housing 11 includes a first side plate 111, a second side plate 112, a third side plate 113, and a fourth side plate 114. The first side plate 111 and the second side plate 112 are spaced apart along a second direction y that intersects with the first direction x; the third side plate 113 and the fourth side plate 114 are spaced apart along a third direction z that intersects with the first direction x and the second direction y. The third side plate 113 and the fourth side plate 114 are connected between the first side plate 111 and the second side plate 112 to form a channel.

[0060] The partition 12 is substantially parallel to the third side plate 113 and the fourth side plate 114 and is connected to the first side plate 111 and the second side plate 112 respectively. A first refrigerant channel 40 is formed between the first side plate 111, the second side plate 112, the third side plate 113 and the partition 12, and a second refrigerant channel 50 is formed between the first side plate 111, the second side plate 112, the fourth side plate 114 and the partition 12. As shown in Figure 3, the portion of the inner wall of the first side plate 111 and the second side plate 112 located within the second refrigerant channel 50 is the first side wall 51.

[0061] In this embodiment, the first side plate 111 and the second side plate 112 are substantially parallel to each other and are substantially perpendicular to the second direction y; the third side plate 113 and the fourth side plate 114 are substantially parallel to each other and are substantially perpendicular to the third direction z; the partition 12 is located between the third side plate 113 and the fourth side plate 114 and is substantially parallel to the third side plate 113 and the fourth side plate 114.

[0062] The computing device disclosed herein can form a channel extending along a first direction x by setting a first side plate 111, a second side plate 112 and a third side plate 113, and can divide the channel into an independent first refrigerant channel 40 and a second refrigerant channel 50 by connecting a partition 12 between the first side plate 111 and the second side plate 112, thereby preventing refrigerant in the second refrigerant channel 50 from flowing into the first refrigerant channel 40, thereby improving the heat exchange efficiency of the computing module 30.

[0063] Figure 4 is a schematic diagram of the structure of the computing module of the computing device according to an embodiment of the present disclosure, and Figure 5 is a schematic diagram of the distribution of heating elements of the computing module of the computing device according to an embodiment of the present disclosure.

[0064] As shown in Figures 4 and 5, the calculation module 30 includes: a PCB board 31, a heat exchanger 32, electrode plates 33, and heating elements 35. Multiple heating elements 35 are arranged on the PCB board 31. The PCB board 31 is perpendicular to the third direction z, and has a first end and a second end in the second direction y. The first end of the PCB board 31 is slidably connected to the first sidewall 51 of the first side plate 111, and the second end of the PCB board 31 is slidably connected to the first sidewall 51 of the second side plate 112.

[0065] As shown in Figure 5, all heating elements 35 are divided into multiple groups, with each group having multiple heating elements 35. The multiple heating elements 35 in each group are spaced apart along the second direction y, and adjacent heating elements 35 in each group are connected in series. For example, in this embodiment, the heating element 35 is a chip used for calculation. For example, all heating elements 35 are divided into 6 groups, with each group having 20 heating elements 35. The 20 heating elements 35 in each group are spaced apart along the second direction y, that is, the 20 heating elements 35 in each group are spaced apart from the first end to the second end of the PCB board 31, thus perpendicular to the setting direction of the second refrigerant channel 50. The multiple groups of heating elements 35 are spaced apart along the first direction x, and adjacent groups of heating elements can be connected in series or in parallel.

[0066] It should be noted that in this embodiment, the PCB board 31 is rectangular, but this is not limiting. In some other embodiments not shown in the figures, the PCB board can also be an irregular shape. Without departing from the inventive concept and technical principles of this disclosure, the above situations all fall within the protection scope of this disclosure.

[0067] The electrode 33 is connected to the first end of the PCB board 31 for connection with the power module 20, as shown in Figure 5. In this embodiment, there are two electrode 33s, one of which is a positive electrode and the other is a negative electrode. Multiple heating elements 35 in each group are distributed at intervals from the position close to the electrode 33 to the direction away from the electrode 33. The first heating element 35 in each group is electrically connected to the positive electrode, and the last heating element 35 in the same group is electrically connected to the negative electrode.

[0068] Furthermore, a guide portion 52 is provided on the first sidewall 51 (see Figure 3), and a sliding portion 34 matching the guide portion 52 is provided on the PCB board 31. The first sidewall 51 and the PCB board 31 achieve sliding engagement through the guide portion 52 and the sliding portion 34.

[0069] For example, as shown in Figures 3 and 4, the guide portion 52 is a guide rail provided on the first sidewall 51, and the sliding portion 34 is a guide groove provided at both ends of the PCB board 31. Both the guide rail and the guide groove are provided along the first direction x. In use, the guide groove at the first end of the PCB board 31 is aligned with the guide rail on the first sidewall 111 and the guide rail is inserted into the guide groove. The guide groove at the second end of the PCB board 31 is aligned with the guide rail on the second sidewall 112 and the guide rail is inserted into the guide groove. Then, the PCB board 31 is pushed along the first direction to push it into the first refrigerant channel 40 to complete the assembly.

[0070] It should be noted that in this embodiment, the guide portion 52 is a guide rail and the sliding portion 34 is a guide groove. However, this is not limiting. In some other embodiments not shown in the figure, the guide portion 52 can be a guide groove and the sliding portion 34 can be a guide rail. Any structure that can achieve a sliding fit is within the protection scope of this disclosure.

[0071] The heat exchanger 32 is mounted on the PCB board 31 and is attached to multiple heating elements 35. The heating elements 35 exchange heat with the refrigerant through the heat exchanger 32.

[0072] Furthermore, the length of the heat exchanger 32 in the second direction y is less than the length of the PCB board 31, and at least one end of the heat exchanger 32 in the second direction y forms a flow space 60 between it and the corresponding first sidewall 51.

[0073] For example, in conjunction with the embodiments shown in Figures 3 and 4, the heat exchanger 32 has a first end and a second end in a second direction. The first end of the heat exchanger 32 is close to the first end of the PCB board 31 and corresponds to the first sidewall 51 of the first side plate 111. The second end of the heat exchanger 32 is close to the second end of the PCB board 31 and corresponds to the first sidewall 51 of the second side plate 112.

[0074] A power module 20 is disposed within a first refrigerant channel 40. The power module 20 has a first end and a second end in the second direction y. The first end of the power module 20 is near the first side plate 111, and the second end is near the second side plate 112. The first end of the power module 20 extends through the first mounting groove 1111 to the outside of the first refrigerant channel 40. An electrode is provided at the first end of the power module 20, and the electrode is electrically connected to the electrode plate 33 of the PCB board 31 via a copper busbar. The first side plate 111 has a first mounting groove 1111 and a second mounting groove 1112. The first mounting groove 1111 communicates with the first refrigerant channel 40, and the second mounting groove 1112 communicates with the second refrigerant channel 50. The electrode plate 33 extends through the second mounting groove 1112 to the outside of the first side plate 111 for electrical connection with the power module 20.

[0075] As shown in Figure 4, the length of the heat exchanger 32 in the second direction y is less than the length of the PCB board 31 in the second direction y. That is to say, the two ends of the heat exchanger 32 in the second direction y are not aligned with the two ends of the PCB board 31 in the second direction y. Therefore, when the two ends of the PCB board 31 in the second direction y are connected to the two first sidewalls 51, a flow space 60 will be formed in the second direction between the first end of the heat exchanger 32 and the first sidewall 51 of the first side plate 111, and between the second end of the heat exchanger 32 and the first sidewall 51 of the second side plate 112.

[0076] Since the gap between the flow space 60 and the fins of the heat exchanger 32 is much larger and the flow resistance is much smaller, the refrigerant will also flow to the flow space 60 with relatively smaller flow resistance after entering the second refrigerant channel 50. This may reduce the amount of refrigerant flowing to the fins of the heat exchanger 32, thus affecting the heat exchange efficiency of the radiator.

[0077] Figure 6 is a schematic diagram of the cooperation between the computing module and the blocking part of the computing device according to an embodiment of the present disclosure, and Figure 7 is a schematic diagram of the connection relationship of the blocking part of the computing device according to an embodiment of the present disclosure.

[0078] To address the issue of the flow space 60 affecting the heat exchanger efficiency, as shown in Figures 6 and 7, the computing device further includes at least one blocking part 70, which is arranged one-to-one with the flow space 60. The blocking part 70 is disposed within the corresponding flow space 60 to prevent the refrigerant in the second refrigerant channel 50 from flowing into the corresponding flow space 60. By providing the blocking part 70 within the flow space 60, the computing device of this disclosure can completely fill the flow space 60, thus preventing the liquid refrigerant from flowing into the flow space 60 and allowing it to flow only to the fins of the heat exchanger 32, thereby improving the heat exchange efficiency between the liquid refrigerant and the heat exchanger 32.

[0079] In the embodiment shown in Figure 6, the sealing part 70 is a strip-shaped structure extending along the first direction x, with both ends of the sealing part 70 extending to both ends of the first refrigerant channel 40. Preferably, the two ends of the sealing part 70 can abut against the inlet plate 13 and the outlet plate 14 respectively, so that the refrigerant can flow directly to the heat exchanger 32 after entering the second refrigerant channel 50, avoiding the liquid refrigerant from flowing into the gaps between the two ends of the sealing part 70 and the inlet plate 13 and the outlet plate 14 respectively, thereby avoiding the generation of eddies, which is more conducive to the flow of refrigerant and improves the heat exchange effect.

[0080] For example, there are two heat exchangers 32, located on both sides of the PCB board 31 respectively. Each heat exchanger 32 forms a flow space 60 with the two first sidewalls 51 at both ends in the second direction y. That is, as shown in FIG4, there are four flow spaces 60, and as shown in FIG6, there are also four corresponding sealing parts 70, each sealing part 70 located within one flow space 60. However, it should be noted that although a heat exchanger 32 is provided on each side of the PCB board 31 in this embodiment, this is not limiting. In some other embodiments not shown in the figures, the PCB board 31 may only have a heat exchanger 32 on one side.

[0081] It should also be noted that in the embodiment shown in FIG. 6, the sealing part 70 is connected to the PCB board 31. However, this is not limiting; the sealing part 70 can also be connected to the first side wall 51. For example, as shown in FIG. 7, the sealing part 70 and the first side wall 51 are integrally formed. That is, the sealing part 70 is integrally formed with the first side plate 111 and the second side plate 112 respectively. This method simplifies the assembly steps and increases the strength of the housing 11.

[0082] As can be understood, as shown in Figure 1, there can be multiple calculation modules 30, which are distributed at intervals along the third direction z. Each heat exchanger 32 forms a flow space 60 with at least one first sidewall 51. There are multiple sealing parts 70, and each flow space 60 is provided with a sealing part 70.

[0083] Figure 8 is a structural schematic diagram of the blocking part of the computing device according to an embodiment of the present disclosure, and Figure 9 is a schematic diagram of the assembly relationship of the blocking part of the computing device according to an embodiment of the present disclosure.

[0084] The computing device shown in Figures 8 and 9 has a structure that is basically the same as that of the above embodiment, except that the location and structure of the blocking part 70 are different.

[0085] As shown in Figures 8 and 9, the blocking part 70 is disposed between the calculation module 30 and the liquid inlet plate 13 and corresponds to the position of the flow space 60. The blocking part 70 is used to block the flow space 60 and the second liquid inlet 132 to prevent the liquid refrigerant entering from the second liquid inlet 132 from flowing into the flow space 60.

[0086] For example, as shown in FIG8, the sealing part 70 has a first surface 71 and a second surface 72. The first surface 71 faces the corresponding flow space 60 and contacts the side of the heat exchanger 32 facing the second liquid inlet 132. The second surface 72 faces the first sidewall 51 and contacts the first sidewall 51. The sealing part 70 seals the corresponding flow space 60 through the first surface 71 and the second surface 72. That is, as shown in FIG8, the first surface 71 is set perpendicular to the first direction x, and the second surface 72 is set perpendicular to the second direction y. By having the first surface 71 contact the side of the heat exchanger 32 facing the second liquid inlet 132 and the second surface 72 contact the first sidewall 51, it is equivalent to sealing one end of the flow space 60, thereby effectively preventing the refrigerant from entering the flow space 60, so that more refrigerant flows to the fins of the heat exchanger 32, improving the heat exchange efficiency.

[0087] As shown in Figures 3 and 4, the heat exchanger 32 forms flow spaces 60 between its two ends in the second direction and the corresponding first sidewalls 51; there are two sealing parts 70, which correspond to the two flow spaces 60 respectively, to seal the corresponding flow spaces 60.

[0088] For example, the heat exchanger 32 has a first end and a second end in the second direction y. The first end of the heat exchanger 32 corresponds to the first sidewall 51 of the first side plate 111 and forms a flow space 60. The second end of the heat exchanger 32 corresponds to the first sidewall 51 of the second side plate 112 and forms a flow space 60. Two sealing parts 70 are respectively provided at the first end and the second end of the heat exchanger 32, and each sealing part 70 corresponds to one flow space 60, thereby sealing the two flow spaces 60 and preventing the refrigerant from entering the corresponding flow space 60. Therefore, more liquid refrigerant enters the fins of the heat exchanger 32.

[0089] It should be noted that in this embodiment, the heat exchanger 32 forms a flow space 60 between its two ends in the second direction and the corresponding first sidewall 51. However, this is not limiting. In some other embodiments not shown in the figure, one end of the heat exchanger 32 may form a flow space 60 with the corresponding first sidewall, and the corresponding sealing part 70 may also be one, which is also within the protection scope of this disclosure.

[0090] There are multiple calculation modules 30, which are distributed at intervals along the third direction z. The blocking parts 70 are all strip-shaped structures arranged along the third direction. The blocking parts 70 correspond to all the flow spaces 60 at one end of all heat exchangers 32 in the second direction y. The blocking parts 70 are used to block all flow spaces 60 to prevent the liquid refrigerant entering from the liquid inlet from flowing into any flow space 60.

[0091] For example, there can be three calculation modules 30, and the first and second ends of the heat exchangers 32 on each calculation module 30 respectively form flow spaces 60 with the corresponding first sidewalls 51. By setting the sealing part 70 as a strip structure and extending the sealing part 70 along the third direction z, the sealing part 70 located at the first end of the heat exchanger can block the flow spaces 60 of all the first ends of the heat exchangers 32, and the sealing part 70 located at the second end of the heat exchanger can block the flow spaces 60 of all the second ends of the heat exchangers 32, thereby preventing the refrigerant from entering any flow space 60. Moreover, the assembly is convenient, the sealing part structure is simple, and it is easy to maintain and replace.

[0092] Furthermore, heat exchangers 32 are respectively provided on both sides of the PCB board 31 in the third direction z. Each heat exchanger 32 forms a flow space 60 between its two ends in the second direction y and the corresponding first sidewall 51. In the second direction y, the flow spaces 60 corresponding to one end of the two heat exchangers 32 in the second direction y are of different sizes. The sealing part 70 has a protrusion 731, which corresponds to the larger flow space 60 of the two heat exchangers 32 in the second direction y, so as to seal the larger flow space 60.

[0093] For example, as shown in Figure 4, the heat exchanger 32 includes a first heat exchanger 321 and a second heat exchanger 322. The first heat exchanger 321 and the second heat exchanger 322 are respectively connected to the two sides of the same PCB board 31 in the third direction z. The first end and the second end of the first heat exchanger 321 form a flow space 60 with the corresponding first sidewall 51. Similarly, the first end and the second end of the second heat exchanger 322 form a flow space 60 with the corresponding first sidewall 51. As can be seen from Figure 4, the two ends of the first heat exchanger 321 and the two ends of the second heat exchanger 322 are staggered. That is, the flow space 60 corresponding to the first end of the first heat exchanger 321 on the right side of Figure 4 is smaller than the flow space 60 corresponding to the first end of the second heat exchanger 322 on the right side of Figure 4. Correspondingly, the flow space 60 corresponding to the second end of the first heat exchanger 321 on the left side of Figure 4 is larger than the flow space 60 corresponding to the second end of the second heat exchanger 322 on the left side of Figure 4. Since the flow space 60 at the same end is of different sizes, if the first surface 71 is smaller, it cannot block the larger flow space 60. Conversely, if the first surface 71 is larger, it will block part of the fins at the first end of the first heat exchanger 321, thus affecting the heat exchange effect.

[0094] In this embodiment, as shown in FIG8, the sealing part 70 has a second surface 72 and a third surface 73 arranged opposite to each other in the second direction y. The first surface 71 is connected between the second surface 72 and the third surface 73. A protrusion 731 is provided on the third surface 73. By providing the protrusion 731, the area of ​​the corresponding position of the first surface 71 can be increased. Therefore, the position of the protrusion 731 corresponds to the larger flow space 60 at the first end of the second heat exchanger 322, avoiding the smaller flow space 60 at the first end of the first heat exchanger 321. This can achieve the sealing of the larger flow space 60, avoid the obstruction of the fins at the first end of the first heat exchanger 321, and ensure heat exchange efficiency.

[0095] As shown in Figure 9, the second surface 72 of the sealing part 70 is also provided with a clearance groove 721 for avoiding the guide part 52. By providing the clearance groove 721, the guide part 52 can be avoided, so that the second surface 72 can better fit with the first sidewall 51.

[0096] It is understood that in the embodiment shown in FIG9, the sealing part 70 is connected to the first sidewall 51, but this is not limiting. FIG10 is a schematic diagram of the cooperation between the sealing part and the liquid inlet plate of the computing device according to an embodiment of the present disclosure. As shown in FIG10, the sealing part 70 can also be fixedly connected to the liquid inlet plate 13.

[0097] As shown in Figure 3, a raised rib 41 is provided on the inner wall of the first refrigerant channel 40 along a first direction. The raised rib 41 contacts the outer wall of the power module 20 to form a sliding gap between the power module 20 and the inner wall of the first refrigerant channel 40. By providing the raised rib 41, the contact area between the outer wall of the power module 20 and the outer wall of the first refrigerant channel 40 can be reduced, thereby reducing friction and allowing the power module 20 to slide into or out of the first refrigerant channel 40 more easily during assembly.

[0098] As shown in Figure 1, the housing assembly 10 further includes a sealing cover 15. The sealing cover 15 is located on one side of the housing 11 in the second direction and is connected to the first side plate 111. A mounting cavity is formed between the sealing cover 15 and the first side plate 111. A copper busbar 80 and a control circuit board 90 are disposed in the mounting cavity. The first side plate 111 is provided with a first mounting groove 1111 and a second mounting groove 1112. The first mounting groove 1111 communicates with the first refrigerant channel 40, and the second mounting groove 1112 communicates with the second refrigerant channel 50. By installing the sealing cover 15, the electrical connection area where the copper busbar 80 and the control circuit board 90 are located is sealed, reducing the entry of liquid refrigerant into the mounting cavity and ensuring the heat dissipation effect of the entire unit.

[0099] It should be noted that the sealing part of this disclosure can be made of materials such as polypropylene, ABS resin (acrylonitrile-styrene-butadiene copolymer, ABS is an abbreviation for Acrylonitrile Butadiene Styrene), rubber, polyethylene foam, or metal.

[0100] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A computing device, comprising: The housing assembly (10), power module (20), and computing module (30) The housing assembly (10) has a first refrigerant channel (40) and a second refrigerant channel (50) arranged along a first direction. The power module (20) is disposed within the first refrigerant channel (40), and the computing module (30) is disposed within the second refrigerant channel (50). Each of the first refrigerant channel (40) and the second refrigerant channel (50) is connected to the outside of the housing assembly (10) at both ends in the first direction, and the first refrigerant channel (40) and the second refrigerant channel (50) are isolated from each other.

2. The computing device according to claim 1, wherein, The housing assembly (10) includes: A housing (11) having a first end and a second end along the first direction, wherein a through channel is provided inside the housing (11) from the first end to the second end; A partition (12) is disposed in the channel along the first direction, the two ends of the partition (12) extending to the first end and the second end of the housing (11) respectively in the first direction, dividing the channel into a first refrigerant channel (40) and a second refrigerant channel (50) that are adjacent in the third direction.

3. The computing device according to claim 2, wherein, The housing assembly (10) further includes: A liquid inlet plate (13) is connected to the first end of the housing (11). The liquid inlet plate (13) is provided with a first liquid inlet (131) and a second liquid inlet (132). The first liquid inlet (131) is connected to the first refrigerant channel (40), and the second liquid inlet (132) is connected to the second refrigerant channel (50); and / or A liquid outlet plate (14) is connected to the second end of the housing (11). The liquid outlet plate (14) is provided with a first liquid outlet (141) and a second liquid outlet (142). The first liquid outlet (141) is connected to the first refrigerant channel (40), and the second liquid outlet (142) is connected to the second refrigerant channel (50).

4. The computing device according to claim 2, wherein, The housing (11) includes: The first side plate (111) and the second side plate (112) are spaced apart along the second direction; The third side plate (113) and the fourth side plate (114) are spaced apart along a third direction. Each of the third side plate (113) and the fourth side plate (114) is connected between the first side plate (111) and the second side plate (112) and forms the channel. The first direction, the second direction and the third direction intersect each other.

5. The computing device according to claim 4, wherein, The partition (12) is parallel to the third side plate (113) and is connected to the first side plate (111) and the second side plate (112) respectively. The first side plate (111), the second side plate (112), the third side plate (113) and the partition (12) form the first refrigerant channel (40). The second refrigerant channel (50) is formed between the first side plate (111), the second side plate (112), the fourth side plate (114) and the partition (12).

6. The computing device according to claim 4, wherein, The housing assembly (10) further includes: A sealing cover (15) is located on one side of the housing (11) in the second direction and is connected to the first side plate (111). The sealing cover (15) and the first side plate (111) form an installation cavity. The first side plate (111) is provided with a first installation groove (1111) and a second installation groove (1112). The first installation groove (1111) is connected to the first refrigerant channel (40), and the second installation groove (1112) is connected to the second refrigerant channel (50).

7. The computing device according to claim 2, wherein, In the second direction, the second refrigerant channel (50) has two opposing first sidewalls (51), and the computing module (30) is connected to the first sidewalls (51); the first direction, the second direction, and the third direction intersect each other.

8. The computing device according to claim 7, wherein, The computing module (30) includes: A PCB board (31) is provided on which multiple heating elements (35) are arranged. The PCB board (31) is arranged perpendicular to the third direction. The two ends of the PCB board (31) in the second direction are slidably connected to the two first sidewalls (51) respectively.

9. The computing device according to claim 8, wherein, The plurality of heating elements (35) are divided into multiple groups, and the heating elements (35) in each group are distributed at intervals along the second direction, and two adjacent heating elements (35) in each group are connected in series.

10. The computing device according to claim 8, wherein, A guide portion (52) is provided on the first sidewall (51), and a sliding portion (34) matching the guide portion (52) is provided on the PCB board (31). The first sidewall (51) and the PCB board (31) achieve sliding engagement through the guide portion (52) and the sliding portion (34).

11. The computing device according to claim 8, wherein, The computing module (30) includes: A heat exchanger (32) is disposed on the PCB board (31) and attached to a plurality of the heating elements (35), the heating elements (35) exchanging heat with the refrigerant through the heat exchanger (32).

12. The computing device according to claim 11, wherein, The length of the heat exchanger (32) in the second direction is less than the length of the PCB board (31) in the second direction, and at least one end of the heat exchanger (32) in the second direction forms a flow space (60) with the corresponding first sidewall (51).

13. The computing device according to claim 12, wherein, The computing device also includes: At least one blocking part (70) is provided in a one-to-one correspondence with the flow space (60), and each of the at least one blocking part (70) is provided in the corresponding flow space (60) to prevent the refrigerant in the second refrigerant channel (50) from flowing to the corresponding flow space (60).

14. The computing device according to claim 13, wherein, The calculation modules (30) are multiple, and the multiple calculation modules (30) are distributed at intervals along the third direction. Each heat exchanger (32) forms the flow space (60) between at least one end in the second direction and the corresponding first sidewall (51). There are multiple blocking parts (70), and one blocking part (70) is provided in each flow space (60).

15. The computing device according to claim 13, wherein, The sealing part (70) is a strip-shaped structure extending along the first direction, and the two ends of the sealing part (70) extend to the two ends of the first refrigerant channel (40).

16. The computing device according to claim 13, wherein, The sealing part (70) is connected to the PCB board (31) or the first sidewall (51).

17. The computing device according to claim 13, wherein, The sealing part (70) and the first sidewall (51) are integrally formed.

18. The computing device according to claim 12, wherein, The housing assembly (10) further includes: a liquid inlet plate (13) connected to the first end of the housing (11), the liquid inlet plate (13) being provided with a first liquid inlet (131) and a second liquid inlet (132), the first liquid inlet (131) being connected to the first refrigerant channel (40), and the second liquid inlet (132) being connected to the second refrigerant channel (50); The computing device further includes at least one sealing part (70), which is disposed between the computing module (30) and the liquid inlet plate (13) and corresponds to the position of the flow space (60). The sealing part (70) is used to seal between the flow space (60) and the second liquid inlet (132) to prevent liquid refrigerant entering from the second liquid inlet (132) from flowing to the flow space (60).

19. The computing device according to claim 18, wherein, The sealing part (70) is fixedly connected to the first side wall (51) or the liquid inlet plate (13).

20. The computing device according to claim 18, wherein, The sealing part (70) has a first surface (71) and a second surface (72). The first surface (71) faces the corresponding flow space (60) and contacts the side of the heat exchanger (32) facing the second liquid inlet (132). The second surface (72) faces the first sidewall (51) and contacts the first sidewall (51). The sealing part (70) seals the corresponding flow space (60) through the first surface (71) and the second surface (72).

21. The computing device according to claim 20, wherein, The first sidewall (51) is provided with a guide portion (52) that slides with the PCB board (31), and the second surface (72) of the sealing portion (70) is also provided with a relief groove (721) for avoiding the guide portion (52).

22. The computing device according to claim 20, wherein, The heat exchanger (32) forms the flow space (60) between its two ends in the second direction and the corresponding first sidewall (51); The blocking part (70) is two and corresponds to the two flow spaces (60) respectively, so as to block the corresponding flow space (60).

23. The computing device according to claim 22, wherein, There are multiple computing modules (30), and the multiple computing modules (30) are distributed at intervals along the third direction.

24. The computing device according to claim 23, wherein, The sealing part (70) is a strip structure arranged along the third direction. The sealing part (70) corresponds to all the flow spaces (60) at one end of all heat exchangers (32) in the second direction. The sealing part (70) is used to seal all the flow spaces (60) to prevent the liquid refrigerant entering from the liquid inlet from flowing to any flow space (60).

25. The computing device according to claim 24, wherein, The PCB board (31) is provided with heat exchangers (32) on both sides of the third direction. Each heat exchanger (32) forms a flow space (60) between its two ends in the second direction and the corresponding first sidewall (51). The flow spaces (60) corresponding to one end of the two heat exchangers (32) in the second direction are different in size. The sealing portion (70) has a protrusion (731) corresponding to the larger of the flow spaces (60) located at one end of the two heat exchangers (32) in the second direction, to seal the larger flow space (60).

26. The computing device according to claim 1, wherein, The inner wall of the first refrigerant channel (40) is provided with a rib (41) arranged along the first direction. The rib (41) contacts the outer wall of the power module (20) so that a sliding gap is formed between the power module (20) and the inner wall of the first refrigerant channel (40).

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