Laser processing device, processing program generation device, laser processing method, and processing program generation program

Abstract

The present invention comprises: a laser oscillator (12) that emits laser light (L); a processing head (14) that irradiates a workpiece (50) with the laser light (L); a drive device (20) that is capable of driving the processing head (14) in the directions of three mutually orthogonal axes; and an axis movement control unit (32) that controls the operation of the drive device (20) and moves the position of the processing head (14) in accordance with a processing program for irradiating the workpiece (50) with the laser light (L) to process the workpiece (50). During laser processing, the axis movement control unit (32) controls the drive device (20) and moves the processing head (14) so that a processing path, which is a movement path of the processing head (14) with respect to the workpiece (50), becomes a spiral processing path.

Description

Laser processing apparatus, processing program generation apparatus, laser processing method, and processing program generation program

[0001] This disclosure relates to a laser processing apparatus, a processing program generation apparatus, a laser processing method, and a processing program generation program for cutting a plate-shaped or tubular workpiece by irradiating it with a laser beam.

[0002] Patent Document 1 discloses a countersinking technique comprising: multiple separation steps to generate a cutting gap along a cutting line that partially follows the contour of a workpiece member to be manufactured from a workpiece; and at least one post-processing step to post-process the workpiece along at least a portion of the cutting gap while the workpiece member is not completely cut out. In the separation steps, the processing beam has a first power density calculated to separate the workpiece. The separation steps partially cut out the workpiece member, which is subsequently connected to the remaining workpiece via one or more joints. In one example, the post-processing steps are performed multiple times by irradiating the same portion of the cutting gap with a processing beam having a second power density calculated not to separate the workpiece. In this case, at least two post-processing steps may be performed so as to have at least one of different post-processing lines and different processing beam power densities. In other examples, the post-processing steps may be performed multiple times to post-process the workpiece, or they may be performed only along the portion of the cutting gap created by the immediately preceding separation step.

[0003] Special Publication No. 2022-523275

[0004] However, in the conventional dish sawing processing technology using a processing beam, an operation including a separation procedure for generating a cutting gap with a processing beam having a first output density calculated to separate the workpiece and a plurality of post-processing procedures with a processing beam having a second output density calculated not to separate the workpiece is required. For this reason, it becomes necessary to leave a joint for connecting the workpiece member to the residual workpiece, and it becomes necessary to perform a removal operation of the workpiece member from the residual workpiece. Then, there is a problem that working time is required for removing the joint, which leads to an increase in the tact time.

[0005] On the other hand, in the conventional dish sawing processing technology using a processing beam, it is necessary to check the sequential processing in order to obtain a desired dish hole angle, which also leads to an increase in the tact time. The same problem also existed when performing drilling on a plate-shaped or tubular workpiece using the conventional technology.

[0006] The present disclosure has been made in view of the above, and an object thereof is to obtain a laser processing apparatus capable of shortening the tact time as compared with the conventional in the drilling of a workpiece.

[0007] In order to solve the above-described problems and achieve the object, the present disclosure includes a laser oscillator that emits laser light, a processing head that irradiates the workpiece with the laser light, a driving device that can drive the processing head in each direction of three axes orthogonal to each other, and an axis movement control unit that controls the operation of the driving device and moves the position of the processing head according to a processing program for processing the workpiece by irradiating the workpiece with the laser light. The axis movement control unit controls the driving device to move the processing head so that the processing path, which is the movement path of the processing head with respect to the workpiece during laser processing, becomes a spiral processing path.

[0008] The laser processing apparatus according to the present disclosure has an effect of being able to shorten the tact time as compared with the conventional in the drilling of a workpiece.

[0009] Figure schematically showing an example of the configuration of a laser processing apparatus according to Embodiment 1 Figure showing an example of the drive mechanism of the processing head in a laser processing apparatus according to Embodiment 1 Figure showing an example of the drive mechanism of the processing head in a laser processing apparatus according to Embodiment 1 Figure showing an example of the drive mechanism of the processing head in a laser processing apparatus according to Embodiment 1 Figure for explaining a joint in laser cutting processing using conventional technology Figure for explaining countersinking processing using conventional technology, a cross-sectional view VII-VII of Figure 6 Figure showing an example of the processing path in countersinking processing in a laser processing apparatus according to Embodiment 1 Figure showing an example of the processing path in countersinking processing in a laser processing apparatus according to Embodiment 1 Figure showing an example of the processing path of the processing head in countersinking in the laser processing apparatus according to Embodiment 1. Figure showing an example of the processing path of the processing head in countersinking in the laser processing apparatus according to Embodiment 1. Figure showing an example of the configuration of the processing program generation device used in the laser processing apparatus according to Embodiment 1. Figure showing an example of processing condition information. Figure showing the types of countersink shapes. Flowchart showing an example of the procedure of the laser processing method according to Embodiment 1. Flowchart showing an example of the procedure of the laser processing method according to Embodiment 1. Block diagram showing an example of the configuration of the computer system that realizes the control device of the laser processing apparatus according to Embodiment 1. Figure comparing the process of countersinking by the laser processing method according to Embodiment 1 with countersinking by conventional technology.

[0010] The laser processing apparatus, processing program generation apparatus, laser processing method, and processing program generation program according to embodiments of this disclosure will be described in detail below with reference to the drawings.

[0011] Embodiment 1. Figure 1 is a schematic diagram showing an example of the configuration of a laser processing apparatus according to Embodiment 1. In Figure 1, the X-axis, Y-axis, and Z-axis are three axes perpendicular to each other. In one example, the X-axis and Y-axis are two axes in the horizontal direction that are perpendicular to each other. The Z-axis is a vertical axis. For each of the X-axis, Y-axis, and Z-axis, the direction indicated by the arrow is considered the positive direction, and the direction opposite to the arrow is considered the negative direction.

[0012] The laser processing apparatus 1 comprises a table 11, a laser oscillator 12, a fiber optic cable 13, a processing head 14, a processing nozzle 15, a processing gas supply unit 16, gas piping 17, a drive shaft 18, a motor 19, and a control device 30.

[0013] The table 11 is used to place a plate-shaped or tubular workpiece 50. The table 11 may also have a function to fix the workpiece 50 in place. An example of a workpiece 50 is a steel plate.

[0014] The laser oscillator 12 emits laser light L. The laser oscillator 12 is a light source that emits laser light L, such as a solid-state laser, gas laser, or semiconductor laser. The laser light L may be a continuous wave or a pulsed wave.

[0015] The fiber cable 13 propagates the laser light L emitted from the laser oscillator 12 to the processing head 14.

[0016] The processing head 14 irradiates the workpiece 50 with laser light L that has propagated through the fiber cable 13. Although not shown in the figure, the processing head 14 has a collimating optical system for parallelizing the laser light L and a focusing lens for focusing the laser light L. The position where the laser light L from the processing head 14 enters the workpiece 50 is called the processing point P. The processing point P is the position on the workpiece 50 where processing is being performed.

[0017] The processing nozzle 15 is located at the end of the processing head 14 on the table 11 side and sprays assist gas G onto the workpiece 50 when the laser beam L is irradiated onto the workpiece 50. In one example, the processing nozzle 15 has an injection port that sprays assist gas G so as to surround the laser beam L emission position of the processing head 14. In this example, a flow path 141 is provided inside the processing head 14 to guide the assist gas G to the processing nozzle 15. The assist gas G is used to remove molten material during processing and cool the workpiece 50 in the area including the processing point P of the workpiece 50, as well as to suppress oxidation of the workpiece 50 or to prevent oxidation of the workpiece 50. The type of gas used for the assist gas G is selected according to the purpose of use. When the purpose is to suppress oxidation of the workpiece 50, oxygen, air, or nitrogen is used as the assist gas G.

[0018] The processing gas supply unit 16 supplies assist gas G to the processing nozzle 15 via the gas piping 17. The processing gas supply unit 16 is a valve. The gas piping 17 is connected between the processing gas supply unit 16 and the processing head 14 so that the assist gas G from the processing gas supply unit 16 is ejected from the processing nozzle 15.

[0019] The drive shafts 18 are connected directly or indirectly to the machining head 14. In this example, although not shown, there are three drive shafts 18 parallel to the X, Y, and Z axes, respectively. Each drive shaft 18 is connected to a motor 19 and transmits power from the motor 19 directly or indirectly to the machining head 14.

[0020] Motor 19 is a servo motor and drives the drive shaft 18, which is the machining axis. In this example, although not shown, an X-axis motor, a Y-axis motor, and a Z-axis motor are connected to each of the three drive shafts 18, which are parallel to the X-axis, Y-axis, and Z-axis, respectively. This makes it possible to move the machining head 14 attached to the drive shaft 18 in the XY plane or in XYZ space. The drive shaft 18 and motor 19 constitute a drive device 20 that can drive the machining head 14 in each of the three mutually orthogonal axes.

[0021] Figures 2 to 4 show an example of a drive mechanism for a processing head in a laser processing apparatus according to Embodiment 1. Figure 2 is a top view of the drive mechanism for the processing head 14, Figure 3 is a side view of the drive mechanism for the processing head 14, and Figure 4 is a front view of the drive mechanism for the processing head 14. Here, as shown in Figure 4, the front view is defined as the state in which the processing head 14 is positioned on the front side of the paper in the YZ plane. The drive mechanism for the processing head 14 includes an X-axis drive unit 20X, a Y-axis drive unit 20Y, and a Z-axis drive unit 20Z. The processing head 14 is fixed to the Z-axis drive unit 20Z. The Z-axis drive unit 20Z is a device capable of driving the processing head 14 in the Z-axis direction and includes a drive shaft parallel to the Z-axis (not shown) and a Z-axis motor connected to this drive shaft. The Z-axis drive unit 20Z is supported by the Y-axis drive unit 20Y. The Y-axis drive unit 20Y is a device capable of driving the Z-axis drive unit 20Z in the Y-axis direction, and includes a drive shaft parallel to the Y-axis (not shown) and a Y-axis motor connected to this drive shaft. The Y-axis drive unit 20Y is supported by the X-axis drive unit 20X. The X-axis drive unit 20X is a device capable of driving the Y-axis drive unit 20Y in the X-axis direction, and includes a drive shaft parallel to the X-axis (not shown) and an X-axis motor connected to this drive shaft.

[0022] Returning to Figure 1, the control device 30 includes a device control unit 31, an axis movement control unit 32, and a machining program generation device 33.

[0023] The device control unit 31 controls the operation of the laser oscillator 12 and the processing gas supply unit 16 according to the processing program generated by the processing program generation device 33. The processing program is a computer program that processes the workpiece 50 by irradiating it with laser light L. The device control unit 31 generates a laser output command according to the processing program and controls the laser oscillator 12 based on the laser output command. As a result, the laser light L with the output based on the laser output command is output at the timing based on the laser output command. The device control unit 31 generates a gas supply command according to the processing program and controls the processing gas supply unit 16 based on the gas supply command. As a result, assist gas G of the gas type and flow rate based on the gas supply command is supplied.

[0024] The axis movement control unit 32 controls the operation of the drive unit 20 to move the position of the machining head 14 according to the machining program generated by the machining program generation device 33. The axis movement control unit 32 generates axis commands according to the machining program and controls the motors 19 based on the axis commands. The axis movement control unit 32 controls the driving of the motors 19 connected to the drive shafts 18 of the X, Y, and Z axes based on the axis commands, thereby driving the drive shafts 18 and moving the machining head 14. In Embodiment 1, the axis movement control unit 32 controls the motors 19 of the X, Y, and Z axes so that the machining head 14 moves in a spiral motion.

[0025] The machining program generation device 33 obtains appropriate machining conditions from the stored machining conditions based on the machining input information, which is information about countersinking or countersinking, input by the operator of the laser machining device 1, and generates a machining program that moves the machining head 14 according to the obtained machining conditions. Details of the configuration of the machining program generation device 33 will be described later.

[0026] A laser processing apparatus 1 having such a configuration has the function of performing laser cutting of a plate-shaped or tubular workpiece 50 by irradiating the workpiece 50 with a continuous wave or pulsed wave laser beam L. More specifically, the laser processing apparatus 1 according to Embodiment 1 performs laser cutting by irradiating the plate-shaped or tubular workpiece 50 with a laser beam L at a processing point P and spraying an assist gas G at the processing point P to separate the plate-shaped or tubular workpiece 50 into a workpiece and scrap material. In one example, the laser processing apparatus 1 according to Embodiment 1 is suitable for countersinking, which is a conical hole made so that the top surface of the screw head is below the top surface of the workpiece 50 that will become the workpiece, and countersinking, which is a process in which the screw head is partially recessed into the workpiece 50 that will become the workpiece, and the area around the hole is chamfered in a conical shape. Note that both countersinking and countersinking are the same in that a conical or frustoconical hole is made in the top surface of the workpiece 50, so both will be referred to as countersinking below.

[0027] Here, we will explain the overview of countersinking by laser cutting using conventional technology. Figure 5 is a diagram illustrating a joint in laser cutting using conventional technology. Here, the processing state is shown when a circular hole is made in the workpiece 50 in a plan view. In normal laser cutting, a laser beam L is irradiated onto a plate-shaped or tubular workpiece 50, melting the workpiece 50 and forming a cutting groove GR, thereby enabling the processing of the desired shape. In the example in Figure 5, the processing head 14 is moved along the processing path TP1 from the piercing line PL to form a cutting groove GR in the workpiece 50. However, if the end material 51 is completely separated from the plate-shaped or tubular workpiece 50, especially if it is made of a thin plate such as a plate with a thickness of 1 mm, the end material 51 may stand up due to the assist gas G blown during processing, and when the processing head 14 is moved to the next starting point, the standing end material 51 may collide with the processing head 14. As a means of preventing this phenomenon, separation from the plate-shaped or tubular workpiece 50 is sometimes intentionally not performed. In this process, the part connecting the scrap material 51 and the processed product 52 is referred to as a joint 53. In this specification, the processing path refers to the path along which the processing head 14 moves relative to the workpiece 50 placed on the table 11. The laser beam L is irradiated along this processing path.

[0028] In the example shown in Figure 5, when a circular hole is machined in the workpiece 50, a piercing line PL is formed by the laser processing device 1 from a predetermined position on the hole to the position that will form the outline of the hole. Once the line reaches the position that will form the outline of the hole, a cutting groove GR is formed along the circular processing path TP1. At this time, the endpoint of the processing path TP1 is set so that the cutting groove GR along the processing path TP1 does not form a closed circle in the workpiece 52. In other words, no cutting groove GR is formed between the intersection of the piercing line PL and the processing path TP1 and the endpoint of the processing path TP1, and the workpiece 52 and the scrap material 51 are connected. This part is the joint 53. By providing this joint 53, it is possible to suppress the scrap material 51 from standing up even when assist gas G is ejected during processing.

[0029] The laser processing apparatus 1 can perform countersinking in addition to laser cutting to separate the workpiece 52 from the scrap material 51. Figures 6 and 7 are diagrams illustrating conventional countersinking techniques. Figure 7 is a cross-sectional view taken along line VII-VII in Figure 6. Figure 6 shows an example of a processing path TP2 in countersinking. First, as shown in Figure 6, a laser cutting process is performed to form a circular hole in the workpiece 50. That is, similar to Figure 5, laser light L is irradiated from the piercing line PL formed in the area that will become the scrap material 51 along the circular processing path TP2, and laser processing is performed so as to leave a joint 53. In the laser cutting process, a laser light L with an output density that can cut the workpiece 50 in a single laser cutting operation is used.

[0030] Subsequently, as shown in Figure 7, a post-processing step is performed in which a laser beam L with reduced power density is irradiated again along the processing path TP2a, which follows the processing path TP2, to form a countersunk hole in which the sides constituting the hole are inclined at an angle that is not perpendicular to the upper surface of the workpiece 50. In this post-processing step, the power density of the laser beam L is reduced compared to the laser cutting process, so the workpiece 50 is processed without being cut. The amount of deviation between the processing path TP2 of the laser cutting process and the processing path TP2a of the post-processing step at this time is called the beam offset amount.

[0031] In both the laser cutting process shown in Figure 5 and the countersinking process shown in Figures 6 and 7, the process involves a joint 53. Therefore, after the processing is complete, it is necessary to separate the processed product 52 from the scrap material 51, i.e., to remove the joint 53, which leads to an increase in cycle time. In addition, in the case of the countersinking process shown in Figures 6 and 7, in order to obtain the desired countersink angle in a subsequent process, it is necessary to fine-tune the processing conditions and use trial and error, requiring sequential processing checks. As a result, this also leads to an increase in cycle time.

[0032] To solve the problems of conventional technologies, the laser processing apparatus 1 according to Embodiment 1 performs countersinking along a spiral processing path across the area where the countersink is to be formed. Figures 8 and 9 show examples of processing paths in countersinking using the laser processing apparatus according to Embodiment 1. Figure 8 shows a counterclockwise spiral processing path TP3 used to form a countersink in the workpiece 50. Figure 9 shows a clockwise spiral processing path TP4 used to form a countersink in the workpiece 50. Both Figures 8 and 9 show processing paths TP3 and TP4 extending from the center of the processed hole to the outer circumference. Alternatively, the counterclockwise spiral processing path TP3 in Figure 8 and the clockwise spiral processing path TP4 in Figure 9 may be combined in a continuous path. In this case, the order of the counterclockwise spiral processing path TP3 and the clockwise spiral processing path TP4 can be arbitrarily selected. Thus, when performing countersinking with the laser processing apparatus 1 according to Embodiment 1, the direction perpendicular to the mounting surface of the table 11 on which the workpiece 50 is placed is defined as the Z-axis direction, and the path in the plane perpendicular to the Z-axis direction in the helical processing path can be one of the following: a clockwise path, a counterclockwise path, or a path that continuously combines a clockwise path and a counterclockwise path.

[0033] Figures 10 and 11 show an example of the machining path of the machining head in countersinking in a laser processing apparatus according to Embodiment 1. In Figure 10, (a) is a top view, i.e., showing the relationship between the workpiece 50 and the machining path TP5 in the XY plane, and (b) is a side view, i.e., showing the relationship between the workpiece 50 and the machining path TP5 in the ZX plane. The machining path TP5 is the movement path of the laser beam L emission position of the machining head 14 during machining. Figure 10 shows the case where the machining path TP5 is a circular spiral path in a plane, i.e., a path in the XY plane without movement in the Z axis direction. When machining is performed using this machining path TP5, holes of the same depth are formed.

[0034] In Figure 11, (a) is a top view, showing the relationship between the workpiece 50 and the machining path TP6 in the XY plane, and (b) is a side view, showing the relationship between the workpiece 50 and the machining path TP6 in the ZX plane. The machining path TP6 is the movement path of the laser beam L emission position of the machining head 14 during machining. Figure 11 shows the case where the machining path TP6 is a three-dimensional path, that is, a spiral path that moves in the Z-axis direction in synchronization with a circular spiral path drawn by a rotation around a certain point in the XY plane.

[0035] The machining path TP6 in Figure 11 is a path that moves from the center to the outer edge in the XY plane, and a path that gradually moves away from the workpiece 50 in the Z axis direction. Here, the machining path TP6 is a counterclockwise spiral path, but it may also be clockwise.

[0036] As shown in Figure 11, machining is performed while raising or lowering the Z-axis of the machining head 14 in synchronization with the rotation of the axis. By machining using a single machining condition to create a helical machining path TP6, a path is also created in the Z-axis direction, making it easier to discharge the molten material. In the conventional technology shown in Figures 5 to 7, a joint 53 was required to change the machining conditions, such as when performing a post-processing step after the laser cutting process. However, in Embodiment 1, countersinking can be performed by using a single machining condition in the helical machining path TP3-TP6. In other words, since the part to be countersunk is machined by the helical machining path TP3-TP6, the scrap material 51 is discharged as machining waste during machining, and only the machined product 52 remains. As a result, a joint 53 like in the conventional technology is not required.

[0037] Note that the machining path TP6 shown in Figure 11 is just one example. In one example, it may be a spiral machining path descending in the negative Z-axis direction. In another example, it may be a path that continuously combines a spiral machining path descending in the negative Z-axis direction and the spiral machining path TP6 ascending in the positive Z-axis direction shown in Figure 11. In this case, the order of the descending spiral machining path and the ascending spiral machining path TP6 can be arbitrarily selected. In other words, in Embodiment 1, the direction perpendicular to the mounting surface of the table 11 on which the workpiece 50 is placed is defined as the Z-axis direction, and the path in the Z-axis direction of the spiral machining path can be one of the following: an ascending path, a descending path, or a path that continuously combines an ascending path and a descending path.

[0038] As described above, in Embodiment 1, a countersunk hole is formed by performing laser processing along a spiral processing path. The laser processing apparatus 1 according to Embodiment 1 has a function to generate a processing program that forms a spiral processing path from the processing conditions for forming the countersunk hole, in order to perform laser processing to form such a countersunk hole. The processing program generation device 33 of the laser processing apparatus 1 according to Embodiment 1 will be described below.

[0039] Figure 12 shows an example of the configuration of a processing program generation device used in a laser processing apparatus according to Embodiment 1. The processing program generation device 33 includes an input unit 321, a processing condition storage unit 322, a processing program storage unit 323, a macro template data storage unit 324, a spiral processing condition acquisition unit 325, a program generation unit 326, and an output unit 327.

[0040] The input unit 321 is an interface that receives data input to the processing program generation device 33. An example of the input unit 321 is an input interface that receives direct input from the operator of the laser processing device 1, such as a keyboard or mouse. Alternatively, the input unit 321 may be a communication interface that receives data from other information processing devices via a communication line. Furthermore, the input unit 321 may be a storage medium interface that can read a portable storage medium such as a semiconductor memory in which data is stored. The data input from the input unit 321 is processing input conditions that include the processing conditions when laser processing is performed in a spiral processing path by the laser processing device 1. The processing input conditions specify the characteristics of the workpiece 50 and the countersunk holes to be formed in the workpiece 50. An example of the characteristics of the workpiece 50 is the material and plate thickness. The characteristics of the countersunk holes are the processing shape, screw size, countersunk hole depth, and countersunk hole angle. In one example, the processing input conditions include the processing shape, screw size, countersunk hole depth, material, plate thickness, and countersunk hole angle.

[0041] The processing condition storage unit 322 stores processing condition information for laser processing along a helical processing path. Figure 13 shows an example of processing condition information. The processing condition information includes processing content specification conditions and helical processing conditions. The processing content specification conditions are information that specifies the characteristics of the workpiece 50 and the countersunk holes to be formed in the workpiece 50. It is desirable that the processing content specification conditions are the same as the processing input conditions. Figure 13 shows an example in which the processing content specification conditions include information such as processing shape, screw size, countersunk hole depth, material, plate thickness, and countersunk hole angle.

[0042] The processed shape indicates the shape of the dish hole processed by laser processing. FIG. 14 is a diagram showing the types of shapes of the dish holes. The types of shapes of the dish holes are classified according to the shape of the cross-section of the dish holes. (a) in FIG. 14 shows the cross-sectional shape of the Y-shaped dish hole 55Y, and (b) shows the cross-sectional shape of the V-shaped dish hole 55V. In the case of the Y-shaped dish hole 55Y, as shown in (a) of FIG. 14, the cross-sectional shape intersects at an angle where the side surface is not perpendicular to the upper surface within a range from the upper surface of the workpiece 50 to a certain depth, not the lower surface, and from the above-mentioned certain depth to the lower surface, it is a hole with a constant diameter and a side surface perpendicular to the lower surface. In the case of the V-shaped dish hole 55V, as shown in (b) of FIG. 14, the cross-sectional shape intersects at an angle where the side surface is not perpendicular to the upper surface within the range from the upper surface to the lower surface of the workpiece 50, and it can be defined as a hole. Returning to FIG. 13, when processing the Y-shaped dish hole 55Y, "Y-shaped" is input for the processed shape, and when processing the V-shaped dish hole 55V, "V-shaped" is input.

[0043] The screw size is the size of the screw that is screwed into the formed dish hole. In one example, when the screw size is determined, the size of the dish hole corresponding to the screw head is also determined. The dish hole depth is the depth of the dish hole formed by laser processing. The material is the material that constitutes the workpiece 50. The plate thickness is the thickness of the workpiece 50. The dish hole angle is, as shown in FIG. 14, in the cross-sectional view passing through the center of the dish hole when viewed from the formation direction of the dish hole, and it is the angle formed by the opposing side surfaces that constitute the dish hole.

[0044] The spiral processing conditions are the conditions for performing laser processing with a spiral processing path defined for the processing content specific conditions. That is, the spiral processing conditions are the laser processing conditions when performing the dish hole processing specified by the processing content specific conditions on the workpiece 50 specified by the processing content specific conditions, that is, when performing the dish hole processing with a spiral processing path. An example of the spiral processing conditions is, as shown in FIG. 13, information including the output, frequency, duty, processing speed, gas type, gas pressure, focus, nozzle height, beam spot diameter, and Z-axis lift distance. Note that the duty is denoted as "Duty" in FIG. 13.

[0045] The output is the output value of the laser beam L. The frequency is the output frequency of the laser beam L. The duty cycle is the ratio of the on-time to the off-time of a pulse in a pulse wave of laser beam L that is continuous at a specific period. The processing speed is the processing speed of the workpiece 50. The processing speed is the distance that is processed per unit time. The unit of processing speed is mm / min. The gas type is the type of assist gas G. The gas pressure is the pressure of the assist gas G. The focal point is the position of the focal point of the laser beam L when the position of the upper surface of the workpiece 50 placed on the table 11 is set as the reference, i.e., 0 mm. The nozzle height is the distance in the Z-axis direction between the upper surface of the workpiece 50 and the tip of the processing nozzle 15 on the table 11 side. The beam focusing diameter is the beam diameter at the focal point. The Z-axis rise distance is the rise distance in the Z-axis direction, i.e., parallel to the processing depth direction, as the processing nozzle 15 moves during processing.

[0046] A processing condition is represented by a single processing content specification condition and a single helical processing condition associated with this processing content specification condition. In other words, in Figure 13, the combination of the processing content specification condition and the helical processing condition in one row constitutes a processing condition. The set of processing conditions collected for each different processing content specification condition constitutes the processing condition information.

[0047] In the processing conditions, the Z-axis elevation distance may be increased to increase the beam diameter on the surface of the workpiece 50. Also, when the Z-axis elevation distance is large, the focal point may be set to a negative value in order to obtain the same beam diameter as when the Z-axis elevation distance is small. The helical processing conditions shown in Figure 13 are, in one example, appropriate, and preferably optimal, processing conditions that have been determined in advance through experiments when laser processing a countersunk hole in a helical processing path on a workpiece 50 specified in the processing content specification conditions.

[0048] The shape of the spiral machining path is determined by the machining conditions as illustrated in FIG. 13. That is, the machining conditions include items that can form a spiral machining path. Further, the machining conditions include an item indicating whether the shape of the dish hole is either a V shape or a Y shape. Note that the presence or absence of a portion with a constant diameter of the Y-shaped dish hole 55Y is determined from the values of the machining shape, thread size, and dish hole depth items in the machining condition information of FIG. 13.

[0049] Returning to FIG. 12, the machining program storage unit 323 stores a base machining program, which is a computer program that includes the machining position of the dish hole machining and in which a spiral machining path is not described. The base machining program is, for example, a Numerical Control (NC) program. The base machining program is, for example, created by an operator who previously performs dish hole machining using the laser processing apparatus 1.

[0050] The macro template data storage unit 324 stores macro template data, which is a computer program in which a machining procedure for performing machining along a spiral machining path is preset. The macro template data is a program defined such that the machining head 14 moves along a spiral machining path using the items included in the machining input conditions and the spiral machining conditions as parameters. That is, the macro template data can be said to be a program that represents the position of the machining head 14 along a spiral machining path using the items included in the machining input conditions and the spiral machining conditions as parameters. Then, by substituting the values of the items included in the machining input conditions and the spiral machining conditions corresponding to each parameter of this macro template data, a macro, which is a program for forming a dish hole having the size and shape specified by the machining input conditions, is generated. In the macro template data, the spiral machining path is expressed using the G2 code or the G3 code, which are rotation correction commands.

[0051] Furthermore, when forming countersunk holes, a piercing command is required to create holes at the countersunk location before laser processing along the spiral processing path. The piercing command may be written before the processing block describing the laser processing along the spiral processing path in the macro template data, or the piercing command may not be written in the macro template data at all, and may be written just before registering the macro of the underlying processing program.

[0052] Furthermore, in the macro template data for performing Y-shaped countersink machining, a processing block describing laser machining to form a hole of a constant diameter below the countersink may be included before or after the processing block describing laser machining along a spiral machining path, or the macro template data may not contain a processing block for forming a hole of a constant diameter below the countersink, while the underlying machining program contains a processing block for forming a hole of a constant diameter below the countersink. In one example, the macro template data is stored in the macro template data storage unit 324 for each machining shape.

[0053] The spiral machining condition acquisition unit 325 refers to machining condition information that includes multiple machining content identification conditions and spiral machining conditions defined for each of the multiple machining content identification conditions, and acquires spiral machining conditions from the machining condition information that are associated with machining content identification conditions that match the machining input conditions.

[0054] Furthermore, if there are no machining content identification conditions in the machining condition information that match the machining input conditions, the spiral machining condition acquisition unit 325 acquires two different machining conditions from the machining condition information, performs linear interpolation on the two acquired machining conditions, and calculates the spiral machining conditions for the machining input conditions. In one example, the spiral machining condition acquisition unit 325 acquires two machining conditions from the machining input conditions in which the countersink angle differs from the machining input conditions. In this case, it is desirable to acquire two machining conditions with countersink angles that are closest to the countersink angle entered in the machining input conditions. It is also desirable that the machining content identification conditions other than the countersink angle match or are close to the machining input conditions. In one example, it is desirable to acquire machining conditions that have the same machining shape.

[0055] Let's explain a specific example of linear interpolation for machining conditions. When a machining input condition of a countersink angle of 40° is entered, Figure 13 does not include a machining condition with a countersink angle of 40°. In this case, we obtain the first machining condition in Figure 13 with a countersink angle of 30° and the second machining condition with a countersink angle of 45°. Then, assuming a linear relationship between the countersink angle and each item of the helical machining condition, we calculate the value of the machining item in the helical machining condition when the countersink angle is 40°.

[0056] The program generation unit 326 generates a processing program that performs laser processing along a spiral processing path using the acquired or calculated spiral processing conditions. Specifically, the program generation unit 326 acquires macro template data from the macro template data storage unit 324. The macro template data is a program that performs laser processing, expressing commands for the movement of the processing head 14 along the spiral processing path using processing input conditions and spiral processing condition items from the processing condition information as parameters. The program generation unit 326 generates a macro by inputting the values ​​of the corresponding items of the processing input conditions and spiral processing conditions acquired or calculated by the spiral processing condition acquisition unit 325 into the parameters of the acquired macro template data.

[0057] The program generation unit 326 obtains a base material machining program corresponding to the machining input conditions from the machining program storage unit 323, registers the generated macro to the obtained base material machining program, and generates a machining program. In one example, the macro is registered to the machining position of the countersunk hole in the base material machining program. As a result, when the machining program is executed and the machining position of the countersunk hole is read, the macro registered to the machining position is executed, and countersunk hole machining with a spiral machining path registered in the macro is performed.

[0058] The output unit 327 outputs the machining program generated by the program generation unit 326 to the device control unit 31 and the axis movement control unit 32. The device control unit 31 controls the operation of the laser oscillator 12 and the machining gas supply unit 16 according to the machining program. The axis movement control unit 32 controls the drive unit 20 so that the machining head 14 moves along the helical machining path according to the machining program.

[0059] Next, a laser processing method using the laser processing apparatus 1 with the above configuration will be described. The laser processing method according to Embodiment 1 basically involves irradiating a workpiece 50 with laser light L emitted from a laser oscillator 12 from a processing head 14 that can move in the directions of three mutually orthogonal axes, thereby performing countersinking on the workpiece 50. In the laser processing method according to Embodiment 1, the processing head 14 is moved so that the processing path, which is the movement path of the processing head 14 relative to the workpiece 50, becomes a spiral processing path, and the laser light L is irradiated onto the workpiece 50. The specific details of this laser processing method will be explained below using a flowchart.

[0060] Figures 15 and 16 are flowcharts showing an example of the procedure for a laser processing method according to Embodiment 1. First, the input unit 321 receives input of processing input conditions from the operator (step S11). In this case, the processing input conditions include the processing shape, screw size, countersunk hole depth, material, plate thickness, and countersunk hole angle. The processing shape is information that specifies whether it is a Y-shape or a V-shape. The screw size and countersunk hole depth are information that specifies the size and depth of the countersunk hole to be formed, respectively. The material and plate thickness are information that specifies the workpiece 50. The countersunk hole angle is information that specifies the angle of the countersunk hole to be formed. In other words, the processing input conditions can be said to be information that specifies the size and shape of the countersunk hole to be formed and the material properties of the workpiece 50.

[0061] Next, the spiral machining condition acquisition unit 325 searches the machining condition storage unit 322 for machining content identification conditions that match the input machining input conditions (step S12), and determines whether there are machining content identification conditions in the machining condition storage unit 322 that match the machining input conditions (step S13).

[0062] If the processing content identification conditions that match the processing input conditions are stored in the processing condition storage unit 322 (if the answer is Yes in step S13), the helical processing condition acquisition unit 325 acquires the helical processing conditions corresponding to the processing content identification conditions that match the processing input conditions from the processing condition storage unit 322 (step S14). In this case, the helical processing conditions include output, frequency, duty cycle, processing speed, gas type, gas pressure, focus, nozzle height, beam focusing diameter, and Z-axis elevation distance.

[0063] On the other hand, if there are no machining content identification conditions matching the machining input conditions in the machining condition storage unit 322 (i.e., No in step S13), the helical machining condition acquisition unit 325 acquires two different machining conditions from the machining condition storage unit 322 (step S15). In this case, it is desirable for the helical machining condition acquisition unit 325 to acquire machining conditions with different countersink angles. Next, the helical machining condition acquisition unit 325 performs linear interpolation using the two acquired machining conditions to calculate the helical machining conditions corresponding to the machining input conditions (step S16).

[0064] Subsequently, or after step S14, the program generation unit 326 obtains the base material machining program from the machining program storage unit 323 (step S17), and obtains the countersink machining position from the base material machining program (step S18). The program generation unit 326 also obtains macro template data from the macro template data storage unit 324 (step S19).

[0065] The program generation unit 326 inputs the acquired or calculated helical machining conditions into the parameters using the machining input conditions and helical machining conditions defined in the macro template data, and generates a macro corresponding to the machining input conditions (step S20). Subsequently, the program generation unit 326 generates a machining program corresponding to the machining input conditions registered in the machining position of the countersunk hole in the base machining program using the generated macro (step S21). The output unit 327 outputs the machining program with the registered macro to the device control unit 31 and the axis movement control unit 32 (step S22).

[0066] Subsequently, the device control unit 31 and the axis movement control unit 32 execute countersinking according to the machining program in which the macro is registered (step S23). At this time, the machining program is executed sequentially, and when the processing position in the machining program reaches the countersinking position, the registered macro is executed, and countersinking is performed by laser machining along the spiral machining path according to the macro. In addition, during countersinking, a piercing process is performed on the workpiece 50 before countersinking is performed along the spiral machining path. When the countersinking is completed, the process ends.

[0067] Steps S11 to S22 show the procedure for generating a machining program and correspond to the machining program generation method.

[0068] In the above description, the macro template data storage unit 324 may store one macro template data corresponding to all processing conditions stored in the processing condition storage unit 322, or it may store multiple types of macro template data. In the latter case, the macro template data storage unit 324 may store macro template data for each processing shape, or it may store macro template data for each type classified by other criteria.

[0069] Next, the hardware configuration for realizing the control device 30 of the laser processing apparatus 1 according to Embodiment 1 will be described. The control device 30 functions as a computer system when a program, which is a computer program describing the processing in the control device 30, is executed on the computer system. Figure 17 is a block diagram showing an example of the configuration of a computer system that realizes the control device of the laser processing apparatus according to Embodiment 1. As shown in Figure 17, this computer system includes a control unit 901, an input unit 902, a storage unit 903, a display unit 904, a communication unit 905, and an output unit 906, which are connected via a system bus 907.

[0070] In Figure 17, the control unit 901 is, in one example, a processor such as a CPU (Central Processing Unit), which executes a program describing the processing in the control device 30. The input unit 902 is, in one example, composed of a keyboard, mouse, etc., and is used by the computer system operator to input various information. The storage unit 903 includes various types of memory such as RAM (Random Access Memory) and ROM (Read Only Memory), and storage devices such as a hard disk, and stores the program to be executed by the control unit 901, necessary data obtained during the processing, etc. The storage unit 903 is also used as a temporary storage area for the program. The display unit 904 is composed of a display, liquid crystal display panel, etc., and displays various screens to the computer system operator. In one example, the input unit 902 and the display unit 904 may be configured as a touch panel in which the input unit 902 and the display unit 904 are integrally formed. The communication unit 905 is a receiver and transmitter that perform communication processing. The output unit 906 is a printer, speaker, etc. Note that Figure 17 is just one example, and the configuration of the computer system is not limited to the example shown in Figure 17.

[0071] Here, we will describe an example of the operation of a computer system until a program becomes executable. In a computer system with the above configuration, for example, a program is installed in the storage unit 903 from a CD-ROM or DVD-ROM set in a CD (Compact Disc)-ROM drive or DVD (Digital Versatile Disc)-ROM drive (not shown). When the program is executed, the program read from the storage unit 903 is stored in the main memory area of ​​the storage unit 903. In this state, the control unit 901 performs processing as a control device 30 according to the program stored in the storage unit 903.

[0072] In the above description, a program describing the processing in the control device 30 is provided using a CD-ROM or DVD-ROM as the recording medium. However, the system is not limited to this, and depending on the configuration of the computer system, the capacity of the program to be provided, a program provided via a transmission medium such as the Internet via the communication unit 905 may also be used.

[0073] The device control unit 31 and axis movement control unit 32 shown in Figure 1, and the spiral machining condition acquisition unit 325 and program generation unit 326 of the machining program generation device 33 shown in Figure 12, are realized by the execution of a program stored in the storage unit 903 shown in Figure 17 by the control unit 901 shown in Figure 17. The storage unit 903 shown in Figure 17 is also used to realize the device control unit 31 and axis movement control unit 32 shown in Figure 1, and the spiral machining condition acquisition unit 325 and program generation unit 326 of the machining program generation device 33 shown in Figure 12. The input unit 321 of the machining program generation device 33 shown in Figure 12 is realized by the input unit 902 shown in Figure 17. The output unit 327 of the machining program generation device 33 shown in Figure 12 is realized by the communication unit 905 shown in Figure 17. The machining condition storage unit 322, machining program storage unit 323, and macro template data storage unit 324 shown in Figure 12 are realized by the storage unit 903 shown in Figure 17.

[0074] In Figure 1, the machining program generation device 33 is shown as being included in the control device 30, but it may also be implemented by an external computer system separate from the control device 30. In this case, the computer system constituting the machining program generation device 33 may have the configuration shown in Figure 17, for example.

[0075] Next, the effects of the laser processing apparatus 1 according to Embodiment 1 compared with conventional technology will be explained. Figure 18 is a diagram comparing countersinking by the laser processing method according to Embodiment 1 with countersinking by conventional technology. In conventional laser cutting countersinking, first, as shown in step S31, laser cutting is performed by irradiating the workpiece 50 with laser light L at a first power density along a circular processing path with a portion missing. As a result, as shown in step S32, a joint 53 is left between the workpiece 52 and the scrap material 51. At this time, the workpiece 50 is cut by a single irradiation of laser light L. Also, the size of the circular scrap material 51 formed at this time is approximately the same as the diameter of the smallest part of the countersink formed.

[0076] Next, as shown in step S33, the cut portion is irradiated with a laser beam L of the second power density to perform countersinking. At this time, the appropriateness of the countersink angle is checked sequentially. Once a countersink with the desired countersink angle is formed, as shown in step S34, the joint 53 connecting the workpiece 52 and the end material 51 is removed, and the workpiece 52 with the countersink is obtained.

[0077] On the other hand, in the countersinking process according to Embodiment 1, as shown in step S23, countersinking is performed by irradiating the workpiece 50 with laser light L along a spiral processing path. By performing laser processing along a spiral processing path, in the portion corresponding to the scrap material 51 of the conventional technology, the scrap material 51 is discharged as processing waste during processing, leaving only the processed product 52. As a result, when the countersinking process is completed, countersinks are formed in the portion that was the processing path.

[0078] As described above, in conventional countersinking, when forming a workpiece 52 with a countersunk hole, the following steps are performed: cutting the workpiece 50 with a laser beam L of a first power density, leaving the joint 53; countersinking the workpiece 50 with a laser beam L of a second power density; and removing the joint 53. In contrast, in the countersinking according to Embodiment 1, a countersunk hole can be formed in the workpiece 50 in a single step. In other words, in the countersinking according to Embodiment 1, it is not necessary to change the power density of the laser beam L from the start to the end of countersinking. That is, as in conventional countersinking, it is not necessary to switch the power density of the laser beam L to perform laser cutting and countersinking. Thus, in the countersinking according to Embodiment 1, the laser cutting process and the countersinking process can be performed on the workpiece 50 simultaneously.

[0079] Furthermore, in the countersinking process according to Embodiment 1, there is no need to provide a joint 53, and therefore there is no need to remove the joint 53. In other words, the work time associated with removing the joint 53 is eliminated. As a result, the laser processing apparatus 1 and laser processing method according to Embodiment 1 can simplify the countersinking process compared to conventional methods, and thus reduce the cycle time compared to conventional methods.

[0080] Furthermore, in conventional countersinking, it was necessary to sequentially check the machining process to obtain the desired countersink angle, which led to an increase in cycle time. However, the laser processing apparatus 1 and laser processing method according to Embodiment 1 use macro template data, which is a program that includes movement commands along a spiral machining path, using the machining input conditions and spiral machining conditions as parameters when performing countersinking along a spiral machining path. In addition, parameters for the countersink angle can be set in this macro template data. Therefore, by substituting the values ​​of the machining input conditions and spiral machining conditions into the parameters of the macro template data, a macro for countersinking according to the machining input data is generated. By registering this macro in the underlying machining program, the laser processing apparatus 1 can perform laser machining according to the machining conditions and form a countersink with the countersink angle specified in the machining input conditions. As a result, it is no longer necessary to sequentially check the countersink angle during countersinking as in the conventional method, and the cycle time can be reduced even during countersinking.

[0081] Furthermore, when processing input conditions are entered, the spiral processing condition acquisition unit 325 acquires or calculates spiral processing conditions corresponding to the processing input conditions, and the program generation unit 326 generates a macro, which is a program for forming a countersunk hole with a shape that satisfies the processing input conditions. As a result, even operators unfamiliar with creating processing programs for the laser processing device 1 can form the desired countersunk hole simply by entering the processing input conditions.

[0082] Furthermore, in conventional countersinking processes, after drilling holes with a piercing tool, a straight or curved piercing line is required to reach a circular machining path with a portion missing. However, in the countersinking process according to Embodiment 1, after drilling holes with a piercing tool, the machining head 14 can be moved along a spiral machining path without using a piercing line. Thus, the countersinking process according to Embodiment 1 makes it possible to simplify the configuration of the machining program compared to conventional techniques.

[0083] Furthermore, the processing program generated by the program generation unit 326 moves the processing head 14 along a spiral processing path. By irradiating the processing head 14 with laser light L while moving it along the spiral processing path, processing debris is discharged along the processing path, and as a result, a countersunk hole is formed. In other words, the laser processing apparatus 1 according to Embodiment 1 can generate a processing program that includes a processing path without the addition of a joint 53.

[0084] As described above, the laser processing apparatus 1 according to Embodiment 1 comprises a laser oscillator 12 that emits laser light L, a processing head 14 that irradiates the workpiece 50 with the laser light L, a drive device 20 that can drive the processing head 14 in the direction of three mutually orthogonal axes, and an axis movement control device 32 that controls the operation of the drive device 20 to move the position of the processing head 14 according to a processing program that irradiates the workpiece 50 with laser light L to process the workpiece 50. Furthermore, the axis movement control device 32 controls the drive device 20 to move the processing head 14 during laser processing so that the processing path, which is the movement path of the processing head 14 relative to the workpiece 50, becomes a spiral processing path.

[0085] Furthermore, in the first embodiment of the laser processing method, the laser beam L emitted from the laser oscillator 12 is irradiated onto the workpiece 50 from a processing head 14 that is movable in the direction of three mutually orthogonal axes to process the workpiece 50. The processing head 14 is moved so that the processing path, which is the path the processing head 14 moves in relation to the workpiece 50, becomes a spiral processing path, and the laser beam L is irradiated onto the workpiece 50.

[0086] This has the effect of shortening the cycle time in countersinking the workpiece 50 compared to conventional methods. In particular, since no joints 53 are formed on the workpiece 50 by laser processing, and the removal of joints 53 is unnecessary, the time required for subsequent processes can be reduced compared to conventional technology.

[0087] Furthermore, in the laser processing apparatus 1 and laser processing method according to Embodiment 1, helical processing conditions corresponding to the processing content specification conditions are determined in advance and stored as processing condition information. The helical processing conditions are determined experimentally in advance to be the optimal conditions for forming the countersunk holes specified by the processing content specification conditions. Therefore, by obtaining helical processing conditions corresponding to the processing content specification conditions that match the processing content input conditions, it is possible to eliminate the need for time to adjust the conditions by laser processing.

[0088] The processing program generation device 33 according to Embodiment 1 is a device that generates a processing program for irradiating a workpiece 50 with laser light L while moving a processing head 14 along a spiral processing path, and comprises an input unit 321, a spiral processing condition acquisition unit 325, and a program generation unit 326. The input unit 321 receives processing input conditions that specify the characteristics of the workpiece 50 and the countersunk holes to be formed in the workpiece 50. The spiral processing condition acquisition unit 325 refers to processing condition information that includes a plurality of processing conditions that associate processing content specification conditions that identify the characteristics of the workpiece 50 and the countersunk holes to be formed in the workpiece 50 with spiral processing conditions that are conditions for performing laser processing along a spiral processing path, and acquires spiral processing conditions that are associated with processing content specification conditions that match the processing input conditions. The program generation unit 326 generates a processing program that performs laser processing along a spiral processing path using the processing input conditions and the acquired spiral processing conditions.

[0089] Furthermore, the processing program generation program according to Embodiment 1 is a program that generates a processing program in which a laser beam L is irradiated onto a workpiece 50 while moving the processing head 14 along a spiral processing path. The processing program generation program causes the computer to execute an input step, a spiral processing condition acquisition step, and a program generation step. In the input step, processing input conditions are received that specify the workpiece 50 and the characteristics of the countersunk hole to be formed in the workpiece 50. In the spiral processing condition acquisition step, processing condition information is referred to, which includes a plurality of processing conditions that associate processing content identification conditions that identify the workpiece 50 and the characteristics of the countersunk hole to be formed in the workpiece 50 with spiral processing conditions that are conditions for performing laser processing along a spiral processing path, and spiral processing conditions that are associated with processing content identification conditions that match the processing input conditions are acquired. In the program generation step, a processing program is generated that performs laser processing along a spiral processing path using the processing input conditions and the acquired spiral processing conditions.

[0090] This has the effect of generating a machining program that shortens the cycle time compared to conventional methods when drilling holes in the workpiece 50. Furthermore, since a machining program that forms a countersunk hole that satisfies the machining input conditions can be generated simply by inputting the machining input conditions, even operators who are not skilled in creating machining programs can obtain a machining program that forms a countersunk hole of the desired size and shape.

[0091] Furthermore, the processing program generation device 33 and processing program generation program according to Embodiment 1 pre-determine helical processing conditions corresponding to the processing content specification conditions and store them as processing condition information. The helical processing conditions are determined experimentally in advance to be the optimal conditions for forming the countersunk holes specified by the processing content specification conditions. Therefore, by obtaining helical processing conditions corresponding to the processing content specification conditions that match the processing content input conditions, the time required for condition adjustment by laser processing is eliminated.

[0092] The configurations shown in the above embodiments are examples only, and it is possible to combine them with other known technologies, combine different embodiments, and omit or modify parts of the configuration without departing from the gist of the invention.

[0093] 1 Laser processing apparatus, 11 Table, 12 Laser oscillator, 13 Fiber cable, 14 Processing head, 15 Processing nozzle, 16 Processing gas supply unit, 17 Gas piping, 18 Drive shaft, 19 Motor, 20 Drive unit, 20X X-axis drive unit, 20Y Y-axis drive unit, 20Z Z-axis drive unit, 30 Control device, 31 Device control unit, 32 Axis movement control unit, 33 Processing program generation device, 50 Workpiece, 51 Scrap material, 52 Processed product, 53 Joint, 55V V-shaped countersunk hole, 55Y Y-shaped countersunk hole, 141 Flow path, 321, 902 Input unit, 322 Processing condition storage unit, 323 Processing program storage unit, 324 Macro template data storage unit, 325 Helical processing condition acquisition unit, 326 Program generation unit, 327, 906 Output unit, 901 Control unit, 903 Storage unit, 904 Display unit, 905 Communication unit, 907 System bus, G Assist gas, L Laser light, P Processing point.

Claims

1. A laser processing apparatus comprising: a laser oscillator that emits laser light; a processing head that irradiates a workpiece with the laser light; a drive device capable of driving the processing head in each of three mutually orthogonal axes; and an axis movement control unit that controls the operation of the drive device to move the position of the processing head according to a processing program that irradiates the workpiece with the laser light to process the workpiece, wherein the axis movement control unit controls the drive device to move the processing head during laser processing so that the processing path, which is the path the processing head moves to the workpiece, becomes a spiral processing path.

2. The laser processing apparatus according to claim 1, further comprising: an input unit that receives processing input conditions specifying the characteristics of the workpiece and the countersink to be formed in the workpiece; a spiral processing condition acquisition unit that refers to processing condition information including a plurality of processing conditions that associate processing content specification conditions that identify the characteristics of the workpiece and the countersink to be formed in the workpiece, and spiral processing conditions that are conditions for performing the laser processing in the spiral processing path defined for the processing content specification conditions, and acquires the spiral processing conditions that are associated with the processing content specification conditions that match the processing input conditions; and a program generation unit that generates a processing program that performs the laser processing in the spiral processing path using the processing input conditions and the acquired spiral processing conditions, wherein the axis movement control unit performs control based on the processing program generated by the program generation unit.

3. The laser processing apparatus according to claim 2, characterized in that the program generation unit generates a processing program in which a macro is registered, which is a macro that is generated by inputting the values ​​of the corresponding items of the processing input conditions and the helical processing conditions acquired by the helical processing condition acquisition unit into the parameters of the macro template data, which is a program defined so that the processing head moves along the helical processing path using the items included in the processing input conditions and the helical processing conditions as parameters.

4. The laser processing apparatus according to claim 2 or 3, characterized in that the helical processing condition acquisition unit acquires two different processing conditions from the processing condition information when there are no processing content identification conditions in the processing condition information that match the processing input conditions, performs linear interpolation on the two acquired processing conditions to calculate helical processing conditions for the processing input conditions, and the program generation unit generates the processing program that performs the laser processing along the helical processing path using the processing input conditions and the calculated helical processing conditions.

5. The laser processing apparatus according to any one of claims 2 to 4, characterized in that the processing input conditions and the processing content specification conditions include an item indicating whether the shape of the countersunk hole is V-shaped or Y-shaped.

6. The laser processing apparatus according to any one of claims 1 to 5, characterized in that the direction perpendicular to the mounting surface of the table on which the workpiece is placed is the Z-axis direction, and the Z-axis direction path in the spiral processing path is one of an upward path, a downward path, or a path that continuously combines an upward path and a downward path.

7. The laser processing apparatus according to any one of claims 1 to 6, characterized in that the direction perpendicular to the mounting surface of the table on which the workpiece is placed is the Z-axis direction, and the path in the plane perpendicular to the Z-axis direction in the helical processing path is one of a clockwise path, a counterclockwise path, or a path that is a continuous combination of a clockwise path and a counterclockwise path.

8. The laser processing apparatus according to any one of claims 1 to 7, characterized in that the direction perpendicular to the mounting surface of the table on which the workpiece is placed is the Z-axis direction, and the path in the plane perpendicular to the Z-axis direction in the helical processing path is a path that goes from the center to the outer circumference.

9. A processing program generation device that generates a processing program for irradiating a workpiece with laser light while moving a processing head along a spiral processing path, comprising: an input unit that receives processing input conditions that specify the characteristics of the workpiece and the countersink to be formed in the workpiece; a spiral processing condition acquisition unit that refers to processing condition information including a plurality of processing conditions that associate processing content specification conditions that identify the characteristics of the workpiece and the countersink to be formed in the workpiece with spiral processing conditions that are conditions for performing laser processing along the spiral processing path, and acquires the spiral processing conditions that are associated with the processing content specification conditions that match the processing input conditions; and a program generation unit that generates the processing program for performing the laser processing along the spiral processing path using the processing input conditions and the acquired spiral processing conditions.

10. The machining program generation apparatus according to claim 9, characterized in that the program generation unit generates a machining program in which a macro is registered, which is a macro that is generated by inputting the values ​​of the corresponding items of the machining input conditions and the helical machining conditions acquired by the helical machining condition acquisition unit into the parameters of the macro template data, which is a program defined so that the machining head moves along the helical machining path using the items included in the machining input conditions and the helical machining conditions as parameters.

11. The processing program generation apparatus according to 9 or 10, characterized in that the helical processing condition acquisition unit acquires two different processing conditions from the processing condition information when there are no processing content identification conditions in the processing condition information that match the processing input conditions, performs linear interpolation on the two acquired processing conditions to calculate helical processing conditions for the processing input conditions, and the program generation unit generates the processing program that performs the laser processing in the helical processing path using the processing input conditions and the calculated helical processing conditions.

12. A laser processing method for processing a workpiece by irradiating it with laser light emitted from a laser oscillator from a processing head that is movable in the direction of each of three mutually orthogonal axes, characterized in that the processing head is moved such that the processing path, which is the path the processing head moves relative to the workpiece, becomes a spiral processing path, thereby irradiating the workpiece with the laser light.

13. A processing program generation program that generates a processing program for processing a workpiece by irradiating the workpiece with laser light while moving a processing head along a spiral processing path, the program comprising: an input step of receiving processing input conditions that specify the characteristics of the workpiece and the countersunk holes to be formed in the workpiece; a spiral processing condition acquisition step of referring to processing condition information that includes a plurality of processing conditions that associate processing content specification conditions that identify the characteristics of the workpiece and the countersunk holes to be formed in the workpiece, and spiral processing conditions that are conditions for performing laser processing along the spiral processing path, and acquiring the spiral processing conditions that are associated with the processing content specification conditions that match the processing input conditions; and a program generation step of generating the processing program that performs the laser processing along the spiral processing path using the processing input conditions and the acquired spiral processing conditions.

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