Resin composition, electronic component device, and method for producing electronic component device

Abstract

A resin composition containing a curable resin and an inorganic filler, having a melt viscosity of 5000 Pa·s or more as measured at 20°C, and having a minimum melt viscosity of 200 Pa·s or less.

Description

Resin composition, electronic component device, and method for manufacturing an electronic component device

[0001] This disclosure relates to a resin composition, an electronic component device, and a method for manufacturing an electronic component device.

[0002] In electronic component devices such as printed circuit boards and semiconductor packages, resin compositions containing curable resins are used to protect or electrically insulate electronic components and wiring mounted on the substrate. In addition to liquid resin compositions, resin compositions molded into arbitrary shapes such as sheets and tablets have been developed for use in electronic component devices. For example, International Publication No. 2023 / 282313 describes a resin composition molded into a film.

[0003] International Publication No. 2023 / 282313

[0004] Resin compositions molded into a film lose viscosity and become fluid when heated. Therefore, by heating and pressurizing a film-like resin composition in contact with a substrate, an insulating layer can be formed on the substrate surface. On the other hand, film-like resin compositions tend to have low fluidity in directions opposite to the direction of pressurization (for example, perpendicular to the direction of pressurization). For this reason, filling the gaps between the substrate and the electronic components placed on it is performed using a liquid resin composition rather than a film-like resin composition.

[0005] If the formation of an insulating layer on the surface of a substrate and the filling of voids between the substrate and electronic components placed thereon can be carried out in the same process using a resin composition molded into any shape, a significant improvement in the productivity of electronic component devices can be expected. In view of the above circumstances, one embodiment of the present disclosure aims to provide a resin composition that can maintain a state of being molded into any shape and has excellent fluidity in a direction different from the direction of pressurization, as well as an electronic component device using this resin composition and a method for manufacturing an electronic component device.

[0006] Specific means for solving the above problems include the following aspects. <1> A resin composition comprising a curable resin and an inorganic filler, having a melt viscosity measured at 20°C of 5000 Pa·s or more and a minimum melt viscosity of 200 Pa·s or less. <2> The resin composition according to <1>, which is in the form of a film. <3> The resin composition according to <1> or <2>, wherein the curable resin comprises a curable resin that is liquid at 25°C and a curable resin that is solid at 25°C. <4> The resin composition according to any one of <1> to <3> for filling the space between a substrate and an electronic component. <5> An electronic component device comprising a substrate, an electronic component, and a cured product of the resin composition according to any one of <1> to <4> disposed between the substrate and the electronic component. <6> A method for manufacturing an electronic component device comprising a substrate and an electronic component, the method including a step of filling the space between the substrate and the electronic component with the resin composition according to any one of <1> to <4>. <7> The method for manufacturing an electronic component device according to <6>, wherein the filling of the resin composition is performed by causing a part of the resin composition in the form of a film to enter the space.

[0007] According to one embodiment of the present disclosure, there is provided a resin composition that can maintain a state of being molded into an arbitrary shape and has excellent fluidity in a direction different from the direction of pressurization, as well as an electronic component device and a method for manufacturing an electronic component device using this resin composition.

[0008] It is a diagram schematically showing an example of a method for manufacturing an electronic component device of the present disclosure. It is a diagram schematically showing an example of a method for manufacturing a conventional electronic component device.

[0009] In this disclosure, the term "process" includes not only processes that are independent of other processes, but also processes that are not clearly distinguishable from other processes, provided that the purpose of the process is achieved. In this disclosure, numerical ranges indicated using "~" include the numbers before and after "~" as the minimum and maximum values, respectively. In numerical ranges described in stages in this disclosure, the upper or lower limit of one numerical range may be replaced by the upper or lower limit of another numerical range described in stages. Also, in numerical ranges described in this disclosure, the upper or lower limit of that numerical range may be replaced by the values ​​shown in the examples. In this disclosure, each component may contain multiple types of the corresponding substance. If multiple types of the substance corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple types of substances present in the composition, unless otherwise specified.

[0010] In this disclosure, “resin composition” means a mixture of two or more components containing at least a resin. If the resin composition contains a curable component, the state in which at least a portion of the curable component has reacted is also included in the resin composition. In this disclosure, “solids” means components other than volatile components such as solvents. In this disclosure, “(meth)acrylate” means “acrylate” or “methacrylate,” “(meth)acrylic” means “acrylic” or “methacrylic,” and “(meth)acryloyl” means “acryloyl” or “methacryloyl.” In this disclosure, “molecular weight” of a compound means the molecular weight that can be calculated from the structural formula if the compound is not a polymer and its structural formula can be identified, and the number-average molecular weight if the compound is a polymer. The mechanisms of action described herein are speculative and do not limit the mechanisms by which the resin composition according to this embodiment exerts its effects. Embodiments that arbitrarily combine the matters described herein are also included.

[0011] <Resin Composition> The resin composition of the present disclosure contains a curable resin and an inorganic filler, and is a resin composition having a melt viscosity measured at 20°C of 5000 Pa·s or more and a minimum melt viscosity of 200 Pa·s or less.

[0012] The resin composition of the present disclosure has a melt viscosity measured at 20°C of 5000 Pa·s or more. Therefore, the resin composition of the present disclosure can maintain a state of being molded into an arbitrary shape. For example, the resin composition of the present disclosure can be used as a film-shaped resin composition.

[0013] Further, the resin composition of the present disclosure has a minimum melt viscosity of 200 Pa·s or less. As shown in the examples described later, a resin composition having a minimum melt viscosity of 200 Pa·s or less is excellent in fluidity in a direction different from the direction of pressurization. Therefore, the resin composition of the present disclosure can coat the surface of the substrate and fill the space (gap) between the substrate and the electronic component disposed thereon. Therefore, according to the resin composition of the present disclosure, formation of an insulating layer on the surface of the substrate and filling of the space between the substrate and the electronic component disposed thereon can be carried out in the same step.

[0014] The upper limit value of the melt viscosity measured at 20°C of the resin composition of the present disclosure is not particularly limited. From the viewpoint of exhibiting excellent fluidity in a direction different from the direction of pressurization while maintaining a state of being molded into an arbitrary shape, the melt viscosity measured at 20°C of the resin composition is preferably 50000 Pa·s or less, preferably 20000 Pa·s or less, and more preferably 15000 Pa·s or less.

[0015] From the viewpoint of exhibiting excellent fluidity in a direction different from the direction of pressurization, the minimum melt viscosity of the resin composition is preferably 100 Pa·s or less, more preferably 50 Pa·s or less, further preferably 10 Pa·s or less, and particularly preferably 8 Pa·s or less. The lower limit value of the minimum melt viscosity of the resin composition is not particularly limited. For example, the minimum melt viscosity of the resin composition may be 0.1 Pa·s or more, 0.5 Pa·s or more, or 1 Pa·s or more.

[0016] The ratio (A / B) of the melt viscosity A to the minimum melt viscosity B of the resin composition, as measured at 20°C, is not particularly limited. From the viewpoint of exhibiting excellent fluidity in a direction different from the direction of pressurization while maintaining a molded state of any shape, the ratio (A / B) of the melt viscosity A to the minimum melt viscosity B of the resin composition, as measured at 20°C, is preferably 100 or more, more preferably 1000 or more, and even more preferably 2000 or more. The ratio (A / B) of the melt viscosity A to the minimum melt viscosity B of the resin composition, as measured at 20°C, may be 20000 or less, 15000 or less, or 12000 or less.

[0017] In this disclosure, the melt viscosity of the resin composition is measured using a viscoelasticity measuring device under the conditions described in the examples.

[0018] The resin composition may be in an uncured state (A-stage) or a semi-cured state (B-stage). The melt viscosity of the resin composition described above is the melt viscosity of the resin composition before it becomes a cured product (C-stage). In this disclosure, "semi-cured product" is synonymous with a resin composition in the B-stage state as defined in JIS K 6800 (2006), and "cured product" is synonymous with a resin composition in the C-stage state as defined in JIS K 6800 (2006).

[0019] The following describes the components that may be contained in the resin composition of this disclosure.

[0020] (Curable Resin) The resin composition includes a curable resin. In this disclosure, a curable resin means a resin that undergoes a chemical reaction and hardens upon treatment such as heating or irradiation with active rays. Examples of curable resins that may be included in the resin composition include compounds having functional groups such as epoxy groups, N-substituted maleimide groups, vinyl groups, (meth)acryloyl groups, hydroxyl groups, carboxyl groups, and amino groups as reactive groups. From the viewpoint of suitability to the manufacturing process of electronic components and devices, heat resistance, etc., it is preferable that the curable resin is a thermosetting resin that hardens upon heating.

[0021] The resin composition may contain only one type of curable resin or two or more types. From the viewpoint of exhibiting excellent fluidity in a direction different from the direction of pressure while maintaining a molded state of any desired shape, it is preferable that the resin composition contains a curable resin that is solid at 25°C and a curable resin that is liquid at 25°C.

[0022] (Epoxy Resin) The resin composition may contain an epoxy resin as a curable resin, or it may contain both an epoxy resin and a curing agent for the epoxy resin as curable resins. In this disclosure, "epoxy resin" means a compound having epoxy groups as reaction groups. From the viewpoint of curing reactivity, the epoxy resin is preferably a compound having two epoxy groups (hereinafter referred to as diepoxy) or a compound having three or more epoxy groups (hereinafter also referred to as polyepoxy resin). In this disclosure, "curing agent for epoxy resin" means a compound having at least one functional group that can react with epoxy groups.

[0023] Specifically, the epoxy resins include: novolac-type epoxy resins (phenol novolac-type epoxy resins, orthocresol novolac-type epoxy resins, etc.) obtained by condensing or co-condensing a novolac resin (phenol novolac-type epoxy resins, orthocresol novolac-type epoxy resins, etc.) obtained by condensing or co-condensing a novolac resin (phenol novolac-type epoxy resins, orthocresol novolac-type epoxy resins, etc.) obtained by condensing or co-condensing the above phenolic compound with an aromatic aldehyde compound (benzaldehyde, salicylaldehyde, etc.) under an acidic catalyst; triphenylmethane-type epoxy resins obtained by condensing or co-condensing a triphenylmethane-type phenolic resin (phenol novolac-type epoxy resins, orthocresol novolac-type epoxy resins, etc.) obtained by condensing or co-condensing the above phenolic compound with an aromatic aldehyde compound (benzaldehyde, salicylaldehyde, etc.) under an acidic catalyst; and novolac resins obtained by co-condensing the above phenolic compound and naphthol compound with an aldehyde compound under an acidic catalyst. Copolymer epoxy resins that are epoxidized fats; diphenylmethane type epoxy resins that are diglycidyl ethers of bisphenol A, bisphenol F, etc.; biphenyl type epoxy resins that are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; stilbene type epoxy resins that are diglycidyl ethers of stilbene-based phenol compounds; sulfur atom-containing epoxy resins that are diglycidyl ethers of bisphenol S, etc.; epoxy resins that are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester type epoxy resins that are glycidyl esters of polycarboxylic acid compounds such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidylamine type epoxy resins in which active hydrogen bonded to nitrogen atoms such as aniline, diaminodiphenylmethane, and isocyanuric acid is replaced with a glycidyl group; dicyclopentadiene type epoxy resins that are epoxidized from a co-condensation resin of dicyclopentadiene and a phenol compound;Alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane, which have epoxidized olefin bonds within the molecule; paraxylylene-modified epoxy resins, which are glycidyl ethers of paraxylylene-modified phenol resins; metaxylylene-modified epoxy resins, which are glycidyl ethers of metaxylylene-modified phenol resins; terpene-modified epoxy resins, which are glycidyl ethers of terpene-modified phenol resins; and dicyclopentadiene-modified phenol resins, which are glycidyl ethers of dicyclopentadiene-modified phenol resins. Examples include pentadiene-modified epoxy resins; cyclopentadiene-modified epoxy resins, which are glycidyl ethers of cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified epoxy resins, which are glycidyl ethers of polycyclic aromatic ring-modified phenolic resins; naphthalene-type epoxy resins, which are glycidyl ethers of naphthalene ring-containing phenolic resins; halogenated phenol novolac-type epoxy resins; hydroquinone-type epoxy resins; trimethylolpropane-type epoxy resins; linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid; and aralkyl-type epoxy resins, which are epoxidized aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins. Epoxy resins may be used individually or in combination of two or more types.

[0024] The epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balancing properties such as moldability and electrical reliability of the resin composition, it is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq. The epoxy equivalent of the epoxy resin shall be the value measured by the method in accordance with JIS K 7236:2009.

[0025] From the viewpoint of exhibiting excellent fluidity in a direction different from the direction of pressure while maintaining a state molded into an arbitrary shape, the resin composition preferably contains an epoxy resin having an oxyalkylene structure, and more preferably contains a diepoxy resin having an oxyalkylene structure.

[0026] In this disclosure, the oxyalkylene structure is defined as -[O-C] ｍ H ２ｍ ] ｎ This refers to a molecular structure represented by -. In the formula, n may be 1 or a number of 2 or more (i.e., polyalkylene oxide). In the formula, m may be 2 (ethylene), 3 (propylene), or a number of more, and may be a combination of different structural units of m. It is preferable that m is 2 or 3.

[0027] The epoxy resin having an oxyalkylene structure preferably contains an aromatic ring, more preferably a bisphenol structure, and even more preferably a bisphenol A (diphenylmethane) structure. The epoxy resin having an oxyalkylene structure may also be a compound having a structure represented by the following general formula (1).

[0028]

[0029] In the formula, R １ , R ２ , R ３ and R ４ Each independently represents a methyl group or a hydrogen atom, and each is preferably a methyl group. k and l are each independently a number of 0 or more (where k + l is 1 or more), and each is preferably independently a number of 1 or more.

[0030] Examples of curing agents for epoxy resins include phenol curing agents, amine curing agents, acid anhydride curing agents, polymer captan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents.

[0031] The resin composition preferably contains a phenol curing agent. Specifically, the phenol curing agent is a polyhydric phenol compound such as resorcinol, catechol, bisphenol A, bisphenol F, or substituted or unsubstituted biphenols; a novolac-type phenolic resin obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene, with an aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, or salicylaldehyde under an acidic catalyst; and the above phenolic compound with dimethoxyparaxylene, bis(methoxymethyl)biph Examples include aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins synthesized from phenols, etc.; paraxylylene and / or metaxylylene-modified phenolic resins; melamine-modified phenolic resins; terpene-modified phenolic resins; dicyclopentadiene-type phenolic resins and dicyclopentadiene-type naphthol resins synthesized by copolymerization of the above phenolic compound and dicyclopentadiene; cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified phenolic resins; biphenyl-type phenolic resins; triphenylmethane-type phenolic resins obtained by condensation or co-condensation of the above phenolic compound and aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst; and phenolic resins obtained by copolymerizing two or more of these. The phenolic curing agent may be used alone or in combination of two or more. In one embodiment, the resin composition may contain a phenolic resin containing a biphenyl structure as the curing agent.

[0032] When the curing agent is a solid, its softening point or melting point is not particularly limited. From the viewpoint of moldability and reflow resistance when the resin composition is used as a sealing material, the softening point or melting point of the curing agent is preferably 40°C to 180°C, and from the viewpoint of handling during the manufacture of the resin composition, it is more preferably 50°C to 130°C.

[0033] The melting point or softening point of the curing agent shall be a value measured in the same manner as the melting point or softening point of the epoxy resin.

[0034] The functional group equivalent of the curing agent (hydroxyl group equivalent in the case of a phenol curing agent, and active hydrogen equivalent in the case of an amine curing agent) is not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, the functional group equivalent of the curing agent is preferably 70 g / eq to 1000 g / eq, and more preferably 80 g / eq to 500 g / eq.

[0035] In the case of phenol curing agents, the hydroxyl group equivalent refers to the value calculated based on the hydroxyl value measured in accordance with JIS K0070:1992. In the case of amine curing agents, the active hydrogen equivalent refers to the value calculated based on the amine value measured in accordance with JIS K7237:1995.

[0036] When the resin composition contains an epoxy resin and a phenol curing agent, the mass ratio (A:B) of epoxy resin A to phenol curing agent B is preferably selected from the range of 1:0.05 to 1:0.2. When the resin composition contains an epoxy resin and a phenol curing agent, the resin composition preferably contains an epoxy resin that is liquid at 25°C and a phenol curing agent that is solid at 25°C.

[0037] The resin composition may contain an amine curing agent. The amine curing agent is preferably a compound having an aromatic ring (aromatic amine compound), more preferably an aromatic amine compound that is liquid at 25°C, and even more preferably an aromatic amine compound that is liquid at 25°C and has two amino groups in one molecule.

[0038] Examples of aromatic amine compounds that are liquid at 25°C include diethyltoluenediamines such as 3,5-diethyltoluene-2,4-diamine and 3,5-diethyltoluene-2,6-diamine, 1-methyl-3,5-diethyl-2,4-diaminobenzene, 1-methyl-3,5-diethyl-2,6-diaminobenzene, 1,3,5-triethyl-2,6-diaminobenzene, 3,3'-diethyl-4,4'-diaminodiphenylmethane, and 3,5,3',5'-tetramethyl-4,4'-diaminodiphenylmethane.

[0039] Among the above compounds, 3,3'-diethyl-4,4'-diaminodiphenylmethane and diethyltoluenediamine are preferred from the viewpoint of storage stability.

[0040] When the resin composition contains a phenol curing agent and an amine curing agent, the mass ratio (A:B) of phenol curing agent A to amine curing agent B is preferably selected from the range of 1:1 to 1:2.5.

[0041] The curable resin contained in the resin composition may be a radically polymerizable curable resin. Resin compositions containing a radically polymerizable curable resin are less susceptible to changes in properties during storage compared to, for example, resin compositions containing an epoxy resin. This offers advantages such as the ability to store them at room temperature.

[0042] Among radical-polymerizable curable resins, maleimide resins are preferred from the viewpoints of heat resistance and dielectric properties (low dielectric constant). In the present disclosure, the maleimide resin means a compound having an N-substituted maleimide group as a reactive group. From the viewpoint of curing reactivity, the maleimide resin is preferably a compound having two N-substituted maleimide groups (hereinafter also referred to as a bismaleimide resin) or a compound having three or more N-substituted maleimide groups (hereinafter also referred to as a polymaleimide resin). From the viewpoint of heat resistance, the maleimide resin is preferably a compound having an N-substituted maleimide group directly bonded to an aromatic ring (hereinafter also referred to as an aromatic maleimide resin), and more preferably a compound having two or three or more N-substituted maleimide groups directly bonded to an aromatic ring (hereinafter also referred to as an aromatic bismaleimide resin or an aromatic polymaleimide resin). The maleimide resin contained in the resin composition may be only one kind or two or more kinds.

[0043] The maleimide resin contained in the resin composition may be a compound having N-substituted maleimide groups at both ends of the molecule. Examples of the compound having N-substituted maleimide groups at both ends of the molecule include a compound represented by the following formula (A1).

[0044]

[0045] In the formula, X ａ１１ is a divalent organic group. The structure of the divalent organic group represented by X ａ１１ is not particularly limited. The divalent organic group represented by X ａ１１ may contain a structure in which the same kind of structural units are linked, and may further contain an N-substituted maleimide group.

[0046] The maleimide resin may contain a condensed ring of an aromatic ring and an aliphatic ring. A preferred example of the condensed ring of an aromatic ring and an aliphatic ring is an indane ring. The indane ring means a condensed bicyclic structure of an aromatic six-membered ring and a saturated aliphatic five-membered ring. The indane ring contained in the maleimide resin is preferably contained as a divalent group represented by the following general formula (A1-1).

[0047]

[0048] In the formula, R ａ１ This is an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. ａ１ R is an integer between 0 and 3. ａ２ ~R ａ４ Each of these is an alkyl group having 1 to 10 carbon atoms. * indicates a bonding site (the same applies below).

[0049] R ａ１ Examples of C1-C10 alkyl groups represented by include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, and decyl groups. These alkyl groups may be linear or branched. ａ１ Examples of alkyl groups included in the C1-C10 alkyloxy group and C1-C10 alkylthio group represented by the above include the same C1-C10 alkyl groups. ａ１ Examples of aryl groups having 6 to 10 carbon atoms represented by R include the phenyl group and the naphthyl group. ａ１ The aryl groups included in the aryloxy group and arylthio group having 6 to 10 carbon atoms represented by the above-mentioned aryl group having 6 to 10 carbon atoms are the same as those mentioned above. ａ１ Examples of cycloalkyl groups having 3 to 10 carbon atoms represented by include cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl group, and cyclodecyl group. From the viewpoint of solubility in solvents and reactivity, R ａ１ The group is preferably an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an aryl group having 6 to 10 carbon atoms, and more preferably an alkyl group having 1 to 4 carbon atoms.

[0050] R ａ２ ~R ａ４Examples of C1-C10 alkyl groups represented by include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, and decyl groups. These alkyl groups may be linear or branched. Among these, R ａ２ ~R ａ４ It is preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group or an ethyl group, and even more preferably a methyl group. ａ１ n is an integer between 0 and 3. ａ１ If it is 2 or 3, then 2 or 3 R ａ１ They may be the same or different.

[0051] The divalent group represented by the general formula (A1-1) is, from the viewpoint of ease of manufacture, n ａ１ If R is 0, ａ２ ~R ａ４ It is preferable that each of these is a methyl group. Specifically, a divalent group represented by the following formula (A1-1a) is preferred, and a divalent group represented by the following formula (A1-1a') or a divalent group represented by the following formula (A1-1a'') is more preferred.

[0052]

[0053] The maleimide resin containing the indan ring is preferably an aromatic maleimide resin, more preferably an aromatic bismaleimide resin, and even more preferably a compound represented by the following general formula (A1-2).

[0054]

[0055] In the formula, R ａ１ ~R ａ４ and n ａ１ This is the same as the one in general formula (A1-1). R ａ５ Each of these is independently a C1-C10 alkyl group, a C1-C10 alkyloxy group, a C1-C10 alkylthio group, a C6-C10 aryl group, a C6-C10 aryloxy group, a C6-C10 arylthio group, a C3-C10 cycloalkyl group, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group. ａ２Each of these is an integer between 0 and 4, independently of the others. ａ３ This is a number between 0.95 and 10.0.

[0056] In the formula, multiple R ａ１ , multiple n ａ１ , multiple R ａ５ or multiple n ａ２ These can be the same or different. ａ３ If the number exceeds 1, multiple R ａ２ , multiple R ａ３ or multiple R ａ４ These may be the same or different.

[0057] R ａ５ Examples of C1-C10 alkyl groups represented by include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, and decyl groups. These alkyl groups may be linear or branched. ａ５ Examples of alkyl groups included in the C1-C10 alkyloxy group and C1-C10 alkylthio group represented by the above include the same C1-C10 alkyl groups. ａ５ Examples of aryl groups having 6 to 10 carbon atoms represented by R include the phenyl group and the naphthyl group. ａ５ The aryl groups included in the aryloxy group and arylthio group having 6 to 10 carbon atoms represented by the above-mentioned aryl group having 6 to 10 carbon atoms are the same as those mentioned above. ａ５ Examples of cycloalkyl groups having 3 to 10 carbon atoms represented by include cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl group, and cyclodecyl group. From the viewpoint of solvent solubility and ease of manufacture, R ａ５ The group is preferably an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an aryl group having 6 to 10 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group.

[0058] n in the formula ａ２n is an integer from 0 to 4, and is preferably an integer from 1 to 3, more preferably 2 or 3, and even more preferably 2, from the viewpoint of compatibility with other resins, dielectric properties, conductive adhesion, and ease of manufacture. ａ２ When n is 1 or greater, the benzene ring and the N-substituted maleimide group have a twisted conformation, and solvent solubility tends to improve due to the suppression of intermolecular stacking. From the perspective of suppressing intermolecular stacking, ａ２ If R is 1 or greater, ａ５ The substitution position of is preferably the ortho position relative to the N-substituted maleimide group. ａ３ From the viewpoint of dielectric properties, conductive adhesion, solvent solubility, handling properties, and heat resistance, the number is preferably 0.98 to 8.0, more preferably 1.0 to 7.0, and even more preferably 1.1 to 6.0. ａ３ This represents the average number of structural units containing an indan ring.

[0059] The maleimide resin represented by general formula (A1-2) is more preferably represented by the following general formula (A1-3) or the following general formula (A1-4) from the viewpoint of dielectric properties, conductive adhesion, solvent solubility, and ease of manufacture.

[0060]

[0061] In the formula, R ａ１ ~R ａ５ , n ａ１ and n ａ３ This is the same as the one in general formula (A1-2).

[0062]

[0063] In the formula, R ａ１ ~R ａ４ , n ａ１ and n ａ３ This is the same as the one in general formula (A1-2).

[0064] Examples of maleimide resins represented by general formula (A1-3) include maleimide resins represented by the following general formula (A1-3-1), maleimide resins represented by the following general formula (A1-3-2), and maleimide resins represented by the following general formula (A1-3-3).

[0065]

[0066] In the formula, n ａ３ This is the same as the one in general formula (A1-2).

[0067] The maleimide resin (A1) represented by general formula (A1-4) is preferably represented by the following general formula (A1-4-1).

[0068] In the formula, n ａ３ This is the same as the one in general formula (A1-2).

[0069] Maleimide resins containing an indan ring can be synthesized by known methods. For example, maleimide resins containing an indan ring can be synthesized by the method described in International Publication No. 2023 / 282313.

[0070] When the resin composition contains a maleimide resin as a curable resin, and the maleimide resin contains a maleimide resin containing an indan ring, it is preferable that the content of the maleimide resin containing an indan ring be 50% by mass or more of the total maleimide resin, more preferably 70% by mass or more, and even more preferably 80% by mass or more. The content of the maleimide resin containing an indan ring may be 100% by mass of the total maleimide resin.

[0071] The number-average molecular weight of the maleimide resin containing the indan ring is not particularly limited. From the viewpoint of compatibility with other resins, conductive adhesion, and heat resistance, the number-average molecular weight of the maleimide resin is preferably 600 to 3,000, more preferably 800 to 2,000, and even more preferably 1,000 to 1,500.

[0072] In this disclosure, the number-average molecular weight of the compound is measured in polystyrene equivalent by gel permeation chromatography (GPC). The GPC measurement conditions are as follows. Instrument: High-speed GPC instrument HLC-8320GPC Detector: UV absorbance detector UV-8320 [Tosoh Corporation] Column: Guard column; TSK Guardcolumn SuperHZ-L + Column; TSKgel SuperHZM-N + TSKgel SuperHZM-M + TSKgel SuperH-RC (all manufactured by Tosoh Corporation, product names) Column size: 4.6 × 20 mm (guard column), 4.6 × 150 mm (column), 6.0 × 150 mm (reference column) Eluent: Tetrahydrofuran Sample concentration: 10 mg / 5 mL Injection volume: 25 μL Flow rate: 1.00 mL / min Measurement temperature: 40°C Calibration curve: Standard polystyrene: TSKstandard The equation is approximated using a cubic equation with POLYSTYRENE (Type; A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) (manufactured by Tosoh Corporation, product name).

[0073] The maleimide resin that may be included as a curable resin in the resin composition may be a maleimide resin other than a maleimide resin containing an indan ring. Specific examples of maleimide resins other than those containing an indan ring include N,N'-ethylenebismaleimide, N,N'-hexamethylenebismaleimide, N,N'-(1,3-phenylene)bismaleimide, N,N'-[1,3-(2-methylphenylene)]bismaleimide, N,N'-[1,3-(4-methylphenylene)]bismaleimide, N,N'-(1,4-phenylene)bismaleimide, bis(4-maleimidophenyl)methane, bis(3-methyl-4-maleimidophenyl)methane, 3,3 '-dimethyl-5,5'-diethyl-4,4'-diphenylmethanebismaleimide, bis(4-maleimidophenyl)ether, bis(4-maleimidophenyl)sulfone, bis(4-maleimidophenyl)sulfide, bis(4-maleimidophenyl)ketone, bis(4-maleimidocyclohexyl)methane, 1,4-bis(4-maleimidophenyl)cyclohexane, 1,4-bis(maleimidomethyl)cyclohexane, 1,4-bis(maleimidomethyl)benzene, 1,3-bis(4-maleimidophenyl (xy)benzene, 1,3-bis(3-maleimidophenoxy)benzene, bis[4-(3-maleimidophenoxy)phenyl]methane, bis[4-(4-maleimidophenoxy)phenyl]methane, 1,1-bis[4-(3-maleimidophenoxy)phenyl]ethane, 1,1-bis[4-(4-maleimidophenoxy)phenyl]ethane, 1,2-bis[4-(3-maleimidophenoxy)phenyl]ethane, 1,2-bis[4-(4-maleimidophenoxy)phenyl]ethane, 2,2-bis[4-( 3-maleimidophenoxy)phenyl]propane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, 2,2-bis[4-(3-maleimidophenoxy)phenyl]butane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]butane, 2,2-bis[4-(3-maleimidophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 4,4-bis(3-maleimidophenoxy)biphenyl, 4,4-bis(4-maleimidophenoxy)biphenyl, bis[4-(3-maleimidophenoxy)phenyl]ketone, bis[4-(4-maleimidophenoxy)phenyl]ketone, bis(4-maleimidophenoxy)disulfide, bis[4-(3-maleimidophenoxy)phenyl]sulfide, bis[4-( 3-maleimoidphenoxy)phenyl]sulfoxide, bis[4-(4-maleimoidphenoxy)phenyl]sulfoxide, bis[4-(3-maleimoidphenoxy)phenyl]sulfone, bis[4-(4-maleimoidphenoxy)phenyl]sulfone, bis[4-(3-maleimoidphenoxy)phenyl]ether, bis[4-(4-maleimoidphenoxy)phenyl]ether, 1,4-bis[4-(4-maleimoidphenoxy )-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(4-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(3-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(3-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(4-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene Examples include zen, 1,3-bis[4-(4-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(3-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(3-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, polyphenylmethanemaleimide, biphenylaralkyl-type maleimide, etc. The resin composition may also contain an aminomaleimide resin as the maleimide resin, having structural units derived from maleimide resin and structural units derived from diamine compounds.

[0074] The resin composition may contain a compound having a (meth)acryloyl group as a curable resin. When the resin composition contains a maleimide resin as a curable resin, from the viewpoint of balancing the properties of the resin composition, it is preferable that the resin composition contains both a maleimide resin and a compound having a (meth)acryloyl group. The resin composition may contain only one compound having a (meth)acryloyl group or two or more.

[0075] Compounds having a (meth)acryloyl group include (meth)acrylic acid esters such as di(meth)acrylic acid esters and trifunctional or more (meth)acrylic acid esters.

[0076] Examples of di(meth)acrylic acid esters include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, tricyclodecane di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, and triethylene glycol di(meth)acrylate. Examples include polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, ethoxylated bisphenol F di(meth)acrylate, and dioxane glycol di(meth)acrylate. An example of dioxane glycol di(meth)acrylate is 2-[5-ethyl-5-[(acryloyloxy)methyl]-1,3-dioxan-2-yl]-2,2-dimethylethyl acrylate.

[0077] Examples of (meth)acrylic acid esters with three or more functions include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0078] From the viewpoint of balancing the properties of the resin composition, it is preferable that the resin composition contains a di(meth)acrylic acid ester, more preferably a di(meth)acrylic acid ester containing an alkylene group, and even more preferably a di(meth)acrylic acid ester in which (meth)acryloyl groups are bonded to both ends of the alkylene group. As the di(meth)acrylic acid ester containing an alkylene group, diacrylic acid esters represented by the following general formula (B-1) and dimethacrylic acid esters represented by the following general formula (B-2) are preferred, and dimethacrylic acid esters represented by the following general formula (B-2) are more preferred.

[0079]

[0080] In the formula, R ｂ１ This is an alkylene group having 1 to 20 carbon atoms.

[0081] In the above general formulas (B-1) and (B-2), R ｂ１ The number of carbon atoms in the alkylene group having 1 to 20 carbon atoms is preferably 4 to 18, more preferably 6 to 15, and even more preferably 8 to 12. Examples of alkylene groups having 1 to 20 carbon atoms include methylene, ethylene, propylene, butylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, undecylene, dodecylene, tetradecylene, and pentadecylene. The alkylene group may be linear, branched, or cyclic, but linear is preferred.

[0082] (Inorganic Filler) The resin composition contains an inorganic filler. When a resin composition contains an inorganic filler, the thermal expansion coefficient of the cured resin composition tends to decrease, improving its heat resistance and flame retardancy. The inorganic filler contained in the resin composition may be one type or two or more types.

[0083] Examples of inorganic fillers include silica, alumina, titanium oxide, beryllium, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, aluminum borate, and silicon carbide. Among these, silica and alumina are preferred from the viewpoint of low thermal expansion, heat resistance, and flame retardancy.

[0084] The average particle size of the inorganic filler is not particularly limited, but from the viewpoint of dispersibility in the resin composition and compatibility with fine wiring, it is preferably 0.01 μm to 20 μm, more preferably 0.1 μm to 10 μm, and even more preferably 0.5 μm to 5 μm.

[0085] In this disclosure, the average particle size of the inorganic filler refers to the particle size at which the volume accumulation in the volume-based particle size distribution curve reaches 50% (volume-average particle size, D50). The volume-based particle size distribution curve can be obtained, for example, by laser diffraction scattering. The shape of the inorganic filler is not particularly limited, but it is preferably spherical.

[0086] The inorganic filler may be surface-treated with a coupling agent to improve dispersibility and adhesion to organic components. Examples of coupling agents include silane coupling agents and titanate coupling agents. Among these, silane coupling agents are preferred. Examples of silane coupling agents include aminosilane coupling agents, vinylsilane coupling agents, and epoxysilane coupling agents.

[0087] (Curing accelerator) The resin composition may contain a curing accelerator. The inclusion of a curing accelerator in the resin composition tends to improve the curability of the resin composition, and the dielectric properties and heat resistance of the cured product tend to improve.

[0088] The type of curing accelerator is not particularly limited and can be selected according to the type of curable resin contained in the resin composition. Examples of curing accelerators include: acidic catalysts such as p-toluenesulfonic acid; amine compounds such as triethylamine, pyridine, tributylamine, and dicyandiamide; imidazole compounds such as methylimidazole, phenylimidazole, and 1-cyanoethyl-2-phenylimidazole; isocyanate-masquimidazole compounds such as the addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole; tertiary amine compounds; quaternary ammonium compounds; phosphorus compounds such as triphenylphosphine; dicumyl peroxide, 2,5-dimethyl-2,5-bis(t- Examples include organic peroxides such as butylperoxy)hexyn-3,2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butylperoxyisopropyl monocarbonate, and 1,3-di(t-butylperoxyisopropyl)benzene; inorganic peroxides such as potassium persulfate, sodium persulfate, and ammonium persulfate; azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(4-methoxy-2'-dimethylvaleronitrile); and carboxylates of manganese, cobalt, zinc, etc.

[0089] When a resin composition contains a radically polymerizable curable resin, it is preferable to include a radical polymerization initiator as a curing accelerator. Examples of radical polymerization initiators include organic peroxides, inorganic peroxides, and azo compounds, which are among the curing accelerators mentioned above. From the viewpoint of improving curability, organic peroxides are preferred.

[0090] The resin composition may contain only one type of curing accelerator or two or more types.

[0091] When a resin composition contains a curing accelerator, its content is not particularly limited, but is preferably 0.1 to 15 parts by mass, more preferably 1 to 10 parts by mass, and even more preferably 4 to 8 parts by mass, relative to the total amount of resin components (100 parts by mass). When the curing accelerator content is 0.1 parts by mass or more, a sufficient curing acceleration effect tends to be obtained. When the curing accelerator content is 15 parts by mass or less, the storage stability of the resin composition tends to be better. When a resin composition contains a radical polymerization initiator as a curing accelerator, its content is not particularly limited, but is preferably 0.05 to 7 parts by mass, more preferably 0.5 to 5 parts by mass, and even more preferably 2 to 4 parts by mass, relative to the total amount of resin components (100 parts by mass). When the radical polymerization initiator content is above the lower limit, a sufficient curing acceleration effect tends to be easily obtained. Also, when the radical polymerization initiator content is below the upper limit, the storage stability tends to be better.

[0092] (Other Components) The resin composition may contain components other than those listed above (other components) as needed. Examples of other components include flame retardants, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, colorants, lubricants, etc. The other components contained in the resin composition may be one type or two or more types.

[0093] (Various properties of the resin composition) The content of the components contained in the resin composition is not particularly limited and can be selected according to the application of the resin composition. From the viewpoint of exhibiting excellent fluidity in a direction different from the direction of pressure while maintaining a molded state of any desired shape, the content of inorganic filler in the resin composition may be 40% to 90% by volume, 45% to 85% by volume, or 50% to 80% by volume. From the viewpoint of exhibiting excellent filling and fluidity in a direction different from the direction of pressure while maintaining a molded state of any desired shape, the content of inorganic filler in the resin composition may be 40% to 90% by mass, 45% to 85% by mass, or 50% to 80% by mass.

[0094] From the viewpoint of exhibiting excellent fluidity in a direction different from the direction of pressure while maintaining a molded state of any desired shape, the content of organic components in the resin composition may be 10% to 60% by volume, 15% to 55% by volume, or 20% to 50% by volume. From the viewpoint of exhibiting excellent fluidity in a direction different from the direction of pressure while maintaining a molded state of any desired shape, the content of organic components in the resin composition may be 10% to 60% by mass, 15% to 55% by mass, or 20% to 50% by mass. The above "content of organic components" refers to the content of non-volatile organic components among the organic components contained in the resin component.

[0095] The shape of the resin composition is not particularly limited and can be selected according to the application of the resin composition. In one embodiment, the resin composition of this disclosure may be in the form of a film. Hereinafter, the film-like resin composition will also be referred to as "resin film".

[0096] The thickness of the resin film is not particularly limited and can be selected according to the application of the resin film. The thickness of the resin film may be, for example, 10 μm or more, 50 μm or more, 80 μm or more, or 100 μm or more. The thickness of the resin film may also be, for example, 1,000 μm or less, 700 μm or less, or 500 μm or less.

[0097] From the viewpoint of handling the resin film, it is preferable that the resin film be placed on a support. The material of the support is not particularly limited and can be resin, metal, paper, etc. If necessary, a release treatment may be applied to the surface of the support that is in contact with the resin film. The thickness of the support is not particularly limited, but from the viewpoint of handling and economy, it is preferably 10 μm to 150 μm, more preferably 20 μm to 100 μm, and even more preferably 25 μm to 50 μm.

[0098] A resin film placed on a support can be prepared, for example, by applying a resin varnish obtained by adding an organic solvent to a resin composition onto the support, drying it, and removing the organic solvent. The organic solvent content in the dried resin film is preferably 2% by mass or less, more preferably 1% by mass or less, and even more preferably 0.5% by mass or less, and may be 0% by mass, based on the total amount of the resin film (100% by mass). When the organic solvent content in the resin film is within the above range, the amount of volatilization of the organic solvent during heat curing is sufficiently suppressed. The resin film may be in a state in which at least a portion of the curable components contained in the resin film have reacted.

[0099] The resin film may have a protective film placed on its surface. For example, the resin film may have a support on one side and a protective film on the other side. The material of the protective film is not particularly limited and can be resin, metal, paper, etc. If necessary, a release treatment may be applied to the surface of the protective film that is in contact with the resin film. The thickness of the protective film is not particularly limited, but from the viewpoint of handling and economy, it is preferably 10 μm to 150 μm, more preferably 20 μm to 100 μm, and even more preferably 25 μm to 50 μm.

[0100] The applications of the resin composition disclosed herein are not particularly limited. Examples of preferred applications include forming an insulating layer on printed circuit boards and encapsulating semiconductor elements contained in semiconductor packages.

[0101] <Method for Manufacturing an Electronic Component Device> The method for manufacturing an electronic component device according to the present disclosure is a method for manufacturing an electronic component device comprising a substrate and an electronic component, and includes a step of filling the space between the substrate and the electronic component with the resin composition of the present disclosure described above.

[0102] In the above method, filling the space between the substrate and the electronic component with the resin composition may be carried out while applying heat and pressure to the resin composition. The conditions for applying heat and pressure are not particularly limited and can be selected according to the components of the resin composition. In the above method, filling the space between the substrate and the electronic component with the resin composition may be carried out while reducing the pressure. The method of reducing the pressure is not particularly limited and can be carried out by known methods such as vacuum lamination. In the above method, filling the space between the substrate and the electronic component with the resin composition may be carried out by inserting a portion of the film-like resin composition into the space between the substrate and the chip.

[0103] Hereinafter, an example of a method for manufacturing an electronic component device using a film-like resin composition will be described with reference to the drawings. Figure 1 is a schematic process diagram showing an example of a method for manufacturing an electronic component device according to the present disclosure. First, as shown in Figure 1(A), an electronic component 20 is placed on a substrate 10. Examples of electronic components 20 include semiconductor chips and interposers. Next, as shown in Figure 1(B), protrusions 30 are formed around the electronic component 20. Examples of protrusions 30 include metal pillars, metal posts, solder balls, and wiring patterns. The protrusions 30 may be relatively raised portions between recesses in a substrate 10 having recesses such as grooves. The spacing between adjacent protrusions 30 can be selected, for example, from 10 μm to 200 μm. The height of the protrusions 10 can be selected, for example, from 10 μm to 200 μm. Next, as shown in Figure 1(C), a resin film 40 is placed on the substrate 10 on which the electronic component 20 and protrusions 30 are arranged, and the resin film 40 is heated and pressurized. The arrows in the figure indicate the direction of pressure. As shown in Figure 1(D), the resin film 40, which becomes fluid due to heating, flows in the direction of pressure, filling the space between the protrusions 30 and forming an insulating layer on the surface of the substrate 10. Furthermore, a portion of the resin film 40 also flows in a direction perpendicular to the direction of pressure, filling the space between the electronic component 20 and the substrate 10.

[0104] Figure 2 is a schematic process diagram illustrating an example of a conventional method for manufacturing electronic component devices. First, as shown in Figure 2(A), the electronic component 20 is placed on the substrate 10. Unlike Figure 1(A), in Figure 2(A), the space between the substrate 10 and the electronic component 20 is filled with underfill material 50. The explanations for Figures 2(B), (C), and (D) are the same as those for Figures 1(B), (C), and (D), so they are omitted.

[0105] As described above, the conventional method shown in Figure 2 involves a step of filling the gap between the substrate and the electronic component with an underfill material. In contrast, the method of the present disclosure shown in Figure 1 fills the gap between the substrate and the electronic component with a resin film instead of an underfill material. Therefore, the method shown in Figure 1 has fewer steps and is more productive than the method shown in Figure 2.

[0106] <Electronic Component Device> The electronic component device of this disclosure includes a substrate, an electronic component, and a cured product of the resin composition of this disclosure described above, which is disposed between the substrate and the electronic component. The substrate included in the electronic component device can be any known substrate, such as a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin (bismaleimide-triazine resin) substrate, or a thermosetting polyphenylene ether substrate, without any particular limitations. The substrate may also be a circuit board, having a conductive layer as a circuit formed in a pattern on its surface. The electronic component included in the electronic component device can be any component mounted on a substrate, such as a semiconductor chip or an interposer, without any particular limitations.

[0107] The embodiment will be described in detail below with reference to examples. However, this embodiment is not limited to the following examples.

[0108] (Preparation of resin film) The materials shown in Table 1 were mixed with methyl ethyl ketone to prepare a resin composition with a solid content of 50% by mass. This resin composition was applied to the release-treated surface of a PET film and dried by heating (105°C, 5 minutes) to produce a resin film with a thickness of 0.15 mm.

[0109] (Measurement of Melt Viscosity) The melt viscosity and minimum melt viscosity of the resin film at 20°C were measured using a viscoelasticity measuring device (product name: ARES-G2, manufactured by TA Instruments). The measurement conditions were: heating rate: 5°C / min, temperature range: 20°C to 170°C, frequency: 0.5 Hz, strain: 5.0%.

[0110] (Evaluation of Filling Ability) An apparatus was fabricated in which a glass plate simulating an electronic component was placed on a glass plate simulating a substrate, with an air gap in between. Specifically, 30 μm thick spacers (2 mm x 2 mm) were attached to each of the four corners of glass plate A (20 mm x 20 mm) simulating an electronic component. Glass plate A was placed on glass plate B (70 mm x 45 mm) simulating a substrate and fixed via the spacers. A resin film was placed on glass plate A and the resin film was pressurized. Pressurization was performed using a vacuum laminating apparatus under the conditions of vacuuming for 120 seconds, pressurization time for 30 seconds, pressurization pressure of 0.2 MPa, and temperature of 100°C. After pressurization, the state of the air gap between glass plate A and glass plate B was observed from the glass plate B side to evaluate the filling ability of the resin film. Specifically, the filling performance of the resin film was evaluated by determining whether the area filled with the resin film was 50% or more of the total area of ​​voids observed from the glass plate B side, and whether it was less than 50%. The results are shown in Table 1.

[0111]

[0112]

[0113] Details of the components listed in Tables 1 and 2 are as follows: Epoxy resin: Liquid at 25°C, R in general formula (1) １ , R ２ , R ３ and R ４Each of the following is an epoxy resin with a methyl group, epoxy equivalent weight 260 g / eq, viscosity 1800 mPa·s at 25°C (ADEKA Corporation, EP-4000S) Curing agent 1: solid at 25°C, phenol resin containing a biphenyl structure (UBE Corporation, MEHC-7851SS) Curing agent 2: liquid at 25°C, curing agent containing 3,3'-diethyl-4,4'-diaminodiphenylmethane (Nippon Kayaku Co., Ltd., Kayahard A-A) Curing agent 3: liquid at 25°C, diethyltoluenediamine (Mitsubishi Chemical Corporation, JER Cure WA) Methacrylate: liquid at 25°C, 1,9-nonanediol dimethacrylate (NOD-N, Shin Nakamura Chemical Industry Co., Ltd.) Maleimide resin: solid at 25°C, aromatic bismaleimide resin containing an indan ring, number average molecular weight: 1,300 Thermoplastic elastomer: Styrene-based thermoplastic elastomer (P1500, Asahi Kasei Corporation) Curing accelerator 1: 1,3-di(t-butylperoxyisopropyl)benzene (NOF Corporation) Curing accelerator 2: Isocyanate macimidazole (G8009L, Daiichi Kogyo Seiyaku Co., Ltd.) Inorganic filler 1: Silica particles with a volume average particle size of 2.4 μm (EQ2410-SMC, Tird Age Technology Co., Ltd.) Inorganic filler 2: Silica particles with a volume average particle size of 1.0 μm (EQ1010-SMC, Tird Age Technology Co., Ltd.) Inorganic filler 3: Silica particles with a volume average particle size of 1.3 μm (SE5050-SEJ, Admatex Co., Ltd.)

[0114] As shown in Tables 1 and 2, the resin compositions of Examples 1 to 3, which had a melt viscosity of 5000 Pa·s or higher measured at 20°C and a minimum melt viscosity of 200 Pa·s or lower, maintained a good film-like shape and exhibited excellent filling properties.

[0115] 10. Substrate 20. Electronic components 30. Protrusions 40. Resin film 50. Underfill material

Claims

1. A resin composition comprising a curable resin and an inorganic filler, wherein the melt viscosity measured at 20°C is 5000 Pa·s or more, and the minimum melt viscosity is 200 Pa·s or less.

2. The resin composition according to claim 1, which is in the form of a film.

3. The resin composition according to claim 1, wherein the curable resin comprises a curable resin that is liquid at 25°C and a curable resin that is solid at 25°C.

4. The resin composition according to claim 1 for filling the space between a substrate and an electronic component.

5. An electronic component apparatus comprising a substrate, an electronic component, and a cured product of the resin composition according to any one of claims 1 to 4, disposed between the substrate and the electronic component.

6. A method for manufacturing an electronic component device comprising a substrate and an electronic component, the method comprising the step of filling the space between the substrate and the electronic component with the resin composition described in any one of claims 1 to 4.

7. The method for manufacturing an electronic component device according to claim 6, wherein the filling of the resin composition is carried out by allowing a portion of the film-like resin composition to enter the space.

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