Ceramic substrate unit for power module and method for manufacturing ceramic substrate unit for power module
The ceramic substrate unit for power modules addresses bonding defects and thermal conductivity issues by using Ag alloy filler layers with varying Ag-to-Cu ratios, ensuring efficient heat dissipation and mechanical rigidity for stable power transfer in high-voltage and high-current conditions.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- AMOGREENTECH CO LTD
- Filing Date
- 2025-10-31
- Publication Date
- 2026-06-04
AI Technical Summary
Conventional power module semiconductor designs face challenges in achieving miniaturization while maintaining high efficiency, mechanical rigidity, and effective heat dissipation, particularly due to bonding defects and thermal conductivity issues, which can lead to semiconductor chip degradation and mechanical damage.
A ceramic substrate unit for power modules is designed with a ceramic substrate having upper and lower metal layers, reinforced by a filler layer composed of Ag alloy with varying Ag-to-Cu ratios, and a reinforcing substrate, which includes a second filler layer with a higher Ag content to reduce bonding temperatures and enhance thermal conductivity and mechanical rigidity.
The design effectively dissipates heat from semiconductor chips, maintains stable bonding, and ensures robust mechanical rigidity, enabling reliable power transfer in high-voltage and high-current environments by reducing thermal stress and preventing layer separation.
Smart Images
Figure KR2025017702_04062026_PF_FP_ABST