Circuit substrate, electronic component, power supply assembly, and vehicle

Abstract

A circuit substrate, an electronic component, a power supply assembly, and a vehicle. The circuit substrate comprises at least one circuit layer and a heat exchange layer, wherein the heat exchange layer and the circuit layer are stacked, and the heat exchange layer is stacked on one side of the circuit layer and is in contact with the circuit layer.

Description

Circuit boards, electronic components, power supply assemblies, and vehicles

[0001] This application claims priority to Chinese patent application No. 202423062310.4, filed on December 11, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of vehicle technology, and more particularly to a circuit board, electronic components, power supply assembly, and vehicle. Background Technology

[0003] Typically, circuit boards mainly include direct bonding copper (DBC) substrates, which are widely used in high-power power electronic modules, aerospace, industrial electronics and other products. Summary of the Invention

[0004] This disclosure provides a circuit board, electronic components, power supply assembly, and vehicle.

[0005] On one hand, a circuit board is provided. The circuit board includes at least one circuit layer and a heat exchange layer. The heat exchange layer is stacked on the circuit layer and is in contact with the circuit layer.

[0006] Some embodiments of this disclosure provide a circuit board. By including a circuit layer and a heat exchange layer on the circuit board, the heat exchange layer is integrated into the circuit board. This eliminates the need to set up a heat exchange structure in the electronic components, and also eliminates the need to connect the circuit board to the heat exchange structure of the electronic components. This simplifies the connection process between the circuit board and the heat exchange structure of the electronic components, and eliminates the need for a connection layer between the circuit board and the heat exchange structure. Therefore, the assembled electronic components can be lighter, the cost can be reduced, and the structure can be more compact.

[0007] In some embodiments, the heat exchange layer includes a heat exchange body and a heat exchange protrusion. The heat exchange body is stacked on and in contact with the circuit layer, and the heat exchange protrusion is mounted on the side of the heat exchange body opposite to the circuit layer.

[0008] This disclosure provides a circuit board in some embodiments. By providing a heat exchange layer including a heat exchange body and heat exchange protrusions, the heat exchange layer can have a good heat exchange level, which can ensure the reliability of the circuit board during operation.

[0009] In some embodiments, the heat exchange protrusion includes at least one of a heat exchange column and a heat exchange fin.

[0010] This disclosure provides a circuit board in some embodiments, which can further improve the heat exchange effect of the heat exchange protrusion by means of the structure of the heat exchange protrusion.

[0011] In some embodiments, at least a portion of the heat exchange layer is made of metal.

[0012] Some embodiments of this disclosure provide a circuit board in which the heat exchange layer is at least partially made of metal, thereby giving the heat exchange body good support and thermal conductivity.

[0013] In some embodiments, the circuit board further includes at least one thermally conductive insulating layer located between the circuit layer and the heat exchange layer.

[0014] Some embodiments of this disclosure provide a circuit board in which a thermally conductive insulating layer is provided, which enables insulation between the circuit layer and the heat exchange layer and facilitates the transfer of heat from the circuit layer to the heat exchange layer, thereby facilitating heat exchange.

[0015] In some embodiments, the thermally conductive insulating layer includes an insulating adhesive, and the heat exchange layer is connected to the circuit layer through the insulating adhesive.

[0016] This disclosure provides a circuit board in some embodiments, which simplifies the connection between the circuit layer and the thermally conductive insulating layer, as well as the connection between the heat exchange layer and the thermally conductive insulating layer, by using insulating adhesive, and the connection process is also simplified.

[0017] In some embodiments, the peel strength of the insulating adhesive is greater than or equal to 1 N / mm.

[0018] Some embodiments of this disclosure provide a circuit board in which the peel strength of the insulating adhesive is set to achieve better adhesion, thereby reducing the risk of connection failure between the circuit layer and the thermally conductive insulating layer, and between the heat exchange layer and the thermally conductive insulating layer.

[0019] In some embodiments, the breakdown voltage of the insulating adhesive is greater than or equal to 20 kV / mm.

[0020] This disclosure provides a circuit board in some embodiments. By setting the breakdown voltage of the insulating adhesive, the insulating adhesive has a good insulating effect, reducing the risk of insulation failure between the circuit layer and the heat exchange layer, and ensuring the reliability of the circuit board.

[0021] In some embodiments, the thermal conductivity of the insulating adhesive is greater than or equal to 3 W / mK and less than or equal to 25 W / mK.

[0022] Some embodiments of this disclosure provide a circuit board in which the thermal conductivity of the insulating adhesive is set so that the insulating adhesive has a good thermal conductivity while the cost of the insulating adhesive is kept within a suitable range.

[0023] In some embodiments, the thickness of the insulating adhesive is greater than or equal to 50 μm and less than or equal to 350 μm.

[0024] Some embodiments of this disclosure provide a circuit board in which the thickness of the insulating adhesive is set to ensure that the insulating adhesive has good insulation properties, reduce the risk of insulation failure, and ensure the thermal conductivity of the insulating adhesive.

[0025] In some embodiments, at least one thermally conductive insulating layer includes multiple thermally conductive insulating layers, and the multiple thermally conductive insulating layers are connected to at least one circuit layer.

[0026] Some embodiments of this disclosure provide a circuit board in which multiple thermally conductive insulating layers are connected to a single circuit layer, thereby saving material costs for the thermally conductive insulating layers and allowing for flexible adjustment of the number of thermally conductive insulating layers.

[0027] In some embodiments, at least one thermally conductive insulating layer includes a single thermally conductive insulating layer located between the circuit layer and the heat exchange layer.

[0028] This disclosure provides a circuit board in some embodiments, which facilitates the installation of the thermally conductive insulating layer by setting the number of thermally conductive insulating layers to one.

[0029] In some embodiments, at least one line layer includes multiple line layers.

[0030] This disclosure provides a circuit board with multiple circuit layers, allowing different electronic devices to be mounted on each circuit layer. This enables the formation of multiple electronic components on a single circuit board, which, compared to related technologies that form one electronic component on a single circuit board, reduces the packaging cost of electronic components and increases power density.

[0031] In some embodiments, the heat exchange layer includes a connecting portion and an enclosing portion. The connecting portion is stacked with a thermally conductive insulating layer. The enclosing portion encloses the connecting portion.

[0032] Some embodiments of this disclosure provide a circuit board in which a connecting portion and a surrounding portion are provided. The surrounding portion is used to connect with a covering portion. After the covering portion is connected with the heat exchange layer, it can encapsulate the circuit board. The arrangement of the covering portion facilitates the encapsulation of the circuit board.

[0033] In some embodiments, the thickness of the circuit layer is greater than or equal to 0.2 mm and less than or equal to 5 mm.

[0034] Some embodiments of this disclosure provide a circuit board that, by setting the thickness of the circuit layer, can ensure the electrical connection function of the circuit layer while having a low impact on the overall thickness of the circuit board.

[0035] This disclosure provides an electronic component, including the circuit board described above, through some embodiments.

[0036] Some embodiments of this disclosure provide an electronic component that, through the arrangement of a circuit board, can reduce the process of connecting the circuit board and the heat exchange structure of the electronic component, and can reduce costs and weight, making the structure of the electronic component more compact.

[0037] In some embodiments, the electronic component further includes at least one device body, which is connected to the circuit layer.

[0038] This disclosure provides an electronic component in some embodiments, which makes the structure of the electronic component more complete by including a component body.

[0039] In some embodiments, the device body includes a chip and connection terminals. The connection terminals are connected to the circuit layer and electrically connected to the chip.

[0040] This disclosure provides an electronic component in some embodiments, which facilitates signal transmission by including a chip and connection terminals in the component body.

[0041] In some embodiments, the chip includes a semiconductor device.

[0042] This disclosure provides some embodiments of an electronic component that, through the use of a chip including a semiconductor device, can better meet usage requirements.

[0043] In some embodiments, the semiconductor device includes at least one of a diode, a metal-oxide-semiconductor field-effect transistor (MOSFET), and an insulated-gate bipolar transistor (IGBT).

[0044] This disclosure provides an electronic component with some embodiments that, through the above-described configuration, enable more flexible circuit design for the electronic component.

[0045] In some embodiments, the device body further includes a thermistor, which is mounted on the circuit layer and electrically connected to the connection terminal.

[0046] This disclosure provides an electronic component in some embodiments that, by setting a thermistor, enables the temperature of the electronic component to be detected, which is beneficial for monitoring the electronic component.

[0047] In some embodiments, the device body further includes a gate resistor, which is mounted on the circuit layer and electrically connected to the chip.

[0048] This disclosure provides an electronic component that enables current sharing among chips by setting a gate resistor.

[0049] In some embodiments, at least one device body includes multiple device bodies, and the multiple device bodies are connected to at least one line layer.

[0050] This disclosure provides an electronic component that, by having multiple component bodies, integrates more circuit functions within a limited space, thereby improving the performance and integration of the electronic component.

[0051] In some embodiments, the electronic components include at least one of a charging circuit assembly and a converter circuit assembly.

[0052] This disclosure provides an electronic component, which may include at least one of a charging circuit assembly and a converter circuit assembly, such that the circuit board of at least one of the charging circuit assembly and the converter circuit assembly has a higher degree of integration, reduces weight and cost, and simplifies the installation process.

[0053] In some embodiments, the charging circuit assembly includes at least one of a power factor correction (PFC) circuit and / or an LLC resonant circuit.

[0054] This disclosure provides an electronic component through some embodiments, which can improve power conversion efficiency and provide a stable output voltage through the above-described configuration.

[0055] In some embodiments, the converter circuit assembly includes at least one of a DC primary side and a DC secondary side.

[0056] This disclosure provides an electronic component through several embodiments, which can improve the working efficiency, reduce costs, enhance reliability, and improve dynamic response capabilities of the electronic component by the above-described configuration.

[0057] In some embodiments, the electronic component further includes a cover portion, which is connected to the heat exchange layer and encloses to form a mounting cavity, with at least a portion of the component body located in the mounting cavity.

[0058] This disclosure provides an electronic component with certain embodiments that, through the above-described configuration, protect the circuit board and the component body, thereby improving the reliability of the electronic component.

[0059] This disclosure provides an electronic component in some embodiments. The heat exchange layer includes a connecting portion and a surrounding portion, which facilitates the connection between the surrounding portion and the heat exchange layer. This protects the circuit board and the device body, thereby improving the reliability of the electronic component.

[0060] In some embodiments, the cover portion includes a frame and a cover plate. The frame is located between the cover plate and the heat exchange layer, and the frame and the cover plate together form an installation cavity.

[0061] Some embodiments of this disclosure provide an electronic component in which the cover portion includes a frame and a cover plate, making the cover portion easy to assemble, transport, and disassemble.

[0062] In some embodiments, the electronic component further includes a packaging section located in the mounting cavity and connected between the cover section and the circuit board.

[0063] This disclosure provides an electronic component in some embodiments, which also includes a packaging section to provide a buffering function inside the electronic component.

[0064] In some embodiments, the encapsulation portion includes a cushioning adhesive.

[0065] This disclosure provides an electronic component in some embodiments, which facilitates the potting of a cushioning material by including a cushioning adhesive in the encapsulation portion.

[0066] On the other hand, a power supply assembly is provided. The power supply assembly includes a circuit board and the aforementioned electronic components, with the electronic components mounted on the circuit board.

[0067] Some embodiments of this disclosure provide a power supply assembly that, through the arrangement of circuit boards and electronic components, can reduce the installation process of the power supply assembly and reduce the cost and weight of the power supply assembly.

[0068] In another aspect, a vehicle is provided. The vehicle includes the aforementioned power supply components.

[0069] This disclosure provides a vehicle through some embodiments, which, with the above-described configuration, can reduce vehicle installation steps and lower assembly costs. Attached Figure Description

[0070] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. However, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0071] Figure 1 is a structural diagram of a circuit board according to some embodiments of the present disclosure;

[0072] Figure 2 is a side view of a circuit board shown in Figure 1;

[0073] Figure 3 is a structural diagram of an electronic component according to some embodiments of the present disclosure;

[0074] Figure 4 is an exploded view of an electronic component shown in Figure 3;

[0075] Figure 5 is a structural diagram of an electronic component shown in Figure 3 from another perspective;

[0076] Figure 6 is a cross-sectional view of an electronic component shown in Figure 3;

[0077] Figure 7 is a structural diagram of a partial structure of the electronic component shown in Figure 3;

[0078] Figure 8 is a top view of a partial structure of an electronic component shown in Figure 3;

[0079] Figure 9 is a structural diagram of a vehicle according to some embodiments of the present disclosure;

[0080] Figure 10 is a block diagram of a power supply assembly according to some embodiments of the present disclosure.

[0081] Reference numerals: 1. Vehicle; 11. Body; 12. Wheel; 1000. Power supply assembly; 300. Circuit board; 100. Electronic component; 110. Circuit board; 111. Circuit layer; 112. Thermally conductive insulating layer; 113. Heat exchange layer; 113a. Heat exchange body; 113b. Heat exchange protrusion; 1131. Connecting part; 1132. Enclosing part; 120. Device body; 121. Chip; 122. Connecting terminal; 130. Covering part; 131. Frame; 132. Cover plate; 1301. Mounting cavity; A1. Charging circuit assembly; A11. PFC circuit; A111. PFC fast transistor; A112. PFC slow transistor; A12. LLC resonant circuit; A121. LLC primary side; A122. LLC secondary side; B1, Converter circuit components; B11, DC primary side; B12, DC secondary side. Detailed Implementation

[0082] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. However, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0083] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0084] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "communication" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a direct connection or an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0085] In embodiments of this disclosure, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, article, or apparatus that includes that element.

[0086] In this disclosure, the terms "exemplarily" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplarily" or "for example" in this disclosure should not be construed as being more preferred or advantageous than other embodiments or designs. Rather, the use of terms such as "exemplarily" or "for example" is intended to present the relevant concepts by way of example.

[0087] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0088] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0089] In related technologies, direct-bonding copper (DBC) substrates mainly consist of a three-layer structure: a circuit layer, an insulating layer, and a metal layer stacked sequentially. The circuit layer is primarily used for connection to components such as chips and resistors. The insulating layer provides insulation between the circuit layer and the metal layer. The metal layer is used for connection to external heat exchange devices. During the assembly of electronic components from the DBC substrate, the metal layer needs to connect to the external heat exchange devices. Due to the complex structure and weight of the DBC substrate, and the need for the metal layer to connect to external heat exchange devices, the assembly process of the DBC substrate is complex.

[0090] To address the aforementioned technical problems, some embodiments of this disclosure provide a circuit board.

[0091] Referring to Figures 1 and 2, some embodiments of this disclosure provide a circuit board 110, which includes a circuit layer 111 and a heat exchange layer 113. The heat exchange layer is stacked on the circuit layer and is in contact with the circuit layer.

[0092] This disclosure provides a circuit board 110 in some embodiments. By including a circuit layer 111 and a heat exchange layer 113 in the circuit board 110, the heat exchange layer 113 is integrated into the circuit board 110. This eliminates the need to set a heat exchange structure in the electronic component 100 (as shown in FIG. 3) and to connect the circuit board 110 with the heat exchange structure of the electronic component 100. This simplifies the connection process between the circuit board 110 and the heat exchange structure of the electronic component 100 and eliminates the need for a connection layer between the circuit board 110 and the heat exchange structure. Therefore, the assembled electronic component 100 can be lighter and the cost can be reduced, making the structure more compact.

[0093] In some embodiments, as shown in FIG2, the heat exchange layer 113 includes a heat exchange body 113a and a heat exchange protrusion 113b. The heat exchange body 113a is stacked on and in contact with the circuit layer 111, and the heat exchange protrusion 113b is installed on the side of the heat exchange body 113a away from the circuit layer 111.

[0094] This disclosure provides a circuit board 110 in some embodiments. By providing a heat exchange layer 113 including a heat exchange body 113a and a heat exchange protrusion 113b, the heat exchange layer 113 can have good heat exchange capability, which can ensure the reliability of the circuit board 110 during operation.

[0095] In some embodiments, the heat exchange protrusion 113b includes at least one of a heat exchange column and a heat exchange fin.

[0096] This disclosure provides a circuit board 110 in some embodiments, which can further improve the heat exchange effect of the heat exchange protrusion 113b by the structural arrangement of the heat exchange protrusion 113b.

[0097] In some embodiments, at least a portion of the heat exchange layer 113 is made of metal.

[0098] Some embodiments of this disclosure provide a circuit board 110, in which at least a portion of the heat exchange layer 113 is made of metal, thereby giving the heat exchange body 113a good support and thermal conductivity.

[0099] In some embodiments, as shown in FIG1 and FIG2, the circuit board 110 further includes a thermally conductive insulating layer 112, which is located between the circuit layer 111 and the heat exchange layer 113.

[0100] Some embodiments of this disclosure provide a circuit board 110. By including a thermally conductive insulating layer 112 in the circuit board 110, insulation can be achieved between the circuit layer 111 and the heat exchange layer 113, and the heat of the circuit layer 111 can be transferred to the heat exchange layer 113 to facilitate heat exchange.

[0101] In some embodiments, the thermally conductive insulating layer 112 includes insulating adhesive, and the heat exchange layer 113 is connected to the circuit layer 111 through the insulating adhesive.

[0102] Some embodiments of this disclosure provide a circuit board 110, which, through the application of insulating adhesive, makes the connection between the circuit layer 111 and the thermally conductive insulating layer 112, as well as the connection between the heat exchange layer 113 and the thermally conductive insulating layer 112, simpler and the connection process more streamlined.

[0103] In some embodiments, the peel strength of the insulating adhesive is greater than or equal to 1 N / mm.

[0104] For example, the peel strength of insulating adhesive includes 1N / mm, 2N / mm, 3N / mm, 4N / mm, 5N / mm, etc.

[0105] If the peel strength of the insulating adhesive is less than 1 N / mm, the insulating adhesive cannot meet the connection requirements with the heat exchange layer 113 and the circuit layer 111, and the reliability of the circuit board 110 is poor.

[0106] Some embodiments of this disclosure provide a circuit board 110. By setting the peel strength of the insulating adhesive, the insulating adhesive can have a better bonding effect, reducing the risk of connection failure between the circuit layer 111 and the thermally conductive insulating layer 112, and between the heat exchange layer 113 and the thermally conductive insulating layer 112.

[0107] In some embodiments, the breakdown voltage of the insulating adhesive is greater than or equal to 20 kV / mm.

[0108] For example, the breakdown voltage of insulating adhesive includes 20kV / mm, 30kV / mm, 40kV / mm, 50kV / mm, 60kV / mm, etc.

[0109] If the breakdown voltage of the insulating adhesive is less than 20kV / mm, the insulating performance of the adhesive is poor, which can easily cause the signal of the line layer 111 to be transmitted to the external circuit, affecting the signal transmission effect.

[0110] This disclosure provides a circuit board 110 in some embodiments. By setting the breakdown voltage of the insulating adhesive, the insulating adhesive has a good insulation effect, which reduces the risk of insulation failure between the circuit layer 111 and the heat exchange layer 113 and ensures the reliability of the circuit board 110.

[0111] In some embodiments, the thermal conductivity of the insulating adhesive is greater than or equal to 3 W / mK and less than or equal to 25 W / mK.

[0112] For example, the thermal conductivity of insulating adhesives includes 3W / mK, 10W / mK, 15W / mK, 20W / mK, 25W / mK, etc.

[0113] If the thermal conductivity of the insulating adhesive is less than 3 W / mK, its thermal conductivity cannot meet the thermal requirements of the circuit layer 111, which can easily cause heat accumulation in the circuit layer 111 and affect its service life. If the thermal conductivity of the insulating adhesive is greater than 25 W / mK, its thermal conductivity is too strong, which can easily cause the circuit layer 111 to lose temperature in low-temperature environments.

[0114] In some embodiments, the thickness of the insulating adhesive is greater than or equal to 50 μm and less than or equal to 350 μm.

[0115] For example, the thickness of the insulating adhesive includes 50μm, 100μm, 200μm, 300μm, and 350μm.

[0116] If the thickness of the insulating adhesive is less than 50 μm, the bonding strength of the insulating adhesive may not meet the requirements; if the thickness of the insulating adhesive is greater than 350 μm, the thermal conductivity of the insulating adhesive may not meet the requirements.

[0117] Some embodiments of this disclosure provide a circuit board 110, which, by setting the thickness of the insulating adhesive, can ensure that the insulating adhesive has good insulation properties, reduce the risk of insulation failure, and ensure the thermal conductivity of the insulating adhesive.

[0118] Furthermore, by setting the thermal conductivity of the insulating adhesive, it is possible to ensure that the insulating adhesive has a good thermal conductivity while reducing the cost of the insulating adhesive.

[0119] In some embodiments, there are multiple thermally conductive insulating layers 112, and the multiple thermally conductive insulating layers 112 are connected to one or more circuit layers 111.

[0120] Some embodiments of this disclosure provide a circuit board 110 in which multiple thermally conductive insulating layers 112 are connected to a circuit layer 111, which can save the material cost of the thermally conductive insulating layers 112 and also allows for flexible adjustment of the number of thermally conductive insulating layers 112.

[0121] In some embodiments, the number of thermally conductive insulating layers 112 is a single layer, and the single thermally conductive insulating layer 112 is located between the circuit layer 111 and the heat exchange layer 113.

[0122] This disclosure provides a circuit board 110 in some embodiments, which facilitates the installation of the thermally conductive insulating layer 112 by setting the number of thermally conductive insulating layers 112 to one.

[0123] In some embodiments, the number of line layers 111 is multiple.

[0124] This disclosure provides a circuit board 110 in some embodiments. By setting the number of circuit layers 111 to be multiple, different device bodies 120 can be mounted on each circuit layer 111 (as shown in FIG3). In this way, multiple electronic components 100 can be formed on a single circuit board 110. Compared with related technologies that form one electronic component 100 on a single circuit board 110, the packaging cost of the electronic component 100 can be reduced and the power density can be increased.

[0125] In some embodiments, the number of line layers 111 is four, and the four line layers 111 are arranged in the same direction.

[0126] This disclosure provides a circuit board 110 in some embodiments, which can better meet installation needs by setting the number of circuit layers 111.

[0127] In some embodiments, there are four circuit layers 111. One circuit layer 111 houses a device body 120 that, together with the circuit layer 111, forms a power factor correction (PFC) fast transistor and a PFC slow transistor. Another circuit layer 111 houses a device body 120 that, together with the circuit layer 111, forms the primary side of a resonance circuit (LLC). A third circuit layer 111 houses a device body 120 that, together with the circuit layer 111, forms the secondary side of the LLC circuit and the primary side of a DC circuit. A fourth circuit layer 111 houses a device body 120 that, together with the circuit layer 111, forms the secondary side of a DC circuit. The PFC fast transistor, PFC slow transistor, LLC primary side, and LLC secondary side together form a charger circuit assembly. The DC primary side and DC secondary side together form a DC / DC circuit assembly. The charger circuit assembly converts AC power to DC power to charge the power battery. The DC / DC circuit assembly converts the high-voltage DC power output from the battery pack to low-voltage DC power to charge the vehicle's low-voltage electrical appliances.

[0128] In some embodiments, as shown in FIG2, the heat exchange layer 113 includes a connecting portion 1131 and an enclosing portion 1132. The connecting portion 1131 is stacked with the thermally conductive insulating layer 112. The enclosing portion 1132 is disposed around the connecting portion 1131.

[0129] This disclosure provides a circuit board 110 with a connecting portion 1131 and a surrounding portion 1132. The surrounding portion 1132 is used to connect with a cover portion 130 (as shown in FIG3). After the cover portion 130 is connected to the heat exchange layer 113, it can encapsulate the circuit board 110. The cover portion 130 facilitates the encapsulation of the circuit board 110.

[0130] In some embodiments, the thickness of the circuit layer 111 is greater than or equal to 0.2 mm and less than or equal to 5 mm.

[0131] For example, the thickness of the line layer 111 includes 0.2mm, 1mm, 2mm, 3mm, 4mm, and 5mm.

[0132] Some embodiments of this disclosure provide a circuit board 110, in which the thickness of the line layer 111 is set so as to ensure the electrical connection function of the line layer 111 while minimizing the impact of the line layer 111 on the overall thickness of the circuit board 110.

[0133] Please refer to Figures 3 to 8. Some embodiments of this disclosure also provide an electronic component 100, including the circuit board 110 described above.

[0134] Some embodiments of this disclosure provide an electronic component 100. By setting up a circuit board 110, the process of connecting the circuit board 110 and the heat exchange structure of the electronic component 100 can be reduced, and the cost and weight can be reduced, making the structure of the electronic component 100 more compact.

[0135] In some embodiments, as shown in Figures 3, 6 and 7, the electronic component 100 includes a device body 120, which is connected to the circuit layer 111.

[0136] The device body 120 includes, but is not limited to, chip 121, connection terminal 122, connection line 123, resistor, etc. The connection terminal 122 is connected to the circuit layer 111 and electrically connected to the chip 121.

[0137] For example, chip 121 is connected to circuit layer 111 by means of soldering or sintering. One end of connecting wire 123 is connected to circuit layer 111, and the other end is connected to chip 121. Connecting wire 123 includes, but is not limited to, structures such as aluminum wire, copper wire, and copper strip. Connecting terminal 122 includes, but is not limited to, DC positive terminal and DC negative terminal.

[0138] This disclosure provides an electronic component 100, which includes a device body 120, making the structure of the electronic component 100 more complete.

[0139] In some embodiments, as shown in FIG6, the device body 120 includes a chip 121 and a connection terminal 122. The connection terminal 122 connects to the circuit layer 111 and is electrically connected to the chip 121.

[0140] This disclosure provides an electronic component 100, which facilitates signal transmission through the component body 120 including a chip 121 and a connection terminal 122.

[0141] In some embodiments, chip 121 includes a semiconductor device.

[0142] This disclosure provides an electronic component 100, which, through a chip 121 including a semiconductor device, can better meet usage requirements.

[0143] In some embodiments, the semiconductor device includes at least one of a diode, a metal-oxide-semiconductor field-effect transistor (MOSFET), and an insulated-gate bipolar transistor (IGBT).

[0144] For example, diodes include fast recovery diodes (FRDs).

[0145] This disclosure provides an electronic component 100 through some embodiments, which allows for more flexible circuit design of the electronic component 100.

[0146] In some embodiments, the resistor included in the device body 120 includes at least one of a thermistor and a gate resistor. The thermistor is mounted on the line layer 111 and electrically connected to the connection terminal 122. The gate resistor is mounted on the line layer 111 and electrically connected to the chip 121.

[0147] The electronic component 100 provided in some embodiments of this disclosure can detect the temperature of the electronic component 100 by setting a thermistor, which is beneficial for monitoring the electronic component 100. By setting a gate resistor, current sharing among the chips 121 can be achieved.

[0148] In some embodiments, there are multiple device bodies 120, and the multiple device bodies 120 are connected to one or more line layers 111.

[0149] Some embodiments of this disclosure provide an electronic component 100, which, by having multiple component bodies 120, can integrate more circuit functions within a limited space, thereby improving the performance and integration of the electronic component 100.

[0150] In some embodiments, as shown in FIG8, the electronic component 100 includes at least one of a charging circuit assembly A1 and a converter circuit assembly B1.

[0151] Some embodiments of this disclosure provide an electronic component 100, which may include at least one of a charging circuit assembly A1 and a converter circuit assembly B1, such that at least one of the charging circuit assembly A1 and the converter circuit assembly B1 is connected to a circuit board 110, which has a higher degree of integration, can reduce weight and cost, and simplifies the installation process.

[0152] In some embodiments, as shown in FIG8, the charging circuit assembly A1 includes at least one of a PFC circuit A11 and an LLC resonant circuit A12.

[0153] The PFC circuit A11 includes at least one of the PFC fast transistor A111 and the PFC slow transistor A112. The LLC resonant circuit A12 includes at least one of the LLC primary side A121 and the LLC secondary side A122.

[0154] For example, PFC circuit A11 includes PFC fast transistor A111 and PFC slow transistor A112, and LLC resonant circuit A12 includes LLC primary side A121 and LLC secondary side A122.

[0155] This disclosure provides an electronic component 100 through some embodiments, which can improve power conversion efficiency and provide a stable output voltage through the above-described configuration.

[0156] In some embodiments, the converter circuit assembly B1 includes at least one of the DC primary side B11 and the DC secondary side B12.

[0157] This disclosure provides an electronic component 100 through some embodiments. The above-described configuration can improve the working efficiency of the electronic component 100, reduce costs, enhance reliability, and improve dynamic response capabilities.

[0158] In some embodiments, as shown in Figures 3, 5 and 6, the electronic component 100 includes a cover portion 130, which is connected to and encloses a heat exchange layer 113 to form a mounting cavity 1301. At least a portion of the thermally conductive insulating layer 112, the circuit layer 111 and the device body 120 are located in the mounting cavity.

[0159] For example, the cover 130 includes a plastic material.

[0160] This disclosure provides an electronic component 100 in some embodiments. The cover portion 130 facilitates the connection between the component body 120 and the heat exchange layer 113, and can protect the circuit board 110 and the component body 120, thereby improving the reliability of the electronic component 100.

[0161] For example, the cover portion 130 is provided on the side of the circuit board away from the heat exchange protrusion.

[0162] In some embodiments, as shown in FIG2, the heat exchange layer 113 includes a connecting portion 1131 and an enclosure portion 1132. The connecting portion 1131 and the thermally conductive insulating layer 112 are stacked together, and the enclosure portion 1132 is disposed around the connecting portion 1131.

[0163] In some embodiments, as shown in FIG4, the cover portion 130 includes a frame 131 and a cover plate 132. The frame 131 is located between the cover plate 132 and the heat exchange layer 113, and the frame 131 and the cover plate 132 enclose a mounting cavity.

[0164] The connection methods between the frame 131 and the heat exchange layer 113 include, but are not limited to, detachable connection and adhesive bonding. The connection methods between the frame 131 and the cover plate 132 include, but are not limited to, snap-fit ​​connection and bolt connection.

[0165] Some embodiments of this disclosure provide an electronic component 100, in which the cover portion 130 includes a frame 131 and a cover plate 132, making the cover portion 130 easy to assemble, transport and disassemble.

[0166] In some embodiments, the electronic component 100 further includes a packaging section located in the mounting cavity and connected between the cover section 130 and the circuit board 110.

[0167] This disclosure provides an electronic component 100 in some embodiments, which also includes a packaging section, so that the electronic component 100 has a buffering function.

[0168] In some embodiments, the cushioning portion includes cushioning rubber.

[0169] Buffering adhesives include, but are not limited to, silicone gels, epoxy resins, etc.

[0170] This disclosure provides an electronic component 100, which facilitates the potting of buffer material by including buffer adhesive in the buffer portion.

[0171] As shown in Figure 10, some embodiments of this disclosure also provide a power supply assembly. The power supply assembly 1000 includes a circuit board 300 and electronic components 100 from any of the above embodiments, the electronic components 100 being mounted on the circuit board.

[0172] Some embodiments of this disclosure provide a power supply assembly that, through the arrangement of circuit boards and electronic components 100, can reduce the installation process of the power supply assembly and reduce the cost and weight of the power supply assembly.

[0173] Referring to Figure 9, some embodiments of this disclosure also provide a vehicle. This vehicle 1 includes the power supply assembly of any of the above embodiments.

[0174] This disclosure provides a vehicle 1 through some embodiments, which can reduce the vehicle installation process and lower assembly costs through the above-described configuration.

[0175] Vehicle 1 can be a pure electric vehicle, a hybrid electric vehicle, a plug-in hybrid electric vehicle, a range-extended electric vehicle, or a gasoline-powered vehicle. Vehicle 1 can also be a sedan, truck, bus, lorry, trailer, etc. Vehicle 1 includes a body 11 and wheels 12, with the wheels 12 supporting the body 11, and the power supply components are installed in vehicle 1.

[0176] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A circuit board (110), comprising: At least one line layer (111); as well as A heat exchange layer (113) is stacked on the circuit layer (111) and in contact with the circuit layer (111).

2. The circuit board (110) according to claim 1, wherein, The heat exchange layer (113) includes: A heat exchange body (113a) is stacked on and in contact with the circuit layer (111); and A heat exchange protrusion (113b) is installed on the side of the heat exchange body (113a) away from the circuit layer (111).

3. The circuit board (110) according to claim 2, wherein, The heat exchange protrusion (113b) includes at least one of a heat exchange column and a heat exchange fin.

4. The circuit board (110) according to any one of claims 1 to 3, wherein, At least a portion of the heat exchange layer (113) is made of metal.

5. The circuit board (110) according to claim 4 further includes at least one thermally conductive insulating layer (112), the thermally conductive insulating layer (112) being located between the circuit layer (111) and the heat exchange layer (113).

6. The circuit board (110) according to claim 5, wherein, The thermally conductive insulating layer (112) includes insulating adhesive, and the heat exchange layer (113) is connected to the circuit layer (111) through the insulating adhesive.

7. The circuit board (110) according to claim 6, wherein, The peel strength of the insulating adhesive is greater than or equal to 1 N / mm.

8. The circuit board (110) according to claim 6 or 7, wherein, The breakdown voltage of the insulating adhesive is greater than or equal to 20kV / mm.

9. The circuit board (110) according to any one of claims 6 to 8, wherein, The thermal conductivity of the insulating adhesive is greater than or equal to 3 W / mK and less than or equal to 25 W / mK.

10. The circuit board (110) according to any one of claims 6 to 9, wherein, The thickness of the insulating adhesive is greater than or equal to 50 μm and less than or equal to 350 μm.

11. The circuit board (110) according to any one of claims 5 to 10, wherein, The at least one thermally conductive insulating layer (112) includes a plurality of thermally conductive insulating layers (112), which are connected to the at least one circuit layer (111).

12. The circuit board (110) according to any one of claims 5 to 10, wherein, The at least one thermally conductive insulating layer (112) includes a single thermally conductive insulating layer (112) located between the circuit layer (111) and the heat exchange layer (113).

13. The circuit board (110) according to any one of claims 1 to 12, wherein, The at least one line layer (111) includes multiple line layers (111).

14. The circuit board (110) according to any one of claims 1 to 13, further comprising a thermally conductive insulating layer (112), the thermally conductive insulating layer (112) being located between the circuit layer (111) and the heat exchange layer (113), wherein, The heat exchange layer (113) includes: The connecting portion (1131) is stacked with the thermally conductive insulating layer (112); and Enclosing portion (1132), enclosing the connecting portion (1131).

15. The circuit board (110) according to any one of claims 1 to 14, wherein, The thickness of the line layer (111) is greater than or equal to 0.2 mm and less than or equal to 5 mm.

16. An electronic component (100) comprising a circuit board (110) according to any one of claims 1 to 15.

17. The electronic component (100) according to claim 16 further includes at least one device body (120) connected to the circuit layer (111).

18. The electronic component (100) according to claim 17, wherein the component body (120) comprises: Chip (121); as well as The connection terminal (122) is connected to the circuit layer (111) and electrically connected to the chip (121).

19. The electronic component (100) according to claim 18, wherein, The chip (121) includes a semiconductor device.

20. The electronic component (100) according to claim 19, wherein, The semiconductor device includes at least one of a diode, a metal-oxide-semiconductor field-effect transistor (MOSFET), and an insulated-gate bipolar transistor (IGBT).

21. The electronic component (100) according to any one of claims 18 to 20, wherein, The device body (120) also includes a thermistor, which is mounted on the circuit layer (111) and electrically connected to the connection terminal (122).

22. The electronic component (100) according to any one of claims 18 to 21, wherein, The device body (120) also includes a gate resistor, which is mounted on the line layer (111) and electrically connected to the chip (121).

23. The electronic component (100) according to any one of claims 17 to 22, wherein, The at least one device body (120) includes a plurality of device bodies (120), which are connected to the at least one line layer (111).

24. The electronic component (100) according to claim 23 further includes at least one of a charging circuit assembly (A1) and a converter circuit assembly (B1).

25. The electronic component (100) according to claim 24, wherein, The charging circuit assembly (A1) includes at least one of a power factor correction (PFC) circuit (A11) and / or an LLC resonant circuit (A12).

26. The electronic component (100) according to claim 24 or 25, wherein, The converter circuit assembly (B1) includes at least one of a DC primary side (B11) and a DC secondary side (B12).

27. The electronic component (100) according to any one of claims 19 to 26 further includes a cover portion (130), the cover portion (130) being connected to the heat exchange layer (113) and enclosing to form a mounting cavity (1301), at least a portion of the device body (120) being located in the mounting cavity (1301).

28. The electronic component (100) according to claim 27, wherein, The cover (130) includes: Frame (131); and The cover plate (132) and the frame (131) are located between the cover plate (132) and the heat exchange layer (113), and the frame (131) and the cover plate (132) enclose the mounting cavity (1301).

29. The electronic component (100) according to claim 27 or 28 further includes a packaging portion located in the mounting cavity (1301) and connected between the cover portion (130) and the circuit board (110).

30. The electronic component (100) according to claim 29, wherein, The encapsulation section includes a cushioning adhesive.

31. A power supply assembly (1000), comprising: Circuit board (300); and The electronic component (100) according to any one of claims 16 to 30 is mounted on the circuit board (300).

32. A vehicle (1) comprising a power supply assembly (1000) according to claim 31.

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