Display panel, display panel manufacturing method, and display apparatus

Abstract

Embodiments of the present application provide a display panel, a display panel manufacturing method, and a display apparatus. The display panel comprises a substrate, a driving circuit layer, a first organic layer, an isolation structure, and a plurality of light-emitting devices, as well as a structural functional layer, a first encapsulation layer, and a second encapsulation layer that are arranged on the side of the first organic layer facing away from the driving circuit layer and sequentially stacked in a direction moving away from the driving circuit layer. The driving circuit layer is arranged on the substrate. The first organic layer is arranged on the side of the driving circuit layer away from the substrate. In a first region, the structural functional layer separates the first organic layer from the first encapsulation layer. In the first region, the orthographic projection of the structural functional layer on the substrate is continuously distributed. The structural functional layer comprises a first inorganic layer. A material of the first encapsulation layer comprises an organic material, and a material of the second encapsulation layer comprises an inorganic material. In this way, the driving circuit layer can be prevented from being corroded by moisture which enters through damaged portions of the second encapsulation layer, thereby solving the problem of abnormal display of the display panel.

Description

Display panel, method for manufacturing display panel, and display device

[0001] Cross-references

[0002] This application claims priority to Chinese Patent Application No. 202411823766.X, filed on December 10, 2024, entitled "Display Panel, Method for Preparing Display Panel, and Display Device", and to Chinese Patent Application No. 2025110949533, filed on August 5, 2025, entitled "Display Panel, Method for Preparing Display Panel, and Display Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of display technology, such as a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0004] With the widespread use of electronic display devices, people have higher requirements for their performance. Display panels based on technologies such as Organic Light Emitting Diode (OLED) and Light Emitting Diode (LED) are widely used in various electronic display devices such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, power saving, and thinness. In the traditional display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also has problems such as limited precision, high development costs, and long development cycles. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance aspects, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe relevant content on the technology of not using fine metal masks, and are provided for reference.

[0005] In related technologies, the reliability of display panel packaging needs to be improved. Summary of the Invention

[0006] In view of the above, embodiments of this application provide a display panel, a method for manufacturing the display panel, and a display device to at least partially solve the above problems.

[0007] According to a first aspect of the embodiments of this application, a display panel is provided. The display panel includes a substrate, a driving circuit layer, a first organic layer, an isolation structure, and a plurality of light-emitting devices, as well as a structural functional layer, a first encapsulation layer, and a second encapsulation layer disposed on the side of the first organic layer away from the driving circuit layer. The driving circuit layer is disposed on the substrate. The first organic layer is disposed on the side of the driving circuit layer away from the substrate. The structural functional layer, the first encapsulation layer, and the second encapsulation layer are sequentially stacked along a direction away from the driving circuit layer. A first structural functional layer separates the first organic layer and the first encapsulation layer. The first structural functional layer is continuously distributed in its orthographic projection on the substrate. The structural functional layer includes a first inorganic layer. The material of the first encapsulation layer includes an organic material. The material of the second encapsulation layer includes an inorganic material. The isolation structure is located between the first organic layer and the first encapsulation layer, and the isolation structure encloses and forms a plurality of isolation openings. The plurality of light-emitting devices are located between the first organic layer and the first encapsulation layer, and at least a portion of the light-emitting devices is located in the corresponding isolation openings.

[0008] According to a second aspect of the present application, a method for manufacturing a display panel is provided. The method includes: providing a substrate, sequentially forming a driving circuit layer and a first organic layer on the substrate; baking the first organic layer; sequentially forming a structural functional layer, a first encapsulation layer and a second encapsulation layer on the side of the first organic layer opposite to the driving circuit layer, and separating the first encapsulation layer and the first organic layer in a first region of the structural functional layer.

[0009] According to a third aspect of the embodiments of this application, a display device is provided, the display device including the display panel described above, or the display panel prepared by the method for preparing the display panel described above.

[0010] According to the solution provided in this application embodiment, since the first encapsulation layer and the first organic layer are isolated by the structural functional layer, direct contact between the first encapsulation layer and the first organic layer is avoided. Even if the second encapsulation layer is damaged, external moisture will be blocked by the structural functional layer, making it difficult for moisture to enter the first organic layer from the first encapsulation layer. This prevents moisture from invading the driving circuit layer from the first organic layer. Therefore, moisture entering from the damaged part of the second encapsulation layer can be prevented from corroding the driving circuit layer, thereby solving the problem of display abnormalities in the display panel. Attached Figure Description

[0011] Figures 1a and 1b are schematic cross-sectional views of a display panel in the relevant art.

[0012] Figure 2 is a cross-sectional structural diagram of a display panel in the first region according to an embodiment of this application.

[0013] Figure 3 is a plan view top view of a display panel provided according to an embodiment of this application.

[0014] Figures 4a and 4b are schematic cross-sectional views of a display panel according to an embodiment of this application.

[0015] Figure 4c is a schematic diagram of the orthographic projection of the first opening and the second opening in the first region onto the substrate in a display panel according to an embodiment of this application.

[0016] Figure 5 is a cross-sectional structural diagram of a display panel according to an embodiment of this application.

[0017] Figure 6 is a cross-sectional structural diagram of a display panel provided according to an embodiment of this application.

[0018] Figure 7 is a cross-sectional structural diagram of a display panel provided according to an embodiment of this application.

[0019] Figures 8a and 8b are schematic cross-sectional views of a display panel according to an embodiment of this application.

[0020] Figure 9 is a cross-sectional structural diagram of a display panel provided according to an embodiment of this application.

[0021] Figure 10 is a cross-sectional structural diagram of a display panel provided according to an embodiment of this application.

[0022] Figures 11a to 11c are schematic cross-sectional views of a display panel according to an embodiment of this application.

[0023] Figure 11d is a plan view of a first inorganic layer provided according to an embodiment of this application.

[0024] Figure 11e is a planar top view of a first sub-conductive layer provided according to an embodiment of this application.

[0025] Figure 11f is a planar top view of a second sub-conductive layer provided according to an embodiment of this application.

[0026] Figure 11g is a plan view of a first inorganic layer provided according to an embodiment of this application.

[0027] Figure 11h is a cross-sectional structural diagram of a display panel provided according to an embodiment of this application.

[0028] Figures 12a to 12c are schematic cross-sectional views of a display panel according to an embodiment of this application.

[0029] Figures 13a to 13f are schematic cross-sectional views of a display panel according to an embodiment of this application.

[0030] Figure 14 is a flowchart of a method for manufacturing a display panel according to an embodiment of this application.

[0031] Figures 15a and 15b are schematic cross-sectional views of a method for manufacturing a display panel according to an embodiment of this application.

[0032] Figures 16a and 16b are schematic cross-sectional views of a method for manufacturing a display panel according to an embodiment of this application.

[0033] Figure 17 is a schematic diagram of a display device according to an embodiment of this application. Detailed Implementation

[0034] The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in the embodiments of this application includes any or all possible combinations of one or more associated listed items.

[0035] The terms “length”, “width”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the scheme of the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0036] When an element or layer is referred to as being "on", "connected to", or "bonded to" another element or layer, the element or layer may be directly on the other element or layer, directly connected to or directly bonded to the other element or layer, or there may be intermediate elements or layers.

[0037] The terms First, Second, etc., are used to describe various elements, components, regions, layers, and / or parts, but these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and / or part from another element, component, region, layer, and / or part.

[0038] Terms such as “installation,” “connection,” “linking,” and “fixing” should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integrated connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium.

[0039] The specific implementation of this application will be further described below with reference to the embodiments and accompanying drawings.

[0040] Figures 1a and 1b show partial cross-sectional structural diagrams of a display panel in the related art. The display panel includes a display area A0 and a non-display area A1. The display panel comprises a driving circuit layer 11, a first organic layer 12, a functional layer 13, an organic encapsulation layer 14, and an inorganic encapsulation layer 15, stacked sequentially. The display panel also includes a light-emitting structure 16 located in the display area A0, disposed on the functional layer 13. A first electrode portion in the functional layer 13 is electrically connected to the driving circuit layer 11 through a via, thus allowing the display function of the display panel to be controlled by the driving circuit layer 11. The functional layer 13 has a vent 133 in the non-display area, through which the organic encapsulation layer 14 contacts the first organic layer 12. During the manufacturing process of the display panel, a baking process removes moisture from the first organic layer 12, which is then released through the vent 133.

[0041] The functional layer 13 may include a first conductive layer 131 and a first inorganic layer 132 stacked together. The first conductive layer 131 is located between the first organic layer 12 and the first inorganic layer 132, and a vent 133 penetrates through the first conductive layer 131 and the first inorganic layer 132. The first inorganic layer 132 may include a pixel opening 1321 in the display area to expose the first conductive layer 131. At least a portion of the light-emitting structure 16 is disposed in the pixel opening 1321 and is in conductive contact with the first conductive layer 131 (i.e., the first electrode portion). The first conductive layer 131 may be electrically connected to the driving circuit layer 11 through a via on the first organic layer 12.

[0042] Because of the presence of the vent 133, when the inorganic encapsulation layer 15 is damaged, moisture will invade the organic encapsulation layer 14 and enter the first organic layer 12 through the vent 133, thereby corroding the driving circuit layer 11 and causing display abnormalities in the display panel.

[0043] To address the aforementioned technical problems, this application provides a display panel. Referring to FIG2, the display panel includes a substrate 23, a driving circuit layer 21, and a first organic layer 22. The driving circuit layer 21 is disposed on the substrate 23, and the first organic layer 22 is disposed on the side of the driving circuit layer 21 away from the substrate 23. The display panel further includes a structural functional layer 30, a first encapsulation layer 41, and a second encapsulation layer 42 disposed on the side of the first organic layer 22 opposite to the driving circuit layer 21. The structural functional layer 30, the first encapsulation layer 41, and the second encapsulation layer 42 are sequentially stacked along a direction away from the driving circuit layer 21, and the structural functional layer 30 separates the first organic layer 22 and the first encapsulation layer 41 in the first region B11. Optionally, the material of the first encapsulation layer 41 includes an organic material, such as an organic insulating material; the material of the second encapsulation layer 42 includes an inorganic material, such as an inorganic insulating material. For example, in the first region B11, the first encapsulation layer 41 and the first organic layer 22 are not in contact. The structural functional layer 30 may include inorganic materials, such as inorganic insulating materials and inorganic conductive materials. For example, inorganic conductive materials may include metallic materials and metal oxides, and inorganic insulating materials may include silicon oxide and silicon nitride. The first organic layer 22 may include organic insulating materials.

[0044] For example, the orthographic projection of the structural functional layer 30 in the first region B11 onto the substrate 23 is continuously distributed. The structural functional layer 30 may include a single layer or multiple layers. The structural functional layer 30 may include multiple layers, and the orthographic projection of the structural functional layer 30 in the first region B11 onto the substrate 23 may be the union of the orthographic projections of the multiple layers in the structural functional layer 30 onto the substrate 23. The structural functional layer 30 may be a single layer, and the orthographic projection of the structural functional layer 30 in the first region B11 onto the substrate 23 is continuously distributed, that is, the structural functional layer 30 continuously covers the entire first region B11, and there are no openings in the structural functional layer 30 in the first region B11. The structural functional layer 30 may include multiple layers of films. For example, the structural functional layer 30 in the first region B11 may be continuously distributed in its orthographic projection on the substrate 23, meaning that each layer of films continuously covers the entire surface of the first region B11. Alternatively, one layer in the first region B11 may have an opening, which is covered by another layer. Or, each layer of films in the first region B11 may have an opening, with the openings of different layers staggered, and each opening covered by other layers in the structural functional layer 30. This arrangement allows the structural functional layer 30 in the first region B11 to isolate the first organic layer 22 and the first encapsulation layer 41.

[0045] For example, the structural functional layer 30 includes a first inorganic layer 32. The first inorganic layer 32 can block the transport of water vapor.

[0046] Through the above technical solution, since the first encapsulation layer 41 and the first organic layer 22 in the first region B11 are separated by the structural functional layer 30, direct contact between the first encapsulation layer 41 and the first organic layer 22 is avoided. Even if the second encapsulation layer 42 is damaged, external moisture will be blocked by the structural functional layer 30, making it difficult for moisture to enter the first organic layer 22 from the first encapsulation layer 41. This prevents moisture from invading the driving circuit layer 21 from the first organic layer 22. Therefore, moisture entering from the damaged part of the second encapsulation layer 42 can be prevented from corroding the driving circuit layer 21, thus solving the problem of display abnormalities in the display panel. For example, no organic layer is provided between the first encapsulation layer 41 and the first organic layer 22 in the first region B11. For example, the first encapsulation layer 41 and the first organic layer 22 in the first region B11 are completely separated by inorganic materials in the structural functional layer 30. For example, the structural functional layer 30 in the first region B11 is in contact with the first encapsulation layer 41. For example, the structural functional layer 30 in the first region B11 is in contact with the first organic layer 22.

[0047] For example, the first area B11 can be a part or all of the non-display area. The first area B11 can be located in one or more border areas, such as two, three, or four border areas, including one or more of the left border area, right border area, top border area, and bottom border area. The first area B11 can be a closed ring, for example, the first area B11 can be located in the left border area, right border area, top border area, and bottom border area; or, the first area B11 can be a non-closed ring, for example, the first area B11 can be located in the left border area, right border area, and top border area, or, the first area B11 can be a non-closed ring, for example, the first area B11 can be located in the left border area, right border area, top border area, and part of the bottom border area. There can be one or more first areas B11, such as two, three, or four, for example, different first areas corresponding to different border areas. Each of at least one first area B11 can correspond to one border area. The first area B11 can be rectangular or irregular in shape, etc. For example, the driver chip can be located in the bottom border area.

[0048] For example, the first zone B11 may include part or all of the display area.

[0049] For example, the first zone B11 may include part or all of the display area, as well as part or all of the non-display area.

[0050] For example, the first zone B11 is located between the display area and the light-transmitting area. The first zone B11 can be a closed ring or a non-closed ring. The light-transmitting area of ​​the display panel can be provided with light-transmitting holes. Optical elements can be provided in the light-transmitting area of ​​the display panel, and the optical elements may include one or more of the following: a camera, a fingerprint recognition module, an infrared sensor, an ambient light detection module, etc.

[0051] The driving circuit layer 21 includes a gate driving circuit. Referring to Figure 3, the gate driving circuit may include a scanning circuit 401 and / or a light-emitting control circuit 402. The scanning circuit 401 can be connected to the pixel circuit PD via a scan line. The scanning circuit can be used to output a scan signal to the pixel circuit PD. The light-emitting control circuit 402 can be connected to the pixel circuit PD via a light-emitting control line. The light-emitting control circuit 402 can be used to output a light-emitting control signal to the pixel circuit. The gate driving circuit may include multiple cascaded shift registers VSR. The output of the shift register VSR can be connected to the pixel circuit PD. The scanning circuit 401 may include multiple cascaded shift registers VSR1. The light-emitting control circuit 402 may include multiple cascaded shift registers VSR2. The first region B11 may have multiple cascaded shift registers. The first region B11 may have a gate driving circuit. The same first region B11 may have a scanning circuit 401 and / or a light-emitting control circuit 402. The scanning circuit 401 may be located in the first border region and / or the second border region. The light-emitting control circuit 402 may be located in the first bezel area and / or the second bezel area. The first bezel area and the second bezel area are located on opposite sides of the display area, for example, they may be the left bezel area and the right bezel area.

[0052] In one possible implementation, referring to Figures 3, 4a, 4b, and 4c, the display panel includes a display area B0 and a non-display area B1. The non-display area B1 includes a first area B11. In the first area B11, a structural functional layer 30 separates a first organic layer 22 and a first encapsulation layer 41. The structural functional layer 30 includes a first conductive layer 31 and a first inorganic layer 32 stacked along the thickness direction Z of the substrate 23. The first conductive layer 31 has a first opening 310 in the first area B11. The first inorganic layer 32 has a second opening 321 in the first area B11. The orthographic projection of the first opening 310 on the substrate 23 is outside the orthographic projection of the second opening 321 on the substrate 23, so as to achieve a continuous distribution of the orthographic projections of the structural functional layer 30 on the substrate 23 in the first area B11. That is, the orthographic projections of the first opening 310 and the second opening 321 on the substrate 23 do not overlap, and the first opening 310 and the second opening 321 are staggered. Thus, in the first region B11 or the non-display region B1, the first encapsulation layer 41 and the first organic layer 22 are separated by the first conductive layer 31 at the second opening 321 and the first inorganic layer 32 at the first opening 310, and are not in direct contact. Figure 4c shows a schematic diagram of the orthographic projection of the first opening 310 and the second opening 321 in the first region B11 onto the substrate. For example, the equivalent total area covered by the orthographic projections of the first inorganic layer 32 and the first conductive layer 31 onto the substrate 23 in the first region B11 is equal to the area of ​​the first region B11. For example, the orthographic projection of the first opening 310 onto the substrate 23 lies within the orthographic projection of the first inorganic layer 32 onto the substrate 23. For example, the orthographic projection of the second opening 321 onto the substrate 23 lies within the orthographic projection of the first conductive layer 31 onto the substrate 23.

[0053] For example, the first conductive layer 31 may include a metallic material. For example, the first inorganic layer 32 may include an inorganic insulating material.

[0054] For example, multiple first openings 310 can be arranged along a first direction X. Multiple first openings 310 can be arranged along a second direction Y. The first direction X and the second direction Y intersect, for example, perpendicularly. Multiple first openings 310 can be arranged in an array. Multiple second openings 321 can be arranged along the first direction.

[0055] For example, multiple second openings 321 can be arranged along the second direction Y. The first direction X and the second direction Y intersect, for example, perpendicularly. Multiple second openings 321 can be arranged in an array.

[0056] For example, the first opening 310 and the second opening 321 can be arranged alternately along the first direction X. The first opening 310 and the second opening 321 can be arranged alternately along the second direction Y.

[0057] In one example, the first conductive layer 31 and the first inorganic layer 32 are stacked sequentially along a direction away from the driving circuit layer 21, with a portion of the first conductive layer 31 exposed in the second opening 321.

[0058] The first inorganic layer 32 provided in this application can be an inorganic insulating layer.

[0059] The non-display area B1 of the display panel surrounds the display area B0. The non-display area B1 may include multiple regions, such as a chin area, a bonding area, and a border area. The first area B11 in this application may be a part or all of the non-display area. The first area B11 may include a border area located on at least one side of the display area B0. For example, there may be multiple first areas B11, with two first areas B11 being a first border area and a second border area located on opposite sides of the display area B0, respectively. The first border area and the second border area may be arranged along the extension direction of the gate lines. The gate lines may include scan lines and / or light-emitting control lines.

[0060] In one possible implementation, referring to FIG5, the display panel includes a display area B0 and a non-display area B1, the non-display area B1 including a first area B11; in the first area B11, a structural functional layer 30 separates a first organic layer 22 and a first encapsulation layer 41; the structural functional layer 30 includes a first conductive layer 31 and a first inorganic layer 32 stacked along the thickness direction Z of the substrate 23; the first conductive layer 31 has a first opening 310 in the first area B11; the first inorganic layer 32 is continuously distributed in the first area B11 to achieve a continuous distribution of the orthographic projection of the structural functional layer 30 on the substrate 23 in the first area B11. For example, the first inorganic layer 32 in the first area B11 continuously covers multiple cascaded shift registers, for example, the area of ​​the orthographic projection of the first inorganic layer 32 on the substrate 23 in the first area B11 is equal to the area of ​​the first area B11. The orthographic projection of the first opening 310 on the substrate is located within the orthographic projection of the first inorganic layer 32 on the substrate. Thus, in the non-display area B1, the first encapsulation layer 41 and the first organic layer 22 can be isolated by the first inorganic layer 32, without direct contact. For example, the gate driving circuit is located in the first area B11. For example, the scanning circuit 401 is located in the first area B11. For example, the light emission control circuit 402 is located in the first area B11.

[0061] For example, within the first region B11, the first inorganic layer 32 continuously covers K1 cascaded shift registers, where K1 is greater than or equal to 20. For example, K1 is greater than or equal to 50. For example, K1 is greater than or equal to 100. K1 can be equal to 10, 20, 30, 40, 50, 60, 70, 80, 90, or 100, etc. For example, the area of ​​the first region B11 is greater than or equal to the area of ​​the orthographic projection of the corresponding gate driving circuit on the substrate 23. For example, in at least one first region B11, the area of ​​each first region B11 is greater than or equal to the area of ​​the orthographic projection of the corresponding scanning circuit 401 on the substrate 23. For example, in at least one first region B11, the area of ​​each first region B11 is greater than or equal to the area of ​​the orthographic projection of the corresponding light-emitting control circuit 402 on the substrate 23. For example, in at least one first region B11, the area of ​​each first region B11 is greater than or equal to the sum of the areas of the orthographic projections of the corresponding scanning circuit 401 and the light-emitting control circuit 402 on the substrate 23. For example, the first inorganic layer 32 in the first region B11 continuously covers the first-stage shift register to the last-stage shift register in the corresponding gate drive circuit. For example, in at least one first region B11, the first inorganic layer 32 in the first region B11 continuously covers the first-stage shift register to the last-stage shift register in the corresponding scan circuit 401, and / or, the first inorganic layer 32 in the first region B11 continuously covers the first-stage shift register to the last-stage shift register in the corresponding light emission control circuit 402.

[0062] For example, the first inorganic layer 32 does not have an opening in the first region B11. For example, the first inorganic layer 32 does not have an opening in the first region B11 that penetrates the first inorganic layer 32 along the thickness direction of the substrate 23. For example, in the first region B11 (i.e., the border region), the first inorganic layer 32 covers the entire surface or the entire layer of the first organic layer 22, or in the first region B11 (i.e., the border region), the first inorganic layer 32 completely covers the first organic layer 22.

[0063] In one possible implementation, referring to FIG6, the display panel includes a display area B0 and a non-display area B1, the non-display area B1 including a first area B11; in the first area B11, a structural functional layer 30 separates a first organic layer 22 and a first encapsulation layer 41; the structural functional layer 30 includes a first conductive layer 31 and a first inorganic layer 32 stacked along the thickness direction of the substrate 23; the first conductive layer 31 is continuously distributed in the first area B11 to achieve a continuous distribution of the orthographic projection of the structural functional layer 30 on the substrate 23 in the first area B11. For example, the first conductive layer 31 in the first area B11 continuously covers multiple cascaded shift registers, for example, the area of ​​the orthographic projection of the first conductive layer 31 on the substrate 23 in the first area B11 is equal to the area of ​​the first area B11. The first inorganic layer 32 has a second opening 321 in the first area B11; the orthographic projection of the second opening 321 on the substrate 23 is located within the orthographic projection of the first conductive layer 31 on the substrate 23. Thus, in the first region B11 or the non-display region B1, the first encapsulation layer 41 and the first organic layer 22 can be isolated by the first conductive layer 31 and do not have direct contact. For example, in the first region B11, the first conductive layer 31 continuously covers the first-stage shift register to the last-stage shift register in the corresponding gate drive circuit. For example, in at least one of the first regions B11, the first conductive layer 31 continuously covers the first-stage shift register to the last-stage shift register in the corresponding scan circuit 401, and / or, the first conductive layer 31 continuously covers the first-stage shift register to the last-stage shift register in the corresponding light-emitting control circuit 402.

[0064] For example, the first conductive layer 31 does not have an opening in the first region B11. For example, the first conductive layer 31 does not have an opening in the first region B11 that penetrates the first conductive layer 31 along the thickness direction of the substrate 23. For example, in the first region B11 (i.e., the border region), the first conductive layer 31 covers the entire surface or the entire layer of the first organic layer 22, and in the first region B11 (i.e., the border region), the first conductive layer 31 completely covers the first organic layer 22.

[0065] In one possible implementation, referring to FIG7, the display panel includes a display area B0 and a non-display area B1. The non-display area B1 includes a first area B11. In the first area B11, a structural functional layer 30 isolates the first organic layer 22 and the first encapsulation layer 41. The structural functional layer 30 includes a first conductive layer 31 and a first inorganic layer 32 stacked along the thickness direction Z of the substrate. The first conductive layer 31 and the first inorganic layer 32 are continuously distributed in the first area B11, so as to achieve a continuous distribution of the orthographic projection of the structural functional layer 30 on the substrate 23 in the first area B11. For example, the first conductive layer 31 in the first area B11 continuously covers multiple cascaded shift registers, and the area of ​​the orthographic projection of the first conductive layer 31 on the substrate 23 in the first area B11 is equal to the area of ​​the first area B11. Thus, in the first area B11 or the non-display area B1, the first encapsulation layer 41 and the first organic layer 22 can be isolated by the first conductive layer 31 and the first inorganic layer 32, without direct contact.

[0066] For example, neither the first conductive layer 31 nor the first inorganic layer 32 has an opening in the first region.

[0067] In one possible implementation, referring to Figures 8a and 8b, the display panel includes a display area B0 and a non-display area B1, with the non-display area B1 including a first area B11. In the first area B11, a structural functional layer 30 separates a first organic layer 22 and a first encapsulation layer 41. The structural functional layer 30 includes an inorganic isolation layer 33, a first conductive layer 31, and a first inorganic layer 32 stacked along the thickness direction Z of the substrate 23. The first conductive layer 31 has a first opening 310 in the first area B11. The first inorganic layer 32 has a second opening 321 in the first area B11. The orthographic projection of the first opening 310 on the substrate 23 overlaps with the orthographic projection of the second opening 321 on the substrate 23. The overlapping area of ​​the orthographic projection of the first opening 310 on the substrate 23 and the orthographic projection of the second opening 321 on the substrate 23 is located within the orthographic projection of the inorganic isolation layer 33 on the substrate 23, so as to achieve a continuous distribution of the orthographic projection of the structural functional layer 30 on the substrate 23 in the first area B11. Thus, in the first region B11 or the non-display region B1, the inorganic isolation layer 33 can separate the first encapsulation layer 41 and the first organic layer 22.

[0068] Optionally, the inorganic isolation layer 33 is located on the side of the first conductive layer 31 and the first inorganic layer 32 that is close to the substrate 23.

[0069] In other embodiments, the inorganic isolation layer 33 is located between the first conductive layer 31 and the first inorganic layer 32.

[0070] In other embodiments, the inorganic isolation layer 33 is located on the side of the first conductive layer 31 and the first inorganic layer 32 away from the substrate 23.

[0071] For example, inorganic isolation layer 33 can be an inorganic insulating layer.

[0072] The inorganic isolation layer 33 can be continuously distributed in the first region B11. For example, the inorganic isolation layer 33 has no opening in the first region B11. For example, the inorganic isolation layer 33 continuously covers multiple cascaded shift registers in the first region B11, for example, the area of ​​the inorganic isolation layer 33 projected onto the substrate 23 in the first region B11 is equal to the area of ​​the first region B11. For example, the inorganic isolation layer 33 continuously covers the first-stage shift register to the last-stage shift register in the corresponding gate drive circuit in the first region B11. For example, in at least one first region B11, the inorganic isolation layer 33 continuously covers the first-stage shift register to the last-stage shift register in the corresponding scan circuit 401, and / or, the inorganic isolation layer 33 continuously covers the first-stage shift register to the last-stage shift register in the corresponding light-emitting control circuit 402.

[0073] In one example, the inorganic isolation layer 33 is made of materials such as silicon oxide and / or silicon nitride. Thus, in the first region B11 or the non-display region B1, the inorganic isolation layer 33 can separate the first encapsulation layer 41 and the first organic layer 22, preventing direct contact between the first encapsulation layer 41 and the first organic layer 22.

[0074] In one possible implementation, referring to FIG9, the display panel includes a display area B0 and a non-display area B1, the non-display area B1 including a first area B11; in the first area B11, a structural functional layer 30 separates a first organic layer 22 and a first encapsulation layer 41; the structural functional layer 30 includes an inorganic isolation layer 33, a first conductive layer 31, and a first inorganic layer 32 stacked along the thickness direction Z of the substrate 23; the first conductive layer 31 has a first opening 310 in the first area B11; the first inorganic layer 32 has a second opening 321 in the first area B11; the orthographic projection of the first opening 310 on the substrate 23 is outside the orthographic projection of the second opening 321 on the substrate 23, so as to achieve a continuous distribution of the orthographic projection of the structural functional layer 30 on the substrate 23 in the first area B11. That is, the first opening 310 and the second opening 321 are staggered. In the first region B11 or the non-display region, the inorganic isolation layer 33 can separate the first encapsulation layer 41 and the first organic layer 22, preventing direct contact between them. For example, the orthographic projection of the first opening 310 on the substrate 23 lies within the orthographic projection of the first inorganic layer 32 on the substrate 23. Similarly, the orthographic projection of the second opening 321 on the substrate 23 lies within the orthographic projection of the first conductive layer 31 on the substrate 23.

[0075] Optionally, the inorganic isolation layer 33 is located on the side of the first conductive layer 31 and the first inorganic layer 32 that is close to the substrate 23.

[0076] For example, inorganic isolation layer 33 can be an inorganic insulating layer.

[0077] The inorganic isolation layer 33 can be continuously distributed in the first region B11. For example, the inorganic isolation layer 33 may not have an opening in the first region B11. For example, the inorganic isolation layer 33 may not have an opening extending through the thickness direction of the substrate 23 in the first region B11. For example, the inorganic isolation layer 33 may cover the entire surface or the entire layer of the first organic layer 22 in the first region B11 (i.e., the border region), or the inorganic isolation layer 33 may completely cover the first organic layer 22 in the first region B11 (i.e., the border region).

[0078] In one possible implementation, referring to FIG10, the display panel includes a display area B0 and a non-display area B1, the non-display area B1 including a first area B11; in the first area B11, a structural functional layer 30 isolates a first organic layer 22 and a first encapsulation layer 41; the structural functional layer 30 includes an inorganic isolation layer 33, a first conductive layer 31, and a first inorganic layer 32 stacked along the thickness direction Z of the substrate 23; the first conductive layer 31 is continuously distributed in the first area B11; the first inorganic layer 32 is continuously distributed in the first area B11; the inorganic isolation layer 33 is continuously distributed in the first area B11 to achieve a continuous orthographic projection of the structural functional layer 30 on the substrate 23 in the first area B11. For example, the first inorganic layer 32 in the first area B11 continuously covers multiple cascaded shift registers, for example, the area of ​​the orthographic projection of the inorganic isolation layer 33 on the substrate 23 in the first area B11 is equal to the area of ​​the first area B11. For example, the first conductive layer 31, the first inorganic layer 32, and the inorganic isolation layer 33 do not have openings in the first region B11.

[0079] Thus, in the first area B11 or the non-display area B1, the inorganic isolation layer 33 can separate the first encapsulation layer 41 and the first organic layer 22, preventing the first encapsulation layer 41 and the first organic layer 22 from coming into direct contact.

[0080] Optionally, the inorganic isolation layer 33 is located on the side of the first conductive layer 31 and the first inorganic layer 32 that is close to the substrate 23.

[0081] Optionally, referring to Figure 13b, in the first region B11, the boundary of the inorganic isolation layer 33 away from the display region B0 is located on the side of the first organic layer 22 away from the display region B0.

[0082] For example, inorganic isolation layer 33 can be an inorganic insulating layer. For example, the first inorganic layer 32 can be an inorganic insulating layer.

[0083] In one possible implementation, referring to FIG10, the display panel further includes a signal trace 70 located in the first region, which is disposed on the side of the second encapsulation layer 42 facing away from the substrate 23. Thus, the driving circuit layer 21 and the signal trace 70 are located on opposite sides of the first conductive layer 31 along a direction parallel to the thickness Z of the substrate 23. The first conductive layer 31 can act as a signal shield, reducing mutual interference between the signal trace 70 and the driving circuit layer 21.

[0084] The driving circuit layer 21 includes a gate driving circuit. In the first region B11, the gate driving circuit and the signal trace 70 are located on opposite sides of the first conductive layer 31 along a direction parallel to the thickness of the substrate 23. The first conductive layer 31 can serve as a signal shield, reducing mutual interference between the signal trace 70 and the gate driving circuit.

[0085] Optionally, signal trace 70 may be a touch trace. For example, the display panel may also include touch electrodes (not shown) located in the display area B0 and electrically connected to the touch trace (e.g., signal trace 70) to enable touch functionality.

[0086] The first area B11 may include a border area located on at least one side of the display area B0. Alternatively, the first area B11 may include a first border area and a second border area located on opposite sides of the display area B0.

[0087] In this embodiment, the first conductive layer 31 is located between the first inorganic layer 32 and the substrate 23. Alternatively, the first inorganic layer 32 is located between the first conductive layer 31 and the substrate 23. In one possible embodiment, referring to FIG11a or FIG11b, the first conductive layer 31 is located between the first inorganic layer 32 and the substrate 23, the first organic layer 22 has a via 221 in the display area B0, the driving circuit layer 21 includes pixel circuits located in the display area B0, and the first conductive layer 31 includes a first electrode portion 311 in the display area B0, the first electrode portion 311 being electrically connected to the pixel circuits through the via 221. Therefore, the first conductive layer 31 and the first inorganic layer 32 are stacked sequentially along a direction away from the substrate 23, and the pixel circuits in the driving circuit layer 21 can provide driving current to the first electrode portion 311, that is, provide driving current to the light-emitting device.

[0088] In one possible embodiment, referring to FIG11a or FIG11b, the first inorganic layer 32 is a pixel defining layer. For example, the display panel further includes a light-emitting device 50, which includes a first electrode portion 311, a light-emitting structure 51, and a second electrode portion 52 sequentially stacked along a direction Z away from the substrate 23. The first electrode portion 311 is located between the first inorganic layer 32 and the substrate 23. The first inorganic layer 32 has a pixel opening 322 in the display area B0. At least a portion of the surface of the first electrode portion 311 facing away from the substrate 23 is exposed in the pixel opening 322. The light-emitting structure is stacked on the surface of the first electrode portion 311 away from the substrate 23 through the pixel opening 322. In this way, the first electrode portion 311, the light-emitting structure 51, and the second electrode portion 52 can form a light-emitting unit. The driving circuit layer 21 can control the light-emitting unit to emit light through an electrical connection with the first electrode portion 311. For example, one of the first electrode portion 311 and the second electrode portion 52 is an anode, and the other is a cathode. For example, the first electrode portion 311 is an anode, and the second electrode portion 52 is a cathode.

[0089] In one example, the first electrode portion 311 is located in the first conductive layer 31, and the first electrode portion 311 is electrically connected to the pixel circuit in the driving circuit layer 21 through the via 221 on the first organic layer 22.

[0090] In one possible embodiment, referring to FIG11a or FIG11b, the display panel further includes an isolation structure 53. The isolation structure 53 may be located between the first organic layer 22 and the first encapsulation layer 41. The isolation structure 53 encloses and forms a plurality of isolation openings 534. The isolation structure 53 may be located on the side of the pixel defining layer or the first inorganic layer 32 away from the substrate 23; alternatively, the pixel defining layer or the first inorganic layer 32 may have clearance openings, and the isolation structure 53 may be located at these clearance openings. The pixel defining layer may include pixel defining portions that enclose and form pixel openings.

[0091] For example, the display panel also includes multiple light-emitting devices 50. These multiple light-emitting devices 50 may be located between the first organic layer 22 and the first encapsulation layer 41. At least a portion of each light-emitting device 50 is located in a corresponding isolation opening 534. Each light-emitting device 50 includes a first electrode portion 311, a light-emitting structure 51, and a second electrode portion 52 sequentially stacked along a direction away from the substrate 23. The second electrode portion 52 is electrically connected to an isolation structure 53. For example, the isolation structure 53 includes a conductive material. Thus, the isolation structure 53 can reliably separate the light-emitting structures 51 of adjacent light-emitting devices 50, and can electrically connect the second electrode portions 52 of adjacent light-emitting devices 50, thereby ensuring the uniformity of conductivity of the second electrode portions 52.

[0092] In one example, the isolation structure 53 is disposed on the side of the first inorganic layer 32 facing away from the substrate 23. The first inorganic layer 32 is a pixel defining layer, and a pixel opening 322 is provided in the display area B0 of the first inorganic layer 32. The pixel opening 322 and the isolation opening 534 are correspondingly disposed. For example, the pixel opening 322 and the isolation opening 534 are connected. The orthographic projection of the pixel opening 322 on the substrate 23 is located within the orthographic projection range of the isolation opening 534 on the substrate 23. For example, the pixel opening 322 exposes at least a portion of the surface of the first electrode portion 311 facing away from the substrate 23.

[0093] In one example, the display panel further includes multiple encapsulation portions 43, which are located on the side of the corresponding light-emitting device 50 away from the substrate 23, and are situated between the first encapsulation layer 41 and the film layer containing the light-emitting device 50. Thus, the encapsulation portions 43 can isolate water and oxygen, protecting the light-emitting device. The material of the encapsulation portions 43 may include inorganic materials, such as inorganic insulating materials. For example, multiple encapsulation portions 43 may be spaced apart.

[0094] The light-emitting device 50 can be of various types, with different types used to emit light of different colors. Optionally, the packaging portion 43 corresponding to the light-emitting device 50 of different colors is different.

[0095] For example, at least a portion of the first conductive layer 31 (e.g., the first conductive layer 31 includes a first sub-conductive layer) is disposed in the same layer as at least a portion of the film layer of the isolation structure 53, and / or, at least a portion of the first conductive layer 31 (e.g., the first conductive layer 31 includes a second sub-conductive layer) is disposed in the same layer as the first electrode portion 311 of the light-emitting device 50.

[0096] For example, in at least one first region B11 (e.g., including the lower border region), the first organic layer 22 and the first encapsulation layer 41 are isolated by the first inorganic layer 31 and the first sub-conductive layer in the structural functional layer 30.

[0097] For example, in at least one first region B11 (e.g., including the left border region and / or the right border region), the first organic layer 22 and the first encapsulation layer 41 are isolated by the first inorganic layer 31 and the second sub-conductive layer in the structural functional layer 30.

[0098] For example, the inorganic isolation layer 33 can be disposed in the same layer as the encapsulation part 43, for example, using the same material.

[0099] Referring to Figure 11a, the isolation structure 53 includes a first structural layer 531 and a second structural layer 532, which are stacked sequentially along a direction close to the substrate 23. The sidewall of the first structural layer 531 facing the isolation opening 534 protrudes beyond the sidewall of the second structural layer 532 facing the isolation opening 534. For example, the orthographic projection of the side of the second structural layer 532 away from the substrate 23 onto the substrate 23 lies within the orthographic projection of the first structural layer 531 onto the substrate 23. For example, the orthographic projection area of ​​the side of the second structural layer 532 away from the substrate 23 onto the substrate 23 is smaller than the orthographic projection area of ​​the first structural layer 531 onto the substrate 23. For example, the cross-section of the isolation structure 53 perpendicular to the substrate 23 may be T-shaped. Optionally, the materials of the first structural layer 531 and the second structural layer 532 are different. Optionally, the material of the second structural layer 532 includes a conductive material. Optionally, the second electrode portion 52 and the second structural layer 532 are in conductive contact. Optionally, the material of the first structural layer 531 includes a conductive material, such as a metallic material, such as titanium, and / or the material of the second structural layer 532 includes a conductive material, such as a metallic material, such as aluminum.

[0100] Optionally, referring to FIG11b, the isolation structure further includes a third structural layer 533. The first structural layer 531, the second structural layer 532, and the third structural layer 533 are stacked sequentially along the direction close to the substrate 23, and the orthographic projection of the second structural layer 532 on the substrate 23 lies within the orthographic projection of the third structural layer 533 on the substrate 23. For example, the orthographic projection area of ​​the second structural layer 532 on the substrate 23 is smaller than the orthographic projection area of ​​the third structural layer 533 on the substrate 23. For example, the cross-section of the isolation structure 53 perpendicular to the substrate 23 may be I-shaped. Optionally, the material of the third structural layer 533 may be the same as or different from the material of the first structural layer 531. For example, the material of the third structural layer 533 includes a conductive material, such as a metallic material, such as molybdenum.

[0101] In one possible implementation, referring to Figures 4a, 4b, 5, 11c, 11d, 11e, 11f, and 11g, the display panel includes a display area B0 and a non-display area B1, the non-display area B1 including a plurality of first areas B11; in the plurality of first areas B11, a structural functional layer 30 separates a first organic layer 22 and a first encapsulation layer 41; the structural functional layer 30 includes a first conductive layer 31 and a first inorganic layer 32 stacked along the thickness direction Z of the substrate 23; the first conductive layer 31 includes a first sub-conductive layer 31a and a second sub-conductive layer 31b.

[0102] Optionally, the first sub-conductive layer 31a and the second sub-conductive layer 31b are located in different conductive layers. Optionally, one of the first sub-conductive layer 31a and the second sub-conductive layer 31b is located on the side of the first inorganic layer 32 away from the substrate 23, and the other is located on the side of the first inorganic layer 32 closer to the substrate 23. For example, the first inorganic layer 32 is located between the first sub-conductive layer 31a and the second sub-conductive layer 31b.

[0103] Multiple first zones B11 include first-class first zone B11a and / or second-class first zone B11b.

[0104] Referring to Figures 11c, 11d, and 11e, in the first type of first region B11a: the first sub-conductive layer 31a has a first opening 310a; the first inorganic layer 32 has a second opening 321 in the first type of first region B11a; the orthographic projection of the first opening 310a on the substrate 23 is outside the orthographic projection of the second opening 321 on the substrate 23, that is, they do not overlap and are staggered. The orthographic projection of the first opening 310a on the substrate 23 is within the orthographic projection of the first inorganic layer 32 on the substrate 23. The orthographic projection of the second opening 321 on the substrate 23 is within the orthographic projection of the first sub-conductive layer 31a on the substrate 23. This arrangement achieves a continuous distribution of the orthographic projections of the structural functional layers 30 on the substrate 23 in the first type of first region B11a. In the first type of first region B11a, the first organic layer 22 and the first encapsulation layer 41 are separated by the first sub-conductive layer 31a and the first inorganic layer 32. For example, in the first type of first region B11a, the first sub-conductive layer 31a and the first inorganic layer 32 are stacked along the thickness direction Z of the substrate 23. The first sub-conductive layer 31a can be connected to a power signal line through the second opening 321.

[0105] Referring to Figures 4a, 4b, 11f, and 11g, in the second type of first region B11b: the second sub-conductive layer 31b has a first opening 310b; the first inorganic layer 32 has a second opening 321 in the second type of first region B11b; the orthographic projection of the first opening 310b on the substrate 23 is outside the orthographic projection of the second opening 321 on the substrate 23, i.e., they do not overlap and are staggered. The orthographic projection of the first opening 310 on the substrate 23 is within the orthographic projection of the first inorganic layer 32 on the substrate 23. The orthographic projection of the second opening 321 on the substrate 23 is within the orthographic projection of the second sub-conductive layer 31b on the substrate 23. This arrangement achieves a continuous distribution of the orthographic projections of the structural functional layers 30 on the substrate 23 in the second type of first region B11b. In the second type of first region B11b, the first organic layer 22 and the first encapsulation layer 41 are separated by the second sub-conductive layer 31b and the first inorganic layer 32. For example, in the second type, the second sub-conductive layer 31b and the first inorganic layer 32 are stacked along the thickness direction Z of the substrate 23 in the first region B11b.

[0106] Alternatively, referring to Figures 5, 11d, and 11f, in the second type of first region B11b: the second sub-conductive layer 31b has a first opening 310b in the second type of first region B11b; the first inorganic layer 32 is continuously distributed in the second type of first region B11b; the orthographic projection of the first opening 310b on the substrate 23 lies within the orthographic projection of the first inorganic layer 32 on the substrate 23. The first inorganic layer 32 does not have an opening in the second type of first region B11b. This arrangement achieves a continuous orthographic distribution of the structural functional layer 30 on the substrate 23 in the second type of first region B11b. In the second type of first region B11b, the first organic layer 22 and the first encapsulation layer 41 are separated by the second sub-conductive layer 31b and the first inorganic layer 32. For example, in the second type of first region B11b, the second sub-conductive layer 31b and the first inorganic layer 32 are stacked along the thickness direction Z of the substrate 23.

[0107] Optionally, the first sub-conductive layer 31a is disposed in the same layer as the isolation structure 53, or the first sub-conductive layer 31a includes at least a portion of the isolation structure 53.

[0108] Optionally, the second sub-conductive layer 31b is disposed in the same layer as the first electrode portion 311 of the light-emitting device 50, or the second sub-conductive layer 31b includes the first electrode portion 311.

[0109] Optionally, the first inorganic layer 32 is a pixel-defining layer.

[0110] Optionally, the first type first area B11a and the second type first area B11b are located in at least two adjacent side border areas of the display area (e.g., the bottom border area and the left border area).

[0111] Optionally, the first type of first area B11a may include a lower border area or be located in the lower border area. For example, the first type of first area B11a is located on the same side of the display area as the driver chip.

[0112] Optionally, the second type of first region B11b may include a left border region or a right border region, or be located in either the left border region or the right border region. For example, the second type of first region B11b may be provided with a gate drive circuit.

[0113] Optional, Category 2, Zone 1, B11b, without isolation structure 53.

[0114] For example, the first sub-conductive layer 31a includes a metallic material. For example, the second sub-conductive layer 31b includes a metallic material.

[0115] Optionally, the plurality of first regions B11 may also include a third type of first region B11c. Referring to Figures 11d, 11e, 11f, and 11h, in the third type of first region B11c: the first inorganic layer 32 is continuously distributed in the third type of first region B11c. This arrangement is to achieve a continuous distribution of the orthographic projection of the structural functional layer 30 of the third type of first region B11c onto the substrate 23. In the third type of first region B11c, the first organic layer 22 and the first encapsulation layer 41 are isolated by the first inorganic layer 32. Optionally, the third type of first region B11c does not have an isolation structure 53. Optionally, the third type of first region B11c does not have a first conductive layer 31. Optionally, the third type of first region B11c does not have a first sub-conductive layer 31a. Optionally, the third type of first region B11c does not have a second sub-conductive layer 31b.

[0116] Optionally, the third type of first zone B11c may include a lower border zone or be located in the lower border zone.

[0117] In some other possible embodiments, the first conductive layer 31 includes one of a first sub-conductive layer 31a and a second sub-conductive layer 31b.

[0118] In some other possible embodiments, the first region B11 includes one or more of the following: a first type of first region B11a, a second type of first region B11b, and a third type of first region B11c.

[0119] In some other possible embodiments, the structural functional layer 30 of the second type first area B11b or the left border area or the right border area can be as shown in Figures 4a to 11b and Figures 12a to 13f.

[0120] In some other possible embodiments, the structural functional layer 30 of the first type first region B11a or lower border region may be as shown in Figures 4a to 11b and Figures 12a to 13f.

[0121] In some other possible embodiments, the structural functional layer 30 of the third type first region B11c or the upper border region may be as shown in Figures 4a to 11b and Figures 12a to 13f.

[0122] Optionally, at least one border region (e.g., the bottom border region) includes two or all three of the following: first type first region B11a, second type first region B11b, and third type first region B11c. For example, the bottom border region includes first type first region B11a and second type first region B11b.

[0123] For example, the left or right border area includes two or three of the following: the first type first area B11a, the second type first area B11b, and the third type first area B11c.

[0124] In another possible embodiment, referring to Figures 12a, 12b, or 12c, the first conductive layer 31 is located between the first inorganic layer 32 and the substrate 23. The first organic layer 22 includes a via 221 in the display area B0, and the inorganic isolation layer 33 has a third opening 331 in the display area B0. The orthographic projection of the via 221 on the substrate 23 overlaps with the orthographic projection of the third opening 331 on the substrate 23. The first conductive layer 31 includes a first electrode portion 311 in the display area B0, and the first electrode portion 311 is electrically connected to the driving circuit layer 21 through the third opening 331 and the via 221. Thus, the orthographic projection of the third opening 331 on the substrate 23 is located within the orthographic projection range of the first electrode portion 311 on the substrate 23, and the driving circuit layer 21 can supply power to the first electrode portion 311.

[0125] Optionally, the first inorganic layer 32 is located between the first conductive layer 31 and the substrate 23. For example, at least a portion of the first conductive layer 31 may be disposed in the same layer as the second electrode portion 52, and / or, at least a portion of the first conductive layer 31 may be disposed in the same layer as at least a portion of the film layer of the isolation structure 53. The two structures disposed in the same layer can be obtained by patterning the same film layer to simplify the process.

[0126] In one possible implementation, referring to Figures 13a, 13b, or 13c, the display panel further includes a barrier 24 located in the non-display area B1 of the display panel. For example, a first area B11 is located between the barrier 24 and the display area B0.

[0127] The first encapsulation layer 41 is located on at least a portion of the barrier 24 near the display area B0. The barrier 24 is made of an organic material. A first conductive layer 31 is disposed on the side of the barrier 24 facing away from the substrate 23. The first conductive layer 31 has a first through-hole 312, and the orthographic projection of the barrier 24 on the substrate 23 overlaps with the orthographic projection of the first through-hole 312 on the substrate 23. Thus, a portion of the surface of the barrier 24 facing away from the substrate 23 can be exposed in the first through-hole 312. This allows moisture in the barrier 24 to dissipate through the first through-hole 312 during fabrication. The barrier 24 can be used to prevent the overflow of organic material during the fabrication of the first encapsulation layer 41, which is beneficial for achieving a narrow bezel.

[0128] In one example, the first inorganic layer 32 has a second through-hole 323. The overlapping area of ​​the orthographic projection of the first through-hole 312 on the substrate 23 and the orthographic projection of the second through-hole 323 on the substrate 23 overlaps with the orthographic projection of the baffle 24 on the substrate 23. Thus, the first through-hole 312 and the second through-hole 323 are connected, or the first through-hole 312 and the second through-hole 323 are designed as a socket. In this way, during the fabrication process, moisture in the baffle 24 can be dissipated through the first through-hole 312 and the second through-hole 323.

[0129] The barrier 24 may include multiple barriers, such as two. For example, the overlapping area of ​​the orthographic projection of at least one first through-hole 312 on the substrate 23 and the orthographic projection of at least one second through-hole 323 on the substrate 23 overlaps with the orthographic projection of the barrier 24 away from the display area B0 on ​​the substrate 23, as shown in FIG13b. For example, the orthographic projection of at least one first through-hole 312 on the substrate 23 overlaps with the orthographic projection of the barrier 24 near the display area B0 on ​​the substrate 23, as shown in FIG13b. For example, the first inorganic layer 32 may fill the first through-hole 312 and contact the barrier 24 near the display area B0.

[0130] Optionally, the material of the retaining wall 24 is the same as the material of the first organic layer 22.

[0131] The barrier 24 may include multiple barriers, such as two. For example, the overlapping area of ​​the orthographic projection of at least one first through-hole 312 on the substrate 23 and the orthographic projection of at least one second through-hole 323 on the substrate 23 overlaps with the orthographic projection of the barrier 24 on the substrate 23 away from the display area B0, as shown in FIG13d. For example, the overlapping area of ​​the orthographic projection of at least one first through-hole 312 on the substrate 23 and the orthographic projection of at least one second through-hole 323 on the substrate 23 overlaps with the orthographic projection of the barrier 24 on the substrate 23 near the display area B0, as shown in FIG13d. For example, the second encapsulation layer 42 may fill the first through-hole 312 and the second through-hole 323 and contact the barrier 24.

[0132] In another possible implementation, referring to FIG13e, the display panel further includes a barrier 24 located in the non-display area B1, with a first encapsulation layer 41 located on at least a portion of the barrier 24 on the side close to the display area B0, and the material of the barrier 24 including an organic material.

[0133] An inorganic isolation layer 33 is located on the side of the barrier 24 closest to the display area B0; a first conductive layer 31 is located on the side of the barrier 24 closest to the display area B0; the first inorganic layer 32 has a second through-hole 323, and the orthographic projection of the barrier 24 on the substrate 23 overlaps with the orthographic projection of the second through-hole 323 on the substrate 23. Thus, during fabrication, moisture in the barrier 24 can dissipate through the second through-hole 323. Multiple barriers 24 may be included, for example, two. For example, the orthographic projection of the barrier 24 furthest from the display area on the substrate 23 overlaps with the orthographic projection of the second through-hole 323 on the substrate. For example, the orthographic projection of the barrier 24 closest to the display area on the substrate 23 does not overlap with the orthographic projection of the second through-hole 323 on the substrate.

[0134] For example, retaining wall 24 and isolation layer 33 are set at intervals.

[0135] In another possible implementation, referring to Figure 13e, in the area where the retaining wall 24 is located, the first inorganic layer 32 is continuously distributed without through holes.

[0136] This application also provides a method for manufacturing a display panel, which can be used to manufacture the display panel in the above embodiments. Referring to Figures 14 and 4b, the manufacturing method includes:

[0137] Step S71, provide a substrate.

[0138] Step S72: A driving circuit layer and a first organic layer are sequentially formed on the substrate;

[0139] Step S73: Bake the first organic layer; this removes moisture from the first organic layer.

[0140] Step S74: A structural functional layer, a first encapsulation layer, and a second encapsulation layer are sequentially formed on the side of the first organic layer away from the driving circuit layer. The first encapsulation layer and the first organic layer are separated by the structural functional layer in the first region.

[0141] Obviously, in the display panel obtained by the above preparation method, the isolation of the structural functional layer 30 can prevent direct contact between the first encapsulation layer 41 and the first organic layer 22. Even if the second encapsulation layer 42 is damaged, external moisture will be blocked by the structural functional layer 30, making it difficult for moisture to enter the first organic layer 22 from the first encapsulation layer 41. This can prevent moisture from invading the driving circuit layer 21 from the first organic layer 22. Therefore, moisture entering from the damaged part of the second encapsulation layer 42 can be prevented from corroding the driving circuit layer 21, thus solving the problem of display abnormalities in the display panel. In addition, by baking to remove moisture from the first organic layer 22 before forming the structural functional layer 30, the moisture in the first organic layer 22 can also be prevented from corroding the driving circuit layer 21. After the structural functional layer 30 is formed, in subsequent high-temperature processes (such as the preparation of light-emitting devices), there is little or no moisture in the first organic layer 22, so there is no need to set vent holes in the structural functional layer 30 to release the moisture generated by the first organic layer 22. For example, in step S73, the substrate on which the first organic layer 22 is formed can be baked, thereby baking the substrate and each film layer thereon to remove moisture from the substrate and each film layer thereon.

[0142] This embodiment can be combined with some or all of the features in the above embodiments, which will not be repeated here.

[0143] In one possible implementation, referring to Figures 4a to 7, a structural functional layer 30 is formed on the side of the first organic layer 22 facing away from the driving circuit layer 21, specifically including:

[0144] A first conductive layer 31 is formed on the side of the first organic layer 22 that is opposite to the driving circuit layer 21.

[0145] A first inorganic layer 32 is formed on the side of the first conductive layer 31 that is opposite to the driving circuit layer 21.

[0146] The display panel includes a display area B0 and a non-display area B1. The non-display area B1 includes a first area B11. A first conductive layer 31 has a first opening 310 in the first area B11. A first inorganic layer 32 has a second opening 321 in the first area B11. The orthographic projection of the first opening 310 on the substrate 23 is outside the orthographic projection of the second opening 321 on the substrate 23.

[0147] Alternatively, the first conductive layer 31 is provided with a first opening 310 in the first region B11; the first inorganic layer 32 is continuously distributed in the first region B11; the orthographic projection of the first opening 310 on the substrate 23 is located within the orthographic projection of the first inorganic layer 32 on the substrate 23.

[0148] Alternatively, the first conductive layer 31 is continuously distributed in the first region B11; the first inorganic layer 32 is provided with a second opening 321 in the first region B11; the orthographic projection of the second opening 321 on the substrate 23 is located within the orthographic projection of the first conductive layer 31 on the substrate 23.

[0149] Alternatively, the first conductive layer 31 is continuously distributed in the first region B11; the first inorganic layer 32 is continuously distributed in the first region B11.

[0150] Based on the above preparation method, it is obvious that the structural functional layer 30 includes a first conductive layer 31 and a first inorganic layer 32. The first conductive layer 31 and the first inorganic layer 32 can jointly separate the first encapsulation layer 41 and the first organic layer 22, avoiding direct contact between the first encapsulation layer 41 and the first organic layer 22.

[0151] After the formation of the first inorganic layer 32 and before the formation of the first encapsulation layer 41, referring to FIG15a or FIG15b, the preparation method provided in this application further includes:

[0152] An isolation structure 53 is formed, and the isolation structure 53 encloses and forms an isolation opening 534;

[0153] The first inorganic layer 32 is patterned to form a pixel opening 322. The orthographic projection of the pixel opening 322 on the substrate 23 is within the orthographic projection range of the isolation opening 534 on the substrate 23. At least a portion of the surface of the first conductive layer 31 on the side opposite to the substrate 23 is exposed in the pixel opening 322.

[0154] A light-emitting structure 51 and a second electrode portion 52 are formed sequentially. The light-emitting structure 51 is disposed in the pixel opening 322, and the light-emitting structure 51 and the second electrode portion 52 are stacked sequentially on the side of the first conductive layer 31 away from the driving circuit layer 21 along the direction away from the driving circuit layer 21.

[0155] Thus, after the light-emitting structure 51, the second electrode portion 52, and the encapsulation portion 43 are formed, the first encapsulation layer 41 and the second encapsulation layer 42 can be formed in sequence, and the structural functional layer 30 separates the first encapsulation layer 41 and the first organic layer 22.

[0156] Referring to Figure 15b, the fabrication method provided in this application further includes: providing a via 221 in the portion of the first organic layer 22 located in the display area B0, so as to allow the first electrode portion 311 of the first conductive layer 31 located in the display area B0 to be electrically connected to the driving circuit layer 21 through the via 221. In this way, the first electrode portion 311, the light-emitting structure 51, and the second electrode portion 52 can form a light-emitting device 50.

[0157] In another possible implementation, referring to FIG16a, a structural functional layer 30 is formed on the side of the first organic layer 22 facing away from the driving circuit layer 21, including:

[0158] An inorganic isolation layer 33, a first conductive layer 31, and a first inorganic layer 32 are sequentially formed on the side of the first organic layer 22 facing away from the driving circuit layer 21. In the first region B11, the inorganic isolation layer 33 covers the first organic layer 22. Thus, the inorganic isolation layer 33 separates the first encapsulation layer 41 and the first organic layer 22, preventing direct contact between them. The material of the inorganic isolation layer 33 may include an inorganic insulating material.

[0159] Based on this method, the inorganic isolation layer 33 in the first region B11 can separate the first encapsulation layer 41 and the first organic layer 22, thus preventing the first encapsulation layer 41 and the first organic layer 22 from directly contacting each other.

[0160] In one example, the inorganic isolation layer 33 is continuously distributed in the first region B11.

[0161] The first conductive layer 31 includes a first electrode portion 311 in the display area B0. The portion of the first organic layer 22 located in the display area B0 is provided with a via 221. The inorganic isolation layer 33 has a third opening 331 communicating with the via 221. The first electrode portion is electrically connected to the driving circuit layer in the first organic layer 22 via the third opening 331, the via 221, and the drive circuit layer.

[0162] Referring to FIG16b, after forming the structural functional layer 30 and before forming the first encapsulation layer 41, the fabrication method provided in this application further includes:

[0163] An isolation structure 53 is formed, and the isolation structure 53 encloses and forms an isolation opening 534;

[0164] At least a portion of the film layer forming the light-emitting device and the encapsulation portion located on the side of the light-emitting device away from the substrate 23 are formed, and at least a portion of the light-emitting device 50 is located in the isolation opening 534.

[0165] At least a portion of the film layer of the light-emitting device 50 may include a light-emitting structure 51 and a second electrode portion 52. The first electrode portion 311 is formed before the isolation structure 53 and the first inorganic layer are formed.

[0166] In one example, the first conductive layer 31 includes a first electrode portion 311 in the display area B0, and the light-emitting device 50 includes the first electrode portion 311, the light-emitting structure 51, and the second electrode portion 52. After forming the isolation opening 534, the first inorganic layer 32 is patterned to form a pixel opening 322. The orthographic projection of the pixel opening 322 on the substrate 23 is located within the orthographic projection range of the isolation opening 534 on the substrate 23. A portion of the surface of the first electrode portion 311 facing away from the substrate 23 is exposed in the pixel opening 322. Then, the light-emitting structure 51 and the second electrode portion 52 are formed sequentially. At least a portion of the light-emitting structure 51 is disposed in the pixel opening 322, and the light-emitting structure 51 and the second electrode portion 52 are sequentially stacked on the side of the first electrode portion 311 facing away from the driving circuit layer 21 along a direction away from the driving circuit layer 21. The first encapsulation layer 41 is located on the side of the second electrode portion 52 facing away from the driving circuit layer 21. At least a portion of the second electrode portion 52 is located in the isolation opening 534 and overlaps with the isolation structure 53. Thus, the isolation structure 53 can reliably separate adjacent light-emitting structures 51, and the overlap between the second electrode portion 52 and the isolation structure 53 is beneficial to structural stability. Moreover, after the light-emitting structure 51, the second electrode portion 52, and the encapsulation portion are formed, the first encapsulation layer 41 and the second encapsulation layer 42 can be formed sequentially, and the structural functional layer 30 separates the first encapsulation layer 41 and the first organic layer 22.

[0167] The luminescent structure 51 may include one or more of the following: a hole injection layer (HIL), a hole transfer layer (HTL), an emitting layer (EML), and an electron transfer layer (ETL). The organic luminescent material in the emitting layer is generally classified into: polymers, small-molecule organic compounds, and complex luminescent materials. Polymers are typically conductive conjugated polymers or semiconductor conjugated polymers, which can be spin-coated, making them simple and low-cost to manufacture, but their purity is not high, and they are inferior to small-molecule organic compounds in terms of durability, brightness, and color. Small-molecule organic luminescent materials are mainly organic dyes, which have advantages such as strong chemical modification capabilities, a wide selection range, easy purification, high quantum efficiency, and the ability to produce emission peaks of various colors such as red, green, blue, and yellow. However, most of them suffer from concentration quenching problems in the solid state. Complex luminescent materials are intermediate between organic and inorganic materials, possessing both the high fluorescence quantum efficiency of organic materials and the high stability of inorganic materials, and are considered a promising class of luminescent materials.

[0168] The encapsulation part 43 in Figures 15a, 15b, 16a, and 16b is not shown; its structure can be seen in Figures 12a and 12b, etc. The light-emitting structure 51, the second electrode part 52, and the encapsulation part 43 in Figures 4a, 4b, 5 to 10, 13a, 13b, 13c, 13d, and 13e are not shown; their structures can be seen in Figures 12a and 12b, etc. Figures 4a, 4b, 5 to 13e, 15a, 15b, 16a, and 16b can be cross-sectional views along the BB direction in Figure 3.

[0169] This application also provides a display device, which includes a display panel, and the display panel can be the aforementioned display panel.

[0170] An exemplary display terminal is shown in Figure 17, which includes a device body 601 and a display panel 602. The display panel 602 is disposed on the device body 601 and electrically connected to the device body 601. The display panel 602 is the display panel in the aforementioned embodiment, used to display static or dynamic images.

[0171] For example, the above-mentioned display device can be implemented in the form of various electronic devices such as mobile phones, tablet computers, handheld computers, wearable devices, and in-vehicle display devices.

[0172] The above embodiments are only used to illustrate the embodiments of this application, and are not intended to limit the embodiments of this application. Those skilled in the art can make various changes, combinations, substitutions, adjustments and modifications without departing from the spirit and scope of the embodiments of this application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of this application, and the patent protection scope of the embodiments of this application should be defined by the claims.

Claims

1. A display panel, the display panel comprising: substrate, A driving circuit layer is disposed on the substrate; A first organic layer is disposed on the side of the driving circuit layer away from the substrate; A structural functional layer, a first encapsulation layer, and a second encapsulation layer are disposed on the side of the first organic layer opposite to the driving circuit layer. The structural functional layer, the first encapsulation layer, and the second encapsulation layer are stacked sequentially along a direction away from the driving circuit layer. In a first region, the structural functional layer isolates the first organic layer and the first encapsulation layer. The structural functional layer in the first region is continuously distributed in its orthographic projection on the substrate. The structural functional layer includes a first inorganic layer. The material of the first encapsulation layer includes an organic material, and the material of the second encapsulation layer includes an inorganic material. An isolation structure is located between the first organic layer and the first encapsulation layer, and the isolation structure encloses and forms a plurality of isolation openings; Multiple light-emitting devices are located between the first organic layer and the first encapsulation layer, with at least a portion of each light-emitting device located in a corresponding isolation opening.

2. The display panel according to claim 1, wherein, The display panel includes a display area and a non-display area, the non-display area including the first area; the structural functional layer includes a first conductive layer and a first inorganic layer stacked along the thickness direction of the substrate; The first conductive layer has a first opening in the first region; The first inorganic layer has a second opening in the first region; The orthographic projection of the first opening on the substrate is outside the orthographic projection of the second opening on the substrate; The first inorganic layer is an inorganic insulating layer.

3. The display panel according to claim 1, wherein, The display panel includes a display area and a non-display area, the non-display area including the first area; the structural functional layer includes a first conductive layer and a first inorganic layer stacked along the thickness direction of the substrate; The first conductive layer has a first opening in the first region; The first inorganic layer is continuously distributed in the first region; The orthographic projection of the first opening on the substrate is located within the orthographic projection of the first inorganic layer on the substrate; The first inorganic layer is an inorganic insulating layer; the first inorganic layer has no opening in the first region.

4. The display panel according to claim 1, wherein, The display panel includes a display area and a non-display area, the non-display area including the first area; the structural functional layer includes a first conductive layer and a first inorganic layer stacked along the thickness direction of the substrate; The first conductive layer is continuously distributed in the first region; The first inorganic layer has a second opening in the first region; The orthographic projection of the second opening on the substrate lies within the orthographic projection of the first conductive layer on the substrate; The first inorganic layer is an inorganic insulating layer; The first conductive layer has no opening in the first region.

5. The display panel according to claim 1, wherein, The display panel includes a display area and a non-display area, the non-display area including the first area; the structural functional layer includes a first conductive layer and a first inorganic layer stacked along the thickness direction of the substrate; The first conductive layer is continuously distributed in the first region; The first inorganic layer is continuously distributed in the first region; The first inorganic layer is an inorganic insulating layer; neither the first conductive layer nor the first inorganic layer has an opening in the first region.

6. The display panel according to claim 1, wherein, The display panel includes a display area and a non-display area, the non-display area including the first area; the structural functional layer includes an inorganic isolation layer, a first conductive layer and a first inorganic layer stacked along the thickness direction of the substrate; The first conductive layer has a first opening in the first region; The first inorganic layer has a second opening in the first region; The orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the second opening on the substrate; The overlapping area of ​​the orthographic projection of the first opening on the substrate and the orthographic projection of the second opening on the substrate is located within the orthographic projection of the inorganic isolation layer on the substrate.

7. The display panel according to claim 6, wherein, The inorganic isolation layer is located on the side of the first conductive layer and the first inorganic layer that is closer to the substrate; The first inorganic layer is an inorganic insulating layer. The inorganic isolation layer is an inorganic insulating layer; The inorganic isolation layer is continuously distributed in the first region; The inorganic isolation layer has no opening in the first region.

8. The display panel according to claim 1, wherein, The display panel includes a display area and a non-display area, the non-display area including the first area; the structural functional layer includes an inorganic isolation layer, a first conductive layer and a first inorganic layer stacked along the thickness direction of the substrate; The first conductive layer has a first opening in the first region; The first inorganic layer has a second opening in the first region; The orthographic projection of the first opening on the substrate is outside the orthographic projection of the second opening on the substrate.

9. The display panel according to claim 8, wherein, The inorganic isolation layer is located on the side of the first conductive layer and the first inorganic layer that is closer to the substrate; The first inorganic layer is an inorganic insulating layer. The inorganic isolation layer is an inorganic insulating layer; The inorganic isolation layer is continuously distributed in the first region; The inorganic isolation layer has no opening in the first region.

10. The display panel according to claim 1, wherein, The display panel includes a display area and a non-display area, the non-display area including the first area; the structural functional layer includes an inorganic isolation layer, a first conductive layer and a first inorganic layer stacked along the thickness direction of the substrate; The first conductive layer is continuously distributed in the first region; The first inorganic layer is continuously distributed in the first region; The inorganic isolation layer is continuously distributed in the first region.

11. The display panel according to claim 10, wherein, The inorganic isolation layer is located on the side of the first conductive layer and the first inorganic layer that is close to the substrate; in the first region, the boundary of the inorganic isolation layer away from the display area is located on the side of the first organic layer away from the display area. The first inorganic layer is an inorganic insulating layer. The inorganic isolation layer is an inorganic insulating layer; None of the first conductive layer, the first inorganic layer, and the inorganic isolation layer have openings in the first region.

12. The display panel according to claim 1, wherein, The display panel includes a display area and a non-display area, and the non-display area includes a plurality of first areas; the structural functional layer includes a first conductive layer and a first inorganic layer stacked along the thickness direction of the substrate; the first conductive layer includes a first sub-conductive layer and a second sub-conductive layer, and the plurality of first areas includes a first type of first area and a second type of first area; In the first category, first zone: The first sub-conductive layer has a first opening in the first region of the first type; The first inorganic layer has a second opening in the first region of the first type; The orthographic projection of the first opening on the substrate is outside the orthographic projection of the second opening on the substrate; In the second category, first zone: The second sub-conductive layer has a first opening in the second type of first region; The first inorganic layer has a second opening in the second type of first region; The orthographic projection of the first opening on the substrate is outside the orthographic projection of the second opening on the substrate; Or, in the second category, first zone: The second sub-conductive layer has a first opening in the second type of first region; The first inorganic layer is continuously distributed in the second type of first region; The orthographic projection of the first opening on the substrate lies within the orthographic projection of the first inorganic layer on the substrate.

13. The display panel according to claim 12, wherein, One of the first sub-conductive layer and the second sub-conductive layer is located on the side of the first inorganic layer away from the substrate, and the other is located on the side of the first inorganic layer closer to the substrate.

14. The display panel according to claim 13, wherein, The first sub-conductive layer is disposed in the same layer as the isolation structure; the second sub-conductive layer is disposed in the same layer as the first electrode portion of the light-emitting device; the first inorganic layer is a pixel defining layer.

15. The display panel according to claim 12, wherein, The first type of first area and the second type of first area are located in the adjacent side border areas of the display area.

16. The display panel according to any one of claims 2 to 15, wherein, The display panel further includes signal traces located in the first area, the signal traces being disposed on the side of the second encapsulation layer opposite to the substrate; the signal traces and the driving circuit layer are located on opposite sides of the first conductive layer along a direction parallel to the thickness of the substrate; The driving circuit layer includes a gate driving circuit. In the first region, the gate driving circuit and the signal trace are located on opposite sides of the first conductive layer along a direction parallel to the thickness of the substrate. The signal traces are touch traces.

17. The display panel according to any one of claims 2 to 15, wherein, The first area includes a border area located on at least one side of the display area. There are multiple first zones, and two first zones are respectively the first border zone and the second border zone located on opposite sides of the display area. The first conductive layer is located between the first inorganic layer and the substrate, or the first inorganic layer is located between the first conductive layer and the substrate.

18. The display panel according to any one of claims 2 to 15, wherein, The first conductive layer is located between the first inorganic layer and the substrate. The first organic layer has a via in the display area, the driving circuit layer includes a pixel circuit located in the display area, and the first conductive layer includes a first electrode portion in the display area, which is electrically connected to the pixel circuit through the via.

19. The display panel according to any one of claims 2 to 15, wherein, The first inorganic layer is a pixel-defining layer. The light-emitting device includes a first electrode portion, a light-emitting structure, and a second electrode portion, which are sequentially stacked along a direction away from the substrate. The first electrode portion is located between the first inorganic layer and the substrate. The first inorganic layer has a pixel opening in the display area, the pixel opening exposing at least a portion of the surface of the first electrode portion away from the substrate, and the light-emitting structure is stacked on the surface of the first electrode portion away from the substrate.

20. The display panel according to any one of claims 1 to 15, wherein, The light-emitting device includes a first electrode portion, a light-emitting structure, and a second electrode portion, which are sequentially stacked along a direction away from the substrate, and the second electrode portion is electrically connected to the isolation structure. The display panel further includes multiple encapsulation portions, each encapsulation portion being located on the side of the corresponding light-emitting device away from the substrate, and the encapsulation portion being located between the first encapsulation layer and the film layer containing the light-emitting device; The packaging portion corresponds to different light-emitting devices with different emission colors.

21. The display panel according to claim 20, wherein, At least a portion of the first conductive layer is disposed in the same layer as at least a portion of the film layer of the isolation structure, and / or, at least a portion of the first conductive layer is disposed in the same layer as the first electrode portion of the light-emitting device; The isolation structure includes a first structural layer and a second structural layer, which are stacked sequentially along a direction close to the substrate. The sidewall of the first structural layer facing the isolation opening protrudes beyond the sidewall of the second structural layer facing the isolation opening. The materials of the first structural layer and the second structural layer are different; The material of the second structural layer includes a conductive material.

22. The display panel according to claim 21, wherein, The isolation structure further includes a third structural layer, wherein the first structural layer, the second structural layer, and the third structural layer are stacked sequentially along the direction close to the substrate; the orthographic projection of the second structural layer on the substrate is located within the orthographic projection of the third structural layer on the substrate. The material of the third structural layer may be the same as or different from the material of the first structural layer.

23. The display panel according to any one of claims 6 to 11, wherein, The first conductive layer is located between the first inorganic layer and the substrate. The first organic layer includes a via in the display area, and the inorganic isolation layer has a third opening in the display area. The orthographic projection of the via on the substrate and the orthographic projection of the third opening on the substrate overlap. The first conductive layer includes a first electrode portion in the display area, and the first electrode portion is electrically connected to the driving circuit layer through the third opening and the via. In the display area, the orthographic projection of the inorganic isolation layer on the substrate overlaps with the orthographic projection of the first inorganic layer on the substrate.

24. The display panel according to any one of claims 2 to 15, wherein, The display panel also includes a barrier wall located in the non-display area of ​​the display panel, and the first area is located between the barrier wall and the display area of ​​the display panel.

25. The display panel according to claim 24, wherein, The first encapsulation layer is located on at least a portion of the barrier wall on the side close to the display area, the barrier wall being made of an organic material, and the first conductive layer is disposed on the side of the barrier wall facing away from the substrate; The first conductive layer has a first through hole, and the orthographic projection of the barrier on the substrate overlaps with the orthographic projection of the first through hole on the substrate; The first inorganic layer has a second through hole, and the overlapping area of ​​the orthographic projection of the first through hole on the substrate and the orthographic projection of the second through hole on the substrate overlaps with the orthographic projection of the barrier on the substrate.

26. The display panel according to any one of claims 6 to 11, wherein, The display panel also includes a barrier located in the non-display area, with the first encapsulation layer located on at least a portion of the barrier on the side closest to the display area, and the barrier being made of an organic material. The inorganic isolation layer is located on the side of the barrier wall closer to the display area; The first conductive layer is located on the side of the barrier wall closer to the display area; The first inorganic layer has a second through hole, and the orthographic projection of the barrier on the substrate overlaps with the orthographic projection of the second through hole on the substrate.

27. A method for manufacturing a display panel, the method comprising: Provide substrate, A driving circuit layer and a first organic layer are sequentially formed on the substrate; Bake the first organic layer; A structural functional layer, a first encapsulation layer, and a second encapsulation layer are sequentially formed on the side of the first organic layer opposite to the driving circuit layer, and the structural functional layer in the first region separates the first encapsulation layer and the first organic layer.

28. The method for manufacturing a display panel according to claim 27, wherein, The formation of a structural functional layer on the side of the first organic layer opposite to the driving circuit layer includes: A first conductive layer is formed on the side of the first organic layer opposite to the driving circuit layer. A first inorganic layer is formed on the side of the first conductive layer opposite to the driving circuit layer. The display panel includes a display area and a non-display area, the non-display area including the first area; the first conductive layer has a first opening in the first area; the first inorganic layer has a second opening in the first area, and the orthographic projection of the first opening on the substrate is outside the orthographic projection of the second opening on the substrate; Alternatively, the first conductive layer has a first opening in the first region; the first inorganic layer is continuously distributed in the first region, and the orthographic projection of the first opening on the substrate is located within the orthographic projection of the first inorganic layer on the substrate. Alternatively, the first conductive layer is continuously distributed in the first region; the first inorganic layer has a second opening in the first region, and the orthographic projection of the second opening on the substrate is located within the orthographic projection of the first conductive layer on the substrate. Alternatively, the first conductive layer may be continuously distributed in the first region; or the first inorganic layer may be continuously distributed in the first region.

29. The method for manufacturing a display panel according to claim 27, wherein, A structural functional layer is formed on the side of the first organic layer opposite to the driving circuit layer, including: An inorganic isolation layer, a first conductive layer, and a first inorganic layer are sequentially formed on the side of the first organic layer opposite to the driving circuit layer. In the first region, the inorganic isolation layer covers the first organic layer; The display panel includes a display area and a non-display area, and the non-display area includes a first area; the inorganic isolation layer is continuously distributed in the first area; After forming the structural functional layers and before forming the first encapsulation layer and the second encapsulation layer, the method further includes: An isolation structure is formed, which encloses an isolation opening; The light-emitting device comprises at least a portion of a film layer and an encapsulation portion located on the side of the light-emitting device away from the substrate, wherein at least a portion of the light-emitting device is located in the isolation opening.

30. A display device comprising a display panel as claimed in any one of claims 1 to 26, or a display panel prepared by the method of preparing the display panel as claimed in any one of claims 27 to 29.

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