Camera module

Abstract

This camera module comprises: a body; a substrate disposed on the outer surface of the body and including a hole; and a bonding member disposed such that at least a portion thereof passes through the hole, and facing the outer surface of the body, wherein the bonding member is made of a light-transmitting material.

Description

Camera module

[0001] This embodiment relates to a camera module.

[0002]

[0003] A camera is a device that captures subjects in photos or videos, and it is mounted on portable devices, drones, vehicles, etc. To improve image quality, camera modules may feature Image Stabilization (IS) to correct or prevent image shake caused by user movement, Auto Focusing (AF) to automatically adjust the distance between the image sensor and the lens to align the lens focal length, and Zooming to increase or decrease the magnification of distant subjects using a zoom lens.

[0004] To implement the aforementioned functions, the camera module includes a substrate, and at least one electronic component is disposed on the surface of the substrate. The substrate is coupled to a body that forms the external shape of the camera module. Therefore, since insufficient coupling force between the substrate and the body may cause a malfunction in the camera module's configuration functions, it is necessary to ensure sufficient coupling force between multiple components.

[0005] In addition, the camera module includes multiple electronic components, and for example, multiple electronic components may be placed on a substrate. Although multiple components within the camera module can be interconnected through an adhesive, there is a problem of reduced production efficiency due to the time required for the adhesive to cure using heat or UV.

[0006]

[0007] The present invention provides a camera module that can improve production efficiency by enabling a robust bonding between multiple components without the use of adhesive.

[0008] In addition, it is to provide a camera module that facilitates securing space for component placement within the circuit board.

[0009]

[0010] A camera module according to the present embodiment comprises: a body; a substrate disposed on the outer surface of the body and including a hole; and a bonding member disposed such that at least a portion penetrates the hole and faces the outer surface of the body, wherein the bonding member is made of a light-transmitting material.

[0011] The above-mentioned bonding member includes a head portion disposed on the outer surface of the substrate; and a coupling portion protruding from the head portion and disposed within the hole, wherein the cross-sectional area of ​​the head portion may be larger than the cross-sectional area of ​​the hole.

[0012] It may include a welded portion disposed between the inner surface of the joint and the outer surface of the body.

[0013] At least a portion of the above welded portion may be positioned between the inner surface of the hole and the joint portion.

[0014] The light transmittance of the above-mentioned bonding member may be higher than the light transmittance of the above-mentioned substrate.

[0015] The material of the above body is plastic, and the material of the above joining member may include at least one of resin, plastic, and acrylic.

[0016] The above body includes a plurality of side plates, the substrate is arranged to wrap around the outer surface of the side plates, and the weld portion may be arranged in the corner area of ​​the body, which is the connection area of ​​the plurality of side plates.

[0017] It may include a metal layer disposed on the outer surface of the above body and facing the above joining member.

[0018] The above substrate may be a flexible printed circuit board (FPCB).

[0019] The inner surface of the head portion can come into contact with the inner surface of the substrate.

[0020]

[0021] Through this embodiment, by implementing a bonding structure between a substrate and a body without adhesive, there is an advantage of being able to improve production efficiency and lower manufacturing costs.

[0022] In particular, there is an advantage that the joining process can be performed more easily by using a laser welding process through a joining member made of a light-transmitting material.

[0023] In addition, by securing the placement area of ​​the wiring layer through the control of bonding strength by region of the bonding part, there is an advantage of being able to secure a wider space for component placement on the substrate.

[0024]

[0025] FIG. 1 is a perspective view of a camera module according to a first embodiment of the present invention.

[0026] FIG. 2 is an exploded perspective view of a camera module according to a first embodiment of the present invention.

[0027] FIG. 3 is a perspective view of a base according to a first embodiment of the present invention.

[0028] FIG. 4 is a plan view illustrating the coupling structure of a substrate coupled to the outer surface of a base according to the first embodiment of the present invention.

[0029] FIG. 5 is a cross-sectional view illustrating the coupling structure of a base and a substrate according to a first embodiment of the present invention.

[0030] FIG. 6 is a drawing showing the bonding interface between a base and a bonding member according to the first embodiment of the present invention.

[0031] FIG. 7 is an exploded perspective view of a camera device according to a first embodiment of the present invention.

[0032] FIG. 8 is a perspective view of a mobile terminal having a camera module applied according to a first embodiment of the present invention.

[0033] FIG. 9 is a perspective view of a mobile terminal with a camera module applied according to another embodiment of the present invention.

[0034] FIG. 10 is an exploded perspective view of a substrate, an infrared filter, and an image sensor according to a second embodiment of the present invention.

[0035] FIG. 11 is a drawing of FIG. 10 shown from a different angle.

[0036] FIG. 12 is a cross-sectional view of a camera module according to a second embodiment of the present invention.

[0037] FIG. 13 is a plan view showing the upper surface of a substrate combined with an infrared filter according to a second embodiment of the present invention.

[0038] FIG. 14 is a drawing of a first bonding part according to a second embodiment of the present invention.

[0039] FIG. 15 is a drawing of a second bonding part according to a second embodiment of the present invention.

[0040]

[0041] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0042] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0043] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0044] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0045] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0046] In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention. These terms are used merely to distinguish the components from other components and are not intended to limit the essence, order, or sequence of the components.

[0047] And, where it is stated that a component is 'connected', 'combined', or 'connected' to another component, this may include not only cases where the component is directly 'connected', 'combined', or 'connected' to the other component, but also cases where it is 'connected', 'combined', or 'connected' due to another component located between the component and the other component.

[0048] Furthermore, when described as being formed or placed "above" or "below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above" or "below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0049] As used below, the 'Optical Axis Direction' is defined as the optical axis direction of the lens and / or image sensor coupled to the lens driving device.

[0050] As used below, the 'vertical direction' may be a direction parallel to or the same as the optical axis. The vertical direction may correspond to the 'z-axis direction'. As used below, the 'horizontal direction' may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Therefore, the horizontal direction may include the 'x-axis direction' and the 'y-axis direction'.

[0051] As used below, the 'Auto Focus (AF) function' is defined as a function that automatically focuses on a subject by adjusting the distance to the image sensor through the movement of the lens along the optical axis according to the distance to the subject, so that a sharp image of the subject can be obtained on the image sensor. Additionally, 'Closed-loop Auto Focus (CLAF) control' is defined as real-time feedback control of the lens position by detecting the distance between the image sensor and the lens to improve the accuracy of focus adjustment.

[0052] The 'optical image stabilization (OIS) function' used below is defined as a function that moves or tilts the lens in a direction perpendicular to the optical axis to offset hand shake in order to prevent the image or video from shaking due to the user's hand shake. Additionally, 'closed-loop auto focus (CLAF) control' is defined as a function that detects the position of the lens relative to the image sensor and provides real-time feedback control of the lens position to improve the accuracy of image stabilization.

[0053] FIG. 1 is a perspective view of a camera module according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view of a camera module according to a first embodiment of the present invention, FIG. 3 is a perspective view of a base according to a first embodiment of the present invention, FIG. 4 is a plan view illustrating a coupling structure of a substrate coupled to the outer surface of a base according to a first embodiment of the present invention, FIG. 5 is a cross-sectional view illustrating a coupling structure of a base and a substrate according to a first embodiment of the present invention, and FIG. 6 is a drawing of the coupling interface between a base and a bonding member according to a first embodiment of the present invention.

[0054] Referring to FIGS. 1 through 6, the camera module (10) may include a lens driving device. The lens driving device may be a voice coil motor (VCM). The lens driving device may be a lens driving motor. The lens driving device may be a lens driving actuator. The lens driving device may include an AF module. The lens driving device may include an OIS module.

[0055] The lens driving device may include a fixed part. The fixed part may be a part that is fixed relatively when the movable part moves. The movable part may move relative to the fixed part.

[0056] The lens driving device may include a base (110). The fixed part may include the base (110). The base (110) may be positioned below the AF carrier (210). The base (110) may be positioned below the OIS carrier (310). The base (110) may be coupled with a cover (700). The AF carrier (210) and the OIS carrier (310) may be positioned on the base (110). The AF carrier (210) and the OIS carrier (310) may be positioned on the lower plate (190) of the base (110). The AF carrier (210) and the OIS carrier (310) may be positioned within the base (110).

[0057] The base (110) may include a lower plate portion (190). The lower plate portion (190) of the base (110) may support the lower surface of the AF moving portion. The lower plate portion (190) of the base (110) may support the lower surface of the AF carrier (210). The lower plate portion (190) may include an opening (192) having a shape that penetrates from one surface to the other surface in the direction of the optical axis. Through the opening (192), an image sensor and a lens may be positioned facing each other in the direction of the optical axis.

[0058] The base (110) may include a side plate (170) extending upward from the bottom plate (190). The base (110) may include four side plates (170). The four side plates (170) may include a first side plate and a third side plate positioned opposite each other, and a second side plate and a fourth side plate positioned opposite each other. The side plates (170) of the base (110) may include holes (111-113). Each side plate (170) of the base (110) may have one hole formed therein. The holes (111-113) of the base (110) may be formed corresponding to the shape of the coil. The inner surface of the holes (111-113) of the base (110) may face the outer surface of the coil. A coil placed on a substrate (120) that is positioned to surround the side plate (170) of the base (110) through a hole (111-113) formed in the side plate (170) of the base (110) can face the internal space of the base (110).

[0059] The side plate (170) of the base (110) may include first to third holes (111-113). The side plate (170) on which the first hole (111) is placed and the side plate (170) on which the second hole (112) is placed may face each other. The side plate (170) on which the first hole (111) is placed and the side plate (170) on which the second hole (112) is placed may be arranged vertically. The side plate (170) on which the first hole (111) is placed and the side plate (170) on which the third hole (113) is placed may be arranged vertically.

[0060] The AF coil (420) placed on the substrate (120) through the first hole (111) can be exposed inwardly toward the base (110). The OIS-x coil (520) placed on the substrate (120) through the second hole (112) can be exposed inwardly toward the base (110). The OIS-y coil (620) placed on the substrate (120) through the third hole (113) can be exposed inwardly toward the base (110).

[0061] The base (110) may include a stepped portion (180). The stepped portion (180) may be formed at the lower end of the outer surface of the base (110). The stepped portion (180) may protrude from the outer surface of the base (110). The stepped portion (180) may have a shape that protrudes outward from the outer surface of the side plate (170) of the base (110). The stepped portion (180) may be placed at the lower end of the side plate (170). The side plate (720) of the cover (700) may be placed on the stepped portion (180) of the base (110). A substrate (120) may be placed on the stepped portion (180) of the base (110).

[0062] The lens driving device may include a substrate (120). The substrate (120) may be a flexible printed circuit board (FPCB). The substrate (120) may be electrically connected to a coil (420, 520, 620). The substrate (120) may be electrically connected to a sensor (430, 530, 630).

[0063] A substrate (120) may be placed on a base (110). The substrate (120) may include a flexible substrate. The substrate (120) may include a flexible printed circuit board (FPCB). The substrate (120) may include an elastic portion.

[0064] The substrate (120) may include four substrates disposed on four sides of the base (110). The four substrates may be formed to wrap around the sides of the base (110). The four substrates may include a first substrate and a third substrate disposed opposite each other, and a second substrate and a fourth substrate disposed opposite each other. The four substrates may be connected to each other. The connection area of ​​the four substrates may be a folded area. At least one of the four substrates may include a terminal portion. The four substrates may include two terminal portions. The two terminal portions may be disposed opposite each other with respect to the optical axis. The terminal portion may include a terminal.

[0065] The substrate (120) may include a terminal. The terminal may be positioned at the bottom of the base (110). The terminal may be coupled to the printed circuit board (50). The terminal may be coupled to the terminal of the printed circuit board (50) through solder. The terminal may be coupled to the terminal of the printed circuit board (50) through a conductive member. The terminal may be connected to the terminal of the printed circuit board (50). The terminal may be electrically connected to the terminal of the printed circuit board (50).

[0066] The lens driving device may include a cover (700). The fixed part may include a cover (700). The cover (700) may be placed on the base (110). The cover (700) may be placed on the base (110). The cover (700) may be coupled to the base (110). The cover (700) may be fixed to the base (110). The cover (700) may accommodate an AF carrier (210) inside. The cover (700) may accommodate an OIS carrier (310) inside. The cover (700) may be a shield member. The cover (700) may be a shield can.

[0067] The cover (700) may include a top plate (710). The top plate (710) may be placed on a moving part. The upward movement of the moving part may be limited by the moving part coming into contact with the top plate (710). The top plate (710) may include a hole through which light passes. The hole may be placed in the center of the top plate (710).

[0068] The cover (700) may include a side plate (720). The side plate (720) may extend downward from the top plate (710). The side plate (720) may be placed on the base (110). The side plate (720) may be placed on a stepped portion that protrudes from the lower end of the outer surface of the base (110). The side plate (720) may include a plurality of side plates. The side plate (720) may include four side plates. The side plate (720) may include a first side plate and a third side plate placed opposite each other, and a second side plate and a fourth side plate placed opposite each other.

[0069] The lens driving device may include a moving part. The moving part may be disposed in a fixed part. The moving part may be disposed within the fixed part. The moving part may be disposed on the fixed part. The moving part may be movably disposed in the fixed part. The moving part may be moved relative to the fixed part by a driving part. The moving part may move during AF driving. The moving part may move during OIS driving. A lens may be coupled to the moving part.

[0070] The lens drive unit may include an AF moving unit. The AF moving unit may be disposed in a fixed part. The AF moving unit may be disposed within the fixed part. The AF moving unit may be disposed on the fixed part. The AF moving unit may be disposed between the fixed part and the OIS moving unit. The AF moving unit may be movably disposed in the fixed part. The AF moving unit may be moved in the direction of the optical axis relative to the fixed part by the AF driving unit. The AF moving unit may be moved during AF driving.

[0071] In the modified example, the AF moving unit and the AF driving unit may be omitted. That is, the OIS moving unit may be placed on the fixed part. Alternatively, the OIS moving unit may be placed on the fixed part, and the AF moving unit may be placed within the OIS moving unit.

[0072] The lens drive unit may include an AF carrier (210). The AF moving unit may include an AF carrier (210). The AF carrier (210) may be an 'AF holder'. The AF carrier (210) may be a 'housing'. The AF carrier (210) may be placed within the base (110). The AF carrier (210) may be placed on the base (110). The AF carrier (210) may be placed within the cover (700). The AF carrier (210) may be placed between the base (110) and the OIS carrier (310). The AF carrier (210) may be placed so as to be movable in the direction of the optical axis.

[0073] The AF carrier (210) may include a bottom plate. The bottom plate may be placed on the base (110). The bottom plate may be placed between the OIS carrier (310) and the bottom plate of the base (110).

[0074] The AF carrier (210) may include a side wall. The side wall may extend upward from the bottom plate. A substrate (120) may be placed on the side wall. An AF coil (420) may be placed on the side wall. An OIS-x coil (520) may be placed on the side wall. An OIS-y coil (620) may be placed on the side wall. The side wall may include a groove that avoids the coil. An AF magnet (410) may be placed on the side wall. An OIS-x magnet (510) may be placed on the side wall. An OIS-y magnet (610) may be placed on the side wall.

[0075] The side wall may include a plurality of side walls. The side wall may include four side walls. The side wall may include a first side wall and a second side wall positioned opposite each other, and a third side wall and a fourth side wall positioned opposite each other. The AF carrier (210) may include a column portion that is not a side wall. One of an AF coil (420), an OIS-x coil (520), and an OIS-y coil (620) may be positioned between two adjacent columns. One of an AF magnet (410), an OIS-x magnet (510), and an OIS-y magnet (610) may be positioned between two adjacent columns.

[0076] The AF carrier (210) may include a hole. The hole may be formed in the side wall of the AF carrier (210). The hole may be open inward. The hole may be formed as a groove. The hole may be replaced by a groove.

[0077] The lens driving device may include an OIS moving unit. The OIS moving unit may be disposed in a fixed part. The OIS moving unit may be disposed within the fixed part. The OIS moving unit may be disposed on the fixed part. The OIS moving unit may be disposed within an AF moving unit. The OIS moving unit may be movably disposed. The OIS moving unit may be moved by an OIS driving unit in a direction perpendicular to the optical axis with respect to the fixed part and the AF moving unit. The OIS moving unit may be moved in the x-axis direction by an OIS-x driving unit. The OIS moving unit may be moved in the y-axis direction by an OIS-y driving unit. The OIS moving unit may be moved during OIS driving.

[0078] The lens driving device may include an OIS carrier (310). The OIS moving part may include an OIS carrier (310). The OIS carrier (310) may be an 'OIS holder'. The OIS carrier (310) may be a 'bobbin'. The OIS carrier (310) may be placed within an AF carrier (210). The OIS carrier (310) may be placed within a base (110). The OIS carrier (310) may be placed on the base (110). The OIS carrier (310) may be placed within a cover (700). The OIS carrier (310) may be placed so as to be movable in a direction perpendicular to the optical axis.

[0079] The OIS carrier (310) may include an outer surface. The OIS carrier (310) may include a plurality of sides. The OIS carrier (310) may include a first side and a third side positioned opposite each other, and a second side and a fourth side positioned opposite each other. A magnet may be disposed on at least one of the plurality of sides of the OIS carrier (310). An OIS-x magnet (510) and an OIS-y magnet (610) may be disposed on the sides of the OIS carrier (310). An AF magnet (410) may be disposed on the first side of the OIS carrier (310). An OIS-x magnet (510) may be disposed on the second side of the OIS carrier (310). An OIS-y magnet (610) may be disposed on the third side of the OIS carrier (310).

[0080] The lens driving device may include a driving unit. The driving unit may move a moving unit relative to a fixed unit. The driving unit may include an AF driving unit. The driving unit may include an OIS driving unit. The driving unit may include an OIS-x driving unit. The driving unit may include an OIS-y driving unit. The driving unit may include a coil and a magnet.

[0081] The lens driving device may include an AF driving unit. The AF driving unit may move the AF moving unit in the direction of the optical axis. The AF driving unit may move the AF carrier (210) in the direction of the optical axis. The AF driving unit may move the AF carrier (210) in the direction of the optical axis through electromagnetic force. The AF driving unit may include a coil and a magnet.

[0082] In this embodiment, the AF carrier (210) and the OIS carrier (310) can move in the optical axis direction through the interaction between the AF coil (420) and the AF magnet (410). The AF coil (420), the AF carrier (210), and the OIS carrier (310) can move together in the optical axis direction.

[0083] The lens drive unit may include an AF magnet (410). The AF drive unit may include an AF magnet (410). The AF magnet (410) may be an 'AF magnet'. The AF magnet (410) may be a permanent magnet. The AF magnet (410) may be placed in a fixed part. The AF magnet (410) may be placed in a base (110). The AF magnet (410) may be placed in a cover (700). The AF magnet (410) may be placed on a side plate of the cover (700). The AF magnet (410) may be placed on an outer surface of the base (110). The AF magnet (410) may be placed on an inner surface of the base (110). The AF magnet (410) may be fixed to the base (110). The AF magnet (410) can be attached to the base (110). The AF magnet (410) can be attached to the base (110) with adhesive. The AF magnet (410) can be placed inside the cover (700). The AF magnet (410) can interact with the AF coil (420). The AF magnet (410) can have electromagnetic interaction with the AF coil (420). The AF magnet (410) can be placed at a position corresponding to the AF coil (420). The AF magnet (410) can face the AF coil (420). The AF magnet (410) can be opposite the AF coil (420). The AF magnet (410) can overlap the AF coil (420) in a direction perpendicular to the optical axis.

[0084] The lens drive unit may include an AF coil (420). The AF drive unit may include an AF coil (420). The AF coil (420) may interact with the AF magnet (410). The AF coil (420) may face the AF magnet (410). The AF coil (420) may face the AF magnet (410). The AF coil (420) may be positioned at a location corresponding to the AF magnet (410). The AF coil (420) may overlap the AF magnet (410) in a direction perpendicular to the optical axis. The AF coil (420) may be placed on the AF carrier (210). The AF coil (420) may be placed on the AF moving unit.

[0085] In this embodiment, the AF coil (420) can move in the direction of the optical axis. The AF coil (420) can move in the direction of the optical axis through interaction with the AF magnet (410). The AF coil (420) can move together with the AF moving part. The AF coil (420) can move in the direction of the optical axis together with the AF moving part. During the AF driving process, the AF coil (420) can move in the direction of the optical axis together with the AF moving part. The AF coil (420) can be placed in the AF moving part. The AF coil (420) can be fixed to the AF moving part. The AF coil (420) can be coupled to the AF moving part.

[0086] The lens drive unit may include an AF sensor (430). The AF drive unit may include an AF sensor (430). The AF sensor (430) may be a Hall sensor. The AF sensor (430) may be placed on an inner substrate. The AF sensor (430) may detect an AF magnet (410). The AF sensor (430) may detect movement of the AF magnet (410). The amount of movement or position of the AF magnet (410) detected by the AF sensor (430) may be used for feedback of the autofocus drive.

[0087] The AF sensor (430) may be a driver IC. The driver IC may include a sensing unit. The sensing unit may include a Hall element (Hall IC). The driver IC may be electrically connected to the AF coil (420). The driver IC may supply current to the AF coil (420).

[0088] The AF sensor (430) may be placed within the AF coil (420). The AF sensor (430) may overlap with the AF magnet (410) in a direction perpendicular to the optical axis. As a variation, the AF sensor (430) may be placed outside the AF coil (420). The AF sensor (430) may overlap with the AF coil (420) in the direction of the optical axis. The AF sensor (430) may overlap with the AF coil (420) in a direction perpendicular to the optical axis.

[0089] The lens driving device may include an OIS driving unit. The OIS driving unit can move the OIS moving unit in a direction perpendicular to the optical axis. The OIS driving unit can move the OIS carrier (310) in a direction perpendicular to the optical axis. The OIS driving unit can move the OIS carrier (310) in a direction perpendicular to the optical axis through electromagnetic force.

[0090] The lens driving device may include an OIS-x driving unit. The OIS driving unit may include an OIS-x driving unit. The OIS-x driving unit may move the OIS carrier (310) in the x-axis direction perpendicular to the optical axis. The OIS-x driving unit may move the OIS carrier (310) in the x-axis direction perpendicular to the optical axis through electromagnetic force. The OIS-x driving unit may include a coil and a magnet.

[0091] In this embodiment, the OIS-x magnet (510) and the OIS-x coil (520) can move the OIS moving part in a first direction perpendicular to the optical axis direction. At this time, the first direction may be the x-axis direction. Due to the interaction between the OIS-x coil (520) and the OIS-x magnet (510), the OIS carrier (310) can move in the x-axis direction perpendicular to the optical axis direction. The OIS-x magnet (510) and the OIS carrier (310) can move together in the x-axis direction.

[0092] The lens drive unit may include an OIS-x magnet (510). The OIS drive unit may include an OIS-x magnet (510). The OIS-x magnet (510) may be an 'OIS-x magnet'. The OIS-x magnet (510) may be a permanent magnet. The OIS-x magnet (510) may be placed in the OIS moving unit. The OIS-x magnet (510) may be spaced apart from the AF magnet (410). The OIS-x magnet (510) may be placed on the OIS carrier (310). The OIS-x magnet (510) may be placed on the outer surface of the OIS carrier (310). The OIS-x magnet (510) may be fixed to the OIS carrier (310). The OIS-x magnet (510) can be coupled to the OIS carrier (310). The OIS-x magnet (510) can be bonded to the OIS carrier (310) with adhesive. The OIS-x magnet (510) can be placed inside the cover (700). The OIS-x magnet (510) can interact with the OIS-x coil (520). The OIS-x magnet (510) can have electromagnetic interaction with the OIS-x coil (520). The OIS-x magnet (510) can be placed at a position corresponding to the OIS-x coil (520). The OIS-x magnet (510) can face the OIS-x coil (520). The OIS-x magnet (510) can be opposite the OIS-x coil (520). The OIS-x magnet (510) can overlap with the OIS-x coil (520) in a direction perpendicular to the optical axis. The OIS-x magnet (510) can overlap with the OIS-x coil (520) in the x-axis direction. The OIS-x magnet (510) can move in the x-axis direction perpendicular to the optical axis.

[0093] The lens driving device may include an OIS-x coil (520). The OIS driving unit may include an OIS-x coil (520). The OIS-x coil (520) may interact with the OIS-x magnet (510). The OIS-x coil (520) may move the OIS-x magnet (510) in the x-axis direction perpendicular to the optical axis. The OIS-x coil (520) may move the OIS-x magnet (510) in the x-axis direction through interaction with the OIS-x magnet (510). The OIS-x coil (520) may face the OIS-x magnet (510). The OIS-x coil (520) may face the OIS-x magnet (510). The OIS-x coil (520) can be positioned at a location corresponding to the OIS-x magnet (510). The OIS-x coil (520) can overlap the OIS-x magnet (510) in a direction perpendicular to the optical axis. The OIS-x coil (520) can be positioned on the AF carrier (210).

[0094] In this embodiment, the OIS-x coil (520) can move together with the AF moving part. The OIS-x coil (520) can move in the optical axis direction together with the AF moving part. During the AF driving process, the OIS-x coil (520) can move in the optical axis direction together with the AF moving part. The OIS-x coil (520) can be placed in the AF moving part. The OIS-x coil (520) can be fixed to the AF moving part. The OIS-x coil (520) can be coupled to the AF moving part.

[0095] The lens driving device may include an OIS-x sensor (530). The OIS driving unit may include an OIS-x sensor (530). The OIS-x sensor (530) may include a Hall sensor. The OIS-x sensor (530) may detect an OIS-x magnet (510). The OIS-x sensor (530) may detect the magnetic force of the OIS-x magnet (510). The OIS-x sensor (530) may be positioned above the OIS-x magnet (510). The OIS-x sensor (530) may overlap with the OIS-x magnet (510) in the direction of the optical axis. As a variation, the OIS-x sensor (530) may be positioned within the OIS-x coil (520). The OIS-x sensor (530) may overlap with the OIS-x coil (520) in the direction of the optical axis. The OIS-x sensor (530) may overlap with the OIS-x coil (520) in a direction perpendicular to the optical axis. The OIS-x sensor (530) may face the OIS-x magnet (510). The OIS-x sensor (530) may be positioned at a location corresponding to the OIS-x magnet (510). The OIS-x sensor (530) may detect the movement of the OIS-x magnet (510). The amount of movement or position of the OIS-x magnet (510) detected by the OIS-x sensor (530) may be used for feedback of the hand shake correction drive in the x-axis direction.

[0096] The lens driving device may include an OIS-x yoke. The OIS-x yoke may be placed on the OIS-x magnet (510). The OIS-x yoke may be placed between the OIS-x magnet (510) and the OIS carrier (310). The OIS-x yoke can prevent magnetic flux leakage of the OIS-x magnet (510) to improve the interaction force with the OIS-x coil (520).

[0097] When viewed from above, the AF magnet (410), AF coil (420), OIS-y magnet (610), and OIS-y coil (620) can be arranged in order along a virtual straight line. When viewed from above, the AF magnet (410), AF coil (420), OIS-y magnet (610), and OIS-y coil (620) can be arranged in order along a virtual straight line. When viewed from above, the AF magnet (410), AF coil (420), OIS-y magnet (610), and OIS-y coil (620) can be arranged in order. When viewed from above, the AF magnet (410), AF coil (420), OIS-y magnet (610), and OIS-y coil (620) can be arranged in order along the y-axis direction. When viewed from above, the AF magnet (410), AF coil (420), OIS-y magnet (610) and OIS-y coil (620) can overlap in the y-axis direction.

[0098] The lens driving device may include an elastic member (140, 150). The elastic member (140, 150) may be formed to support OIS driving. The elastic member (140, 150) may support the movement of the OIS moving part. The elastic member (140, 150) may be formed to press the OIS guide member. The elastic member may be formed to guide both OIS-x axis driving and OIS-y axis driving using only the OIS guide member. The elastic member (140, 150) may include a plate spring. The elastic member (140, 150) may include a wire. The elastic member (140, 150) may have elasticity. The elastic member (140, 150) may be formed of metal.

[0099] The elastic member (140, 150) can press the OIS guide member in the direction of the AF moving part. The elastic member (140, 150) can press the OIS moving part in the direction of the AF moving part. At this time, the elastic member may include an upper elastic member (140), a lower elastic member (150), and a wire.

[0100] Hereinafter, the combined structure of the base (110) and the substrate (120) according to the present embodiment will be described.

[0101] Meanwhile, since the base (110) forms the outer shape of the lens driving device by combining with the cover (700), the base (110) will be referred to as the body (110) in the following description.

[0102] As illustrated in FIGS. 2 to 6, the body (110) may include a bottom plate (190), a side plate (170), and a stepped portion (180).

[0103] An opening (192) is positioned in the center of the lower plate (190), and through the opening (192), an image sensor and a lens can be positioned facing each other in the direction of the optical axis. The lower plate (190) can support the lower surface of the AF moving part.

[0104] The side plate (170) may have a shape that protrudes upward from the upper surface of the bottom plate (190). The side plate (170) includes four side plates, and the four side plates may include a first side plate and a third side plate positioned opposite each other, and a second side plate and a fourth side plate positioned opposite each other. Each of the four side plates may be positioned perpendicularly to an adjacent side plate. The side plate (170) may have a rectangular cross-sectional shape due to the four side plates.

[0105] The side plate (170) may include an outer surface and an inner surface opposite to the outer surface. A substrate (120) may be attached to the outer surface of the side plate (170). The substrate (120) may be positioned to wrap around the outer surface of the side plate (170). The outer surface of the side plate (170) may be surrounded by the substrate (120).

[0106] A portion of the outer surface of the side plate (170) may have a shape that protrudes outwardly in a direction perpendicular to the optical axis direction compared to other regions. For example, the outer surface of the side plate (170) may include a first outer surface (171) positioned in a corner region and a second outer surface (173) positioned between a plurality of corner regions. The first outer surface (171) may be positioned in the corner region of the side plate (170) to connect a plurality of second outer surfaces (173). The first outer surface (171) may protrude outwardly in a direction perpendicular to the optical axis direction compared to the second outer surface (173). The first outer surface (171) and the second outer surface (173) may be positioned in a stepped manner in a direction perpendicular to the optical axis direction. At least a portion of the first outer surface (171) may be formed rounded to connect two of the four side plates. For example, based on a first outer surface (171) positioned in a corner area connecting a first side plate and a second side plate, the first outer surface (171) may each include a first surface positioned on the first side plate, a second surface positioned on the second side plate, and a rounded corner surface connecting the first surface and the second surface.

[0107] The substrate (120) can be positioned to wrap around the outer surface of the side plate (170). The substrate (120) can be bonded to the outer surface of the side plate (170). The substrate (120) can be bonded to the outer surface of the side plate (170) by welding. The substrate (120) can be bonded to the outer surface of the side plate (170) by laser welding. Accordingly, since the adhesive for bonding the substrate (120) and the side plate (170) is omitted, production efficiency can be improved. In addition, compared to the bonding process using adhesive, the bonding process using laser welding has the advantage that the substrate (120) can be more accurately aligned without tolerance in the set area of ​​the body (110).

[0108] A welding area for joining the substrate (120) and the side plate (170) may be placed on the first outer surface (171). Accordingly, the inner surface of the substrate (120) and the second outer surface (173) may be spaced apart in a direction perpendicular to the optical axis direction, at least in part.

[0109] The substrate (120) may include a hole (118). The hole (118) may have a shape that penetrates from the outer surface of the substrate (120) to the inner surface. The hole (118) may be positioned to face the first outer surface (171) of the side plate (170) in a direction perpendicular to the optical axis direction. The hole (118) may have a circular cross-sectional shape, but is not limited thereto and may have various shapes including triangles and squares.

[0110] The camera module (10) may include a bonding member (900). The bonding member (900) may be coupled to a hole (118) of the substrate (120). The bonding member (900) may include a head portion (910) and a bonding portion (920).

[0111] The head portion (910) may be positioned on the outer surface of the substrate (120). The cross-sectional area of ​​the head portion (910) may be larger than the cross-sectional area of ​​the hole (118). When the joining member (900) and the substrate (120) are joined, at least a portion of the inner surface of the head portion (910) may be in contact with the outer surface of the substrate (120). At least a portion of the head portion (910) may be positioned to cover the outer surface of the substrate (120) in a direction perpendicular to the optical axis direction. When the joining portion (920) and the side plate (170) are joined through the welding portion (950) to be described later, the inner surface of the head portion (910) may be in close contact with the outer surface of the substrate (120).

[0112] The connecting portion (920) may have a shape that protrudes inwardly from the head portion (910) in a direction perpendicular to the optical axis. The cross-sectional shape of the connecting portion (920) may be formed to correspond to the cross-sectional shape of the hole (118). The cross-sectional area of ​​the connecting portion (920) may correspond to the cross-sectional area of ​​the hole (118), but alternatively, the cross-sectional area of ​​the connecting portion (920) may be formed smaller than the cross-sectional area of ​​the hole (118), so that a gap of a predetermined distance may be formed between the outer surface of the connecting portion (920) and the inner surface of the hole (118) before the welding process. The connecting portion (920) may come into contact with the outer surface of the side plate (170).

[0113] The inner surface of the joint part (920) and the outer surface of the side plate (170) can each form a bonding interface for bonding the body (110) and the bonding member (900). A laser welding area can each be formed between the inner surface of the joint part (920) and the inner surface of the side plate (170).

[0114] The bonding member (900) may be formed of a transparent material. The bonding member (900) may be formed of a light-transmitting material. Accordingly, a laser for providing a heat source to the bonding interface may be transmitted to the bonding interface by passing through the bonding member (900) from an external region of the bonding member (900). The laser transmitted to the bonding interface heats and melts the inner surface of the bonding part (920) and / or the outer surface of the side plate (170), thereby bonding the bonding member (900) and the body (110) together.

[0115] To increase the transmittance of the laser through the bonding member (900), the light transmittance of the bonding member (900) may be higher than the light transmittance of the substrate (120).

[0116] In the embodiment, the body (110) and the bonding member (900) may each be made of a material with a similar melting point. For example, the material of the body (110) may be plastic. The material of the bonding member (900) may include at least one of resin, plastic, and acrylic.

[0117] Accordingly, by means of a heat source provided from the outside of the bonding member (900), as shown in FIG. 6, a weld (950) can be formed at the bonding interface between the body (110) placed within the hole (118) of the substrate (120) and the bonding member (900), in which the outer surface of the body (110) or the inner surface of the bonding member (900) are fused together. Accordingly, during the process of forming the weld (950), as the inner surface of the head portion (910) of the bonding member (900) is pressed against the outer surface of the substrate (120), the bonding of the substrate (120) to the outer surface of the body (110) through the bonding member (900) can be firmly achieved. The welded portion (950) is positioned between the inner surface of the joint portion (920) and the outer surface of the side plate (170), as well as between the inner surface of the hole (118) of the joint portion (920), so that the joint member (900) and the substrate (120) can be joined together.

[0118] In the embodiment, the formation of the weld (950) is described as being based on the material properties of the body (110) and the joining member (900); however, as a variation, the formation of the weld (950) can also be achieved through a metal layer. In this case, a metal layer may be disposed on the outer surface of the body (110), that is, on the outer surface of the side plate (170) that is joined to the joining member (900). Accordingly, the body (110) and the joining member (900) can be joined through the melting region of the metal layer formed by a laser that has passed through the joining member (900).

[0119] According to the above structure, by implementing a bonding structure between the substrate and the body without adhesive, there is an advantage of improving production efficiency and lowering manufacturing costs.

[0120] In particular, there is an advantage that the joining process can be performed more easily by using a laser welding process through a joining member made of a light-transmitting material.

[0121] Hereinafter, a camera device according to the first embodiment of the present invention will be described with reference to the drawings.

[0122] FIG. 7 is an exploded perspective view of a camera device according to a first embodiment of the present invention.

[0123] The camera device (10A) may include a camera module.

[0124] The camera device (10A) may include a lens module (20) coupled to an OIS carrier (310) of a lens driving device (10), a filter (30) disposed between the lens module (20) and an image sensor (60) to block light of a specific frequency band, a sensor base (40) disposed between the lens driving device (10) and a printed circuit board (50), a printed circuit board (50) on which the image sensor (60) is disposed, a motion sensor (70) mounted on the printed circuit board (50) and outputting rotational angular velocity information due to the movement of the camera device (10A), a control unit (80) that controls the lens driving device (10) to perform an autofocus function and / or a hand shake correction function, and a connector (90) electrically connected to the printed circuit board (50).

[0125] Hereinafter, an optical device according to an embodiment of the present invention will be described with reference to the drawings.

[0126] FIG. 8 is a perspective view of a mobile terminal with a camera module applied according to a first embodiment of the present invention, and FIG. 9 is a perspective view of a mobile terminal with a camera module applied according to another embodiment of the present invention.

[0127] The optical device (1) may include one or more of a mobile phone, mobile phone, portable terminal, mobile terminal, smartphone, smart pad, portable smart device, digital camera, laptop computer, digital broadcasting terminal, PDA (Personal Digital Assistants), PMP (Portable Multimedia Player), and navigation. The optical device (1) may include any device for capturing images or photographs.

[0128] The optical device (1) may include a main body (20). The optical device (1) may include a camera device (10A). The camera device (10A) may be placed on the main body (20). The camera device (10A) may photograph a subject. The optical device (1) may include a display. The display may be placed on the main body (20). The display may output one or more of the images and video captured by the camera device (10A). The display may be placed on a first surface of the main body (20). The camera device (10A) may be placed on one or more of the first surface of the main body (20) and a second surface opposite the first surface.

[0129] Hereinafter, a camera module according to the second embodiment of the present invention will be described.

[0130] FIG. 10 is an exploded perspective view of a substrate, an infrared filter, and an image sensor according to a second embodiment of the present invention, FIG. 11 is a drawing of FIG. 10 from a different angle, FIG. 12 is a cross-sectional view of a camera module according to a second embodiment of the present invention, FIG. 13 is a plan view showing the upper surface of a substrate to which an infrared filter is coupled according to a second embodiment of the present invention, FIG. 14 is a drawing of a first bonding part according to a second embodiment of the present invention, and FIG. 15 is a drawing of a second bonding part according to an embodiment of the present invention.

[0131] Referring to FIGS. 10 to 15, a camera module according to a second embodiment of the present invention may include a substrate (1100), an image sensor (1200), and an infrared blocking filter (1300).

[0132] With respect to the substrate (1100), the infrared blocking filter (1300) and the image sensor (1200) may be arranged facing each other in the direction of the optical axis. For example, the infrared blocking filter (1300) may be placed on the upper surface of the substrate (1100), and the image sensor (1200) may be placed on the lower surface of the substrate (1100).

[0133] The substrate (1100) may be a ceramic substrate comprising at least one ceramic layer. For example, the substrate (1100) may be at least one of high temperature co-fired ceramics (HTCC) and low temperature co-fired ceramics (LTCC).

[0134] As illustrated in FIG. 12, the substrate (1100) may include a plurality of layers arranged in the optical axis direction. The plurality of layers may also be named ceramic layers or insulating layers. For example, the plurality of layers may include a first layer (1101), a second layer (1102) arranged on the first layer (1101), and a third layer (1103) arranged on the second layer (1102). The substrate (1100) may further include a wiring layer arranged on the surface of each of the plurality of layers and via electrodes connecting the wiring layer arranged in the optical axis direction that penetrate each of the plurality of layers.

[0135] A plurality of electronic components (1130) for driving a camera module may be disposed on the surface of the substrate (1100). The electronic components (1130) may be disposed on the upper surface of the substrate (1100). For example, the electronic components (1130) may include a control chipset for controlling the camera module or a plurality of resistors, etc.

[0136] The substrate (1100) may include a hole (1110). The hole (1110) may be positioned in the center of the substrate (1100). The hole (1110) may have a shape that penetrates from the upper surface to the lower surface of the substrate (1100). Light passing through the lens (1500) and the infrared blocking filter (1300) through the hole (1110) may be transmitted to the image sensor (1200). The hole (1110) may penetrate the second layer (1102) and the third layer (1103) simultaneously. The cross-sectional area of ​​the hole (1110) may be smaller than the cross-sectional area of ​​the image sensor (1200) and / or the infrared blocking filter (1300).

[0137] A groove (1120, see FIG. 12) may be disposed on the lower surface of the substrate (1100). The groove (1120) may have a shape in which a portion of the lower surface of the substrate (1100) is concave upward. The groove (1120) may be disposed on the outer side of the hole (1110). At least a portion of the groove (1120) may have a shape that penetrates the lower surface from the upper surface of the first layer (1101). A portion of the lower surface of the second layer (1102) may be exposed downward through the groove (1120).

[0138] The image sensor (1200) can be bonded through a flip-chip process within a groove (1120) disposed on the lower surface of the substrate (1100). The upper surface of the image sensor (1200) can be electrically connected to the lower surface of the second layer (1102) exposed downward through the groove (1120). The camera module may include a third bonding part (1210, see FIG. 12) that electrically connects the image sensor (1200) and the substrate (1100), and the image sensor (1200) can be electrically connected to the substrate (1100) through the third bonding part (1210).

[0139] An infrared blocking filter (1300) can be placed on a substrate (1100). Light incident internally through a lens (1500) can pass through the infrared blocking filter (1300) and be transmitted to an image sensor (1200). The infrared blocking filter (1300) can be placed between the lens (1500) and the image sensor (1200). The infrared blocking filter (1300) can be bonded to the upper surface of the substrate (1100) by a laser welding method. Accordingly, since the infrared blocking filter (1300) and the substrate (1100) can be bonded without adhesive, production efficiency can be improved, and the infrared blocking filter (300) can be more accurately aligned without tolerance in a set area on the substrate (1100).

[0140] As illustrated in FIGS. 13 to 15, the camera module may include a bonding portion (1400) that bonds a substrate (1100) and an infrared blocking filter (1300). The bonding portion (1400) may be positioned between the substrate (1100) and the infrared blocking filter (1300). The bonding portion (1400) may be an area that mutually bonds the substrate (1100) and the infrared blocking filter (1300) by welding.

[0141] A metal layer (1401, see FIG. 14 and 15) for welding with an infrared blocking filter (1300) may be disposed on the substrate (1100). The metal layer (1401) may be a metal region exposed upward from the surface of the substrate (1100). The metal layer (1401) may be a metal pattern disposed on a ceramic layer constituting the substrate (1100). The metal layer (1401) is disposed on the third layer (1103) and may be exposed upward through a protective layer (not shown), such as solder resist, disposed on the third layer (1103). The metal layer (1401) may have a closed-loop cross-section and may be disposed outside the hole (1110) forming area. As an example, the metal layer (1401) may have a rectangular cross-sectional shape. The metal layer (1401) can be arranged to overlap the infrared blocking filter (1300) in the direction of the optical axis. Accordingly, as the laser provided downward on the infrared blocking filter (1300) passes through the infrared blocking filter (1300) and is provided to the metal layer (1401), bonding between the infrared blocking filter (1300) and the substrate (1100) can be achieved by heating and melting the metal layer (1401).

[0142] The bonding portion (1400) may include a first bonding portion (1410) and a second bonding portion (1420). The first bonding portion (1410) and the second bonding portion (1420) can form a closed-loop cross-section by combination between the substrate (1100) and the infrared blocking filter (1300). Accordingly, the inner region of the bonding portion (1400) can be sealed from the outer region through the bonding portion (1400). Therefore, the problem of reduced image quality due to external gas on the optical path placed inside the bonding portion (1400) can be resolved.

[0143] As illustrated in FIG. 14, the first bonding portion (1410) may be an area where an infrared blocking filter (1300), a metal layer (1401), and a ceramic layer within a substrate (1100) are bonded via a laser. In the formation area of ​​the first bonding portion (1410), the metal layer (1401) may have a separated area in a horizontal direction perpendicular to the optical axis direction. The first bonding portion (1410) may be named a hard bonding portion.

[0144] The second bonding portion (1420) is an area in the bonding portion (1400) other than the formation area of ​​the first bonding portion (410), and may be an area where the infrared blocking filter (1300) and the metal layer (1401) are bonded. In the formation area of ​​the second bonding portion (1420), the metal layer (1401) may not be separated in the horizontal direction. In the formation area of ​​the second bonding portion (1420), the metal layer (1401) may be arranged to overlap the ceramic layer of the substrate (1100) and the infrared blocking filter (300) in the optical axis direction. The second bonding portion (1420) may be named a soft bonding portion.

[0145] As described above, a plurality of electronic components (1130) may be disposed on the substrate (1100). The plurality of electronic components (1130) may include a first electronic component (1132) disposed outside the bonding portion (1400) and a second electronic component (1134) disposed inside the bonding portion (1400), based on the bonding portion (1400). The first electronic component (1132) may be disposed so as not to overlap with the infrared blocking filter (1300) in the optical axis direction. The second electronic component (1134) may be disposed so as to overlap with the infrared blocking filter (1300) in the optical axis direction.

[0146] A wiring layer (1136) that electrically connects a first electronic component (1132) and a second electronic component (1134) may be disposed on the substrate (1100). The wiring layer (1136) may be disposed on the upper surface of the substrate (1100). The wiring layer (1136) may be a metal layer patterned on the upper surface of the substrate (1100) to electrically connect the first electronic component (1132) and the second electronic component (1134). The first electronic component (1132) and the second electronic component (1134) are disposed to form the same height on the upper surface of the substrate (1100), and the wiring layer (1136) may be disposed along a horizontal direction to connect the first electronic component (1132) and the second electronic component (1134). However, this is not limited to the first electronic component (1132) being positioned higher than the second electronic component (1134) with respect to the optical axis direction, and in this case, the wiring layer (1136) may include a region that is bent at least once to electrically connect the first electronic component (1132) and the second electronic component (1134).

[0147] At least a portion of the second bonding portion (1420) may be arranged to overlap with the wiring layer (1136). The second bonding portion (1420) may form a portion of the wiring layer (1136). The horizontal length of the second bonding portion (1420) may be equal to the width of the wiring layer (1135). According to an embodiment, in the arrangement area of ​​the wiring layer (1136) for electrical connection, a bonding structure between the infrared blocking filter (1300) and the substrate (1100) is implemented through the second bonding portion (1420), which is a soft bonding portion where the metal layer (1401) is not separated, thereby having the advantage of forming an electrical connection between different electronic components while simultaneously bonding the infrared blocking filter (1300) and the substrate (1100) together. Additionally, in areas other than the wiring layer (1136) where electrical connection is not required, a bonding structure between the infrared blocking filter (1300) and the substrate (1100) is implemented through the first bonding part (1410), which is a hard bonding part, thereby reinforcing the bonding strength of the second bonding part (1420) so that the infrared blocking filter (1300) and the substrate (1100) can be firmly bonded to each other.

[0148] In the bonding section (1400), the length of the first bonding section (1410) may be longer than the length of the second bonding section (1420). Accordingly, the bonding strength between the substrate (1100) and the infrared blocking filter (1300) can be improved through the first bonding section (1410), which has a relatively high bonding strength.

[0149] Meanwhile, a dummy pattern (1138) may be disposed on the substrate (1100). The dummy pattern (1138) may be a ground area that is not electrically connected to the electronic component (1130). The dummy pattern (1138) may overlap with the first bonding portion (1410). At least a portion of the dummy pattern (1138) may form the first bonding portion (1410), and accordingly, the bonding strength between the infrared blocking filter (1300) and the substrate (1100) may be improved, and a ground structure between the substrate (1100) and other components through the dummy pattern (1138) may be realized.

[0150] According to the structure described above, by implementing a bonding structure between the infrared blocking filter and the substrate without adhesive, there is an advantage of improving production efficiency and lowering manufacturing costs.

[0151] In addition, by securing the placement area of ​​the wiring layer through the control of bonding strength by region of the bonding part, there is an advantage of being able to secure a wider space for component placement on the substrate.

[0152] In the foregoing, although all components constituting an embodiment of the present invention have been described as being combined or operating in combination, the present invention is not necessarily limited to such embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined in one or more ways. Furthermore, terms such as "include," "constitute," or "have" described above, unless specifically stated otherwise, mean that the relevant component may be inherent; thus, they should be interpreted as allowing for the inclusion of additional components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains, unless otherwise defined. Terms commonly used, such as those defined in advance, should be interpreted in accordance with their meaning in the context of the relevant technology and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the present invention.

[0153] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

Claims

1. Body; A substrate disposed on the outer surface of the above body and including a hole; and It includes a joining member that is positioned so that at least a portion penetrates the hole and faces the outer surface of the body, and The above-mentioned bonding member is a camera module made of a light-transmitting material.

2. In Paragraph 1, The above-mentioned joining member is, A head portion disposed on the outer surface of the above substrate; and It includes a coupling portion that protrudes from the head portion and is disposed within the hole, and A camera module in which the cross-sectional area of ​​the head portion is larger than the cross-sectional area of ​​the hole.

3. In Paragraph 2, A camera module comprising a welded portion disposed between the inner surface of the joint portion and the outer surface of the body.

4. In Paragraph 3, At least a portion of the above-mentioned weld is a camera module positioned between the inner surface of the hole and the above-mentioned joint.

5. In Paragraph 1, A camera module in which the light transmittance of the above-mentioned bonding member is higher than the light transmittance of the above-mentioned substrate.

6. In Paragraph 1, The material of the above body is plastic, and The material of the above-mentioned bonding member comprises at least one of resin, plastic, and acrylic, for a camera module.

7. In Paragraph 3, The above body includes a plurality of side plates, and The above substrate is positioned to wrap around the outer surface of the above side plate, and The above welded portion is a camera module positioned in the corner area of ​​the body, which is the connection area of ​​the plurality of side plates.

8. In Paragraph 1, A camera module comprising a metal layer disposed on the outer surface of the body and facing the joining member.

9. In Paragraph 1, The above substrate is a camera module that is a flexible printed circuit board (FPCB).

10. In Paragraph 2, The inner surface of the head portion is a camera module in contact with the inner surface of the substrate.

Images