Handler for testing electronic components

Abstract

The present invention relates to a handler for testing electronic components. The handler for testing electronic components, according to the present invention, has a supply / retrieval mechanism, which supplying, to a test table, a support tray that supports a repair pad for repairing test pins of a test board, or retrieves the support tray from the test table. When the present invention is applied, the test pins can be repaired even during operation, and thus reliability of a test can be ensured and the time required for repairing the test pins can be minimized.

Description

electronic component test handler

[0001] The present invention relates to a handler for supporting the testing of an electronic component by electrically connecting the electronic component and a tester.

[0002] An electronic component test handler is equipment that handles electronic components to electrically connect them to a tester.

[0003] As the integration density of electronic components, such as semiconductor devices, continues to increase, the line width of circuits is becoming increasingly narrow. Consequently, greater precision is required when connecting electronic components to testers.

[0004] For example, previously, it was possible to make a proper electrical connection between electronic components and testers with an error range of 20㎛, but now, the reality is that an error range of 10㎛ or less, or even a few㎛, is required.

[0005] Meanwhile, among electronic components, there are dies that are separated into individual units from the wafer state.

[0006] The die can be completed as a final product by undergoing a packaging process or by stacking it for HBM (High Bandwidth Memory) production and then undergoing a packaging process.

[0007] To perform post-die operations, testing of the die is required.

[0008] Electronic components in die form can be tested by electrically connecting contact pads to a tester.

[0009] Since the gaps between the contact pads on the die are fine and the die is very thin, it can easily break or shatter, so automated testing capable of adequately supporting testing of electronic components in the die or HBM state has not been proposed until now. Accordingly, the applicant has proposed Korean Published Patent No. 10-2021-0088373 (hereinafter referred to as the 'prior art').

[0010] The prior art proposes a technique for aligning the positions of electronic components by repositioning them before connecting them to a tester.

[0011] The prior art scans an electronic component on a test table (named a 'chuck' in the prior art) with a camera to determine its current position and readjusts the position of the electronic component to reduce the error range.

[0012] According to the prior art, the precise positioning of electronic components enables automated testing of electronic components at the die level.

[0013] According to the prior art, electronic components loaded on a test table are electrically connected to a tester through a test board.

[0014] The electronic component is electrically connected to the tester by making electrical contact between the terminal (including the contact pad) of the electronic component and the test pin.

[0015] Test boards can vary mechanically, and depending on the mechanical shape of the test pins, scratching may occur when the test pins come into contact with the terminals of electronic components. This scratching phenomenon causes scratch damage to both the electronic component terminals and the test pins.

[0016] Scratch damage is damage caused by foreign matter adhering to the test pin and wear due to frequent use of the test pin.

[0017] Since test pins are made of a more durable material than the terminals of electronic components, foreign matter may be generated as the terminals of the electronic components are scratched, and this foreign matter may adhere to the test pins, causing damage.

[0018] Even if the test pin is made of a robust material with better wear resistance than the terminals of electronic components, damage such as wear may occur to the test pin due to frequent scratching between metal materials.

[0019] If scratch damage occurs on the test pins, it may cause electrical connection failures between the tester and electronic components, or reduce the response speed of the electronic components to test signals, thereby lowering the reliability of the test.

[0020] In particular, in high-speed tests to verify the response speed of electronic components, scratch damage on test pins needs to be continuously removed.

[0021] If the handler is stopped to repair the test pin or operations for testing are suspended, the handler's operating rate decreases accordingly.

[0022] [Prior Art Literature]

[0023] [Patent Literature]

[0024] (Patent Document 1) Republic of Korea Published Patent No. 10-2021-0088373

[0025] There is a need to repair scratch damage on the test pins even during the normal operation of the electronic component test handler.

[0026] A handler for testing electronic components according to the present invention comprises: a transport shuttle having a transport table capable of transporting electronic components by moving while the electronic components are loaded; a first hand that loads electronic components to be tested onto the transport table in a first area by the operation of the transport shuttle, or unloads electronic components that have completed testing and have arrived at the first area by loading them onto the transport table; a second hand that unloads electronic components from the transport table that has been moved from the first area to a second area separated from the first area by the operation of the transport shuttle; a test table on which electronic components to be tested unloaded from the transport table by the second hand are loaded; and a moving mechanism that moves the test table by the second hand between a loading space where electronic components are loaded onto the test table and a test space having a test board for electrically connecting the electronic components to a tester, and electrically connects or disconnects the terminals of the electronic components loaded on the test table and the test pins of the test board. It includes: a supply mechanism for supplying a support tray that supports a repair pad for repairing the test pin to the test table or for retrieving the support tray from the test table; and a controller that controls the transport shuttle, the first hand, the second hand, the moving mechanism, and the supply mechanism.

[0027] The controller can control the second hand, the moving mechanism, and the receiving mechanism so that the support tray is loaded onto the test table after the electronic components are loaded onto the test table.

[0028] The support tray includes a support plate that supports the repair pad; and a support leg whose upper end supports the support plate and whose lower end rests on the test table.

[0029] When the support tray is loaded on the test table, there is a gap between the lower surface of the support plate and the upper surface of the test table.

[0030] The above support leg has a vertical length such that an alignment space is formed within the gap between the lower surface of the support plate and the upper surface of the test table, allowing electronic components to be aligned within the space when the support tray is loaded on the test table.

[0031] The repair pad is integrally fixed to the base plate.

[0032] The above support plate supports the above repair pad in a detachable manner.

[0033] It further includes a vacuum device that provides vacuum pressure for fixing electronic components loaded on the test table; wherein the test table has vacuum holes formed therein where vacuum pressures supplied by the vacuum device act to fix the electronic components by vacuum pressure, and some of the vacuum holes can be used to fix the support tray.

[0034] The support tray comprises a support plate that supports the repair pad; and a support leg whose upper end supports the support plate and whose lower end rests on the test table; wherein the support leg is fixed to the test table by vacuum pressure acting in the vacuum hole.

[0035] A vacuum path is formed in the above support leg to transmit the vacuum pressure acting on the above vacuum hole to the above repair pad, and the above repair pad is fixed to the above base plate by the vacuum pressure coming through the above vacuum path.

[0036] The above supply mechanism includes a tray feeder for supplying the support tray to the test table or retrieving the support tray from the test table; and a pad feeder for supplying the repair pad to the support plate or retrieving the repair pad from the support plate.

[0037] It further includes a camera for photographing the repair pad; and the controller analyzes the image captured by the camera to determine the time for replacing the repair pad.

[0038] It further includes a relocation mechanism that operates to relocate the position of the loaded electronic components when the electronic components to be tested on the test table are loaded by the second hand.

[0039] It further includes a foreign matter remover for removing foreign matter generated as a result of repairing the above test pin.

[0040] The second hand, the test table, and the moving mechanism are each provided in two, and the supply mechanism supplies the support tray to one of the two test tables.

[0041] It further includes a cleaning device for cleaning the upper surface of the above test table.

[0042] According to the present invention, the following effects are achieved.

[0043] First, the reliability of the test is ensured by repairing the test pins during the normal operation of the handler using a test table and support tray for electrical connection between the electronic components and the tester.

[0044] Second, since the idle time of the test table can be utilized to the fullest extent, the time required to repair the test pins can ultimately be minimized.

[0045] FIG. 1 is a conceptual plan view of a handler for testing electronic components according to the present invention.

[0046] FIGS. 2 to 16 are reference diagrams for explaining the electronic component test handler of FIG. 1.

[0047] FIG. 17 is a conceptual plan view of a test handler according to another example of the present invention.

[0048] Preferred embodiments according to the present invention are described by example with reference to the attached drawings, provided that for the sake of brevity, descriptions of well-known or redundant components are omitted or compressed as much as possible.

[0049] Explanation from the Logistics Perspective of Electronic Components

[0050] FIG. 1 is a conceptual plan view of an electronic component test handler (TH, hereinafter abbreviated as 'handler') according to the present invention.

[0051] The handler (TH) according to the present invention may be divided into a moving part (MP), a loading / unloading part (LU), a relocation part (RP), and a connecting part (CP), and includes a transport shuttle (100), a first hand (210), a second hand (220), a test table (300), a vacuum device (400), a relocation mechanism (500), a moving mechanism (600), a foreign matter remover (710), a supply mechanism (720), a cleaning mechanism (730), and a controller (800).

[0052] In the moving section (MF), electronic components can be moved to exchange electronic components between the unloading section (LU) and the relocation section (RP). To this end, a transport shuttle (100) for carrying electronic components is installed in the moving section (MP).

[0053] A transport shuttle (100) is provided to transport electronic components between the unloading section (LU) and the relocation section (RP).

[0054] The transport shuttle (100) has a movable transport table (110).

[0055] The transport shuttle (100) may have at least one transport table (110).

[0056] The transport table (110) can move back and forth in one direction.

[0057] The transport table (110) can move back and forth in the X-axis direction.

[0058] In the case where there are multiple transport tables (100), the multiple transport tables (110) may be provided in parallel in the Y-axis direction. In this case, the multiple transport tables (110) need to be implemented to move back and forth in the X-axis direction independently of each other.

[0059] The transport table (110) can move between the first area (A1) on the unloading side (LU) and the second area (A2) on the relocation side (RP).

[0060] Electronic components can be loaded on the transport table (110).

[0061] The transport table (110) is not a pocket structure having a mounting groove on which an electronic component can be mounted, but a vacuum structure that fixes an electronic component mounted on a flat surface by vacuum pressure.

[0062] As shown in the schematic plan view of FIG. 2, the transport table (110) has vacuum holes (VH) and vacuum grooves (VG) formed therein for vacuum-adsorbing electronic components.

[0063] One vacuum hole (VH) and one vacuum groove (VG) form a pair.

[0064] The vacuum pressure coming through the vacuum hole (VH) acts on the electronic component as it is evenly distributed through the vacuum groove (VG).

[0065] Since the electronic component can be fixed to the transport table (110) by vacuum pressure, no movement of the electronic component occurs during the process of moving in the X-axis direction while being carried on the transport table (110). Therefore, as long as the electronic component is placed precisely on the transport table (110), the tolerance for misalignment of the electronic component, which has been a problem, can be minimized.

[0066] The vacuum holes (VH) and vacuum grooves (VG) can be arranged in a 2x8 matrix form.

[0067] Since the loading capacity of the transport table (110) can be increased or decreased, the number of vacuum holes (VH) and vacuum grooves (VG) can also be increased or decreased.

[0068] According to the present invention, electronic components are supplied to a test table (300) via a transport shuttle (100), and a support tray (10) to be described later is supplied directly to the test table (300) from a supply mechanism (720) without passing through the transport shuttle (100).

[0069] In the unloading section (LU), electronic components are supplied to the handler (TH) or recovered from the handler (TH).

[0070] Electronic components to be tested are supplied to the handler (TH) through the unloading section (LU), and electronic components that have completed testing are recovered from the handler (TH) through the unloading section.

[0071] Electronic components can be loaded onto a Jetec Tray, Ring Frame, or other types of customer tray and supplied to or retrieved from the handler (TH).

[0072] Electronic components to be tested in the unloading section (LU) are loaded onto a transport table (110) in the first area (A1), and electronic components that have completed testing and are loaded onto the transport table (110) in the first area (A1) are unloaded from the transport table (110). To this end, a first hand (210) is provided in the unloading section (LU).

[0073] The first hand (210) is provided to load electronic components onto the transport table (110) or to take them from the transport table (110).

[0074] For unloading operations by the first hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).

[0075] The first hand (210) loads electronic components to be tested onto a transport table (110) in the first area (A1) or unloads electronic components that have been tested from a transport table (110) in the first area (A1).

[0076] The first hand (210) may have one or more pickers capable of gripping or releasing electronic components. The pickers may grip electronic components by vacuum pressure.

[0077] Preferably, four pickers can be installed in pairs on the first hand (210) to improve processing capacity.

[0078] For example, as shown in the schematic diagram of FIG. 3, the first hand (210) may have four pickers (P) arranged in a 2x2 matrix. Of course, depending on the implementation, the number of pickers (P) provided in the first hand (210) may be increased or decreased.

[0079] When the first hand (210) has multiple pickers (P), some of the pickers (P) may be implemented to grip electronic components in a live bug state (a state where the terminal is facing downward) and other pickers (P) may be implemented to grip electronic components in a dead bug state (a state where the terminal is facing upward).

[0080] The first hand (210) may further include a camera (C).

[0081] The first hand (210) is controlled by the controller (800) to grasp an electronic component whose position is accurately calculated from an image captured by the camera (C) before grasping the electronic component from the customer tray.

[0082] The first hand (210) is controlled by the controller (800) so that the center of the electronic component is aligned with the vacuum hole (VH), the position of which is accurately calculated from an image captured by the camera (C) before the electronic component is placed on the transport tray (110).

[0083] The first hand (210) is controlled to load electronic components at a position accurately calculated from an image captured by a camera (C) when moving electronic components from a transport table (110) to a customer tray.

[0084] Therefore, the picker (P) can grasp or load electronic components at a more precise position, and thus enables precise positioning of the electronic components.

[0085] In the relocation section (RP), electronic components (ED) to be tested are unloaded from the transport table (110) and loaded onto the test table (300), and the electronic components loaded onto the test table (300) are relocated. To this end, a relocation space (RS) is formed in the relocation section (RP) for the relocation of electronic components.

[0086] According to the present embodiment, the relocation portion (RP) is positioned on one side of the connection portion (CP) in the X-axis direction.

[0087] The repositioning part (RP) is equipped with a second hand (220).

[0088] The second hand (220) takes an electronic component (ED) to be tested from the transport table (110) or loads an electronic component (ED) that has been tested onto the transport table (110).

[0089] For unloading operations by the second hand (220), the transport table (110) must be moved toward the relocation section (RP) and be in the second area (A2).

[0090] The second hand (220) takes electronic components to be tested from the transport table (110) in the second area (A2) or loads electronic components that have been tested from the transport table (110) in the second area (A2).

[0091] The second hand (220) may be configured in the same way as the first hand (210). Of course, the number of pickers (P) provided in the first hand (210) and the number of pickers (P) provided in the second hand (220) may be different. However, all pickers (P) of the second hand (220) are implemented to grasp electronic components in a deadbug state.

[0092] The second hand (220) loads the electronic components to be tested from the transport table (110) in the second area (A2) onto the test table (300) that has been moved to the relocation section (RP).

[0093] In order for electronic components to be tested by the second hand (220) to be loaded onto the test table (300), the test table (300) must be located in the relocation space (RP). Therefore, the relocation space (RP) can be renamed as a loading space.

[0094] The second hand (220) loads the electronic components that have been tested and are loaded on the test table (300) onto the transport table (110) in the second area (A2).

[0095] The test table (300) is provided to load electronic components (ED) that are unloaded from the transport table (110) by the second hand (220).

[0096] A support tray (10) can also be loaded onto the test table (300).

[0097] As shown in the schematic excerpt of FIG. 4, the test table (300) is rectangular in shape and has a flat top surface.

[0098] The test table (300) may be in the shape of a disc when viewed from a flat surface, and in this case, the top surface is also flat.

[0099] The electronic components are loaded onto the test table (300) in a manner such that they are placed on the flat upper surface of the test table (300).

[0100] The test table (300) can be moved in the X-axis, Y-axis, and Z-axis directions.

[0101] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the axis of rotation.

[0102] Generally, during the process of moving electronic components (ED) to the test table (300), shock or inertia accompanying the movement occurs. Shock or inertia, etc., can disrupt the position of the electronic components loaded on the test table (300). To prevent this, vacuum holes (h) are formed in the area where the electronic components are loaded on the test table (300).

[0103] The vacuum structure of the test table (300) for fixing electronic components may be the same as the vacuum structure of the transport table (110).

[0104] When an electronic component is placed on the test table (300) by the second hand (220), the electronic component can be settled in the position where it was placed by vacuum pressure. In that state, when the second hand (220) releases the grip on the electronic component, the electronic component is fixed in the position where it was settled without shifting.

[0105] The vacuum device (400) provides vacuum pressure to the vacuum holes (h) in the test table (300) through a vacuum circuit (not shown).

[0106] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic components (ED) through the vacuum hole (h), and the electronic components loaded on the test table (300) are fixed in position by the vacuum pressure.

[0107] The vacuum pressure provided by the vacuum device (400) may be used to fix the support tray (10), and furthermore, may also be used to fix the repair pad described later.

[0108] The vacuum holes (h) can be implemented to be selectively opened or closed depending on the control of the vacuum circuit. The electronic components (ED) can be selectively fixed to the test table (300) or removed from the test table (300).

[0109] The electronic components are electrically connected to the tester while loaded on the test table (300).

[0110] The electrical connection between the electronic components loaded on the test table (300) and the tester is made via a test board (20).

[0111] The test board (20) has test pins that are electrically in contact with electronic components.

[0112] The test board (20) is connected to the handler (TH) at the connection part (CP).

[0113] The electronic components loaded on the test table (300) that has been moved to the connection part (CP) and the test pins of the test board (20) are electrically contacted.

[0114] The test board (20) may have any structure as long as it has a configuration that can be electrically connected to electronic components.

[0115] The test board (20) may be a widely known probe card. In this case, it is preferable that the test table (300) be provided in the form of a disc.

[0116] The test board (20) may have a structure having socket modules. Test pins are provided in the socket modules, and the socket modules are installed in the socket body. In this case, to optimize the test capacity relative to the size of the equipment, it is preferable that the test table (300) be provided in the shape of a square plate.

[0117] As shown in the bottom view of FIG. 5, test boards (20) have test zones (TZ) arranged therein, each corresponding to one electronic component.

[0118] The test zones (TZ) correspond one-to-one with the electronic components loaded on the test table (300).

[0119] One test zone (TZ) is equipped with test pins (t) for electrically connecting to one electronic component.

[0120] The test pins (t) in one test zone (TZ) form a set of clusters that form the test zone (TZ) and are electrically connected to the electronic component (ED).

[0121] If the test board (20) is a probe card, a set of test pins is densely arranged in the test area (TZ). Here, the set of test pins corresponds to terminals on an electronic component.

[0122] In the case where the test board (20) has a structure with a socket module, a set of test pins is installed in one socket module (22), and one socket module (22) forms one test zone (TZ). Therefore, replacing one socket module (22) replaces one test zone (TZ).

[0123] The test area (TZ) and the electronic component (ED) must be aligned. If the coordinates of the electronic component (ED) on the test table (300) on the XY plane do not match the coordinates of the test area (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester.

[0124] As shown in the conceptual example of FIG. 6, if an electronic component (ED) on the test table (300) is at an angular position having a rotation angle (Θ1) twisted in the Θ-axis direction with respect to the test zone (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester. Therefore, all test zones (TZ) of the test board (20) and all electronic components (ED) on the test table (300) must be aligned.

[0125] A relocation mechanism (500) is provided to realize alignment between the test zone (TZ) and the electronic component (ED).

[0126] According to the present embodiment, the electronic component (ED) is moved from the transport table (110) to the test table (300) by the second hand (220). During this process, an error in the position of the electronic component (ED) may occur due to an operating error or operating shock of the second hand (220).

[0127] The positions of the electronic components (ED) loaded onto the test table (300) by the second hand (220) on the XY plane or each position may be different, and the electronic components (ED) loaded onto the test table (300) and the test zones (TZ) of the test board (20) may not coincide with each other.

[0128] It does not matter if the error tolerance between the electronic component (ED) and the test zone (TZ) is wide. However, the reality is that the packaged semiconductor device requires a precision of within 30㎛, and in the case of the die or HBM, a precision of within 5㎛ is required.

[0129] In the present invention, when the second hand (220) moves electronic components (ED) from the transport table (110) to the test table (300), the electronic components (ED) are loaded into temporary zones and then relocated from the temporary zones to the fixed zones.

[0130] The temporary area is not a set location, but an arbitrary location where the electronic component (ED) is placed on the test table (300) by the second hand (220).

[0131] The temporary zone is a location that is not set or fixed by the controller (800) but is arbitrarily determined by the second hand (220). For example, when the second hand (220) places an electronic component (ED) on the test table (300), the area where the electronic component (ED) is placed becomes the temporary zone.

[0132] Exaggerated Figure 7 shows an example of a temporary zone (BZ) on a test table (300).

[0133] The fixed position zone refers to the location where the electronic component and the test zone (TZ) coincide. An exaggerated figure 8 shows the relationship between the temporary zone (BZ) and the fixed position zone (RZ) on the test table (300).

[0134] The position zone (RZ) may be pre-set, but it may also be set to match the position and arrangement of the test zones (TZ) on the test board (20) after the electronic components (ED) to be tested are loaded onto the test table (300).

[0135] In Fig. 8, the temporary zone (BZ) has errors in the X-axis, Y-axis, and Θ-axis directions with respect to the fixed zone (RZ).

[0136] A relocation mechanism (500) is provided to precisely relocate the position of an electronic component (ED) loaded on a test table (300) in a relocation space (RS).

[0137] The relocation mechanism (500) is provided to relocate the position of an electronic component (ED) loaded on a test table (300) by the second hand (220) from a temporary zone (BZ) to a fixed zone (RZ).

[0138] According to the present embodiment, the second hand (220) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into a temporary zone (BZ). Then, a relocation mechanism (500) is utilized to move the electronic components (ED) in the temporary zone (BZ) to the designated zone (RZ).

[0139] As shown in the schematic diagram of FIG. 9, the relocation mechanism (500) includes a relocation picker (510) and a relocation camera (520).

[0140] The relocation mechanism (500) has its position fixed.

[0141] The relocation mechanism (500) can be fixedly mounted on the frame forming the skeleton of the handler (TH).

[0142] The repositioning picker (510) can grasp or release the electronic component (ED). The repositioning picker (510) can grasp the electronic component (ED) by vacuum pressure.

[0143] The repositioning picker (510) is fixed in a horizontal position in the X-axis and Y-axis directions.

[0144] The relocation camera (520) is positioned apart from the relocation picker (510).

[0145] A repositioning camera (520) is provided to photograph electronic components (ED).

[0146] As in the example of FIG. 10, the repositioning camera (520) photographs identification marks (M: M1, M2) on the electronic component (ED). The identification marks (M) may be arranged diagonally opposite each other.

[0147] The controller (800) can determine the temporary location (BZ) of the electronic component (ED) by analyzing the location of the identification mark (M) or the positional relationship between the identification marks (M).

[0148] However, the object photographed by the relocation camera (520) to relocate the electronic component (ED) does not need to be limited to the identification mark (M). The object photographed by the relocation camera (520) may be replaced with the corner of the electronic component (ED), the identification pad or identification pattern of the electronic component (ED), etc.

[0149] The relocation picker (510) and the relocation camera (520) are combined into a single module. Therefore, the relative placement positions of the relocation picker (510) and the relocation camera (520) are fixed.

[0150] The moving mechanism (600) can move the test table (300) in the horizontal direction, which is the X-axis and Y-axis direction.

[0151] The moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.

[0152] The moving mechanism (600) can move the test table (300) up and down in the Z-axis direction.

[0153] As shown in the schematic excerpt of FIG. 11, the moving mechanism (600) includes a rotating mechanism (610), an elevator (620), a first moving mechanism (640), and a second moving mechanism (660).

[0154] The rotator (610) rotates the test table (300) in the Θ-axis direction.

[0155] The angular position of the electronic component (ED) can be adjusted by rotating the test table (300) by means of the rotating device (610).

[0156] The elevator (620) raises the test table (300).

[0157] The test table (300) is connected to the elevator (620) via a rotating mechanism (610).

[0158] When the test table (300) is raised by the elevator (620), the electronic components (ED) of the test table (300) come into contact with the test pins (t), thereby electrically connecting the electronic components (ED) to the tester. When the test table (300) is lowered by the elevator (620), the contact between the electronic components (ED) and the test pins (t) is released, and the test table (300) becomes capable of moving in a horizontal direction.

[0159] The first moving device (640) moves the test table (300) in the X-axis direction.

[0160] By moving the test table (300) in the X-axis direction by the first moving device (640), the test table (300) can be selectively positioned in the relocation space (RS) and the test space (TS). Here, the test space (TS) is a space formed in the connection part (CP), and when the test table (300) is in the test space (TS), an electrical connection is made between the electronic component (ED) and the tester by raising the test table (300).

[0161] Furthermore, the first moving device (640) can move the test table (300) beyond the relocation space (RS) to the area where the supplying device (720) is located, so that the supplying device (720) supplies the support tray (10) to the test table (300) or the supplying device (720) retrieves the support tray (10) from the test table (300). However, if the supplying device (720) is implemented to bring the support tray (10) into the relocation space (RS) or to take the support tray (10) out of the relocation space (RS), it is not necessary for the first moving device (640) to be implemented to move the test table (300) beyond the relocation space (RS). Here, the support tray (10) is a tool used to repair the test pin (t).

[0162] The second mover (660) moves the test table (300) in the Y-axis direction.

[0163] The above-mentioned moving mechanism (600) has four functions.

[0164] The first function is to move the test table (300) between the relocation space (RS) and the test space (TS).

[0165] The second function is to electrically connect or disconnect electronic components (ED) to the tester.

[0166] The third function is for the relocation of electronic components (ED) in the relocation space (RS).

[0167] The fourth function is a function for repairing the test pin (t) in the test space (TS). Depending on how it is controlled, all movement of the test table (300) by the moving mechanism (600) can contribute to removing foreign matter from the test pin (t) or polishing the test pin (t).

[0168] Since the repositioning picker (510) is fixed, the test table (300) moves in the horizontal X-axis and Y-axis directions or rotates in the Θ-axis direction to adjust the position of the electronic component (ED) on the horizontal plane.

[0169] Depending on the implementation, the test table (300) is raised and lowered during the relocation process of the electronic component (ED), thereby enabling the relocation picker (510) to grasp or release the electronic component (ED).

[0170] Here, the operation during the relocation of electronic components (ED) is explained.

[0171] As shown in Fig. 8, the temporary zone (BZ) of the electronic component (ED) may differ from the fixed zone (RZ) in the X-axis, Y-axis, and Θ-axis directions.

[0172] The relocation camera (520) photographs the electronic component (ED) on the test table (300) and identifies the temporary zone (BZ) through the location of the identification mark (M).

[0173] When the temporary zone (BZ) is identified, the first mover (640) and the second mover (660) operate to position the center of the temporary zone (BZ) below the relocation picker (510), and the elevator (620) operates to raise the test table (300).

[0174] When the repositioning picker (510) adsorbs and grips the electronic component (ED) of the raised test table (300) by vacuum pressure, the elevator (620) operates to lower the test table (300). Afterward, the first moving device (640) and the second moving device (660) operate to align the center of the positioning zone (RZ) with the center of the electronic component (ED) gripped by the repositioning picker (510), and the rotating device (610) operates to align the electronic component (ED) with the positioning zone (RZ). In this state, the elevator (620) operates to raise the test table (300), thereby allowing the electronic component (ED) held by the repositioning picker (510) to settle in the positioning zone (RZ).

[0175] When the electronic component (ED) is secured to the test table (300) by vacuum pressure applied through the vacuum hole (h) while the electronic component (ED) is seated in the positioning zone (RZ), the repositioning picker (510) releases the grip of the electronic component (ED). Then, the test table (300) lowers and begins repositioning the next electronic component (ED).

[0176] For reference, if precise control of the operation of the second hand (220) is possible, the second hand (220) may be equipped with a camera, and the relocation mechanism (500) may be omitted. In this case, the relocation of the electronic component (ED) can be achieved by utilizing the second hand (220).

[0177] Furthermore, the second hand (220) may be implemented to move the electronic component (ED) directly to the positioning zone (RZ) when moving it from the transport table (110) to the test table (300).

[0178] The foreign substance remover (710) removes foreign substances in at least one of the relocation space (RS) or the test space (TS).

[0179] The foreign matter remover (710) may be equipped with a blower and a suction device in pairs.

[0180] The foreign substance remover (710) may be controlled by a controller (800) to operate at the time when foreign substances occur.

[0181] The supply mechanism (720) supplies the support tray (10) to the test table (300) or retrieves the support tray (10) from the test table (300).

[0182] The support tray (10) is a tool for supporting a repair pad for repairing a test pin (t).

[0183] A cleaning device (730) is provided to clean the upper surface of the test table (300).

[0184] The cleaning device (730) includes a cleaning nozzle (731).

[0185] The cleaning nozzle (730) cleans foreign matter on the upper surface of the test table (300).

[0186] It is preferable that the cleaning nozzle (731) be a vacuum nozzle that sucks up foreign matter by vacuum pressure rather than blowing air.

[0187] In the method of blowing air, foreign substances on the upper surface of the test table (300) are removed from the test table (300) by the air, but may remain in the space. There is a possibility that the foreign substances in the space may contaminate the upper surface of the test table (300) again.

[0188] The cleaning nozzle (731) can be installed on the second hand (220) to move together with the picker (P) of the second hand (220).

[0189] At least one cleaning nozzle (731) may be installed on the second hand (220).

[0190] The cleaning device (730) may include a vacuum device that provides vacuum pressure to the cleaning nozzle (731). However, it may be implemented to use the vacuum pressure of a vacuum line provided in the factory, and in this case, the cleaning device (730) of the handler (TH) is sufficient to have an opening / closing valve that opens and closes the vacuum line and the cleaning nozzle (731) instead of a vacuum device.

[0191] The controller (800) controls the components necessary for the proper operation of the handler (TH), such as the transport shuttle (100), the first hand (210), the second hand (220), the vacuum device (400), the relocation mechanism (500), the moving mechanism (600), the foreign matter remover (710), the supply mechanism (720), and the cleaning mechanism (730).

[0192] In particular, the controller (800) can control the second hand (220), the moving mechanism (600), and the receiving mechanism (720) so that the electronic component (ED) is loaded onto the test table (300) and the support tray (10) is loaded onto the test table (300).

[0193] Next, the method of operation of the handler (TH) according to the present invention will be described from the perspective of testing electronic components (ED).

[0194] In the unloading section (LU), the first hand (210) loads electronic components (ED) to be tested onto a transport table (110) in the first area (A1).

[0195] When all the electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates and moves the transport table (110) to the second area (A2).

[0196] The second hand (220) unloads electronic components (ED) from the transport table (110) in the second area (A2) and moves them to the test table (300) in the relocation area (RS). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second hand (220) are temporary zones (BZ).

[0197] When all the electronic components (ED) to be tested are loaded onto the test table (300) as required, the controller (800) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from the temporary zones (BZ) to the fixed zones (RZ).

[0198] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the test space (TS). Afterwards, the moving mechanism (600) operates to raise the test table (300) toward the test board (20) so that the electronic components (ED) are electrically connected to the tester.

[0199] When the testing of the electronic components (ED) is finished, the test table (300) is moved to the relocation section (RP) by the moving mechanism (600). Then, the second hand (220) moves the electronic components (ED) that have completed testing to the transport tray (110) in the second area (A2), and the transport tray (110) filled with the electronic components (ED) that have completed testing moves to the first area (A1). Subsequently, the first hand (210) unloads the electronic components (ED) that have completed testing from the transport table (110) and loads them onto an empty customer tray.

[0200] Based on the basic operation method described above, the electronic component (ED) is supplied to the tester for testing, and is retrieved after the test is completed.

[0201] <Explanation of the application of the support tray>

[0202] 1. Structure of the support tray

[0203] The support tray (10) is used to repair the test pins (t) on the test board (20).

[0204] FIG. 12 shows an example of a support tray (10).

[0205] The support tray (10) supports a repair pad (rp) for repairing the test pin (t).

[0206] The repair pad (rp) may be in a form with adhesive applied. The adhesive can remove foreign matter stuck to the test pin (t).

[0207] The repair pad (rp) may be in a form with an abrasive applied. The abrasive can grind the test pin (t) to sharpen the contact point or grind away scratches to smooth the surface.

[0208] The support tray (10) includes a support plate (11) and support legs (12).

[0209] The base plate (11) supports the repair pad (rp).

[0210] The flat shape of the base plate (11) may be the same as the flat shape of the test board (20) and the repair pad (rp).

[0211] The flat shape of the base plate (11) can be circular or square.

[0212] The support leg (12) supports the base plate (11).

[0213] The upper part of the support leg (12) supports the base plate (11), and the lower part rests on the test table (300).

[0214] The support leg (12) separates the lower surface of the support plate (11) from the upper surface of the test table (300) when the support tray (10) is loaded on the test table (300), thereby forming a gap (G) between the support plate (11) and the test table (300) as shown in FIG. 13.

[0215] An alignment space (AS) is formed between the base plate (11) and the test table (300), which are separated by the support legs (12), so that an electronic component (ED) can be positioned in alignment. The support legs (12) have an vertical length that forms the alignment space (AS) where the electronic component can be aligned. Therefore, it is possible for the base tray (10) and the electronic component (ED) to be loaded together on the test table (300).

[0216] The controller (800) can control the second hand (220), the moving mechanism (600), and the receiving mechanism (720) so that the electronic components (ED) are loaded onto the test table (300) and the support tray (10) is loaded onto the test table (300).

[0217] The vacuum pressure acting on the vacuum hole (h) of the test table (300) is also used to fix the support tray (10).

[0218] With the support tray (10) and electronic components (ED) loaded together on the test table (300), some of the vacuum holes (h) are used to secure the support tray (10).

[0219] According to the present invention, the vacuum pressure acting in the vacuum hole (h) fixes the support tray (10) to the test table (300) by fixing the support leg (112). To this end, it is preferable that the bottom surface of the support leg (112) has a wide and flat shape.

[0220] The support tray (10) according to the example of FIG. 12 has a structure in which a square plate-shaped support plate (11) is supported by a plurality of support legs (12). However, considering the shape of the test board (20) or the stable support strength of the support legs (12), it may have various structures as shown in FIG. 14.

[0221] Figure 14 (a) shows that the support leg (12) takes the shape of a square tube.

[0222] The support tray (10) of Fig. 14 (b) and (c) has a disc-shaped support plate (11).

[0223] According to the present invention, repair of the test pin (t) may be possible whenever the electronic component (ED) and the test board (20) come into contact.

[0224] Repair of the test pin (t) is performed when the test table (300) is positioned in the test space (TS) and the repair pad (rp) is attached to the base plate (11).

[0225] The controller (800) controls the moving mechanism (600) to move the test table (300) loaded with the support tray (10) at least once, thereby causing the test pin (t) to be repaired (adherence of foreign matter or polishing of the test pin) by the repair pad (rp).

[0226] Foreign matter may occur depending on the repair work of the test pin (t).

[0227] When the repair work on the test pin (t) is completed, the controller (800) operates the foreign matter remover (710) to remove the generated foreign matter.

[0228] 2. Combined structure of the support tray and repair pad

[0229] Even if there is inertia due to the movement of the test table (300) or operational shock of the equipment, the repair pad (rp) must be fixedly attached to the support tray (10) in that position.

[0230] According to a preferred first example, the repair pad (rp) is integrally fixed to the base plate (11). For example, the repair pad (rp) can be fixed to the base plate (11) by a strong adhesive.

[0231] In the case of the first example, the repair pad (rp) is loaded onto the test table (300) together with the support tray (10) by simply loading it onto the test table (300).

[0232] The second example considers the replaceability of the repair pad (RP).

[0233] According to the second example, the repair pad (rp) is detachably supported on the base plate (11).

[0234] One preferred example among the second examples is that the repair pad (rp) may be fixed to the base plate (11) by vacuum pressure supplied from the vacuum device (400). To this end, as shown in FIG. 15, a vacuum path (vw) is formed in the base plate (11) and the support leg (12) of the support tray (10) to transmit vacuum pressure acting through the vacuum hole (h) of the test table (300) to the repair pad (rp). Thus, the repair pad (rp) is fixed to the base plate (11) by vacuum pressure supplied from the vacuum device (400) and acting through the vacuum hole (h) and the vacuum path (vw).

[0235] When the second example is applied, there is an advantage in that the support tray (10) can be recycled because only the repair pad (rp) needs to be replaced when the repair pad (rp) needs to be replaced.

[0236] However, for the second example, a handler (TH) such as Fig. 16 may be required.

[0237] The handler (TH) of FIG. 16 includes a supply mechanism (720) comprising a tray supply device (721) and a pad supply device (722).

[0238] The tray supply device (721) supplies the support tray (10) to the test table (300) or retrieves the support tray (10) from the test table (300).

[0239] The pad supply device (722) supplies a repair pad (rp) to the base plate (11) or retrieves a repair pad (rp) from the base plate (11).

[0240] The first or second example may be applied selectively by comprehensively considering the specifications, test conditions, test time, etc. of the handler (TH).

[0241] Repair pads (RP) can be used repeatedly, but they need to be replaced before their function is lost.

[0242] There are various examples regarding checking the replacement timing of repair pads (RP).

[0243] For example, it can be implemented to replace the repair pad (rp) when used a set number of times.

[0244] For example, the controller (800) can determine the replacement time of the repair pad (rp) by analyzing the condition of the repair pad (rp) through an image of the repair pad (rp) captured by a camera. Here, the condition of the repair pad (rp) analyzed by the controller (800) may include the height of the repair pad (rp), the distribution area of ​​foreign substances attached to the repair pad (rp), the surface shape of the repair pad (rp), etc. It is preferable that the camera for this purpose be installed in the supply mechanism (720).

[0245] 3. 2 test tables

[0246] As shown in FIG. 17, two test tables (300) may be provided in the handler (TH).

[0247] According to the example of FIG. 17, a pair of repositioning parts (RP) are provided with the connecting part (CP) in between, and two second hands (220) and moving mechanisms (600) are also provided.

[0248] In the example of FIG. 17, it is not necessary to implement the support tray (10) so that it is loaded onto both test tables (300).

[0249] The support tray (10) can be implemented so that it is loaded only on the test table (300) adjacent to the storage device (720).

[0250] 4. Description of characteristic movements

[0251] According to the present invention, while the second hand (220) has loaded electronic components to be tested onto the test table (300), the receiving mechanism (720) loads the support tray (10) onto the test table (300).

[0252] The controller (800) first loads the electronic components (ED) to be tested onto the test table (300) and then controls the second hand (220), the moving mechanism (600), and the repositioning mechanism (500) to reposition the electronic components (ED). In this process, the controller (800) controls the electronic components (ED) not to be loaded into the area where the support legs (12) of the support tray (10) are located (hereinafter referred to as the 'leg position area').

[0253] Once the electronic components (ED) are loaded in the remaining area excluding the leg position area, the controller (800) controls the moving mechanism (600) and the receiving mechanism (720) to load the support tray (10) onto the test table (300).

[0254] When the support tray (10) is loaded onto the test table (300), the controller (800) controls the moving mechanism (600) to move the test table (300) to the test space (TS), and then repairs the test pin (t) by moving the test table (300) up, down, rotate, or horizontally at least once.

[0255] When the repair of the test pin (t) is completed, the controller (800) controls the moving mechanism (600) and the receiving mechanism (720) to move the support tray (10) from the test table (300).

[0256] When the support tray (10) is removed from the test table (300), the controller (800) controls the second hand (220), the moving mechanism (600), and the relocation mechanism (500) to additionally load electronic components (ED) to be tested in the leg position area and then relocate the additionally loaded electronic components (ED).

[0257] When the electronic components (ED) to be tested are loaded in the leg position area and the relocation is completed, the controller (800) controls the moving mechanism (600) to electrically connect the electronic components (ED) to the tester.

[0258] Afterwards, the electronic components (ED) for which testing has been completed are moved from the test table (300) to the unloading section (LU) via the transport table (110), and the electronic components (ED) to be newly tested are loaded from the unloading section (LU) to the test table (300) via the transport table (110).

[0259] Repairs to the test pin (t) may be performed at every test, or periodically whenever a set number of tests are performed.

[0260] Meanwhile, depending on the implementation, the process of additionally loading electronic components (ED) into the bridge location area may be omitted, or a separate bridge location area may be formed in an area other than the area where electronic components (ED) are loaded.

[0261] In particular, when the test table (300) is provided in pairs, the electronic components (ED) and the support tray (10) are loaded onto the other test table (300) while the test table (300) is being provided for testing, so that preparations can be made in advance for testing the electronic components (ED) and repairing the test pins (t), thereby minimizing the idle time of the test table (300) and allowing repairs to be performed on the test pins (t) whenever necessary.

[0262] The embodiments described above are merely preferred examples of the present invention and may have various applications. Therefore, the present invention should not be understood as being limited only to the contents described above. Instead, the scope of the present invention should be understood as the separately described claims and their equivalents.

Claims

1. A transport shuttle having a transport table capable of transporting electronic components by moving while the electronic components are loaded; A first hand that loads electronic components to be tested onto the transport table in the first area by the operation of the above transport shuttle, or unloads electronic components that have completed testing and have arrived at the first area by being loaded onto the said transport table; A second hand that retrieves electronic components from a transport table moved from the first area to a second area separated from the first area by the operation of the transport shuttle; A test table on which electronic components to be tested are loaded, which are unloaded from the transport table by the second hand; A moving mechanism that moves the above test table by the second hand between a loading space where electronic components are loaded on the test table and a test space containing a test board for electrically connecting the electronic components to a tester, and electrically connects or disconnects the terminals of the electronic components loaded on the test table and the test pins of the test board; A receiving mechanism for supplying a support tray that supports a repair pad for repairing the test pin to the test table or for retrieving the support tray from the test table; and A controller controlling the above transport shuttle, the above first hand, the above second hand, the above moving mechanism, and the above receiving mechanism; comprising Handler for testing electronic components.

2. In Paragraph 1, The controller can control the second hand, the moving mechanism, and the receiving mechanism so that the support tray is loaded onto the test table after loading electronic components onto the test table. Handler for testing electronic components.

3. In Paragraph 2, The above support tray is A support plate supporting the above repair pad; and A support leg comprising: an upper portion that supports the base plate, and a lower portion that rests on the test table. Handler for testing electronic components.

4. In Paragraph 3, With the support tray loaded on the test table, there is a gap between the lower surface of the support plate and the upper surface of the test table. Handler for testing electronic components.

5. In Paragraph 4, The support leg has a vertical length such that an alignment space is formed within the gap between the lower surface of the support plate and the upper surface of the test table, allowing electronic components to be aligned and positioned within the gap when the support tray is loaded on the test table. Handler for testing electronic components.

6. In Paragraph 5, The repair pad is integrally fixed to the above base plate. Handler for testing electronic components.

7. In Paragraph 5, The above support plate detachably supports the above repair pad. Handler for testing electronic components.

8. In Paragraph 1, It further includes a vacuum device that provides vacuum pressure for fixing electronic components loaded on the test table above, and The above test table has vacuum holes formed therein where vacuum pressures supplied from the vacuum device act to fix electronic components by vacuum pressure, and Some of the above vacuum holes can be used to secure the support tray. Handler for testing electronic components.

9. In Paragraph 8, The above support tray is A support plate supporting the above repair pad; and The upper end supports the base plate, and the lower end includes a support leg that rests on the test table; The above support legs are fixed to the test table by the vacuum pressure acting in the vacuum hole. Handler for testing electronic components.

10. In Paragraph 9, The above support plate detachably supports the above repair pad. Handler for testing electronic components.

11. In Paragraph 10, A vacuum path is formed in the above support leg to transmit the vacuum pressure acting on the above vacuum hole to the above repair pad, and The above repair pad is fixed to the base plate by vacuum pressure coming through the above vacuum furnace. Handler for testing electronic components.

12. In Paragraph 10, The above supply and demand organization is A tray feeder for supplying the support tray to the test table or retrieving the support tray from the test table; and A pad feeder for supplying the repair pad to the base plate or retrieving the repair pad from the base plate; Handler for testing electronic components.

13. In Paragraph 1, A camera for photographing the above repair pad; further comprising, The above controller analyzes the image captured by the camera to determine the time for replacing the repair pad. Handler for testing electronic components.

14. In Paragraph 1, A relocation mechanism that operates to relocate the positions of loaded electronic components when electronic components to be tested are loaded onto the test table by the second hand; further comprising Handler for testing electronic components.

15. In Paragraph 1, A foreign matter remover for removing foreign matter generated as a result of repairing the above test pin; further comprising Handler for testing electronic components.

16. In Paragraph 1, The above-mentioned second hand, the above-mentioned test table, and the above-mentioned moving mechanism are each provided in two units, and The above supply mechanism supplies the support tray to one of the two test tables. Handler for testing electronic components.

17. In Paragraph 1, A cleaning device for cleaning the upper surface of the above test table; further comprising Handler for testing electronic components.

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