A circuit board rapid detection device
The modularly designed rapid circuit board testing device solves the problem of high testing costs for small batches of circuit boards, and achieves a flexible and efficient testing process and equipment convenience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- AUTOBIO LABTEC INSTR CO LTD
- Filing Date
- 2025-07-08
- Publication Date
- 2026-06-12
AI Technical Summary
Existing circuit board testing fixtures require the design and manufacture of molds for each circuit board, resulting in high costs and making them unsuitable for testing needs in small-batch production.
The modularly designed circuit board rapid testing device includes a base frame, a test module, a pressure module, and an electrical integration module. Electrical connections are achieved through detachable test modules and flexible telescopic components, and the test data is acquired and processed in conjunction with the electrical integration module.
It improves the flexibility and efficiency of testing, reduces mold replacement costs, simplifies the testing process, and enhances the convenience and space utilization of the equipment.
Smart Images
Figure CN224354538U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board testing technology, and in particular to a rapid circuit board testing device. Background Technology
[0002] In the electronics manufacturing industry, the testing of PCBs (Printed Circuit Boards) is crucial, directly impacting the quality and reliability of the final electronic products. Typically, the industry employs specialized PCB testing fixtures to perform this task. These fixtures possess the capability to quickly and accurately inspect PCBs, effectively screening for various defects and problems, thereby significantly improving the overall quality of the PCBs and reducing the risk of electronic product malfunctions due to PCB failures.
[0003] Currently, most common circuit board testing fixtures on the market use a one-to-one mold for testing. This means that a dedicated mold needs to be made for each specific model or specification of PCB circuit board. While this one-to-one testing method ensures testing accuracy, it also brings significant drawbacks. Because a mold needs to be designed and manufactured individually for each circuit board, the entire mold-making process is not only time-consuming but also requires a significant investment of manpower, resources, and capital, resulting in high mold-making costs. Due to these characteristics, this one-to-one mold-based circuit board testing fixture is generally more suitable for high-volume circuit board testing scenarios. In mass production, the mold-making cost can be distributed across a large number of circuit board products, thereby reducing the unit product testing cost and making this testing method economically feasible.
[0004] However, in actual testing work, the situation is often not so ideal. We frequently encounter the need to test small batches of multi-module PCB circuit boards. In this case, the PCB circuit boards of different modules may have significant differences in design, function, and layout, resulting in a large number of testing points that are complexly distributed and involve cumbersome testing procedures. Since each type of PCB circuit board has its unique testing requirements, if we continue to use the traditional method of making separate test fixtures for each type of circuit board, the cost of manufacturing circuit board test fixtures will become extremely high. Moreover, due to the small-batch production, the frequency of use of the testing fixtures is relatively low. After a set of fixtures is made, it may only be used to test a small number of circuit board products, which makes it impossible to effectively distribute the cost of the fixtures. From a cost-effectiveness perspective, this approach is clearly not worthwhile. Utility Model Content
[0005] In view of this, the purpose of this utility model is to overcome the shortcomings of related technologies, and this utility model provides a rapid circuit board testing device.
[0006] This utility model provides the following technical solution:
[0007] A rapid circuit board testing device includes a base frame, a testing module, a pressure-down module, and an electrical integration module.
[0008] The base frame is provided with a mounting part; the test module is detachably mounted on the mounting part, and the test module includes a positioning plate for placing the corresponding test board; the pressing module is mounted on the base frame, and the pressing module includes a pressing plate located above the positioning plate, with a pressing part on the lower end face of the pressing plate; the electrical integration module is mounted on the base frame and is electrically connected to the test module; specifically, the electrical integration module, as the core control unit of the entire testing device, is responsible for coordinating the operation of various components, collecting test data, and communicating with external devices; the pressing module, by driving the pressing plate to move closer to the positioning plate, can drive the pressing part to push each test point of the test board closer to the test module and establish an electrical connection.
[0009] As a further improvement to the above technical solution, the test module further includes a module substrate and a tooling circuit board. The module substrate and the tooling circuit board are fixedly connected by connectors. The positioning plate is connected to the end face of the module substrate facing away from the tooling circuit board by an elastic telescopic member. The end face of the module substrate near the positioning plate is provided with multiple connection probes corresponding to the positions of various test points on the board under test. The connection probes are electrically connected to the circuits on the tooling circuit board. Specifically, the connection probes are elastic probes. The tooling circuit board is electrically connected to the electrical integration module.
[0010] As a further improvement to the above technical solution, the elastic telescopic component is provided in multiple ways, specifically including a telescopic rod and an elastic component, wherein the telescopic rod and the elastic component are both disposed between the positioning plate and the module base plate.
[0011] As a further improvement to the above technical solution, the mounting part includes a mounting cavity, the mounting cavity having openings on its side and top, a cover being provided on the side opening of the mounting cavity, the lower end of the cover being hinged to the opening from the side, and the upper end of the cover being assembled and connected to the module substrate or base frame via a connector; a first slide rail is provided on the inner side wall of the mounting cavity, and a first slide groove corresponding to the first slide rail is provided on the side of the module substrate, the first slide rail and the first slide groove slidingly engaging relative to each other.
[0012] As a further improvement to the above technical solution, the module substrate is provided with a first wiring portion, which is electrically connected to the tooling circuit board; the electrical integration module includes a second wiring portion corresponding to the first wiring portion; when the positioning plate slides into the mounting cavity, it can drive the first wiring portion to approach the second wiring portion and perform docking connection.
[0013] As a further improvement to the above technical solution, the pressing module also includes a pressing bracket and a push-pull linkage. The push-pull linkage is disposed between the pressing bracket and the base frame. The pressing plate is detachably mounted on the pressing bracket. By pushing and pulling the push-pull linkage, the pressing bracket can be driven to move the pressing plate in the vertical direction.
[0014] As a further improvement to the above technical solution, a second sliding groove is horizontally provided on the lower pressure bracket, and a second sliding rail corresponding to the second sliding groove is provided on the side of the lower pressure plate. The second sliding rail and the second sliding groove are slidably engaged. A limiting member is provided in the second sliding groove to limit the relative position of the second sliding rail and the second sliding groove.
[0015] As a further improvement to the above technical solution, the limiting component is specifically a limiting bead. The end face of the second slide groove near the second slide rail is provided with a movable groove. The limiting bead is disposed in the movable groove. An elastic element is provided between the limiting bead and the movable groove. The second slide rail is provided with a limiting groove corresponding to the limiting bead. Under the elastic force of the elastic element, the limiting post partially falls into the limiting groove, thereby limiting the relative position between the lower pressure bracket and the lower pressure plate.
[0016] As a further improvement to the above technical solution, a guide rod is vertically inserted through the lower pressure bracket, and the guide rod is fixedly mounted on the base frame.
[0017] As a further improvement to the above technical solution, the end of the pressure plate near the positioning plate is provided with a push column corresponding to the plate to be tested, and the push column is used to form a pressure part.
[0018] As a further improvement to the above technical solution, the base frame is provided with multiple indicator lights, which are electrically connected to the electrical integration module.
[0019] As a further improvement to the above technical solution, a display module is provided on the base frame, and the display module is electrically connected to the electrical integration module.
[0020] As a further improvement to the above technical solution, the positioning plate is provided with positioning pins corresponding to the mounting holes on the test plate. Multiple positioning pins are provided to limit the relative position of the test plate and the positioning plate.
[0021] Compared with related technologies, the beneficial effects of this utility model are:
[0022] The circuit board rapid testing device provided by this utility model allows operators to select a matching test module based on the testing requirements of a specific model or specification of circuit board during actual testing. This test module is custom-designed for the specific structure and test points of the circuit board, ensuring both accuracy and comprehensiveness of the testing.
[0023] Subsequently, the operator needs to install the selected test module on the mounting part of the base frame of this utility model. During the installation process, the test module is electrically connected to the electrical integration module on the base frame.
[0024] After completing the installation and electrical connection of the test module, the operator needs to connect the electrical integration module to a stable power supply system via a dedicated power interface to provide the necessary power support for the entire testing device. Once the power connection is confirmed to be correct and all parts of the device are in normal working order, the operator can then place the circuit board under test stably onto the positioning plate on the test module.
[0025] Next, the operator activates the pressure module on the testing device. The pressure module is connected to the pressure plate via a mechanical transmission mechanism. Once activated, the pressure module drives the pressure plate to move smoothly vertically towards the positioning plate. As the pressure plate approaches, its pressure section contacts the circuit board under test and applies appropriate pressure, ensuring a tight and stable electrical connection between each test point on the circuit board and its corresponding contact on the testing module.
[0026] Once the circuit board under test (PCB) is electrically connected to the test module, the electrical integration module will immediately initiate the testing program to perform power-on tests on various circuits of the PCB and read the power-on data of each circuit in real time. This data includes, but is not limited to, key parameters such as voltage, current, and resistance values, which comprehensively reflect the electrical performance of the PCB. The read data will be presented to the operator visually through other feedback components on the electrical integration module. The operator can observe and judge the displayed data according to preset pass / fail standards, thereby quickly determining whether the PCB is qualified.
[0027] Furthermore, the rapid circuit board testing device provided by this invention also possesses high flexibility and scalability. When different models or specifications of circuit boards need to be tested, operators only need to replace the corresponding test module according to the new circuit board. This design greatly simplifies the testing process, improves testing efficiency, and also reduces the cost and time investment required to redesign and manufacture the entire testing fixture due to the need to replace the circuit board. Moreover, because the testing module adopts a modular design, it is small in size and compact in structure, making it easy to store when not in use, further improving the ease of use and space utilization of the equipment.
[0028] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0029] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0030] Figure 1 This is a schematic diagram of the circuit board rapid testing device in one embodiment of the present invention.
[0031] Figure 2 This invention provides a schematic diagram of the circuit board rapid testing device from another perspective in one embodiment of the present invention.
[0032] Figure 3 This is a schematic diagram of a partial structure of a circuit board rapid testing device according to one embodiment of the present invention;
[0033] Figure 4 This diagram shows a schematic view of the test module in one embodiment of the present invention.
[0034] Figure 5 This invention provides a schematic diagram of the test module from another perspective in one embodiment of the present invention.
[0035] Figure 6 A schematic diagram of the lower pressure plate from one perspective is shown in one embodiment of the present invention.
[0036] Explanation of key component symbols:
[0037] 100-Base frame; 110-Mounting cavity; 111-First slide rail; 120-Baffle; 130-Indicator light; 140-Display module; 200-Test module; 210-Positioning plate; 211-Elastic telescopic component; 212-Positioning pin; 220-Module base plate; 221-Connection probe; 222-First slide groove; 223-First wiring part; 230-Tooling circuit board; 300-Pressing module; 310-Pressing plate; 311-Second slide rail; 312-Push column; 313-Limiting groove; 320-Pressing bracket; 321-Second slide groove; 330-Push-pull linkage; 340-Guide rod; 400-Test board; 500-Electrical integrated module; 510-Second wiring part. Detailed Implementation
[0038] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0039] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0041] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0042] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0043] like Figures 1 to 3 As shown, an embodiment of this utility model provides a rapid circuit board testing device, including a base frame 100, a testing module 200, a pressing module 300, and an electrical integration module 500.
[0044] The base frame 100 is provided with a mounting part; the test module 200 is detachably mounted on the mounting part, and the test module 200 includes a positioning plate 210, on which a corresponding test board 400 is placed; the pressing module 300 is mounted on the base frame 100, and the pressing module 300 includes a pressing plate 310, which is located above the positioning plate 210, and the lower end face of the pressing plate 310 is provided with a pressing part; the electrical integration module 500 is disposed on the base frame 100, and the electrical integration module 500 is electrically connected to the test module 200; the pressing module 300 can drive the pressing plate 310 to move closer to the positioning plate 210, thereby driving the pressing part to push each test point of the test board 400 closer to the test module 200 and establish an electrical connection.
[0045] Specifically, the electrical integration module 500, as the core control unit of the entire testing device, is responsible for coordinating the operation of various components, collecting testing data, and communicating with external devices. It includes a microcontroller (MCU), a data acquisition chip, a communication interface chip, a power management chip, and a storage chip.
[0046] The microcontroller serves as the "brain" of the electrical integration module 500, responsible for coordinating the overall operational logic and instruction scheduling of the entire testing device. Specifically, it can be an STM32F4 series microcontroller from STMicroelectronics, based on the ARM Cortex-M4 core, possessing powerful computing capabilities and rich peripheral interfaces. Within the testing device, it can process data from various components in real time, accurately sending control commands to the test module 200 and other components according to the preset testing process, ensuring coordinated operation of all parts. The data acquisition chip is used to collect various electrical parameter data generated during the testing process. Specifically, it can use the AD7606 chip from Analog Devices, which features 16-bit resolution, can simultaneously acquire multiple analog signals, and has high input impedance and low noise characteristics, effectively reducing the impact of external interference on the acquired data. In circuit board testing, the AD7606 can accurately acquire analog signals such as voltage and current at various test points on the circuit board under test, convert these analog signals into digital signals, and transmit them to the microcontroller for subsequent processing. The communication interface chip can specifically use the FT232RL chip from FTDI (Silicon Labs), which can convert data from the electrical integrated module 500 into USB protocol data, facilitating connection and communication with a host computer. Through the USB interface, operators can use host computer software to set parameters and upgrade programs for the testing device. Simultaneously, the host computer can acquire test data in real time for more in-depth analysis and processing. The power management chip is responsible for providing a stable and reliable power supply to the various components in the electrical integrated module 500. Specifically, the TPS5430 chip from Texas Instruments can be used; it is a commonly used step-down DC-DC converter with high efficiency, a wide input voltage range, and good load regulation. In the testing device, the TPS5430 converts the input power supply voltage into a stable voltage suitable for the operation of components such as the microcontroller and data acquisition chip, ensuring that each component operates under normal voltage and improving the stability and reliability of the entire system. Simultaneously, the power management chip monitors and protects the power supply. When abnormal power conditions occur, such as overvoltage, undervoltage, or overcurrent, it can take timely measures to protect the components in the electrical integrated module 500 from damage. The storage chip stores the testing device's program code, configuration parameters, and historical data generated during the testing process. Common storage chips include flash memory and static random access memory (SRAM). Specifically, the Winbond W25Q128JVSIQ flash memory chip can be used, with a storage capacity of 128Mbit, using an SPI interface for data transmission, offering fast read / write speeds and long data retention time.It can store the firmware program of the detection device. When the system starts, the microcontroller can read the program from the flash memory and execute it. The static random access memory can be ISSI's IS61LV25616AL static random access memory, which has a storage capacity of 256K×16bit, fast access speed, and is suitable for temporary storage of real-time data generated during the detection process, so that the microcontroller can quickly read and process it.
[0047] The rapid circuit board testing device provided in this embodiment, during actual testing operations, when a specific model or specification of circuit board needs to be tested, the operator first needs to select a matching test module 200 according to the testing requirements of the circuit board. This test module 200 is custom-designed for the special structure and test points of the circuit board, ensuring the accuracy and comprehensiveness of the testing.
[0048] Subsequently, the operator needs to install the selected test module 200 on the mounting section of the base frame 100 in this embodiment. During the installation process, the test module 200 is electrically connected to the electrical integration module 500 on the base frame 100.
[0049] After completing the installation and electrical connection of the test module 200, the operator needs to connect the electrical integration module 500 to a stable power supply system through a dedicated power interface to provide the necessary power support for the entire testing device. After ensuring that the power connection is correct and that all parts of the device are in normal working condition, the operator can place the circuit board to be tested stably on the positioning plate 210 on the test module 200.
[0050] Next, the operator activates the pressure module 300 on the testing device. The pressure module 300 is connected to the pressure plate 310 via a mechanical transmission mechanism. Once activated, the pressure module 300 drives the pressure plate 310 to move smoothly in a vertical direction towards the positioning plate 210. As the pressure plate 310 gradually approaches, its pressure section contacts the circuit board under test and applies appropriate pressure, ensuring a tight and stable electrical connection between each test point on the circuit board and its corresponding contact on the testing module 200.
[0051] Once the circuit board under test (PCB) is electrically connected to the test module 200, the electrical integration module 500 will immediately initiate the testing program to perform power-on tests on various circuits of the PCB and read the power-on data of each circuit in real time. This data includes, but is not limited to, key parameters such as voltage, current, and resistance values, which comprehensively reflect the electrical performance of the PCB. The read data will be presented to the operator visually through other feedback components on the electrical integration module 500. The operator can observe and judge the displayed data according to preset pass / fail standards, thereby quickly determining whether the PCB is qualified.
[0052] Furthermore, the rapid circuit board testing device provided in this embodiment also possesses high flexibility and scalability. When different models or specifications of circuit boards need to be tested, the operator only needs to replace the corresponding test module 200 according to the new circuit board. This design greatly simplifies the testing process, improves testing efficiency, and also reduces the cost and time investment required to redesign and manufacture the entire testing fixture due to the need to replace the circuit board. Moreover, because the testing module adopts a modular design, it is small in size and compact in structure, making it easy to store when not in use, further improving the ease of use and space utilization of the equipment.
[0053] like Figure 4As shown, in some specific embodiments, the test module 200 further includes a module substrate 220 and a fixture circuit board 230. The module substrate 220 and the fixture circuit board 230 are fixedly connected by a connector. The positioning plate 210 is connected to the end face of the module substrate 220 facing away from the fixture circuit board 230 by an elastic telescopic member 211. The elastic telescopic member 211 has a certain elastic deformation capacity, and can be compressed or stretched when subjected to external force, and return to its original shape after the external force is removed. The fixture circuit board 230 is the core circuit carrier for realizing the test function, and integrates the relevant circuits for testing the corresponding board under test 400. These circuits can accurately detect specific parameters and performance indicators of the circuit board under test. The module substrate 220 has multiple connection probes 221 on its end face near the positioning plate 210, corresponding to the positions of various test points on the board under test 400. These connection probes 221 are electrically connected to the circuitry on the tooling circuit board 230, and are specifically elastic probes. The tooling circuit board 230 is electrically connected to the electrical integration module 500. During actual testing, when the pressure plate 310 applies top pressure to the board under test 400, the board under test 400 pushes the positioning plate 210 towards the module substrate 220. Since the positioning plate 210 and the module substrate 220 are connected by an elastic telescopic member 211, the movement of the positioning plate 210 compresses the elastic telescopic member 211. As the elastic telescopic member 211 is compressed, the various test points on the board under test 400 gradually contact the elastic probes on the module substrate 220 and achieve electrical connection. At this time, the test circuit on the tooling circuit board 230 starts to work, performs power-on measurement on the circuit board under test, collects relevant electrical parameter data, and transmits this data to the electrical integration module 500.
[0054] Because an elastic telescopic member 211 is provided between the positioning plate 210 and the module substrate 220, when the positioning plate 210 is not subjected to external force, the elastic telescopic member 211 will return to its original shape, keeping the positioning plate 210 and the module substrate 220 relatively far apart. This design has significant advantages, effectively preventing accidental connection between the test board 400 and the connection probe 221 during the placement of the test board 400 onto the positioning plate 210. If the positioning plate 210 and the module substrate 220 are too close when placing the test board 400, the test board 400 may accidentally contact the connection probe 221, leading to a short circuit or other abnormalities, affecting the normal testing process or even damaging the equipment. The presence of the elastic telescopic member 211 ensures a sufficient safe distance between the positioning plate 210 and the connection probe 221 when placing the test board 400, thereby improving the safety of use in this embodiment.
[0055] Furthermore, using a flexible probe as the connection probe 221 offers several advantages. The elastic properties of the flexible probe allow it to better adapt to uneven surfaces on the test board 400. When the test board 400 has minor manufacturing errors or surface irregularities, the flexible probe can maintain close contact with the test point on the test board 400 through its own elastic deformation, thereby improving connection reliability. Simultaneously, the elastic buffering effect of the flexible probe can prevent deformation damage to the connection probe 221 or the test board 400 when the downward pressure provided by the pressure plate 310 is excessive. If a rigid probe is used, it may bend or break due to excessive pressure, and the test point on the test board 400 may also be damaged due to excessive pressure. The flexible probe can absorb excessive pressure to a certain extent, protecting the connection probe 221 and the test board 400 from damage, thus improving the reliability of this embodiment.
[0056] In some specific embodiments, multiple elastic telescopic components 211 are provided, specifically including telescopic rods and elastic elements; each elastic telescopic component 211 is composed of two parts: a telescopic rod and an elastic element. The telescopic rod is usually made of high-strength, wear-resistant metal materials, such as stainless steel or aluminum alloy, and its structure is generally a hollow sleeve type, including an inner rod and an outer tube. The inner rod can slide smoothly along the axial direction within the outer tube. The telescopic rod is set between the positioning plate 210 and the module substrate 220, mainly serving a guiding function. When the positioning plate 210 moves under the top pressure of the lower pressure plate 310, the telescopic rod can restrict the movement direction of the positioning plate 210, ensuring that it can only move in a direction perpendicular to the module substrate 220. This is because, under the constraint of the telescopic rod, the positioning plate 210 cannot shift or wobble in the horizontal direction, and can only move linearly along the axial direction of the telescopic rod, that is, in a direction perpendicular to the module substrate 220, thereby ensuring the accurate alignment of the circuit board under test and the connection probe 221, avoiding problems such as inaccurate test results or damage to the connection probe 221 due to positioning deviation.
[0057] An elastic element is also disposed between the positioning plate 210 and the module substrate 220. It is generally made of materials with good elasticity and recovery properties, such as springs or elastic rubber. Taking a spring as an example, it can be a compression spring, with its two ends fixedly connected to the positioning plate 210 and the module substrate 220 respectively. When the pressure plate 310 applies pressure to the test plate 400, pushing the positioning plate 210 closer to the module substrate 220, the elastic element will be compressed and undergo elastic deformation, storing elastic potential energy. When the external force disappears, i.e., when the pressure plate 310 moves away or the pressure is reduced, the elastic element will release the stored elastic potential energy, pushing the positioning plate 210 back to its initial position. The presence of the elastic element not only provides a buffer for the movement of the positioning plate 210, preventing damage due to excessive instantaneous force, but also provides sufficient power when the positioning plate 210 resets, ensuring that the positioning plate 210 can accurately and quickly return to its original position, preparing for the next test.
[0058] Multiple elastic telescopic components 211 work together to support, guide, and buffer the positioning plate 210. Through this design, the positioning plate 210 can always move in a direction perpendicular to the module substrate 220 when the elastic telescopic components 211 are compressed, thereby ensuring the stability and reliability of the entire test module 200 and providing a strong guarantee for the accurate testing of the circuit board under test.
[0059] In some specific embodiments, the mounting part includes a mounting cavity 110, with openings on both its side and top. A cover 120 is provided on the side opening of the mounting cavity 110, with its lower end hinged to the opening from the side. The upper end of the cover 120 is assembled to the module substrate 220 or the base frame 100 via a connector. A first slide rail 111 is provided on the inner wall of the mounting cavity 110, and a first sliding groove 222 corresponding to the first slide rail 111 is provided on the side of the module substrate 220. The first slide rail 111 and the first sliding groove 222 slide relative to each other. The relative sliding of the first slide rail 111 and the first sliding groove 222 allows the test module 200 to be quickly installed in the mounting cavity 110. Closing the cover 120 then restricts the relative position of the test module 200 relative to the mounting cavity 110, thereby achieving rapid installation of the test module 200 and improving the efficiency of this embodiment.
[0060] In some specific embodiments, the module substrate 220 is provided with a first wiring portion 223, which is electrically connected to the tooling circuit board 230; the electrical integration module 500 includes a second wiring portion 510 corresponding to the first wiring portion 223; when the positioning plate 210 slides into the mounting cavity 110, it can drive the first wiring portion 223 to approach the second wiring portion 510 and connect them, so that when the test module 200 is installed in the mounting cavity 110, it can be electrically connected to the electrical integration module 500 simultaneously, making the installation process simpler and faster.
[0061] In some specific embodiments, the pressing module 300 further includes a pressing bracket 320 and a push-pull linkage 330. The push-pull linkage 330 is disposed between the pressing bracket 320 and the base frame 100. The pressing plate 310 is detachably mounted on the pressing bracket 320. By pushing and pulling the push-pull linkage 330, the pressing bracket 320 can be driven to move the pressing plate 310 in the vertical direction. The push-pull linkage 330 can be manually operated by an operator or connected to a power component for automatic control.
[0062] In some specific embodiments, the lower pressure bracket 320 is provided with a second sliding groove 321 horizontally, and the side of the lower pressure plate 310 is provided with a second sliding rail 311 corresponding to the second sliding groove 321. The second sliding rail 311 and the second sliding groove 321 are slidably engaged. A limiting member is provided in the second sliding groove 321 to limit the relative position of the second sliding rail 311 and the second sliding groove 321. This facilitates the quick replacement of the lower pressure plate 310 on the lower pressure bracket 320 as needed.
[0063] like Figure 6 As shown, in some specific embodiments, the limiting member is specifically a limiting bead. The second slide groove 321 has a movable groove on its end face near the second slide rail 311. The limiting bead is disposed in the movable groove. An elastic member is provided between the limiting bead and the movable groove. The second slide rail 311 has a limiting groove 313 corresponding to the limiting bead. Under the elastic force of the elastic member, the limiting post partially falls into the limiting groove 313, which facilitates the reliable limiting of the relative position between the lower pressure bracket 320 and the lower pressure plate 310. In addition, the aforementioned structure is also provided between the first slide groove 222 and the first slide rail 111, which will not be described in detail here.
[0064] In some specific embodiments, a guide rod 340 is vertically inserted through the pressure bracket 320. The guide rod 340 is fixedly mounted on the base frame 100 to facilitate guiding the downward pressing direction of the pressure plate 310 and ensure the reliability of this embodiment.
[0065] In some specific embodiments, the end of the pressure plate 310 near the positioning plate 210 is provided with a push post 312 corresponding to the test plate 400. The push post 312 is used to form a pressure part. Specifically, the position of the push post 312 corresponds to the blank area of the test plate 400 to avoid pressure damage to the circuit of the test plate 400 and improve the reliability of this embodiment.
[0066] In some specific embodiments, the base frame 100 is provided with a plurality of indicator lights 130, which are electrically connected to the electrical integration module 500, and the plurality of indicator lights 130 can display different colors respectively.
[0067] During actual testing, the electrical integration module 500 precisely controls the corresponding indicator lights 130 to illuminate according to different test results and pre-set program logic. After testing a circuit board, the electrical integration module 500 quickly processes and analyzes the collected data to determine whether the circuit board is qualified and whether there are any issues requiring special attention. It then immediately sends control commands to the corresponding indicator lights 130. Operators can instantly understand the circuit board's test results simply by observing the color change of the indicator lights 130, without spending extra time reviewing complex test data or waiting for system prompts. This greatly improves the efficiency and accuracy of the testing work, while also reducing the professional skills required of operators, making the entire testing process simpler and easier.
[0068] In some specific embodiments, a display module 140 is provided on the base frame 100, and the display module 140 is electrically connected to the electrical integration module 500. During actual operation, the main function of the display module 140 is to directly display the test results and various parameters received by the electrical integration module 500. After the test module 200 completes the testing of the circuit board under test, it transmits the collected relevant data to the electrical integration module 500. The electrical integration module 500 quickly processes and analyzes this data to obtain various parameters such as the voltage, current, and resistance values of the circuit board, as well as test results determining whether the circuit board is qualified. Subsequently, the electrical integration module 500 transmits this information to the display module 140 via electrical connection. After receiving this information, the display module 140 presents it in a clear and intuitive manner. For example, it may display the specific values of each parameter in numerical form, explain in words whether the test result is "qualified" or "unqualified," or even show the changing trends of certain parameters in the form of charts or curves, allowing operators to have a more comprehensive understanding of the circuit board's performance.
[0069] By setting up such a display module 140, operators no longer need to obtain test results and parameter information through other complex methods; they can simply view the information on the display module 140. This not only improves the efficiency of the testing work and reduces the workload of operators, but also avoids misjudgments caused by untimely or inaccurate information, thereby improving the accuracy and reliability of the entire testing process.
[0070] like Figure 5 As shown, in some specific embodiments, the positioning plate 210 is provided with positioning pins 212 corresponding to the mounting holes on the test plate 400. Multiple positioning pins 212 are provided to limit the relative position of the test plate 400 and the positioning plate 210, so as to ensure the accurate placement of the test plate 400 on the positioning plate 210.
[0071] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0072] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A rapid circuit board testing device, characterized in that, include: A base frame (100) is provided with a mounting part; The test module (200) is detachably mounted on the mounting part. The test module (200) includes a positioning plate (210) on which a corresponding test board (400) is placed. A pressing module (300) is mounted on the base frame (100). The pressing module (300) includes a pressing plate (310), which is located above the positioning plate (210). The lower end face of the pressing plate (310) is provided with a pressing part. An electrical integration module (500) is mounted on the base frame (100) and is electrically connected to the test module (200); The pressing module (300) drives the pressing plate (310) to move closer to the positioning plate (210), thereby driving the pressing part to push each test point of the test board (400) closer to the test module (200) and establish an electrical connection.
2. The circuit board rapid testing device according to claim 1, characterized in that, The test module (200) further includes a module substrate (220) and a tooling circuit board (230). The module substrate (220) and the tooling circuit board (230) are fixedly connected by a connector. The positioning plate (210) is connected to the end face of the module substrate (220) away from the tooling circuit board (230) by an elastic telescopic member (211). The end face of the module substrate (220) near the positioning plate (210) is provided with a plurality of connection probes (221) corresponding to the positions of each test point of the board under test (400). The connection probes (221) are electrically connected to the circuit on the tooling circuit board (230). The tooling circuit board (230) is electrically connected to the electrical integration module (500).
3. The circuit board rapid testing device according to claim 2, characterized in that, The mounting part includes a mounting cavity (110), and the mounting cavity (110) has openings on its side and top. The side opening of the mounting cavity (110) is provided with a cover (120). The inner side wall of the mounting cavity (110) is provided with a first slide rail (111), and the side of the module base plate (220) is provided with a first slide groove (222) corresponding to the first slide rail (111). The first slide rail (111) and the first slide groove (222) slide relative to each other.
4. The circuit board rapid testing device according to claim 3, characterized in that, The module substrate (220) is provided with a first wiring portion (223), which is electrically connected to the tooling circuit board (230); the electrical integration module (500) includes a second wiring portion (510) corresponding to the first wiring portion (223); when the positioning plate (210) slides into the mounting cavity (110), it can drive the first wiring portion (223) to approach the second wiring portion (510) and make a docking connection.
5. The circuit board rapid testing device according to claim 1, characterized in that, The pressing module (300) also includes a pressing bracket (320) and a push-pull linkage (330). The push-pull linkage (330) is disposed between the pressing bracket (320) and the base frame (100). The pressing plate (310) is detachably mounted on the pressing bracket (320). By pushing and pulling the push-pull linkage (330), the pressing bracket (320) can be driven to move the pressing plate (310) in the vertical direction.
6. The circuit board rapid testing device according to claim 5, characterized in that, The lower pressure bracket (320) is horizontally provided with a second slide groove (321), and the side of the lower pressure plate (310) is provided with a second slide rail (311) corresponding to the second slide groove (321). The second slide rail (311) and the second slide groove (321) slide relative to each other. The second slide groove (321) is provided with a limiting member to limit the relative position of the second slide rail (311) and the second slide groove (321).
7. The circuit board rapid testing device according to claim 5, characterized in that, A guide rod (340) is vertically inserted through the lower support (320), and the guide rod (340) is fixedly installed on the base frame (100).
8. The circuit board rapid testing device according to any one of claims 1 to 7, characterized in that, The end of the pressure plate (310) near the positioning plate (210) is provided with a push column (312) corresponding to the test plate (400), and the push column (312) is used to form the pressure part.
9. The circuit board rapid testing device according to any one of claims 1 to 7, characterized in that, The base frame (100) is provided with multiple indicator lights (130), which are electrically connected to the electrical integration module (500).
10. The circuit board rapid testing device according to any one of claims 1 to 7, characterized in that, The base frame (100) is provided with a display module (140), which is electrically connected to the electrical integration module (500).