A fast positioning chip test fixture and method

Abstract

The application discloses a chip testing fixture capable of fast positioning, which comprises a testing platform, a positioning mechanism, a pin correction pressing block, a probe and a first driving mechanism; the testing platform is provided with a working position for placing a chip to be tested; the positioning mechanism is used for positioning the chip to be tested to the working position; the pin correction pressing block is movably connected with the testing platform, so as to be capable of approaching the working position and pressing the pins of the chip to be tested, and being capable of moving away from the working position to release the pins of the chip to be tested; the probe is installed on the pin correction pressing block; the first driving mechanism is drivingly connected with the pin correction pressing block, and is used for driving the pin correction pressing block to approach or move away from the working position, so that the probe is electrically connected to the pins of the chip to be tested when the pin correction pressing block approaches the working position, and the probe is separated from the pins of the chip to be tested when the pin correction pressing block moves away from the working position.

Description

Technical Field

[0001] This invention relates to the field of chip test fixture technology, and in particular to a chip test fixture and method for rapid positioning. Background Technology

[0002] In chip testing processes, rapid positioning and clamping test fixtures are crucial for improving testing efficiency and accuracy. However, due to the susceptibility of chips to mechanical stress or vibration during transportation, handling, or loading, their precision pins often bend, shift, or deform. When a chip with misaligned pins is placed into a test fixture, misalignment between the pins and probes or contact points occurs, leading to unreliable electrical connections, unstable signal transmission, or increased contact resistance. This introduces testing errors and can even cause misjudgments, chip damage, or damage to the testing equipment. This not only affects the repeatability and reliability of test results but also limits overall testing efficiency. Summary of the Invention

[0003] In order to overcome the shortcomings of the prior art, the purpose of this invention is to provide a chip test fixture and method for rapid positioning, which can correct deformed pins and achieve stable and reliable electrical contact, so as to ensure the accuracy of test results and test efficiency.

[0004] The objective of this invention is achieved through the following technical solution:

[0005] A chip testing fixture for rapid positioning, comprising:

[0006] The test platform has a working position for placing the chip under test;

[0007] A positioning mechanism is used to position the chip under test to the working position.

[0008] A pin calibration block is movably connected to the test platform so as to be able to approach the working position relative to the test platform and press the pins of the chip under test, and to be able to move away from the working position relative to the test platform to release the pins of the chip under test.

[0009] A probe, which is mounted on the pin calibration block;

[0010] A first driving mechanism drives the pin calibration block and is used to drive the pin calibration block closer to or further away from the working position, so that the probe electrically contacts the pin of the chip under test when the pin calibration block is close to the working position, and disengages from the pin of the chip under test when the pin calibration block is far away from the working position.

[0011] Furthermore, the pin correction block is provided with a correction slope, and the horizontal height of the end of the correction slope away from the working position is greater than the horizontal height of the end of the correction slope close to the working position; the driving end of the first driving mechanism can abut against the correction slope so as to slide along the inclination direction of the correction slope and drive the pin correction block closer to or away from the working position.

[0012] Furthermore, the first drive mechanism is also connected to a drive roller, which is used to abut against the correction slope.

[0013] Furthermore, at least two pin calibration blocks are provided, and the two pin calibration blocks are arranged symmetrically.

[0014] The first driving mechanism further includes a driving plate, and the driving rollers are provided with at least two, both of which are connected to the driving plate. Each pin correction block has at least one driving roller that abuts against the corresponding correction slope, so as to drive the corresponding pin correction block closer to or further away from the working position.

[0015] Furthermore, the pin calibration block is also connected to multiple pin separation components. The pin separation components are located on the side of the pin calibration block closest to the test platform and are linearly distributed. Each pin separation component can be inserted into the gap between two adjacent chip pins and moves with the pin calibration block.

[0016] Furthermore, the pin alignment block is provided with multiple mounting cavities; one of the pin separation components is located in one of the mounting cavities and extends from the mounting cavity to the external environment; one end of one of the pin separation components is hinged to the corresponding mounting cavity, and the other end is connected to the mounting cavity through a first elastic member, so that one end of one of the pin separation components has a tendency to move away from the corresponding mounting cavity.

[0017] Furthermore, the chip testing fixture for rapid positioning also includes a first link, a second link, a base, a reset torsion spring, a height reset mechanism, a transmission rod, and a linear drive mechanism;

[0018] One end of the first connecting rod is hinged to the test platform, and the other end of the first connecting rod is hinged to one end of the second connecting rod. The other end of the second connecting rod is connected to the base, and the base and the test platform are spaced apart. The two ends of the reset torsion spring are respectively connected to the first connecting rod and the test platform so that the first connecting rod maintains a preset angle.

[0019] The height reset mechanism includes a sliding block, a guide rod, and a compression spring; the sliding block is located between the base and the test platform and is slidably connected to the test platform; one end of the guide rod is connected to the sliding block; the other end of the guide rod passes through the test platform and is slidably connected to the test platform; both ends of the compression spring are connected to the base and the sliding block respectively, so that the sliding block and the base have a tendency to move away from each other;

[0020] The linear drive mechanism is mounted on the base and is connected to the pin correction block via a transmission rod to drive the pin correction block closer to or further away from the working position.

[0021] Furthermore, the pin calibration block is provided with multiple clearance through holes, the transmission rod passes through the clearance through holes and is connected to the probe.

[0022] Furthermore, a second elastic element is provided between the probe and the transmission rod, with both ends of the second elastic element connected to the probe and the transmission rod respectively, so that the probe has a tendency to move away from the transmission rod.

[0023] A chip testing method for rapid positioning and clamping, comprising a rapid positioning chip testing fixture as described in any one of claims 1-9, including the following steps:

[0024] Place the chip in the working position and activate the positioning mechanism to position the chip.

[0025] Drive the pin calibration block to move closer to the working position relative to the test platform;

[0026] The first driving mechanism is activated, which drives the pin calibration block to move closer to the working position relative to the test platform. The pin calibration block presses down on and calibrates the pins of the chip under test, while the probe makes conductive contact with the pins of the chip under test for electrical testing.

[0027] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0028] 1. Based on the active connection between the pin calibration block and the test platform, it can be close to the working position relative to the test platform to press the pins of the chip under test, and can be far away from the working position relative to the test platform to release the pins of the chip under test. This design enables efficient integration of calibration operation and chip loading and unloading process. It can automatically complete the precise pressure and reset of deformed pins in the test cycle, which not only reduces the risk of contact failure caused by pin misalignment, but also effectively avoids the efficiency bottleneck and consistency difference of traditional manual or visual calibration, thereby improving the automation level and operational reliability of the test process. At the same time, when the pin calibration block is close to the working position, it is allowed to slightly abut against the opposite sides of the chip, further improving the calibration accuracy and chip positioning accuracy.

[0029] 2. Based on the probe being mounted on the pin calibration block, the probe and the calibration block form an integrated motion unit. This ensures that when the probe contacts the pin, the pin is already in the ideal geometric posture shaped and held firmly by the calibration block. This fundamentally avoids problems such as unstable contact resistance, signal discontinuity, or test point offset caused by residual deformation or positional fluctuation of the pin. It improves the physical stability and electrical performance consistency of the electrical connection point, ensuring the integrity of the test signal and the accuracy of the measurement results.

[0030] 3. Based on the first driving mechanism, a pin calibration block is driven to move closer to or away from the working position. This allows the probe to electrically contact the pin of the chip under test when the pin calibration block is close to the working position, and to detach from the pin of the chip under test when the pin calibration block is away from the working position. In this design, this core structure integrates the pin calibration and probe electrical contact—two processes that might otherwise be separate—into a continuous flow of actions with a defined sequence through a controlled motion stroke. This not only simplifies the actuator but also ensures the consistency of the timing and process of the operation from a mechanical logic perspective. Its benefit lies in the fact that the simplified physical structure enforces the sequential order of key steps (i.e., calibration before contact, separation before release), thereby fundamentally guaranteeing the repeatability of the test process and ensuring that each test follows the exact same electrical contact establishment conditions. This further improves the comparability and accuracy of test data and reduces systematic errors introduced by differences in operation timing. Meanwhile, the integrated drive and execution design reduces the number of independent moving parts and coordination interfaces, which simplifies the control system logic and enhances system stability, providing a stable hardware foundation for automated testing. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of a chip testing fixture for rapid positioning according to the present invention;

[0032] Figure 2 for Figure 1A magnified view of a section at point A in the middle;

[0033] Figure 3 for Figure 1 Cross-sectional view of the structure;

[0034] Figure 4 for Figure 3 A magnified view of a section at point B in the middle;

[0035] Figure 5 for Figure 3 A magnified view of a section at point C;

[0036] Figure 6 for Figure 1 Another cross-sectional view of the structure;

[0037] Figure 7 for Figure 6 A magnified view of a section at point D.

[0038] In the diagram: 1. Test platform; 101. Working position; 2. Positioning mechanism; 3. Pin correction pressure block; 301. Correction slope; 302. Mounting cavity; 4. Probe; 5. First drive mechanism; 501. Drive plate; 6. Drive roller; 7. Pin separation component; 8. First elastic element; 9. First connecting rod; 10. Second connecting rod; 11. Base; 12. Reset torsion spring; 13. Height reset mechanism; 1301. Sliding block; 1302. Guide rod; 1303. Compression spring; 14. Transmission rod; 15. Linear drive mechanism; 16. Clearance through hole; 17. Second elastic element. Detailed Implementation

[0039] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0040] It should be noted that when an element is described as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is described as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0042] See Figures 1-7 A preferred embodiment of the present invention provides a rapid positioning chip test fixture, comprising a test platform 1, a positioning mechanism 2, a pin calibration block 3, a probe 4, and a first driving mechanism 5. The test platform 1 has a working position 101 for placing the chip under test (DUT). The positioning mechanism 2 is used to position the DUT to the working position 101. The pin calibration block 3 is movably connected to the test platform 1, so that it can approach the working position 101 relative to the test platform 1 and press the pins of the DUT, and can move away from the working position 101 relative to the test platform 1 to release the pins of the DUT. The probe 4 is mounted on the pin calibration block 3. The first driving mechanism 5 drives the pin calibration block 3 and is used to drive the pin calibration block 3 to approach or move away from the working position 101, so that the probe 4 electrically contacts the pins of the DUT when the pin calibration block 3 approaches the working position 101, and disengages the probe 4 from the pins of the DUT when the pin calibration block 3 moves away from the working position 101.

[0043] The working principle of this invention is as follows: During testing, the chip under test is first positioned at the working position 101 of the test platform 1 by the positioning mechanism 2. Then, the pin calibration block 3, which is movably connected to the test platform 1, is moved to a preparatory position directly above the chip pins. Next, the first driving mechanism 5 is activated, driving the positioned pin calibration block 3 towards the chip; the lower surface of the block first contacts and presses against the chip pins, mechanically correcting and shaping any bending deformation caused by transportation or handling, restoring all pins to their preset standard geometric positions. While maintaining its pin calibration function, the pin calibration block 3's movement trajectory includes a component that causes the block as a whole to shift laterally relative to the chip, thereby driving the probe 4 mounted on it to stably contact the calibrated pins from the side. At this point, physical and electrical contact is achieved between the calibrated pins and the probe 4 mounted on the pin calibration block 3. The test system then establishes an electrical path with the chip through the probe 4, enabling parameter testing. After the test is completed, the first drive mechanism 5 moves in the reverse direction, driving the pin correction block 3 to rise and reset. The probe 4 is first safely separated from the pin, and then the pin correction block 3 is driven to move back to the initial position, so that the tested chip can be taken out smoothly.

[0044] Obviously, based on the active connection between the pin calibration block 3 and the test platform 1, which allows it to approach the working position 101 relative to the test platform 1 and press the pins of the chip under test, and to move away from the working position 101 relative to the test platform 1 to release the pins of the chip under test, this design enables efficient integration of calibration operations with the chip loading and unloading process. It can automatically complete the precise pressure application and reset of deformed pins in the test cycle, which not only reduces the risk of contact failure caused by pin misalignment, but also effectively avoids the efficiency bottleneck and consistency difference of traditional manual or visual calibration, thereby improving the automation level and operational reliability of the test process. At the same time, when the pin calibration block 3 is close to the working position 101, it is allowed to slightly abut against the opposite sides of the chip, further improving the calibration accuracy and chip positioning accuracy.

[0045] Based on the fact that the probe 4 is mounted on the pin calibration block 3, the probe 4 and the calibration block form an integrated motion unit. This ensures that when the probe 4 contacts the pin, the pin is already in the ideal geometric posture that has been shaped and held firmly by the calibration block. This fundamentally avoids problems such as unstable contact resistance, signal discontinuity, or test point offset caused by residual deformation or positional fluctuation of the pin. It improves the physical stability and electrical performance consistency of the electrical connection point, and ensures the integrity of the test signal and the accuracy of the measurement results.

[0046] The first driving mechanism 5 drives the pin calibration block 3, which moves the pin calibration block 3 closer to or further away from the working position 101. This allows the probe 4 to electrically contact the pin of the chip under test when the pin calibration block 3 is close to the working position 101, and to disengage from the pin of the chip under test when the pin calibration block 3 is away from the working position 101. In this design, this core structure integrates the pin calibration and probe 4 electrical contact—two processes that might otherwise be separate—into a continuous flow of actions with a defined sequence through a controlled movement stroke. This not only simplifies the actuator but also ensures the consistency of the timing and process of the operation from a mechanical logic perspective. Its benefit lies in the fact that the simplified physical structure enforces the sequential order of key steps (i.e., calibration before contact, separation before release), fundamentally guaranteeing the repeatability of the test process and ensuring that each test follows the exact same electrical contact establishment conditions. This further improves the comparability and accuracy of test data and reduces systematic errors introduced by differences in operational timing. Meanwhile, the integrated drive and execution design reduces the number of independent moving parts and coordination interfaces, which simplifies the control system logic and enhances system stability, providing a stable hardware foundation for automated testing.

[0047] It is worth noting that the pin calibration block 3 mentioned in this solution should be modular, allowing for quick replacement based on the package type, pin layout, and electrical testing requirements of different chips. Each modular block integrates a calibration structure precisely matched to the pin position of that specific chip and a dedicated probe array 4, ensuring that a uniform calibration force is applied to all pins simultaneously when the block is pressed down, and that the probe array 4 achieves high-precision coplanar contact with the calibrated pins. This modular strategy not only improves the versatility of the fixture and the flexibility of the production line, enabling the same test platform 1 to efficiently adapt to multiple chip models, but also ensures the repeatability of the test after each replacement through pre-aligned modules, avoiding the tedious process of re-aligning and calibrating for different chips. The modular design also simplifies the maintenance and upgrade process; damaged or worn probe 4 units can be replaced along with the block module, reducing the complexity of equipment maintenance and downtime, thus achieving an optimized balance between rapid changeover and long-term reliable operation. Preferably, the probes 4 installed on the block can be arranged in a high-density array, with their deployment range and number fully covering and exceeding the possible location range of the target chip pins. In this configuration, as long as any pin of the chip can form effective electrical contact with at least one probe 4 in the array after calibration, the system can identify and utilize this path to complete the test. The system has automatic detection and routing functions, which can dynamically ignore redundant probe 4 points that have not established physical contact, and only perform signal excitation and data acquisition on the actually connected effective contacts. This design reduces the stringent requirements for the absolute positional alignment between the pin and probe 4, improves the fixture's fault tolerance and test adaptability to different degrees of pin offset or non-uniform deformation, and ensures that even if there are slight alignment deviations during rapid positioning, it will not affect the feasibility and integrity of the core electrical test, thereby further enhancing the application range of the test system.

[0048] In this solution, a pin calibration block 3 is movably connected to the test platform 1, allowing it to move closer to or further away from the working position 101 relative to the test platform 1. The connection structure can be a simple hinge structure with a vertical elastic reset structure for manual forward movement and passive downward pressing. Specifically, a bracket is set on the side of the test platform 1, and the rear end of the pin calibration block 3 is movably connected to the bracket via a set of hinge shafts, allowing the block to swing around the hinge shafts in an approximately vertical arc trajectory. The operator can manually push the front end of the block forward (towards the working position 101) using a handle, causing it to move closer to the chip around the hinge shaft. Simultaneously, a vertically positioned (or along the tangent of the swing arc) elastic reset structure, such as a compression spring 1303 or a tension spring, is connected between the block and the bracket. After the first drive mechanism 5 resets, the pin calibration block 3 automatically disconnects from the electrical connection with the pin and resets to its initial height; alternatively, an automated solution can be used, where another drive mechanism (such as a motor or cylinder) works in conjunction with the first drive mechanism 5 (such as a motor or cylinder) to complete this action.

[0049] More preferably, the pin calibration block 3 is provided with a calibration ramp 301, the horizontal height of the end of the calibration ramp 301 away from the working position 101 is greater than the horizontal height of the end of the calibration ramp 301 close to the working position 101; the driving end of the first driving mechanism 5 can abut against the calibration ramp 301, so as to slide along the tilt direction of the calibration ramp 301 and drive the pin calibration block 3 to move closer to or away from the working position 101. In this scheme, the pin calibration block 3 is provided with a calibration ramp 301 with a specific tilt angle, the end of the ramp away from the working position 101 is higher, and the end close to the working position 101 is lower. When the driving end of the first driving mechanism 5 abuts against the ramp and slides along its tilt direction, the linear motion of the driving mechanism is decomposed into two components, horizontal and vertical, thereby driving the pin calibration block 3 to simultaneously complete the combined motion of horizontally approaching the working position 101 and vertically pressing down on the pin. This process allows the block to first push and press the chip pin into the calibration position, and then allow the probe 4 mounted on the block to establish a stable electrical contact with the calibrated pin. After the test, the drive end slides in the reverse direction, causing the pressure block to first rise vertically along the original path to release pressure, and then return horizontally to the initial position, completing the fully automatic test cycle. This inclined plane drive structure integrates multiple actions such as correction, contact, and reset into a coherent physical process through a single mechanical constraint. This not only simplifies the mechanical transmission chain and control logic, but also ensures the accuracy and repeatability of each step through the geometric characteristics of the inclined plane. The first drive mechanism 5 maintains a constant relative position during the pressing process, giving the pin correction pressure block 3 a locking function, maintaining stable contact pressure during the testing phase, and further improving the reliability of the test.

[0050] More preferably, the first drive mechanism 5 is also connected to a drive roller 6, which abuts against the correction slope 301. In this scheme, the drive roller 6 replaces sliding friction with rolling contact, reducing the frictional resistance and wear of the drive end of the first drive mechanism 5 during reciprocating motion on the correction slope 301. This not only reduces the power requirements and energy consumption of the drive mechanism, but also reduces surface wear caused by long-term friction between the slope and the drive end, thereby extending the service life of key moving parts and improving the long-term operational stability and maintenance cycle of the entire test fixture. Moreover, rolling contact makes the force transmission smoother and more stable, effectively avoiding the stick-slip effect or jitter that may be caused by sliding friction. This ensures precise control of the speed and position of the pin correction block 3 during the compound motion, making the downward correction and horizontal feed actions smoother and more consistent, thereby further improving the uniformity of chip pin correction and the repeatability of the probe 4 contact point, providing a guarantee for high reliability testing.

[0051] More preferably, the pin calibration blocks 3 are provided with at least two blocks, which are symmetrically arranged. The first driving mechanism 5 also includes a driving plate 501 and at least two driving rollers 6, both of which are connected to the driving plate 501. Each pin calibration block 3 has at least one driving roller 6 that abuts against the corresponding calibration slope 301, so as to drive the corresponding pin calibration block 3 to move closer to or away from the working position 101. This symmetrical structure realizes simultaneous and synchronous calibration and contact of the pins on both sides or around the chip. Driven by a single driving plate 501, the two blocks move along the calibration slope 301 through their respective driving rollers 6, which can ensure that the calibration force and contact pressure applied to both sides of the chip are highly consistent in timing and magnitude. This effectively avoids the twisting or offset of the chip at the test position caused by unilateral force application or asynchronous movement, and ensures the symmetry of the pin calibration shape and the consistency of the contact resistance of the probe 4, thereby improving the reliability and accuracy of the test results, which is especially important for precision or high pin count chips.

[0052] More preferably, the pin alignment block 3 is also connected to multiple pin separation components 7. These components 7 are located on the side of the pin alignment block 3 closest to the test platform 1 and are linearly distributed. Each pin separation component 7 can be inserted into the gap between two adjacent chip pins and moves with the pin alignment block 3. When the pin alignment block 3, carrying multiple linearly distributed pin separation components 7, moves downwards towards the chip, these separation components insert into the gaps between adjacent pins. As the block continues to press down, the separation components first physically separate and align the pins, preventing short circuits or mutual interference between adjacent pins during the alignment process. Subsequently, the alignment bottom surface of the block applies uniform planar pressure and shaping to the separated pins, ultimately completing the alignment and establishing electrical contact with the probes 4. The active intervention of the pin separation components 7 before mechanical alignment effectively eliminates the risk of pin overlap caused by dense pins or excessive bending. Simultaneously, the separation action pre-regulates the spatial order of the pin array, resulting in a more uniform distribution of subsequent planar alignment force, improving the consistency and accuracy of the alignment, and is particularly suitable for reliable testing of high-density, fine-pitch pin chips. It is worth noting that the pin separation component 7 should be designed to be as thin and light as possible to ensure that its front end can be inserted into the fine pin gaps of high-density chips without interference. At the same time, when contacting the side of the pin, its contact surface should have a low coefficient of friction and sufficient hardness to reduce resistance during insertion and prevent wear and debris generation; its structure should also have appropriate elasticity or flexibility, so as to provide effective guidance and restraint when separating the pins, while avoiding scratching the fragile pins or applying excessive lateral stress due to excessive rigidity, so as to protect the pin integrity to the maximum extent while achieving precise separation.

[0053] More preferably, the pin alignment block 3 has multiple mounting cavities 302; one pin separation component 7 is located in one of the mounting cavities 302 and extends from the mounting cavity 302 to the external environment; one end of one pin separation component 7 is hinged to the corresponding mounting cavity 302, and the other end is connected to the mounting cavity 302 through a first elastic member 8, so that one end of one pin separation component 7 has a tendency to move away from the corresponding mounting cavity 302. In this solution, through the constant tension provided by the first elastic member 8, the free end of the separation component always has a tendency to expand outward, which ensures that its front end can actively align and gently probe into the pin gap before contacting the pin, reducing the risk of rigid impact. When encountering pin position deviation or local resistance during insertion, the hinge structure allows the separation component to adaptively deflect and make way within a certain range, avoiding stress concentration or pin damage caused by forced alignment. After insertion is completed, the elastic member can provide a stable lateral force, maintaining the separation effect while allowing the component to float with the natural micro-movement of the pin in the gap. In addition, this design is also to avoid the problem that the pin separation component 7 will press against the test platform 1 when the pin alignment block 3 is attached to the test platform 1, causing the probe 4 to be unable to be aligned.

[0054] More preferably, a rapid positioning chip testing fixture further includes a first link 9, a second link 10, a base 11, a reset torsion spring 12, a height reset mechanism 13, a transmission rod 14, and a linear drive mechanism 15; one end of the first link 9 is hinged to the test platform 1, and the other end of the first link 9 is hinged to one end of the second link 10, the other end of the second link 10 is connected to the base 11, and the base 11 and the test platform 1 are spaced apart; the two ends of the reset torsion spring 12 are respectively connected to the first link 9 and the test platform 1, so that the first link 9 maintains a preset angle; the height reset mechanism 13 includes a sliding block 1301 and a guide rod 15. 302 and compression spring 1303; sliding block 1301 is located between base 11 and test platform 1 and is slidably connected to test platform 1; one end of guide rod 1302 is connected to sliding block 1301; the other end of guide rod 1302 passes through test platform 1 and is slidably connected to test platform 1; both ends of compression spring 1303 are respectively connected to base 11 and sliding block 1301, so that sliding block 1301 and base 11 have a tendency to move away from each other; linear drive mechanism 15 is installed on base 11 and is driven by pin correction pressure block 3 through transmission rod 14, so as to drive pin correction pressure block 3 to move closer to or away from working position 101. In this scheme, when the first drive mechanism 5 presses down pin correction pressure block 3, base 11 drives first link 9 through second link 10 to overcome the torque of reset torsion spring 12, so that the entire base 11 and the linear drive mechanism 15, transmission rod 14 and pin correction pressure block 3 assembly installed on it will descend as a whole relative to the fixed test platform 1. Simultaneously, the sliding block 1301 slides along the guide rod 1302 and compresses the compression spring 1303. This process adaptively lowers the height of the pin alignment block 3 until it aligns with the chip pins placed on the working position 101 of the fixed test platform 1. After the test, the downward pressure of the first drive mechanism 5 is removed, and the reset torsion spring 12 and the compression spring 1303 jointly drive the base 11 and related components to rise and reset as a whole. This solution ensures that the pin alignment block 3 can be reset to its initial height and horizontal position after each test through the combination of the reset torsion spring 12 and the compression spring 1303; combined with the independent control of the alignment block by the linear drive mechanism 15, the automation level of the fixture is further improved.

[0055] More preferably, the pin calibration block 3 is provided with multiple clearance through holes 16, through which the transmission rod 14 passes and connects to the probe 4. In this design, the transmission rod 14 passes through the clearance through holes 16 of the calibration block and is directly rigidly connected to the probe 4, making it both a power transmission rod and an electrical conduction path. This not only avoids the complex internal wiring in traditional designs and prevents signal attenuation or unstable contact caused by cable bending and friction, but also simplifies the internal structure of the block and improves space utilization efficiency. It also enhances the response speed and positioning repeatability of the probe 4, providing a more reliable hardware foundation for high-precision testing, reducing potential failure points, and improving the overall reliability of the system.

[0056] More preferably, a second elastic element 17 is provided between the probe 4 and the transmission rod 14. The two ends of the second elastic element 17 are connected to the probe 4 and the transmission rod 14 respectively, so that the probe 4 has a tendency to move away from the transmission rod 14. In this scheme, the addition of a second elastic element 17 between the probe 4 and the transmission rod 14 provides the probe 4 with an independent floating buffer and pressure control mechanism. When the transmission rod 14 drives the probe 4 to press down, the elastic element is compressed, and the resulting reaction force provides a controllable and compliant contact pressure for the tip of the probe 4, thereby effectively avoiding excessive pressure damage caused by positioning errors in the transmission system or slight differences in pin height. This elastic connection not only protects the chip pins and the probe 4 itself, but also ensures that even with slight vibrations or flatness deviations during testing, the probe 4 can maintain stable and reliable physical contact with the pins, thereby improving the stability of the electrical connection and the safety of the testing process.

[0057] A chip testing method for rapid positioning and clamping, comprising a rapid positioning chip testing fixture as described in any one of claims 1-9, including the following steps:

[0058] Place the chip in the working position 101 and start the positioning mechanism 2 to position the chip.

[0059] Drive the pin correction block 3 to move closer to the working position 101 relative to the test platform 1;

[0060] The first driving mechanism 5 is activated, which drives the pin correction block 3 to move closer to the working position 101 relative to the test platform 1, so that the pin correction block 3 presses and corrects the pins of the chip under test, while the probe 4 makes conductive contact with the pins of the chip under test for electrical testing.

[0061] In the step of placing the chip at the working position 101 and activating the positioning mechanism 2 to position the chip, the robotic arm or operator places the chip under test in the preset bearing area (working position 101) of the test platform 1. The positioning mechanism 2 is then activated, and its moving parts (such as pneumatic grippers, positioning pins, or vacuum holding units) apply a constraint force to the chip, ensuring its precise positioning in the horizontal plane and eliminating initial positional deviations caused by placement. The positioning action should ensure that the chip is securely constrained without excessive stress to prevent mechanical damage to the pins during the positioning stage. For chips of different package sizes, the positioning mechanism 2 must have corresponding adjustment or adaptive capabilities.

[0062] In the step of driving the pin calibration block 3 closer to the working position 101 relative to the test platform 1, the driving source of the pin calibration block 3 (which can be a manual, pneumatic, or electric device independent of the first driving mechanism 5) is activated, causing the pin calibration block 3 to move from the initial standby position to a preparatory position directly above the chip pins, preparing for subsequent calibration and testing. Under this drive, the pin calibration block 3 (when at least two blocks are set) can slightly abut against the opposite ends of the chip to further calibrate the chip position. It is worth noting that the preparatory position needs to be preset according to the chip thickness and pin height to ensure a safe gap between the bottom surface of the block and the top of the pin.

[0063] In the step of activating the first driving mechanism 5, which drives the pin alignment block 3 to move closer to the working position 101 relative to the test platform 1, so that the pin alignment block 3 presses and aligns the pins of the chip under test, and simultaneously makes the probe 4 electrically contact the pins of the chip under test for electrical testing, the first driving mechanism 5 is activated, driving the pin alignment block 3 to perform the final downward movement. The bottom surface of the block first contacts the pin, and relies on its structure (such as a flat bottom surface or a separate component) to mechanically shape and correct the bent or offset pins. As the driving stroke continues, the probe 4 mounted on the block then establishes a stable electrical contact with the aligned pin, and the test system synchronously begins electrical performance testing. The downward stroke and pressure need to be precisely controlled to sufficiently correct pin deformation but avoid damage to the pins or the chip body. The timing sequence of the alignment and electrical contact actions should be reliable, ensuring that the probe 4 only contacts the pin after alignment is completed. During the test, the driving mechanism needs to be kept stable to maintain a constant contact pressure.

[0064] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0066] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip testing fixture for rapid positioning, characterized in that, include: Test platform (1), the test platform (1) has a working position (101) for placing the chip under test. Positioning mechanism (2), the positioning mechanism (2) is used to position the chip under test to the working position (101). Pin calibration block (3) is movably connected to the test platform (1) so as to be able to approach the working position (101) relative to the test platform (1) and press the pins of the chip under test, and to be able to move away from the working position (101) relative to the test platform (1) to release the pins of the chip under test; Probe (4), the probe (4) is mounted on the pin correction block (3); The first driving mechanism (5) drives the pin calibration block (3) and drives the pin calibration block (3) to move closer to or away from the working position (101) so that the probe (4) conductively contacts the pin of the chip under test when the pin calibration block (3) is close to the working position (101) and disengages from the pin of the chip under test when the pin calibration block (3) is away from the working position (101).

2. The chip testing fixture for rapid positioning according to claim 1, characterized in that, The pin correction block (3) is provided with a correction slope (301). The horizontal height of the end of the correction slope (301) away from the working position (101) is greater than the horizontal height of the end of the correction slope (301) close to the working position (101). The driving end of the first driving mechanism (5) can abut against the correction slope (301) so that it can slide along the tilt direction of the correction slope (301) and drive the pin correction block (3) to move closer to or away from the working position (101).

3. The chip testing fixture for rapid positioning according to claim 2, characterized in that, The first drive mechanism (5) is also connected to a drive roller (6), which is used to abut against the correction slope (301).

4. The chip testing fixture for rapid positioning according to claim 3, characterized in that, The pin correction pressure block (3) is provided in at least two pieces, and the two pin correction pressure blocks (3) are arranged symmetrically; The first driving mechanism (5) further includes a driving plate (501), and the driving roller (6) is provided with at least two, both of which are connected to the driving plate (501). Each pin correction block (3) has at least one driving roller (6) that abuts against the corresponding correction slope (301) so as to drive the corresponding pin correction block (3) to move closer to or away from the working position (101).

5. A chip testing fixture for rapid positioning according to claim 1, characterized in that, The pin calibration block (3) is also connected to a plurality of pin separation components (7). The pin separation components (7) are located on the side of the pin calibration block (3) close to the test platform (1) and are linearly distributed. Each pin separation component (7) can be inserted into the gap between two adjacent chip pins and move with the pin calibration block (3).

6. A chip testing fixture for rapid positioning according to claim 5, characterized in that, The pin alignment block (3) is provided with multiple mounting cavities (302); one of the pin separation components (7) is located in one of the mounting cavities (302) and extends from the mounting cavity (302) to the external environment; one end of one of the pin separation components (7) is hinged to the corresponding mounting cavity (302), and the other end is connected to the mounting cavity (302) through a first elastic member (8), so that one end of one of the pin separation components (7) has a tendency to move away from the corresponding mounting cavity (302).

7. A chip testing fixture for rapid positioning according to claim 1, characterized in that, The chip testing fixture for rapid positioning also includes a first link (9), a second link (10), a base (11), a reset torsion spring (12), a height reset mechanism (13), a transmission rod (14), and a linear drive mechanism (15). One end of the first connecting rod (9) is hinged to the test platform (1), and the other end of the first connecting rod (9) is hinged to one end of the second connecting rod (10). The other end of the second connecting rod (10) is connected to the base (11), and the base (11) and the test platform (1) are spaced apart. The two ends of the reset torsion spring (12) are respectively connected to the first connecting rod (9) and the test platform (1) so that the first connecting rod (9) maintains a preset angle. The height reset mechanism (13) includes a sliding block (1301), a guide rod (1302), and a compression spring (1303). The sliding block (1301) is located between the base (11) and the test platform (1) and is slidably connected to the test platform (1). One end of the guide rod (1302) is connected to the sliding block (1301). The other end of the guide rod (1302) passes through the test platform (1) and is slidably connected to the test platform (1). The two ends of the compression spring (1303) are respectively connected to the base (11) and the sliding block (1301) so that the sliding block (1301) and the base (11) have a tendency to move away from each other. The linear drive mechanism (15) is mounted on the base (11) and is driven to the pin correction block (3) via the transmission rod (14) to drive the pin correction block (3) to move closer to or away from the working position (101).

8. A chip testing fixture for rapid positioning according to claim 7, characterized in that, The pin correction block (3) is provided with multiple clearance through holes (16), the transmission rod (14) passes through the clearance through holes (16) and is connected to the probe (4).

9. A chip testing fixture for rapid positioning according to claim 8, characterized in that, A second elastic element (17) is provided between the probe (4) and the transmission rod (14). The two ends of the second elastic element (17) are respectively connected to the probe (4) and the transmission rod (14) so ​​that the probe (4) has a tendency to move away from the transmission rod (14).

10. A chip testing method for rapid positioning and clamping, comprising a chip testing fixture for rapid positioning as described in any one of claims 1-9, characterized in that, Includes the following steps: Place the chip in the working position (101) and start the positioning mechanism (2) to position the chip; Drive the pin correction block (3) to move closer to the working position (101) relative to the test platform (1). The first driving mechanism (5) is activated, which drives the pin correction block (3) to move closer to the working position (101) relative to the test platform (1), so that the pin correction block (3) presses and corrects the pins of the chip under test, and at the same time the probe (4) makes conductive contact with the pins of the chip under test for electrical testing.

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