Electronic device

Abstract

An electronic device, comprising a middle frame assembly (2), a display screen (1), a rear housing assembly (3), and a conductive film (4). The middle frame assembly (2) comprises a middle-frame conductor (202); the display screen (1) is connected to an adhesive-dispensing platform surface (201) of the middle frame assembly (2); the rear housing assembly (3) is connected to the middle frame assembly (2) and is arranged opposite the display screen (1); the rear housing assembly (3) is provided with a rear-housing radiator (5); and the conductive film (4) is supported on the display screen (1) and is electrically connected to the middle-frame conductor (202). By means of arranging the rear-housing radiator (5) on the rear housing assembly (3) and electrically connecting the conductive film (4) supported on the display screen (1) to the middle-frame conductor (202), the clearance area of an antenna is formed at the junction of the middle frame assembly (2) and the rear housing assembly (3), thereby laying a foundation for increasing the screen-to-body ratio and reducing screen bezels.

Description

electronic devices

[0001] This application claims priority to Chinese patent application filed on December 19, 2024, with application number 202411899606.3 and entitled "Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic product technology, and in particular to an electronic device. Background Technology

[0003] The display screen consists of a screen cover and a display component. In common watch designs, the display component does not overlap with the adhesive dispensing platform of the watch frame, resulting in a relatively large black border around the screen. However, if the display component were to overlap with the adhesive dispensing platform, it would reduce the clearance area for the antenna, thus degrading antenna performance. Summary of the Invention

[0004] This application provides an electronic device that can reduce the black border of the screen without causing a deterioration in antenna performance.

[0005] The technical solution is as follows:

[0006] The first aspect of this application provides an electronic device, comprising:

[0007] Mid-frame assembly, including mid-frame conductor;

[0008] The display screen is attached to the dispensing table of the mid-frame assembly;

[0009] The rear shell assembly is connected to the mid-frame assembly and positioned opposite the display screen; a rear shell radiator is provided on the rear shell assembly.

[0010] A conductive film is supported on the display screen and electrically connected to the conductive body in the middle frame.

[0011] In this application, a rear shell radiator is provided on the rear shell assembly, and a conductive film supported on the display screen is electrically connected to the conductive body of the middle frame, so that the clear area of ​​the antenna is formed at the connection between the middle frame assembly and the rear shell assembly, which provides a premise for increasing the screen ratio and reducing the black border of the screen.

[0012] In some implementations, the display screen includes a screen cover and a display component, with the display component disposed on the inner side of the screen cover and the circumferential edge of the display component stacked with the dispensing platform along the thickness direction of the electronic device.

[0013] In this implementation, by setting the circumferential edge of the display component to be stacked with the dispensing table surface along the thickness direction of the electronic device, the black border of the screen can be reduced and the screen ratio increased.

[0014] In some implementations, the conductive film is attached to the inner surface of the display screen.

[0015] In this implementation, a conductive film is attached to the inner side of the display component to facilitate connection between the conductive film and the conductive body of the middle frame.

[0016] In some implementations, the display screen includes a flexible circuit board with a conductive film integrated on it.

[0017] In this implementation, by embedding a conductive film on the substrate layer of the flexible circuit board, the efficiency of electronic device assembly can be improved.

[0018] In some implementations, the conductive film is a copper foil, a conductive cloth, a polymer film containing a metal coating, a composite film containing a copper foil, or a composite film containing a conductive cloth.

[0019] In this implementation, the conductive film can be of various types, providing more options for the conductive film layer, so as to select the appropriate type of conductive film according to the design requirements.

[0020] In some implementations, the thickness of the conductive film ranges from 0.02 mm to 0.1 mm.

[0021] In this implementation, the thickness of the conductive film is set to be between 0.02mm and 0.1mm to avoid the conductive film being too thick, which would increase the thickness of the electronic device, and to avoid the conductive film being too thin, which would reduce its strength.

[0022] In some implementations, the conductive film covers 45% to 95% of the inner surface of the display screen.

[0023] In some implementations, the conductive film includes a film body and a raised portion. The raised portion is connected to the film body and is raised to the side away from the display screen. The raised portion is electrically connected to the conductive body of the middle frame.

[0024] In this implementation, the conductive film includes a film body and a raised portion, so that an electrical connection position can be formed between the raised portion and the middle frame assembly based on the shape of the middle frame assembly.

[0025] In some implementations, the mid-frame assembly also includes a non-conductive mid-frame body, which is connected to the conductive mid-frame body; the area on the mid-frame assembly that is electrically connected to the conductive film is called the mid-frame electrical connection area.

[0026] One or more electrical connection regions are formed on the middle frame conductor; and / or,

[0027] The mid-frame assembly also includes one or more built-in conductive sheets disposed in the non-conductive body of the mid-frame, with one end of the built-in conductive sheet connected to the conductive body of the mid-frame and the other end forming the electrical connection area of ​​the mid-frame.

[0028] In this implementation, one or more electrical connection areas are formed on the middle frame conductor, which facilitates electrical connection with the conductive film. When it is necessary to increase the number of electrical connection points between the conductive film and the middle frame assembly, or when it is inconvenient for the middle frame conductor to be electrically connected with the conductive film, an internal conductive sheet can be set in the non-conductive body of the middle frame. One end of the internal conductive sheet is connected to the middle frame conductor, and the other end forms the middle frame electrical connection area.

[0029] In some implementations, the conductive body of the middle frame is integrally injection molded with the non-conductive body of the middle frame after processing and forming, and at least the conductive body of the middle frame has an electrical connection area formed on the middle frame.

[0030] In this implementation, by integrally injection molding the non-conductive middle frame onto the conductive middle frame, it is convenient to manufacture non-conductive middle frames with complex shapes, and it is also beneficial to form a middle frame electrical connection area on the conductive middle frame.

[0031] In some implementations, the conductive body and the non-conductive body of the middle frame are processed and then spliced ​​together, and the non-conductive body of the middle frame and the built-in conductive sheet are formed by insert injection molding.

[0032] In this implementation, the method of splicing the conductive body and the non-conductive body of the middle frame together usually makes it difficult to form an electrical connection area on the conductive body of the middle frame. Therefore, it is necessary to set an embedded conductive sheet in the non-conductive body of the middle frame. The non-conductive body of the middle frame and the embedded conductive sheet are integrally injection molded as inserts, which avoids complex assembly processes.

[0033] In some implementations, the electrical connection area of ​​the middle frame and the conductive film are electrically connected through a conductive material or through a conductive component; or the conductive film is pressed onto the conductive body of the middle frame by an elastic element to achieve electrical connection between the conductive film and the conductive body of the middle frame.

[0034] In this implementation, there are multiple electrical connection methods between the electrical connection area of ​​the middle frame and the direct connection area, and the appropriate connection method can be selected according to the specific design of the electronic device.

[0035] In some implementations, the conductive film is connected to the electrical connection area of ​​the middle frame via conductive foam.

[0036] Conductive foam includes a foam substrate and conductive double-sided adhesive applied to the foam substrate; or,

[0037] Conductive foam includes a foam substrate and an adhesive layer disposed on one side of the foam substrate, wherein the area of ​​the adhesive layer is smaller than the area of ​​the foam substrate; or,

[0038] The conductive foam includes a foam substrate, an outer conductive layer, and double-sided adhesive. The outer conductive layer is wrapped around the foam substrate, and the double-sided adhesive is applied to the areas of the foam substrate not covered by the outer conductive layer.

[0039] This implementation provides three conductive foam structures, allowing you to choose the appropriate conductive foam based on cost and the resistance requirements of the connection between the electrical connection area and the direct connection area of ​​the middle frame.

[0040] In some implementations, a direct connection area is formed on the conductive film, and the direct connection area is electrically connected to the electrical connection area of ​​the middle frame.

[0041] In this implementation, the number of components can be reduced by setting a direct connection area and an electrical connection area between the middle frame and the direct connection area.

[0042] In some implementations, the direct connection region is in the shape of a ring; or, there is more than one direct connection region, and the direct connection region is in the shape of a strip.

[0043] This implementation provides two shapes for the direct connection area: one based on the structure of the middle frame component, which allows for a reasonable setting of the connection area between the conductive film and the middle frame component.

[0044] In some implementations, the electronic device also includes a screen dispensing pad, with the electrical connection portion between the direct connection area and the electrical connection area of ​​the mid-frame arranged along the circumferential direction of the screen dispensing pad.

[0045] In this implementation, by setting the part where the direct connection area is electrically connected to the conductive body of the middle frame and the screen dispensing pad is set along the circumferential direction of the dispensing platform, the width of the dispensing platform can be reduced, which in turn can reduce the width of the cross-section of the middle frame component, so as to increase the size of the battery in the electronic device and improve the battery's battery life.

[0046] In some implementations, an indirect connection region is formed on the conductive film, and the electronic device also includes an intermediate conductive sheet disposed on the electrical connection region of the middle frame, and the indirect connection region is connected to the electrical connection region of the middle frame through the intermediate conductive sheet.

[0047] In this implementation, an intermediate conductive sheet is provided so that the indirect connection area can be electrically connected to the electrical connection area of ​​the middle frame through the intermediate conductive sheet.

[0048] In some implementations, the intermediate conductive sheet is a copper foil, a steel sheet, a conductive cloth, a polymer film or composite film containing a metal coating, or a printed conductive silver paste coating.

[0049] In this implementation, multiple types of intermediate conductive sheets can be provided, offering more options for selecting the appropriate type of intermediate conductive sheet according to design requirements.

[0050] In some implementations, the thickness of the intermediate conductive sheet ranges from 0.01 mm to 0.2 mm.

[0051] In this implementation, by setting the thickness range of the intermediate conductive sheet to 0.02mm to 0.1mm, the thickness of the intermediate conductive sheet is set to avoid increasing the thickness of the electronic device if it is too large, and to avoid reducing the strength of the intermediate conductive sheet if it is too small.

[0052] In some implementations, the electronic device also includes a welding plate, on which one or more welding plates are superimposed on the side of the intermediate conductive sheet opposite to the electrical connection area of ​​the middle frame, and the welding plate and the intermediate conductive sheet are welded to the electrical connection area of ​​the middle frame.

[0053] In this implementation, a welding plate is stacked on the intermediate conductive sheet to increase the welding thickness and minimize the possibility of welding defects.

[0054] In some implementations, the intermediate conductive sheet is a copper foil, and the thickness of the intermediate conductive sheet ranges from 0.02 mm to 0.07 mm.

[0055] In this implementation, the copper foil with a thickness of 0.02mm to 0.07mm is relatively soft and deformable, and can be attached to the bottom support in a conformal manner to facilitate the connection between the middle conductive sheet and the electrical connection area of ​​the middle frame and the conductive film.

[0056] In some implementations, the intermediate conductive sheet extends out of the middle frame assembly in the direction of the central axis of the middle frame assembly, and the area of ​​the intermediate conductive sheet extending out of the middle frame assembly is supported on the battery of the electronic device.

[0057] In this implementation, the area where the battery-supported intermediate conductive sheet extends out of the middle frame assembly is set to facilitate a stable electrical connection between the intermediate conductive sheet and the conductive film.

[0058] In some implementations, the intermediate conductive sheet extends out of the middle frame assembly in the direction of the central axis of the middle frame assembly, and a reinforcing sheet is provided on at least one side of the plate surface of the intermediate conductive sheet.

[0059] In this implementation, a reinforcing sheet is provided on the intermediate conductive sheet to increase the strength of the intermediate conductive sheet and prevent it from being scratched or torn during assembly. Attached Figure Description

[0060] Figure 1 is a cross-sectional view of a watch in the prior art;

[0061] Figure 2 is another cross-sectional view of a watch in the existing related art;

[0062] Figure 3 is a schematic diagram of the structure of the dial provided in an embodiment of this application;

[0063] Figure 4 is an exploded view of the dial provided in an embodiment of this application;

[0064] Figure 5 is a simplified cross-sectional view of the mid-frame assembly, display screen, and rear shell assembly provided in an embodiment of this application;

[0065] Figure 6 is an exploded view of the conductive film and display screen provided in the embodiment of this application;

[0066] Figure 7 is a structural schematic diagram of the mid-frame component provided in an embodiment of this application;

[0067] Figure 8 is a partial cross-sectional view of the dial provided in an embodiment of this application;

[0068] Figure 9 is a partial cross-sectional schematic diagram of the electrical connection area of ​​the middle frame and the direct connection area provided in the embodiment of this application, which are electrically connected by foam.

[0069] Figure 10 is a partial cross-sectional schematic diagram of the electrical connection area of ​​the middle frame and the direct connection area provided in the embodiment of this application, which are electrically connected by conductive foam.

[0070] Figure 11 is a partial cross-sectional view of an embodiment of this application, showing that when the conductive film is integrated on a flexible circuit board, it is connected to the electrical connection area of ​​the middle frame through conductive foam.

[0071] Figure 12 is a cross-sectional schematic diagram of the conductive foam provided in the embodiment of this application;

[0072] Figure 13 is a schematic diagram showing the positional relationship between the mid-frame assembly, the display screen, and the conductive film provided in an embodiment of this application.

[0073] Figure 14 is a schematic diagram of the structure of the conductive film provided in an embodiment of this application;

[0074] Figure 15 is a cross-sectional schematic diagram showing the connection between the raised portion and the conductive body of the middle frame provided in an embodiment of this application;

[0075] Figure 16 is an exploded view of the mid-frame assembly provided in an embodiment of this application;

[0076] Figure 17 is a schematic diagram of the structure of the mid-frame assembly provided in the embodiment of this application, which is provided with a glue frame and a screen adhesive pad.

[0077] Figure 18 is a structural schematic diagram of the main body of the dial provided in an embodiment of this application;

[0078] Figure 19 is an exploded view of the conductive film and the main body of the dial provided in the embodiment of this application;

[0079] Figure 20 is a cross-sectional schematic diagram showing the connection between the intermediate conductive sheet and the conductive film provided in the embodiment of this application;

[0080] Figure 21 is another cross-sectional view of the connection between the intermediate conductive sheet and the conductive film provided in the embodiment of this application.

[0081] The meanings of the various symbols in the attached diagrams are as follows: 100, dial; 1, display screen; 2, mid-frame assembly; 3, back shell assembly; 4, conductive film; 5, back shell radiator; 6, conductive foam; 7, foam; 8, intermediate conductive sheet; 9, welding plate; 10, reinforcing sheet; 11, battery; 12, elastic buffer pad; 13, screen adhesive pad; 14, adhesive layer; 101, screen cover; 102, display assembly; 1021, flexible circuit board; 201, adhesive dispensing platform; 202, mid-frame conductor; 203, mid-frame non-conductive body; 204, mid-frame electrical connection area; 205, built-in conductive sheet; 206, colloid; 207, circumferential inner side; 2021, conductive main body; 2022, support plate; 2031, upper side of mid-frame non-conductive body; 2041, First middle frame electrical connection area; 2042, Second middle frame electrical connection area; 2043, Third middle frame electrical connection area; 2044, Fourth middle frame electrical connection area; 2045, Fifth middle frame electrical connection area; 2051, Conductive connection area; 401, Direct connection area; 402, Indirect connection area; 403, Diaphragm body; 404, Raised portion; 4021, First indirect connection area; 4022, Second indirect connection area; 4023, Third indirect connection area; 4024, Fourth indirect connection area; 4041, Arc-shaped bending section; 4042, Connecting section; 601, Foam substrate; 602, Adhesive layer; 603, Outer conductive layer; 604, Intermediate adhesive layer; 6011, Adhesive layer side; 701, Foam body; 702, Foam adhesive layer; 801, First intermediate conductive sheet; 802, Second intermediate conductive sheet; 803, Third intermediate conductive sheet; 804, Fourth intermediate conductive sheet. Detailed Implementation

[0082] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings. The embodiments described with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0083] In the description of this application, it should be understood that the terms "length", "width", "thickness", "top", "bottom", "inner", "outer", "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0084] To facilitate a clear description of the technical solutions of this application, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" do not necessarily imply that they are different.

[0085] In this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0086] In this application, "and / or" is merely a way of describing the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0087] In this application, "one or more layers" refers to a situation that includes one layer.

[0088] It should be noted that, in this application, the words "in one embodiment," "exemplarily," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "in one embodiment," "exemplarily," or "for example" should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of words such as "in one embodiment," "exemplarily," and "for example" is intended to present the relevant concepts in a specific manner.

[0089] Before providing a detailed explanation of the electronic devices provided in the embodiments of this application, the existing related technologies and scenarios will be described first.

[0090] Screen-to-body ratio and antenna performance are two important characteristics of electronic devices. Screen-to-body ratio usually refers to the ratio of the display area to the overall size of the device, while antenna performance usually refers to the antenna's ability to receive and radiate radio waves. Taking a watch as an example, please refer to Figures 1 and 2, which show cross-sectional views of the display screen 1, the mid-frame assembly 2, and the back cover assembly 3 in a watch.

[0091] The watch includes a display screen 1, a mid-frame assembly 2, and a back cover assembly 3, with the display screen 1 and back cover assembly 3 connected to the mid-frame assembly 2. The display screen 1 includes a screen cover 101 and a display component 102, with the display component 102 disposed on the inner side of the screen cover 101.

[0092] Please refer to Figure 1. A dispensing platform 201 is formed on the middle frame component 2. The screen cover 101 is located above the dispensing platform 201 in Figure 1. The display component 102 is not located above the dispensing platform 201 in Figure 1. The black border of the screen refers to the black area around the display screen 1. The length of the black border of the screen is shown as L1 in Figure 1.

[0093] In the field of antennas, "clearance" refers to the sufficient space reserved around the antenna radiator to enable it to effectively transmit and receive electromagnetic waves. In the example of Figure 1, the gap between the metal part of the mid-frame assembly 2 and the display assembly 102 forms a clearance area, through which the watch's antenna can radiate signals. Figure 1 provides a simplified illustration of electromagnetic wave transmission through the clearance area.

[0094] Please refer to Figure 2. The screen cover plate 101 is located above the dispensing platform 201 in Figure 2. The edge of the display component 102 along the circumferential direction is also located above the dispensing platform 201 in Figure 2. As the distance between the edge of the display component 102 and the circumferential edge of the screen cover plate 101 decreases, the black border of the screen will also decrease. Please refer to Figure 2, which shows that the length of the black border of the screen is L2. It can be seen that L2 is less than L1.

[0095] While the black border of the screen can be reduced as shown in Figure 2, it will reduce the clearance between the metal part of the mid-frame component 2 and the display component 102, which will in turn degrade the antenna performance.

[0096] Based on the above problems, this embodiment provides an electronic device. By setting a rear shell radiator on the rear shell assembly and setting a conductive film supported on the display screen and electrically connected to the middle frame conductor, the clear area of ​​the antenna is formed at the connection between the middle frame assembly and the rear shell assembly, which provides a premise for increasing the screen ratio and reducing the black border of the screen.

[0097] The electronic device provided in this embodiment will be described in detail below with reference to the accompanying drawings.

[0098] The electronic device provided in this embodiment may also be referred to as a mobile device, terminal device, mobile terminal, or terminal. This electronic device includes, but is not limited to, mobile phones, laptops, tablet computers, laptop computers, personal digital assistants (PDAs), wearable devices (such as watches, wristbands, etc.), and other electronic devices that require high screen-to-body ratio and antenna performance. For the purpose of more conveniently illustrating the electronic device provided in this application embodiment, and as an example rather than a limitation, the technical solution of this application will be described in detail below using a watch as an example.

[0099] Please refer to Figures 3-5. Figure 3 is a schematic diagram of the external structure of the dial 100 provided in this embodiment. Figure 4 is an exploded view of the dial 100 provided in this embodiment. Figure 5 is a simplified cross-sectional view of the display screen 1, the middle frame assembly 2, and the back cover assembly 3 provided in this embodiment. Figure 6 is an exploded view of the conductive film 4 and the display screen 1 provided in this embodiment. For ease of description, in this embodiment, the width direction of the dial 100 is defined as the X-axis direction, the length direction of the dial 100 is defined as the Y-axis direction, and the thickness direction of the dial 100 is defined as the Z-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are all perpendicular to each other.

[0100] The electronic device provided in this application embodiment includes a watch face 100 and a watch strap. The watch face 100, also known as the watch head, is the main body of the watch. The watch strap typically consists of two parts, connected to opposite sides of the watch face 100, which work together to wear the watch on the user's wrist.

[0101] Please refer to Figure 4. The electronic device, namely the dial 100, provided in this embodiment includes a display screen 1, a mid-frame assembly 2, and a back cover assembly 3. The display screen 1 and the back cover assembly 3 are connected to the mid-frame assembly 2 and are arranged opposite to each other. The interior of the display screen 1, the mid-frame assembly 2, and the back cover assembly 3 forms a receiving cavity, which can be used to accommodate electronic components such as speakers, motherboards, cameras, microphones, sensors, and batteries 11.

[0102] Among them, the display screen 1 may be, but is not limited to, an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MOLED) display screen, a quantum dot light-emitting diode (QLED) display screen, etc.

[0103] Please refer to Figure 4. The mid-frame assembly 2 includes a mid-frame conductor 202, which can serve as an exterior finish to enhance the aesthetics of the electronic device.

[0104] In one example, the mid-frame conductor 202 is formed using processes such as MIM (Metal Powder Injection Molding Technology), CNC (Computer Numerical Control), forging, stamping, PDS (Printing Direct Structure), and LDS (Laser-Direct-structuring).

[0105] In one example, referring to Figure 4, the middle frame assembly 2 also includes a middle frame non-conductive body 203, which can be made of plastic. In one specific example, the middle frame conductive body 202 is integrally injection molded with the inner middle frame non-conductive body 203 after being formed by CNC, MIMM, or forging; in other specific examples, the middle frame non-conductive body 203 is made of metal material through processes such as CNC, MIMM, or forging, and the middle frame non-conductive body 203 is fixed to the middle frame conductive body 202.

[0106] Please refer to Figure 5. The electronic device provided in this embodiment also includes a conductive film 4, which is supported on the display screen 1 and electrically connected to the mid-frame conductor 202.

[0107] Specifically, the conductive film 4 is a thin film or composite film with conductive properties. In one example, the conductive film 4 is disposed on the inner side of the display assembly 102, and in other examples, the conductive film 4 is integrated on the flexible printed circuit board (FPC) 1021 of the display assembly 102.

[0108] In this embodiment, the conductive film 4 is electrically connected to the middle frame conductor 202. The electrical connection between the two forms a shielding effect, so that the connection position between the middle frame assembly 2 and the display screen 1 cannot be used as a clearance area for the antenna.

[0109] Please refer to Figure 5. The electronic device provided in this embodiment also includes a rear shell radiator 5, which is disposed on the rear shell assembly 3.

[0110] In one example, the rear shell radiator 5 is glued, welded, or embedded in the rear shell assembly 3. The size of the rear shell radiator 5 is not specifically limited in this embodiment, as long as a good clearance area is formed at the connection between the middle frame assembly 2 and the rear shell assembly 3. Please refer to Figure 5, which simply illustrates the outward emission of electromagnetic waves through the clearance area.

[0111] In this embodiment, a rear shell radiator 5 is provided on the rear shell assembly 3, and a conductive film 4 supported on the display screen 1 is electrically connected to the middle frame conductor 202, so that the antenna clearance area is formed at the connection between the middle frame assembly 2 and the rear shell assembly 3, which provides a premise for increasing the screen ratio and reducing the black border of the screen.

[0112] For example, please refer to Figure 5. The circumferential edge of the display component 102 is stacked with the dispensing platform 201 along the thickness direction of the dial 100, i.e., the Z-axis direction in Figure 5, in order to reduce the black border of the screen and increase the screen ratio.

[0113] Specifically, please refer to Figure 5. There is a gap between the dispensing platform 201 and the inner side of the screen cover plate 101 and the inner side of the display component 102. Along the X-axis direction in Figure 5, the middle frame component 2 is directly opposite the free end of the screen cover plate 101 and the display component 102 to form a circumferential side 207. The screen cover plate 101 and the display component 102 are sealed and connected to the dispensing platform 201 and the circumferential side 207 by the adhesive 206.

[0114] In one example, as shown in Figure 4, a screen dispensing pad 13 is also provided on the dispensing platform 201. Multiple screen dispensing pads 13 are distributed at intervals along the circumferential direction of the dispensing platform 201, and the display component 102 is supported on the screen dispensing pads 13.

[0115] Additionally, it should be noted that when the circumferential edge of the display component 102 is not stacked with the dispensing platform 201 along the thickness direction of the watch, the solution provided in this embodiment, which has a rear shell radiator 5 on the rear shell component 3, a conductive film 4 supported on the display screen 1, and an electrical connection between the conductive film 4 and the middle frame conductor 202, can still be used, so that the clearance area of ​​the antenna is formed at the connection between the middle frame component 2 and the rear shell component 3.

[0116] As described in one example above, the conductive film 4 is disposed on the inner side of the display component 102. In a specific example, the conductive film 4 is attached to the inner side of the display component 102.

[0117] Specifically, the shape of the conductive film 4 matches the shape of the inner side of the display component 102, and the conductive film 4 is attached to the inner side of the display component 102.

[0118] Please refer to Figure 6, which is an exploded view of the conductive film 4 and the display assembly 102. The conductive film 4 is located on one side of the inner surface of the display assembly 102. The display assembly 102 includes a flexible circuit board 1021, and the conductive film 4 is attached to the flexible circuit board 1021.

[0119] In this embodiment, by attaching the conductive film 4 to the inner side of the display component 102, it is convenient for the conductive film 4 to be connected to the middle frame conductor 202.

[0120] As described in one example above, the conductive film 4 is integrated on the flexible circuit board 1021 of the display component 102. In a specific example, the conductive film 4 is embedded in the substrate layer of the flexible circuit board 1021.

[0121] Typically, a flexible circuit board 1021 includes a substrate layer, a conductive layer, a cover layer, and an adhesive layer. The substrate layer is usually made of a polymer material with good flexibility. The substrate layer is the foundation of the entire flexible circuit board 1021, providing support for other functional layers. The conductive layer is mainly composed of metallic materials, most commonly copper foil. During the fabrication of the flexible circuit board 1021, the copper foil is bonded to the substrate layer using adhesives or by direct lamination, and various circuit patterns are formed on the conductive layer through processes such as etching. The cover layer is mainly used to protect the conductive layer and circuit lines from damage caused by the external environment. The adhesive layer is used to firmly bond the various layers together.

[0122] In this embodiment, the conductive film 4 is embedded in the substrate layer of the flexible circuit board 1021, and a portion of the conductive film 4 is exposed outside the substrate layer for electrical connection with the middle frame conductor 202.

[0123] In this embodiment, by setting the conductive film 4 to be embedded on the substrate layer of the flexible circuit board 1021, the efficiency of electronic device assembly can be improved.

[0124] Regarding the conductive film 4, in one embodiment, the conductive film 4 includes, but is not limited to, copper foil, conductive cloth, polymer film containing metal coating, composite film containing copper foil, or composite film containing conductive cloth.

[0125] For composite films containing copper foil, for example, in one example, the composite film has a three-layer structure with a polymer substrate in the middle and copper foil on both sides; in other examples, the composite film has a two-layer structure with a polymer substrate and copper foil on the two sides respectively.

[0126] For example, when the conductive film 4 is embedded on the substrate layer of the flexible circuit board 1021, the conductive film 4 is preferably copper foil; for example, when the conductive film 4 is pasted on the inner side of the display component 102, the conductive film 4 is preferably conductive cloth or a polymer film containing metal coating or a composite film containing copper foil or a composite film containing conductive cloth.

[0127] In this embodiment, the conductive film 4 can be of various types, providing more options for the conductive film layer, so as to select the appropriate type of conductive film 4 according to the design requirements.

[0128] Regarding the conductive film 4, in one embodiment, the thickness of the conductive film 4 ranges from 0.02 mm to 0.1 mm.

[0129] Please refer to Figure 5. The conductive film 4 and the display screen 1 are arranged along the Z-axis, i.e., the thickness direction of the dial 100. Therefore, when the thickness of the conductive film 4 is relatively too large, it will increase the thickness of the dial 100, which is not conducive to the thinning design of electronic devices; when the thickness of the conductive film 4 is relatively too small, the strength of the conductive film 4 will decrease, and it will be easy to tear. Therefore, the thickness range of the conductive film 4 is preferably 0.02mm to 0.1mm.

[0130] The thickness of the conductive film 4 ranges from 0.02 mm to 0.1 mm. For example, the thickness of the conductive film 4 can be 0.02 mm, 0.05 mm, 0.07 mm, 0.09 mm, 0.1 mm, etc.

[0131] For example, when the conductive film 4 is embedded on the substrate layer of the flexible circuit board 1021, the thickness of the conductive film 4 can be designed to be relatively small due to the protection of the substrate layer of the flexible circuit board 1021; when the conductive film 4 is pasted on the inner side of the display component 102, the thickness of the conductive film 4 can be designed to be relatively large.

[0132] In this embodiment, by setting the thickness range of the conductive film 4 to 0.02mm to 0.1mm, it is possible to avoid the conductive film 4 being too thick, which would increase the thickness of the electronic device, and to avoid the conductive film 4 being too thin, which would reduce its strength.

[0133] Regarding the conductive film 4, in one embodiment, the conductive film 4 covers 45% to 95% of the inner side surface of the display screen 1.

[0134] For example, conductive film 4 covers 45%, 50%, 60%, 70%, 80%, 90%, and 95% of the inner side of display screen 1, etc.

[0135] In this embodiment, the area of ​​the conductive film 4 covering the inner side of the display screen 1 can be reasonably set according to the design requirements.

[0136] Please refer to Figures 7 and 8. Figure 7 is a structural schematic diagram of the mid-frame component 2 provided in the embodiment of this application, and Figure 8 is a partial cross-sectional schematic diagram of the dial 100 provided in the embodiment of this application.

[0137] Regarding the electrical connection between the conductive film 4 and the middle frame conductor 202, in one embodiment, the area on the middle frame assembly 2 that is electrically connected to the conductive film 4 is called the middle frame electrical connection area 204; one or more middle frame electrical connection areas 204 are formed on the middle frame conductor 202; and / or, the middle frame assembly 2 further includes one or more built-in conductive sheets 205 disposed in the middle frame non-conductive body 203, one end of the built-in conductive sheet 205 being connected to the middle frame conductor 202 and the other end forming the middle frame electrical connection area 204.

[0138] In this embodiment, one middle frame electrical connection area 204 is connected to the conductive film 4 to form an electrical connection point, and multiple middle frame electrical connection areas 204 are connected to the conductive film 4 to form multiple electrical connection points.

[0139] In this embodiment, referring to FIG7, the middle frame electrical connection area 204 may be formed only on the middle frame conductor 202; or, referring to FIG8, the electrical connection with the conductive film 4 may be achieved simply by providing an embedded conductive sheet 205 on the middle frame non-conductive body 203; or, in the electronic device, the middle frame electrical connection area 204 may be formed on the middle frame conductor 202, or the conductive film 4 may be electrically connected by providing an embedded conductive sheet 205 on the middle frame non-conductive body 203.

[0140] The built-in conductive sheet 205 is a film or composite film with conductive properties. In one embodiment, the built-in conductive sheet 205 includes, but is not limited to, copper foil, conductive cloth, polymer film containing metal coating, composite film containing copper foil, or composite film containing conductive cloth.

[0141] Please refer to Figure 8, which illustrates the formation of a mid-frame electrical connection area 204 on the built-in conductive sheet 205. The side of the mid-frame non-conductive body 203 closest to the display screen 1 along the thickness direction is the upper side surface 2031 of the mid-frame non-conductive body. In one example, the mid-frame electrical connection area 204 on the built-in conductive sheet 205 protrudes from the upper side surface 2031 of the mid-frame non-conductive body; in another example, the mid-frame electrical connection area 204 on the built-in conductive sheet 205 does not protrude from the upper side surface 2031 of the mid-frame non-conductive body.

[0142] For example, the electrical connection between the built-in conductive sheet 205 and the middle frame conductor 202 includes, but is not limited to, welding the built-in conductive sheet 205 to the middle frame conductor 202, connecting the built-in conductive sheet 205 to the middle frame conductor 202 with conductive adhesive, connecting the built-in conductive sheet 205 to the middle frame conductor 202 with conductive foam 6, and the built-in conductive sheet 205 undergoing elastic deformation and being squeezed onto the middle frame conductor 202.

[0143] The area on the built-in conductive sheet 205 that connects to the middle frame conductor 202 is called the conductive connection area 2051, as shown in Figure 8. In the example of Figure 8, a protrusion is formed on the conductive connection area 2051, which can abut against the inner surface of the middle frame conductor 202 to achieve an electrical connection between the built-in conductive sheet 205 and the middle frame conductor 202.

[0144] In one example, the number of electrical connection areas 204 in the middle frame is 1 to 12, and one electrical connection area 204 in the middle frame forms an electrical connection point with the conductive film 4. The number of electrical connection points between the middle frame assembly 2 and the conductive film 4 is 1 to 12.

[0145] In one example, the number of electrical connection points between the middle frame assembly 2 and the conductive film 4 is 1, 2, 3, 5, 9, or 12, etc. Please refer to Figure 7, which illustrates three middle frame electrical connection areas 204 on the middle frame assembly 2, with each middle frame electrical connection area 204 distributed circumferentially along the middle frame conductor 202.

[0146] In this embodiment, one or more electrical connection areas 204 are formed on the middle frame conductor 202, which can be conveniently electrically connected to the conductive film 4. When it is necessary to increase the number of electrical connection points between the conductive film 4 and the middle frame assembly 2, or when it is inconvenient for the middle frame conductor 202 to be electrically connected to the conductive film 4, an embedded conductive sheet 205 can be provided in the middle frame non-conductive body 203. One end of the embedded conductive sheet 205 is connected to the middle frame conductor 202, and the other end forms the middle frame electrical connection area 204.

[0147] In one embodiment, the middle frame conductive body 202 is integrally injection molded with the middle frame non-conductive body 203 after processing and forming, and at least the middle frame conductive body 202 has a middle frame electrical connection region 204 formed on it.

[0148] Please refer to Figure 7. In the example in Figure 7, it can be understood that the middle frame conductive body 202 is integrally injection molded with the inner middle frame non-conductive body 203 after molding. When the middle frame non-conductive body 203 is integrally injection molded on the middle frame conductive body 202, the middle frame conductive body 202 can be conveniently electrically connected to the conductive film 4. Therefore, at least a middle frame electrical connection area 204 is formed on the middle frame conductive body 202.

[0149] In this embodiment, by integrally injection molding the non-conductive middle frame 203 onto the conductive middle frame 202, it is convenient to manufacture the non-conductive middle frame 203 with complex shapes, and it is also beneficial to form the electrical connection area 204 of the middle frame on the conductive middle frame 202.

[0150] In one embodiment, the middle frame conductive body 202 and the middle frame non-conductive body 203 are processed and then spliced ​​together, and a conductive film 4 is provided inside the middle frame non-conductive body 203.

[0151] For example, referring to Figure 8, the mid-frame conductive body 202 includes a conductive main body 2021 and a support plate 2022. The support plate 2022 is located on the circumferential inner side of the conductive main body 2021. A dispensing platform 201 is formed on the side of the support plate 2022 facing the display screen 1, and the mid-frame non-conductive body 203 is located on the side of the support plate 2022 away from the display screen 1. In this embodiment, it is difficult to form a mid-frame electrical connection area 204 on the mid-frame conductive body 202. Instead, an internal conductive sheet 205 is provided inside the mid-frame non-conductive body 203 to electrically connect it to the conductive film 4.

[0152] In one example, the non-conductive body 203 in the middle frame is fixed to the conductive body 202 in the middle frame by clips and adhesive.

[0153] In one example, the built-in conductive sheet 205 and the non-conductive body 203 of the middle frame are integrally molded using insert injection molding. Insert injection molding is a molding method in which the insert is pre-placed in an injection mold, and then molten plastic is injected into the mold through an injection molding process, so that the insert and the plastic are integrated. In other examples, the built-in conductive sheet 205 can also be placed on the non-conductive body 203 of the middle frame by providing mounting holes and mounting the built-in conductive sheet 205 into the mounting holes.

[0154] In this embodiment, the middle frame conductive body 202 and the middle frame non-conductive body 203 are spliced ​​together. It is usually difficult to form the middle frame electrical connection area 204 on the middle frame conductive body 202. Therefore, it is necessary to set the built-in conductive sheet 205 in the middle frame non-conductive body 203. In addition, the middle frame non-conductive body 203 and the built-in conductive sheet 205 are integrally injection molded as inserts, which avoids complex assembly processes.

[0155] As described above, the area on the middle frame assembly 2 that is electrically connected to the conductive film 4 is called the middle frame electrical connection area 204. The middle frame electrical connection area 204 is electrically connected to the conductive film 4. In one embodiment, the middle frame electrical connection area 204 is directly electrically connected to the conductive film 4. In another embodiment, an intermediate conductive sheet 8 is provided on the middle frame electrical connection area 204, and the intermediate conductive sheet 8 is connected to the conductive film 4. That is, the middle frame electrical connection area 204 is indirectly electrically connected to the conductive film 4 through the intermediate conductive sheet 8.

[0156] The following mainly describes an example of direct electrical connection between the mid-frame electrical connection area 204 and the conductive film 4. Please refer to Figures 9-13. Figure 9 is a partial cross-sectional view of the conductive film 4 connected to the mid-frame assembly 2 provided in this embodiment; Figure 10 is another partial cross-sectional view of the conductive film 4 connected to the mid-frame provided in this embodiment; Figure 11 is a partial cross-sectional view of the conductive film 4 integrated on the flexible circuit board 1021 and connected to the mid-frame assembly 2 provided in this embodiment; Figure 12 is a cross-sectional view of the conductive foam 6 provided in this embodiment; Figure 13 is a schematic diagram of the distribution of the conductive foam 6 and the screen adhesive pad 13 on the mid-frame assembly 2 provided in this embodiment.

[0157] In one embodiment, as shown in Figures 9-10, a direct connection region 401 is formed on the conductive film 4, and the direct connection region 401 is electrically connected to the middle frame electrical connection region 204. That is, in this embodiment, the area on the conductive film 4 that is directly electrically connected to the middle frame electrical connection region 204 is referred to as the direct connection region 401.

[0158] In one example, one or more direct connection areas 401 are formed on the conductive film 4. When two or more direct connection areas 401 are formed on the conductive film 4, in one example, all direct connection areas 401 are connected to the middle frame conductor 202, that is, the middle frame electrical connection area 204 on the middle frame assembly 2 is formed on the middle frame conductor 202; in another example, all direct connection areas 401 are connected to the built-in conductive sheet 205, that is, the middle frame electrical connection area 204 on the middle frame assembly 2 is formed on the built-in conductive sheet 205; in yet another example, some direct connection areas 401 are connected to the middle frame conductor 202, and some direct connection areas 401 are connected to the built-in conductive sheet 205.

[0159] In this embodiment, by setting the direct connection area 401 on the conductive film 4 to be electrically connected to the electrical connection area 204 of the middle frame, the number of parts can be reduced.

[0160] In one embodiment, the middle frame electrical connection area 204 and the direct connection area 401 are electrically connected by a conductive material or by a conductive component; or the direct connection area 401 is pressed onto the middle frame conductor 202 by an elastic element to achieve the electrical connection between the direct connection area 401 and the middle frame conductor 202.

[0161] For example, the electrical connection area 204 of the middle frame and the direct connection area 401 are electrically connected by conductive materials, including but not limited to electrical connection via conductive adhesive, electrical connection via conductive silicone grease, electrical connection via conductive silver paste, electrical connection via solder, etc. Here, conductive adhesive is an adhesive with conductive properties, conductive silicone grease is a material with conductive microparticles added to silicone grease, and conductive silver paste is a functional material composed of silver powder or silver compounds, binders, solvents, and additives. Electrical connection via solder means that the direct connection area 401 of the conductive film 4 is soldered onto the electrical connection area 204 of the middle frame.

[0162] For example, the direct connection area 401 is pressed onto the mid-frame conductor 202 by an elastic element to achieve electrical connection between the direct connection area 401 and the mid-frame conductor 202, including but not limited to pressing the direct connection area 401 onto the mid-frame conductor 202 by foam 7. Referring to Figure 9, foam 7 is illustrated. Foam 7 includes a foam body 701 and a foam adhesive layer 702, which is adhered to the display assembly 102. Alternatively, the foam adhesive layer 702 can be adhered to the direct connection area 401. The foam body 701 is a material made of foamed plastic particles and has excellent elasticity. The elastic deformation of the foam body 701 presses the direct connection area 401 onto the mid-frame conductor 202, achieving electrical connection through contact between the direct connection area 401 and the mid-frame conductor 202. Additionally, Figure 9 illustrates the conductive film 4 adhered to the display assembly 102 by an adhesive layer 14.

[0163] For example, the electrical connection area 204 of the middle frame and the direct connection area 401 are electrically connected by conductive components, including but not limited to the electrical connection area 204 of the middle frame and the direct connection area 401 through conductive foam 6, the electrical connection area 204 of the middle frame and the direct connection area 401 through conductive pads, the electrical connection area 204 of the middle frame and the direct connection area 401 through metal springs, etc. Among these, the conductive pad is a pad with conductive properties, generally composed of conductive materials and supporting materials. Common supporting materials include elastomers such as rubber and silicone.

[0164] The middle frame electrical connection area 204 and the direct connection area 401 are electrically connected by a metal spring. Specifically, one end of the metal spring is welded to the middle frame electrical connection area 204 and the other end abuts against the direct connection area 401. Alternatively, one end of the metal spring is welded to the direct connection area 401 and the other end abuts against the middle frame electrical connection area 204.

[0165] Please refer to Figure 10, which illustrates the electrical connection area 204 of the middle frame and the direct connection area 401 connected electrically via conductive foam 6. In Figure 10(a), the adhesive layer 602 on the conductive foam 6 is connected to the direct connection area 401, and in Figure 10(b), the adhesive layer 602 on the conductive foam 6 is connected to the electrical connection area 204 of the middle frame. The conductive foam 6 has a certain degree of elasticity, and in Figure 10, it is compressed between the electrical connection area 204 and the direct connection area 401. Furthermore, in other examples, the adhesive layers 602 on both sides of the conductive foam 6 are connected to the electrical connection area 204 and the direct connection area 401 of the middle frame, respectively.

[0166] Regarding the connection between the middle frame electrical connection area 204 and the direct connection area 401, preferably, the middle frame electrical connection area 204 and the direct connection area 401 are electrically connected through conductive foam 6, so as to improve the reliability of the connection between the middle frame electrical connection area 204 and the direct connection area 401.

[0167] Please refer to Figure 11, which shows a partial cross-sectional view of the conductive film 4 connected to the electrical connection area 204 of the mid-frame via conductive foam 6 when the conductive film 4 is integrated on the flexible circuit board 1021. Figure 11(a) shows the conductive foam 6 adhered to the electrical connection area 204 of the mid-frame, and Figure 11(b) shows the conductive foam 6 adhered to the flexible circuit board 1021. The conductive film 4 is embedded within the substrate layer of the flexible circuit board 1021, and copper is partially exposed on the substrate layer corresponding to the position of the conductive foam 6, allowing the conductive foam 6 to contact the conductive film 4 embedded in the substrate layer.

[0168] In one example, the contact area between the conductive foam 6 and the electrical connection area 204 of the middle frame is greater than 1.5 square millimeters, and the contact area between the conductive foam 6 and the direct connection area 401 is greater than 1.5 square millimeters, to ensure that the impedance is low enough to improve antenna efficiency.

[0169] In one example, one or more direct connection areas 401 are formed on the conductive film 4. When two or more direct connection areas 401 are formed on the conductive film 4, in one example, each direct connection area 401 is connected to the middle frame electrical connection area 204 in the same way. For example, each direct connection area 401 is connected to the middle frame electrical connection area 204 through conductive foam 6. In another example, each direct connection area 401 is connected to the middle frame electrical connection area 204 in a different way.

[0170] In this embodiment, there are multiple electrical connection methods between the middle frame electrical connection area 204 and the direct connection area 401, and a suitable connection method can be selected according to the specific design of the electronic device.

[0171] Regarding the conductive foam 6, in one embodiment, please refer to Figure 12(a). The conductive foam 6 includes a foam substrate 601 and a conductive double-sided adhesive disposed on the foam substrate 601. That is, the adhesive layer 602 shown in Figure 12(a) is a conductive double-sided adhesive. The conductive double-sided adhesive is a double-sided adhesive with conductive properties, and the foam substrate 601 contains conductive particles.

[0172] Please refer to Figure 12(a). The entire area of ​​one side of the foam substrate 601 is provided with conductive double-sided adhesive. The electrical connection area 204 of the middle frame and the direct connection area 401 can be electrically connected through the conductive double-sided adhesive and the foam substrate 601.

[0173] Regarding the conductive foam 6, in one embodiment, please refer to Figure 12(b). The conductive foam 6 includes a foam substrate 601 and an adhesive layer 602 disposed on one side of the foam substrate 601. The adhesive layer 602 has a hollow structure, and the foam substrate 601 contains conductive particles.

[0174] In this embodiment, the adhesive layer 602 can be a conductive double-sided adhesive or a non-conductive double-sided adhesive. The adhesive layer 602 has a hollow structure, which can be understood as follows: the side on which the adhesive layer 602 is disposed on the foam substrate 601 is the adhesive layer pasting side 6011. The adhesive layer pasting side 6011 is not entirely covered with the adhesive layer 602, but only a portion of it. That is, the area of ​​the adhesive layer 602 is smaller than the area of ​​the adhesive layer pasting side 6011, thus forming a hollow structure. When the conductive foam 6 shown in Figure 12(b) is disposed between the electrical connection area 204 and the direct connection area 401 of the middle frame, since the conductive foam 6 is squeezed between the electrical connection area 204 and the direct connection area 401 of the middle frame, the area of ​​the foam substrate 601 without adhesive layer 602 is in contact with the electrical connection area 204 or the direct connection area 401 of the middle frame, thereby achieving electrical connection between the area without adhesive layer 602 and the electrical connection area 204 of the middle frame.

[0175] The adhesive layer 602 has a hollow structure. For example, in one example, the adhesive layer 602 includes two or more adhesives, which are arranged along the length direction of the foam substrate 601 and spaced apart along the width direction of the foam substrate 601.

[0176] Regarding the conductive foam 6, in one embodiment, please refer to Figure 12(c). The conductive foam 6 includes a foam substrate 601, an outer conductive layer 603, and an adhesive layer 602. The outer conductive layer 603 is wrapped around the foam substrate 601 and is adhered to the foam substrate 601 through an intermediate adhesive layer 604. The adhesive layer 602 is disposed in the area of ​​the foam substrate 601 that is not covered by the outer conductive layer 603. The adhesive layer 602 can be conductive double-sided adhesive or non-conductive double-sided adhesive. The outer conductive layer 603 can be copper foil or conductive cloth. The foam substrate 601 can be ordinary foam, that is, the foam substrate 601 does not contain conductive particles.

[0177] The above embodiments provide three structures for conductive foam 6, and a suitable conductive foam 6 can be selected according to cost and resistance requirements for the connection between the middle frame electrical connection area 204 and the direct connection area 401.

[0178] As described above, a screen dispensing pad 13 is also provided on the dispensing platform 201. Multiple screen dispensing pads 13 are spaced apart along the circumferential direction of the dispensing platform 201, and the display component 102 is supported on the screen dispensing pads 13. In one embodiment, the portion of the direct connection area 401 that is electrically connected to the mid-frame conductor 202 is positioned along the circumferential direction of the screen dispensing pad 13.

[0179] Please refer to Figure 13(a), which shows a cross-sectional view of the mid-frame assembly 2, the display screen 1, and the conductive film 4. Please also refer to Figure 13(b), which is a top view of the mid-frame assembly 2 shown in Figure 13(a) without cross-section. As can be seen from Figure 13(b), the conductive foam 6 and the screen adhesive pad 13 are arranged along the circumferential direction of the adhesive dispensing platform 201. In one example, more than one conductive foam 6 is disposed between two adjacent screen adhesive pads 13.

[0180] Figure 13(b) shows conductive foam 6. The conductive foam 6 in Figure 13(b) can also be replaced by conductive adhesive, conductive silver paste, conductive silicone grease, metal spring or conductive pad, etc.

[0181] In this embodiment, by setting the part of the direct connection area 401 that is electrically connected to the middle frame conductor 202 and the screen dispensing pad 13 to be set along the circumferential direction of the dispensing platform 201, the width of the dispensing platform 201 can be reduced, thereby reducing the width of the cross-section of the middle frame assembly 2, which is conducive to increasing the size of the battery 11 in the electronic device and improving the battery 11's battery life.

[0182] Regarding the direct connection area 401, in one embodiment, the direct connection area 401 is annular. That is, it can be understood that the conductive film 4 is electrically connected to the middle frame conductor 202 along its circumferential direction, thus forming an annular direct connection area 401 on the conductive film 4. When the direct connection area 401 is connected to the middle frame conductor 202 through conductive foam 6, an annular conductive foam 6 can be selected.

[0183] In addition, in embodiments where the direct connection area 401 is annular, to avoid spatial interference with the screen adhesive pad 13 on the mid-frame assembly 2, the electrical connection position between the conductive film 4 and the mid-frame conductor 202 can be set on the inner ring side of the screen adhesive pad 13 distributed circumferentially.

[0184] Regarding the direct connection area 401, in another embodiment, there is one or more direct connection areas 401, and the direct connection area 401 is strip-shaped.

[0185] Please refer to Figure 13(b). Multiple conductive foams 6 are arranged at intervals along the circumferential direction of the middle frame component 2. Each conductive foam 6 corresponds to a direct connection area 401. That is, there are multiple direct connection areas 401 and the direct connection areas 401 are distributed at intervals along the circumferential direction.

[0186] In this embodiment, the strip-shaped direct connection area 401 can be understood as rectangular, square, trapezoidal, elliptical, etc.

[0187] This embodiment provides two shapes for the direct connection area 401, namely, based on the structure of the middle frame component 2, the connection area between the conductive film 4 and the middle frame component 2 can be reasonably set.

[0188] Please refer to Figures 14 and 15. Figure 14 is a structural schematic diagram of the conductive film 4 provided in the embodiment of this application, and Figure 15 is a cross-sectional schematic diagram of the connection between the raised portion 404 and the middle frame conductor 202 provided in the embodiment of this application.

[0189] In one embodiment, referring to FIG14, the conductive film 4 includes a film body 403 and a raised portion 404. The raised portion 404 is connected to the film body 403 and is raised towards the side opposite to the display screen 1. A direct connection area 401 is formed on part or all of the raised portion 404. Referring to FIG15, it is shown that the raised portion 404 is raised towards the side opposite to the display screen 1, and the raised portion 404 is electrically connected to the middle frame conductor 202.

[0190] The display component 102 has a layered structure, including a substrate layer, an adhesive layer, and a polarizing layer, etc. Figure 15 shows the layered structure of the display component 102.

[0191] Please refer to Figure 15, which illustrates the mid-frame electrical connection area 204 formed on the mid-frame conductor 202. The mid-frame electrical connection area 204 is away from the display assembly 102 along the thickness direction of the electronic device, i.e., the Z-axis direction in Figure 15; that is, the mid-frame electrical connection area 204 is not facing away from the display assembly 102. In this case, when assembling the electronic device, the conductive film 4 can be attached to the inner side of the display screen 1 first, and then the display screen 1 and the mid-frame assembly 2 can be assembled. The raised portion 404 is electrically connected to the mid-frame electrical connection area 204 from the side of the mid-frame assembly 2 away from the display screen 1.

[0192] Referring to Figure 9, when an elastic element is used to press the direct connection area 401 onto the middle frame conductor 202 to achieve electrical connection between the direct connection area 401 and the middle frame conductor 202, the raised portion 404 on the conductive film 4 can be pressed onto the middle frame conductor 202 by the elastic element. In Figure 9, the middle frame electrical connection area 204 faces the display assembly 102.

[0193] In one example, the conductive film 4 includes one or more protrusions 404.

[0194] In one example, a direct connection region 401 is formed on a portion of the raised portion 404, and an indirect connection region 402, which will be described in detail below, is formed on a portion of the raised portion 404.

[0195] In one example, not only is a direct connection area 401 formed on the raised portion 404, but a direct connection area 401 is also formed on the diaphragm body 403.

[0196] Regarding the raised portion 404, in a specific example please refer to Figure 14, the raised portion 404 includes an arc-shaped curved section 4041 and a connecting section 4042. The arc-shaped curved section 4041 connects the diaphragm body 403 and the connecting section 4042, and a direct connection area 401 is formed on the connecting section 4042.

[0197] In one example, a reinforcing layer is provided on the raised portion 404. For instance, when the conductive film 4 is copper foil, a conductive cloth can be added to the raised portion 404 as a reinforcing layer.

[0198] In one example, one or more reinforcing layers are provided on the raised portion 404.

[0199] In this embodiment, the conductive film 4 is provided to include a film body 403 and a raised portion 404, so that an electrical connection position is formed between the raised portion 404 and the middle frame assembly 2 based on the shape of the middle frame assembly 2.

[0200] In other embodiments, the conductive film 4 includes only the film body 403, that is, the conductive film 4 does not include the raised portion 404. The shape of the film body 403 matches the shape of the inner side of the display screen 1, and one or more direct connection areas 401 are formed on the film body 403.

[0201] The following section mainly introduces an example of the electrical connection area 204 in the middle frame being indirectly electrically connected to the conductive film 4 through the intermediate conductive sheet 8.

[0202] Please refer to Figures 16-20. Figure 16 is an exploded view of the mid-frame assembly 2 provided in this embodiment; Figure 17 is a structural schematic diagram of the mid-frame assembly 2 provided in this embodiment, showing the colloid 206 and the screen adhesive pad 13 disposed on it; Figure 18 is a structural schematic diagram of the main body of the dial provided in this embodiment; Figure 19 is an exploded view of the conductive film 4 and the main body of the dial provided in this embodiment; Figure 20 is a cross-sectional schematic diagram of the connection between the intermediate conductive sheet 8 and the conductive film 4 provided in this embodiment. The main body of the dial refers to the structure of the dial 100 excluding the display screen 1 and the conductive film 4.

[0203] In one embodiment, an indirect connection region 402 is formed on the conductive film 4. The electronic device also includes an intermediate conductive sheet 8, which is disposed on the middle frame electrical connection region 204. The indirect connection region 402 is connected to the middle frame electrical connection region 204 through the intermediate conductive sheet 8. Please refer to Figure 19, where the indirect connection region 402 on the conductive film 4 is roughly illustrated with a box.

[0204] In one example, one or more indirect connection regions 402 are formed on the conductive film 4. The number of intermediate conductive sheets 8 corresponds to the number of indirect connection regions 402, with each indirect connection region 402 corresponding to one intermediate conductive sheet 8.

[0205] One end of the intermediate conductive piece 8 is electrically connected to the electrical connection area 204 of the middle frame. The electrical connection area 204 of the middle frame can be formed on the conductive piece 205 built into the non-conductive body 203 of the middle frame, or it can be formed on the conductive body 202 of the middle frame. Please refer to Figures 17 and 18 for comparison. Figure 17 shows that the electrical connection area 204 of the middle frame is formed on the conductive body 202 of the middle frame, and Figure 18 shows that the intermediate conductive piece 8 is disposed on the conductive body 202 of the middle frame and is electrically connected to the electrical connection area 204 of the middle frame.

[0206] In one example, referring to Figure 17, five middle frame electrical connection regions 204 are formed on the middle frame conductor 202. The five middle frame electrical connection regions 204 are a first middle frame electrical connection region 2041, a second middle frame electrical connection region 2042, a third middle frame electrical connection region 2043, a fourth middle frame electrical connection region 2044, and a fifth middle frame electrical connection region 2045. Referring to Figure 18, four intermediate conductive sheets 8 are shown. The four intermediate conductive sheets 8 are a first intermediate conductive sheet 801, a second intermediate conductive sheet 802, a third intermediate conductive sheet 803, and a fourth intermediate conductive sheet 804. The first intermediate conductive sheet 801 is electrically connected to the first middle frame electrical connection region 2041, the second intermediate conductive sheet 802 is electrically connected to the second middle frame electrical connection region 2042, the third intermediate conductive sheet 803 is electrically connected to the third middle frame electrical connection region 2043, and the fourth intermediate conductive sheet 804 is electrically connected to the fourth middle frame electrical connection region 2044. Please refer to Figure 19. Four indirect connection areas 402 are indicated by dashed boxes. These four indirect connection areas 402 are the first indirect connection area 4021, the second indirect connection area 4022, the third indirect connection area 4023, and the fourth indirect connection area 4024. The first indirect connection area 4021 is electrically connected to the first intermediate conductive sheet 801, the second indirect connection area 4022 is electrically connected to the second intermediate conductive sheet 802, the third indirect connection area 4023 is electrically connected to the third intermediate conductive sheet 803, and the fourth indirect connection area 4024 is electrically connected to the fourth intermediate conductive sheet 804.

[0207] The fifth frame electrical connection area 2045 in Figure 17 is electrically connected to the direct connection area 401 in Figure 19. It should be noted that, in the example where the conductive film 4 includes a film body 403 and raised portions 404, the raised portions 404 may not have a direct connection area 401 formed, but rather an indirect connection area 402. This allows the raised portions 404 to be electrically connected to the intermediate conductive sheet 8. In one example, the conductive film 4 includes two or more raised portions 404, with some raised portions 404 having a direct connection area 401 and others having an indirect connection area 402.

[0208] As shown in Figure 17, the areas of the first middle frame electrical connection area 2041 and the second middle frame electrical connection area 2042 are relatively small, making it inconvenient to connect with the conductive film 4. That is, when the limited space of the middle frame conductor 202 makes it difficult to achieve an electrical connection with the conductive film 4 structurally, an intermediate conductive sheet 8 can be provided on the middle frame conductor 202. The intermediate conductive sheet 8 acts as an extension of the middle frame conductor 202, and the conductive film 4 is transferred through the intermediate conductive sheet 8 to achieve an electrical connection with the middle frame conductor 202. In addition, if the shape of the conductive film 4 and other factors make it inconvenient to directly connect the middle frame electrical connection area 204 on the middle frame conductor 202 with the conductive film 4, an intermediate conductive sheet 8 can be provided on the middle frame conductor 202 to achieve an electrical connection with the conductive film 4.

[0209] Similarly, if it is inconvenient for the built-in conductive sheet 205 to be directly connected to the conductive film 4, the built-in conductive sheet 205 can also be connected to the conductive film 4 through the intermediate conductive sheet 8.

[0210] For example, the intermediate conductive sheet 8 can be soldered onto the electrical connection area 204 of the middle frame, or the intermediate conductive sheet 8 can be connected to the electrical connection area 204 of the middle frame via conductive adhesive, etc. Preferably, the intermediate conductive sheet 8 is soldered onto the electrical connection area 204 of the middle frame to reduce impedance.

[0211] The indirect connection area 402 is electrically connected to the intermediate conductive sheet 8. For example, the intermediate conductive sheet 8 and the indirect connection area 402 are electrically connected through a conductive material or through a conductive component; or the indirect connection area 402 is pressed onto the intermediate conductive sheet 8 by an elastic element to achieve the electrical connection between the intermediate conductive sheet 8 and the middle frame conductive body 202. For details, please refer to the above description of the electrical connection between the direct connection area 401 and the middle frame electrical connection area 204.

[0212] Preferably, the indirect connection area 402 is electrically connected to the intermediate conductive sheet 8 through the conductive foam 6.

[0213] Regarding the conductive foam 6, in one example, the conductive foam 6 includes a foam substrate 601 and conductive double-sided adhesive disposed on the foam substrate 601; in another example, the conductive foam 6 includes a foam substrate 601 and an adhesive layer 602 disposed on one side of the foam substrate 601, wherein the adhesive layer 602 has a hollow structure; in yet another example, the conductive foam 6 includes a foam substrate 601, an outer conductive layer 603, and an adhesive layer 602, wherein the outer conductive layer 603 is wrapped around the foam substrate 601 and is adhered to the foam substrate 601 through an intermediate adhesive layer 604, and the adhesive layer 602 is disposed in the area of ​​the foam substrate 601 not covered by the outer conductive layer 603.

[0214] In one example, the contact area between the conductive foam 6 and the intermediate conductive sheet 8 is greater than 1.5 square millimeters, and the contact area between the conductive foam 6 and the indirect connection area 402 is greater than 1.5 square millimeters, to ensure that the impedance is low enough to improve antenna efficiency.

[0215] Preferably, the electronic device also includes an elastic buffer pad 12 for supporting the display screen 1. Referring to Figure 19, the elastic buffer pad 12 is shown in the diagram, which is disposed on the intermediate conductive sheet 8, the mid-frame assembly 2, and the battery 11. The elastic buffer pad 12 disposed on the battery 11 protects the battery 11.

[0216] In this embodiment, an intermediate conductive sheet 8 is provided so that the indirect connection area 402 can be electrically connected to the middle frame electrical connection area 204 through the intermediate conductive sheet 8.

[0217] Referring to the example described above where a direct connection region 401 is formed on the conductive film 4, it should be noted that the conductive film 4 may only have a direct connection region 401 or only have an indirect connection region 402. Alternatively, as shown in Figure 19, both a direct connection region 401 and an indirect connection region 402 may be formed on the conductive film 4.

[0218] Regarding the intermediate conductive sheet 8, the intermediate conductive sheet 8 is a film or composite film with conductive properties. In one embodiment, the intermediate conductive sheet 8 is a copper foil, a steel sheet, a conductive cloth, a polymer film or composite film containing a metal coating, or a printed conductive silver paste coating.

[0219] For example, the intermediate conductive sheet 8 is a composite film containing copper foil or a composite film containing conductive cloth.

[0220] In this embodiment, the intermediate conductive sheet 8 can be of various types, providing more options for the intermediate conductive sheet 8, so as to select the appropriate type of intermediate conductive sheet 8 according to the design requirements.

[0221] In one embodiment, the thickness of the intermediate conductive sheet 8 ranges from 0.01 mm to 0.2 mm.

[0222] For example, the thickness of the intermediate conductive sheet 8 can be 0.01mm, 0.05mm, 0.10mm, 0.15mm, 0.2mm, etc.

[0223] In this embodiment, by setting the thickness range of the intermediate conductive sheet 8 to 0.02mm to 0.1mm, it is possible to avoid the intermediate conductive sheet 8 being too thick, which would increase the thickness of the electronic device, and to avoid the intermediate conductive sheet 8 being too thin, which would reduce its strength.

[0224] In one embodiment, the intermediate conductive sheet 8 is a deformable conductive plate that can be deformed to attach to the middle frame assembly 2.

[0225] In one specific example, the intermediate conductive sheet 8 is a copper foil, and the thickness of the intermediate conductive sheet 8 ranges from 0.02 mm to 0.07 mm. Copper foil within this thickness range is relatively soft and deformable, and can be conformally attached to the middle frame assembly 2.

[0226] Specifically, please refer to Figure 18, which shows that the fourth conductive film 4 is not a flat plate, but a curved plate attached to the middle frame assembly 2.

[0227] For example, the thickness of the intermediate conductive sheet 8 is 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, etc.

[0228] When the intermediate conductive sheet 8 is welded onto the middle frame conductive body 202, for copper foil with a thickness of 0.02mm to 0.07mm, ultrasonic welding is preferred. Ultrasonic welding uses high-frequency vibration waves to be transmitted to the surfaces of two objects to be welded. Under pressure, the surfaces of the two objects rub against each other to generate heat. When the temperature rises to the melting point of the material, the materials fuse together under pressure to achieve welding.

[0229] In this embodiment, the intermediate conductive sheet 8 is configured as a conductive plate with deformable capability, which can be attached to the middle frame assembly 2 in a conformal manner, so that the intermediate conductive sheet 8 can connect the middle frame electrical connection area 204 and the conductive film 4.

[0230] In one embodiment, referring to FIG21, the electronic device further includes a welding plate 9, and one or more welding plates 9 are superimposed on the side of the intermediate conductive sheet 8 opposite to the electrical connection area 204 of the middle frame, and the welding plate 9 and the intermediate conductive sheet 8 are welded to the electrical connection area 204 of the middle frame.

[0231] Please refer to Figure 21, which illustrates a layer of welding plate 9 superimposed on the intermediate conductive sheet 8. The number of welding plates 9 on the intermediate conductive sheet 8 is not limited to just one layer; two, three, or four layers of welding plates 9 can also be superimposed along the thickness direction of the intermediate conductive sheet 8. In addition, the conductive foam 6 that has not undergone elastic deformation is indicated by the square dashed box in Figure 21.

[0232] When the intermediate conductive sheet 8 is a copper foil of 0.02mm to 0.07mm, the thinness of the copper foil can easily lead to poor welding in laser welding (a welding method that uses a high-energy-density laser beam as a heat source). By stacking a welding plate 9 on the intermediate conductive sheet 8, the welding thickness is increased, making laser welding possible.

[0233] In a specific example, the welding plate 9 is a copper foil, and two or more layers of welding plates 9 are stacked on the intermediate conductive sheet 8 so that the total thickness of the welding plate 9 and the intermediate conductive sheet 8 is >0.05mm, thereby increasing the welding yield.

[0234] In a specific example, the welding plate 9 is a steel sheet, and one or more welding plates 9 with a thickness of 0.02 mm to 0.1 mm are stacked on the intermediate conductive sheet 8 to increase the welding yield.

[0235] In this embodiment, by stacking a welding plate 9 on the intermediate conductive sheet 8, the welding thickness is increased to minimize the occurrence of welding defects.

[0236] In one embodiment, when the intermediate conductive sheet 8 extends out of the middle frame assembly 2 in the direction of the central axis of the middle frame assembly 2, the area of ​​the intermediate conductive sheet 8 extending out of the middle frame assembly 2 is supported on the battery 11 of the electronic device.

[0237] Please refer back to Figure 18, which shows the first intermediate conductive sheet 801. The first intermediate conductive sheet 801 extends out of the middle frame assembly 2 in the direction of the central axis of the middle frame assembly 2, that is, the first intermediate conductive sheet 801 is not fully supported on the middle frame assembly 2.

[0238] The portion of the intermediate conductive sheet 8 that extends out of the middle frame assembly 2 can be called a cantilever structure. The cantilever structure can be set to support the battery 11 so that the intermediate conductive sheet 8 can be stably connected to the conductive film 4.

[0239] Specifically, when the cantilever structure is connected to the conductive diaphragm 4 via the conductive foam 6, the battery 11 can compress the conductive foam 6 to achieve a stable electrical connection between the cantilever structure and the conductive diaphragm 4. Simultaneously, the compression of the conductive foam 6 also reduces contact resistance. Please refer to Figure 20, which illustrates how the battery 11 supports the first intermediate conductive sheet 801 to compress the conductive foam 6. It should be noted that the conductive foam 6 shown in the square dashed box in Figure 20 is the one that has not undergone elastic deformation.

[0240] In this embodiment, the battery 11 supports the area where the intermediate conductive sheet 8 extends out of the middle frame assembly 2, so as to facilitate a stable electrical connection between the intermediate conductive sheet 8 and the conductive film 4.

[0241] In one embodiment, when the intermediate conductive sheet 8 extends out of the middle frame assembly 2 in the direction of the central axis of the middle frame assembly 2, a reinforcing sheet 10 is provided on at least one side of the plate surface of the intermediate conductive sheet 8.

[0242] The portion of the intermediate conductive sheet 8 extending beyond the middle frame assembly 2 can be referred to as a cantilever structure. During assembly, if the intermediate conductive sheet 8 has a cantilever structure, it may be prone to scratching and tearing due to the lack of fixed support and its poor strength (e.g., copper foil with a thickness of less than 0.10 mm). In this case, it is preferable to provide a reinforcing sheet 10 on at least one side of the plate surface of the intermediate conductive sheet 8. Please refer to Figure 20, which illustrates that reinforcing sheets 10 are provided on both sides of the intermediate conductive sheet 8.

[0243] In one example, the reinforcing sheet 10 includes, but is not limited to, a polymer film with a thickness of 0.01 mm to 0.2 mm.

[0244] In one example, one or more reinforcing sheets 10 are disposed on the plate surface on each side of the intermediate conductive sheet 8.

[0245] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: Mid-frame assembly, including mid-frame conductor; The display screen is connected to the dispensing table of the middle frame assembly; A rear shell assembly is connected to the middle frame assembly and is disposed opposite to the display screen; a rear shell radiator is disposed on the rear shell assembly. A conductive film is supported on the display screen and electrically connected to the conductive body of the middle frame.

2. The electronic device as claimed in claim 1, characterized in that, The display screen includes a screen cover and a display component. The display component is disposed on the inner side of the screen cover, and the circumferential edge of the display component is stacked with the dispensing table surface along the thickness direction of the electronic device.

3. The electronic device as claimed in claim 1, characterized in that, The conductive film is attached to the inner surface of the display screen; or, the display screen includes a flexible circuit board, and the conductive film is integrated on the flexible circuit board.

4. The electronic device as claimed in claim 1, characterized in that, The conductive film includes a film body and a raised portion. The raised portion is connected to the film body and is raised to the side away from the display screen. At least the raised portion is electrically connected to the middle frame conductor.

5. The electronic device as claimed in claim 1, characterized in that, The conductive film is a copper foil, conductive cloth, a polymer film containing a metal coating, a composite film containing copper foil, or a composite film containing conductive cloth; and / or, The thickness of the conductive film ranges from 0.02 mm to 0.1 mm; and / or, The conductive film covers 45% to 95% of the inner side of the display screen.

6. The electronic device as claimed in any one of claims 1-5, characterized in that, The middle frame assembly also includes a middle frame non-conductive body, which is connected to the middle frame conductive body. The area on the middle frame assembly that is electrically connected to the conductive film is called the middle frame electrical connection area. One or more electrical connection regions of the middle frame are formed on the middle frame conductor; and / or The mid-frame assembly further includes one or more built-in conductive sheets disposed within the non-conductive body of the mid-frame, one end of which is connected to the conductive body of the mid-frame, and the other end of which forms the electrical connection area of ​​the mid-frame.

7. The electronic device as claimed in claim 6, characterized in that, The conductive body of the middle frame is processed and molded integrally with the non-conductive body of the middle frame by injection molding, and at least the conductive body of the middle frame has an electrical connection area formed thereon; or... The conductive body of the middle frame and the non-conductive body of the middle frame are spliced ​​together to form the non-conductive body of the middle frame and the built-in conductive sheet by insert injection molding.

8. The electronic device as claimed in claim 6, characterized in that, The electrical connection area of ​​the middle frame is electrically connected to the conductive film through a conductive material or through a conductive component; or the conductive film is pressed onto the conductive body of the middle frame by an elastic element to achieve the electrical connection between the conductive film and the conductive body of the middle frame.

9. The electronic device as claimed in claim 6, characterized in that, The conductive film is connected to the electrical connection area of ​​the middle frame via conductive foam, wherein... The conductive foam includes a foam substrate and conductive double-sided adhesive disposed on the foam substrate; or... The conductive foam includes a foam substrate and an adhesive layer disposed on one side of the foam substrate, wherein the area of ​​the adhesive layer is smaller than the area of ​​the foam substrate; or, The conductive foam includes a foam substrate, an outer conductive layer, and an adhesive layer. The outer conductive layer is wrapped around the foam substrate, and the adhesive layer is disposed in the area of ​​the foam substrate not covered by the outer conductive layer.

10. The electronic device as claimed in claim 6, characterized in that, A direct connection area is formed on the conductive film, and the direct connection area is electrically connected to the electrical connection area of ​​the middle frame.

11. The electronic device as claimed in claim 10, characterized in that, The direct connection area is in the shape of a ring; or, there is one or more direct connection areas, and the direct connection area is in the shape of a strip.

12. The electronic device as claimed in claim 10, characterized in that, The electronic device also includes a screen dispensing pad, and the electrical connection portion between the direct connection area and the electrical connection area of ​​the middle frame is arranged along the circumferential direction of the screen dispensing pad.

13. The electronic device as claimed in claim 6, characterized in that, An indirect connection area is formed on the conductive film. The electronic device also includes an intermediate conductive sheet, which is disposed on the electrical connection area of ​​the middle frame. The indirect connection area is connected to the electrical connection area of ​​the middle frame through the intermediate conductive sheet.

14. The electronic device as claimed in claim 13, characterized in that, The intermediate conductive sheet is a copper foil, steel sheet, conductive cloth, polymer film with metal coating, composite film, or printed conductive silver paste coating; and / or... The thickness of the intermediate conductive sheet ranges from 0.01 mm to 0.2 mm.

15. The electronic device as claimed in claim 13, characterized in that, The electronic device further includes a welding plate, and one or more welding plates are superimposed on the side of the intermediate conductive sheet opposite to the electrical connection area of ​​the middle frame. The welding plate and the intermediate conductive sheet are welded to the electrical connection area of ​​the middle frame.

16. The electronic device as claimed in claim 13, characterized in that, The thickness of the intermediate conductive sheet ranges from 0.02 mm to 0.07 mm.

17. The electronic device as claimed in claim 13, characterized in that, The intermediate conductive sheet extends out of the middle frame assembly in the direction of the central axis of the middle frame assembly, and the area of ​​the intermediate conductive sheet extending out of the middle frame assembly is supported on the battery of the electronic device.

18. The electronic device as claimed in claim 13, characterized in that, The intermediate conductive sheet extends out of the middle frame assembly in the direction of the central axis of the middle frame assembly, and a reinforcing sheet is provided on at least one side of the plate surface of the intermediate conductive sheet.

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