Inspection result display device and inspection result display method

Abstract

This inspection result display method causes an inspection result of an inspection device, which captures, with a camera, an image of a substrate on which a component is mounted by a component mounting device and inspects the state of the component mounted on the substrate, to be displayed on a display unit. The method includes: extracting a search keyword from a file name of an inspection image file including an image captured by the camera (ST3); searching, on the basis of the extracted search keyword, mounting log information including a work record of the component mounting device for a work record related to the inspection image file (ST4); and displaying, on the display unit, the retrieved work record and the captured image included in the inspection image file in association with each other (ST5).

Description

Inspection Result Display Device and Inspection Result Display Method

[0006]

[0001] The present disclosure relates to an inspection result display device and an inspection result display method for displaying inspection results of an inspection device.

[0002] A component mounting line including a component mounting device for mounting components on a substrate and an inspection device for inspecting the state of the components mounted on the substrate by imaging the substrate on which the components are mounted by the component mounting device with a camera is known (for example, Patent Document 1). When the inspection device disclosed in Patent Document 1 determines that the inspection result is defective, it acquires information on the mounting device, nozzle, head, and feeder involved in the mounting process of the defective part from the mounting device based on the identification information of the substrate and the inspection result, and displays the inspection image and the inspection result together within the same screen of the monitor.

[0003] Japanese Patent Application Laid-Open No. 2006-228799

[0004] However, in the prior art including Patent Document 1, when the component mounting device and the inspection device perform component mounting and substrate inspection based on common data, although the mounting log information when the component is mounted and the captured image of the component can be displayed on the same screen, if the equipment vendors of the component mounting device and the inspection device are different and component mounting and substrate inspection are performed based on separate data, the mounting log information of the component mounting device and the captured image of the inspection device cannot be associated. There was room for further improvement in order to easily analyze the defective part by associating the mounting log information with the captured image of the defective part and displaying it.

[0005] Therefore, an object of the present disclosure is to provide an inspection result display device and an inspection result display method capable of appropriately associating and displaying the work results of a component mounting device and the captured images of an inspection device.

[0006] The inspection result display device of this disclosure is an inspection result display device that displays the inspection results of an inspection device that uses a camera to image a substrate on which components are mounted by a component mounting device and inspects the state of the components mounted on the substrate, and comprises: an extraction unit that extracts search keywords from the file name of an inspection image file including the image captured by the camera; a search unit that searches for work records related to the inspection image file from mounting log information including the work records of the component mounting device based on the extracted search keywords; and a display unit that displays the searched work records and the inspection image file in association.

[0007] The inspection result display method of this disclosure is an inspection result display method that displays on a display unit the inspection results of an inspection device that uses a camera to image a substrate on which components are mounted by a component mounting device and inspects the state of the components mounted on the substrate, and includes an extraction step of extracting search keywords from the file name of an inspection image file which includes the image captured by the camera; a search step of searching for the work record related to the inspection image file from mounting log information which includes the work record of the component mounting device based on the extracted search keywords; and a display step of associating the searched work record with the image captured in the inspection image file which includes the image captured by the inspection image file and displaying it on the display unit.

[0008] According to this disclosure, the work performance of the component mounting device and the images captured by the inspection device can be displayed in an appropriate correlation.

[0009] Diagram illustrating the configuration of a printed circuit board manufacturing system according to one embodiment of the present disclosure. Plan view showing an example of a single-sided circuit board, an example of a multi-sided circuit board, and an example of a carrier-using circuit board, on which components are mounted in the printed circuit board manufacturing system according to one embodiment of the present disclosure. Plan view showing the configuration of the main part of the component mounting device included in the printed circuit board manufacturing system according to one embodiment of the present disclosure. Perspective view of a mounting head attached to the component mounting device included in the printed circuit board manufacturing system according to one embodiment of the present disclosure. Block diagram showing the configuration of the printed circuit board manufacturing system according to one embodiment of the present disclosure. Diagram illustrating an example of a file name for an inspection image file created in the printed circuit board manufacturing system according to one embodiment of the present disclosure, and an example of a keyword extraction rule. Diagram illustrating an example of an inspection image display screen displayed on the display unit of a component mounting inspection device included in the printed circuit board manufacturing system according to one embodiment of the present disclosure. Diagram illustrating an example of a reference table used in the printed circuit board manufacturing system according to one embodiment of the present disclosure. Diagram illustrating an example of an inspection result display screen displayed on the display unit of an inspection result display device according to one embodiment of the present disclosure. Flow diagram of an inspection result display method according to one embodiment of the present disclosure.

[0010] An embodiment of this disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be appropriately modified according to the specifications of the mounted substrate manufacturing system, inspection result display device, component mounting system server, inspection result storage server, mounting line, component mounting device, component mounting inspection device, reflow inspection device, etc. In the following, all corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted. In Figure 3 and some parts described later, the X-axis in the substrate transport direction (left-right direction in Figure 3) and the Y-axis in the substrate transport direction (up-down direction in Figure 3) are shown as two mutually orthogonal axes in the horizontal plane. In Figure 3 and some parts described later, the Z-axis (up-down direction in Figure 4) is shown as the height direction perpendicular to the horizontal plane.

[0011] First, with reference to Figure 1, the configuration of the mounted circuit board manufacturing system 1 will be explained. The mounted circuit board manufacturing system consists of work equipment constituting one mounting line Q, and a communication network 2 connecting the inspection result display device 3, the component mounting system server 4, and the inspection result storage server 5. Note that the mounted circuit board manufacturing system 1 does not need to have one mounting line Q; it may have two or more. In this case, the inspection result display device 3, the component mounting system server 4, and the inspection result storage server 5 will be connected to two or more mounting lines Q.

[0012] The assembly line Q is configured by connecting in series the work equipment that performs operations on substrates B transported by built-in substrate transport lanes, such as a screen printing machine M1, a print inspection machine M2, component mounting machines M3-M4, a component mounting inspection machine M5, a reflow machine M6, and a reflow inspection machine M7, from upstream (left side of the page) to downstream (right side of the page) in the substrate transport direction. The assembly line Q has the function of manufacturing assembled substrates with components D mounted on substrate B. Note that the assembly line Q is a group of work equipment connected via a communication network 2, and the work equipment does not need to be physically connected to each other. Hereinafter, an assembled substrate with components D mounted on it may also be simply referred to as a "substrate".

[0013] In Figure 1, the screen printing apparatus M1 performs a solder printing operation, printing paste-like solder onto a substrate B transported from upstream via a screen mask mounted on the printing work unit. The printing inspection apparatus M2 performs a printing inspection operation, inspecting the condition of the solder printed on the substrate B using a printing inspection work unit that includes a solder inspection camera and various sensors. The inspection results, including the surface condition of the solder-laden substrate B inspected by the printing inspection apparatus M2, are transmitted to the inspection result storage server 5 and stored in the inspection result storage server 5.

[0014] Component mounting devices M3 to M4 use nozzles attached to their mounting heads to pick up components D supplied by component supply units such as tape feeders and tray feeders, and perform mounting operations by placing them on circuit boards B on which solder has been printed. Mounting log information, including the work performance of component mounting devices M3 to M4, is transmitted to and stored in the component mounting system server 4. The mounting line Q is not limited to a configuration of two component mounting devices M3 to M4, but may consist of one or three or more component mounting devices M3 to M4.

[0015] In Figure 1, the component mounting inspection device M5 performs mounting inspection work, which involves inspecting the position and condition of components D mounted on the substrate B using a mounting inspection work unit that includes a mounting inspection camera. The inspection results, including mounting errors (missing components) where components D are not mounted at the mounting points on the substrate B inspected by the component mounting inspection device M5, are transmitted to the inspection result storage server 5 and stored in the inspection result storage server 5. The reflow apparatus M6 heats the substrate B that has been brought into the apparatus using a substrate heating unit, melting and solidifying the solder on the substrate, and performs substrate heating work to join the electrodes (lands) of the substrate B with the terminals of the components D.

[0016] The reflow inspection device M7 performs a reflow inspection operation, which involves a reflow inspection unit including a reflow inspection camera, to inspect the position and condition of components D mounted on substrate B after reflow. The inspection results, including the condition of components D after reflow, are transmitted to the inspection result storage server 5 and stored in the inspection result storage server 5.

[0017] Thus, the component mounting inspection device M5 and the reflow inspection device M7 are inspection devices that use cameras (mounting inspection camera, reflow inspection camera) to image the substrate B on which components D have been mounted by component mounting devices M3 to M4, and inspect the condition of the components D mounted on the substrate B. If the number of substrate transport lanes of the multiple work equipment that the mounting line Q has differs, a distribution device is provided in the mounting line Q to distribute substrate B transported from multiple substrate transport lanes of the upstream work equipment to one substrate transport lane of the downstream work equipment, or to distribute substrate B transported from one substrate transport lane of the upstream work equipment to multiple substrate transport lanes of the downstream work equipment.

[0018] Here, referring to Figure 2, an example of a substrate on which components D are mounted by component mounting devices M3 to M4 will be described. Component mounting devices M3 to M4 mount components D at the mounting points P of the single-sided substrate Ba, the aggregate substrate Bb, and the carrier-using substrates Bd(1) to Bd(4) placed on the carrier T. The aggregate substrate Bb is separated into individual substrates Bc(1) to Bc(4) after inspection by the reflow inspection device M7. The carrier-using substrates Bd(1) to Bd(4) placed on the carrier T are removed from the carrier T after inspection by the reflow inspection device M7.

[0019] In Figure 2(a), each single-sided substrate Ba is assigned a substrate ID to identify it. The mounting points P on the single-sided substrate Ba are specified as XY coordinates on the single-sided substrate Ba. Furthermore, each mounting point P on the single-sided substrate Ba is associated with a component reference that identifies the circuit number or component type of the component assigned on the circuit diagram of the electrical circuit formed on the single-sided substrate Ba. In order to match the data with the aggregate substrate Bb and the carrier-using substrate Bd, each single-sided substrate Ba may be assigned the same carrier ID as the substrate ID.

[0020] In Figure 2(b), each aggregate substrate Bb is assigned a carrier ID to identify the aggregate substrate Bb. Each of the individual substrates Bc(1) to Bc(4) within the aggregate substrate Bb is assigned a substrate ID to identify the individual substrate Bc(1) to Bc(4). The mounting points P of the individual substrates Bc(1) to Bc(4) are specified as the XY coordinates for each individual substrate Bc(1) to Bc(4). Furthermore, each mounting point P of the individual substrates Bc(1) to Bc(4) is associated with a component reference that identifies the circuit number or component type of component D on the circuit diagram of the electrical circuit formed on the individual substrates Bc(1) to Bc(4). Alternatively, each individual substrate Bc(1) to Bc(4) may be identified by a combination of the carrier ID of the aggregate substrate Bb and an individual substrate position number that identifies the position of the individual substrate Bc(1) to Bc(4) within the aggregate substrate Bb.

[0021] In Figure 2(c), each carrier T is assigned a carrier ID to identify it. Each of the carrier substrates Bd(1) to Bd(4) placed on the carrier T is assigned a substrate ID to identify it. The mounting points P of each carrier substrate Bd(1) to Bd(4) are specified as the XY coordinates for each of the carrier substrates Bd(1) to Bd(4). Furthermore, each mounting point P of each carrier substrate Bd(1) to Bd(4) is associated with a component reference that identifies the circuit number or component type of component D on the circuit diagram of the electrical circuit formed on the carrier substrate Bd(1) to Bd(4).

[0022] In the following explanation, unless otherwise specified, we will use a single-sided substrate Ba as an example of substrate B on which component D is mounted in component mounting devices M3 to M4.

[0023] Next, with reference to Figures 3 and 4, the detailed configuration of component mounting devices M3 to M4 will be described. At the top center of the base 6, a first substrate transport lane L1 is located on the front side in the Y-axis direction, and a second substrate transport lane L2 is located on the rear side. The first substrate transport lane L1 is equipped with a pair of first substrate transport conveyors K1 that transport substrates B along the X-axis. The second substrate transport lane L2 is equipped with a pair of second substrate transport conveyors K2 that transport substrates B along the X-axis. Hereafter, unless there is a need to distinguish between them, the first substrate transport lane L1 and the second substrate transport lane L2 will simply be referred to as "substrate transport lane L". In other words, component mounting devices M3 to M4 have a plurality of substrate transport lanes L for transporting substrates B.

[0024] A first component supply unit S1 is located in front of the first substrate transport lane L1. A second component supply unit S2 is located behind the second substrate transport lane L2. Multiple component supply units 7 (tape feeders) are mounted on top of the first component supply unit S1 and the second component supply unit S2. The component supply units 7 feed carrier tapes holding components D in a pitch manner and supply them to the pickup position.

[0025] In Figure 3, Y-axis tables 8 equipped with linear drive mechanisms are arranged along the Y-axis direction at both ends of the upper surface of the base 6 in the X-axis direction. A first X-axis table 9A, equipped with a linear drive mechanism on its front side, is coupled to the Y-axis table 8 so as to be movable back and forth along the Y-axis direction. A second X-axis table 9B, equipped with a linear drive mechanism on its rear side, is also coupled to the Y-axis table 8 so as to be movable back and forth along the Y-axis direction. The first X-axis table 9A and the second X-axis table 9B are arranged along the X-axis direction.

[0026] The first X-axis table 9A is connected to a first mounting head H1 that moves left and right along the X-axis direction. The second X-axis table 9B is connected to a second mounting head H2 that also moves left and right along the X-axis direction. Hereafter, unless otherwise necessary, the first mounting head H1 and the second mounting head H2 will simply be referred to as "mounting head H".

[0027] In Figure 4, below the mounting head H, a plurality of spindles 10 are arranged that move up and down along the Z-axis and rotate around the Z-axis. A nozzle holder 11 is positioned at the lower end of each spindle 10. Each nozzle holder 11 is fitted with a nozzle 12 that attracts and holds the part D.

[0028] In Figure 3, the first mounting head H1 moves horizontally (in the X-axis and Y-axis directions) by a linear drive mechanism, holds the component D supplied to the pickup position by the component supply unit 7, and mounts it on the substrate B. The Y-axis table 8 and the first X-axis table 9A constitute the first mounting head moving mechanism 13A, which moves the first mounting head H1 at least from above the first component supply unit S1 to above the first substrate transport lane L1.

[0029] The second mounting head H2 moves horizontally (in the X-axis and Y-axis directions) by a linear drive mechanism, holds the component D supplied to the pickup position by the component supply unit 7, and mounts it on the substrate B. The Y-axis table 8 and the second X-axis table 9B constitute the second mounting head moving mechanism 13B, which moves the second mounting head H2 at least from above the second component supply unit S2 to above the second substrate transport lane L2.

[0030] Furthermore, the component mounting devices M3 to M4 are not limited to a configuration with two substrate transport lanes L (first substrate transport lane L1, second substrate transport lane L2), but may also be configured with one substrate transport lane L. Also, the component mounting devices M3 to M4 are not limited to a configuration with two mounting heads H (first mounting head H1, second mounting head H2), but may also be configured with one mounting head H.

[0031] In Figure 3, the control unit 14 is located on the base 6. The first substrate transport conveyor K1, the second substrate transport conveyor K2, the first mounting head moving mechanism 13A, the second mounting head moving mechanism 13B, the first mounting head H1, the second mounting head H2, and the component supply unit 7 constitute the mechanism section 15 (Figure 5) of the component mounting devices M3 to M4. The control unit 14 controls the mechanism section 15 to perform the mounting operation of mounting components D onto the substrate B transported by the first substrate transport lane L1 or the second substrate transport lane L2.

[0032] Next, referring to Figure 5, the configuration of the control system and information processing system of the mounted circuit board manufacturing system 1 will be described. Here, we will mainly describe the function of the mounted circuit board manufacturing system 1 that displays the inspection results of the inspection of the circuit board B on which components D have been mounted by component mounting devices M3 to M4, by the inspection devices (component mounting inspection device M5, reflow inspection device M7). In other words, the mounted circuit board manufacturing system 1, which includes an inspection result display device 3 and an inspection device, constitutes an inspection result display system that displays the inspection results performed by the inspection device. In the following, the component mounting inspection device M5 will be used as an example of the inspection device, but the reflow inspection device M7 is similar, and a detailed explanation will be omitted.

[0033] A control unit 14 is connected to a mechanism unit 15, which is provided in the component mounting devices M3 to M4. The control unit 14 includes a storage unit 20, an execution unit 21, an installation log creation unit 22, a data update unit 23, and the like. The storage unit 20 is a memory device that stores production data 24, installation log information 25, and the like. The production data 24 stores information necessary for the component mounting devices M3 to M4 to perform the mounting work, such as model information 24a, installation program 24b, and component setup information 24c.

[0034] In Figure 5, the model information 24a includes, for each model of mounting board, the type of board B (single-sided board Ba, multi-board Bb, carrier-using board Bd, etc.), information regarding the mounting point P of component D on board B (XY coordinates, circuit number), the type of component D, and its size (length, width, thickness). The mounting program 24b includes information for operating the mechanism 15, such as the order in which component D is mounted on board B, information identifying the spindle 10 of the mounting head H on which component D is mounted, and information identifying the nozzle 12 attached to the spindle 10. The component setup information 24c includes the set position of the component supply unit 7 (tape feeder) or the set position of component D in the component supply section (first component supply section S1, second component supply section S2) of the component mounting devices M3 to M4.

[0035] In Figure 5, the execution unit 21 controls the mechanism unit 15 based on the production data 24 to perform the mounting operation of mounting components D onto the substrate B transported by the substrate transport lane L. The mounting log creation unit 22 collects the work results of component mounting devices M3 to M4 and stores them in the storage unit 20 as mounting log information 25. The mounting log information 25 includes the substrate ID of the substrate B (single-sided substrate Ba, individual substrate Bc, carrier-using substrate Bd), the carrier ID of the aggregate substrate Bb or carrier T, information about the mounting point P (circuit number), the set position of the component supply unit 7 that supplied the components D, and information about the spindle 10 and nozzle 12 on which the components D are mounted.

[0036] The data update unit 23 transmits the mounting log information 25 stored in the storage unit 20 to the component mounting system server 4 at a predetermined timing, such as when the mounting work on one board B is completed. The component mounting system server 4 has a database function and stores the received mounting log information 25 in the mounting log information storage unit 26.

[0037] In Figure 5, the processing unit 30 of the component mounting inspection device M5 is connected to a measurement unit 31, a display unit 32, and an operation unit 33, which include a mounting inspection camera that images the components D mounted on the substrate B. The display unit 32 is a display device such as a liquid crystal panel, which displays various data as well as various information such as an operation screen and an input screen for operation by the operation unit 33. The operation unit 33 is an input device such as a keyboard, touch panel, or mouse, which is used when entering operation commands or data.

[0038] The processing unit 30 includes an inspection unit 34, a storage unit 35, a screen copy unit 36, and a data update unit 37. The storage unit 35 is a storage device that stores inspection data 38, captured images 39, inspection result information 40, screen copy images 41, etc. The inspection data 38 includes data such as a component reference that identifies the component D to be inspected, which is necessary to perform the inspection for each type of mounting board, as well as an inspection program and judgment criteria for determining whether the component is good or bad. The component reference includes the mounting point P of the component D on the board B, the size of the component D, etc.

[0039] In Figure 5, the inspection unit 34 controls the measurement unit 31 based on the inspection data 38 to capture an image of the mounting point P on the substrate B where the component D is mounted, and stores the captured image 39 in the storage unit 35. The inspection unit 34 also processes the captured image 39 to calculate the amount of displacement (deviation) of the component D, makes a preliminary determination of whether the mounting is acceptable or not based on the calculated deviation, and stores the inspection result information 40, including the cause of the defect, in the storage unit 35.

[0040] Furthermore, if the initial judgment result is negative, the inspection unit 34 displays an initial judgment result display screen including the captured image 39 on the display unit 32 to allow the operator to make a final judgment on whether the mounting is acceptable or not, displays an inspection image display screen on the display unit 32, and stores the inspection result information 40, including the captured image 39 and the final judgment result, in the storage unit 35. In addition, the inspection unit 34 statistically processes the data contained in the inspection result information 40 to calculate the number of mounted boards produced, the good product rate of the mounted components D, the defective product rate, the percentage for each cause of defect, etc., and stores these in the inspection result information 40.

[0041] In Figure 5, the screen copy unit 36 ​​copies the inspection image display screen shown on the display unit 32 and stores it in the storage unit 35 as the screen copy image 41. That is, the screen copy unit 36 ​​copies the inspection image display screen showing the inspection result displayed on the display unit 32 when the component mounting inspection device M5 determines that the initial judgment is defective, or when the operator determines that the final judgment is defective. In other words, the screen copy image 41 is a screen copy of the inspection device displaying the image 39 of the mounting point P captured by the camera.

[0042] The data update unit 37 transmits the captured image 39, inspection result information 40, and screen copy image 41 stored in the storage unit 35 to the inspection result storage server 5 at a predetermined timing, such as when the inspection work on one circuit board B is completed. The captured image 39, inspection result information 40, and screen copy image 41 are assigned filenames based on a predetermined filename naming convention.

[0043] The inspection result storage server 5 has a function as a database and stores the received information in association with information identifying the inspection device as the transmission source. Specifically, the inspection result storage server 5 stores the received inspection result information 40 in the inspection result information storage unit 42 as an inspection result information file, stores the captured image 39 in the captured image storage unit 43 as a captured image file, and stores the screen copy image 41 in the screen copy image storage unit 44 as a screen copy image file. The captured image file and the screen copy image file stored in the inspection result storage server 5 are inspection image files including the captured image 39 of the camera of the inspection device.

[0044] Here, referring to FIG. 6(a), an example of the file name given to the captured image 39, the inspection result information 40, and the screen copy image 41 created by the component mounting inspection device M5 will be described. FIG. 6(a) is an example of the file name of the captured image file of the carrier-using substrate Bd. The file name is formed by combining, in order, "carrier ID", "component reference number", "position within the carrier", and "inspection date and time" with a delimiter character (in this example, "-"). The "carrier ID" is information identifying the carrier T on which the carrier-using substrate Bd is placed. The "component reference number" is information identifying the component D to be inspected. In this example, at the beginning of the "component reference number", the "lane number" identifying the substrate transfer lane L that transferred the carrier T is combined. That is, the file name includes information (lane number) identifying the substrate transfer lane L.

[0045] The "position within the carrier" is information identifying the position on the carrier T where the carrier-using substrate Bd is placed. The "inspection date and time" is the date and time (December 25, 2024, 19:58:44) when the component mounting inspection device M5 inspected the mounting state of the component D. Thus, the information included in the file name includes substrate information (carrier ID, position within the carrier) regarding the substrate B on which the component D to be inspected is mounted, and component information (component reference number) regarding the component D to be inspected, and the substrate B and the component D to be inspected can be identified from the file name.

[0046] Here, referring to FIG. 7, an example of an inspection image display screen 60 displayed by the inspection unit 34 on the display unit 32 will be described. On the inspection image display screen 60, an inspection result list 61, statistical information 62, inspection position 63, good product image 64, inspection image 65, inspection result 66, and inspection result details 67 are displayed. In the inspection result list 61, the carrier ID, substrate ID, component reference number, primary determination result, and final determination result of the carrier T holding the substrate B or the carrier-using substrate Bd to be inspected are displayed. When the primary determination result or the final determination result is "OK", it indicates that the mounting state is a good product, and when it is "NG", it indicates that the product is defective. Also, when the primary determination result is "N / A", it indicates that the quality of the mounting could not be determined by the automatic primary determination by the component mounting inspection device M5.

[0047] When a component reference number is selected in the inspection result list 61, the information of the selected component D is displayed in the inspection position 63, good product image 64, inspection image 65, inspection result 66, and inspection result details 67. In this example, the component D with diagonal hatching on the component reference number is selected. In the statistical information 62, the carrier ID, production number of the mounting substrate, number of good products and their ratio, number of defective products and their ratio, and details of defects (defect list) are displayed. In the defect list, the number and ratio of missing components, position deviation (in the X-axis direction and Y-axis direction), rotation deviation (in the θ-axis direction), component difference, and other defect contents of the component D are displayed.

[0048] In FIG. 7, at the inspection position 63, the position of the component D selected in the inspection result list 61 on the substrate B is indicated by a marker 68. In this example, the component D mounted on the carrier-using substrate Bd(4) placed on the carrier T is selected. In the good product image 64, a sample image of the good product of the component D selected in the inspection result list 61 is displayed. In the inspection image 65, the captured image 39 of the component D selected in the inspection result list 61 by the camera is displayed. The circuit number (C654) printed on the substrate B is shown in the captured image 39.

[0049] Inspection result 66 displays the final judgment result (NG) and the nature of the defect (rotational misalignment). Inspection result details 67 displays the part name of part D, the deviation of the X-axis coordinate (amount of deviation from the normal position), the deviation of the Y-axis coordinate, and the deviation in the θ-axis direction.

[0050] In Figure 5, the inspection result display device 3 has the function of displaying the inspection results of the inspection devices (component mounting inspection device M5, reflow inspection device M7). The inspection result display device 3 includes an extraction unit 50, a search unit 51, an inspection result acquisition unit 52, a display processing unit 53, a keyword extraction rule storage unit 54, a reference table storage unit 55, a display unit 56, and an operation unit 57. The display unit 56 is a display device such as a liquid crystal panel, which displays various data as well as various information such as an operation screen and an input screen for operation by the operation unit 57. The operation unit 57 is an input device such as a keyboard, touch panel, or mouse, which is used when entering operation commands or data.

[0051] The keyword extraction rule storage unit 54 is a storage device that stores keyword extraction rules (Figure 6(b)) used when extracting search keywords from file names of images 39, inspection result information 40, screen copy images 41, etc., created by the inspection device. The keyword extraction rules are set based on the file naming rules used by the inspection device when assigning file names to images 39, etc. The reference table storage unit 55 is a storage device that stores a reference table that associates components D mounted by component mounting devices M3 to M4 at mounting points P on substrate B with components D mounted at mounting points P on substrate B that are inspected by component mounting inspection device M5. The reference table is used as information to associate the two when the equipment vendor (A) of component mounting devices M3 to M4 and the equipment vendor (B) of component mounting inspection device M5 are different, and the information that identifies the mounting point P used by equipment vendor (A) is different from the information that identifies the mounting point P used by equipment vendor (B).

[0052] Furthermore, if the equipment vendors for component mounting devices M3 to M4 and component mounting inspection device M5 are the same, or if the equipment vendors are different but the information identifying the mounting point P used is the same, a reference table is not necessary. Thus, the inspection result display device 3 includes a keyword extraction rule storage unit 54 that stores keyword extraction rules and a reference table storage unit 55 that stores corresponding information (reference table).

[0053] Here, with reference to Figure 8, an example of a reference table stored in the reference table storage unit 55 will be described. The reference table associates mounting point information 70 that identifies the mounting point P, a circuit number 71 that identifies the component D on the circuit diagram, and a component reference number 72 that identifies the component D to be inspected by the inspection device. The circuit number 71 is a mounting point reference used by component mounting devices M3 to M4 to identify the mounting point P on the board B when mounting the component D. The component reference number 72 is a component reference used by the component mounting inspection device M5 to identify the component D to be inspected. In other words, the reference table is correspondence information between the mounting point reference (circuit number 71) of the component mounting devices M3 to M4 and the component reference (component reference number 72) of the inspection device.

[0054] In Figure 5, the extraction unit 50, search unit 51, inspection result acquisition unit 52, and display processing unit 53 are realized by, for example, a memory that stores the programs executed by each processing unit, and a processor that executes the programs. The extraction unit 50 extracts inspection keywords from the filenames of inspection image files (imaging image files, screen copy image files) stored in the inspection result storage server 5, based on the keyword extraction rules stored in the keyword extraction rule storage unit 54. Specifically, the extraction unit 50 extracts at least board information related to board B (carrier ID, position within the carrier) and component information related to component D (component reference number) as search keywords from the filename. Furthermore, if the filename contains information that identifies the board transport lane L (lane number), the extraction unit 50 extracts information that identifies the board transport lane L as a search keyword from the filename.

[0055] In Figure 5, the search unit 51 searches for work records related to the inspection image file from the mounting log information, which includes the work records of component mounting devices M3 to M4, stored in the component mounting system server 4, based on the extracted search keywords. Specifically, the search unit 51 refers to the correspondence information (reference table) between the component reference (component reference number 72) used by the inspection device to identify the component D to be inspected and the mounting point reference (circuit number 71) used by the component mounting devices M3 to M4 to identify the mounting point P when mounting the component D on the board B. The search unit 51 searches for the mounting point reference corresponding to the component reference corresponding to the component information extracted by the extraction unit 50, and searches for work records related to the inspection image file based on the searched mounting point reference.

[0056] In other words, the search unit 51 obtains the work record of the mounting operation in which component D was mounted at mounting point P (defective location) where the inspection result was found to be defective, by referring to a reference table from the mounting log information stored in the component mounting system server 4. In this way, by referring to the reference table, even if the equipment vendors of the component mounting devices M3 to M4 and the inspection device are different, the work record of the component mounting devices M3 to M4 and the defective locations inspected by the inspection device can be automatically associated.

[0057] If a reference table is not prepared, the search unit 51 estimates and acquires the work record of a part D with a matching or similar part name, based on the part information extracted by the extraction unit 50, as the work record of the defective location. In this case, work records for multiple mounting points P may be acquired as candidates for the work record of the defective location (see the hatched items in Figure 9).

[0058] The work record obtained by the search unit 51 includes information related to at least one of the following: the date and time when the component mounting devices M3 to M4 mounted component D on the substrate B; the mounting head H on which component D was mounted; the spindle 10 of the mounting head H on which component D was mounted; the nozzle 12 that held component D; the component supply unit 7 that supplied component D; and the set position of the component supply unit 7.

[0059] In Figure 5, the inspection result acquisition unit 52 acquires the judgment result of the part D inspected by the inspection device and the state of part D (defect details, deviation, etc.) from the inspection result information 40 stored in the inspection result storage server 5. The display processing unit 53 displays an inspection result display screen on the display unit 56, which associates the work record retrieved by the search unit 51, the inspection image file (image file, screen copy image file) including the captured image 39, the judgment result of part D included in the inspection result information 40 acquired by the inspection result acquisition unit 52, and the state of part D.

[0060] Next, with reference to Figure 9, an example of the inspection result display screen 80 displayed on the display unit 56 by the display processing unit 53 will be described. The inspection result display screen 80 displays a combination of the mounting log information (work performance) of the component mounting devices M3 to M4 and the inspection result information 40 of the component mounting inspection device M5. In the example in Figure 9, the mounting log information displays the date and time the component D was mounted, the carrier ID, the board ID, the circuit number 71, the component name, equipment information identifying the component mounting devices M3 to M4, information identifying the mounting head H, spindle 10, and nozzle 12 on which the component D was mounted, the set position (component set position) of the component supply unit 7, and information identifying the component supply unit 7. In addition, the inspection result information 40 includes the captured image file (captured image 39), the component reference number 72, and the final mounting judgment result.

[0061] Furthermore, if there is no reference table, or if the information in the reference table is inappropriate, and multiple mounting points P corresponding to the captured image file are found, the relevant items will be hatched or colored on the inspection result display screen 80. The display processing unit 53 may also display a screen copy file showing the captured image 39 on the inspection result display screen 80 instead of the captured image file. In this way, the inspection result display device 3 appropriately associates the mounting log information of the component mounting devices M3 to M4 with the captured image 39 of the inspection device and displays it on the display unit 56.

[0062] Next, following the flow chart in Figure 10, a method for displaying inspection results on the display unit 56 of the inspection device will be described. The following description will be based on an example in which the inspection result display device 3 displays the inspection results of the component mounting inspection device M5 on the display unit 56 as the inspection result display screen 80. On the inspection result display screen 80, each time the inspection device (component mounting inspection device M5) determines that the mounting state of component D is defective, the inspection results of the component D that was determined to be defective will be added.

[0063] The extraction unit 50 detects whether or not unconfirmed inspection information has been added to the inspection result storage server 5 (ST1: detection step). If unconfirmed inspection information is added in the detection step (ST1), in other words, if a defective mounting point P (defective location) is detected in the inspection device, the extraction unit 50 reads the file name of the added inspection image file (captured image file, screen copy screen file) (ST2). Next, the extraction unit 50 extracts search keywords from the file name of the inspection image file containing the camera's captured image 39 based on the keyword extraction rules (ST3: extraction step).

[0064] In Figure 10, the search unit 51 then searches for work records related to the inspection image file from the mounting log information, including the work records of component mounting devices M3 to M4, stored in the component mounting system server 4, based on the extracted search keywords (ST4: search step). Next, the display processing unit 53 associates the searched work records with the captured images 39 included in the inspection image file and displays them on the display unit 56 as an inspection result display screen 80 (ST5: display step). As a result, the captured images 39 of the mounting point P (defective location) detected as a defect, and the work records of component mounting devices M3 to M4 when component D was mounted on said mounting point P are added to the inspection result display screen 80 displayed on the display unit 56.

[0065] In this way, each time a defect is detected by the inspection device, the display unit 56 displays the image 39 of the defect and the work performance in association with it, allowing workers and managers to easily analyze the defect.

[0066] As explained above, this disclosure discloses the following technical concepts.

[0067] (Technology 1) An inspection result display device 3 that displays the inspection results of an inspection device (component mounting inspection device M5, reflow inspection device M7) that uses a camera to image a substrate B on which components D are mounted by component mounting devices M3 to M4 and inspects the state of components D mounted on the substrate B, comprising: an extraction unit 50 that extracts search keywords from the file names of inspection image files (image file, screen copy image file) including the camera image 39; a search unit 51 that searches for work records related to the inspection image file from mounting log information including the work records of component mounting devices M3 to M4 based on the extracted search keywords; and a display unit 56 that displays the searched work records in association with the inspection image file.

[0068] This allows the work performance of component mounting devices M3 to M4 and the captured images 39 of the inspection device to be displayed in an appropriate correlation.

[0069] (Technology 2) The inspection result display device 3 according to Technology 1, wherein the extraction unit 50 extracts at least board information (carrier ID, position within the carrier) related to board B and component information (component reference number 72) related to component D from the file name as search keywords.

[0070] This allows for the identification of defective areas from the filenames of the inspection image files, and enables the appropriate association and display of the work performance of the component mounting devices M3 to M4 with the images 39 captured by the inspection device.

[0071] (Technology 3) The inspection result display device 3 according to Technology 1 or 2, wherein the search unit 51 refers to correspondence information (reference table) of a component reference (component reference number 72) used by the inspection device (component mounting inspection device M5, reflow inspection device M7) to identify the component D to be inspected, and a mounting point reference (circuit number 71) used by the component mounting devices M3 to M4 to identify the mounting point P when mounting the component D on the mounting point P of the substrate B, searches for a mounting point reference corresponding to the component reference corresponding to the component information (component reference number 72) extracted by the extraction unit 50, and searches for work results related to the inspection image file (component reference number 72) based on the searched mounting point reference.

[0072] This allows the work performance of component mounting devices M3 to M4 and the captured images 39 of the inspection device to be displayed in an appropriate association based on the corresponding information.

[0073] (Technical 4) The inspection result display device 3 described in Technical 3 further includes a storage unit (reference table storage unit 55) that stores corresponding information.

[0074] This allows for the appropriate correlation and display of the work performance of the component mounting devices M3-M4 and the captured images 39 of the inspection device, even if the equipment vendors for the component mounting devices M3-M4 and the inspection device are different.

[0075] (Technology 5) The inspection result display device 3 according to any one of technologies 1 to 4, further comprising a storage unit (keyword extraction rule storage unit 54) that stores keyword extraction rules for extracting search keywords from file names.

[0076] This allows for the appropriate correlation and display of the work performance of the component mounting devices M3-M4 and the captured images 39 of the inspection device, even if the equipment vendors for the component mounting devices M3-M4 and the inspection device are different.

[0077] (Technology 6) The component mounting devices M3 to M4 have a plurality of substrate transport lanes L for transporting substrates B, and the extraction unit 50 extracts information (lane number) that identifies the substrate transport lane L from the file name as a search keyword, the inspection result display device according to any one of Technologies 1 to 5.

[0078] This makes it possible to appropriately correlate and display the work performance of component mounting devices M3 to M4, which have multiple substrate transport lanes L, with the captured images 39 from the inspection device.

[0079] (Technical 7) The inspection result display device 3 according to any one of Technical 1 to 6, wherein the work results displayed by the display unit 56 include information relating to at least one of the following: the date and time when the component mounting devices M3 to M4 mounted component D on the substrate B, the mounting head H on which component D was mounted, the spindle 10 of the mounting head H on which component D was mounted, the nozzle 12 that held component D, the component supply unit 7 that supplied component D, and the set position of the component supply unit 7.

[0080] This allows the work performance of component mounting devices M3 to M4 and the captured images 39 of the inspection device to be displayed in an appropriate correlation.

[0081] (Technical 8) The inspection image file (screen copy image file) is a screen copy of the inspection device on which the captured image 39 is displayed, as described in any one of Technical 1 to 7.

[0082] This allows the work performance of component mounting devices M3 to M4 and the captured images 39 of the inspection device to be displayed in an appropriate correlation.

[0083] (Technology 9) An inspection result display device 3 according to any one of Technologies 1 to 8, further comprising an inspection result acquisition unit 52 that acquires the judgment result of a component D inspected by an inspection device (component mounting inspection device M5, reflow inspection device M7) and the state of component D, wherein a display unit 56 displays the work results, inspection image file, judgment result of component D, and state of component D in association with each other.

[0084] This allows for the display of the work performance of component mounting devices M3 to M4, the captured images 39 of the inspection device, the judgment results, and the state of component D in an appropriate correlation.

[0085] (Technical 10) An inspection result display method that displays the inspection results of an inspection device (component mounting inspection device M5, reflow inspection device M7) that images a substrate B on which components D are mounted by component mounting devices M3 to M4 with a camera and inspects the state of components D mounted on the substrate B, the method comprising: an extraction step (ST3) of extracting search keywords from the file name of an inspection image file (image file, screen copy image file) that includes an image captured by a camera 39; a search step (ST4) of searching for work results related to the inspection image file from mounting log information including the work results of component mounting devices M3 to M4; and a display step (ST5) of associating the searched work results with the image captured by the inspection image file and displaying them on the display unit 56.

[0086] This allows the work performance of component mounting devices M3 to M4 and the captured images 39 of the inspection device to be displayed in an appropriate correlation.

[0087] This application is based on a Japanese patent application (Patent Application No. 2024-222987) filed on December 18, 2024, the contents of which are incorporated herein by reference.

[0088] The inspection result display device and inspection result display method disclosed herein have the effect of appropriately relating and displaying the work performance of a component mounting device and the captured images of an inspection device, and are useful in the field of mounting components onto a substrate.

[0089] 1. Assembly board manufacturing system (inspection result display system) 3. Inspection result display device 7. Component supply unit 10. Spindle 12. Nozzle B. Substrate D. Component H. Mounting head L. Substrate transport lane M3-M4. Component mounting device M5. Component mounting inspection device (inspection device) M7. Reflow inspection device (inspection device) P. Mounting point

Claims

1. An inspection result display device that displays the inspection results of an inspection device that uses a component mounting device to image a circuit board on which components are mounted using a camera and inspects the condition of the components mounted on the circuit board, comprising: an extraction unit that extracts search keywords from the file name of an inspection image file including the image captured by the camera; a search unit that searches for work records related to the inspection image file from mounting log information including the work records of the component mounting device based on the extracted search keywords; and a display unit that displays the searched work records in association with the inspection image file.

2. The inspection result display device according to claim 1, wherein the extraction unit extracts at least substrate information relating to the substrate and component information relating to the component from the file name as search keywords.

3. The inspection result display device according to claim 2, wherein the search unit refers to correspondence information between a component reference used by the inspection device to identify the component to be inspected and a mounting point reference used by the component mounting device to identify the mounting point when mounting the component on the mounting point of the substrate, searches for the mounting point reference corresponding to the component reference corresponding to the component information extracted by the extraction unit, and searches for the work record related to the inspection image file based on the searched mounting point reference.

4. The inspection result display device according to claim 3, further comprising a storage unit that stores the corresponding information.

5. The inspection result display device according to claim 1, further comprising a storage unit that stores keyword extraction rules for extracting the search keyword from the file name.

6. The inspection result display device according to claim 1, wherein the component mounting device has a plurality of substrate transport lanes for transporting the substrate, and the extraction unit extracts information that identifies the substrate transport lane from the file name as the search keyword.

7. The inspection result display device according to claim 1, wherein the work performance displayed by the display unit includes information relating to at least one of the following: the date and time the component mounting device mounted the component on the substrate, the mounting head on which the component was mounted, the spindle of the mounting head on which the component was mounted, the nozzle holding the component, the component supply unit that supplied the component, and the set position of the component supply unit.

8. The inspection result display device according to claim 1, wherein the inspection image file is a screen copy of the inspection device on which the captured image is displayed.

9. The inspection result display device according to claim 1, further comprising an inspection result acquisition unit that acquires the judgment result of the part inspected by the inspection device and the state of the part, wherein the display unit displays the work record, the inspection image file, the judgment result of the part, and the state of the part in association with each other.

10. An inspection result display method for displaying the inspection results of an inspection device that uses a component mounting device to image a circuit board on which components are mounted using a camera and inspects the condition of the components mounted on the circuit board, the method comprising: an extraction step of extracting search keywords from the file name of an inspection image file including the image captured by the camera; a search step of searching for the work record related to the inspection image file from mounting log information including the work record of the component mounting device based on the extracted search keywords; and a display step of associating the searched work record with the image captured in the inspection image file and displaying it on the display unit.

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