Wiring member and wiring member for eyewear

Abstract

An embodiment of the present invention relates to a wiring member comprising a light-transmitting insulating substrate and a plurality of wiring patterns provided on the insulating substrate. The plurality of wiring patterns have a first wiring pattern composed of a first connection pad, a second connection pad, and connection wiring connecting the first connection pad and the second connection pad. The connection wiring includes a juxtaposed portion having a plurality of metal wires spaced apart from each other. In the juxtaposed portion, the gap between two adjacent metal wires is wider than the width of the metal wires, thus making it possible to achieve both improved invisibility of a conductive wiring and low resistance.

Description

Wiring member and wiring member for eyewear

[0001] The present invention relates to a wiring member and a wiring member for eyewear.

[0002] Patent Document 1 discloses a system for determining a line-of-sight detection position, including a device configured to be worn on the head of a wearer, and one or more illumination light sources attached to the device within the visual field of the eyes of the wearer wearing the device. The one or more illumination light sources are arranged to illuminate the eyes and are configured to minimize interference with the vision of the wearer within the visual field. The system also includes an eye detection camera attached to the device and arranged to view the eyes, and a processor connected to the eye detection camera for analyzing an image of the eyes acquired by the eye detection camera to identify one or more flashes reflected from the eyes from the one or more illumination light sources and to identify the position of the features of the eyes relative to the one or more flashes, thereby determining the position viewed by the wearer.

[0003] Patent Document 2 discloses an assembly including a transparent substrate including a first surface and a second surface opposite the first surface, wherein the first surface includes a viewing area through which light passes before reaching an eye box, and a plurality of microdevices attached to the first surface and coupled to respective conductive paths arranged in a pseudo-random pattern, the plurality of microdevices including at least one microdevice disposed within the viewing area.

[0004] Japanese Patent Publication No. 2014-532542, Japanese Patent Publication No. 2021-534837

[0005] When mounting a device in a visual field range or on an optical path, such as a member worn in front of the eyes like glasses or goggles, or a translucent member, it is necessary to improve the invisibility of the conductive wiring connected to this device. On the other hand, if the conductive wiring is made thinner to improve invisibility, the electrical resistance of the conductive wiring increases, which hinders the reduction of resistance.

[0006] The present invention aims to provide a wiring member and a wiring member for eyewear that can achieve both improved visibility of conductive wiring and low resistance.

[0007] One aspect of the present invention comprises a light-transmitting insulating substrate and a plurality of wiring patterns provided on the insulating substrate, wherein the plurality of wiring patterns have a first wiring pattern composed of a first connection pad, a second connection pad, and a connecting wire connecting the first connection pad and the second connection pad, and the connecting wire includes a parallel section having a plurality of spaced-apart metal wires, wherein the gap between two adjacent metal wires in the parallel section is wider than the width of the metal wires.

[0008] With this configuration, the connecting wiring has a parallel section with multiple metal wires, and in this parallel section, the gap between two adjacent metal wires is wider than the width of the metal wires, thus improving the visibility without increasing the electrical resistance of the conductive wiring.

[0009] In the above wiring member, it is preferable that the width of the parallel section is wider than the width of the first and second connection pads. This widens the width of the parallel section, improving visibility by reducing the density of multiple metal wires.

[0010] In the above wiring component, the connecting wiring may include a branching section where one metal wire branches into multiple metal wires. This reduces the density of the multiple metal wires at the branching section without increasing the electrical resistance of the conductive wiring, thereby improving visibility.

[0011] In the above-described wiring component, it is preferable that the width of the metal wiring at the branching point is narrower after the branching point than before the branching point. This widens the spacing between the metal wiring after the branching point, improving visibility.

[0012] In the above-described wiring component, it is preferable that the cross-sectional area of ​​the single metal wire before branching at the branching point is equal to the sum of the cross-sectional areas of the multiple metal wires after branching. This ensures that the overall electrical resistance of the conductive wiring is maintained even with branching points.

[0013] In the above wiring member, it is preferable that the multiple metal wires after branching constitute a part of the parallel arrangement section.

[0014] In the above wiring member, the branching portion may be formed between the parallel section and the first connection pad, or between the parallel section and the second connection pad.

[0015] In the above wiring component, it is preferable that the gap between two adjacent metal wires before the branching point is wider than the width of the metal wires. This improves the visibility of the conductive wiring before the branching point.

[0016] In the above wiring member, it is preferable that the ratio of the gap between adjacent metal wires in the parallel arrangement (Space / Line) is constant, the width of the multiple metal wires is less than 20 μm, the ratio of the gap between the widths of two adjacent metal wires is greater than 10, and the aspect ratio of the thickness to the width of the multiple metal wires is greater than 0.5 and less than 2.5.

[0017] In the above wiring member, the metal wiring may have a laminate of a CuNi alloy which is an adhesion layer with an insulating substrate and Cu which is a main conductive layer formed on the adhesion layer.

[0018] In the above wiring member, the plurality of wiring patterns have a second wiring pattern composed of a third connection pad, a fourth connection pad, and a connecting wire connecting the third connection pad and the fourth connection pad, and the first wiring pattern and the second wiring pattern are arranged with the first connection pad and the third connection pad adjacent to each other with a gap in between, and the first connection pad and the third connection pad may constitute a connection unit with the device. This improves the invisibility without increasing the electrical resistance of the conductive wiring connected to the device.

[0019] In the above wiring member, the multiple wiring patterns are arranged to form a series circuit by repeatedly connecting to a device via a connection unit, and among the multiple connection pads of the multiple wiring patterns, the connection pads that do not constitute a connection unit may be external connection pads.

[0020] In the above wiring member, the plurality of wiring patterns include a third wiring pattern comprising a fifth connection pad, a sixth connection pad, and a connecting wire connecting the fifth connection pad and the sixth connection pad, and the first wiring pattern further includes a seventh connection pad connected to a second connection pad by a connecting wire, and the first wiring pattern and the third wiring pattern are arranged such that the second connection pad and the fifth connection pad are adjacent to each other with a gap between them, and the second connection pad and the fifth connection pad constitute a connection unit with a device, and the first wiring pattern may be used as a common wiring, with the second wiring pattern and the third wiring pattern being arranged in parallel.

[0021] In the above wiring component, connection pads that do not constitute a connection unit may be external connection pads.

[0022] In the above wiring member, the device connected to the connection unit may be a light source device or an image sensor.

[0023] Another aspect of the present invention is a wiring member for eyewear comprising a translucent insulating substrate having a central region and a peripheral region, an external connection pad disposed in the peripheral region, and a plurality of wiring patterns electrically connected to the external connection pad and extending around the central region, wherein the wiring patterns include parallel sections having a plurality of spaced-apart metal wires, and in the parallel sections, the gap between two adjacent metal wires is wider than the width of the metal wires.

[0024] With this configuration, in a plurality of wiring patterns provided on a translucent insulating substrate, the gap between two adjacent metal wires in a parallel arrangement of multiple metal wires is wider than the width of the metal wires, thus improving invisibility without increasing the electrical resistance of the conductive wiring.

[0025] In the above-described wiring component for eyewear, the wiring pattern has connecting wires, and it is preferable that the number of connecting wires in the wiring pattern increases from the peripheral area to the periphery of the central area, and that the width of the connecting wires becomes narrower. In eyewear, the visibility of the wiring pattern is more easily affected in the central area. Therefore, by increasing the number of connecting wires from the peripheral area to the periphery of the central area, and by making the width of the connecting wires narrower, the visibility is improved without increasing the electrical resistance of the conductive wiring.

[0026] In the above-described wiring component for eyewear, the wiring pattern preferably has a branching section where one metal wire of the connecting wiring branches into multiple metal wires, and the multiple metal wires after branching are closer to the central region. By having the metal wires after branching closer to the central region in this way, the invisibility in the central region, which is easily affected by visibility, is improved.

[0027] In the above-mentioned wiring component for eyewear, the multiple metal wires after branching may constitute part of the parallel arrangement section.

[0028] In the above-described wiring member for eyewear, multiple wiring patterns may have multiple connection units arranged in a series circuit around the central region.

[0029] In the above-described wiring component for eyewear, multiple wiring patterns may have connection units for common wiring of parallel circuits arranged around the central region.

[0030] According to the present invention, it is possible to provide a wiring member and a wiring member for eyewear that can achieve both improved invisibility of conductive wiring and low resistance.

[0031] This is a plan view illustrating a wiring member according to the first embodiment. This is an enlarged plan view illustrating a wiring member according to the first embodiment. This is a schematic plan view illustrating a wiring member according to the first embodiment. This is a cross-sectional view taken along the line A1-A1' in Figure 2A. This is an enlarged view of part A in Figure 2B. This is a schematic plan view illustrating a state in which a device is mounted. This is a cross-sectional view taken along the line A2-A2' in Figure 3A. This is a schematic cross-sectional view illustrating metal wiring. This is a schematic cross-sectional view illustrating metal wiring. This is a schematic cross-sectional view illustrating metal wiring. This is a plan view illustrating a wiring member according to the second embodiment. This is an enlarged plan view illustrating a wiring member according to the second embodiment. This is a schematic plan view illustrating a wiring member according to the second embodiment. This is a cross-sectional view taken along the line B1-B1' in Figure 6A. This is a cross-sectional view taken along the line B2-B2' in Figure 6A. This is a schematic plan view illustrating a wiring member according to the third embodiment. This is a cross-sectional view taken along the line C1-C1' in Figure 7A. This is a cross-sectional view taken along the line C2-C2' in Figure 7A. This is a schematic plan view illustrating a wiring member according to the fourth embodiment. This is an enlarged plan view schematically illustrating the parallel arrangement of wiring members according to the fourth embodiment. This is an enlarged plan view schematically illustrating the parallel arrangement of wiring members according to the fourth embodiment. This is a plan view schematically illustrating a wiring member according to the fifth embodiment. This is a cross-sectional view taken along the line E1-E1' in Figure 9A. This is an enlarged plan view showing a specific example of a wiring member according to the fifth embodiment. This is a cross-sectional view taken along the line E2-E2' in Figure 10A. This is a cross-sectional view taken along the line E3-E3' in Figure 10A. This is a plan view schematically illustrating a wiring member according to the sixth embodiment. This is a cross-sectional view taken along the line F1-F1' in Figure 11A. This is a plan view illustrating another example of a branching section. This is a plan view illustrating another example of a branching section. This is a plan view illustrating another example of a branching section. This is a plan view schematically illustrating a wiring member according to the seventh embodiment. This is an enlarged view of section B in Figure 13A. This is a cross-sectional view taken along the line G1-G1' in Figure 13B. This is a plan view schematically illustrating a wiring member according to the eighth embodiment. This is a cross-sectional view taken along the line H1-H1' in Figure 14A. This is an enlarged plan view showing an example of the pattern width of dummy wiring. This is a cross-sectional view taken along the line H2-H2' in Figure 15A. This is an enlarged plan view illustrating a wiring member according to the ninth embodiment. This is a cross-sectional view taken along the line I1-I1' in Figure 16A. This is a schematic cross-sectional view showing an example of another metal wiring. This is a schematic cross-sectional view showing an example of another metal wiring. This is a schematic cross-sectional view showing an example of another metal wiring.This is a schematic cross-sectional view showing examples of other connecting wires and connecting pads. This is a diagram showing examples of wiring components for eyewear. This is a magnified schematic view of the lens portion.

[0032] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the following description, the same reference numerals will be used for identical components, and components that have already been described will be omitted from the description as appropriate.

[0033] (First Embodiment) Figure 1A is a plan view illustrating a wiring member 1A according to the first embodiment. Figure 1B is an enlarged plan view illustrating a wiring member 1A according to the first embodiment.

[0034] The wiring member 1A according to the first embodiment comprises a light-transmitting insulating substrate 10 and a plurality of wiring patterns 20 provided on the insulating substrate 10. Examples of materials for the insulating substrate 10 include resin (for example, PET (Polyethylene Terephthalate), COP (Cyclo-Olefin Polymer), acrylic, CPI (Colorless and Transparent Polyimide)), and glass. A specific example of the insulating substrate 10 is the lens portion of eyeglasses (eyewear).

[0035] The insulating substrate 10 may or may not be light-transmitting. The insulating substrate 10 may form part of the product to which the wiring pattern 20 is applied, or it may temporarily hold the wiring pattern 20 and be removed (e.g., peeled off) after the wiring pattern 20 is transferred to the product to which it is applied.

[0036] The plurality of wiring patterns 20 provided on the insulating substrate 10 have a first wiring pattern 21 composed of a first connection pad 31, a second connection pad 32, and a connecting wire 201 connecting the first connection pad 31 and the second connection pad 32. The connecting wire 201 includes a parallel section 202 having a plurality of metal wires 50 spaced apart from each other. In the parallel section 202, the gap between two adjacent metal wires 50 is wider than the width of the metal wire 50.

[0037] In the wiring member 1A, the entire connecting wiring 201 that connects the first connecting pad 31 and the second connecting pad 32 forms a parallel section 202. That is, one end of a plurality of metal wires 50 is connected to the first connecting pad 31, and these plurality of metal wires 50 extend substantially parallel to each other, with their other ends connected to the second connecting pad 32.

[0038] Here, it is preferable that the width of the parallel section 202 (length in the direction perpendicular to the extension direction) is wider than the width of the first connection pad 31 and the second connection pad 32. This widens the width of the parallel section 202, improving visibility by reducing the density of the multiple metal wirings.

[0039] Figure 2A is a schematic plan view illustrating a wiring member according to the first embodiment. Figure 2B is a cross-sectional view taken along line A1-A1' in Figure 2A. Figure 2C is an enlarged view of part A in Figure 2B. Figure 3A is a schematic plan view illustrating a state in which a device is mounted. Figure 3B is a cross-sectional view taken along line A2-A2' in Figure 3A. For the sake of explanation, the connecting wiring 201 is simplified in Figures 2A to 3B. In the wiring member 1A, the connecting wiring 201 and the connecting pads (first connecting pad 31, etc.) of the plurality of wiring patterns 20 are formed on one surface 10a of the insulating substrate 10. A wiring protection layer 40 is formed on the connecting wiring 201.

[0040] In the wiring member 1A, the gap S between two adjacent metal wires 50 in the parallel section 202 is wider than the width L of the metal wire 50. As a result, compared to the case where a single thick metal wire 50 constitutes the conductive wiring, the conductive wiring is divided into multiple wires and dispersed, thereby improving visibility without increasing electrical resistance.

[0041] In this embodiment, the ratio (Space / Line) of the gap S to the width L of adjacent metal wirings 50 in the juxtaposed portion 202 is constant. The width L of the plurality of metal wirings 50 is less than 20 μm, the ratio of the gap S to the width L of two adjacent metal wirings 50 is greater than 10, and the aspect ratio of the thickness H to the width L of the plurality of metal wirings 50 is preferably greater than 0.5 and less than 2.5. Thereby, the width of the juxtaposed portion 202 expands, and the invisibility is improved due to the decrease in the density of the plurality of metal wirings. At the same time, the increase in the electrical resistance of the conduction wiring formed by the plurality of metal wirings 50 is suppressed. Further, when the aspect ratio of the thickness H to the width L of the metal wiring 50 is 2.5 or more, the metal wiring 50 is likely to peel off from the insulating substrate 10 due to the film stress of the metal wiring 50. Therefore, by making the aspect ratio of the thickness H to the width L of the metal wiring 50 less than 2.5, the film stress of the metal wiring 50 is reduced, and the metal wiring 50 can obtain good adhesion to the insulating substrate 10.

[0042] In the wiring member 1A, the plurality of wiring patterns 20 include a second wiring pattern 22 formed of a third connection pad 33, a fourth connection pad 34, and a connection wiring 201 connecting between the third connection pad 33 and the fourth connection pad 34.

[0043] The first wiring pattern 21 and the second wiring pattern 22 are arranged such that the first connection pad 31 and the third connection pad 33 are adjacent to each other with a gap therebetween. The first connection pad 31 and the third connection pad 33 constitute a connection unit with the device D. That is, the first connection pad 31 and the third connection pad 33 are used as pads for mounting the device D, and the device D is mounted so as to straddle between the first connection pad 31 and the third connection pad 33.

[0044] In the wiring member 1A, the plurality of wiring patterns 20 include a third wiring pattern 23 formed of a fifth connection pad 35, a sixth connection pad 36, and a connection wiring 201 connecting between the fifth connection pad 35 and the sixth connection pad 36.

[0045] The first wiring pattern 21 has a seventh connection pad 37 to which the second connection pad 32 is connected by a connection wiring 201. The first wiring pattern 21 and the third wiring pattern 23 are arranged such that the second connection pad 32 and the fifth connection pad 35 are adjacent to each other with a gap therebetween. The second connection pad 32 and the fifth connection pad 35 constitute a connection unit with the device D. That is, the second connection pad 32 and the fifth connection pad 35 are used as pads for mounting the device D, and the device D is mounted so as to straddle between the second connection pad 32 and the fifth connection pad 35. Thereby, with the first wiring pattern 21 as a common wiring, the second wiring pattern 22 and the third wiring pattern 23 are arranged so as to form a parallel circuit.

[0046] The fourth connection pad 34, the sixth connection pad 36, and the seventh connection pad 37 to which the device D is not connected (which do not constitute a connection unit) are used as external connection pads EX. In this case, the seventh connection pad 37 in the first wiring pattern 21 is a common external connection pad EX.

[0047] In the wiring member 1A, with such a first wiring pattern 21 as a common wiring, a plurality (for example, two, namely, circuit configurations CR1 and CR2) of configurations in which the second wiring pattern 22 and the third wiring pattern 23 form a parallel circuit are provided.

[0048] As the device D, a light source device (such as an LED) or an image sensor or the like is used. For example, two of the four devices D are light source devices, and the other two are image sensors.

[0049] Figs. 4A to 4C are schematic cross-sectional views illustrating metal wirings. The metal wiring 50 shown in Fig. 4A is constituted by a laminate of a patterned adhesion layer 51 provided on an insulating base material 10 and a main conductive layer 52 formed on the adhesion layer 51. For example, a CuNi alloy is used for the adhesion layer 51. Also, for example, Cu is used for the main conductive layer 52.

[0050] The metal wiring 50 shown in Figure 4B is composed of a laminate of an adhesion layer 53 provided on an insulating substrate 10 and a main conductive layer 52 formed on the adhesion layer 53. For example, an easy-adhesion layer can be used for the adhesion layer 53. The insulating adhesion layer 53 does not need to be patterned.

[0051] The metal wiring 50 shown in Figure 4C is composed of a laminate of an adhesion layer 53 provided on an insulating substrate 10, a patterned adhesion layer 51 formed on the adhesion layer 53, and a main conductive layer 52 formed on the adhesion layer 51. For example, an easy-adhesion layer is used for the adhesion layer 53, a CuNi alloy is used for the adhesion layer 51, and Cu is used for the main conductive layer 52.

[0052] (Second Embodiment) Figure 5A is a plan view illustrating a wiring member 1B according to the second embodiment. Figures 5B and 5C are enlarged plan views illustrating a wiring member 1B according to the second embodiment. The wiring member 1B according to the second embodiment comprises a light-transmitting insulating substrate 10 and a plurality of wiring patterns 20 provided on the insulating substrate 10. The insulating substrate 10 is made of, for example, resin or glass. A specific example of the insulating substrate 10 is the lens portion of eyeglasses (eyewear).

[0053] The plurality of wiring patterns 20 provided on the insulating substrate 10 have a first wiring pattern 21 composed of a first connection pad 31, a second connection pad 32, and a connecting wire 201 connecting the first connection pad 31 and the second connection pad 32. The connecting wire 201 includes a parallel section 202 having a plurality of metal wires 50 spaced apart from each other. In the parallel section 202, the gap between two adjacent metal wires 50 is wider than the width of the metal wire 50.

[0054] In the wiring member 1B, the entire connecting wiring 201 that connects the first connecting pad 31 and the second connecting pad 32 forms a parallel section 202. That is, one end of a plurality of metal wires 50 is connected to the first connecting pad 31, and these plurality of metal wires 50 extend substantially parallel to each other, with their other ends connected to the second connecting pad 32.

[0055] One parallel section 202 shown in Figure 5B is composed of eight metal wires 50, and one parallel section 202 shown in Figure 5C is composed of ten metal wires 50. In both cases, the width of the parallel section 202 (the total width occupied by the multiple metal wires 50) is wider than the width of the first connection pad 31 and the second connection pad 32. If the first connection pad 31 and the second connection pad 32 are rectangular, the multiple metal wires 50 are connected along multiple sides (for example, three sides) of the four sides. As a result, the multiple metal wires 50 of the parallel section 202 extend outward from the first connection pad 31 and the second connection pad 32, increasing the overall width and improving visibility due to a decrease in the density of the multiple metal wires 50.

[0056] Figure 6A is a schematic plan view illustrating a wiring member according to the second embodiment. Figure 6B is a cross-sectional view taken along line B1-B1' in Figure 6A. Figure 6C is a cross-sectional view taken along line B2-B2' in Figure 6A. For the sake of explanation, the connecting wiring 201 is simplified in Figures 6A to 6C. In the wiring member 1B, the gap S between two adjacent metal wires 50 in the parallel section 202 is wider than the width L of the metal wire 50. As a result, compared to the case where the conductive wiring is composed of one thick metal wire 50, the conductive wiring is divided and dispersed into multiple wires, thereby improving invisibility without increasing electrical resistance.

[0057] In the wiring member 1B according to the second embodiment, similar to the wiring member 1A according to the first embodiment, the ratio of the gap S to the width L of adjacent metal wirings 50 in the parallel section 202 (Space / Line) is constant, the width L of the multiple metal wirings 50 is less than 20 μm, the ratio of the gap S to the width L of two adjacent metal wirings 50 is greater than 10, and the aspect ratio of the thickness H to the width L of the multiple metal wirings 50 is greater than 0.5 and less than 2.5, which is preferable. This widens the width of the parallel section 202, improving its invisibility, and suppresses the increase in electrical resistance of the conductive wiring composed of multiple metal wirings 50. Furthermore, if the aspect ratio of the thickness H to the width L of the metal wiring 50 is 2.5 or more, the film stress of the metal wiring 50 makes it easier for the metal wiring 50 to peel off from the insulating substrate 10. Therefore, by setting the aspect ratio of the thickness H to the width L of the metal wiring 50 to less than 2.5, the film stress of the metal wiring 50 is reduced, and the metal wiring 50 can achieve good adhesion with the insulating substrate 10.

[0058] Furthermore, in the wiring member 1B, the plurality of wiring patterns 20 have a second wiring pattern 22 which is composed of a third connection pad 33, a fourth connection pad 34, and a connecting wire 201 that connects the third connection pad 33 and the fourth connection pad 34.

[0059] The first wiring pattern 21 and the second wiring pattern 22 have the first connection pad 31 and the third connection pad 33 positioned adjacent to each other with a gap between them. The first connection pad 31 and the third connection pad 33 constitute a connection unit with device D. In other words, the first connection pad 31 and the third connection pad 33 are used as pads for mounting device D, and device D is mounted so as to straddle the space between the first connection pad 31 and the third connection pad 33.

[0060] Furthermore, in the wiring member 1B, the multiple wiring patterns 20 are arranged to form a series circuit by repeatedly connecting to the device D via a connection unit. The connection pads of the multiple wiring patterns 20 that do not constitute a connection unit become the external connection pads EX.

[0061] For example, the wiring member 1B has a first wiring pattern 21, a second wiring pattern 22, a third wiring pattern 23, a fourth wiring pattern 24, and a fifth wiring pattern 25.

[0062] The third wiring pattern 23 consists of a fifth connection pad 35, a sixth connection pad 36, and a connection wire 201 connecting the fifth connection pad 35 and the sixth connection pad 36. The fifth connection pad 35 is positioned adjacent to the second connection pad 32, with a gap between them. The connection unit is then formed by mounting device D so as to straddle the space between the fifth connection pad 35 and the second connection pad 32.

[0063] The fourth wiring pattern 24 consists of a seventh connection pad 37, an eighth connection pad 38, and a connection wire 201 connecting the seventh connection pad 37 and the eighth connection pad 38. The seventh connection pad 37 is positioned adjacent to the fourth connection pad 34, with a gap between them. The connection unit is then formed by mounting device D so as to straddle the space between the seventh connection pad 37 and the fourth connection pad 34.

[0064] The fifth wiring pattern 25 consists of a ninth connection pad 39, a tenth connection pad 310, and a connection wire 201 connecting the ninth connection pad 39 and the tenth connection pad 310. The ninth connection pad 39 is positioned adjacent to the eighth connection pad 38, with a gap between them. The connection unit is then formed by mounting device D so as to straddle the space between the ninth connection pad 39 and the eighth connection pad 38.

[0065] In the wiring member 1B, the third wiring pattern 23, the first wiring pattern 21, the second wiring pattern 22, the fourth wiring pattern 24, and the fifth wiring pattern 25 are arranged in a series circuit via a connection unit in that order. The sixth connection pad 36 and the tenth connection pad 310, which do not constitute a connection unit, are at both ends of the series circuit and these become the external connection pads EX.

[0066] (Third Embodiment) Figure 7A is a schematic plan view illustrating the wiring member 1C according to the third embodiment. Figure 7B is a cross-sectional view taken along the line C1-C1' in Figure 7A. Figure 7C is a cross-sectional view taken along the line C2-C2' in Figure 7A. For the sake of clarity, the connecting wiring 201 is simplified in Figures 7A to 7C. The wiring member 1C according to the third embodiment comprises a light-transmitting insulating substrate 10 and a plurality of wiring patterns 20 provided on one side and the other side of the insulating substrate 10, respectively. The insulating substrate 10 is made of, for example, resin or glass. A specific example of the insulating substrate 10 is the lens portion of eyeglasses (eyewear).

[0067] The multiple wiring patterns 20 of the wiring member 1C according to the third embodiment have the same configuration as the multiple wiring patterns 20 of the wiring member 1A according to the first embodiment, but of the two parallel circuit configurations, circuit configuration CR1 is formed on one surface 10a of the insulating substrate 10, and circuit configuration CR2 is formed on the other surface 10b of the insulating substrate 10. When viewed in the direction normal to surfaces 10a and 10b of the insulating substrate 10, circuit configuration CR1 and circuit configuration CR2 are arranged in positions that do not overlap each other.

[0068] (Fourth Embodiment) Figure 8A is a schematic plan view illustrating the wiring member 1D according to the fourth embodiment. Figures 8B and 8C are enlarged plan views schematically illustrating the parallel arrangement portion 202 of the wiring member 1D according to the fourth embodiment. For the sake of explanation, the connecting wiring 201 is simplified in Figures 8A to 8C. The wiring member 1D according to the fourth embodiment comprises a light-transmitting insulating substrate 10 and a plurality of wiring patterns 20 provided on the insulating substrate 10. The insulating substrate 10 is made of, for example, resin or glass. A specific example of the insulating substrate 10 is the lens portion of eyeglasses (eyewear).

[0069] The plurality of wiring patterns 20 of the wiring member 1D according to the fourth embodiment have the same configuration as the plurality of wiring patterns 20 of the wiring member 1A according to the first embodiment, but the connecting wiring 201 includes a curved portion 201a. In some cases, the connecting wiring 201 provided between two connecting pads (for example, between the third connecting pad 33 and the fourth connecting pad 34) cannot be connected using only straight portions. In this case, by including a curved portion 201a in the connecting wiring 201, it is possible to avoid sharp bending of the metal wiring 50.

[0070] The curved section 201a may be a metal wiring 501 with a low curvature curve as shown in Figure 8B, or a metal wiring 502 with a high curvature curve as shown in Figure 8C. Also, as shown in Figure 8C, a metal wiring 503 in which the angles of multiple short straight lines are changed is also included in the curved section 201a.

[0071] (Fifth Embodiment) Figure 9A is a schematic plan view illustrating a wiring member 1E according to the fifth embodiment. Figure 9B is a cross-sectional view taken along the line E1-E1' in Figure 9A. For the sake of clarity, the connecting wiring 201 is simplified in Figures 9A and 9B. The wiring member 1E according to the fifth embodiment comprises a light-transmitting insulating substrate 10 and a plurality of wiring patterns 20 provided on the insulating substrate 10. The insulating substrate 10 is made of, for example, resin or glass. A specific example of the insulating substrate 10 is the lens portion of eyeglasses (eyewear).

[0072] The plurality of wiring patterns 20 of the wiring member 1E according to the fifth embodiment have a similar configuration to the plurality of wiring patterns 20 of the wiring member 1A according to the first embodiment, but the number and spacing of the plurality of metal wires 50 constituting some of the connecting wiring 201 are different from the number and spacing of the plurality of metal wires 50 constituting other connecting wiring 201.

[0073] For example, in wiring member 1E, the number of metal wires 50 in the connecting wiring 201-1 that connects the first connection pad 31 and the second connection pad 32 of the first wiring pattern 21 is greater than the number of metal wires 50 in other connecting wiring 201. Also, the gaps between the metal wires 50 in connecting wiring 201-1 are narrower than the gaps between the metal wires 50 in other connecting wiring 201.

[0074] Figure 10A is an enlarged plan view showing a specific example of the wiring member 1E according to the fifth embodiment. Figure 10A shows an enlarged plan view of section E shown in Figure 9A. Figure 10B is a cross-sectional view taken along the line E2-E2' in Figure 10A. Figure 10C is a cross-sectional view taken along the line E3-E3' in Figure 10A. The wiring member 1E shown in Figure 10A has a configuration in which the first wiring pattern 21 is a common wiring, and the second wiring pattern 22 and the third wiring pattern 23 form a parallel circuit. The number of metal wires 50 in the connection wiring 201-1 of the first wiring pattern 21, which is the common wiring, is greater than the number of metal wires 50 in the other connection wirings 201. Also, as shown in Figures 10B and 10C, the gap S1 between the metal wires 50 of the connection wiring 201-1 is narrower than the gap S2 between the metal wires 50 of the other connection wirings 201.

[0075] It is desirable to reduce the resistance of the first wiring pattern 21, which will serve as the common wiring. On the other hand, if the metal wiring 50 is made thicker to reduce resistance, it will be more easily visible. Therefore, by making the width L1 of each of the multiple metal wirings 50 in the connecting wiring 201-1 of the first wiring pattern 21, which will serve as the common wiring, thinner than the width L2 of each of the metal wirings 50 in the second wiring pattern 22 and the third wiring pattern 23, the total line width is increased to reduce resistance, while the visibility is improved by widening the width W1 of the parallel section 202 to a width W2, thereby reducing the density of the multiple metal wirings 50.

[0076] Furthermore, the width L2 of each of the multiple metal wires 50 constituting the connecting wiring 201 in the second wiring pattern 22 and the third wiring pattern 23 may be made thicker than the width L1 of each of the multiple metal wires 50 in the connecting wiring 201-1 of the first wiring pattern 21. That is, in the second wiring pattern 22 and the third wiring pattern 23, since there are fewer metal wires 50 compared to the first wiring pattern 21, the width L2 of the metal wires 50 may be made thicker to match the total cross-sectional area of ​​the multiple metal wires 50. Also, if the height of the metal wires 50 is the same, the total line width may be matched.

[0077] Furthermore, in the second wiring pattern 22 and the third wiring pattern 23, if the width L2 of the multiple metal wires 50 is made thicker than the width L1 of each of the multiple metal wires 50 in the first wiring pattern 21 which serves as common wiring, the gap S2 between the multiple metal wires 50 may be made wider than the gap S1 in the first wiring pattern 21 which serves as common wiring. This improves the invisibility due to the reduced density of the multiple metal wires 50.

[0078] As a result, the second wiring pattern 22 and the third wiring pattern 23 achieve lower resistance while increasing the width of the parallel arrangement section 202, thereby improving their invisibility by reducing the density of the multiple metal wires 50.

[0079] Furthermore, when the wiring component 1E is applied to the lens portion of the eyewear, the number and thickness of the metal wiring 50 can be increased in the central area of ​​the lens portion closer to the eyeball, thereby making the metal wiring 50 less visible while ensuring the power supply function. On the other hand, in the peripheral area of ​​the lens portion, the number and thickness of the metal wiring 50 can be decreased and the spacing between them can be increased, thereby making the metal wiring 50 less visible while ensuring the power supply function.

[0080] (Sixth Embodiment) Figure 11A is a schematic plan view illustrating a wiring member 1F according to the sixth embodiment. Figure 11B is a cross-sectional view taken along the line F1-F1' in Figure 11A. For the sake of clarity, the connecting wiring 201 is simplified in Figures 11A and 11B. The wiring member 1F according to the sixth embodiment comprises a light-transmitting insulating substrate 10 and a plurality of wiring patterns 20 provided on the insulating substrate 10. The insulating substrate 10 is made of, for example, resin or glass. A specific example of the insulating substrate 10 is the lens portion of eyeglasses (eyewear).

[0081] The multiple wiring patterns 20 of the wiring member 1F according to the sixth embodiment have a similar configuration to the multiple wiring patterns 20 of the wiring member 1E according to the fifth embodiment, but branching sections 205 are provided in part of the connecting wiring 201. In the example shown in Figure 11A, branching sections 205 are provided in the middle of the connecting wiring 201 of the first wiring pattern 21, in the middle of the connecting wiring 201 of the second wiring pattern 22, and in the middle of the connecting wiring 201 of the third wiring pattern 23.

[0082] The branching section 205 divides the single metal wire 50 before branching into multiple metal wires 50. The multiple metal wires 50 after branching by the branching section 205 form a part of the parallel section 202.

[0083] It is preferable that the width of the metal wiring 50 at the branching section 205 is narrower after branching than before branching. This widens the gaps between the multiple metal wirings 50 after branching, improving invisibility due to the reduced density of the multiple metal wirings. It is also preferable that the cross-sectional area of ​​the metal wiring 50 at the branching section 205 is equal to the sum of the cross-sectional areas of the single metal wiring 50 before branching and the multiple metal wirings 50 after branching. This maintains the overall electrical resistance of the conductive wiring even with the branching section 205 present.

[0084] Figures 12A to 12C are plan views illustrating other examples of branching sections. In the example shown in Figure 12A, a first branching section 205a is provided between the parallel section 202 and the first connection pad 31, and a second branching section 205b is provided between the parallel section 202 and the second connection pad 32. From the first connection pad 31 side toward the second connection pad 32 side, the two metal wires 50 are each divided into two by the first branching section 205a, resulting in a parallel section 202 with four metal wires 50. Furthermore, the four metal wires 50 are combined into two by the second branching section 205b and connected to the second connection pad 32. Thus, when viewed in one direction, the branching section 205 branches the metal wires 50, but when viewed in the opposite direction, it can be said to be a merging section that combines multiple metal wires 50.

[0085] In the example shown in Figure 12B, multiple branching sections 205 are provided. That is, one metal wire 50 is branched into two metal wires 50 by branching section 205c, and each metal wire 50 is further branched into two wires by branching sections 205d and 205e. The number of branching sections 205 is not limited to this.

[0086] Figure 12C shows a specific example of a wiring pattern 20 equipped with branching sections 205. In this example, seven metal wires 50 are connected to both the first connection pad 31 and the second connection pad 32. On the first connection pad 31 side, there is a first branching section 205a that branches each of the seven metal wires 50 into two. That is, there are seven first branching sections 205a on the first connection pad 31 side. On the other hand, on the second connection pad 32 side, there is a second branching section 205b that branches each of the seven metal wires 50 into two. That is, there are seven second branching sections 205b on the second connection pad 32 side. With this configuration, the seven metal wires 50 connected to the first connection pad 31 and the second connection pad 32 are branched into 14 metal wires 50, and the 14 branched metal wires 50 form a parallel section 202.

[0087] In this case, when a first branch section 205a and a second branch section 205b are provided, it is preferable that the width of the metal wiring 50 becomes narrower after branching than before branching. This suppresses the increase in the area occupied by the metal wiring 50, and makes it possible to achieve both low resistance and invisibility of the metal wiring 50.

[0088] Furthermore, as shown in the specific example in Figure 12C, when connecting multiple metal wires 50 to the rectangular first connection pad 31 and second connection pad 32, it is preferable to connect them across multiple sides (for example, three sides) rather than concentrating them on one side of the first connection pad 31 or second connection pad 32, and to arrange them so that they spread outward beyond the width of the first connection pad 31 or second connection pad 32. This widens the gap between two adjacent metal wires 50, improving their visibility.

[0089] (Seventh Embodiment) Figure 13A is a schematic plan view illustrating the wiring member 1G according to the seventh embodiment. Figure 13B is an enlarged view of section G in Figure 13A. Figure 13C is a cross-sectional view taken along the line G1-G1' in Figure 13B. For the sake of clarity, the connecting wiring 201 is simplified in Figures 13A to 13C. The wiring member 1G according to the seventh embodiment comprises a light-transmitting insulating substrate 10 and a plurality of wiring patterns 20 provided on the insulating substrate 10. The insulating substrate 10 is made of, for example, resin or glass. A specific example of the insulating substrate 10 is the lens portion of eyeglasses (eyewear).

[0090] The wiring member 1G according to the seventh embodiment has a similar configuration to the multiple wiring patterns 20 of the wiring member 1F according to the sixth embodiment, but the width of the multiple metal wires 50 is sequentially changed in a part of the wiring pattern 20. Specifically, in the multiple metal wires 50 of the parallel arrangement section 202, the width is arranged to gradually narrow from the center to the outside. In other words, a gradient is provided in the change in the width of the multiple metal wires 50. This reduces the abrupt change in the difference in density between the areas where the multiple metal wires 50 are present or absent, and increases the invisibility of the parallel arrangement section 202.

[0091] (Eighth Embodiment) Figure 14A is a schematic plan view illustrating the wiring member 1H according to the eighth embodiment. Figure 14B is a cross-sectional view taken along the line H1-H1' in Figure 14A. For the sake of clarity, the connecting wiring 201 is simplified in Figures 14A and 14B. The wiring member 1H according to the eighth embodiment comprises a light-transmitting insulating substrate 10 and a plurality of wiring patterns 20 provided on the insulating substrate 10. The insulating substrate 10 is made of, for example, resin or glass. A specific example of the insulating substrate 10 is the lens portion of eyeglasses (eyewear).

[0092] The plurality of wiring patterns 20 of the wiring member 1H according to the eighth embodiment have the same configuration as the plurality of wiring patterns 20 of the wiring member 1A according to the first embodiment, but the wiring member 1H further includes dummy wiring 60 arranged around the wiring patterns 20. The dummy wiring 60 has metal wiring 60a arranged along the connecting wiring 201 of the wiring patterns 20. For example, the dummy wiring 60 has a plurality of metal wirings 60a arranged around the parallel arrangement portion 202 so as to be along the metal wiring 50 of the parallel arrangement portion 202. By providing such dummy wiring 60, the power supply performance of the plurality of metal wirings 50 of the connecting wiring 201 is maintained, while the difference in density between areas with and without the plurality of metal wirings 50 is reduced.

[0093] Figure 15A is an enlarged plan view showing an example of the pattern width of the dummy wiring. Figure 15B is a cross-sectional view taken along the line H2-H2' in Figure 15A. As shown in Figures 15A and 15B, among the multiple metal wires 60a of the dummy wiring 60, the metal wire 60a closest to the parallel section 202 may be provided such that it is wider and has a larger cross-sectional area compared to the metal wire 60a furthest from the parallel section 202. For example, among the multiple metal wires 60a of the dummy wiring 60, the pattern width of the metal wires 60a narrows sequentially from the side closer to the parallel section 202 to the side further away. That is, a gradient is provided in the change of width of the multiple metal wires 60a. This increases the invisibility of the dummy wiring 60 composed of multiple metal wires 60a.

[0094] (Ninth Embodiment) Figure 16A is an enlarged plan view illustrating a wiring member 1I according to the ninth embodiment. Figure 16B is a cross-sectional view taken along the line I1-I1' in Figure 16A. For the sake of clarity, the connecting wiring 201 is simplified in Figures 16A and 16B. The wiring member 1I according to the ninth embodiment comprises a light-transmitting insulating substrate 10 and a plurality of wiring patterns 20 provided on the insulating substrate 10. The insulating substrate 10 is made of, for example, resin or glass. A specific example of the insulating substrate 10 is the lens portion of eyeglasses (eyewear).

[0095] The plurality of wiring patterns 20 of the wiring member 1I according to the ninth embodiment have the same configuration as the plurality of wiring patterns 20 of the wiring member 1A according to the first embodiment, but further include a shield portion 70 on some of the connecting wirings 201. The shield portion 70 is provided at a position that overlaps with the connecting wirings 201 when viewed in the thickness direction of the insulating substrate 10. As shown in Figure 16B, it is preferable that the shield portion 70 is provided on both one side surface 10a and the other side surface 10b of the insulating substrate 10 at the location of the connecting wirings 201 to be shielded. By providing the shield portion 70, it is possible to suppress the intrusion of noise signals into the connecting wirings 201 from the outside.

[0096] (Other Examples of Metal Wiring and Connecting Pads) Figures 17A to 17C are schematic cross-sectional views showing other examples of metal wiring. The metal wiring 50 shown in Figure 17A has a conductor portion 5011 and an optical function portion 5012. The conductor portion 5011 is patterned with a metallic material such as Cu. The optical function portion 5012 is provided on at least a portion of the surface of the conductor portion 5011. In the example shown in Figure 17A, the optical function portion 5012 is provided on the upper and lower surfaces of the conductor portion 5011. That is, the conductor portion 5011 is provided between the upper and lower optical function portions 5012.

[0097] Examples of optical functional units 5012 include those having an anti-reflection function for infrared and visible light, and a blackening function that absorbs light. Conductor parts 5011 formed from metal materials tend to reflect ambient light, which can reduce invisibility. Therefore, by providing optical functional units 5012 on the conductor part 5011, reflection of ambient light can be suppressed, and invisibility can be improved even when metal materials are used. Furthermore, in a system for determining the gaze detection position, if an infrared LED is used in device D (see Figure 2A, etc.), infrared light from the infrared LED and infrared light from the eyeball may be reflected by the metal material, potentially reducing the accuracy of gaze detection. Therefore, by providing optical functional units 5012 with an anti-reflection function for infrared light and a blackening function that absorbs infrared light, the accuracy of gaze detection can be improved.

[0098] Furthermore, if the insulating substrate 10 is translucent, there is a possibility that light transmitted through the insulating substrate 10 from the insulating substrate 10 side may be reflected by the conductor portion 5011. For this reason, by providing an optical functional portion 5012 between the insulating substrate 10 and the conductor portion 5011, the reflection of light from the insulating substrate 10 side can be suppressed.

[0099] The metal wiring 50 shown in Figure 17B has a conductor portion 5011 and an optical functional portion 5012 that surrounds the conductor portion 5011. By covering the conductor portion 5011 with the optical functional portion 5012, the anti-reflection function of light around the entire periphery of the conductor portion 5011 can be enhanced.

[0100] Figure 17C is a schematic cross-sectional view showing an example of another connection pad. The connection pad 30 shown in Figure 17C has a conductor portion 3011 made of a metallic material and a cap layer 3012 provided on the conductor portion 3011. The cap layer 3012 is a connection stabilization layer. By providing the cap layer 3012 on the conductor portion 3011, the mechanical and electrical connection between the connection pad 30 and the external terminal is stabilized. For example, the connection stabilization layer may be formed as a single layer or laminate of metals such as Au, Ag, Ag alloy, Ni, Ni alloy, Cu, Cu alloy, etc.

[0101] Figure 18 is a schematic cross-sectional view showing examples of other connecting wiring and connecting pads. Figure 18 shows an example of connecting wiring 201 and connecting pad 30 using an imprint mold 80. The imprint mold 80 is provided on an insulating substrate 10. For example, an imprint mold 80 is formed by pressing a convex stamp onto an imprint resin to transfer the shape of the connecting wiring 201 and connecting pad 30 as recesses. The connecting wiring 201 and connecting pad 30 are formed by embedding a conductive material in the recesses of this imprint mold 80. An insulating member 90 is provided on the connecting wiring 201, and an opening in the insulating member 90 is provided on a part of the connecting pad 30.

[0102] (Examples of wiring members for eyewear) Figures 19A and 19B show examples of wiring members for eyewear. Figures 19A and 19B show examples of wiring members 1A to 1I (hereinafter collectively referred to as wiring member 1) according to this embodiment being applied to eyewear 100. Figure 19B shows an enlarged schematic diagram of the lens portion 110 of the eyewear 100.

[0103] The eyewear 100 shown in Figure 19A is of the glasses type, but it may also be of other forms such as goggles or glasses-attached type. For example, in the case of glasses-type eyewear 100, it has two lens parts 110 corresponding to the positions of the left and right eyes, and left and right temple parts 120 that rest on the ears. The wiring member 1 according to this embodiment is applied to the lens part 110 of the eyewear 100 (see Figure 19B).

[0104] When eye tracking (gaze detection) is performed using the eyewear 100, a light source device (e.g., an infrared LED) and an image sensor are used as device D. That is, a light source device is mounted on one of the connection pads 30, and an image sensor is mounted on one of the other connection pads 30. In addition, the connection pad 30 to which device D is not connected is positioned as an external connection pad EX on the outer edge side of the lens portion 110, i.e., away from the center of the field of view.

[0105] When applying the wiring member 1 to the eyewear 100, the insulating base material 10 of the wiring member 1 may be attached to the lens portion 110 (for example, by adhesive), or the lens portion 110 may be used as the insulating base material 10. Alternatively, the connecting wiring 201 and connecting pad 30 may be transferred from the insulating base material 10 to the lens portion 110, and the insulating base material 10 may be peeled off after the transfer.

[0106] When the insulating substrate 10 is attached to the lens portion 110, a light-transmitting insulating substrate 10 (light-transmitting substrate) is used. In this case, the wiring member 1 becomes a light-transmitting wiring member.

[0107] When the wiring member 1 is a light-transmitting wiring member, as shown in Figure 19B, the insulating substrate 10 has a central region R1 and a peripheral region R2 outside the central region R1. The connection pad 30 is arranged in the peripheral region R2 of the insulating substrate 10. In addition, at least one of the connection pads 30 that will become the external connection pad EX is positioned on the outer edge side of the insulating substrate 10 than the other connection pads 30. This makes it possible to provide both power supply to the device D connected to the connection pad 30 in the eyewear 100 and the invisibility of the connection wiring 201.

[0108] Although the embodiments described above are examples, the present invention is not limited to these examples. For example, any additions, deletions, or design modifications of components to the aforementioned embodiments, or combinations of the features of the configuration examples of each embodiment, as appropriate by those skilled in the art, are also included within the scope of the present invention, as long as they retain the essence of the present invention.

[0109] 1, 1A to 1I...Wiring material 10...Insulating base material 10a, 10b...Surface 20...Wiring pattern 21...First wiring pattern 22...Second wiring pattern 23...Third wiring pattern 24...Fourth wiring pattern 25...Fifth wiring pattern 30...Connecting pad 31...First connecting pad 32...Second connecting pad 33...Third connecting pad 34...Fourth connecting pad 35...Fifth connecting pad 36...Sixth connecting pad 37...Seventh connecting pad 38...Eighth connecting pad 39...Ninth connecting pad 310...Tenth connecting pad 40...Wiring protection layer 50...Metal wiring 51...Adhesion layer 52...Main conductive layer 53...Adhesion layer 60...Dummy wiring 60a...Metal wiring 70...Shielding part 80...Imprint type 90...Insulating material 100...Eyewear 110...Lens part 120...Spur section 201...Connection wiring 201-1...Connection wiring 201a...Curved section 202...Parallel section 205, 205c, 205d, 205e...Branching section 205a...First branching section 205b...Second branching section 501, 502, 503...Metal wiring 3011...Conductor section 3012...Cap layer 5011...Conductor section 5012...Optical function section CR1, CR2...Circuit configuration D...Device EX...External connection pad L, L1, L2...Width H...Thickness R1...Central area R2...Peripheral area S, S1, S2...Gap W1, W2...Width

Claims

A light-transmitting insulating substrate, The insulating substrate comprises a plurality of wiring patterns provided on the insulating substrate, Multiple of the aforementioned wiring patterns are It has a first wiring pattern comprising a first connection pad, a second connection pad, and a connection wire connecting the first connection pad and the second connection pad, The aforementioned connecting wiring includes a parallel section having multiple metal wires spaced apart from each other, A wiring member characterized in that, in the parallel arrangement section, the gap between two adjacent metal wires is wider than the width of the metal wires. 　 The wiring member according to claim 1, wherein the width of the parallel arrangement portion is wider than the width of the first connection pad and the second connection pad. 　 The wiring member according to claim 1, wherein the connecting wiring includes a branching section in which one metal wire branches into multiple metal wires. 　 The wiring member according to claim 3, wherein in the branching section, the width of the metal wiring is narrower after the branching than before the branching. 　 The wiring member according to claim 4, wherein at the branching portion, the cross-sectional area of ​​the single metal wire before branching is equal to the sum of the cross-sectional areas of the multiple metal wires after branching. 　 The wiring member according to claim 3, wherein the multiple metal wires after branching constitute a part of the parallel arrangement section. 　 The wiring member according to claim 3, wherein the branch portion is formed between the parallel portion and the first connection pad. 　 The wiring member according to claim 3, wherein the branch portion is formed between the parallel portion and the second connection pad. 　 The wiring member according to claim 3, wherein, in the branching section, the gap between the two adjacent metal wires before the branching is wider than the width of the metal wires. 　 In the parallel arrangement section, the ratio of the gap between adjacent metal wires (Space / Line) is constant. The width of the plurality of metal wires is less than 20 μm, and the ratio of the gap between the widths of two adjacent metal wires is greater than 10. The wiring member according to claim 1, wherein the aspect ratio of the thickness to the width of the plurality of metal wirings is greater than 0.5 and less than 2.

5. The wiring member according to claim 1, wherein the metal wiring has a laminate of a CuNi alloy which is an adhesion layer with the insulating substrate and Cu which is a main conductive layer formed on the adhesion layer. 　 The aforementioned multiple wiring patterns are The second wiring pattern comprises a third connection pad, a fourth connection pad, and a connection wire connecting the third and fourth connection pads. The first wiring pattern and the second wiring pattern are arranged such that the first connection pad and the third connection pad are adjacent to each other with a gap between them. The wiring member according to claim 1, wherein the first connection pad and the third connection pad constitute a connection unit with a device. 　 The wiring member according to claim 12, wherein the plurality of wiring patterns are arranged to form a series circuit by repeatedly connecting to the device via the connection unit, and among the plurality of connection pads of the plurality of wiring patterns, the connection pads that do not constitute the connection unit are external connection pads. 　 Multiple of the aforementioned wiring patterns are The third wiring pattern comprises a fifth connection pad, a sixth connection pad, and a connection wire connecting the fifth connection pad and the sixth connection pad. The first wiring pattern further comprises a seventh connection pad connected to the second connection pad by a connection wire, The first wiring pattern and the third wiring pattern are arranged such that the second connection pad and the fifth connection pad are adjacent to each other with a gap between them. The second connection pad and the fifth connection pad constitute a connection unit with the device. The wiring member according to claim 12, wherein the first wiring pattern is used as a common wiring, and the second wiring pattern and the third wiring pattern are arranged to form a parallel circuit. 　 The wiring member according to claim 14, wherein the connection pad that does not constitute the connection unit is an external connection pad. 　 The wiring member according to claim 12, wherein the device connected to the connection unit is a light source device or an image sensor. 　 A light-transmitting insulating substrate having a central region and a peripheral region, External connection pads arranged in the aforementioned peripheral region, It has a plurality of wiring patterns that are electrically connected to the external connection pad and extend around the central region, The wiring pattern comprises a parallel section having multiple metal wires spaced apart from each other, In the parallel arrangement section, the gap between two adjacent metal wires is wider than the width of the metal wires, in the wiring member for eyewear. 　 The wiring pattern has connecting wires, the number of connecting wires in the wiring pattern is greater from the peripheral region to the periphery of the central region, and the width of the connecting wires becomes narrower, as described in claim 17. 　 The wiring pattern has a branching section in which one metal wire of the connecting wiring branches into multiple metal wires, and the multiple metal wires after branching are close to the central region, as described in claim 18. 　 The wiring member for eyewear according to claim 19, wherein the multiple metal wires after branching constitute a part of the parallel arrangement portion. 　 The wiring member for eyewear according to claim 17, wherein the plurality of wiring patterns have a plurality of connection units arranged in a series circuit around the central region. 　 The wiring member for eyewear according to claim 17, wherein the plurality of wiring patterns have connection units for common wiring of parallel circuits arranged around the central region.

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