Substrate processing system

Abstract

A disclosed substrate processing system comprises a vacuum transport module, a plurality of process modules, and a shared transmission path. The vacuum transport module has a vacuum transport chamber. The plurality of process modules each include a first side part disposed along one side surface of the vacuum transport chamber, a processing chamber connected to the vacuum transport chamber at the first side part, and a second side part extending on the opposite side from the first side part. The shared transmission path, which is for supplying power to the plurality of process modules, is connected to the second side parts of the plurality of process modules and extends along the second side parts of the plurality of process modules.

Description

Substrate Processing System

[0001] Exemplary embodiments of the present disclosure relate to a substrate processing system.

[0002] The substrate processing system is used in substrate processing. The following Patent Document 1 discloses a substrate processing system including a transfer chamber and a plurality of plasma processing chamber units.

[0003] Japanese Patent Application Laid-Open No. 2002-151296

[0004] The present disclosure provides a technique for facilitating wiring for power supply to a plurality of process modules of a substrate processing system.

[0005] In one exemplary embodiment, a substrate processing system is disclosed. The substrate processing system includes a vacuum transfer module, a plurality of process modules, and a common transmission line. The vacuum transfer module has a vacuum transfer chamber. Each of the plurality of process modules includes a first side portion disposed along one side surface of the vacuum transfer chamber, a processing chamber connected to the vacuum transfer chamber at the first side portion, and a second side portion extending on the opposite side of the first side portion. The common transmission line is a transmission line for power supply to the plurality of process modules, is attached to the second side portion of each of the plurality of process modules, and extends along the second side portion of each of the plurality of process modules.

[0006] According to one exemplary embodiment, a technique for facilitating wiring for power supply to a plurality of process modules of a substrate processing system is provided.

[0007] This is a plan view showing a substrate processing system according to one exemplary embodiment. This is a side view showing a substrate processing system according to one exemplary embodiment. This is a perspective view showing an example of a connector in a substrate processing system according to one exemplary embodiment. This is an exploded perspective view showing an example of a process module in a substrate processing system according to one exemplary embodiment. This is a diagram showing an example of a power supply configuration including a breaker in a substrate processing system according to one exemplary embodiment. This is a perspective view showing another example of a connector in a substrate processing system according to one exemplary embodiment. This is a cross-sectional view showing a transport system in a substrate processing system according to one exemplary embodiment. This is a perspective view showing an example of a transport device and a planar motor in a substrate processing system according to one exemplary embodiment. This is a block diagram of a computer (a type of circuit) capable of realizing the various control modes described herein.

[0008] Various exemplary embodiments will be described in detail below with reference to the drawings. In each drawing, the same or corresponding parts will be denoted by the same reference numerals.

[0009] Figure 1 is a plan view showing a substrate processing system according to one exemplary embodiment. Figure 1 schematically shows the substrate processing system according to one exemplary embodiment viewed from above. Figure 2 is a side view showing the substrate processing system according to one exemplary embodiment.

[0010] The substrate processing system 1 shown in Figures 1 and 2 includes a vacuum transport module 10 and a plurality of process modules 11 (PM). The substrate processing system 1 may further include a load port 13, a loader module 14, and load lock modules 151, 152. The substrate processing system 1 may further include a plurality of transport devices 20. The substrate processing system 1 may also further include a control unit 2.

[0011] The load port 13 is configured to support one or more substrate carriers 16 placed on it. Each of the substrate carriers 16 is a container capable of housing multiple substrates W. Each of the substrate carriers 16 is, for example, a FOUP (Front Opening Unified Pod). The load port 13 is located along one of a pair of side walls of the atmospheric transport chamber 14c of the loader module 14.

[0012] The loader module 14 is positioned between the load port 13 and the load lock modules 151 and 152, respectively. The loader module 14 includes an atmospheric transport chamber 14c. The atmospheric transport chamber 14c has an atmospheric transport space 14s as its internal space. The pressure in the atmospheric transport space 14s is set to atmospheric pressure.

[0013] The loader module 14 further includes a transport robot 14r. The transport robot 14r is located inside the atmospheric transport chamber 14c. Under the control of the control unit 2, the transport robot 14r is configured to transport the substrate W between the substrate carrier 16 and the respective pre-depressurization chambers of the load lock modules 151 and 152, which will be described later, via the atmospheric transport space 14s.

[0014] Each of the load lock modules 151 and 152 is arranged along the other of the pair of side walls of the atmospheric transport chamber 14c. Each of the load lock modules 151 and 152 is positioned between the atmospheric transport chamber 14c and the vacuum transport chamber 10c of the vacuum transport module 10. Each of the load lock modules 151 and 152 has a pre-depressurization chamber. Each of the load lock modules 151 and 152 is connected to the atmospheric transport chamber 14c via a gate valve. The pre-depressurization chambers of each of the load lock modules 151 and 152 and the atmospheric transport chamber 14c are connected by opening the gate valve between them and are isolated from each other by closing the gate valve. Each of the load lock modules 151 and 152 is also connected to the vacuum transport chamber 10c via a gate valve.

[0015] The vacuum transfer chamber 10c has a vacuum transfer space 10s as its internal space. The vacuum transfer space 10s can be set to a reduced pressure state or a vacuum state by a pump connected to the vacuum transfer chamber 10c. The vacuum transfer space 10s and the respective pre-reduced pressure chambers of the load lock modules 151 and 152 are connected by opening the gate valve between them, and are isolated from each other by closing the gate valve.

[0016] In one embodiment, the vacuum transfer chamber 10c may have a substantially rectangular parallelepiped shape. That is, the vacuum transfer chamber 10c may include a pair of first side walls extending along its longitudinal direction and a pair of second side walls extending along its short direction. One of the pair of second side walls constitutes one end of the vacuum transfer chamber 10c in the longitudinal direction. The other of the pair of second side walls constitutes the other end of the vacuum transfer chamber 10c in the longitudinal direction. The vacuum transfer chamber 10c is connected to each of the load lock modules 151 and 152 via a gate valve positioned along one of the pair of second side walls.

[0017] The substrates W placed in the pre-depressurization chambers of the load lock modules 151 and 152 are transported from the pre-depressurization chambers into the vacuum transport space 10s by one of the multiple transport devices 20. The substrates W in the vacuum transport space 10s are then transported by one of the multiple transport devices 20 into the processing chamber 11c of one of the multiple process modules 11. An example of the multiple transport devices 20 will be described later.

[0018] The control unit 2 is composed of circuits as described later. The control unit 2 is configured to control each part of the substrate processing system 1. The control unit 2 is configured to control the transport device 20 located in the vacuum transport space 10s to transport the substrate W between the vacuum transport chamber 10c and a selected process module 11 from among the multiple process modules 11.

[0019] Each of the multiple process modules 11 is arranged along the vacuum transport chamber 10c. In the illustrated example, the multiple process modules 11 include multiple process modules 111 and multiple process modules 112. The number of multiple process modules 111 and the number of multiple process modules 112 can each be any number of two or more.

[0020] Each of the plurality of process modules 11 includes a first side 11a, a processing chamber 11c, and a second side 11b. The first side 11a of each of the plurality of process modules 111 is positioned along one side 101 of the vacuum transfer chamber 10c. The side 101 is provided by one of the pair of first side walls described above. The first side 11a of each of the plurality of process modules 112 is positioned along one side 102 of the vacuum transfer chamber 10c. The side 102 is provided by the other of the pair of first side walls described above. The side 101 and the side 102 extend along the longitudinal and vertical directions of the vacuum transfer chamber 10c. The second side 11b extends on the side opposite to the first side 11a. In other words, of the pair of sides of each of the multiple process modules 11 in directions perpendicular to the longitudinal and vertical directions of the vacuum transfer chamber 10c, namely the second side 11b of the first side 11a and second side 11b, the second side 11b is further away from the vacuum transfer chamber 10c than the first side 11a.

[0021] Each processing chamber 11c of the multiple process modules 11 is connected to the vacuum transport chamber 10c at a first side portion 11a via a gate valve. Each processing chamber 11c of the multiple process modules 11 has a processing space as its internal space. The processing spaces of each of the multiple process modules 11 and the vacuum transport space 10s are connected by opening the gate valve between them, and are isolated from each other by closing the gate valve.

[0022] Each of the multiple process modules 11 is configured to process the substrate W within its processing space. The processing performed in each of the multiple process modules 11, i.e., substrate processing, may include, but is not limited to, film deposition, etching (e.g., plasma etching), ashing, and cleaning.

[0023] The following describes the power supply configuration for multiple process modules 111, that is, the power supply configuration including a common transmission line 40. The substrate processing system 1 further includes a power supply configuration for multiple process modules 112, that is, a configuration including another common transmission line 40. The power supply configuration for multiple process modules 112 is the same as the power supply configuration for multiple process modules 111. The following describes the power supply configuration for multiple process modules 111, and omits the description of the power supply configuration for multiple process modules 112.

[0024] In the illustrated example, the substrate processing system 1 includes a common transmission line 40. The transmission line 40 is provided for supplying power to a plurality of process modules 111. In an example where three-phase AC power is transmitted through the transmission line 40, the transmission line 40 includes three wires 40i. The number of wires 40i constituting the transmission line 40 may be one or more, and is set according to the power to be transmitted. Each wire 40i may be composed of a busbar.

[0025] The transmission line 40 is attached to the second side 11b of each of the multiple process modules 111 and extends along the second side 11b of each of the multiple process modules 111. The transmission line 40 and each wire 40i may extend horizontally along the second side 11b. In one embodiment, the transmission line 40 may be located within a height range of 0 mm to 1700 mm, 280 mm to 1670 mm, or 400 mm to 1640 mm from the floor surface FS (see Figure 2) on which the substrate processing system 1 is placed or from the surface on which the worker stands during work. In this embodiment, wiring work for power supply lines, such as cables from the transmission line 40 to each process module 111, is facilitated. Furthermore, the multiple breakers 60, described later, attached to the transmission line 40 may be positioned within a range of 0 mm to 1700 mm in height from the floor surface FS or the surface on which the worker stands, or within a range of 280 mm to 1670 mm, or within a range of 400 mm to 1640 mm. Also, the center of each breaker operating section of the multiple breakers 60 may be positioned within a range of 0 mm to 1700 mm in height from the floor surface FS or the surface on which the worker stands, or within a range of 280 mm to 1670 mm, or within a range of 400 mm to 1640 mm. In this case, the operation of the multiple breakers 60 becomes easier.

[0026] As shown in Figure 1, the substrate processing system 1 may further include a power box 50. The power box 50 includes a main breaker 50m. A power supply line from, for example, a commercial AC power source is connected to the main breaker 50m. The transmission line 40 is electrically connected to the power box 50 to receive power from the main breaker 50m. Each wire 40i of the transmission line 40 is electrically connected to the power box 50 by, for example, a power supply line 52. The power box 50 may include a switch. In this case, the power supply to the transmission line 40 can be easily stopped by setting the switch to the OFF state.

[0027] As shown in Figure 2, in one embodiment, the transmission line 40 may include a plurality of partial transmission lines 41. Each of the plurality of partial transmission lines 41 is attached to the second side 11b of a corresponding process module 111 among a plurality of process modules 111. The plurality of partial transmission lines 41 may be attached to the second side 11b of the corresponding process module 111 while housed in a duct 42 (e.g., a bus duct). Each of the plurality of partial transmission lines 41 may extend horizontally along the second side 11b of the corresponding process module 111.

[0028] In one embodiment, the transmission line 40 may further include one or more connectors 44. The transmission line 40, the duct 42, and one or more connectors 44 constitute a transmission line assembly 400. In this case, one or more connectors 44 are arranged alternately with a plurality of partial transmission lines 41 that constitute each wire 40i. One or more connectors 44 connect the plurality of partial transmission lines 41 that constitute each wire 40i in series.

[0029] In one embodiment, each of the one or more connectors 44 may be configured to slide horizontally with respect to two of the multiple partial transmission lines 41 that constitute each electric wire 40i and are electrically connected to each other. In this case, the installation of the connectors 44 is made easier.

[0030] Refer to Figure 3 below. Figure 3 is a perspective view showing an example of a connector in a substrate processing system according to one exemplary embodiment. In the example shown in Figure 3, each connector 44 includes a slot 44s. In one example, each connector 44 includes three slots 44s. Each slot 44s extends parallel to two partial transmission lines 41 connected in series therein. Each connector 44 includes a contact 44p located within each slot 44s. The contact 44p may be located along the wall surface defining the corresponding slot 44s and extend parallel to the two partial transmission lines 41 connected in series. Within each slot 44s, the two partial transmission lines 41 are connected in series via the contact 44p. In the example shown in Figure 3, each connector 44 is slidable horizontally with respect to the two partial transmission lines 41 located within each slot 44s.

[0031] Hereinafter, Figures 4 and 5 will be referred to in conjunction with Figures 1 and 2. Figure 4 is an exploded perspective view showing an example of a process module in a substrate processing system according to one exemplary embodiment. Figure 5 is a diagram showing an example of a power supply configuration including a breaker in a substrate processing system according to one exemplary embodiment.

[0032] In one embodiment, the substrate processing system 1 may further include a plurality of circuit breakers 60. The substrate processing system 1 may further include a plurality of sockets 62. The transmission line assembly 400 may further include a plurality of circuit breakers 60 and a plurality of sockets 62.

[0033] Each of the multiple sockets 62 is electrically connected to the transmission line 40 at a location along the second side 11b of the corresponding process module 111 among the multiple process modules 111. As shown in Figure 5, each socket 62 includes a slot that extends parallel to the wire 40i to be connected. In the example in Figure 5, each socket 62 includes three slots that house three wires 40i therein. Each socket 62 has a contact 62c in each slot. The contact 62c makes contact with the wire 40i and electrically connects to the wire 40i. The contact 62c may be elastic, such as a spring (e.g., a leaf spring).

[0034] Each of the multiple circuit breakers 60 is mounted on a plurality of sockets 62. Each of the multiple circuit breakers 60 is electrically connected to the transmission line 40 via its corresponding socket 62. Each of the multiple circuit breakers 60 may be detachable from its corresponding socket 62. That is, each of the multiple circuit breakers 60 may be a plug-in circuit breaker. In this case, each of the multiple sockets 62 is configured as a plug-in base.

[0035] Multiple individual power supply lines 63 extend from multiple circuit breakers 60. Each of the multiple individual power supply lines 63 (e.g., cables) electrically connects the transmission line 40 to multiple process modules 111 via the multiple circuit breakers 60. Each of the multiple individual power supply lines 63 includes a connector 63c, as shown in Figures 2, 4, and 5.

[0036] In one embodiment, each of the multiple process modules 111 (or multiple process modules 11) may further include a lower unit 70, as shown in Figure 4. The lower unit 70 is configured to be positioned in the space 11L below the processing chamber 11c.

[0037] The lower unit 70 includes at least one device that is electrically connected to the corresponding breaker 60 via the corresponding individual power supply line 63 from among the multiple individual power supply lines 63. As shown in Figure 5, the lower unit 70 includes a connector 70c that is connected to the connector 63c of the corresponding individual power supply line 63. At least one device mounted on the lower unit 70 is easily electrically connected to the transmission line 40 by connecting the connector 63c to the connector 70c.

[0038] In one embodiment, the lower unit 70 may further include a cart 70v on which at least one of the above-described devices is mounted. In this case, the lower unit 70 is moved from outside the space 11L toward the space 11L along the insertion direction indicated by the arrow in Figure 4, i.e., from the second side portion 11b toward the first side portion 11a, and is positioned within the space 11L. In this case, the connector 70c may be positioned toward the insertion direction of the lower unit 70 into the space 11L (the direction of the arrow shown in Figure 5). That is, the connector 70c is positioned to receive the connector 63c approaching from the opposite direction to the insertion direction of the lower unit 70 into the space 11L as the lower unit 70 is moved into the space 11L. In this case, the operation of connecting the connector 70c and the connector 63c to each other is facilitated.

[0039] In one embodiment, a plurality of process modules 111 (or a plurality of process modules 11) may include at least one plasma processing apparatus. In this case, the at least one plasma processing apparatus may include at least one RF power supply 71 as the at least one device mounted on the lower unit 70. The at least one RF power supply 71 may include a source RF power supply and / or a bias RF power supply. The source RF power supply is configured to generate an RF signal used to generate plasma from gas in the processing chamber 11c. The bias RF power supply is configured to generate a bias RF signal supplied to the substrate support to draw ions from the plasma to the substrate on the substrate support in the processing chamber 11c.

[0040] Furthermore, at least one plasma processing apparatus may include at least one DC power supply 72 as the at least one device mounted on the lower unit 70. The at least one DC power supply 72 may include a DC power supply used to apply a DC voltage to the electrostatic electrodes in the electrostatic chuck of the substrate support and / or a DC power supply used to generate a sequence of voltage pulses supplied to the substrate support to draw ions from the plasma to the substrate on the substrate support. In addition to the RF power supply 71 and / or the DC power supply 72, the at least one device mounted on the lower unit 70 may include other devices that operate using power supplied from the transmission line 40.

[0041] The following refers to Figure 6. Figure 6 is a perspective view showing another example of a connector in a substrate processing system according to one exemplary embodiment. The substrate processing system 1 may include one or more connectors 44 shown in Figure 6 instead of one or more connectors 44 shown in Figure 3.

[0042] The connector 44 shown in Figure 6 includes a conductor plate 44L and two sockets 44k. Each of the two sockets 44k includes an outer conductor 44o and an inner conductor 44i. Each of the outer conductor 44o and the inner conductor 44i has a substantially cylindrical shape, with the inner conductor 44i positioned within the outer conductor 44o. The outer conductor 44o is fixed to the conductor plate 44L. The inner conductor 44i is slidable horizontally within the outer conductor 44o while maintaining an electrical connection with the outer conductor 44o. In the example in Figure 6, each of a pair of partial transmission lines 41, i.e., two partial transmission lines 41 connected in series with each other, includes a pin 41p. The pin 41p of each of the pair of partial transmission lines 41 is inserted into an inner hole of the inner conductor 44i of the corresponding socket 44k and electrically connected to the inner conductor 44i. The connector 44 shown in Figure 6 is also slidable horizontally with respect to the two partial transmission lines 41.

[0043] Hereinafter, referring to FIGS. 7 and 8, a transfer system 100 of an example of a substrate processing system 1 including a plurality of transfer devices 20 will be described. FIG. 7 is a cross-sectional view showing an example of a transfer system in a substrate processing system according to one exemplary embodiment. FIG. 8 is a perspective view showing an example of a transfer device and a planar motor in a substrate processing system according to one exemplary embodiment.

[0044] In one embodiment, the transfer system 100 may be configured to move a plurality of transfer devices 20 using a planar motor 30 (linear motor unit). In this case, the transfer system 100 includes a plurality of transfer devices 20 and a planar motor 30.

[0045] The planar motor 30 includes a main body 31, a plurality of electromagnetic coils 32, and a drive source 33. The main body 31 constitutes the bottom of the vacuum transfer chamber 10c. The plurality of electromagnetic coils 32 are arranged over the inside of the main body 31 and are arranged under the vacuum transfer space 10s. The plurality of electromagnetic coils 32 may be two-dimensionally arranged over the inside of the main body 31. The drive source 33 is configured to individually supply current to the plurality of electromagnetic coils 32. The supply and stop of current from the drive source 33 to each of the plurality of electromagnetic coils 32, as well as the direction and magnitude of the current from the drive source 33 to each of the plurality of electromagnetic coils 32, are controlled by the control unit 2. Under the control of the control unit 2, a magnetic field is generated in the vacuum transfer space 10s by supplying current to one or more of the plurality of electromagnetic coils 32 selected from the plurality of electromagnetic coils 32.

[0046] Each of the plurality of transfer devices 20 includes a base 21 and an end effector 22. The base 21 includes a plurality of magnets 23 (for example, permanent magnets). The plurality of magnets 23 are arranged within the base 21. The plurality of magnets 23 may be two-dimensionally arranged within the base 21. The end effector 22 is supported by the base 21. The end effector 22 is configured to support the substrate W placed thereon. Note that the end effector 22 may also be configured to be able to support consumable parts such as a ring member (for example, an edge ring used in a plasma processing apparatus) placed thereon.

[0047] In the transfer system 100, by setting the direction of the current supplied from the drive source 33 to the plurality of electromagnetic coils 32 (i.e., a plurality of electromagnets) so that the plurality of electromagnetic coils 32 and the plurality of magnets 23 repel each other, the transfer device 20 can be levitated from the main body 31 within the vacuum transfer space 10s based on the principle of magnetic levitation. Further, by individually controlling the current supplied from the drive source 33 to the plurality of electromagnetic coils 32 by the control unit 2, the transfer device 20 can be moved along the surface of the main body 31 while being levitated within the vacuum transfer space 10s, and the position of the transfer device 20 can be controlled. Also, the levitation amount of the transfer device 20 can be controlled by controlling the magnitude of the current.

[0048] According to the transfer system 100, the control unit 2 controls the movement of each of the plurality of transfer devices 20, and each of the plurality of transfer devices 20 can transfer the substrate W within the vacuum transfer space 10s between the vacuum transfer space 10s and the plurality of process modules 11 or between the vacuum transfer space 10s and the preliminary decompression chamber. Also, a plurality of substrates W can be transferred simultaneously or in parallel by the plurality of transfer devices 20.

[0049] Hereinafter, an example of a circuit (control circuit) that can constitute the control unit 2 of the substrate processing system 1 will be described.

[0050] FIG. 9 illustrates a block diagram of a computer (a type of circuit) capable of realizing various control modes described in this specification. Further, the control mode of the present disclosure can be implemented as a system, a method, and / or a computer program product. The computer program product may include a computer-readable storage medium in which computer-readable program instructions for causing one or more processing devices to execute the modes of the present embodiment are recorded.

[0051] A computer-readable storage medium may be a tangible device capable of storing instructions used by an instruction execution device (processor). A computer-readable storage medium may, but is not limited to, an electronic storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination thereof. More specific examples of computer-readable storage media include, but are not exhaustive, flexible disks, hard disks, solid-state drives (SSDs), random-access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or Flash), static random-access memory (SRAM), compact disks (CDs or CD-ROMs), digital multipurpose disks (DVDs), memory cards or memory sticks (and suitable combinations thereof). In this disclosure, a computer-readable storage medium should not be interpreted as a transient signal itself, such as, for example, radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides or other transmission media (e.g., optical pulses passing through optical fiber cables), or electrical signals transmitted via wires.

[0052] The computer-readable program instructions described in this disclosure can be downloaded from a computer-readable storage medium to a suitable computing device or processing device, or they can be downloaded to an external computer or external storage device via a global network (i.e., the Internet), a local area network, a wide area network, and / or a wireless network. Networks include transmission copper wires, optical fiber, wireless communications, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface of each computing device or processing device can receive computer-readable program instructions from the network, transfer those computer-readable program instructions, and store them in a computer-readable storage medium within the computing device or processing device.

[0053] Computer-readable program instructions for performing the operations of the Disclosure may include machine language instructions and / or microcode. These instructions can be compiled or interpreted from source code written in any combination of one or more programming languages, including assembly language, Basic, Fortran, Java®, Python, R, C, C++, C#, etc. Computer-readable program instructions can be fully executed on a user's personal computer, notebook computer, tablet, or smartphone, or may be fully executed on a remote computer or computer server, or on any combination of these computing devices. The remote computer or computer server may be connected to one or more of the user's devices via a computer network, including a local area network, a wide area network, or a global network (i.e., the Internet). Alternatively, electronic circuits, including, for example, programmable logic circuits, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), may be configured or customized to execute computer-readable program instructions using information from the computer-readable program instructions and implement embodiments of the Disclosure.

[0054] This specification will describe aspects of the present disclosure with reference to flowcharts and block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the present disclosure. Those skilled in the art will understand that each block in the flowcharts and block diagrams, as well as combinations of blocks in the flowcharts and block diagrams, can be implemented by computer-readable program instructions.

[0055] Computer-readable program instructions capable of implementing the systems and methods described in this disclosure may be supplied to one or more processors (and / or one or more cores within a processor) of a general-purpose computer, a dedicated computer, or other programmable device. This makes it possible to generate a machine that constructs a system for implementing the functions specifically shown in the flowcharts and block diagrams of this disclosure, through instructions executed via the processors of the computer or other programmable device. These computer-readable program instructions may also be stored in a computer-readable storage medium that can instruct the computer, programmable device, and / or other device to function in a particular manner. The computer-readable storage medium storing the instructions is a product containing instructions that implement the embodiments of the functions specifically shown in the flowcharts and block diagrams of this disclosure.

[0056] Furthermore, computer-readable program instructions can be loaded into a computer, another programmable device, or other device, and a series of operations can be executed on that computer, other programmable device, or other device to realize a computer implementation process. Therefore, the functions specifically shown in the flowcharts and block diagrams of this disclosure can be realized by instructions executed on a computer, another programmable device, or other device.

[0057] Figure 9 is a functional block diagram showing a network system 800 in which one or more computers and servers are connected to a network. In one embodiment, the hardware and software environments illustrated in Figure 9 may serve as an exemplary platform for implementing the software and / or methods relating to this disclosure.

[0058] Referring to Figure 9, the network system 800 may include, but is not limited to, a computer 805, a network 810, a remote computer 815, a web server 820, a cloud storage server 825, and a computer server 830. In some embodiments, one or more examples of the functional blocks illustrated in Figure 9 may be used.

[0059] Further details of computer 805 are shown in Figure 9. The functional blocks illustrated within computer 805 are merely illustrative examples for constructing exemplary functions and do not encompass all of its functions. Details of the remote computer 815, web server 820, cloud storage server 825, and computer server 830 are not shown, but these computers and devices may also include functions similar to those shown for computer 805.

[0060] Computer 805 may be a personal computer (PC), desktop computer, laptop computer, tablet computer, netbook computer, personal data device (PDA), smartphone, or other programmable electronic device capable of communicating with other devices on the network 810.

[0061] The computer 805 may include a processing unit 835, a bus 837, a memory 840, a non-volatile storage device 845, a network interface 850, a peripheral device interface 855, and a display device interface 865. In some embodiments, these functions may be implemented as individual electronic subsystems (integrated circuit chips or combinations of chips and associated devices), while in other embodiments, some of the combinations of functions may be implemented on a single chip (also known as a system-on-a-chip or SoC).

[0062] The processing unit 835 may be one or more single-chip or multi-chip microprocessors designed and / or manufactured by Intel Corporation, Advanced Micro Devices, Inc. (AMD), Arm Holdings, Apple Computer, etc. Examples of microprocessors include Intel Corporation's Celeron, Pentium®, Core i3, Core i5, Core i7; AMD's Opteron, Phenom, Athlon, Turion, Ryzen; and Arm's Cortex-A, Cortex-R, Cortex-M, etc.

[0063] Bus 837 may be a proprietary or industry-standard high-speed parallel or serial peripheral interconnect bus such as ISA, PCI, PCI Express (PCI-e), or AGP.

[0064] The memory 840 and the non-volatile storage device 845 may be computer-readable storage media. The memory 840 may include any suitable volatile storage device such as dynamic random access memory (DRAM) and static random access memory (SRAM). The non-volatile storage device 845 may include one or more of the following: flexible disk, hard disk, solid-state drive (SSD), read-only memory (ROM), erasable programmable read-only memory (EPROM or Flash), compact disc (CD or CD-ROM), digital multipurpose disc (DVD), memory card, or memory stick.

[0065] The program 848 may be a collection of machine-readable instructions and / or machine-readable data stored in at least one memory, such as a non-volatile storage device 845, and used to create, manage, and control specific software functions as described in detail and illustrated in the drawings of this disclosure. In some embodiments, memory 840 may be much faster than the non-volatile storage device 845. In that case, the program 848 may be transferred from the non-volatile storage device 845 to memory 840 and then executed by the processing unit 835. The program 848 includes computer program code. In one implementation, at least one memory storing the computer program code comprises at least one processing unit (such as a processing circuit described later) for carrying out the control process and claimed advanced embodiments of this disclosure.

[0066] Computer 805 may communicate and interact with other computers via network 810 using network interface 850. Network 810 may be, for example, a local area network (LAN), a wide area network (WAN) such as the Internet, or a combination thereof, and may include wired, wireless, or fiber optic connections. In general, network 810 can be any combination of connections and protocols that support communication between two or more computers and associated devices.

[0067] The peripheral interface 855 may enable data input and output via other devices that can be locally connected to the computer 805. For example, the peripheral interface 855 may enable connection to an external device 860. The external device 860 may include devices such as a keyboard, mouse, keypad, touchscreen, and / or other suitable input devices. The external device 860 may also include portable computer-readable storage media such as a thumb drive, portable optical or magnetic disk, and memory card. Software and data used to implement embodiments of the present disclosure (e.g., program 848) may be stored on such portable computer-readable storage media. In this case, the software may be loaded into the non-volatile storage device 845, or directly into memory 840 via the peripheral interface 855. The peripheral interface 855 may use industry-standard connections such as RS-232 or Universal Serial Bus (USB) to connect to the external device 860.

[0068] The computer 805 may be connected to the display device 870 via the display device interface 865. In one embodiment, the display device 870 may be used to present a command line or a graphical user interface to the user of the computer 805. The display device interface 865 may be connected to the display device 870 using one or more proprietary or industry standard connections such as VGA, DVI, DisplayPort, HDMI®, etc.

[0069] As described above, the network interface 850 enables communication with other computing systems or storage systems or computing devices or storage devices outside of the computer 805. The software programs and data described herein may be downloaded to the non-volatile storage device 845 via the network interface 850 and network 810 from, for example, a remote computer 815, a web server 820, a cloud storage server 825, or a computer server 830. Furthermore, the systems and methods described herein may be implemented by one or more computers connected to the computer 805 via the network interface 850 and network 810. For example, in one embodiment, the systems and methods described herein may be implemented by a combination of a remote computer 815, a computer server 830, or computers interconnected on network 810.

[0070] The data, datasets, and / or databases used in the embodiments of the systems and methods described herein may be stored in or downloaded from a remote computer 815, a web server 820, a cloud storage server 825, or a computer server 830.

[0071] The circuits used in this application can be defined as one or more of the following: electronic components (such as semiconductor devices), a plurality of electronic components directly connected to each other or interconnected via electronic communication, a computer, a network of computer devices, a remote computer, a web server, a cloud storage server, or a computer server. For example, each of the one or more of the computer, remote computer, web server, cloud storage server, and computer server may be included as a component of the circuit, or may include the circuit. In some embodiments, one or more examples of these components may be used, and each of the one or more examples of these components may also be included in the circuit, or may include the circuit. In some embodiments, a circuit represented by a network system may include a serverless computing system that corresponds to virtualized hardware resources. A circuit represented by a computer may be a personal computer (PC), a desktop computer, a laptop computer, a tablet computer, a netbook computer, a personal data device (PDA), a smartphone, or other programmable electronic device that can communicate with other devices on a network. The circuit may be a general-purpose computer, a dedicated computer, or other programmable device described herein that includes one or more processing units. Each processing unit may be one or more single-chip microprocessors or multi-chip microprocessors. One or more processing units are considered processing circuits or circuits because they incorporate transistors and other circuits. The circuits can implement the systems and methods described in this disclosure based on computer-readable program instructions. These program instructions are supplied to one or more processing units (and / or one or more cores within processing units) of one or more general-purpose computers, dedicated computers, or other programmable devices described herein. This makes it possible to generate a machine that constructs a system for implementing the functions specifically shown in the flowcharts and block diagrams of this disclosure, through instructions contained within the circuits or executed via one or more processing units of a programmable device containing the circuits.Alternatively, a circuit may be a pre-programmed structure, such as a programmable logic device or an application-specific integrated circuit. A circuit is considered a circuit whether it is used alone or in combination with other programmable circuits or other pre-programmed circuits.

[0072] In light of the above teachings, it is clear that numerous modifications and variations of the present invention are possible. Therefore, it should be understood that, within the scope of the appended claims, the present invention can be implemented in forms other than those specifically described herein.

[0073] Although various exemplary embodiments have been described above, the invention is not limited to the exemplary embodiments described above, and various additions, omissions, substitutions, and modifications may be made. Furthermore, it is possible to combine elements from different embodiments to form other embodiments.

[0074] For example, the vacuum transport module 10 may be configured to transport substrates W, etc., using a transport robot (e.g., a SCARA robot) inside the vacuum transport chamber 10c, rather than the transport device 20.

[0075] Herein, various exemplary embodiments included in this disclosure are described in [E1] to [E11] below.

[0076] [E1] A substrate processing system comprising: a vacuum transfer module having a vacuum transfer chamber; a plurality of process modules, each including a first side portion arranged along one side of the vacuum transfer chamber, a processing chamber connected to the vacuum transfer chamber at the first side portion, and a second side portion extending on the opposite side of the first side portion; and a common transmission path for supplying power to the plurality of process modules, attached to the second side portion of each of the plurality of process modules and extending along the second side portion of each of the plurality of process modules.

[0077] [E2] The substrate processing system according to E1, wherein the common transmission line includes a plurality of sub-transmission lines connected in series, and each of the plurality of sub-transmission lines is attached to the second side of a corresponding process module among the plurality of process modules.

[0078] [E3] The substrate processing system according to E2, wherein the common transmission line is arranged alternately with the plurality of partial transmission lines, and further includes one or more connectors that connect the plurality of partial transmission lines in series.

[0079] [E4] The substrate processing system according to E3, wherein the plurality of partial transmission lines extend horizontally, and each of the one or more connectors is configured to slide horizontally with respect to two of the plurality of partial transmission lines that are electrically connected to each other.

[0080] [E5] A substrate processing system according to any one of E1 to E4, further comprising: a plurality of circuit breakers attached to the common transmission line; and a plurality of individual power supply lines that electrically connect the common transmission line and the plurality of process modules to each other via the plurality of circuit breakers.

[0081] [E6] The substrate processing system according to E5, wherein each of the plurality of process modules includes a lower unit located in the space below the processing chamber, the lower unit of each of the plurality of process modules includes a device electrically connected to a corresponding breaker among the plurality of breakers via a corresponding individual power supply line among the plurality of individual power supply lines, each of the plurality of individual power supply lines includes a connector, and the lower unit includes a connector connected to the connector of the corresponding individual power supply line.

[0082] [E7] The substrate processing system according to E6, wherein the lower unit further includes a cart on which the device is mounted, and the connector of the lower unit is positioned toward the insertion direction of the lower unit into the space below the processing chamber.

[0083] [E8] The substrate processing system according to E6 or E7, wherein the plurality of process modules include at least one plasma processing apparatus, and the at least one plasma processing apparatus includes an RF power supply as the device.

[0084] [E9] The substrate processing system according to any one of E5 to E8, wherein the common transmission line extends horizontally along the second side of each of the plurality of process modules.

[0085] [E10] The substrate processing system according to E9, wherein the plurality of breakers attached to the common transmission line are positioned within a range of 0 mm to 1700 mm in the height direction from the floor surface on which the substrate processing system is located or the surface on which workers stand during work.

[0086] [E11] A circuit board processing system according to any one of E1 to E10, further comprising a power box including a main breaker electrically connected to a commercial AC power supply, wherein the common transmission line is connected to the power box to receive power from the main breaker.

[0087] From the above description, it will be understood that the various embodiments of this disclosure are described herein for illustrative purposes and can be modified in various ways without departing from the scope and spirit of this disclosure. Accordingly, the various embodiments disclosed herein are not intended to limit the scope and spirit, and the true scope and spirit are shown by the appended claims.

[0088] 1...Substrate processing system, 10...Vacuum transfer module, 10c...Vacuum transfer chamber, 11, 111, 112...Process module, 11a...First side, 11b...Second side, 11c...Processing chamber, 40...Transmission line.

Claims

1. A substrate processing system comprising: a vacuum transfer module having a vacuum transfer chamber; a plurality of process modules, each including a first side portion arranged along one side of the vacuum transfer chamber, a processing chamber connected to the vacuum transfer chamber at the first side portion, and a second side portion extending on the opposite side of the first side portion; and a common transmission path for supplying power to the plurality of process modules, attached to the second side portion of each of the plurality of process modules and extending along the second side portion of each of the plurality of process modules.

2. The substrate processing system according to claim 1, wherein the common transmission line includes a plurality of sub-transmission lines connected in series, and each of the plurality of sub-transmission lines is attached to the second side of a corresponding process module among the plurality of process modules.

3. The substrate processing system according to claim 2, wherein the common transmission line is arranged alternately with the plurality of partial transmission lines, and further comprises one or more connectors that connect the plurality of partial transmission lines in series.

4. The substrate processing system according to claim 3, wherein the plurality of partial transmission lines extend horizontally, and each of the one or more connectors is configured to slide horizontally with respect to two of the plurality of partial transmission lines that are electrically connected to each other.

5. The substrate processing system according to claim 1, further comprising: a plurality of circuit breakers attached to the common transmission line; and a plurality of individual power supply lines that electrically connect the common transmission line and the plurality of process modules to each other via the plurality of circuit breakers.

6. The substrate processing system according to claim 5, wherein each of the plurality of process modules includes a lower unit located in the space below the processing chamber, the lower unit of each of the plurality of process modules includes a device electrically connected to a corresponding breaker among the plurality of breakers via a corresponding individual power supply line among the plurality of individual power supply lines, each of the plurality of individual power supply lines includes a connector, and the lower unit includes a connector connected to the connector of the corresponding individual power supply line.

7. The substrate processing system according to claim 6, wherein the lower unit further includes a cart on which the device is mounted, and the connector of the lower unit is positioned toward the insertion direction of the lower unit into the space below the processing chamber.

8. The substrate processing system according to claim 6, wherein the plurality of process modules include at least one plasma processing apparatus, and the at least one plasma processing apparatus includes an RF power supply as the device.

9. The substrate processing system according to any one of claims 5 to 8, wherein the common transmission line extends horizontally along the second side of each of the plurality of process modules.

10. The substrate processing system according to claim 9, wherein the plurality of breakers attached to the common transmission line are positioned within a range of 0 mm to 1700 mm in the height direction from the floor surface on which the substrate processing system is located or the surface on which workers stand during work.

11. The substrate processing system according to any one of claims 1 to 8, further comprising a power box including a main breaker electrically connected to a commercial AC power supply, wherein the common transmission line is connected to the power box to receive power from the main breaker.

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