Substrate processing system and substrate processing method

Abstract

A substrate processing system according to one aspect of the present disclosure comprises a batch processing unit that collectively processes a lot including a plurality of substrates, a single-wafer processing unit that processes the substrates of the lot one by one, an interface unit that delivers the substrates from the batch processing unit to the single-wafer processing unit with a liquid film formed thereon, and a control circuit, the control circuit calculating a certain interval during which the timings of a first conveyance process, a second conveyance process, and a third conveyance process of the substrates do not overlap with other timings at which the substrates are conveyed by a conveyance unit, setting the start timing of the first conveyance process of the substrates so that the first conveyance process is started at each calculated certain interval, and adding an adjustment time to the processing time of a first process when calculating the certain interval.

Description

Substrate Processing System and Substrate Processing Method

[0001] The present disclosure relates to a substrate processing system and a substrate processing method.

[0002] There is disclosed a technique in which a substrate is transported to a liquid processing unit to form a liquid film, and then the substrate is transported from the liquid processing unit to a drying unit for drying (see, for example, Patent Document 1). In Patent Document 1, the timing of transporting the substrate to the liquid processing unit is controlled so that the timing when the substrate on which the liquid film is formed is transported to the drying unit does not overlap with the timing when other substrates are transported.

[0003] Japanese Patent Application Laid-Open No. 2020-004757

[0004] The present disclosure provides a technique capable of reducing the drying risk of a substrate during the adjustment time added when the transport time varies when transporting a substrate having a liquid film formed on its surface.

[0005] A substrate processing system according to one aspect of the present disclosure comprises a batch processing unit for processing a lot containing multiple substrates in a batch, a single-wafer processing unit for processing the substrates in the lot one by one, an interface unit for receiving the substrates from the batch processing unit to the single-wafer processing unit with a liquid film formed on them, and a control circuit, wherein the single-wafer processing unit comprises a plurality of first processing units for performing a first processing on the substrates, a plurality of second processing units for performing a second processing on the substrates that have undergone the first processing, and a transport unit for transporting the substrates to the interface unit, the plurality of first processing units, and the plurality of second processing units, and the control circuit controls the transport of the substrates with the liquid film formed on them from the interface unit to the first processing units. Based on the processing time of the first transport process in which the substrate is sent, the processing time of the first process, the processing time of the second transport process in which the substrate is transported from the first processing unit to the second processing unit, the processing time of the second process, and the processing time of the third transport process in which the substrate is unloaded from the second processing unit, a certain interval is calculated in which the timing of the first transport process, the second transport process and the third transport process of the substrate do not overlap with the timing of other substrates being transported by the transport unit. The start timing of the first transport process of the substrate is set so that the first transport process is started at each of the calculated certain intervals, and an adjustment time is added to the processing time of the first process when calculating the certain interval.

[0006] According to this disclosure, when transporting a substrate on which a liquid film has been formed on its surface, the risk of the substrate drying out during the adjustment time added when transport time varies can be reduced.

[0007] Figure 1 is a schematic plan view showing a substrate processing system according to an embodiment. Figure 2 is a diagram showing an example of a second transfer table according to an embodiment. Figure 3 is a flowchart showing a substrate processing method according to an embodiment. Figure 4 is a diagram illustrating a transport control method according to the first example of the embodiment. Figure 5 is a diagram showing an example of liquid processing before adjustment time is added. Figure 6 is a diagram showing a first example of liquid processing after adjustment time is added. Figure 7 is a diagram showing a second example of liquid processing after adjustment time is added. Figure 8 is a diagram showing a third example of liquid processing after adjustment time is added. Figure 9 is a diagram illustrating a transport control method according to the second example of the embodiment. Figure 10 is a diagram illustrating a transport control method according to the third example of the embodiment. Figure 11 is a diagram illustrating a transport control method according to the first reference example. Figure 12 is a diagram illustrating a transport control method according to the fourth example of the embodiment. Figure 13 is a diagram illustrating a transport control method according to the fifth example of the embodiment. Figure 14 is a diagram illustrating a transport control method according to the second reference example. Figure 15 is a diagram illustrating a transport control method according to the sixth example of the embodiment. Figure 16 is a diagram illustrating a transport control method according to the seventh embodiment.

[0008] Hereinafter, exemplary embodiments of the present disclosure, not limited to those described herein, will be described with reference to the attached drawings. In all attached drawings, identical or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted.

[0009] In the following explanation, the XYZ Cartesian coordinate system is used, but this coordinate system is defined for explanatory purposes only and is not limited to the orientation of the substrate processing system 1. The view from the XY plane is referred to as the plan view, and from any point, the positive Z-axis side may be referred to as "up," and the negative Z-axis side may be referred to as "down."

[0010] [Substrate Processing System] Referring to Figure 1, the substrate processing system 1 according to the embodiment will be described. Figure 1 is a schematic plan view showing the substrate processing system 1 according to the embodiment.

[0011] As shown in Figure 1, the substrate processing system 1 comprises an input / output unit 2, a first interface unit 3, a batch processing unit 4, a second interface unit 5, a single-wafer processing unit 6, and a control circuit 9.

[0012] The loading / unloading section 2 serves as both the loading and unloading section. This allows the substrate processing system 1 to be miniaturized. The loading / unloading section 2 includes a load port 21, a stocker 22, a loader 23, and a cassette transport device 24.

[0013] The load port 21 is located on the negative X-axis side of the loading / unloading section 2. Multiple load ports 21 (for example, four) are arranged along the Y-axis. The number of load ports 21 is not particularly limited. Cassettes C are placed on the load ports 21. Cassette C contains multiple (for example, 25) substrates W. Cassette C is loaded into and out of the load port 21. Inside the cassette C, the substrates W are held horizontally and along the Z-axis at a second pitch P2 (P2 = N × P1) which is N times the first pitch P1. N is a natural number of 2 or more, and in this embodiment it is 2, but it may be 3 or more.

[0014] Multiple (for example, four) stockers 22 are arranged along the Y-axis at the center of the X-axis of the loading / unloading section 2. Multiple (for example, two) stockers 22 are arranged along the Y-axis adjacent to the first interface section 3 on the positive X-axis side of the loading / unloading section 2. Stockers 22 may be arranged in multiple stages along the Z-axis. Stockers 22 temporarily store cassettes C containing substrates W before cleaning, and cassettes C that have become empty after the substrates W have been removed. The number of stockers 22 is not particularly limited.

[0015] The loader 23 is adjacent to the first interface section 3. The loader 23 is positioned on the positive X-axis side of the loading / unloading section 2. The cassette C is placed on the loader 23. The loader 23 is provided with a lid opening / closing mechanism (not shown) for opening and closing the lid of the cassette C. Multiple loaders 23 may be provided. The loaders 23 may be arranged in multiple stages along the Z-axis.

[0016] The cassette transport device 24 transports the cassette C between the load port 21, the stocker 22, and the loader 23. The cassette transport device 24 is, for example, a multi-joint transport robot.

[0017] The first interface unit 3 is positioned on the positive X-axis side of the loading / unloading unit 2. The first interface unit 3 transports the substrate W between the loading / unloading unit 2, the batch processing unit 4, and the single-wafer processing unit 6. The first interface unit 3 includes a substrate transfer device 31, a lot formation unit 32, and a first transfer table 33.

[0018] The substrate transfer device 31 transports the substrate W between the cassette C placed on the loader 23, the lot forming unit 32, and the first transfer table 33. The substrate transfer device 31 consists of a multi-axis (e.g., 6-axis) arm robot, and has a substrate holding arm 31a at its tip. The substrate holding arm 31a has a plurality of holding claws (not shown) capable of holding a plurality of substrates W (e.g., 25). The substrate holding arm 31a can assume any position and orientation in three-dimensional space while holding the substrate W with its holding claws.

[0019] The lot formation unit 32 is positioned on the positive X-axis side of the first interface unit 3. The lot formation unit 32 holds multiple substrates W at a first pitch P1 (P1 = P2 / N) to form a lot L.

[0020] The first transfer table 33 is adjacent to the single-wafer processing unit 6. The first transfer table 33 is positioned on the positive Y-axis side of the first interface unit 3. The first transfer table 33 receives the substrate W from the fourth transport device 61 and temporarily stores it until it is handed over to the loading / unloading unit 2.

[0021] The batch processing unit 4 is located on the positive X-axis side of the first interface unit 3. The loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4 are arranged in this order, from the negative X-axis side to the positive X-axis side. The batch processing unit 4 processes a lot L containing multiple substrates W (for example, 50 or 100) at a first pitch P1 all at once. One lot L consists of, for example, M cassettes C with substrates W. M is a natural number greater than or equal to 2. M may be the same natural number as N, or a different natural number from N. The batch processing unit 4 includes a chemical tank 41, a rinse tank 42, a first transport device 43, a processing tool 44, and a drive device 45.

[0022] The chemical solution tank 41 and the rinse solution tank 42 are arranged along the X-axis. For example, the chemical solution tank 41 and the rinse solution tank 42 are arranged in this order from the positive side of the X-axis to the negative side of the X-axis. The chemical solution tank 41 and the rinse solution tank 42 are collectively referred to as the treatment tank. The number of chemical solution tanks 41 and rinse solution tanks 42 is not limited to that shown in Figure 1. For example, although there is one set of chemical solution tank 41 and rinse solution tank 42 in Figure 1, there may be multiple sets.

[0023] The chemical tank 41 stores the chemical solution into which the lot L is immersed. The chemical solution is, for example, an aqueous phosphoric acid solution (H ３ PO ４ The phosphoric acid aqueous solution selectively etches and removes the silicon nitride film from the silicon oxide film. The chemical solution is not limited to phosphoric acid aqueous solution. The chemical solution may also be DHF (dilute hydrofluoric acid), BHF (mixture of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (mixture of sulfuric acid, hydrogen peroxide and water), SC1 (mixture of ammonia, hydrogen peroxide and water), SC2 (mixture of hydrochloric acid, hydrogen peroxide and water), TMAH (mixture of tetramethylammonium hydroxide and water), plating solution, etc. The chemical solution may be for stripping treatment or plating treatment. The number of chemical solutions is not particularly limited and may be multiple.

[0024] The rinsing solution tank 42 stores the first rinsing solution into which the lot L is immersed. The first rinsing solution is pure water that removes the chemical solution from the substrate W, for example, DIW (deionized water).

[0025] The first transport device 43 includes a guide rail 43a and a first transport arm 43b. The guide rail 43a is positioned on the negative side of the Y-axis relative to the processing tank. The guide rail 43a extends along the X-axis from the first interface unit 3 to the batch processing unit 4. The first transport arm 43b moves along the guide rail 43a. The first transport arm 43b may move along the Z-axis or rotate around the Z-axis. The first transport arm 43b transports a lot L in a single batch between the first interface unit 3 and the batch processing unit 4.

[0026] The processing device 44 receives and holds the lot L from the first transport arm 43b. The processing device 44 holds the multiple substrates W along the Y axis at a first pitch P1, and holds each of the multiple substrates W vertically.

[0027] The drive unit 45 moves the processing tool 44 along the X and Z axes. The processing tool 44 immerses the lot L in the chemical solution stored in the chemical solution tank 41, then immerses the lot L in the first rinse solution stored in the rinse solution tank 42, and then passes the lot L to the first conveying device 43.

[0028] In this embodiment, there is one unit for the processing tool 44 and the drive unit 45, but there may be multiple units. In the latter case, one unit immerses the rod L in the chemical solution stored in the chemical solution tank 41, and another unit immerses the rod L in the first rinse solution stored in the rinse solution tank 42. In this case, the drive unit 45 only needs to move the processing tool 44 along the Z-axis, and does not need to move the processing tool 44 along the X-axis.

[0029] The second interface unit 5 is positioned on the positive Y-axis side of the batch processing unit 4. The second interface unit 5 transports the substrate W between the batch processing unit 4 and the single-wafer processing unit 6. The second interface unit 5 includes an immersion tank 51, a second transport device 52, a third transport device 53, and a second transfer table 54.

[0030] The immersion tank 51 is positioned outside the movement range of the first transport arm 43b. For example, the immersion tank 51 is positioned offset to the positive Y-axis relative to the processing tank. The immersion tank 51 stores the second rinse liquid into which the lot L is immersed. The second rinse liquid is, for example, DIW (deionized water). The substrate W is held in the second rinse liquid until it is lifted out of the second rinse liquid by the third transport device 53. Since the substrate W is below the liquid surface of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrate W, preventing the collapse of the uneven pattern on the substrate W.

[0031] The second transport device 52 includes a Y-axis drive device 52a, a Z-axis drive device 52b, and a second transport arm 52c.

[0032] The Y-axis drive unit 52a is positioned on the positive X-axis side of the second interface unit 5. The Y-axis drive unit 52a extends along the Y-axis from the second interface unit 5 to the batch processing unit 4. The Y-axis drive unit 52a moves the Z-axis drive unit 52b and the second transport arm 52c along the Y-axis. The Y-axis drive unit 52a may include a ball screw.

[0033] The Z-axis drive unit 52b is movably mounted on the Y-axis drive unit 52a. The Z-axis drive unit 52b moves the second transport arm 52c along the Z-axis. The Z-axis drive unit 52b may include a ball screw.

[0034] The second transport arm 52c is movably mounted to the Z-axis drive unit 52b. The second transport arm 52c receives and holds the lot L from the first transport arm 43b. The second transport arm 52c holds multiple substrates W along the Y-axis at a first pitch P1, and holds each of the multiple substrates W vertically. The second transport arm 52c moves along the Y-axis and Z-axis by the Y-axis drive unit 52a and the Z-axis drive unit 52b. The second transport arm 52c is configured to be movable to multiple positions, including a handover position, an immersion position, and a standby position.

[0035] The transfer position is the position where the lot L is transferred between the first transport arm 43b and the second transport arm 52c. The transfer position is on the negative side of the Y axis and the positive side of the Z axis.

[0036] The immersion position is the position in which the rod L is immersed in the immersion tank 51. The immersion position is located on the positive side of the Y-axis and the negative side of the Z-axis compared to the handover position.

[0037] The standby position is the position where the second transport arm 52c waits when the lot L is not being transferred or when the lot L is not being immersed in the immersion tank 51. The standby position is directly below the transfer position (negative Z-axis side) and does not obstruct the movement of the first transport arm 43b. In this case, the second transport arm 52c can move to the transfer position by moving only upward (positive Z-axis side), thus improving throughput. The standby position may also be the same position as the immersion position. In this case, it is possible to prevent particles that may be generated as a result of the operation of the first transport device 43 from adhering to the second transport arm 52c. The standby position may also be directly above the immersion position (positive Z-axis side). In this way, by setting the standby position to a position different from the transfer position, contact between the first transport arm 43b and the second transport arm 52c can be prevented.

[0038] The second conveying device 52 moves the second conveying arm 52c to the immersion position or standby position while the first conveying device 43 is operating. This prevents contact between the first conveying arm 43b and the second conveying arm 52c.

[0039] The third transport device 53 consists of a multi-axis (e.g., 6-axis) arm robot and has a third transport arm 53a at its tip. The third transport arm 53a has a holding claw (not shown) capable of holding one substrate W. The third transport arm 53a can take any position and orientation in three-dimensional space while holding the substrate W with the holding claw. The third transport device 53 transports the substrate W between the second transport arm 52c, which is in the immersion position, and the second transfer table 54. At this time, since the immersion tank 51 is located outside the movement range of the first transport arm 43b, the first transport arm 43b and the third transport arm 53a do not interfere with each other. As a result, one of the first transport device 43 and the third transport device 53 can be operated independently of the operating state of the other. Therefore, the first transport device 43 and the third transport device 53 can be operated at any timing, so the time required to transport the substrate W can be shortened. As a result, the productivity of the substrate processing system 1 is improved.

[0040] The second delivery stage 54 is adjacent to the single wafer processing unit 6. The second delivery stage 54 is arranged on the negative X-axis side of the second interface unit 5. The second delivery stage 54 temporarily stores the substrate W received from the third transfer device 53 until it is delivered to the single wafer processing unit 6. The substrate W taken out from the immersion tank 51 is placed on the second delivery stage 54. The substrate W placed on the second delivery stage 54 is preferably in a state where, for example, its surface is wet with the second rinse liquid. In this case, the surface tension of the second rinse liquid does not act on the substrate W, and the collapse of the uneven pattern of the substrate W can be suppressed. The number of the second delivery stages 54 may be one or more. Details of the second delivery stage 54 will be described later.

[0041] The single wafer processing unit 6 is arranged on the negative X-axis side of the second interface unit 5. The single wafer processing unit 6 is arranged on the positive Y-axis side of the loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4. The single wafer processing unit 6 processes the substrates W one by one. The single wafer processing unit 6 includes a fourth transfer device 61, a liquid processing device 62, and a drying device 63.

[0042] The fourth transfer device 61 includes a guide rail 61a and a fourth transfer arm 61b.

[0043] The guide rail 61a is arranged on the negative Y-axis side of the single wafer processing unit 6. The guide rail 61a extends along the X-axis in the single wafer processing unit 6.

[0044] The fourth transfer arm 61b moves along the guide rail 61a. The fourth transfer arm 61b rotates around the Z-axis. The fourth transfer arm 61b transfers the substrate W between the second delivery stage 54, the liquid processing device 62, the drying device 63, and the first delivery stage 33. The number of the fourth transfer arms 61b may be one or more. In the latter case, the fourth transfer device 61 transfers a plurality of (for example, five) substrates W at once.

[0045] The liquid processing device 62 is arranged on the positive X-axis side and positive Y-axis side of the single-sheet processing unit 6. The liquid processing device 62 is of the single-sheet type and processes the substrate W one by one with a processing liquid. The liquid processing device 62 is arranged in multiple stages (for example, three stages) along the Z-axis. Thereby, a plurality of substrates W can be processed with the processing liquid simultaneously. The processing liquid may be plural, for example, pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be an alcohol such as IPA (isopropyl alcohol).

[0046] The drying device 63 is arranged adjacent to the liquid processing device 62 on the negative X-axis side. In this case, it can be arranged such that the end face on the positive Y-axis side of the single-sheet processing unit 6 is flush or substantially flush with the end face on the positive Y-axis side of the second interface unit 5. Therefore, almost no dead space occurs, and the footprint of the substrate processing system 1 can be reduced. On the other hand, if the drying device 63 is arranged adjacent to the liquid processing device 62 on the positive Y-axis side, the end face on the positive Y-axis side of the single-sheet processing unit 6 protrudes beyond the end face on the positive Y-axis side of the second interface unit 5, and dead space may occur. The drying device 63 is of the single-sheet type and dries the substrate W one by one with a supercritical fluid. The drying device 63 is arranged in multiple stages (for example, three stages) along the Z-axis. Thereby, a plurality of substrates W can be dried simultaneously.

[0047] Both the liquid processing device 62 and the drying device 63 do not have to be of the single-sheet type. The liquid processing device 62 may be of the single-sheet type and the drying device 63 may be of the batch type. The drying device 63 may dry a plurality of substrates W collectively with a supercritical fluid. The number of substrates W processed collectively in the drying device 63 may be equal to or more than the number of substrates W processed collectively in the liquid processing device 62, but may also be less. Devices other than the liquid processing device 62 and the drying device 63 may be arranged in the single-sheet processing unit 6.

[0048] The control circuit 9 is, for example, a computer. The control circuit 9 comprises an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as memory. The storage unit 92 stores programs that control various processes performed in the board processing system 1. The control circuit 9 controls the operation of the board processing system 1 by causing the arithmetic unit 91 to execute the programs stored in the storage unit 92. The programs may be stored in a storage medium (device) such as a hard disk, compact disk, magnetic optical disk, memory card, or non-volatile memory, and installed from the storage medium to the computer.

[0049] The control circuit 9 includes one or more electronic circuits such as a CPU, FPGA (Field Programmable Gate Array), or ASIC (Application Specific Integrated Circuit), and performs the various control operations described in this specification by executing instruction codes stored in memory or by circuit design for special applications.

[0050] In the substrate processing system 1, the substrate W is transported from the loading / unloading section 2 to the first interface section 3, batch processing section 4, second interface section 5, and single-wafer processing section 6 in that order, and then returns to the loading / unloading section 2.

[0051] [Second Transfer Platform] The second transfer platform 54 will be described with reference to Figure 2. Figure 2 is a diagram showing an example of the second transfer platform 54 according to this embodiment. Figure 2(a) is a plan view, and Figure 2(b) is a cross-sectional view. Figure 2(b) corresponds to a cross-sectional view along the line IIb-IIb in Figure 2(a).

[0052] As shown in Figure 2, the second transfer table 54 has a substrate holding section 70 and a pure water supply section 80. In Figure 2(a), the pure water supply section 80 is omitted.

[0053] The substrate holder 70 has a liquid receiving section 71 and a plurality of pins 72. The liquid receiving section 71 has a bottom plate 71a and a wall section 71b. The bottom plate 71a has a disc shape. The wall section 71b is provided in an annular shape on the bottom plate 71a. The plurality of pins 72 are provided on the bottom plate 71a. In the example of Figure 2, there are three pins 72, but there may be four or more. The surface including the upper end of each pin 72 is horizontal. The upper end of each pin 72 is located above the upper end of the wall section 71b. The plurality of pins 72 support the substrate W from below above the bottom plate 71a. A first liquid film LF1, which is a liquid film of the second rinsing liquid, may be formed on the upper surface of the substrate W.

[0054] The pure water supply unit 80 includes a nozzle 81, a pure water supply line 82, and a return line 83. The pure water supply line 82 is connected to the nozzle 81. The nozzle 81 discharges pure water supplied through the pure water supply line 82. A branching point 85 is provided in the pure water supply line 82, and the return line 83 is connected to the branching point 85. Even when pure water is not being discharged from the nozzle 81, pure water flows through the portion of the pure water supply line 82 upstream of the branching point 85 and through the return line 83. The pure water supply unit 80 configured in this way supplies pure water to the upper surface of the substrate W.

[0055] [Operation of the Substrate Processing System] Referring to Figures 1 and 3, the operation of the substrate processing system 1 according to the embodiment, that is, the substrate processing method, will be described. Figure 3 is a flowchart of the substrate processing method according to the embodiment. The processing shown in Figure 3 is executed under the control of the control circuit 9.

[0056] First, cassette C, containing multiple circuit boards W, is loaded into the loading / unloading section 2 and placed on the load port 21. Inside cassette C, the circuit boards W are held horizontally and along the Z-axis at a second pitch P2 (P2 = N × P1). N is a natural number of 2 or more; in this embodiment, it is 2, but it may be 3 or more.

[0057] Next, the cassette transport device 24 transports the cassette C from the load port 21 to the loader 23. Once the cassette C is transported to the loader 23, the lid is opened by the lid opening / closing mechanism.

[0058] Next, the substrate transfer device 31 receives the substrate W contained in the cassette C (S1 in Figure 3) and transports it to the lot formation unit 32.

[0059] Next, the lot forming unit 32 holds multiple substrates W at a first pitch P1 (P1 = P2 / N) to form a lot L (S2 in Figure 3). One lot L consists of, for example, M substrates W for cassette C. Since the pitch of the substrates W narrows from the second pitch P2 to the first pitch P1, the number of substrates W processed at once can be increased.

[0060] Next, the first conveying device 43 receives the lot L from the lot forming unit 32 and conveys it to the processing device 44.

[0061] Next, the processing tool 44 descends from above the chemical solution tank 41, immersing the rod L in the chemical solution and performing treatment with the chemical solution (S3 in Figure 3). After that, the processing tool 44 rises to lift the rod L out of the chemical solution, and then moves toward the negative side of the X axis toward above the rinse solution tank 42.

[0062] Next, the processing tool 44 descends from above the rinse liquid tank 42, immerses the lot L in the first rinse liquid, and performs treatment with the rinse liquid (S3 in Figure 3). After that, the processing tool 44 rises to lift the lot L out of the first rinse liquid. Then, the first conveying device 43 receives the lot L from the processing tool 44 and hands it over to the second conveying device 52.

[0063] Next, the second transport arm 52c of the second transport device 52 moves to the positive side of the Y-axis and descends from above the immersion tank 51, immersing the lot L in the second rinsing liquid (S4 in Figure 3). The multiple substrates W of the lot L are held in the second rinsing liquid until they are pulled out of the second rinsing liquid by the third transport device 53. Since the substrates W are below the liquid surface of the second rinsing liquid, the surface tension of the second rinsing liquid does not act on the substrates W, preventing the collapse of the uneven pattern on the substrates W.

[0064] Next, the third transport device 53 transports the substrates W of the lot L, which are held by the second transport arm 52c in the second rinsing liquid, to the second transfer table 54. The third transport device 53 transports the substrates W one by one to the second transfer table 54. On the second transfer table 54, pure water is discharged onto the upper surface of the substrates W to prevent the surface from drying out and the uneven pattern from collapsing, forming a second liquid film, which is a liquid film of pure water.

[0065] Next, the fourth transport device 61 receives the substrate W from the second transfer table 54 and transports it to the liquid processing device 62.

[0066] Next, the liquid processing apparatus 62 processes each substrate W with liquid (S5 in Figure 3). The liquid may consist of multiple liquids, for example, pure water such as DIW and a drying liquid with a lower surface tension than pure water. The drying liquid may be an alcohol such as IPA. The liquid processing apparatus 62 supplies pure water and the drying liquid in this order to the upper surface of the substrate W, forming a liquid film of the drying liquid.

[0067] Next, the fourth transport device 61 receives the substrate W from the liquid processing device 62 and holds the substrate W horizontally with the drying liquid film facing upwards. The fourth transport device 61 then transports the substrate W from the liquid processing device 62 to the drying device 63.

[0068] Next, the drying apparatus 63 dries the substrates W one by one with supercritical fluid (S5 in Figure 3). The drying liquid can be replaced with supercritical fluid, and the collapse of the uneven pattern on the substrate W due to the surface tension of the drying liquid can be suppressed. Since the supercritical fluid requires a pressure vessel, the process is carried out on a sheet-by-sheet basis rather than in batches in order to miniaturize the pressure vessel.

[0069] In this embodiment, the drying apparatus 63 is a single-wafer type, but as described above, it may also be a batch type. The batch type drying apparatus 63 dries multiple substrates W, each with a liquid film formed on it, all at once using a supercritical fluid. While the single-wafer type drying apparatus 63 has one transport arm for holding the substrates W, the batch type drying apparatus 63 has multiple transport arms.

[0070] In this embodiment, the drying apparatus 63 dries the substrate W by supercritical drying, but the drying method is not particularly limited. Any drying method that can suppress the collapse of the uneven pattern of the substrate W is acceptable, and may be, for example, spin drying, scan drying, or water-repellent drying. In spin drying, the liquid processing apparatus 62 rotates the substrate W and removes the drying liquid from the substrate W by centrifugal force. In scan drying, the substrate W is rotated while the supply position of the drying liquid is moved from the center of the substrate W toward the outer circumference of the substrate W, and the liquid film is removed from the substrate W by centrifugal force. In scan drying, the supply position of the drying gas, such as nitrogen gas, may also be moved from the center of the substrate W toward the outer circumference of the substrate W in accordance with the supply position of the drying liquid.

[0071] Next, the fourth transport device 61 receives the substrate W from the drying device 63 and transports it to the first transfer table 33.

[0072] Next, the substrate transfer device 31 receives the substrate W from the first transfer table 33 and stores it in the cassette C (S6 in Figure 3). The cassette C, containing multiple substrates W, is then discharged from the loading / unloading section 2. This completes the process shown in Figure 3.

[0073] [Transport Control Method] Referring to Figures 4 to 16, a method for controlling the transport of substrates W in the single-wafer processing unit 6 in the substrate processing system 1 (hereinafter referred to as the "transport control method") will be described. The transport control method according to this embodiment is executed under the control of the control circuit 9.

[0074] Hereinafter, the process by which the fourth transport device 61 transports the substrate W from the second transfer table 54 to the liquid processing device 62 will be referred to as the first transport process, and the processing time of the first transport process will be referred to as the first transport time. The process by which the fourth transport device 61 transports the substrate W from the liquid processing device 62 to the drying device 63 will be referred to as the second transport process, and the processing time of the second transport process will be referred to as the second transport time. The process by which the fourth transport device 61 transports the substrate W from the drying device 63 to the first transfer table 33 will be referred to as the third transport process, and the processing time of the third transport process will be referred to as the third transport time.

[0075] The following describes a case where the single-wafer processing unit 6 of the substrate processing system 1 has three sets of liquid processing devices 62 and drying devices 63, and the three sets of liquid processing devices 62 and drying devices 63 work in pairs to continuously process the substrate. However, the single-wafer processing unit 6 of the substrate processing system 1 may also have two or four or more sets of liquid processing devices 62 and drying devices 63, and the two or four or more sets of liquid processing devices 62 and drying devices 63 work in pairs to continuously process the substrate. In this case as well, the same transport control method as in the case where three sets of liquid processing devices 62 and drying devices 63 work in pairs to continuously process the substrate can be applied.

[0076] Figure 4 is a diagram illustrating a transport control method according to the first embodiment. In Figure 4, the first, second, and third pairs of liquid processing apparatus 62 and drying apparatus 63 are labeled "SPIN / SCC-1", "SPIN / SCC-2", and "SPIN / SCC-3", respectively. In Figure 4, the liquid processing performed by the liquid processing apparatus 62 is labeled "Q1", the drying processing performed by the drying apparatus 63 is labeled "Q2", the first transport processing is labeled "T1", the second transport processing is labeled "T2", the third transport processing is labeled "T3", and the adjustment processing added to the liquid processing is labeled "R1".

[0077] The upper part of Figure 4 shows the transport schedule for the substrate W when the adjustment process R1 is not added. In the example shown in the upper part of Figure 4, the processing time of the drying process Q2 is longer than the processing time of the liquid process Q1, and is also longer than three times the total time of the first transport process T1, the second transport process T2, and the third transport process T3.

[0078] As shown in the upper part of Figure 4, if the adjustment process R1 is not added, the timing of the third transport process T3 for one substrate W and the timing of the first transport process T1 for the other substrate W overlap. Specifically, the timing of the third transport process T3, in which the substrate W is transported from the first set of drying apparatus 63 to the first transfer table 33, overlaps with the timing of the first transport process T1, in which the other substrate W is transported from the second transfer table 54 to the second set of liquid processing apparatus 62 (see dashed line enclosed area A11). Also, the timing of the third transport process T3, in which the substrate W is transported from the second set of drying apparatus 63 to the first transfer table 33, overlaps with the timing of the first transport process T1, in which the other substrate W is transported from the second transfer table 54 to the third set of liquid processing apparatus 62 (see dashed line enclosed area A12). Furthermore, the timing of the third transport process T3, in which the substrate W is transported from the third drying apparatus 63 to the first transfer table 33, overlaps with the timing of the first transport process T1, in which the other substrate W is transported from the second transfer table 54 to the first liquid processing apparatus 62 (see dashed line enclosed area A13).

[0079] The lower part of Figure 4 shows the transport schedule for the substrate W when adjustment process R1 is added. As shown in the lower part of Figure 4, the control circuit 9 calculates a fixed interval (cycle time) based on the first transport time, the processing time of liquid treatment Q1, the second transport time, the processing time of drying treatment Q2, and the third transport time, such that the timing of the first, second, and third transport processes for one substrate W does not overlap with the timing when other substrates W are transported by the fourth transport device 61. When calculating the cycle time, the control circuit 9 adds adjustment time to the processing time of liquid treatment Q1 by adding adjustment process R1 to liquid treatment Q1. Next, the control circuit 9 sets the start timing of the first transport process for the substrate W so that the first transport process starts for each calculated cycle time. In this way, when adjustment process R1 is added to liquid treatment Q1, the liquid treatment device 62 can supply rinsing liquid to the substrate W during adjustment process R1. Therefore, when transporting a substrate W on which a liquid film has formed on its surface, the risk of the substrate W drying out during the adjustment time added when the transport time varies can be reduced.

[0080] The lower part of Figure 4 illustrates the case where the adjustment process R1 is added at the beginning of the liquid process Q1, but the timing of the addition of the adjustment process R1 is not limited to this.

[0081] If the liquid treatment Q1 has multiple steps, and the multiple steps include a treatment liquid supply step that supplies treatment liquid to the substrate W, the control circuit 9 may add an adjustment time to the treatment time of the treatment liquid supply step. In this case, the treatment liquid is supplied to the surface of the substrate W during the added adjustment time. This reduces the risk of the substrate W drying out during the added adjustment time. The treatment liquid is, for example, a rinsing liquid such as DIW. The treatment liquid may also be a drying liquid such as IPA. The treatment liquid supply step may be, for example, the first step of the multiple steps. The treatment liquid supply step may also be the last step of the multiple steps.

[0082] If the liquid treatment Q1 has multiple steps, the control circuit 9 may add a pretreatment step before the first of the multiple steps. The pretreatment step includes an adjustment time and is a step of supplying a rinse liquid such as DIW. In this case, the rinse liquid is supplied to the surface of the substrate W during the added adjustment time. Therefore, the risk of the substrate W drying out during the added adjustment time can be reduced. In addition, the adjustment time can be added to the processing time of the liquid treatment Q1 without changing the processing time of each of the multiple steps. Therefore, this is effective when the processing time of each step included in the liquid treatment Q1 has been optimized and it is difficult to change the processing time of each step.

[0083] If the liquid treatment Q1 has multiple steps and a processing recipe including the liquid treatment Q1 is stored in the storage unit 92, the control circuit 9 may select a step to which adjustment time is added based on the information of the multiple steps of the liquid treatment Q1 included in the processing recipe stored in the storage unit 92. The information of the multiple steps of the liquid treatment Q1 may include the type of treatment liquid. For example, the control circuit 9 adds adjustment time to the step where the treatment liquid is a rinse solution. In other words, the control circuit 9 increases the processing time of the step where the treatment liquid is a rinse solution by the adjustment time. The control circuit 9 may also add adjustment time to the step where the treatment liquid is a drying solution. In other words, the control circuit 9 may increase the processing time of the step where the treatment liquid is a drying solution by the adjustment time.

[0084] Figure 5 shows an example of liquid treatment Q1 before adjustment time is added. As shown in Figure 5, liquid treatment Q1 includes a rinse liquid supply step, a chemical solution supply step, and a drying liquid supply step. The rinse liquid supply step is a step of supplying rinse liquid as a treatment liquid to the surface of the substrate W. The rinse liquid is, for example, DIW. The chemical solution supply step is a step of supplying rinse liquid and chemical solution as treatment liquids to the surface of the substrate W. The chemical solutions are, for example, SC1 and DHF. However, the types of chemical solutions are not limited to these. The drying liquid supply step is a step of supplying drying liquid as a treatment liquid to the surface of the substrate W. The drying liquid is, for example, IPA. In the example of Figure 5, the treatment time for the rinse liquid supply step is X1, the treatment time for the chemical solution supply step is X2, and the treatment time for the drying liquid supply step is X3.

[0085] Figure 6 shows a first example of the liquid treatment Q1 after adjustment time has been added. In the example in Figure 6, adjustment time X4 is added to the treatment time X1 of the rinse liquid supply step. In this case, the rinse liquid is supplied to the surface of the substrate W during the adjustment time X4. Therefore, the risk of the substrate W drying out during the added adjustment time can be reduced.

[0086] Figure 7 shows a second example of the liquid treatment Q1 after adjustment time has been added. In the example in Figure 7, adjustment time X4 is added to the processing time X3 of the drying liquid supply step. In this case, the drying liquid is supplied to the surface of the substrate W during the adjustment time X4. Therefore, the risk of the substrate W drying out during the added adjustment time can be reduced.

[0087] Figure 8 shows a third example of the liquid treatment Q1 after adjustment time has been added. In the example in Figure 8, a pretreatment step with adjustment time X4 is added before the rinse liquid supply step, which is the first of the multiple steps of the liquid treatment Q1. The pretreatment step is a step of supplying rinse liquid to the surface of the substrate W. In this case, the rinse liquid is supplied to the surface of the substrate W during the adjustment time X4, which is the processing time of the pretreatment step. Therefore, the risk of the substrate W drying out during the added adjustment time can be reduced. In addition, the adjustment time can be added to the processing time of the liquid treatment Q1 without changing the processing time of each of the multiple steps. Therefore, this is effective when the processing time of each step included in the liquid treatment Q1 has been optimized and it is difficult to change the processing time of each step.

[0088] Figure 9 is a diagram illustrating a transport control method according to a second embodiment. In Figure 9, the first, second, and third pairs of liquid processing apparatus 62 and drying apparatus 63 are labeled "SPIN / SCC-1", "SPIN / SCC-2", and "SPIN / SCC-3", respectively. In Figure 9, the liquid processing performed by the liquid processing apparatus 62 is labeled "Q1", the drying processing performed by the drying apparatus 63 is labeled "Q2", the first transport processing is labeled "T1", the second transport processing is labeled "T2", the third transport processing is labeled "T3", the adjustment processing added to the liquid processing is labeled "R1", and the adjustment processing added to the drying processing is labeled "R2".

[0089] The upper part of Figure 9 shows the transport schedule for the substrate W when adjustment processes R1 and R2 are not added. In the example shown in the upper part of Figure 9, three times the total time of the first transport process T1, the second transport process T2, and the third transport process T3 is longer than the processing time of the liquid process Q1 and also longer than the processing time of the drying process Q2.

[0090] As shown in the upper part of Figure 9, if adjustment processes R1 and R2 are not added, the timing of the third transport process T3 for one substrate W and the timing of the second transport process T2 for the other substrate W overlap. Specifically, the timing of the third transport process T3, in which the substrate W is transported from the second set of drying apparatus 63 to the first transfer table 33, overlaps with the timing of the second transport process T2, in which the other substrate W is transported from the first set of liquid processing apparatus 62 to the first set of drying apparatus 63 (see dashed line enclosed area A21). Also, the timing of the third transport process T3, in which the substrate W is transported from the third set of drying apparatus 63 to the first transfer table 33, overlaps with the timing of the second transport process T2, in which the other substrate W is transported from the second set of liquid processing apparatus 62 to the second set of drying apparatus 63 (see dashed line enclosed area A22). Furthermore, the timing of the third transport process T3, in which the substrate W is transported from the first set of drying apparatus 63 to the first transfer table 33, overlaps with the timing of the second transport process T2, in which the other substrate W is transported from the third set of liquid processing apparatus 62 to the third set of drying apparatus 63 (see dashed line enclosed area A23).

[0091] The lower part of Figure 9 shows the transport schedule for the substrate W when adjustment processes R1 and R2 are added. As shown in the lower part of Figure 9, the control circuit 9 calculates a fixed interval (cycle time) based on the first transport time, the processing time of liquid treatment Q1, the second transport time, the processing time of drying treatment Q2, and the third transport time, such that the timing of the first, second, and third transport processes for one substrate W does not overlap with the timing when other substrates W are transported by the fourth transport device 61. When calculating the cycle time, the control circuit 9 adds adjustment time to the processing time of liquid treatment Q1 by adding adjustment process R1 to liquid treatment Q1, and adds adjustment time to the processing time of drying treatment Q2 by adding adjustment process R2 to drying treatment Q2. Next, the control circuit 9 sets the start timing of the first transport process for the substrate W so that the first transport process starts at each calculated cycle time. In this way, when adjustment process R1 is added to liquid treatment Q1, the liquid treatment device 62 can supply rinsing liquid to the substrate W during adjustment process R1. Therefore, when transporting a substrate W with a liquid film formed on its surface, the risk of the substrate W drying out during the adjustment time added when transport time varies can be reduced. Also, when the adjustment process R2 is added to the drying process Q2, the surface of the substrate W is already dried by the drying process Q2 when the adjustment process R2 is performed. Therefore, even if no processing liquid is supplied to the surface of the substrate W, the collapse of the uneven pattern on the substrate W is unlikely to occur.

[0092] The lower part of Figure 9 illustrates the case where the adjustment process R1 is added at the beginning of the liquid process Q1, but the timing of the addition of the adjustment process R1 is not limited to this. The timing of the addition of the adjustment process R1 may be the same as the timing of the addition of the adjustment process R1 in the transport control method according to the first example of the embodiment.

[0093] Figure 10 is a diagram illustrating a transport control method according to a third embodiment. In Figure 10, the first, second, and third pairs of liquid processing apparatus 62 and drying apparatus 63 are labeled "SPIN / SCC-1", "SPIN / SCC-2", and "SPIN / SCC-3", respectively. In Figure 10, the liquid processing performed by the liquid processing apparatus 62 is labeled "Q1", the drying processing performed by the drying apparatus 63 is labeled "Q2", the first transport processing is labeled "T1", the second transport processing is labeled "T2", the third transport processing is labeled "T3", and the adjustment processing added to the drying processing is labeled "R2".

[0094] The upper part of Figure 10 shows the transport schedule for the substrate W when the adjustment process R2 is not added. In the example shown in the upper part of Figure 10, the processing time of the liquid treatment Q1 is longer than the processing time of the drying treatment Q2, and is also longer than three times the total time of the first transport process T1, the second transport process T2, and the third transport process T3.

[0095] As shown in the upper part of Figure 10, if the adjustment process R2 is not added, the timing of the third transport process T3 for one substrate W and the timing of the second transport process T2 for the other substrate W overlap. Specifically, the timing of the third transport process T3, in which the substrate W is transported from the first set of drying apparatus 63 to the first transfer table 33, overlaps with the timing of the second transport process T2, in which the other substrate W is transported from the third set of liquid processing apparatus 62 to the third set of drying apparatus 63 (see dashed line enclosed area A31). Also, the timing of the third transport process T3, in which the substrate W is transported from the second set of drying apparatus 63 to the first transfer table 33, overlaps with the timing of the second transport process T2, in which the other substrate W is transported from the first set of liquid processing apparatus 62 to the first set of drying apparatus 63 (see dashed line enclosed area A32). Furthermore, the timing of the third transport process T3, in which the substrate W is transported from the third drying apparatus 63 to the first transfer table 33, overlaps with the timing of the second transport process T2, in which another substrate W is transported from the second liquid processing apparatus 62 to the second drying apparatus 63 (see dashed line enclosed area A33).

[0096] The lower part of Figure 10 shows the transport schedule for the substrate W when the adjustment process R2 is added. As shown in the lower part of Figure 10, the control circuit 9 calculates a fixed interval (cycle time) based on the first transport time, the processing time of the liquid treatment Q1, the second transport time, the processing time of the drying treatment Q2, and the third transport time, such that the timing of the first, second, and third transport processes for one substrate W does not overlap with the timing when other substrates W are transported by the fourth transport device 61. When calculating the cycle time, the control circuit 9 adds the adjustment time to the processing time of the drying treatment Q2 by adding the adjustment process R2 to the drying treatment Q2. Next, the control circuit 9 sets the start timing of the first transport process for the substrate W so that the first transport process starts at each calculated cycle time. In this way, when the adjustment process R2 is added to the drying treatment Q2, the surface of the substrate W is dried by the drying treatment Q2 when the adjustment process R2 is performed. For this reason, even if the processing liquid is not supplied to the surface of the substrate W, the collapse of the uneven pattern on the substrate W is unlikely to occur.

[0097] Figure 11 is a diagram illustrating the transport control method of the first reference example. Figure 12 is a diagram illustrating the transport control method according to the fourth embodiment. Figure 13 is a diagram illustrating the transport control method according to the fifth embodiment. Figures 11 to 13 show an example of a transport schedule for substrates W when the start of the first transport process T1 is delayed due to the continuous processing of two lots L with different processing times. Figures 11 to 13 show the case where the processing time of the liquid treatment Q1, the processing time of the drying treatment Q2, and the cycle time differ between two lots L that are processed continuously. However, the transport control methods according to the fifth and sixth embodiments can be applied when at least one of the processing time of the liquid treatment Q1, the processing time of the drying treatment Q2, and the cycle time differs between two lots L that are processed continuously.

[0098] In Figures 11 to 13, the first, second, and third pairs of liquid processing equipment 62 and drying equipment 63 are labeled "SPIN / SCC-1", "SPIN / SCC-2", and "SPIN / SCC-3", respectively. In Figures 11 to 13, the liquid processing performed by the liquid processing equipment 62 is labeled "Q1", the drying processing performed by the drying equipment 63 is labeled "Q2", the first transport processing is labeled "T1", the second transport processing is labeled "T2", and the third transport processing is labeled "T3".

[0099] In the transport control method of the first reference example, the control circuit 9 controls the fourth transport device 61 to maintain an interval of at least the cycle time when transporting the substrate W from the second transfer table 54 to the liquid processing device 62. Furthermore, the control circuit 9 controls the fourth transport device 61 to prioritize the second transport process T2 among the first transport process T1, the second transport process T2, and the third transport process T3. In other words, the control circuit 9 controls the fourth transport device 61 to prioritize the transport of the substrate W from the liquid processing device 62 to the drying device 63 over the transport of the substrate W from the second transfer table 54 to the liquid processing device 62 and the transport of the substrate W from the drying device 63 to the first transfer table 33. Furthermore, the control circuit 9 controls the fourth transport device 61 to prioritize the third transport process T3 among the first transport process T1 and the third transport process T3. In other words, the control circuit 9 controls the fourth transfer device 61 to prioritize the transfer of the substrate W from the drying device 63 to the first transfer device 33 over the transfer of the substrate W from the second transfer table 54 to the liquid processing device 62.

[0100] As shown in Figure 11, in the transport control method of the first reference example, if the processing time of liquid treatment Q1, the processing time of drying treatment Q2, and the cycle time differ between two lots L that are processed consecutively, the start of the first transport treatment T1 may be delayed, as indicated by arrow 101. This is because the start of liquid treatment Q1 is delayed in order to prevent waiting time from occurring between liquid treatment Q1 and drying treatment Q2.

[0101] If the start of the first transport process T1 is delayed, the start of the first transport process T1 for a subsequent substrate W may be delayed, as shown by arrow 102. This is because the timing of the first transport process T1 for one substrate W overlaps with the timing of the second transport process T2 for other substrates W, and the second transport process T2, which has a higher priority than the first transport process T1, is performed first. The priority of the second transport process T2 is set higher than the priorities of the first transport process T1 and the third transport process T3 in order to prevent the top surface of the substrate W from drying out and the uneven pattern from collapsing. Also, the timing of the first transport process T1 for one substrate W overlaps with the timing of the third transport process T3 for other substrates W, and the third transport process T3, which has a higher priority than the first transport process T1, is performed first.

[0102] If the start of the first transport process T1 is delayed, the start of the third transport process T3 for a subsequent substrate W may be delayed, as shown by arrow 103. This is because the timing of the third transport process T3 for one substrate W overlaps with the timing of the second transport process T2 for other substrates W, and the second transport process T2, which has a higher priority than the third transport process T3, is performed first.

[0103] Thus, if the start of the first transport process T1 is delayed, delays will continue to occur in the start of the first transport process T1 and the third transport process T3 for the substrates W that are processed thereafter.

[0104] In the transport control method according to the fourth example, in addition to the transport control method of the first reference example, the control circuit 9 performs the following control. First, as shown in Figure 12, if the start of the first transport process T1 is delayed, the control circuit 9 controls the fourth transport device 61 to suppress the start of processing of the next lot L after processing of the current lot L. A delay in the start of the first transport process T1 means, for example, that the first transport process T1 cannot be started at the start time of a predetermined cycle time. A delay in the start of the first transport process T1 may also mean that the first transport process T1 cannot be started within a predetermined time from the start time of a predetermined cycle time. The predetermined time is, for example, 1 / 10 of the cycle time. Next, the control circuit 9 controls the fourth transport device 61 to start the first transport process T1 of the next lot L after all liquid processing devices 62 and all drying devices 63 are no longer containing substrates W. In this case, delays in the start of the first transport process T1 and the third transport process T3 can be prevented from continuing. Also, transport of substrates W can be resumed at predetermined intervals.

[0105] In the transport control method according to the fifth example, in addition to the transport control method of the first reference example, the control circuit 9 performs the following control. First, as shown in Figure 13, if the start of the first transport process T1 is delayed, the control circuit 9 controls the fourth transport device 61 to skip the first transport process T1 for liquid transport devices 62 that cannot start the first transport process T1. Next, the control circuit 9 sets the priority of the first transport process T1 for liquid transport devices 62 that cannot start the first transport process T1 to the lowest level. For example, consider the case where the order of use of the liquid transport devices 62 is as follows: first is the first set of liquid transport devices 62, second is the second set of liquid transport devices 62, third is the third set of liquid transport devices 62, and the first transport process T1 for the first set of liquid transport devices 62 is skipped. In this case, the control circuit 9 changes the order of use of the liquid transport devices 62, with the first being the second set of liquid transport devices 62, the second being the third set of liquid transport devices 62, and the third being the first set of liquid transport devices 62. In other words, the control circuit 9 controls the fourth transport device 61 to perform the first transport process T1 on the second set of liquid processing devices 62 at the start of the next cycle time following the cycle time in which the first transport process T1 could not be started. In this case, delays in the start of the first transport process T1 and the third transport process T3 can be prevented. Furthermore, since the start of processing of the next lot L after processing of the current lot L is not suppressed, the decrease in productivity can be minimized.

[0106] Figure 14 is a diagram illustrating the transport control method of the second reference example. Figure 15 is a diagram illustrating the transport control method according to the sixth embodiment. Figure 16 is a diagram illustrating the transport control method according to the seventh embodiment. Figures 14 to 16 show an example of the transport schedule for the substrate W when the start of the first transport process T1 is delayed due to maintenance performed in the liquid processing apparatus 62. The maintenance process includes module cleaning, dummy dispensing, etc.

[0107] In Figures 14 to 16, the first, second, and third pairs of liquid treatment devices 62 and drying devices 63 are labeled "SPIN / SCC-1", "SPIN / SCC-2", and "SPIN / SCC-3", respectively. In Figures 14 to 16, the liquid treatment performed by the liquid treatment device 62 is labeled "Q1", the drying treatment performed by the drying device 63 is labeled "Q2", the first transport treatment is labeled "T1", the second transport treatment is labeled "T2", and the third transport treatment is labeled "T3". In Figures 14 to 16, the maintenance treatment performed by the liquid treatment device 62 is labeled "M1".

[0108] In the transport control method of the second reference example, the control circuit 9 performs the same control as in the transport control method of the first reference example. As shown in Figure 14, in the transport control method of the second reference example, if maintenance processing is performed in the second set of liquid processing devices 62 and the third set of liquid processing devices 62, for example, the start of the first transport processing T1 for the second set of liquid processing devices 62 and the third set of liquid processing devices 62 is delayed, as shown by arrows 201 and 202. This is because the maintenance processing in the liquid processing devices 62 and the second transport processing T2 for other substrates W are given priority.

[0109] If the start of the first transport process T1 for the second and third sets of liquid processing devices 62 is delayed, the start of the first transport process T1 for a subsequent substrate W may be delayed, as shown by arrows 203 to 208. This is because the timing of the first transport process T1 for one substrate W overlaps with the timing of the second transport process T2 for other substrates W, and the second transport process T2, which has a higher priority than the first transport process T1, is performed first. Also, the timing of the first transport process T1 for one substrate W overlaps with the timing of the third transport process T3 for other substrates W, and the third transport process T3, which has a higher priority than the first transport process T1, is performed first.

[0110] If the start of the first transport process T1 for the second and third sets of liquid processing devices 62 is delayed, the start of the third transport process T3 for a substrate W to be processed thereafter may be delayed, as shown by arrows 209 and 210.

[0111] Thus, if the start of the first transport process T1 is delayed, delays will continue to occur in the start of the first transport process T1 and the third transport process T3 for the substrates W that are processed thereafter.

[0112] In the transport control method according to the sixth example, the control circuit 9 performs the following control, similar to the transport control method according to the fourth example. First, as shown in Figure 15, if the start of the first transport process T1 is delayed, the control circuit 9 controls the fourth transport device 61 to suppress the start of processing of the next lot L after processing of the current lot L. A delay in the start of the first transport process T1 means, for example, that the first transport process T1 cannot be started at the start time of a predetermined cycle time. A delay in the start of the first transport process T1 may also mean that the first transport process T1 cannot be started within a predetermined time from the start time of a predetermined cycle time. The predetermined time is, for example, 1 / 10 of the cycle time. Next, the control circuit 9 controls the fourth transport device 61 to start the first transport process T1 of the next lot L after all the liquid processing devices 62 and all the drying devices 63 are no longer filled with substrates W. In this case, delays in the start of the first transport process T1 and the third transport process T3 can be prevented from continuing. Also, transport of substrates W can be resumed at predetermined intervals.

[0113] In the transport control method according to the seventh example, the control circuit 9 performs the following control, similar to the transport control method according to the fifth example. First, as shown in Figure 16, if the start of the first transport process T1 is delayed, the control circuit 9 controls the fourth transport device 61 to skip the first transport process T1 for liquid transport devices 62 that cannot start the first transport process T1. Next, the control circuit 9 sets the priority of the first transport process T1 for liquid transport devices 62 that cannot start the first transport process T1 to the lowest level. For example, consider the case where the order of use of the liquid transport devices 62 is as follows: first, second, third, and third, and the first transport process T1 for the second set of liquid transport devices 62 is skipped. In this case, the control circuit 9 changes the order of use of the liquid transport devices 62, with the first being the third set of liquid transport devices 62, the second being the first set of liquid transport devices 62, and the third being the second set of liquid transport devices 62. In other words, the control circuit 9 controls the fourth transport device 61 to perform the first transport process T1 on the third set of liquid processing devices 62 at the start of the next cycle time following the cycle time in which the first transport process T1 could not be started. In this case, delays in the start of the first transport process T1 and the third transport process T3 can be prevented. Furthermore, since the start of processing of the next lot L after processing of the current lot L is not suppressed, the decrease in productivity can be minimized.

[0114] In the above embodiments, the case in which the transport control method according to the first to seventh embodiments is executed in a substrate processing system 1 comprising an input / output unit 2, a first interface unit 3, a batch processing unit 4, a second interface unit 5, a single-wafer processing unit 6, and a control circuit 9 has been described. However, the transport control method according to the first to seventh embodiments can also be executed in a substrate processing system that does not have a batch processing unit 4 and a second interface unit 5. That is, the transport control method according to the first to seventh embodiments can also be executed in a substrate processing system comprising an input / output unit 2, a first interface unit 3, a batch processing unit 4, and a control circuit 9.

[0115] In the above embodiment, the fourth conveying device 61 is an example of a conveying unit, the liquid processing device 62 is an example of a first processing unit, the liquid processing Q1 is an example of a first processing unit, the drying device 63 is an example of a second processing unit, and the drying processing Q2 is an example of a second processing unit.

[0116] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The above embodiments may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims.

[0117] This international application claims priority based on Japanese Patent Application No. 2024-225421, filed on 20 December 2024, and Japanese Patent Application No. 2025-146820, filed on 4 September 2025, and the entire contents of said application are incorporated herein by reference.

[0118] 1 Substrate processing system 4 Batch processing unit 5 Second interface unit 6 Single-wafer processing unit 61 Fourth transport device 62 Liquid processing device 63 Drying device 9 Control circuit Q1 Liquid processing Q2 Drying processing L Lot W Substrate

Claims

1. A batch processing unit for processing a lot containing multiple substrates in a batch; a single-wafer processing unit for processing the substrates in the lot one by one; an interface unit for receiving the substrates from the batch processing unit to the single-wafer processing unit with a liquid film still formed on them; and a control circuit, wherein the single-wafer processing unit comprises a plurality of first processing units for performing a first processing on the substrates; a plurality of second processing units for performing a second processing on the substrates that have undergone the first processing; and a transport unit for transporting the substrates to the interface unit, the plurality of first processing units, and the plurality of second processing units, and the control circuit is A substrate processing system that calculates a fixed interval between the timing of the first, second, and third transport processes of the substrate and the timing of other substrates being transported by the transport unit, based on the processing time of the first transport process in which the substrate on which the liquid film is formed is transported from the interface unit to the first processing unit, the processing time of the first process, the processing time of the second transport process in which the substrate is transported from the first processing unit to the second processing unit, the processing time of the second process, and the processing time of the third transport process in which the substrate is unloaded from the second processing unit, so as not to overlap, sets the start timing of the first transport process of the substrate so as to start at each of the calculated fixed intervals, and adds an adjustment time to the processing time of the first process when calculating the fixed interval.

2. The substrate processing system according to claim 1, wherein the first process comprises a plurality of steps, the plurality of steps including a step of supplying a processing liquid to the substrate, and the control circuit adds the adjustment time to the processing time of the step of supplying the processing liquid.

3. The substrate processing system according to claim 2, wherein the step of supplying the processing liquid is the first of the plurality of steps.

4. The substrate processing system according to claim 2, wherein the step of supplying the processing liquid is the last of the plurality of steps.

5. The substrate processing system according to claim 1, wherein the first process comprises a plurality of steps, the control circuit adds a pre-processing step having the adjustment time before the first of the plurality of steps, and the pre-processing step is a step of supplying a processing liquid to the substrate.

6. A substrate processing system according to claim 1, comprising a storage unit for storing a processing recipe including the first processing, wherein the first processing has a plurality of steps, and the control circuit selects a step for adding the adjustment time from among the plurality of steps based on information of the plurality of steps included in the processing recipe stored in the storage unit.

7. The substrate processing system according to claim 6, wherein the information includes the type of processing solution.

8. The substrate processing system according to claim 7, wherein the control circuit adds the adjustment time to the step in which the processing liquid is a rinsing liquid.

9. The substrate processing system according to claim 7, wherein the control circuit adds the adjustment time to the step in which the processing liquid is a drying liquid.

10. The substrate processing system according to any one of claims 1 to 9, wherein the interface unit comprises an immersion tank for immersing the lot processed in the batch processing unit, and a transfer table for holding the substrate removed from the immersion tank until it is transported to the single-wafer processing unit, and the transfer table for supplying rinsing liquid to the surface of the substrate, and the first transport process is the process of transporting the substrate from the transfer table to the first processing unit.

11. The substrate processing system according to any one of claims 1 to 9, wherein the control circuit controls the transport of the substrate on which the liquid film has been formed from the batch processing unit to the single-wafer processing unit at the set start timing.

12. The substrate processing system according to claim 1, wherein the control circuit performs control to suppress the start of processing of the next lot after processing of the current lot if the start of the first transport processing is delayed.

13. The substrate processing system according to claim 12, wherein the control circuit determines whether the start of the first transport process has been delayed based on information of the maintenance process performed by the first processing unit, or information of the processing time of the current lot and the next lot.

14. The substrate processing system according to claim 12, wherein the control circuit performs control to start the first transport process for the next lot after the plurality of first processing units and the plurality of second processing units have reached a state in which no substrates are present.

15. The substrate processing system according to claim 1, wherein the control circuit performs control to skip the first transport process for the first processing unit that is unable to start the first transport process if the start of the first transport process is delayed.

16. The substrate processing system according to claim 15, wherein the control circuit performs control that prioritizes the second transport process among the first transport process, the second transport process and the third transport process.

17. The substrate processing system according to claim 15, wherein the control circuit performs control to set the priority of the first transport process to the lowest level for the first processing unit that is unable to start the first transport process.

18. The substrate processing system according to claim 12 or 15, wherein the control circuit controls the first processing unit to start maintenance processing when the substrate is not present in the first processing unit.

19. The substrate processing system according to claim 13, wherein the control circuit is configured to determine whether the start of the first transport process has been delayed based on information on the processing times of the current lot and the next lot, and determines that the start of the first transport process has been delayed if the processing time of the current lot and the processing time of the next lot are different.

20. A substrate processing method performed by a substrate processing system comprising: a batch processing unit for processing a lot containing multiple substrates in a batch; a single-wafer processing unit for processing the substrates of the lot one by one; and an interface unit for transferring the substrates on which a liquid film has been formed between the batch processing unit and the single-wafer processing unit, wherein the single-wafer processing unit comprises: a plurality of first processing units for performing a first processing on the substrate; a plurality of second processing units for performing a second processing on the substrates on which the first processing has been performed; and a transport unit for transporting the substrates to the interface unit, the plurality of first processing units, and the plurality of second processing units, A substrate processing method comprising: calculating a fixed interval in which the timing of the first, second, and third transport processes of the substrate does not overlap with the timing of other substrates being transported by the transport unit, based on the processing time of a first transport process in which the substrate on which the liquid film is formed is transported from the interface unit to the first processing unit; the processing time of the first process; the processing time of a second transport process in which the substrate is transported from the first processing unit to the second processing unit; the processing time of the second process; and the processing time of a third transport process in which the substrate is unloaded from the second processing unit; setting the start timing of the first transport process of the substrate so that the first transport process is started at each of the calculated fixed intervals; and adding an adjustment time to the processing time of the first process when calculating the fixed interval.

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