Coupler for obtaining power of RF signal, and electronic device having same

Abstract

The present invention relates to a coupler for obtaining power of a radio frequency (RF) signal. A PEMS coupler has a structure robust to thickness variations of a PCB. An electronic device having such a coupler is provided. The electronic device can accurately detect power of an RF signal from the coupler and perform an accurate calibration process by itself.

Description

Coupler for acquiring power of an RF signal and electronic device having the same

[0001] The present disclosure relates to a coupler for acquiring power of an RF (radio frequency) signal and an electronic device having the same.

[0002] A coupler can be placed adjacent to an RF signal line to sample the power of RF signals transmitted and received through an antenna. The coupler can be embedded in a multilayer PCB. Such a coupler may be referred to as a PEMS (Printed Circuit Board Embedded Solution) coupler. Information regarding the power of the RF signal obtained through the coupler can be used in a process to calibrate performance by testing RF transmission and reception performance. An electronic device can perform the calibration process autonomously using the coupler without the support of separate measurement equipment.

[0003] The information described above is provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] Due to variations in PCB thickness, the accuracy of power detection may differ depending on the electronic device performing the self-calibration process. For example, during the fabrication of PEMS couplers, the thickness of the dielectric material between layers of the PCB may exceed the allowable tolerance. Since dielectric thickness is inversely proportional to capacitance, it can affect the coupling factor, a characteristic of the coupler.

[0005] Various embodiments of the present disclosure can provide a coupler that is robust to PCB thickness variations and capable of miniaturization, and an electronic device having the same. Accordingly, the electronic device can accurately detect the power of an RF signal from the coupler and perform an accurate calibration process itself.

[0006] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below.

[0007] According to one embodiment, a coupler for acquiring power of a radio frequency (RF) signal may include a printed circuit board (PCB); a first signal line embedded in the PCB; and a second signal line embedded in the PCB. The first signal line may include a first port, a second port, a first element, and a second element. The second signal line may include a third port, a fourth port, a third element, and a fourth element. A first layer of the PCB may include the first port; the third port; a first element of the first signal line extending from the first port; and a third element of the second signal line extending from the third port. A second layer of the PCB may include the second port; and a second element of the first signal line extending from the second port and connected to the first element through a first via. A third layer of the PCB may include the fourth port; and a fourth element of the second signal line extending from the fourth port and connected to the third element through a second via. At least a portion of the first element, at least a portion of the second element, and at least a portion of the fourth element may be aligned in a line while overlapping when viewing the plane in a first direction perpendicular to the plane of the PCB. The third element may be located inside the first element without overlapping with the first element when viewing the plane in the first direction. At least a portion of the first element and at least a portion of the third element may be aligned in a line.

[0008] According to one embodiment, an electronic device including the coupler is provided. The electronic device may include an antenna; a wireless communication circuit configured to receive an RF signal from the antenna through the first signal line and output an RF signal to the antenna; and a power detection circuit configured to detect the power of the RF signal output from the wireless communication circuit to the antenna through the second signal line.

[0009] According to various embodiments of the present disclosure, the PEMS coupler has a structure robust to variations in PCB thickness. An electronic device having such a coupler is provided. The electronic device can accurately detect the power of an RF signal from the coupler and perform an accurate calibration process itself. In addition, various effects that are directly or indirectly understood from this document may be provided.

[0010] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0011] Figure 2 illustrates the configuration of an electronic device having a PEMS coupler.

[0012] Figure 3 is a diagram illustrating power extraction from a PEMS coupler.

[0013] FIGS. 4a and 4b are drawings for illustrating a coupling structure applicable to a PEMS coupler according to one embodiment.

[0014] FIGS. 5a, 5b, 5c, 5d, 5e, and 5f illustrate a PEMS coupler having a coupling structure robust to thickness variation according to one embodiment.

[0015] Figure 6 is a diagram illustrating an example of a coupling structure applicable to a PEMS coupler.

[0016] Figure 7a is a graph showing the relationship between frequency and power ratio in a PEMS coupler having the coupling structure of Figure 6.

[0017] Figure 7b is a graph showing the relationship between frequency and power ratio in a PEMS coupler having the coupling structure of Figure 5a.

[0018] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0019] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0020] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0021] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0022] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0023] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0024] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0025] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0026] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0027] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0028] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0030] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0032] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0034] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0036] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0037] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0038] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0039] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0040] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0041] FIG. 2 illustrates the configuration of an electronic device (200) having a PEMS coupler (240). FIG. 3 is a diagram illustrating power extraction from the PEMS coupler (240).

[0042] Referring to FIG. 2, the electronic device (200) may include an antenna (210), a wireless communication circuit (220), a power detection circuit (230), a PEMS coupler (240), a memory (288), and a processor (e.g., including processing circuitry) (299).

[0043] Instructions may be stored in memory (288). Some of the instructions may be stored in memory (288) and others may be stored in the internal memory of the processor (299). When the instructions are executed by the processor (299), they may cause the electronic device (200) to perform a given operation (e.g., a correction process using power information obtained through the power detection circuit (230).

[0044] A processor (299) (e.g., processor (120) of FIG. 1) may include a communication processor (CP) and an application processor (AP). The CP, together with the AP, may be configured on a single chip or included in a single package. The description of the processor (120) may apply equally to the processor (299).

[0045] The wireless communication circuit (220) can receive a digital signal from the processor (299), convert it into an RF signal, and output it to the antenna (210). The wireless communication circuit (220) can receive an RF signal from the antenna (210), convert it into a digital signal, and output it to the processor (299). In one embodiment, the wireless communication circuit (220) may include a radio frequency integrated circuit (RFIC) (223) and a radio frequency front end (RFFE) (225).

[0046] The RFIC (223) receives a digital signal from a processor (299) (e.g., CP) and converts the digital signal into an analog signal of a specified baseband (hereinafter, baseband signal), and, based on the control of the processor (299) (e.g., CP), can convert the received baseband signal into an RF signal of a specified frequency band. For example, the RFIC (223) can generate an RF signal by mixing a reference frequency signal generated by a local oscillator (LO) with the baseband signal. The RFIC (223) can output the RF signal to the antenna (210) through the RFFE (225). The RFIC (223) can receive an RF signal from the antenna (210) through the RFFE (225) and convert the RF signal into a baseband signal. For example, the RFIC (223) can generate a baseband signal by mixing a reference frequency signal generated by the LO with the RF signal. The RFIC (223) can convert the baseband signal into a digital signal and output it to a processor (299) (e.g., CP).

[0047] The power detection circuit (230) can detect the power of an RF signal (hereinafter referred to as Tx (transmitted) RF signal) output from a wireless communication circuit (220) to an antenna (210) through a PEMS coupler (240). The power detection circuit (230) can provide information regarding the detected power to a processor (299). For example, the power detection circuit (230) can receive an RF signal from the PEMS coupler (240), convert the received RF signal into a digital signal, and output it to the processor (299). According to one embodiment, the power detection circuit (230) may be a component included in the wireless communication circuit (220) (e.g., RFIC (223)).

[0048] The PEMS coupler (240) may include a first signal line (241), a second signal line (242), and a PCB (243). The PCB (243) may have a multilayer structure. The first signal line (241) and the second signal line (242) may be configured on the PCB (243). Port a, which is one end of the first signal line (241), may be connected to the RFFE (225) of the wireless communication circuit (220), and port b, which is the other end of the first signal line (241), may be connected to the antenna (210). Port c, which is one end of the second signal line (242), may be connected to the power detection circuit (230), and port d, which is the other end of the second signal line (242), may be connected to the ground (260) of the electronic device (200). A resistive element (e.g., a resistor or other circuit (e.g., a capacitor or inductor having resistance, etc.)) (250) may be placed between ground (260) and port d so that the RF signal extracted from the PEMS coupler (240) flows to the power detection circuit (230) through electrical coupling between the first signal line (241) and the second signal line (242). The resistive element (250) may be mounted on the surface of the PCB (243). Referring to FIG. 3, the RF signal (310) input to port a of the first signal line (310) may be output to the antenna (210) through port b. When an RF signal (310) flows through the first signal line (241), an incident wave (320) and a reflected wave (330) can be generated in the PEMS coupler (240) through electrical coupling (e.g., inductive coupling (301) and capacitive coupling (302)). The incident wave (320) and the reflected wave (330) can flow to the power detection circuit (230) through port c of the second signal line (242). The accuracy of power detection can be determined by the difference between the power of the incident wave (310) and the power of the reflected wave (330).The lower the power of the reflected wave (330), the higher the accuracy can be.

[0049] Two signal lines (241, 242) can be formed on the PCB (243) in a structure that reduces the influence of the thickness between layers on the accuracy of power detection. As an example of such a structure, the second signal line (242) can be partially formed on multiple layers of the PCB (243). At least a portion of the first signal line (241) can be formed on the same layer as a portion of the second signal line (242). Accordingly, the size of the PEMS coupler (240) can be reduced.

[0050] FIGS. 4a and 4b are drawings for illustrating a coupling structure applicable to a PEMS coupler (e.g., the PEMS coupler (240) of FIG. 2) according to one embodiment.

[0051] Referring to FIG. 4a, a first conductor (401) (e.g., part of the first signal line (241)) and a second conductor (402) (e.g., part of the second signal line (242)) may each be formed on different layers. Power of the RF signal flowing in the first conductor (401) may be transferred to the second conductor (402) by electrical coupling (e.g., inductive coupling (301) and capacitive coupling (302)). The capacitance (C1) between the first conductor (401) and the second conductor (402) may be defined as shown in Equation 1 below. In the formula, W is the width of the two conductors (401, 402) and d is the distance between the two conductors (401, 402). ε is a predetermined constant value. Referring to Equation 1, C1 is affected by d. d can vary depending on the thickness of the dielectric located between layers. As the dielectric thickness decreases, C1 increases, and as the dielectric thickness increases, C1 decreases. Therefore, variations in thickness can be a factor that lowers the reliability of the power value detected using the coupler.

[0052]

[0053] The above mathematical formula 1 is merely an example to aid understanding, and embodiments of the present disclosure are not limited thereto. For example, the above mathematical formula 1 may be modified, applied, or extended in various ways.

[0054] The coupling coefficient can be increased by the fringing effect, a phenomenon in which magnetic field lines bend toward the edges. The fringing effect can occur between conductors formed on the same layer.

[0055] Referring to FIG. 4b, a third conductor (403) (e.g., part of the first signal line (241)) and a fourth conductor (404) (e.g., part of the second signal line (242)) can be formed on the same layer. Coupling due to the fringing effect between two adjacent conductors (403, 404) located on the same layer can increase the transfer efficiency of energy (e.g., power). The capacitance (C2) between the third conductor (403) and the fourth conductor (404) can be defined as Equation 2 below. In the formula, W is the width of the two conductors (403, 404) and S is the distance between the two conductors (403, 404). ln() is the natural logarithm function, ε is a predetermined constant value, and π is the ratio of the circumference to the circumference.

[0056]

[0057] The above mathematical formula 2 is merely an example to aid understanding, and embodiments of the present disclosure may not be limited thereto. For example, the above mathematical formula 2 may be modified, applied, or extended in various ways.

[0058] C2 is affected by S. If S becomes smaller, C2 increases, and if S becomes larger, C2 decreases. Therefore, deviation in the distance “S” between the two wires (403, 404) can be a factor that lowers the reliability of the power value detected using the coupler.

[0059] A PEMS coupler according to an embodiment of the present disclosure can be robust against deviations in thickness (e.g., d described above) and / or distance (e.g., S described above) by having a coupling structure having a first conductor (401), a second conductor (402) located on a different layer from the first conductor (401), and a fourth conductor (404) located on the same layer as the first conductor (401) (e.g., third conductor (403)). Therefore, the reliability of the power value detected using the coupler can be high.

[0060] FIGS. 5a, 5b, 5c, 5d, 5e, and 5f illustrate a PEMS coupler (500) having a coupling structure robust to thickness variation according to one embodiment. Specifically, FIG. 5a is a perspective view of the PEMS coupler (500). FIG. 5b shows a front view of the PEMS coupler (500). FIG. 5c is a drawing of the PEMS coupler (500) cut in the AB direction. FIG. 5d is a drawing of the PEMS coupler (500) cut in the CD direction. FIG. 5e is a drawing of the PEMS coupler (500) cut in the EF direction. FIG. 5f is a drawing of the PEMS coupler (500) cut in the GH direction. The PEMS coupler (500) may include a first signal line (510), a second signal line (520), and a multilayer PCB (530; see FIG. 5c, 5d, 5e and 5f).

[0061] The first signal line (510) may include a first port (511) and a second port (512). One of the first port (511) and the second port (512) may be port a (see FIG. 2) connected to a wireless communication circuit (220) and the other may be port b (see FIG. 2) connected to an antenna (210).

[0062] The second signal line (520) may include a third port (521) and a fourth port (522). One of the third port (521) and the fourth port (522) may be port c (see FIG. 2) connected to the power detection circuit (230) and the other may be port d (see FIG. 2) connected to ground (260).

[0063] In the first signal line (510), the first element (e.g., part of the first signal line including a conductive material or conductor) (513) and the first port (511) may be formed on the first layer (or substrate) (531) of the PCB (530). The first element (513) may extend from the first port (511) and be connected to the second element (514) in the second signal line (520) through a first via (541). According to one embodiment, the first port (511) may be placed on a different layer (e.g., a second layer (532), a third layer (533), or another layer not shown) other than the first layer (531) and thus may be connected to the first element (513) through a different via.

[0064] In the first signal line (510), the second element (514) and the second port (512) may be formed on the second layer (532) of the PCB (530). The second element (514) may extend from the second port (512) and be connected to the first element (513) through a first via (541). According to one embodiment, the second port (512) may be placed on a different layer (e.g., the first layer (531), the third layer (533), or another layer) other than the second layer (532), and accordingly may be connected to the second element (514) through another via.

[0065] In the second signal line (520), the third element (523) and the third port (521) may be formed on the first layer (531) of the PCB (530). The third element (523) may extend from the third port (521) and be connected to the fourth element (524) in the second signal line (520) through a second via (542). According to one embodiment, the third port (521) may be placed on a different layer (e.g., the second layer (532), the third layer (533), or another layer) other than the first layer (531), and accordingly may be connected to the third element (523) through another via.

[0066] In the second signal line (520), the fourth element (524) and the fourth port (522) may be formed on the third layer (533) of the PCB (530). The fourth element (524) may extend from the fourth port (522) and be connected to the third element (523) in the second signal line (520) through a second via (542). According to one embodiment, the fourth port (522) may be placed on a different layer (e.g., the first layer (531), the second layer (532), or another layer) other than the third layer (533), and accordingly may be connected to the fourth element (524) through another via.

[0067] The PEMS coupler (500) may include a conductive pattern (550) (e.g., a resistor element (250) in FIG. 2) for isolation from surrounding electronic components. The conductive pattern (550) is connected to a fourth port (522) and may have a closed-loop form (e.g., a cage structure) surrounding a first signal line (510) and a second signal line (520), as shown in FIG. 5b. For example, the conductive pattern (550) may include a first conductive pattern (551) placed on a first layer (531), a second conductive pattern (552) placed on a second layer (532), and a third conductive pattern (553) placed on a third layer (533), as shown in FIG. 5c, 5d, 5e, and 5f. The conductive patterns of each layer may be connected to each other through vias.

[0068] The elements (513, 514, 523, 524) may have a shape that is rolled clockwise or counterclockwise when viewed in a direction perpendicular to the plane of the PCB (530) (e.g., xy plane) (e.g., z-axis direction).

[0069] Referring to FIG. 5b, the PCB (530) may have a rectangular shape. For example, the PCB (530) has a first side (or, upper side) (501), a second side (or, right side) (502) perpendicular to the first side (501), a third side (or, left side) (503) parallel to the second side (502), and a fourth side (or, lower side) (504) parallel to the first side (501). A first port (511) and a first via (541) may be placed on the first layer (531) adjacent to the first side (501). A first element (513) may extend from the first port (511) to the first via (541) along the third side (503), the fourth side (504), and the second side (502).

[0070] A third port (521) may be placed in the first layer (531) between the first port (511) and the first via (541) and adjacent to the first side (501). A second via (542) may be placed in the first layer (531) adjacent to the first via (541) and closer to the fourth side (504) compared to the first via (541). A third element (523) may extend from the third port (521) to the second via (542) along the third side (503), the fourth side (504), and the second side (502). The third element (523) may be located inside the first element (513) as illustrated.

[0071] The second port (512) may be placed in the second layer (532) adjacent to the second side (502). The fourth port (522) may be placed in the third layer (533) adjacent to the second side (502) and closer to the fourth side (504) compared to the second port (512). The second element (514) may extend from the first via (541) along the third side (503), the fourth side (504), and the second side (502) to the second port (512). The fourth element (524) may extend from the second via (542) along the third side (503), the fourth side (504), and the second side (502) to the fourth port (522).

[0072] At least a portion of the first element (513), at least a portion of the second element (514), and at least a portion of the fourth element (524) can be aligned in a line while overlapping when viewed in a first direction (e.g., z-axis direction) perpendicular to the plane of the PCB (500) (e.g., xy plane). Referring to FIG. 5b, the left portion of the first element (513), the left portion of the second element (514), and the left portion of the fourth element (524) can be extended along the left side (503) (e.g., in a straight line parallel to the left side (503)) while overlapping when viewed in the first direction of the plane of the PCB (530). The lower portion of the first element (513), the lower portion of the second element (514), and the lower portion of the fourth element (524) may be extended along the lower side (504) (e.g., in a straight line parallel to the lower side (504)) while overlapping when viewing the plane of the PCB (530) in the first direction. The right portion of the first element (513), the right portion of the second element (514), and the right portion of the fourth element (524) may be extended along the right side (502) (e.g., in a straight line parallel to the right side (502)) while overlapping when viewing the plane of the PCB (530) in the first direction.

[0073] The third element (523) may be located inside the first element (513) without overlapping with the first element (513) when viewing the plane of the PCB (530) in the first direction. At least a portion of the first element (513) and at least a portion of the third element (523) may be aligned in a line. Referring to FIG. 5b, the left portion of the third element (523) may be located inside the PCB (530) more than the left portion of the first element (513) and may extend in a straight line parallel to the left portion of the first element (513). The lower portion of the third element (523) may be located inside the PCB (530) more than the lower portion of the first element (513) and may extend in a straight line parallel to the lower portion of the first element (513). The right portion of the third element (523) is located inside the PCB (530) compared to the right portion of the first element (513) and can be extended in a straight line parallel to the right portion of the first element (513).

[0074] One or more layers may be located between the first layer (531) and the second layer (532) and / or between the second layer (532) and the third layer (533).

[0075] FIG. 6 is a diagram illustrating an example of a coupling structure applicable to a PEMS coupler. FIG. 7a is a graph showing the relationship between frequency and power ratio in a PEMS coupler having the coupling structure of FIG. 6. FIG. 7b is a graph showing the relationship between frequency and power ratio in a PEMS coupler (500) having the coupling structure of FIG. 5a. In FIG. 7a and FIG. 7b, the y-axis represents the ratio of the power detected using a power detection circuit to the power of an RF signal input from a wireless communication circuit to the PEMS coupler, and the magnitude of the power ratio is expressed in decibels. In FIG. 7a and FIG. 7b, the x-axis represents the frequency of the RF signal input from a wireless communication circuit to the corresponding PEMS coupler, and the unit is GHz.

[0076] Referring to FIG. 6, the PEMS coupler may include a third signal line (630) placed on the first layer of a multilayer PCB and a fourth signal line (640) placed on the second layer of the PCB. In the third signal line (630), one end (631) may be connected to a wireless communication circuit (e.g., wireless communication circuit (220)) and the other end (632) may be connected to an antenna (e.g., antenna (210)). In the fourth signal line (640), one end (641) may be connected to a power detection circuit (e.g., power detection circuit (230)) and the other end (642) may be connected to ground (e.g., ground (260)). For example, the other end (642) may be connected to ground through a resistor (e.g., resistor (250)). The third signal line (630) and the fourth signal line (640) have a shape similar to that shown in FIG. 5a and can be aligned in a line while overlapping when viewing the plane in a direction perpendicular to the plane of the PCB.

[0077] Referring to FIG. 6 and FIG. 7a, reference numeral 711 indicates the relationship between frequency and power ratio when the distance between the third signal line (630) and the fourth signal line (640) (e.g., the thickness of the dielectric between the two signal lines (630, 640)) is a first distance value. Reference numeral 721 indicates the relationship between frequency and power ratio when the distance between the third signal line (630) and the fourth signal line (640) is a second distance value (> first distance value). Reference numeral 731 indicates the relationship between frequency and power ratio when the distance between the third signal line (630) and the fourth signal line (640) is a third distance value (> second distance value). FIG. 7a can be seen that the coupling coefficient decreases as the distance increases.

[0078] Referring to FIG. 7b, reference numeral 712 indicates the relationship between frequency and power ratio when the distance between the first signal line (510) and the second signal line (520) (e.g., the thickness of the second layer (532)) is a first distance value. Reference numeral 722 indicates the relationship between frequency and power ratio when the distance between the first signal line (510) and the second signal line (520) is a second distance value (> first distance value). Reference numeral 732 indicates the relationship between frequency and power ratio when the distance between the first signal line (510) and the second signal line (520) is a third distance value (> second distance value). FIG. 7b shows that the coupling coefficient decreases as the distance increases. Additionally, FIG. 7b shows that the coupling structure of FIG. 5a has a smaller deviation in the coupling coefficient compared to the coupling structure of FIG. 6. That is, it can be seen in Figures 7a and 7b that the bonding structure of Figure 5a is robust to thickness variations compared to the bonding structure of Figure 6.

[0079] According to one embodiment, a coupler for acquiring power of an RF (radio frequency) signal (e.g., PEMS coupler (240) or PEMS coupler (500)) may include a printed circuit board (PCB); a first signal line embedded in the PCB; and a second signal line embedded in the PCB. The first signal line may include a first port, a second port, a first element, and a second element. The second signal line may include a third port, a fourth port, a third element, and a fourth element. A first layer of the PCB may include the first port; the third port; a first element of the first signal line extending from the first port; and a third element of the second signal line extending from the third port. A second layer of the PCB may include the second port; and a second element of the first signal line extending from the second port and connected to the first element through a first via. A third layer of the PCB may include the fourth port; and may include a fourth element of the second signal line extending from the fourth port and connected to the third element through a second via. At least a portion of the first element, at least a portion of the second element, and at least a portion of the fourth element may be aligned in a line while overlapping when viewing the plane in a first direction perpendicular to the plane of the PCB. The third element may be located inside the first element without overlapping with the first element when viewing the plane in the first direction. At least a portion of the first element and at least a portion of the third element may be aligned in a line.

[0080] According to one embodiment, an electronic device (e.g., electronic device (200)) including the coupler is provided. The electronic device may include an antenna; a wireless communication circuit configured to receive an RF signal from the antenna through the first signal line and output an RF signal to the antenna; and a power detection circuit configured to detect the power of the RF signal output from the wireless communication circuit to the antenna through the second signal line.

[0081] The first element may be formed on the first layer in a clockwise or counterclockwise winding shape from the first port to the first via when the plane is viewed in the first direction. The third element may be formed on the first layer in a winding shape from the third port to the second via in the same direction as the winding shape of the first element when the plane is viewed in the first direction.

[0082] The ground may include a conductive pattern formed on at least one layer of the PCB.

[0083] The conductive pattern may be located outside the first signal line and the second signal line when the plane is viewed in the first direction.

[0084] The conductive pattern may have the form of a closed loop surrounding the first signal line and the second signal line.

[0085] The above PCB may have a rectangular shape. The first port and the third port may be located adjacent to the first side of the rectangle. The second port and the fourth port may be located adjacent to the second side, which is perpendicular to the first side.

[0086] The first port may be connected to the wireless communication circuit and the second port may be connected to the antenna. The third port may be connected to the power detection circuit and the fourth port may be connected to the ground.

[0087] In the above explanation, prefixes such as “first,” “second,” and “third” are intended merely to distinguish components of the same name and are not assigned any special meaning in themselves, such as importance or order.

[0088] In the present disclosure, the expression 'connection' means not only a direct connection between components, but also an electrical connection where other components (e.g., resistors, inductors, etc.) are present between components.

[0089] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0090] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0091] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. According to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0092] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0093] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0094] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, antenna; A PCB (printed circuit board) including a first signal line and a second signal line; A wireless communication circuit configured to receive an RF signal from the antenna through the first signal line and output an RF signal to the antenna; and The above wireless communication circuit includes a power detection circuit configured to detect the power of an RF signal output to the antenna through the second signal line, and The first signal line includes a first port, a second port, a first element, and a second element, and one of the first port and the second port is connected to the antenna and the other is connected to the wireless communication circuit, and The second signal line includes a third port, a fourth port, a third element, and a fourth element, and one of the third port and the fourth port is connected to the power detection circuit and the other is connected to the ground of the electronic device, and The first layer of the PCB comprises the first port; the third port; a first element of the first signal line extending from the first port; and a third element of the second signal line extending from the third port, and The second layer of the PCB comprises the second port; and a second element of the first signal line extending from the second port and connected to the first element through a first via, and The third layer of the PCB comprises the fourth port; and a fourth element of the second signal line extending from the fourth port and connected to the third element through a second via, At least a portion of the first element, at least a portion of the second element, and at least a portion of the fourth element are aligned in a line while overlapping when the plane is viewed in a first direction perpendicular to the plane of the PCB, and The third element is located inside the first element without overlapping with the first element when the plane is viewed in the first direction, and An electronic device in which at least a portion of the first element and at least a portion of the third element are aligned in a line.

2. In claim 1, the first element is formed in the first layer in a clockwise or counterclockwise winding shape from the first port to the first via when viewing the plane in the first direction, and The above third element is an electronic device formed on the first layer in a winding shape in the same direction as the winding direction of the first element from the third port to the second via when viewing the plane in the first direction.

3. An electronic device according to claim 1, wherein the ground includes a conductive pattern formed on at least one layer of the PCB.

4. In claim 3, the conductive pattern is an electronic device located outside the first signal line and the second signal line when the plane is viewed in the first direction.

5. An electronic device according to claim 4, wherein the conductive pattern has the form of a closed loop surrounding the first signal line and the second signal line.

6. In claim 1, the PCB has a rectangular shape, The first port and the third port are located adjacent to the first side of the rectangle, and An electronic device in which the second port and the fourth port are located adjacent to the second side that is perpendicular to the first side.

7. In Paragraph 1, The first port is connected to the wireless communication circuit and the second port is connected to the antenna, and An electronic device in which the third port is connected to the power detection circuit and the fourth port is connected to the ground.

8. In a coupler for acquiring power of an RF (radio frequency) signal, PCB (printed circuit board); A first signal line embedded in the above PCB; and It includes a second signal line embedded in the above PCB, and The above first signal line includes a first port, a second port, a first element and a second element, and The above second signal line includes a third port, a fourth port, a third element, and a fourth element, and The first layer of the PCB comprises the first port; the third port; a first element of the first signal line extending from the first port; and a third element of the second signal line extending from the third port, and The second layer of the PCB comprises the second port; and a second element of the first signal line extending from the second port and connected to the first element through a first via, and The third layer of the PCB comprises the fourth port; and a fourth element of the second signal line extending from the fourth port and connected to the third element through a second via, At least a portion of the first element, at least a portion of the second element, and at least a portion of the fourth element are aligned in a line while overlapping when the plane is viewed in a first direction perpendicular to the plane of the PCB, and The third element is located inside the first element without overlapping with the first element when the plane is viewed in the first direction, and A coupler in which at least a portion of the first element and at least a portion of the third element are aligned in a line.

9. In claim 8, the first element is formed in the first layer in a clockwise or counterclockwise winding shape from the first port to the first via when viewing the plane in the first direction, and The third element is a coupler formed on the first layer in a winding shape in the same direction as the winding direction of the first element from the third port to the second via when viewing the plane in the first direction.

10. The coupler according to claim 8, further comprising a conductive pattern formed on at least one layer of the PCB and connected to the third port or the fourth port.

11. In claim 10, the conductive pattern is a coupler located outside the first signal line and the second signal line when the plane is viewed in the first direction.

12. In claim 11, the conductive pattern is a coupler having the form of a closed loop surrounding the first signal line and the second signal line.

13. In claim 8, the PCB has a rectangular shape, The first port and the third port are located adjacent to the first side of the rectangle, and A coupler in which the second port and the fourth port are located adjacent to the second side that is perpendicular to the first side.

14. In Paragraph 8, The first port is connected to the wireless communication circuit and the second port is connected to the antenna, and A coupler in which the third port is connected to the power detection circuit and the fourth port is connected to the ground.

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