Temperature controller of device test handler

Abstract

The present invention relates to a temperature controller of a device test handler for testing whether a device that has been fully produced in a manufacturing process is a good product or a defective product, the temperature controller being capable of controlling the temperature of a device heated or cooled under test conditions to be constant even if the testing time of the device being tested by a test unit is delayed in heating or cooling, under the test conditions, the device loaded on a vacuum chuck, and then transferring the device to the test unit. To this end, in the present invention, each of covers (130) having a pocket (131) is provided on transfer paths of respective vacuum chucks (100) in which devices (32) to be tested are loaded to be aligned and move along rails (105), so that the devices (32) suctioned to the vacuum chucks (100) at standby positions are surrounded by the pockets (131) of the covers (130) and thus the temperature thereof is controlled.

Description

Temperature control device for device test handler

[0001] The present invention relates to a device test handler for testing whether a device produced in a manufacturing process is a good product or a defective product. More specifically, it relates to a temperature maintenance device for a device test handler that can maintain a constant temperature of a device heated or cooled to test conditions even if the test time of the device being tested in the test section is delayed during the process of transferring a device loaded on a vacuum chuck to a test section after heating or cooling the device to test conditions.

[0002] Generally, in the manufacturing process, devices produced are tested for performance before shipment to determine whether they are good or defective; good devices are shipped, while defective ones are disposed of.

[0003] When performing a performance test of a device as described above, a high temperature or low temperature test is performed depending on the usage environment of the device. At this time, multiple devices are loaded onto a vacuum chuck and aligned, and then the vacuum chuck is heated or cooled to test conditions to perform a performance test of the device in the test section.

[0004] The recent trend in the electronics industry is to manufacture devices at low prices that are lightweight, miniaturized, high-speed, multifunctional, and high-performance. In addition, to improve the performance of integrated circuits, they are being developed into three-dimensional structures such as multi-chip stacked packages.

[0005] Among these multi-chip stacked packages, HBM is a high-performance (RAM) interface for three-dimensional stacked dynamic RAM (DRAM).

[0006] The above HBM is formed by stacking multiple chips sequentially on a wafer, then molding them as a single unit, separating them into individual pieces through a sawing process, and then conducting tests to ship only the products selected as good quality.

[0007] FIG. 1 is a plan view showing a conventional device test handler, comprising a main body (20), a loading section (51) and an unloading section (52) provided on the main body where a FOUP (Front Open Unified Pod) (40) containing a wafer ring frame (30) is located, a wafer ring frame handling member (42) located on one side of the loading section and the unloading section to withdraw or store a wafer ring frame (30) from each FOUP (40), a device loading position (61) and an unloading position (62) located between the loading section, the unloading section and the handling member, a plurality of loading pickers (81) and unloading pickers (82) installed to be reciprocally movable on a gantry (70) installed above the device loading position and the unloading position to handle a device (32), and a loading picker (81) provided on the loading picker (81) such that the loading picker [handles] the wafer ring frame (30) A vision camera (83) for confirming the position of a device (32) attached to a film (31) and causing a plurality of pickers to sequentially hold the device one by one; a first lower camera (84) installed on one side of the device unloading position to confirm and correct the position of the device (32) held by the unloading picker (82); a loading buffer (91) and an unloading buffer (92) that move back and forth along a rail (93) installed on one side of the device loading position and unloading position; a transfer picker (101) that positions the device placed on the loading buffer onto the upper part of the vacuum chuck (100) or unloads the device that has completed testing to the unloading buffer (92); a device alignment unit (110) equipped on the transfer picker that aligns the device by confirming the position of the device as the device (32) is loaded onto the vacuum chuck (100) and notifying the control unit of the coordinate value; and on the vacuum chuck It is configured to include a test unit (120) for testing the suctioned device.

[0008] Accordingly, before loading the device (32) onto the upper surface of the vacuum chuck (100), the vacuum chuck (100) is maintained at room temperature, heated to about 50 to 170°C, or cooled to about 0 to -55°C depending on the test conditions of the device.

[0009] In this state, a loading picker (81) installed on the gantry (70) sequentially picks up devices (32) from a wafer ring frame (30) located at the device loading position (61), then moves along the gantry (70) and sequentially places the devices on the upper part of the loading buffer (91).

[0010] When a plurality of devices (32) are placed on the upper part of the loading buffer (91) and the loading buffer (91) moves along the rail (93) to the point where the vacuum chuck (100) is installed, the transfer picker (101) holds the device (32) to be tested and places it in the vacuum hole of the vacuum chuck (100).

[0011] In this way, when the transfer picker (101) places the device (32) to be tested into the vacuum hole of the vacuum chuck (100), the device is finely moved and vacuum-adsorbed to align it by means of a vacuum device (not shown) installed to be connected to the vacuum hole. Since this operation is described in detail in Patent No. 2270760 previously registered by the applicant, a detailed explanation will be omitted.

[0012] After aligning the device (32) loaded on the vacuum chuck (100) with the operation described above, the vacuum chuck (100) with multiple devices attached moves along the rail (105) to the test section (120), so that the device is tested for a set time in the test section (120).

[0013]

[0014] (Prior Art Literature)

[0015] (Patent Document 0001) Republic of Korea Registered Patent Publication 10-0873670 (Published Dec. 12, 2008)

[0016] (Patent Document 0002) Republic of Korea Registered Patent Publication 10-1697119 (Published Jan. 18, 2017)

[0017] (Patent Document 0003) Republic of Korea Registered Patent Publication 10-2142687 (Published Aug. 07, 2020)

[0018] (Patent Document 0004) Republic of Korea Registered Patent Publication 10-2270760 (Published June 30, 2021)

[0019]

[0020] However, in these conventional device test handlers, if the time taken to test a device loaded on one vacuum chuck in the test section is longer than the time required to complete loading while aligning the device to the vacuum chuck located on the opposite side, the temperature of the vacuum chuck loaded to align the device changes, making it impossible to maintain consistent test results and consequently causing a fatal defect that reduces the test reliability of the device.

[0021] Furthermore, when conducting low-temperature tests on the device, frost forms on the cooled device, which further reduces the reliability of the device's test.

[0022] The present invention has been devised to solve such conventional problems, and its purpose is to improve the structure of the handler so that the temperature of the device heated or cooled to test conditions can be maintained at a constant level even if the test time of the device being tested in the test section is delayed during the process of transferring the device loaded on the vacuum chuck to the test section after heating or cooling it to test conditions.

[0023] Another objective of the present invention is to prevent the phenomenon in which a device aligned with the vacuum chuck is contaminated by particles during the transfer of the vacuum chuck.

[0024] According to an embodiment of the present invention for achieving the above objective, a temperature maintenance device for a device test handler is provided, characterized by installing a cover having a pocket on the transfer path of each vacuum chuck, on which a device to be tested is loaded in alignment and moves along a rail, so that the temperature of the device adsorbed to the vacuum chuck in the standby position is maintained by being enclosed by the pocket of the cover.

[0025]

[0026] The present invention is provided with a cover having a pocket installed at the standby position of each vacuum chuck, so that even if the test time of a device adsorbed to one vacuum chuck in the test section is delayed, the temperature of the device loaded on the vacuum chuck located on the other side is maintained by the pocket formed in the cover, thereby preventing not only the phenomenon of the device's temperature changing but also the phenomenon of frost forming on the device during low-temperature testing, thus maintaining the test reliability of the device.

[0027] FIG. 1 is a plan view showing a conventional device test handler.

[0028] FIG. 2 is a plan view of a test handler to which an embodiment of the present invention is applied.

[0029] FIG. 3 is a perspective view showing the essential parts of the present invention.

[0030] FIG. 4 is a bottom perspective view showing the essential parts of the present invention.

[0031] FIGS. 5A and 5B are perspective views showing the operating state of the present invention.

[0032] FIGS. 6a and 6b are cross-sectional views illustrating other embodiments of the present invention.

[0033]

[0034] Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. It should be noted that the drawings are schematic and not drawn to scale. The relative dimensions and proportions of parts in the drawings are exaggerated or reduced in size for clarity and convenience in the drawings, and any dimensions are merely illustrative and not limiting. Also, the same reference numerals are used to denote similar features for identical structures, elements, or parts appearing in two or more drawings.

[0035] FIG. 2 is a plan view of a test handler to which an embodiment of the present invention is applied, FIG. 3 is a perspective view showing the main part of the present invention, and FIG. 4 is a bottom perspective view showing the main part of the present invention. In the configuration of the present invention, parts that are identical to the configuration of a conventional test handler are omitted from description and are given the same reference numerals.

[0036] In the present invention, a cover (130) having a pocket (131) is installed on the transport path of each vacuum chuck (100) that moves along a rail (105) while the device (32) to be tested is loaded and aligned.

[0037] Although such a cover (130) may be fixedly installed on the main body (20) by a separate mechanism, in one embodiment of the present invention, it is fixedly installed on a fixing mechanism (150) to which the upper vision camera (103) is fixed.

[0038] In one embodiment of the present invention, as shown in FIGS. 3 and 4, a cover (130) having the pocket (131) is fixedly installed in a standby position, and a vacuum chuck (100) moving along a rail (105) is installed to be able to move up and down as shown in FIGS. 5a and 5b, so that when the vacuum chuck (100) is in standby, the temperature of the device (32) is maintained by being wrapped by the pocket (131) of the cover (130) as the vacuum chuck (100) rises.

[0039] However, as shown in FIG. 6a and FIG. 6b, which are other embodiments, the cover (130) having the pocket (131) may be installed to be raised and lowered by a driving source (140) such as a cylinder in a standby position, and the vacuum chuck (100) may be installed to be movable along a rail (105), so that when the vacuum chuck (100) is in standby, the temperature of the device (32) may be maintained by being wrapped in the pocket (131) of the cover (130) by lowering the cover (130).

[0040] In each embodiment of the present invention, brackets (132) are fixed to both sides of the cover (130) so as to fix the cover (130) to the fixed structure (150) in a standby position.

[0041] The operation of the present invention is described as follows.

[0042] First, while maintaining the vacuum chuck (100) on which the device (32) is loaded under test conditions, the transfer picker (101) sequentially holds the device (32) to be tested and places it on the vacuum hole of the vacuum chuck (100), and then the device is finely moved by vacuum suction by a vacuum device (not shown) installed to be connected to the vacuum hole and aligned.

[0043] After aligning the device (32) loaded on the vacuum chuck (100) with the operation described above, the vacuum chuck (100) with multiple devices inserted moves along the rail (105) to the test section (120) and, while conducting a test for a set time, the devices to be tested are loaded sequentially onto the upper surface of the vacuum chuck (100) on the other side.

[0044] Therefore, after the test of the device loaded on the vacuum chuck (100) for a set time in the test section (120) is completed and the vacuum chuck (100) is moved back to the device alignment section (110) for unloading, the vacuum chuck (100) loaded with the device to be tested on the other side moves along the rail (105) toward the test section (120).

[0045] However, when the device to be tested is loaded in alignment on the vacuum chuck (100) on one side and the test of the device from the vacuum chuck in the test section (120) is not completed, the device of the present invention must ensure that the temperature of the device loaded on the vacuum chuck (100) does not change.

[0046] To this end, when the vacuum chuck (100) loaded with the device moves along the rail (105) to a standby position and stops as shown in FIG. 5a of an embodiment, the vacuum chuck (100) rises as shown in FIG. 5b and surrounds the device (32) that is adsorbed and aligned with the vacuum chuck (100) by the pocket (131) of the cover (130), thereby allowing the temperature of the device (32) adsorbed to the vacuum chuck (100) to be maintained at a test temperature.

[0047] Meanwhile, in FIG. 6a, which is illustrated as another embodiment, the vacuum chuck (100) loaded with the device moves along the rail (105) to a standby position and stops as in FIG. 6a, which is shown as an embodiment, and then the cover (130) is lowered by the driving source (140) as in FIG. 6b, so that the device adsorbed to the vacuum chuck (100) is aligned by the pocket (131) of the cover (130) is covered, thereby allowing the temperature of the device (32) adsorbed to the vacuum chuck (100) to be maintained at a test temperature.

[0048] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing the technical concept or essential features.

[0049] Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting, and the scope of the invention as described in the above detailed description is defined by the claims set forth below, and all modifications or variations derived from the meaning and scope of the claims and equivalent concepts thereof should be interpreted as being included within the scope of the invention.

[0050]

[0051] [Explanation of the symbol]

[0052] 20 : Main body 32 : Device

[0053] 100: Vacuum chuck 105: Rail

[0054] 130 : Cover 131 : Pocket

[0055] 132 : Bracket 140 : Driving element

[0056] 150 : Fixed structure

Claims

1. A temperature maintenance device for a device test handler, characterized in that a cover (130) having a pocket (131) is installed on the transfer path of each vacuum chuck (100) that moves along a rail (105) while the device (32) to be tested is loaded in alignment, so that the temperature of the device (32) adsorbed to the vacuum chuck (100) in the standby position is maintained by being wrapped by the pocket (131) of the cover (130).

2. In Claim 1, A temperature maintenance device for a device test handler, characterized in that a cover (130) having the above pocket (131) is fixedly installed in a standby position, and a vacuum chuck (100) that moves along a rail (105) is installed to be able to move up and down, so that when the vacuum chuck (100) is in standby, the temperature of the device (32) is maintained by the pocket (131) of the cover (130) as the vacuum chuck (100) rises.

3. In Claim 1, A temperature maintenance device for a device test handler, characterized in that a cover (130) having the above pocket (131) is installed in a standby position so as to be raised and lowered by a driving source (140), and a vacuum chuck (100) is installed so as to be movable along a rail (105), so that when the vacuum chuck (100) is in standby, the temperature of the device (32) is maintained by the pocket (131) of the cover (130) when the cover (130) is lowered.

4. In claim 2 or claim 3, A temperature maintenance device for a device test handler, characterized by fixing brackets (132) to both sides of the cover (130) and fixing the brackets (132) to the fixing mechanism (150) of the main body (20).

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