High pressure substrate processing apparatus, and substrate processing method using same

Abstract

The present invention comprises: a chamber for providing a processing space of a substrate; a pressurizing unit for maintaining an internal pressure of the chamber at the set pressure or higher by providing pressurized air to the chamber; a processing liquid supply unit for supplying a processing liquid from one surface to the other surface of the substrate accommodated and rotated in the chamber; a foreign substance discharge unit for providing an airflow of the pressurized air from one surface to the other surface of the substrate so as to discharge moisture and foreign substances included in the pressurized air together with the processing liquid; a first discharge line provided in a discharge port so as to adjust the flow rate of the pressurized air discharged from the chamber; and a second discharge line which is arranged to be spaced apart from the first discharge line, wherein, when discharged along the first discharge line, moisture and foreign substances separated from the pressurized air are discharged to the outside of the chamber together with the processing liquid through the second discharge line.

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