Signal transmission line apparatus and method

Using high dielectric constant materials like Zirconia in electrical connectors addresses heat and field distribution issues, enhancing thermal management and electrical performance while enabling system scaling.

WO2026136845A1PCT designated stage Publication Date: 2026-06-25SAMTEC INC

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
SAMTEC INC
Filing Date
2025-12-19
Publication Date
2026-06-25

AI Technical Summary

Technical Problem

Existing electrical connectors using low dielectric constant materials generate undesirable heat transfer and enlarged electrical field distribution, leading to increased thermal conductivity and reduced electrical performance.

Method used

Employing a high dielectric constant material, such as Zirconia or its alloys, to confine the electrical field and reduce the waveguide mode cross section, thereby minimizing heat transfer and maintaining electrical performance.

Benefits of technology

The use of high dielectric constant materials effectively reduces thermal conductivity and maintains electrical performance, allowing for increased system scaling and improved field confinement.

✦ Generated by Eureka AI based on patent content.

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Abstract

An electrical connector as described and claimed herein. The electrical connector may be a signal transmission line. The electrical connector may use a high dielectric constant material.
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Description

Atty. Docket No.: S AMTE-0027-WO-01SIGNAL TRANSMISSION LINE APPARATUS AND METHODBYANDREW D. JOSEPHSON TROY B. HOLLANDATTORNEY REFERENCE: SAMTE-0027-WO-01TECHNICAL FIELD[OOOlJThe present embodiments relate generally to an electrical connector, with particular embodiments shown for a signal transmission line having a high dielectric constant material.BACKGROUND

[0002] Typical connectors (e.g. electrical, RF) may use a dielectric material having a low dielectric constant (e.g. less than 9, PTFE). As a result, the connectors may generate undesirable heat transfer and / or have increased electrical field distribution associated with a corresponding enlarged cross section. Thus, there is a need for a connector configuration to use material having a high dielectric constant to, but is not limited to, reduce the cross section, isolate the electrical field distribution, reduce the amount of metal used, and / or reduce thermal conductivity.

[0003] In some implementations, the high dielectric constant material, means, and / or connector configuration may pull the electrical field into the dielectric material confining the modal distribution spatially. The ground plane return and / or shield path of the waveguide may be reduced in size and become more finite in extent without sacrificing electrical RF performance. Reduction of the high thermal conductivity conductors in the waveguide may reduce conductionAtty. Docket No.: S AMTE-0027-WO-01 heat transfer and allow for increased system scaling (e.g. beyond superconducting coaxial cables). Further, the reduced cross sectional insulator material may allow for less heat transfer (e.g. phono) through the insulator or high dielectric constant material.

[0004] The present invention is directed at overcoming, or at least improving upon, the disadvantages of the prior art.BRIEF DESCRIPTION OF THE ILLUSTRATIONS

[0005] In the drawings, like reference characters generally refer to the same parts throughout the different views. Also, the drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention.

[0006] Figure 1 is a sectional view of one embodiment of an electrical connector illustrating one embodiment of a cable.

[0007] Figure 2A is a sectional view of another embodiment of a cable.

[0008] Figure 2B is a sectional view of the field distribution of Fig. 2A.

[0009] Figure 3 is a sectional view of another embodiment of a cable.

[0010] Figure 4 is a sectional view of another embodiment of a cable, illustrating another position of a signal conductor in broken lines.

[0011] Figure 5 is a sectional view of one embodiment of an electrical connector illustrating one embodiment of a microstrip.

[0012] Figure 6 is a sectional view of another embodiment of a microstrip.

[0013] Figure 7 is a sectional view of another embodiment of a microstrip.

[0014] Figure 8 is a sectional view of another embodiment of a microstrip.

[0015] Figure 9 is a sectional view of another embodiment of a microstrip.Atty. Docket No.: S AMTE-0027-WO-01

[0016] Figure 10 is a sectional view of one embodiment of an electrical connector illustrating one embodiment of a stripline.

[0017] Figure 11 is a sectional view of another embodiment of a stripline; and

[0018] Figure 12 is a top view and / or bottom view of another embodiment of a stripline.DETAILED DESCRIPTION

[0019] Embodiments may further be understood with reference to the various Figures. With reference to the Figures, an embodiment provides for one or more electrical connectors 20. The electrical connector 20 may include a signal transmission line or radio frequency (RF) interconnect 30 such as, but is not limited to, a cable 30a (e.g. flexible), circuit / microstrip 30b (e.g. flexible), and / or stripline 30c (e.g. flexible). Embodiments of the cable 30a are shown in Figs. 1-4. Embodiments of the circuit / microstrip 30b are shown in Figs. 5-9. Embodiments of the stripline 30c are shown in Figs. 10-12. The electromagnetic means, signal transmission line 30, and / or connector 20, or portions thereof, includes or is made of a dielectric constant material or structure 40 having a high dielectric constant. The electromagnetic means may be the high dielectric constant material 40 positioning the conductor(s) 50, 60 and / or connector 20, or portions thereof, for the transmission of the signal (e.g. RF) and / or reducing the waveguide mode cross section of the signal transmission line 30 (e.g. electric field, magnetic field, both). The dielectric constant (e.g. high) of the material 40 may be at least 10 or greater than 10. The high dielectric constant material 40 may be a material (e.g. Zirconia, pure) or may be alloyed with one or more additional materials (e.g. yttria, ceria, etc.). The dielectric constant material 40 may be, but is not limited to, a ceramic (e.g. Zirconia, Zirconia alloy, alloy, ceramic alloy, inorganic, yttria-stabilized zirconia) in some embodiments. The dielectric constant material 40 may be extruded in some applications (e.g. cable 30a, microstrip 30b, stripline 30c). TheAtty. Docket No.: S AMTE-0027-WO-01 connector 20 or signal transmission line 30 may be used in, but is not limited to, a cryogenic environment (e.g. temperatures between 4 and 20 Kelvin) or non-cryogenic environment (e.g. high temperature application).

[0020] In some embodiments, the dielectric constant material 40 and / or connector 20, or portions thereof, may have a high dielectric constant within one or more ranges. The dielectric constant material may be in a range of about 10-30, about 15-30, about 20-30, about 25-30, about 28-30, about 26-29, about 27-28, or about 27-29 (e.g. + / - 1, + / - 2, + / -3, etc.). The dielectric constant material 40 may be at least 10 or greater than 10, 1.2 times larger than 10, 1.5 times larger than 10, 1.7 times larger than 10, 2 times larger than 10, 2.2 times larger than 10, 2.5 times larger than 10, 2.8 times larger than 10, or 3 times larger than 10. For example, in embodiments where the dielectric constant material is Zirconia the dielectric constant may be greater than or equal to about 28 (e.g. + / - 1, + / - 2, etc.).

[0021] In some implementations, the signal transmission line 30 and / or connector 20 may include at least one signal conductor 50 and one or more ground conductors 60 positioned in one or more configurations. The signal conductor 50 may be positioned relative to the one or more ground conductors 60 by one or more dielectric constant materials 40. The dielectric constant material 40 (e.g. trace 32, if used) may be described as disposed between or interconnecting (e.g. substrate, if used) the signal conductor(s) 50 and the one or more ground conductors 60. The signal conductor 50 may be metal / conductive material or alloy (e.g. super conductive, simple). For example, the signal conductor material may be, but is not limited to, NbTi, MgB2, Sn, etc. The ground conductor 60 may be metal / conductive material or alloy (e.g. simple). For example, the ground conductor material may be, but is not limited to, aluminum, NbTi, or copper, etc. In some embodiments, the NbTi on YSZ (yttria-stabilized zirconia) ceramic combination may beAtty. Docket No.: S AMTE-0027-WO-01 used for superconducting quantum, high temperature applications, and / or electrode interconnect in fuel cell applications. In various embodiments, the MgB2 may be used in combination with a ceramic substrate with the high dielectric constant (e.g. thin, flexible, Zirconia, inorganic). The MgB2 may lower the thermal conductivity by making it highly polycrystalline in some embodiments (e.g. increase phonon scattering). As shown in the one embodiment in Figs. 9, 11, and 12, the one or more ground conductors 60 may be a plurality of ground conductors 60 (e.g. in a single plane, cable, microstrip, stripline). In some embodiments as shown in Figs. 1-8 and 10, the one or more ground conductors 60 may be a single ground conductor (e.g. in a single plane, multiple planes). The signal conductor 50 may be in a variety of positions and / or orientations relative to the ground conductor(s) 60. As shown in Figs. 1-3, 5, 6, 9, 10, and 11 the signal conductor(s) 50 may be substantial parallel to the one or more ground conductors, or portions thereof (e.g. cable, microstrip). As shown in Figs. 1, 4, 7, and 8, the signal conductor(s) 50 may be substantially perpendicular to the one or more ground conductors, or portions thereof (e.g. cable, microstrip). As shown in Fig. 1, the signal conductor(s) 50 may be both perpendicular and parallel to one or more portions of the ground conductor 60.

[0022] In some implementations, the one or more signal conductors 50 and / or one or more ground conductors 60 may be positioned or orientated relative to the one or more dielectric constant material 40. The one or more signal conductors 50 and / or one or more ground conductors 60 may be positioned or adjacent one or more exterior surfaces 40a (e.g. top wall, side wall, bottom wall, channel) of the dielectric constant material 40. The signal conductor(s) 50 may be positioned on the top wall 41 in some embodiments as shown in Figs. 1, 3, 5, 6, and 9. The signal conductor(s) 50 may be positioned on the side wall 42 and / or 43 in some embodiments as shown in Fig. 4, 7, and 8. In some embodiments as shown in Figs. 10 and 11, the signalAtty. Docket No.: S AMTE-0027-WO-01 conductor(s) 50 may be surround by or contained within the dielectric constant material 40. Adjacent dielectric constant materials 40 (e.g. trace, first, second, etc.), or portions thereof, may position signal conductors 50 on opposing side walls 42 and 43 facing away from each other as shown in Fig. 7. In some embodiments as shown in Figs. 5, 6, and 9, adjacent dielectric constant materials 40 (e.g. trace, first, second), or portions thereof, may position signal conductors 50 on adjacent top walls 41. In some embodiments as shown in Fig. 8, adjacent dielectric constant materials 40 (e.g. trace, first, second), or portions thereof, may position signal conductors 50 on the same side wall 42 or 43 facing in the same direction. The ground conductor(s) 60 may be positioned on or adjacent the bottom wall 44 in some embodiments as shown in Figs. 1-9, 10, and 11. The ground conductor(s) 60 may be positioned on or adjacent the top wall 41 in some embodiments as shown in Figs. 10 and 11. The ground conductor(s) may be directly positioned against the dielectric constant material 40 or bottom wall 44, or portion thereof, as shown in Figs. 1-4, 10, and 11. In some embodiments as shown in Figs. 5-9, the ground conductor(s) 60 may be adjacent and spaced from the dielectric constant material 40 or bottom wall 44, or portion thereof, by one or more substrate layers 31. The ground conductor(s) 60 may be positioned on or adjacent one or more side walls 42, 43 as shown in Fig. 1. Although the ground conductor may be positioned on both side walls 42 and 43 as shown in Fig. 1, the ground conductor 60 may be positioned on a single side wall 42 or 43, or portion thereof, in various embodiments.

[0023] In some implementations, the dielectric constant material 40 (e.g. trace 32, cable 30a, microstrip 30b, strip line 30c) may include one or more channels 45. The one or more channels 45 may be positioned in one or more exterior surfaces 40a of the dielectric constant material 40 (e.g. trace 32). Although the channel 45 is shown in Figs. 2A-2B and 11 as positioned in a top wall 41 ofAtty. Docket No.: S AMTE-0027-WO-01 the dielectric constant material 40, it should be understood that the channel(s) 45 may be positioned in other sides (e.g. side wall(s) 42, 43, 41 and 42, 41 and 43, bottom wall 44, one wall of the exterior, two or more walls of the exterior, etc.). For example as shown in Fig. 11, the bottom wall 44 may include one or more channels 45. The channel 45 may include a bottom wall 45 a and one or more side walls 45b, 45 c interconnected to the bottom wall 45 a. The signal conductor(s) 50 may be positioned in or engage one or more walls of the channel(s) 45. The one or more walls 45a, 45b, and / or 45c may position the one or more signal conductors 50. As shown in Figs. 2A-2B, the signal conductor 50 may be positioned on the bottom wall 45a of the channel 45. In some embodiments, the signal conductor may be positioned on a side wall 45b and / or 45 c of the channel 45. The one or more walls or sides of the channel that project away from, receive, extend from the signal conductor 50 (e.g. on one or more lateral sides) may assist in isolating the field(s), reduce the cross section, and / or reduce the thermal conductivity.Although the cross-section of the channel is rectangular in shape, the channel cross-section may be a variety of shapes and still be within the scope of the invention. For example, the channel may be arcuate in cross-section. Although not shown, the trace(s) 32, or portions thereof, may include one or more channels. As shown in Figs. 10 and 11, the channel(s) 45, if used, do not have to contain the signal conductor and / or ground conductor.

[0024] In some implementations, the electrical connector 20, signal transmission line 30, and / or microstrip 30b may include one or more substrate layers 31 and / or one or more traces 32. The one or more traces 32 may be or include the dielectric constant material 40. The traces 32 may be similar in configuration or different in configuration. For example, as shown in Fig. 6, the first traces 32a are the same as each other and the same as the second trace 32b. For example, as shown in Fig. 7, the first trace 32a is a different configuration than the second trace 32b. TheAtty. Docket No.: S AMTE-0027-WO-01 dielectric constant material 40 and / or trace 32 may be positioned adjacent one or more substrate layers 31, or portions thereof. The signal conductor(s) 50 may be positioned adjacent to or on the trace 32, or portions thereof, and / or dielectric constant material 40. The one or more ground conductors 60 may be positioned adjacent the one or more substrate layers 31 (e.g. first, second, both). The trace 32 and / or substrate layer(s) 31, or portions thereof, may be positioned between the signal conductor 50 and the ground conductor 60. As shown in Figs. 5 and 7-9, the one or more substrate layers 31 and trace(s) 32 / dielectric constant material 40 / signal conductor 50 may be positioned on a single side or surface 61 (e.g. top, first) of the one or more ground conductors 60 (e.g. plane, single, plurality). In some embodiments as shown in Fig. 6, the one or more substrate layers 31 and trace(s) 32 / dielectric constant material 40 / signal conductor(s) 50 may be positioned on opposing sides or surfaces 61 (e.g. top, first) and 62 (e.g. bottom, second, opposing surface), respectively, of the one or more ground conductors 60 (e.g. plane, single, plurality). For example as shown in Fig. 6, a first trace(s) 32a (e.g. with signal conductor, with dielectric constant material) and first substrate layer(s) 31a may be positioned on the first side 61 of the ground conductor(s) 60 and a second trace(s) 32b (e.g. with signal conductor, with dielectric constant material) and second substrate layer(s) 31b may be positioned on the second side 62 of the ground conductor(s) 60. The substrate or PCB 31 may be made of a material such as, but is not limited to, polyimide.

[0025] In some implementations as shown in Fig. 1, the electrical connector 20, signal transmission line 30, cable 30a, and / or dielectric constant material 40 may position the signal conductor 50 on the top wall 41 , or portions thereof, of the dielectric constant material 40. The ground conductor(s) 60 extends along both the side walls 42 and 43 and the bottom wall 44 of the dielectric constant material 40, or portions thereof.Atty. Docket No.: S AMTE-0027-WO-01

[0026] In some implementations as shown in Figs. 2A and 2B, the electrical connector 20, signal transmission line 30, cable 30a, and / or dielectric constant material 40 may position the signal conductor 50 on one or more walls of the channel 45 (e.g. side wall 45b, side wall 45 c, bottom wall 45a), more specifically the bottom wall 45a of the dielectric constant material 40. The ground conductor 60 extends along at least the bottom wall 44 of the dielectric constant material 40, or portions thereof. Fig. 2B illustrates the electronic field (e.g. EMI) of the embodiment of Fig. 2A.

[0027] In some implementations as shown in Fig. 3, the electrical connector 20, signal transmission line 30, cable 30a, and / or dielectric constant material 40 may position the signal conductor 50 on the top wall 41 , or portions thereof, of the dielectric constant material 40. The ground conductor 60 is positioned along at least the bottom wall 44, or portions thereof, of the dielectric constant material 40.

[0028] In some implementations as shown in Fig. 4, the electrical connector 20, signal transmission line 30, cable 30a, and / or dielectric constant material 40 may position the signal conductor 50 on the side wall 42, or portions thereof, of the dielectric constant material 40. The ground conductor 60 is positioned along at least the bottom wall 44, or portions thereof, of the dielectric constant material 40. In some embodiments as shown in broken lines in Fig. 4, the signal conductor 50 may be positioned on the side wall 43.

[0029] In some implementations as shown in Fig. 5, the electrical connector 20, signal transmission line 30, microstrip 30b, and / or dielectric constant material(s) 40 may position the signal conductor 50 on the top wall 41, or portions thereof, of the dielectric constant material 40 / trace(s) 32. The trace(s) 32 (e.g. first 32a, second 32b) and the substrate layer(s) 31 (e.g. first 31a) is positioned on the top / first side 61 of the ground conductor(s) 60 (e.g. single, plane), or portions thereof. AAtty. Docket No.: S AMTE-0027-WO-01 single ground conductor 60 may be positioned along the substrate layer 31 in a plane (e.g. single, horizontal).

[0030] In some implementations as shown in Fig. 6, the electrical connector 20, signal transmission line 30, microstrip 30b, and / or dielectric constant material(s) 40 may position the signal conductor 50 on the top wall 41, or portions thereof, of the dielectric constant material 40 / trace(s) 32. The trace(s) 32 (e.g. first 32a) and the substrate layer(s) 31 (e.g. first 3 la) is positioned on the top / first side 61 of the ground conductor(s) 60 (e.g. single, plurality, plane), or portions thereof. The trace(s) 32 (e.g. second 32b) and the substrate layer(s) 31 (e.g. second 31b) are positioned on the bottom / second side 62 of the ground conductor(s) 60 (e.g. single, plurality, plane), or portions thereof. Adjacent dielectric constant material 40 (e.g. traces), or portions thereof, may position signal conductors on the top wall 41.

[0031] In some implementations as shown in Fig. 7, the electrical connector 20, signal transmission line 30, microstrip 30b, and / or dielectric constant material(s) 40 may position the signal conductor 50 on at least one side wall 42, 43, or portions thereof, of the dielectric constant material 40 / trace(s) 32. The first trace 32a may include the signal conductor 50 on the side wall 42 and the second trace 32b may include the signal conductor 50 on the side wall 43. The trace(s) 32 (e.g. first 32a, second 32b) and the substrate layer(s) 31 (e.g. first 31a) is positioned on the top / first side 61 of the ground conductor(s) 60 (e.g. single, plurality, plane), or portions thereof. The second side 62 may be free from another substrate layer(s) and / or trace(s). Adjacent dielectric constant material 40 (e.g. first trace 32a, second trace 32b), or portions thereof, may position signal conductors on opposing side walls 42 and 43, respectively, facing away from each other. Although not shown, the signal conductors 50 may face each other from opposing interior facing walls 42 and 43, facing towards each other, of adjacent traces 32.Atty. Docket No.: S AMTE-0027-WO-01

[0032] In some implementations as shown in Fig. 8, the electrical connector 20, signal transmission line 30, microstrip 30b, and / or dielectric constant material(s) 40 may position the signal conductor 50 on the side wall 43, or portions thereof, of the dielectric constant material 40 / trace(s) 32.Both the first trace 32a and the second trace 32b include the signal conductor on the same side wall 43 (e.g. facing in the same direction). The trace(s) 32 (e.g. first 32a, second 32b, both) and the substrate layer(s) 31 (e.g. first 31a) is positioned on the top / first side 61 of the ground conductor(s) 60 (e.g. single, plurality, plane), or portions thereof. Adjacent dielectric constant material 40 (e.g. first trace 32a, second trace 32b), or portions thereof, may position signal conductors on same side wall 43 facing in the same direction. In some embodiments, the signal conductors may be on the same side wall 42 of the traces 32a and 32b or dielectric constant material 40 facing the other / another direction. A single ground conductor 60 is shown along the substrate layer 31 in a plane (e.g. single, horizontal), however a plurality of ground conductors 60 may be positioned along the substrate layer 31 in a plane (e.g. single, horizontal) and / or adjacent the trace, respectively, in some embodiments.

[0033] In some implementations as shown in Fig. 9, the electrical connector 20, signal transmission line 30, microstrip 30b, and / or dielectric constant material(s) 40 may position the signal conductor 50 on the top wall 41, or portions thereof, of the dielectric constant material 40 / trace(s) 32 (e.g. first 32a, second 32b). The trace(s) 32(e.g. first 32a, second 32b, both) and the substrate layer(s) 31 (e.g. first 3 la) is positioned on the top / first side 61 of the ground conductor(s) 60 (e.g. plurality, plane), or portions thereof. A plurality of ground conductors 60 may be positioned along the substrate layer 31 in a plane (e.g. single, horizontal) and / or adjacent the trace, respectively.Atty. Docket No.: S AMTE-0027-WO-01

[0034] In some implementations, the pitch between traces 32 (e.g. adjacent) and / or dielectric constant material 40 may be reduced. The trace(s) 32 (e.g. adjacent) and / or dielectric constant material40 may minimize the cross talk therebetween. The adjacent traces 32 (e.g. adjacent) and / or dielectric constant material 40 may be positioned at a pitch of at least 0.4 mm to 0.6 mm, 0.4 mm, 0.6 mm in some embodiments.

[0035] In some implementations as shown in Fig. 10, the electrical connector 20, signal transmission line 30, stripline 30c, and / or dielectric constant material(s) 40 may position the signal conductor 50 within the dielectric constant material 40 between two ground conductors 60. The stripline 30c may include the high dielectric constant material 40 to position one or more signal conductors 50 between two opposing ground conductors 60. Although a single ground conductor 60 is shown in Fig. 10 on the respective exterior surface of the high dielectric constant material 40, a plurality of ground conductors may be used in the top and / or bottom plane of the stripline.

[0036] In some implementations as shown in Fig. 11, the electrical connector 20, signal transmission line 30, stripline 30c, and / or dielectric constant material(s) 40 may position the signal conductor 50 within the dielectric constant material 40 between two ground conductors 60. The stripline 30c may include the high dielectric constant material 40 to position one or more signal conductors 50 between two opposing ground conductors 60. A plurality of ground conductors 60 may be positioned against the top wall 41 and the bottom wall 44, respectively. The top wall41 and / or bottom wall 44 may include one or more channels 45. As shown in Fig. 11, both the top wall 41 and bottom wall 44 include a plurality of channels 45 positioned in the exterior surfaces 40a. The channels 45 may be positioned between adjacent ground conductors 60. TheAtty. Docket No.: S AMTE-0027-WO-01 channel(s) 45 may increase flexibility of the signal transmission line 30 (e.g. 30a, 30b, 30c). With increased flexibility, installation and / or assembly may be improved.

[0037] In some implementations, the signal transmission line 30 (e.g. 30a, 30b, 30c), or portions thereof, may vary in width along its length. As shown in the one embodiment in Fig. 12, the stripline 30c has a width that varies from wide to narrow to wide. It should be understood that other patterns of varying width may be used. For example, narrow to wide along the length, wide to narrow along the length, wide to narrow to wide to narrow along the length, etc. Although it is shown in the one embodiment in Fig. 12 that a stripline 30c is used continuously across the entire length of the signal transmission line 30, it should be understood that the signal transmission line 30 may include a variety of configurations and patterns of the cable 30a, microstrip 30b, and / or strip line 30c along its length. Varying the structural configuration along the signal transmission line may allow for control or varying of the impedance and / or field along the length / application. For example, the configuration along the length may be a microstrip to stripline to microstrip along the length, a stripline to microstrip to stripline along the length, a stripline to microstrip along the length, etc.

[0038] In some embodiments, an electrical connector may include a signal transmission line made of a dielectric constant material of at least 10 or greater than 10.

[0039] In addition, in some embodiments, the signal transmission line may be or includes a cable. In various embodiments, the signal transmission line may be or includes a microstrip. In some embodiments, the signal transmission line may be or includes a stripline. In some embodiments, the signal transmission line may include a signal conductor and one or more ground conductors. In various embodiments, the signal conductor may be made of MgB2. In some embodiments, the electrical connector may include one or more substrate layers and one or more traces,Atty. Docket No.: S AMTE-0027-WO-01 wherein the one or more traces includes the dielectric constant material adjacent the one or more substrate layers and the signal conductor positioned on the dielectric constant material, and wherein the one or more substrate layers is positioned adjacent the one or more ground conductors. In various embodiments, the one or more substrate layers may include a first substrate layer and a second substrate layer positioned on opposing sides of the one or more ground conductors, and wherein the one or more traces are positioned on both of the first substrate layer and the second substrate layer, respectively. In some embodiments, the one or more substrate layers may include a first substrate layer positioned on a side of the one or more ground conductors, and wherein the one or more traces are positioned on the first substrate layer. In various embodiments, adjacent traces of the one or more traces may include the signal conductor on a top wall of the adjacent traces, a side wall facing towards each other of the adjacent traces, or a side wall of the adjacent traces facing in the same direction. In some embodiment, adjacent traces may be positioned at a pitch of at least 0.4 mm to 0.6 mm. In some embodiments, the one or more ground conductors may include a plurality of ground conductors. In various embodiments, the one or more ground conductors may include a single ground conductor. In some embodiments, the dielectric constant material may be disposed between the signal conductor and the one or more ground conductors. In various embodiments, the signal conductor may be substantially perpendicular to the one or more ground conductors. In some embodiments, the signal conductor may be substantially parallel to the one or more ground conductors. In various embodiments, the dielectric constant material may include at least one channel therein, and wherein the signal conductor may be positioned in at least one channel. In various embodiments, the dielectric constant material may be 1.2 times larger than 10. In some embodiments, the dielectric constant material may be 1.5 times larger than 10. In variousAtty. Docket No.: S AMTE-0027-WO-01 embodiments, the dielectric constant material may be 1.7 times larger than 10. In some embodiments, the dielectric constant material may be 2 times larger than 10. In various embodiments, the dielectric constant material may be 2.2 times larger than 10. In some embodiments, the dielectric constant material may be 2.5 times larger than 10. In various embodiments, the dielectric constant material may be 2.8 times larger than 10. In some embodiments, the dielectric constant material may be 3 times larger than 10. In various embodiments, the dielectric constant material may be a ceramic or a ceramic alloy. In some embodiments, the dielectric constant material may be at least a zirconia material or a zirconia alloy.

[0040] In some embodiments, an electrical connector may include a signal transmission line. In various embodiments, the electrical connector may include an electromagnetic means to reduce a waveguide mode cross section of the signal transmission line.

[0041] In addition, in some embodiments, the electromagnetic means may include a dielectric constant material of at least 10 or greater than 10. In various embodiments, the dielectric constant material may be in a range of 10-30, 15-30, 20-30, 25-30, 28-30, 26-29, 27-28, or 27-29. In some embodiments, the signal transmission line may be or includes a cable. In various embodiments, the signal transmission line may be or includes a microstrip. In some embodiments, the signal transmission line may be or includes a stripline. In some embodiments, the signal transmission line may include a signal conductor and one or more ground conductors. In various embodiments, the signal conductor may be made of MgB2 and the dielectric constant material is a ceramic.

[0042] While several embodiments have been described and illustrated herein, those of ordinary skill in the art will readily envision a variety of other means and / or structures for performing theAtty. Docket No.: S AMTE-0027-WO-01 function and / or obtaining the results and / or one or more of the advantages described herein, and each of such variations and / or modifications is deemed to be within the scope of the embodiments described herein. More generally, those skilled in the art will readily appreciate that all parameters, dimensions, materials, and configurations described herein are meant to be exemplary and that the actual parameters, dimensions, materials, and / or configurations will depend upon the specific application or applications for which the teachings is / are used. Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific embodiments described herein. It is, therefore, to be understood that the foregoing embodiments are presented by way of example only and that, within the scope of the appended claims and equivalents thereto, embodiments may be practiced otherwise than as specifically described and claimed. Embodiments of the present disclosure are directed to each individual feature, system, article, material, and / or method described herein. In addition, any combination of two or more such features, systems, articles, materials, and / or methods, if such features, systems, articles, materials, and / or methods are not mutually inconsistent, is included within the scope of the present disclosure.[0043JA11 definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and / or ordinary meanings of the defined terms.

[0044] The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.”

[0045] The phrase “and / or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed withAtty. Docket No.: S AMTE-0027-WO-01“and / or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined. Other elements may optionally be present other than the elements specifically identified by the “and / or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and / or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.

[0046] As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and / or” as defined above. For example, when separating items in a list, “or” or “and / or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items. Only terms clearly indicated to the contrary, such as “only one of’ or “exactly one of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements. In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e. “one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of.” “Consisting essentially of,” when used in the claims, shall have its ordinary meaning as used in the field of patent law.

[0047] As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding anyAtty. Docket No.: S AMTE-0027-WO-01 combinations of elements in the list of elements. This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, “at least one of A and B” (or, equivalently, “at least one of A or B,” or, equivalently “at least one of A and / or B”) can refer, in one embodiment, to at least one, optionally including more than one, A, with no B present (and optionally including elements other than B); in another embodiment, to at least one, optionally including more than one, B, with no A present (and optionally including elements other than A); in yet another embodiment, to at least one, optionally including more than one, A, and at least one, optionally including more than one, B (and optionally including other elements); etc.

[0048] It should also be understood that, unless clearly indicated to the contrary, in any methods claimed herein that include more than one step or act, the order of the steps or acts of the method is not necessarily limited to the order in which the steps or acts of the method are recited.

[0049] In the claims, as well as in the specification above, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” “composed of,” and the like are to be understood to be open-ended, i.e., to mean including but not limited to. Only the transitional phrases “consisting of’ and “consisting essentially of’ shall be closed or semi-closed transitional phrases, respectively, as set forth in the United States Patent Office Manual of Patent Examining Procedures, Section 2111.03.

[0050] It is to be understood that the embodiments are not limited in its application to the details of construction and the arrangement of components set forth in the description or illustrated in the drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. Unless limited otherwise, the terms “connected,” “coupled,” “inAtty. Docket No.: S AMTE-0027-WO-01 communication with,” and “mounted,” and variations thereof herein are used broadly and encompass direct and indirect connections, couplings, and mountings. In addition, the terms “connected” and “coupled” and variations thereof are not restricted to physical or mechanical connections or couplings.

[0051] The foregoing description of several embodiments of the invention has been presented for purposes of illustration. It is not intended to be exhaustive or to limit the invention to the precise steps and / or forms disclosed, and obviously many modifications and variations are possible in light of the above teaching.

Claims

Atty. Docket No.: S AMTE-0027-WO-01CLAIMS1. An electrical connector comprising: a signal transmission line made of a dielectric constant material of at least 10 or greater than 10.

2. The electrical connector of claim 1 wherein the signal transmission line includes a cable.

3. The electrical connector of any one of claims 1-2 wherein the signal transmission line includes a microstrip.

4. The electrical connector of any one of claims 1-3 wherein the signal transmission line includes a stripline.

5. The electrical connector of any one of claims 1-4 wherein the signal transmission line includes a signal conductor and one or more ground conductors.

6. The electrical connector of claim 5 wherein the signal conductor is made of MgB2.

7. The electrical connector of any one of claims 3-6 further comprising one or more substrate layers and one or more traces, wherein the one or more traces includes the dielectric constant material adjacent the one or more substrate layers and the signal conductor positioned on the dielectric constant material, and wherein the one or more substrate layers is positioned adjacent the one or more ground conductors.

8. The electrical connector of claim 7 wherein the one or more substrate layers include a first substrate layer and a second substrate layer positioned on opposing sides of the one or more ground conductors, and wherein the one or more traces are positioned on both of the first substrate layer and the second substrate layer, respectively.Atty. Docket No.: S AMTE-0027-WO-019. The electrical connector of claim 7 wherein the one or more substrate layers include a first substrate layer positioned on a side of the one or more ground conductors, and wherein the one or more traces are positioned on the first substrate layer.

10. The electrical connector of any one of claims 7-9 wherein adjacent traces of the one or more traces includes the signal conductor on a top wall of the adjacent traces, a side wall facing towards each other of the adjacent traces, or a side wall of the adjacent traces facing in the same direction.

11. The electrical connector of any one of claims 7-9 wherein adjacent traces are positioned at a pitch of at least 0.4 mm to 0.6 mm.

12. The electrical connector of any one of claims 7-11 wherein the one or more ground conductors includes a plurality of ground conductors.

13. The electrical connector of any one of claims 7-11 wherein the one or more ground conductors includes a single ground conductor.

14. The electrical connector of any one of claims 5-13 wherein the dielectric constant material is disposed between the signal conductor and the one or more ground conductors.

15. The electrical connector of any one of claims 5-14 wherein the signal conductor is substantially perpendicular to the one or more ground conductors.

16. The electrical connector of any one of claims 5-14 wherein the signal conductor is substantially parallel to the one or more ground conductors.

17. The electrical connector of any one of claims 5-16 wherein the dielectric constant material includes at least one channel therein, and wherein the signal conductor is positioned in the at least one channel.Atty. Docket No.: S AMTE-0027-WO-0118. The electrical connector of any one of claims 1-17 wherein the dielectric constant material is 1.2 times larger than 10.

19. The electrical connector of any one of claims 1-17 wherein the dielectric constant material is 1.5 times larger than 10.

20. The electrical connector of any one of claims 1-17 wherein the dielectric constant material is 1.7 times larger than 10.

21. The electrical connector of any one of claims 1-17 wherein the dielectric constant material is 2 times larger than 10.

22. The electrical connector of any one of claims 1-17 wherein the dielectric constant material is 2.2 times larger than 10.

23. The electrical connector of any one of claims 1-17 wherein the dielectric constant material is 2.5 times larger than 10.

24. The electrical connector of any one of claims 1-17 wherein the dielectric constant material is 2.8 times larger than 10.

25. The electrical connector of any one of claims 1-17 wherein the dielectric constant material is 3 times larger than 10.

26. The electrical connector of any one of claims 1-17 wherein the dielectric constant material is a ceramic or a ceramic alloy.

27. The electrical connector of any one of claims 1-17 and 26 wherein the dielectric constant material is at least a zirconia material or a zirconia alloy.

28. An electrical connector comprising: a signal transmission line; andAtty. Docket No.: S AMTE-0027-WO-01 an electromagnetic means to reduce a waveguide mode cross section of the signal transmission line.

29. The electrical connector of claim 28 wherein the electromagnetic means includes a dielectric constant material of at least 10 or greater than 10.

30. The electrical connector of claim 29 wherein the dielectric constant material is in a range of 10-30, 15-30, 20-30, 25-30, 28-30, 26-29, 27-28, or 27-29.

31. The electrical connector of any one of claims 28-30 wherein the signal transmission line includes a cable.

32. The electrical connector of any one of claims 28-31 wherein the signal transmission line includes a microstrip.

33. The electrical connector of any one of claims 28-32 wherein the signal transmission line includes a stripline.

34. The electrical connector of any one of claims 28-33 wherein the signal transmission line includes a signal conductor and one or more ground conductors.

35. The electrical connector of claim 34 wherein the signal conductor is made of MgB2 and the dielectric constant material is a ceramic.