Display module

Abstract

A display module, comprising a display panel, a first circuit board, a second circuit board, a cover plate assembly, a backplate assembly and a connecting member. Two ends of a first bending portion of the display panel are respectively connected to a display portion and a bonding portion of the display panel, and the first bending portion can be bent. Two ends of the first circuit board are respectively connected to the binding portion and the second circuit board, and the first circuit board can be bent. The display portion comprises a light-exit surface and a non-light-exit surface that are disposed opposite each other in a direction of thickness of the display portion. When both the first bending portion and the first circuit board are bent, the bonding portion, the first circuit board and the second circuit board are located on the side of the display portion having the non-light-exit surface, and the second circuit board is located on the side of the first circuit board away from the display portion. The cover plate assembly is disposed on the side of the display portion having the light-exit surface, and the backplate assembly is disposed on the side of the display portion having the non-light-exit surface. The backplate assembly comprises an extension portion, which overlaps with the cover plate assembly in the direction of thickness of the display portion. The connecting member is disposed between the cover plate assembly and the extension portion, and connects the cover plate assembly and the extension portion.

Description

Display Module Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a display module. Background Technology

[0002] In some display modules, the bonding part of the display panel is bent to the back of the display panel and connected to the circuit board. By bending the part of the display panel that bonds the driving circuit to the back of the display panel, the screen ratio of the front of the display panel (i.e. the display surface of the display panel) is increased, thereby narrowing the bezel of the display module and reducing the overall size of the display module. Summary of the Invention

[0003] On one hand, a display module is provided. The display module includes: a display panel, a first circuit board, a second circuit board, a cover plate assembly, a back plate assembly, and connectors. The display panel includes a display part, a first bending part, and a bonding part. One end of the first bending part is connected to the display part, and the other end is connected to the bonding part. The first bending part is bendable. The display part includes a light-emitting surface and a non-light-emitting surface disposed opposite to each other in its thickness direction.

[0004] One end of the first circuit board is connected to the bonding part, and the other end is connected to the second circuit board. The first circuit board is bendable. When both the first bending part and the first circuit board are bent, the bonding part, the first circuit board, and the second circuit board are located on the non-light-emitting side of the display part, and the second circuit board is located on the side of the first circuit board away from the display part.

[0005] The cover plate assembly is located on the light-emitting side of the display section. The back plate assembly is located on the non-light-emitting side of the display section; the back plate assembly includes an extension that does not overlap with the display section but overlaps with the cover plate assembly along the thickness direction of the display section. A connector is located between the cover plate assembly and the extension, connecting the cover plate assembly and the extension.

[0006] In some embodiments, the first bend is connected to one side of the display portion in a first direction, which is perpendicular to the thickness direction of the display portion. The back panel assembly also includes a main body portion that overlaps with the cover plate assembly in the thickness direction of the display portion. The extension portion of the back panel assembly includes a first extension portion and a second extension portion.

[0007] The first extension and the second extension are respectively connected to both sides of the main body in a second direction, which is parallel to the axis of the first bending portion when it is bent and perpendicular to the thickness direction of the display portion. The connector includes a first connector and a second connector, the first connector being used to connect the first extension and the cover plate assembly, and the second connector being used to connect the second extension and the cover plate assembly.

[0008] In some embodiments, the extension of the backplate assembly further includes a third extension connected to the side of the body portion away from the first bend. The connector also includes a third connector for connecting the third extension and the cover plate assembly.

[0009] In some embodiments, a gap exists between the connector and the display unit. The back panel assembly is provided with a first buffer structure, which is at least partially located within the gap along the thickness direction of the display unit, and the first buffer structure is used to buffer stress on the back panel assembly.

[0010] In some embodiments, the first buffer structure includes a plurality of first holes disposed on the backplate assembly, the plurality of first holes being spaced apart along the extension direction of the connector. The first holes are through holes and / or blind holes.

[0011] In some embodiments, the first buffer structure includes a first groove disposed on the backplate assembly, the first groove extending along the extension direction of the connector. The opening of the first groove faces toward or away from the cover plate assembly.

[0012] In some embodiments, the height of the connector is equal to the thickness of the display section. The height of the connector is its dimension in the thickness direction of the display section.

[0013] In some embodiments, the display module further includes a reinforcing plate, which is stacked with and fixed to the second circuit board.

[0014] In some embodiments, the second circuit board includes a third surface and a fourth surface disposed opposite to each other in its own thickness direction, the third surface being provided with bonding pins, and the first circuit board being connected to the bonding pins.

[0015] When both the first bend and the first circuit board are bent, the third surface is closer to the display section than the fourth surface; the reinforcing plate is provided on the third surface and is positioned to avoid the bonding pins.

[0016] In some embodiments, the display module further includes a conductive structure, which is located between the reinforcing plate and the first circuit board when both the first bent portion and the first circuit board are bent, and is electrically connected to the grounding structure on the reinforcing plate and the first circuit board respectively.

[0017] In some embodiments, the first circuit board includes a first sub-part, a second bent part, and a second sub-part. The first sub-part is connected to a bonding part, the second sub-part is connected to a second circuit board, and the second bent part is connected between the first sub-part and the second sub-part. The first sub-part includes a first surface and a second surface disposed opposite to each other in its own thickness direction.

[0018] The display module also includes a chip and a fixing member. The chip is disposed on the first surface of the first sub-part of the second bend. When both the first bend and the second bend are bent, the first surface is closer to the display part than the second surface, the fixing member covers the second surface, and the edge portion of the fixing member is connected to the back panel assembly. The fixing member is electrically connected to the back panel assembly.

[0019] In some embodiments, the edge portions on both sides of the fastener are connected to the back panel assembly in the second direction, which is parallel to the axis of the first bent portion when bent and perpendicular to the thickness direction of the display portion.

[0020] In some embodiments, the display module further includes a shielding structure that covers the fourth surface of the second circuit board when both the first bend and the first circuit board are bent, and the edge portion of the shielding structure is connected to the cover plate assembly.

[0021] In some embodiments, the edge portion of the shielding structure includes a first edge portion, and the first edge portion and a first bend portion are located on both sides of the display portion. The first edge portion is connected to the cover plate assembly.

[0022] In some embodiments, the edge portion of the shielding structure includes a second edge portion and a third edge portion, which are located on opposite sides of the display portion in a second direction; the axis of the first bending portion during bending is perpendicular to the thickness direction of the display portion. Both the second edge portion and the third edge portion are connected to the cover plate assembly.

[0023] In some embodiments, the edge portion of the shielding structure includes a first edge portion, a second edge portion, and a third edge portion, which are disposed separately from each other in the circumferential direction of the display.

[0024] In some embodiments, the edge portion of the shielding structure is provided with a bevel, and the angle between the bevel and the cover plate assembly is an acute angle.

[0025] In some embodiments, the end of the edge portion of the shielding structure that is connected to the cover plate assembly has a gap with the side of the display portion.

[0026] In some embodiments, the first circuit board includes a first sub-part, a second bending part, and a second sub-part. The first sub-part is connected to a bonding part, the second sub-part is connected to the second circuit board, and the second bending part is connected between the first sub-part and the second sub-part. The second bending part is provided with a second buffer structure, which is used to buffer the stress generated when the second bending part is bent.

[0027] In some embodiments, the second buffer structure includes a plurality of second holes disposed on the second bend, the plurality of second holes being arranged at intervals along the axis of the second bend when it bends. The second holes are through holes and / or blind holes. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0029] Figure 1 is a structural diagram of a display module according to some embodiments;

[0030] Figure 2 is a structural diagram of a display module according to some other embodiments;

[0031] Figure 3 is a structural diagram of a display module according to some other embodiments;

[0032] Figure 4 is a partially enlarged structural view of the backplane assembly according to some embodiments;

[0033] Figure 5 is a partially enlarged structural view of the backplane assembly according to some other embodiments;

[0034] Figure 6A is a side view structural diagram of a display module according to some embodiments;

[0035] Figure 6B is a partially enlarged structural view of the fastener according to some embodiments;

[0036] Figure 7 is a side view of a display module according to some other embodiments;

[0037] Figure 8A is a structural diagram of one side of the third surface of the second circuit board according to some embodiments;

[0038] Figure 8B is a structural diagram of one side of the third surface of the second circuit board according to some other embodiments;

[0039] Figure 9 is a side view structural diagram of a display module according to some other embodiments;

[0040] Figure 10 is a structural diagram of a display module according to some other embodiments;

[0041] Figure 11 is a side view of a display module according to some other embodiments. Detailed Implementation

[0042] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0043] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0044] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0045] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0046] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0047] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0048] As used herein, depending on the context, the term “if” may optionally be interpreted as meaning “when”, “in the event of”, “in response to determination”, or “in response to detection”. Similarly, depending on the context, the phrase “if it is determined that…” or “if [the stated condition or event] is detected” may optionally be interpreted as meaning “in the event of determination that…”, “in response to determination that…”, “when [the stated condition or event] is detected”, or “in response to the detection of [the stated condition or event]”.

[0049] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0050] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0051] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0052] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0053] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0054] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0055] Some embodiments of this disclosure provide a display module 10.

[0056] In some embodiments, the display module 10 includes a display panel 1 and a chip 25 (IC, Integrated Circuit Chip).

[0057] The display panel 1 has multiple light-emitting elements formed on it, including but not limited to organic light-emitting diodes (OLEDs), mini light-emitting diodes (MLEDs), or micro light-emitting diodes (MLEDs).

[0058] Chip 25 is used to provide a drive signal to the display panel 1 to control the light-emitting elements on the display panel 1 to emit light, thereby displaying an image.

[0059] In some examples, chip 25 is disposed on display panel 1, and chip 25 sends drive signals to display panel 1.

[0060] In other examples, the display module 10 also includes a first circuit board 2, one end of which is connected to the display panel 1. A chip 25 is disposed on the first circuit board 2, and the chip 25 sends a drive signal to the display panel 1 through the first circuit board 2.

[0061] Furthermore, the first circuit board 2 has the characteristic of being flexible and can be a chip-on-flex (COF, or chip-on-film).

[0062] The display panel 1 includes a front and a back. The side of the display panel 1 that emits light can be referred to as the front of the display panel 1, and the opposite side can be referred to as the back of the display panel 1. In addition, the display panel 1 can have different shapes, such as the display panel 1 being non-bendable or the display panel 1 being bendable.

[0063] In some examples, the display panel 1 is not bendable, with one end of the first circuit board 2 connected to the display panel 1 and the other end bent to the back of the display panel 1. In this case, since no chip 25 occupies a portion of the display panel 1, more light-emitting elements can be formed on the same size display panel 1, thereby improving the resolution of the display panel 1.

[0064] In other examples, as shown in Figures 1 and 2, the display panel 1 is bendable, with the portion of the display panel 1 used to connect to the first circuit board 2 bent to the back of the display panel 1 and connected to the first circuit board 2 on the back. This further reduces the proportion of the non-display area on the front of the display panel 1 compared to a non-bendable case, thus increasing the screen-to-body ratio of the display panel 1.

[0065] Taking a bendable display panel 1 as an example, as shown in Figures 1 and 2, the display panel 1 includes a display part 11, a first bending part 12, and a binding part 13. One end of the first bending part 12 is connected to the display part 11, and the other end is connected to the binding part 13. The first bending part 12 is bendable. One end of the first circuit board 2 is connected to the binding part 13. The first circuit board 2 is bendable.

[0066] The display unit 11 includes a light-emitting surface and a non-light-emitting surface disposed opposite to each other in its thickness direction. When both the first bending portion 12 and the first circuit board 2 are bent, the binding portion 13, the first circuit board 2 and the second circuit board 3 are located on the non-light-emitting surface side of the display unit 11, and the second circuit board 3 is located on the side of the first circuit board 2 away from the display unit 11.

[0067] In some embodiments, as shown in Figures 1 and 2, the display module 10 further includes a cover plate assembly 4 disposed on the light-emitting surface side of the display section 11. When the first bending portion 12 is bent, the orthographic projection of the display panel 1 onto the cover plate assembly 4 is located within the range of the cover plate assembly 4. When the first bending portion 12 is unfolded (without bending), the orthographic projection of the display panel 1 onto the cover plate assembly 4 overlaps with the cover plate assembly 4, or is located within the range of the cover plate assembly 4.

[0068] Furthermore, regardless of whether the first bending portion 12 is unfolded or bent, the orthographic projection of the display portion 11 of the display panel 1 onto the cover plate assembly 4 is within the range of the cover plate assembly 4.

[0069] Specifically, in some examples, the cover assembly 4 may include a glass cover CG (Cover Glass or Cover Lens).

[0070] The light-emitting surface of the display unit 11 is the same as the light-emitting surface of the display module 10. By providing a glass cover on the light-emitting surface of the display panel 1, it can effectively resist external impacts. For example, when the display panel 1 is dropped or collided, it can protect the display panel 1 and prevent the display panel 1 from being damaged by bumps.

[0071] In other examples, the cover plate assembly 4 may also include a polarizer (POL).

[0072] When ambient light shines into the display panel 1, some film layers within the display panel 1 reflect and emit the ambient light, forming reflected light. This reflected light interferes with the imaging of the display panel 1 and reduces its display contrast.

[0073] By setting a polarizer on the light-emitting surface of the display panel 1, when ambient light is reflected and emitted from the display panel 1, at least part (or all) of the reflected light will be blocked by the polarizer and cannot be emitted, effectively reducing the impact of reflected light on the display effect. That is, the display effect of the display module 10 can be further optimized by using a polarizer.

[0074] Based on the above, when the cover assembly 4 includes a glass cover and a polarizer, the polarizer may be disposed between the display portion 11 of the display panel 1 and the glass cover. The glass cover and the polarizer may be bonded together using optically clear adhesive (OCA).

[0075] Of course, the glass cover and polarizer can also be connected in other ways, and the cover assembly 4 can also include other structures besides the glass cover and polarizer. This is only an exemplary description of some possible implementations and is not intended to limit this disclosure.

[0076] In some embodiments, as shown in Figures 1 and 2, the display module 10 further includes a backplate assembly 5 disposed on the non-light-emitting side of the display section 11. The backplate assembly 5 includes a main body 52, which overlaps with the cover plate assembly 4 in the thickness direction of the display section 11.

[0077] For example, the back panel assembly 5 includes at least one back panel. When the back panel assembly 5 includes multiple back panels, the multiple back panels are stacked sequentially along the thickness direction of the display portion 11.

[0078] Therefore, in some examples, the back panel is made of a material with high thermal conductivity, which has good thermal conductivity. In this way, the back panel assembly 5 can absorb the heat generated by the display panel 1 and dissipate the heat into the air, thereby achieving the effect of heat dissipation for the display panel 1 and preventing the display panel 1 from overheating.

[0079] For example, the backplate can be a screen cooling film (SCF). The screen cooling film (SCF) can be one or more layers of thin film used for heat conduction and dissipation. Materials for the screen cooling film (SCF) include, but are not limited to, natural graphite screen cooling film, artificial graphite screen cooling film, graphene screen cooling film, and carbon nanotube screen cooling film. Alternatively, the screen cooling film (SCF) can also consist of a layered mesh adhesive, foam, and copper foil. The screen cooling film (SCF) can be bonded to the display unit 11 using a mesh adhesive.

[0080] For example, the backplate material can also be materials with good thermal conductivity, such as copper, aluminum, and stainless steel.

[0081] Of course, the backplate may also include other materials. This is merely an illustrative example of some possible implementations and is not intended to limit the scope of this disclosure.

[0082] Based on the above, the back panel assembly 5 also has a certain degree of rigidity. The main body 52 of the back panel assembly 5 can provide structural support for the display unit 11, improve the overall strength of the display panel 1, and reduce the risk of damage to the display panel 1 caused by external forces (such as accidental collisions).

[0083] In some embodiments, as shown in Figures 1 and 2, the back panel assembly 5 includes an extension 51 along the thickness direction of the display portion 11. The extension 51 does not overlap with the display portion 11 but overlaps with the cover plate assembly 4.

[0084] Based on this, the display module 10 also includes a connector 6. Along the thickness direction of the display part 11, the connector 6 is disposed between the cover plate assembly 4 and the extension part 51, connecting the cover plate assembly 4 and the extension part 51.

[0085] By providing an extension 51 to the back panel assembly 5, the extension 51 extends outward from the main body 52 towards the display part 11 and is connected to the cover assembly 4 via the connector 6. In this way, the display part 11 is fixed between the back panel assembly 5 and the cover assembly 4, which enhances the fit and tightness between the display part 11 and the cover assembly 4 and prevents peeling between the display part 11 and the cover assembly 4.

[0086] For example, connector 6 may be a very high bond (VHB) adhesive block. For instance, connector 6 may be high-adhesion foam adhesive or other supportive adhesive blocks. The adhesive force of connector 6 may be greater than or equal to 5000 gf / inch.

[0087] The main body 52 of the back panel assembly 5 is provided corresponding to the display part 11 of the display panel 1. The extension part 51 of the back panel assembly 5 extends beyond the display part 11 relative to the main body 52. ​​The main body 52 and the extension part 51 of the back panel assembly 5 may crack or break under external force.

[0088] Since the connector 6 has good adhesion and a certain degree of support, it can not only connect the cover plate assembly 4 and the back plate assembly 5, but also provide some support to the cover plate assembly 4 and the back plate assembly 5, thus preventing the main body 52 and the extension 51 of the back plate assembly 5 from cracking or breaking under external force.

[0089] In some embodiments, as shown in Figures 1 and 2, the first bending portion 12 is connected to one side of the display portion 11 in a first direction X, which is perpendicular to the thickness direction of the display portion 11. The extension portion 51 of the back panel assembly 5 includes a first extension portion 511 and a second extension portion 512. The first extension portion 511 and the second extension portion 512 are respectively connected to both sides of the main body portion 52 in a second direction Y, which is parallel to the axis of the first bending portion 12 when bent and perpendicular to the thickness direction of the display portion 11. The connector 6 includes a first connector 61 and a second connector 62. The first connector 61 is used to connect the first extension portion 511 and the cover plate assembly 4, and the second connector 62 is used to connect the second extension portion 512 and the cover plate assembly 4.

[0090] In this way, the two opposite ends of the back panel assembly 5 extend from the opposite sides of the display section 11 and are connected to the cover plate assembly 4, thereby better fixing the display section 11 and avoiding the problem of peeling between the display section and the cover plate assembly 4.

[0091] In some embodiments, as shown in FIG3, the extension 51 of the back panel assembly 5 further includes a third extension 513, which is connected to the side of the main body 52 away from the first bend 12. The connector 6 further includes a third connector 63 for connecting the third extension 513 and the cover assembly 4.

[0092] In this way, the ends of the back panel assembly 3 extend from multiple sides of the display unit 11 and are connected to the cover plate assembly 4, which increases the area of ​​the connection between the cover plate assembly 4 and the back panel assembly 5, further enhancing the fixing effect on the display unit 11 and better preventing the problem of peeling between the display unit and the cover plate assembly 4.

[0093] Exemplarily, in this embodiment, the first connecting member 61, the second connecting member 62, and the third connecting member 63 may be as shown in FIG. 3 and are three independently provided connecting members; alternatively, the first connecting member 61, the second connecting member 62, and the third connecting member 63 may also be connected to each other to form a "C" shape.

[0094] In some embodiments, as shown in FIGS. 1, 2, and 3, the height of the connecting member 6 is equal to the thickness of the display portion 11. Here, the height of the connecting member 6 is the dimension of the connecting member 6 in the thickness direction of the display portion 11.

[0095] The main body portion 52 of the backplane assembly 5 contacts the display portion 11, and the extension portion 51 extends outside the display portion 11 and is connected to the cover plate assembly 4. By making the thickness of the connecting member 6 (the dimension of the connecting member 6 in the thickness direction of the display portion 11) match the dimension of the gap between the cover plate assembly 4 and the backplane assembly 5 (the gap between the cover plate assembly 4 and the backplane assembly 5 in the thickness direction of the display portion 11, or the thickness of the display portion 11), in this way, the entire backplane assembly 5 can be ensured to be located in the same plane, and can better achieve mutual contact with the display portion 11, ensuring the support and heat dissipation effects of the backplane assembly 5 on the display portion 11.

[0096] In some embodiments, as shown in FIGS. 1, 2, and FIG. 3, there is a gap between the connecting member 6 and the display portion 11. The backplane assembly 5 is provided with a first buffer structure 53. Along the thickness direction of the display portion 11, at least a part of the first buffer structure 53 is located in the gap, and the first buffer structure 53 is used to buffer the stress of the backplane assembly 5.

[0097] Considering the process deviation allowed by the connecting member 6 itself and the deviation that may be caused by the influence of manufacturing equipment during the preparation process, the actual size of the connecting member 6 may have a certain deviation from the designed size, that is, the size of the connecting member 6 may be larger or smaller than the gap between the cover plate assembly 4 and the backplane assembly 5. In this way, there may be a step difference between the main body portion 52 and the extension portion 51 of the backplane assembly 5, and the stress caused by the step difference at the connected part of the main body portion 52 and the extension portion 51 may cause the connected part of the main body portion 52 and the extension portion 51 to be affected by stress and appear cracks or disconnections and other defects.

[0098] By providing the first buffer structure 53 on the backplane assembly 5, in this way, even when there is a certain deviation between the thickness of the connecting member 6 and the gap between the cover plate assembly 4 and the backplane assembly 5, the first buffer structure 53 can also relieve the influence of the stress caused by the step difference on the backplane assembly 5, and avoid damage to the backplane assembly 5 caused by stress.

[0099] In some embodiments, as shown in FIG4, the first buffer structure 53 includes a plurality of first holes 531 disposed on the back plate assembly 5, the plurality of first holes 531 being spaced apart along the extending direction of the connector 6. The first holes 531 are through holes and / or blind holes. In other embodiments, as shown in FIGS. 3 and 5, the first buffer structure 53 includes a first groove 532 disposed on the back plate assembly 5, the first groove 532 extending along the extending direction of the connector 6. The opening of the first groove 532 faces toward or away from the cover plate assembly 4.

[0100] By providing multiple openings or slots on the back panel assembly 5, the thickness of the portion of the back panel assembly 5 located between the connector 6 and the display portion 11 can be reduced. This reduces the stress on the back panel assembly 5 under the aforementioned step difference when there is a deviation between the thickness of the connector 6 and the thickness of the display portion 11, thus preventing damage to the back panel assembly 5 under the stress caused by the aforementioned step difference.

[0101] In some embodiments, as shown in FIG6A, the display module 10 further includes a second circuit board 3, and the other end of the first circuit board 2 is connected to the second circuit board 3. That is, both ends of the first circuit board 2 are connected to the bonding portion 13 of the display panel 1 and the second circuit board 3, respectively. When both the first bending portion 12 and the first circuit board 2 are bent, the bonding portion 13, the first circuit board 2 and the second circuit board 3 are located on the non-light-emitting surface side of the display portion 11, and the second circuit board 3 is located on the side of the first circuit board 2 away from the display portion 11.

[0102] For example, the second circuit board 3 includes, but is not limited to, a printed circuit board (PCB) or a flexible printed circuit (FPC). The second circuit board 3 can serve as a signal transmission medium, capable of transmitting signals from external devices (such as motherboards or processors) to the chip 25 on the second circuit board 3, and transmitting the signals processed by the chip 25 to the display panel 1.

[0103] In some examples, the second circuit board 3 has a power management circuit. The power management circuit can convert the external power supply into voltage and current suitable for the operation of the display panel 1 and the chip 25, thereby achieving a stable power supply and effective management, and ensuring the normal operation of the display panel 1 and the chip 25.

[0104] Furthermore, the power management circuit on the second circuit board 3 can also provide overcurrent, overvoltage and undervoltage protection measures to prevent damage or failure of the display panel 1 and chip 25 due to abnormal power supply.

[0105] Based on this, in some embodiments, as shown in Figures 6A and 7, the first circuit board 2 includes a first sub-part 21, a second bending part 22, and a second sub-part 23. The first sub-part 21 is connected to the binding part 13, the second sub-part 23 is connected to the second circuit board 3, and the second bending part 22 is connected between the first sub-part 21 and the second sub-part 23. The second bending part 22 is provided with a second buffer structure 24, which is used to buffer the stress generated when the second bending part 22 is bent.

[0106] By providing a second buffer structure 24 on the second bending portion 22, the second buffer structure 24 can alleviate the stress generated when the first circuit board 2 is bent, and prevent the second circuit board 3 from deviating from the predetermined position under the bending stress of the second bending portion 22. This ensures that each part of the display module 10 can remain in the predetermined position and will not deviate from the predetermined position under the influence of the bending stress of the display panel 1 and the first circuit board 2, thus preventing problems such as unstable connection or connection failure.

[0107] In some embodiments, as shown in FIG7, the second buffer structure 24 includes a plurality of second holes 241 disposed on the second bending portion 22, the plurality of second holes 241 being arranged at intervals along the axis of the second bending portion 22 when it bends. The second holes 241 are through holes and / or blind holes.

[0108] By forming multiple second holes 241 on the second bending portion 22, the thickness of the second bending portion 22 can be reduced, thereby reducing the bending stress generated in the second bending portion 22 when the first circuit board 2 is bent, and further reducing the stress exerted on the second circuit board 3 by the second bending portion 22 under the influence of bending stress, thus preventing the second circuit board 3 from deviating from the predetermined position under the action of the bending stress generated when the second bending portion 22 is bent.

[0109] In some embodiments, as shown in Figures 6A and 8A, the display module 10 further includes a reinforcing plate 7, which is stacked with the second circuit board 3 and fixed to the second circuit board 3.

[0110] By providing a reinforcing plate 7 on one side of the second circuit board 3, the second circuit board 3 and the reinforcing plate 7 are integrated as a whole, which has better rigidity than the second circuit board 3, thereby preventing the second circuit board 3 from deforming and ensuring the effective connection between the second circuit board 3 and the first circuit board 2.

[0111] In some embodiments, as shown in FIG6A and FIG8A, the second circuit board 3 includes a third surface 3a and a fourth surface 3b disposed opposite to each other in its own thickness direction. The third surface 3a is provided with a bonding pin 31, and the first circuit board 2 is connected to the bonding pin 31.

[0112] In some examples, the reinforcing plate 7 is disposed on the fourth surface 3b and corresponds to the bonding pin 31. That is, the bonding pin 31 is located within the range of the reinforcing plate 7 along the thickness of the second circuit board 3. This improves the strength of the second circuit board 3 at the bonding pin 31 portion, preventing deformation of the second circuit board 3 at the bonding pin 31 portion, which could lead to unstable connection or connection failure between the second circuit board 3 and the first circuit board 2.

[0113] In other examples, as shown in Figure 8A, the reinforcing plate 7 is disposed on the third surface 3a and is positioned to avoid the bonding pin 31. When both the first bend 12 and the first circuit board 2 are bent, the third surface 3a is closer to the display part 11 than the fourth surface 3b. In this way, the contact area between the reinforcing plate 7 and the second circuit board 3 is larger, which can better improve the strength of the second circuit board 3 and prevent the second circuit board 3 from deforming.

[0114] In some other embodiments, the reinforcing plate 7 may include a first reinforcing plate and a second reinforcing plate. The first reinforcing plate is disposed on the fourth surface 3b and corresponds to the bonding pin 31. The second reinforcing plate may be disposed on the third surface 3a and avoids the bonding pin 31. In this way, by providing reinforcing plates 7 on both opposite sides of the second circuit board 3, the overall strength of the second circuit board 3 can be better improved.

[0115] In some embodiments, the first circuit board 2 is provided with a grounding structure. By providing a grounding structure, it is possible to ensure stable signal transmission between the first circuit board 2 and the display panel 1, and to prevent signal transmission failures caused by potential differences.

[0116] For example, the grounding structure can be conductive adhesive, conductive cloth or conductive foam, or it can be a grounding wire, grounding pad or grounding layer, etc.

[0117] The statement "grounding structure can be conductive adhesive, conductive cloth, or conductive foam" directly equates conductive adhesive, conductive cloth, or conductive foam with a grounding structure. However, while conductive adhesive, conductive cloth, or conductive foam are materials used to achieve electrical connections or grounding, they are not synonymous with a complete grounding structure. A grounding structure typically refers to a system or device that includes conductive materials (such as conductive adhesive, conductive cloth, or conductive foam) to conduct current to the ground or other low-potential points.

[0118] "The grounding structure can be conductive adhesive, conductive cloth, or conductive foam." This describes a grounding function or system implemented using conductive adhesive, conductive cloth, or conductive foam, which better aligns with the definition of a grounding structure. Here, conductive adhesive, conductive cloth, or conductive foam serve as part of the grounding process, enabling electrical connections and thus forming a complete grounding structure.

[0119] In some embodiments, as shown in Figures 6A and 8A, the display module 10 further includes a conductive structure 8. When both the first bending portion 12 and the first circuit board 2 are bent, the conductive structure 8 is located between the reinforcing plate 7 and the first circuit board 2, and the conductive structure 8 is electrically connected to the grounding structure on the reinforcing plate 7 and the first circuit board 2, respectively.

[0120] In this case, the material of the reinforcing plate 7 includes a conductive material.

[0121] For example, the reinforcing plate 7 can be a stainless steel plate. Of course, the reinforcing plate 7 can also be other conductive materials, and this disclosure does not limit it.

[0122] For example, the reinforcing plate 7 may include an insulating support plate and a conductive material layer covering the support plate.

[0123] For example, the conductive structure 8 can be conductive foam.

[0124] The second circuit board 3 is connected to the grounding structure on the first circuit board 2 through the reinforcing plate 7 and the conductive structure 8, thereby realizing the grounding of the second circuit board 3, ensuring stable signal transmission between the second circuit board 3 and the first circuit board 2, and preventing signal transmission failures caused by potential differences.

[0125] In other embodiments, as shown in Figures 6A and 8B, the second circuit board 3 has a copper drain area with a grounding structure within it. One end of the conductive structure 8 is connected to the grounding structure on the second circuit board 3. In a projected view of the second circuit board 3, the conductive structure 8 surrounds the grounding structure on the second circuit board 3. That is, the conductive structure 8 covers the grounding structure on the second circuit board 3.

[0126] In this case, the main function of the reinforcing plate 7 is to improve the local rigidity of the second circuit board 3. Therefore, the reinforcing plate 7 can be made of a hard, non-conductive material, such as a ceramic sheet or a plastic sheet. Of course, in this case, the reinforcing plate 7 can also include a conductive material.

[0127] When both the first bending portion 12 and the first circuit board 2 are bent, the conductive structure 8 is located between the grounding structure on the second circuit board 3 and the first circuit board 2, and the conductive structure 8 is electrically connected to the grounding structure on the second circuit board 3 and the grounding structure on the first circuit board 2 respectively.

[0128] By designing a copper leakage area on the second circuit board 3 and a grounding structure in the copper leakage area, for example, a conductive structure or grounding layer can be designed in the copper leakage area. The grounding structure on the second circuit board 3 is connected to the grounding structure on the first circuit board 2 through the conductive structure 8 to achieve grounding, ensuring the stability and connectivity of the circuit, and preventing static electricity accumulation and damage to structures such as light-emitting elements in the display module 10.

[0129] In some embodiments, as shown in FIG9, the first sub-part 21 of the first circuit board 2 includes a first surface 21a and a second surface 21b disposed opposite to each other in its own thickness direction. When both the first bending portion 12 and the second bending portion 22 are bent, the first surface 21a is closer to the display portion 11 than the second surface 21b, and the chip 25 is disposed on the first surface 21a of the first sub-part 21 of the second bending portion 22.

[0130] In this way, when both the first bending portion 12 and the second bending portion 22 are bent, the chip 25 is located between the backplate assembly 5 and the first circuit board 2, which can provide a certain degree of protection for the chip 25 and prevent the chip 25 from being damaged by bumps.

[0131] In some embodiments, as shown in FIG6A, the display module 10 further includes a pad D disposed on the back panel assembly 5. When both the first bend 12 and the second bend 22 are bent, the pad D is located between the back panel assembly 5 and the first sub-part 21.

[0132] By setting the pad D, the first circuit board 2 can be supported when both the first bend 12 and the second bend 22 are bent, thereby maintaining the stability and flatness of the first circuit board 2.

[0133] In some embodiments, as shown in FIG6A, when both the first bending portion 12 and the second bending portion 22 are bent, at least a portion of the binding portion 13 of the display panel 1 overlaps with the pad D along the thickness direction of the display portion 11 of the display panel 1.

[0134] In this way, the pad D can play a certain supporting role between the display part 11 and the binding part 13 of the display panel 1, which can effectively prevent the first bending part 12 from being over-bent, thereby avoiding the problem of deformation or damage caused by excessive bending of the first bending part 12.

[0135] In some embodiments, the display portion 11 of the display panel 1 is provided with a pixel circuit for transmitting pixel driving signals to the light-emitting element, the bonding portion 13 is provided with a bonding electrode for receiving electrical signals transmitted from the first circuit board 2, and the first bending portion 12 is provided with a signal line. The pixel circuit and the bonding electrode are connected through the signal line, thereby transmitting electrical signals from the first circuit board 2 to the pixel circuit.

[0136] In this way, by setting the pad D, it is possible to prevent the signal lines on the first bending part 12 from cracking or breaking due to excessive bending, thus ensuring an effective connection between the pixel circuit and the bonding electrode.

[0137] Based on the above, the material of pad D is an insulating material, thereby ensuring that pad D will not have a negative impact on the electrical performance of display panel 1.

[0138] For example, pad D needs to be made of a material with a softer surface texture.

[0139] For example, the material of pad D includes, but is not limited to, foam adhesive, or acrylic adhesive or resin with a substrate.

[0140] In some embodiments, as shown in Figures 3 and 6A, the display module 10 further includes a fastener 9 that covers the second surface 21b of the first sub-part 21, and the edge portion of the fastener 9 is connected to the back panel assembly 5. The fastener 9 is electrically connected to the back panel assembly 5.

[0141] By setting the fixing component 9, on the one hand, the first circuit board 2 can be constrained and its position fixed to prevent displacement; on the other hand, the electromagnetic interference of the chip 25 on the first circuit board 2 can be shielded to prevent electromagnetic interference from affecting the chip 25 and thus protect the chip 25.

[0142] On the other hand, the backplate assembly 5 can be connected to the grounding structure on the first circuit board 2 through the fastener 9, so as to achieve grounding of the backplate assembly 5.

[0143] For example, as shown in FIG6B, the fastener 9 includes a first sub-layer 91 and a second sub-layer 92 stacked together. The first sub-layer 91 is an insulating material, and the second sub-layer 92 is a conductive material. The second sub-layer 92 covers the surface of the first sub-layer 91.

[0144] In the orthographic projection onto the cover plate assembly 4, along the second direction Y, the first sublayer 91 is located within the area of ​​the second sublayer 92. That is, along the second direction Y, the end of the second sublayer 92 extends beyond the first sublayer 91.

[0145] For example, the first sublayer 91 can be an adhesive, such as Mylar adhesive. Of course, the first sublayer 91 can also be made of other materials.

[0146] For example, the second sublayer 92 may be a conductive portion. The portion of the second sublayer 92 extending beyond the first sublayer 91 is connected to the backplate assembly 5, thereby achieving an electrical connection between the fastener 9 and the backplate assembly 5. Simultaneously, the second sublayer 92 is also connected to the conductive structure 8, thereby achieving an electrical connection between the fastener 9 and the conductive structure 8.

[0147] In some embodiments, as shown in FIG3, the edge portions on both sides of the fastener 9 in the second direction Y are connected to the back panel assembly 5. The second direction Y is parallel to the axis of the first bending portion 12 when it is bent and perpendicular to the thickness direction of the display portion 11.

[0148] In this way, the fasteners 9 are connected to the backplate assembly 5 from opposite sides of the first circuit board 2, which can better achieve the constraint effect on the first circuit board 2.

[0149] In some embodiments, as shown in FIG6A, when both the first bending portion 12 and the second bending portion 22 are bent, the conductive structure 8 is located between the second circuit board 3 and the fixing member 9, and the conductive structure 8 is in contact with the fixing member 9.

[0150] In this way, when both the display panel 1 and the first circuit board 2 are bent, the second circuit board 3 can be connected to the conductive structure on the first circuit board 2 through the conductive structure 8, thereby achieving grounding of the second circuit board 3.

[0151] Electromagnetic interference (EMI) is the electromagnetic waves generated by electronic devices during operation that cause interference to other devices. In display module 10, if the electromagnetic interference on the surface of the second circuit board 3 is not effectively controlled, it may interfere with other electronic components within display module 10, leading to problems such as signal distortion or image quality degradation in display module 10.

[0152] Based on this, in some embodiments, as shown in FIG1 and FIG6A, the display module 10 further includes a shielding structure G, which covers the fourth surface 3b of the second circuit board 3 when both the first bending portion 12 and the first circuit board 2 are bent.

[0153] In some examples, the shielding structure G comprises a single metal layer. For instance, the material of the shielding structure G includes, but is not limited to, metals such as copper or aluminum. The conductivity of the single metal layer allows for the absorption and reflection of electromagnetic waves, thereby achieving a shielding effect. Specifically, in this case, the shielding structure G can be a thin film or coating covering the surface of the second circuit board 3, or it can be a foil attached to the second circuit board 3.

[0154] In other examples, the shielding structure G comprises multiple metal layers, each of which may have a different thickness and material. The shielding effect of the shielding structure G can be improved by changing the interlayer spacing between the different metal layers, and / or by changing the material combination of the multiple metal layers. In this case, adjacent metal layers may be separated by an insulating layer to prevent interlayer short circuits in the shielding structure G.

[0155] In some other embodiments, the shielding structure G is a nanocomposite film structure, comprising stacked metal layers and nanomaterial layers. Nanomaterials can absorb, scatter, and refract electromagnetic waves, providing a wider range of frequency shielding. By combining the metal layers with the nanomaterial layers (e.g., nanoparticles or nanofibers), the shielding effect of the shielding structure G can be enhanced by utilizing the special properties of nanomaterials.

[0156] In other examples, the shielding structure G includes an elastic polymer film. For instance, the shielding structure G may be composed of an elastic polymer material with shielding properties. The shielding effect of the shielding structure G can be further improved by adding conductive fillers (such as carbon nanotubes or metal fillers) to the elastic polymer material.

[0157] Based on this, in some other embodiments, as shown in FIG1 and FIG6A, when both the first bending portion 12 and the first circuit board 2 are bent, the shielding structure G covers the fourth surface 3b of the second circuit board 3, and the edge portion of the shielding structure G is connected to the cover plate assembly 4.

[0158] Compared to the case where the shielding structure G only covers the fourth surface 3b of the second circuit board 3, by designing the shielding structure G to extend outward, the edge of the shielding structure G is connected to the cover plate assembly 4, forming a relatively closed space between the shielding structure G and the cover plate assembly 4. In this way, the shielding structure G can also provide a certain shielding effect for the structure located in the aforementioned space, thus improving the shielding effect of the shielding structure G.

[0159] Furthermore, the edge portion of the shielding structure G is connected to the cover plate assembly 4, which can also play a certain constraining role on the display panel 1, the first circuit board 2 and the second circuit board 3, reduce the influence of bending stress on the display panel 1 and the first circuit board 2, avoid the display panel 1 or the second circuit board 3 from unfolding under the action of bending stress, which would cause abnormal connection between the various parts of the display module 10, and improve the connection stability between the various parts of the display module 10.

[0160] Based on this, in some embodiments, as shown in Figures 1 and 6A, the edge portion of the shielding structure G includes a first edge portion G1, and the first edge portion G1 and the first bend portion 12 are located on both sides of the display portion 11. The first edge portion G1 is connected to the cover plate assembly 4.

[0161] The first edge portion G1 and the first bend portion 12 may be located on opposite sides of the display portion 11, or the first edge portion G1 and the first bend portion 12 may be located on adjacent sides of the display portion 11.

[0162] By extending at least one edge of the shielding structure G to the outside of the second circuit board 3 and connecting it with the cover plate assembly 4, the second circuit board 3 can be constrained to a certain extent, which in turn constrains the display panel 1, the first circuit board 2, and the second circuit board 3. This reduces the impact of bending stress on the display panel 1 and the first circuit board 2, prevents the display panel 1 or the second circuit board 3 from unfolding under bending stress, which could lead to abnormal connections between the various parts of the display module 10, and improves the connection stability between the various parts of the display module 10.

[0163] In other embodiments, as shown in FIG7, the edge portion of the shielding structure G includes a second edge portion G2 and a third edge portion G3, which are located on opposite sides of the display portion 11 in the second direction Y; the axis of the first bending portion 12 during bending is perpendicular to the thickness direction of the display portion 11. Both the second edge portion G2 and the third edge portion G3 are connected to the cover plate assembly 4.

[0164] In this way, by extending the edge portions of the opposing sides of the shielding structure G to the outside of the second circuit board 3 and connecting them with the cover plate assembly 4, the shielding structure G can surround the display panel 1, the first circuit board 2 and the second circuit board 3 from the side of the second circuit board 3 away from the display unit 11 and from both sides of the display unit 11 along the second direction Y. This achieves a constraint effect on the display panel 1, the first circuit board 2 and the second circuit board 3 from multiple directions, reduces the influence of bending stress on the display panel 1 and the first circuit board 2, avoids the display panel 1 or the second circuit board 3 from unfolding under bending stress, which could lead to abnormal connections between the various parts of the display module 10, and improves the connection stability between the various parts of the display module 10.

[0165] In some other embodiments, as shown in FIG11, the edge portion of the shielding structure G includes a fourth edge portion G4, the fourth edge portion G4 and the first bending portion 12 are respectively located on both sides of the display portion 11 in the first direction X, and the fourth edge portion G4 is connected to the cover plate assembly 4.

[0166] In this way, the shielding structure G can surround the display panel 1, the first circuit board 2 and the second circuit board 3 from the side of the second circuit board 3 away from the display part 11 and the side of the first bending part 12 of the display panel 1, thereby constraining the display panel 1, the first circuit board 2 and the second circuit board 3 from multiple directions, reducing the influence of bending stress on the display panel 1 and the first circuit board 2, avoiding the problem of abnormal connection between the various parts of the display module 10 caused by the display panel 1 or the second circuit board 3 unfolding under the action of bending stress, and improving the connection stability between the various parts of the display module 10.

[0167] Based on the above, the edge portion of the shielding structure G may include at least one of the first edge portion G1, the second edge portion G2, the third edge portion G3, and the fourth edge portion G4. When the shielding structure G includes multiple (two or more) edge portions, the multiple edge portions of the shielding structure G are separated from each other in the circumferential direction of the display unit 11.

[0168] For example, as shown in FIG10, the edge portion of the shielding structure G includes a first edge portion G1, a second edge portion G2 and a third edge portion G3, which are separated from each other in the circumferential direction of the display unit 11.

[0169] Furthermore, as shown in Figures 1, 7, 10 and 11, the edge portion of the shielding structure G can be connected to the cover plate assembly 4 via the connector 6.

[0170] Based on this, as shown in FIG10, the extension 51 of the back panel assembly 5 and the edge portion of the shielding structure G located on the same side of the display section 11 can be connected to the cover plate assembly 4 via the same connector 6.

[0171] Based on the above embodiments, in some embodiments, as shown in Figures 1, 6A, 7, 10 and 11, the edge portion of the shielding structure G is set with an inclined surface, and the angle between the inclined surface and the cover plate assembly 4 is an acute angle.

[0172] In this way, the edge of the shielding structure G is set with an angle, and the angle between the angle and the cover plate assembly 4 is an acute angle. Therefore, the bending angle of the bent part of the shielding structure G is an obtuse angle. The part of the shielding structure G located on the fourth surface 3b side of the second circuit board 3 forms a gentler bending angle with the edge of the shielding structure G, so as to avoid cracks or breaks caused by excessive stress in the bent part of the shielding structure G.

[0173] In some embodiments, as shown in Figures 1, 6A, 7, 10, and 11, the end of the edge portion of the shielding structure G connected to the cover plate assembly 4 has a gap with the side of the display portion 11. Furthermore, the edge portion of the shielding structure G has a gap with the display panel 1.

[0174] This effectively avoids interference between the shielding structure G and the display panel 1, which could damage the display panel 1 and prevent it from displaying properly.

[0175] Based on the above embodiments, when both the display panel 1 and the first circuit board 2 are bent, the distance between the display panel 1 and the second circuit board 3 needs to be maintained within a certain range.

[0176] If the distance between the display panel 1 and the second circuit board 3 is too large, the second circuit board 3 will deviate upward (away from the display part 11) from the predetermined position. There may be a risk that the second circuit board 3 will fail to connect with the first circuit board 2 or fail to connect with the fixing member 9 in the display module 10, which will prevent the second circuit board 3 from achieving grounding.

[0177] If the distance between the display panel 1 and the second circuit board 3 is too small, the display panel 1 and the first circuit board 2 may be excessively bent under the squeezing force applied by the second circuit board 3, causing defects such as cracks or breaks in the bent parts of the display panel 1 and the first circuit board 2.

[0178] Based on this, in some embodiments, as shown in Figures 1 and 7, the display module 10 further includes a connecting support structure K, disposed on the back panel assembly 5 and located on at least one side of the first circuit board 2 along the second direction Y. When both the display panel 1 and the first circuit board 2 are bent, the connecting support structure K is located between the back panel assembly 5 and the second circuit board 3, and the two ends of the connecting support structure K in the thickness direction of the display portion 11 are respectively connected to the back panel assembly 5 and the second circuit board 3.

[0179] Specifically, the connecting support structure K can be located on one side of the first circuit board 2 along the second direction Y, or it can be located on opposite sides of the first circuit board 2 along the second direction Y.

[0180] By setting the connecting support structure K, it can provide support between the back panel assembly 5 and the second circuit board 3, and can also limit the position of the second circuit board 3 along the thickness direction of the display part 11. This prevents the display panel 1 and the first circuit board 2 from being excessively bent under the pressure applied by the second circuit board 3 under external force, ensuring that the display module 10 can work normally and improving the reliability of the display module 10.

[0181] For example, the materials used to connect the support structure K include, but are not limited to, pressure-sensitive adhesives (PSA).

[0182] In this way, the connecting support structure K not only provides support, but also connects the second circuit board 3 to the back plate assembly 5, further restricting the position of the second circuit board 3 in the thickness direction of the display section 11 and improving the connection stability between the various structural parts in the display module 10.

[0183] Therefore, the connecting support structure K, while fulfilling its supporting and connecting functions, should not interfere with any of the structural components within the display module 10. For example, there is a gap between the connecting support structure K and the display panel 1. Similarly, there is a gap between the connecting support structure K and the edge portion of the shielding structure G.

[0184] Based on any of the foregoing embodiments, the display module 10 can be any device that displays moving (e.g., video), stationary (e.g., still image), text, or images.

[0185] More specifically, the embodiments described are intended to be implemented in or associated with a variety of electronic devices, including but not limited to in-vehicle devices (e.g., in-vehicle navigation systems, in-vehicle displays, vehicle steering wheel finger screens, vehicle gear lever screens, vehicle boss button screens, etc.), smart wearable devices (e.g., smartwatches or smart bracelets), portable electronic devices (e.g., portable game consoles, e-book readers, etc.), smart pens or keyboards, etc.

[0186] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, comprising: The display panel includes a display part, a first bending part, and a binding part. One end of the first bending part is connected to the display part, and the other end is connected to the binding part. The first bending part is bendable. The display part includes a light-emitting surface and a non-light-emitting surface arranged opposite to each other in its thickness direction. A first circuit board and a second circuit board, one end of the first circuit board is connected to the binding part, and the other end is connected to the second circuit board. The first circuit board is bendable. When both the first bending part and the first circuit board are bent, the binding part, the first circuit board and the second circuit board are located on the non-light-emitting side of the display part, and the second circuit board is located on the side of the first circuit board away from the display part. The cover plate assembly is located on the light-emitting surface side of the display unit; A back panel assembly is disposed on the non-light-emitting side of the display unit; the back panel assembly includes an extension portion along the thickness direction, the extension portion not overlapping with the display unit, but overlapping with the cover plate assembly; A connector is disposed between the cover plate assembly and the extension, connecting the cover plate assembly and the extension.

2. The display module according to claim 1, wherein, The first bent portion is connected to one side of the display portion in a first direction, which is perpendicular to the thickness direction; The back panel assembly further includes a main body portion that overlaps with the cover plate assembly in the thickness direction; the extension portion includes a first extension portion and a second extension portion, which are respectively connected to both sides of the main body portion in a second direction, which is parallel to the axis of the first bending portion when it is bent and perpendicular to the thickness direction. The connector includes a first connector and a second connector, the first connector being used to connect the first extension and the cover plate assembly, and the second connector being used to connect the second extension and the cover plate assembly.

3. The display module according to claim 2, wherein, The extension also includes a third extension, which is connected to the side of the main body away from the first bend. The connector further includes a third connector for connecting the third extension and the cover plate assembly.

4. The display module according to any one of claims 1 to 3, wherein, There is a gap between the connector and the display unit; The backplate assembly is provided with a first buffer structure, which is located at least partially within the gap along the thickness direction. The first buffer structure is used to buffer the stress of the backplate assembly.

5. The display module according to claim 4, wherein, The first buffer structure includes a plurality of first holes disposed on the back plate assembly, the plurality of first holes being spaced apart along the extension direction of the connector; The first hole is a through hole and / or a blind hole.

6. The display module according to claim 4, wherein, The first buffer structure includes a first groove disposed on the back plate assembly, the first groove extending along the extension direction of the connector; The opening of the first groove faces the cover plate assembly or faces away from the cover plate assembly.

7. The display module according to any one of claims 1 to 6, wherein, The height of the connector is equal to the thickness of the display unit; The height of the connector is the dimension of the connector in the thickness direction.

8. The display module according to any one of claims 1 to 7, further comprising: A reinforcing plate is stacked on top of the second circuit board and fixed to the second circuit board.

9. The display module of claim 8, wherein, The second circuit board includes a third surface and a fourth surface disposed opposite to each other in its own thickness direction. The third surface is provided with bonding pins, and the first circuit board is connected to the bonding pins. When both the first bend and the first circuit board are bent, the third surface is closer to the display part than the fourth surface. The reinforcing plate is disposed on the third surface and is positioned to avoid the bonding pins.

10. The display module according to claim 9, further comprising: The conductive structure is located between the reinforcing plate and the first circuit board when both the first bent portion and the first circuit board are bent, and the conductive structure is electrically connected to the grounding structure on the reinforcing plate and the first circuit board respectively.

11. The display module of claim 10, wherein, The first circuit board includes a first sub-part, a second bent part, and a second sub-part. The first sub-part is connected to the bonding part, the second sub-part is connected to the second circuit board, and the second bent part is connected between the first sub-part and the second sub-part. The first sub-part includes a first surface and a second surface that are disposed opposite to each other in its own thickness direction. The display module also includes: The chip is disposed on the first surface; The fastener, when both the first bend and the second bend are bent, has the first surface closer to the display portion than the second surface, the fastener covers the second surface, and the edge portion of the fastener is connected to the back panel assembly; The fastener is electrically connected to the backplate assembly.

12. The display module of claim 11, wherein, The edges of both sides of the fastener in the second direction are connected to the back plate assembly, and the second direction is parallel to the axis of the first bent portion when it is bent and perpendicular to the thickness direction.

13. The display module according to any one of claims 9 to 12, further comprising: The shielding structure covers the fourth surface of the second circuit board when both the first bend and the first circuit board are bent, and the edge portion of the shielding structure is connected to the cover plate assembly.

14. The display module of claim 13, wherein, The edge portion of the shielding structure includes a first edge portion, and the first edge portion and the first bent portion are located on both sides of the display portion; The first edge portion is connected to the cover plate assembly.

15. The display module of claim 13 or 14, wherein, The edge portion of the shielding structure includes a second edge portion and a third edge portion, which are respectively located on both sides of the display portion in the second direction; the axis of the first bending portion is perpendicular to the thickness direction when it is bent. Both the second edge portion and the third edge portion are connected to the cover plate assembly.

16. The display module of claim 15, wherein, The edge portion of the shielding structure includes a first edge portion, a second edge portion, and a third edge portion, which are separated from each other in the circumferential direction of the display unit.

17. The display module of any one of claims 13-16, wherein, The edge portion of the shielding structure is set with a slope, and the angle between the slope and the cover plate assembly is an acute angle.

18. The display module of any one of claims 13-17, wherein, The edge portion of the shielding structure, at one end connected to the cover plate assembly, has a gap with the side of the display unit.

19. The display module of any one of claims 1-18, wherein, The first circuit board includes a first sub-part, a second bent part, and a second sub-part. The first sub-part is connected to the bonding part, the second sub-part is connected to the second circuit board, and the second bent part is connected between the first sub-part and the second sub-part. The second bending portion is provided with a second buffer structure, which is used to buffer the stress generated when the second bending portion is bent.

20. The display module of claim 19, wherein, The second buffer structure includes a plurality of second holes disposed on the second bending portion, the plurality of second holes being arranged at intervals along the axis of the second bending portion when it bends; The second hole is a through hole and / or a blind hole.

Images