Electronic device

Abstract

Embodiments of the present application relate to the technical field of electronics, and provide an electronic device. The electronic device comprises a middle frame, a battery cover, a battery, a sub-board, a main board, a camera module, and a flexible printed circuit board. The middle frame has an accommodating cavity. The battery cover covers the accommodating cavity. The battery, the sub-board, and the main board are all located in the accommodating cavity. The sub-board is spaced apart from the main board. In the length direction of the electronic device, the battery is located between the sub-board and the main board. The main board comprises a first surface, a second surface, and a side surface, and the second surface is opposite to the first surface and faces the battery cover. The side surface connects the first surface and the second surface and faces the battery. The camera module is provided on the second surface of the main board. The flexible printed circuit board is at least partially located in the accommodating cavity. The flexible printed circuit board is connected to the first surface of the main board, extends between the side surface of the main board and the battery in the thickness direction of the electronic device, and is bent to be connected to the sub-board.

Description

electronic devices

[0001] Cross-reference of related applications

[0002] This application claims priority to Chinese Patent No. 202411990036.9, filed with the Chinese Patent Office on December 28, 2024, entitled "Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of electronic technology, and more specifically, to an electronic device. Background Technology

[0004] Electronic devices (such as mobile phones) typically include components like camera modules and batteries. As the performance of electronic devices improves, more components (such as more camera modules) or larger components (such as larger batteries or larger camera modules) are needed internally. However, when more or larger components are incorporated into an electronic device, the technology suffers from insufficient internal space. Summary of the Invention

[0005] This application provides an electronic device. The electronic device includes a mid-frame, a battery cover, a battery, a sub-board, a main board, a camera module, and a flexible circuit board. The mid-frame has a receiving cavity. The battery cover is disposed on the receiving cavity. The battery, sub-board, and main board are all located within the receiving cavity. The sub-board and main board are spaced apart. Along the length of the electronic device, the battery is located between the sub-board and the main board. The main board includes a first surface, a second surface, and a side surface. The second surface is opposite to the first surface and faces the battery cover. The side surface connects to the first and second surfaces and faces the battery. The camera module is disposed on the second surface of the main board. The flexible circuit board is at least partially located within the receiving cavity. The flexible circuit board is connected to the first surface of the main board and extends along the thickness direction of the electronic device between the side surface of the main board and the battery, and is bent to connect with the sub-board.

[0006] The electronic device of this application embodiment connects the flexible circuit board to the first surface of the motherboard away from the battery cover, rather than to the second surface of the motherboard facing the battery cover. Thus, without changing the size of the motherboard, the second surface of the motherboard facing the battery cover can accommodate more or larger components (such as more or larger camera modules).

[0007] Furthermore, while keeping the number and size of components arranged on the second surface of the motherboard facing the battery cover unchanged, the area of ​​the motherboard can be reduced, allowing the battery volume to be increased, thereby improving the battery capacity.

[0008] In related technologies, the flexible circuit board spanning the battery is connected to the surface of the motherboard facing the battery cover. When more camera modules or larger camera modules are installed on the second surface of the motherboard facing the battery cover, the layout space on the second surface of the motherboard facing the battery cover is insufficient. Furthermore, in related technologies, increasing the battery volume to improve battery capacity requires shortening the length of the motherboard, which reduces the motherboard area and further exacerbates the conflict between the connection position of the flexible circuit board on the second surface of the motherboard facing the battery cover and the layout position of the camera modules.

[0009] In summary, the electronic device of this application embodiment, by connecting the flexible circuit board spanning the battery to the first surface of the motherboard facing away from the battery cover, helps to resolve the conflict between the increased number or size of components in the electronic device and the insufficient space on the second surface of the motherboard facing the battery cover, making full use of the double-sided space of the motherboard and improving the internal space utilization rate of the electronic device.

[0010] In some embodiments, the flexible circuit board is bent between the battery and the battery cover and extends along the length of the electronic device to connect with the sub-board.

[0011] In the above embodiments, the flexible circuit board is bent between the battery and the battery cover. The flexible circuit board can be accessed by removing the battery cover, which facilitates maintenance and replacement.

[0012] In some embodiments, the middle frame includes a base plate and a spacer. The spacer is connected to the base plate and protrudes toward the battery cover. The main board and the battery are located on opposite sides of the spacer. The flexible circuit board includes a first connecting portion, a second connecting portion, and a bending portion. The first connecting portion is connected to a first surface of the main board and is located between the first surface of the main board and the base plate. The second connecting portion is connected to a sub-board. The bending portion is connected between the first connecting portion and the second connecting portion and is at least partially located between a side surface of the main board and the spacer.

[0013] In the above embodiments, the arrangement of the spacer in the middle frame and the bending portion in the flexible circuit board makes the layout of the flexible circuit board in the receiving cavity more orderly, enhances the support and stability of the flexible circuit board, reduces the bending deformation of the flexible circuit board due to space constraints during use, and improves the reliability of electronic devices.

[0014] In some embodiments, the electronic device also includes a reinforcing member that is attached to the bend.

[0015] In the above embodiments, by setting a reinforcing member attached to the bending portion, it is beneficial to limit the shape change of the bending portion of the flexible circuit board, prevent the flexible circuit board from bending or rebounding during use, thereby avoiding the flexible circuit board from arching up and hitting the battery cover, reducing the risk of battery cover molding and flexible circuit board wire breakage, and improving the durability of the flexible circuit board and the overall reliability of electronic devices.

[0016] In some embodiments, the bending portion includes a first portion, a second portion, and a third portion connected sequentially. The first portion connects to the first connecting portion and is located between a first surface of the motherboard and the base plate. The second portion is located between a side surface of the motherboard and the spacer. The third portion connects to the second connecting portion and is at least partially located on the side of the spacer facing away from the base plate. The reinforcing member includes a first reinforcing portion and a second reinforcing portion. The first reinforcing portion is adhered to the third portion, and along the thickness direction of the electronic device, the projection of the first reinforcing portion on the base plate overlaps with the projection of the spacer on the base plate. The second reinforcing portion connects to the first reinforcing portion and is adhered to the second portion.

[0017] In the above embodiments, by including a first part, a second part, and a third part in the bending section, and providing a first reinforcing part and a second reinforcing part in the reinforcing member, multi-segment bending control of the flexible circuit board is achieved. This design not only ensures that the flexible circuit board maintains the required approximately 90° shape at the bending point, but also further enhances the stability of the flexible circuit board through the multiple supports of the reinforcing member, preventing the flexible circuit board from detaching or breaking during assembly and use, and improving the firmness of the connection between the flexible circuit board and the motherboard and the fatigue resistance of the electronic device.

[0018] In some embodiments, the projection of the first reinforcement on the base plate does not overlap with the projection of the battery on the base plate along the thickness direction of the electronic device.

[0019] In the above embodiments, the projection of the first reinforcing part on the base plate does not overlap with the projection of the battery, which helps to ensure that the reinforcing part and the battery maintain an appropriate safe distance, avoid physical interference between the reinforcing part and the battery, and thus help to reduce the risk of potential mechanical wear and structural conflict.

[0020] In some embodiments, the reinforcing member further includes a third reinforcing part, which is connected to the second reinforcing part and attached to the first part.

[0021] In the above embodiments, by providing a third reinforcing part that is adhered to the first portion of the bending section in the reinforcing member, the reinforcing member provides additional support at the first portion of the flexible circuit board, enhancing the structural strength and stability of the flexible circuit board in complex bending areas. This multi-layered reinforcement design effectively prevents deformation and breakage of the flexible circuit board under high stress environments, improving the durability and reliability of electronic devices in practical use.

[0022] In some embodiments, the third reinforcing part is bonded to the first surface of the motherboard; or, the first surface of the motherboard is fitted with a first nut, and the third reinforcing part is locked to the first nut by a first screw; or, the first surface of the motherboard is provided with a first screw, and the third reinforcing part is locked to the first screw; or, the first surface of the motherboard is fitted with a first buckle, and the third reinforcing part is engaged with the first buckle.

[0023] In the above embodiments, the third reinforcing part and the first surface of the motherboard can be connected by various methods such as adhesive bonding, screw fastening, or snap-fit ​​connection. These connection methods ensure a firm fixation between the reinforcing part and the motherboard, preventing the flexible circuit board from detaching from the reinforcing part due to rebound force or external force after assembly. The diverse connection methods further enhance the flexibility and adaptability of the assembly between the flexible circuit board and the motherboard.

[0024] In some embodiments, the reinforcing member further includes a fourth reinforcing portion, which is connected to the second reinforcing portion, extends in a direction away from the first reinforcing portion, and is connected to the second surface.

[0025] In the above embodiments, the fourth reinforcing part provides additional support for the flexible circuit board on the second surface of the motherboard, further enhancing the structural stability of the flexible circuit board. Through multi-directional reinforcement design, the support force of the flexible circuit board in different directions is ensured, preventing deformation or breakage of the flexible circuit board due to multi-directional stress, and improving the damage resistance of electronic devices in complex operating environments.

[0026] In some embodiments, the fourth reinforcing part is adhered to the second surface of the motherboard; or, the second surface of the motherboard is fitted with a second nut, and the fourth reinforcing part is locked to the second nut by a second screw; or, the second surface of the motherboard is provided with a second screw, and the fourth reinforcing part is locked to the second screw; or, the second surface of the motherboard is fitted with a second buckle, and the fourth reinforcing part is engaged with the second buckle.

[0027] In the above embodiments, the specific connection methods between the fourth reinforcing part and the second surface of the motherboard include bonding, screw fastening, or snap-fit ​​connection. These connection methods ensure a stable bond between the fourth reinforcing part and the second surface of the motherboard, preventing the reinforcing part from detaching due to rebound force or external force during use. This further enhances the support of the flexible circuit board on the second surface of the motherboard, improves the stability and reliability of the overall structure, and ensures the normal operation of electronic equipment under high load or extreme conditions.

[0028] In some embodiments, the spacer has a slot facing the motherboard. The reinforcement also includes a fifth reinforcement that is connected to the second reinforcement, avoids the second portion, extends toward the spacer, and is held in the slot.

[0029] In the above embodiments, the fifth reinforcing part, through its engagement with the slot of the spacer part, provides additional fixation and support for the flexible circuit board, further restricting the displacement of the flexible circuit board in multiple directions, improving the stability of the flexible circuit board connection, and ensuring the shock resistance performance of the electronic device under extreme conditions such as drops.

[0030] In some embodiments, the flexible circuit board includes a third surface and a fourth surface, the fourth surface being disposed opposite to the third surface and facing the battery cover. The reinforcing member is bonded to the third surface of the bent portion, or the reinforcing member is bonded to the fourth surface of the bent portion.

[0031] In the above embodiments, the reinforcing member can be attached to the third or fourth surface of the bent portion, thereby allowing selection based on factors such as the specific structure of the flexible circuit board, the internal layout of the electronic device, and the manufacturing process. This improves the flexibility of electronic device design while meeting the shape control and reliability requirements of the flexible circuit board.

[0032] In some embodiments, the electronic device further includes a first connector and a second connector. The first connector is disposed on a first surface of the motherboard, and the first connection portion is connected to the motherboard through the first connector. The second connector is disposed on a sub-board, and the second connection portion is connected to the sub-board through the second connector.

[0033] In the above embodiments, the motherboard and the flexible circuit board are connected through a first connector, and the sub-board and the flexible circuit board are connected through a second connector, thereby simplifying the electrical connection between the flexible circuit board and the motherboard and sub-board, and improving the stability and maintainability of the connection.

[0034] In some embodiments, the flexible circuit board further includes a first reinforcing plate and a second reinforcing plate, the first reinforcing plate being located on the side of the first connecting portion away from the first connecting portion, and the second reinforcing plate being located on the side of the second connecting portion away from the second connector.

[0035] In the above embodiments, the provision of the first reinforcing plate and the second reinforcing plate enhances the structural strength of the flexible circuit board at the connection point, preventing the flexible circuit board from breaking due to the fragility of the connection point under high stress environment, thereby improving the reliability of the electronic device. Attached Figure Description

[0036] Figure 1 is a partial structural diagram of an electronic device in the related technology.

[0037] Figure 2 is a cross-sectional view along line II-II in Figure 1.

[0038] Figure 3 is a schematic diagram of the structure of the electronic device according to the first embodiment of this application.

[0039] Figure 4 is a cross-sectional view of line IV-IV in Figure 3.

[0040] Figure 5 is a partial cross-sectional schematic diagram of the electronic device according to the second embodiment of this application.

[0041] Figure 6 is a partial cross-sectional schematic diagram of an electronic device according to the third embodiment of this application.

[0042] Figure 7 is a partial cross-sectional schematic diagram of an electronic device according to the fourth embodiment of this application.

[0043] Figure 8 is a partial cross-sectional schematic diagram of an electronic device according to the fifth embodiment of this application.

[0044] Figure 9 is a partial cross-sectional schematic diagram of an electronic device according to the sixth embodiment of this application.

[0045] Figure 10(a) is a structural schematic diagram of the flexible circuit board and reinforcing member in Figure 9, and Figure 10(b) is a planar schematic diagram of the connector of the related technology and the flexible circuit board, reinforcing member and buckle in Figure 9.

[0046] Figure 11 is a partial cross-sectional schematic diagram of an electronic device according to the seventh embodiment of this application.

[0047] Figure 12 is a partial cross-sectional schematic diagram of an electronic device according to the eighth embodiment of this application.

[0048] Figure 13 is a partial cross-sectional schematic diagram of an electronic device according to the ninth embodiment of this application.

[0049] Figure 14 is a schematic diagram of the flexible circuit board and reinforcing member in Figure 13.

[0050] Figure 15 is a partial cross-sectional schematic diagram of an electronic device according to the tenth embodiment of this application.

[0051] Figure 16 is a schematic diagram of the flexible circuit board and reinforcing member in Figure 15.

[0052] Figure 17 is a partial cross-sectional schematic diagram of the electronic device according to the eleventh embodiment of this application.

[0053] Figure 18 is a partial cross-sectional schematic diagram of the electronic device according to the twelfth embodiment of this application.

[0054] Figure 19 is a partial cross-sectional schematic diagram of an electronic device according to the thirteenth embodiment of this application.

[0055] Figure 20 is a schematic diagram of the structure of the flexible circuit board and the reinforcing member in the electronic device of the fourteenth embodiment of this application.

[0056] Figure 21 is a schematic diagram of the structure of an electronic device according to the fifteenth embodiment of this application.

[0057] Key component symbols: Electronic equipment 110000i', 110000ja, 110000kb, 110000lc, 110000dm, 110000en, 10100f0, o 100g, 100h, Middle frame 10', 10 Base plate 11 Spacing part 12 Receiving cavity R, R' First receiving cavity R1 Second receiving cavity R2 Battery cover 20', 20 Display screen 30', 30 Camera module 40', 40 Battery 50', 50 Sub-board 60', 60 Second connector 62 Main board 70', 70 Surface S' First surface S1 Second surface S2 Side surface S3 First connector 71 Flexible circuit board 80', 80 First connecting part 81 Second connecting part 82 Bending part 83 First part 831 Second part 832 Third part 833 First reinforcing plate 84 Second reinforcing plate 85, Third surface 80c, Fourth surface 80d, Reinforcing part 90, First reinforcing part 91, Second reinforcing part 92, Third reinforcing part 93, Fourth reinforcing part 94, Fifth reinforcing part 95, Connector T, Clip A, Nut B, Screw C, First clip A1, First nut B1, First screw C1, Second clip A2, Second nut B2, Second screw C2, Slot K, Screw hole H, First direction X, Second direction Y, Third direction Z

[0058] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0059] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the embodiments of this application, and should not be construed as limiting this application.

[0060] In the description of the embodiments of this application, the terms "length", "width", "thickness", "upper", "lower", "front", "rear", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the implementation of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0061] In the description of the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features.

[0062] In the description of the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0063] In the description of the embodiments of this application, unless otherwise stated, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows communication between the two components; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components.

[0064] Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0065] Figure 1 is a partial structural schematic diagram of the electronic device 100' in the related art. Figure 2 is a cross-sectional schematic diagram along line II-II in Figure 1. Referring to Figures 1 and 2, the electronic device 100' includes a middle frame 10', a battery cover 20', a display screen 30', multiple camera modules 40', a battery 50', a sub-board 60', a main board 70', and multiple flexible printed circuit boards (FPCs) 80'.

[0066] Specifically, the display screen 30' is located on the side of the middle frame 10' opposite to the battery cover 20'. The middle frame 10' has a receiving cavity R'. The battery cover 20' covers the receiving cavity R'. The camera module 40', battery 50', sub-board 60', main board 70', and flexible circuit board 80' are all located within the receiving cavity R'. The sub-board 60' and main board 70' are spaced apart. The battery 50' is located between the sub-board 60' and the main board 70'.

[0067] Multiple camera modules 40' are mounted on the surface S' of the motherboard 70' facing the battery cover 20'.

[0068] Multiple flexible circuit boards 80' include an antenna FPC, a main FPC, a screen adapter FPC, and a battery FPC. Each of the antenna FPC, main FPC, and screen adapter FPC has one end connected to the sub-board 60', and the other end connected across the battery 50' to the surface S' of the main board 70' facing the battery cover 20'. One end of the battery FPC is connected to the surface S' of the main board 70' facing the battery cover 20', and the other end is connected to the battery 50'. Each flexible circuit board 80' can be connected to both the main board 70' and the sub-board 60' via a connector T. The connector T can be a board-to-board (BTB) connector.

[0069] In the process of developing this application, the inventors discovered at least the following problems in the related technology. Specifically, due to advancements in camera configuration specifications, the size of the camera module 40' is increasing, and it is often centrally positioned along the width of the electronic device 100'. This results in the camera module 40' increasing in size to the level shown by the dotted line in Figure 1, occupying the layout position of the BTB connector on the motherboard 70' near the lower edge of the battery 50'. Consequently, the layout space on the surface S' of the motherboard 70' facing the battery cover 20' is insufficient, making it impossible to arrange the numerous BTB connectors on the motherboard 70' used for connecting to the antenna FPC, main FPC, screen adapter FPC, and battery FPC.

[0070] Furthermore, in related technologies, if the capacity of battery 50' is to be increased by increasing the volume of battery 50', the area of ​​motherboard 70' needs to be reduced, and the dimensions of motherboard 70' along the length of electronic device 100' need to be shortened. This further exacerbates the conflict between the position of the BTB connector on the surface S' of motherboard 70' facing battery cover 20' and the position of camera module 40'. Therefore, when more or larger components are installed inside electronic device 100', electronic device 100' in related technologies suffers from insufficient internal space.

[0071] The electronic devices of this application embodiments are described below with reference to the accompanying drawings. These electronic devices may be, but are not limited to, mobile phones, tablets, wearable devices, smart home devices, etc. The following description uses a mobile phone as an example to illustrate the technical solutions of this application embodiment.

[0072] Figure 3 is a schematic diagram of the structure of the electronic device 100a according to the first embodiment of this application. As shown in Figure 3, the electronic device 100a includes a mid-frame 10, a battery cover 20, a display screen 30, and a camera module 40. The mid-frame 10 and the battery cover 20 are connected, and the display screen 30 is located on one side of the mid-frame 10 for displaying images. The camera module 40 is a rear-facing camera, and the camera module 40 is opposite to the display screen 30. The battery cover 20 has a light-transmitting area corresponding to the camera module 40, so that external light can enter the camera module 40 to form an image.

[0073] For ease of description, the width direction of electronic device 100a is defined as the first direction X, the length direction of electronic device 100a is defined as the second direction Y, the thickness direction of electronic device 100a is defined as the third direction Z, and the direction in which the battery cover 20 points to the display screen 30 is defined as the positive direction of the third direction Z.

[0074] Figure 4 is a cross-sectional view along line IV-IV in Figure 3. As shown in Figure 4, the electronic device 100a also includes a battery 50, a sub-board 60, a main board 70, and a flexible circuit board 80.

[0075] The middle frame 10 has a receiving cavity R on the side opposite to the display screen 30, and the battery cover 20 is disposed on the receiving cavity R. The battery 50, the sub-board 60, and the main board 70 are all located within the receiving cavity R. The flexible circuit board 80 is at least partially located within the receiving cavity R. Along the second direction Y, the sub-board 60 and the main board 70 are spaced apart. Along the second direction Y, the battery 50 is located between the main board 70 and the sub-board 60.

[0076] For ease of description, the direction from the secondary board 60 to the main board 70 is defined as the positive direction of the second direction Y.

[0077] The motherboard 70 is the core circuit board in the electronic device 100a, and is responsible for the main operations and data processing of the electronic device 100a. The motherboard 70 may integrate, but is not limited to, the following components: processor, memory, storage chips (such as flash memory), power management chips, etc.

[0078] Sub-board 60 is a secondary circuit board of the auxiliary mainboard 70 in electronic device 100a, and is used to perform specific auxiliary functions. Sub-board 60 may support, but is not limited to, the following components: charging interface, audio interface, microphone, speaker, etc.

[0079] The motherboard 70 includes a first surface S1, a second surface S2, and a side surface S3. The second surface S2 is opposite to the first surface S1 and faces the battery cover 20. The side surface S3 connects the first surface S1 and the second surface S2 and faces the battery 50. The camera module 40 is disposed on the second surface S2 of the motherboard 70. The flexible circuit board 80 is connected to the first surface S1 of the motherboard 70 and extends upward in a third direction Z between the side surface S3 of the motherboard 70 and the battery 50, bends between the battery 50 and the battery cover 20, and extends in a second direction Y to connect with the sub-board 60. In some embodiments, the flexible circuit board 80 can be any one of an antenna FPC, a main FPC, or a screen adapter FPC.

[0080] The electronic device 100a of this application embodiment connects the flexible circuit board 80 to the first surface S1 of the motherboard 70 away from the battery cover 20, rather than to the second surface S2 of the motherboard 70 facing the battery cover 20. As a result, without changing the size of the motherboard 70, more or larger components (such as more or larger camera modules 40) can be arranged on the second surface S2 of the motherboard 70. In addition, without changing the number and size of the components arranged on the second surface S2 of the motherboard 70, the area of ​​the motherboard 70 can be reduced, so that the volume of the battery 50 can be increased, thereby increasing the capacity of the battery 50.

[0081] In related technologies, the flexible circuit board 80' spanning the battery 50' is connected to the surface of the motherboard 70' facing the battery cover 20'. When more camera modules 40' or larger camera modules 40' are installed on the surface S' of the motherboard 70' facing the battery cover 20', the layout space on the surface S' of the motherboard 70' facing the battery cover 20' is insufficient. Furthermore, in related technologies, if the volume of the battery 50' is increased to improve its capacity, the length of the motherboard 70' needs to be shortened. This results in a reduction in the area of ​​the motherboard 70', further exacerbating the conflict between the connection position of the flexible circuit board 80' on the surface S' of the motherboard 70' facing the battery cover 20' and the layout position of the camera modules 40'.

[0082] In summary, the electronic device 100a of this application embodiment, by connecting the flexible circuit board 80 spanning the battery 50 to the first surface S1 of the motherboard 70 facing away from the battery cover 20, helps to resolve the conflict between the increased number of components on the second surface S2 of the motherboard 70 facing the battery cover 20, the increased size of components on the second surface S2 of the motherboard 70 facing the battery cover 20, or the increased volume of the battery 50 and the insufficient space on the second surface S2 of the motherboard 70 facing the battery cover 20, fully utilizes the double-sided space of the motherboard 70, and improves the internal space utilization rate of the electronic device 100a.

[0083] Specifically, the middle frame 10 includes a base plate 11 and a spacer 12. The spacer 12 is connected to the base plate 11 and protrudes toward the battery cover 20. The main board 70 and the battery 50 are located on opposite sides of the spacer 12.

[0084] More specifically, the partition 12 divides the receiving cavity R into a first receiving cavity R1 and a second receiving cavity R2 that are spatially connected. The motherboard 70 and the camera module 40 are located in the first receiving cavity R1. The battery 50 and the sub-board 60 are located in the second receiving cavity R2. The second receiving cavity R2 is also referred to as the battery compartment below.

[0085] The flexible circuit board 80 includes a first connecting portion 81, a second connecting portion 82, and a bending portion 83. The first connecting portion 81 is connected to the first surface S1 of the main board 70 and is located between the first surface S1 of the main board 70 and the base plate 11. The second connecting portion 82 is connected to the sub-board 60. The bending portion 83 is connected between the first connecting portion 81 and the second connecting portion 82, and is at least partially located between the side surface S3 of the main board 70 and the spacer portion 12.

[0086] The bending portion 83 includes a first portion 831, a second portion 832, and a third portion 833 connected sequentially. The first portion 831 is connected to the first connecting portion 81 and is located between the first surface S1 of the main board 70 and the base plate 11. The second portion 832 is located between the side surface S3 of the main board 70 and the spacer portion 12. The third portion 833 is connected to the second connecting portion 82, extends in the negative direction of the second direction Y to the spacer portion 12 on the side opposite to the base plate 11, and is at least partially located on the side of the spacer portion 12 opposite to the base plate 11.

[0087] Therefore, by setting the middle spacing 12 in the middle frame 10 and setting the various parts of the bending portion 83 in the flexible circuit board 80, the layout of the flexible circuit board 80 in the receiving cavity R is more orderly, which enhances the support and stability of the flexible circuit board 80, reduces the bending deformation of the flexible circuit board 80 due to space constraints during use, and improves the reliability of the electronic device 100a.

[0088] The electronic device 100a also includes a first connector 71 and a second connector 62. The first connector 71 is disposed on a first surface S1 of the main board 70, and a first connecting portion 81 is connected to the main board 70 through the first connector 71. The second connector 62 is disposed on the surface of the sub-board 60 near the battery cover 20, and a second connecting portion 82 is connected to the sub-board 60 through the second connector 62. The first connector 71 and the second connector 62 can be, but are not limited to, BTB connectors.

[0089] Therefore, the main board 70 is connected to the flexible circuit board 80 through the first connector 71, and the sub-board 60 is connected to the flexible circuit board 80 through the second connector 62, which simplifies the electrical connection between the flexible circuit board 80 and the main board 70 and the sub-board 60, and improves the stability and maintainability of the connection.

[0090] During the assembly process, the flexible circuit board 80 is first fastened to the first connector 71 on the first surface S1 of the main board 70, forming a whole with the main board 70. Then, the flexible circuit board 80 and the main board 70 are placed together in the receiving cavity R of the middle frame 10. By folding the flexible circuit board 80 back, the flexible circuit board 80 is made to cross the battery 50 and be fastened to the sub-board 60 through the second connector 62.

[0091] The flexible circuit board 80 also includes a first reinforcing plate 84 and a second reinforcing plate 85. The first reinforcing plate 84 is located on the side of the first connecting portion 81 opposite to the first connecting portion 81. The second reinforcing plate 85 is located on the side of the second connecting portion 82 opposite to the second connector 62. Thus, the arrangement of the first reinforcing plate 84 and the second reinforcing plate 85 enhances the structural strength of the flexible circuit board 80 at the connection points, preventing the flexible circuit board 80 from breaking due to the fragility of the connection points under high stress conditions, thereby improving the reliability of the electronic device 100a.

[0092] It should be noted that since the flexible circuit board 80 is very long along the second direction Y above the battery 50, if the flexible circuit board 80 is only fixed to the main board 70 and the sub-board 60 at both ends through the first connector 71 and the second connector 62 respectively, then the flexible circuit board 80 lacks shape restrictions.

[0093] At the folded position where the flexible circuit board 80 crosses the battery 50 and is fastened to the first surface S1 of the main board 70, the flexible circuit board 80 cannot form an ideal 90° bend and is prone to rebounding and opening up, forming the shape shown by the dotted line in Figure 4. As shown by the dotted line in Figure 4, a relatively large R-angle is formed near the battery cover 20, and the flexible circuit board 80 arches up against the middle frame 10 and the battery cover 20, causing the battery cover 20 to be molded. In addition, in scenarios such as micro-motion soft pressure testing, clicking the battery cover 20 will cause the flexible circuit to move towards the battery 50 side, causing the flexible circuit to rub back and forth with the sharp corner at the interval 12, which poses a risk of being worn by the structural sharp corner or broken by micro-motion fatigue.

[0094] Based on this, in some embodiments, the electronic device reinforces the bending portion 83 of the flexible circuit board 80 to limit the shape change of the bending portion 83 of the flexible circuit board 80, prevent the flexible circuit board 80 from bending or rebounding during use, thereby avoiding the flexible circuit board 80 from arching up and hitting the battery cover 20, reducing the risk of molded battery cover 20 and broken wires on the flexible circuit board 80, and improving the durability of the flexible circuit board 80 and the reliability of the electronic device.

[0095] Figure 5 is a partial cross-sectional schematic diagram of the electronic device 100b according to the second embodiment of this application. Components such as the display screen and battery cover are omitted in Figure 5. As shown in Figure 5, the electronic device 100b also includes a reinforcing member 90. The reinforcing member 90 is attached to the bent portion 83 of the flexible circuit board 80.

[0096] Specifically, the flexible circuit board 80 includes a third surface 80c and a fourth surface 80d. The fourth surface 80d is disposed opposite to the third surface 80c and faces the battery cover, or rather, away from the base plate 11 of the middle frame 10. The reinforcing member 90 is bonded to the fourth surface 80d of the bent portion 83.

[0097] By setting a reinforcing member 90 attached to the bending portion 83, it is beneficial to limit the shape change of the bending portion 83 of the flexible circuit board 80, prevent the flexible circuit board 80 from bending or rebounding during use, thereby avoiding the flexible circuit board 80 from arching up and hitting the battery cover 20, reducing the risk of molded battery cover 20 and broken wires on the flexible circuit board 80, and improving the durability of the flexible circuit board 80 and the overall reliability of the electronic device 100b.

[0098] Specifically, the reinforcing member 90 includes a first reinforcing part 91, a second reinforcing part 92, and a third reinforcing part 93 connected in sequence. The first reinforcing part 91 is attached to the fourth surface 80d of the third part 833. Along the thickness direction of the electronic device 100b, the projection of the first reinforcing part 91 on the base plate 11 overlaps with the projection of the spacer 12 on the base plate 11.

[0099] The second reinforcing part 92 is attached to the fourth surface 80d of the second part 832, and the third reinforcing part 93 is attached to the fourth surface 80d of the first part 831.

[0100] The second reinforcing part 92 is approximately perpendicular to the first reinforcing part 91 and the third reinforcing part 93. The first reinforcing part 91 and the third reinforcing part 93 extend from opposite ends of the second reinforcing part 92 in opposite directions, so that the reinforcing member 90 is approximately Z-shaped with two 90° bends (or approximately 90° bends).

[0101] Therefore, by providing a three-dimensional reinforcing member 90 to the bending portion 83 of the flexible circuit board 80, the flexible circuit board 80 bends 90° at the position where it climbs the battery compartment (or at the position of the gap 12 between the main board 70 and the middle frame 10), following the shape of the reinforcing member 90, thereby achieving shape control of the flexible circuit board 80. Moreover, by providing a first reinforcing member 91, a second reinforcing member 92, and a third reinforcing member 93 in the reinforcing member 90, corresponding to different parts of the bending portion 83 respectively, multi-segment bending control of the flexible circuit board 80 is achieved.

[0102] Furthermore, this design not only ensures that the flexible circuit board 80 can maintain the required approximately 90° shape at the bend, but also further enhances the stability of the flexible circuit board 80 through the multiple supports of the reinforcing member 90, preventing the flexible circuit board 80 from coming off or breaking during assembly and use, and improving the firmness of the connection between the flexible circuit board 80 and the motherboard 70, as well as the durability and reliability of the electronic device 100b in actual use.

[0103] Furthermore, considering the machinability of the reinforcing member 90, the length of the reinforcing member 90 toward the second receiving cavity R2 (or the length of the first reinforcing part 91) is not less than 0.2 mm.

[0104] In addition, since the reinforcing member 90 and the battery 50 need to maintain a certain safe distance, the bending length of the reinforcing member 90 cannot be too long. Therefore, the length of the first reinforcing part 91 is generally the sum of the thickness of the flexible circuit board 80, the width of the gap between the flexible circuit board 80 and the spacer 12, and the thickness of the spacer 12 of the middle frame 10.

[0105] That is, along the thickness direction of the electronic device 100b, the projection of the first reinforcing part 91 on the base plate 11 does not overlap with the projection of the battery 50 on the base plate 11. This avoids physical interference between the reinforcing part 90 and the battery 50, thereby helping to reduce the risk of potential mechanical wear and structural conflicts.

[0106] In some embodiments, the length of the first reinforcing portion 91 is greater than or equal to 0.2 mm and less than or equal to 0.5 mm (e.g., 0.2 mm to 0.3 mm, 0.3 mm to 0.4 mm, 0.4 mm to 0.5 mm).

[0107] Figure 6 is a partial cross-sectional schematic diagram of an electronic device 100c according to the third embodiment of this application. The battery cover and display screen of the electronic device 100c are omitted in Figure 6. As shown in Figure 6, unlike electronic device 100b, in electronic device 100c, the reinforcing member 90 is bonded to the third surface 80c of the bent portion 83.

[0108] Therefore, depending on the specific structure of the flexible circuit board 80, the internal layout of the electronic device, and the manufacturing process, the reinforcing member 90 can be bonded to the third surface 80c or the fourth surface 80d of the bent portion 83. This improves the flexibility of electronic device design while meeting the shape control and reliability requirements of the flexible circuit board 80.

[0109] In some embodiments, the layout spacing between the first connector 71 and the battery 50 is too small, resulting in a short third reinforcing portion 93 in the bending section of the reinforcing member 90, making it difficult to process a Z-shaped bend with two consecutive bends. Therefore, based on the electronic device 100b in FIG. 5 and the electronic device 100c in FIG. 6, the third reinforcing portion 93 of the reinforcing member 90 can be omitted.

[0110] Specifically, Figure 7 is a partial cross-sectional schematic diagram of the electronic device 100d according to the fourth embodiment of this application. As shown in Figure 7, unlike the electronic device 100b in Figure 5, in the electronic device 100d, the reinforcing member 90 can be composed of a first reinforcing part 91 and a second reinforcing part 92, and the whole is generally L-shaped.

[0111] Figure 8 is a partial cross-sectional schematic diagram of an electronic device 100e according to the fifth embodiment of this application. As shown in Figure 8, unlike the electronic device 100c in Figure 6, in the electronic device 100e, the reinforcing member 90 can be composed of a first reinforcing part 91 and a second reinforcing part 92, and the whole is generally L-shaped.

[0112] Figure 9 is a partial cross-sectional schematic diagram of an electronic device 100f according to a sixth embodiment of this application. As shown in Figure 9, unlike the electronic device 100d in Figure 7, in the electronic device 100f, the reinforcing member 90 further includes a fourth reinforcing part 94. The fourth reinforcing part 94 is connected to the second reinforcing part 92, extends in a direction away from the first reinforcing part 91, and is connected to one side of the second surface S2 of the motherboard 70.

[0113] Specifically, a clip A is attached to the second surface S2 of the motherboard 70, and the fourth reinforcing part 94 engages with the clip A on the second surface S2 of the motherboard 70. Thus, the fourth reinforcing part 94 provides additional support for the flexible circuit board 80 on the second surface S2 of the motherboard 70, further enhancing the structural stability of the flexible circuit board 80. Through multi-directional reinforcement design, the support force of the flexible circuit board 80 in different directions is ensured, preventing deformation or breakage of the flexible circuit board 80 due to multi-directional stress, and improving the damage resistance of the electronic device 100f in complex operating environments.

[0114] Furthermore, due to the arrangement of the fourth reinforcing part 94 and the snap-fit ​​A, the length of the second reinforcing part 92 along the third direction Z can be shortened while meeting the support requirements for the flexible circuit board 80.

[0115] Figure 10(a) is a schematic diagram of the structure of the flexible circuit board 80 and the reinforcing member 90 in Figure 9. As shown in Figure 10(a), the first reinforcing part 91 and the two fourth reinforcing parts 94 are all bent from the same end of the second reinforcing part 92. Along the first direction X, the size of the second reinforcing part 92 is larger than the size of the second part 832 of the flexible circuit board 80. The first reinforcing part 91 and the second reinforcing part 92 are connected at approximately the middle position along the first direction X, and are bent toward the negative direction of the second direction Y to fit onto the third part 833 of the flexible circuit board 80. Along the first direction X, the width of the first reinforcing part 91 is approximately equal to the width of the third part 833 of the flexible circuit board 80 to increase the reinforcing area of ​​the third part 833. The two fourth reinforcing parts 94 are spaced apart on opposite sides of the first reinforcing part 91 along the first direction X, and are both bent toward the positive direction of the second direction Y for engaging with the snap-fit ​​A shown in Figure 9.

[0116] Therefore, by extending two fourth reinforcing portions 94 beyond the second portion 832 of the flexible circuit board 80 to form a small wing-shaped cantilever, and bending towards one side of the motherboard 70 to provide a support position, while a buckle A is provided on the second surface S2 of the motherboard 70 to limit and fix the two fourth reinforcing portions 94 extending from the reinforcing member 90, it is beneficial to ensure a stable connection between the reinforcing member 90 and the second surface S2 of the motherboard 70.

[0117] In some embodiments, the latch A on the second surface S2 of the motherboard 70 can be formed by surface mount technology (SMT) of the latch A hardware, but is not limited thereto.

[0118] Figure 10(b) is a planar schematic diagram of the connector T of the related technology and the flexible circuit board 80, reinforcing member 90, and snap-fit ​​A in Figure 9. The dimensions of the connector T in the related technology are shown in the dashed rectangle. As can be seen from Figure 10(b), the dimensions of each snap-fit ​​A in the first direction X and the second direction Y are much smaller than the dimensions of the connector T. Therefore, although the snap-fit ​​A in this embodiment occupies some area of ​​the second surface S2 of the motherboard 70, it still saves space on the second surface S2 of the motherboard 70 compared to the method in the related technology where the flexible circuit board is connected to the second surface of the motherboard via the connector T.

[0119] It should be noted that in applications where the flexible circuit board 80 needs to carry a large current (such as when the flexible circuit board 80 is a main FPC), the conductive layer (such as the copper layer) in the flexible circuit board 80 is usually thickened by electroplating, making the flexible circuit board 80 relatively rigid and with a large rebound force. Even with the design shown in Figure 9, after the reinforcing part 90 is assembled with the flexible circuit board 80, the fourth reinforcing part 94 may still be dislodged from the clip A due to the rebound at the lower bend of the flexible circuit board 80 (i.e., the connection between the first part 831 and the second part 832).

[0120] In this case, it is necessary to ensure the distance between the first connector 71 and the side surface S3 of the motherboard 70. The reinforcing member 90 is set in a three-fold bend shape. The two sections of the flexible circuit board 80 are made to bend at approximately 90° by the reinforcing member 90. This ensures that the flexible circuit board 80 is in a Z-shape with two sections bent at approximately 90° before it is shipped and assembled to the motherboard 70. This prevents the reinforcing member 90 from coming off the clip A on the second surface S2 of the motherboard 70 due to the rebound at the bend position.

[0121] Figure 11 is a partial cross-sectional schematic diagram of an electronic device 100g according to the seventh embodiment of this application. As shown in Figure 11, in the electronic device 100g, the reinforcing member 90 includes a first reinforcing part 91, a second reinforcing part 92, a third reinforcing part 93, and a fourth reinforcing part 94. The first reinforcing part 91 and the fourth reinforcing part 94 are both connected to the same end of the second reinforcing part 92 and are bent in opposite directions. The first reinforcing part 91 and the second reinforcing part 92 are both attached to the fourth surface 80d of the flexible circuit board 80. The third reinforcing part 93 and the fourth reinforcing part 94 are respectively connected to the opposite ends of the second reinforcing part 92 and are both bent toward the main board 70.

[0122] Clips A are attached to both the first surface S1 and the second surface S2 of the motherboard 70. A third reinforcing part 93 engages with clip A on the first surface S1 of the motherboard 70. A fourth reinforcing part 94 engages with clip A on the second surface S2 of the motherboard 70. Clips A on both the first surface S1 and the second surface S2 of the motherboard 70 can be formed using SMT surface mount clip A hardware, but are not limited to this. For ease of description, clip A on the first surface S1 of the motherboard 70 is referred to as the first clip A1, and clip A on the second surface S2 of the motherboard 70 is referred to as the second clip A2.

[0123] Therefore, compared to electronic device 100f, in electronic device 100g, the bent portion 83 of the flexible circuit board 80 can not only maintain a Z-shape with two approximately 90° bends under the action of the reinforcing member 90, but also the reinforcing member 90 is engaged with the first latch A1 on the first surface S1 of the motherboard 70 through the third reinforcing portion 93, which helps to prevent the reinforcing member 90 from coming out of the latch A on the second surface S2 of the motherboard 70 due to the rebound at the connection between the first portion 831 and the second portion 832.

[0124] Figure 12 is a partial cross-sectional schematic diagram of the electronic device 100h according to the eighth embodiment of this application. As shown in Figure 12, unlike the electronic device 100g in Figure 11, in the electronic device 100h, the third reinforcing part 93 of the reinforcing member 90 is bonded to the first surface S1 of the motherboard 70. In other embodiments, the fourth reinforcing part 94 can be bonded to the second surface S2 of the motherboard 70. Thus, the third reinforcing part 93 can be bonded or snapped to the first surface S1 of the motherboard 70, and the fourth reinforcing part 94 can be bonded or snapped to the second surface S2 of the motherboard 70, to ensure a firm fixation between the reinforcing member 90 and the motherboard 70, preventing the flexible circuit board 80 from coming off the reinforcing member 90 due to rebound force or external force after assembly. In addition, the third reinforcing part 93 and the first surface S1 of the motherboard 70, and the fourth reinforcing part 94 and the second surface S2 of the motherboard 70, can be connected in various ways, further improving the flexibility and adaptability of the assembly between the flexible circuit board 80 and the motherboard 70.

[0125] Figure 13 is a partial cross-sectional schematic diagram of an electronic device 100i according to the ninth embodiment of this application. As shown in Figure 13, in the electronic device 100i, no latches are arranged on the first surface S1 or the second surface S2 of the motherboard 70. The spacer portion 12 of the middle frame 10 has a slot K facing the motherboard 70.

[0126] The reinforcing member 90 includes a first reinforcing part 91, a second reinforcing part 92, and a fifth reinforcing part 95. The first reinforcing part 91 is connected to one end of the second reinforcing part 92, extends toward the side opposite to the main board 70, and is attached to the third portion 833 of the bent portion 83 of the flexible circuit board 80. The second reinforcing part 92 is attached to the portion of the second portion 832 of the bent portion 83 of the flexible circuit board 80 near the first portion 831. The fifth reinforcing part 95 is connected to the end of the second reinforcing part 92 opposite to the first reinforcing part 91, extends toward the spacer portion 12, and is held in the slot K of the spacer portion 12.

[0127] Therefore, the fifth reinforcing part 95 of the reinforcing member 90, through its engagement with the slot K of the spacer part 12, provides additional fixation and support for the flexible circuit board 80, further restricting the displacement of the flexible circuit board 80 in multiple directions, improving the stability of the connection of the flexible circuit board 80, and ensuring the shock resistance performance of the electronic device 100i under extreme conditions such as drops.

[0128] Figure 14 is a schematic diagram of the flexible circuit board 80 and the reinforcing member 90 in Figure 13. As shown in Figure 14, along the first direction X, the width of the first reinforcing part 91 is approximately equal to the width of the third part 833 of the flexible circuit board 80, so as to increase the reinforcing area of ​​the third part 833. Along the first direction X, two fifth reinforcing parts 95 are spaced apart on opposite sides of the second reinforcing part 92. Each fifth reinforcing part 95 avoids the second part 832 of the bent part 83 of the flexible circuit board 80 and is bent towards the negative direction of the second direction Y, so as to be fixed with the slot K on the middle frame 10.

[0129] Referring to Figures 13 and 14, during the assembly process, the assembly consisting of the flexible circuit board 80 and the reinforcing member 90 is first engaged with the first connector 71 on the first surface S1 of the main board 70, and then the fifth reinforcing part 95 of the reinforcing member 90 is obliquely inserted into the slot K of the spacer part 12 of the middle frame 10.

[0130] Figure 15 is a partial cross-sectional schematic diagram of an electronic device 100j according to the tenth embodiment of this application. As shown in Figure 15, unlike the electronic device 100i in Figure 13, the electronic device 100j not only has a slot K on the spacer portion 12 of the middle frame 10, but also a latch A on the second surface S2 of the motherboard 70. The reinforcing member 90 includes a first reinforcing part 91, a second reinforcing part 92, a fourth reinforcing part 94, and a fifth reinforcing part 95. The fourth reinforcing part 94 engages with the latch A on the second surface S2 of the motherboard 70, and the fifth reinforcing part 95 engages with the slot K on the spacer portion 12. Thus, along the second direction Y, the opposite sides of the reinforcing member 90 engage with the motherboard 70 and the middle frame 10 respectively, which helps to enhance the positional fixation of the flexible circuit board 80 and prevent it from coming off in extreme environments such as roller drops.

[0131] Figure 16 is a structural schematic diagram of the flexible circuit board 80 and the reinforcing member 90 in Figure 15. As shown in Figure 16, there is one fourth reinforcing part 94 and one fifth reinforcing part 95. Along the first direction X, the fourth reinforcing part 94 and the fifth reinforcing part 95 are spaced apart on opposite sides of the second reinforcing part 92. The fifth reinforcing part 95 avoids the second portion 832 of the bent portion 83 of the flexible circuit board 80 and is bent in the negative direction of the second direction Y to be fixed with the slot K on the middle frame 10 shown in Figure 15. The fourth reinforcing part 94 is bent in the positive direction of the second direction Y to be engaged with the second snap-fit ​​A2 shown in Figure 15. In addition, the fourth reinforcing part 94 and the fifth reinforcing part 95 are respectively located on opposite sides of the second portion 832 of the bent portion 83 of the flexible circuit board 80 along the first direction X.

[0132] In other embodiments, the number of the fourth reinforcing part 94 and the number of the fifth reinforcing part 95 are not limited to those described above, and can be designed to take into account both the fixing requirements of the flexible circuit board 80 and the ease of assembly.

[0133] Figure 17 is a partial cross-sectional schematic diagram of the electronic device 100k according to the eleventh embodiment of this application. As shown in Figure 17, unlike the electronic device 100h in Figure 12, considering the layout of the motherboard 70, the electronic device 100k has a nut B attached to the second surface S2 of the motherboard 70 at a position where the flexible circuit board 80 is bent at approximately 90°. The fourth reinforcing part 94 of the reinforcing member 90 can be locked to the nut B on the second surface S2 of the motherboard 70 by a screw C.

[0134] Figure 18 is a partial cross-sectional schematic diagram of the electronic device 100l according to the twelfth embodiment of this application. As shown in Figure 18, unlike the electronic device 100k in Figure 17, since the second surface S2 of the motherboard 70 is fastened to the fourth reinforcing part 94 by screw C, compared with the snap-fit ​​method between the motherboard 70 and the fourth reinforcing part 94, the problem of the flexible circuit board 80 coming off the snap A in extreme scenarios such as roller drop can be effectively avoided, thus having better medium- and long-term reliability. Therefore, in the electronic device 100l, the third reinforcing part 93 of the reinforcing member 90 can be omitted, and the length of the second reinforcing part 92 can be appropriately shortened.

[0135] Figure 19 is a partial cross-sectional schematic diagram of the electronic device 100m according to the thirteenth embodiment of this application. As shown in Figure 19, unlike the electronic device 100k in Figure 17, in the electronic device 100m, a nut B is attached to the first surface S1 of the motherboard 70, and the third reinforcing part 93 is locked to the nut B at the first surface S1 of the motherboard 70 by a screw C.

[0136] For ease of description, the screws C on the first surface S1 and the second surface S2 of the motherboard 70 are referred to as the first screw C1 and the second screw C2, respectively, and the nuts B on the first surface S1 and the second surface S2 of the motherboard 70 are referred to as the first nut B1 and the second nut B2, respectively. The first nut B1 and the second nut B2 can be mounted on the first surface S1 and the second surface S2 of the motherboard 70 by SMT, but are not limited thereto.

[0137] In other embodiments, a first screw C1 may be provided on the first surface S1 of the motherboard 70, and the third reinforcing part 93 may be locked to the first screw C1 by a first nut B1. Alternatively, a second screw C2 may be provided on the second surface S2 of the motherboard 70, and the fourth reinforcing part 94 may be locked to the second screw C2 by a second nut B2.

[0138] Therefore, when the reinforcing member 90 has a third reinforcing part 93, the third reinforcing part 93 can be fixed to the first surface S1 of the main board 70 using one of several connection methods, such as adhesive bonding, screw fastening, or snap-fit ​​connection. Similarly, when the reinforcing member 90 has a fourth reinforcing part 94, the fourth reinforcing part 94 can be fixed to the second surface S2 of the main board 70 using one of several connection methods, such as adhesive bonding, screw fastening, or snap-fit ​​connection. This not only helps to ensure a firm fixation between the reinforcing member 90 and the main board 70, preventing the flexible circuit board 80 from detaching from the reinforcing member 90 after assembly due to rebound force or external force, but also improves the flexibility and adaptability of the assembly between the flexible circuit board 80 and the main board 70.

[0139] It should be noted that Figures 9 to 19 illustrate the application of the reinforcing member 90 to the fourth surface 80d of the flexible circuit board 80. In other embodiments, the reinforcing member 90 may be bonded to the third surface 80c of the flexible circuit board 80. The reinforcing member 90 includes a first reinforcing part 91 bonded to the third portion 833 of the bent portion 83 and a second reinforcing part 92 bonded to the second portion 832 of the bent portion 83. Furthermore, depending on the requirements for fixing the bending shape of the flexible circuit board 80, the reinforcing member 90 may also include any one, any two combinations, or all three of the third reinforcing part 93, the fourth reinforcing part 94, and the fifth reinforcing part 95.

[0140] For example, the third reinforcing part 93 can be attached to the first portion 831 of the bent portion 83 of the flexible circuit board 80. The fourth reinforcing part 94 can avoid the second portion 832 of the bent portion 83 of the flexible circuit board 80 from being bonded, snapped, or secured to the second surface S2 of the main board 70 by screws C. The fifth reinforcing part 95 is directly fixed to the slot K of the spacer portion 12 of the middle frame 10.

[0141] Figure 20 is a structural schematic diagram of the flexible circuit board 80 and the reinforcing member 90 in the electronic device 100n according to the fourteenth embodiment of this application. As shown in Figure 20, in the electronic device 100n, the reinforcing member 90 is attached to the third surface 80c of the flexible circuit board 80. The fourth reinforcing part 94 avoids the second part 832 of the bent part 83 of the flexible circuit board 80 and has a screw hole H for connection with a nut on the motherboard by screws.

[0142] Figure 21 is a schematic diagram of the structure of an electronic device 100o according to the fifteenth embodiment of this application. As shown in Figure 21, unlike the electronic device 100a in Figure 4, in the electronic device 100o, the third portion 833 of the bent portion 83 of the flexible circuit board 80 extends between the spacer portion 12 of the middle frame 10 and the battery cover 20, and then bends in the negative direction of the third direction Z to the spacer portion 12 of the middle frame 10 and the battery 50. After the third portion 833 of the bent portion 83 of the flexible circuit board 80 extends in the negative direction of the third direction Z between the spacer portion 12 of the middle frame 10 and the battery 50, it bends in the negative direction of the second direction Y to the spacer portion 11 of the middle frame 10 and the battery 50, and then extends in the negative direction of the second direction Y between the spacer portion 12 of the middle frame 10 and the battery 50 to connect with the sub-plate 60.

[0143] Furthermore, in the electronic device 100o, the second connector 62 is provided on the surface of the sub-board 60 facing away from the battery cover 20, and the second connection portion 85 of the flexible circuit board 80 is connected to the surface of the sub-board 60 facing away from the battery cover 20 through the second connector 62, thereby saving the layout space of the surface of the sub-board 60 facing the battery cover 20.

[0144] Understandably, any of the reinforcing members 90 described above can be provided for the bent portion 83 of the flexible circuit board 80 in the electronic device 100o, and will not be described again.

[0145] In other embodiments, after the flexible circuit board 80 is connected to the first surface S1 of the main board 70, it can extend along the side of the battery 50 to connect with the sub-board 60, and does not overlap with the battery 50 in the third direction Z, thereby reducing the thickness of the electronic device.

[0146] In summary, in the electronic device of this application embodiment, by connecting the flexible circuit board to the first surface of the motherboard facing away from the battery cover, the spatial conflict between the second surface of the motherboard facing the battery cover and the camera module is resolved, making full use of the space on both sides of the motherboard. Furthermore, the reinforcement members constrain the free shape of the bent portion of the flexible circuit board, preventing it from hitting the battery cover and causing a dead bend or fretting fatigue breakage, thus achieving high reliability of the flexible circuit board.

[0147] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. An electronic device, comprising: include: The middle frame has a receiving cavity; A battery cover is provided on the receiving cavity; The battery, sub-board, and main board are all located within the receiving cavity, with the sub-board and main board spaced apart. Along the length of the electronic device, the battery is located between the sub-board and the main board. The main board includes a first surface, a second surface, and a side surface, with the second surface opposite to the first surface and facing the battery cover. The side surface connects the first surface and the second surface and faces the battery; A camera module is disposed on the second surface of the motherboard; as well as A flexible circuit board, at least partially located within the receiving cavity, is connected to the first surface of the motherboard and extends along the thickness direction of the electronic device between the side surface of the motherboard and the battery, and is bent to connect with the sub-board.

2. The electronic device of claim 1, wherein, The flexible circuit board is bent between the battery and the battery cover, and extends along the length of the electronic device to connect with the sub-board.

3. The electronic device of claim 2, wherein, The middle frame includes a base plate and a spacer portion; the spacer portion is connected to the base plate and protrudes toward the battery cover; the main board and the battery are located on opposite sides of the spacer portion; the flexible circuit board includes a first connecting portion, a second connecting portion, and a bending portion; the first connecting portion is connected to the first surface of the main board and is located between the first surface of the main board and the base plate; the second connecting portion is connected to the sub-board; the bending portion is connected between the first connecting portion and the second connecting portion and is at least partially located between the side surface of the main board and the spacer portion.

4. The electronic device of claim 3, wherein, The electronic device also includes a reinforcing member, which is attached to the bent portion.

5. The electronic device of claim 4, wherein, The bending portion includes a first part, a second part, and a third part connected in sequence; the first part is connected to the first connecting part and is located between the first surface of the motherboard and the base plate; the second part is located between the side surface of the motherboard and the spacer; the third part is connected to the second connecting part and is at least partially located on the side of the spacer away from the base plate. The reinforcing member includes a first reinforcing part and a second reinforcing part; the first reinforcing part is attached to the third part, and along the thickness direction of the electronic device, the projection of the first reinforcing part on the base plate overlaps with the projection of the spacer on the base plate; The second reinforcing part is connected to the first reinforcing part and is attached to the second part.

6. The electronic device of claim 5, wherein, Along the thickness direction of the electronic device, the projection of the first reinforcing part on the base plate does not overlap with the projection of the battery on the base plate.

7. The electronic device of claim 5 or 6, wherein, The reinforcing member further includes a third reinforcing part, which is connected to the second reinforcing part and is attached to the first part.

8. The electronic device of claim 7, wherein, The third reinforcing part is attached to the first surface of the motherboard; or, the first surface of the motherboard is fitted with a first nut, and the third reinforcing part is locked to the first nut by a first screw; or, the first surface of the motherboard is provided with a first screw, and the third reinforcing part is locked to the first screw; or, the first surface of the motherboard is fitted with a first buckle, and the third reinforcing part is engaged with the first buckle.

9. The electronic device according to any one of claims 5 to 8, characterized in that, The reinforcing member further includes a fourth reinforcing part, which is connected to the second reinforcing part, extends in a direction away from the first reinforcing part, and is connected to the second surface.

10. The electronic device of claim 9, wherein, The fourth reinforcing part is attached to the second surface of the motherboard; or, the second surface of the motherboard is fitted with a second nut, and the fourth reinforcing part is locked to the second nut by a second screw; or, the second surface of the motherboard is provided with a second screw, and the fourth reinforcing part is locked to the second screw; or, the second surface of the motherboard is fitted with a second buckle, and the fourth reinforcing part is engaged with the second buckle.

11. The electronic device according to any one of claims 5 to 10, wherein The spacer portion has a slot facing the motherboard; the reinforcing member further includes a fifth reinforcing portion, which is connected to the second reinforcing portion, avoids the second portion, extends toward the spacer portion, and is held in the slot.

12. The electronic device according to any one of claims 4 to 11, wherein The flexible circuit board includes a third surface and a fourth surface, the fourth surface being disposed opposite to the third surface and facing the battery cover; the reinforcing member is attached to the third surface of the bent portion, or the reinforcing member is attached to the fourth surface of the bent portion.

13. The electronic device of any of claims 3-12, wherein, The electronic device further includes a first connector and a second connector. The first connector is disposed on the first surface of the motherboard, and the first connection portion is connected to the motherboard through the first connector. The second connector is disposed on the sub-board, and the second connection portion is connected to the sub-board through the second connector.

14. The electronic device according to claim 13, characterized in that, The flexible circuit board further includes a first reinforcing plate and a second reinforcing plate, wherein the first reinforcing plate is located on the side of the first connecting portion away from the first connecting portion, and the second reinforcing plate is located on the side of the second connecting portion away from the second connector.

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