Terminal block, method for manufacturing terminal block, and injection molded body

Abstract

A terminal block (1) has an assembly (2) and a resin part (3), and can be attached to a case (9) accommodating an electronic device. The assembly (2) has a bus bar (21), a mounting body (22), a chip-type component (23), an injection molded body (24), and a covering material (26). The covering material (26) covers the chip-type component (23) and a soldered portion in a housing part (240). In the assembly (2), an arm part (25b) of a first rod-like body (251) is electrically joined to the bus bar (21), and an arm part (25b) of a second rod-like body (252) is electrically joined to the mounting body (22).

Description

Terminal block, method for manufacturing terminal block, and injection molded body Cross-reference to related applications

[0001] This application is based on Japanese Patent Application No. 2024-225919 filed in Japan on December 23, 2024, the contents of which are incorporated herein by reference.

[0002] The present disclosure relates to a terminal block, a method for manufacturing a terminal block, and an injection molded body.

[0003] Conventionally, a terminal block in which a chip-type component composed of a bus bar and a chip capacitor is inserted into an injection mold and resin is injection-molded is known. Such a terminal block is used, for example, by being attached to a case that houses an electronic device such as a DC / DC converter.

[0004] As such a terminal block and its manufacturing method, for example, the technique described in Patent Document 1 is known. In Patent Document 1, after a chip capacitor 29 is mounted on a connection portion 25 of a lead frame 21 fixed to a conductive bar 11 by soldering or the like, a part of a first fixing portion 23 and a second fixing portion 27 of the lead frame 21, the chip capacitor 29, and the connection portion 25 are molded with a resin material to form a primary molded portion 33 (the reference numerals are those of Patent Document 1).

[0005] Japanese Unexamined Patent Application Publication No. 2016-72504

[0006] However, the technique of Patent Document 1 has the following problem. That is, in Patent Document 1, after the chip capacitor 29 is soldered, the primary molded portion 33 is molded. When the primary molded portion 33 is molded, the injection mold is corroded by flux residues caused by the flux contained in the solder or the flux applied during soldering. When such corrosion of the injection mold occurs, the corroded portion is transferred to the surface of the formed resin portion, and the appearance of the resin portion of the terminal block deteriorates.

[0007] This disclosure has been made in view of the above issues, and aims to provide a terminal block that can suppress corrosion of injection molds due to flux residue caused by soldering and suppress deterioration of the appearance of the resin part, a method for manufacturing a terminal block, and an injection molded article suitable for use in a terminal block.

[0008] The terminal block, the method for manufacturing the terminal block, and the injection-molded article relating to this disclosure are as follows:

[0009] The first disclosure is a terminal block that can be attached to a case housing electronic equipment, comprising an assembly and a resin part covering a part of the assembly, wherein the assembly comprises a busbar with one end inserted into a through hole formed in the wall of the case, a mounting body made of a metal material and arranged in a direction intersecting the busbar, a chip-type component consisting of one or more chip capacitors, an injection-molded body disposed on the busbar and electrically connected to the busbar and electrically connected to the mounting body, and having a housing for housing the chip-type component, and a covering material, wherein the resin part covers at least a part of the busbar, the mounting body, and the injection-molded body, wherein the injection-molded body is formed in a box shape having a frame-shaped frame portion and a bottom portion that closes one opening of the frame portion, and the box interior space enclosed by the frame portion, the other opening of the frame portion and the bottom portion is the housing for housing the chip-type component, The assembly comprises a first and second conductive rod-shaped body, each integrally having an exposed portion embedded in the frame portion of the frame and partially exposed inside the housing portion, and an arm portion extending outward from the frame portion, and arranged spaced apart from each other, wherein one end of the chip-type component is soldered to the exposed portion of the first rod-shaped body, the arm portion of the first rod-shaped body is electrically connected to the busbar, the other end of the chip-type component is soldered to the exposed portion of the second rod-shaped body, the arm portion of the second rod-shaped body is electrically connected to the mounting body, and the chip-type component and the soldered portion are covered by the covering material, thus forming a terminal block.

[0010] The second disclosure is a terminal block in which, in the first disclosure, the covering material is formed from a covering material that has hardened after being filled inside the housing portion, and is made of a material that is softer than the resin that forms the frame.

[0011] The third disclosure is that, in the first or second disclosure, the chip-type component housed in the housing is a terminal block having a portion in which two or more chip capacitors are arranged in series.

[0012] The fourth disclosure is a terminal block in which, in any one of the first to third disclosures, the injection-molded body has a partition wall portion erected from the bottom within the housing portion, and the chip-type component housed in the housing portion has a portion in which the chip capacitors are arranged in parallel with the partition wall portion in between.

[0013] The fifth disclosure is that in any one of the first to fourth disclosures, the first rod-shaped body and the second rod-shaped body are both terminal blocks having corners connecting the exposed portion and the arm portion.

[0014] The sixth disclosure is a terminal block in which, in any one of the first to fifth disclosures, the injection-molded body has a projection protruding from the outer surface of the bottom, the busbar has a projection insertion portion consisting of a hole or recess into which the projection of the injection-molded body can be inserted, and the assembly is a terminal block in which the projection of the injection-molded body is inserted into the projection insertion portion of the busbar.

[0015] The seventh disclosure is a method for manufacturing a terminal block that can be attached to a case housing electronic equipment, comprising an assembly and a resin part covering a part of the assembly, comprising a preparation step of preparing the assembly and an injection molding step of setting the assembly in an injection mold and performing injection molding, wherein the assembly comprises a busbar with one end inserted into a through hole formed in the wall of the case, a mounting body made of a metal material and arranged in a direction intersecting the busbar, a chip-type component consisting of one or more chip capacitors, an injection-molded body disposed on the busbar and electrically connected to the busbar and electrically connected to the mounting body and having a housing part for housing the chip-type component, and a covering material, wherein the injection-molded body is formed in a box shape having a frame-shaped frame part and a bottom part that closes one opening of the frame part, and the box interior space enclosed by the frame part, the other opening of the frame part and the bottom part is the housing part for housing the chip-type component, The assembly comprises a conductive first rod-shaped body and a conductive second rod-shaped body, each integrally provided with an exposed portion embedded in the frame portion of the frame and partially exposed inside the housing portion, and an arm portion extending outward from the frame, and arranged spaced apart from each other, wherein one end of the chip-type component is soldered to the exposed portion of the first rod-shaped body, and the arm portion of the first rod-shaped body is electrically connected to the busbar, the other end of the chip-type component is soldered to the exposed portion of the second rod-shaped body, and the arm portion of the second rod-shaped body is electrically connected to the mounting body, and the chip-type component and the soldered portion are covered with the covering material, and the injection molding process is a process of setting the assembly in an injection mold, forming the resin portion by injection molding so as to cover at least a part of the busbar, the mounting body, and the injection molded body, and integrating the resin portion and the assembly, thus providing a method for manufacturing a terminal block.

[0016] The eighth disclosure is a method for manufacturing a terminal block, wherein, in the seventh disclosure, the covering material is formed from a covering material that has hardened after being filled inside the housing portion, and is made of a material that is softer than the resin that forms the frame.

[0017] The ninth disclosure is a method for manufacturing a terminal block in which, in the seventh or eighth disclosure, the chip-type component housed in the housing portion has a portion in which two or more chip capacitors are arranged in series.

[0018] The tenth disclosure is a method for manufacturing a terminal block, wherein, in any one of the seventh to ninth disclosures, the injection-molded body has a partition wall portion erected from the bottom within the housing portion, and the chip-type component housed in the housing portion has a portion in which the chip capacitors are arranged in parallel with the partition wall portion in between.

[0019] The eleventh disclosure is a method for manufacturing a terminal block, wherein in any one of the seventh to tenth disclosures, the preparation step includes: a housing step of housing the chip-type component in the housing of the injection-molded body; a soldering step of soldering one end of the chip-type component to the exposed portion of the first rod-shaped body and the other end of the chip-type component to the exposed portion of the second rod-shaped body; a covering material forming step of filling the inside of the housing with a covering material and hardening it to form the covering material that covers the chip-type component and the soldered portion; and an assembly step of electrically joining the arm portion of the first rod-shaped body to the busbar and electrically joining the arm portion of the second rod-shaped body to the mounting body to form the assembly.

[0020] The twelfth disclosure is a method for manufacturing a terminal block, wherein, in any one of the seventh to eleventh disclosures, the injection-molded body has a projection that protrudes from the outer surface of the bottom, the busbar has a projection insertion portion consisting of a hole or recess into which the projection of the injection-molded body can be inserted, and the assembly has the projection of the injection-molded body inserted into the projection insertion portion of the busbar.

[0021] The 13th disclosure is an injection-molded body used in at least one of a terminal block that can be attached to a case housing electronic equipment, and a method for manufacturing the terminal block, the injection-molded body being formed in a box shape having a frame portion formed in a frame shape and a bottom portion that closes one opening of the frame portion, the box interior space enclosed by the frame portion, the other opening of the frame portion and the bottom portion being a housing portion for housing one or more chip-type components consisting of chip capacitors, and the injection-molded body having an exposed portion embedded in the frame portion of the frame and partially exposed inside the housing portion, and an arm portion extending outward from the frame portion, and comprising a conductive first rod-shaped body and a conductive second rod-shaped body arranged spaced apart from each other.

[0022] In the terminal block of the first disclosure, a chip-type component consisting of one or more chip capacitors housed in the housing of an injection-molded body is soldered to a first rod-shaped body and a second rod-shaped body of the injection-molded body, the first rod-shaped body is electrically connected to a busbar, and the second rod-shaped body is electrically connected to a mounting body. Therefore, when the terminal block of the first disclosure is mounted on a case housing electronic equipment, even if electrical noise from inside the case is transmitted to the busbar, the electrical noise can be removed by the chip capacitor. Furthermore, in this terminal block of the first disclosure, when the assembly is set in an injection mold and the resin part of the terminal block is molded during the manufacturing of the terminal block, the coating material covering the chip-type component and the soldered parts makes it difficult for flux residue caused by soldering to flow out, thus suppressing corrosion of the injection mold and preventing deterioration of the surface condition of the resin part. In addition, the frequency of maintenance work on the injection mold can also be reduced. Therefore, according to the terminal block of the first disclosure, it is possible to provide a terminal block that can suppress corrosion of the injection molding die due to flux residue caused by soldering and suppress deterioration of the appearance of the resin part. Furthermore, according to the terminal block of the first disclosure, since the chip type component is covered with a covering material, it is also possible to prevent the chip capacitor housed in the housing part of the injection molded body from being destroyed or displaced due to heat or external stress when the resin part of the terminal block is injection molded.

[0023] In addition to the effects of the terminal block of the first disclosure, the second disclosure's terminal block is further formed from a covering material which is hardened from a covering material filled inside the housing and is made of a material softer than the resin forming the frame. As a result, the covering material can absorb stress and vibrations applied to the chip capacitor, resulting in a terminal block with excellent reliability in electrical noise suppression.

[0024] In addition to the effects of the terminal blocks of the first or second disclosure, the terminal block of the third disclosure further has a portion in which two or more chip capacitors are arranged in series, so even if one chip capacitor fails, it will not short-circuit and will not fail, thus providing redundancy and improving safety.

[0025] The terminal block of the fourth disclosure, in addition to the effects of any one of the terminal blocks of the first to third disclosures, further has a portion in which the chip-type component housed in the housing has chip capacitors arranged in parallel with a partition wall formed in the housing of the injection-molded body in between. Therefore, the partition wall makes it easy to align the chip capacitors, and the portion in which the chip capacitors are arranged in parallel increases the overall capacitance of the chip-type component, thereby removing electrical noise.

[0026] The terminal block of the fifth disclosure, in addition to the effects of any one of the terminal blocks of the first to fourth disclosures, further has a first rod-shaped body and a second rod-shaped body, both of which have corners connecting the exposed portion and the arm portion. By adjusting the angle of the corner, it is possible to form the arm portion in a direction that facilitates joining with busbars and mounting bodies, thereby facilitating the manufacture of the assembly during the production of the terminal block.

[0027] The terminal block of the sixth disclosure, in addition to the effects of any one of the terminal blocks of the first to fifth disclosures, further allows for the formation of an assembly by inserting the protrusions of the injection-molded body into the protrusion insertion parts of the busbar during the manufacturing of the terminal block. This makes it possible to easily position and fix the injection-molded body relative to the busbar.

[0028] Since the terminal block manufacturing method of the seventh disclosure has the above-described configuration, it is relatively easy to solder the chip-type component, which consists of one or more chip capacitors housed in the housing portion of the injection-molded body, to the first rod-shaped body and the second rod-shaped body of the injection-molded body, to electrically connect the first rod-shaped body to the busbar, to electrically connect the second rod-shaped body to the mounting body, and to prepare the assembly. Furthermore, in the terminal block manufacturing method of the seventh disclosure, the chip-type component and the soldered parts can be relatively easily covered with a covering material when preparing the assembly.

[0029] Therefore, in the terminal block manufacturing method of the seventh disclosure, when the assembly is set in the injection mold and the resin part of the terminal block is molded, the coating material makes it difficult for flux residue caused by soldering to flow out, suppressing corrosion of the injection mold and suppressing deterioration of the surface condition of the resin part. Thus, the terminal block manufacturing method of the seventh disclosure provides a terminal block manufacturing method that can suppress corrosion of the injection mold due to flux residue caused by soldering and suppress deterioration of the appearance of the resin part.

[0030] In addition to the effects of the terminal block manufacturing method of the seventh disclosure, the eighth disclosure further provides a terminal block with superior reliability in electrical noise suppression because the covering material is formed from a material that is softer than the resin forming the frame, and is formed from a covering material that has hardened after being filled inside the housing.

[0031] The method for manufacturing a terminal block according to the ninth disclosure provides, in addition to the effects of the methods for manufacturing a terminal block according to the seventh or eighth disclosure, a terminal block that can be obtained in which the chip-type components housed in the housing have a portion in which two or more chip capacitors are arranged in series, so that even if one chip capacitor fails, a short-circuit failure will not occur, and redundancy can be provided by the remaining chip capacitors, thereby improving safety.

[0032] The method for manufacturing a terminal block according to the tenth disclosure provides, in addition to the effects of any one of the methods for manufacturing a terminal block according to the seventh to ninth disclosures, a further benefit of the method for manufacturing a terminal block according to the tenth disclosure. Since the chip-type component housed in the housing has a portion in which chip capacitors are arranged in parallel with a partition wall formed in the housing of the injection-molded body in between, the partition wall allows for easy alignment of the chip capacitors, and the portion in which the chip capacitors are arranged in parallel increases the overall capacitor capacitance of the chip-type component, thereby enabling the production of a terminal block that can remove electrical noise.

[0033] The method for manufacturing a terminal block according to the eleventh disclosure, in addition to the effects of any one of the methods for manufacturing a terminal block according to the seventh to tenth disclosures, further has the above-described configuration in the preparation step, so that the preparation of an assembly having the above-described configuration can be easily realized. In particular, since the covering material can be formed by curing the covering material filled in a box-shaped frame during the preparation of the assembly, the chip-type components and soldered parts can be covered with the covering material more easily.

[0034] The method for manufacturing a terminal block according to the twelfth disclosure has the advantages of any one of the methods for manufacturing a terminal block according to the seventh to eleventh disclosures, plus, in the preparation step, the protrusions of the injection-molded body can be inserted into the protrusion insertion parts of the busbar to form an assembly, so that the injection-molded body can be easily positioned and fixed with respect to the busbar.

[0035] The injection-molded article of the 13th disclosure has the configuration described above. Therefore, the injection-molded article of the 13th disclosure can be provided which an injection-molded article can be suitably used in at least one of the terminal blocks of any one of the first to sixth disclosures and the manufacturing method of any one of the terminal blocks of any one of the seventh to twelfth disclosures.

[0036] Figure 1 is an exploded perspective view showing the terminal block according to Embodiment 1 and the terminal block manufactured by the manufacturing method of the terminal block according to Embodiment 1, removed from the case. Figure 2 is a perspective view of the terminal block according to Embodiment 1 and the terminal block manufactured by the manufacturing method of the terminal block according to Embodiment 1. Figure 3 is a perspective view of the assembly of the terminal block according to Embodiment 1 and the assembly prepared in the preparation step of the manufacturing method of the terminal block according to Embodiment 1 (however, the covering material is not shown). Figure 4 is a perspective view of the injection molded body provided by the assembly of the terminal block according to Embodiment 1 and the injection molded body provided by the assembly prepared in the preparation step of the manufacturing method of the terminal block according to Embodiment 1. Figure 5 is a perspective view showing the first rod-shaped body and the second rod-shaped body provided by the injection molded body shown in Figure 4. Figure 6 is a perspective view showing the injection molded body shown in Figure 4 with a chip-type component mounted in the housing and before the covering material is formed. Figure 7 is a perspective view showing the injection molded body with a chip-type component mounted in the housing and a covering material formed thereon. Figure 8 is a perspective view showing a modified example of the injection molded body with a chip-type component mounted in the housing and a covering material formed thereon. Figure 9 is a perspective view showing a modified injection molded body included in an assembly of a terminal block according to Embodiment 1, and an injection molded body included in an assembly prepared in the preparation step of the manufacturing method for the terminal block according to Embodiment 1. Figure 10 is a perspective view of an assembly of a terminal block according to Embodiment 2, and an assembly prepared in the preparation step of the manufacturing method for the terminal block according to Embodiment 2 (covering material is not shown). Figure 11 is a perspective view showing the insertion of the protrusion of the injection molded body into the protrusion insertion part of the busbar when assembling the assembly shown in Figure 10 (covering material is not shown). Figure 12 is a perspective view showing the electrical connection of the mounting body after the injection molded body has been positioned and fixed to the busbar as in Figure 11 (covering material is not shown). Figure 13 is a perspective view of the injection molded body shown in Figure 11, viewed from the back. Figure 14 is a perspective view of the assembly shown in Figure 10, viewed from the back.

[0037] A terminal block, a method for manufacturing a terminal block, and an injection-molded product according to one embodiment will be described in detail with reference to Figures 1 to 14.

[0038] 1. The terminal block, the method for manufacturing the terminal block, and the injection-molded body according to Embodiment 1 will be described in detail with reference to Figures 1 to 9.

[0039] (Outline of the terminal block) The terminal block 1 according to this embodiment can be attached to a case 9 housing electronic equipment (not shown), as illustrated in Figures 1 and 2.

[0040] The terminal block 1 has an assembly 2 and a resin part 3 that covers a part of the assembly 2. The assembly 2 has a bus bar 21, a mounting body 22, a chip-type component 23 consisting of one or more chip capacitors 231, an injection-molded body 24, and a covering material 26 (see Figures 3 to 9, etc.). The detailed configuration of the assembly 2 will be described later, but in Figures 1 and 2, a part of the bus bar 21, a part of the mounting body 22, the chip-type component 23, the injection-molded body 24, and the covering material 26 of the assembly 2 are covered by the resin part 3, so these parts are not shown in Figures 1 and 2.

[0041] The resin part 3 can be formed from, for example, a highly thermally conductive resin. Specific examples of highly thermally conductive resins include PPS (polyphenylene sulfide) resin, PA (polyamide) resin, PBT (polybutylene terephthalate) resin, and PC (polycarbonate) resin. The terminal block 1, with the resin part 3 covering the busbar 21, allows for efficient heat dissipation from the busbar 21, through which a large current flows, to the outside air, while also ensuring insulation.

[0042] The terminal block 1 is configured to be mountable to the case 9. Here, we will explain using the example of mounting the terminal block 1 to the case 9 via mounting holes 221 located on both sides of the busbar 21 in the resin part 3. In Figure 2, the direction of arrow A indicates the direction in which the terminal block 1 is mounted to the case 9.

[0043] Case 9 may also be referred to as an electrical component case, and electronic devices such as a DC / DC converter are accommodated therein. Case 9 can be formed of a metal material such as aluminum (aluminum includes aluminum alloys, the same shall apply hereinafter and will not be repeated). The shape of case 9 is not particularly limited as long as it can accommodate the electronic device and can attach the terminal block 1.

[0044] In FIG. 1, case 9 having a case bottom surface portion (not shown), a wall portion 91 erected on the outer periphery of the case bottom surface portion, and a lid portion 92 provided opposite to the case bottom surface portion and closing a case opening (not shown) formed at one end of the wall portion 91 is illustrated. A through hole 911 penetrating the wall portion 91 is formed in the wall portion 91. One end portion of the bus bar 21 of the terminal block 1 is inserted into this through hole 911. Therefore, this through hole 911 can also be referred to as an insertion hole for the bus bar. In the present embodiment, one through hole 911 is formed in the wall portion 91, and bolt insertion holes 912 are formed on both sides of the through hole 911, respectively.

[0045] As illustrated in FIG. 2, on both sides of the bus bar 21 fixed to the resin portion 3 of the terminal block 1, mounting holes 221 of the mounting bodies 22 embedded in the resin portion 3 are provided, and a part of the outer peripheral edge portion 222 of the mounting holes 221 is exposed. In the terminal block 1, each mounting hole 221 is formed at a position corresponding to the position of each bolt insertion hole 912 of the case 9. In the present embodiment, the case where the number of the mounting holes 221 in the terminal block 1 is two in accordance with the number of the bolt insertion holes 912 of the case 9 is illustrated, but it is not limited thereto, and the number of the mounting holes 221 can be changed to any number corresponding to the number of the bolt insertion holes 912 of the case 9. Further, the position of the mounting holes 221 in the terminal block 1 is not limited to the above position and can be changed to any position corresponding to the position of the bolt insertion holes 912 of the case 9.

[0046] When attaching the terminal block 1 to the case 9, align the two mounting holes 221 in the terminal block 1 with the two bolt insertion holes 912 in the case 9, insert two bolts 93 into the respective mounting holes 221 and bolt insertion holes 912, and tighten with nuts or the like. Note that a thread groove may be formed on the inner peripheral surface of the bolt insertion hole 912 of the case 9, and the bolt 93 may be tightened into this bolt insertion hole 912. Thereby, the terminal block 1 is fixed to the case 9 with one end of the bus bar 21 of the terminal block 1 inserted into the through hole 911 of the case 9. Also, each bolt 93 inserted into each bolt insertion hole 912 of the case 9 is in electrical contact with the outer peripheral edge 222 of each mounting hole 221. Note that one end of the bus bar 21 inserted into the through hole 911 of the case 9 can be electrically connected to an electronic device by bolts, nuts, screws, etc. inside the case 9.

[0047] After the terminal block 1 is attached to the case 9, if electrical noise in the case 9 is transmitted to the bus bar 21, the electrical noise can escape through the bus bar 21 → the first rod-shaped body 251 (described later) of the injection molded body 24 → the chip capacitor 231 of the injection molded body 24 → the second rod-shaped body 252 (described later) of the injection molded body 24 → the mounting hole 221 of the mounting body 22 → the bolt 93 → the ground (not shown) of the case 9.

[0048] (Detailed Configuration of Terminal Block) As described above, the terminal block 1 has an assembly 2 including an injection molded body 24, and a part of this assembly 2 is covered by a resin part 3. Hereinafter, the detailed configuration of the injection molded body 24, the detailed configuration of the assembly 2, and the covering by the resin part 3 will be described in order.

[0049] (1) Detailed Configuration of Injection Molded Body The injection molded body 24 includes a housing part 240 for housing chip-type components 23, as exemplified in FIG. 4 and the like. Specifically, the injection molded body 24 has a frame body 241, a first rod-shaped body 251, and a second rod-shaped body 252. The injection molded body 24 is formed by insert molding with the first rod-shaped body 251 and the second rod-shaped body 252 inserted.

[0050] The frame 241 is formed in a box shape, having a frame portion 241a formed in a frame shape and a bottom portion 241b that closes one of the openings of the frame portion 241a. In Figure 4 and other figures, an example is shown in which the frame portion 241a is formed in a square shape, but the shape of the frame portion 241a is not particularly limited. In the injection molded body 24, the box-like space enclosed by the frame portion 241a, the other opening 241c of the frame portion 241a, and the bottom portion 241b is used as a storage portion 240 for housing the chip-type component 23.

[0051] As illustrated in Figure 4, the injection-molded body 24 may have partition walls 241d erected from the bottom 241b within the housing section 240, for the purpose of improving positioning when housing the chip capacitors 231 that constitute the chip-type component 23. In Figure 4, an example is shown in which two partition walls 241d spaced apart from each other are formed within the housing section 240, allowing the chip capacitors 231 to be mounted in three locations. The number of partition walls 241d is not particularly limited and can be appropriately selected according to the number of chip capacitors 231, etc.

[0052] The frame 241 is made of resin. The resin forming the frame 241 has insulating properties. Examples of resins that form the frame 241 include PPS resin, PA resin, PBT resin, PC resin, PEEK resin, and CCP (liquid crystal polymer). When the resin part 3 is injection molded, it is preferable that the frame 241 be made of a material compatible with the resin forming the resin part 3 (hereinafter sometimes referred to as a compatible material) from the viewpoint of improving the bonding between the resin part 3 and the frame 241 and improving the unity between the resin part 3 and the frame 241. Examples of compatible materials include PPS resin, PA resin, PBT resin, PC resin, PEEK resin, and CCP (liquid crystal polymer). Particularly preferable, it is desirable that the frame 241 be made of the same type (including the same) of material as the resin forming the resin part 3 from the viewpoint of high compatibility, excellent bonding between the resin part 3 and the frame 241, and excellent unity between the resin part 3 and the frame 241.

[0053] Both the first rod-shaped body 251 and the second rod-shaped body 252 are electrically conductive and have an exposed portion 25a and an arm portion 25b. Examples of materials that make up the first rod-shaped body 251 and the second rod-shaped body 252 include metal materials such as copper (including copper alloys, hereafter omitted) and tin-plated copper, from the viewpoint of having low electrical resistance.

[0054] The exposed portion 25a is embedded in the frame portion 241a of the frame body 241 and partially exposed inside the housing portion 240. In Figure 4 and other figures, an example is shown in which the surface of the exposed portion 25a that is positioned on the housing portion 240 side is exposed inside the housing portion 240. On the other hand, the arm portion 25b is integrally connected to the exposed portion 25a and extends outward from the frame portion 241a. In this embodiment, both the first rod-shaped body 251 and the second rod-shaped body 252 have a corner portion 25c that connects the exposed portion 25a and the arm portion 25b, as illustrated in Figure 5. In other words, the exposed portion 25a and the arm portion 25b are connected via the corner portion 25c.

[0055] The first rod-shaped body 251 and the second rod-shaped body 252 are formed by bending a rectangular rod-shaped member made of the above-mentioned metal material into an L-shape, and thus exhibit an overall L-shape. In Figure 5, the case in which the angle θ of the corner portion 25c, which is the angle between the exposed portion 25a and the arm portion 25b, is a right angle is illustrated, but the angle θ can be appropriately adjusted in a direction that makes it easy to join the arm portion 25b with the bus bar 21 or the mounting body 22. Furthermore, the angle θ in the first rod-shaped body 251 and the second rod-shaped body 252 may be the same or different.

[0056] In the injection-molded body 24, the first rod-shaped body 251 and the second rod-shaped body 252 are arranged spaced apart from each other, as illustrated in Figure 4. Figure 4 shows an example in which the first rod-shaped body 251 and the second rod-shaped body 252 are spaced apart from each other, with the exposed portion 25a of the first rod-shaped body 251 embedded in a predetermined side of the rectangular frame portion 241a so as to be partially exposed inside the housing portion 240, and the exposed portion 25a of the second rod-shaped body 252 embedded in a side of the rectangular frame portion 241a opposite to the predetermined side so as to be partially exposed inside the housing portion 240.

[0057] In this example, as illustrated in Figure 4, the arms 25b of the first rod-shaped body 251 and the arms 25b of the second rod-shaped body 252 are configured to protrude from diagonally opposite portions of the rectangular frame portion 241a. However, the configuration is not limited to this, and the protruding positions can be appropriately changed considering the mounting positions with respect to the busbar 21 and the mounting body 22. For example, as illustrated in Figure 9, in the injection-molded body 24, the arms 25b of the first rod-shaped body 251 can also protrude in the same direction as the arms 25b of the second rod-shaped body 252.

[0058] (2) Detailed Configuration of the Assembly Assembly 2 includes a busbar 21, a mounting body 22, a chip-type component 23, an injection-molded body 24, and a covering material 26, as illustrated in Figures 3 to 9. Note that in Figure 3, the covering material 26 is omitted from the illustration for the purpose of clearly showing the chip-type component 23. In other words, the assembly 2 illustrated in Figure 3 actually has the covering material 26 provided on the injection-molded body 24, as illustrated in Figure 7 or Figure 8.

[0059] The busbar 21, as illustrated in Figure 3, is typically formed from a metal material. Examples of metal materials used to form the busbar 21 include copper, stainless steel, and other highly conductive metal plates. One end of the busbar 21 is inserted into a through hole 911 formed in the wall portion 91 of the case 9. Therefore, one end of the busbar 21 is formed to protrude from the resin portion 3. The other end of the busbar 21 is also formed to protrude from the resin portion 3. In Figure 3, an example is shown in which the busbar 21 is formed in a flat shape, but the shape of the busbar 21 is not particularly limited. The busbar 21 may have one or more bent portions formed by bending a metal plate that has been formed into a predetermined shape by, for example, press working.

[0060] In this embodiment, the busbar 21 may have a protrusion 211. Here, the protrusion 211 protrudes from one side edge of the busbar 21. The protrusion 211 can be formed, for example, by punching out a busbar shape including a portion for forming the protrusion 211 from a metal plate and then bending the portion. Alternatively, the protrusion 211 can be formed by joining a separate protrusion 211 to one side edge of the busbar 21 by welding or the like. The former method makes it easier to form the protrusion 211 than joining a separate protrusion 211 to the busbar 21. The position from which the protrusion 211 protrudes from the busbar 21 can be appropriately changed considering the position of the arm portion 25b of the first rod-shaped body 251.

[0061] The mounting body 22, as illustrated in Figure 3 and other figures, is formed from a metal material. Examples of metal materials used to form the mounting body 22 include copper, stainless steel, and other highly conductive metal plates. The mounting body 22 is positioned in a direction that intersects with the bus bar 21. In this embodiment, as illustrated in Figure 3 and other figures, the mounting body 22 is positioned in a direction perpendicular to the bus bar 21. The term "perpendicular" as used above includes not only cases where the mounting body 22 and the bus bar 21 intersect at a right angle, but also cases where the mounting body 22 and the bus bar 21 intersect at an angle ranging from -15° to +15°.

[0062] In this embodiment, the mounting body 22 has the aforementioned mounting holes 221 formed at both ends. In addition, a busbar arrangement portion 223 is formed in the longitudinal center of the mounting body 22 where the busbar 21 is arranged. In other words, in the mounting body 22, one mounting hole 221 is formed in one region and one in the other region, with the busbar arrangement portion 223 in between. Here, the busbar arrangement portion 223 is formed by cutting out a portion of the longitudinal side edge of the mounting body 22.

[0063] Although Figure 3 shows an example in which the mounting body 22 is formed in a flat shape, the shape of the mounting body 22 is not particularly limited. The mounting body 22 may have one or more bent portions formed by bending a metal plate that has been formed into a predetermined shape by, for example, press working.

[0064] The chip component 23 consists of one or more chip capacitors 231. In this embodiment, the chip component 23 is composed of multiple chip capacitors 231. Figures 3 and 6 show an example in which the chip component 23 is composed of six chip capacitors 231, but the number of chip capacitors 231 constituting the chip component 23 is not particularly limited and can be changed as appropriate considering the specifications of the terminal block 1, etc. Specifically, examples of chip capacitors 231 include multilayer ceramic chip capacitors. This type of chip capacitor 231 usually has a pair of electrodes.

[0065] The assembly 2 has an injection-molded body 24 having the configuration described above. In the assembly 2, a chip-type component 23 is housed in the housing section 240 of the injection-molded body 24. When the chip-type component 23 is composed of a plurality of chip capacitors 231, the chip-type component 23 housed in the housing section 240 may have a portion in which two or more chip capacitors 231 are arranged in series, or it may have a portion in which the chip capacitors 231 are arranged in parallel. In the former case, even if one chip capacitor 231 fails, a short-circuit failure will not occur, and redundancy can be provided by the remaining chip capacitors 231, making it possible to obtain a terminal block 1 that can improve safety. In the latter case, a terminal block 1 can be obtained that can remove electrical noise by increasing the total capacitor capacity of the chip-type component 23.

[0066] In this embodiment, specifically as illustrated in Figures 3 and 6, the chip-type components 23 housed in the housing section 240 are arranged with chip capacitors 231 in parallel, separated by a partition wall 241d. In each partitioned area formed by the partition wall 241d (here, an example is given of three partitioned areas), two or more chip capacitors are arranged in series (here, an example is given of two chip capacitors arranged in series).

[0067] In assembly 2, the chip-type component 23 housed in the housing section 240 has one end soldered to the exposed portion 25a of the first rod-shaped body 251 and the other end soldered to the exposed portion 25a of the second rod-shaped body 252. Specifically in this embodiment, as illustrated in Figures 3 and 6, the electrodes of adjacent chip capacitors 231 arranged in series are soldered to each other, one electrode of the chip capacitor 231 located on the side of the exposed portion 25a of the first rod-shaped body 251 is soldered to the exposed portion 25a of the first rod-shaped body 251, and the other electrode of the chip capacitor 231 located on the side of the exposed portion 25a of the second rod-shaped body 252 is soldered to the exposed portion 25a of the second rod-shaped body 252. In other words, assembly 2 has soldered portions within the housing section 240 of the injection-molded body 24. Note that in the drawings, the soldered portions are marked with dots.

[0068] In assembly 2, the injection-molded body 24, in which the chip-type component 23 is housed in the housing section 240, is positioned on the busbar 21 and electrically joined to the busbar 21, as well as electrically joined to the mounting body 22. Specifically, the arm portion 25b of the first rod-shaped body 251 in the injection-molded body 24 is electrically joined to the busbar 21, and the arm portion 25b of the second rod-shaped body 252 is electrically joined to the mounting body 22. More specifically, as illustrated in Figure 3, the arm portion 25b of the first rod-shaped body 251 in the injection-molded body 24 is electrically joined to a protrusion 211 formed on the busbar 21, and the arm portion 25b of the second rod-shaped body 252 is electrically joined to the surface (plate surface) of the mounting body 22. Examples of the joining methods include various types of welding, such as spot welding. In this example, the injection-molded body 24 is placed on the surface of the busbar 21 and electrically joined to the busbar 21, that is, the injection-molded body 24 is electrically joined to the busbar 21 while in contact with the surface of the busbar 21. However, the injection-molded body 24 may also be electrically joined to the busbar 21 while not in contact with the surface of the busbar 21.

[0069] In the assembly 2, the covering material 26 can be formed, for example, by hardening a covering material filled inside the housing 240, as illustrated in Figure 7. From the viewpoint of ensuring more reliable absorption of stress and vibrations applied to the chip capacitor 231 constituting the chip-type component 23 by the covering material 26, it is preferable that the covering material 26 is made of a material softer than the resin forming the frame 241. As for the material forming the covering material 26, from the viewpoint of heat resistance and other factors, for example, silicone rubber material, urethane rubber material, acrylic resin material, etc. are preferred. Specifically, the covering material before hardening is preferably liquid (including paste or slurry, hereafter omitted) and remains softer than the material forming the frame 241 even after hardening. The covering material may also be an ultraviolet-curable material.

[0070] In the assembly 2, the covering material 26 covers the chip-type component 23 and the soldered portion, as illustrated in Figure 7. The soldered portion in this embodiment is as described above. The covering material 26 only needs to cover the chip-type component 23 and the soldered portion, and may also cover a part of the upper end of the frame portion 241a of the frame 241. Alternatively, the covering material 26 may be formed from a material having the same hardness as the frame 241 as a lid that is placed over the housing portion 240, as illustrated in Figure 8, and may cover the chip-type component 23 and the soldered portion.

[0071] (3) In the resin-covered terminal block 1, the resin part 3 covers at least a portion of each of the bus bar 21, the mounting body 22, and the injection-molded body 24. In this embodiment, as illustrated in Figures 1 and 2, an example is shown in which a portion of the bus bar 21, a portion of the mounting body 22, the chip-type component 23, the injection-molded body 24, and the covering material 26 are covered by the resin part 3.

[0072] In other words, in the terminal block 1, both ends of the busbar 21 are exposed to the outside of the resin part 3, while the rest of the busbar 21 is embedded within the resin part 3. Also, the mounting holes 221 and outer peripheral edge 222 of the mounting body 22 are exposed to the outside of the resin part 3, while the rest of the mounting body 22 is embedded within the resin part 3. Furthermore, the entire injection-molded body 24, which includes a covering material 26 that covers the chip-type component 23 in the housing part 240 and the soldered portion, is embedded within the resin part 3. In this case, the unity between the assembly 2 and the resin part 3 can be increased. Although not shown in the figures, for example, the resin part 3 may be formed so that a part of the covering material 26 is exposed. In this case, the amount of material used to form the resin part 3 can be reduced, which can contribute to miniaturization of the terminal block 1 and reduction of material costs.

[0073] (Method for Manufacturing Terminal Blocks) The method for manufacturing terminal blocks according to this embodiment (hereinafter sometimes referred to as "this manufacturing method") is a method for manufacturing terminal blocks 1 that can be attached to a case 9 housing electronic equipment, and which have an assembly 2 and a resin part 3 that covers a part of the assembly 2 as described above. This manufacturing method has a preparation step and an injection molding step. Each step will be described below.

[0074] <Preparation Process> In this manufacturing method, the preparation process is the process of preparing the assembly 2. The assembly 2 may be prepared by procuring an already completed assembly 2, or it may be manufactured by assembling the individual components that make up the assembly 2 within the preparation process.

[0075] An example of the procedure for manufacturing the assembly 2 described above will be explained using Figures 3 to 7.

[0076] When the assembly 2 is manufactured in the preparation process, the preparation process can consist of a housing process, a soldering process, a covering material formation process, and an assembly process. Each process will be described in order below.

[0077] -Housing Process- The housing process involves housing the chip-type component 23 in the housing section 240 of the injection-molded body 24. Here, as illustrated in Figure 6 and other examples, a plurality of chip capacitors 231 constituting the chip-type component 23 are arranged in predetermined positions.

[0078] - Soldering Process - The soldering process is a process of soldering the chip-type component 23 housed in the housing section 240 of the injection-molded body 24, as illustrated in Figure 6 and other figures. Specifically, in this process, one end of the chip-type component 23 is soldered to the exposed portion 25a of the first rod-shaped body 251, and the other end of the chip-type component 23 is soldered to the exposed portion 25a of the second rod-shaped body 252.

[0079] More specifically, in this embodiment, as illustrated in Figure 6 and the like, the chip-type component 23 housed in the housing section 240 of the injection-molded body 24 is composed of a plurality of chip capacitors 231, and has a portion in which two or more chip capacitors 231 are arranged in series. Therefore, in order to electrically connect the chip capacitors 231 arranged in series with the first rod-shaped body 251 and the second rod-shaped body 252, the electrodes of adjacent chip capacitors 231 arranged in series are soldered together, one electrode of the chip capacitor 231 located on the side of the exposed portion 25a of the first rod-shaped body 251 is soldered to the exposed portion 25a of the first rod-shaped body 251, and the other electrode of the chip capacitor 231 located on the side of the exposed portion 25a of the second rod-shaped body 252 is soldered to the exposed portion 25a of the second rod-shaped body 252.

[0080] -Coating Material Formation Process- The coating material formation process is a process in which a coating material is filled into the interior of the housing portion 240 and hardened to form a coating material 26 that covers the chip-type component 23 and the soldered portion, as illustrated in Figures 6 and 7.

[0081] Various known methods can be used to fill the interior of the housing 240 with the coating material. Furthermore, the method for curing the coating material can be appropriately selected depending on the type of coating material used. For example, if the coating material is heat-curable, the injection-molded body 24, with the coating material filled inside the housing 240, can be placed in a high-temperature furnace to cure the coating material. Alternatively, if the coating material is an ultraviolet-curable material, ultraviolet light can be irradiated onto the coating material to cure it relatively easily.

[0082] - Assembly Process - The assembly process, as illustrated in Figure 3, involves electrically connecting the arm portion 25b of the first rod-shaped body 251 to the busbar 21 and electrically connecting the arm portion 25b of the second rod-shaped body 252 to the mounting body 22 to form the assembly 2.

[0083] In the example shown in Figure 3, specifically, the arm portion 25b of the first rod-shaped body 251 and the protruding portion 211 of the busbar 21 are joined by welding. On the other hand, the arm portion 25b of the second rod-shaped body 252 and the surface (plate surface) of the mounting body 22 are joined by welding. As a result, the injection-molded body 24 on which the chip-type component 23 is mounted and the busbar 21 are electrically joined, and the injection-molded body 24 on which the chip-type component 23 is mounted and the mounting body 22 are electrically joined.

[0084] Furthermore, as illustrated in Figure 9, if the injection-molded body 24 is configured such that the arm portion 25b of the first rod-shaped body 251 protrudes in the same direction as the arm portion 25b of the second rod-shaped body 252, the protruding portion 211 of the busbar 21 can be joined to the arm portion 25b of the first rod-shaped body 251 and the protruding portion 211 of the busbar 21 by making the protruding portion 211 of the busbar 21 protrude from the side edge of the busbar 21 opposite to the side shown in Figure 3.

[0085] This allows for the creation of an assembly 2, as illustrated in Figure 3, during the preparation process.

[0086] <Injection Molding Process> In this manufacturing method, the injection molding process is the process of setting the assembly 2 in an injection mold (not shown) and performing injection molding.

[0087] In the injection molding process, the assembly 2 shown in Figure 3 is set inside the injection mold. Then, by performing injection molding so as to cover at least a portion of each of the busbar 21, mounting body 22, and injection molded body 24, a resin part 3 is formed, and the resin part 3 and the assembly 2 are integrated. This allows the positional relationship of the busbar 21, mounting body 22, and injection molded body 24 to be fixed in the assembly 2. In addition, the resin part 3 can be formed into a desired shape by exposing a portion of the outer peripheral edge 222 of the mounting hole 221. After that, the terminal block 1 can be obtained by demolding.

[0088] In the injection molding process, the resin part 3 may be formed such that the entire covering material 26 is embedded within the resin part 3, as illustrated in Figures 1 and 2, or, although not shown, the resin part 3 may be formed so that a part of the covering material 26 is exposed. In the former case, the unity between the covering material 26 and the resin part 3 can be increased. In the latter case, the amount of material used to form the resin part 3 can be reduced, which can contribute to miniaturization of the terminal block 1 and reduction of material costs. In the latter case, for example, the resin part 3 can be formed such that at least a part of the upper surface 261 of the covering material 26 is exposed to the outside, and the rest of the covering material 26 is embedded within the resin part 3.

[0089] Furthermore, the above-mentioned descriptions of terminal blocks, terminal block manufacturing methods, and injection-molded products may be referenced from each other as needed, and each component described in each description may be applied individually or in any combination as necessary.

[0090] In the terminal block 1 according to the above embodiment, a chip-type component 23 consisting of one or more chip capacitors 231 housed in a housing portion 240 of an injection-molded body 24 is soldered to a first rod-shaped body 251 and a second rod-shaped body 252 of the injection-molded body 24, the first rod-shaped body 251 is electrically connected to a busbar 21, and the second rod-shaped body 252 is electrically connected to a mounting body 22. Therefore, when the terminal block 1 according to the above embodiment is attached to a case 9 housing electronic equipment, even if electrical noise from inside the case 9 is transmitted to the busbar 21, the electrical noise can be removed by the chip capacitors 231. Furthermore, in the terminal block 1 according to this embodiment, when the assembly 2 is set in the injection mold to mold the resin part 3 of the terminal block 1 during manufacturing, the coating material 26 covering the chip-type component 23 and the soldered portion makes it difficult for flux residue caused by soldering to leak out, thereby suppressing corrosion of the injection mold and preventing deterioration of the surface condition of the resin part 3. It is also possible to reduce the frequency of maintenance work on the injection mold. Therefore, according to the terminal block 1 according to this embodiment, it is possible to provide a terminal block 1 that can suppress corrosion of the injection mold due to flux residue caused by soldering and suppress deterioration of the appearance of the resin part 3. In addition, according to the terminal block 1 according to this embodiment, since the chip-type component 23 is covered with the coating material 26, it is also possible to prevent the chip capacitor 231 housed in the housing part 240 of the injection molded body 24 from being destroyed or misaligned due to heat or external stress when the resin part 3 is injection molded during the manufacturing of the terminal block 1. Furthermore, if the covering material 26 is formed from a material that is softer than the resin material forming the frame 241, and is formed from the hardened covering material filled inside the housing 240, it is possible to prevent vibration and stress from being directly applied to the chip capacitor 231 that constitutes the chip-type component 23, and a terminal block 1 with excellent reliability in electrical noise suppression can be obtained. Specifically, the stress applied to the chip capacitor 231 includes the injection pressure when the resin part 3 is injection molded, the stress when the resin part 3 shrinks after injection molding, and the stress when the bolt 93 is tightened into the mounting hole 221 of the mounting body 22.

[0091] Since the terminal block manufacturing method according to this embodiment has the above-described configuration, it is relatively easy to solder the chip-type component 23, which consists of one or more chip capacitors 231 housed in the housing portion 240 of the injection-molded body 24, to the first rod-shaped body 251 and the second rod-shaped body 252 of the injection-molded body 24, to electrically connect the first rod-shaped body 251 to the busbar 21, to electrically connect the second rod-shaped body 252 to the mounting body 22, and to prepare the assembly 2. Furthermore, in the terminal block manufacturing method according to this embodiment, when preparing the assembly 2, the chip-type component 23 and the soldered parts can be relatively easily covered with a covering material 26.

[0092] Therefore, in the terminal block manufacturing method according to this embodiment, when the assembly 2 is set in the injection mold and the resin part 3 of the terminal block 1 is molded, the coating material 26 makes it difficult for flux residue caused by soldering to flow out, suppresses corrosion of the injection mold, and suppresses deterioration of the surface condition of the resin part 3. Thus, the terminal block manufacturing method according to this embodiment provides a terminal block manufacturing method that can suppress corrosion of the injection mold due to flux residue caused by soldering and suppress deterioration of the appearance of the resin part 3.

[0093] The injection-molded body 24 according to this embodiment has the configuration described above. Therefore, the injection-molded body 24 according to this embodiment can be provided which can be suitably used in at least one of the terminal block 1 of this embodiment and the method for manufacturing the terminal block according to this embodiment.

[0094] 2. Terminal block, method for manufacturing the terminal block, and injection molded body according to Embodiment 2. The terminal block, method for manufacturing the terminal block, and injection molded body according to Embodiment 2 will be described in detail with reference to Figures 10 to 14. Embodiment 2 differs from Embodiment 1 mainly in the configuration of the busbar 21, mounting body 22, injection molded body 24, and the assembly 2 having these. Therefore, the following description will focus on the differences from Embodiment 1. In addition, among the reference numerals used in Embodiment 2 and later, those that are the same as those used in the previously described embodiments represent the same components, etc., as in the previously described embodiments, unless otherwise specified.

[0095] As illustrated in Figure 10, in the assembly 2, the protruding portion 211 of the busbar 21 and the arm portion 25b of the first rod-shaped body 251 are electrically joined by welding. The mounting body 22 and the arm portion 25b of the second rod-shaped body 252 are electrically joined by welding.

[0096] In Embodiment 2, the mounting body 22 has mounting holes 221 into which bolts 93 are inserted only on one side of the busbar 21. This configuration makes the assembly 2 more compact overall. The mounting body 22 may also be formed on both sides of the busbar 21.

[0097] Figure 10 shows an example in which the mounting body 22 has a mounting hole 221 and an insertion portion 224 that extends outward from the outer peripheral edge 222 of the mounting hole 221. Also in Figure 10, an example is shown in which the injection-molded body 24 has a fitting portion 241e (not shown in Figure 10) into which the insertion portion 224 of the mounting body 22 is inserted and fitted into a part of the frame portion 241a of the frame body 241. As illustrated in Figures 11 to 13, this fitting portion 241e is formed as a covering portion 241f formed such that a part of the material of the frame portion 241a covers the base portion of the arm portion 25b of the second rod-shaped body 252.

[0098] Furthermore, in the second embodiment, as illustrated in Figure 10, a collar 4 separate from the mounting body 22 is set in the injection molding die for molding the resin part 3, and the resin part 3 is injection molded. This makes it possible to form a terminal block 1 in which a collar 4 into which a bolt 93 can be inserted is embedded in the resin part 3.

[0099] Here, the injection-molded body 24 has a projection 241g that protrudes from the outer surface of the bottom 241b, as illustrated in Figures 11 and 13. In Figures 11 and 13, an example is shown in which the projection 241g is formed in a angular shape. Specifically, an example is shown in which the projection 241g is formed in a rectangular prism shape. The shape of the projection 241g is not limited to a rectangular prism, but may be a triangular prism, or other polygonal prism. The shape of the projection 241g may also be hemispherical, cross-shaped, L-shaped, etc. In addition, although Figures 11 and 13 show an example in which one projection 241g is formed on the bottom 241b, the number of projections 241g is not limited, and multiple projections 241g may be formed on the bottom 241b.

[0100] As illustrated in Figures 11 and 14, the busbar 21 has a projection insertion portion 212 which is a hole or recess into which the projection 241g of the injection molded body 24 can be inserted. The projection insertion portion 212 may be a through hole or a recess, as long as it has a shape that allows the projection 241g of the injection molded body 24 to be inserted and fitted. In Figures 11 and 14, an example is shown in which the projection insertion portion 212 is formed by a hole that penetrates the busbar 21.

[0101] As illustrated in Figures 10, 11, 12, and 14, the assembly 2 is constructed by inserting the protrusion 241g of the injection-molded body 24 into the protrusion insertion portion 212 of the busbar 21. With this configuration, the injection-molded body 24 can be easily positioned and fixed relative to the busbar 21. In this case, if the protrusion 241g is formed in a angular shape as described above, the injection-molded body 24 will not rotate relative to the busbar 21 after assembly, thereby improving the positioning of the injection-molded body 24 relative to the busbar 21.

[0102] Furthermore, in Embodiment 2, as illustrated in Figures 11 and 14, the case in which the projection 241g is press-fitted into the projection insertion portion 212, which has a through-hole, is shown. However, although not shown, the projection 241g and the projection insertion portion 212 may also be fixed by locking.

[0103] In Embodiment 2, the assembly of the assembly 2 after inserting the protrusion 241g of the injection-molded body 24 into the protrusion insertion portion 212 of the busbar 21, as described above, can be carried out, for example, as follows.

[0104] As illustrated in Figure 12, the protruding portion 211 of the busbar 21 and the arm portion 25b of the first rod-shaped body 251 are welded together to electrically connect them. In addition, the insertion portion 224 of the mounting body 22 is inserted into the fitting portion 241e of the injection-molded body 24, and the insertion portion 224 inserted into the fitting portion 241e and the arm portion 25b of the second rod-shaped body 252 are welded together to electrically connect them. This allows the assembly 2 illustrated in Figures 10 and 14 to be assembled. With this assembly 2, when setting the assembly 2 in the injection molding die during the injection molding of the resin part 3, it is possible to prevent the busbar 21 and the injection-molded body 24 from shifting relative to each other.

[0105] The other configurations and effects are the same as in Embodiment 1.

[0106] This disclosure is not limited to the embodiments described above, and various modifications are possible without departing from its essence. Furthermore, the configurations shown in each embodiment can be combined in any way.

Claims

1. A terminal block that can be attached to a case housing electronic equipment, comprising an assembly and a resin part covering a part of the assembly, wherein the assembly comprises a busbar with one end inserted into a through hole formed in the wall of the case, a mounting body made of a metal material and arranged in a direction intersecting the busbar, a chip-type component consisting of one or more chip capacitors, an injection-molded body disposed on the busbar and electrically connected to the busbar and electrically connected to the mounting body, and having a housing for housing the chip-type component, and a covering material, wherein the resin part covers at least a part of the busbar, the mounting body, and the injection-molded body, wherein the injection-molded body is formed in a box shape having a frame-shaped frame portion and a bottom portion that closes one opening of the frame portion, and the box interior space enclosed by the frame portion, the other opening of the frame portion and the bottom portion is the housing for housing the chip-type component, A terminal block comprising a first and second conductive rod-shaped body, which are integrally provided with an exposed portion embedded in the frame portion of the frame and partially exposed inside the housing portion, and an arm portion extending outward from the frame portion, and which are spaced apart from each other, wherein one end of the chip-type component is soldered to the exposed portion of the first rod-shaped body, and the arm portion of the first rod-shaped body is electrically connected to the busbar, the other end of the chip-type component is soldered to the exposed portion of the second rod-shaped body, and the arm portion of the second rod-shaped body is electrically connected to the mounting body, and the chip-type component and the soldered portion are covered by the covering material.

2. The terminal block according to claim 1, wherein the covering material is formed from a covering material that has hardened after being filled inside the housing portion, and is made of a material that is softer than the resin that forms the frame.

3. The terminal block according to claim 1, wherein the chip-type component housed in the housing section has a portion in which two or more chip capacitors are arranged in series.

4. The injection-molded body has a partition wall portion erected from the bottom portion within the housing portion, and the chip-type component housed in the housing portion has a portion in which the chip capacitors are arranged in parallel with the partition wall portion in between, according to claim 1.

5. The terminal block according to claim 1, wherein both the first rod-shaped body and the second rod-shaped body have a corner portion connecting the exposed portion and the arm portion.

6. The terminal block according to claim 1, wherein the injection-molded body has a projection that protrudes from the outer surface of the bottom, the busbar has a projection insertion portion consisting of a hole or recess into which the projection of the injection-molded body can be inserted, and the assembly has the projection of the injection-molded body inserted into the projection insertion portion of the busbar.

7. A method for manufacturing a terminal block that can be attached to a case housing electronic equipment, comprising an assembly and a resin part covering a part of the assembly, comprising a preparation step of preparing the assembly and an injection molding step of setting the assembly in an injection mold and performing injection molding, wherein the assembly comprises a busbar with one end inserted into a through hole formed in the wall of the case, a mounting body made of a metal material and arranged in a direction intersecting the busbar, a chip-type component consisting of one or more chip capacitors, an injection-molded body arranged on the busbar and electrically connected to the busbar and electrically connected to the mounting body, and having a housing part for housing the chip-type component, and a covering material, wherein the injection-molded body is formed in a box shape having a frame-shaped frame part and a bottom part that closes one opening of the frame part, and the box interior space enclosed by the frame part, the other opening of the frame part and the bottom part is the housing part for housing the chip-type component, A method for manufacturing a terminal block, comprising: a conductive first rod-shaped body and a conductive second rod-shaped body, which are integrally provided with an exposed portion embedded in the frame portion of the frame and partially exposed inside the housing portion, and an arm portion extending outward from the frame, and which are spaced apart from each other; the assembly having one end of the chip-type component soldered to the exposed portion of the first rod-shaped body, and the arm portion of the first rod-shaped body electrically connected to the busbar; the other end of the chip-type component soldered to the exposed portion of the second rod-shaped body, and the arm portion of the second rod-shaped body electrically connected to the mounting body; the chip-type component and the soldered portion being covered by the covering material; and the injection molding step comprising setting the assembly in an injection mold, forming the resin portion by injection molding so as to cover at least a part of the busbar, the mounting body, and the injection molded body, and integrating the resin portion and the assembly.

8. The method for manufacturing a terminal block according to claim 7, wherein the covering material is formed from a covering material that has hardened after being filled inside the housing portion, and is made of a material that is softer than the resin that forms the frame.

9. The method for manufacturing a terminal block according to claim 7, wherein the chip-type component housed in the housing section has a portion in which two or more chip capacitors are arranged in series.

10. The method for manufacturing a terminal block according to claim 7, wherein the injection-molded body has a partition wall portion erected from the bottom portion within the housing portion, and the chip-type component housed in the housing portion has a portion in which the chip capacitors are arranged in parallel with the partition wall portion in between.

11. The method for manufacturing a terminal block according to claim 7, wherein the preparation step includes: a housing step of housing the chip-type component in the housing of the injection-molded body; a soldering step of soldering one end of the chip-type component to the exposed portion of the first rod-shaped body and the other end of the chip-type component to the exposed portion of the second rod-shaped body; a covering material forming step of filling the inside of the housing with a covering material and hardening it to form a covering material that covers the chip-type component and the soldered portion; and an assembly step of electrically joining the arm portion of the first rod-shaped body to the busbar and electrically joining the arm portion of the second rod-shaped body to the mounting body to form the assembly.

12. The method for manufacturing a terminal block according to claim 7, wherein the injection-molded body has a projection that protrudes from the outer surface of the bottom, the busbar has a projection insertion portion consisting of a hole or recess into which the projection of the injection-molded body can be inserted, and the assembly has the projection of the injection-molded body inserted into the projection insertion portion of the busbar.

13. An injection-molded body for use in a terminal block that can be attached to a case housing electronic equipment, comprising: a resin frame body formed in a box shape having a frame portion formed in a frame shape and a bottom portion that closes one opening of the frame portion, wherein the internal space enclosed by the frame portion, the other opening of the frame portion and the bottom portion is a housing portion for housing one or more chip capacitors; and a conductive first rod-shaped body and a second rod-shaped body integrally comprising an exposed portion embedded in the frame portion of the frame body and partially exposed inside the housing portion, and an arm portion extending outward from the frame portion, and arranged spaced apart from each other.

Images